JPH07307265A - Tight contact reinforcing treatment apparatus - Google Patents

Abstract

PURPOSE:To provide a tight contact reinforcing treatment apparatus which facilitate the uniform coating of tight contact reinforcing agent over the whole surface of a substrate. CONSTITUTION:The vapor of tight contact reinforcing agent is supplied into a treatment space in a chamber 10 from a swollen part 20. As the vapor of the tight contact reinforcing agent is spouted out from a vapor outlet port 20c and guided by the side wall 20a of the swollen part 20 and flows along the side wall 20a, the eddy current 30 of HMDS vapor is formed. The HMDS vapor diffused like this is supplied uniformly over a substrate 12. As a result, the problem such that the density and flow rate of the vapor of the tight contact reinforcing agent are unevenly increased on the part of the substrate 12 directly under the vapor outlet port 20c can be avoided and the vapor of the tight contact reinforcing agent can be supplied approximately uniformly over the whole surface 12 beneath the eddy current. By the approximately uniform supply of the tight contact reinforcing agent, the uneven coating of the agent can be effectively avoided and the uneven coating and separation of coating liquid applied afterwards can be avoided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coating liquid and a substrate before coating a predetermined coating liquid such as photoresist on the surface of various substrates such as a glass rectangular substrate for liquid crystal, a semiconductor wafer and a substrate for a color filter. The present invention relates to an adhesion strengthening treatment device that applies a predetermined adhesion strengthening agent to the surface of a substrate in order to strengthen the adhesion to the substrate.

[0002]

2. Description of the Related Art For example, an apparatus disclosed in Japanese Utility Model Publication No. 2-36276 is known as a conventional adhesion strengthening apparatus. In this apparatus, in order to suppress the occurrence of uneven coating of the adhesion enhancer, a rectifying plate having a large number of pores is arranged above the substrate to be treated, and the vapor of the adhesion enhancer is supplied as a laminar flow.

FIG. 6 is a diagram showing the construction of this adhesion strengthening processing apparatus. In this apparatus, the substrate 1 to be subjected to the adhesion strengthening treatment is vacuum-sucked on the plate 2 by the vacuum suction holes 5 formed in the plate 2 containing the heating element.
The lid 3 is brought close to the plate 2 from above to form a semi-closed chamber. Then, the vapor of the adhesion enhancer is supplied into the semi-closed chamber through the vapor supply pipe 4 connected to the upper center portion of the lid body 3 to apply the adhesion enhancer to the surface of the substrate 1. Here, in this apparatus, the vapor of the adhesion enhancer discharged from the vapor supply pipe 4 is spread evenly over the entire surface of the substrate 1, and a large number of pores are formed for the purpose of uniformly applying the adhesion enhancer. The rectifying plate 7 is arranged inside the lid 3 in close proximity to the substrate surface.

[0004]

However, in the apparatus as shown in FIG. 6, it is not possible to sufficiently prevent uneven application of the adhesion enhancer. That is, the application amount of the adhesion enhancer is relatively large in the central portion of the substrate 1, and the application amount becomes relatively smaller toward the periphery thereof. this is,
It is considered that this is because the amount of supply of the adhesion enhancing agent increases in the region immediately below the discharge port of the vapor supply pipe 4 due to the increase in the density and flow velocity of the vapor of the adhesion enhancing agent. Then, the coating unevenness caused by the non-uniformity of the supply amount of the adhesion enhancer causes the coating unevenness of the coating liquid when the coating liquid such as the photoresist is subsequently applied, and the pattern formed on the substrate. It may cause peeling of the.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an adhesion strengthening treatment apparatus which can apply an adhesion strengthening agent more uniformly on the entire surface of a substrate.

[0006]

[Means for Solving the Problems]
The adhesion strengthening treatment apparatus according to claim 1, wherein the adhesion strengthening treatment apparatus supplies vapor of the adhesion strengthening agent to the surface of the substrate to apply the adhesion strengthening agent to the surface of the substrate, and a substrate supporting means for supporting the substrate, Opening / closing which forms a substantially sealed processing space in the closed state and accommodates the substrate supported by the substrate supporting means in the processing space, and opens the processing space in the opened state to allow loading and unloading of the substrate. A free processing space forming means, and a vapor supply means for supplying the adhesion enhancing vapor into the processing space formed by closing the processing space forming means while forming an air flow substantially parallel to the substrate surface. It is characterized by including.

According to a second aspect of the present invention, in the adhesion strengthening treatment apparatus, the vapor supply means has a vortex flow forming means for forming a vortex flow in a plane substantially parallel to the substrate surface.

According to another aspect of the adhesion strengthening treatment apparatus of the present invention, the vapor supply means is arranged above the treatment space forming means, and the air flow guide has a cylindrical inner wall surface extending in a direction substantially perpendicular to the substrate surface. And a vapor discharge means for discharging the vapor of the adhesion enhancer along the inner wall surface of the air flow guide means.

According to a fourth aspect of the present invention, there is provided an adhesion strengthening processing apparatus comprising: an airtight means for keeping the processing space airtight when the processing space forming means is closed; and a pressure reducing means for depressurizing and exhausting the airtight processing space. Is further provided.

According to a fifth aspect of the present invention, there is provided an adhesion strengthening processing apparatus further comprising a current plate having a large number of pores arranged near the surface of the substrate supported by the substrate supporting means.

[0011]

According to the adhesion-strengthening treatment apparatus of claim 1, the vapor supply means supplies the vapor of the adhesion-strengthening agent into the processing space formed by closing the processing space forming means.
Since it is supplied while forming an air flow that is almost parallel to the substrate surface, it prevents the state in which the density or flow velocity of the vapor of the adhesion enhancer is biased toward the substrate portion directly below the supply port of the adhesion enhancer, The vapor of the adhesion enhancer can be diffused and evenly supplied to the entire substrate below the air flow. By supplying the vapor of the adhesion enhancer almost uniformly, it is possible to effectively prevent the application unevenness of the adhesion enhancer and prevent the subsequent application unevenness and peeling of the coating liquid.

Further, according to the adhesion strengthening treatment apparatus of the second aspect, since the vapor supply means has a vortex flow forming means for forming a vortex in a plane substantially parallel to the surface of the substrate, the entire substrate below the vortex is covered. The vapor of the adhesion enhancer can be more evenly diffused and supplied.

According to another aspect of the adhesion strengthening treatment apparatus of the present invention, the vapor supply means has the cylindrical inner wall surface extending in a direction substantially perpendicular to the surface of the substrate, and the air flow guide means. Since it has a vapor discharge means for discharging the vapor of the adhesion enhancer along the inner wall surface, the vapor of the adhesion enhancer from the vapor discharge means is guided along the cylindrical inner wall surface of the air flow guiding means, It is possible to easily form a vortex of the vapor of the adhesion enhancing agent in the parallel planes.

According to the fourth aspect of the adhesion strengthening processing apparatus, the airtight means for keeping the processing space airtight when the processing space forming means is closed and the processing space kept airtight are decompressed and exhausted. Since the decompression means is further provided, it is possible to prevent the problem that the vapor of the adhesion enhancing agent is discharged to the outside of the adhesion enhancing processing apparatus and contaminates the atmosphere and surrounding apparatuses while keeping the internal pressure of the processing space constant.

Further, according to the adhesion strengthening processing apparatus of the fifth aspect, since the rectifying plate having a large number of pores arranged near the surface of the substrate supported by the substrate supporting means is further provided, this rectifying is performed. It is possible to form a laminar flow of the adhesion enhancer vapor with a more uniform density and flow rate through the plate, and to evenly supply the adhesion enhancer vapor to the entire lower substrate to prevent unevenness in the application of the adhesion enhancer. It can be effectively prevented.

[0016]

EXAMPLE FIG. 1 is a diagram showing an adhesion strengthening apparatus according to the first example. The airtight chamber 10 accommodates the substrate 12 to be subjected to the adhesion strengthening treatment in the processing space therein. The loading and unloading of the substrate 12 is performed by opening and closing a shutter 16 formed on the side portion of the airtight chamber 10. Although not shown, the shutter 16 is provided with a seal member for maintaining airtightness.

The bulging portion 20 bulging from the upper part of the airtight chamber 10 is for supplying hexamethyldisilazane (hereinafter referred to as HMDS) vapor (hereinafter referred to as HMDS vapor) which is an adhesion enhancer in a vortex flow. , A cylindrical side wall portion 20a extending in the direction normal to the surface of the substrate 12 (upward in the drawing) and an upper lid portion 20b. Part of the side wall portion 20a has H
Discharge port 2 communicating with pipe 14 for supplying MDS vapor
0c is formed. HMD from discharge port 20c
The S vapor is guided by the side wall portion 20a,
A vortex is formed in the cavity formed by a and the upper lid portion 20b. This cavity is an airtight chamber 1
It is opened to the processing space of 0, and the vortex flow of the HMDS vapor is supplied into the processing space of the airtight chamber 10.

A pair of exhaust ports (not shown) are formed at the bottom of the airtight chamber 10 and connected to the vacuum source 18. The vacuum source 18 exhausts the HMDS vapor and the like in the processing space kept in an airtight state to keep the vapor pressure thereof constant, and the vapor of the HMDS vapor is discharged to the outside of the adhesion strengthening treatment device to remove the atmosphere and the surrounding environment. Prevent devices from getting contaminated.

The operation of the adhesion strengthening apparatus of the first embodiment will be described below with reference to FIG.

First, as shown in FIG. 2A, the shutter 16 of the airtight chamber 10 is opened, the substrate 12 is guided into the airtight chamber 10 and placed on the support 19. Then, the shutter 16 is closed to keep the airtight chamber 10 in an airtight state.

Next, as shown in FIG. 2B, the HMDS vapor formed by a suitable bubbler is supplied into the bulging portion 20 through the pipe 14 at a constant flow rate for a predetermined time. The supplied HMDS vapor is jetted from the discharge port 20c,
The vortex flow 30 of the HMDS vapor is formed because it is guided by the side wall portion 20a of the bulging portion 20 and proceeds along the side wall portion 20a. At this time, since the vacuum source 18 is operated to exhaust the gas from the exhaust port 17, the processing space in the airtight chamber 10 is maintained at a reduced pressure state of a substantially constant pressure.

The bulging portion 20 has a diameter of about 20 cm, and the airtight chamber 10 has a volume of about 30 (liter). The amount of HMDS vapor supplied is 5 to 100 (N-li
ter / min). Below 5 (N-liter / min),
It is difficult to form an effective vortex flow to uniformly supply the HMDS vapor onto the substrate 12, and the vortex flow is 100 (N-liter / mi).
n) or more, the problem that the amount of HMDS contained in the HMDS vapor gradually decreases due to the bubbler's ability, and the vacuum source 1
There is a problem that the capacity of 8 must be increased.
In the apparatus of the embodiment, the HMDS vapor can be more uniformly supplied onto the substrate 12 in the range of 20-40 (N-liter / min).

After stopping the supply of the HMDS vapor after a certain period of time, the vacuum source 1 is operated until the HMDS vapor is sufficiently exhausted.
Operate 8 to replace normal air. After that, the shutter 16 is opened and the substrate 12 is taken out. A uniform coating layer of HMDS is formed on the substrate 12. In addition, HM
When a resist or the like as a coating solution is spin-coated on a substrate coated with DS, the adhesion of the coating solution is enhanced. At this time, since the resist or the like is applied on the uniform coating layer of HMDS, it is possible to effectively prevent the occurrence of uneven coating or peeling of the resist or the like.

FIG. 3 is a view for explaining the state in the airtight chamber 10 during the supply of HMDS vapor. Since the HMDS vapor supplied into the bulging portion 20 (dotted line) is ejected from the discharge port 20c (dotted line) and proceeds along the side wall portion 20a (dotted line), the side wall portion 20
A vortex flow 30 of the HMDS vapor is formed as an air flow rotating in a horizontal plane along the inner surface of a (dotted line). The vortex flow 30 spreads in the airtight chamber 10 therebelow, and the vortex flow 30 of the HMDS vapor also spreads in the airtight chamber 10. Thus, in the apparatus of the first embodiment, the vortex flow 30 of the HMDS vapor is formed in the airtight chamber 10,
Since the HMDS vapor diffuses uniformly, the discharge port 20
It is possible to prevent the occurrence of non-uniform supply such as an increase in the density and flow velocity of the HMDS vapor in the region immediately below c, and the vortex flow 30
The HMDS vapor can be supplied almost uniformly over the entire substrate 12 below. By such a substantially uniform supply of HMDS vapor, it is possible to effectively prevent the occurrence of coating unevenness of HMDS. As a result, it is possible to effectively solve the above-mentioned problem due to local excess or deficiency of HMDS, that is, the problem of peeling of resist or the like due to excessive coating and the decrease in adhesion of resist or the like due to insufficient coating.

FIG. 4 is a diagram showing the adhesion strengthening processing apparatus of the second embodiment. This device is a modification of the device of the first embodiment, and the same parts are designated by the same reference numerals and the description thereof is omitted.

A current plate 40 having a large number of pores formed between the bulging portion 20 and the substrate 12 in the airtight chamber 10.
Are arranged parallel to the surface of the substrate 12. The straightening plate 40 supplies the HMDS vapor more uniformly to the entire lower substrate 12, so that the density and the flow velocity of the HMD are more uniform.
A laminar flow of S vapor is formed.

The main part of the operation of the apparatus of the second embodiment will be described below. HMDS supplied into the bulging portion 20
When the vapor is ejected from the discharge port 20c, the side wall portion 20
a As an air flow rotating in a horizontal plane along the inner surface, HM
A vortex 30 of DS vapor is formed. This vortex 30
It spreads in the airtight chamber 10 below it. Further, due to the presence of the flow straightening plate 40, a laminar flow of HMDS vapor having a more uniform density and flow velocity is formed below the flow straightening plate 40. As a result, the HMDS vapor can be more uniformly supplied to the entire substrate 12 below, and the occurrence of uneven HMDS coating can be more effectively prevented. Therefore, in the apparatus of the second embodiment, it is possible to more effectively solve the problems that the resist or the like is peeled off or the adhesiveness is deteriorated due to the local excess or shortage of coating of HMDS.

FIG. 5 is a view showing the adhesion strengthening processing apparatus of the third embodiment. The substrate 12 to be subjected to the adhesion strengthening treatment is vacuum-adsorbed on the plate 52 containing the heating element. By placing the lid 53 on the plate 52, a closed chamber is formed around the substrate 12 in cooperation with the plate 52. The plate 52 is a means for supporting the substrate 12 and adjusts the temperature of the substrate 12 to enhance the adhesiveness when applying the HMDS, thereby enabling a quick application process.

The bulging portion 20 bulging from the upper portion of the lid 53
Is for supplying the HMDS vapor to the surface of the substrate 12 in the form of vortex as in the first embodiment.
0a and the upper lid portion 20b. A discharge port 20c communicating with the pipe 14 for supplying the HMDS vapor is formed in a part of the side wall portion 20a. The HMDS vapor from the discharge port 20c is guided by the side wall portion 20a,
A vortex flow is formed in the cavity formed by the side wall portion 20a and the upper lid portion 20b, and is supplied into the closed chamber.

The operation of the apparatus of the third embodiment will be described below. First, the lid 53 is opened, the support pins (not shown) are projected from the plate 52, and the substrate 12 is placed on the support pins. Then, the substrate 12 is lowered together with the support pins, and the substrate 12 is vacuum-adsorbed on the plate 52. Next, the lid 53 is lowered to form a closed chamber around the substrate 12.

Next, the temperature of the substrate 12 is set to a predetermined temperature by waiting for a predetermined time. Then, the HMDS vapor is supplied into the bulging portion 20 through the pipe 14 at a constant flow rate for a predetermined time. The supplied HMDS vapor is discharged from the discharge port 20c.
The vortex flow 30 of the HMDS vapor is formed because the HMDS vapor is jetted out from and is guided to the side wall portion 20a of the bulging portion 20 and proceeds along the side wall portion 20a. The diffused HMDS vapor is uniformly supplied onto the substrate 12.

After the supply of the HMDS vapor is stopped after a fixed time, the lid 53 is opened and the support pins (not shown) are projected from the plate 52 to take out the substrate 12. Board 1
A uniform coating layer of HMDS is formed on the surface 2. In addition, when a resist or the like is spin-coated on a substrate coated with HMDS, the adhesion of the coating solution is enhanced. At this time, since the resist or the like is applied on the uniform coating layer of HMDS, it is possible to effectively prevent the occurrence of uneven coating or peeling of the resist or the like.

Although the present invention has been described with reference to the embodiments, the present invention is not limited to the embodiments. For example, the shape of the bulging portion 20 provided to generate the vortex flow of the adhesion enhancing agent such as HMDS vapor may be any shape such as a shape having an elliptical cross section as long as it forms a vortex flow that uniformly diffuses. it can.

Further, in the above-mentioned embodiment, the adhesion strengthening treatment apparatus is composed of the decompression type and the closed type chambers, but the adhesion strengthening processing apparatus may be constituted of the semi-closed type chamber.

[0035]

According to the adhesion strengthening treatment device of the first aspect,
The vapor supply means supplies the vapor of the adhesion enhancing agent into the processing space formed by closing the processing space forming means while forming an air flow substantially parallel to the substrate surface. The state where the density and flow velocity of the adhesion enhancer vapor is biased toward the part of the substrate directly below the steam supply port of the above is prevented, and the vapor of the adhesion enhancer is diffused almost uniformly over the entire substrate below the air flow. Can be supplied. As a result, it is possible to effectively prevent application unevenness of the adhesion enhancer and prevent subsequent application unevenness and peeling of the coating liquid.

Further, according to the adhesion strengthening processing apparatus of the second aspect, since the vapor supply means has a vortex flow forming means for forming a vortex flow in a plane substantially parallel to the substrate surface, the entire substrate below the vortex flow is covered. The vapor of the adhesion enhancer can be more evenly diffused and supplied.

Further, in the adhesion-strengthening treatment apparatus according to the third aspect, since the steam supply means has the air flow guide means and the steam discharge means, the steam of the adhesion strengthening agent from the steam discharge means is in the tubular shape of the air flow guide means. It is possible to easily form a vortex of the vapor of the adhesion enhancer in a plane that is guided along the inner wall surface of the substrate and is substantially parallel to the substrate surface.

Further, in the adhesion-strengthening treatment apparatus according to the present invention, since the sealing means and the pressure reducing means are further provided, the vapor of the adhesion-strengthening agent is discharged to the outside of the adhesion-strengthening treatment apparatus while keeping the internal pressure of the processing space constant. Therefore, it is possible to prevent the problem that the environment and surrounding devices are polluted.

Further, in the adhesion strengthening treatment device according to the fifth aspect, since the straightening plate is further provided, it is possible to form a laminar flow of the adhesion strengthening agent vapor having a more uniform density and flow velocity through the straightening plate. Further, the vapor of the adhesion enhancer can be more uniformly supplied to the entire lower substrate to effectively prevent the uneven application of the adhesion enhancer.

[Brief description of drawings]

FIG. 1 is a diagram showing a configuration of an adhesion strengthening processing apparatus according to a first embodiment.

FIG. 2 is a diagram showing an operation of the apparatus according to the first embodiment.

FIG. 3 is a diagram showing the generation of a vortex flow by the device according to the first embodiment.

FIG. 4 is a diagram showing a configuration of an adhesion strengthening processing apparatus according to a second embodiment.

FIG. 5 is a diagram showing a configuration of an adhesion strengthening processing apparatus according to a third embodiment.

FIG. 6 is a diagram showing a configuration of a conventional adhesion strengthening processing device.

[Explanation of symbols]

 10 Airtight chamber 12 Substrate 16 Shutter 18 Vacuum source 20 Bulging part 20b Side wall part 20c Discharge port 30 Eddy current 52 Plate 53 Cover

Claims (5)

[Claims] 1. An adhesion-strengthening treatment apparatus for supplying vapor of an adhesion-strengthening agent to the surface of a substrate to apply the adhesion-strengthening agent to the surface of the substrate, the substrate-supporting means supporting the substrate, and substantially sealed in a closed state. And an openable and closable storage space that accommodates the substrate supported by the substrate supporting means in the processing space and opens the processing space to allow loading and unloading of the substrate in the open state. Vapor supply for supplying the vapor of the adhesion enhancer into the processing space forming means and the processing space formed by closing the processing space forming means while forming an air flow substantially parallel to the substrate surface. An adhesion strengthening treatment device comprising: 2. The adhesion strengthening processing apparatus according to claim 1, wherein the vapor supply unit has a vortex flow forming unit that forms a vortex flow in a plane substantially parallel to the substrate surface. 3. The vapor supply means is arranged above the processing space forming means, and has an inner wall surface of a tubular shape extending in a direction substantially perpendicular to the surface of the substrate, and the air flow guide means. The adhesion strengthening apparatus according to claim 1 or 2, further comprising: a steam discharging unit that discharges the steam of the adhesion strengthening agent along the inner wall surface. 4. An airtight means for keeping the processing space airtight when the processing space forming means is closed, and a pressure reducing means for depressurizing and exhausting the airtight processing space. The adhesion strengthening treatment device according to any one of claims 1 to 3. 5. The flow control plate according to claim 1, further comprising: a current plate having a large number of pores arranged near the surface of the substrate supported by the substrate supporting means. Adhesion strengthening processing device.