KR20190026857A - 무전해 니켈 또는 니켈 합금 도금용 니켈 콜로이드 촉매액 및 무전해 니켈 또는 니켈 합금 도금방법 - Google Patents

무전해 니켈 또는 니켈 합금 도금용 니켈 콜로이드 촉매액 및 무전해 니켈 또는 니켈 합금 도금방법 Download PDF

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Publication number
KR20190026857A
KR20190026857A KR1020197003658A KR20197003658A KR20190026857A KR 20190026857 A KR20190026857 A KR 20190026857A KR 1020197003658 A KR1020197003658 A KR 1020197003658A KR 20197003658 A KR20197003658 A KR 20197003658A KR 20190026857 A KR20190026857 A KR 20190026857A
Authority
KR
South Korea
Prior art keywords
nickel
solution
catalyst
electroless
plating
Prior art date
Application number
KR1020197003658A
Other languages
English (en)
Korean (ko)
Inventor
아키히로 요시자와
유야 다나카
에이 우치다
가오루 다나카
Original Assignee
이시하라 케미칼 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이시하라 케미칼 가부시키가이샤 filed Critical 이시하라 케미칼 가부시키가이샤
Priority to KR1020207031699A priority Critical patent/KR102341914B1/ko
Publication of KR20190026857A publication Critical patent/KR20190026857A/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1837—Multistep pretreatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
KR1020197003658A 2016-07-08 2017-07-07 무전해 니켈 또는 니켈 합금 도금용 니켈 콜로이드 촉매액 및 무전해 니켈 또는 니켈 합금 도금방법 KR20190026857A (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020207031699A KR102341914B1 (ko) 2016-07-08 2017-07-07 무전해 니켈 또는 니켈 합금 도금용 니켈 콜로이드 촉매액 및 무전해 니켈 또는 니켈 합금 도금방법

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016136363 2016-07-08
JPJP-P-2016-136363 2016-07-08
PCT/JP2017/024976 WO2018008746A1 (ja) 2016-07-08 2017-07-07 無電解ニッケル又はニッケル合金メッキ用のニッケルコロイド触媒液並びに無電解ニッケル又はニッケル合金メッキ方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020207031699A Division KR102341914B1 (ko) 2016-07-08 2017-07-07 무전해 니켈 또는 니켈 합금 도금용 니켈 콜로이드 촉매액 및 무전해 니켈 또는 니켈 합금 도금방법

Publications (1)

Publication Number Publication Date
KR20190026857A true KR20190026857A (ko) 2019-03-13

Family

ID=60912178

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020207031699A KR102341914B1 (ko) 2016-07-08 2017-07-07 무전해 니켈 또는 니켈 합금 도금용 니켈 콜로이드 촉매액 및 무전해 니켈 또는 니켈 합금 도금방법
KR1020197003658A KR20190026857A (ko) 2016-07-08 2017-07-07 무전해 니켈 또는 니켈 합금 도금용 니켈 콜로이드 촉매액 및 무전해 니켈 또는 니켈 합금 도금방법

Family Applications Before (1)

Application Number Title Priority Date Filing Date
KR1020207031699A KR102341914B1 (ko) 2016-07-08 2017-07-07 무전해 니켈 또는 니켈 합금 도금용 니켈 콜로이드 촉매액 및 무전해 니켈 또는 니켈 합금 도금방법

Country Status (5)

Country Link
JP (1) JP6268379B2 (ja)
KR (2) KR102341914B1 (ja)
CN (1) CN109642323B (ja)
TW (1) TWI734804B (ja)
WO (1) WO2018008746A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220078949A (ko) * 2020-12-04 2022-06-13 주식회사 티엘비 인쇄회로기판 및 이의 제조방법

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6374624B1 (ja) 2018-01-29 2018-08-15 ユニ・チャーム株式会社 吸収性物品
JP2022134922A (ja) * 2021-03-04 2022-09-15 株式会社Jcu 無電解ニッケルめっき浴および無電解ニッケル合金めっき浴

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0293076A (ja) 1988-09-29 1990-04-03 Sanko Tokushu Kinzoku Kogyo Kk 無電解メッキに利用される微細な金属体の製造方法
JPH03180476A (ja) 1989-12-08 1991-08-06 Sony Corp 光ディスクの原盤作成方法
JPH11209878A (ja) 1998-01-22 1999-08-03 Dipsol Chem Co Ltd 金属コロイド安定化剤、該安定化剤を含有する金属コロイド液状組成物、その調製方法及びその使用
JP2007177268A (ja) 2005-12-27 2007-07-12 Okuno Chem Ind Co Ltd 無電解ニッケルめっき用貴金属表面活性化液
JP2007270344A (ja) 2006-03-09 2007-10-18 Okuno Chem Ind Co Ltd 無電解ニッケルめっき液

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US4339476A (en) * 1978-08-17 1982-07-13 Nathan Feldstein Dispersions for activating non-conductors for electroless plating
US4261747A (en) * 1978-12-06 1981-04-14 Nathan Feldstein Dispersions for activating non-conductors for electroless plating
US4339376A (en) * 1980-08-13 1982-07-13 Asahi-Dow Limited Highly heat-resistant thermoplastic resin composition having high oil-resistance
CN101096769A (zh) * 2006-06-26 2008-01-02 比亚迪股份有限公司 一种电镀方法
KR101058635B1 (ko) * 2008-12-23 2011-08-22 와이엠티 주식회사 무전해 니켈 도금액 조성물, 연성인쇄회로기판 및 이의 제조 방법
US8591636B2 (en) * 2010-12-14 2013-11-26 Rohm And Haas Electronics Materials Llc Plating catalyst and method
JP6047713B2 (ja) * 2012-05-11 2016-12-21 石原ケミカル株式会社 無電解銅メッキ方法
US9441300B2 (en) 2013-03-15 2016-09-13 Rohm And Haas Electronic Materials Llc Stable catalysts for electroless metallization
JP5649150B1 (ja) * 2014-07-17 2015-01-07 日本エレクトロプレイテイング・エンジニヤース株式会社 無電解メッキ用前処理液および無電解メッキ方法
JP6201153B2 (ja) * 2014-09-11 2017-09-27 石原ケミカル株式会社 無電解ニッケル又はニッケル合金メッキ用のニッケルコロイド触媒液並びに無電解ニッケル又はニッケル合金メッキ方法
JP6209770B2 (ja) * 2015-02-19 2017-10-11 石原ケミカル株式会社 無電解銅メッキ用の銅コロイド触媒液並びに無電解銅メッキ方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0293076A (ja) 1988-09-29 1990-04-03 Sanko Tokushu Kinzoku Kogyo Kk 無電解メッキに利用される微細な金属体の製造方法
JPH03180476A (ja) 1989-12-08 1991-08-06 Sony Corp 光ディスクの原盤作成方法
JPH11209878A (ja) 1998-01-22 1999-08-03 Dipsol Chem Co Ltd 金属コロイド安定化剤、該安定化剤を含有する金属コロイド液状組成物、その調製方法及びその使用
JP2007177268A (ja) 2005-12-27 2007-07-12 Okuno Chem Ind Co Ltd 無電解ニッケルめっき用貴金属表面活性化液
JP2007270344A (ja) 2006-03-09 2007-10-18 Okuno Chem Ind Co Ltd 無電解ニッケルめっき液

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220078949A (ko) * 2020-12-04 2022-06-13 주식회사 티엘비 인쇄회로기판 및 이의 제조방법

Also Published As

Publication number Publication date
CN109642323A (zh) 2019-04-16
WO2018008746A1 (ja) 2018-01-11
TWI734804B (zh) 2021-08-01
KR20200128202A (ko) 2020-11-11
KR102341914B1 (ko) 2021-12-22
JP2018012882A (ja) 2018-01-25
TW201809352A (zh) 2018-03-16
JP6268379B2 (ja) 2018-01-31
CN109642323B (zh) 2021-04-09

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