TWI715019B - 奈米複合材料及其製備方法及封裝結構 - Google Patents
奈米複合材料及其製備方法及封裝結構 Download PDFInfo
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- TWI715019B TWI715019B TW108114353A TW108114353A TWI715019B TW I715019 B TWI715019 B TW I715019B TW 108114353 A TW108114353 A TW 108114353A TW 108114353 A TW108114353 A TW 108114353A TW I715019 B TWI715019 B TW I715019B
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- fluorine
- titanium dioxide
- doped titanium
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- 239000002114 nanocomposite Substances 0.000 title claims abstract description 58
- 239000000463 material Substances 0.000 title claims abstract description 43
- 238000000034 method Methods 0.000 title claims abstract description 11
- 239000000853 adhesive Substances 0.000 claims abstract description 42
- 230000001070 adhesive effect Effects 0.000 claims abstract description 42
- SOQBVABWOPYFQZ-UHFFFAOYSA-N oxygen(2-);titanium(4+) Chemical compound [O-2].[O-2].[Ti+4] SOQBVABWOPYFQZ-UHFFFAOYSA-N 0.000 claims abstract description 17
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 78
- 239000004408 titanium dioxide Substances 0.000 claims description 38
- 239000002073 nanorod Substances 0.000 claims description 37
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 22
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 claims description 18
- HJIMAFKWSKZMBK-UHFFFAOYSA-N 3,3,4,4,5,5,6,6,7,7,8,8,9,9,10,10,10-heptadecafluorodecyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F HJIMAFKWSKZMBK-UHFFFAOYSA-N 0.000 claims description 14
- 229920006280 packaging film Polymers 0.000 claims description 11
- 239000012785 packaging film Substances 0.000 claims description 11
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 claims description 9
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 claims description 9
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 claims description 9
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 9
- 239000005642 Oleic acid Substances 0.000 claims description 9
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 claims description 9
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 claims description 9
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 claims description 9
- 238000002360 preparation method Methods 0.000 claims description 8
- 238000004806 packaging method and process Methods 0.000 claims description 7
- 238000003980 solgel method Methods 0.000 claims description 6
- 230000002378 acidificating effect Effects 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000003054 catalyst Substances 0.000 claims description 3
- 239000012153 distilled water Substances 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 239000002243 precursor Substances 0.000 claims description 3
- 239000004094 surface-active agent Substances 0.000 claims description 3
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 claims description 2
- -1 trimethylamine -N-oxide anhydride Chemical class 0.000 claims description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 5
- 229910052731 fluorine Inorganic materials 0.000 description 5
- 239000011737 fluorine Substances 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000012780 transparent material Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- LWZXTNAYLTXIPM-UHFFFAOYSA-N 1,1,2,2,10,10,10-heptafluorodecyl(trimethoxy)silane Chemical compound FC(C([Si](OC)(OC)OC)(F)F)(CCCCCCCC(F)(F)F)F LWZXTNAYLTXIPM-UHFFFAOYSA-N 0.000 description 1
- LLLWMXQKXWIRDZ-UHFFFAOYSA-N 1-ethenylpyrrolidin-2-one Chemical compound C=CN1CCCC1=O.C=CN1CCCC1=O LLLWMXQKXWIRDZ-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- VLCAYQIMSMPEBW-UHFFFAOYSA-N methyl 3-hydroxy-2-methylidenebutanoate Chemical compound COC(=O)C(=C)C(C)O VLCAYQIMSMPEBW-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- UYPYRKYUKCHHIB-UHFFFAOYSA-N trimethylamine N-oxide Chemical compound C[N+](C)(C)[O-] UYPYRKYUKCHHIB-UHFFFAOYSA-N 0.000 description 1
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Abstract
一種奈米複合材料的製備方法,其包括:製備氟摻雜的二氧化鈦奈米棒;將所述氟摻雜的二氧化鈦奈米棒分散於透明黏合劑中,得到奈米複合黏合劑;以及處理所述奈米複合黏合劑的表面,使其表面粗糙化並暴露出部分所述氟摻雜的二氧化鈦奈米棒,得到透明的奈米複合材料。還提供一種奈米複合材料,以及應用該奈米複合材料的封裝結構。
Description
本發明涉及奈米材料製備技術領域,尤其涉及一種奈米複合材料、其製備方法以及應用其的封裝結構。
透明材料可用於如電子書、柔性顯示器以及柔性太陽能電池等器件的封裝材料。然,當透明材料的表面積累水和油時,會干擾材料的透明度。是故,需要開發一種用於器件封裝的疏水和疏油的透明材料。
本發明提供一種奈米複合材料的製備方法,其包括:步驟S1:製備氟摻雜的二氧化鈦奈米棒;步驟S2:將所述氟摻雜的二氧化鈦奈米棒分散於透明黏合劑中,得到奈米複合黏合劑;以及步驟S3:處理所述奈米複合黏合劑的表面,使其表面粗糙化並暴露出部分所述氟摻雜的二氧化鈦奈米棒,得到透明的奈米複合材料。
本發明還提供一種奈米複合材料,其包括:
透明黏合劑;以及氟摻雜的二氧化鈦奈米棒,分散於所述透明黏合劑中,其中,部分所述氟摻雜的二氧化鈦奈米棒從所述透明黏合劑的表面暴露出。
本發明還提供一種封裝結構,其包括:基底;器件,設置於所述基底的一表面上;以及封裝膜,其覆蓋所述器件並延伸部分覆蓋所述基底以將所述器件封裝於所述基底上,所述封裝膜採用上述的奈米複合材料形成,且所述氟摻雜的二氧化鈦奈米棒從封裝膜遠離所述器件及所述基底的表面暴露出。
本發明提供的奈米複合材料的製備方法,藉由等離子體處理使部分氟摻雜的二氧化鈦奈米棒暴露出,使得該奈米複合材料具有表面改性的二氧化鈦奈米紋理粗糙表面。另,奈米複合材料的表面暴露的氟摻雜的二氧化鈦奈米棒為氟基材料,使得奈米複合材料具有較低的表面能。是故,該奈米複合材料具有奈米紋理粗糙表面和較低的表面能,表現出較佳的疏水性和疏油性。
100:封裝結構
20:基底
30:器件
40:電極
50:封裝膜
10:奈米複合材料
11:奈米複合黏合劑
111:透明黏合劑
112:氟摻雜的二氧化鈦奈米棒
S1、S2、S3:步驟
圖1為本發明實施例的奈米複合材料的製備方法的流程示意圖。
圖2為本發明實施例的奈米複合材料的製備方法中各步驟的結構示意圖。
圖3為本發明實施例的封裝結構的剖面示意圖。
請同時參閱圖1和圖2,本發明一實施例提供的奈米複合材料10的製備方法,包括:
步驟S1:製備氟摻雜的二氧化鈦奈米棒112。
步驟S2:將氟摻雜的二氧化鈦奈米棒112分散於透明黏合劑111中,得到奈米複合黏合劑11。
步驟S3:處理奈米複合黏合劑11的表面,使其表面粗糙化並暴露出部分氟摻雜的二氧化鈦奈米棒112,得到透明的奈米複合材料10。
於一實施例中,步驟S1包括採用溶膠-凝膠的方法製備氟摻雜的二氧化鈦奈米棒112的步驟。
於一實施例中,步驟S1中,在採用溶膠-凝膠的方法製備氟摻雜的二氧化鈦奈米棒112的步驟之前,還包括製備水解的1H,1H,2H,2H-全氟癸基三甲氧基矽烷(1H,1H,2H,2H-perfluorodecyl trimethoxysilane,PFDTMES)溶液的步驟。其中,1H,1H,2H,2H-全氟癸基三甲氧基矽烷又稱十七氟癸基三甲氧基矽烷,其分子式為C13H13F17O3Si,其化學式為:
於一實施例中,製備水解的1H,1H,2H,2H-全氟癸基三甲氧基矽烷的步驟包括將蒸餾水、乙醇及乙酸混合,獲得酸性乙醇溶液;然後將1H,1H,2H,2H-全氟癸基三甲氧基矽烷加入酸性乙醇溶液中,在室溫條件下攪拌,得到水解的1H,1H,2H,2H-全氟癸基三甲氧基矽烷溶液。更具體地:將3ml蒸餾水加入100ml乙醇(純度為99.5%)中製備乙醇溶液。然後,將適量的乙酸(純度為99.5%)加入上述乙醇溶液中,將其pH值調節至2.8,得到酸性乙醇溶液。然後,將2ml的1H,1H,2H,2H-全氟癸基三甲氧基矽烷加入該酸性乙
醇溶液中,在室溫條件下,攪拌30分鐘,進而獲得水解1H,1H,2H,2H-全氟癸基三甲氧基矽烷。該過程中,化學反應方程式如下:
於一實施例中,得到水解1H,1H,2H,2H-全氟癸基三甲氧基矽烷後,採用溶膠-凝膠的方法,以異丙醇鈦(Titanium isopropoxide,TTIP)為前驅體,油酸(Oleic acid,OA)為表面活性劑,三甲胺-N-氧化物脫水物(Trimethylamino-N-oxide dihydrate,TMAO)為催化劑,添加水解1H,1H,2H,2H-全氟癸基三甲氧基矽烷溶液製備氟摻雜的二氧化鈦奈米棒112。
具體地,以異丙醇鈦為前驅體,油酸為表面活性劑,在異丙醇鈦和油酸的品質百分比為0.02至0.05的比例下,添加10g三甲胺-N-氧化物脫水物為催化劑,以及添加1ml水解的1H,1H,2H,2H-全氟癸基三甲氧基矽烷溶液,混合後,在80℃至100℃溫度條件下,攪拌10小時至15小時,進而得到氟摻雜的二氧化鈦奈米棒112。
於一實施例中,異丙醇鈦和油酸的品質百分比例如為0.02、0.03、0.04、0.05等。
於一實施例中,將異丙醇鈦、油酸、三甲胺-N-氧化物脫水物以及水解的1H,1H,2H,2H-全氟癸基三甲氧基矽烷溶液,混合後,攪拌的溫度例如為,80℃、85℃、90℃、95℃以及100℃等,攪拌的時間例如為,10小時、11小時、12小時、13小時、14小時以及15小時等。
其中,氟摻雜的二氧化鈦奈米棒112的長度不大於30奈米,氟摻雜的二氧化鈦奈米棒112的直徑不大於5奈米。該步驟中兩步反應,首先異丙醇
鈦(TTIP)和油酸(OA)反應獲得鈦酸酯(Titanate eater),其反應的化學方程式如下:
然後,鈦酸酯與水解的1H,1H,2H,2H-全氟癸基三甲氧基矽烷(hydrolyzed PFDTMES)發生縮合反應生成氟摻雜的二氧化鈦奈米棒112(Fluoro-Doped TiO2 Nanorods),其反應的化學方程式如下:
於一實施例中,步驟S2中,透明黏合劑111為本領域常規使用的各種透明黏合劑。例如,其可以為丙烯酸酯黏合劑(8106黏合劑),其組成成分(重量百分比)如下:氨基甲酸酯丙烯酸低聚物(Urethane acrylic oligomer)50%,N-乙烯基-2-吡咯烷酮(N-vinyl-2-pyrrolidone)10%,光聚合引發劑(Photoinitiator)1%,矽烷耦合劑(Silane couple agent)9%,羥乙基甲基丙烯酸酯(Hydroxyethylmethylacrylate)15%,以及丙烯醯胺(Acrylamide)15%。
於一實施例中,步驟S2中包括將重量百分比為8.5%-12%的氟摻雜的二氧化鈦奈米棒112分散至透明黏合劑111中後,在保護氣氣氛中例如氬氣
氣氛中,常溫攪拌20小時至30小時,從而得到奈米複合黏合劑11的步驟。
於一實施例中,氟摻雜的二氧化鈦奈米棒112的重量百分比例如可以為8.5%、9%、10%、11%以及12%等。
於一實施例中,步驟S2中將氟摻雜的二氧化鈦奈米棒112分散至透明黏合劑111中後,在保護氣氣氛中常溫攪拌的時間例如可以為20小時、24小時、25小時及30小時等。
於一實施例中,步驟S3採用氧氣等離子體處理奈米複合黏合劑11的表面,使奈米複合黏合劑11的表面粗糙化並暴露出部分氟摻雜的二氧化鈦奈米棒112,從而獲得奈米複合材料10。於其他實施例中,亦可以採用例如二氧化碳、氬氣、氨氣、氮氣等氣體對奈米複合黏合劑11的表面進行等離子體處理。或者,亦可以採用其他表面處理技術,使奈米複合黏合劑11的表面粗糙化並暴露出部分氟摻雜的二氧化鈦奈米棒112。
本發明實施例提供的奈米複合材料10的製備方法,藉由等離子體處理奈米複合黏合劑11的表面,使部分氟摻雜的二氧化鈦奈米棒112暴露出,使得奈米複合材料10具有二氧化鈦奈米紋理粗糙表面。另,由於氟原子具有較小的原子半徑和最大的電負性,使得氟元素為能夠有效降低表面能的元素,由於奈米複合材料10其表面暴露的氟摻雜的二氧化鈦奈米棒112為氟基材料,因而奈米複合材料10具有較低的表面能。是故,奈米複合材料10兼具奈米紋理粗糙表面和較低的表面能,表現出較佳的疏水性和疏油性。
本發明實施例還提供利用上述方法製備的奈米複合材料10,其包括透明黏合劑111以及分散於透明黏合劑111中的氟摻雜的二氧化鈦奈米棒112。部分氟摻雜的二氧化鈦奈米棒112從透明黏合劑111的表面暴露出。奈米複合材
料10具有二氧化鈦奈米紋理粗糙表面,且其表面暴露的氟摻雜的二氧化鈦奈米棒112為氟基材料,是故,奈米複合材料10兼具奈米紋理粗糙表面和較低的表面能,表現出較佳的疏水性和疏油性。
另,奈米複合材料10中,氟摻雜的二氧化鈦奈米棒112為無機材料,透明黏合劑111為有機聚合物。是故,奈米複合材料10既具備無機材料機械性能佳的優點,又具備有機材料柔韌且重量輕的優點。
於一實施例中,透明黏合劑111為丙烯酸酯黏合劑時,丙烯酸酯黏合劑為紫外光光固化黏合劑,其加入氟摻雜的二氧化鈦奈米棒112後仍為透明的紫外光光固化黏合劑。奈米複合材料10中氟摻雜的二氧化鈦奈米棒112的重量百分比為8.5%-12%。氟摻雜的二氧化鈦奈米棒112的長度不大於30奈米,氟摻雜的二氧化鈦奈米棒的直徑不大於5奈米。於一實施例中,氟摻雜的二氧化鈦奈米棒112的重量百分比例如可以為8.5%、9%、10%、11%以及12%等。
本發明實施例還提供一種封裝結構100,如圖3所示,其包括基底20、設置於基底20的一表面上的器件30以及封裝膜50。封裝膜50覆蓋器件30並延伸部分覆蓋基底20以將器件30封裝於基底20上。封裝膜50採用上述奈米複合材料10形成,且氟摻雜的二氧化鈦奈米棒從封裝膜50遠離器件30以及基底20的表面暴露出。
於一實施例中,器件30可以為電子書、柔性顯示器以及柔性太陽能電池等。基底20可以為柔性基底,例如為PET。
於一實施例中,基底20可以為金屬基印刷電路板(Metal Core Printed Circuit Board,MCPCB)。封裝結構100還包括電性連接基底20和器件30的電極40,封裝膜50覆蓋電極40以及器件30並延伸部分覆蓋基底20,以將電極
40以及器件30封裝於基底20上。
由於奈米複合材料10表現出較佳的疏水性和疏油性,進而使得應用其的封裝結構100具備較佳的疏水性和疏油性。
以上實施方式僅用以說明本發明的技術方案而非限制,儘管參照較佳實施方式對本發明進行了詳細說明,本領域的普通技術人員應當理解,可以對本發明的技術方案進行修改或等同替換,而不脫離本發明技術方案的精神及範圍。
S1、S2、S3:步驟
Claims (9)
- 一種奈米複合材料的製備方法,其改良在於,包括:步驟S1:製備氟摻雜的二氧化鈦奈米棒;步驟S2:將所述氟摻雜的二氧化鈦奈米棒分散於透明黏合劑中,得到奈米複合黏合劑;以及步驟S3:處理所述奈米複合黏合劑的表面,使其表面粗糙化並暴露出部分所述氟摻雜的二氧化鈦奈米棒,得到透明的奈米複合材料;其中,步驟S3中採用等離子體處理所述奈米複合黏合劑的表面。
- 如請求項1所述的製備方法,其中,步驟S1中包括採用溶膠-凝膠的方法製備氟摻雜的二氧化鈦奈米棒。
- 如請求項2所述的製備方法,其中,採用溶膠-凝膠的方法製備氟摻雜的二氧化鈦奈米棒的步驟包括:以異丙醇鈦為前驅體,油酸為表面活性劑,三甲胺-N-氧化物脫水物為催化劑,添加水解的1H,1H,2H,2H-全氟癸基三甲氧基矽烷溶液,製備氟摻雜的二氧化鈦奈米棒的步驟。
- 如請求項3所述的製備方法,其中,步驟S1中,在採用溶膠-凝膠的方法製備氟摻雜的二氧化鈦奈米棒的步驟之前,還包括製備所述水解的1H,1H,2H,2H-全氟癸基三甲氧基矽烷溶液的步驟。
- 如請求項4所述的製備方法,其中,製備所述水解的1H,1H,2H,2H-全氟癸基三甲氧基矽烷溶液的步驟包括:將蒸餾水、乙醇及乙酸混合,得到酸性乙醇溶液;然後將1H,1H,2H,2H-全氟癸基三甲氧基矽烷加入所述酸性乙醇溶液中,在室溫條件下攪拌,得到水解的1H,1H,2H,2H-全氟癸基三甲氧基矽烷溶液。
- 一種奈米複合材料,其中,包括:表面粗糙化的透明黏合劑;以及氟摻雜的二氧化鈦奈米棒,分散於所述透明黏合劑中,其中,部分所述氟摻雜的二氧化鈦奈米棒從所述透明黏合劑的表面暴露出。
- 如請求項6所述的奈米複合材料,其中,所述奈米複合材料中所述氟摻雜的二氧化鈦奈米棒的重量百分比為8.5%-12%。
- 如請求項6所述的奈米複合材料,其中,所述氟摻雜的二氧化鈦奈米棒的長度不大於30奈米,所述氟摻雜的二氧化鈦奈米棒的直徑不大於5奈米。
- 一種封裝結構,其中,包括:基底;器件,設置於所述基底的一表面上;以及封裝膜,其覆蓋所述器件並延伸部分覆蓋所述基底以將所述器件封裝於所述基底上,所述封裝膜採用如請求項6至8中任意一項所述的奈米複合材料形成,且所述氟摻雜的二氧化鈦奈米棒從所述封裝膜遠離所述器件及所述基底的表面暴露出。
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