TWI745363B - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

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Publication number
TWI745363B
TWI745363B TW106109202A TW106109202A TWI745363B TW I745363 B TWI745363 B TW I745363B TW 106109202 A TW106109202 A TW 106109202A TW 106109202 A TW106109202 A TW 106109202A TW I745363 B TWI745363 B TW I745363B
Authority
TW
Taiwan
Prior art keywords
resin
resin composition
mass
epoxy resin
component
Prior art date
Application number
TW106109202A
Other languages
English (en)
Chinese (zh)
Other versions
TW201805324A (zh
Inventor
長嶋将毅
Original Assignee
日商味之素股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商味之素股份有限公司 filed Critical 日商味之素股份有限公司
Publication of TW201805324A publication Critical patent/TW201805324A/zh
Application granted granted Critical
Publication of TWI745363B publication Critical patent/TWI745363B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L45/00—Compositions of homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring system; Compositions of derivatives of such polymers
    • C08L45/02—Compositions of homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring system; Compositions of derivatives of such polymers of coumarone-indene polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesive Tapes (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW106109202A 2016-03-28 2017-03-20 樹脂組成物 TWI745363B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016064640A JP6776577B2 (ja) 2016-03-28 2016-03-28 樹脂組成物
JP2016-064640 2016-03-28

Publications (2)

Publication Number Publication Date
TW201805324A TW201805324A (zh) 2018-02-16
TWI745363B true TWI745363B (zh) 2021-11-11

Family

ID=59983725

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106109202A TWI745363B (zh) 2016-03-28 2017-03-20 樹脂組成物

Country Status (4)

Country Link
JP (1) JP6776577B2 (ko)
KR (2) KR102325456B1 (ko)
CN (1) CN107236251B (ko)
TW (1) TWI745363B (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6911806B2 (ja) * 2018-03-29 2021-07-28 味の素株式会社 樹脂組成物、シート状積層材料、プリント配線板及び半導体装置
JP7076263B2 (ja) * 2018-03-30 2022-05-27 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品
TWI688607B (zh) * 2018-10-04 2020-03-21 台光電子材料股份有限公司 樹脂組合物及由其製成之物品
JP7342358B2 (ja) * 2018-12-26 2023-09-12 住友ベークライト株式会社 樹脂組成物、それを用いたキャリア付樹脂膜、プリプレグ、積層板、プリント配線基板および半導体装置
CN113348195B (zh) * 2019-02-05 2022-05-31 普林科技有限公司 树脂组合物、清漆、层叠板以及印刷配线基板
WO2021024364A1 (ja) * 2019-08-06 2021-02-11 デクセリアルズ株式会社 接着剤組成物、熱硬化性接着シート及びプリント配線板
JP7512613B2 (ja) * 2020-03-03 2024-07-09 住友ベークライト株式会社 樹脂組成物、それを用いたキャリア付樹脂膜、プリプレグ、積層板、プリント配線基板および半導体装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5159004A (en) * 1988-11-18 1992-10-27 Sumitomo Chemical Company, Limited Thermoplastic resin composition
JP2014034580A (ja) * 2012-08-07 2014-02-24 Ajinomoto Co Inc 樹脂組成物
JP2015004009A (ja) * 2013-06-21 2015-01-08 味の素株式会社 樹脂組成物

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02160858A (ja) * 1988-12-15 1990-06-20 Sumitomo Chem Co Ltd 熱可塑性樹脂組成物
JPH05211251A (ja) * 1991-12-04 1993-08-20 Nippon Steel Chem Co Ltd 半導体封止用樹脂組成物
JP2524453B2 (ja) * 1992-06-12 1996-08-14 住友ベークライト株式会社 熱硬化性樹脂組成物
JP2000309678A (ja) * 1999-02-22 2000-11-07 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP3695521B2 (ja) 2000-08-01 2005-09-14 信越化学工業株式会社 液状エポキシ樹脂組成物及び半導体装置
JP6378533B2 (ja) * 2013-06-01 2018-08-22 日東電工株式会社 熱伝導性粘着シート
JP6452335B2 (ja) 2013-08-09 2019-01-16 日鉄ケミカル＆マテリアル株式会社 エポキシ樹脂組成物及びその硬化物
JP6235969B2 (ja) * 2014-06-23 2017-11-22 京セラ株式会社 圧縮成形用粉粒状樹脂組成物および樹脂封止型半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5159004A (en) * 1988-11-18 1992-10-27 Sumitomo Chemical Company, Limited Thermoplastic resin composition
JP2014034580A (ja) * 2012-08-07 2014-02-24 Ajinomoto Co Inc 樹脂組成物
JP2015004009A (ja) * 2013-06-21 2015-01-08 味の素株式会社 樹脂組成物

Also Published As

Publication number Publication date
JP6776577B2 (ja) 2020-10-28
CN107236251B (zh) 2021-03-02
KR102376003B1 (ko) 2022-03-21
TW201805324A (zh) 2018-02-16
KR20170113230A (ko) 2017-10-12
CN107236251A (zh) 2017-10-10
JP2017179014A (ja) 2017-10-05
KR20210114901A (ko) 2021-09-24
KR102325456B1 (ko) 2021-11-15

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