TWI735672B - 光束掃描裝置、圖案描繪裝置、及圖案描繪裝置之精度檢查方法 - Google Patents

光束掃描裝置、圖案描繪裝置、及圖案描繪裝置之精度檢查方法 Download PDF

Info

Publication number
TWI735672B
TWI735672B TW106134121A TW106134121A TWI735672B TW I735672 B TWI735672 B TW I735672B TW 106134121 A TW106134121 A TW 106134121A TW 106134121 A TW106134121 A TW 106134121A TW I735672 B TWI735672 B TW I735672B
Authority
TW
Taiwan
Prior art keywords
polygon mirror
light beam
light
origin
scanning
Prior art date
Application number
TW106134121A
Other languages
English (en)
Chinese (zh)
Other versions
TW201832860A (zh
Inventor
加藤正紀
鬼頭義昭
林田洋祐
Original Assignee
日商尼康股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商尼康股份有限公司 filed Critical 日商尼康股份有限公司
Publication of TW201832860A publication Critical patent/TW201832860A/zh
Application granted granted Critical
Publication of TWI735672B publication Critical patent/TWI735672B/zh

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/12—Scanning systems using multifaceted mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Laser Beam Printer (AREA)
  • Mechanical Optical Scanning Systems (AREA)
TW106134121A 2016-10-04 2017-10-03 光束掃描裝置、圖案描繪裝置、及圖案描繪裝置之精度檢查方法 TWI735672B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2016-196440 2016-10-04
JP2016196440 2016-10-04

Publications (2)

Publication Number Publication Date
TW201832860A TW201832860A (zh) 2018-09-16
TWI735672B true TWI735672B (zh) 2021-08-11

Family

ID=61831523

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106134121A TWI735672B (zh) 2016-10-04 2017-10-03 光束掃描裝置、圖案描繪裝置、及圖案描繪裝置之精度檢查方法

Country Status (5)

Country Link
JP (1) JP7040453B2 (ko)
KR (1) KR102450792B1 (ko)
CN (1) CN109791281B (ko)
TW (1) TWI735672B (ko)
WO (1) WO2018066285A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023053879A1 (ja) * 2021-09-30 2023-04-06 日東電工株式会社 レーザ加工方法、光学シートの製造方法およびレーザ加工装置
CN114821627B (zh) * 2022-06-29 2022-09-27 江西少科智能建造科技有限公司 户门安装图纸智能审查方法、系统、存储介质及电子设备

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62174718A (ja) * 1986-01-28 1987-07-31 Fujitsu Ltd 走査光学装置
US5386221A (en) * 1992-11-02 1995-01-31 Etec Systems, Inc. Laser pattern generation apparatus
JPH08110488A (ja) * 1994-10-11 1996-04-30 Canon Inc 光走査装置
TW318894B (ko) * 1995-12-04 1997-11-01 Komatsu Mfg Co Ltd
JP2005275399A (ja) * 2004-03-15 2005-10-06 Hewlett-Packard Development Co Lp 平面外のスキャン開始
JP2011242725A (ja) * 2010-05-21 2011-12-01 Canon Inc 光走査装置、画像形成装置及び画像表示装置
WO2015166910A1 (ja) * 2014-04-28 2015-11-05 株式会社ニコン パターン描画装置、パターン描画方法、デバイス製造方法、レーザ光源装置、ビーム走査装置、および、ビーム走査方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19726581C5 (de) * 1997-06-23 2010-02-04 Sick Ag Verfahren zur Bestimmung der Fokuslage einer optoelektronischen Vorrichtung
JP4934498B2 (ja) * 2007-05-17 2012-05-16 キヤノン株式会社 走査式光学装置、画像形成装置及びジッター補正方法
JP2010004008A (ja) * 2007-10-31 2010-01-07 Nikon Corp 光学ユニット、照明光学装置、露光装置、露光方法、およびデバイス製造方法
JP6314774B2 (ja) 2014-09-26 2018-04-25 株式会社デンソー レーザ照射制御装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62174718A (ja) * 1986-01-28 1987-07-31 Fujitsu Ltd 走査光学装置
US5386221A (en) * 1992-11-02 1995-01-31 Etec Systems, Inc. Laser pattern generation apparatus
JPH08110488A (ja) * 1994-10-11 1996-04-30 Canon Inc 光走査装置
TW318894B (ko) * 1995-12-04 1997-11-01 Komatsu Mfg Co Ltd
JP2005275399A (ja) * 2004-03-15 2005-10-06 Hewlett-Packard Development Co Lp 平面外のスキャン開始
JP2011242725A (ja) * 2010-05-21 2011-12-01 Canon Inc 光走査装置、画像形成装置及び画像表示装置
WO2015166910A1 (ja) * 2014-04-28 2015-11-05 株式会社ニコン パターン描画装置、パターン描画方法、デバイス製造方法、レーザ光源装置、ビーム走査装置、および、ビーム走査方法

Also Published As

Publication number Publication date
CN109791281A (zh) 2019-05-21
JP7040453B2 (ja) 2022-03-23
KR102450792B1 (ko) 2022-10-06
JPWO2018066285A1 (ja) 2019-07-18
TW201832860A (zh) 2018-09-16
WO2018066285A1 (ja) 2018-04-12
KR20190057371A (ko) 2019-05-28
CN109791281B (zh) 2021-07-30

Similar Documents

Publication Publication Date Title
TWI753104B (zh) 圖案描繪裝置、及圖案描繪方法
WO2017104717A1 (ja) パターン描画装置
TWI735672B (zh) 光束掃描裝置、圖案描繪裝置、及圖案描繪裝置之精度檢查方法
TWI722250B (zh) 光束掃描裝置及圖案描繪裝置
TWI712818B (zh) 圖案描繪裝置
TWI820043B (zh) 圖案描繪裝置
TWI770062B (zh) 光束掃描裝置及圖案描繪裝置
CN108885337B (zh) 光束扫描装置及图案描绘装置
JPWO2018066159A1 (ja) パターン描画装置、およびパターン描画方法
JP2017107036A (ja) パターン描画装置、およびパターン描画方法