TWI719896B - 黏晶裝置,剝離單元,夾頭及半導體裝置的製造方法 - Google Patents
黏晶裝置,剝離單元,夾頭及半導體裝置的製造方法 Download PDFInfo
- Publication number
- TWI719896B TWI719896B TW109115701A TW109115701A TWI719896B TW I719896 B TWI719896 B TW I719896B TW 109115701 A TW109115701 A TW 109115701A TW 109115701 A TW109115701 A TW 109115701A TW I719896 B TWI719896 B TW I719896B
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- Prior art keywords
- die
- dicing tape
- chuck
- movable platform
- aforementioned
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims description 18
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000013078 crystal Substances 0.000 claims abstract description 36
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- 238000000034 method Methods 0.000 claims description 30
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- 238000010586 diagram Methods 0.000 description 17
- 239000010408 film Substances 0.000 description 17
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- 238000000465 moulding Methods 0.000 description 2
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- 229920005989 resin Polymers 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
- H01L2221/6839—Separation by peeling using peeling wedge or knife or bar
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019168865A JP7377654B2 (ja) | 2019-09-17 | 2019-09-17 | ダイボンディング装置、剥離ユニット、コレットおよび半導体装置の製造方法 |
JP2019-168865 | 2019-09-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI719896B true TWI719896B (zh) | 2021-02-21 |
TW202113992A TW202113992A (zh) | 2021-04-01 |
Family
ID=74876585
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109115701A TWI719896B (zh) | 2019-09-17 | 2020-05-12 | 黏晶裝置,剝離單元,夾頭及半導體裝置的製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7377654B2 (ko) |
KR (1) | KR102430326B1 (ko) |
CN (1) | CN112530834B (ko) |
TW (1) | TWI719896B (ko) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050081986A1 (en) * | 2003-10-15 | 2005-04-21 | Heung-Kyu Kwon | Die bonding apparatus and method for bonding semiconductor chip using the same |
US20100055878A1 (en) * | 2006-05-23 | 2010-03-04 | Renesas Technology Corp. | Fabrication Method of Semiconductor Device |
US20150348882A1 (en) * | 2014-06-02 | 2015-12-03 | Infineon Technologies Ag | Three-dimensional stack of leaded package and electronic member |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4226489B2 (ja) * | 2004-02-25 | 2009-02-18 | 日東電工株式会社 | チップのピックアップ方法 |
JP2005322815A (ja) * | 2004-05-11 | 2005-11-17 | Matsushita Electric Ind Co Ltd | 半導体製造装置および半導体装置の製造方法 |
JP4664150B2 (ja) * | 2005-08-05 | 2011-04-06 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法および半導体製造装置 |
JP5160135B2 (ja) * | 2007-04-18 | 2013-03-13 | キヤノンマシナリー株式会社 | 半導体装置の製造装置及び製造方法 |
JP4397429B1 (ja) | 2009-03-05 | 2010-01-13 | 株式会社新川 | 半導体ダイのピックアップ装置及びピックアップ方法 |
JP5284144B2 (ja) * | 2009-03-11 | 2013-09-11 | 芝浦メカトロニクス株式会社 | 半導体チップのピックアップ装置及びピックアップ方法 |
KR101562021B1 (ko) * | 2009-08-11 | 2015-10-20 | 삼성전자주식회사 | 반도체 칩 부착 장치 및 반도체 칩 부착 방법 |
JP5813432B2 (ja) * | 2011-09-19 | 2015-11-17 | ファスフォードテクノロジ株式会社 | ダイボンダ及びボンディング方法 |
KR101385443B1 (ko) * | 2013-09-13 | 2014-04-16 | 이향이 | 반도체 칩 픽업 이송용 콜렛 |
JP6349496B2 (ja) * | 2014-02-24 | 2018-07-04 | 株式会社新川 | 半導体ダイのピックアップ装置及びピックアップ方法 |
JP6018670B2 (ja) | 2015-06-15 | 2016-11-02 | 株式会社東芝 | ダイボンディング装置、および、ダイボンディング方法 |
EP3234992B1 (de) * | 2016-01-29 | 2018-09-26 | JENOPTIK Optical Systems GmbH | Verfahren und vorrichtung zum herauslösen eines mikro-chips aus einem wafer und aufbringen des mikro-chips auf ein substrat |
JP6621771B2 (ja) * | 2017-01-25 | 2019-12-18 | ファスフォードテクノロジ株式会社 | 半導体製造装置および半導体装置の製造方法 |
JP6653273B2 (ja) * | 2017-01-26 | 2020-02-26 | ファスフォードテクノロジ株式会社 | 半導体製造装置および半導体装置の製造方法 |
JP6941513B2 (ja) * | 2017-09-07 | 2021-09-29 | ファスフォードテクノロジ株式会社 | 半導体製造装置および半導体装置の製造方法 |
JP6967411B2 (ja) * | 2017-09-19 | 2021-11-17 | ファスフォードテクノロジ株式会社 | 半導体製造装置、半導体装置の製造方法およびコレット |
-
2019
- 2019-09-17 JP JP2019168865A patent/JP7377654B2/ja active Active
-
2020
- 2020-05-12 TW TW109115701A patent/TWI719896B/zh active
- 2020-07-02 KR KR1020200081390A patent/KR102430326B1/ko active IP Right Grant
- 2020-08-04 CN CN202010770198.7A patent/CN112530834B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050081986A1 (en) * | 2003-10-15 | 2005-04-21 | Heung-Kyu Kwon | Die bonding apparatus and method for bonding semiconductor chip using the same |
US20100055878A1 (en) * | 2006-05-23 | 2010-03-04 | Renesas Technology Corp. | Fabrication Method of Semiconductor Device |
US20150348882A1 (en) * | 2014-06-02 | 2015-12-03 | Infineon Technologies Ag | Three-dimensional stack of leaded package and electronic member |
Also Published As
Publication number | Publication date |
---|---|
KR102430326B1 (ko) | 2022-08-08 |
TW202113992A (zh) | 2021-04-01 |
CN112530834A (zh) | 2021-03-19 |
KR20210032893A (ko) | 2021-03-25 |
JP2021048201A (ja) | 2021-03-25 |
JP7377654B2 (ja) | 2023-11-10 |
CN112530834B (zh) | 2024-03-08 |
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