TWI717394B - 具有熱阻流件之靜電卡盤 - Google Patents

具有熱阻流件之靜電卡盤 Download PDF

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Publication number
TWI717394B
TWI717394B TW105131840A TW105131840A TWI717394B TW I717394 B TWI717394 B TW I717394B TW 105131840 A TW105131840 A TW 105131840A TW 105131840 A TW105131840 A TW 105131840A TW I717394 B TWI717394 B TW I717394B
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TW
Taiwan
Prior art keywords
thermal
semiconductor processing
esc
electrostatic chuck
top plate
Prior art date
Application number
TW105131840A
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English (en)
Chinese (zh)
Other versions
TW201725652A (zh
Inventor
龍茂林
艾立克斯 派特森
垠 吳
關 周
Original Assignee
美商蘭姆研究公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商蘭姆研究公司 filed Critical 美商蘭姆研究公司
Publication of TW201725652A publication Critical patent/TW201725652A/zh
Application granted granted Critical
Publication of TWI717394B publication Critical patent/TWI717394B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW105131840A 2015-10-05 2016-10-03 具有熱阻流件之靜電卡盤 TWI717394B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/875,473 2015-10-05
US14/875,473 US9805963B2 (en) 2015-10-05 2015-10-05 Electrostatic chuck with thermal choke

Publications (2)

Publication Number Publication Date
TW201725652A TW201725652A (zh) 2017-07-16
TWI717394B true TWI717394B (zh) 2021-02-01

Family

ID=58448019

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105131840A TWI717394B (zh) 2015-10-05 2016-10-03 具有熱阻流件之靜電卡盤

Country Status (4)

Country Link
US (1) US9805963B2 (https=)
JP (1) JP6930826B2 (https=)
KR (1) KR102648014B1 (https=)
TW (1) TWI717394B (https=)

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TWI635282B (zh) * 2017-08-29 2018-09-11 創意電子股份有限公司 半導體元件之測試設備及其搬運裝置
US11515130B2 (en) * 2018-03-05 2022-11-29 Applied Materials, Inc. Fast response pedestal assembly for selective preclean
CN110911332B (zh) * 2018-09-14 2022-11-25 北京北方华创微电子装备有限公司 静电卡盘
JP7002014B2 (ja) * 2018-10-30 2022-01-20 Toto株式会社 静電チャック
CN111668151B (zh) * 2019-03-05 2024-06-25 Toto株式会社 静电吸盘及处理装置
JP7441404B2 (ja) 2019-03-05 2024-03-01 Toto株式会社 静電チャック、および処理装置
US12131890B2 (en) 2019-03-08 2024-10-29 Lam Research Corporation Chuck for plasma processing chamber
KR102810211B1 (ko) * 2019-06-07 2025-05-19 어플라이드 머티어리얼스, 인코포레이티드 심리스 전기 도관
CN112768331B (zh) * 2019-11-01 2023-09-29 中微半导体设备(上海)股份有限公司 一种等离子体处理装置及其下电极组件、静电卡盘
JP7550551B2 (ja) * 2020-06-30 2024-09-13 京セラ株式会社 静電チャック
US20220301914A1 (en) * 2021-03-22 2022-09-22 Tokyo Electron Limited Electrostatic chuck for a plasma processing apparatus
JP7725614B2 (ja) * 2021-05-14 2025-08-19 アプライド マテリアルズ インコーポレイテッド 高速排熱能力を備えた高温サセプタ
US12563991B2 (en) * 2021-08-25 2026-02-24 Applied Materials, Inc. Thermal choke plate
US11764094B2 (en) * 2022-02-18 2023-09-19 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor processing tool and methods of operation
JP7845786B2 (ja) * 2022-04-27 2026-04-14 東京エレクトロン株式会社 基板処理方法及び基板処理装置

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US20080218931A1 (en) * 2007-03-09 2008-09-11 Taiwan Semiconductor Manufacturing Co., Ltd. System for decharging a wafer or substrate after dechucking from an electrostatic chuck
US20100116788A1 (en) * 2008-11-12 2010-05-13 Lam Research Corporation Substrate temperature control by using liquid controlled multizone substrate support

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JPH07183277A (ja) * 1993-12-21 1995-07-21 Tokyo Electron Ltd 処理装置
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JP5203612B2 (ja) * 2007-01-17 2013-06-05 株式会社日立ハイテクノロジーズ プラズマ処理装置
KR101582785B1 (ko) 2008-08-12 2016-01-07 어플라이드 머티어리얼스, 인코포레이티드 정전 척 조립체
JP5198226B2 (ja) * 2008-11-20 2013-05-15 東京エレクトロン株式会社 基板載置台および基板処理装置
JP5143184B2 (ja) 2010-05-07 2013-02-13 日本碍子株式会社 ウエハー載置装置の製造方法
JP6052169B2 (ja) * 2011-04-27 2016-12-27 住友大阪セメント株式会社 静電チャック装置
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JP6077301B2 (ja) * 2012-12-28 2017-02-08 日本特殊陶業株式会社 静電チャック
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TW201518538A (zh) 2013-11-11 2015-05-16 應用材料股份有限公司 像素化冷卻溫度控制的基板支撐組件

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Publication number Priority date Publication date Assignee Title
US20030047283A1 (en) * 2001-09-10 2003-03-13 Applied Materials, Inc. Apparatus for supporting a substrate and method of fabricating same
US20080218931A1 (en) * 2007-03-09 2008-09-11 Taiwan Semiconductor Manufacturing Co., Ltd. System for decharging a wafer or substrate after dechucking from an electrostatic chuck
US20100116788A1 (en) * 2008-11-12 2010-05-13 Lam Research Corporation Substrate temperature control by using liquid controlled multizone substrate support

Also Published As

Publication number Publication date
JP2017085089A (ja) 2017-05-18
KR102648014B1 (ko) 2024-03-14
JP6930826B2 (ja) 2021-09-01
TW201725652A (zh) 2017-07-16
US20170098566A1 (en) 2017-04-06
US9805963B2 (en) 2017-10-31
KR20170044012A (ko) 2017-04-24

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