CN109642323B - 化学镀镍或镍合金用镍胶体催化剂液以及化学镀镍或镍合金方法 - Google Patents

化学镀镍或镍合金用镍胶体催化剂液以及化学镀镍或镍合金方法 Download PDF

Info

Publication number
CN109642323B
CN109642323B CN201780042262.6A CN201780042262A CN109642323B CN 109642323 B CN109642323 B CN 109642323B CN 201780042262 A CN201780042262 A CN 201780042262A CN 109642323 B CN109642323 B CN 109642323B
Authority
CN
China
Prior art keywords
nickel
plating
catalyst
solution
colloidal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201780042262.6A
Other languages
English (en)
Chinese (zh)
Other versions
CN109642323A (zh
Inventor
吉泽章央
田中雄也
内田卫
田中薰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ishihara Chemical Co Ltd
Original Assignee
Ishihara Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ishihara Chemical Co Ltd filed Critical Ishihara Chemical Co Ltd
Publication of CN109642323A publication Critical patent/CN109642323A/zh
Application granted granted Critical
Publication of CN109642323B publication Critical patent/CN109642323B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1837—Multistep pretreatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
CN201780042262.6A 2016-07-08 2017-07-07 化学镀镍或镍合金用镍胶体催化剂液以及化学镀镍或镍合金方法 Active CN109642323B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016136363 2016-07-08
JP2016-136363 2016-07-08
PCT/JP2017/024976 WO2018008746A1 (ja) 2016-07-08 2017-07-07 無電解ニッケル又はニッケル合金メッキ用のニッケルコロイド触媒液並びに無電解ニッケル又はニッケル合金メッキ方法

Publications (2)

Publication Number Publication Date
CN109642323A CN109642323A (zh) 2019-04-16
CN109642323B true CN109642323B (zh) 2021-04-09

Family

ID=60912178

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780042262.6A Active CN109642323B (zh) 2016-07-08 2017-07-07 化学镀镍或镍合金用镍胶体催化剂液以及化学镀镍或镍合金方法

Country Status (5)

Country Link
JP (1) JP6268379B2 (ja)
KR (2) KR20190026857A (ja)
CN (1) CN109642323B (ja)
TW (1) TWI734804B (ja)
WO (1) WO2018008746A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6374624B1 (ja) 2018-01-29 2018-08-15 ユニ・チャーム株式会社 吸収性物品
KR102459414B1 (ko) * 2020-12-04 2022-10-27 주식회사 티엘비 인쇄회로기판 및 이의 제조방법
JP2022134922A (ja) * 2021-03-04 2022-09-15 株式会社Jcu 無電解ニッケルめっき浴および無電解ニッケル合金めっき浴

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4339476A (en) * 1978-08-17 1982-07-13 Nathan Feldstein Dispersions for activating non-conductors for electroless plating
US4261747A (en) * 1978-12-06 1981-04-14 Nathan Feldstein Dispersions for activating non-conductors for electroless plating
CA1166389A (en) * 1980-08-13 1984-04-24 Hideo Kasahara Highly heat-resistant thermoplastic resin composition containing polyphenylene ether, polyamide and a copolymer including acid anhydride or imide containing units
JPH0613753B2 (ja) * 1988-09-29 1994-02-23 三晃特殊金属工業株式会社 無電解メッキに使用する微細な金属体を含む溶液の製造方法
JP2881871B2 (ja) 1989-12-08 1999-04-12 ソニー株式会社 光ディスクの原盤作成方法
JP3960674B2 (ja) 1998-01-22 2007-08-15 ディップソール株式会社 金属コロイド安定化剤、該安定化剤を含有する金属コロイド液状組成物、その調製方法及びその使用
JP2007177268A (ja) 2005-12-27 2007-07-12 Okuno Chem Ind Co Ltd 無電解ニッケルめっき用貴金属表面活性化液
JP5344416B2 (ja) 2006-03-09 2013-11-20 奥野製薬工業株式会社 自己触媒型無電解ニッケルめっき液用耐折り曲げ性向上剤及び自己触媒型無電解ニッケルめっき液
CN101096769A (zh) * 2006-06-26 2008-01-02 比亚迪股份有限公司 一种电镀方法
KR101058635B1 (ko) * 2008-12-23 2011-08-22 와이엠티 주식회사 무전해 니켈 도금액 조성물, 연성인쇄회로기판 및 이의 제조 방법
US8591636B2 (en) * 2010-12-14 2013-11-26 Rohm And Haas Electronics Materials Llc Plating catalyst and method
JP6047713B2 (ja) * 2012-05-11 2016-12-21 石原ケミカル株式会社 無電解銅メッキ方法
US9441300B2 (en) 2013-03-15 2016-09-13 Rohm And Haas Electronic Materials Llc Stable catalysts for electroless metallization
JP5649150B1 (ja) * 2014-07-17 2015-01-07 日本エレクトロプレイテイング・エンジニヤース株式会社 無電解メッキ用前処理液および無電解メッキ方法
JP6201153B2 (ja) * 2014-09-11 2017-09-27 石原ケミカル株式会社 無電解ニッケル又はニッケル合金メッキ用のニッケルコロイド触媒液並びに無電解ニッケル又はニッケル合金メッキ方法
JP6209770B2 (ja) * 2015-02-19 2017-10-11 石原ケミカル株式会社 無電解銅メッキ用の銅コロイド触媒液並びに無電解銅メッキ方法

Also Published As

Publication number Publication date
CN109642323A (zh) 2019-04-16
JP2018012882A (ja) 2018-01-25
TWI734804B (zh) 2021-08-01
KR20190026857A (ko) 2019-03-13
KR102341914B1 (ko) 2021-12-22
KR20200128202A (ko) 2020-11-11
JP6268379B2 (ja) 2018-01-31
TW201809352A (zh) 2018-03-16
WO2018008746A1 (ja) 2018-01-11

Similar Documents

Publication Publication Date Title
KR101831099B1 (ko) 무전해 니켈 또는 니켈 합금 도금용 니켈 콜로이드 촉매액 및 무전해 니켈 또는 니켈 합금 도금방법
TWI684673B (zh) 化學鍍銅用之銅膠體催化溶液及化學鍍銅方法
JP3929399B2 (ja) 無電解金属めっきのための方法
JP6343787B1 (ja) 無電解銅メッキ用の銅コロイド触媒液並びに無電解銅メッキ方法
CN109642323B (zh) 化学镀镍或镍合金用镍胶体催化剂液以及化学镀镍或镍合金方法
JP6047713B2 (ja) 無電解銅メッキ方法
EP2610366A2 (en) Plating catalyst and method
CN115803476B (zh) 化学镀镍或镍合金用镍胶体催化液、化学镀镍或镍合金方法、以及镀镍或镍合金基板的制造方法
WO2021220788A1 (ja) 無電解ニッケル又はニッケル合金メッキ用のニッケルコロイド触媒液、無電解ニッケル又はニッケル合金メッキ方法、及びニッケル又はニッケル合金メッキ基板の製造方法
JP6735981B2 (ja) 無電解銅メッキ方法及び当該方法を用いたプリント配線板の製造方法
EP2610365A2 (en) Plating catalyst and method
JP2024151625A (ja) 無電解銅メッキ用のニッケルコロイド触媒液並びに無電解銅メッキ方法
JP2023008598A (ja) 無電解ニッケル又はニッケル合金メッキ方法
JP5364880B2 (ja) クロム酸−硫酸混液によるエッチング処理の後処理剤

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant