TWI733771B - Curable resin composition - Google Patents

Curable resin composition Download PDF

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TWI733771B
TWI733771B TW106108011A TW106108011A TWI733771B TW I733771 B TWI733771 B TW I733771B TW 106108011 A TW106108011 A TW 106108011A TW 106108011 A TW106108011 A TW 106108011A TW I733771 B TWI733771 B TW I733771B
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acrylate
resin composition
curable resin
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TW201809044A (en
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青野智史
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日商協立化學產業股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06Polymers provided for in subclass C08G
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • C08F2/48Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F265/00Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
    • C08F265/04Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
    • C08F265/06Polymerisation of acrylate or methacrylate esters on to polymers thereof
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

本發明係有關特徵為,同時擔保無機基材與有機基材之接著力的硬化性組成物中,含有分子量5,000以上之(甲基)丙烯酸基低聚物(成分A)、(甲基)丙烯酸基單體(成分B),與由光自由基聚合引發劑及熱自由基聚合引發劑所成群中所選出之至少一種之自由基聚合引發劑(成分C),且黏度為150mPa˙s以下之硬化性樹脂組成物。 The present invention is characterized in that the curable composition that guarantees the adhesion between the inorganic substrate and the organic substrate at the same time contains (meth)acrylic oligomer (component A) and (meth)acrylic acid with a molecular weight of 5,000 or more Base monomer (component B), and at least one radical polymerization initiator (component C) selected from the group of photo-radical polymerization initiators and thermal radical polymerization initiators, and the viscosity is 150mPa˙s or less The curable resin composition.

Description

硬化性樹脂組成物 Curable resin composition

本發明係有關硬化性樹脂組成物 The present invention relates to a curable resin composition

已知使用噴墨用油墨之噴墨印刷為,可以較低成本於基板上形成所希望之圖型,及極薄化之樹脂層(薄膜)的方法。該類噴墨用油墨如專利文獻1所提案,含有具有羥基之單官能聚合性單體、二官能(甲基)丙烯酸酯及光聚合引發劑之光硬化性噴墨用油墨。 It is known that inkjet printing using inkjet ink is a method that can form a desired pattern on a substrate at a lower cost and a very thin resin layer (film). This type of inkjet ink is a photocurable inkjet ink containing a monofunctional polymerizable monomer having a hydroxyl group, a difunctional (meth)acrylate, and a photopolymerization initiator, as proposed in Patent Document 1.

最近隨著顯示器等之顯示裝置薄背化,有關貼合含有前面板、面板與濾光器等之蓋透鏡與TFT(薄膜二極管)等顯示元件及構件用之接著劑如專利文獻2所提案特徵為,含有一分子中具有2個以上之(甲基)丙烯醯基之胺基甲酸酯(甲基)丙烯酸酯低聚物,與具有羥基之(甲基)丙烯酸酯,與非自由基聚合性柔軟性成分,與光自由基聚合引發劑之紫外線硬化型接著劑組成物。 Recently, as display devices such as displays have become thinner, the bonding agent for display elements and components such as cover lenses including front panels, panels, and filters, and TFTs (thin film diodes) is proposed in Patent Document 2. It contains urethane (meth)acrylate oligomers with more than 2 (meth)acrylic groups in one molecule, and (meth)acrylates with hydroxyl groups, and non-radical polymerization It is an ultraviolet curable adhesive composition with a flexible component and a photo-radical polymerization initiator.

先前技術文獻 Prior art literature 專利文獻 Patent literature

專利文獻1:特開2008-63556號公報 Patent Document 1: Japanese Patent Application Publication No. 2008-63556

專利文獻2:特開2014-118508號公報 Patent Document 2: JP 2014-118508 A

近年來已開發之影像顯示裝置用之構件之接著方法如,薄狀塗佈噴墨而貼合之方法,因此也需求對應其之接著劑。但噴墨可塗附之程度為150mPa˙s以下,故黏度極低,因此如專利文獻2之實施例所揭示之添加方式係難同時擔保玻璃等之無機基材,與薄膜等之有機基材的接著力。 In recent years, a method of bonding components for image display devices has been developed, such as a thin coating and inkjet bonding method. Therefore, an adhesive corresponding to it is also required. However, the inkjet can be applied to a degree below 150mPa˙s, so the viscosity is extremely low. Therefore, the addition method disclosed in the examples of Patent Document 2 is difficult to guarantee both inorganic substrates such as glass and organic substrates such as thin films. The next force.

為了解決上述問題,本發明之目的為提供既使貼合無機基材與有機基材時,也可使基材相互間具有優良接著力之光及熱硬化性樹脂組成物。 In order to solve the above-mentioned problems, the object of the present invention is to provide a light and thermosetting resin composition that can have excellent adhesion between the substrates even when the inorganic substrate and the organic substrate are bonded.

本發明者發現特徵為,含有分子量5,000以上之(甲基)丙烯酸基低聚物(成分A),與(甲基)丙烯酸基單體(成分B),與光及/或熱自由基聚合引發劑(成分C),且黏度為150mPa˙s以下之組成物可解決前述課題,而完成本發明。 The present inventors discovered that it is characterized by a (meth)acrylic oligomer (component A) with a molecular weight of 5,000 or more, and a (meth)acrylic monomer (component B), which is initiated by radical polymerization with light and/or heat. (Component C) and a composition with a viscosity of 150 mPa˙s or less can solve the aforementioned problems and complete the present invention.

本發明係由下述構成。 The present invention is constituted by the following.

[1]一種硬化性樹脂組成物,其為含有分子量5,000以上之(甲基)丙烯酸基低聚物(成分A)、(甲基)丙烯酸基單 體(成分B),與由光自由基聚合引發劑及熱自由基聚合引發劑所成群中所選出之至少一種之自由基聚合引發劑(成分C),且黏度為150mPa˙s以下。 [1] A curable resin composition containing a (meth)acrylic oligomer (component A) with a molecular weight of 5,000 or more, a (meth)acrylic monomer Body (component B), and at least one radical polymerization initiator (component C) selected from the group of photo-radical polymerization initiators and thermal radical polymerization initiators, and the viscosity is 150mPa˙s or less.

[2]如[1]之硬化性樹脂組成物,其中成分B為含有10mPa˙s以下之(甲基)丙烯酸基單體。 [2] The curable resin composition according to [1], wherein component B is a (meth)acrylic monomer containing 10 mPa˙s or less.

[3]如[1]或[2]之硬化性樹脂組成物,其中成分B為含有脂環式(甲基)丙烯酸基單體、含有羥基之(甲基)丙烯酸基單體及C6~C30之烷基(甲基)丙烯酸基單體。 [3] The curable resin composition of [1] or [2], wherein component B is an alicyclic (meth)acrylic monomer, a hydroxyl-containing (meth)acrylic monomer, and C 6 ~ C 30 alkyl (meth)acrylic monomer.

[4]如[1]~[3]中任一項之硬化性樹脂組成物,其中相對於成分A及成分B之合計100重量份,成分A為30重量份以下。 [4] The curable resin composition according to any one of [1] to [3], wherein the component A is 30 parts by weight or less with respect to 100 parts by weight of the total of the component A and the component B.

[5]如[1]~[4]中任一項之硬化性樹脂組成物,其為接著劑。 [5] The curable resin composition according to any one of [1] to [4], which is an adhesive.

[6]如[1]~[4]中任一項之硬化性樹脂組成物,其為使用於由旋轉塗佈機、模具塗佈機、定量分配器、噴墨塗佈、網版印刷及照相凹版印刷所成群中所選出之一種以上之方法。 [6] The curable resin composition of any one of [1] to [4], which is used in spin coaters, die coaters, quantitative dispensers, inkjet coating, screen printing, and More than one method selected from a group of gravure printing houses.

藉由本發明可提供既使貼合無機基材與有機基材時,也可使基材相互間具有優良接著力之光及熱硬化性樹脂組成物。 According to the present invention, it is possible to provide a light and thermosetting resin composition that can have excellent adhesion between the substrates even when an inorganic substrate and an organic substrate are bonded.

[用語定義] [Definition of terms]

「(甲基)丙烯酸酯」係指丙烯酸酯及甲基丙烯酸酯中至少一方。 "(Meth)acrylate" means at least one of acrylate and methacrylate.

「(甲基)丙烯醯基」係指丙烯醯基及甲基丙烯醯基中至少一方。 "(Meth)acryloyl group" means at least one of an acryloyl group and a methacryloyl group.

「(甲基)丙烯酸基」係指丙烯酸基及甲基丙烯酸基中至少一方。 "(Meth)acryl group" means at least one of an acrylic group and a methacryl group.

[硬化性樹脂組成物] [Curable resin composition]

硬化性樹脂組成物(以下單稱為「組成物」)為,含有分子量5,000以上之(甲基)丙烯酸基低聚物(成分A)、(甲基)丙烯酸基單體(成分B),與由光自由基聚合引發劑及熱自由基聚合引發劑所成群中所選出之至少一種之自由基聚合引發劑(成分C),且黏度為150mPa˙s以下。 The curable resin composition (hereinafter simply referred to as "composition") is a (meth)acrylic oligomer (component A) with a molecular weight of 5,000 or more, a (meth)acrylic monomer (component B), and At least one kind of radical polymerization initiator (component C) selected from the group of photo radical polymerization initiators and thermal radical polymerization initiators, and the viscosity is 150 mPa˙s or less.

(分子量5,000以上之(甲基)丙烯酸基低聚物(成分A)) ((Meth)acrylic oligomer with molecular weight above 5,000 (component A))

分子量5,000以上之(甲基)丙烯酸基低聚物(成分A)為,分子中具有1個以上之(甲基)丙烯醯基。(甲基)丙烯酸基低聚物之分子量較佳為5,000~100,000,更佳為10,000~70,000,特佳為20,000~50,000。本說明書中分子量係藉由凝膠滲透色譜(GPC),使用標準聚苯乙烯之檢量線換算所得之重量平均分子量。 The (meth)acrylic oligomer with a molecular weight of 5,000 or more (component A) has one or more (meth)acrylic groups in the molecule. The molecular weight of the (meth)acrylic oligomer is preferably 5,000 to 100,000, more preferably 10,000 to 70,000, particularly preferably 20,000 to 50,000. The molecular weight in this specification is the weight average molecular weight calculated by gel permeation chromatography (GPC) using the calibration curve of standard polystyrene.

(甲基)丙烯酸酯低聚物無特別限定,例如由骨 架具有聚胺基甲酸酯之(甲基)丙烯酸酯低聚物、骨架具有聚異戊二烯之(甲基)丙烯酸酯低聚物及骨架具有聚丁二烯之(甲基)丙烯酸酯低聚物所成群中所選出之一種以上。該等(甲基)丙烯酸酯低聚物可使用一種或二種以上。 The (meth)acrylate oligomer is not particularly limited, and for example, it is made of bone (Meth)acrylate oligomers with polyurethane frame, (meth)acrylate oligomers with polyisoprene frame, and (meth)acrylates with polybutadiene frame More than one selected from the group of oligomers. One or two or more of these (meth)acrylate oligomers can be used.

<骨架具有聚胺基甲酸酯之(甲基)丙烯酸酯低聚物> <(Meth)acrylate oligomer with polyurethane skeleton>

骨架具有聚胺基甲酸酯之(甲基)丙烯酸酯低聚物如,脂肪族系(但後述之橡膠系及氫化橡膠系除外)、由聚丁二烯及聚異戊二烯所成群中所選出之一種以上等之橡膠系、由氫化聚丁二烯及氫化聚異戊二烯所成群中所選出之一種以上等之氫化橡膠系、聚醚系、聚碳酸酯系、聚酯系或該等組合之胺基甲酸酯(甲基)丙烯酸酯低聚物。骨架具有聚胺基甲酸酯之(成分A)市售品如,UV-3700B(日本合成製:分子量38,000)、(UA10000B(KSM公司製:分子量25,000)、UN7700(根上工業股份公司製:分子量20,000)、UN-9200A(根上工業股份公司製:分子量15,000)、UN-9000H(根上工業股份公司製:分子量5,000)、EB230(戴歇爾股份公司製:分子量5,000)等。 (Meth)acrylate oligomers with polyurethane in the skeleton, such as aliphatic series (except for rubber series and hydrogenated rubber series described later), polybutadiene and polyisoprene groups One or more rubber series selected from the group, one or more hydrogenated rubber series selected from the group of hydrogenated polybutadiene and hydrogenated polyisoprene, polyether series, polycarbonate series, polyester It is a urethane (meth)acrylate oligomer or a combination of these. Commercially available products with polyurethane skeleton (component A) such as UV-3700B (manufactured by Nippon Gosei: molecular weight 38,000), (UA10000B (manufactured by KSM: molecular weight 25,000), UN7700 (manufactured by Negami Kogyo Co., Ltd.: molecular weight) 20,000), UN-9200A (Negami Industry Co., Ltd.: molecular weight 15,000), UN-9000H (Negami Industry Co., Ltd.: molecular weight 5,000), EB230 (Decher Co., Ltd.: molecular weight 5,000), etc.

胺基甲酸酯(甲基)丙烯酸酯例如可由特開2008-260898號公報所記載之方法般,使有機二異氰酸酯與含有羥基之(甲基)丙烯酸酯化合物反應所得。 The urethane (meth)acrylate can be obtained by reacting an organic diisocyanate with a hydroxyl group-containing (meth)acrylate compound like the method described in JP 2008-260898 A, for example.

<<有機二異氰酸酯>> <<Organic Diisocyanate>>

有機二異氰酸酯可為具有2個以上之異氰酸根合基之 化合物,無特別限定,可為芳香族、脂肪族或脂環式聚異氰酸酯,例如伸甲苯基二異氰酸酯、二苯基甲烷二異氰酸酯、氫化二苯基甲烷二異氰酸酯、聚苯基甲烷聚異氰酸酯、改質二苯基甲烷二異氰酸酯、氫化伸二甲苯基二異氰酸酯、伸二甲苯基二異氰酸酯、六伸甲基二異氰酸酯、三甲基六伸甲基二異氰酸酯、四甲基伸二甲基二異氰酸酯、異佛系酮二異氰酸酯、降冰片烯二異氰酸酯、1,3-雙(異氰酸根合甲基)環己烷、伸苯基二異氰酸酯、賴胺酸三異氰酸酯、萘二異氰酸酯等之聚異氰酸酯,或該等聚異氰酸酯與聚醇反應所得之末端含有異氰酸酯基之胺基甲酸酯預聚物等。 The organic diisocyanate can be one with more than 2 isocyanato groups The compound is not particularly limited, and can be aromatic, aliphatic or alicyclic polyisocyanate, such as tolyl diisocyanate, diphenylmethane diisocyanate, hydrogenated diphenylmethane diisocyanate, polyphenylmethane polyisocyanate, modified High quality diphenylmethane diisocyanate, hydrogenated xylylene diisocyanate, xylylene diisocyanate, hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, tetramethylmethylene diisocyanate, isophores Polyisocyanates such as ketone diisocyanate, norbornene diisocyanate, 1,3-bis(isocyanatomethyl)cyclohexane, phenylene diisocyanate, lysine triisocyanate, naphthalene diisocyanate, etc., or such Polyisocyanate and polyol are reacted with urethane prepolymers containing isocyanate groups at the end, etc.

<<含有羥基之(甲基)丙烯酸酯化合物>> <<(meth)acrylate compound containing hydroxyl group>>

含有羥基之(甲基)丙烯酸酯化合物可為分子中具有1個以上之羥基之(甲基)丙烯酸酯化合物,無特別限定。該類含有羥基之(甲基)丙烯酸酯化合物之具體例除了成分B中後述之物外,例如2-羥基乙基(甲基)丙烯醯磷酸酯等含有磷原子之,分子中具有1個以上之羥基之(甲基)丙烯酸酯化合物,及甘油二(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯等之分子中具有2個以上之羥基之(甲基)丙烯酸酯化合物。 The (meth)acrylate compound containing a hydroxyl group may be a (meth)acrylate compound having one or more hydroxyl groups in the molecule, and is not particularly limited. Specific examples of such hydroxyl-containing (meth)acrylate compounds include those described later in component B, such as 2-hydroxyethyl (meth)acrylic acid phosphate, etc., which contain phosphorus atoms and have one or more in the molecule The hydroxyl (meth)acrylate compound, and glycerol di(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, etc., which have 2 or more hydroxyl groups in the molecule (Meth)acrylate compound.

<骨架具有聚異戊二烯之(甲基)丙烯酸酯低聚物及骨架具有聚丁二烯之(甲基)丙烯酸酯低聚物> <(Meth)acrylate oligomer with polyisoprene in its skeleton and (meth)acrylate oligomer with polybutadiene in its skeleton>

骨架具有聚異戊二烯之(甲基)丙烯酸酯低聚物及骨架具有聚丁二烯之(甲基)丙烯酸酯低聚物可為氫添加物。骨架具有聚丁二烯之(甲基)丙烯酸酯低聚物及骨架具有聚異戊二烯之(甲基)丙烯酸酯低聚物可使用市售品。例如骨架具有聚異戊二烯之(甲基)丙烯酸酯低聚物市售品如,UC-1(庫拉雷公司製:分子量25,000)、UC-203(庫拉雷公司製:分子量35,000)等。本說明書中骨架具有聚異戊二烯之(甲基)丙烯酸酯低聚物及骨架具有聚丁二烯之(甲基)丙烯酸酯為,不具有胺基甲酸酯鍵結之物。 The (meth)acrylate oligomer with polyisoprene in its skeleton and the (meth)acrylate oligomer with polybutadiene in its skeleton may be hydrogen additives. Commercially available (meth)acrylate oligomers having polybutadiene in the skeleton and (meth)acrylate oligomers having polyisoprene in the skeleton can be used. For example, commercially available products of (meth)acrylate oligomers having polyisoprene in the skeleton, such as UC-1 (manufactured by Curaray Corporation: molecular weight 25,000), UC-203 (manufactured by Curaray Corporation: molecular weight 35,000) Wait. In this specification, the (meth)acrylate oligomer with polyisoprene in the skeleton and the (meth)acrylate with polybutadiene in the skeleton are those that do not have a urethane bond.

(甲基)丙烯酸酯低聚物較佳為,骨架具有聚胺基甲酸酯之(甲基)丙烯酸酯低聚物,更佳為由聚醚系胺基甲酸酯(甲基)丙烯酸酯低聚物、聚酯系胺基甲酸酯(甲基)丙烯酸酯低聚物、脂肪族系胺基甲酸酯(甲基)丙烯酸酯低聚物、橡膠系胺基甲酸酯(甲基)丙烯酸酯低聚物及氫化橡膠系胺基甲酸酯(甲基)丙烯酸酯低聚物所成群中所選出之一種以上。(甲基)丙烯酸酯低聚物可為一種或二種以上併用。 The (meth)acrylate oligomer is preferably a (meth)acrylate oligomer having polyurethane in the skeleton, more preferably a polyether-based urethane (meth)acrylate Oligomers, polyester-based urethane (meth)acrylate oligomers, aliphatic-based urethane (meth)acrylate oligomers, rubber-based urethane (meth)acrylate oligomers, rubber-based urethane (meth) ) One or more selected from the group of acrylate oligomers and hydrogenated rubber-based urethane (meth)acrylate oligomers. The (meth)acrylate oligomer may be used alone or in combination of two or more.

((甲基)丙烯酸基單體(成分B)) ((Meth)acrylic monomer (component B))

(甲基)丙烯酸基單體(成分B)可為分子中具有1個以上之(甲基)丙烯醯基之單體樹脂,無特別限定,較佳為由單官能(甲基)丙烯酸酯單體所成群中所選出之一種以上。成分B之黏度無特別限定,較佳為10mPa˙s以下,更佳為8mPa˙s以下。成分B具有該類黏度時,傾向有效率降 低組成物之黏度。 The (meth)acrylic monomer (component B) may be a monomer resin having one or more (meth)acrylic groups in the molecule, and is not particularly limited, but is preferably composed of monofunctional (meth)acrylate monomers. More than one selected from the group of bodies. The viscosity of component B is not particularly limited, but is preferably 10 mPa˙s or less, and more preferably 8 mPa˙s or less. When component B has this kind of viscosity, it tends to decrease the efficiency Low composition viscosity.

<單官能(甲基)丙烯酸酯單體> <Monofunctional (meth)acrylate monomer>

單官能(甲基)丙烯酸酯單體可為分子中具有1個(甲基)丙烯醯基之(甲基)丙烯酸酯化合物,無特別限定,例如可由脂環式(甲基)丙烯酸酯、含有羥基之(甲基)丙烯酸酯、烷基(甲基)丙烯酸酯及芳香族(甲基)丙烯酸酯所成群中所選出之一種以上。 The monofunctional (meth)acrylate monomer may be a (meth)acrylate compound having one (meth)acrylic acid group in the molecule, and is not particularly limited. For example, it may be alicyclic (meth)acrylate or containing One or more selected from the group of hydroxyl (meth)acrylate, alkyl (meth)acrylate, and aromatic (meth)acrylate.

烷基(甲基)丙烯酸酯無特別限定,例如n-丁基(甲基)丙烯酸酯、i-丁基(甲基)丙烯酸酯、t-丁基(甲基)丙烯酸酯、2-乙基己基(甲基)丙烯酸酯、異辛基(甲基)丙烯酸酯、異癸基(甲基)丙烯酸酯、月桂基(甲基)丙烯酸酯、硬脂醯(甲基)丙烯酸酯、異硬脂醯(甲基)丙烯酸酯等。烷基(甲基)丙烯酸酯較佳為C6~C30之烷基(甲基)丙烯酸基單體。烷基(甲基)丙烯酸酯就可將柔軟性賦予硬化物,更有效率降低組成物之黏度,減少組成物之臭氣之觀點,較佳為C6~C30之烷基(甲基)丙烯酸酯,C6~C30之烷基可為直鏈或支鏈狀,就得到更優良之接著力之觀點又以支鏈狀更佳。C6~C30之烷基之碳數較佳為6~20,更佳為8~16。 The alkyl (meth)acrylate is not particularly limited, for example, n-butyl (meth)acrylate, i-butyl (meth)acrylate, t-butyl (meth)acrylate, 2-ethyl Hexyl (meth)acrylate, isooctyl (meth)acrylate, isodecyl (meth)acrylate, lauryl (meth)acrylate, stearyl (meth)acrylate, isostearyl (Meth)acrylate and the like. The alkyl (meth)acrylate is preferably a C 6 to C 30 alkyl (meth)acrylic monomer. Alkyl (meth)acrylate can impart softness to the hardened product, and reduce the viscosity of the composition more efficiently, and reduce the odor of the composition. The alkyl (methyl) group of C 6 ~ C 30 is preferred. Acrylate, the C 6 ~ C 30 alkyl group can be linear or branched, and the viewpoint that better adhesion can be obtained is branched. The carbon number of the C 6 -C 30 alkyl group is preferably 6-20, more preferably 8-16.

含有羥基之(甲基)丙烯酸酯如,2-羥基乙基(甲基)丙烯酸酯、2-羥基丙基(甲基)丙烯酸酯、2-羥基丁基(甲基)丙烯酸酯、4-羥基丁基(甲基)丙烯酸酯等之羥基取代烷基(甲基)丙烯酸酯,及2-(甲基)丙烯醯氧基乙基-2- 羥基丙基酞酸酯、2-羥基-3-(甲基)丙烯醯氧基丙基(甲基)丙烯酸酯、己內酯改質2-羥基乙基(甲基)丙烯酸酯、環己烷二甲醇單(甲基)丙烯酸酯等之羥基取代烷基(甲基)丙烯酸酯以外之含有羥基之(甲基)丙烯酸酯等。 Hydroxy-containing (meth)acrylates such as 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 4-hydroxyl Hydroxy-substituted alkyl (meth)acrylates such as butyl (meth)acrylate, and 2-(meth)acryloyloxyethyl-2- Hydroxypropyl phthalate, 2-hydroxy-3-(meth)acryloxypropyl (meth)acrylate, caprolactone modified 2-hydroxyethyl (meth)acrylate, cyclohexane Hydroxyl-containing (meth)acrylates other than alkyl (meth)acrylates other than hydroxy-substituted alkyl (meth)acrylates such as dimethanol mono(meth)acrylates, etc.

脂環式(甲基)丙烯酸酯如,二環戊烯氧基乙基(甲基)丙烯酸酯、降冰片烯(甲基)丙烯酸酯、二環戊烷基(甲基)丙烯酸酯、異冰片基(甲基)丙烯酸酯等。 Alicyclic (meth)acrylates such as dicyclopentenyloxyethyl (meth)acrylate, norbornene (meth)acrylate, dicyclopentyl (meth)acrylate, isobornyl Base (meth)acrylate and the like.

成分B就相對於無機基材與有機基材雙方具有更優良接著力之觀點,更佳為含有脂環式(甲基)丙烯酸酯、含有羥基之(甲基)丙烯酸酯及C6~C30之烷基(甲基)丙烯酸酯。 Component B has better adhesion to both inorganic substrates and organic substrates. It is more preferable to contain alicyclic (meth)acrylate, hydroxyl-containing (meth)acrylate, and C 6 ~C 30 The alkyl (meth) acrylate.

(由光自由基聚合引發劑及熱自由基聚合引發劑所成群中所選出之至少一種之自由基聚合引發劑(成分C)) (At least one radical polymerization initiator selected from the group of photo radical polymerization initiators and thermal radical polymerization initiators (component C))

為了促進硬化,組成物可含有由光自由基聚合引發劑及熱自由基聚合引發劑所成群中所選出之至少一種之自由基聚合引發劑。自由基聚合引發劑可為一種或二種以上併用。組成物含有光自由基聚合引發劑時,組成物為以能量線而硬化之光硬化性樹脂組成物。組成物含有熱自由基聚合引發劑時,組成物為以熱而硬化之熱硬化性樹脂組成物。組成物含有光自由基聚合引發劑及熱自由基聚合引發劑時,組成物為以能量線及/或熱而硬化之光及/或熱硬化性樹脂組成物。 In order to promote hardening, the composition may contain at least one radical polymerization initiator selected from the group of photo radical polymerization initiators and thermal radical polymerization initiators. The radical polymerization initiator may be used alone or in combination of two or more kinds. When the composition contains a photoradical polymerization initiator, the composition is a photocurable resin composition that is cured by energy rays. When the composition contains a thermal radical polymerization initiator, the composition is a thermosetting resin composition that is cured by heat. When the composition contains a photo radical polymerization initiator and a thermal radical polymerization initiator, the composition is a light and/or thermosetting resin composition that is cured by energy rays and/or heat.

<光自由基聚合引發劑> <Photo-radical polymerization initiator>

光自由基聚合引發劑可為藉由光的照射而發生自由基之化合物,無特別限定。光自由基聚合引發劑如,二苯甲酮、二乙醯酯、苄酯、苯偶因、ω-溴乙醯苯、氯丙酮、苯乙酮、2,2-二乙氧基乙醯苯、2,2-二甲氧基-2-苯基丙酮、p-二甲基胺基乙醯苯;p-二甲基胺基苯丙酮、2-氯二苯甲酮、p,p’-雙二乙基胺基二苯甲酮、米蚩酮、苯偶因甲基醚、苯偶因異丁基醚、苯偶因-n-丁基醚、苄基二甲基縮酮、1-羥基環己基苯基酮、2-羥基-2-甲基-1-酮、1-(4-異丙基苯基)-2-羥基-2-甲基丙烷-1-酮、甲基苯醯甲酸酯、2,2-二乙氧基乙醯苯及4-N,N’-二甲基乙醯苯類等之羰基系光聚合引發劑;二苯基二硫化物及二苄基二硫化物等之硫化物系光聚合引發劑;苯醌及蒽醌等之醌系光聚合引發劑;偶氮雙異丁腈及2,2’-偶氮雙丙烷等之偶氮系光聚合引發劑等之紫外光引發劑,以及2-苄基-2-二甲基胺基-1-(4-嗎啉基苯基)-丁烷-1-酮、2-二甲基胺基-2-(4-甲基-苄基)-1-(4-嗎啉基苯基)-丁烷-1-酮、雙(2,4,6-三甲基苯醯基)-苯基膦氧化物、2,4,6-三甲基苯醯基-二苯基膦氧化物等之可視光引發劑。 The photoradical polymerization initiator may be a compound that generates radicals by light irradiation, and is not particularly limited. Optical radical polymerization initiators such as benzophenone, diacetyl ester, benzyl ester, benzidine, ω-bromoacetone benzene, chloroacetone, acetophenone, 2,2-diethoxy acetone benzene , 2,2-Dimethoxy-2-phenylacetone, p-dimethylamino acetonitrile; p-dimethylaminopropiophenone, 2-chlorobenzophenone, p,p'- Bisdiethylamino benzophenone, Michler's ketone, benzyl methyl ether, benzyl isobutyl ether, benzyl-n-butyl ether, benzyl dimethyl ketal, 1- Hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-ketone, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropane-1-one, methyl phenyl ketone Carbonyl-based photopolymerization initiators such as formate, 2,2-diethoxyacetbenzene and 4-N,N'-dimethylacetonitrile; diphenyl disulfide and dibenzyl disulfide Sulfide-based photopolymerization initiators such as sulfides; Quinone-based photopolymerization initiators such as benzoquinone and anthraquinone; Azo-based photopolymerization initiators such as azobisisobutyronitrile and 2,2'-azobispropane UV light initiators such as reagents, and 2-benzyl-2-dimethylamino-1-(4-morpholinylphenyl)-butane-1-one, 2-dimethylamino-2 -(4-Methyl-benzyl)-1-(4-morpholinylphenyl)-butan-1-one, bis(2,4,6-trimethylphenanyl)-phenylphosphine oxidation It can be a visible light initiator such as 2,4,6-trimethylphenanyl-diphenylphosphine oxide.

就提高硬化速度,減少光硬化後著色之觀點,光自由基聚合引發劑較佳為羰基系光聚合引發劑,特佳為1-羥基-環己基-苯基-酮。 From the viewpoint of increasing the curing speed and reducing coloration after photocuring, the photoradical polymerization initiator is preferably a carbonyl-based photopolymerization initiator, and particularly preferably 1-hydroxy-cyclohexyl-phenyl-ketone.

光自由基聚合引發劑可為一種或二種以上併用。 The photoradical polymerization initiator may be used alone or in combination of two or more kinds.

<熱自由基聚合引發劑> <Thermal radical polymerization initiator>

熱自由基聚合引發劑可為藉由熱而發生自由基之化合物,無特別限定,例如有機過氧化物及偶氮化合物等,較佳為有機過氧化物。 The thermal radical polymerization initiator may be a compound that generates free radicals by heat, and is not particularly limited. For example, organic peroxides and azo compounds, etc., are preferably organic peroxides.

有機過氧化物可為含有過氧基(-O-O-)之有機化合物,例如二醯基過氧化物類、氫過氧化物類、二烷基過氧化物類、過氧縮酮類、過氧酯類、過氧碳酸酯類等。 The organic peroxide may be an organic compound containing a peroxy group (-OO-), such as diacyl peroxides, hydroperoxides, dialkyl peroxides, peroxyketals, peroxy Esters, peroxycarbonates, etc.

有機過氧化物之具體例如,二月桂醯過氧化物、二苯醯過氧化物、雙-3,5,5-三甲基己醯過氧化物般之二醯基過氧化物類;1,1,3,3-四甲基丁基氫過氧化物、枯烯氫過氧化物(例如化藥艾固周公司製之卡雅庫H)、t-丁基氫過氧化物般之氫過氧化物類;t-己基過氧2-乙基己酸酯、二戊基過氧化物、2,5-二甲基-2,5-二(t-丁基過氧)己烷、1,3-雙(t-丁基過氧異丙基)苯、t-丁基戊基過氧化物、二-t-丁基過氧化物、2,5-二甲基-2,5-二(t-丁基過氧)己炔-3般之二烷基過氧化物類;2,2-雙(4,4-二-t-丁基過氧環己基)丙烷、1,1-二-t-丁基過氧環己烷、2,2-二-t-丁基過氧丁烷般之過氧縮酮類;1,1,3,3-四甲基丁基過氧新癸酸酯、α-枯基過氧新癸酸酯、t-丁基過氧新癸酸酯、t-丁基過氧新丁酸酯、t-丁基過氧三甲基乙酸酯、1,1,3,3-四甲基丁基過氧2-乙基己酸酯、t-戊基過氧2-乙基己酸酯、t-丁基過氧2-乙基己酸酯、二-t-丁基過氧六氫對苯二甲酸酯、t-戊基過氧3,5,5-三甲基己酸酯、t-丁基過氧乙酸酯、t-丁基過氧苯酸酯、t-己基過氧苯酸酯、t-戊基過氧苯酸酯般之過氧酯 類;二-2-乙基己基過氧二碳酸酯、二異丙基過氧二碳酸酯、t-丁基過氧異丙基碳酸酯、t-丁基過氧2-乙基己基碳酸酯、1,6-雙(t-丁基過氧碳醯氧基)己烷般之過氧碳酸酯類等。 Specific examples of organic peroxides include dilaurel peroxide, diphenyl peroxide, bis-3,5,5-trimethylhexyl peroxide, and diamino peroxides; 1. 1,3,3-tetramethylbutyl hydroperoxide, cumene hydroperoxide (e.g. Kayaku H manufactured by Aiguzhou Chemicals Co., Ltd.), t-butyl hydroperoxide-like hydrogen peroxide Oxides; t-hexylperoxy 2-ethylhexanoate, dipentyl peroxide, 2,5-dimethyl-2,5-bis(t-butylperoxy)hexane, 1, 3-bis(t-butylperoxyisopropyl)benzene, t-butylpentyl peroxide, di-t-butyl peroxide, 2,5-dimethyl-2,5-bis( t-butylperoxy) dialkyl peroxides like hexyne-3; 2,2-bis(4,4-di-t-butylperoxycyclohexyl)propane, 1,1-di- Peroxyketals like t-butylperoxycyclohexane and 2,2-di-t-butylperoxybutane; 1,1,3,3-tetramethylbutylperoxyneodecanoic acid Esters, α-cumylperoxyneodecanoate, t-butylperoxyneodecanoate, t-butylperoxyneobutyrate, t-butylperoxytrimethyl acetate, 1, 1,3,3-Tetramethylbutylperoxy 2-ethylhexanoate, t-pentylperoxy 2-ethylhexanoate, t-butylperoxy 2-ethylhexanoate, two -t-butylperoxyhexahydroterephthalate, t-pentylperoxy 3,5,5-trimethylhexanoate, t-butylperoxyacetate, t-butylperoxy Peroxy esters like oxybenzoate, t-hexylperoxybenzoate, t-pentylperoxybenzoate Class; di-2-ethylhexylperoxydicarbonate, diisopropylperoxydicarbonate, t-butylperoxyisopropyl carbonate, t-butylperoxy2-ethylhexyl carbonate , 1,6-bis(t-butylperoxycarboxy) hexane-like peroxycarbonate, etc.

偶氮化合物如,偶氮雙異丁腈、2,2’-偶氮雙(2-甲基異丁腈)、2,2’-偶氮雙(2,4-二甲基戊腈)、二甲基-2,2’-偶氮雙(異丁酸酯)、2,2’-偶氮雙(4-甲氧基-2,4-二甲基戊腈)等。 Azo compounds such as azobisisobutyronitrile, 2,2'-azobis(2-methylisobutyronitrile), 2,2'-azobis(2,4-dimethylvaleronitrile), Dimethyl-2,2'-azobis(isobutyrate), 2,2'-azobis(4-methoxy-2,4-dimethylvaleronitrile) and the like.

熱自由基聚合引發劑可使用市售品。就安定性及有害性之觀點,熱自由基聚合引發劑較佳為有機過氧化物,特佳為過氧酯類。又,就組成物之安定性與硬化溫度之平衡性觀點,有機過氧化物較佳為,作為有機過氧化物失活之指標用的1小時半衰期之溫度為50~110℃。 Commercially available thermal radical polymerization initiators can be used. From the viewpoint of stability and harmfulness, the thermal radical polymerization initiator is preferably an organic peroxide, and particularly preferably a peroxy ester. Furthermore, from the viewpoint of the balance between the stability of the composition and the curing temperature, the organic peroxide preferably has a one-hour half-life temperature of 50 to 110°C as an indicator of the inactivation of the organic peroxide.

熱自由基聚合引發劑可為一種或二種以上併用。 The thermal radical polymerization initiator may be one type or two or more types used in combination.

(其他成分) (Other ingredients)

無損本發明效果之範圍內,組成物可含有其他成分。其他成分如,由可塑劑、偶合劑、聚合禁止劑、接著賦予劑、防氧化劑、消泡劑、顏料、填充劑、鏈轉移劑;光安定劑、表面張力調整劑、塗平劑;紫外線吸收劑及抑泡劑所成群中所選出之一種以上。該等可使用噴墨塗佈用組成物領域中業者已知之成分。 The composition may contain other components within a range that does not impair the effects of the present invention. Other ingredients such as plasticizers, coupling agents, polymerization inhibitors, adhering agents, antioxidants, defoamers, pigments, fillers, chain transfer agents; light stabilizers, surface tension modifiers, leveling agents; UV absorbers One or more selected from the group of anti-foaming agents and anti-foaming agents. For these, components known to those in the field of inkjet coating compositions can be used.

(組成物之黏度) (Viscosity of composition)

組成物之黏度為150mPa˙s以下。因其為該類低黏度之組成物,故可以薄化膜厚狀塗佈於基材上。組成物之黏度較佳為100mPa˙s以下,特佳為80mPa˙s以下。組成物之黏度下限值可為能進行噴墨塗佈之值,無特別限定,可為黏度計測定之黏度以下。雖未限定組成物之黏度下限值,但組成物之黏度可為例如1mPa˙s以上。黏度為大氣壓、25℃下使用錐形板型黏度計測定之值。 The viscosity of the composition is below 150mPa˙s. Because it is such a low-viscosity composition, it can be coated on the substrate in a thinner film thickness. The viscosity of the composition is preferably 100 mPa˙s or less, particularly preferably 80 mPa˙s or less. The lower limit of the viscosity of the composition may be a value that can be ink-jet coated, and is not particularly limited, and may be less than the viscosity measured by a viscometer. Although the lower limit of the viscosity of the composition is not limited, the viscosity of the composition can be, for example, 1 mPa˙s or more. Viscosity is the value measured with a cone plate viscometer at 25°C under atmospheric pressure.

(較佳組成) (Preferred composition)

組成物中成分A之含量相對於成分A及成分B之合計100重量份較佳為30重量份以下,更佳為20重量份以下,特佳為10重量份以下。成分A之含量為前述範圍時,傾向可有效率降低組成物之黏度,且具有更優良之接著力。 The content of Component A in the composition is preferably 30 parts by weight or less with respect to 100 parts by weight of the total of Component A and Component B, more preferably 20 parts by weight or less, and particularly preferably 10 parts by weight or less. When the content of component A is in the aforementioned range, it tends to effectively reduce the viscosity of the composition and have better adhesion.

組成物中光自由基聚合引發劑之含量相對於成分A及成分B之合計100重量份較佳為0.1~20質量份,又以0.5~15質量份為佳,更佳為0.5~10質量份。光自由基聚合引發劑之含量為前述範圍時,藉由照射能量線可有效率使組成物硬化。 The content of the photo-radical polymerization initiator in the composition is preferably 0.1-20 parts by weight, preferably 0.5-15 parts by weight, more preferably 0.5-10 parts by weight relative to 100 parts by weight of the total of component A and component B . When the content of the photoradical polymerization initiator is in the aforementioned range, the composition can be cured efficiently by irradiating energy rays.

組成物中熱自由基聚合引發劑之含量相對於成分A及成分B之合計100重量份較佳為0.01~15質量份,又以0.1~10質量份為佳,更佳為0.5~5質量份。熱自由基聚合引發劑之含量為前述範圍時,藉由加熱可有效率使組成物硬化。 The content of the thermal radical polymerization initiator in the composition is preferably 0.01-15 parts by mass relative to 100 parts by weight of the total of component A and component B, preferably 0.1-10 parts by mass, more preferably 0.5-5 parts by mass . When the content of the thermal radical polymerization initiator is in the aforementioned range, the composition can be cured efficiently by heating.

組成物中其他成分之合計含量相對於成分A及成分B之合計100重量份較佳為0.01~15質量份,又以0.1~10質量份為佳,特佳為1~5質量份。 The total content of the other components in the composition is preferably 0.01 to 15 parts by mass relative to 100 parts by weight of the total of component A and component B, preferably 0.1 to 10 parts by mass, and particularly preferably 1 to 5 parts by mass.

組成物之硬化性成分較佳為,僅由成分A及成分B所形成。硬化性成分僅由成分A及成分B所形成時,組成物不會含有環氧樹脂等之成分A及成分B以外之其他硬化性成分。此時之硬化性成分係指,可藉由照射光及加熱進行聚合及交聯之成分。 The curable component of the composition is preferably composed only of component A and component B. When the curable component is formed of only component A and component B, the composition will not contain other curable components other than component A and component B such as epoxy resin. The curable component at this time refers to a component that can be polymerized and crosslinked by irradiation with light and heating.

(組成物之調製方法) (Preparation method of composition)

組成物之製造方法可為,藉由含有混合成分A、成分B、成分C及依情形添加之其他成分之步驟的製造方法所得。混合方法無特別限定,可使用各種金屬、塑料容器、攪拌翼、攪拌機等。 The manufacturing method of the composition may be obtained by a manufacturing method including a step of mixing Component A, Component B, Component C, and other components added as appropriate. The mixing method is not particularly limited, and various metals, plastic containers, stirring blades, mixers, etc. can be used.

(組成物之硬化方法) (How to harden the composition)

組成物含有光自由基聚合引發劑時,可以能量線使組成物硬化。組成物含有熱自由基聚合引發劑時,可加熱使組成物硬化。組成物含有光自由基聚合引發劑及熱自由基聚合引發劑時,可以能量線及/或加熱使組成物硬化。 When the composition contains a photoradical polymerization initiator, the composition can be cured by energy rays. When the composition contains a thermal radical polymerization initiator, the composition can be hardened by heating. When the composition contains an optical radical polymerization initiator and a thermal radical polymerization initiator, the composition can be hardened by energy rays and/or heating.

<藉由能量線而硬化> <Hardened by energy rays>

能量線無特別限定,可使用可視光線、紫外線、X線、電子線等之活性能量線。能量線較佳為紫外線。紫外 線之光源可使用能發射紫外線(UV)之光源。紫外線之光源如,金屬鹵化燈、高壓水銀燈、氙燈、水銀氙燈、鹵素燈、脈衝氙燈、LED等。 The energy rays are not particularly limited, and active energy rays such as visible light, ultraviolet rays, X-rays, and electron rays can be used. The energy rays are preferably ultraviolet rays. UV The linear light source can be a light source capable of emitting ultraviolet (UV). Ultraviolet light sources such as metal halide lamps, high-pressure mercury lamps, xenon lamps, mercury xenon lamps, halogen lamps, pulsed xenon lamps, LEDs, etc.

照射能量線時之照射量較佳為,使能量線之積算光量為500~10,000mJ/cm2。積算光量較佳為1,000~8,000mJ/cm2,更佳為1,000~6,000mJ/cm2The irradiation amount when irradiating the energy ray is preferably such that the cumulative light amount of the energy ray is 500 to 10,000 mJ/cm 2 . The accumulated light amount is preferably 1,000 to 8,000 mJ/cm 2 , and more preferably 1,000 to 6,000 mJ/cm 2 .

<藉由加熱而硬化> <harden by heating>

加熱溫度及加熱時間可為能使組成物熱硬化,而使基材相互間接合之溫度及時間,無特別限定。加熱溫度較佳為70~120℃,更佳為80~110℃。加熱時間較佳為10分鐘~2小時,更佳為20分鐘~100分鐘。 The heating temperature and heating time can be the temperature and time that can heat the composition to bond the substrates to each other, and are not particularly limited. The heating temperature is preferably 70 to 120°C, more preferably 80 to 110°C. The heating time is preferably 10 minutes to 2 hours, more preferably 20 minutes to 100 minutes.

(組成物之用途) (Purpose of composition)

組成物可作為於基材上形成硬化物用之組成物,及使基材相互間貼合用之接著劑,較佳為作為接著劑用。又,因組成物為低黏度,可以薄化膜厚狀塗佈於基材上,故可作為旋轉塗佈機、模具塗佈機、定量分配器、噴墨塗佈(噴墨印刷)、網版印刷及照相凹版印刷所成群中所選出之一種以上之方法用之組成物,較佳為作為噴墨塗佈用組成物。又,組成物更佳為,作為藉由噴墨塗佈使基材相互間貼合用之接著劑。下面將說明使用組成物使基材相互間貼合而得層合體之製造方法。 The composition can be used as a composition for forming a hardened product on a substrate and an adhesive for bonding the substrates to each other, and is preferably used as an adhesive. In addition, since the composition has a low viscosity, it can be coated on a substrate in a thin film thickness, so it can be used as a spin coater, die coater, metering dispenser, inkjet coating (inkjet printing), web The composition for more than one method selected from the group of plate printing and gravure printing is preferably used as a composition for inkjet coating. Furthermore, the composition is more preferably used as an adhesive for bonding substrates to each other by inkjet coating. Hereinafter, a method of manufacturing a laminate obtained by bonding the base materials to each other using the composition will be described.

<層合體之製造方法> <Manufacturing method of laminated body>

層合體之製造方法為含有下述步驟(A)、(B)及(C)。 The manufacturing method of the laminate includes the following steps (A), (B), and (C).

(A)使用硬化性樹脂組成物於基材1上形成硬化性樹脂組成物層之步驟,(B)將基材2貼合於硬化樹脂層上,而得貼合體之步驟,及(C)將貼合體加熱及/或照射能量線,得層合體之步驟。 (A) A step of forming a curable resin composition layer on the base material 1 using a curable resin composition, (B) a step of bonding the base material 2 to the cured resin layer to obtain a bonded body, and (C) The step of heating and/or irradiating the laminated body with energy rays to obtain a laminated body.

<層合體> <Laminated body>

層合體為,介有硬化性樹脂組成物之硬化物接合基材1及基材2。基材1及基材2如,由無機基材、有機基材或無機與有機之混合物所形成之基材。無機基材如,由玻璃、金屬及陶瓷所成群中所選出之一種以上。有機基材如塑料。基材1及基材2可為相同基材或相異基材。層合體除了基材1及基材2外,可另含有其他基材,該基材之接著方法無特別限定。 In the laminate, the base material 1 and the base material 2 are joined to each other with a cured product of a curable resin composition interposed therebetween. The substrate 1 and the substrate 2 are, for example, substrates formed of an inorganic substrate, an organic substrate, or a mixture of inorganic and organic. Inorganic substrates, for example, one or more selected from the group of glass, metal and ceramics. Organic substrates such as plastics. The substrate 1 and the substrate 2 may be the same substrate or different substrates. In addition to the substrate 1 and the substrate 2, the laminate may further contain other substrates, and the bonding method of the substrates is not particularly limited.

基材1及基材2可為透光性之構件或不透光之構件。透光性構件可為,具有因應層合體目的之透光性,例如層合體為影像顯示裝置時可為,具有能視別顯示體所形成之影像之程度的可視光透光性。透光性構件如,玻璃、(甲基)丙烯酸樹脂、聚對苯二甲酸乙二醇酯、聚萘二酸乙二醇酯、聚碳酸酯、聚醯亞胺、聚酯、環鏈烯聚合物等之板狀材料或薄片材料。該等可於單面或雙面實施硬 編碼處理、防反射處理、防眩處理、防污處理、防霧處理、偏光處理、波長切斷處理等。又,可於透光性構件形成遮光層。該類透光性構件如,圖像片及裝飾板。 The substrate 1 and the substrate 2 may be light-transmitting members or non-light-transmitting members. The light-transmitting member may have light-transmitting properties corresponding to the purpose of the laminated body. For example, when the laminated body is an image display device, it may have visible light-transmitting properties to the extent that the image formed by the display body can be distinguished. Translucent members such as glass, (meth)acrylic resin, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyester, cyclic olefin polymerization Plate or sheet materials such as objects. These can be implemented hard on one or both sides Coding processing, anti-reflection processing, anti-glare processing, anti-fouling processing, anti-fog processing, polarization processing, wavelength cutting processing, etc. In addition, a light-shielding layer can be formed on the light-transmitting member. Such light-transmitting components include image sheets and decorative panels.

不透光之構件可為不透光之有機材料、不透光之無機材料或該等之組合物,無特別限定。不透光之構件如,氧化鋁等之陶瓷之板狀材料或薄片材料、實施表面氧化等之絕緣處理後之不銹鋼等之金屬薄片、熱硬化性樹脂、熱塑性樹脂之板狀材料或薄片材料。該類不透光之構件之具體例如,液晶顯示面板、有機EL顯示面板、保護面板、觸控面板、有機EL元件、濾光器等已形成之構件。 The opaque member can be an opaque organic material, an opaque inorganic material, or a combination of these, and is not particularly limited. Light-impermeable components such as ceramic plate or sheet materials such as alumina, stainless steel and other metal sheets after insulation treatment such as surface oxidation, plate materials or sheet materials of thermosetting resins, and thermoplastic resins. Specific examples of such opaque components include liquid crystal display panels, organic EL display panels, protective panels, touch panels, organic EL elements, filters, and other formed components.

例如藉由以基材1或基材2之一方為顯示體,另一方為透光性構件或不透光性構件,可製造各種影像顯示裝置之層合體。具體態樣如下所述。 For example, by using one of the substrate 1 or the substrate 2 as a display body and the other as a translucent member or an opaque member, laminates of various image display devices can be manufactured. The specific aspect is as follows.

(1)藉由使基材1或基材2之一方為液晶顯示面板,另一方為透光性構件,可製造液晶顯示裝置。 (1) A liquid crystal display device can be manufactured by making one of the substrate 1 or the substrate 2 a liquid crystal display panel and the other a light-transmitting member.

(2)藉由使基材1或基材2之一方以有機EL顯示面板,另一方為透光性構件,可製造所謂的頂部放射型有機EL顯示裝置。 (2) A so-called top emission type organic EL display device can be manufactured by making one of the base material 1 or the base material 2 an organic EL display panel, and the other as a light-transmitting member.

(3)藉由使基材1或基材2之一方為有機EL顯示面板,另一方為不透光之構件,可製造所謂的底部放射型有機EL顯示裝置。 (3) By making one of the substrate 1 or the substrate 2 an organic EL display panel, and the other an opaque member, a so-called bottom emission type organic EL display device can be manufactured.

(4)藉由使基材1或基材2之一方為保護面板,另一方為影像顯示裝置或各種基板等,可製造附保護面板之影 像顯示裝置或附保護面板之基板。又,可使基材1或基材2中一方為保護面板,另一方為透光性構件。 (4) By making one of the base material 1 or base material 2 a protective panel and the other is an image display device or various substrates, it is possible to manufacture a shadow with a protective panel Like a display device or a substrate with a protective panel. In addition, one of the base material 1 or the base material 2 may be a protective panel, and the other may be a translucent member.

(5)藉由使基材1或基材2之一方為已形成透明電極之透光性基板,另一方為透光性構件,可製造觸控面板。又,可使基材1或基材2之一方為觸控面板,另一方為透光性構件。 (5) A touch panel can be manufactured by making one of the base material 1 or the base material 2 a light-transmitting substrate on which a transparent electrode has been formed, and the other being a light-transmitting member. In addition, one of the base material 1 or the base material 2 may be a touch panel, and the other may be a translucent member.

因此層合體之製造方法可為,使基材1或基材2之一方為液晶顯示面板、有機EL顯示面板、保護面板或觸控面板,另一方為透光性構件或不透光之構件。 Therefore, the manufacturing method of the laminate can be that one of the substrate 1 or the substrate 2 is a liquid crystal display panel, an organic EL display panel, a protective panel, or a touch panel, and the other is a translucent member or a non-transmitting member.

層合體之製造方法係組合基材1與基材2時,較佳為使一方為無機材料,另一方為有機材料,更佳為玻璃、聚醯亞胺或該等組合之基材上層合濾光器所得之基材,與玻璃、聚醯亞胺或該等組合之基材上依序層合EL等之元件及保護膜所得之基材的組合物。此時之光及熱硬化性樹脂組成物較佳為,適用於層合濾光器之基材上之物。 When the manufacturing method of the laminate is to combine the base material 1 and the base material 2, preferably one is an inorganic material and the other is an organic material, and more preferably glass, polyimide or a combination of these are laminated on the base material. The substrate obtained by the optical device, the composition of the substrate obtained by sequentially laminating elements such as EL and the protective film on the substrate of glass, polyimide or these combinations. The light and thermosetting resin composition at this time is preferably one suitable for the substrate of the laminated optical filter.

<步驟(A)> <Step (A)>

步驟(A)為,基材1上使用光及熱硬化性樹脂組成物以形成硬化性樹脂組成物層之步驟。 Step (A) is a step of using a light and thermosetting resin composition on the substrate 1 to form a curable resin composition layer.

<<使用方法>> <<How to use>>

將組成物使用於基材1之方法無特別限定,例如由旋轉塗佈機、模具塗佈機、定量分配器、噴墨印刷、網版印 刷及照相凹版印刷所成群中所選出之一種以上之方法,但較佳為噴墨印刷。使用組成物所形成之硬化性樹脂組成物層之厚度無特別限定,例如可為10~500μm,較佳為30~350μm。 The method of applying the composition to the substrate 1 is not particularly limited, and for example, it is a spin coater, a die coater, a metering dispenser, inkjet printing, and screen printing. Brush and gravure printing are one or more methods selected from the group, but inkjet printing is preferred. The thickness of the curable resin composition layer formed using the composition is not particularly limited. For example, it may be 10 to 500 μm, preferably 30 to 350 μm.

<步驟(B)> <Step (B)>

步驟(B)為,將基材2貼合於硬化性樹脂組成物層上,得貼合體之步驟。可為於形成硬化性樹脂組成物層之基板1上方,以接連硬化性樹脂組成物層之方式載置基板2,再貼合基材1與基材2。 Step (B) is a step of bonding the base material 2 to the curable resin composition layer to obtain a bonded body. It may be that the substrate 2 is placed on the substrate 1 on which the curable resin composition layer is formed in such a manner that the curable resin composition layer is successively placed, and then the base material 1 and the base material 2 are bonded together.

層合體之製造方法可為,步驟(B)另含有使由基材1、基材2及其間之樹脂層所形成之貼合體進行加壓處理之步驟。藉此可提升貼合體之密合力。加壓處理可使用橡膠滾軸、平板加壓裝置等進行。 The manufacturing method of the laminated body may be that the step (B) further includes a step of subjecting the laminated body formed by the base material 1, the base material 2 and the resin layer between them to a pressure treatment. Thereby, the adhesion force of the fitting body can be improved. The pressure treatment can be performed using a squeegee, a flat pressure device, or the like.

<步驟(C)> <Step (C)>

步驟(C)為,將貼合體加熱及/或照射能量線,得層合體之步驟。藉由步驟(C)可使基材1與基材2之間的硬化性樹脂組成物層硬化,而使基材相互間接合。 Step (C) is a step of heating and/or irradiating the bonded body with energy rays to obtain a laminated body. In the step (C), the curable resin composition layer between the base material 1 and the base material 2 is cured, and the base materials are joined to each other.

步驟(C)之諸條件可與前述藉由能量線而硬化及藉由加熱而硬化相同。又,基材1為可透過能量線之基材時,可由基材1側將能量線照射於硬化性樹脂組成物層,而形成硬化樹脂層,或由硬化性樹脂組成物層側照射能量線,而形成硬化樹脂層。基材1為無法使能量線透過 之基材時,可由硬化性樹脂組成物層側將能量線照射於硬化性樹脂組成物層,而形成硬化樹脂層。又,基材1可為不透光(可視光無法透過)但可使能量線(例如紫外線)透過,或透光(可視光可透過)但無法使能量線(例如紫外線)透過之物。 The conditions of step (C) can be the same as the aforementioned hardening by energy rays and hardening by heating. In addition, when the substrate 1 is a substrate permeable to energy rays, the curable resin composition layer can be irradiated with energy rays from the side of the substrate 1 to form a hardened resin layer, or energy rays can be irradiated from the side of the curable resin composition layer. , And form a hardened resin layer. Substrate 1 is unable to transmit energy rays In the case of the base material, the curable resin composition layer may be irradiated with energy rays from the curable resin composition layer side to form the curable resin layer. In addition, the substrate 1 may be opaque (visible light cannot pass through) but can transmit energy rays (for example, ultraviolet rays), or transparent (visible light can pass through) but cannot transmit energy rays (for example, ultraviolet rays).

層合體之製造方法可使用於基材1及基材2中至少一方為透光性構件時,接合基材1及基材2用。層合體之用途如液晶等之影像顯示裝置。又層合體可使用於基材1及基材2已同時形成不透光構件或不透光之元件或濾器等時,接合基材1及基材2用。層合體之用途如有機EL等之影像顯示裝置。 The manufacturing method of the laminated body can be used for joining the base material 1 and the base material 2 when at least one of the base material 1 and the base material 2 is a translucent member. The use of the laminate is as an image display device such as liquid crystal. In addition, the laminate can be used for joining the base material 1 and the base material 2 when the base material 1 and the base material 2 are formed simultaneously with opaque members, opaque elements, filters, and the like. The use of the laminate is as an image display device such as organic EL.

實施例 Example

下面將舉實施例更具體說明本發明,但本發明非限定於該等實施例。表中無特別註明下,係指質量份、質量%。 The following examples will illustrate the present invention in more detail, but the present invention is not limited to these examples. Unless otherwise specified in the table, it means parts by mass and% by mass.

[調製硬化性樹脂組成物] [Preparation of curable resin composition]

依各表所記載之添加比,以容器(材質SUS)秤取成分A、成分B及成分C中熱自由基聚合引發劑以外之各成分後,60~80℃、大氣壓下使用Three One馬達(新東科學公司製)以200回轉/分攪拌30分鐘~1小時。其次確認組成物之溫度返回25℃後,秤取熱自由基聚合引發劑,大氣壓、25℃下使用Three One馬達均勻混合,調製實施例 1~12及比較例1~4之光或熱硬化性樹脂組成物。 After weighing the components other than the thermal radical polymerization initiator in component A, component B, and component C in a container (material SUS) according to the addition ratio described in each table, use the Three One motor at 60~80°C and atmospheric pressure ( (Manufactured by Shinto Science Co.)) Stir at 200 revolutions/min for 30 minutes to 1 hour. Secondly, after confirming that the temperature of the composition has returned to 25°C, the thermal radical polymerization initiator is weighed out and mixed uniformly using a Three One motor at atmospheric pressure and 25°C to prepare an example Light or thermosetting resin composition of 1 to 12 and Comparative Examples 1 to 4.

[測定物性] [Measurement of physical properties]

使用硬化性樹脂組成物以下述方法測定特性。 Using the curable resin composition, the characteristics were measured by the following methods.

(黏度) (Viscosity)

使用黏度計(RE105U:東機產業(股)製),大氣壓、25℃下選定適當錐形板與回轉速度,測定液狀之光硬化性樹脂組成物之黏度。 Using a viscometer (RE105U: manufactured by Toki Sangyo Co., Ltd.), an appropriate cone plate and rotation speed were selected at atmospheric pressure and 25°C to measure the viscosity of the liquid photocurable resin composition.

(撕剝試驗) (Tear test)

無機基材係使用玻璃載片,有機材料係使用PI(聚醯亞胺)薄膜。將表1~表3所記載之硬化性樹脂組成物0.2g滴在玻璃載片(松浪玻璃公司製S1127)上,貼合切成3×10cm之PI薄膜(東雷公司製卡普東,厚50μm)後,以橡膠滾軸(SN-版畫,橡膠滾軸1號)施加約1kg的同時往返薄膜上方5次使液體延展於基材上。其後使用金屬鹵化燈(艾固拉製ECS-301)將3000mJ/cm2之光線照射於添加光自由基聚合引發劑之實施例1~3、7、9及11,與比較例1及2之硬化性樹脂組成物使其硬化。使用烤箱(ESPEC公司製LC113)以100℃加熱30分鐘經添加熱自由基聚合引發劑之實施例4~6、8、10及12,與比較例3及4之硬化性樹脂組成物使其硬化。使用該等試驗片,利用拉伸試驗機(密那貝製TG-2kV)以拉伸速度60mm/分進行180°撕剝 試驗。算出約剝離40mm之平均值。 A glass slide is used for the inorganic substrate, and a PI (polyimide) film is used for the organic material. Drop 0.2 g of the curable resin composition described in Table 1 to Table 3 on a glass slide (S1127 manufactured by Songlang Glass Co., Ltd.), and bond it to a PI film cut into 3×10 cm (Caputon manufactured by Donglei Co., Ltd., thick After 50 μm), apply about 1 kg with a squeegee (SN-print, squeegee No. 1) while going back and forth above the film 5 times to spread the liquid on the substrate. After that, a metal halide lamp (ECS-301 manufactured by Aigula) was used to irradiate 3000mJ/cm 2 of light on Examples 1 to 3, 7, 9 and 11 with the addition of a photoradical polymerization initiator, and Comparative Examples 1 and 2 The curable resin composition makes it harden. Use an oven (LC113 manufactured by ESPEC) to heat at 100°C for 30 minutes to harden the curable resin composition of Examples 4-6, 8, 10, and 12 with the addition of a thermal radical polymerization initiator, and Comparative Examples 3 and 4 . Using these test pieces, a 180° peel test was performed with a tensile tester (TG-2kV manufactured by Minabe) at a tensile speed of 60 mm/min. Calculate the average value of about 40mm peeled off.

結果如表1~表3所示。 The results are shown in Table 1 to Table 3.

Figure 106108011-A0202-12-0022-1
Figure 106108011-A0202-12-0022-1

Figure 106108011-A0202-12-0022-2
Figure 106108011-A0202-12-0022-2

Figure 106108011-A0202-12-0023-3
Figure 106108011-A0202-12-0023-3

(A)(甲基)丙烯酸基低聚物 (A) (Meth) acrylic oligomer

(a-1):UA10000B:聚醚系胺基甲酸酯丙烯酸酯低聚物(分子量25,000,KSM股份公司製) (a-1): UA10000B: Polyether urethane acrylate oligomer (molecular weight 25,000, manufactured by KSM Co., Ltd.)

(a-2):UN7700:聚酯系胺基甲酸酯丙烯酸酯低聚物(分子量20,000,根上工業股份公司製) (a-2): UN7700: Polyester-based urethane acrylate oligomer (molecular weight 20,000, manufactured by Negami Kogyo Co., Ltd.)

(a-3):EB230:脂肪族系胺基甲酸酯丙烯酸酯低聚物(分子5,000,戴歇爾股份公司製) (a-3): EB230: Aliphatic urethane acrylate oligomer (molecule 5,000, manufactured by Decher Co., Ltd.)

(a-4):UV6300B:胺基甲酸酯丙烯酸酯低聚物(分子量3,000,日本合成化學股份公司製) (a-4): UV6300B: Urethane acrylate oligomer (molecular weight 3,000, manufactured by Nippon Synthetic Chemical Co., Ltd.)

(a-5):TE2000:聚丁二烯系胺基甲酸酯丙烯酸酯低聚物(分子量3,000,日本曹達股份公司製) (a-5): TE2000: Polybutadiene-based urethane acrylate oligomer (molecular weight 3,000, manufactured by Soda Co., Ltd.)

(B)(甲基)丙烯酸基單體 (B) (Meth) acrylic monomer

(b-1):IBOA:異冰片基丙烯酸酯(黏度7.7mPa˙s,大阪有機化學工業股份公司) (b-1): IBOA: Isobornyl acrylate (viscosity 7.7mPa˙s, Osaka Organic Chemical Industry Co., Ltd.)

(b-2):4HBA:4-羥基丁基丙烯酸酯(黏度5.5mPa˙s,大阪有機化學工業股份公司) (b-2): 4HBA: 4-hydroxybutyl acrylate (viscosity 5.5mPa˙s, Osaka Organic Chemical Industry Co., Ltd.)

(b-3):L-A:月桂基丙烯酸酯(黏度4.0mPa˙s,大阪有機化學工業股份公司) (b-3): L-A: Lauryl Acrylate (Viscosity 4.0mPa˙s, Osaka Organic Chemical Industry Co., Ltd.)

(b-4):IOAA:異辛基丙烯酸酯(黏度2mPa˙s,大阪有機化學工業股份公司) (b-4): IOAA: Isooctyl acrylate (viscosity 2mPa˙s, Osaka Organic Chemical Industry Co., Ltd.)

(C)自由基聚合引發劑 (C) Free radical polymerization initiator

(c-1)I-184:1-羥基-環己基-苯基-酮(光自由基聚合引發劑,BASF公司製) (c-1) I-184: 1-hydroxy-cyclohexyl-phenyl-ketone (photo-radical polymerization initiator, manufactured by BASF)

(c-2)帕歐庫O:t-丁基過氧2-乙基己酸酯(熱自由基聚合引發劑,日本油脂股份公司製) (c-2) Paoku O: t-butylperoxy 2-ethylhexanoate (thermal radical polymerization initiator, manufactured by Nippon Oil & Fat Co., Ltd.)

使用實施例1~12之組成物貼合無機基材與有機基材時,可得較高之撕剝強度,及優良之無機基材與有機基材之接著力。 When the composition of Examples 1 to 12 is used to bond the inorganic substrate and the organic substrate, higher peel strength and excellent adhesion between the inorganic substrate and the organic substrate can be obtained.

特別是比較實施例1~3及實施例4~6,結果會因進一步驟提高低聚物之分子量,而進一步提高撕剝強度。 In particular, comparing Examples 1 to 3 and Examples 4 to 6, as a result, the molecular weight of the oligomer is further increased, and the peel strength is further improved.

比較實施例1與4、比較實施例2與5及比較實施例3與6時,結果藉由熱硬化可進一步提高撕剝強度。比較實施例2與7、實施例5與8、實施例3與9及實施例6與10時,結果會因成分A之含量較少,而進一步提高撕剝強度。 When comparing Examples 1 and 4, Comparative Examples 2 and 5, and Comparative Examples 3 and 6, as a result, the peel strength can be further improved by thermal hardening. When comparing Examples 2 and 7, Examples 5 and 8, Examples 3 and 9, and Examples 6 and 10, the result will be that the content of component A is less, and the peel strength is further improved.

比較實施例3與11,及比較實施例6與12時,結果成分B為含有「烷基鏈較短且支鏈狀」(甲基)丙烯酸基單 體之組成物,比較其為含有「烷基鏈較長且直鏈狀」(甲基)丙烯酸基單體之組成物時可進一步提高撕剝強度。 Comparing Examples 3 and 11, and Comparative Examples 6 and 12, the result is that component B contains a "short and branched alkyl chain" (meth)acrylic group. The composition of the body can further improve the peel strength when compared with the composition containing the "longer and linear alkyl chain" (meth)acrylic monomer.

因比較例1~4係使用分子量為3,000之低聚物,故撕剝強度較低,無機基材與有機基材之接著力較差。 Since Comparative Examples 1 to 4 use oligomers with a molecular weight of 3,000, the peel strength is low, and the adhesion between the inorganic substrate and the organic substrate is poor.

產業上利用可能性 Industrial use possibility

因組成物可使無機材料與有機材料具有優良接著力,故可作為較佳為使噴墨塗佈用之基材相互間貼合用之接著劑用,產業上具有較高適用性。 Since the composition can have excellent adhesion between inorganic materials and organic materials, it can be used as an adhesive preferably for bonding substrates for inkjet coating to each other, and has high industrial applicability.

Claims (7)

一種硬化性樹脂組成物,其特徵為含有分子量5,000以上之(甲基)丙烯酸基低聚物(成分A)、(甲基)丙烯酸基單體(成分B),及由光自由基聚合引發劑及熱自由基聚合引發劑所成群中所選出之至少一種之自由基聚合引發劑(成分C),成分B為含有脂環式(甲基)丙烯酸酯、含有羥基之(甲基)丙烯酸酯及支鏈狀之C6~C16之烷基(甲基)丙烯酸酯,且黏度為150mPa˙s以下。 A curable resin composition characterized by containing a (meth)acrylic oligomer (component A) with a molecular weight of 5,000 or more, a (meth)acrylic monomer (component B), and a photo-radical polymerization initiator And at least one kind of radical polymerization initiator selected from the group of thermal radical polymerization initiators (component C), component B is a (meth)acrylate containing alicyclic (meth)acrylate and hydroxyl group And branched C 6 ~C 16 alkyl (meth)acrylate, and the viscosity is below 150mPa˙s. 如請求項1之硬化性樹脂組成物,其中成分B為含有10mPa˙s以下之(甲基)丙烯酸酯。 Such as the curable resin composition of claim 1, wherein component B is (meth)acrylate containing less than 10 mPa˙s. 如請求項1或2之硬化性樹脂組成物,其中相對於成分A及成分B之合計100重量份,成分A為30重量份以下。 The curable resin composition of claim 1 or 2, wherein the component A is 30 parts by weight or less with respect to 100 parts by weight of the total of the component A and the component B. 如請求項1或2之硬化性樹脂組成物,其為接著劑。 Such as the curable resin composition of claim 1 or 2, which is an adhesive. 如請求項3之硬化性樹脂組成物,其為接著劑。 Such as the curable resin composition of claim 3, which is an adhesive. 如請求項1或2之硬化性樹脂組成物,其係使用於由旋轉塗佈機、模具塗佈機、定量分配器、噴墨塗佈、網版印刷及照相凹版印刷所成群中所選出之一種以上之方法。 Such as the curable resin composition of claim 1 or 2, which is used in a group selected from a group of spin coaters, die coaters, quantitative dispensers, inkjet coating, screen printing, and gravure printing More than one method. 如請求項3之硬化性樹脂組成物,其係使用於由旋轉塗佈機、模具塗佈機、定量分配器、噴墨印刷、網版印刷及照相凹版印刷所成群中所選出之一種以上之方法。 For example, the curable resin composition of claim 3, which is used for one or more selected from a group of spin coaters, die coaters, quantitative dispensers, inkjet printing, screen printing, and gravure printing method.
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