GB2091634B - Transfer lamination of vapour deposited copper thin sheets and films - Google Patents

Transfer lamination of vapour deposited copper thin sheets and films

Info

Publication number
GB2091634B
GB2091634B GB8133585A GB8133585A GB2091634B GB 2091634 B GB2091634 B GB 2091634B GB 8133585 A GB8133585 A GB 8133585A GB 8133585 A GB8133585 A GB 8133585A GB 2091634 B GB2091634 B GB 2091634B
Authority
GB
United Kingdom
Prior art keywords
films
thin sheets
copper thin
deposited copper
vapour deposited
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8133585A
Other versions
GB2091634A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of GB2091634A publication Critical patent/GB2091634A/en
Application granted granted Critical
Publication of GB2091634B publication Critical patent/GB2091634B/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/06—Coating on the layer surface on metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/20—Inorganic coating
    • B32B2255/205—Metallic coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
GB8133585A 1981-01-22 1981-11-06 Transfer lamination of vapour deposited copper thin sheets and films Expired GB2091634B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US22729081A 1981-01-22 1981-01-22

Publications (2)

Publication Number Publication Date
GB2091634A GB2091634A (en) 1982-08-04
GB2091634B true GB2091634B (en) 1984-12-05

Family

ID=22852538

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8133585A Expired GB2091634B (en) 1981-01-22 1981-11-06 Transfer lamination of vapour deposited copper thin sheets and films

Country Status (5)

Country Link
JP (1) JPS57142355A (en)
DE (1) DE3200593A1 (en)
FR (1) FR2498125B1 (en)
GB (1) GB2091634B (en)
IT (1) IT1150131B (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4499152A (en) * 1982-08-09 1985-02-12 General Electric Company Metal-clad laminate construction
US4427716A (en) * 1983-01-21 1984-01-24 General Electric Company Method for predetermining peel strength at copper/aluminum interface
US4452664A (en) * 1983-08-01 1984-06-05 General Electric Company Method for predetermining peel strength at copper/aluminum interface
FR2554046B1 (en) * 1983-10-28 1986-05-09 Gen Electric METAL COVERED LAMINATE AND MANUFACTURING METHOD
GB2148182B (en) * 1983-11-03 1987-02-11 Gen Electric Metal-clad laminate construction
GB8333753D0 (en) * 1983-12-19 1984-01-25 Thorpe J E Dielectric boards
JPH0333469Y2 (en) * 1985-11-22 1991-07-16
JPS6287831U (en) * 1985-11-22 1987-06-04
EP0395871A3 (en) * 1989-05-05 1991-09-18 Gould Electronics Inc. Protected conductive foil and procedure for protecting an electrodeposited metallic foil during further processing
DE4009182A1 (en) * 1990-03-22 1991-09-26 Bayer Ag LAMINATED AREA
JP4754402B2 (en) * 2006-05-17 2011-08-24 三井金属鉱業株式会社 Copper foil with carrier foil, method for producing copper foil with carrier foil, surface-treated copper foil with carrier foil, and copper-clad laminate using the surface-treated copper foil with carrier foil
US7913381B2 (en) 2006-10-26 2011-03-29 Carestream Health, Inc. Metal substrate having electronic devices formed thereon
CN107889354A (en) * 2016-09-29 2018-04-06 Ｊｘ金属株式会社 The metal foil of appendix body, laminate, the manufacture method of the manufacture method of printing distributing board and e-machine
JP7186141B2 (en) * 2019-07-10 2022-12-08 Ｊｘ金属株式会社 Copper foil for flexible printed circuit boards

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL108173C (en) * 1954-06-25
US4100317A (en) * 1970-10-23 1978-07-11 Oike & Co., Ltd. Metal leaf
BE788117A (en) * 1971-08-30 1973-02-28 Perstorp Ab PROCESS FOR THE PRODUCTION OF ELEMENTS FOR PRINTED CIRCUITS
JPS4999779A (en) * 1973-01-09 1974-09-20
JPS5729878B2 (en) * 1973-03-10 1982-06-25
JPS49114772A (en) * 1973-03-10 1974-11-01
DE2413932C2 (en) * 1973-04-25 1984-08-30 Yates Industries, Inc., Bordentown, N.J. Process for the manufacture of a composite film for the formation of printed circuits
JPS5016624A (en) * 1973-06-08 1975-02-21
JPS514286A (en) * 1974-07-01 1976-01-14 Nippon Denkai Kk KINZOKUSUHAKUBARIGOSEIJUSHIBANNO SEIZOHOHO
US4091138A (en) * 1975-02-12 1978-05-23 Sumitomo Bakelite Company Limited Insulating film, sheet, or plate material with metallic coating and method for manufacturing same
US3969199A (en) * 1975-07-07 1976-07-13 Gould Inc. Coating aluminum with a strippable copper deposit
CH613152A5 (en) * 1976-08-13 1979-09-14 Uop Inc Process for producing a metallised laminate
JPS53115069A (en) * 1977-03-18 1978-10-07 Nippon Mining Co Method of producing printed circuit board

Also Published As

Publication number Publication date
FR2498125A1 (en) 1982-07-23
GB2091634A (en) 1982-08-04
IT1150131B (en) 1986-12-10
FR2498125B1 (en) 1989-03-31
IT8219222A0 (en) 1982-01-21
JPS57142355A (en) 1982-09-03
DE3200593A1 (en) 1982-09-02

Similar Documents

Publication Publication Date Title
GB8401911D0 (en) Transfer lamination of thin sheets/films
GB2082632B (en) Transfer lamination of vapour deposited foils method and product
JPS5590356A (en) Multilayer film structure resistant against layer separation
DE3275835D1 (en) Low gloss films of enhanced adhesion
JPS57121064A (en) Formation of surface-even thin film
GB2130189B (en) Vapour deposition of films
GB8310802D0 (en) Measuring thickness of thin layers
GB2091634B (en) Transfer lamination of vapour deposited copper thin sheets and films
DE3273531D1 (en) Discrete thin film capacitor
ZA857033B (en) Transfer metallizing film
GB8518833D0 (en) Forming moncrystalline thin film
GB2110983B (en) Dielectric films
AU4320985A (en) Film lamination and process thereof
GB8518834D0 (en) Forming moncrystalline thin film
AU555715B2 (en) Handling thin sheets of material
GB2181456B (en) Depositing metal films on dielectric substrates
GB2145433B (en) Transfer lamination of vapour deposited copper films
AU552461B2 (en) Film coating methol and apparatus
DE3274506D1 (en) Thin film capacitor
GB2098241B (en) Thin layer depositing apparatus
GB2049554B (en) Transfer printing of films sheets and foils
AU9023982A (en) Manifolds of strutted film
JPS57165832A (en) Thin film
DE3363295D1 (en) Dispenser of single film sheets
JPS57187926A (en) Laminated metallized film capacitor

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee