JP6685392B2 - 付加製造プロセスを用いて高機能研磨パッドを形成する方法及び装置 - Google Patents
付加製造プロセスを用いて高機能研磨パッドを形成する方法及び装置 Download PDFInfo
- Publication number
- JP6685392B2 JP6685392B2 JP2018519328A JP2018519328A JP6685392B2 JP 6685392 B2 JP6685392 B2 JP 6685392B2 JP 2018519328 A JP2018519328 A JP 2018519328A JP 2018519328 A JP2018519328 A JP 2018519328A JP 6685392 B2 JP6685392 B2 JP 6685392B2
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- layer
- polishing pad
- pad
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0045—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by stacking sheets of abrasive material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/04—Zonally-graded surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/009—Tools not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/112—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Applications Claiming Priority (23)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/885,950 US10384330B2 (en) | 2014-10-17 | 2015-10-16 | Polishing pads produced by an additive manufacturing process |
| US14/885,950 | 2015-10-16 | ||
| US14/887,240 | 2015-10-19 | ||
| US14/887,240 US10821573B2 (en) | 2014-10-17 | 2015-10-19 | Polishing pads produced by an additive manufacturing process |
| US14/920,801 US10875145B2 (en) | 2014-10-17 | 2015-10-22 | Polishing pads produced by an additive manufacturing process |
| US14/920,801 | 2015-10-22 | ||
| US201662280537P | 2016-01-19 | 2016-01-19 | |
| US62/280,537 | 2016-01-19 | ||
| US15/002,384 | 2016-01-20 | ||
| US15/002,384 US10875153B2 (en) | 2014-10-17 | 2016-01-20 | Advanced polishing pad materials and formulations |
| US201662304134P | 2016-03-04 | 2016-03-04 | |
| US62/304,134 | 2016-03-04 | ||
| US201662323599P | 2016-04-15 | 2016-04-15 | |
| US62/323,599 | 2016-04-15 | ||
| US201662331234P | 2016-05-03 | 2016-05-03 | |
| US62/331,234 | 2016-05-03 | ||
| US201662339807P | 2016-05-21 | 2016-05-21 | |
| US62/339,807 | 2016-05-21 | ||
| US201662380334P | 2016-08-26 | 2016-08-26 | |
| US201662380015P | 2016-08-26 | 2016-08-26 | |
| US62/380,334 | 2016-08-26 | ||
| US62/380,015 | 2016-08-26 | ||
| PCT/US2016/055793 WO2017066077A1 (en) | 2015-10-16 | 2016-10-06 | Method and apparatus for forming advanced polishing pads using an additive manufacturing process |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020063448A Division JP7009542B2 (ja) | 2015-10-16 | 2020-03-31 | 付加製造プロセスを用いて高機能研磨パッドを形成する方法及び装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018533487A JP2018533487A (ja) | 2018-11-15 |
| JP2018533487A5 JP2018533487A5 (enExample) | 2019-11-21 |
| JP6685392B2 true JP6685392B2 (ja) | 2020-04-22 |
Family
ID=58517785
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018519328A Active JP6685392B2 (ja) | 2015-10-16 | 2016-10-06 | 付加製造プロセスを用いて高機能研磨パッドを形成する方法及び装置 |
| JP2020063448A Active JP7009542B2 (ja) | 2015-10-16 | 2020-03-31 | 付加製造プロセスを用いて高機能研磨パッドを形成する方法及び装置 |
| JP2022002501A Active JP7434378B2 (ja) | 2015-10-16 | 2022-01-11 | 付加製造プロセスを用いて高機能研磨パッドを形成する方法及び装置 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020063448A Active JP7009542B2 (ja) | 2015-10-16 | 2020-03-31 | 付加製造プロセスを用いて高機能研磨パッドを形成する方法及び装置 |
| JP2022002501A Active JP7434378B2 (ja) | 2015-10-16 | 2022-01-11 | 付加製造プロセスを用いて高機能研磨パッドを形成する方法及び装置 |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP3362224B1 (enExample) |
| JP (3) | JP6685392B2 (enExample) |
| KR (2) | KR102584551B1 (enExample) |
| CN (6) | CN112025544B (enExample) |
| SG (1) | SG10202106436WA (enExample) |
| TW (4) | TWI816269B (enExample) |
| WO (1) | WO2017066077A1 (enExample) |
Families Citing this family (61)
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| US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
| US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
| US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
| US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| CN107078048B (zh) | 2014-10-17 | 2021-08-13 | 应用材料公司 | 使用加成制造工艺的具复合材料特性的cmp衬垫建构 |
| US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
| US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
| US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
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| CN108136568B (zh) | 2020-10-09 |
| CN112025544B (zh) | 2022-11-01 |
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| KR20180056786A (ko) | 2018-05-29 |
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| CN112025544A (zh) | 2020-12-04 |
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| CN112059937B (zh) | 2022-11-01 |
| JP7434378B2 (ja) | 2024-02-20 |
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| JP2022064894A (ja) | 2022-04-26 |
| JP2018533487A (ja) | 2018-11-15 |
| JP2020124801A (ja) | 2020-08-20 |
| KR20230145211A (ko) | 2023-10-17 |
| CN112045556A (zh) | 2020-12-08 |
| JP7009542B2 (ja) | 2022-01-25 |
| CN112045557B (zh) | 2022-11-01 |
| EP3362224B1 (en) | 2024-08-14 |
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| CN112045555B (zh) | 2022-12-30 |
| EP3362224A1 (en) | 2018-08-22 |
| CN112045556B (zh) | 2022-06-28 |
| TWI754275B (zh) | 2022-02-01 |
| CN112059937A (zh) | 2020-12-11 |
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