JP2011119534A - Heat treatment apparatus and heat treatment method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a solidified product of vaporized components from falling onto a substrate while suppressing blockage of an exhaust passage owing to solidification of components vaporized from a coating. <P>SOLUTION: In a treatment vessel 100, a first rectifying plate 140 with multiple first through holes 142 is disposed over a stage 130, and a second rectifying plate 150 with multiple second through holes 152 is disposed over the first rectifying plate 140 within the treatment vessel 100. A cooling portion 160 is provided to cool the second rectifying plate 150. An exhaust port 120, which is provided to the treatment vessel 100, is disposed opposite the stage 130 across the second rectifying plate 150. In a planar view, the second through holes 152 do not overlap the first through holes 142. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a heat treatment apparatus and a heat treatment method for heat treating a substrate.

  A manufacturing process of a semiconductor device or an LCD (Liquid Crystal Display) includes a heat treatment process in which a coating film on a substrate is heat-treated and baked. In this heat treatment step, the low molecular components are volatilized together with the solvent contained in the coating film. This volatilized component solidifies and adheres when cooled by the top plate of the processing container of the heat treatment apparatus. If the adhered material is peeled off from the top plate and dropped on the substrate, it causes a pattern defect in the subsequent process. Further, the component volatilized from the coating film may be solidified not only in the processing container but also in the exhaust pipe. When the volatilized component is solidified in the exhaust pipe, the exhaust pipe may be blocked.

  Patent Document 1 discloses that a porous rectifying plate is provided above a substrate, thereby suppressing deposits from dropping from the ceiling of the processing container onto the substrate. Patent Document 2 discloses that a lower plate and a trap mechanism are provided in this order above a substrate to cool the trap mechanism. In Patent Document 2, the inside of the processing container is exhausted via a lower plate and a trap mechanism. The lower plate is provided with a plurality of through holes. The gas passing through these through holes is finally guided to the trap mechanism through a single passage provided in the center of the lower plate. .

JP 2004-193349 A JP 2003-68725 A

  In the technique described in Patent Document 1, it is possible to suppress the deposits from the top plate in the processing container from falling on the substrate, but it is not possible to suppress the components volatilized from the coating film from solidifying in the exhaust pipe. It was. On the other hand, in the technique described in Patent Document 2, as described above, the gas that has passed through the through hole is guided to the trap mechanism via a single exhaust path provided in the center of the lower plate. In such a configuration, in the exhaust path, there is a possibility that the component volatilized from the coating film is solidified and the exhaust path is blocked.

  As described above, it is difficult to suppress the solidified product of the volatilized component from falling on the substrate while suppressing the exhaust passage from being blocked by the solidified component volatilized from the coating film.

According to the present invention, a processing vessel;
A stage disposed in the processing vessel and on which a substrate is placed;
A heating unit for heating the substrate on the stage;
A first current plate disposed above the stage in the processing vessel and having a plurality of first through holes;
A second rectifying plate disposed above the first rectifying plate in the processing vessel and having a plurality of second through holes;
A cooling unit for cooling the second current plate;
An exhaust port provided in the processing container and positioned on the opposite side of the stage via the second rectifying plate;
With
A heat treatment apparatus is provided in which the second through hole does not overlap the first through hole in plan view.

  According to the present invention, the atmosphere around the substrate is exhausted from the exhaust port after taking the first through hole of the first rectifying plate and the second through hole of the second rectifying plate in this order. At this time, since the second rectifying plate is cooled, the component volatilized from the coating film on the substrate is solidified and attached by the second rectifying plate. For this reason, it can suppress that the component volatilized from the coating film is solidified in the exhaust pipe and the exhaust pipe is blocked.

  In addition, since the second through hole does not overlap the first through hole in plan view, the exhausted gas flows through the space between the first rectifying plate and the second rectifying plate. In this case, since the component volatilized from the coating film on the substrate comes to adhere to the entire lower surface of the second rectifying plate, the solidified material grows in the region of the second rectifying plate located above the first through hole. It becomes difficult to do. Therefore, it can suppress that the deposit | attachment of a 2nd baffle plate falls on a board | substrate through a 1st through-hole.

According to the present invention, a substrate having a coating film is disposed in a processing container,
In the processing container, a first current plate having a plurality of first through holes is disposed above the substrate,
In the processing container, a second rectifying plate having a plurality of second through holes that do not overlap the first through hole in a plan view is disposed above the first rectifying plate,
There is provided a heat treatment method for heating the coating film of the substrate while evacuating the processing vessel from above the second rectifying plate and cooling the second rectifying plate.

  ADVANTAGE OF THE INVENTION According to this invention, it can suppress that the solidified material of the volatilized component falls on a board | substrate, suppressing that an exhaust pipe obstruct | occludes when the component volatilized from the coating film solidifies.

It is sectional drawing which shows the structure of the heat processing apparatus which concerns on embodiment. It is a top view of the 1st current plate. It is a top view of the 2nd baffle plate.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, similar constituent elements are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

  FIG. 1 is a cross-sectional view illustrating a configuration of a heat treatment apparatus according to an embodiment. FIG. 2 is a plan view of the first rectifying plate 140 included in the heat treatment apparatus shown in FIG. FIG. 3 is a plan view of the second rectifying plate 150 included in the heat treatment apparatus shown in FIG. This heat treatment apparatus is an apparatus for heat treating the substrate 10, and includes a processing vessel 100, a stage 130, a heating unit 132, a first rectifying plate 140, a second rectifying plate 150, a cooling unit 160, and an exhaust port 120. The stage 130 is disposed in the processing container 100 and the substrate 10 is placed thereon. The heating unit 132 heats the substrate 10 on the stage 130. In the present embodiment, the heating unit 132 is a heater built in the stage 130. The first rectifying plate 140 is arranged above the stage 130 in the processing container 100 and has a plurality of first through holes 142. The second rectifying plate 150 is disposed above the first rectifying plate 140 in the processing vessel 100 and has a plurality of second through holes 152. The cooling unit 160 cools the second rectifying plate 150. The exhaust port 120 is provided in the processing container 100 and is located on the opposite side of the stage 130 via the second rectifying plate 150. In the example shown in the figure, the exhaust port 120 is provided in the top plate of the processing container 100, but may be provided in a portion of the side surface of the processing container 100 that is located above the second rectifying plate 150. In plan view, the second through hole 152 does not overlap the first through hole 142.

  The substrate 10 is, for example, a wafer that becomes a semiconductor chip or a substrate that becomes an LCD. The substrate 10 is formed with a coating film such as a photoresist film (including an antireflection film formed on the bottom), a low dielectric constant insulating film, or an embedding material. The heat treatment apparatus shown in FIG. 1 is an apparatus for heat-treating and baking a coating film. Then, the coating film on the substrate 10 is heated using the heating unit 132 while cooling the second rectifying plate 150 while exhausting the inside of the processing container 100 from the exhaust port 120.

  In the present embodiment, the cooling unit 160 includes a cooling pipe attached to the second rectifying plate 150, and cools the second rectifying plate 150 by flowing a cooling medium such as cooling water through the cooling pipe. As shown in FIG. 3, the cooling pipes constituting the cooling unit 160 are stretched radially and annularly so as to pass between the plurality of second through holes 152. Then, the cooling medium is supplied to the cooling pipe located at the outermost periphery, and the cooling medium is discharged from the cooling pipe located near the center of the second rectifying plate 150. In the example shown in the figure, the cooling pipe is attached to the surface of the second rectifying plate 150 facing the top plate of the processing container 100, but may be embedded in the second rectifying plate 150.

  Further, as shown in FIG. 2, the first through holes 142 are provided at almost equal intervals on the entire surface of the first rectifying plate 140, and the second through holes 152 are formed on the entire surface of the second rectifying plate 150 as shown in FIG. They are provided at approximately equal intervals. For example, the arrangement interval of the first through holes 142 is the same as the arrangement interval of the second through holes 152. And the 1st through-hole and the 2nd through-hole 152 are arrange | positioned so that it may become alternate by planar view.

  The first rectifying plate 140 and the second rectifying plate 150 are attached to the side surface of the processing container 100. For this reason, there is no gap between the first rectifying plate 140 and the side surface of the processing container 100, and there is no gap between the second rectifying plate 150 and the side surface of the processing container 100. Moreover, the 2nd baffle plate 150 is provided so that removal from the processing container 100 is possible.

  An intake port 110 is provided on the side surface of the processing container 100. When viewed in the height direction, the air inlet 110 is located between the lower surface of the first rectifying plate 140 and the upper surface of the stage 130.

  Next, the operation and effect of this embodiment will be described. According to the present embodiment, the atmosphere around the substrate 10 is exhausted from the exhaust port 120 through the first through hole 142 of the first rectifying plate 140 and the second through hole 152 of the second rectifying plate 150. Since the second rectifying plate 150 is cooled, the components volatilized from the coating film on the substrate 10 are solidified and attached by the second rectifying plate 150. For this reason, it can suppress that the component volatilized from the coating film solidifies in an exhaust pipe.

  In addition, since the second through hole 152 does not overlap the first through hole 142 in plan view, the gas that has passed through the first through hole 142 and the first current plate 140 and the first It flows horizontally through the space between the two rectifying plates 150. For this reason, the component volatilized from the coating film on the substrate 10 comes to adhere to the entire lower surface of the second rectifying plate 150 and solidifies in the region of the second rectifying plate 150 located above the first through hole 142. Things are difficult to grow. Therefore, it is possible to suppress the deposits on the second rectifying plate 150 from falling on the substrate through the first through hole 142.

  Further, as described above, the gas that has passed through the first through-hole 142 flows horizontally in the space between the first rectifying plate 140 and the second rectifying plate 150, and therefore contacts the second rectifying plate 150 for a long time. Therefore, the component volatilized from the coating film on the substrate 10 is efficiently trapped on the second rectifying plate 150.

  In addition, there is no gap between the second current plate 150 and the side surface of the processing container 100. For this reason, the atmosphere around the substrate 10 surely flows through the space between the first rectifying plate 140 and the second rectifying plate 150 when exhausted. Therefore, it can further suppress that the component volatilized from the coating film solidifies in the exhaust pipe.

  Moreover, the 2nd baffle plate 150 is provided so that removal from the processing container 100 is possible. Therefore, maintenance of the second rectifying plate 150 can be easily performed, and the operating rate of the heat treatment apparatus can be increased.

  As mentioned above, although embodiment of this invention was described with reference to drawings, these are the illustrations of this invention, Various structures other than the above are also employable.

DESCRIPTION OF SYMBOLS 10 Substrate 100 Processing container 110 Intake port 120 Exhaust port 130 Stage 132 Heating unit 140 First rectifying plate 142 First through hole 150 Second rectifying plate 152 Second through hole 160 Cooling unit

Claims (4)

A processing vessel;
A stage disposed in the processing vessel and on which a substrate is placed;
A heating unit for heating the substrate on the stage;
A first current plate disposed above the stage in the processing vessel and having a plurality of first through holes;
A second rectifying plate disposed above the first rectifying plate in the processing vessel and having a plurality of second through holes;
A cooling unit for cooling the second current plate;
An exhaust port provided in the processing container and positioned on the opposite side of the stage via the second rectifying plate;
With
A heat treatment apparatus in which the second through hole does not overlap the first through hole in plan view. The heat treatment apparatus according to claim 1,
A heat treatment apparatus having no gap between the second current plate and the side surface of the processing container. In the heat treatment apparatus according to claim 1 or 2,
The heat treatment apparatus, wherein the second rectifying plate is detachable from the processing container. A substrate having a coating film is disposed in the processing container,
In the processing container, a first current plate having a plurality of first through holes is disposed above the substrate,
In the processing container, a second rectifying plate having a plurality of second through holes that do not overlap the first through hole in a plan view is disposed above the first rectifying plate,
A heat treatment method of heating the coating film of the substrate while evacuating the processing vessel from above the second rectifying plate and cooling the second rectifying plate.

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