TWI730044B - 基板研磨方法、頂環及基板研磨裝置 - Google Patents

基板研磨方法、頂環及基板研磨裝置 Download PDF

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Publication number
TWI730044B
TWI730044B TW106104069A TW106104069A TWI730044B TW I730044 B TWI730044 B TW I730044B TW 106104069 A TW106104069 A TW 106104069A TW 106104069 A TW106104069 A TW 106104069A TW I730044 B TWI730044 B TW I730044B
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TW
Taiwan
Prior art keywords
substrate
polishing
top ring
area
pressure
Prior art date
Application number
TW106104069A
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English (en)
Chinese (zh)
Other versions
TW201801853A (zh
Inventor
磯野慎太郎
安田穂積
並木計介
鍋谷治
福島誠
富樫真吾
山木暁
Original Assignee
日商荏原製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商荏原製作所股份有限公司 filed Critical 日商荏原製作所股份有限公司
Priority to US15/458,513 priority Critical patent/US10464185B2/en
Priority to JP2017048326A priority patent/JP7157521B2/ja
Publication of TW201801853A publication Critical patent/TW201801853A/zh
Application granted granted Critical
Publication of TWI730044B publication Critical patent/TWI730044B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B24B41/047—Grinding heads for working on plane surfaces
    • B24B41/0475—Grinding heads for working on plane surfaces equipped with oscillating abrasive blocks, e.g. mounted on a rotating head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW106104069A 2016-03-15 2017-02-08 基板研磨方法、頂環及基板研磨裝置 TWI730044B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US15/458,513 US10464185B2 (en) 2016-03-15 2017-03-14 Substrate polishing method, top ring, and substrate polishing apparatus
JP2017048326A JP7157521B2 (ja) 2016-03-15 2017-03-14 基板研磨方法、トップリングおよび基板研磨装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-050922 2016-03-15
JP2016050922 2016-03-15

Publications (2)

Publication Number Publication Date
TW201801853A TW201801853A (zh) 2018-01-16
TWI730044B true TWI730044B (zh) 2021-06-11

Family

ID=59870868

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106104069A TWI730044B (zh) 2016-03-15 2017-02-08 基板研磨方法、頂環及基板研磨裝置

Country Status (3)

Country Link
KR (1) KR102292286B1 (ko)
CN (1) CN107186617B (ko)
TW (1) TWI730044B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102561647B1 (ko) * 2018-05-28 2023-07-31 삼성전자주식회사 컨디셔너 및 이를 포함하는 화학 기계적 연마 장치
JP7074606B2 (ja) * 2018-08-02 2022-05-24 株式会社荏原製作所 基板を保持するためのトップリングおよび基板処理装置
KR102712571B1 (ko) * 2018-08-06 2024-10-04 가부시키가이샤 에바라 세이사꾸쇼 기판 보유 지지 장치 및 기판 연마 장치
KR102705647B1 (ko) * 2019-05-02 2024-09-11 삼성전자주식회사 컨디셔너, 이를 포함하는 화학 기계적 연마 장치 및 이 장치를 이용한 반도체 장치의 제조 방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0747167A2 (en) * 1995-06-09 1996-12-11 Applied Materials, Inc. Apparatus for holding a substrate during polishing
US20090191791A1 (en) * 2008-01-30 2009-07-30 Ebara Corporation Polishing method and polishing apparatus
TW201117278A (en) * 2009-07-24 2011-05-16 Semes Co Ltd Substrate polishing apparatus and method of polishing substrate using the same
US20110159783A1 (en) * 2008-08-21 2011-06-30 Makoto Fukushima Method and apparatus for polishing a substrate
US20150273657A1 (en) * 2014-03-27 2015-10-01 Ebara Corporation Elastic membrane, substrate holding apparatus, and polishing apparatus

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4718107B2 (ja) * 2003-05-20 2011-07-06 株式会社荏原製作所 基板保持装置及び研磨装置
TWI674171B (zh) * 2012-01-31 2019-10-11 日商荏原製作所股份有限公司 基板保持裝置、研磨裝置、及研磨方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0747167A2 (en) * 1995-06-09 1996-12-11 Applied Materials, Inc. Apparatus for holding a substrate during polishing
US20090191791A1 (en) * 2008-01-30 2009-07-30 Ebara Corporation Polishing method and polishing apparatus
JP2009178800A (ja) * 2008-01-30 2009-08-13 Ebara Corp 研磨方法及び研磨装置
US20110159783A1 (en) * 2008-08-21 2011-06-30 Makoto Fukushima Method and apparatus for polishing a substrate
TW201117278A (en) * 2009-07-24 2011-05-16 Semes Co Ltd Substrate polishing apparatus and method of polishing substrate using the same
US20150273657A1 (en) * 2014-03-27 2015-10-01 Ebara Corporation Elastic membrane, substrate holding apparatus, and polishing apparatus

Also Published As

Publication number Publication date
KR20170107381A (ko) 2017-09-25
TW201801853A (zh) 2018-01-16
CN107186617A (zh) 2017-09-22
CN107186617B (zh) 2021-02-05
KR102292286B1 (ko) 2021-08-24

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