TWI671375B - Photohardenable composition - Google Patents

Photohardenable composition Download PDF

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TWI671375B
TWI671375B TW105105477A TW105105477A TWI671375B TW I671375 B TWI671375 B TW I671375B TW 105105477 A TW105105477 A TW 105105477A TW 105105477 A TW105105477 A TW 105105477A TW I671375 B TWI671375 B TW I671375B
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meth
acrylate
adhesive composition
light
hydrogenated
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TW105105477A
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TW201638286A (en
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金子聖
寺田智仁
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日商協立化學產業股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08Homopolymers or copolymers of acrylic acid esters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06Polymers provided for in subclass C08G
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/10Homopolymers or copolymers of methacrylic acid esters
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/40Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Laminated Bodies (AREA)

Abstract

本發明為關於一種光硬化型接著組成物,其係即使是在氧存在下進行光照射之情形,亦可賦予與氧為不存在之情形時為同等接著強度的層合體,本發明之光硬化型接著組成物係含有:(A)分子量為10,000~70,000的4官能以上的(甲基)丙烯酸酯寡聚物、(B)單官能(甲基)丙烯酸酯單體、(C)光反應起始劑、(D)軟化點為70~150℃的賦黏劑、及(E)液狀可塑劑。 The present invention relates to a light-curing type adhesive composition, which can provide a laminate having the same adhesion strength as when oxygen is absent even in the case of light irradiation in the presence of oxygen. The light-curing of the present invention The type adhesive composition system contains (A) a 4-functional or more (meth) acrylate oligomer having a molecular weight of 10,000 to 70,000, (B) a monofunctional (meth) acrylate monomer, and (C) photoreaction Starter, (D) a tackifier with a softening point of 70 to 150 ° C, and (E) a liquid plasticizer.

Description

光硬化型接著組成物 Photocuring type adhesive composition

本發明為關於光硬化型接著組成物、使用此的層合體、使用此的光學顯示體、及層合體之製造方法。 The present invention relates to a photocurable adhesive composition, a laminate using the same, an optical display using the same, and a method for producing the laminate.

近年,使用於智慧型手機等的圖像顯示裝置,就防止因表面反射所造成的辨視性降低之點而言,係將液晶顯示面板或有機EL面板等的顯示體與觸控面板予以直接貼合,或為了補強而進行著顯示體與保護面板等的前面板之貼合、或觸控面板與前面板之貼合。在圖像顯示裝置之製造方法中,已知有一種使接著之方法,其係將光硬化性樹脂組成物塗布於接著對象之一側之基材後,照射紫外線,使形成光硬化性樹脂組成物的暫時硬化樹脂層,之後再與另一側之基材貼合(專利文獻1)。 In recent years, image display devices used in smart phones and the like have been designed to directly reduce the visibility caused by surface reflections, such as liquid crystal display panels or organic EL panels, and touch panels. Lamination, or the bonding of the display body and the front panel, such as a protective panel, or the touch panel and the front panel for reinforcement. As a method of manufacturing an image display device, there is known a method of bonding, which is a method of applying a photocurable resin composition to a substrate on one side of a target, and then irradiating ultraviolet rays to form a photocurable resin composition. The resin layer temporarily hardens the resin layer, and is then bonded to the substrate on the other side (Patent Document 1).

然而,在光硬化性樹脂組成物所廣泛使用的丙烯酸樹脂系的自由基聚合型,會因為空氣中的氧阻礙硬化而表面硬化性為差,故於表面會殘留表面為未充分硬化的成分,隨之具有所謂接著強度會降低之問題。對此,專利文獻2揭示一種方法,其係於減壓下或氮等的惰性氣體 氣氛下,對含有聚異戊二烯甲基丙烯酸酯寡聚物、二環戊烯氧基乙基甲基丙烯酸酯及甲基丙烯酸月桂酯的光硬化性樹脂組成物照射紫外線。 However, the radical polymerization type of acrylic resins widely used in photocurable resin compositions has poor surface hardening properties due to oxygen in the air hindering hardening. Therefore, components that are not sufficiently hardened remain on the surface. As a result, there is a problem that the bonding strength is reduced. In response, Patent Document 2 discloses a method in which an inert gas such as nitrogen or the like is used under reduced pressure. The photocurable resin composition containing polyisoprene methacrylate oligomer, dicyclopentenyloxyethyl methacrylate, and lauryl methacrylate was irradiated with ultraviolet rays in the atmosphere.

[先前技術文獻] [Prior technical literature]

[專利文獻] [Patent Literature]

[專利文獻1]日本特開2013-151151號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2013-151151

[專利文獻2]日本特開2013-254189號公報 [Patent Document 2] Japanese Patent Laid-Open No. 2013-254189

然而,以專利文獻2所記載之方法時,為了排除因氧所造成的硬化阻礙之影響,必須導入用來設置成為減壓或惰性氣體氣氛的裝置。 However, in the method described in Patent Document 2, it is necessary to introduce a device for setting a reduced pressure or an inert gas atmosphere in order to eliminate the influence of the hardening barrier caused by oxygen.

因此,本發明為解決上述問題,本發明之目的為提供一種光硬化型接著組成物,其係即使是在氧存在下進行光照射之情形,亦可賦予與氧為不存在之情形時為同等接著強度的層合體。 Therefore, in order to solve the above-mentioned problems, the present invention aims to provide a light-curing type adhesive composition, which is equivalent to the case where oxygen is absent even when light is irradiated in the presence of oxygen. Followed by a laminate of strength.

本發明為具有下述構成。 The present invention has the following configuration.

[1].一種光硬化型接著組成物,其係含有:(A)分子量為10,000~70,000的4官能以上的(甲基)丙 烯酸酯寡聚物、(B)單官能(甲基)丙烯酸酯單體、(C)光反應起始劑、(D)軟化點為70~150℃的賦黏劑、及(E)液狀可塑劑。 [1]. A light-curing type adhesive composition comprising: (A) a tetrafunctional or higher (meth) acrylic acid having a molecular weight of 10,000 to 70,000 Acrylate oligomer, (B) monofunctional (meth) acrylate monomer, (C) photoreaction initiator, (D) tackifier with softening point of 70 to 150 ° C, and (E) liquid Shape plasticizer.

[2].如上述[1]之光硬化型接著組成物,其中,(A)成分係選自由骨架中具有(氫化)聚異戊二烯、(氫化)聚丁二烯及聚胺基甲酸酯構造的(甲基)丙烯酸酯寡聚物所成之群之1種以上。 [2]. The light-curing type adhesive composition according to the above [1], wherein the component (A) is selected from the group having (hydrogenated) polyisoprene, (hydrogenated) polybutadiene, and polyurethane in the skeleton. One or more groups of (meth) acrylate oligomers having an acid ester structure.

[3].如上述[1]或[2]之光硬化型接著組成物,其中,(B)成分係選自由烷基(甲基)丙烯酸酯及羥基取代烷基(甲基)丙烯酸酯所成之群之1種以上。 [3]. The light-curable adhesive composition according to the above [1] or [2], wherein the component (B) is selected from the group consisting of an alkyl (meth) acrylate and a hydroxy-substituted alkyl (meth) acrylate One or more of the group.

[4].一種層合體,其係以上述[1]~[3]中任一項之光硬化型接著組成物貼合而成。 [4]. A laminate formed by laminating the light-curing type adhesive composition according to any one of the above [1] to [3].

[5].如上述[4]之層合體,其係光學顯示體。 [5]. The laminated body as described in [4] above, which is an optical display.

[6].一種製造方法,其係層合體之製造方法,含有下述步驟(I)~(III):(I)將上述[1]~[3]中任一項之光硬化型接著組成物適用於基材1,來形成光硬化型接著組成物層之步驟;(II)對步驟(I)所得之光硬化型接著組成物層照射能量線,來形成光硬化型接著組成物之硬化物之步驟;及(III)將基材2貼合至步驟(II)所得之硬化物之上之步驟。 [6]. A manufacturing method, which is a method for manufacturing a laminated body, comprising the following steps (I) to (III): (I) combining the photohardening type of any one of the above [1] to [3] The material is suitable for the step of forming the photo-curable adhesive composition layer on the substrate 1; (II) irradiating the light-curable adhesive composition layer obtained in step (I) with energy rays to form a light-curable adhesive composition; And (III) a step of attaching the substrate 2 to the hardened product obtained in the step (II).

[7].如上述[6]之製造方法,其中,在步驟(II)所形成 的硬化物的光硬化型接著組成物之反應率為90%以上。 [7]. The manufacturing method according to the above [6], wherein the method is formed in step (II) The photo-curing type adhesive composition of the cured product has a reaction rate of 90% or more.

藉由本發明,可提供一種光硬化型接著組成物,其係即使是在氧存在下進行光照射之情形,亦可賦予與氧為不存在之情形時為同等接著強度的層合體。 According to the present invention, it is possible to provide a light-curable adhesive composition that can provide a laminate having the same adhesive strength as when oxygen is absent, even when light is irradiated in the presence of oxygen.

[實施發明之最佳形態] [Best Mode for Implementing Invention]

(光硬化型接著組成物) (Light-curing type adhesive composition)

光硬化型接著組成物係含有:(A)分子量為10,000~70,000的4官能以上的(甲基)丙烯酸酯寡聚物、(B)單官能(甲基)丙烯酸酯單體、(C)光反應起始劑、(D)軟化點為70~150℃的賦黏劑、及(E)液狀可塑劑。 The photocuring type adhesive composition system contains (A) a tetrafunctional or higher (meth) acrylate oligomer having a molecular weight of 10,000 to 70,000, (B) a monofunctional (meth) acrylate monomer, and (C) light The reaction initiator, (D) a tackifier having a softening point of 70 to 150 ° C, and (E) a liquid plasticizer.

<(A)分子量為10,000~70,000的4官能以上的(甲基)丙烯酸酯寡聚物> <(A) A tetrafunctional (meth) acrylate oligomer having a molecular weight of 10,000 to 70,000>

(A)分子量為10,000~70,000的4官能以上的(甲基)丙烯酸酯寡聚物(以下亦稱為「(A)寡聚物」),係分子中具有4以上的(甲基)丙烯醯基。本說明書中,「(甲基)丙烯酸酯」為包含「丙烯酸酯」及「甲基丙烯酸酯」之雙方。又,「(甲基)丙烯醯基」為包含「丙烯醯基」及「甲基丙烯醯基」之雙方。 (A) A tetrafunctional or higher (meth) acrylate oligomer having a molecular weight of 10,000 to 70,000 (hereinafter also referred to as "(A) oligomer"), which has (meth) acrylic acid having 4 or more in the molecule base. In this specification, "(meth) acrylate" includes both "acrylate" and "methacrylate". In addition, "(meth) acrylfluorenyl" includes both "acrylfluorenyl" and "methacrylfluorenyl".

(A)寡聚物之分子量為10,000~70,000,又較佳為20,000~50,000。當寡聚物之分子量為未滿10,000時,具有彈性率為上昇、可撓性為降低之傾向,當寡聚物之分子量為超過70,000時,黏度為上昇,作業性具有降低之傾向。本說明書中,分子量為以凝膠滲透層析法(GPC)測定,使用標準聚苯乙烯的檢測線所換算而得的重量平均分子量。 (A) The molecular weight of the oligomer is 10,000 to 70,000, and more preferably 20,000 to 50,000. When the molecular weight of the oligomer is less than 10,000, the elasticity tends to increase and the flexibility decreases. When the molecular weight of the oligomer exceeds 70,000, the viscosity increases and the workability tends to decrease. In this specification, the molecular weight is a weight average molecular weight measured by gel permeation chromatography (GPC) and converted using a standard polystyrene detection line.

(A)寡聚物的官能數((甲基)丙烯醯基的數目)為4官能以上,較佳為4~10官能,又較佳為4~6官能,特佳為4官能。當寡聚物官能數為3官能以下時,在氧存在下進行光照射時,因氧所造成的硬化阻礙將變得顯著,接著強度會降低。又,當(A)寡聚物的官能數為10官能以下時,在氧存在下進行光照射時,且可抑制伴隨於官能數之增加的彈性率之增加。 (A) The functional number of the oligomer (the number of (meth) acrylfluorenyl groups) is 4 or more, preferably 4 to 10, more preferably 4 to 6, and particularly preferably 4. When the number of functional groups of the oligomer is 3 or less, when the light is irradiated in the presence of oxygen, the hardening barrier due to oxygen becomes significant, and then the strength decreases. Further, when the number of functional groups of the (A) oligomer is 10 or less, when light is irradiated in the presence of oxygen, an increase in elastic modulus accompanying an increase in the number of functional groups can be suppressed.

(A)寡聚物未特別限定,舉例如骨架中具有(氫化)聚異戊二烯、(氫化)聚丁二烯或聚胺基甲酸酯的(甲基)丙烯酸酯寡聚物。該等(甲基)丙烯酸酯寡聚物可使用1種類或2種類以上。在此,(氫化)聚異戊二烯為包含聚異戊二烯及/或氫化聚異戊二烯,(氫化)聚丁二烯為包含聚丁二烯及/或氫化聚丁二烯。 (A) The oligomer is not particularly limited, and examples thereof include a (meth) acrylate oligomer having (hydrogenated) polyisoprene, (hydrogenated) polybutadiene, or polyurethane in its backbone. These (meth) acrylate oligomers can be used singly or in combination of two or more kinds. Here, (hydrogenated) polyisoprene includes polyisoprene and / or hydrogenated polyisoprene, and (hydrogenated) polybutadiene includes polybutadiene and / or hydrogenated polybutadiene.

骨架中具有(氫化)聚丁二烯的(甲基)丙烯酸酯寡聚物,舉例如(氫化)聚丁二烯(甲基)丙烯酸酯、及(氫化)聚丁二烯胺基甲酸酯(甲基)丙烯酸酯。 (Meth) acrylate oligomers having (hydrogenated) polybutadiene in the backbone, such as (hydrogenated) polybutadiene (meth) acrylate, and (hydrogenated) polybutadiene urethane (Meth) acrylate.

骨架中具有(氫化)聚異戊二烯的(甲基)丙烯酸 酯寡聚物,舉例如(氫化)聚異戊二烯(甲基)丙烯酸酯、及(氫化)聚異戊二烯胺基甲酸酯(甲基)丙烯酸酯。 (Meth) acrylic acid with (hydrogenated) polyisoprene in the skeleton Examples of the ester oligomer include (hydrogenated) polyisoprene (meth) acrylate and (hydrogenated) polyisoprenecarbamate (meth) acrylate.

骨架中具有聚胺基甲酸酯的(甲基)丙烯酸酯寡聚物,舉例如聚醚系、聚碳酸酯系、聚酯系或該等組合的聚胺基甲酸酯(甲基)丙烯酸酯寡聚物。作為骨架中具有聚胺基甲酸酯的(A)(甲基)丙烯酸酯寡聚物的市售品,舉例如UV-7610B(日本合成化學公司製;分子量11,000、9官能)等。 (Meth) acrylate oligomers having a polyurethane in the skeleton, such as polyether-based, polycarbonate-based, polyester-based, or combinations thereof Ester oligomers. As a commercially available product of the (A) (meth) acrylate oligomer having a polyurethane in the skeleton, for example, UV-7610B (manufactured by Nippon Synthetic Chemical Co., Ltd .; molecular weight 11,000, 9-functional) and the like can be mentioned.

(A)寡聚物,較佳為骨架中具有(氫化)聚丁二烯,又較佳為胺基甲酸酯(甲基)丙烯酸改質(氫化)聚丁二烯。(A)寡聚物可為1種,或亦可併用2種以上。 (A) The oligomer is preferably a (hydrogenated) polybutadiene in a skeleton, and more preferably a urethane (meth) acrylic modified (hydrogenated) polybutadiene. (A) The oligomer may be one type, or two or more types may be used in combination.

<<(A)寡聚物之製造方法>> << (A) Manufacturing method of oligomer >>

(A)寡聚物可藉由例如日本特開2014-189758號公報或日本特開2002-309185號公報中所記載之方法來製造。又,(A)寡聚物可藉由下述方法來製造:將含有羥基的樹脂與(甲基)丙烯酸進行縮合之方法;將(甲基)丙烯酸酯與含有羥基的樹脂進行酯交換之方法。更,(A)寡聚物,具體而言可藉由包含「得到具有異氰酸基的預聚物的步驟」、與「得到(甲基)丙烯酸酯寡聚物的步驟」之方法來製造,該「得到具有異氰酸基的預聚物的步驟」,係將含有羥基的(氫化)聚丁二烯、含有羥基的(氫化)聚異戊二烯;選自由含有羥基的聚酯、含有羥基的聚醚、及含有羥基的聚碳酸酯所成之群之1以上的含有羥基的樹脂;與聚異氰酸酯 反應,而得到具有異氰酸基的預聚物;該「得到(甲基)丙烯酸酯寡聚物的步驟」,係使具有異氰酸基的預聚物與含有羥基的(甲基)丙烯酸酯反應,而(甲基)丙烯酸酯寡聚物。以下對於「含有羥基的樹脂」、「聚異氰酸酯」、「含有羥基的(甲基)丙烯酸酯、」「(甲基)丙烯酸酯」進行說明。 (A) An oligomer can be manufactured by the method described in Unexamined-Japanese-Patent No. 2014-189758 or Unexamined-Japanese-Patent No. 2002-309185, for example. The (A) oligomer can be produced by a method of condensing a hydroxyl group-containing resin and (meth) acrylic acid, and a method of transesterifying a (meth) acrylate with a hydroxyl group-containing resin. . More specifically, (A) an oligomer can be produced by a method including "a step of obtaining a prepolymer having an isocyanate group" and "a step of obtaining a (meth) acrylate oligomer". The "step of obtaining a prepolymer having an isocyanate group" is a method in which a hydroxyl-containing (hydrogenated) polybutadiene and a hydroxyl-containing (hydrogenated) polyisoprene are selected from the group consisting of a hydroxyl-containing polyester, Hydroxy group-containing polyethers and hydroxyl group-containing polycarbonates in groups of 1 or more; and polyisocyanates Reacting to obtain a prepolymer having an isocyanate group; this "step of obtaining a (meth) acrylate oligomer" is a process in which a prepolymer having an isocyanate group and a (meth) acrylic acid containing a hydroxyl group Ester reaction, while (meth) acrylate oligomers. The "hydroxyl-containing resin", "polyisocyanate", "hydroxyl-containing (meth) acrylate," and "(meth) acrylate" are described below.

<<<含有羥基的樹脂>>> <<< Hydroxy-containing resin >>>

含有羥基的樹脂為(甲基)丙烯酸酯寡聚物的原料樹脂,舉例如含有羥基的(氫化)聚丁二烯、含有羥基的(氫化)聚異戊二烯、含有羥基的聚酯、含有羥基的聚醚、及含有羥基的聚碳酸酯。含有羥基的樹脂,較佳為:於兩末端具有羥基的(氫化)聚丁二烯、於兩末端具有羥基的(氫化)聚異戊二烯、於兩末端具有羥基的聚酯、於兩末端具有羥基的聚醚、及於兩末端具有羥基的聚碳酸酯。藉此可導入於兩末端為1以上的(甲基)丙烯醯基,較佳為於兩末端為2以上的(甲基)丙烯醯基。 The hydroxyl-containing resin is a raw material resin of a (meth) acrylate oligomer. Examples of the resin include hydroxyl-containing (hydrogenated) polybutadiene, hydroxyl-containing (hydrogenated) polyisoprene, hydroxyl-containing polyester, Hydroxyl polyether and hydroxyl-containing polycarbonate. The hydroxyl group-containing resin is preferably (hydrogenated) polybutadiene having hydroxyl groups at both ends, (hydrogenated) polyisoprene having hydroxyl groups at both ends, polyester having hydroxyl groups at both ends, and polyesters at both ends. Polyether having a hydroxyl group, and polycarbonate having hydroxyl groups at both ends. This allows introduction of a (meth) acrylfluorenyl group having 1 or more at both ends, preferably a (meth) acrylfluorenyl group having 2 or more at both ends.

作為於兩末端具有羥基的(氫化)聚丁二烯,舉例如GI-3000(日本曹達公司製)、GI-1000(日本曹達公司製)、G-3000(日本曹達公司製)、Poly bd(出光興產公司製)等。作為於兩末端具有羥基的(氫化)聚異戊二烯,舉例如Poly ip(出光興產公司製)等。作為於兩末端具有羥基的聚酯、於兩末端具有羥基的聚醚、及於兩末端具有羥基的聚碳酸酯,舉例如Polylite OD-X-2251(DIC公司製)、 PPG(三井化學公司製)、Duranol T5652(旭化成化學公司製)、Preminol 4004、Preminol 4015(旭硝子公司製)、Adeka polyether P-3000、Adeka new ace V14-90(Adeka公司製)等,已有多數被市售,可因應作為目的之分子量或極性來使用,未特別限定。 Examples of the (hydrogenated) polybutadiene having hydroxyl groups at both ends include GI-3000 (manufactured by Soda Corporation of Japan), GI-1000 (manufactured by Soda Corporation of Japan), G-3000 (manufactured by Soda Corporation of Japan), Poly bd ( (By Idemitsu Kosan Co., Ltd.). Examples of the (hydrogenated) polyisoprene having hydroxyl groups at both ends include Poly ip (manufactured by Idemitsu Kosan Co., Ltd.). Examples of polyesters having hydroxyl groups at both ends, polyethers having hydroxyl groups at both ends, and polycarbonates having hydroxyl groups at both ends include Polylite OD-X-2251 (manufactured by DIC Corporation), PPG (made by Mitsui Chemicals), Duranol T5652 (made by Asahi Kasei Chemicals), Preminol 4004, Preminol 4015 (made by Asahi Glass Co., Ltd.), Adeka polyether P-3000, Adeka new ace V14-90 (made by Adeka), etc. It is commercially available and can be used depending on the molecular weight or polarity for the purpose, and it is not particularly limited.

<<<聚異氰酸酯>>> <<< Polyisocyanate >>>

聚異氰酸酯,只要是具有2個以上的異氰酸基的化合物即可,未特別限定,舉例如芳香族、脂肪族、或脂環式聚異氰酸酯。 The polyisocyanate is not particularly limited as long as it is a compound having two or more isocyanate groups, and examples thereof include aromatic, aliphatic, and alicyclic polyisocyanates.

芳香族聚異氰酸酯,舉例如甲苯二異氰酸酯(tolylene diisocyanate)、二苯基甲烷二異氰酸酯、聚苯基甲烷聚異氰酸酯、改質二苯基甲烷二異氰酸酯、苯二甲撐二異氰酸酯(xylylene diisocyanate)、四甲基苯二甲撐二異氰酸酯、伸苯異氰酸酯(phenylene diisocyanate)、萘二異氰酸酯(naphthalene diisocyanate)等。 Aromatic polyisocyanates include, for example, tolylene diisocyanate, diphenylmethane diisocyanate, polyphenylmethane polyisocyanate, modified diphenylmethane diisocyanate, xylylene diisocyanate, four Methylxylylene diisocyanate, phenylene diisocyanate, naphthalene diisocyanate, and the like.

脂環式聚異氰酸酯,舉例如氫化二苯基甲烷二異氰酸酯、氫化苯二甲撐二異氰酸酯、異佛酮二異氰酸酯、降莰烯二異氰酸酯、1,3-雙(異氰酸基甲基)環己烷等。 Alicyclic polyisocyanate, for example, hydrogenated diphenylmethane diisocyanate, hydrogenated xylylene diisocyanate, isophorone diisocyanate, norbornene diisocyanate, 1,3-bis (isocyanatomethyl) ring Hexane, etc.

脂肪族聚異氰酸酯,舉例如六亞甲二異氰酸酯、三甲基六亞甲二異氰酸酯、離胺酸二異氰酸酯、離胺酸三異氰酸酯等。 Examples of the aliphatic polyisocyanate include hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, lysine diisocyanate, and lysine triisocyanate.

<<<含有羥基的(甲基)丙烯酸酯>>> <<< Hydroxy (meth) acrylate >>>

含有羥基的(甲基)丙烯酸酯,只要是分子中具有1個以上的羥基及1個以上的(甲基)丙烯醯基的(甲基)丙烯酸酯化合物即可,未特別限定。含有羥基的(甲基)丙烯酸酯,舉例如(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸2-羥基丁酯、(甲基)丙烯酸4-羥基丁酯、2-(甲基)丙烯醯基氧基乙基-2-羥基丙基鄰苯二甲酸酯、己內酯改質(甲基)丙烯酸2-羥基乙酯、環己烷二甲醇單(甲基)丙烯酸酯等的分子中具有1個的羥基及1個的(甲基)丙烯醯基的(甲基)丙烯酸酯;2-羥基-3-(甲基)丙烯醯基氧基丙基(甲基)丙烯酸酯、新戊四醇三(甲基)丙烯酸酯、二新戊四醇五(甲基)丙烯酸酯等的分子中具有1個的羥基及2個以上的(甲基)丙烯醯基的(甲基)丙烯酸酯等。 The (meth) acrylate containing a hydroxyl group is not particularly limited as long as it is a (meth) acrylate compound having one or more hydroxyl groups and one or more (meth) acrylfluorenyl groups in the molecule. Hydroxyl-containing (meth) acrylates include, for example, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, and (meth) acrylic acid 4-hydroxybutyl ester, 2- (meth) propenyloxyethyl-2-hydroxypropyl phthalate, caprolactone modified 2-hydroxyethyl (meth) acrylate, cyclohexyl (Meth) acrylic acid esters having one hydroxyl group and one (meth) acrylfluorenyl group in molecules such as alkanedimethanol mono (meth) acrylate; 2-hydroxy-3- (meth) acrylamide Molyloxypropyl (meth) acrylate, neopentaerythritol tri (meth) acrylate, dipentaerythritol penta (meth) acrylate, etc. have one hydroxyl group and two or more (Meth) acrylfluorenyl (meth) acrylate and the like.

藉由調整含有羥基的樹脂之羥基的數目、及含有羥基的(甲基)丙烯酸酯中的(甲基)丙烯醯基的數目,可得到(A)寡聚物。作為含有羥基的樹脂及含有羥基的(甲基)丙烯酸酯之組合,只要是所得之寡聚物為分子內具有4以上的(甲基)丙烯醯基即可,未特別限定。作為含有羥基的樹脂及含有羥基的(甲基)丙烯酸酯之組合,可舉例如下述含有羥基的樹脂及含有羥基的(甲基)丙烯酸酯之組合,即,含有羥基的樹脂為於兩末端具有1個的羥基的樹脂,含有羥基的(甲基)丙烯酸酯為具有1個的羥基及1個以上的(甲基)丙烯醯基的(甲基)丙烯酸酯化合物。 By adjusting the number of hydroxyl groups of the hydroxyl group-containing resin and the number of (meth) acrylfluorenyl groups in the hydroxyl group-containing (meth) acrylate, (A) an oligomer can be obtained. The combination of the hydroxyl-containing resin and the hydroxyl-containing (meth) acrylate is not particularly limited as long as the obtained oligomer has a (meth) acrylfluorenyl group having 4 or more in the molecule. Examples of the combination of a hydroxyl group-containing resin and a hydroxyl group-containing (meth) acrylate include the following combination of a hydroxyl group-containing resin and a hydroxyl group-containing (meth) acrylate. That is, the hydroxyl group-containing resin has For one hydroxyl resin, a (meth) acrylate containing a hydroxyl group is a (meth) acrylate compound having one hydroxyl group and one or more (meth) acrylfluorenyl groups.

<<<(甲基)丙烯酸酯>>> <<< (meth) acrylate >>>

(甲基)丙烯酸酯,只要是分子中具有1個以上的(甲基)丙烯醯基、且不具有羥基的(甲基)丙烯酸酯化合物即可,未特別限定。作為如此般的化合物,舉例如(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸十六酯、(甲基)丙烯酸十八酯、(甲基)丙烯酸異十八酯等的(甲基)丙烯酸的烷基酯;(甲基)丙烯酸苄酯等的(甲基)丙烯酸的芳烷基酯;(甲基)丙烯酸環己酯、異莰基(甲基)丙烯酸酯、二環戊烯基(甲基)丙烯酸酯等的(甲基)丙烯酸的脂環式酯;四氫糠基(甲基)丙烯酸酯等的(甲基)丙烯酸的雜環基酯等。 The (meth) acrylate is not particularly limited as long as it is a (meth) acrylate compound having one or more (meth) acrylfluorenyl groups in the molecule and not having a hydroxyl group. Examples of such a compound include methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, octyl (meth) acrylate, and 2-ethylhexyl (meth) acrylate. (Meth) acrylic acid alkyl esters such as esters, lauryl (meth) acrylate, cetyl (meth) acrylate, octadecyl (meth) acrylate, and isooctadecyl (meth) acrylate; Aryl (meth) acrylic acid such as benzyl methacrylate; cyclohexyl (meth) acrylate, isofluorenyl (meth) acrylate, dicyclopentenyl (meth) acrylate, etc. Alicyclic esters of (meth) acrylic acid; heterocyclic esters of (meth) acrylic acid, such as tetrahydrofurfuryl (meth) acrylate, and the like.

各成分之使用量、反應溫度、反應時間等的條件,只要是可得到(A)寡聚物即可未特別限定,可適當選擇。 The conditions such as the amount of each component, the reaction temperature, and the reaction time are not particularly limited as long as the oligomer (A) can be obtained, and can be appropriately selected.

<(B)單官能(甲基)丙烯酸酯單體> <(B) Monofunctional (meth) acrylate monomer>

(B)單官能(甲基)丙烯酸酯單體,只要是分子中具有1個(甲基)丙烯醯基的(甲基)丙烯酸酯化合物即可,未特別限定。(B)單官能(甲基)丙烯酸酯單體,舉例如(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸十八酯、(甲基)丙烯酸異十八酯等的烷基(甲基)丙烯酸酯;(甲基)丙烯酸甲氧基乙 酯等的烷氧基取代烷基(甲基)丙烯酸酯;(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸2-羥基丁酯、(甲基)丙烯酸4-羥基丁酯等的羥基取代烷基(甲基)丙烯酸酯;2-(甲基)丙烯醯基氧基乙基-2-羥基丙基鄰苯二甲酸酯、2-羥基-3-(甲基)丙烯醯基氧基丙基(甲基)丙烯酸酯、己內酯改質(甲基)丙烯酸2-羥基乙酯、環己烷二甲醇單(甲基)丙烯酸酯等的羥基取代烷基(甲基)丙烯酸酯以外的含有羥基的(甲基)丙烯酸酯;(甲基)丙烯酸苄酯、(甲基)丙烯酸苯酯等;二環戊烯氧基乙基(甲基)丙烯酸酯、降莰烯(甲基)丙烯酸酯、二環戊烯基(甲基)丙烯酸酯、異莰基(甲基)丙烯酸酯等。(B)單官能(甲基)丙烯酸酯單體,較佳為選自由烷基(甲基)丙烯酸酯及羥基取代烷基(甲基)丙烯酸酯所成之群之1種以上。 (B) The monofunctional (meth) acrylate monomer is not particularly limited as long as it is a (meth) acrylate compound having one (meth) acrylfluorenyl group in the molecule. (B) Monofunctional (meth) acrylate monomers such as 2-ethylhexyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, (meth) Alkyl (meth) acrylic acid such as tert-butyl acrylate, isodecyl (meth) acrylate, lauryl (meth) acrylate, octadecyl (meth) acrylate, isooctadecyl (meth) acrylate Ester; methoxyethyl (meth) acrylate Alkoxy-substituted alkyl (meth) acrylates such as esters; 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, ( Hydroxy-substituted alkyl (meth) acrylates such as 4-hydroxybutyl (meth) acrylate; 2- (meth) acrylfluorenyloxyethyl-2-hydroxypropyl phthalate, 2- Hydroxy-3- (meth) acrylfluorenyloxypropyl (meth) acrylate, caprolactone modified 2-hydroxyethyl (meth) acrylate, cyclohexanedimethanol mono (meth) acrylate Hydroxyl-substituted (meth) acrylates other than alkyl (meth) acrylates; hydroxyl-containing (meth) acrylates; benzyl (meth) acrylate, phenyl (meth) acrylate, etc .; dicyclopentenyloxyethyl ( (Meth) acrylate, norbornene (meth) acrylate, dicyclopentenyl (meth) acrylate, isofluorenyl (meth) acrylate, and the like. (B) The monofunctional (meth) acrylate monomer is preferably one or more selected from the group consisting of an alkyl (meth) acrylate and a hydroxy-substituted alkyl (meth) acrylate.

(B)單官能(甲基)丙烯酸酯單體可為1種,或亦可併用2種以上。當併用2種以上的(B)單官能(甲基)丙烯酸酯單體時,較佳為烷基(甲基)丙烯酸酯及羥基取代烷基(甲基)丙烯酸酯之組合。 (B) A monofunctional (meth) acrylate monomer may be used 1 type, or 2 or more types may be used together. When two or more (B) monofunctional (meth) acrylate monomers are used in combination, a combination of an alkyl (meth) acrylate and a hydroxy-substituted alkyl (meth) acrylate is preferred.

(B)單官能(甲基)丙烯酸酯單體,相對於(A)寡聚物100質量份,較佳為1~250質量份,又較佳為20~200質量份,更佳為30~150質量份,特佳為40~90質量份。 (B) Monofunctional (meth) acrylate monomer is preferably 1 to 250 parts by mass, more preferably 20 to 200 parts by mass, and more preferably 30 to 100 parts by mass of (A) oligomer. 150 parts by mass, particularly preferably 40 to 90 parts by mass.

<(C)光反應起始劑> <(C) Photoreaction initiator>

(C)光反應起始劑未特別限定,可例示如:1-[4-(2-羥基 乙氧基)苯基]-2-羥基-2-甲基-1-丙烷-1-酮、1-羥基-環己基-苯基-酮、二苯甲酮、2,2-二甲氧基-1,2-二苯乙烷-1-酮、2,4,6-三甲基苯甲醯基二苯基氧化膦、2,4,6-三甲基苯甲醯基苯基乙氧基氧化膦、2-苄基-2-二甲基胺基-1-(4-嗎啉基苯基)丁酮-1、2-羥基-2-甲基-1-苯基-丙烷-1-酮、2-甲基-1-[4-甲硫基]苯基]-2-嗎啉基丙烷-1-酮、苯偶姻甲基醚、苯偶姻乙基醚、苯偶姻異丁基醚、苯偶姻異丙基醚、雙(2,4,6-三甲基苯甲醯基)-苯基氧化膦、2-羥基-2-甲基-[4-(1-甲基乙烯基)苯基]丙醇寡聚物、2-羥基-2-甲基-[4-(1-甲基乙烯基)苯基]丙醇寡聚物,2-羥基-2-甲基-1-苯基-1-丙酮、異丙基噻吨酮、o-苯甲醯苯甲酸甲酯、[4-(甲基苯硫基)苯基]苯基甲烷、2,4-二乙基噻吨酮、2-氯噻吨酮、二苯甲酮、乙基蒽醌、二苯甲酮銨鹽、噻吨酮銨鹽、雙(2,6-二甲氧基苯甲醯基)-2,4,4-三甲基-戊基氧化膦、雙(2,6-二甲氧基苯甲醯基)-2,4,4-三甲基-戊基氧化膦、2,4,6-三甲基二苯甲酮、4-甲基二苯甲酮、4,4’-雙二乙基胺基二苯甲酮、1,4二苯甲醯基苯、10-丁基-2-氯吖啶酮、2,2’雙(o-氯苯基)4,5,4’,5’-肆(3,4,5-三甲氧基苯基)1,2’-聯咪唑、2,2’雙(o-氯苯基)4,5,4’,5’-四苯基-1,2’-聯咪唑、2-苯甲醯基萘、4-苯甲醯基聯苯、4-苯甲醯基二苯基醚、丙烯酸化二苯甲酮、雙(η 5-2,4-環戊二烯-1-基)-雙(2,6-二氟-3-(1H-吡咯-1-基)-苯基)鈦、o-甲基苯甲醯基苯甲酸酯、p-二甲基胺基苯甲酸乙酯、p-二甲基胺基苯甲酸異戊基乙酯、活性叔胺、咔唑‧苯酮系光反應起始劑、吖啶系光反應起始 劑、三嗪系光反應起始劑、苯甲醯基系光反應起始劑等。 (C) The photoreaction initiator is not particularly limited, and examples thereof include: 1- [4- (2-hydroxy Ethoxy) phenyl] -2-hydroxy-2-methyl-1-propane-1-one, 1-hydroxy-cyclohexyl-phenyl-one, benzophenone, 2,2-dimethoxy -1,2-diphenylethane-1-one, 2,4,6-trimethylbenzylidenediphenylphosphine oxide, 2,4,6-trimethylbenzylidenephenylethoxy Phosphine oxide, 2-benzyl-2-dimethylamino-1- (4-morpholinylphenyl) butanone-1, 2-hydroxy-2-methyl-1-phenyl-propane-1 -Ketone, 2-methyl-1- [4-methylthio] phenyl] -2-morpholinylpropane-1-one, benzoin methyl ether, benzoin ethyl ether, benzoin Butyl ether, benzoin isopropyl ether, bis (2,4,6-trimethylbenzyl) -phenylphosphine oxide, 2-hydroxy-2-methyl- [4- (1-methyl Vinyl) phenyl] propanol oligomer, 2-hydroxy-2-methyl- [4- (1-methylvinyl) phenyl] propanol oligomer, 2-hydroxy-2-methyl -1-phenyl-1-acetone, isopropylthioxanthone, methyl o-benzidine benzoate, [4- (methylphenylthio) phenyl] phenylmethane, 2,4-diethyl Thiothanone, 2-chlorothioxanthone, benzophenone, ethyl anthraquinone, benzophenone ammonium salt, thioxanthone ammonium salt, bis (2,6-dimethoxybenzyl) -2,4,4-trimethyl-pentylphosphine oxide, bis (2,6-dimethoxy Phenylbenzyl) -2,4,4-trimethyl-pentylphosphine oxide, 2,4,6-trimethylbenzophenone, 4-methylbenzophenone, 4,4'- Bisdiethylaminobenzophenone, 1,4benzophenylidenebenzene, 10-butyl-2-chloroacridone, 2,2'bis (o-chlorophenyl) 4,5,4 ', 5'-Di (3,4,5-trimethoxyphenyl) 1,2'-biimidazole, 2,2'bis (o-chlorophenyl) 4,5,4', 5'-tetra Phenyl-1,2'-biimidazole, 2-benzylidene naphthalene, 4-benzylidene biphenyl, 4-benzylidene diphenyl ether, acrylated benzophenone, bis (η 5 -2,4-cyclopentadien-1-yl) -bis (2,6-difluoro-3- (1H-pyrrole-1-yl) -phenyl) titanium, o-methylbenzylidenebenzene Formates, p-dimethylaminobenzoic acid ethyl ester, p-dimethylaminobenzoic acid isoamylethyl ester, active tertiary amines, carbazole · benzophenone-based photoreaction initiators, acridine-based Light reaction initiation Agents, triazine-based photoreactive initiators, benzamidine-based photoreactive initiators, and the like.

(C)光反應起始劑係以選自由1-羥基-環己基-苯基-酮及2,4,6-三甲基苯甲醯基苯基乙氧基氧化膦之所成之群之1種以上為較佳。 (C) The photoreaction initiator is selected from the group consisting of 1-hydroxy-cyclohexyl-phenyl-one and 2,4,6-trimethylbenzylphenylethoxyphosphine oxide. One or more kinds are preferable.

(C)光反應起始劑可為1種,或亦可併用2種以上。 (C) The photoreaction initiator may be one type, or two or more types may be used in combination.

(C)光反應起始劑,相對於(A)寡聚物100質量份,以0.1~20質量份為較佳,又較佳為0.5~15質量份,更佳為1~10質量份。 (C) The photoreaction initiator is preferably 0.1 to 20 parts by mass relative to 100 parts by mass of the oligomer (A), more preferably 0.5 to 15 parts by mass, and even more preferably 1 to 10 parts by mass.

<(D)軟化點為70~150℃的賦黏劑> <(D) Adhesive with softening point of 70 ~ 150 ℃>

光硬化型接著組成物係包含(D)軟化點為70~150℃的賦黏劑(以下亦稱為「(D)賦黏劑」)。藉由光硬化型接著組成物包含(D)賦黏劑,接著強度之提昇,同時將可使硬化物之柔軟化,可提昇對被著體之追循性。 The light-curing type adhesive composition system includes (D) an adhesion promoter having a softening point of 70 to 150 ° C (hereinafter also referred to as "(D) adhesion promoter"). The light-curing type adhesive composition contains (D) a tackifier, and then the strength is improved. At the same time, the hardened material can be softened and the followability to the adherend can be improved.

(D)賦黏劑之軟化點,就接著強度與柔軟性之觀點而言,以75~130℃為較佳,又較佳為80~120℃。軟化點係藉由環球法所測定之值。 (D) The softening point of the tackifier is preferably 75 to 130 ° C, and more preferably 80 to 120 ° C from the viewpoints of adhesion strength and flexibility. The softening point is a value measured by the ring and ball method.

只要是滿足上述之軟化點未特別限定,(D)賦黏劑係可舉例不均化松香酯、聚合松香酯、(氫化)松香酯等的松香酯系樹脂;丙烯酸聚合物、丙烯酸共聚物等的丙烯酸系樹脂;聚矽氧系樹脂;萜烯樹脂、萜烯酚樹脂、改質萜烯樹脂、氫化萜烯樹脂等的萜烯系樹脂;熱可塑性彈性物;石油樹脂;脂環族飽和烴基樹脂;松香酚等的松香系樹脂;二甲苯樹脂等。 As long as it satisfies the above-mentioned softening point, the (D) tackifier is exemplified by rosin ester resins such as heterogeneous rosin esters, polymerized rosin esters, (hydrogenated) rosin esters; acrylic polymers, acrylic copolymers, etc. Acrylic resins; polysiloxane resins; terpene resins such as terpene resins, terpene phenol resins, modified terpene resins, and hydrogenated terpene resins; thermoplastic elastomers; petroleum resins; alicyclic saturated hydrocarbon groups Resin; rosin-based resins such as rosin phenol; xylene resins.

(D)賦黏劑係以松香酯系樹脂為較佳,氫化松香酯為又較佳。松香酯系樹脂由於松香的羧酸部分進行酯化,可抑制因酸成分而對被著體(例如,觸控面板的配線部等)之影響。更,氫化松香酯由於松香進行氫化,亦可防止於初期及暴露於熱之際的著色。(D)賦黏劑可為1種,或亦可併用2種以上。 (D) A rosin ester resin is more preferable as a tackifier, and hydrogenated rosin ester is more preferable. The rosin ester resin is esterified with the carboxylic acid portion of the rosin, which can suppress the influence of the acid component on the adherend (for example, the wiring portion of the touch panel). In addition, hydrogenated rosin ester can prevent the coloring at the initial stage and when exposed to heat due to the hydrogenation of rosin. (D) One type of tackifier may be used, or two or more types may be used in combination.

(D)賦黏劑的量係於光硬化型接著組成物100質量%中可為5~70質量%。只要在該範圍內即可,反應成分的量為適當從而可得到良好的皮膜性,同時對於接著強度的展現效果亦為有利。賦黏劑係於光硬化型接著組成物100質量%中,以10~60質量%為較佳,15~50質量%為又較佳。 (D) The amount of the tackifier may be 5 to 70% by mass based on 100% by mass of the photocurable adhesive composition. As long as it is within this range, the amount of the reaction component is appropriate so that good film properties can be obtained, and at the same time, the effect of exhibiting the adhesive strength is also advantageous. The tackifier is based on 100% by mass of the light-curing type adhesive composition, preferably 10 to 60% by mass, and more preferably 15 to 50% by mass.

<(E)液狀可塑劑> <(E) Liquid plasticizer>

光硬化型接著組成物係包含(E)液狀可塑劑。所謂液狀係大氣壓下在25℃所展現的流動性,可舉例如使用圓錐-平板式黏度計(Cone-and-plate viscometer),顯示1,000Pa‧s以下的黏度(例如,0.01~1,000Pa‧s的黏度)。藉由光硬化型接著組成物包含(E)液狀可塑劑,可得到彈性率小、且柔軟的硬化物。 The photocuring type adhesive composition system contains (E) a liquid plasticizer. The so-called fluidity exhibited at 25 ° C under the atmospheric pressure of a liquid system can be, for example, a cone-and-plate viscometer to display a viscosity of 1,000 Pa · s or less (for example, 0.01 to 1,000 Pa‧ s viscosity). When the light-curing type adhesive composition contains (E) a liquid plasticizer, a cured product having a small elastic modulus and a softness can be obtained.

作為(E)液狀可塑劑,可舉例鄰苯二甲酸二丁酯、鄰苯二甲酸二異壬酯、鄰苯二甲酸二庚酯、鄰苯二甲酸二(2-乙基己基)酯、鄰苯二甲酸二異癸酯、鄰苯二甲酸丁苄酯等的鄰苯二甲酸酯;己二酸二辛酯、己二酸二異壬 酯、癸二酸二辛酯、癸二酸二異壬酯、1,2-環己烷二羧酸二異壬酯等的多元羧酸烷基酯(例如,多元羧酸的C3~C12烷基酯等);磷酸三甲苯酯、磷酸三丁酯等的磷酸酯;偏苯三甲酸酯;三乙二醇雙(2-乙基己酸酯)等的聚氧烷二醇的烷基酯(例如,二、三或四乙二醇的C3~C12烷基酯等);橡膠系聚合物、橡膠系共聚合物(例如,聚異戊二烯、聚丁二烯或聚丁烯、或該等氫化物、於該等於兩末端中導入羥基的衍生物或於該等氫化物之兩末端中導入羥基的衍生物等);熱可塑性彈性物;石油樹脂;脂環族飽和烴基樹脂;萜烯樹脂、萜烯酚樹脂、改質萜烯樹脂、氫化萜烯樹脂等的萜烯系樹脂;松香酚等的松香系樹脂;不均化松香酯系樹脂、聚合松香酯系樹脂、(氫化)松香酯系樹脂等的松香酯系樹脂;二甲苯樹脂等;丙烯酸聚合物、丙烯酸共聚物等的丙烯酸系樹脂。該等可為液狀。 Examples of the (E) liquid plasticizer include dibutyl phthalate, diisononyl phthalate, diheptyl phthalate, bis (2-ethylhexyl) phthalate, Phthalate such as diisodecyl phthalate, butyl benzyl phthalate; dioctyl adipate, diisononyl adipate Alkyl esters of polycarboxylic acids such as esters, dioctyl sebacate, diisononyl sebacate, diisononyl 1,2-cyclohexanedicarboxylic acid (e.g., C3 to C12 alkanes of polycarboxylic acids) Esters, etc.); Phosphate esters such as tricresyl phosphate, tributyl phosphate; trimellitate; alkyl esters of polyoxyalkylene glycols such as triethylene glycol bis (2-ethylhexanoate) (For example, C3 to C12 alkyl esters of di-, tri-, or tetraethylene glycol, etc.); rubber-based polymers, rubber-based copolymers (for example, polyisoprene, polybutadiene, or polybutene, or The hydrides, derivatives with hydroxyl groups introduced into the two ends or derivatives with hydroxyl groups introduced into both ends of the hydrides, etc.); thermoplastic elastomers; petroleum resins; alicyclic saturated hydrocarbon-based resins; terpenes Terpene resins such as olefin resins, terpene phenol resins, modified terpene resins, and hydrogenated terpene resins; rosin resins such as rosin phenol; heterogeneous rosin ester resins, polymerized rosin ester resins, (hydrogenated) Rosin ester resins such as rosin ester resins; xylene resins; etc .; acrylic resins such as acrylic polymers and acrylic copolymers. These may be liquid.

作為(E)液狀可塑劑係以松香酯系樹脂(但,可為液狀)為較佳,以氫化松香酯(但,可為液狀)為較佳。(E)液狀可塑劑可為1種,或亦可併用2種以上。 As the liquid plasticizer (E), a rosin ester resin (but may be a liquid) is preferred, and a hydrogenated rosin ester (but may be a liquid) is more preferred. (E) The liquid plasticizer may be used alone or in combination of two or more.

就藉由(D)賦黏劑從而展現出強度之觀點而言,相對於(D)賦黏劑100質量份,(E)液狀可塑劑可設為300質量份以下的量。就接著強度與柔軟性之觀點而言,以10~250質量份為較佳,又較佳為30~200質量份,更佳為50~150質量份。 From the viewpoint of exhibiting strength by the (D) tackifier, the (E) liquid plasticizer can be used in an amount of 300 parts by mass or less with respect to 100 parts by mass of the (D) tackifier. From the viewpoint of adhesion strength and flexibility, 10 to 250 parts by mass is preferable, 30 to 200 parts by mass is more preferable, and 50 to 150 parts by mass is more preferable.

<進一步的成分> <Further ingredients>

於光硬化型接著組成物中,在不損及本發明之效果的範圍內,可調配接著賦予劑、抗氧化劑、消泡劑、顏料、填充劑、鏈鎖轉移劑、光穩定劑、表面張力調整劑、調平劑、紫外線吸收劑、抑泡劑等。進一步的成分可為1種,或亦可併用2種以上。進一步的成分的總含有量,相對於(A)寡聚物100質量份,以0.01~15質量份為較佳,又較佳為0.1~10質量份,更佳為1~5質量份。 In the light-curing type adhesive composition, an adhesion-imparting agent, an antioxidant, an antifoaming agent, a pigment, a filler, a chain transfer agent, a light stabilizer, and a surface tension can be adjusted within a range that does not impair the effect of the present invention. Adjusting agent, leveling agent, ultraviolet absorber, foam suppressant, etc. Further components may be 1 type, or 2 or more types may be used together. The total content of the further components is preferably 0.01 to 15 parts by mass relative to 100 parts by mass of the (A) oligomer, more preferably 0.1 to 10 parts by mass, and even more preferably 1 to 5 parts by mass.

<光硬化型接著組成物之調製方法> <Method for preparing light-curable adhesive composition>

光硬化型接著組成物係可藉由混合各成分來進行調製。混合之方法未特別限定,可使用各種金屬、塑膠容器、攪拌翼、攪拌機。 The photocuring type adhesive composition system can be prepared by mixing the components. The method of mixing is not particularly limited, and various metals, plastic containers, stirring wings, and mixers can be used.

<光硬化型接著組成物之用途> <Application of Photocurable Adhesive Composition>

光硬化型接著組成物係可使用於貼合任意的基材1及任意的基材2之用途。基材1及基材2係可為相同的基材、或亦可為相異的基材。基材1及基材2之至少一者可為光透過性構件。據此,從光透過性構件側對光硬化型接著組成物照射能量線(例如紫外線)而可形成硬化樹脂層。作為光透過性構件,可舉例玻璃、(甲基)丙烯酸樹脂、聚對苯二甲酸乙二酯、聚萘二甲酸乙二酯、聚碳酸酯、聚醯亞胺、聚酯、環烯烴聚合物等。 The light-curable adhesive composition can be used for bonding any substrate 1 and any substrate 2. The substrate 1 and the substrate 2 may be the same substrate or different substrates. At least one of the substrate 1 and the substrate 2 may be a light-transmitting member. Accordingly, the light-curable adhesive composition is irradiated with energy rays (for example, ultraviolet rays) from the light-transmitting member side to form a cured resin layer. Examples of the light-transmitting member include glass, (meth) acrylic resin, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyester, and cycloolefin polymer. Wait.

光硬化型接著組成物係以貼合顯示體與觸控面板、顯示體與前面板、或觸控面板與前面板之用途為較 佳。使用光硬化型接著組成物,藉由使顯示體與觸控面板、顯示體與前面板、或觸控面板與前面板貼合可得到光學顯示體。 The light-curing type adhesive composition is more suitable for bonding display body and touch panel, display body and front panel, or touch panel and front panel. good. An optical display can be obtained by using a light-curing type adhesive composition and bonding a display and a touch panel, a display and a front panel, or a touch panel and a front panel.

作為前面板,可舉例玻璃或工程塑料、例如壓克力板(單面或兩面進行硬質塗佈處理或AR塗佈處理皆可)、聚碳酸酯板、PET板、PEN板等的透明塑膠板。亦可將前面板作成為保護面板。作為觸控面板,可舉例電阻膜式、靜電容量式、電磁感應式、或光學式的觸控面板。作為顯示體,可舉例LCD、EL顯示器、EL照明、電子紙、及電漿顯示器等。前面板、觸控面板、及顯示體係可具有段差、或亦可具有遮光部。在此,所謂遮光部係指沒有對在接著面上所塗布的光硬化型接著組成物照射硬化時所需要的能量線(例如紫外線)之部分之意。 Examples of the front panel include glass or engineering plastics, such as acrylic panels (either hard-coated or AR-coated on one or both sides), transparent plastic plates such as polycarbonate plates, PET plates, and PEN plates. . The front panel can also be used as a protective panel. Examples of the touch panel include a resistive film type, an electrostatic capacity type, an electromagnetic induction type, and an optical type touch panel. Examples of the display body include LCD, EL display, EL lighting, electronic paper, and plasma display. The front panel, the touch panel, and the display system may have a step, or may have a light shielding portion. Here, the light-shielding portion means a portion that does not irradiate the light-curing type adhesive composition applied on the adhesive surface with energy rays (for example, ultraviolet rays) required for curing.

(層合體) (Laminate)

藉由以光硬化型接著組成物來作貼合所得之層合體亦為本發明之對象。具體而言,層合體係藉由將任意的基材1及任意的基材2以光硬化型接著組成物來作貼合而得到。層合體之製造方法未特別限定,但以後述之層合體之製造方法為較佳。又,藉由以光硬化型接著組成物來作貼合所得之層合體,係以光學顯示體為較佳。 A laminated body obtained by laminating a light-curable adhesive composition is also an object of the present invention. Specifically, the laminated system is obtained by bonding arbitrary base materials 1 and arbitrary base materials 2 with a photocurable adhesive composition. The manufacturing method of a laminated body is not specifically limited, The manufacturing method of the laminated body mentioned later is preferable. In addition, it is preferable to use an optical display as the laminated body obtained by bonding with a photocurable adhesive composition.

(層合體之製造方法) (Manufacturing method of laminated body)

層合體之製造方法係基材1與基材2,為介隔著光硬 化型接著組成物之硬化物而所層合的層合體之製造方法,且含有下述步驟(I)~(III):(I)將光硬化型接著組成物適用於基材1,來形成光硬化型接著組成物層之步驟;(II)對步驟(I)所得之光硬化型接著組成物層照射能量線,來形成光硬化型接著組成物之硬化物之步驟;及(III)將基材2貼合於步驟(II)所得之硬化物之上之步驟。 The manufacturing method of the laminated body is the base material 1 and the base material 2. A method for producing a laminated body formed by laminating a hardened product of a composition and a composition, and including the following steps (I) to (III): (I) applying a photocurable adhesive composition to the substrate 1 to form (Ii) a step of irradiating the light-curable adhesive composition layer obtained in step (I) with energy rays to form a light-curable adhesive composition hardened product; and (III) applying The step of bonding the base material 2 to the cured product obtained in the step (II).

於層合體之製造方法中,光硬化型接著組成物、基材1及基材2係包含較佳的方式,如同上述般。因此,層合體之製造方法係以光學顯示體之製造方法為較佳。又,藉由層合體之製造方法所得之層合體係以光學顯示體為較佳。 In the method for manufacturing a laminated body, the photocurable adhesive composition, the base material 1 and the base material 2 include a preferable method, as described above. Therefore, the manufacturing method of the laminated body is preferably the manufacturing method of the optical display. Moreover, it is preferable that the laminated system obtained by the manufacturing method of a laminated body is an optical display body.

<步驟(I)> <Step (I)>

步驟(I)係光硬化型接著組成物適用於基材1,來形成光硬化型接著組成物層之步驟。 Step (I) is a step of applying a photocurable adhesive composition to the substrate 1 to form a photocurable adhesive composition layer.

光硬化型接著組成物適用於基材1之方法未特別限定,可利用藉由模塗布機、分注器、網版印刷等之方法。光硬化型接著組成物層的厚度未特別限定,可設為例如10~500μm,以30~350μm為較佳。 The method of applying the photocurable adhesive composition to the substrate 1 is not particularly limited, and a method such as a die coater, a dispenser, and screen printing can be used. The thickness of the photocuring type adhesive composition layer is not particularly limited, and may be, for example, 10 to 500 μm, and more preferably 30 to 350 μm.

<步驟(II)> <Step (II)>

步驟(II)係對步驟(I)所得之光硬化型接著組成物層照 射能量線,來形成光硬化型接著組成物之硬化物之步驟。 Step (II) is a photo-curing type adhesive composition layer obtained in step (I). A step of radiating energy rays to form a light-curing type cured composition.

能量線未特別限定,可使用可視光線、紫外線、X線、電子線等的活性能量線。能量線係以紫外線為較佳。作為紫外線的光源係可使用發出紫外線(UV)的光源。作為紫外線的光源,可舉例如金屬鹵素燈、高壓水銀燈、氙氣燈、水銀氙氣燈、鹵素燈、脈衝氙氣燈、LED等。LED的波峰波長未特別限定,可舉例365nm、405nm、375nm、385nm及395nm。從LED以外的光源所發出的光係可藉由通過光學濾波器來調整成特定波長的光。具體而言,藉由通過遮斷300nm以下波長的光的光學濾波器及/或遮斷500nm以上的波長的光的光學濾波器可來作調整。 The energy ray is not particularly limited, and active energy rays such as visible light rays, ultraviolet rays, X-rays, and electron rays can be used. The energy ray is preferably ultraviolet. As the ultraviolet light source, a light source emitting ultraviolet (UV) light can be used. Examples of the ultraviolet light source include metal halogen lamps, high-pressure mercury lamps, xenon lamps, mercury xenon lamps, halogen lamps, pulsed xenon lamps, and LEDs. The peak wavelength of the LED is not particularly limited, and examples thereof include 365 nm, 405 nm, 375 nm, 385 nm, and 395 nm. The light emitted from a light source other than the LED can be adjusted to light of a specific wavelength by passing through an optical filter. Specifically, adjustment can be performed by an optical filter that blocks light having a wavelength of 300 nm or less and / or an optical filter that blocks light having a wavelength of 500 nm or more.

能量線的照射係以能量線的累積光量成為30~15,000mJ/cm2之方式可來進行照射。累積光量係以50~12,000mJ/cm2為較佳,100~10,000mJ/cm2為又較佳。 The irradiation of the energy ray can be performed so that the accumulated light amount of the energy ray becomes 30 to 15,000 mJ / cm 2 . The accumulated light amount is preferably 50 to 12,000 mJ / cm 2 , and 100 to 10,000 mJ / cm 2 is more preferable.

於步驟(II)中,從光硬化型接著組成物側來照射能量線,從而可形成硬化樹脂層。在此,當基材1為光透過性構件之情形時,能量線亦可從光透過性構件側對光硬化型接著組成物進行照射來形成硬化樹脂層。 In step (II), energy rays are irradiated from the light-curing type to the composition side to form a cured resin layer. Here, when the substrate 1 is a light-transmitting member, the energy ray may irradiate the light-curable adhesive composition from the light-transmitting member side to form a cured resin layer.

於步驟(II)所形成的硬化物中的光硬化型接著組成物之反應率未特別限定,以90%以上為較佳。當反應率為90%以上時,即使於貼合後沒有進行更進一步的照射,由於展現充分的強度故可使步驟簡略化。又,不用擔心因為沒有硬化而殘留的光硬化型接著組成物所造成對其 他構件之滲透或損壞、來自硬化物的滲出,故將亦可適用於在層合體上設置有不透光的遮光層之情形、或完全不透光的基材之貼合。反應率係由能量線(例如紫外線)照射前後的光硬化型接著組成物中的(甲基)丙烯醯基之減少率來定義,可藉由FT-IR來進行測定。尚,將光硬化型接著組成物中的(甲基)丙烯醯基為全部反應之情形設為100%。 The reaction rate of the photocurable adhesive composition in the hardened material formed in step (II) is not particularly limited, but it is preferably 90% or more. When the reaction rate is 90% or more, even if no further irradiation is performed after bonding, the steps can be simplified because they exhibit sufficient strength. In addition, there is no need to worry about the photo-curing type adhesive composition remaining because it is not cured. The permeation or damage of other components, and the exudation from hardened materials, can also be applied to the case where a light-shielding light-shielding layer is provided on the laminate, or the lamination of completely opaque substrates. The reaction rate is defined by the reduction rate of the (meth) acrylfluorenyl group in the photocurable adhesive composition before and after irradiation with energy rays (for example, ultraviolet rays), and can be measured by FT-IR. In the case where the (meth) acrylfluorenyl group in the photocuring type adhesive composition is completely reacted, it is set to 100%.

<步驟(III)> <Step (III)>

步驟(III)係將基材2貼合於步驟(II)所得之硬化物之上從而可得到層合體之步驟。於形成硬化物的基板1之上,以與硬化物相接之方式來載置基板2,並可貼合基板1與基板2。基材2係於步驟(I)中所沒有應用光硬化型接著組成物的基材。 Step (III) is a step of laminating the base material 2 on the hardened material obtained in step (II) to obtain a laminate. The substrate 2 is placed on the substrate 1 on which the cured object is formed, and the substrate 1 and the substrate 2 can be bonded together. The substrate 2 is a substrate to which a photocurable adhesive composition is not applied in step (I).

層合體之製造方法係亦可包含加壓處理由基材1、基材2及該等之間的光硬化型接著組成物之硬化物所構成之貼合體之步驟。層合體之製造方法係藉由包含加壓處理,從而使層合體之接著強度更加提昇。加壓處理係可使用橡膠輥、平板壓製裝置等來進行。 The manufacturing method of a laminated body may include the process of pressurizing the bonded body which consists of the base material 1, the base material 2, and the hardened | cured material of the photocuring type adhesive composition among these. The manufacturing method of the laminated body is to improve the bonding strength of the laminated body by including pressure treatment. The pressure treatment can be performed using a rubber roller, a plate press, or the like.

[實施例] [Example]

以下,藉由實施例及比較例更進而詳細地說明本發明。本發明並不受這些實施例的限定。只要没有特别地說明表示係質量份、質量%。 Hereinafter, the present invention will be described in more detail using examples and comparative examples. The invention is not limited by these examples. As long as there is no special description, it means mass parts and mass%.

均勻地混合表1所表示之調配的各成分,來 調製實施例‧比較例之光硬化型接著組成物。在此,聚丁二烯胺基甲酸酯丙烯酸酯A~F係依據下述合成例1~6來製造。 Mix the ingredients shown in Table 1 evenly. A light-curing type adhesive composition of Example ‧ Comparative Example was prepared. Here, polybutadiene urethane acrylates A to F are produced according to the following Synthesis Examples 1 to 6.

合成例1(聚丁二烯胺基甲酸酯丙烯酸酯A之製造) Synthesis example 1 (manufacturing of polybutadiene urethane acrylate A)

於具備有溫度計、攪拌器、滴入漏斗、附有乾燥管的冷卻管的四頸燒瓶中,放入兩末端羥基氫化聚丁二烯(GI-3000、日本曹達股份有限公司製、數平均分子量3,000、碘價21、羥基價25~35mgKOH/g)300g(將羥基價作為30mgKOH進行計算的分子量:0.080莫耳)、作為聚合抑制之p-甲氧基苯酚0.1g、作為錫觸媒之二月桂酸二丁基錫(dibutyltin dilaurate)(東京Fine化學公司製、L101)0.1g。昇溫至80℃後,花費1小時均勻滴入異佛酮二異氰酸酯(Desmodur I、住化Bayer Urethane公司製)30.2g(0.136莫耳)。滴入結束後,以80℃進行3小時反應。之後,追加丙烯酸4-羥基丁酯(4-HBA、日本化成股份有限公司製)11.5g(0.080莫耳)。以80℃進行4小時反應後,藉由FT-IR確認在異氰酸酯的吸收波長(2270nm)的吸收已消失並結束反應,可得到具有將氫化聚丁二烯與異佛酮二異氰酸酯作為重覆單位、且在末端具有聚合性不飽和鍵結的平均官能基數2的聚胺基甲酸酯丙烯酸酯寡聚物。所得之氫化聚丁二烯骨架聚胺基甲酸酯丙烯酸酯之重量平均分子量係12,000。尚,重量平均分子量係藉由GPC進行測定,並使用標準聚苯乙烯的檢測線所換算之值。 A four-necked flask equipped with a thermometer, a stirrer, a dropping funnel, and a cooling tube with a drying tube was charged with hydroxyhydrogenated polybutadiene (GI-3000, manufactured by Japan Soda Co., Ltd., and number average molecular weight) at both ends. 3,000, iodine value 21, hydroxyl value 25-35 mgKOH / g) 300 g (molecular weight calculated by using hydroxyl value as 30 mg KOH: 0.080 mole), 0.1 g of p-methoxyphenol as polymerization inhibitor, and tin catalyst 2 0.1 g of dibutyltin dilaurate (L101, manufactured by Tokyo Fine Chemicals). After raising the temperature to 80 ° C., 30.2 g (0.136 mol) of isophorone diisocyanate (Desmodur I, manufactured by Sumika Bayer Urethane Co., Ltd.) was dropped uniformly over 1 hour. After completion of the dropwise addition, a reaction was performed at 80 ° C for 3 hours. Thereafter, 11.5 g (0.080 mol) of 4-hydroxybutyl acrylate (4-HBA, manufactured by Nippon Kasei Co., Ltd.) was added. After carrying out the reaction at 80 ° C for 4 hours, it was confirmed by FT-IR that the absorption at the isocyanate absorption wavelength (2270 nm) had disappeared and the reaction was completed. Thus, hydrogenated polybutadiene and isophorone diisocyanate were obtained as a repeating unit Polyurethane acrylate oligomer having an average number of functional groups of 2 having a polymerizable unsaturated bond at the terminal. The weight average molecular weight of the obtained hydrogenated polybutadiene skeleton polyurethane acrylate was 12,000. The weight average molecular weight is a value measured by GPC and converted using a standard polystyrene detection line.

合成例2(聚丁二烯胺基甲酸酯丙烯酸酯B之製造) Synthesis example 2 (manufacturing of polybutadiene urethane acrylate B)

除了將異佛酮二異氰酸酯的量設為26.7g(0.120莫耳)以外,與合成例1以相同之方式,可得到平均官能基數為2、且重量平均分子量為26,000的聚胺基甲酸酯丙烯酸酯寡聚物。 A polyurethane having an average number of functional groups of 2 and a weight average molecular weight of 26,000 was obtained in the same manner as in Synthesis Example 1 except that the amount of isophorone diisocyanate was set to 26.7 g (0.120 mol). Acrylate oligomers.

合成例3(聚丁二烯胺基甲酸酯丙烯酸酯C之製造) Synthesis example 3 (manufacturing of polybutadiene urethane acrylate C)

除了將異佛酮二異氰酸酯的量設為23.1g(0.104莫耳)以外,與合成例1以相同之方式,可得到平均官能基數為2、且重量平均分子量為43,000的聚胺基甲酸酯丙烯酸酯寡聚物。 A polyurethane having an average number of functional groups of 2 and a weight average molecular weight of 43,000 was obtained in the same manner as in Synthesis Example 1 except that the amount of isophorone diisocyanate was set to 23.1 g (0.104 mol). Acrylate oligomers.

合成例4(聚丁二烯胺基甲酸酯丙烯酸酯D之製造) Synthesis example 4 (manufacturing of polybutadiene urethane acrylate D)

除了將甲基丙烯酸2-羥基-3-丙烯醯氧基丙酯(NK ester701A、新中村化學公司製)設為17.1g(0.080莫耳)並替代丙烯酸4-羥基丁酯以外,與合成例2以相同之方式,可得到平均官能基數為4、且重量平均分子量為24,000的聚胺基甲酸酯丙烯酸酯寡聚物。 The same procedure as in Synthesis Example 2 was carried out except that 2-hydroxy-3-propenyloxypropyl methacrylate (NK ester701A, manufactured by Shin Nakamura Chemical Co., Ltd.) was changed to 17.1 g (0.080 mol) in place of 4-hydroxybutyl acrylate. In the same manner, a polyurethane oligomer having an average number of functional groups of 4 and a weight average molecular weight of 24,000 can be obtained.

合成例5(聚丁二烯胺基甲酸酯丙烯酸酯E之製造) Synthesis example 5 (manufacturing of polybutadiene urethane acrylate E)

除了將異佛酮二異氰酸酯的量設為24.9g(0.112莫耳)以外,與合成例4以相同之方式,可得到平均官能基數為4、且重量平均分子量為36,000的聚胺基甲酸酯丙烯酸酯 寡聚物。 A polyurethane having an average number of functional groups of 4 and a weight average molecular weight of 36,000 was obtained in the same manner as in Synthesis Example 4 except that the amount of isophorone diisocyanate was set to 24.9 g (0.112 mol). Acrylate Oligomer.

合成例6(聚丁二烯胺基甲酸酯丙烯酸酯F之製造) Synthesis example 6 (manufacturing of polybutadiene urethane acrylate F)

除了將異佛酮二異氰酸酯的量設為23.1g(0.104莫耳)以外,與合成例4以相同之方式,可得到平均官能基數為4、且重量平均分子量為42,000的聚胺基甲酸酯丙烯酸酯寡聚物。 A polyurethane having an average number of functional groups of 4 and a weight average molecular weight of 42,000 was obtained in the same manner as in Synthesis Example 4 except that the amount of isophorone diisocyanate was 23.1 g (0.104 mole). Acrylate oligomers.

使用所得之實施例‧比較例之光硬化型接著組成物,以如下述般之方式來測定特性。 Using the obtained photocurable adhesive composition of Example ‧ Comparative Example, the characteristics were measured in the following manner.

<彈性率> <Elasticity>

彈性率係依據JISZ1702來製作No.3啞鈴型試片(厚度1mmt),使用拉伸壓縮試驗機(Minebea製、Techno graph TG-2kN),藉以10mm/min的速度來進行測定。尚,啞鈴型試片係使用傳送帶型金屬鹵素燈(Eye Graphics公司製、200mW/cm2),由以6,000mJ/cm2使光硬化型接著組成物硬化的硬化物來進行製作。 The elastic modulus was measured according to JIS Z1702 to produce a No. 3 dumbbell-shaped test piece (thickness: 1 mmt) using a tensile compression tester (manufactured by Minebea, Techno graph TG-2kN) at a speed of 10 mm / min. The dumbbell-shaped test piece was produced using a conveyor-type metal halide lamp (200 mW / cm 2 manufactured by Eye Graphics Co., Ltd.) and a hardened product obtained by hardening a photocurable adhesive composition at 6,000 mJ / cm 2 .

<OPEN強度及CLOSE強度> <OPEN intensity and CLOSE intensity>

可得到如下述般的OPEN強度及CLOSE強度之測定試片。 Test pieces for measuring OPEN intensity and CLOSE intensity can be obtained as described below.

<<OPEN硬化之強度測定試片>> << OPEN Hardening Test Pieces >>

以光硬化型接著組成物的塗布部分成為寬20mm之方 式,於基材1(26mm×75mm×1.1mmt、玻璃),使用3片賽珞凡膠帶(50μ mt)來黏貼已製作的150μ mt厚度的間隔物,並使用金屬刮板塗布光硬化型接著組成物來形成光硬化型接著組成物層後,藉由傳送帶型金屬鹵素燈(Eye Graphics公司製、200mW/cm2),以3,000mJ/cm2從光硬化型接著組成物層側照射光後形成光硬化型接著組成物之硬化物。將基材3(26mm×150mm×0.1mmt、PET)載置於光硬化型接著組成物之硬化物上、且接合,可得到OPEN硬化之強度測定試片。 The thickness of the coated part of the light-curable adhesive composition was 20 mm. On the substrate 1 (26 mm x 75 mm x 1.1 mmt, glass), three pieces of Saifan tape (50 μ mt) were used to adhere the 150 μ mt thickness. After forming a photocurable adhesive composition layer using a metal blade to coat the photocurable adhesive composition with a metal blade, a conveyor-type metal halide lamp (Eye Graphics, 200mW / cm 2 ) was used at 3,000mJ / cm 2 is irradiated with light from the light-curing type adhesive composition layer side to form a cured product of the light-curing type adhesive composition. The substrate 3 (26 mm × 150 mm × 0.1 mmt, PET) was placed on the cured product of the photocurable adhesive composition and joined to obtain an OPEN-cured strength measurement test piece.

<<CLOSE硬化之強度測定試片>> << CLOSE Hardened Strength Test Piece >>

以光硬化型接著組成物的塗布部分成為寬20mm之方式,於基材1(26mm×75mm×1.1mmt、玻璃)上,使用3片賽珞凡膠帶(50μ mt)來黏貼已製作的150μ mt厚度的間隔物,並使用金屬刮板塗布光硬化型接著組成物來形成光硬化型接著組成物層後,將基材2(26mm×75mm×0.05mmt、離型PET)載置於光硬化型接著組成物層上、且接合後,藉由傳送帶型金屬鹵素燈(Eye Graphics公司製、200mW/cm2),以3,000mJ/cm2透過基材1來照射光後形成光硬化型接著組成物之硬化物。將基材2剝離,並將基材3(26mm×150mm×0.1mmt、PET)載置於已剝離基材2的面上、且接合,可得到CLOSE硬化之強度測定試片。 The coated part of the light-curing type adhesive composition was 20 mm wide. On the substrate 1 (26 mm × 75 mm × 1.1 mmt, glass), three pieces of Saifan tape (50 μ mt) were used to stick the produced 150 μ mt. Thickness of the spacer, and coating the light-curable adhesive composition with a metal blade to form a light-curable adhesive composition layer, and then placing the substrate 2 (26 mm × 75 mm × 0.05 mmt, release PET) on the light-curable adhesive Next, on the composition layer and after bonding, it was irradiated with light through a substrate 1 at 3,000 mJ / cm 2 by a conveyor-type metal halide lamp (200 mW / cm 2 manufactured by Eye Graphics) to form a light-curing adhesive composition. Of hardened. The base material 2 was peeled, and the base material 3 (26 mm × 150 mm × 0.1 mmt, PET) was placed on the surface of the peeled base material 2 and bonded to obtain a CLOSE-hardened strength measurement test piece.

<<OPEN強度及CLOSE強度之測定>> << Determination of OPEN intensity and CLOSE intensity >>

OPEN強度及CLOSE強度係使用拉伸壓縮試驗機(Minebea製、Techno graph TG-2kN)藉以300mm/min的速度來進行測定。 The OPEN strength and CLOSE strength were measured at a speed of 300 mm / min using a tensile compression tester (manufactured by Minebea, Techno graph TG-2kN).

<強度變化率> <Intensity change rate>

可求出上述之OPEN強度及CLOSE強度之強度變化率。強度變化率若為20%以下時評估為「○」,若超過20%時評估為「×」。 The intensity change rate of the above OPEN intensity and CLOSE intensity can be obtained. When the intensity change rate is 20% or less, it is evaluated as "○", and when it exceeds 20%, it is evaluated as "X".

<反應率> <Response rate>

於光硬化型接著組成物之硬化物中,光硬化型接著組成物之反應率係作為光硬化型接著組成物之能量線照射前後的丙烯醯基之減少率,藉由FT-IR(Perkin ELmer公司製、Spectrum100)來進行測定。減少率係藉由下述數式(1)並代入從能量線照射前的光硬化型接著組成物層的FT-IR測定圖譜中的基線起800~820cm-1的吸收波峰高度(X),與從能量線照射後的光硬化型接著組成物之硬化物的FT-IR測定圖譜中的基線起800~820cm-1的吸收波峰高度(Y)而可求出。 In the cured product of the photocurable adhesive composition, the reaction rate of the photocurable adhesive composition is the reduction rate of the acryl fluorenyl group before and after the energy rays of the photocurable adhesive composition are irradiated. By FT-IR (Perkin ELmer Company, Spectrum 100). The reduction rate is obtained by substituting the following formula (1) into the absorption peak height (X) of 800 to 820 cm -1 from the baseline in the FT-IR measurement pattern of the photocurable type composition layer before energy ray irradiation, It can be obtained from the absorption peak height (Y) of 800 to 820 cm -1 from the baseline in the FT-IR measurement pattern of the light-cured adhesive composition hardened product after irradiation with energy rays.

反應率(%)={(X-Y)/X}×100‧‧‧(1) Response rate (%) = ((X-Y) / X) × 100‧‧‧ (1)

<<OPEN硬化之硬化率之測定>> << Determination of hardening rate of OPEN hardening >>

以光硬化型接著組成物的塗布部分成為寬20mm之方式,於基材1(26mm×75mm×1.1mmt、玻璃)上,使用3片賽珞凡膠帶(50μ mt)來黏貼已製作的150μ mt厚度的間隔物,並使用金屬刮板塗布光硬化型接著組成物來形成光硬化型接著組成物層後,藉由傳送帶型金屬鹵素燈(Eye Graphics公司製、200mW/cm2),以3,000mJ/cm2從光硬化型接著組成物層側照射光後形成光硬化型接著組成物之硬化物。將基材3(26mm×150mm×0.1mmt、PET)載置於光硬化型接著組成物之硬化物上、且接合,可得到OPEN硬化之強度測定試片。對於OPEN硬化之強度測定試片中的光硬化型接著組成物之硬化物,測定光硬化型接著組成物之反應率。 The coated part of the light-curing type adhesive composition was 20 mm wide. On the substrate 1 (26 mm × 75 mm × 1.1 mmt, glass), three pieces of Saifan tape (50 μ mt) were used to stick the produced 150 μ mt. Thickness of the spacer, and coating the light-curable adhesive composition with a metal blade to form a light-curable adhesive composition layer, and then a conveyor-type metal halide lamp (Eye Graphics, 200mW / cm 2 ) was used at 3,000mJ / cm 2 The light-curable adhesive composition is cured by irradiating light from the side of the photo-curable adhesive composition layer. The substrate 3 (26 mm × 150 mm × 0.1 mmt, PET) was placed on the cured product of the photocurable adhesive composition and joined to obtain an OPEN-cured strength measurement test piece. The cured product of the photocurable adhesive composition in the OPEN-cured strength measurement test piece was measured for the reaction rate of the photocurable adhesive composition.

<<CLOSE硬化之硬化率之測定>> << Determination of the hardening rate of CLOSE hardening >>

以光硬化型接著組成物的塗布部分成為寬20mm之方式,於基材1(26mm×75mm×1.1mmt、玻璃)上,使用3片賽珞凡膠帶(50μ mt)來黏貼已製作的150μ mt厚度的間隔物,並使用金屬刮板塗布光硬化型接著組成物來形成光硬化型接著組成物層後,將基材2(26mm×75mm×0.05mmt、離型PET)載置於光硬化型接著組成物層上、且接合後,藉由傳送帶型金屬鹵素燈(Eye Graphics公司製、200mW/cm2),以3,000mJ/cm2透過基材1來照射光後形成光硬化型接著組成物之硬化物。將基材2剝離,並將基材3(26mm×150mm×0.1mmt、PET)載置於已剝離基材2的面 上、且接合,可得到CLOSE硬化之強度測定試片。對於CLOSE硬化之強度測定試片中的光硬化型接著組成物之硬化物,測定光硬化型接著組成物之反應率。 The coated part of the light-curing type adhesive composition was 20 mm wide. On the substrate 1 (26 mm × 75 mm × 1.1 mmt, glass), three pieces of Saifan tape (50 μ mt) were used to stick the produced 150 μ mt. Thickness of the spacer, and coating the light-curable adhesive composition with a metal blade to form a light-curable adhesive composition layer, and then placing the substrate 2 (26 mm × 75 mm × 0.05 mmt, release PET) on the light-curable adhesive Next, on the composition layer and after bonding, it was irradiated with light through a substrate 1 at 3,000 mJ / cm 2 by a conveyor-type metal halide lamp (200 mW / cm 2 manufactured by Eye Graphics) to form a light-curing adhesive composition. Of hardened. The base material 2 was peeled, and the base material 3 (26 mm × 150 mm × 0.1 mmt, PET) was placed on the surface of the peeled base material 2 and bonded to obtain a CLOSE-hardened strength measurement test piece. The cured product of the photo-curable adhesive composition in the CLOSE-cured strength measurement test piece was measured for the reaction rate of the photo-curable adhesive composition.

將結果匯整於表1。 The results are summarized in Table 1.

實施例1~3係強度變化率為0(即,沒有OPEN硬化與CLOSE硬化之強度差別)。即,藉由包含4官能以上的(甲基)丙烯酸酯寡聚物,即使是在氧存在下照射光之情形,亦具有與氧不存在之情形為同等的接著強度。另一方面,比較例1~3係因不包含4官能以上的(甲基)丙烯酸酯寡聚物,相較於在氧不存在之情形下照射光時之接著強度而言,在氧存在下照射光時的接著強度為降低。 Examples 1 to 3 have a strength change rate of 0 (that is, there is no difference in strength between OPEN hardening and CLOSE hardening). That is, by including a (meth) acrylic acid ester oligomer having four or more functions, even in the case where light is irradiated in the presence of oxygen, the bonding strength is equivalent to that in the case where oxygen is not present. On the other hand, Comparative Examples 1 to 3 do not contain a (meth) acrylic acid ester oligomer having more than four functions. Compared with the adhesion strength when light is irradiated in the absence of oxygen, in the presence of oxygen When the light was irradiated, the bonding strength decreased.

[產業利用性] [Industrial availability]

光硬化型接著組成物係為層合體、特別是適合作為光學顯示體及光學顯示體之接著劑。 The photocurable adhesive composition is a laminate, and is particularly suitable as an adhesive for optical displays and optical displays.

Claims (7)

一種光硬化型接著組成物,其係含有:(A)分子量為10,000~70,000的4~6官能的(甲基)丙烯酸酯寡聚物、(B)單官能(甲基)丙烯酸酯單體、(C)光反應起始劑、(D)軟化點為70~150℃的賦黏劑、及(E)液狀可塑劑。A light-curing type adhesive composition comprising: (A) a 4 to 6-functional (meth) acrylate oligomer having a molecular weight of 10,000 to 70,000, (B) a monofunctional (meth) acrylate monomer, (C) a photoreaction initiator, (D) a tackifier having a softening point of 70 to 150 ° C, and (E) a liquid plasticizer. 如請求項1之光硬化型接著組成物,其中,(A)成分係選自由骨架中具有(氫化)聚異戊二烯、(氫化)聚丁二烯及聚胺基甲酸酯構造的(甲基)丙烯酸酯寡聚物所成之群之1種以上。The photocuring type adhesive composition according to claim 1, wherein the component (A) is selected from the group consisting of (hydrogenated) polyisoprene, (hydrogenated) polybutadiene, and polyurethane having One or more groups of meth) acrylate oligomers. 如請求項1或2之光硬化型接著組成物,其中,(B)成分係選自由烷基(甲基)丙烯酸酯及羥基取代烷基(甲基)丙烯酸酯所成之群之1種以上。The light-curable adhesive composition according to claim 1 or 2, wherein the component (B) is one or more members selected from the group consisting of an alkyl (meth) acrylate and a hydroxy-substituted alkyl (meth) acrylate. . 一種層合體,其係以請求項1~3中任一項之光硬化型接著組成物貼合而成。A laminated body formed by laminating the light-curing type of any one of claims 1 to 3 with the composition. 如請求項4之層合體,其係光學顯示體。The laminated body as claimed in claim 4 is an optical display. 一種製造方法,其係層合體之製造方法,含有下述步驟(I)~(III):(I)將請求項1~3中任一項之光硬化型接著組成物適用於基材1,來形成光硬化型接著組成物層之步驟;(II)對步驟(I)所得之光硬化型接著組成物層照射能量線,來形成光硬化型接著組成物之硬化物之步驟;及(III)將基材2貼合至步驟(II)所得之硬化物之上之步驟。A manufacturing method, which is a method for manufacturing a laminated body, comprising the following steps (I) to (III): (I) applying the photocurable adhesive composition of any one of claims 1 to 3 to the substrate 1, A step of forming a light-curable type adhesive composition layer; (II) a step of irradiating the light-curable type adhesive composition layer obtained in step (I) with energy rays to form a light-curable type adhesive composition hardened product; and ) A step of bonding the substrate 2 to the hardened product obtained in the step (II). 如請求項6之製造方法,其中,在步驟(II)所形成的硬化物的光硬化型接著組成物之反應率為90%以上。The manufacturing method according to claim 6, wherein the reaction rate of the photocurable adhesive composition of the cured product formed in the step (II) is 90% or more.
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Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6970881B2 (en) * 2017-03-16 2021-11-24 株式会社スリーボンド Curable resin composition
JP7075109B2 (en) * 2017-04-14 2022-05-25 協立化学産業株式会社 Photo-curing adhesive composition
WO2019069872A1 (en) * 2017-10-04 2019-04-11 日本化薬株式会社 Uv-curable adhesive composition, cured product thereof, and method for manufacturing optical member employing uv-curable adhesive composition
KR20200066320A (en) * 2017-10-11 2020-06-09 세메다인 가부시키 가이샤 Photocurable pressure-sensitive adhesive composition and adhesion method
JP7442438B2 (en) * 2018-12-21 2024-03-04 積水化学工業株式会社 Adhesive compositions, adhesives for electronic parts, and adhesives for display elements
JP7426203B2 (en) * 2019-08-02 2024-02-01 アイカ工業株式会社 Photocurable resin composition
KR20210074014A (en) * 2019-12-11 2021-06-21 주식회사 엘지화학 Surface protecting film for a optical component
CN116656298A (en) * 2023-06-12 2023-08-29 柏仁新材料(广州)股份有限公司 High-temperature-resistant environment-friendly UV adhesive and preparation method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012145751A (en) * 2011-01-12 2012-08-02 Nippon Shokubai Co Ltd Ultraviolet curable resin composition for optical use, hardened material, and display device
CN103998548A (en) * 2012-12-14 2014-08-20 迪睿合电子材料有限公司 Photocurable resin composition, and method of manufacturing image display device employing same

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000038547A (en) 1998-07-24 2000-02-08 Mitsubishi Rayon Co Ltd Photocuring adhesive composition and optical member using same
US7915319B2 (en) * 2005-12-19 2011-03-29 Henkel Corporation Visible light curing systems, methods for reducing health risks to individuals exposed to systems designed to cure curable compositions by exposure to radiation, methods for bonding substrates and visible light curing compositions
JP5736614B2 (en) * 2011-01-12 2015-06-17 協立化学産業株式会社 Active energy ray-curable resin composition containing polyfunctional acrylate compound
KR101740536B1 (en) * 2011-01-12 2017-05-26 동우 화인켐 주식회사 Adhesive composition for optical use
CN102898958B (en) * 2011-07-25 2016-11-02 汉高股份有限公司 A kind of adhesive composition
CN103087640A (en) * 2011-11-08 2013-05-08 汉高股份有限公司 Dual-curing adhesive composition and application thereof and method for bonding substrates
JP5304922B1 (en) * 2012-05-09 2013-10-02 デクセリアルズ株式会社 Manufacturing method of image display device
JP2014031453A (en) 2012-08-03 2014-02-20 Nippon Shokubai Co Ltd Ultraviolet-curable resin composition for optical laminate, cured product and optical laminate
JP5218802B1 (en) 2012-11-13 2013-06-26 デクセリアルズ株式会社 Manufacturing method of image display device
CN103865470B (en) * 2014-02-12 2016-04-06 惠晶显示科技(苏州)有限公司 A kind of photocuring edge sealing adhesive
JP2015214594A (en) * 2014-05-07 2015-12-03 昭和電工株式会社 Polymerizable composition, polymer, tacky-adhesive sheet for optical use, image display device, and production method of the device
WO2015190563A1 (en) * 2014-06-11 2015-12-17 日本化薬株式会社 Uv-curable resin composition for use in touchscreen, and bonding method and article using said uv-curable resin

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012145751A (en) * 2011-01-12 2012-08-02 Nippon Shokubai Co Ltd Ultraviolet curable resin composition for optical use, hardened material, and display device
CN103998548A (en) * 2012-12-14 2014-08-20 迪睿合电子材料有限公司 Photocurable resin composition, and method of manufacturing image display device employing same

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