TWI716210B - 表面處理銅箔、覆銅積層板及印刷配線板 - Google Patents

表面處理銅箔、覆銅積層板及印刷配線板 Download PDF

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Publication number
TWI716210B
TWI716210B TW108144080A TW108144080A TWI716210B TW I716210 B TWI716210 B TW I716210B TW 108144080 A TW108144080 A TW 108144080A TW 108144080 A TW108144080 A TW 108144080A TW I716210 B TWI716210 B TW I716210B
Authority
TW
Taiwan
Prior art keywords
copper foil
treated
treatment layer
layer
surface treatment
Prior art date
Application number
TW108144080A
Other languages
English (en)
Chinese (zh)
Other versions
TW202028484A (zh
Inventor
五刀郁浩
三木敦史
宮本宣明
Original Assignee
日商Ｊｘ金屬股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Ｊｘ金屬股份有限公司 filed Critical 日商Ｊｘ金屬股份有限公司
Publication of TW202028484A publication Critical patent/TW202028484A/zh
Application granted granted Critical
Publication of TWI716210B publication Critical patent/TWI716210B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/16—Electroplating with layers of varying thickness
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW108144080A 2019-01-30 2019-12-03 表面處理銅箔、覆銅積層板及印刷配線板 TWI716210B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019014795A JP7114499B2 (ja) 2019-01-30 2019-01-30 表面処理銅箔、銅張積層板及びプリント配線板
JPJP2019-014795 2019-01-30

Publications (2)

Publication Number Publication Date
TW202028484A TW202028484A (zh) 2020-08-01
TWI716210B true TWI716210B (zh) 2021-01-11

Family

ID=71842054

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108144080A TWI716210B (zh) 2019-01-30 2019-12-03 表面處理銅箔、覆銅積層板及印刷配線板

Country Status (3)

Country Link
JP (1) JP7114499B2 (ja)
TW (1) TWI716210B (ja)
WO (1) WO2020158140A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI747088B (zh) * 2019-01-30 2021-11-21 日商Ｊｘ金屬股份有限公司 表面處理銅箔、覆銅積層板及印刷配線板

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022138837A1 (ja) * 2020-12-24 2022-06-30 日本製鉄株式会社 チタン材
KR20230159392A (ko) * 2021-03-26 2023-11-21 미쓰이금속광업주식회사 조화 처리 구리박, 캐리어를 구비한 구리박, 동장 적층판 및 프린트 배선판
WO2022202541A1 (ja) * 2021-03-26 2022-09-29 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
KR20240017840A (ko) * 2021-06-03 2024-02-08 미쓰이금속광업주식회사 조화 처리 구리박, 동장 적층판 및 프린트 배선판
WO2023281775A1 (ja) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
CN117769491A (zh) 2021-08-06 2024-03-26 索尼集团公司 铜箔层压板及印刷线路板

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007268596A (ja) * 2006-03-31 2007-10-18 Nikko Kinzoku Kk 粗化処理用銅合金箔
JP2011009207A (ja) * 2009-05-29 2011-01-13 Jx Nippon Mining & Metals Corp リチウム電池集電体用圧延銅箔
JP2016036829A (ja) * 2014-08-07 2016-03-22 Jx日鉱日石金属株式会社 圧延銅箔及びそれを用いた二次電池用集電体
TW201712128A (zh) * 2015-09-24 2017-04-01 Jx Nippon Mining & Metals Corp 金屬箔、附離型層金屬箔、積層體、印刷電路板、半導體封裝、電子機器及印刷電路板之製造方法
TW201717713A (zh) * 2015-09-24 2017-05-16 Jx Nippon Mining & Metals Corp 金屬箔、附脫模層之金屬箔、積層體、印刷配線板、半導體封裝、電子機器及印刷配線板之製造方法
TW201832628A (zh) * 2017-02-02 2018-09-01 日商Ｊｘ金屬股份有限公司 附脫模層金屬箔、金屬箔、積層體、印刷配線板、半導體封裝、電子機器及印刷配線板的製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5871426B2 (ja) 2012-01-31 2016-03-01 古河電気工業株式会社 高周波伝送用表面処理銅箔、高周波伝送用積層板及び高周波伝送用プリント配線板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007268596A (ja) * 2006-03-31 2007-10-18 Nikko Kinzoku Kk 粗化処理用銅合金箔
JP2011009207A (ja) * 2009-05-29 2011-01-13 Jx Nippon Mining & Metals Corp リチウム電池集電体用圧延銅箔
JP2016036829A (ja) * 2014-08-07 2016-03-22 Jx日鉱日石金属株式会社 圧延銅箔及びそれを用いた二次電池用集電体
TW201712128A (zh) * 2015-09-24 2017-04-01 Jx Nippon Mining & Metals Corp 金屬箔、附離型層金屬箔、積層體、印刷電路板、半導體封裝、電子機器及印刷電路板之製造方法
TW201717713A (zh) * 2015-09-24 2017-05-16 Jx Nippon Mining & Metals Corp 金屬箔、附脫模層之金屬箔、積層體、印刷配線板、半導體封裝、電子機器及印刷配線板之製造方法
TW201832628A (zh) * 2017-02-02 2018-09-01 日商Ｊｘ金屬股份有限公司 附脫模層金屬箔、金屬箔、積層體、印刷配線板、半導體封裝、電子機器及印刷配線板的製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI747088B (zh) * 2019-01-30 2021-11-21 日商Ｊｘ金屬股份有限公司 表面處理銅箔、覆銅積層板及印刷配線板

Also Published As

Publication number Publication date
TW202028484A (zh) 2020-08-01
WO2020158140A1 (ja) 2020-08-06
JP2020122189A (ja) 2020-08-13
JP7114499B2 (ja) 2022-08-08

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