TWI734873B - 分割裝置 - Google Patents

分割裝置 Download PDF

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Publication number
TWI734873B
TWI734873B TW106142561A TW106142561A TWI734873B TW I734873 B TWI734873 B TW I734873B TW 106142561 A TW106142561 A TW 106142561A TW 106142561 A TW106142561 A TW 106142561A TW I734873 B TWI734873 B TW I734873B
Authority
TW
Taiwan
Prior art keywords
wafer
tape
dividing
interval
wafers
Prior art date
Application number
TW106142561A
Other languages
English (en)
Chinese (zh)
Other versions
TW201826373A (zh
Inventor
木篤
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW201826373A publication Critical patent/TW201826373A/zh
Application granted granted Critical
Publication of TWI734873B publication Critical patent/TWI734873B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
TW106142561A 2017-01-12 2017-12-05 分割裝置 TWI734873B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-003235 2017-01-12
JP2017003235A JP6785162B2 (ja) 2017-01-12 2017-01-12 分割装置

Publications (2)

Publication Number Publication Date
TW201826373A TW201826373A (zh) 2018-07-16
TWI734873B true TWI734873B (zh) 2021-08-01

Family

ID=62911234

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106142561A TWI734873B (zh) 2017-01-12 2017-12-05 分割裝置

Country Status (3)

Country Link
JP (1) JP6785162B2 (ja)
KR (1) KR102426263B1 (ja)
TW (1) TWI734873B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7436772B2 (ja) 2018-12-27 2024-02-22 日亜化学工業株式会社 半導体装置の製造方法
KR102542890B1 (ko) * 2023-04-03 2023-06-13 남진우 웨이퍼 신장 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200913096A (en) * 2007-06-19 2009-03-16 Renesas Tech Corp Manufacturing method for semiconductor integrated device
CN102822946A (zh) * 2010-03-31 2012-12-12 古河电气工业株式会社 半导体装置的制造方法
TW201700671A (zh) * 2015-03-24 2017-01-01 Furukawa Electric Co Ltd 半導體加工用膠帶

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4288392B2 (ja) * 2003-09-29 2009-07-01 株式会社東京精密 エキスパンド方法
JP4744957B2 (ja) 2005-07-13 2011-08-10 株式会社ディスコ ウエーハに装着された接着フィルムの破断装置
JP4955377B2 (ja) * 2006-12-12 2012-06-20 リンテック株式会社 チップ間隔の測定装置とその測定方法
JP2009094126A (ja) * 2007-10-04 2009-04-30 Furukawa Electric Co Ltd:The チップのピックアップ方法
JP5409280B2 (ja) 2009-11-09 2014-02-05 株式会社ディスコ チップ間隔拡張方法
JP6170681B2 (ja) 2013-01-24 2017-07-26 株式会社ディスコ 拡張装置および拡張方法
JP6103217B2 (ja) * 2013-05-30 2017-03-29 株式会社東京精密 ワーク分割装置及びワーク分割方法
JP2015204362A (ja) * 2014-04-14 2015-11-16 株式会社ディスコ チップ間隔維持方法
JP2016004832A (ja) 2014-06-13 2016-01-12 株式会社ディスコ テープ拡張装置
JP5939416B2 (ja) 2016-02-12 2016-06-22 株式会社東京精密 ワーク分割装置及びワーク分割方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200913096A (en) * 2007-06-19 2009-03-16 Renesas Tech Corp Manufacturing method for semiconductor integrated device
CN102822946A (zh) * 2010-03-31 2012-12-12 古河电气工业株式会社 半导体装置的制造方法
TW201700671A (zh) * 2015-03-24 2017-01-01 Furukawa Electric Co Ltd 半導體加工用膠帶

Also Published As

Publication number Publication date
JP6785162B2 (ja) 2020-11-18
KR20180083260A (ko) 2018-07-20
TW201826373A (zh) 2018-07-16
KR102426263B1 (ko) 2022-07-29
JP2018113349A (ja) 2018-07-19

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