TWI727026B - 硬化性組成物，硬化物之製造方法及其硬化物 - Google Patents

硬化性組成物，硬化物之製造方法及其硬化物 Download PDF

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Publication number
TWI727026B
TWI727026B TW106110860A TW106110860A TWI727026B TW I727026 B TWI727026 B TW I727026B TW 106110860 A TW106110860 A TW 106110860A TW 106110860 A TW106110860 A TW 106110860A TW I727026 B TWI727026 B TW I727026B
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TW
Taiwan
Prior art keywords
group
carbon atoms
aforementioned
formula
compound
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TW106110860A
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English (en)
Chinese (zh)
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TW201809020A (zh
Inventor
松土和彦
渡辺智志
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日商Ａｄｅｋａ股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F210/00—Copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16—Cyclic ethers having four or more ring atoms
    • C08G65/18—Oxetanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/101—Esters; Ether-esters of monocarboxylic acids
    • C08K5/103—Esters; Ether-esters of monocarboxylic acids with polyalcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Polyethers (AREA)
TW106110860A 2016-03-30 2017-03-30 硬化性組成物，硬化物之製造方法及其硬化物 TWI727026B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-069794 2016-03-30
JP2016069794 2016-03-30

Publications (2)

Publication Number Publication Date
TW201809020A TW201809020A (zh) 2018-03-16
TWI727026B true TWI727026B (zh) 2021-05-11

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW106110860A TWI727026B (zh) 2016-03-30 2017-03-30 硬化性組成物，硬化物之製造方法及其硬化物

Country Status (5)

Country Link
JP (1) JP6910347B2 (ko)
KR (1) KR102356563B1 (ko)
CN (1) CN108779321B (ko)
TW (1) TWI727026B (ko)
WO (1) WO2017170881A1 (ko)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104745104A (zh) * 2013-12-25 2015-07-01 东亚合成株式会社 光固化性粘接剂组合物、偏光板及其制造方法、光学构件以及液晶显示装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI251123B (en) * 1999-09-17 2006-03-11 Hitachi Chemical Co Ltd Photosensitive resin composition, photosensitive element using the resin composition, method of manufacturing resist pattern, and method of manufacturing printed wiring board
KR20120086737A (ko) * 2002-05-03 2012-08-03 디에스엠 아이피 어셋츠 비.브이. 방사선 경화성 수지 조성물 및 이를 이용한 급속 성형법
EP1728826B1 (en) * 2004-03-26 2011-04-20 Kaneka Corporation Composition curable by both free-radical photocuring and cationic photocuring
JP4667145B2 (ja) * 2004-07-22 2011-04-06 三井化学株式会社 光硬化型樹脂組成物及びそれからなるプラスチック用樹脂組成物
CN102272227B (zh) * 2009-03-13 2014-03-12 帝斯曼知识产权资产管理有限公司 可辐射固化树脂组合物以及使用这种组合物的快速三维成像方法
JP5240380B1 (ja) * 2011-07-05 2013-07-17 Ｊｓｒ株式会社 樹脂組成物、重合体、硬化膜および電子部品
JP6103687B2 (ja) 2012-11-22 2017-03-29 チェイル インダストリーズ インコーポレイテッド 偏光板用接着剤組成物
CN104813741B (zh) * 2012-11-28 2018-01-05 日本化药株式会社 树脂组合物及其固化物(1)
JP6164609B2 (ja) 2013-08-23 2017-07-19 東亞合成株式会社 光硬化性接着剤組成物、偏光板とその製造法、光学部材及び液晶表示装置
JPWO2015068454A1 (ja) * 2013-11-07 2017-03-09 積水化学工業株式会社 有機エレクトロルミネッセンス表示素子用封止剤
JP6337523B2 (ja) 2014-03-07 2018-06-06 東洋インキＳｃホールディングス株式会社 活性エネルギー線重合性樹脂組成物および積層体
JP6222637B2 (ja) * 2014-03-19 2017-11-01 富士フイルム株式会社 重合性非線形光学材料、非線形光学膜、光学素子、光変調素子、及び非線形光学膜の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104745104A (zh) * 2013-12-25 2015-07-01 东亚合成株式会社 光固化性粘接剂组合物、偏光板及其制造方法、光学构件以及液晶显示装置

Also Published As

Publication number Publication date
CN108779321A (zh) 2018-11-09
JPWO2017170881A1 (ja) 2019-02-07
WO2017170881A1 (ja) 2017-10-05
WO2017170881A9 (ja) 2021-04-01
CN108779321B (zh) 2021-04-02
JP6910347B2 (ja) 2021-07-28
KR102356563B1 (ko) 2022-01-26
KR20180132071A (ko) 2018-12-11
TW201809020A (zh) 2018-03-16

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