TWI747330B - 可撓性印刷基板用銅箔 - Google Patents

可撓性印刷基板用銅箔 Download PDF

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Publication number
TWI747330B
TWI747330B TW109120157A TW109120157A TWI747330B TW I747330 B TWI747330 B TW I747330B TW 109120157 A TW109120157 A TW 109120157A TW 109120157 A TW109120157 A TW 109120157A TW I747330 B TWI747330 B TW I747330B
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TW
Taiwan
Prior art keywords
copper foil
copper
flexible printed
printed circuit
orientation
Prior art date
Application number
TW109120157A
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English (en)
Chinese (zh)
Other versions
TW202106885A (zh
Inventor
坂東慎介
石野裕士
Original Assignee
日商Ｊｘ金屬股份有限公司
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Application filed by 日商Ｊｘ金屬股份有限公司 filed Critical 日商Ｊｘ金屬股份有限公司
Publication of TW202106885A publication Critical patent/TW202106885A/zh
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Publication of TWI747330B publication Critical patent/TWI747330B/zh

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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
    • B21B1/40—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling foils which present special problems, e.g. because of thinness
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Conductive Materials (AREA)
TW109120157A 2019-07-10 2020-06-16 可撓性印刷基板用銅箔 TWI747330B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2019-128145 2019-07-10
JP2019128145A JP7186141B2 (ja) 2019-07-10 2019-07-10 フレキシブルプリント基板用銅箔

Publications (2)

Publication Number Publication Date
TW202106885A TW202106885A (zh) 2021-02-16
TWI747330B true TWI747330B (zh) 2021-11-21

Family

ID=74058821

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109120157A TWI747330B (zh) 2019-07-10 2020-06-16 可撓性印刷基板用銅箔

Country Status (4)

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JP (2) JP7186141B2 (enExample)
KR (2) KR20210007845A (enExample)
CN (1) CN112210689B (enExample)
TW (1) TWI747330B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7186141B2 (ja) * 2019-07-10 2022-12-08 Ｊｘ金属株式会社 フレキシブルプリント基板用銅箔
US20240072108A1 (en) 2021-02-01 2024-02-29 Rohm Co., Ltd. Sic semiconductor device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201309818A (zh) * 2011-08-23 2013-03-01 Jx Nippon Mining & Metals Corp 壓延銅箔
TW201910524A (zh) * 2017-08-03 2019-03-16 日商Ｊｘ金屬股份有限公司 可撓性印刷基板用銅箔、使用其之覆銅積層體、可撓性印刷基板及電子機器
TW201920700A (zh) * 2017-08-03 2019-06-01 日商Ｊｘ金屬股份有限公司 可撓性印刷基板用銅箔、使用其之覆銅積層體、可撓性印刷基板及電子機器

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2091634B (en) * 1981-01-22 1984-12-05 Gen Electric Transfer lamination of vapour deposited copper thin sheets and films
JPS616742U (ja) 1984-06-18 1986-01-16 株式会社大泉製作所 サ−ミスタ測温体
JPH01319641A (ja) * 1988-06-21 1989-12-25 Hitachi Cable Ltd 軟質圧延銅箔およびフレキシブルプリント基板
JP4118832B2 (ja) * 2004-04-14 2008-07-16 三菱伸銅株式会社 銅合金及びその製造方法
JP4992940B2 (ja) * 2009-06-22 2012-08-08 日立電線株式会社 圧延銅箔
CN107046768B (zh) * 2016-02-05 2019-12-31 Ｊｘ金属株式会社 柔性印刷基板用铜箔、使用它的覆铜层叠体、柔性印刷基板和电子器件
CN107046763B (zh) * 2016-02-05 2019-12-24 Ｊｘ金属株式会社 柔性印刷基板用铜箔、使用其的覆铜层叠体
JP6328679B2 (ja) * 2016-03-28 2018-05-23 Ｊｘ金属株式会社 フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器
JP2016211077A (ja) * 2016-07-26 2016-12-15 Ｊｘ金属株式会社 チタン銅
JP6617313B2 (ja) * 2017-08-03 2019-12-11 Ｊｘ金属株式会社 フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器
JP6442020B1 (ja) * 2017-10-12 2018-12-19 福田金属箔粉工業株式会社 硬質圧延銅箔及び該硬質圧延銅箔の製造方法
CN108246804B (zh) * 2018-01-12 2019-11-05 中色奥博特铜铝业有限公司 一种高弯折性能压延铜箔的制备方法
JP7186141B2 (ja) * 2019-07-10 2022-12-08 Ｊｘ金属株式会社 フレキシブルプリント基板用銅箔

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201309818A (zh) * 2011-08-23 2013-03-01 Jx Nippon Mining & Metals Corp 壓延銅箔
TW201910524A (zh) * 2017-08-03 2019-03-16 日商Ｊｘ金屬股份有限公司 可撓性印刷基板用銅箔、使用其之覆銅積層體、可撓性印刷基板及電子機器
TW201920700A (zh) * 2017-08-03 2019-06-01 日商Ｊｘ金屬股份有限公司 可撓性印刷基板用銅箔、使用其之覆銅積層體、可撓性印刷基板及電子機器

Also Published As

Publication number Publication date
JP7186141B2 (ja) 2022-12-08
KR20210007845A (ko) 2021-01-20
CN112210689B (zh) 2021-12-14
TW202106885A (zh) 2021-02-16
KR20220054767A (ko) 2022-05-03
CN112210689A (zh) 2021-01-12
JP2022095855A (ja) 2022-06-28
JP2021014603A (ja) 2021-02-12

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