TWI734804B - 用於化學鍍鎳或鎳合金的鎳膠體催化劑液以及化學鍍鎳或鎳合金方法 - Google Patents

用於化學鍍鎳或鎳合金的鎳膠體催化劑液以及化學鍍鎳或鎳合金方法 Download PDF

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Publication number
TWI734804B
TWI734804B TW106122325A TW106122325A TWI734804B TW I734804 B TWI734804 B TW I734804B TW 106122325 A TW106122325 A TW 106122325A TW 106122325 A TW106122325 A TW 106122325A TW I734804 B TWI734804 B TW I734804B
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TW
Taiwan
Prior art keywords
nickel
catalyst
solution
colloidal
electroless
Prior art date
Application number
TW106122325A
Other languages
English (en)
Chinese (zh)
Other versions
TW201809352A (zh
Inventor
吉澤章央
田中雄也
內田衛
田中薰
Original Assignee
日商石原化學股份有限公司
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Publication of TW201809352A publication Critical patent/TW201809352A/zh
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Publication of TWI734804B publication Critical patent/TWI734804B/zh

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1837—Multistep pretreatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
TW106122325A 2016-07-08 2017-07-04 用於化學鍍鎳或鎳合金的鎳膠體催化劑液以及化學鍍鎳或鎳合金方法 TWI734804B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016136363 2016-07-08
JPJP2016-136363 2016-07-08

Publications (2)

Publication Number Publication Date
TW201809352A TW201809352A (zh) 2018-03-16
TWI734804B true TWI734804B (zh) 2021-08-01

Family

ID=60912178

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106122325A TWI734804B (zh) 2016-07-08 2017-07-04 用於化學鍍鎳或鎳合金的鎳膠體催化劑液以及化學鍍鎳或鎳合金方法

Country Status (5)

Country Link
JP (1) JP6268379B2 (ja)
KR (2) KR20190026857A (ja)
CN (1) CN109642323B (ja)
TW (1) TWI734804B (ja)
WO (1) WO2018008746A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6374624B1 (ja) 2018-01-29 2018-08-15 ユニ・チャーム株式会社 吸収性物品
KR102459414B1 (ko) * 2020-12-04 2022-10-27 주식회사 티엘비 인쇄회로기판 및 이의 제조방법
JP2022134922A (ja) * 2021-03-04 2022-09-15 株式会社Jcu 無電解ニッケルめっき浴および無電解ニッケル合金めっき浴

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100155108A1 (en) * 2008-12-23 2010-06-24 Samsung Electro-Mechanics Co., Ltd. Electroless nickel plating solution composition, flexible printed circuit board and manufacturing method thereof

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US4339476A (en) * 1978-08-17 1982-07-13 Nathan Feldstein Dispersions for activating non-conductors for electroless plating
US4261747A (en) * 1978-12-06 1981-04-14 Nathan Feldstein Dispersions for activating non-conductors for electroless plating
CA1166389A (en) * 1980-08-13 1984-04-24 Hideo Kasahara Highly heat-resistant thermoplastic resin composition containing polyphenylene ether, polyamide and a copolymer including acid anhydride or imide containing units
JPH0613753B2 (ja) * 1988-09-29 1994-02-23 三晃特殊金属工業株式会社 無電解メッキに使用する微細な金属体を含む溶液の製造方法
JP2881871B2 (ja) 1989-12-08 1999-04-12 ソニー株式会社 光ディスクの原盤作成方法
JP3960674B2 (ja) 1998-01-22 2007-08-15 ディップソール株式会社 金属コロイド安定化剤、該安定化剤を含有する金属コロイド液状組成物、その調製方法及びその使用
JP2007177268A (ja) 2005-12-27 2007-07-12 Okuno Chem Ind Co Ltd 無電解ニッケルめっき用貴金属表面活性化液
JP5344416B2 (ja) 2006-03-09 2013-11-20 奥野製薬工業株式会社 自己触媒型無電解ニッケルめっき液用耐折り曲げ性向上剤及び自己触媒型無電解ニッケルめっき液
CN101096769A (zh) * 2006-06-26 2008-01-02 比亚迪股份有限公司 一种电镀方法
US8591636B2 (en) * 2010-12-14 2013-11-26 Rohm And Haas Electronics Materials Llc Plating catalyst and method
JP6047713B2 (ja) * 2012-05-11 2016-12-21 石原ケミカル株式会社 無電解銅メッキ方法
US9441300B2 (en) 2013-03-15 2016-09-13 Rohm And Haas Electronic Materials Llc Stable catalysts for electroless metallization
JP5649150B1 (ja) * 2014-07-17 2015-01-07 日本エレクトロプレイテイング・エンジニヤース株式会社 無電解メッキ用前処理液および無電解メッキ方法
JP6201153B2 (ja) * 2014-09-11 2017-09-27 石原ケミカル株式会社 無電解ニッケル又はニッケル合金メッキ用のニッケルコロイド触媒液並びに無電解ニッケル又はニッケル合金メッキ方法
JP6209770B2 (ja) * 2015-02-19 2017-10-11 石原ケミカル株式会社 無電解銅メッキ用の銅コロイド触媒液並びに無電解銅メッキ方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100155108A1 (en) * 2008-12-23 2010-06-24 Samsung Electro-Mechanics Co., Ltd. Electroless nickel plating solution composition, flexible printed circuit board and manufacturing method thereof

Also Published As

Publication number Publication date
CN109642323A (zh) 2019-04-16
CN109642323B (zh) 2021-04-09
JP2018012882A (ja) 2018-01-25
KR20190026857A (ko) 2019-03-13
KR102341914B1 (ko) 2021-12-22
KR20200128202A (ko) 2020-11-11
JP6268379B2 (ja) 2018-01-31
TW201809352A (zh) 2018-03-16
WO2018008746A1 (ja) 2018-01-11

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