JP6172753B2 - Polyurethane compound and resin composition containing the same - Google Patents

Description

  The present invention relates to a resin composition containing a urethane (meth) acrylate having a hydrogenated polybutadiene polyol as a main skeleton. Furthermore, since the cured film of the resin composition of the present invention is excellent in flexibility, transparency, moisture resistance, adhesion to a substrate, and has little curing shrinkage, it is particularly useful for bonding applications such as optical films for display devices. is there.

  Conventionally, urethane (meth) acrylate, which is a reaction product of a polyol compound, a polyisocyanate compound, and a hydroxyl group-containing (meth) acrylate compound, has been widely used for applications such as coating agents, adhesives, and photoresists. For example, in the field where degradation due to yellowing such as Patent Document 1 is particularly problematic, a urethane (meth) acrylate compound is designed based on a highly transparent polyol compound and an aliphatic or alicyclic polyisocyanate. To do.

  In some cases, hydrogenated polybutadiene is selected as a polyol compound to improve yellowing or weather resistance when exposed to harsh conditions. In Patent Document 2, urethane (meth) acrylate is produced using hydrogenated polybutadiene polyol. Although it is excellent in weather resistance as a cured product, it is considered that the hydrogenated polybutadiene skeleton has very high hydrophobicity and is limited in compatibility with monomers and additives that can be blended as a composition. In addition, the hydrogenated polybutadiene polyol used has a relatively high iodine value, suggesting the possibility that it does not give properties that satisfy the currently required weather resistance and light resistance. Furthermore, since it is manufactured as a urethane (meth) acrylate resin without dilution, the actual industrialization has a high viscosity and may cause problems in terms of workability.

  In recent years, studies and achievements of urethane (meth) acrylates for LCD (liquid crystal display) applications have become active. For example, in patent document 3, it is utilized as a photocurable adhesive composition used for bonding of an optical display or a touch sensor using a polybutadiene-based (meth) acrylate oligomer and a urethane (meth) acrylate oligomer. As urethane (meth) acrylate, it is estimated that the thing excellent in a softness | flexibility and the weather resistance and light resistance will be requested | required from now on. Patent Document 4 describes the application of urethane (meth) acrylate using a polyol compound having no aromatic ring to an LCD optical member.

Japanese Patent No. 2582575 Japanese Patent No. 4868654 JP 2012-46658 A JP 2011-190421 A

  For optical member applications represented by these display applications, urethane (meth) acrylates require higher weather resistance, light resistance, improved cured film properties, and improved compatibility with other resins, monomers, and additives. Further, in the industrialization, detailed design of urethane (meth) acrylate materials and compositions having excellent workability will be required in the future, assuming an actual production line.

  An object of the present invention is to provide a resin composition that improves the above-described requirements, provides a cured film having excellent weather resistance and light resistance, and excellent flexibility, and has a low shrinkage upon curing.

  As a result of intensive studies in order to solve the previous problems, the present inventors have found that a resin composition having a specific compound and composition can solve the problems, and have reached the present invention.

That is, the present invention provides (1) a polyurethane compound (E) obtained by reacting the following compound (A) with compound (B), compound (C) and compound (D),
Compound (A): hydrogenated polybutadiene polyol compound compound (B): polyethylene glycol compound (C): polyisocyanate compound compound (D): (meth) acrylate compound having one or more hydroxyl groups (2) hydrogenated polybutadiene polyol compound The polyurethane compound (E) according to (1), wherein the iodine value of (A) is 20 or less,
(3) The polyurethane compound (E) according to (1) or (2), wherein the polyethylene glycol (B) has a number average molecular weight of 100 to 4,000.
(4) The polyurethane compound (E) according to any one of (1) to (3), wherein the polyisocyanate compound (C) is an aliphatic diisocyanate compound,
(5) The polyurethane compound (E) according to any one of (1) to (4), wherein the (meth) acrylate compound (D) having one or more hydroxyl groups is 2-hydroxyethyl (meth) acrylate,
(6) A photosensitive resin composition comprising the polyurethane compound (E) according to any one of (1) to (5) and a polymerizable compound (F) other than (E),
(7) The photosensitive resin composition according to (6), wherein the polymerizable compound (F) is an alkyl (meth) acrylate or an alkylene (meth) acrylate,
(8) The photosensitive resin composition according to (6) or (7), which contains a photopolymerization initiator (G),
(9) A cured product of the photosensitive resin composition according to any one of (6) to (8),
(10) The method for producing a photosensitive resin composition according to (6) or (7), wherein the polyurethane compound (E) is synthesized in the presence of the polymerizable compound (F),
About.

The cured film of the photosensitive resin composition containing the polyurethane compound of the present invention has excellent flexibility, weather resistance, light resistance, and optical use that needs to maintain transparency, as well as ink, plastic paint, In various fields such as paper printing, metal coating, furniture coating, lining, adhesives, as well as insulating varnishes, insulating sheets, laminates, printed circuit boards, resist inks, semiconductor encapsulants in the electronics field Application is possible.

  The polyurethane compound (E) of the present invention is first reacted with the hydrogenated polybutadiene polyol (A) and polyethylene glycol (B) and the polyisocyanate compound (C) (hereinafter referred to as the first reaction), and then the remaining isocyanate groups On the other hand, a (meth) acrylate compound (D) having one or more hydroxyl groups is reacted (hereinafter referred to as a second reaction).

As the hydrogenated polybutadiene polyol (A) used in the first reaction of the present invention, any hydrogenated reduction product of a general polybutadiene polyol can be used. The iodine value is more preferably 20 or less, and particularly preferably 15 or less. As for the molecular weight of (A), all generally available molecular weight distributions can be used, but those having a number average molecular weight of 500 to 5,000 are particularly preferred when balancing the flexibility and curability, The thing of 500-3000 is especially preferable.
Examples of the commercially available hydrogenated polybutadiene polyol (A) include Nippon Soda Co., Ltd .: GI-1000, GI-2000, GI-3000, CRAY VALEY KRASOL HLBP-H 1000, HLBP-H 2000, HLBP-H. 3000 etc. are mentioned.

As specific examples of the polyethylene glycol (B) used in the first reaction of the present invention, all commercially available polyethylene glycols can be used. For example, PEG # 200T and PEG # manufactured by NOF Corporation can be used. 200, PEG # 300, PEG # 400, PEG # 600, PEG # 1000, PEG # 1500, PEG # 1540, PEG # 200, PEG # 4000, PEG # 4000P, PEG # 6000, PEG # 6000P, PEG # 11000, PEG # 20000 or the like, urethane grades with these moisture management products, and the like can also be used. The water content is preferably 2% or less, particularly preferably 1% or less, in order to suppress thickening due to an increase in molecular weight.
In addition, with respect to the molecular weight of (B), all generally available molecular weight distributions can be used, but those having a number average molecular weight of 50 to 6000 are particularly preferred when a balance between flexibility and curability is achieved. Particularly preferred is ~ 4000.
Here, in the obtained polyurethane compound (E), the structure derived from polyethylene glycol is incorporated in a dispersive manner so that the polyethylene glycol skeleton and the hydrogenated polybutadiene skeleton are incorporated uniformly, thereby improving the compatibility with the monomer. From the viewpoint, the number average molecular weight of polyethylene glycol is more preferably 2000 or less, and particularly preferably 500 or less.
Further, in the polyurethane compound (E), it is preferable that 5 to 10 mol% of polyethylene glycol (B) is incorporated in view of the total number of moles of hydrogenated polybutadiene polyol (A) and polyethylene glycol (B). It is.
The hydroxyl value is preferably 400 or less, and more preferably 300 or less. Although a minimum is not specifically limited, For example, what is necessary is just 50 or more.

Here, in the present invention, when hydrogenated polybutadiene polyol (A) and polyethylene glycol (B) are used in the reaction, the use ratio of hydrogenated polybutadiene (A) and polyethylene glycol (B) is not particularly limited. ) Component: Component (B) is preferably 9.999: 0.001-1: 9, more preferably 9.999: 0.001-3: 7, and 9.999: 0.001-4: in molar ratio. 6 is particularly preferred.
In addition, the number average molecular weight of the hydrogenated polybutadiene polyol (A) used in the present invention is preferably a combination of those having a number average molecular weight greater than that of the polyethylene glycol (B) used. It is more preferable that the hydrogenated polybutadiene polyol (A) has a number average molecular weight + 500 number average molecular weight, and it is particularly preferable that the hydrogenated polybutadiene polyol (A) has a number average molecular weight of polyethylene glycol (B) +1000. preferable.

  The polyisocyanate compound (C) used in the first reaction of the present invention is a compound comprising two or more isocyanate groups in one molecule, and examples thereof include aliphatic diisocyanate compounds and aromatic diisocyanates. Compounds, trimers thereof, and the like. The aliphatic diisocyanate compound as used herein means a diisocyanate compound in which an isocyanate group is bonded to a chain carbon atom, and a diisocyanate compound in which an isocyanate group is bonded to a carbon atom of a cyclic saturated hydrocarbon, and an aromatic diisocyanate compound. Means an isocyanate compound in which an isocyanate group is bonded to a carbon atom of an aromatic ring.

  Examples of the aliphatic diisocyanate compound include 1,6-hexamethylene diisocyanate, isophorone diisocyanate, hydrogenated tolylene diisocyanate, hydrogenated xylylene diisocyanate, hydrogenated diphenylmethane diisocyanate, 1,3-diisocyanate cyclohexane, and 1,4-diisocyanate. Cyclohexane, dicyclohexylmethane-4,4'-diisocyanate, m-tetramethylxylene diisocyanate, p-tetramethylxylene diisocyanate, 1,4-tetramethylene diisocyanate, 1,12-dodecamethylene diisocyanate, 2,2,4-trimethylcyclohexane Diisocyanate, 2,4,4-trimethylcyclohexane diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate Sulfonate, 2,4,4-trimethylhexamethylene diisocyanate, lysine diisocyanate, norbornane diisocyanate and the like.

  Examples of the aromatic diisocyanate compound include tolylene diisocyanate, xylylene diisocyanate, diphenylmethane diisocyanate, 1,5-naphthalene diisocyanate, tolidine diisocyanate, 1,6-phenylene diisocyanate, 1,4-phenylene diisocyanate, 1,6-phenylene. And diisocyanate monomers such as diisocyanate.

  Among these, an aliphatic diisocyanate compound and a trimer of the aliphatic diisocyanate compound are preferable because the weather resistance of the coating film is improved. Examples of the trimer of the aliphatic diisocyanate compound include the above-mentioned aliphatic isocyanate-based isocyanurate-type polyisocyanates, and specific examples include hexamethylene diisocyanate and isophorone diisocyanate. These may be used alone or in a mixture.

  In the present invention, the first reaction is carried out in an equivalent relationship (C / (A + B)> 1: [NCO] / [OH] molar ratio) such that isocyanate groups remain after the reaction. When the preparation ratio is increased, a large amount of unreacted polyisocyanate compound (C) is present, which may affect the flexibility of the photosensitive resin composition. On the other hand, when the preparation ratio is reduced, the molecular weight is increased and the curability of the photosensitive resin composition may be affected. Specifically, preferably, the OH group of the alcohol compound (A + B) is 0.1 to 0.9 mol with respect to 1.0 mol of the NCO group of the polyisocyanate compound (C).

  In the present invention, the first reaction can be carried out in the absence of a solvent. However, in order to improve the workability and the viscosity of the product is high, the following compound in a solvent having no alcoholic hydroxyl group or a polymerizable compound (described later) F) is preferable. Specific examples of the solvent include ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone, aromatic hydrocarbons such as benzene, toluene, xylene, and tetramethylbenzene, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, and dipropylene glycol. Glycol ethers such as dimethyl ether, dipropylene glycol diethyl ether, triethylene glycol dimethyl ether, triethylene glycol diethyl ether, ethyl acetate, butyl acetate, methyl cellosolve acetate, ethyl cellosolve acetate, butyl cellosolve acetate, carbitol acetate, propylene glycol monomethyl ether acetate , Propylene glycol monoethyl ether acetate, Propylene glycol monomethyl ether acetate, esters such as dialkyl glutarate, dialkyl succinate and dialkyl adipate, cyclic esters such as γ-butyrolactone, petroleum solvents such as petroleum ether, petroleum naphtha, hydrogenated petroleum naphtha and solvent naphtha Can be carried out alone or in a mixed organic solvent.

  The reaction temperature is usually 30 to 150 ° C, preferably 50 to 100 ° C. The end point of the reaction is confirmed by a decrease in the amount of isocyanate. A catalyst may be added for the purpose of shortening the reaction time. As this catalyst, either a basic catalyst or an acidic catalyst is used. Examples of the basic catalyst include amines such as pyridine, pyrrole, triethylamine, diethylamine, dibutylamine and ammonia, and phosphines such as tributylphosphine and triphenylphosphine. Examples of acidic catalysts include copper naphthenate, cobalt naphthenate, zinc naphthenate, tributoxyaluminum, titanium tetraisopropoxide, zirconium tetrabutoxide, aluminum chloride, tin octylate, octyltin trilaurate, dibutyltin dilaurate, Mention may be made of Lewis acid catalysts such as octyltin diacetate. The addition amount of these catalysts is 0.1-1 weight part normally with respect to 100 weight part of total weight parts of a diol compound (A + B) and a polyisocyanate compound (C).

  The polyurethane compound (E) of the present invention is obtained by reacting (second reaction) a (meth) acrylate compound (D) having one or more hydroxyl groups with respect to the remaining isocyanate group after the first reaction. Can do.

The (meth) acrylate compound (D) having one or more hydroxyl groups used in the second reaction of the present invention is a compound having at least one hydroxyl group and one (meth) acrylate in one molecule, Specifically, 2-hydroxyethyl (meth) acrylate, propylene glycol mono (meth) acrylate, butanediol mono (meth) acrylate, pentanediol mono (meth) acrylate, hexanediol mono (meth) acrylate, diethylene glycol mono (meta) ) Acrylate, dipropylene glycol mono (meth) acrylate, triethylene glycol mono (meth) acrylate, tripropylene glycol mono (meth) acrylate, tetraethylene glycol mono (meth) acrylate, polyethylene glycol Dihydric alcohols such as mono (meth) acrylate, polypropylene glycol mono (meth) acrylate, neopentyl glycol mono (meth) acrylate, ethoxylated neopentyl glycol mono (meth) acrylate, and hydroxypivalate neopentyl glycol mono (meth) acrylate Mono (meth) acrylates of

Trimethylolpropane mono (meth) acrylate, ethoxylated trimethylolpropane mono (meth) acrylate, propoxylated trimethylolpropane mono (meth) acrylate, tris (2-hydroxyethyl) isocyanurate mono (meth) acrylate, glycerin mono (meta) ) Acrylate, trimethylolpropane di (meth) acrylate, ethoxylated trimethylolpropane di (meth) acrylate, propoxylated trimethylolpropane di (meth) acrylate, tris (2-hydroxyethyl) isocyanurate di (meth) acrylate, glycerin Mono- and di (meth) acrylates of trivalent alcohols such as di (meth) acrylate, and some of the hydroxyl groups of these alcohols are alkyl groups or ε-caprolactone. Modified mono- and di (meth) acrylate;

Pentaerythritol mono (meth) acrylate, dipentaerythritol mono (meth) acrylate, ditrimethylolpropane mono (meth) acrylate, pentaerythritol di (meth) acrylate, dipentaerythritol di (meth) acrylate, ditrimethylolpropane di (meth) Acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol tri (meth) acrylate, ditrimethylolpropane tri (meth) acrylate, dipentaerythritol tetra (meth) acrylate, ditrimethylolpropane tetra (meth) acrylate, dipentaerythritol hexa Polyfunctionals (meth) of tetrahydric or higher alcohols such as (meth) acrylate and ditrimethylolpropane hexa (meth) acrylate ) And those having a hydroxyl group in acrylates, polyfunctional (meth) acrylate having a hydroxyl group partially modified with an alkyl group and ε- caprolactone hydroxyl groups of these alcohols, and the like.

Among the (meth) acrylate compounds (D) having one or more hydroxyl groups described above, 2-hydroxyethyl (meth) acrylate is particularly preferable from the viewpoint of excellent curability and flexibility. From the viewpoint of easy workability, a polymerizable compound (F) described later in the present invention may be added during the reaction.

  The second reaction of the present invention is charged in an equivalent relationship such that the isocyanate group of the intermediate obtained after the first reaction is eliminated. Specifically, preferably, 1.0 to 3.0 mol of OH groups of the (meth) acrylate compound (D) having one or more hydroxyl groups with respect to 1.0 mol of NCO groups of the intermediate obtained after the first reaction. More preferably, the content is 1.0 to 2.0 mol.

The second reaction of the present invention can also be carried out in the absence of a solvent, but the product has a high viscosity and the above-described solvent and / or polymerizable compound (F) described later in the present invention for improving workability. It is preferable to carry out under mixing. Moreover, reaction temperature is 30-150 degreeC normally, Preferably it is the range of 50-100 degreeC. The end point of the reaction is confirmed by a decrease in the amount of isocyanate. The aforementioned catalyst may be added for the purpose of shortening the reaction time.
Here, it is preferable to carry out under mixing with the polymerizable compound (F) described later. This is because, by using the compound as a diluent, most of the curable resin component occupies, so that troubles hardly occur at the time of curing and hardened physical properties are hardly adversely affected. Moreover, from a compatible viewpoint, combined use of alkyl (meth) acrylate or alkylene (meth) acrylate (following, F-5) is preferable.
Among them, a compound having a (meth) acryloyloxy group having a long chain of C5 to C35, more preferably C15 to C35, such as alkyl (meth) acrylate or alkylene (meth) acrylate is preferable. This is because by having such a structure, a product having excellent compatibility and transparency can be obtained.

  Usually, a polymerization inhibitor such as 4-methoxyphenol is already added to the acrylate compound used as a raw material, but a polymerization inhibitor may be added again during the reaction. Examples of such polymerization inhibitors include hydroquinone, 4-methoxyphenol, 2,4-dimethyl-6-t-butylphenol, 2,6-di-t-butyl-4-cresol, 3-hydroxythiophenol, Examples include p-benzoquinone, 2,5-dihydroxy-p-benzoquinone, and phenothiazine. The amount used is 0.01 to 1% by weight based on the reaction raw material mixture.

  The photosensitive resin composition of the present invention can contain a polymerizable compound (F) other than the polyurethane compound (E) of the present invention and the component (E) as an optional component. Specific examples of the polymerizable compound (F) that can be used include a compound having a (meth) acryloyloxy group, a maleimide compound, a (meth) acrylamide compound, and an unsaturated polyester.

Specific examples of the compound having a (meth) acryloyloxy group that can be used in combination with the photosensitive resin composition of the present invention include (poly) ester (meth) acrylate (F-1); urethane (meth) acrylate (F-2). ); Epoxy (meth) acrylate (F-3); (poly) ether (meth) acrylate (F-4); alkyl (meth) acrylate or alkylene (meth) acrylate (F-5); having an aromatic ring (meta) ) Acrylate (F-6); (meth) acrylate (F-7) having an alicyclic structure, and the like can be mentioned, but are not limited thereto.
In addition, about a reaction material, it can obtain on well-known reaction conditions.

  The (poly) ester (meth) acrylate (F-1) that can be used in combination with the photosensitive resin composition of the present invention is a general term for (meth) acrylate having one or more ester bonds in the main chain, and urethane (meth). Acrylate (F-2) is a general term for (meth) acrylate having one or more urethane bonds in the main chain, and epoxy (meth) acrylate (F-3) is a monofunctional or higher functional epoxy compound and (meth). As a generic name of (meth) acrylate obtained by reacting acrylic acid, (poly) ether (meth) acrylate (F-4) is a generic name of (meth) acrylate having one or more ether bonds in the main chain, Alkyl (meth) acrylate or alkylene (meth) acrylate (F-5) means that the main chain is linear alkyl, branched alkyl, and linear or terminal halogen. As a general term for (meth) acrylate which may have a child and / or a hydroxyl group, (meth) acrylate (F-6) having an aromatic ring is (meth) acrylate having an aromatic ring in the main chain or side chain. As a general term, (meth) acrylate (F-7) having an alicyclic structure has an alicyclic structure that may contain an oxygen atom or a nitrogen atom in the structural unit in the main chain or side chain (meth). These are used as a general term for acrylates.

  Examples of the (poly) ester (meth) acrylate (F-1) that can be used in combination with the photosensitive resin composition of the present invention include caprolactone-modified 2-hydroxyethyl (meth) acrylate, ethylene oxide and / or propylene oxide-modified phthalate. Monofunctional (poly) ester (meth) acrylates such as acid (meth) acrylate, ethylene oxide modified succinic acid (meth) acrylate, caprolactone modified tetrahydrofurfuryl (meth) acrylate; hydroxypivalate ester neopentyl glycol di (meth) Acrylate, caprolactone-modified hydroxypivalate ester neopentyl glycol di (meth) acrylate, epichlorohydrin-modified phthalic acid di (meth) acrylate; trimethylolpropane or glycerol 1 1 mole or more ε- caprolactone, .gamma.-butyrolactone, .delta.-valerolactone of triol obtained by adding a cyclic lactone compound of mono-, di- or tri (meth) acrylate;

Mono, di, tri or tetra (meth) acrylate of tetraol obtained by adding 1 mol or more of cyclic lactone compound such as ε-caprolactone, γ-butyrolactone, δ-valerolactone to 1 mol of pentaerythritol or ditrimethylolpropane Mono- or poly (meth) acrylate of hexaol obtained by adding 1 mol or more of cyclic lactone compound such as ε-caprolactone, γ-butyrolactone, δ-valerolactone to 1 mol of dipentaerythritol;

Diol components such as (poly) ethylene glycol, (poly) propylene glycol, (poly) tetramethylene glycol, (poly) butylene glycol, 3-methyl-1,5-pentanediol, hexanediol, maleic acid, fumaric acid, succinic acid Acids, adipic acid, phthalic acid, isophthalic acid, hexahydrophthalic acid, tetrahydrophthalic acid, dimer acid, sebacic acid, azelaic acid, polybasic acids such as 5-sodium sulfoisophthalic acid, and their reactants (Meth) acrylates of polyester polyols, such as (meth) acrylates of cyclic lactone-modified polyester diols composed of the diol component and polybasic acids and their anhydrides and ε-caprolactone, γ-butyrolactone, δ-valerolactone, etc. Multifunctional (poly) ester ( Can be mentioned data) acrylate, and the like, but is not limited thereto.

  The urethane (meth) acrylate (F-2) that can be used in combination with the photosensitive resin composition of the present invention comprises at least one (meth) acryloyloxy group-containing hydroxy compound (F-2-I) and an isocyanate compound (F- It is a general term for (meth) acrylates obtained by reaction with 2-ro).

  Specific examples of the hydroxy compound (F-2-I) having at least one (meth) acryloyloxy group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and 2-hydroxybutyl. (Meth) acrylate, 4-hydroxyethyl (meth) acrylate, cyclohexanedimethanol mono (meth) acrylate, polyethylene glycol mono (meth) acrylate, polypropylene glycol mono (meth) acrylate, pentaerythritol tri (meth) acrylate, 2-hydroxy Ring-opening reaction product of (meth) acrylate compound having various hydroxyl groups such as -3-phenoxypropyl (meth) acrylate, and (meth) acrylate compound having the above hydroxyl group and ε-caprolactone Etc. can be mentioned.

  Specific examples of the isocyanate compound (F-2-ro) include, for example, P-phenylene diisocyanate, m-phenylene diisocyanate, P-xylene diisocyanate, m-xylene diisocyanate, 2,4-tolylene diisocyanate, 2,6-triylene diisocyanate. Aromatic diisocyanates such as diisocyanate, 4,4'-diphenylmethane diisocyanate, naphthalene diisocyanate; aliphatics such as isophorone diisocyanate, hexamethylene diisocyanate, 4,4'-dicyclohexylmethane diisocyanate, hydrogenated xylene diisocyanate, norbornene diisocyanate, lysine diisocyanate Or diisocyanates having an alicyclic structure; one or more burettes of isocyanate monomers or the above diisocyanates Things a trimer polyisocyanates of the isocyanate and the like; the and the isocyanate compound include polyisocyanates obtained by urethane reaction of the polyol compound.

In addition, when obtaining urethane (meth) acrylate, in the reaction of the hydroxy compound (F-2-i) having a (meth) acryloyloxy group and the isocyanate compound (F-2-ro), a polyol is optionally reacted. It doesn't matter.
Examples of the polyol that can be used include 1 to 10 carbon atoms such as neopentyl glycol, 3-methyl-1,5-pentanediol, ethylene glycol, propylene glycol, 1,4-butanediol, and 1,6-hexanediol. Triols such as alkylene glycol, trimethylolpropane, pentaerythritol, alcohols having a cyclic skeleton such as tricyclodecane dimethylol, bis- [hydroxymethyl] -cyclohexane, and the like; and these polyhydric alcohols and polybasic acids (for example, succinic acid) , Phthalic acid, hexahydrophthalic anhydride, terephthalic acid, adipic acid, azelaic acid, tetrahydrophthalic anhydride, etc.) polyester polyol obtained by reaction with polyhydric alcohol and ε-caprolactone Lactone alcohol, polycarbonate polyol (for example, polycarbonate diol obtained by reaction of 1,6-hexanediol and diphenyl carbonate) or polyether polyol (for example, polyethylene glycol, polypropylene glycol, polytetramethylene glycol, ethylene oxide-modified bisphenol A, etc.) Etc.

  The epoxy (meth) acrylate (F-3) that can be used in combination with the photosensitive resin composition of the present invention is obtained by reacting an epoxy resin containing an epoxy group having one or more functionalities with (meth) acrylic acid (meta). ) A general term for acrylate. Specific examples of epoxy resins used as raw materials for epoxy (meth) acrylates include phenyl diglycidyl ethers such as hydroquinone diglycidyl ether, catechol diglycidyl ether, resorcinol diglycidyl ether; bisphenol-A type epoxy resin, bisphenol-F type epoxy Resin, bisphenol-S type epoxy resin, bisphenol type epoxy compound such as 2,2-bis (4-hydroxyphenyl) -1,1,1,3,3,3-hexafluoropropane epoxy compound; hydrogenated bisphenol- A type epoxy resin, hydrogenated bisphenol-F type epoxy resin, hydrogenated bisphenol-S type epoxy resin, hydrogenated 2,2-bis (4-hydroxyphenyl) -1,1,1,3,3,3-hexa Fluoropropane Epoxy Hydrogenated bisphenol type epoxy compounds such as compounds; Halogenated bisphenol type epoxy compounds such as brominated bisphenol-A type epoxy resins and brominated bisphenol-F type epoxy resins; Alicyclic diglycidyl such as cyclohexanedimethanol diglycidyl ether compounds Ether compounds; Aliphatic diglycidyl ether compounds such as 1,6-hexanediol diglycidyl ether, 1,4-butanediol diglycidyl ether, and diethylene glycol diglycidyl ether; Polysulfide type diglycidyl ether compounds such as polysulfide diglycidyl ether; Phenol Novolac epoxy resin, cresol novolac epoxy resin, trishydroxyphenylmethane epoxy resin, dicyclopentadienephenol Epoxy resins, biphenol type epoxy resin, bisphenol -A novolac epoxy resins, naphthalene skeleton-containing epoxy resin, a heterocyclic epoxy resin or the like.

  Examples of the (poly) ether (meth) acrylate (F-4) that can be used in combination with the photosensitive resin composition of the present invention include butoxyethyl (meth) acrylate, butoxytriethylene glycol (meth) acrylate, epichlorohydrin-modified butyl ( (Meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, 2-ethoxyethyl (meth) acrylate, ethyl carbitol (meth) acrylate, phenoxyethyl (meth) acrylate, nonylphenoxypolyethylene glycol (meth) acrylate, etc. Functional (poly) ether (meth) acrylates;

  Alkylene glycol di (meth) acrylates such as polyethylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, polybutylene glycol di (meth) acrylate, polytetramethylene glycol di (meth) acrylate; ethylene oxide and propylene oxide Copolymer, copolymer of propylene glycol and tetrahydrofuran, polyisoprene glycol, hydrogenated polyisoprene glycol, polybutadiene glycol, polyhydric hydroxyl compounds such as hydrogenated polybutadiene glycol and other polyhydric hydroxyl compounds and (meth) acrylic Polyfunctional (meth) acrylates derived from acids; 1 mole or more of ethylene oxide, propylene oxide, butylene oxide, etc. per 1 mole of neopentyl glycol Di (meth) acrylate of a diol obtained by adding Jo ether;

  Di (meth) acrylates of alkylene oxide modified products of bisphenols such as bisphenol A, bisphenol F and bisphenol S; Hydrogenated bisphenols such as hydrogenated bisphenol A, hydrogenated bisphenol F and hydrogenated bisphenol S (Meth) acrylate; mono-, di- or tri (meth) acrylate of triol obtained by adding 1 mol or more of cyclic ether compound such as ethylene oxide, propylene oxide, butylene oxide to 1 mol of trimethylolpropane or glycerin;

  Mono-, di-, tri-, or tetra (meth) acrylates of triols obtained by adding 1 mol or more of a cyclic ether compound such as ethylene oxide, propylene oxide, butylene oxide to 1 mol of pentaerythritol or ditrimethylolpropane; 1 mol of dipentaerythritol Examples thereof include polyfunctional (poly) ether (meth) acrylates such as hexaol tri- to hexafunctional (meth) acrylates to which cyclic ether compounds such as ethylene oxide, propylene oxide, butylene oxide and the like are added in a molar amount or more.

  Examples of the alkyl (meth) acrylate or alkylene (meth) acrylate (F-5) that can be used in the photosensitive resin composition of the present invention include, for example, methyl (meth) acrylate, ethyl (meth) acrylate, and propyl (meth) acrylate. , N-butyl (meth) acrylate, i-butyl (meth) acrylate, t-butyl (meth) acrylate, hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, lauryl (meth) acrylate, octyl (meth) acrylate , Isooctyl (meth) acrylate, decyl (meth) acrylate, dodecyl (meth) acrylate, stearyl (meth) acrylate, isostearyl (meth) acrylate, isobornyl (meth) acrylate, dicyclopentenyl (meth) acrylate , Dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, cyclohexyl (meth) acrylate, trimethylcyclohexyl (meth) acrylate, 1-adamantyl (meth) acrylate, 2-ethylhexyl carbitol (meth) acrylate, etc. Monofunctional (meth) acrylates of

  Ethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, 2 -Di (meth) acrylates of hydrocarbon diols of methyl-1,8-octanediol di (meth) acrylate, 1,9-nonanediol di (meth) acrylate, 1,10-decanediol di (meth) acrylate;

Mono (meth) acrylate, di (meth) acrylate or tri (meth) acrylate of trimethylolpropane (hereinafter, “poly” is used as a general term for polyfunctionality such as di, tri, tetra, etc.), mono (meth) of glycerin Triols such as acrylate or poly (meth) acrylate, mono- or poly (meth) acrylate of pentaerythritol, mono- or poly (meth) acrylate of ditrimethylolpropane, mono- or poly (meth) acrylate of dipentaerythritol, tetraol, hexa Mono- or poly (meth) acrylates of polyhydric alcohols such as oar;

And hydroxyl group-containing (meth) acrylic compounds such as 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and 4-hydroxybutyl (meth) acrylate.

  Examples of the (meth) acrylate (F-6) having an aromatic ring that can be used in combination with the photosensitive resin composition of the present invention include monofunctional (meth) acrylates such as phenyl (meth) acrylate and benzyl (meth) acrylate. And di (meth) acrylates such as bisphenol A di (meth) acrylate and bisphenol F di (meth) acrylate, but are not limited thereto.

  Examples of the (meth) acrylate (F-7) having an alicyclic structure that can be used in combination with the photosensitive resin composition of the present invention include cyclohexyl (meth) acrylate, cyclopentyl (meth) acrylate, isobornyl (meth) acrylate, and di Monofunctional (meth) acrylates having an alicyclic structure such as cyclopentenyl (meth) acrylate; di (meth) acrylates of hydrogenated bisphenols such as hydrogenated bisphenol A and hydrogenated bisphenol F; tricyclodecane dimethylol di ( Examples thereof include polyfunctional (meth) acrylates having a cyclic structure such as (meth) acrylate; alicyclic (meth) acrylates having an oxygen atom or the like in the structure such as tetrafurfuryl (meth) acrylate. However, it is not limited to these.

  Examples of the compound having a (meth) acryloyl group that can be used in combination with the photosensitive resin composition of the present invention include, for example, a reaction product of a (meth) acrylic acid polymer and glycidyl (meth) acrylate, in addition to the above-described compounds. Or a poly (meth) acrylic polymer (meth) acrylate such as a reaction product of a glycidyl (meth) acrylate polymer and (meth) acrylic acid; a (meth) acrylate having an amino group such as dimethylaminoethyl (meth) acrylate; Isocyanuric (meth) acrylates such as (meth) acryloxyethyl isocyanurate; (meth) acrylates having a polysiloxane skeleton; polybutadiene (meth) acrylates, melamine (meth) acrylates, and the like can also be used.

  Examples of the maleimide group-containing compound (F-8) that can be used in combination with the photosensitive resin composition of the present invention include Nn-butylmaleimide, N-hexylmaleimide, 2-maleimidoethyl-ethyl carbonate, 2- Monofunctional aliphatic maleimides such as maleimidoethyl-propyl carbonate and N-ethyl- (2-maleimidoethyl) carbamate; Alicyclic monofunctional maleimides such as N-cyclohexylmaleimide; N, N-hexamethylene bismaleimide, polypropylene Aliphatic bismaleimides such as glycol-bis (3-maleimidopropyl) ether and bis (2-maleimidoethyl) carbonate; cycloaliphatic such as 1,4-dimaleimidocyclohexane and isophorone bisurethane bis (N-ethylmaleimide) Bismaleimide; maleimidoacetic acid and poly Obtained by esterification of carboxymaleimide derivatives such as maleimide compounds obtained by esterification with tetramethylene glycol, maleimide compounds by maleification of maleimidocaproic acid and pentaerythritol tetraethylene oxide adducts, and various (poly) ols. (Poly) ester (poly) maleimide compounds and the like that can be used can be mentioned, but are not limited thereto.

  Examples of the (meth) acrylamide compound (F-9) that can be used in combination with the photosensitive resin composition of the present invention include monofunctional (meth) acrylamides such as acryloylmorpholine and N-isopropyl (meth) acrylamide; Examples thereof include polyfunctional (meth) acrylamides such as (meth) acrylamide.

  Examples of the unsaturated polyester (F-10) that can be used in combination with the photosensitive resin composition of the present invention include fumaric acid esters such as dimethyl malate and diethyl malate; polyunsaturated such as maleic acid and fumaric acid. The esterification reaction product of carboxylic acid and a polyhydric alcohol can be mentioned.

The polymerizable compound (F) that can be used in combination with the photosensitive resin composition of the present invention is a combination of alkyl (meth) acrylate or alkylene (meth) acrylate (F-5) that has low viscosity, excellent light resistance, and workability. Although it is preferable, the compound is not limited to the above-described compounds, and one or a plurality of compounds can be used in combination without particular limitation as long as the compound has a copolymerizability with the component (E).
Among them, a compound having a (meth) acryloyloxy group having a long chain of C5 to C35, more preferably C15 to C35, such as alkyl (meth) acrylate or alkylene (meth) acrylate is preferable. This is because a photosensitive resin composition having excellent compatibility and transparency can be obtained by having such a structure.

  In the photosensitive resin composition of the present invention, the ratio of the components (E) and (F) is not particularly limited, but the component (F) is 10 to 2000 wt% with respect to 100 wt% of the component (E). %, Preferably 20 to 1000% by weight.

  Specific examples of the photopolymerization initiator (G) used in the photosensitive resin composition of the present invention include benzoins such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, and benzoin isobutyl ether; acetophenone, 2, 2-diethoxy-2-phenylacetophenone, 1,1-dichloroacetophenone, 2-hydroxy-2-methyl-phenylpropan-1-one, diethoxyacetophenone, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1- [4 Acetophenones such as-(methylthio) phenyl] -2-morpholinopropan-1-one; anthraquino such as 2-ethylanthraquinone, 2-tertiarybutylanthraquinone, 2-chloroanthraquinone, 2-amylanthraquinone Thioxanthones such as 2,4-diethylthioxanthone, 2-isopropylthioxanthone, 2-chlorothioxanthone; ketals such as acetophenone dimethyl ketal and benzyl dimethyl ketal; benzophenone, 4-benzoyl-4′-methyldiphenyl sulfide, Benzophenones such as 4,4′-bismethylaminobenzophenone; phosphine oxides such as 2,4,6-trimethylbenzoyldiphenylphosphine oxide and bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide . The addition ratio of these is usually 0.01 to 30% by weight, preferably 0.1 to 25% by weight, when the solid content of the photosensitive resin composition is 100% by weight.

  These can be used singly or as a mixture of two or more, and further, tertiary amines such as triethanolamine and methyldiethanolamine, N, N-dimethylaminobenzoic acid ethyl ester, N, N-dimethylaminobenzoic acid isoamyl ester Can be used in combination with an accelerator such as a benzoic acid derivative. As the addition amount of these accelerators, an amount of 100% by weight or less is added to the photopolymerization initiator (G) as necessary.

  Furthermore, the photosensitive resin composition of the present invention is a non-reactive compound, an inorganic filler, an organic filler, a silane coupling agent, a tackifier, an antifoaming agent, a leveling agent, a plasticizer, an oxidation, depending on the application. Inhibitors, ultraviolet absorbers, flame retardants, pigments, dyes, and the like can be used as appropriate.

  Specific examples of the non-reactive compound include a liquid or solid oligomer or resin having low reactivity or non-reactivity, and includes an alkyl (meth) acrylate copolymer, an epoxy resin, liquid polybutadiene, Cyclopentagen derivatives, saturated polyester oligomers, xylene resins, polyurethane polymers, ketone resins, diallyl phthalate polymers (dup resins), petroleum resins, rosin resins, fluorine-based oligomers, silicon-based oligomers, phthalate esters, phosphate esters, Glycol esters, citric acid esters, aliphatic dibasic acid esters, fatty acid esters, epoxy plasticizers, castor oils, terpene hydrogenated resin polyisoprene skeletons, oligomers or polymers having polybutadiene skeletons or xylene skeletons, and That S Le product, homopolymer, epoxy-modified polybutadiene, butadiene - styrene random copolymer, polybutene, and the like can be mentioned softening agents etc., but is not limited thereto. The weight ratio of such components in the ultraviolet curable resin composition is usually 10 to 80% by weight, preferably 10 to 70% by weight.

  Examples of the inorganic filler include silicon dioxide, silicon oxide, calcium carbonate, calcium silicate, magnesium carbonate, magnesium oxide, talc, kaolin clay, calcined clay, zinc oxide, zinc sulfate, aluminum hydroxide, aluminum oxide, and glass. , Mica, barium sulfate, alumina white, zeolite, silica balloon, glass balloon, and the like. These inorganic fillers may be added with a silane coupling agent, titanate coupling agent, aluminum coupling agent, zirconate coupling agent, or the like, and reacted to form a halogen group, an epoxy group, a hydroxyl group, or a thiol. It can also have a functional group.

  Examples of the organic filler include benzoguanamine resin, silicone resin, low density polyethylene, high density polyethylene, polyolefin resin, ethylene / acrylic acid copolymer, polystyrene, acrylic copolymer, polymethyl methacrylate resin, fluororesin, Nylon 12, nylon 6/66, phenol resin, epoxy resin, urethane resin, polyimide resin and the like can be mentioned.

  Examples of the silane coupling agent include silane coupling agents such as γ-glycidoxypropyl tremethoxysilane and γ-chloropropyltrimethoxysilane, and tetra (2,2-diallyloxymethyl-1-butyl) bis (ditridecyl). ) Titanate coupling agents such as phosphite titanate and bis (dioctylpyrophosphate) ethylene titanate; Aluminum coupling agents such as acetoalkoxyaluminum diisopropylate; Zirconium coupling agents such as acetylacetone / zirconium complex, etc. be able to.

  Any tackifier, antifoaming agent, leveling agent, plasticizer, antioxidant, ultraviolet absorber, flame retardant, pigment, and dye that can be used in the photosensitive resin composition of the present invention can be used. In the range which does not impair the sclerosis | hardenability and resin characteristic, a thing can be especially used without a restriction | limiting.

In order to obtain the photosensitive resin composition of the present invention, the above-described components may be mixed, and the order and method of mixing are not particularly limited.
When present in the composition of various additives, the weight ratio of the various additives in the photocurable transparent adhesive composition is 0.01 to 3% by weight, preferably 0.01 to 1% by weight, and more preferably. Is 0.02 to 0.5% by weight.

  The photosensitive resin composition of the present invention does not substantially require a solvent. For example, ketones such as methyl ethyl ketone and methyl isobutyl ketone, acetates such as ethyl acetate and butyl acetate, benzene, toluene, xylene and the like It is also possible to dilute and use the photosensitive resin composition of the present invention with other generally used organic solvents such as aromatic hydrocarbons.

  The photosensitive resin composition of the present invention can be polymerized by irradiation with ultraviolet rays or visible rays having a wavelength of 180 to 500 nm. Further, it can be cured by irradiation with energy rays other than ultraviolet rays or by heat.

  Examples of the light generation source of ultraviolet light or visible light having a wavelength of 180 to 500 nm include, for example, a low pressure mercury lamp, a high pressure mercury lamp, an ultrahigh pressure mercury lamp, a metal halide lamp, a chemical lamp, a black light lamp, a mercury-xenon lamp, an excimer lamp, and a short. Examples include arc lamps, helium / cadmium lasers, argon lasers, excimer lasers, and sunlight.

  The photosensitive resin composition of the present invention is excellent in flexibility, weather resistance, light resistance, and optical applications that need to maintain transparency, as well as ink, plastic paint, paper printing, metal coating, furniture It is useful in many fields such as various coating fields such as painting, linings, adhesives, and insulating varnishes, insulating sheets, laminates, printed boards, resist inks, and semiconductor encapsulants in the electronics field. More specific applications include planographic relief inks, flexographic inks, gravure inks, screen inks and other ink fields, glossy fields, paper coating materials fields, wood coating materials fields, beverage can coating materials or printing ink fields, Soft packaging film coating agent, printing ink or adhesive, thermal paper, thermal film coating agent, printing ink, adhesive, adhesive or optical fiber coating agent, liquid crystal display device, organic EL display device, touch panel type image display device It is useful for applications such as air gap fillers for display devices (fillers for gaps between display devices and face plates).

  EXAMPLES Hereinafter, although an Example demonstrates this invention further more concretely, this invention is not limited to the following Example.

Synthesis example 1
GI-2000 manufactured by Nippon Soda Co., Ltd. (iodine value: 12.2, hydroxyl value: 46.8 mg · KOH) as a hydrogenated polybutadiene polyol compound was added to a reactor equipped with a reflux condenser, a stirrer, a thermometer, and a temperature controller. / G) is 523.93 g (0.22 mol), polyethylene glycol 4.64 g (0.012 mol) PEG # 400 (hydroxyl value: 278 mg · KOH / g) manufactured by NOF Corporation, a new polymerizable compound 200.31 g of S-1800A (isostearyl acrylate) manufactured by Nakamura Chemical Co., Ltd. and 0.36 g of 4-methoxyphenol as a polymerization inhibitor were added and stirred until uniform, and the internal temperature was adjusted to 50 ° C. Subsequently, 61.35 g (0.28 mol) of isophorone diisocyanate was added as a polyisocyanate compound and reacted at 80 ° C. until the target NCO content was reached. Next, 11.00 g (0.095 mol) of 2-hydroxyethyl acrylate manufactured by Osaka Organic Chemical Industry Co., Ltd. was used as the (meth) acrylate compound having one or more hydroxyl groups, and tin octylate was added as the urethanization reaction catalyst in an amount of 0.001. 18 g was added and reacted at 80 ° C., and when the NCO content was 0.1% or less, the end point of the reaction was used to obtain a polyurethane compound (E-1).

Synthesis example 2
GI-2000 manufactured by Nippon Soda Co., Ltd. (iodine value: 12.2, hydroxyl value: 46.8 mg · KOH) as a hydrogenated polybutadiene polyol compound was added to a reactor equipped with a reflux condenser, a stirrer, a thermometer, and a temperature controller. / G) 431.62 g (0.18 mol), NOF Co., Ltd. PEG # 400 (hydroxyl value: 278 mg · KOH / g) as polyethylene glycol, 8.07 g (0.020 mol), new as polymerizable compound 167.54 g of S-1800A (isostearyl acrylate) manufactured by Nakamura Chemical Co., Ltd. and 0.30 g of 4-methoxyphenol as a polymerization inhibitor were added and stirred until uniform, and the internal temperature was adjusted to 50 ° C. Subsequently, 53.35 g (0.24 mol) of isophorone diisocyanate was added as a polyisocyanate compound and reacted at 80 ° C. until the target NCO content was reached. Next, 9.57 g (0.082 mol) of 2-hydroxyethyl acrylate manufactured by Osaka Organic Chemical Industry Co., Ltd. was used as the (meth) acrylate compound having one or more hydroxyl groups, and tin octylate was added as the urethanization reaction catalyst in an amount of 0.057 g. A polyurethane compound (E-2) was obtained by adding 15 g and reacting at 80 ° C., and setting the end point of the reaction when the NCO content was 0.1% or less.

Synthesis example 3
GI-2000 manufactured by Nippon Soda Co., Ltd. (iodine value: 12.2, hydroxyl value: 46.8 mg · KOH) as a hydrogenated polybutadiene polyol compound was added to a reactor equipped with a reflux condenser, a stirrer, a thermometer, and a temperature controller. / G) 441.21 g (0.18 mol), NOF Corporation PEG # 2000 (hydroxyl value: 51.6 mg · KOH / g) as polyethylene glycol, 100.04 g (0.046 mol), polymerizable compound 204.54 g of S-1800A (isostearyl acrylate) manufactured by Shin-Nakamura Chemical Co., Ltd. and 0.37 g of 4-methoxyphenol as a polymerization inhibitor were added and stirred until uniform, and the internal temperature was adjusted to 50 ° C. Subsequently, 61.35 g (0.28 mol) of isophorone diisocyanate was added as a polyisocyanate compound and reacted at 80 ° C. until the target NCO content was reached. Next, 11.00 g (0.095 mol) of 2-hydroxyethyl acrylate manufactured by Osaka Organic Chemical Industry Co., Ltd. was used as the (meth) acrylate compound having one or more hydroxyl groups, and tin octylate was added as the urethanization reaction catalyst in an amount of 0.001. 18 g was added and reacted at 80 ° C., and the point where the NCO content was 0.1% or less was set as the end point of the reaction, to obtain a polyurethane compound (E-3).

Synthesis example 4
In a reactor equipped with a reflux condenser, a stirrer, a thermometer, and a temperature control device, as a hydrogenated polybutadiene polyol compound, KRASOL HLBH-P 2000 (iodine value: 13.5, hydroxyl value: 0.89 meq / g) manufactured by CRAY VALEY 404.49 g (0.18 mol), 39.00 g (0.18 mol) of PEG # 200 (hydroxyl value: 518 mg · KOH / g) manufactured by NOF Corporation as polyethylene glycol, and Shin-Nakamura Chemical Co., Ltd. as a polymerizable compound ( 202.20 g of S-1800A (isostearyl acrylate) manufactured by Co., Ltd. and 0.36 g of 4-methoxyphenol as a polymerization inhibitor were added and stirred until uniform, and the internal temperature was adjusted to 50 ° C. Subsequently, 120.04 g (0.54 mol) of isophorone diisocyanate was added as a polyisocyanate compound and reacted at 80 ° C. until the target NCO content was reached. Next, 43.06 g (0.37 mol) of 2-hydroxyethyl acrylate manufactured by Osaka Organic Chemical Industry Co., Ltd. was used as the (meth) acrylate compound having one or more hydroxyl groups, and tin octylate was added as the urethanization reaction catalyst in an amount of 0.03. 18 g was added and reacted at 80 ° C., and the point where the NCO content was 0.1% or less was set as the end point of the reaction, to obtain a polyurethane compound (E-4).

Formulation Example 1
20 parts by mass of the polyurethane compound (E-1) of Synthesis Example 1, 19 parts by mass of S-1800A (isostearyl acrylate) manufactured by Shin-Nakamura Chemical Co., Ltd., 10 parts by mass of Bremer LA (lauryl acrylate) manufactured by NOF Corporation, Yashara Chemical Co., Ltd. Clearon M-105 (aromatically modified hydrogenated terpene resin) 18 parts by mass, JX Nippon Oil & Energy Corporation LV-100 (polybutene) 10 parts by mass, Nippon Soda Co., Ltd. GI-2000 (1,2-hydrogenated polybutadiene glycol) 20 parts by mass, Osaka Organic Chemical Industries, Ltd. 4-HBA (4-hydroxybutyl acrylate) 3 parts by mass, LAMBSON speed cure TPO (2,4,6-trimethyl) 0.5 parts by mass of benzoyldiphenylphosphine oxide) IRGACURE184 (1-hydroxycyclo) manufactured by BASF Hexylphenylketone) 0.5 parts by mass was heated to 70 ° C. and mixed to obtain a resin composition of the present invention. The viscosity of this resin composition was 4200 mPa · s.

Formulation Example 2
20 parts by mass of the polyurethane compound (E-2) of Synthesis Example 2, 19 parts by mass of S-1800A (isostearyl acrylate) manufactured by Shin-Nakamura Chemical Co., Ltd., 10 parts by mass of Bremer LA (lauryl acrylate) manufactured by NOF Corporation, Yashara Chemical Co., Ltd. Clearon M-105 (aromatically modified hydrogenated terpene resin) 18 parts by mass, JX Nippon Oil & Energy Corporation LV-100 (polybutene) 10 parts by mass, Nippon Soda Co., Ltd. GI-2000 (1,2-hydrogenated polybutadiene glycol) 20 parts by mass, Osaka Organic Chemical Industries, Ltd. 4-HBA (4-hydroxybutyl acrylate) 3 parts by mass, LAMBSON speed cure TPO (2,4,6-trimethyl) 0.5 parts by mass of benzoyldiphenylphosphine oxide) IRGACURE184 (1-hydroxycyclo) manufactured by BASF Hexylphenylketone) 0.5 parts by mass was heated to 70 ° C. and mixed to obtain a resin composition of the present invention. The viscosity of this resin composition was 3800 mPa · s.

Formulation Example 3
20 parts by mass of the polyurethane compound (E-3) of Synthesis Example 3, 19 parts by mass of S-1800A (isostearyl acrylate) manufactured by Shin-Nakamura Chemical Co., Ltd., 10 parts by mass of Bremer LA (lauryl acrylate) manufactured by NOF Corporation, Yashara Chemical Co., Ltd. Clearon M-105 (aromatically modified hydrogenated terpene resin) 18 parts by mass, JX Nippon Oil & Energy Corporation LV-100 (polybutene) 10 parts by mass, Nippon Soda Co., Ltd. GI-2000 (1,2-hydrogenated polybutadiene glycol) 20 parts by mass, Osaka Organic Chemical Industries, Ltd. 4-HBA (4-hydroxybutyl acrylate) 3 parts by mass, LAMBSON speed cure TPO (2,4,6-trimethyl) 0.5 parts by mass of benzoyldiphenylphosphine oxide) IRGACURE184 (1-hydroxycyclo) manufactured by BASF Hexylphenylketone) 0.5 parts by mass was heated to 70 ° C. and mixed to obtain a resin composition of the present invention. The viscosity of this resin composition was 4300 mPa · s.

Formulation Example 4
20 parts by mass of the polyurethane compound (E-4) of Synthesis Example 4, 19 parts by mass of S-1800A (isostearyl acrylate) manufactured by Shin-Nakamura Chemical Co., Ltd., 10 parts by mass of Bremer LA (lauryl acrylate) manufactured by NOF Corporation, Yashara Chemical Co., Ltd. Clearon M-105 (aromatically modified hydrogenated terpene resin) 18 parts by mass, JX Nippon Oil & Energy Corporation LV-100 (polybutene) 10 parts by mass, Nippon Soda Co., Ltd. GI-2000 (1,2-hydrogenated polybutadiene glycol) 20 parts by mass, Osaka Organic Chemical Industries, Ltd. 4-HBA (4-hydroxybutyl acrylate) 3 parts by mass, LAMBSON speed cure TPO (2,4,6-trimethyl) 0.5 parts by mass of benzoyldiphenylphosphine oxide) IRGACURE184 (1-hydroxycyclo) manufactured by BASF Hexylphenylketone) 0.5 parts by mass was heated to 70 ° C. and mixed to obtain a resin composition of the present invention. The viscosity of this resin composition was 3000 mPa · s.

Formulation Examples 1 to 4 are shown in Table 1, and the following evaluation was performed.

(Viscosity) It was measured at 25 ° C. using an E-type viscometer (TV-200: manufactured by Toki Sangyo Co., Ltd.).

  (Refractive index) The refractive index (25 ° C.) of the resin was measured with an Abbe refractometer (DR-M2: manufactured by Atago Co., Ltd.).

(Curing shrinkage rate) Two 1 mm thick glass slides coated with a fluorine-based mold release agent were prepared, and the film thickness of the obtained ultraviolet curable resin composition was 200 μm on one mold release agent application surface. It applied so that it might become. Thereafter, the two slide glasses were bonded so that the respective release agent application surfaces face each other. The resin composition was cured by irradiating the resin composition with ultraviolet rays having an integrated light quantity of 3000 mJ / cm ^{2 through} a glass with a high-pressure mercury lamp (80 W / cm, ozone-less). Thereafter, the two slide glasses were peeled off to produce a cured product for measuring the film specific gravity. Based on JIS K7112 B method, specific gravity (DS) of hardened | cured material was measured. Moreover, the liquid specific gravity (DL) of the resin composition was measured at 25 degreeC. From the measurement results of DS and DL, the cure shrinkage rate was calculated from the following formula and found to be less than 2.5%.
Curing shrinkage (%) = (DS−DL) ÷ DS × 100

(Rigidity) Two PET films subjected to a release treatment were prepared, and the obtained ultraviolet curable resin composition was applied to one of the release surfaces so that the film thickness was 200 μm. Thereafter, the two PET films were bonded together such that the release surfaces face each other. The resin composition was cured by irradiating the resin composition with ultraviolet rays having an integrated light quantity of 3000 mJ / cm ^{2 through} a PET film with a high-pressure mercury lamp (80 W / cm, ozone-less). Thereafter, the two PET films were peeled off to prepare a cured product for measuring the rigidity. The rigidity was measured with ARES (manufactured by TA Instruments).

(Transmittance) Two slide glasses having a thickness of 1 mm were prepared, and the obtained ultraviolet curable resin composition was applied to one of them so that the film thickness after curing was 200 μm. Then, two slide glasses were bonded together. The resin composition was cured by irradiating ultraviolet rays with an integrated light amount of 3000 mJ / cm ² with a high-pressure mercury lamp (80 W / cm, ozone-less) through the glass to prepare a cured product for measuring transmittance. About the transparency of the obtained hardened | cured material, the transmittance | permeability in the wavelength range of 400-800 nm and 400-450 nm was measured using the spectrophotometer (U-3310, Hitachi High-Technologies Corporation). As a result, the transmittance of 400 to 800 nm was 90% or more, and the transmittance of 400 to 450 nm was 90% or more.

(Heat and moisture resistant adhesion) A 1 mm thick glass slide and a 1 mm thick glass plate, or a 1 mm thick glass plate with a polarizing film pasted on one side, and an ultraviolet curable resin composition obtained on one side Was applied so that the film thickness was 200 μm, and the other was bonded to the coated surface. Through the glass, the resin composition was irradiated with ultraviolet rays having an integrated light amount of 3000 mJ / cm ² with a high-pressure mercury lamp (80 W / cm, ozone-less), and the resin composition was cured to prepare a sample for evaluating adhesiveness. Using this, a heat resistance test at 85 ° C. and a humidity resistance test at 60 ° C. and 90% RH were conducted and left for 100 hours. In the sample for evaluation, peeling of the cured resin from the glass or polarizing film was confirmed visually, but there was no peeling.

The photosensitive resin composition containing the polyurethane compound of the present invention is useful as an optical use member because it is excellent in flexibility, weather resistance, light resistance, and transparency. Furthermore, the cured product of the photosensitive resin composition of the present invention is useful as an adhesive for bonding a transparent display substrate.

Claims (8)

It contains a polymerizable compound (F) other than polyurethane compounds (E) and (E) obtained by reacting compound (A) and compound (B), compound (C) and compound (D) shown below. The photosensitive resin composition for adhesives which bonds the display body board | substrate characterized by these.
Compound (A): Hydrogenated polybutadiene polyol compound compound (B): Polyethylene glycol compound (C): Polyisocyanate compound compound (D): (meth) acrylate compound having one or more hydroxyl groups The photosensitive resin composition for adhesives for bonding a display substrate according to claim 1, comprising the polyurethane compound (E) according to claim 1, wherein the hydrogenated polybutadiene polyol compound (A) has an iodine value of 20 or less . . The number average molecular weight of the polyethylene glycol (B) is 100 to 4,000. 3. The adhesive for laminating the display substrate according to claim 1 or 2 containing the polyurethane compound (E) according to claim 1 or 2. Photosensitive resin composition . The display substrate according to any one of claims 1 to 3, comprising the polyurethane compound (E) according to any one of claims 1 to 3, wherein the polyisocyanate compound (C) is an aliphatic diisocyanate compound. The photosensitive resin composition for adhesives which bonds together . The polyurethane compound (E) according to any one of claims 1 to 4, wherein the (meth) acrylate compound (D) having one or more hydroxyl groups is 2-hydroxyethyl (meth) acrylate. 5. A photosensitive resin composition for an adhesive, to which the display substrate according to any one of 4 is bonded . Polymerizable compound (F) is an alkyl (meth) acrylate or an alkylene (meth) photosensitive resin composition according to any one of claims 1 to 5 acrylate. The photosensitive resin composition as described in any one of Claims 1 thru | or 6 containing a photoinitiator (G). Hardened | cured material of the photosensitive resin composition as described in any one of Claims 1 thru | or 7 .