TWI739024B - 電漿處理裝置 - Google Patents

電漿處理裝置 Download PDF

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Publication number
TWI739024B
TWI739024B TW107127210A TW107127210A TWI739024B TW I739024 B TWI739024 B TW I739024B TW 107127210 A TW107127210 A TW 107127210A TW 107127210 A TW107127210 A TW 107127210A TW I739024 B TWI739024 B TW I739024B
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TW
Taiwan
Prior art keywords
processing
plasma
plasma processing
data
prediction model
Prior art date
Application number
TW107127210A
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English (en)
Chinese (zh)
Other versions
TW201933418A (zh
Inventor
梅田祥太
野木慶太
鹿子嶋昭
白石大輔
Original Assignee
日商日立全球先端科技股份有限公司
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Application filed by 日商日立全球先端科技股份有限公司 filed Critical 日商日立全球先端科技股份有限公司
Publication of TW201933418A publication Critical patent/TW201933418A/zh
Application granted granted Critical
Publication of TWI739024B publication Critical patent/TWI739024B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32926—Software, data control or modelling
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G01J3/28—Investigating the spectrum
    • G01J3/443—Emission spectrometry
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H01J37/32972—Spectral analysis
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/20—Pc systems
    • G05B2219/26—Pc applications
    • G05B2219/2602—Wafer processing

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Quality & Reliability (AREA)
  • Automation & Control Theory (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
TW107127210A 2018-01-17 2018-08-06 電漿處理裝置 TWI739024B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018005761A JP7058129B2 (ja) 2018-01-17 2018-01-17 プラズマ処理装置
JP2018-005761 2018-01-17

Publications (2)

Publication Number Publication Date
TW201933418A TW201933418A (zh) 2019-08-16
TWI739024B true TWI739024B (zh) 2021-09-11

Family

ID=67214239

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107127210A TWI739024B (zh) 2018-01-17 2018-08-06 電漿處理裝置

Country Status (4)

Country Link
US (1) US11289313B2 (https=)
JP (1) JP7058129B2 (https=)
KR (1) KR102100210B1 (https=)
TW (1) TWI739024B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11966203B2 (en) 2019-08-21 2024-04-23 Kla Corporation System and method to adjust a kinetics model of surface reactions during plasma processing
JP7542417B2 (ja) 2019-12-27 2024-08-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、基板処理方法、基板処理システム、及び学習用データの生成方法
JP7429623B2 (ja) * 2020-08-31 2024-02-08 株式会社日立製作所 製造条件設定自動化装置及び方法
WO2026018701A1 (ja) * 2024-07-17 2026-01-22 東京エレクトロン株式会社 プラズマ処理装置及びレシピ登録方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8992721B2 (en) * 2009-10-09 2015-03-31 Hitachi High-Technologies Corporation Plasma processing apparatus
TW201515095A (zh) * 2013-10-04 2015-04-16 應用材料股份有限公司 匹配兩電漿反應器之預測方法
US20160379896A1 (en) * 2015-06-26 2016-12-29 Hitachi High-Technologies Corporation Plasma processing apparatus and data analysis apparatus
TW201724157A (zh) * 2015-06-12 2017-07-01 Tokyo Electron Ltd 電漿處理裝置、電漿處理裝置之控制方法及記憶媒體
TW201742101A (zh) * 2016-03-03 2017-12-01 蘭姆研究公司 使用一或多夾具及效率決定匹配網路模型之參數的系統及方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4317701B2 (ja) 2003-03-12 2009-08-19 東京エレクトロン株式会社 処理結果の予測方法及び予測装置
JP2004335841A (ja) * 2003-05-09 2004-11-25 Tokyo Electron Ltd プラズマ処理装置の予測装置及び予測方法
JP2005051269A (ja) * 2004-10-12 2005-02-24 Hitachi Ltd 半導体処理装置
WO2007066404A1 (ja) 2005-12-08 2007-06-14 Spansion Llc 半導体製造装置、その制御システムおよびその制御方法
JP2009049382A (ja) 2007-07-26 2009-03-05 Panasonic Corp ドライエッチング方法およびドライエッチング装置
JP4836994B2 (ja) 2008-06-11 2011-12-14 株式会社日立製作所 半導体処理装置
JP6220319B2 (ja) 2014-07-17 2017-10-25 株式会社日立ハイテクノロジーズ データ解析方法及びプラズマエッチング方法並びにプラズマ処理装置
JP6310866B2 (ja) * 2015-01-30 2018-04-11 株式会社日立ハイテクノロジーズ プラズマ処理装置及びプラズマ処理方法並びに解析方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8992721B2 (en) * 2009-10-09 2015-03-31 Hitachi High-Technologies Corporation Plasma processing apparatus
TW201515095A (zh) * 2013-10-04 2015-04-16 應用材料股份有限公司 匹配兩電漿反應器之預測方法
TW201724157A (zh) * 2015-06-12 2017-07-01 Tokyo Electron Ltd 電漿處理裝置、電漿處理裝置之控制方法及記憶媒體
US20160379896A1 (en) * 2015-06-26 2016-12-29 Hitachi High-Technologies Corporation Plasma processing apparatus and data analysis apparatus
TW201742101A (zh) * 2016-03-03 2017-12-01 蘭姆研究公司 使用一或多夾具及效率決定匹配網路模型之參數的系統及方法

Also Published As

Publication number Publication date
KR102100210B1 (ko) 2020-04-14
US20190221407A1 (en) 2019-07-18
JP2019125506A (ja) 2019-07-25
KR20190087940A (ko) 2019-07-25
US11289313B2 (en) 2022-03-29
TW201933418A (zh) 2019-08-16
JP7058129B2 (ja) 2022-04-21

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