TWI754275B - 拋光墊及形成其之方法 - Google Patents

拋光墊及形成其之方法 Download PDF

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Publication number
TWI754275B
TWI754275B TW109114978A TW109114978A TWI754275B TW I754275 B TWI754275 B TW I754275B TW 109114978 A TW109114978 A TW 109114978A TW 109114978 A TW109114978 A TW 109114978A TW I754275 B TWI754275 B TW I754275B
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TW
Taiwan
Prior art keywords
polishing
polishing pad
pad
layer
advanced
Prior art date
Application number
TW109114978A
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English (en)
Chinese (zh)
Other versions
TW202110579A (zh
Inventor
西法帕奇亞 卡納帕西亞潘
傅博詣
亞敘溫 裘卡林姆
丹尼爾 瑞特法德
拉吉菲 巴札
馬韓卓Ｃ 奧利拉
浩智 黃
傑森Ｇ 馮
麻由 山村
Original Assignee
美商應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US14/885,950 external-priority patent/US10384330B2/en
Priority claimed from US14/887,240 external-priority patent/US10821573B2/en
Priority claimed from US14/920,801 external-priority patent/US10875145B2/en
Priority claimed from US15/002,384 external-priority patent/US10875153B2/en
Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TW202110579A publication Critical patent/TW202110579A/zh
Application granted granted Critical
Publication of TWI754275B publication Critical patent/TWI754275B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0045—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by stacking sheets of abrasive material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/04—Zonally-graded surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/009—Tools not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/112—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
TW109114978A 2015-10-16 2016-10-06 拋光墊及形成其之方法 TWI754275B (zh)

Applications Claiming Priority (22)

Application Number Priority Date Filing Date Title
US14/885,950 2015-10-16
US14/885,950 US10384330B2 (en) 2014-10-17 2015-10-16 Polishing pads produced by an additive manufacturing process
US14/887,240 2015-10-19
US14/887,240 US10821573B2 (en) 2014-10-17 2015-10-19 Polishing pads produced by an additive manufacturing process
US14/920,801 2015-10-22
US14/920,801 US10875145B2 (en) 2014-10-17 2015-10-22 Polishing pads produced by an additive manufacturing process
US201662280537P 2016-01-19 2016-01-19
US62/280,537 2016-01-19
US15/002,384 2016-01-20
US15/002,384 US10875153B2 (en) 2014-10-17 2016-01-20 Advanced polishing pad materials and formulations
US201662304134P 2016-03-04 2016-03-04
US62/304,134 2016-03-04
US201662323599P 2016-04-15 2016-04-15
US62/323,599 2016-04-15
US201662331234P 2016-05-03 2016-05-03
US62/331,234 2016-05-03
US201662339807P 2016-05-21 2016-05-21
US62/339,807 2016-05-21
US201662380015P 2016-08-26 2016-08-26
US201662380334P 2016-08-26 2016-08-26
US62/380,334 2016-08-26
US62/380,015 2016-08-26

Publications (2)

Publication Number Publication Date
TW202110579A TW202110579A (zh) 2021-03-16
TWI754275B true TWI754275B (zh) 2022-02-01

Family

ID=58517785

Family Applications (4)

Application Number Title Priority Date Filing Date
TW110148859A TWI816269B (zh) 2015-10-16 2016-10-06 拋光墊及形成其之方法
TW112132508A TW202400363A (zh) 2015-10-16 2016-10-06 拋光墊及形成其之方法
TW109114978A TWI754275B (zh) 2015-10-16 2016-10-06 拋光墊及形成其之方法
TW105132308A TWI695752B (zh) 2015-10-16 2016-10-06 用於以積層製程形成先進拋光墊的配方

Family Applications Before (2)

Application Number Title Priority Date Filing Date
TW110148859A TWI816269B (zh) 2015-10-16 2016-10-06 拋光墊及形成其之方法
TW112132508A TW202400363A (zh) 2015-10-16 2016-10-06 拋光墊及形成其之方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW105132308A TWI695752B (zh) 2015-10-16 2016-10-06 用於以積層製程形成先進拋光墊的配方

Country Status (7)

Country Link
EP (1) EP3362224B1 (enExample)
JP (3) JP6685392B2 (enExample)
KR (2) KR102584551B1 (enExample)
CN (6) CN112025544B (enExample)
SG (1) SG10202106436WA (enExample)
TW (4) TWI816269B (enExample)
WO (1) WO2017066077A1 (enExample)

Families Citing this family (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
CN107078048B (zh) 2014-10-17 2021-08-13 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
EP4574852A3 (en) * 2017-06-30 2025-10-15 Align Technology, Inc. 3d printed composites from a single resin by patterned light exposures
EP3431832A1 (en) * 2017-07-19 2019-01-23 Ratier-Figeac SAS Bellows
US11072050B2 (en) * 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
WO2019032286A1 (en) * 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
CN108081534A (zh) * 2017-11-15 2018-05-29 东莞万德电子制品有限公司 塑胶材料3d打印工艺及其成品
KR102625059B1 (ko) * 2017-12-27 2024-01-12 니타 듀폰 가부시키가이샤 연마 패드
JP6971839B2 (ja) * 2017-12-27 2021-11-24 ニッタ・デュポン株式会社 研磨パッド
EP3765261A4 (en) * 2018-03-16 2021-12-29 Nano-Dimension Technologies, Ltd. Inkjet printing of three-dimensional ceramic pattern
EP3753957B1 (en) * 2018-03-30 2023-09-06 Mitsui Chemicals, Inc. Photolithographic curable composition, evaporative pattern, and method for producing three dimensional shaped article
DE102018205761B4 (de) 2018-04-16 2025-07-10 LF GmbH & Co. KG Verfahren zur Herstellung eines Reibmaterials, hierdurch hergestelltes Reibmaterial und dessen Verwendung
JP7067228B2 (ja) * 2018-04-17 2022-05-16 Dic株式会社 構造体の製造方法
JP7373503B2 (ja) * 2018-05-07 2023-11-02 アプライド マテリアルズ インコーポレイテッド 親水性及びゼータ電位の調節可能な化学機械研磨パッド
JP7068921B2 (ja) 2018-05-15 2022-05-17 東京エレクトロン株式会社 部品の形成方法及びプラズマ処理装置
JP7319425B2 (ja) * 2018-05-15 2023-08-01 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理装置用部品
JP6887618B2 (ja) * 2018-05-30 2021-06-16 日本電気硝子株式会社 調光機能付き積層体
CN112654655A (zh) * 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
EP3850300A2 (en) 2018-10-19 2021-07-21 Inkbit, LLC High-speed metrology
US11354466B1 (en) 2018-11-02 2022-06-07 Inkbit, LLC Machine learning for additive manufacturing
JP2022506523A (ja) 2018-11-02 2022-01-17 インクビット， エルエルシー インテリジェント付加製造方法
CN109133917B (zh) * 2018-11-02 2022-03-25 华南农业大学 一种dlp增材制造用的陶瓷浆料及其制备方法和采用该浆料制备成品的方法
CA3118309A1 (en) * 2018-11-16 2020-05-22 Inkbit, LLC Inkjet 3d printing of multi-component resins
WO2020128779A2 (en) * 2018-12-18 2020-06-25 3M Innovative Properties Company Bonded abrasive articles and methods of manufacture
CN111378383B (zh) * 2018-12-28 2022-05-13 安集微电子（上海）有限公司 一种聚醚胺化合物在pi介电材料抛光中的用途
AU2020205973A1 (en) 2019-01-08 2021-07-15 Inkbit, LLC Reconstruction of surfaces for additive manufacturing
US11077620B2 (en) 2019-01-08 2021-08-03 Inkbit, LLC Depth reconstruction in additive fabrication
US20200230781A1 (en) * 2019-01-23 2020-07-23 Applied Materials, Inc. Polishing pads formed using an additive manufacturing process and methods related thereto
US11851570B2 (en) * 2019-04-12 2023-12-26 Applied Materials, Inc. Anionic polishing pads formed by printing processes
US20200384601A1 (en) * 2019-06-10 2020-12-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc Thin film fluoropolymer composite cmp polishing pad
JP2022545469A (ja) * 2019-08-21 2022-10-27 アプライド マテリアルズ インコーポレイテッド 研磨パッドの付加製造
KR102228152B1 (ko) * 2019-08-26 2021-03-17 임재영 연마장치
KR102182309B1 (ko) * 2019-09-06 2020-11-24 임재영 연마장치
US12006442B2 (en) 2019-09-11 2024-06-11 Applied Materials, Inc. Additive manufacturing of polishing pads
US20210069860A1 (en) * 2019-09-11 2021-03-11 Applied Materials, Inc. Compositions and Methods of Additive Manufacturing of Polishing Pads
US10994477B1 (en) 2019-11-01 2021-05-04 Inkbit, LLC Optical scanning for industrial metrology
US11712837B2 (en) 2019-11-01 2023-08-01 Inkbit, LLC Optical scanning for industrial metrology
DE102020102282B3 (de) * 2020-01-30 2021-04-08 Infineon Technologies Ag Halbleitervorrichtung mit ausrichtungspads und verfahren zu deren herstellung
US10926473B1 (en) 2020-02-20 2021-02-23 Inkbit, LLC Multi-material scanning for additive fabrication
WO2021222086A1 (en) * 2020-04-28 2021-11-04 Carbon, Inc. Methods of making a three-dimensional object
US11806829B2 (en) * 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US10994490B1 (en) 2020-07-31 2021-05-04 Inkbit, LLC Calibration for additive manufacturing by compensating for geometric misalignments and distortions between components of a 3D printer
EP4192649B1 (en) * 2020-08-10 2025-01-01 3M Innovative Properties Company Abrasive articles and method of making the same
TWI851930B (zh) * 2020-10-19 2024-08-11 美商Ｃｍｃ材料有限責任公司 用於化學機械拋光墊之可uv固化樹脂
CN113478336B (zh) * 2021-06-29 2022-08-19 中国科学院长春光学精密机械与物理研究所 一种沥青抛光垫的制作装置及制作方法
TWI843009B (zh) 2021-08-17 2024-05-21 財團法人工業技術研究院 光固化樹脂組成物、含其之三維物件及該三維物件之製造方法
TWI823509B (zh) * 2022-08-04 2023-11-21 磐采股份有限公司 可發泡樹脂組成物
CN120051356A (zh) * 2022-09-22 2025-05-27 Cmc材料有限责任公司 具有二硫键的化学机械抛光垫
DE102022126743A1 (de) * 2022-10-13 2024-04-18 Ernst-Abbe-Hochschule Jena Körperschaft des öffentlichen Rechts Werkzeug zum Materialabtrag und Verfahren zu seiner Herstellung
EP4605174A1 (de) * 2022-10-17 2025-08-27 Satisloh GmbH Graduierte und adaptive polierwerkzeuge sowie verfahren zu deren herstellung
CN116038551B (zh) * 2023-01-10 2023-12-29 燕山大学 光化学机械研磨方法及光敏活性研磨液
US20240342856A1 (en) * 2023-04-17 2024-10-17 Taiwan Semiconductor Manufacturing Co., Ltd. Methods of Forming an Abrasive Slurry and Methods for Chemical-Mechanical Polishing
TW202502888A (zh) * 2023-06-02 2025-01-16 日商吳羽股份有限公司 研磨墊及被研磨物之研磨方法
JP7739510B1 (ja) 2024-03-28 2025-09-16 ノリタケ株式会社 樹脂組成物、および、該樹脂組成物を用いたシートの製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1359322A (zh) * 1999-07-09 2002-07-17 3M创新有限公司 含多孔陶瓷磨料复合物的金属粘结的磨料制品和用其磨制工件的方法
CN101428404A (zh) * 2008-12-22 2009-05-13 南京航空航天大学 固结磨料研磨抛光垫及其制备方法
CN102686362A (zh) * 2009-12-30 2012-09-19 3M创新有限公司 包括分相共混聚合物的抛光垫及其制备和使用方法
TWI385050B (zh) * 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
TWI409136B (zh) * 2006-07-19 2013-09-21 Innopad Inc 表面具微溝槽之化學機械平坦化墊
TWI483810B (zh) * 2011-05-05 2015-05-11 Nexplanar Corp 具有對準特徵之拋光墊

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4985340A (en) * 1988-06-01 1991-01-15 Minnesota Mining And Manufacturing Company Energy curable compositions: two component curing agents
US5453312A (en) * 1993-10-29 1995-09-26 Minnesota Mining And Manufacturing Company Abrasive article, a process for its manufacture, and a method of using it to reduce a workpiece surface
US5795218A (en) * 1996-09-30 1998-08-18 Micron Technology, Inc. Polishing pad with elongated microcolumns
WO1998028108A1 (en) * 1996-12-20 1998-07-02 Unique Technology International Private Limited Manufacture of porous polishing pad
US5919082A (en) * 1997-08-22 1999-07-06 Micron Technology, Inc. Fixed abrasive polishing pad
US6183346B1 (en) * 1998-08-05 2001-02-06 3M Innovative Properties Company Abrasive article with embossed isolation layer and methods of making and using
US6592443B1 (en) * 2000-08-30 2003-07-15 Micron Technology, Inc. Method and apparatus for forming and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates
US6838149B2 (en) * 2001-12-13 2005-01-04 3M Innovative Properties Company Abrasive article for the deposition and polishing of a conductive material
US20040058623A1 (en) * 2002-09-20 2004-03-25 Lam Research Corporation Polishing media for chemical mechanical planarization (CMP)
US20070010169A1 (en) * 2002-09-25 2007-01-11 Ppg Industries Ohio, Inc. Polishing pad with window for planarization
US20040209066A1 (en) * 2003-04-17 2004-10-21 Swisher Robert G. Polishing pad with window for planarization
US6884156B2 (en) * 2003-06-17 2005-04-26 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
KR100590202B1 (ko) * 2003-08-29 2006-06-15 삼성전자주식회사 연마 패드 및 그 형성방법
US20050060941A1 (en) * 2003-09-23 2005-03-24 3M Innovative Properties Company Abrasive article and methods of making the same
US20050227590A1 (en) * 2004-04-09 2005-10-13 Chien-Min Sung Fixed abrasive tools and associated methods
US20050260929A1 (en) * 2004-05-20 2005-11-24 Jsr Corporation Chemical mechanical polishing pad and chemical mechanical polishing method
KR20070108546A (ko) * 2005-02-18 2007-11-12 네오패드 테크놀로지즈 코포레이션 화학적 기계적인 평탄화를 위해 적합화된 연마 패드와 그연마 패드의 제조 및 사용 방법
EP1848569B1 (en) * 2005-02-18 2016-11-23 NexPlanar Corporation Customized polishing pads for cmp and method of using the same
US7524345B2 (en) 2005-02-22 2009-04-28 Saint-Gobain Abrasives, Inc. Rapid tooling system and methods for manufacturing abrasive articles
US20070049164A1 (en) * 2005-08-26 2007-03-01 Thomson Clifford O Polishing pad and method for manufacturing polishing pads
JP4884726B2 (ja) * 2005-08-30 2012-02-29 東洋ゴム工業株式会社 積層研磨パッドの製造方法
US7594845B2 (en) * 2005-10-20 2009-09-29 3M Innovative Properties Company Abrasive article and method of modifying the surface of a workpiece
US20070117393A1 (en) * 2005-11-21 2007-05-24 Alexander Tregub Hardened porous polymer chemical mechanical polishing (CMP) pad
CN101500756A (zh) * 2005-11-30 2009-08-05 应用材料公司 具有表面粗糙度的抛光垫
KR20070070094A (ko) * 2005-12-28 2007-07-03 제이에스알 가부시끼가이샤 화학 기계 연마 패드 및 화학 기계 연마 방법
US7410413B2 (en) * 2006-04-27 2008-08-12 3M Innovative Properties Company Structured abrasive article and method of making and using the same
KR101276962B1 (ko) * 2006-07-28 2013-06-19 도레이 카부시키가이샤 상호 침입 고분자 그물형 구조체의 제조 방법 및 이를 이용한 연마 패드의 제조 방법
US7635290B2 (en) * 2007-08-15 2009-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Interpenetrating network for chemical mechanical polishing
WO2009032768A2 (en) * 2007-09-03 2009-03-12 Semiquest, Inc. Polishing pad
WO2009088945A1 (en) * 2007-12-31 2009-07-16 Innopad, Inc. Chemical-mechanical planarization pad
JP2010077288A (ja) * 2008-09-26 2010-04-08 Toray Ind Inc 相互侵入高分子網目構造体、研磨パッドおよび相互侵入高分子網目構造体の製造方法
EP2398577A2 (en) * 2009-02-19 2011-12-28 Bonner, Alex Garfield Porous interpenetrating polymer network
US20130012108A1 (en) * 2009-12-22 2013-01-10 Naichao Li Polishing pad and method of making the same
KR20120112662A (ko) * 2009-12-30 2012-10-11 쓰리엠 이노베이티브 프로퍼티즈 컴파니 유기 미립자 로딩된 폴리싱 패드 및 이를 제조 및 사용하는 방법
US9017140B2 (en) * 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
EP2585541B1 (en) * 2010-06-25 2016-06-08 3M Innovative Properties Company Semi-interpenetrating polymer network
KR20130138294A (ko) * 2010-12-16 2013-12-18 쓰리엠 이노베이티브 프로퍼티즈 컴파니 상호침투 중합체 층
US20120302148A1 (en) * 2011-05-23 2012-11-29 Rajeev Bajaj Polishing pad with homogeneous body having discrete protrusions thereon
SG10201508090WA (en) * 2011-11-29 2015-10-29 Nexplanar Corp Polishing pad with foundation layer and polishing surface layer
US9067299B2 (en) * 2012-04-25 2015-06-30 Applied Materials, Inc. Printed chemical mechanical polishing pad
WO2015023442A1 (en) * 2013-08-10 2015-02-19 Applied Materials, Inc. Cmp pads having material composition that facilitates controlled conditioning
US9421666B2 (en) * 2013-11-04 2016-08-23 Applied Materials, Inc. Printed chemical mechanical polishing pad having abrasives therein
US9993907B2 (en) * 2013-12-20 2018-06-12 Applied Materials, Inc. Printed chemical mechanical polishing pad having printed window
CN107078048B (zh) * 2014-10-17 2021-08-13 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1359322A (zh) * 1999-07-09 2002-07-17 3M创新有限公司 含多孔陶瓷磨料复合物的金属粘结的磨料制品和用其磨制工件的方法
TWI385050B (zh) * 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
TWI409136B (zh) * 2006-07-19 2013-09-21 Innopad Inc 表面具微溝槽之化學機械平坦化墊
CN101428404A (zh) * 2008-12-22 2009-05-13 南京航空航天大学 固结磨料研磨抛光垫及其制备方法
CN102686362A (zh) * 2009-12-30 2012-09-19 3M创新有限公司 包括分相共混聚合物的抛光垫及其制备和使用方法
TWI483810B (zh) * 2011-05-05 2015-05-11 Nexplanar Corp 具有對準特徵之拋光墊

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