TWI742374B - Reduced pressure drying apparatus and reduced pressure drying method - Google Patents

Abstract

The subject of the present invention is to provide a technique for reducing the occurrence of uneven drying of the processing liquid when the processing liquid on the substrate is dried under reduced pressure.

In the present invention, a recess 12 is provided on the bottom surface 100 of the cavity 10, and an exhaust port 14 is provided on the bottom surface 120 of the recess 12. A first rectifying plate 30 is provided at a position overlapping with the exhaust port 14 in the Z-axis direction (the depth direction of the recess 12) in the accommodating space 10S. At the end (-X side end 32a or +X side end 32b) of the first rectifying plate 30 and the inner edge of the recess 12 (-X side edge 124a or +X side edge 124b) in the Z-axis direction A second rectifying plate 40 is provided at a position overlapping (the depth direction of the recess 12). The plurality of holding parts 52 hold the substrate 9 at a position above the first rectifying plate 30 and the second rectifying plate 40 (upper position L1 or lower position L2).

Description

Decompression drying device and decompression drying method

The present invention relates to a reduced-pressure drying device and a reduced-pressure drying method, and more particularly to a technique for drying a processing liquid coated on a substrate. The substrates to be processed include, for example, semiconductor substrates, liquid crystal display devices, and organic EL (Electroluminescence; electroluminescence) display devices such as FPD (Flat Panel Display) substrates, optical disk substrates, magnetic disk substrates, Substrates for optical disks, substrates for photomasks, ceramic substrates, substrates for solar cells, printed circuit boards, etc.

In the past, a substrate processing apparatus (for example, a liquid crystal panel manufacturing apparatus, etc.) has known a reduced-pressure drying apparatus that performs a reduced-pressure drying process on a substrate coated with a processing liquid on the surface. For example, in the photolithography step, there is the use of reduced pressure in order to appropriately dry the coating film of the resist solution applied on the substrate to be processed, such as a glass substrate, before pre-baking. The situation of the drying device.

A conventional representative reduced-pressure drying device, for example, as described in Patent Document 1, is performed by placing the substrate horizontally on a substrate support member of an appropriate height arranged in an openable and closable chamber, and then closing the chamber. Drying treatment under reduced pressure (for example, refer to Patent Documents 1 and 2).

In this type of reduced-pressure drying treatment, first, the chamber is evacuated by an external vacuum pump through an exhaust port provided in the chamber. By this vacuum exhaust, the pressure in the chamber has changed from the atmospheric pressure state to a reduced pressure state, and in this reduced pressure state, the solvent component evaporates from the resist coating film on the substrate. At the point in time when the pressure in the chamber is reduced to a certain pressure, the pressure in the chamber is ended. After that, inert gas (such as nitrogen) or air is ejected or diffused from the supply port provided in the chamber to make The pressure in the chamber returns to atmospheric pressure (recompresses the chamber). If the pressure in the chamber is restored, the chamber will be opened and the substrate will be removed from the chamber.

In the case of vacuum exhaust in the chamber, generally speaking, the closer to the exhaust port, the greater the flow rate of the ambient gas. When the flow rate is high, there is a possibility that the surface condition of the processing liquid on the substrate will be disordered, and there is a possibility that uneven drying may occur. In Patent Document 1, the middle plate is provided above the exhaust port provided at the bottom of the chamber. The exhaust port is covered by the middle plate to form an exhaust path from the middle plate and the bottom of the chamber to the exhaust port. In addition, Patent Document 2 also describes that a rectifying plate is arranged above the exhaust port provided at the bottom.

[Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 9-320949

[Patent Document 2] Japanese Patent Laid-Open No. 2004-47582

In the above-mentioned conventional technology, since the ambient gas is sucked in from the gap between the peripheral end of the middle plate and the side wall of the chamber, the flow velocity of the ambient gas in the region close to the gap becomes larger. Therefore, since the substrate is arranged on the periphery of the gap, there is a possibility that the processing liquid on the substrate will be unevenly dried, and there is room for improvement.

The present invention aims to provide a technique for reducing the occurrence of uneven drying of the processing liquid when the processing liquid on the substrate is dried under reduced pressure.

In order to solve the above-mentioned problems, the first aspect is a reduced-pressure drying device that dries the treatment liquid existing on the first major surface of the substrate having the first major surface and the second major surface by reducing the pressure; : Frame body, which has a storage space that can contain the substrate, and has a first surface facing the storage space; a recessed portion provided on the first surface; an exhaust port provided in the depth direction of the recessed portion Bottom surface; a suction mechanism that sucks the ambient gas in the storage space through the exhaust port; a first member, which is arranged in the storage space at a position overlapping the exhaust port in the depth direction; second A member, which is arranged in the housing space at a position spaced apart from the end of the first member and the inner edge of the recess along the depth direction, and is arranged in the depth direction from the end and the inner edge Overlapping position; and a substrate holding portion that holds the substrate in the accommodating space at a position opposite to the exhaust port with respect to the first member and the second member.

In the second aspect, in the reduced-pressure drying device of the first aspect, the substrate holding portion includes a plurality of pins supporting the second main surface of the substrate.

The third aspect is in the reduced-pressure drying device of the second aspect. The plurality of pins includes: a plurality of first pins arranged along the first direction; and a plurality of second pins, etc. The plurality of first pins are arranged along the first direction at intervals in a second direction orthogonal to the first direction; the second member is arranged on the plurality of first pins and the plurality of second Between pins.

The fourth aspect is the reduced-pressure drying device of the second aspect or the third aspect, and further includes: a moving drive portion that moves the plurality of pins along the depth direction to move the substrate at Move between the first substrate position and the second substrate position closer to the exhaust port than the first substrate position.

In the fifth aspect, in the reduced pressure drying device of the fourth aspect, the moving drive unit causes the substrate to be removed from the first The substrate position moves toward the above-mentioned second substrate position.

The sixth aspect is in the reduced-pressure drying device of any one of the first aspect to the fifth aspect, and the first member is provided between the second member and the exhaust port.

The seventh aspect is in the reduced-pressure drying device of the sixth aspect, in which at least a part of the first member is located in the concave portion.

The eighth aspect is in the reduced pressure drying device of the seventh aspect, in which all the first members are located in the recesses.

The ninth aspect is in the reduced-pressure drying device of the eighth aspect, wherein the end portion and the inner edge portion are on the same plane.

The tenth aspect is in the reduced pressure drying device of any one of the first aspect to the ninth aspect, the substrate holding portion holds the substrate in a horizontal posture with the first main surface facing upward in the vertical direction The first member, the second member, and the exhaust port are located on the second main surface side of the substrate held by the substrate holding portion.

The eleventh aspect is a reduced-pressure drying method in which the treatment liquid existing on the first major surface of a substrate having a first major surface and a second major surface is dried by reducing pressure; it has: a first step, which The above-mentioned substrate is carried into the above-mentioned storage space having a storage space and a frame body facing the first surface of the storage space; and a second step, which after the above-mentioned first step, passes through a recess provided on the above-mentioned first surface The exhaust port on the bottom surface in the depth direction sucks the ambient air in the storage space; the second step includes: being arranged in the storage space at a position overlapping the exhaust port in the depth direction The step of changing the direction of the airflow toward the exhaust port by the first member; and being spaced from both the end of the first member and the inner edge of the recess in the depth direction by being arranged in the accommodation space The step of changing the direction of the airflow toward the exhaust port by separating the second member at the position of the interval and the position overlapping with both the end portion and the inner edge portion in the depth direction.

According to the reduced-pressure drying device of the first aspect, since the upper side of the exhaust port is covered by the first member, when the ambient gas in the containing space is exhausted, the ambient gas above the first member can be prevented from facing the exhaust port In the case of being directly inhaled. In addition, since the gap between the edge of the recess and the end of the first member is covered by the second member, it can prevent the ambient air above the second member from being directly sucked into the gap. With these effects, the flow rate of the ambient gas around the substrate can be reduced, thereby reducing the occurrence of uneven drying of the treatment liquid.

According to the reduced-pressure drying device of the second aspect, since the second main surface is supported by a plurality of pins, the contact area can be reduced thereby, and therefore, the occurrence of uneven drying of the treatment liquid caused by the contact of the supporting member can be suppressed.

According to the reduced-pressure drying device of the third aspect, the direction of the airflow toward the exhaust port can be changed between the first pin and the second pin.

According to the reduced-pressure drying device of the fourth aspect, the substrate can be moved between the first substrate position far away from the exhaust port and the second substrate position close to the exhaust port. Therefore, the position of the substrate can be adjusted corresponding to the speed of the ambient gas sucked in by the exhaust port.

According to the decompression drying device of the fifth aspect, immediately after the decompression in the containing space starts, the substrate can be placed in a position away from the exhaust port with a faster airflow, and the flow velocity near the exhaust port can be reduced accordingly. After the pressure is lowered, the substrate is brought close to the exhaust port, thereby suppressing the influence of the flow rate. In addition, by bringing the substrate close to the vicinity of the exhaust port, the reduced-pressure drying of the processing liquid can be promoted.

According to the reduced-pressure drying device of the sixth aspect, the first member is arranged at a position closer to the exhaust port than the second member. In the vicinity of the exhaust port where the airflow becomes larger, the first member suppresses the direct inhalation of ambient air toward the exhaust port. Therefore, the influence of air flow when the processing liquid on the first main surface of the substrate is dried can be reduced, and uneven drying of the processing liquid can be suppressed.

According to the reduced-pressure drying device of the seventh aspect, since at least a part of the first member is located in the recessed portion, the portion of the first member exposed to the outside of the recessed portion can be reduced. As a result, a large space in which the substrate can be arranged in the storage space can be ensured.

According to the reduced-pressure drying device of the eighth aspect, since the first members are all located in the recesses, it is possible to ensure a large space in the storage space where the substrate can be arranged.

According to the vacuum drying device of the ninth aspect, since the end of the first member and the inner edge of the recess are on the same plane, when the ambient gas passes through the gap between the end of the first member and the inner edge of the recess, It can reduce the chaos of the airflow.

According to the decompression drying device of the tenth aspect, when the surface of the substrate with the processing liquid is arranged in a vertical upward state, the ambient gas in the containing space is sucked through the exhaust port, thereby enabling the surrounding gas The ambient gas moves toward the lower side in the vertical direction.

According to the reduced-pressure drying method of the 11th aspect, since the upper part of the exhaust port is covered by the first member, when the ambient gas in the containing space is exhausted, the ambient gas above the first member can be prevented from facing the exhaust port In the case of being directly inhaled. In addition, since the gap between the edge of the recess and the end of the first member is covered by the second member, it can prevent the ambient air above the second member from being directly sucked into the gap. With these effects, the flow rate of the ambient gas around the substrate can be reduced, thereby reducing the occurrence of uneven drying of the treatment liquid.

1. 1A‧‧‧Decompression drying device

9‧‧‧Substrate

10‧‧‧Chamber (frame)

10P‧‧‧Open and close

10S‧‧‧Containment Space

12‧‧‧Concave

12a‧‧‧-X side recess

12b‧‧‧+X side recess

14‧‧‧Exhaust port

20‧‧‧Suction mechanism

30‧‧‧The first rectifier plate (the first member)

30a‧‧‧-X side first rectifier plate

30b‧‧‧+X side 1st rectifier plate

32a‧‧‧-X side end

32b‧‧‧+X side end

34a‧‧‧-X side clearance

34b‧‧‧+X side clearance

40, 40a, 40b, 40c, 40d‧‧‧Second rectifier plate (second member)

50‧‧‧Lifting mechanism

52, 52a, 52b‧‧‧Supporting part (substrate holding part)

54‧‧‧Lift drive unit (mobile drive unit)

70‧‧‧Control Department

80‧‧‧Finger

90‧‧‧Upper surface

100‧‧‧Bottom (1st side)

102‧‧‧Outer surface

104‧‧‧Wall

120‧‧‧Bottom

122‧‧‧Inner wall

124a‧‧‧-X side edge (inner edge)

124b‧‧‧+X side edge (inner edge)

520‧‧‧Lift board

522‧‧‧pin

L1‧‧‧Up position (1st board position)

L2‧‧‧Lower position (2nd board position)

Fig. 1 is a schematic plan view showing the inside of the chamber 10 of the reduced-pressure drying apparatus 1 of the embodiment viewed from the upper side in the vertical direction.

FIG. 2 is a schematic plan view showing the inside of the chamber 10 without the four second rectifying plates 40 and the lifting mechanism 50 of the reduced-pressure drying device 1 of the embodiment viewed from the upper side in the vertical direction.

Fig. 3 is a schematic cross-sectional view of the reduced-pressure drying device 1 along the line A-A in Fig. 1.

4 is a schematic cross-sectional view showing the reduced-pressure drying apparatus 1 when the substrate 9 to be processed is carried in.

FIG. 5 is a schematic cross-sectional view showing the reduced-pressure drying device 1 when the exhaust is started.

FIG. 6 is a schematic cross-sectional view showing the reduced-pressure drying device 1 when a predetermined time has passed after the start of exhausting.

FIG. 7 is a schematic cross-sectional view showing the reduced-pressure drying apparatus 1 when the processed substrate 9 is carried out to the outside.

FIG. 8 is a diagram showing a reduced-pressure drying device 1A of a modified example.

Hereinafter, the embodiments of the present invention will be described with reference to the accompanying drawings. In addition, the constituent elements described in this embodiment are only examples, and are not intended to limit the scope of the present invention to only these constituent elements. In the drawings, for ease of understanding, there are cases where the size or quantity of each part is illustrated exaggeratedly or briefly as needed.

Unless otherwise specified, it means the expression of relative or absolute positional relationship (such as "toward one direction", "along one direction", "parallel", "orthogonal", "center", "concentric", "coaxial" ", etc.), not only strictly expressing the positional relationship, but also expressing the state of relative displacement of the angle or distance within the range of tolerance or the same degree of function can be obtained. Unless otherwise specified, the representation of an equal state (such as "identity", "equal", "homogeneous", etc.) not only refers to a quantitatively strictly equal state, but also means that there is a tolerance or that the same can be obtained The poor state of the function of the degree. Unless otherwise specified, expressions of shapes (such as "quadrilateral" or "cylindrical", etc.) are not only those that strictly express geometrically these shapes, but also within the range where the same degree of efficacy can be obtained. It also means that, for example, it has a shape such as unevenness or chamfering. The expression of "install", "have", "have", "include" or "have" one component is not an exclusive expression excluding the existence of other components. Unless otherwise specified, the so-called "~above", in addition to the case where two components are connected, also includes the case where two components are separated.

<1. Implementation mode>

Fig. 1 is a schematic plan view showing the inside of the chamber 10 of the reduced-pressure drying apparatus 1 of the embodiment viewed from the upper side in the vertical direction. Fig. 2 is a schematic plan view showing the inside of the chamber 10 without the four second rectifying plates 40 and the lifting mechanism 50 of the reduced-pressure drying apparatus 1 of the embodiment viewed from the upper side in the vertical direction. Fig. 3 is a schematic cross-sectional view of the reduced-pressure drying device 1 along the line A-A in Fig. 1.

In each figure, in order to clarify the positional relationship of each part of the reduced-pressure drying apparatus 1, the X-axis, Y-axis, and Z-axis are indicated. In this example, the X-axis direction and the Y-axis direction are horizontal directions, and the Z-axis direction is a vertical direction. In each axis, set the direction of the front end of the arrow as the + (positive) direction, and set the opposite direction as the-(negative) direction. Set the vertical direction upward as "+Z direction" and downward as "-Z direction". The positional relationship of each part described below is only an example, and is not intended to be limited to these positional relationships.

The reduced-pressure drying device 1 includes a chamber 10. The chamber 10 has a rectangular parallelepiped shape, and is a frame with a housing space 10S inside. The reduced-pressure drying device 1 accommodates the substrate 9 in the housing space 10S, and performs a reduced-pressure drying process of drying the treatment liquid coated on the upper surface 90 (first main surface) of the substrate 9 by reducing the pressure.

An opening/closing part 10P is provided in a portion of the +Y side wall of the chamber 10 close to the +Z side. The opening and closing portion 10P is formed between the outside of the chamber 10 and the receiving space 10S of the chamber 10 to pass through the opening of the substrate 9. In addition, the opening and closing portion 10P closes the opening to block the outside from the housing space 10S, so that the substrate 9 cannot pass through.

The chamber 10 has a bottom surface 100 facing the receiving space 10S. The bottom surface 100 becomes a horizontal plane. Four recesses 12 are provided on the bottom surface 100. The four recesses 12 include two -X-side recesses 12a arranged on the -X side, and two +X-side recesses 12b arranged on the +X side.

The number of recesses 12 is not limited to four, and can be changed arbitrarily. For example, only one recess 12 may be provided.

Hereinafter, description will be given focusing on one recess 12. The recess 12 has a shape recessed from the bottom surface 100 in the -Z direction. Although the recess 12 is rectangular when viewed from the upper side in the vertical direction, it is not essential. The bottom surface 120 of the depth direction (Z-axis direction) of the recess 12 becomes a horizontal plane. The recess 12 has an inner wall surface 122 that rises upward in the vertical direction from the outer peripheral portion of the bottom surface 120. The inner wall surface 122 has a portion extending in the vertical direction so as to be perpendicular to the bottom surface 120. By extending the inner wall surface 122 in the vertical direction, the flow of the ambient gas toward the exhaust port 14 can be rectified to the vertical direction.

An exhaust port 14 is provided on the bottom surface 120 of the recess 12. That is, the reduced-pressure drying device 1 has four exhaust ports 14. The exhaust port 14 is connected to the accommodating space 10S via the recess 12. The exhaust port 14 is connected to the suction mechanism 20. The suction mechanism 20 has a vacuum pump (not shown) that operates in response to a control command from the control unit 70. The suction mechanism 20 sucks the ambient gas in the absorption volume 10S through the exhaust port 14 according to the control command, and discharges it to the outside.

The reduced-pressure drying device 1 includes four first rectifying plates 30 (first members). In this example, one first rectification plate 30 is arranged inside each of the four recesses 12. The four first rectification plates 30 include two of the two -X-side recesses 12a each having one inside each. One -X-side first rectifying plate 30a and two +X-side first rectifying plates 30b are respectively arranged inside the two +X-side recesses 12b.

Each first rectifying plate 30 is arranged at a position overlapping the exhaust port 14 in the Z-axis direction in the housing space 10S. That is, for each first rectifying plate 30, when the first rectifying plate 30 and the exhaust port 14 are seen in a plan view from the upper side in the vertical direction toward the downward (-Z direction) in the vertical direction, the first rectifying plate 30 is It is arranged at a position overlapping with the exhaust port 14 in the containing space 10S. The first rectifying plate 30 is arranged at a position spaced apart from the exhaust port 14 in the Z-axis direction. The first rectifying plate 30 is a plate-shaped member, which is smaller than the opening of each recess 12 when viewed in the depth direction and larger than the opening of each exhaust port 14. The first rectifying plate 30 is arranged in a posture parallel to the horizontal plane. That is, when the first rectifying plate 30, the recessed portion 12, and the exhaust port 14 are viewed in a plan view from the upper side in the vertical direction toward the downward (-Z direction) in the vertical direction, the first rectifying plate 30 is smaller than the opening of the recessed portion 12. It is larger than the opening of the exhaust port 14. Furthermore, the opening of the recess 12 is a part of the space in the recess 12 connected to the space above the recess 12 in the accommodating space 10S, and the opening of the exhaust port 14 is the space in the exhaust port 14 connected to the space in the recess 12 Part of the space.

The entirety of each first rectifying plate 30 is arranged in the corresponding recess 12. In this example, the upper surface of each first rectifying plate 30 and the outer surface 102 including the end of the corresponding recess 12 are located at the same height. The upper surface of each first rectifying plate 30 is flush with the outer surface 102, and the outer surface 102 includes the inner edge portion of the bottom surface 100 as the inner edge portion of the corresponding concave portion 12 surrounding the periphery of each concave portion 12. That is, the upper surface of the first rectifying plate 30 and the outer surface 102 are located on the same plane, and the outer surface 102 includes the bottom surface 100 as the inner edge portion of the recess 12 corresponding to the first rectifying plate 30. The inner edge of the periphery of the recess 12. In this way, by disposing the first rectifying plate 30 in the recess 12, the space where the substrate 9 can be arranged in the housing space 10S can be increased. In addition, the length dimension in the Z-axis direction of the storage space 10S can be reduced.

Furthermore, a part of the first rectifying plate 30 may also be inside the recess 12 and further to the bottom surface 120 side (−Z side) than the outer surface 102. That is, a part of the first rectifying plate 30 may be outside the recess 12 and above the outer surface 102 (+Z side). In this way, even if it is a part, the length of the cavity 10 in the Z-axis direction can be reduced by putting the first rectifying plate 30 in the recess 12.

A gap is provided between the first rectifying plate 30 and the inner edge of the rectangle of the recess 12. In detail, a -X side gap 34a is provided between the -X side end 32a of the first rectifying plate 30 and the -X side edge 124a of the recess 12, and the +X side end of the first rectifying plate 30 A +X side gap 34b is provided between 32b and the +X side edge 124b of the recess 12. The -X-side end 32a is located at the -X-side end of the first rectifying plate 30, the -X-side edge 124a is located at the -X-side edge of the recess 12, and the +X-side end 32b is located at the first rectification The +X-side end of the plate 30 and the +X-side edge 124b are located at the +X-side edge of the recess 12.

The reduced-pressure drying device 1 includes four second rectifying plates 40 (second members). The four second rectifying plates 40 extend from the -X side to the +X side, and sequentially include the second rectifying plates 40a, 40b, 40c, and 40d. That is, from the -X side to the +X side, the second rectifying plate 40a, the second rectifying plate 40b, the second rectifying plate 40c, and the second rectifying plate 40d are arranged in the order described above. The four second rectifying plates 40a, 40b, 40c, and 40d have rectangular plate shapes, respectively. The four second rectifying plates 40a, 40b, 40c, and 40d have the same length in the Y-axis direction. In addition, the two second rectifying plates 40a and 40d have the same width in the X-axis direction, and the two second rectifying plates 40b and 40c have the same width in the X-axis direction. The two second rectifying plates 40a, 40d are arranged at an interval along the X-axis direction, and two second rectifying plates 40b, 40c are arranged between the two. The two second rectifying plates 40b and 40c are also arranged at a distance from each other along the X-axis direction. The two second rectifying plates 40a and 40b are also arranged at a distance from each other along the X-axis direction. The two second rectifying plates 40c and 40d are also arranged at a distance from each other along the X-axis direction.

Each of the second rectifying plates 40a, 40b, 40c, and 40d is arranged at intervals along the Z-axis direction with respect to both the outer peripheral end portion of the first rectifying plate 30 and the outer surface 102, and is arranged to overlap in the Z-axis direction Location. That is, when the second rectifying plate 40a, 40b, 40c, 40d, the first rectifying plate 30, and the outer surface 102 are seen through the second rectifying plate 40a, 40b, 40c, 40d, the first rectifying plate 30, and the outer surface 102 when viewed from the upper side of the vertical direction toward the downward (-Z direction) in the vertical direction The plates 40a, 40b, 40c, and 40d are respectively arranged at positions overlapping with both the outer peripheral end portion of the first rectifying plate 30 and the inner edge portion of the recess 12 in the housing space 10S.

For example, the second rectifying plate 40a located on the most -X side is opposite to the -X side end 32a including the two -X side first rectifying plates 30a in the Z-axis direction, and two opposite to the two- The -X side edge portion 124a (inner edge portion) of the X side concave portion 12a overlaps with a portion of the outer surface 102. That is, when the second rectifying plate 40a, the first rectifying plate 30, and the outer surface 102 are seen through the second rectifying plate 40a, the first rectifying plate 30, and the outer surface 102 from the upper side of the vertical direction toward the downward (-Z direction) in the vertical direction, the second rectifying plate 40a is arranged in the housing In the space 10S, the -X side edge portions 32a of the two -X side first rectifying plates 30a, and the -X side edge portions of the two -X side recesses 12a opposed to the -X side end portions 32a, respectively The position where the two sides of 124a overlap. That is, the second rectifying plate 40a covers the upper side of the -X side gap 34a of the two -X side recesses 12a.

In the Z-axis direction, the second rectifying plate 40b is connected to the +X side end 32b including the two -X side first rectifying plate 30a and the +X side edge of the two -X side recesses 12a facing the same The outer surface 102 of the portion 124b (inner edge portion) partially overlaps. That is, when the second rectifying plate 40b, the first rectifying plate 30, and the outer surface 102 are seen through the second rectifying plate 40b, the first rectifying plate 30, and the outer surface 102 from the upper side in the vertical direction toward the downward (-Z direction) in the vertical direction, the second rectifying plate 40b is arranged in the housing In the space 10S, the +X-side edge portions 32b of the two -X-side first rectifying plates 30a and the +X-side edge portions 124b of the two -X-side concave portions 12a opposed to the +X-side end portions 32b, respectively The position where the two sides overlap. That is, the second rectifying plate 40b covers the upper side of the +X-side gap 34b of the two -X-side recesses 12a.

In the Z-axis direction, the second rectifying plate 40c is connected to the -X side end 32a including the two +X-side first rectifying plates 30b and the -X side edge of the two +X-side recesses 12b facing the same The outer surface 102 of the portion 124a (inner edge portion) partially overlaps. That is, when the second rectifying plate 40c, the first rectifying plate 30, and the outer surface 102 are seen through the second rectifying plate 40c, the first rectifying plate 30, and the outer surface 102 from the upper side in the vertical direction toward the downward (-Z direction) in the vertical direction, the second rectifying plate 40c is arranged in the housing In the space 10S, the -X side ends 32a of the two +X side first rectifying plates 30b, and the two +X side recesses 12b facing the -X side ends 32a are respectively -X side The position where both sides of the edge 124a overlap. That is, the second rectifying plate 40c covers the upper side of the -X side gap 34a of the two +X side recesses 12b.

The second rectifying plate 40d located on the most +X side, in the Z-axis direction, includes two +X-side end portions 32b of the +X-side first rectifying plate 30b, and two +X-side recesses facing the same Part of the outer surface 102 of the +X side edge portion 124b (inner edge portion) of 12b overlaps. That is, when looking through the second rectifying plate 40d, the first rectifying plate 30, and the outer surface 102 from the upper side in the vertical direction toward the downward (-Z direction) in the vertical direction, the second rectifying plate 40d is arranged in the housing In the space 10S, the +X-side end portions 32b of the two +X-side first rectifying plates 30b, and the +X-side edge portions of the two +X-side recesses 12b opposed to the +X-side end portions 32b, respectively The position where the two sides of 124b overlap. That is, the second rectifying plate 40d covers the upper side of the +X-side gap 34b of the two +X-side recesses 12b.

The elevating mechanism 50 supports the substrate 9 above the plurality of second rectifying plates 40 and moves the substrate 9 up and down in the vertical direction. The lifting mechanism 50 includes six supporting parts 52 and a lifting driving part 54.

The six support portions 52 are arranged on the side opposite to the exhaust port 14 with respect to the first rectifying plate 30. That is, the six support portions 52 and the exhaust port 14 are arranged at positions on opposite sides of each other with the first rectifying plate 30 interposed therebetween. The six support portions 52 include three support portions 52a and three support portions 52b. The support portions 52a and 52b are respectively provided with a lift plate 520 extending in the Y-axis direction, and a plurality of pins 522 arranged on one lift plate 520 at intervals in the Y-axis direction. In this example, one support part 52a, one support part 52b is arranged at a position near the -X side, a position near the center of the X axis direction, and a position near the +X side in the storage space 10S. Viewed from the upper side in the vertical direction, between the second rectifying plate 40a and the second rectifying plate 40b, between the second rectifying plate 40b and the second rectifying plate 40c, and between the second rectifying plate 40c and the second rectifying plate 40d One support part 52a, one support part 52b is respectively arrange|positioned. The substrate 9 is supported on the upper ends of the plurality of pins 522 provided in the support portion 52a or the support portion 52b, and is held on the side opposite to the exhaust port 14 with respect to the first rectifying plate 30 and the second rectifying plate 40 Location. That is, the substrate 9 is held at a position opposite to the exhaust port 14 with the first rectifying plate 30 and the second rectifying plate 40 as a reference.

The lift drive part 54 is connected to the lift plate 520 of each of the three support parts 52a and the three support parts 52b, and individually lifts these up and down in a vertical direction. The driving force of the elevating driving part 54 as a moving driving part may also be transmitted through a rod-shaped member (not shown) that penetrates the bottom surface 100 of the chamber 10 and is connected to the lower surface of the elevating plate 520. The support portion 52a and the support portion 52b are respectively raised and lowered in the vertical direction by the driving force of the raising and lowering driving portion 54. Furthermore, two or more support portions 52 among the six support portions 52 can also be directly connected in a manner of integral lifting and lowering. For example, the three support portions 52a may be connected to each other to be raised and lowered integrally. In addition, the three support portions 52b may be connected to each other and raised and lowered integrally. In such a case, since the movement axis (rod-shaped member) of the up-and-down drive portion 54 can be reduced, the structure of the up-and-down drive portion 54 can be simplified.

The plurality of pins 522 included in the support portion 52a are arranged in a manner different from the positions of the plurality of pins 522 included in the support portion 52b in the Y-axis direction. The reason for this is to correspond to substrates 9 of various sizes. In addition, the position of each pin 522 is not limited to this, and can be set arbitrarily.

For example, the plural pins 522 provided in the support portion 52a on the -X side are an example of plural first pins arranged along the Y-axis direction. The plurality of pins 522 provided in the support portion 52a in the center of the X-axis direction are arranged along the Y-axis direction at intervals along the X-axis direction with respect to the plurality of pins 522 provided in the support portion 52a on the -X side An example of the plural second pins. The second rectifying plate 40b is an example of the second member arranged between the plurality of first pins and the plurality of second pins.

In addition, the plurality of pins 522 provided in the support portion 52a in the center of the X-axis direction is an example of a plurality of first pins, and the plurality of pins 522 provided in the support portion 52a on the +X side is an example of the plurality of second pins. One case. The second rectifying plate 40c is an example of the second member arranged between the plurality of first pins and the plurality of second pins.

The reduced-pressure drying device 1 includes a control unit 70. The control unit 70 may also be configured with a CPU (Central Processing Unit) for performing various arithmetic processing, and a ROM (Read-Only Memory) as a memory dedicated to reading for storing basic programs. , RAM (Random Access Memory; random access memory) is a general computer that stores all kinds of information that can be read and written freely. The control unit 70 may also be provided with an auxiliary storage device for storing control application software (program) or various data. Various functions can be realized by the CPU operating with the control application software. The control unit 70 is communicably connected to the opening/closing unit 10P, the suction mechanism 20, and the lifting drive unit 54, and sends control commands to these, thereby controlling these operations.

<Action description>

The operation of the reduced-pressure drying process of the reduced-pressure drying device 1 having the above-mentioned configuration will be described. Furthermore, unless otherwise specified, the operation of the reduced-pressure drying device 1 is executed in accordance with the control command from the control unit 70.

Fig. 4 is a schematic side view showing the reduced-pressure drying apparatus 1 when the substrate 9 to be processed is carried in. The reduced-pressure drying process includes a carrying-in step S1 of carrying the substrate 9 to be processed (the substrate 9 coated with the processing liquid on the upper surface 90) into the housing space 10S of the chamber 10 from the outside.

In the carry-in step S1, the control unit 70 arranges a plurality of support portions 52 (three support portions 52a in the example shown in FIG. 4) corresponding to the support of the substrate 9 to be processed in a predetermined vertical position. The predetermined vertical position is the predetermined position in the vertical direction. After that, the control unit 70 opens the opening and closing unit 10P. The substrate 9 is carried into the storage space 10S by a transport device (not shown) through the opened opening and closing portion 10P. Then, a conveying device not shown places the substrate 9 on each pin 522 of the plurality of support portions 52. As a result, the substrate 9 is held at the upper position L1 (first substrate position).

The conveying device may include, for example, a plurality of fingers 80 extending in the Y-axis direction that support the lower surface of the substrate 9. The plurality of fingers 80 may include one or more fingers 80 that enter between the support part 52b arranged at the side of -X and the support part 52a arranged at the central position, and the finger part 80 that can enter the support part 52a arranged at the central position. One or more fingers 80 (refer to FIG. 4) at a position between the support portion 52b and the support portion 52a arranged at the +X side position. Each finger 80 of the support substrate 9 is made to enter the accommodating space 10S through the opening and closing portion 10P, and thereafter, each finger 80 is moved downward between the corresponding support portions 52. Thereby, the substrate 9 is transferred to each support portion 52 in a state where each finger 80 and each support portion 52 do not interfere.

Fig. 5 is a schematic side view showing the reduced-pressure drying device 1 when the exhaust is started. When the carrying-in step S1 ends, the exhaust step S2 is performed. In the exhaust step S2, the control unit 70 activates the suction mechanism 20 to exhaust the ambient gas in the storage space 10S from the plurality of exhaust ports 14.

As shown in FIG. 5, the ambient gas in the containing space 10S moves toward the exhaust port 14. Here, the direction in which the ambient gas in the storage space 10S moves toward the exhaust port 14 is changed by the second rectifying plates 40a-40d. In detail, the traveling direction of the ambient gas on the second rectifying plates 40a, 40b, 40c, and 40d is changed to the horizontal direction toward the ends by the upper surfaces as horizontal planes. Then, the ambient gas passes downward through the gap between the second rectifying plate 40a and the second rectifying plate 40b, the gap between the second rectifying plate 40b and the second rectifying plate 40c, the gap between the second rectifying plate 40c and the second rectifying plate 40d, and The gaps between the walls 104 on the four sides of the containing space 10S and the ends of the second rectifying plates 40a, 40b, 40c, and 40d move downwards of the second rectifying plates 40a, 40b, 40c, and 40d.

In addition, the direction in which the ambient gas moves toward the exhaust port 14 is changed by the plurality of first rectifying plates 30. In detail, the traveling direction of the ambient gas moving below the second rectifying plates 40a, 40b, 40c, 40d is determined by the plurality of first rectifying plates 30 (-X side first rectifying plates 30a and + The upper surface of the X-side first rectifying plate 30b) is changed to a horizontal direction toward the ends (including the -X-side end 32a and the +X-side end 32b) of the plurality of first rectifying plates 30. In addition, the traveling direction of the ambient gas moving below the second rectifying plates 40a, 40b, 40c, 40d is changed to the direction of the bottom surface 100 (outer surface 102) as the bottom surface 100 (outer surface 102) as a horizontal plane. ) Is the horizontal direction of the inner edge of the recess 12 at the end. Thereafter, the ambient gas flows in the gap between the inner edge portion of the recess 12 (including the -X side edge portion 124a and the +X side edge portion 124b) and the peripheral end of the first rectifying plate 30 (including the -X side gap 34a and +X). The side gap 34b) moves downward, thereby entering each recess 12. Then, it is discharged to the outside through the exhaust port 14 in each recess 12.

After the exhaust step S2 is started, since there is a large amount of ambient gas in the containing space 10S, the flow velocity of the ambient gas will increase near the exhaust port 14. In the present embodiment, after the exhaust step S2 is started, the substrate 9 is arranged at the first substrate position L1 away from the vicinity of the exhaust port 14 whose flow velocity becomes so fast, thereby preventing the coating on the upper surface 90 from being applied. The surface of the treatment liquid is chaotic and bumping. Thereby, the occurrence of uneven drying in the treatment liquid can be reduced.

Fig. 6 is a schematic side view showing the reduced-pressure drying device 1 when a predetermined time has passed after the start of exhausting. During the exhaust step S2, the descending step S3 is performed. In the lowering step S3, the control unit 70 lowers the plurality of support portions 52 after a predetermined time (first predetermined time) has elapsed after the start of exhaust. Thereby, the board|substrate 9 moves from the upper position L1 to the lower position L2 (2nd board|substrate position). The lower position L2 is a position closer to the exhaust port 14 on the lower side in the vertical direction than the upper position L1.

Since the lower position L2 is closer to the exhaust port 14 than the upper position L1, the ambient gas is relatively lean and the gas pressure is lower. Therefore, by arranging the substrate 9 in the lower position L2, the processing liquid of the substrate 9 can be efficiently dried. Here, even if the substrate 9 is arranged at the lower position L2, since the flow velocity of the ambient gas around the substrate 9 is small, the possibility of causing disorder on the surface of the processing liquid or bumping of the processing liquid is low. The reason is that the first predetermined time has passed since the start of exhaust.

FIG. 7 is a schematic side view showing the reduced-pressure drying apparatus 1 when the processed substrate 9 is carried out to the outside. When the exhaust step S3 ends, the unloading step S4 is performed. In the unloading step S4, the control unit 70 stops the exhaust after a predetermined time (the second predetermined time) has elapsed after starting the exhaust. Thereby, the flow of the ambient gas remaining in the containing space 10S is stopped. Then, by opening the atmosphere of the containing space 10S, the air pressure in the containing space 10S is restored. The opening to the atmosphere of the storage space 10S may be performed through the exhaust port 14, or may be performed through an unshown suction port.

In the unloading step S4, the control section 70 raises the plurality of support sections 52 supporting the substrate 9 to move the substrate 9 from the lower position L2 to the upper position L1. Furthermore, the opening of the storage space 10S to the atmosphere may be performed after the substrate 9 is moved from the lower position L2 to the upper position L1, or during the period during which the substrate 9 is moved from the lower position L2 to the upper position L1.

In addition, when the control unit 70 opens the opening and closing portion 10P, a transport device not shown receives the substrate 9 supported at the upper position L1 via the opened opening and closing portion 10P, and carries the substrate 9 out of the storage space 10S.

As shown in FIGS. 5 and 6, in the reduced-pressure drying device 1, an exhaust port 14 is provided in a recessed portion 12 that is an excavation portion provided on the bottom surface 100 of the chamber 10. Therefore, since the opening of the recessed portion 12 is larger than that of the exhaust port 14, the external opening area of the exhaust port 14 can be increased. Thereby, in the exhaust step S2, the flow velocity of the ambient gas toward the exhaust port 14 can be reduced.

As shown in FIGS. 5 and 6, in the reduced-pressure drying device 1, the first rectifying plate 30 covers the upper side of the exhaust port 14. The first rectifying plate 30 can prevent the ambient air above the first rectifying plate 30 of the accommodating space 10S from being directly sucked into the exhaust port 14. Since the ambient gas is sucked in from the periphery of the first rectifying plate 30 to below the first rectifying plate 30, the suction port of the ambient gas viewed from the substrate 9 can be enlarged and dispersed in appearance. In this way, the flow rate of the ambient gas around the substrate 9 can be reduced.

As shown in Figures 5 and 6, in the reduced-pressure drying device 1, the second rectifying plate 40 (second rectifying plates 40a, 40b, 40c, 40d) is used to cover the inner edge of the recess 12 and the first rectifying plate 30 Above the end of the gap (-X side gap 34a and +X side gap 34b). This prevents the ambient air directly above the second rectifying plate 40 from being directly sucked into the gap between the recess 12 and the first rectifying plate 30. Since the ambient gas is sucked under the second rectifying plate 40 from the periphery of the second rectifying plate 40, the suction port of the ambient gas viewed from the substrate 9 can be enlarged in appearance and can be dispersed. In this way, the flow rate of the ambient gas around the substrate 9 can be reduced.

As shown in Figures 5 and 6, the gap between the second rectifying plate 40 and the first rectifying plate 30, the gap between the second rectifying plate 40 and the bottom surface 100 (outer surface 102), and the gap between the first rectifying plate 30 and the bottom surface 120 , Respectively extend along the horizontal direction. Therefore, as the ambient gas in the accommodating space 10S passes through the gaps before reaching the exhaust port 14 provided on the lower side in the vertical direction, the direction of the air flow is changed into a zigzag shape in the vertical direction and the horizontal direction. In this case, compared to the case where the first rectifying plate 30 and the second rectifying plate 40 are not provided, the total distance of the passage through which the ambient gas flows can be made longer. Thereby, the flow velocity of the ambient gas can be reduced.

By making the first rectifying plate 30 and the second rectifying plate 40 into a flat plate shape, it is possible to suppress the chaos of the air flow on these surfaces. In addition, by setting the bottom surface 100 (outer surface 102) of the chamber 10 and the bottom surface 120 of the recess 12 as flat surfaces, it is possible to prevent the airflow from being chaotic on these surfaces.

<2. Modifications>

Although the embodiments have been described above, the present invention is not limited to those described above, and various modifications can be made.

In the above embodiment, the exhaust port 14 is provided on the bottom surface 120 of the depth direction of the recess 12, but it may be provided on the inner wall surface 122 of the recess 12.

In the above-mentioned embodiment, the exhaust port 14 is provided in the recess 12 provided in the bottom surface 100 on the lower side in the vertical direction. The exhaust port 14 may also be provided on the wall surface 104 that rises in the vertical direction from the outer peripheral end of the bottom surface 100 facing the accommodating space 10S.

FIG. 8 is a diagram showing a reduced-pressure drying device 1A of a modified example. In the above-mentioned embodiment, the first rectifying plate 30 is arranged inside the recess 12. Like the reduced-pressure drying device 1A shown in FIG. 8, the first rectifying plate 30 may be provided above the recess 12 (outside the recess 12). Also, like the reduced-pressure drying device 1A, the second rectifying plate 40 (second rectifying plates 40a, 40b, 40c, 40d) may be arranged on the lower side (closer to the exhaust port 14) than the first rectifying plate 30 ). The second rectifying plate 40 is arranged in the Z-axis direction and the end of the first rectifying plate 30 (-X side end 32a or +X side end 32b) and the inner edge of the recess 12 (-X side edge 124a) Or the position where the +X side edge 124b) overlaps. That is, when the first rectifying plate 30, the second rectifying plate 40, and the recess 12 are seen through the first rectifying plate 30, the second rectifying plate 40, and the recess 12 in a plan view from the upper side in the vertical direction toward the downward (-Z direction) in the vertical direction, the second rectifying plate 40 is arranged in the accommodating space A position overlapping with both the outer peripheral end portion of the first rectifying plate 30 and the inner edge portion of the recess 12 in 10S. By providing the second rectifying plate 40 in this way, it is also possible to prevent ambient air from being sucked into the gap between the first rectifying plate 30 and the recess 12.

Although the present invention has been described in detail, all the aspects described above are only examples, and the present invention is not limited to these aspects. The countless modified examples that are not illustrated can be understood as those that can be thought of without departing from the scope of the present invention. The configurations described in the above embodiments and modifications may be appropriately combined or omitted as long as they do not contradict each other.

1‧‧‧Decompression drying device

9‧‧‧Substrate

10‧‧‧Chamber (frame)

10P‧‧‧Open and close

10S‧‧‧Containment Space

12‧‧‧Concave

12a‧‧‧-X side recess

12b‧‧‧+X side recess

14‧‧‧Exhaust port

20‧‧‧Suction mechanism

30a‧‧‧-X side first rectifier plate

30b‧‧‧+X side 1st rectifier plate

32a‧‧‧-X side end

32b‧‧‧+X side end

34a‧‧‧-X side clearance

34b‧‧‧+X side clearance

40a, 40b, 40c, 40d‧‧‧Second rectifier plate (second member)

50‧‧‧Lifting mechanism

52a, 52b‧‧‧Supporting part (substrate holding part)

54‧‧‧Lift drive unit (mobile drive unit)

70‧‧‧Control Department

90‧‧‧Upper surface

100‧‧‧Bottom (1st side)

102‧‧‧Outer surface

104‧‧‧Wall

120‧‧‧Bottom

122‧‧‧Inner wall

124a‧‧‧-X side edge (inner edge)

124b‧‧‧+X side edge (inner edge)

520‧‧‧Lift board

522‧‧‧pin

Claims (11)

A reduced-pressure drying device that dries the processing liquid existing on the first major surface of a substrate having a first major surface and a second major surface by reducing pressure; The storage space for accommodating the substrate and has a first surface facing the storage space; a recessed portion provided on the first surface; an exhaust port provided on the bottom surface in the depth direction of the recessed portion; a suction mechanism, which Ambient air in the storage space is sucked through the exhaust port; a first member is arranged in the storage space at a position overlapping the exhaust port in the depth direction; and a second member is arranged in the above A position in the accommodating space that is spaced apart from the end of the first member and the inner edge of the recess along the depth direction and overlaps the end and the inner edge in the depth direction; and substrate holding A portion that holds the substrate in the accommodating space at a position opposite to the exhaust port with respect to the first member and the second member. The reduced-pressure drying device of claim 1, wherein the substrate holding portion includes a plurality of pins supporting the second main surface of the substrate. Such as the reduced pressure drying device of claim 2, wherein the plurality of pins include: a plurality of first pins, which are arranged along the first direction; and a plurality of second pins, which are from the plurality of first pins The pins are arranged along the first direction at intervals in a second direction orthogonal to the first direction; the second member is arranged between the plurality of first pins and the plurality of second pins. Such as the vacuum drying device of claim 2 or 3, wherein it is further provided with: The movable driving unit moves the plurality of pins along the depth direction to move the substrate between a first substrate position and a second substrate position closer to the exhaust port than the first substrate position. The reduced-pressure drying device of claim 4, wherein the moving drive unit causes the substrate to move from the first substrate position to the 2 Move the substrate position. The reduced-pressure drying device according to any one of claims 1 to 3, wherein the first member is provided between the second member and the exhaust port. The reduced-pressure drying device according to claim 6, wherein at least a part of the first member is located in the concave portion. The reduced-pressure drying device of claim 7, wherein all of the first members are located in the recesses. The vacuum drying device of claim 8, wherein the end portion and the inner edge portion are on the same plane. The reduced-pressure drying device according to any one of claims 1 to 3, wherein the substrate holding portion holds the substrate in a horizontal posture with the first main surface facing upward in the vertical direction, and the first member and the second The member and the exhaust port are located on the second main surface side of the substrate held by the substrate holding portion. A method for drying under reduced pressure by reducing the pressure to dry the processing liquid existing on the first major surface of a substrate having a first major surface and a second major surface; The substrate is carried into the storage space having the storage space and the frame body facing the first surface of the storage space; and the second step, which, after the first step, is installed on the first surface via The exhaust port on the bottom surface of the depth direction of the recess is provided to suck the ambient air in the storage space; the second step includes: being arranged in the storage space in the depth direction and the exhaust port The step of changing the direction of the airflow toward the exhaust port by overlapping the first member at the position; The step of changing the direction of the airflow toward the exhaust port by a second member at a position spaced apart in the depth direction and overlapping with both the end portion and the inner edge portion in the depth direction.

Images