TWI752394B - 用於微影設備中的基板固持器及器件製造方法 - Google Patents

用於微影設備中的基板固持器及器件製造方法 Download PDF

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Publication number
TWI752394B
TWI752394B TW108147528A TW108147528A TWI752394B TW I752394 B TWI752394 B TW I752394B TW 108147528 A TW108147528 A TW 108147528A TW 108147528 A TW108147528 A TW 108147528A TW I752394 B TWI752394 B TW I752394B
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TW
Taiwan
Prior art keywords
nodules
substrate
substrate holder
stiffness
group
Prior art date
Application number
TW108147528A
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English (en)
Chinese (zh)
Other versions
TW202030831A (zh
Inventor
喬漢斯 約瑟夫斯 梅森
安卓列 史卡德
赫曼 馬夸特
Original Assignee
荷蘭商Ａｓｍｌ荷蘭公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 荷蘭商Ａｓｍｌ荷蘭公司 filed Critical 荷蘭商Ａｓｍｌ荷蘭公司
Publication of TW202030831A publication Critical patent/TW202030831A/zh
Application granted granted Critical
Publication of TWI752394B publication Critical patent/TWI752394B/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Health & Medical Sciences (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW108147528A 2019-01-23 2019-12-25 用於微影設備中的基板固持器及器件製造方法 TWI752394B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP19153181 2019-01-23
EP19153181.3 2019-01-23

Publications (2)

Publication Number Publication Date
TW202030831A TW202030831A (zh) 2020-08-16
TWI752394B true TWI752394B (zh) 2022-01-11

Family

ID=65200697

Family Applications (2)

Application Number Title Priority Date Filing Date
TW108147528A TWI752394B (zh) 2019-01-23 2019-12-25 用於微影設備中的基板固持器及器件製造方法
TW110148137A TW202213622A (zh) 2019-01-23 2019-12-25 用於微影設備中的基板固持器及器件製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW110148137A TW202213622A (zh) 2019-01-23 2019-12-25 用於微影設備中的基板固持器及器件製造方法

Country Status (9)

Country Link
US (1) US20220115260A1 (ja)
EP (1) EP3915142A1 (ja)
JP (2) JP7269351B2 (ja)
KR (1) KR20210105415A (ja)
CN (1) CN113348543A (ja)
NL (1) NL2024454A (ja)
SG (1) SG11202107101PA (ja)
TW (2) TWI752394B (ja)
WO (1) WO2020151878A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023241893A1 (en) * 2022-06-15 2023-12-21 Asml Netherlands B.V. Substrate support and lithographic apparatus

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050248746A1 (en) * 2004-05-04 2005-11-10 Asml Netherland B.V. Lithographic apparatus, article support member, and method
TWI336422B (en) * 2005-12-08 2011-01-21 Molecular Imprints Inc Method for expelling gas positioned between a substrate and a mold
TW201724350A (zh) * 2015-10-09 2017-07-01 Ａｓｍｌ荷蘭公司 基板台及微影裝置
US20180259855A1 (en) * 2015-09-28 2018-09-13 Asml Netherlands B.V. A Substrate Holder, a Lithographic Apparatus and Method of Manufacturing Devices

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG2010050110A (en) 2002-11-12 2014-06-27 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
EP3049869B1 (en) * 2013-09-27 2017-11-08 ASML Netherlands B.V. Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method
US10353303B2 (en) * 2015-06-11 2019-07-16 Asml Netherlands B.V. Lithographic apparatus and method for loading a substrate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050248746A1 (en) * 2004-05-04 2005-11-10 Asml Netherland B.V. Lithographic apparatus, article support member, and method
TWI336422B (en) * 2005-12-08 2011-01-21 Molecular Imprints Inc Method for expelling gas positioned between a substrate and a mold
US20180259855A1 (en) * 2015-09-28 2018-09-13 Asml Netherlands B.V. A Substrate Holder, a Lithographic Apparatus and Method of Manufacturing Devices
TW201724350A (zh) * 2015-10-09 2017-07-01 Ａｓｍｌ荷蘭公司 基板台及微影裝置

Also Published As

Publication number Publication date
JP7269351B2 (ja) 2023-05-08
CN113348543A (zh) 2021-09-03
WO2020151878A1 (en) 2020-07-30
JP2023095890A (ja) 2023-07-06
US20220115260A1 (en) 2022-04-14
TW202213622A (zh) 2022-04-01
EP3915142A1 (en) 2021-12-01
KR20210105415A (ko) 2021-08-26
NL2024454A (en) 2020-08-18
TW202030831A (zh) 2020-08-16
JP2022517546A (ja) 2022-03-09
SG11202107101PA (en) 2021-07-29

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