TWI755467B - 研磨用組合物 - Google Patents

研磨用組合物 Download PDF

Info

Publication number
TWI755467B
TWI755467B TW106146202A TW106146202A TWI755467B TW I755467 B TWI755467 B TW I755467B TW 106146202 A TW106146202 A TW 106146202A TW 106146202 A TW106146202 A TW 106146202A TW I755467 B TWI755467 B TW I755467B
Authority
TW
Taiwan
Prior art keywords
water
polishing
polishing composition
soluble
soluble polymers
Prior art date
Application number
TW106146202A
Other languages
English (en)
Chinese (zh)
Other versions
TW201829717A (zh
Inventor
松田修平
杉田規章
松下隆幸
Original Assignee
日商霓塔杜邦股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商霓塔杜邦股份有限公司 filed Critical 日商霓塔杜邦股份有限公司
Publication of TW201829717A publication Critical patent/TW201829717A/zh
Application granted granted Critical
Publication of TWI755467B publication Critical patent/TWI755467B/zh

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
TW106146202A 2016-12-28 2017-12-28 研磨用組合物 TWI755467B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016255099 2016-12-28
JP2016-255099 2016-12-28

Publications (2)

Publication Number Publication Date
TW201829717A TW201829717A (zh) 2018-08-16
TWI755467B true TWI755467B (zh) 2022-02-21

Family

ID=62709419

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106146202A TWI755467B (zh) 2016-12-28 2017-12-28 研磨用組合物

Country Status (5)

Country Link
JP (1) JP7077236B2 (ja)
KR (1) KR20190098142A (ja)
CN (1) CN110036086B (ja)
TW (1) TWI755467B (ja)
WO (1) WO2018124230A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020035870A (ja) * 2018-08-29 2020-03-05 株式会社フジミインコーポレーテッド 研磨用組成物
CN111378379B (zh) * 2018-12-29 2022-08-05 安集微电子（上海）有限公司 一种化学机械抛光液及其应用
JP7433042B2 (ja) * 2019-12-24 2024-02-19 ニッタ・デュポン株式会社 研磨用組成物
JP2022155523A (ja) 2021-03-30 2022-10-13 株式会社フジミインコーポレーテッド 研磨用組成物、及び窒化ケイ素を選択的に除去する方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200914596A (en) * 2007-09-28 2009-04-01 Nitta Haas Inc Polishing composition
TW201615797A (zh) * 2014-09-05 2016-05-01 卡博特微電子公司 漿液組合物、清洗組合物、基板拋光方法及清洗方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7524347B2 (en) * 2004-10-28 2009-04-28 Cabot Microelectronics Corporation CMP composition comprising surfactant
FR2917440B1 (fr) * 2007-06-12 2010-09-24 Comptoir Hydro Electro Thermiq Cabine modulaire pour fumeurs et espaces fumeurs modulables resultant de l'assemblage de telles cabines.
JP5371416B2 (ja) 2008-12-25 2013-12-18 富士フイルム株式会社 研磨液及び研磨方法
JP2015205348A (ja) * 2012-08-30 2015-11-19 日立化成株式会社 研磨剤、研磨剤セット及び基体の研磨方法
CN104603227B (zh) * 2012-08-31 2017-03-08 福吉米株式会社 研磨用组合物和基板的制造方法
EP2826827B1 (en) * 2013-07-18 2019-06-12 Basf Se CMP composition comprising abrasive particles containing ceria

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200914596A (en) * 2007-09-28 2009-04-01 Nitta Haas Inc Polishing composition
TW201615797A (zh) * 2014-09-05 2016-05-01 卡博特微電子公司 漿液組合物、清洗組合物、基板拋光方法及清洗方法

Also Published As

Publication number Publication date
KR20190098142A (ko) 2019-08-21
CN110036086B (zh) 2022-04-26
TW201829717A (zh) 2018-08-16
WO2018124230A1 (ja) 2018-07-05
JP7077236B2 (ja) 2022-05-30
JPWO2018124230A1 (ja) 2019-10-31
CN110036086A (zh) 2019-07-19

Similar Documents

Publication Publication Date Title
TWI755467B (zh) 研磨用組合物
CN105264647B (zh) 硅晶圆研磨用组合物
EP3366746B1 (en) Polishing composition
CN108138032B (zh) 研磨用组合物
CN106663619B (zh) 硅晶圆研磨用组合物
KR20110099627A (ko) 연마용 조성물 및 그것을 사용한 연마 방법
TWI770098B (zh) 矽晶圓研磨用組合物及研磨方法
CN111527589A (zh) 研磨用组合物
WO2015005433A1 (ja) 研磨用組成物およびその製造方法
WO2010005103A1 (ja) 研磨組成物
JP7002354B2 (ja) 研磨用組成物
JP7061968B2 (ja) 研磨用組成物及び研磨方法
JP7157651B2 (ja) 研磨用組成物
CN112400005B (zh) 研磨用组合物
JP2014116557A (ja) 研磨用組成物およびその利用