TWI734575B - 電磁波屏蔽片及電磁波屏蔽性配線電路基板 - Google Patents

電磁波屏蔽片及電磁波屏蔽性配線電路基板 Download PDF

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Publication number
TWI734575B
TWI734575B TW109126000A TW109126000A TWI734575B TW I734575 B TWI734575 B TW I734575B TW 109126000 A TW109126000 A TW 109126000A TW 109126000 A TW109126000 A TW 109126000A TW I734575 B TWI734575 B TW I734575B
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TW
Taiwan
Prior art keywords
electromagnetic wave
wave shielding
conductive adhesive
layer
adhesive layer
Prior art date
Application number
TW109126000A
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English (en)
Chinese (zh)
Other versions
TW202107969A (zh
Inventor
岸大将
森祥太
早坂努
Original Assignee
日商東洋油墨Ｓｃ控股股份有限公司
日商東洋科美股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商東洋油墨Ｓｃ控股股份有限公司, 日商東洋科美股份有限公司 filed Critical 日商東洋油墨Ｓｃ控股股份有限公司
Publication of TW202107969A publication Critical patent/TW202107969A/zh
Application granted granted Critical
Publication of TWI734575B publication Critical patent/TWI734575B/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)
TW109126000A 2019-08-01 2020-07-31 電磁波屏蔽片及電磁波屏蔽性配線電路基板 TWI734575B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019142448A JP6624331B1 (ja) 2019-08-01 2019-08-01 電磁波シールドシート、および電磁波シールド性配線回路基板
JP2019-142448 2019-08-01

Publications (2)

Publication Number Publication Date
TW202107969A TW202107969A (zh) 2021-02-16
TWI734575B true TWI734575B (zh) 2021-07-21

Family

ID=69100908

Family Applications (1)

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TW109126000A TWI734575B (zh) 2019-08-01 2020-07-31 電磁波屏蔽片及電磁波屏蔽性配線電路基板

Country Status (4)

Country Link
JP (1) JP6624331B1 (ko)
KR (1) KR102238613B1 (ko)
CN (1) CN111741595B (ko)
TW (1) TWI734575B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI826240B (zh) * 2023-01-16 2023-12-11 蘇憲強 可絕緣及抑制電磁波之無線電路模組及製造方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116134612A (zh) * 2021-07-29 2023-05-16 东洋油墨Sc控股株式会社 电子零件搭载基板、电子零件保护片以及电子机器
JP7193031B1 (ja) * 2021-07-29 2022-12-20 東洋インキＳｃホールディングス株式会社 電子部品搭載基板、及び電子部品保護シート
JP7113412B1 (ja) 2022-04-06 2022-08-05 東洋インキＳｃホールディングス株式会社 保護膜、保護膜を有する筐体およびそれを用いてなる電子機器

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JP2017147276A (ja) * 2016-02-15 2017-08-24 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、電磁波シールド性配線回路基板および電子機器
TW201819183A (zh) * 2016-07-11 2018-06-01 藤森工業股份有限公司 電磁波遮蔽材
WO2018147298A1 (ja) * 2017-02-08 2018-08-16 タツタ電線株式会社 電磁波シールドフィルム、シールドプリント配線板及び電子機器
CN208609256U (zh) * 2017-07-20 2019-03-15 信越聚合物株式会社 电磁波屏蔽膜及带电磁波屏蔽膜的印刷电路板

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JP2007332418A (ja) * 2006-06-15 2007-12-27 Fukuda Metal Foil & Powder Co Ltd 表面処理銅箔
US10015915B2 (en) * 2011-11-24 2018-07-03 Tatsuta Electric Wire & Cable Co., Ltd. Shield film, shielded printed wiring board, and method for manufacturing shield film
KR101288884B1 (ko) 2011-12-29 2013-08-07 (주)덕산코트랜 히트펌프식 냉ㆍ온수 공급장치
JP2013168643A (ja) 2012-01-17 2013-08-29 Toyo Ink Sc Holdings Co Ltd 電磁波シールドシートおよび電磁波シールド層付き配線板の製造方法
KR101537004B1 (ko) * 2012-09-06 2015-07-15 제일모직 주식회사 수지 조성물 및 이를 이용한 성형품
JP6402503B2 (ja) * 2014-06-23 2018-10-10 大日本印刷株式会社 積層材、タッチパネルセンサ、電磁波遮蔽材、及び、画像表示装置
JP6511473B2 (ja) * 2014-12-05 2019-05-15 タツタ電線株式会社 電磁波シールドフィルム
CN205864954U (zh) * 2016-07-26 2017-01-04 昆山雅森电子材料科技有限公司 高传输高屏蔽效能的电磁干扰屏蔽膜
CN109219332A (zh) * 2017-07-03 2019-01-15 信越聚合物株式会社 电磁波屏蔽膜及其制造方法、以及带有电磁波屏蔽膜的印刷电路板及其制造方法
JP6970025B2 (ja) * 2018-01-10 2021-11-24 タツタ電線株式会社 電磁波シールドフィルム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017147276A (ja) * 2016-02-15 2017-08-24 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、電磁波シールド性配線回路基板および電子機器
TW201819183A (zh) * 2016-07-11 2018-06-01 藤森工業股份有限公司 電磁波遮蔽材
WO2018147298A1 (ja) * 2017-02-08 2018-08-16 タツタ電線株式会社 電磁波シールドフィルム、シールドプリント配線板及び電子機器
CN208609256U (zh) * 2017-07-20 2019-03-15 信越聚合物株式会社 电磁波屏蔽膜及带电磁波屏蔽膜的印刷电路板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI826240B (zh) * 2023-01-16 2023-12-11 蘇憲強 可絕緣及抑制電磁波之無線電路模組及製造方法

Also Published As

Publication number Publication date
CN111741595B (zh) 2021-06-01
TW202107969A (zh) 2021-02-16
CN111741595A (zh) 2020-10-02
JP6624331B1 (ja) 2019-12-25
JP2021027102A (ja) 2021-02-22
KR20210015661A (ko) 2021-02-10
KR102238613B1 (ko) 2021-04-09

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