TWI717608B - 超音波加工裝置 - Google Patents

超音波加工裝置 Download PDF

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Publication number
TWI717608B
TWI717608B TW107117697A TW107117697A TWI717608B TW I717608 B TWI717608 B TW I717608B TW 107117697 A TW107117697 A TW 107117697A TW 107117697 A TW107117697 A TW 107117697A TW I717608 B TWI717608 B TW I717608B
Authority
TW
Taiwan
Prior art keywords
ultrasonic
ultrasonic unit
guide
holder
processing device
Prior art date
Application number
TW107117697A
Other languages
English (en)
Chinese (zh)
Other versions
TW201900385A (zh
Inventor
高崎光也
Original Assignee
日商日本磁性技術控股股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日本磁性技術控股股份有限公司 filed Critical 日商日本磁性技術控股股份有限公司
Publication of TW201900385A publication Critical patent/TW201900385A/zh
Application granted granted Critical
Publication of TWI717608B publication Critical patent/TWI717608B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B35/00—Machines or devices designed for superfinishing surfaces on work, i.e. by means of abrading blocks reciprocating with high frequency
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW107117697A 2017-05-25 2018-05-24 超音波加工裝置 TWI717608B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017103891A JP6286600B1 (ja) 2017-05-25 2017-05-25 超音波加工装置
JP2017-103891 2017-05-25

Publications (2)

Publication Number Publication Date
TW201900385A TW201900385A (zh) 2019-01-01
TWI717608B true TWI717608B (zh) 2021-02-01

Family

ID=61282705

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107117697A TWI717608B (zh) 2017-05-25 2018-05-24 超音波加工裝置

Country Status (4)

Country Link
EP (1) EP3632615A4 (ja)
JP (1) JP6286600B1 (ja)
TW (1) TWI717608B (ja)
WO (1) WO2018216720A1 (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62225280A (ja) * 1986-03-25 1987-10-03 斎藤　長男 超音波振動を振動工具に伝達する方法
CA2792976A1 (en) * 2010-03-12 2011-09-15 Structural Integrity Technologies Inc. Ultrasonic instrument for the deformation treatment of surfaces and weld joints

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5994591A (ja) * 1982-11-20 1984-05-31 Brother Ind Ltd 超音波加工機械
JPS6458464A (en) * 1987-08-25 1989-03-06 Cho Onpa Kogyo Co Supersonic wave attachment
JPH0226388A (ja) * 1988-07-15 1990-01-29 Mitsubishi Electric Corp 配管の支持装置
JPH0453610A (ja) * 1990-06-20 1992-02-21 Toshiba Ceramics Co Ltd 超音波ロータリ穴明機用工具振れ止め治具
JPWO2005049255A1 (ja) * 2003-11-20 2007-06-07 大西　一正 機械加工装置
JP2012035374A (ja) 2010-08-09 2012-02-23 Mitsui Eng & Shipbuild Co Ltd 超音波加工方法およびその装置
CN202062262U (zh) * 2011-04-28 2011-12-07 北京市电加工研究所 拉丝模超声波整形抛光机
JP6042120B2 (ja) * 2012-07-06 2016-12-14 株式会社ニフコ 超音波加工装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62225280A (ja) * 1986-03-25 1987-10-03 斎藤　長男 超音波振動を振動工具に伝達する方法
CA2792976A1 (en) * 2010-03-12 2011-09-15 Structural Integrity Technologies Inc. Ultrasonic instrument for the deformation treatment of surfaces and weld joints

Also Published As

Publication number Publication date
EP3632615A4 (en) 2021-03-24
JP6286600B1 (ja) 2018-02-28
TW201900385A (zh) 2019-01-01
WO2018216720A1 (ja) 2018-11-29
EP3632615A1 (en) 2020-04-08
JP2018199174A (ja) 2018-12-20

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