JP2004047582A - Substrate treatment equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide substrate treatment equipment for manufacturing a high quality substrate by suitably drying the substrate. <P>SOLUTION: A substrate storing container 102 has a supply opening 103 for supplying gas and an exhaust opening 104 for exhausting the gas, and is provided with a diffusion part 109 so that the gas supplied from the supply opening 103 does not generate a strong stream. The gas injected into a substrate storing container from the supply opening 103 collides with the diffusion part 109 to be diffused so as to gradually fill the whole substrate storing container. A flow-straightening part 107 is provided between the substrate mounted on a mounting part 105 and the exhaust opening 104, and the stream formed by the gas exhausted from the exhaust opening 104 is prevented from acting directly on the substrate. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a substrate processing apparatus for drying a chemical solution applied on a substrate.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a substrate process of applying a chemical solution to a substrate such as a liquid crystal or a semiconductor and then drying the chemical solution on the substrate has been generally performed.
[0003]
As a drying method used in such a substrate drying process, a reduced-pressure drying method in which drying is performed by lowering the pressure in a container accommodating a substrate is known. The vacuum drying method includes a gas injection process of filling an internal atmosphere with an inert gas or the like and a substrate replacement process of replacing a substrate. In the substrate replacement process, outside air flows in to open the lid of the container housing the substrate. Therefore, gas is injected every time the substrate is replaced.
[0004]
[Problems to be solved by the invention]
However, in the conventional vacuum drying method, there is simply a supply port for an inert gas or the like, and in order to reduce the time for replacement, a large amount of the inert gas needs to be supplied. There were problems such as scattering and formation of drying unevenness and wind ripples due to a strong air current.
[0005]
Further, in the substrate replacement process, when the lid of the container is open, the air may be sucked, the dust in the container may be rolled up, and the dust may adhere to the surface of the substrate.
[0006]
SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a substrate processing apparatus capable of suitably drying a substrate and producing a high-quality substrate.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, a substrate processing apparatus according to the present invention includes:
Mounting means for mounting the substrate,
A substrate container for accommodating the substrate placed on the placing means,
A, a substrate processing apparatus for drying a substrate surface in the substrate container,
The substrate container has a discharge port for discharging gas in the substrate container on the lower surface side of the substrate mounted on the mounting means,
A rectifying plate is provided between the discharge port and the substrate to prevent a gas flow discharged from the discharge port from directly acting on the substrate.
[0008]
The substrate container,
A supply port for supplying a predetermined gas into the substrate container,
A diffusion unit for diffusing the gas supplied from the supply port,
It is characterized by having.
[0009]
The diffusion unit,
A first diffusion member having a plurality of first diffusion holes for diffusing the gas supplied from the supply port;
A second diffusion member having a plurality of second diffusion holes smaller in diameter than the first diffusion holes to further diffuse the gas passing through the first diffusion holes;
It is characterized by including.
[0010]
The substrate processing apparatus includes:
Injection means for injecting the predetermined gas from the supply port,
Decompression means for drying the coating film on the substrate by sucking the gas in the substrate container from the outlet and reducing the pressure of the predetermined gas,
Further having
The substrate container may further include an opening / closing lid for taking the substrate in and out.
[0011]
The current plate has a larger area than the substrate,
It is characterized in that it is arranged such that the outside air that flows in by opening the opening / closing lid passes under the current plate and is discharged from the discharge port.
[0012]
The apparatus further comprises control means for controlling the injection means and the pressure reducing means to change the air pressure in the substrate container in a plurality of patterns.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, preferred embodiments of the present invention will be illustratively described in detail with reference to the drawings. However, the relative arrangement of components, display screens, and the like described in this embodiment are not intended to limit the scope of the present invention to only them, unless otherwise specified.
[0014]
<Overview>
A substrate processing apparatus as an embodiment of the present invention has a mounting portion on which a substrate is mounted, and seals the periphery of the substrate mounted on the mounting portion with a substrate container, and inactivates the inside of the substrate container. The substrate is filled with a gas such as a gas and dried.
[0015]
For this reason, the substrate container is provided with a supply port for supplying gas. Further, the substrate container is provided with a diffusion portion near the supply port so that the gas supplied from the supply port does not generate a strong airflow. The gas injected into the substrate container from the supply port collides with the diffusion unit and diffuses, and gently fills the entire substrate container. In addition, a discharge port for discharging gas in the substrate container is provided on the lower surface side of the substrate mounted on the mounting portion. A rectifying plate is provided between the outlet and the substrate placed on the mounting portion, and prevents a gas flow discharged from the outlet from directly acting on the substrate. Note that the substrate processing apparatus includes a pump as a decompression unit for discharging gas from the discharge port.
[0016]
The drying of the coating film on the substrate is promoted by lowering the air pressure in the substrate container by sucking the gas in the substrate container from the outlet.
[0017]
The substrate container has an opening / closing lid for replacing the substrate. At the time of substrate replacement, the outside air that has flowed in by opening the opening / closing lid passes through the lower side of the current plate and is discharged from the discharge port. At this time, the current plate is formed to have a larger area than the substrate so that the inflowed outside air does not act on the substrate.
[0018]
Further, the substrate processing apparatus has a control unit including a processor, and controls a pump as a pressure reducing unit to change the atmospheric pressure in the substrate container in various patterns.
[0019]
<Structure>
FIG. 1 is a diagram showing a schematic configuration of a substrate processing apparatus 1 according to the present embodiment. Here, FIG. 1A is a plan view of the substrate processing apparatus 1 with a cover removed. Here, the outer frame drawn by the dotted line indicates the position of the lid to be covered. FIGS. 1B and 1C are an AA sectional view and a BB sectional view showing the inside of the substrate processing apparatus 1.
[0020]
As shown in FIG. 1, the substrate processing apparatus 1 includes a lid 101 that can be opened and closed, and a substrate container 102 having a bottomed cylindrical shape that creates a sealed space together with the lid 101 when the lid 101 is closed. . On the bottom surface of the substrate container 102, for example, three suction ports 103 having a diameter of about 30 mm are provided along one side wall thereof, and one discharge port 104 having a diameter of about 100 mm is provided near the center. The suction port 103 functions as a supply port for supplying an inert gas as a predetermined gas into the substrate container 102. The discharge port 104 is for discharging gas from the substrate container 102.
[0021]
Also, a plurality of lift pins 105 for supporting the substrate penetrate the bottom surface of the substrate container 102 and are connected to the base plate 106 outside the substrate container 102. That is, the substrate placed on the lift pins 105 moves up and down in conjunction with the base plate 106. A seal is provided between the lift pins 105 and the bottom surface of the substrate container 102 so that gas does not leak from the substrate container 102.
[0022]
Inside the substrate container 102, a rectifying plate 107 is fixed above the outlet 104 and along the bottom surface thereof to prevent an air flow of gas discharged from the outlet from directly acting on the substrate. ing. A small gap d1 (for example, 2 to 3 mm) is formed between the current plate 107 and the bottom surface by the plurality of spacers 108. The current plate 107 is a flat metal plate having a plurality of holes through which the lift pins 105 are inserted, and is larger than the substrate as shown in FIG. The shape is along. Therefore, the gas (or outside air) discharged from the outlet 104 passes under the flow straightening plate 107 through the gap between the edge of the flow straightening plate 107 and the side wall of the substrate container 102. That is, the gas discharged from the discharge port 104 does not directly flow along the substrate, but forms an airflow along the side wall and the bottom surface of the substrate container 102. This prevents the occurrence of turbulence in the substrate container 102.
[0023]
Further, a diffusion unit 109 is provided in the substrate container 102 so as to cover above the suction port 103. The diffusing unit 109 includes a first diffusing member 109a for diffusing gas sucked from the suction port 103 as a first stage, and a second diffusing member 109b for diffusing gas passing through the first diffusing member 109a as a second stage. Including. These diffusion members are long members each having an inverted U-shaped cross section, and the second diffusion member 109b is a bottomless box-shaped member attached so as to cover the entire first diffusion member 109a. is there. The first diffusion member 109a includes a ceiling and two longitudinal side walls, and the ceiling is provided with a plurality of diffusion holes (for example, φ6 mm). The second diffusion member 109b includes a ceiling, two long side walls, and two short side walls, and the ceiling and two short side walls have a first diffusion side. A plurality of diffusion holes having a smaller diameter (for example, φ3 mm) than the member 109a are also provided. The second diffusion member 109b has more diffusion holes per unit area than the first diffusion member 109a.
[0024]
One side wall in the longitudinal direction of these diffusion members is joined to each other so that the lower ends thereof are aligned with each other, and is integrally mounted on the bottom surface of the substrate container 102. At this time, by interposing the spacer 110 between the second diffusion member 109b and the substrate container 102, as shown in FIG. 1B, the side walls of the first diffusion member 109a and the second diffusion member 109b on the substrate side. A small gap d2 (for example, 1 mm) is formed between the lower end of the substrate holder 102 and the substrate container 102. As a result, a part of the gas flowing from the suction port 103 passes through the gap d2, passes directly below the current plate 107, and is discharged from the discharge port 104. The second diffusion member 109b and the spacer 110 are fixed by screws 111.
[0025]
FIG. 2 is a diagram illustrating a state of attachment of the diffusion unit 109 to the substrate container 102.
[0026]
As shown in FIG. 2, three columnar spacers 110 are attached to the bottom surface of the substrate container 102. Then, the right front side wall of the first diffusion member 109a and the right front side wall of the second diffusion member 109b are joined by a bolt (not shown). Here, the first diffusion member 109a is illustrated as one member, but may be formed of two long members having the same cross section. In that case, it is conceivable that the two long members are joined at, for example, the middle spacer 110 portion.
[0027]
The first diffusion member 109a and the second diffusion member 109b are joined, and the integrated diffusion part 109 is placed on the spacer 110, and the bolt 111 is inserted through a stupid hole provided in the second diffusion member 109b. It is fixed to the substrate container 102 by being screwed with the spacer 110.
[0028]
Thus, the diffusion section 109 covers the suction port 103 while forming a minute gap.
[0029]
<Operation>
Next, referring to FIGS. 3 and 4, a description will be given of a flow path of gas and outside air when the substrate is dried in the substrate processing apparatus 1 having the above-described configuration.
[0030]
FIGS. 3 and 4 are schematic end views of the substrate processing apparatus 1 corresponding to FIG. 1B, and show only a configuration necessary for explaining gas and outside air flow paths. 3 shows a flow path in the gas injection process, and FIG. 4 shows a flow path in the substrate replacement process.
[0031]
As shown in FIG. 3, most of the inflowing gas collides with the ceiling of the first diffusion member 109a, the flow velocity is reduced, and the gas is diffused from the first diffusion hole h1 and flows out. Then, it further collides with the ceiling portion of the second diffusion member 109b, and its momentum is further weakened, and is further diffused from the diffusion hole h2 and flows out into the substrate container 102.
[0032]
As a result, the flow pressure of the gas that has flowed in is sufficiently weakened before it reaches the substrate, and the gas is discharged from the discharge port 104 without forming wind ripples or uneven drying on the substrate. Thus, the gas inside the substrate container 102 is replaced, and the pressure inside the substrate container 102 is reduced, thereby promoting the drying of the substrate.
[0033]
In addition, since the air is discharged from the outlet 104 through the gap below the current plate 107, the dust inside the air conditioner does not roll up.
[0034]
On the other hand, in the substrate replacement process, the substrate is moved upward by the lift pins at the same time as the lid 101 is opened as shown in FIG. At this time, outside air flows in at a stretch from above the substrate container 102. However, since the straightening plate 107 is provided, if the air is sucked from the discharge port 104 by a pump (not shown), as shown in FIG. A flow path is formed along the side wall. The gas in the substrate container 102 is also discharged from the discharge port 104 along with this flow. At this time, the substrate is located above the outside air inlet, and the occurrence of turbulent flow inside the substrate container 102 is suppressed. The dust that has been rolled up in the step does not adhere to the substrate. Therefore, the outside air can be quickly flowed into the substrate container 102 without adversely affecting the substrate, and the ventilation in the substrate container 102 can be performed.
[0035]
Further, due to the effect of the rectifying plate, even when the lid 101 is opened, it is possible to strongly suck the liquid through the outlet 104, so that it is possible to prevent the odor or the like of the solvent from leaking from the substrate container 102 to the outside.
[0036]
<Pressure control>
The substrate processing apparatus 1 can set the increasing and decreasing pressure, the time thereof, and the increasing and decreasing pressure speed for each substrate in order to more effectively perform the drying under reduced pressure.
[0037]
Therefore, as shown in FIG. 5, the substrate processing apparatus 1 includes a control valve and a pressure switch for controlling the atmospheric pressure in the substrate container 102. Thereby, as shown in FIGS. 6 and 7, the set pressure, the elapsed time, and the pressure increase / decrease time can be set for each substrate. Therefore, not only the flow path of the gas in the substrate container 102 but also the flow rate can be set in accordance with the substrate, and the substrate can be dried under reduced pressure under optimal conditions.
[0038]
(Other embodiments)
In the above embodiment, three suction ports are provided, but the present invention is not limited to this, and may be two or less or four or more.
[0039]
Further, although two types of diffusion members are provided in combination, the present invention is not limited to this, and one type or three or more types may be combined.
[0040]
【The invention's effect】
As described above, according to the present invention, it is possible to provide a substrate processing apparatus that appropriately dries a substrate and generates a high-quality substrate.
[Brief description of the drawings]
FIG. 1 is a diagram showing a schematic configuration of a substrate processing apparatus according to an embodiment of the present invention.
FIG. 2 is a diagram illustrating a configuration of a diffusion unit of the substrate processing apparatus according to the embodiment of the present invention.
FIG. 3 is a diagram illustrating a flow path in the substrate processing apparatus according to the embodiment of the present invention.
FIG. 4 is a diagram showing a flow path in the substrate processing apparatus according to the embodiment of the present invention.
FIG. 5 is a diagram illustrating a configuration for pressure control of the substrate processing apparatus according to the embodiment of the present invention.
FIG. 6 is a diagram illustrating an example of a recipe for pressure control of the substrate processing apparatus according to the embodiment of the present invention.
FIG. 7 is a diagram illustrating a pressure control step of the substrate processing apparatus according to the embodiment of the present invention.

Claims (6)

Mounting means for mounting the substrate,
A substrate container for accommodating the substrate placed on the placing means,
A, a substrate processing apparatus for drying a substrate surface in the substrate container,
The substrate container has a discharge port for discharging gas in the substrate container on the lower surface side of the substrate mounted on the mounting means,
A substrate processing apparatus, comprising: a rectifying plate between the discharge port and the substrate for preventing an air flow of gas discharged from the discharge port from directly acting on the substrate. The substrate container,
A supply port for supplying a predetermined gas into the substrate container,
A diffusion unit for diffusing the gas supplied from the supply port,
The substrate processing apparatus according to claim 1, further comprising: The diffusion unit,
A first diffusion member having a plurality of first diffusion holes for diffusing the gas supplied from the supply port;
A second diffusion member having a plurality of second diffusion holes smaller in diameter than the first diffusion holes to further diffuse the gas having passed through the first diffusion holes;
The substrate processing apparatus according to claim 2, further comprising: The substrate processing apparatus includes:
Injection means for injecting the predetermined gas from the supply port,
Decompression means for drying the coating film on the substrate by sucking the gas in the substrate container from the outlet and reducing the pressure of the predetermined gas,
Further having
4. The substrate processing apparatus according to claim 1, wherein the substrate container further includes an opening / closing lid for taking in and out the substrate. 5. The current plate has a larger area than the substrate,
5. The substrate processing apparatus according to claim 4, wherein the substrate processing apparatus is arranged so that outside air that has flowed in by opening the opening / closing lid passes under the current plate and is discharged from the discharge port. The substrate processing apparatus according to claim 4, further comprising a control unit that controls the injection unit and the decompression unit to change the atmospheric pressure in the substrate container in a plurality of patterns.

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