TWI713592B - 螢光體組成物、螢光體片以及使用他們的形成物、led晶片、led封裝體、發光裝置、背光單元、顯示器以及led封裝體的製造方法 - Google Patents

螢光體組成物、螢光體片以及使用他們的形成物、led晶片、led封裝體、發光裝置、背光單元、顯示器以及led封裝體的製造方法 Download PDF

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TWI713592B
TWI713592B TW105131129A TW105131129A TWI713592B TW I713592 B TWI713592 B TW I713592B TW 105131129 A TW105131129 A TW 105131129A TW 105131129 A TW105131129 A TW 105131129A TW I713592 B TWI713592 B TW I713592B
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Taiwan
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phosphor
group
light
organic compound
general formula
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TW105131129A
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Chinese (zh)
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TW201728739A (zh
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石田豊
梅原正明
田中大作
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日商東麗股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/06—Luminescent, e.g. electroluminescent, chemiluminescent materials containing organic luminescent materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7704—Halogenides
    • C09K11/7705—Halogenides with alkali or alkaline earth metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/77068—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/08—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)
  • Electroluminescent Light Sources (AREA)
TW105131129A 2015-09-29 2016-09-28 螢光體組成物、螢光體片以及使用他們的形成物、led晶片、led封裝體、發光裝置、背光單元、顯示器以及led封裝體的製造方法 TWI713592B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2015190908 2015-09-29
JP2015-190908 2015-09-29
JP2015219206 2015-11-09
JP2015-219206 2015-11-09
JP2016-058157 2016-03-23
JP2016058157 2016-03-23

Publications (2)

Publication Number Publication Date
TW201728739A TW201728739A (zh) 2017-08-16
TWI713592B true TWI713592B (zh) 2020-12-21

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TW105131129A TWI713592B (zh) 2015-09-29 2016-09-28 螢光體組成物、螢光體片以及使用他們的形成物、led晶片、led封裝體、發光裝置、背光單元、顯示器以及led封裝體的製造方法

Country Status (5)

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JP (1) JP6760077B2 (ja)
KR (1) KR102404622B1 (ja)
CN (1) CN107995920B (ja)
TW (1) TWI713592B (ja)
WO (1) WO2017057074A1 (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
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CN109563405B (zh) 2016-07-29 2022-06-17 株式会社Lg化学 含氮环状化合物、包含其的色彩转换膜以及包含其的背光单元和显示装置
TW201910403A (zh) * 2017-07-28 2019-03-16 日商道康寧東麗股份有限公司 光學構件用樹脂薄片、具備其之光學構件、積層體或發光元件以及光學構件用樹脂薄片之製造方法
TWI779077B (zh) 2017-09-08 2022-10-01 日商杜邦東麗特殊材料股份有限公司 密封光半導體元件的製造方法
TWI787326B (zh) 2017-09-08 2022-12-21 日商杜邦東麗特殊材料股份有限公司 密封光半導體元件的製造方法
WO2019155076A1 (en) * 2018-02-12 2019-08-15 Signify Holding B.V. Led light source with fluoride phosphor
TWI669207B (zh) * 2018-03-12 2019-08-21 品化科技股份有限公司 半導體元件的異質材料結合方法
TWI648878B (zh) * 2018-05-15 2019-01-21 東貝光電科技股份有限公司 Led發光源、led發光源之製造方法及其直下式顯示器
CN111826157A (zh) 2019-04-19 2020-10-27 日亚化学工业株式会社 氟化物荧光体、发光装置和氟化物荧光体的制造方法
WO2022131364A1 (ja) * 2020-12-17 2022-06-23 富士フイルム株式会社 波長変換部材、発光装置および液晶表示装置
KR102486743B1 (ko) * 2021-01-21 2023-01-10 한국광기술원 고품질 형광체 플레이트 및 그의 제조방법
CN117157378A (zh) * 2021-04-07 2023-12-01 浙江光昊光电科技有限公司 一种混合物及其在光电领域的应用
WO2023210342A1 (ja) * 2022-04-25 2023-11-02 東レ株式会社 組成物

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US20070228932A1 (en) * 2006-03-14 2007-10-04 Kabushiki Kaisha Toshiba Light-emitting device, method for producing the same and fluorescent device
JP2011241160A (ja) * 2010-05-17 2011-12-01 Yamamoto Chem Inc 色変換材料、該材料を含む組成物、該組成物を使用した色変換光学部品および該色変換光学部品を使用した発光素子
JP2014136771A (ja) * 2013-01-17 2014-07-28 Yamamoto Chem Inc 波長変換層、及びこれを用いた波長変換フィルタ

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JP4005749B2 (ja) 1999-12-13 2007-11-14 出光興産株式会社 色変換膜及び有機エレクトロルミネッセンス素子
JP4948713B2 (ja) 2001-04-19 2012-06-06 三井化学株式会社 色変換材料、該材料を含む組成物、該組成物を使用した色変換光学部品および該色変換光学部品を使用した発光素子
JP4948714B2 (ja) 2001-05-24 2012-06-06 三井化学株式会社 色変換材料、該材料を含む組成物、該組成物を使用した色変換光学部品および該色変換光学部品を使用した発光素子
KR20080007247A (ko) * 2005-05-12 2008-01-17 이데미쓰 고산 가부시키가이샤 색 변환 재료 조성물 및 이것을 포함하는 색 변환 매체
JP5221859B2 (ja) 2006-03-09 2013-06-26 株式会社Ａｄｅｋａ クマリン化合物を含有してなるフィルム、クマリン化合物とマトリクスを含む色変換層、該色変換層を含む色変換フィルタ、補色層、補色フィルタならびに多色発光デバイス
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JP2012022028A (ja) 2010-07-12 2012-02-02 Ns Materials Kk 液晶ディスプレイ
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KR102035511B1 (ko) * 2013-10-24 2019-10-23 도레이 카부시키가이샤 형광체 조성물, 형광체 시트, 형광체 시트 적층체와 그들을 사용한 led 칩, led 패키지 및 그 제조 방법

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US20070228932A1 (en) * 2006-03-14 2007-10-04 Kabushiki Kaisha Toshiba Light-emitting device, method for producing the same and fluorescent device
JP2011241160A (ja) * 2010-05-17 2011-12-01 Yamamoto Chem Inc 色変換材料、該材料を含む組成物、該組成物を使用した色変換光学部品および該色変換光学部品を使用した発光素子
JP2014136771A (ja) * 2013-01-17 2014-07-28 Yamamoto Chem Inc 波長変換層、及びこれを用いた波長変換フィルタ

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Publication number Publication date
JP6760077B2 (ja) 2020-09-23
CN107995920A (zh) 2018-05-04
JPWO2017057074A1 (ja) 2018-07-12
CN107995920B (zh) 2021-03-12
KR20180061146A (ko) 2018-06-07
TW201728739A (zh) 2017-08-16
WO2017057074A1 (ja) 2017-04-06
KR102404622B1 (ko) 2022-06-02

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