TWI712820B - Pattern exposure device - Google Patents

Abstract

(無)

Description

Pattern exposure device

The present invention relates to a beam scanning device and a beam scanning method for scanning the spot light of a beam irradiated on an irradiated body, a pattern drawing device and a pattern drawing method for scanning the spot light to draw a predetermined pattern on the irradiated body, and using the Device manufacturing method of pattern drawing method, laser light source device for pattern drawing device and beam scanning device.

As disclosed in Japanese Patent Laid-Open No. 61-134724 and Japanese Patent Laid-Open No. 2001-133710, there is known a laser irradiation device and a laser drawing device. The laser irradiation device and the laser drawing device are semi-reflective The mirror splits the laser beam from a laser oscillator (laser beam light source) into two, so that each of the split laser beams enters two polygon mirrors (rotating polygon mirrors), thereby making the two lasers The light beam scans the object to be drawn. In addition, Japanese Patent Laid-Open No. 2001-133710 also discloses that the respective response drawing data of the two laser beams after the split of the two polygon mirrors are modulated by the ON/OFF AOM (acousto-optic modulation element).

However, the beam scanning performed by the polygon mirror depends on the number of reflection surfaces of the polygon mirror and the incident conditions of the optical system behind the polygon mirror (fθ lens, etc.). There may be lasers that cannot be incident during the rotation of the polygon mirror. The condition during which the light beam is effectively reflected to the object being drawn. Therefore, even if the laser beam is divided into two by a half mirror as in the past and incident on the two polygon mirrors, there will be a period when the laser beam cannot be effectively irradiated to the object being drawn, that is, it is not drawing. During this period, the laser beam from the light source cannot be used effectively.

The pattern drawing device of the first aspect of the present invention draws a predetermined pattern on the illuminated object by scanning points of laser light, and is characterized by comprising: a light source device for emitting the laser light; and a plurality of drawing units for making the laser light The scanning point generated by the incident light includes an optical scanning member that scans the laser light and an optical lens system, which are arranged to scan the scanning point in different areas on the illuminated body; and a plurality of optical elements for selection, for Switching whether to make the laser light from the light source device enter the selected drawing unit among the plurality of drawing units, and are arranged in series along the traveling direction of the laser light from the light source device.

The pattern drawing device of the second aspect of the present invention draws a predetermined pattern on the illuminated object by scanning points of laser light, and is characterized by comprising: a light source device for emitting the laser light; and a plurality of drawing units for making the laser light The scanning point generated by the incident light includes an optical scanning component and an optical lens system that scans the laser light, and is arranged to scan the scanning point in different areas on the illuminated object; a plurality of optical elements for selection are used to make The laser light from the light source device selectively enters the plurality of drawing units, and is arranged in line along the traveling direction of the laser light from the light source device; and the light modulator for drawing is to be scanned according to regulations Point the drawing data of each of the plurality of drawing units of the pattern drawn on the illuminated body to modulate the intensity of the laser light incident on the plurality of optical elements for selection.

A pattern drawing device according to a third aspect of the present invention includes: a pulsed light source device that generates a pulse-shaped light beam whose oscillation period can be adjusted; and a first drawing unit that projects the light beam from the pulsed light source device onto the irradiated body as a spot light, And the light beam is deflected in a predetermined period during the projection period and the non-projection period of the spot light on the illuminated object, and the light beam of the light source device is projected onto the illuminated object as a spot light during the projection period, and The beam is deflected in a predetermined cycle in the projection period and the non-projection period, and the spot light is scanned along a second drawing line on the illuminated object that is different from the first drawing line during the projection period; 1 Control system to correspond to the non-projection period of the second drawing unit during the projection period of the first drawing unit, and to correspond to the non-projection period of the first drawing unit during the projection period of the second drawing unit Method, synchronously controlling the first drawing unit and the second drawing unit; and a second control system so that the projection period of the first drawing unit is based on the first drawing of the pattern to be drawn by the first drawing line The information controls the oscillation of the light beam, and during the projection period of the second drawing unit, the pulse light source device is controlled according to the second drawing information of the pattern to be drawn by the second drawing line to control the oscillation of the light beam.

The pattern drawing device of the fourth aspect of the present invention adjusts the intensity of the spot light of the ultraviolet laser light condensed on the irradiated body according to drawing data, and scans the spot light relative to the irradiated body, thereby The pattern is drawn on the irradiated body, which is characterized by comprising: a laser light source device, including a light source unit that generates seed light as the source of the ultraviolet laser light, a light amplifier that injects and amplifies the light, and A wavelength conversion optical element that generates the ultraviolet laser light from the amplified light; and a drawing modulation device, in order to modulate the intensity of the spot light, modulate the light generated from the light source part according to the drawing data The strength.

The fifth aspect of the pattern drawing method of the present invention is to adjust the intensity of the spot light of the ultraviolet laser light condensed on the irradiated body according to drawing data, while scanning the spot light and the irradiated body relatively, thereby Describing a pattern on the illuminated body is characterized by comprising: a conversion step of amplifying the kind of light that is the source of the ultraviolet laser light by an optical amplifier, and converting the amplified kind of light by a wavelength conversion optical element Forming the ultraviolet laser light; and a modulation step, in order to modulate the intensity of the spot light, modulate the intensity of the light incident on the optical amplifier according to the drawing data.

The device manufacturing method of the sixth aspect of the present invention includes: while moving the light-sensitive substrate prepared as the irradiated object in the first direction, the light-sensitive layer on the substrate is formed by the pattern drawing method of the fifth aspect. The action of drawing a pattern for the element; and the action of selectively forming a predetermined pattern material according to the difference between the irradiated part and the non-irradiated part of the spot light of the photosensitive layer.

The laser light source device according to the seventh aspect of the present invention is connected to a device that draws a pattern by spot light condensed on an irradiated body, and emits a beam of light as the spot light, and is characterized by comprising: a first semiconductor light source, Respond to the clock pulse of the predetermined period, and generate the first pulse light with the light emission time shorter than the predetermined period and the sharp rise and fall of the peak intensity; the second semiconductor light source responds to the clock pulse to generate the light emission time shorter and shorter than the predetermined period The first pulsed light has a long light-emitting time and a broad second pulsed light with a small peak intensity; a fiber optical amplifier for the first pulsed light or the second pulsed light to be injected; and a switching member based on the pattern information to be drawn The input is to make the first pulsed light enter the fiber optical amplifier when the spot light is projected on the illuminated object, and make the second pulsed light when the spot light is not projected on the illuminated object The method of injecting into the fiber optical amplifier is optically switched.

The beam scanning device according to the eighth aspect of the present invention is provided with a plurality of scanning units arranged in a predetermined positional relationship. The scanning unit has a rotating polygon mirror that deflects the light beam from the light source device repeatedly, and allows the deflected beam to be incident and focused. A projection optical system for one-dimensional scanning of spot light on an irradiated body is characterized by comprising: a light beam switching member that switches the light path of the light beam so that the light beam from the light source device is incident on a plurality of the scanning units One of the scanning units that performs one-dimensional scanning of the spot light; and a beam switching control section, which uses the rotating polygon mirror of the scanning unit to perform the deflection of the beam with respect to every at least one reflecting surface of the rotating polygon mirror. Control the light beam switching component so that each of the plurality of scanning units sequentially performs one-dimensional scanning of the spot light.

A light beam scanning device according to a ninth aspect of the present invention has a plurality of scanning modules in which a plurality of scanning units are arranged in a predetermined positional relationship, and the scanning unit is provided with a multi-faceted rotating surface that rotates at a constant rotation speed in order to repeatedly deflect the light beam from the light source device A mirror and a projection optical system for the deflected beam to enter and condense into a point light for one-dimensional scanning on the irradiated body, characterized by having: a beam switching member that switches the optical path of the beam so that it comes from The light beam of the light source device is incident on a plurality of the scanning units to perform one-dimensional scanning of the spot light; and a beam switching control part, the deflection of the light beam is performed by the rotating polygon mirror of each scanning unit The light beam switching member is controlled to switch between the first state in which the continuous reflecting surface of the rotating polygonal mirror is repeated and the second state in which at least one reflecting surface of the rotating polygonal mirror is repeated, so that a plurality of Each of the scanning units sequentially performs one-dimensional scanning of the spot light.

In the light beam scanning method of the tenth aspect of the present invention, a plurality of scanning units are arranged in a predetermined positional relationship to perform beam scanning on an irradiated body. The scanning unit is provided with a rotating polygon mirror for reversingly deflected light beams to enter and condense light. A projection optical system for one-dimensionally scanned point light on the illuminated body is characterized by comprising: synchronously rotating a plurality of the rotating polygon mirrors so that the rotation angles of the rotating polygon mirrors of each of the plurality of scanning units The position becomes the predetermined phase relationship with each other; and in order to sequentially perform one-dimensional scanning of the spot light by each of the plurality of scanning units, the deflection of the beam by the rotating polygon mirror is at every interval of the rotating polygon mirror At least one reflective surface switches the action of the scanning unit into which the light beam enters in a repetitive manner.

The beam scanning method of the eleventh aspect of the present invention scans the irradiated body by a beam scanning device in which a plurality of scanning units are arranged in a predetermined positional relationship. The scanning unit is provided with a rotating multi-faceted surface that can be rotated at a certain rotation speed. A projection optical system in which a mirror repetitively deflected beam enters and condenses into a one-dimensional scanning point light on the irradiated body, characterized in that it includes: synchronously rotating a plurality of the rotating polygon mirrors to make the plurality of scanning The rotation angle position of the rotating polygon mirror of each unit becomes an action in a predetermined phase relationship; the deflection of the beam performed by the rotating polygon mirror is switched in such a way that the continuous reflecting surface of the rotating polygon mirror is repeated. The scanning unit, whereby each of the plurality of scanning units sequentially performs the first scanning step of one-dimensional scanning of the point light; the deflection of the light beam by the rotating polygon mirror is at least every interval of the rotating polygon mirror A reflective surface switches the scanning unit into which the light beam enters in a repetitive manner, whereby each of the plurality of scanning units sequentially performs the second scanning step of the one-dimensional scanning of the spot light; and switches the first scanning step and The switching step of the second scanning step.

The pattern drawing method according to the twelfth aspect of the present invention uses a drawing device that arranges a plurality of scanning units that cause the spot light of the light beam from the light source device to perform main scanning along the drawing line so that the pattern drawn by each drawing line is The substrate continues in the main scanning direction of the drawing line, so that the plurality of scanning units and the substrate move relatively in a sub-scanning direction that intersects the main scanning direction, and is characterized by including: among the plurality of scanning units, selecting The action of the specific scanning unit corresponding to the width of the substrate in the main scanning direction, or the width or position of the exposed area of the pattern drawn on the substrate in the main scanning direction; and according to the individual drawing of the specific scanning unit The pattern data modulates the intensity of the light beam, and sequentially supplies the light beam from the light source device to the specific scanning unit through the light beam distribution unit.

With respect to the pattern drawing device, pattern drawing method, beam scanning device, beam scanning method, device manufacturing method, and laser light source device of the present invention, preferred embodiments are disclosed and described in detail below with reference to the drawings. In addition, the aspect of the present invention is not limited to these embodiments, and includes those with various changes or improvements. That is, the constituent elements described below include those that can be easily thought of by those having ordinary knowledge in the technical field to which the present invention belongs and those that are substantially the same, and the constituent elements described below can be appropriately combined. In addition, various omissions, substitutions, or changes of constituent elements can be made without departing from the scope of the present invention.

(First Embodiment) FIG. 1 is a diagram showing a schematic configuration of an element manufacturing system 10 including an exposure apparatus EX for applying exposure processing to a substrate (a subject to be irradiated) FS according to the first embodiment. In addition, in the following description, without special limitation, an XYZ orthogonal coordinate system with the direction of gravity as the Z direction is set, and the X direction, Y direction, and Z direction are described according to the arrows in the figure.

The component manufacturing system 10 is, for example, a manufacturing system constructed with a production line for manufacturing flexible displays, flexible wirings, flexible sensors, etc. as electronic components. Hereinafter, the description will be made on the premise of a flexible display as an electronic component. As the flexible display, there are, for example, an organic EL display, a liquid crystal display, and the like. The component manufacturing system 10 has a so-called roll-to-roll (Roll To Roll) structure, that is, it is sent out from a supply reel (not shown) on which a flexible sheet substrate (sheet substrate) FS is wound in a roll shape. The substrate FS continuously applies various treatments to the sent substrate FS, and then winds the substrate FS after various treatments with a recovery reel (not shown). The substrate FS has a strip shape in which the moving direction of the substrate FS becomes the long side direction (long strip), and the width direction becomes the short side direction. The substrate FS sent out from the supply reel is sequentially processed by the sequencer PR1, the exposure device (pattern drawing device, beam scanning device) EX, and the sequencer PR2, and is wound by the recovery reel.

In addition, the X direction is a direction (conveying direction) from the sequencer PR1 to the sequencer PR2 through the exposure device EX in the horizontal plane. The Y direction is the direction orthogonal to the X direction in the horizontal plane, and is the width direction (short side direction) of the substrate FS. The Z direction is the direction orthogonal to the X direction and the Y direction (upward direction), and is parallel to the direction of gravity.

The substrate FS uses, for example, a resin film, or a foil made of metal or alloy such as stainless steel. As the material of the resin film, for example, polyethylene resin, polypropylene resin, polyester resin, vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, At least one of polycarbonate resin, polystyrene resin, and ethyl acetate resin. In addition, the thickness or rigidity (Young's coefficient) of the substrate FS only needs to be within a range where the substrate FS does not produce creases or irreversible wrinkles caused by bending when passing through the conveying path of the exposure device EX. As the base material of the substrate FS, a film such as PET (polyethylene terephthalate) or PEN (polyethylene naphthalate) with a thickness of about 25 μm to 200 μm is a typical example of a preferable sheet substrate.

The substrate FS may be heated by the processes applied by the sequencer PR1, the exposure device EX, and the sequencer PR2. Therefore, it is preferable to select a substrate FS of a material with a significant thermal expansion coefficient. For example, the thermal expansion coefficient can be suppressed by mixing an inorganic filler in the resin film. The inorganic filler may also be, for example, titanium oxide, zinc oxide, aluminum oxide, or silicon oxide. In addition, the substrate FS may be an ultra-thin glass monolayer with a thickness of about 100 μm manufactured by the float method or the like, or may be a laminate in which the above-mentioned resin film, foil, etc. are bonded to the ultra-thin glass.

However, the flexibility of the substrate FS refers to the property that the substrate FS will not be cut or broken even if a force of its own weight is applied to the substrate FS. In addition, the nature of bending by the force of its own weight is also included in flexibility. In addition, the material, size, and thickness of the substrate FS vary depending on the layer structure of the film formed on the substrate FS, temperature, humidity, etc., and the degree of flexibility. In any case, when the substrate FS is correctly wound around the various conveying reels, rotating drums, and other conveying direction switching members provided in the conveying path in the component manufacturing system 10 of the first embodiment, as long as it does not bend and cause folds The substrate FS can be transported smoothly if it is scratched or damaged (tear or crack), it can be said to be in the range of flexibility.

The program device PR1 performs the pre-step processing on the substrate FS subjected to the exposure processing by the exposure device EX. The sequencer PR1 transports the substrate FS that has been processed in the pre-step toward the exposure device EX. Through the processing of this pre-step, the substrate FS conveyed to the exposure device EX becomes a substrate (photosensitive substrate) having a photosensitive functional layer (photosensitive layer, photosensitive layer) formed on the surface.

This photosensitive functional layer is a layer (film) by applying a solution on the substrate FS and drying it. The photosensitive functional layer is typically photoresist (liquid or dry film), but as a material that does not need to be developed, it has a liquid-repellent modified photosensitive silane coupling agent (SAM), Or a photosensitive reducing agent for plating reducing base appears in the part receiving ultraviolet radiation. When a photosensitive silane coupling agent is used as the photosensitive functional layer, the pattern portion on the substrate FS exposed to ultraviolet rays is changed from liquid repellency to lyophilic. Therefore, a liquid containing conductive ink (an ink containing conductive nanoparticles such as silver or copper) or a semiconductor material is selectively coated on the lyophilic part, thereby forming a thin film transistor (TFT), etc. Electrodes, semiconductors, wiring for insulation or connection, or pattern layers as electrodes. When a photosensitive reducing agent is used as a photosensitive functional layer, a plating reducing group appears on the pattern part of the substrate exposed to ultraviolet rays. Therefore, immediately after exposure, the substrate FS is immersed in a plating solution containing palladium ions or the like for a certain period of time, thereby forming (precipitating) a patterned layer of palladium. This plating process is an additive process, but in addition, in the case of the etching process as a subtractive process, the substrate FS transported to the exposure device EX can also be made of PET or PEN Base material, metal thin films such as aluminum (Al) or copper (Cu) are deposited on the entire surface or selectively, and a photoresist layer is further laminated on it.

In this first embodiment, the exposure apparatus EX is an exposure apparatus of a direct drawing method that does not use a photomask, that is, an exposure apparatus of a so-called line scan method. The exposure device EX irradiates the illuminated surface (photosensitive surface) of the substrate FS supplied from the program device PR1 with a light pattern corresponding to a predetermined pattern for display electronic components, circuits, or wiring. Although it will be described in detail later, the exposure device EX transports the substrate FS in the +X direction (sub-scanning direction) while applying the spot light SP of the exposure beam (laser light, irradiation light) LB on the substrate FS (substrate FS The irradiated surface) scans one-dimensionally in the predetermined scanning direction (Y direction), and at the same time highly modulates (ON/OFF) the intensity of the spot light SP according to the pattern data (drawing data, drawing information). Thereby, a light pattern corresponding to a predetermined pattern of electronic components, circuits, wirings, etc., is drawn on the illuminated surface (photosensitive surface) of the substrate FS. That is, the sub-scanning of the substrate FS and the main scanning of the spot light SP cause the spot light SP to be relatively two-dimensionally scanned on the illuminated surface of the substrate FS, and the predetermined exposure pattern is drawn on the substrate FS. In addition, the substrate FS is transported along the transport direction (+X direction), so the exposure area W of the pattern exposed by the exposure device EX is provided in plural at predetermined intervals along the longitudinal direction of the substrate FS (refer to FIG. 5) . Since electronic components are formed in this exposure area W, the exposure area W is also an electronic component formation area. In addition, the electronic component is formed by overlapping a plurality of pattern layers (layers with patterns), so the patterns corresponding to each layer can also be exposed by the exposure device EX.

The program device PR2 performs subsequent processing (for example, plating processing or development, etching processing, etc.) on the substrate FS after exposure processing by the exposure device EX. Through the processing of this subsequent step, a patterned layer of the device is formed on the substrate FS.

As described above, the electronic component is formed by overlapping a plurality of pattern layers, so one pattern layer is generated through at least each process of the component manufacturing system 10. Therefore, in order to produce electronic components, it is necessary to go through each process of the component manufacturing system 10 shown in FIG. 1 at least twice. Therefore, the recovery reel on which the substrate FS is wound is installed as a supply reel in another component manufacturing system 10, whereby patterns can be laminated. Repeat the above actions to form electronic components. Therefore, the processed substrate FS is in a state in which a plurality of electronic components (exposure regions W) are connected in the longitudinal direction of the substrate FS at a predetermined interval. That is, the substrate FS becomes a multi-sided substrate.

The recycling reel for recycling the substrate FS formed in the connected state of electronic components can also be installed in a cutting device not shown. A cutting device equipped with a recovery reel divides (cuts) the processed substrate FS into electronic components (electronic component forming area W), thereby forming a plurality of electronic components. The size of the substrate FS is, for example, about 10 cm to 2 m in the width direction (the direction of the short side), and 10 m or more in the length direction (the direction of the long side). In addition, the size of the substrate FS is not limited to the above-mentioned size.

Next, the exposure apparatus EX will be described in detail. The exposure device EX is housed in the temperature control chamber ECV. The temperature control chamber ECV maintains a predetermined temperature inside, and controls the shape change caused by the temperature of the substrate FS being conveyed inside. The temperature control chamber ECV is configured on the setting surface E of the manufacturing plant through passive or active anti-vibration units SU1, SU2. Anti-vibration units SU1, SU2 reduce the vibration from the installation surface E. The installation surface E can be the ground itself of the factory, or it can be the surface on the installation platform (pedestal) installed on the ground in order to expose the horizontal surface. The exposure device EX includes a substrate transport mechanism 12, a light source device (pulse light source device, laser light source device) 14, a drawing head 16, and a control device 18.

The substrate conveying mechanism 12 conveys the substrate FS conveyed from the sequencer PR1 at a predetermined speed in the exposure apparatus EX, and then sends it to the sequencer PR2 at a predetermined speed. With this substrate transport mechanism 12, the transport path of the substrate FS transported in the exposure apparatus EX is defined. The substrate transport mechanism 12 has an edge position controller EPC, a drive roller R1, a tension roller RT1, a rotating drum (cylinder) DR, and a tension roller RT2 in order from the upstream side (-X direction side) in the transport direction of the substrate FS , Drive roller R2, and drive roller R3.

The edge position controller EPC adjusts the position in the width direction (Y direction, the short side direction of the substrate FS) of the substrate FS conveyed from the sequencer PR1. That is, the edge position controller EPC is to position the end (edge) in the width direction of the substrate FS to be conveyed under a predetermined tension in the range of ± tens of μm to tens of μm relative to the target position. The method of (allowable range) moves the substrate FS in the width direction to adjust the position of the substrate FS in the width direction. The edge position controller EPC has a roller on which the substrate FS is hung, and an edge sensor (end detection part) not shown in the figure that detects the position of the end (edge) of the substrate FS in the width direction, according to the edge sensor The detected detection signal moves the above-mentioned roller of the edge position controller EPC to the Y direction to adjust the position of the substrate FS in the width direction. The driving roller R1 rotates while holding the front and back surfaces of the substrate FS conveyed from the edge position controller EPC, and conveys the substrate FS toward the rotating drum DR. In addition, the edge position controller EPC can also be wound around the longitudinal direction of the substrate FS of the rotating drum DR with respect to the central axis (rotation axis) AXo of the rotating drum DR in a constant orthogonal manner, so as to appropriately adjust the width direction of the substrate FS In order to correct the inclination error of the traveling direction of the substrate FS, adjust the parallelism of the rotation axis of the aforementioned roller of the edge position controller EPC and the Y axis appropriately.

The rotating drum DR has a central axis AXo extending in the Y direction and a direction crossing the direction of gravity, and a cylindrical outer peripheral surface with a certain radius from the central axis AXo. While imitating the outer peripheral surface (circumferential surface), the substrate FS One part is supported in the longitudinal direction while rotating around the central axis AXo to transport the substrate FS in the +X direction. The rotating drum DR supports, with its circumferential surface, the exposure area (part) on the substrate FS on which the light beam LB (point light SP) from the drawing head 16 is projected. On both sides of the rotating drum DR in the Y direction, there are shafts Sft supported by annular bearings such that the rotating drum DR rotates around the central axis AXo. The shaft Sft is rotated around the central axis AXo by a rotational torque given to a rotation driving source (for example, composed of a motor or a reduction mechanism, etc.) controlled by the control device 18 (not shown). In addition, for convenience, a plane including the central axis AXo and parallel to the YZ plane is called the central plane Poc.

The driving rollers R2 and R3 are arranged at a predetermined interval along the conveyance direction (+X direction) of the substrate FS, and give a predetermined slack state to the substrate FS after exposure. The driving rollers R2 and R3, like the driving roller R1, rotate while holding the front and back surfaces of the substrate FS, and convey the substrate FS toward the sequencer PR2. The driving rollers R2 and R3 are provided on the downstream side (+X direction side) in the conveying direction with respect to the rotating drum DR, and the driving roller R2 is provided on the upstream side (-X direction side) in the conveying direction with respect to the driving roller R3. The tension adjustment rollers RT1 and RT2 apply force in the -Z direction to apply a predetermined tension in the longitudinal direction to the substrate FS wound on the rotating drum DR and supported. This stabilizes the tension applied to the longitudinal direction of the substrate FS of the rotating drum DR within a predetermined range. In addition, the control device 18 rotates the driving rollers R1 to R3 by controlling a rotation driving source (for example, constituted by a motor or a reduction mechanism, etc.) not shown.

The light source device 14 has a light source (pulse light source), and emits a pulsed light beam (pulse light, laser light) LB. This light beam LB is ultraviolet light having a peak wavelength in a wavelength band below 370 nm, and the oscillation frequency (light emission frequency) of the light beam LB is Fs. The light beam LB emitted from the light source device 14 enters the drawing head 16. The light source device 14 is controlled by the control device 18 to emit and emit the light beam LB at the emission frequency Fs. The structure of the light source device 14 will be described in detail later, but it is a semiconductor laser element that generates pulsed light in the infrared wavelength range, an optical fiber amplifier, and the conversion of the amplified pulsed light in the infrared wavelength range into pulsed light in the ultraviolet wavelength range. Wavelength conversion optical elements (harmonic generation elements), etc., can also be used as a fiber amplifier laser light source that can obtain pulsed light of high-intensity ultraviolet light with an oscillation frequency Fs of hundreds of MHz and a pulse light emission time of about picoseconds.

The drawing head 16 includes a plurality of scanning units Un (U1 to U6) into which the light beams LB respectively enter. The drawing head 16 draws a predetermined pattern by a plurality of scanning units (drawing units) U1 to U6 on a part of the substrate FS supported by the circumferential surface of the rotating drum DR of the substrate transport mechanism 12. The drawing head 16 is a so-called multi-beam drawing head 16 in which a plurality of scanning units U1 to U6 of the same configuration are arranged. The drawing head 16 repeatedly exposes the pattern for electronic components on the substrate FS. Therefore, the exposure area (electronic component formation area) W of the exposed pattern is provided in plural at predetermined intervals along the longitudinal direction of the substrate FS (see FIG. 5 ). The control device 18 controls each part of the exposure device EX and causes each part to execute processing. The control device 18 includes a computer and a storage medium storing a program. The computer executes the program stored in the storage medium and has the function of the control device 18 of the first embodiment.

2 is a diagram showing a supporting frame (device column) 30 supporting a plurality of scanning units (drawing units) Un of the drawing head 16 and the rotating drum DR. The support frame 30 has a main body frame 32, a three-point support portion 34, and a drawing head support portion 36. The support frame 30 is housed in the temperature control chamber ECV. The main body frame 32 rotatably supports the rotating drum DR, the tension adjustment roller RT1 (not shown), and RT2 through a ring bearing. The three-point support portion 34 is provided at the upper end of the main body frame 32, and supports the drawing head support portion 36 provided above the rotating drum DR at three points.

The drawing head support portion 36 supports the scanning unit Un (U1~U6) of the drawing head 16. The drawing head support portion 36 positions the scanning units U1, U3, U5 on the downstream side (+X side) of the conveying direction relative to the central axis AXo of the rotating drum DR ) And supported side by side along the width direction of the substrate FS (refer to FIG. 1). In addition, the drawing head support portion 36 supports the scanning units U2, U4, U6 on the upstream side (-X side) in the conveying direction with respect to the central axis AXo in parallel along the width direction (Y direction) of the substrate FS (see FIG. 1 ). In addition, here, the drawing width in the Y direction of one scanning unit Un (scanning range of spot light SP, drawing line SLn), as an example, if it is about 20~50mm, by adding three odd-numbered scanning units U1, A total of six scanning units Un of U3, U5 and three even-numbered scanning units U2, U4, U6 are arranged in the Y direction, so that the width of the Y direction that can be drawn is expanded to 120mm~300mm.

FIG. 3 is a diagram depicting the structure of the head 16. In the first embodiment, the exposure apparatus EX includes two light source devices 14 (14a, 14b). The drawing head 16 has a plurality of scanning units U1 to U6, guides the light beam LB from the light source device 14a to the plurality of scanning units U1, U3, U5, and guides the light into the optical system (beam switching member) 40a, and transmits the light beam from the light source device 14b The LB guides the light introduction optical system (beam switching member) 40b to a plurality of scanning units U2, U4, U6.

First, the light introduction optical system (light beam switching member) 40a will be described using FIG. 4. In addition, the light introduction optical systems 40a and 40b have the same configuration, so the light introduction optical system 40a is described here, and the description of the light introduction optical system 40b is omitted.

The light introduction optical system 40a, from the light source device 14 (14a) side, has a condenser lens 42, a collimator lens 44, a reflecting mirror 46, a condenser lens 48, a selection optical element 50, a reflecting mirror 52, and a collimating lens 54 , Condenser lens 56, selective optical element 58, reflecting mirror 60, collimator 62, condenser lens 64, selective optical element 66, reflecting mirror 68, and absorber 70.

The condenser lens 42 and the collimator lens 44 amplify the light beam LB emitted from the light source device 14a. In detail, first, the condenser lens 42 causes the light beam LB to converge to the focal position behind the condenser lens 42, and the collimator lens 44 causes the light beam LB to be converged and scattered by the condenser lens 42 to a predetermined beam diameter (for example, the number mm) of parallel light.

The reflecting mirror 46 reflects the light beam LB that has become parallel light by the collimator lens 44 and irradiates it to the optical element 50 for selection. The condensing lens 48 condenses (converges) the light beam LB that has entered the optical element 50 for selection so as to have a beam waist width in the optical element 50 for selection. The optical element 50 for selection is transmissive to the light beam LB, for example, an acousto-optic modulator (AOM: Acousto-Optic Modulator) is used. AOM, if an ultrasonic signal (high-frequency signal) is applied, the incident light beam LB (0-order light) will be generated as the outgoing light beam (light beam LBn) by diffracting the first-order diffracted light at the diffraction angle corresponding to the high-frequency frequency . In addition, in the first embodiment, each of the plurality of selection optical elements 50, 58, 66 is emitted as primary diffracted light and then enters the corresponding scanning units U1, U3, U5. The light beams LBn are LB1, LB3, LB5 indicates that each optical element 50, 58, 66 for selection has a function of deflecting the optical path of the light beam LB from the light source device 14 (14a). The configuration, function, function, etc. of each optical element 50, 58, 66 for selection may be the same as each other. The optical elements 50, 58, 66 for selection will turn on/off the diffracted light that is diffracted by the incident light beam LB according to the ON/OFF of the drive signal (high frequency signal) from the control device 18.

In detail, the optical element 50 for selection irradiates the incident light beam LB to the optical element 58 for selection in the next stage when the drive signal (high-frequency signal) from the control device 18 is OFF. On the other hand, when the drive signal (high-frequency signal) from the control device 18 is ON, the optical element 50 is selected to diffract the incident light beam LB, and the light beam LB1, which is the primary diffracted light, is irradiated to the mirror 52 . The reflecting mirror 52 reflects the incident light beam LB1 and irradiates it to the collimator lens 100 of the scanning unit U1. That is, the control device 18 switches (drives) the selection optical element 50 to ON/OFF, and the selection optical element 50 switches whether or not the light beam LB1 enters the scanning unit U1.

A collimator 54 for returning the light beam LB irradiated to the optical element 58 for selection to parallel light, and a collimator 54 for making the light beam LB irradiated to the optical element for selection 58 return to parallel light, and a collimator 54 for making parallel light by the collimator 54 The light beam LB is condensed (converged) again into a condenser lens 56 with a beam waist width in the optical element 58 for selection.

The optical element 58 for selection, like the optical element 50 for selection, is transparent to the light beam LB, for example, an acousto-optic modulation element (AOM) is used. When the driving signal (high-frequency signal) transmitted from the control device 18 is OFF, the optical element 58 for selection transmits the incident light beam LB directly and irradiates it to the optical element 66 for selection, and then transmits it from the control device 18 When the driving signal (high-frequency signal) from the source is ON, the incident light beam LB is diffracted, and the light beam LB3, which is the primary diffracted light, is irradiated to the mirror 60. The mirror 60 reflects the incident light beam LB3 and irradiates it to the collimator lens 100 of the scanning unit U3. That is, the control device 18 switches the optical element 58 for selection ON/OFF, and the optical element 58 for selection switches whether or not the light beam LB3 is incident on the scanning unit U3.

Between the optical element for selection 58 and the optical element for selection 66, a collimator 62 for returning the light beam LB irradiated to the optical element for selection 66 back to parallel light, and a collimator 62 for making parallel light by the collimator 62 The light beam LB is condensed (converged) again into a condenser lens 64 with a beam waist width in the optical element 66 for selection.

The optical element 66 for selection, like the optical element 50 for selection, has transmissivity to the light beam LB, for example, an acousto-optic modulation element (AOM) is used. The optical element 66 for selection causes the incident light beam LB to irradiate toward the absorber 70 when the drive signal (high-frequency signal) from the control device 18 is in the OFF state, and the drive signal (high-frequency signal) from the control device 18 is In the ON state, the incident light beam LB is diffracted, and the light beam LB5, which is the primary diffracted light, is irradiated toward the mirror 68. The reflecting mirror 68 reflects the incident light beam LB5 and irradiates it to the collimator lens 100 of the scanning unit U5. That is, the control device 18 switches the optical element 66 for selection ON/OFF, and the optical element 66 for selection switches whether or not the light beam LB5 is incident on the scanning unit U5. The absorber 70 is a light absorber for preventing the light beam LB from leaking to the outside.

The light introduction optical system 40b is briefly described. The selection optical elements 50, 58, 66 of the light introduction optical system 40b switch whether to make the light beam LB enter the scanning units U2, U4, U6. In this case, the reflecting mirrors 52, 60, 68 of the light introduction optical system 40b reflect the light beams LB2, LB4, LB6 emitted from the selective optical elements 50, 58, 66 and irradiate them to the collimating mirrors of the scanning units U2, U4, U6 100.

In addition, the actual acousto-optic modulation element (AOM), the generation efficiency of the first-order diffracted light is about 80% of that of the zero-order light, so the beams LB1 (LB2) of each deflection of the optical elements 50, 58, 66 are selected, The intensity of LB3 (LB4) and LB5 (LB6) is lower than that of the original beam LB. In addition, when any one of the optical elements 50, 58, 66 for selection is in the ON state, the zero-order light that is not diffracted and goes straight remains about 20%, but is finally absorbed by the absorber 70.

Next, the plural scanning units Un (U1 to U6) shown in FIG. 3 will be described. The scanning unit Un projects the light beam LBn from the light source device 14 (14a, 14b) onto the irradiated surface of the substrate FS by converging into a spot light SP, while using the rotating polygon mirror PM to make the spot light SP on the substrate The irradiated surface of the FS performs one-dimensional scanning along the drawing line (scanning line) SLn of the predetermined straight line. In addition, the drawing line SLn of the scanning unit U1 is represented by SL1, and similarly, the drawing line SLn of the scanning units U2 to U6 is represented by SL2 to SL6.

FIG. 5 is a diagram showing the drawing line SLn (SL1~SL6) of the spot light SP scanned by each scanning unit Un (U1~U6). As shown in FIG. 5, each scanning unit Un (U1 to U6) shares the scanning area in such a way that a plurality of scanning units Un (U1 to U6) all cover the entire width direction of the exposure area W. Thereby, each scanning unit Un (U1 to U6) can draw a pattern on a plurality of regions divided in the width direction of the substrate FS. The length of each drawing line SLn (SL1~SL6) is the same in principle. That is, the scanning distance of the spot light SP of the light beam LBn scanned along the drawing lines SL1 to SL6 is the same in principle. In addition, if the width of the exposure area W is to be increased, it can be dealt with by increasing the length of the drawing line SLn itself or by increasing the number of scanning units Un provided in the Y direction.

In addition, the actual drawing lines SLn (SL1~SL6) are set to be shorter than the maximum length that the spot light SP can actually scan on the illuminated surface. For example, if the drawing magnification in the main scanning direction (Y direction) is the initial value (without magnification correction), the maximum length of the drawing line SLn of the drawing pattern is 30mm, then the maximum scanning length of the spot light SP on the illuminated surface Each of the scanning start point side and the scanning end point side of the drawing line SLn has a space of approximately 0.5 mm, which is set to approximately 31 mm. By setting in the above manner, within the range of the maximum scanning length of the spot light SP of 31 mm, the position of the drawing line SLn of 30 mm or the drawing magnification can be fine-tuned in the main scanning direction. The maximum scanning length of the spot light SP is not limited to 31mm, and is mainly determined by the aperture of the fθ lens FT (refer to FIG. 3) after the polygon mirror (rotating polygon mirror) PM arranged in the scanning unit Un, and it can also be 31mm or more.

A plurality of drawing lines (scanning lines) SL1 to SL6 are arranged in two rows in the circumferential direction of the rotating drum DR with the center plane Poc interposed therebetween. The drawing lines SL1, SL3, SL5 are located on the substrate FS on the downstream side (+X direction side) in the conveying direction with respect to the center plane Poc. The drawing lines SL2, SL4, SL6 are located on the substrate FS on the upstream side (-X direction side) in the conveying direction with respect to the center plane Poc. Each drawing line SLn (SL1~SL6) is substantially parallel along the width direction of the substrate FS, that is, the central axis AXo of the rotating drum DR, and is shorter than the length in the width direction of the substrate FS.

The drawing lines SL1, SL3, SL5 are arranged at predetermined intervals along the width direction of the substrate FS (scanning direction, Y direction), and the drawing lines SL2, SL4, SL6 are also arranged along the width direction of the substrate FS (scanning direction, Y direction). ) Is placed at a predetermined interval. At this time, the drawing line SL2 is arranged between the drawing line SL1 and the drawing line SL3 in the width direction of the substrate FS. Similarly, the drawing line SL3 is arranged between the drawing line SL2 and the drawing line SL4 in the width direction of the substrate FS. The drawing line SL4 is arranged between the drawing line SL3 and the drawing line SL5 in the width direction of the substrate FS. The drawing line SL5 is arranged between the drawing line SL4 and the drawing line SL6 in the width direction of the substrate FS. That is, the drawing lines SL1 to SL6 are arranged to cover the entire width direction of the exposure area W drawn on the substrate FS.

The scanning direction of the spot light SP of the light beams LBn (LB1, LB3, LB5) scanned along the odd-numbered drawing lines SL1, SL3, SL5 is a one-dimensional direction, which is the same direction. The scanning direction of the spot light SP of the light beams LBn (LB2, LB4, LB6) scanned along the even-numbered drawing lines SL2, SL4, SL6 is a one-dimensional direction, which is the same direction. The scanning direction of the light beam LBn (spot light SP) scanned along the drawing lines SL1, SL3, SL5 and the scanning direction of the light beam LBn (spot light SP) scanned along the drawing lines SL2, SL4, SL6 are opposite to each other. In detail, the scanning direction of the light beam LBn (spot light SP) scanned along the drawing lines SL2, SL4, SL6 is the +Y direction, and the light beam LBn (spot light SP) scanned along the drawing lines SL1, SL3, SL5 The scanning direction is the -Y direction. This is caused by using the polygon mirror PM rotating in the same direction as the polygon mirror PM of the scanning units U1~U6. Thereby, the drawing start position of the drawing lines SL1, SL3, SL5 (the position of the drawing start point (scanning start point)) and the drawing start position of the drawing lines SL2, SL4, SL6 are adjacent (or partially overlapped) in the Y direction. In addition, the drawing end positions of the drawing lines SL3 and SL5 (the positions of the drawing end points (scanning end points)) and the drawing end positions of the drawing lines SL2 and SL4 are adjacent to (or partially overlapped) in the Y direction. When the drawing lines SLn are arranged such that the ends of the drawing lines SLn adjacent in the Y direction partially overlap each other, for example, as long as the drawing start position or the drawing end position is in the Y direction relative to the length of each drawing line SLn Repeat the range below a few %.

In addition, the width of the drawing line SLn in the sub-scanning direction corresponds to the thickness of the size (diameter) ø of the spot light SP. For example, when the size ø of the spot light SP is 3 μm, the width of the sub-scanning direction of the drawing line SLn is also 3 μm. The spot light SP can also be projected along the drawing line SLn in a manner overlapping a predetermined length (for example, half of the size ø of the spot light SP). Also, when drawing lines SLn (e.g., drawing line SL1 and drawing line SL2) adjacent to each other in the Y direction are adjacent to each other (in the case of continuation), similarly, as long as they overlap a predetermined length (e.g., the size of the spot light SP is ø Half).

In the case of the first embodiment, since the light beam LB from the light source device 14 is pulsed light, the spot light SP projected on the drawing line SLn during the main scanning period is discrete according to the oscillation frequency of the light beam LB. Therefore, it is necessary to make the spot light SP projected by one pulse light of the light beam LB and the spot light SP projected by the next pulse light overlap in the main scanning direction. The amount of repetition is set according to the size ø of the spot light SP, the scanning speed Vs of the spot light SP, and the oscillation frequency Fs of the light beam LB. However, when the intensity distribution of the spot light SP is approximately Gaussian, it only needs to be relative to the point light SP. The effective diameter size determined by 1/e ² (or 1/2) of the peak intensity ø overlaps ø/2. Therefore, even in the sub-scanning direction (the direction orthogonal to the drawing line SLn), it is preferably set so that the substrate FS only moves between one scan of the spot light SP along the drawing line SLn and the next scan The effective size of the spotlight SP is approximately 1/2 of the distance or less. In addition, although the setting of the exposure amount of the photosensitive function layer on the substrate FS can be adjusted with the peak value of the light beam LB (pulsed light), when the intensity of the light beam LB cannot be increased, it is only necessary to use A decrease in the scanning speed Vs in the main scanning direction of the spot light SP, an increase in the oscillation frequency Fs of the beam LB, or a decrease in the transport speed in the sub-scanning direction of the substrate FS, etc., make the spot light SP in the main scanning direction Or the overlap in the sub-scanning direction can be increased to more than 1/2 of the actual size ø.

Next, the structure of the scanning unit Un shown in FIG. 3 will be explained. In addition, the scanning units U1 to U6 have the same configuration, so only the scanning unit U1 will be described here. The scanning unit U1 has a collimator 100 after the mirror 52 shown in FIG. 4, a mirror 102, a condenser lens 104, an optical element 106 for drawing, a collimator 108, a mirror 110, a cylindrical lens CYa, and a mirror 114. Polygonal mirror (light scanning member, deflection member) PM, fθ lens FT, cylindrical lens CYb, and mirror 122. The collimating lenses 100, 108, the reflecting mirrors 102, 110, 114, 122, the condenser lens 104, the cylindrical lenses CYa, CYb, and the fθ lens FT constitute an optical lens system.

The reflecting mirror 102 reflects the light beam LB1 incident from the collimator lens 100 in the -Z direction in FIG. 3, and enters the drawing optical element 106 as a light modulator for drawing. The condenser lens 104 condenses (converges) the light beam LB1 (parallel light beam) incident on the drawing optical element 106 to have a beam waist width in the drawing optical element 106. The drawing optical element 106 is transmissive to the light beam LB1, and for example, an acousto-optic modulation element (AOM) is used. When the driving signal (high-frequency signal) from the control device 18 is in the OFF state, the optical element 106 for drawing causes the incident light beam LB1 to irradiate the shielding plate or absorber not shown in the figure, and then the driving signal from the control device 18 When the (high frequency signal) is in the ON state, the incident light beam LB1 is diffracted, and its primary diffracted light (the drawing light beam, that is, the light beam LB1 whose intensity is modulated according to the pattern data) is irradiated to the mirror 110. The shielding plate and the absorber are used to prevent the light beam LB1 from leaking to the outside.

A collimator 108 is provided between the mirror 110 and the drawing optical element 106 to make the light beam LB1 incident on the mirror 110 parallel light. The reflecting mirror 110 reflects the incident light beam LB1 toward the reflecting mirror 114 in the -X direction, and the reflecting mirror 114 reflects the incident light beam LB1 toward the polygon mirror PM. The polygon mirror (rotating polygon mirror) 116 reflects the incident light beam LB1 toward the fθ lens having an optical axis parallel to the X axis toward the -X direction. The polygon mirror PM deflects (reflects) the incident light beam LB1 in a plane parallel to the XY plane in order to scan the spot light SP of the light beam LB1 on the illuminated surface of the substrate FS. Specifically, the polygon mirror PM has a rotation axis AXp extending in the Z direction, and a plurality of reflection surfaces RP (eight reflection surfaces RP in this first embodiment) formed around the rotation axis AXp. By rotating the polygon mirror PM in a predetermined rotation direction with the rotation axis AXp as the center, the reflection angle of the pulse-shaped light beam LB1 irradiated to the reflection surface RP can be continuously changed. Thereby, the reflection direction of the light beam LB1 is deflected by a reflective surface RP, and the spot light SP of the light beam LB1 irradiated on the illuminated surface of the substrate FS can be scanned in the scanning direction (the width direction of the substrate FS, the Y direction). That is, the polygon mirror PM deflects the incident light beam LB1 and scans the spot light SP along the drawing line (scanning line) SL1 shown in FIG. 5. In addition, the polygon mirror PM is rotated at a constant speed by a rotation driving source not shown (for example, composed of a motor or a reduction mechanism). The rotation driving source is controlled by the control device 18.

Since the point light SP of the light beam LB1 can be scanned along the drawing line SL1 by a reflecting surface RP of the polygon mirror PM, the drawing line of the point light SP is scanned on the illuminated surface of the substrate FS by one rotation of the polygon mirror PM The number of SL1 is the same as the number of reflecting surface RP at maximum eight. As mentioned above, the effective length (for example, 30mm) of the drawing line SL1 is set to a length below the maximum scanning length (for example, 31mm) of the spot light SP that can be scanned by the polygon mirror PM. In the initial setting (design), The center point of the drawing line SL1 is set at the center of the maximum scan length.

In addition, as an example, assuming that the effective length of the drawing line SL1 is 30mm, the spot light SP with the effective size ø of 3μm is overlapped by 1.5μm one by one, while the spot light SP is irradiated to the illuminated surface of the substrate FS along the drawing line SL1 At the time of up, the number of spot lights SP (the number of pulses of the light beam LB from the light source device 14) irradiated by one scan becomes 20000 (30mm/1.5μm). Moreover, if the scanning time of the spot light SP along the drawing line SL1 is 200μsec, the pulse-shaped spot light SP must be irradiated 20000 times during this period. Therefore, the light emission frequency Fs of the light source device 14 becomes Fs≧20000 times/200μsec= 100MHz.

Returning to the description of the configuration of the scanning unit U1, the cylindrical lens CYa provided between the mirror 110 and the mirror 114 causes the light beam LB1 to be on the reflecting surface of the polygon mirror PM in the Z direction (non-scanning direction) orthogonal to the scanning direction The light is condensed (converged) on the RP into an oblong shape (slit shape) extending in a direction parallel to the XY plane. With this cylindrical lens CYa, even if the reflecting surface RP is inclined with respect to the Z direction (Z axis) (when there is a surface falling error), its influence can be suppressed, and the formation of the light beam LB1 irradiated on the substrate FS can be suppressed The irradiation position of the spot light is staggered in the conveying direction (X direction) of the substrate FS.

The light beam LB1 reflected by the polygon mirror PM irradiates the fθ lens FT including the condenser lens. The fθ lens FT with an optical axis extending in the X-axis direction projects the light beam LB1 reflected by the polygon mirror PM on a plane parallel to the XY plane to the telecentric scanning lens of the mirror 122 in a manner parallel to the X-axis. The incident angle θ of the light beam LB1 to the fθ lens FT changes according to the rotation angle (θ/2) of the polygon mirror PM. The fθ lens FT projects the light beam LB1 to an image height position on the illuminated surface of the substrate FS that is proportional to the incident angle θ. Assuming that the focal distance is fo and the image height position is y, the fθ lens FT has the relationship y=fo·θ. Therefore, the light beam LB1 (point light SP) can be scanned accurately and uniformly in the Y direction by the fθ lens FT. When the incident angle to the fθ lens FT is 0 degrees, the light beam LB1 entering the fθ lens FT travels along the fθ lens FT.

The light beam LB1 irradiated from the fθ lens FT passes through the mirror 122 and is irradiated with spot light SP on the substrate FS. The cylindrical lens CYb arranged between the fθ lens FT and the mirror 122 makes the spot light SP of the light beam LB1 condensed on the substrate FS into a minute circle with a diameter of several μm (for example, 3 μm), and its generatrix is in the Y direction parallel. Thereby, the drawing line SL1 (refer to FIG. 5) extended in the Y direction formed by the spot light (scanning point) SP is prescribed|regulated on the board|substrate FS. In the case of no cylindrical lens CYb, by the action of the cylindrical lens CYa in front of the polygon mirror PM, the spot light condensed on the substrate FS extends in the direction (X direction) orthogonal to the scanning direction (Y direction) The long oval shape.

As described above, in the state where the substrate FS is transported in the X direction, the spot light SP of the light beam LB is scanned in the scanning direction (Y direction) by the scanning units U1 to U6 to draw a predetermined pattern on the substrate FS. The scanning units U1 to U6 are arranged on the drawing head support portion 36 in a manner of scanning different areas on the substrate FS. In addition, when the size (length of the drawing line) of the spot light SP on the substrate FS in the scanning direction is Ds, and the scanning speed (relative scanning speed) of the spot light SP on the substrate FS is Vs, the oscillation frequency of the light beam LB Fs must satisfy the relationship of Fs≧Vs/Ds. Since the light beam LB is pulsed light, if the oscillation frequency Fs does not satisfy the relationship of Fs≧Vs/Ds, the spot light SP of the light beam LB is irradiated onto the substrate FS at a predetermined interval (gap). If the oscillation frequency Fs satisfies the relationship of Fs≧Vs/Ds, the spot light SP can be irradiated on the substrate FS in a manner overlapping with each other in the scanning direction, so even the pulsed beam LB can be substantially continuous in the scanning direction The linear pattern is well drawn on the substrate FS. In addition, the scanning speed Vs of the spot light SP and the rotation speed of the polygon mirror PM become faster.

Fig. 6 is a diagram showing the relationship between the polygon mirror PM of each scanning unit U1~U6 and the scanning direction of a plurality of drawing lines SLn (SL1~SL6). In the plurality of scanning units U1, U3, U5 and the plurality of scanning units U2, U4, U6, the mirror 114, the polygon mirror PM, and the fθ lens FT are symmetrical with respect to the center plane Poc. Therefore, by rotating the polygon mirror PM of each scanning unit U1~U6 in the same direction (to the left), each scanning unit U1, U3, U5 moves the point of the beam LB from the drawing start position to the drawing end position in the -Y direction The light SP scans, and each scanning unit U2, U4, U6 scans the spot light SP of the light beam LB in the +Y direction from the drawing start position to the drawing end position. In addition, the rotation direction of the polygon mirror PM of each scanning unit U2, U4, U6 can be opposite to the rotation direction of the polygon mirror PM of each scanning unit U1, U3, U5, so that each scanning unit U1~U6 The scanning direction of the spot light SP of the light beam LB is the same in the same direction (+Y direction or -Y direction).

Here, as the polygon mirror PM rotates, the angle of the reflecting surface RP also changes with the passage of time. Therefore, the rotation angle α of the polygon mirror PM that can make the light beam LB incident on the specific reflection surface RP of the polygon mirror PM enter the fθ lens FT is limited.

FIG. 7 is a diagram for explaining the rotation angle α of the polygon mirror PM that can deflect (reflect) the light beam LBn in such a way that the reflecting surface RP of the polygon mirror PM of the scanning unit Un enters the fθ lens FT. This rotation angle α is the maximum scanning rotation angle range of the polygon mirror PM that can scan the spot light SP on the irradiated surface of the substrate FS by the polygon mirror PM of the scanning unit Un through a reflective surface RP. Hereinafter, the rotation angle α is referred to as the maximum scanning rotation angle range. The period during which the polygon mirror PM rotates by the maximum scanning rotation angle range α becomes the effective scanning period (maximum scanning time) of the spot light SP. The maximum scanning rotation angle range α corresponds to the maximum scanning length of the drawing line SLn. The larger the maximum scanning rotation angle range α, the longer the maximum scanning length. The rotation angle β represents the rotation angle from the angle of the polygon mirror PM when the light beam LB starts to enter a specific reflecting surface RP to the angle of the polygon mirror PM when the incident on the specific reflecting surface RP ends. That is, the rotation angle β is the angle at which the polygon mirror PM rotates the reflecting surface RP. The rotation angle β is defined by the number Np of the reflecting surface RP of the polygon mirror PM, and can be expressed as β≒360/Np. Therefore, the specific reflective surface RP of the polygon mirror PM of the scanning unit Un cannot scan the spot light SP on the illuminated surface of the substrate FS, that is, the reflected light reflected by the specific reflective surface RP of the polygon mirror PM cannot The non-scanning rotation angle range r of the polygon mirror PM incident on the fθ lens FT is expressed by the relational expression r=β-α. The period during which the polygon mirror PM rotates the non-scanning rotation angle range r becomes the invalid scanning period of the spot light SP. In this non-scanning rotation angle range r, the scanning unit Un cannot make the light beam LBn irradiate the substrate FS. The rotation angle α and the non-scanning rotation angle range r have the relationship of equation (1). r=(360°/Np)-α …(1) (Among them, N is the number of the reflecting surface RP of the polygon mirror PM)

In the first embodiment, since the polygon mirror PM has eight reflecting surfaces RP, N=8. Therefore, the formula (1) can be represented by the formula (2). r=45 degrees-α …(2)

The maximum scanning rotation angle range α is changed according to conditions such as the distance between the polygon mirror PM and the fθ lens FT. For example, if the maximum scanning rotation angle range α is 15 degrees, the non-scanning rotation angle range r becomes 30 degrees, and the scanning efficiency of the polygon mirror PM becomes α/β=1/3 in FIG. 7. That is, while the polygon mirror PM of the scanning unit Un rotates in the non-scanning rotation angle range r (30 degrees), the light beam LBn incident on the polygon mirror PM is useless.

Therefore, in the first embodiment, by switching the scanning unit Un in which the light beam LB from one light source device 14 enters, and periodically distributing the light beam LB to the three scanning units Un, the scanning efficiency can be improved. That is, by staggering the drawing periods (scanning periods for scanning the spot light SP) of the three scanning units Un, the light beam LB from the light source device 14 is not useless, and the scanning efficiency can be improved.

In addition, the effective scanning period (effective drawing period), that is, the maximum scanning rotation angle range α is the range within which the spot light SP can be effectively scanned on the drawing line SLn after the beam LBn enters the fθ lens FT, but the maximum scanning rotation angle range α is also based on The focal distance on the front side of the fθ lens FT is changed. In the case of the same eight-sided polygon mirror PM as above, the maximum scanning rotation angle range α is 10 degrees, according to equation (2), the non-scanning rotation angle r is 35 degrees during the non-drawing period, and the scanning efficiency of the drawing at this time It becomes approximately 1/4 (10/45). Conversely, when the maximum scanning rotation angle range α is 20 degrees, according to the equation (2), the non-scanning rotation angle r during the non-drawing period is 25 degrees, and the scanning efficiency of the drawing at this time becomes about 1/2(20/ 45). In addition, when the scanning efficiency is more than 1/2, the number of scanning units Un allocated to the light beam LB can also be two. That is, the number of scanning units Un that can be allocated to the light beam LB is limited by the scanning efficiency.

FIG. 8 is a schematic diagram of the optical path of the light guiding optical system 40a and the plurality of scanning units U1, U3, U5. When the drive signal (high frequency signal) applied from the control device 18 to the selective optical element (AOM) 50 is ON and the drive signal applied to the selective optical elements 58, 66 is OFF, the selective optical element 50 makes the incident The beam LB is diffracted. Thereby, the light beam LB1 that is the primary diffracted light diffracted by the optical element 50 for selection is incident on the scanning unit U1 through the mirror 52, and the light beam LB does not enter the scanning units U3, U5. Similarly, when the driving signal applied to the selection optical element (AOM) 58 from the control device 18 is ON and the driving signal applied to the selection optical elements 50, 66 is OFF, it transmits through the selection optical element 50 in the ON state. The light beam LB is incident on the optical element 58 for selection, and the optical element 58 for selection diffracts the incident light beam LB. Thereby, the light beam LB3 which is the primary diffracted light diffracted by the optical element 58 for selection is incident on the scanning unit U3 through the mirror 60, and the light beam LB does not enter the scanning units U1, U5. In addition, when the drive signal applied to the selection optical element (AOM) 66 from the control device 18 is ON and the drive signal applied to the selection optical elements 50, 58 is OFF, it transmits through the selection optical element 50 in the OFF state, The light beam LB of 58 is incident on the selection optical element 66, and the selection optical element 66 diffracts the incident light beam LB. Thereby, the light beam LB5 that is the primary diffracted light diffracted by the selected optical element 66 enters the scanning unit U5 through the mirror 68, and the light beam LB does not enter the scanning units U1, U3.

As described above, by introducing light into the optical system 40a, the plurality of selection optical elements 50, 58, 66 are arranged in series along the traveling direction of the light beam LB from the light source device 14, and the plurality of selection optical elements 50, 58, 66 can be Switch to select whether the light beam LBn (LB1, LB3, LB5) is incident on any one of the scanning units U1, U3, U5. The control device 18 controls a plurality of optical elements 50, 58, 66 for selection by periodically switching the scanning unit Un in which the light beam LB enters, for example, scanning unit U1→scanning unit U3→scanning unit U5→scanning unit U1. . That is, the light beams LBn (LB1, LB3, LB5) are sequentially incident on a plurality of scanning units U1, U3, U5 at a predetermined scanning time to switch.

The rotation of the polygon mirror PM of the scanning unit U1 is controlled by the control device 18 during the period when the light beam LB1 is incident on the scanning unit U1, so that the incident light beam LB1 can be reflected toward the fθ lens FT. That is, the period during which the light beam LB1 enters the scanning unit U1 is synchronized with the scanning period of the spot light SP of the light beam LB1 performed by the scanning unit U1 (the maximum scanning rotation angle range α in FIG. 7). That is, the polygon mirror PM of the scanning unit U1 is synchronized with the incident period of the light beam LB1 to deflect the light beam LB1 in such a manner that the spot light SP of the light beam LB1 incident on the scanning unit U1 scans along the drawing line SL1. The same is true for the polygon mirrors PM of the scanning units U3 and U5. When the light beams LB3 and LB5 are incident on the scanning units U3 and U5, their rotation is controlled by the control device 18 to reflect the incident light beams LB3 and LB5 to the fθ lens FT. . That is, the period during which the light beams LB3 and LB5 enter the scanning units U3 and U5 is synchronized with the scanning period of the light beams LB3 and LB5 performed by the scanning units U3 and U5. That is, the polygon mirror PM of the scanning unit U3, U5 is synchronized with the period when the light beams LB3, LB5 are incident, so that the spot light SP of the light beam LB incident on the scanning unit U3, U5 scans along the drawing line SL3, SL5. The method deflects the beams LB3, LB5.

As mentioned above, the light beam LB from one light source device 14a is supplied to any one of the three scanning units U1, U3, U5 in a time-sharing manner. Therefore, the polygon mirror PM of each of the scanning units U1, U3, U5 is The rotational drive is controlled by the method of making the rotation speed uniform while maintaining a certain angle difference (maintaining the phase difference) in the rotation angle position. Specific examples of its control will be described later.

In addition, the control device 18 controls the supply of pattern data (drawing data) of the pattern drawn on the substrate FS by the light beams LB1, LB3, LB5 irradiated from each scanning unit U1, U3, U5 according to regulations. The driving signal (high frequency signal) of the optical element 106 for drawing of the scanning units U1, U3, U5 is ON/OFF. Thereby, the drawing optical element 106 of each scanning unit U1, U3, U5 diffracts the incident light beams LB1, LB3, LB5 according to the ON/OFF driving signal, and can adjust the intensity of the spot light SP. For this pattern data, for example, if one point (pixel) of the drawing pattern is 3×3μm, it will be "1" when the drive signal is ON (drawing) and "0" when the drive signal is OFF (non-drawing) for each point. The binary data of "is generated as bitmap data, which is temporarily stored in the memory (RAM) for each scanning unit Un.

To further explain in detail the pattern data set for each scanning unit Un, the pattern data (drawing data) is based on the direction along the scanning direction (main scanning direction, Y direction) of the spot light SP as the row direction and along the substrate FS The direction of the conveying direction (sub-scanning direction, X direction) is a bitmap data composed of a plurality of pixel data (hereinafter referred to as pixel data) that are two-dimensionally decomposed in a row direction. This pixel data is 1-bit data of "0" or "1". The pixel data of "0" means that the intensity of the spot light SP irradiated on the substrate FS is at a low level, and the pixel data of "1" means that the intensity of the spot light SP irradiated on the substrate FS is at a high level. The pixel data of a row of the pattern data corresponds to a drawing line SLn (SL1~SL6), and the intensity of the point light SP projected to the substrate FS along a drawing line SLn (SL1~SL6) is modulated according to the pixel data of the row. The pixel data in this row is called sequence data (drawing information). That is, the pattern data is the bitmap data of the serial data DLn arranged in the row direction. DL1 represents the sequence data DLn of the pattern data of the scanning unit U1. Similarly, there may be situations where DL2~DL6 represent the sequence data DLn of the pattern data of the scanning units U2~U6.

The control device 18, based on the pattern data of the scanning unit Un incident on the light beam LBn (sequence data DLn composed of "0" and "1"), inputs the ON/OFF drive signal into the depiction of the scanning unit Un incident on the light beam LBn Use optical components (AOM) 106. For the drawing optical element 106, if an ON driving signal is input, the incident light beam LBn is diffracted and then irradiated to the mirror 110, and if an OFF driving signal is input, the incident light beam LBn is irradiated to the above-mentioned reflecting plate not shown Or the aforementioned absorber. As a result, when the light beam LBn enters the scanning unit Un, if the drive signal for ON is input to the drawing optical element 106, the spot light SP of the light beam LBn is irradiated on the substrate FS (the intensity of the spot light SP becomes higher), and the drive is turned off When the signal is input to the optical element 106 for drawing, the spot light of the light beam LBn does not irradiate the substrate FS (the intensity of the spot light SP becomes 0). Therefore, the scanning unit Un incident by the light beam LBn can draw a pattern based on the pattern data on the substrate FS along the drawing line SLn.

For example, when the light beam LB3 enters the scanning unit U3, the control device 18 switches (drives) the drawing optical element 106 of the scanning unit U3 on/off based on the pattern data of the scanning unit U3. Thereby, the scanning unit U3 can draw a pattern based on the pattern data on the substrate FS along the drawing line SL3. In the above manner, each scanning unit U1, U3, U5 can adjust the intensity of the spot light (scanning spot light) SP along the drawing lines SL1, SL3, SL5, and draw a pattern based on the pattern data on the substrate FS.

In addition, although the operation of the light introducing optical system 40a and the plurality of scanning units U1, U3, U5 has been described using FIG. 8, the light introducing optical system 40b and the plurality of scanning units U2, U4, U6 are also the same. Briefly, the control device 18 controls a plurality of options by switching the even-numbered scanning unit Un into which the light beam LBn from the light source device 14b enters, for example, scanning unit U2→scanning unit U4→scanning unit U6→scanning unit U2. Use optics 50, 58, 66. That is, the switching is performed in such a manner that the light beam LB sequentially enters each of the plurality of scanning units U2, U4, U6 at a predetermined scanning time. The polygon mirror PM of each scanning unit U2, U4, U6, under the control of the control device 18, is synchronized with the period when the light beam LBn is incident, so that the point light SP of the incident light beam LBn is along the drawing line SL2, SL4, The SL6 scanning method deflects the beam LBn. In addition, the control device 18 uses the scanning units U2, U4, and U6 to draw patterns based on pattern data on the substrate FS along the drawing lines SL2, SL4, and SL6, according to the light beam LBn (LB2, LB4, LB6) The pattern data (sequence data DLn(DL2, DL4, DL6) composed of "0" and "1") of the scanning unit Un(U2, U4, U6) injected, control the scanning unit Un(U2, U4, U6) ) The drawing optical element (AOM) 106.

As described above, in the first embodiment described above, a plurality of optical elements 50, 58, 66 for selection are arranged in series along the traveling direction of the light beam LB from the light source device 14a (14b). The optical elements 50, 58, 66 make the light beam LBn selectively enter any one of the scanning units U1, U3, U5 (scanning units U2, U4, U6) in a time-sharing manner, and the light beam LB will not be useless. The utilization efficiency of the light beam LB can be improved.

In addition, the rotation speed and the rotation phase of each polygon mirror PM of the plurality of (here, three) scanning units Un are synchronized with each other, and the light beam LBn is incident by the plurality of optical elements 50, 58, 66 for selection The periods of the scanning units Un are synchronized, and the polygon mirror PM deflects the light beam LBn by scanning the spot light SP on the substrate FS, so the light beam LB is not useless, and the scanning efficiency can be improved.

In addition, the optional optical elements (AOM) 50, 58, 66 only need to be in the ON state during one scan of the spot light SP performed by each polygon mirror PM of the scanning unit Un. For example, if the number of reflection surfaces of the polygon mirror PM is Np, and the rotation speed Vp of the polygon mirror PM is (rpm), the time Tss corresponding to the rotation angle β of one of the reflection surfaces RP of the polygon mirror PM becomes Tss=60/( Np・Vp) seconds. For example, when the number of reflecting surfaces Np is 8 and the rotation speed Vp is 30,000, the rotation of one of the polygon mirrors PM is 2 milliseconds, and the time Tss is 0.25 milliseconds. Converting this to a frequency of 4kHz, that is, compared to the acousto-optic modulator (optical element 106 for drawing) that modulates the pattern data of the light beam LB of the ultraviolet wavelength at a high speed of tens of MHz, as long as it is very Acousto-optic modulating components with low response frequency are sufficient. Therefore, the selective optical element (AOM) 50, 58, 66 can use the first-order diffracted light that is deflected with respect to the incident light beam LB (0-order light), that is, the one with a larger diffraction angle of LBn (LB1~LB6). Therefore, the light beams LBn (LB1~LB6) deflected from the path of the light beam LB that linearly transmits the selection optical elements 50, 58, 66 are guided to the mirrors 52, 60, 68 of the scanning unit Un (refer to Fig. 3 , Figure 4) The configuration becomes easier.

(Modifications of the above-mentioned first embodiment) The first embodiment described above can also be modified as follows. In the first embodiment described above, the light beam LB is distributed to three scanning units Un, but in this modification, the light beam LB from one light source device 14 is distributed to five scanning units Un.

FIG. 9 is a diagram showing the configuration of the drawing head 16 in a modification of the above-mentioned first embodiment. In this modification example, there is one light source device 14 and the drawing head 16 has five scanning units Un (U1 to U5). In addition, the same reference numerals are assigned to the same configuration as the first embodiment described above, or the illustration is omitted, and only the different parts are described. In addition, in FIG. 9, the cylindrical lens CYb shown in FIG. 3 is omitted from the illustration.

In this modification, instead of the light introduction optical systems 40a, 40b, a light introduction optical system (light beam switching member) 130 is used. The light introduction optical system 130, as shown in FIG. 10, except the condenser lens 42, the collimator lens 44, the reflecting mirror 46, the condenser lens 48, the selective optical element 50, the reflecting mirror 52, the collimating lens shown in FIG. In addition to the mirror 54, the condensing lens 56, the selective optical element 58, the reflecting mirror 60, the collimator 62, the condensing lens 64, the selective optical element 66, the reflecting mirror 68, and the absorber 70, it is further equipped with selective optics The element 132, the reflecting mirror 134, the collimating lens 136, the condenser lens 138, the selective optical element 140, the reflecting mirror 142, the collimating lens 144, and the condenser lens 136.

The selection optical element 132, the collimator lens 136, and the condensing lens 138 are arranged between the condensing lens 56 and the selection optical element 58 in this order. Therefore, in this modified example, when the drive signal (high-frequency signal) from the control device 18 is OFF, the optical element 50 for selection transmits the incident light beam LB directly and irradiates it to the optical element 132 for selection to condense the light. The lens 56 condenses the light beam LB that has entered the selection optical element 132 in the selection optical element 132 into a beam waist width.

The optical element for selection 132 is transmissive to the light beam LB, and for example, an acousto-optic modulation element (AOM) is used. The optical element 132 for selection, when the drive signal from the control device 18 is OFF, transmits the incident light beam LB directly and then irradiates the optical element 58 for selection, and when the drive signal (high frequency signal) from the control device 18 is ON When the incident light beam LB is diffracted, the light beam LB2 that is the primary diffracted light is irradiated to the mirror 134. The reflecting mirror 134 reflects the incident light beam LB2 and enters the collimating mirror 100 of the scanning unit U2. That is, the control device 18 switches the optical element 132 for selection ON/OFF, and the optical element 132 for selection switches whether or not the light beam LB2 is incident on the scanning unit U2. The collimator 136 makes the light beam LB irradiated to the optical element 58 for selection into parallel light, and the condenser lens 138 makes the light beam LB made into parallel light by the collimator lens 136 converge into the beam waist width in the optical element 58 for selection .

The optical element 140 for selection, the collimator lens 144, and the condenser lens 146 are provided between the condenser lens 64 and the optical element 66 for selection in this order. Therefore, in this modified example, when the drive signal from the control device 18 is OFF, the optical element 58 for selection transmits the incident light beam LB directly and then irradiates the optical element 140 for selection, and the condenser lens 64 makes the incident The light beam LB of the selection optical element 140 is condensed in the selection optical element 140 to have a beam waist width.

The selection optical element 140 is transmissive to the light beam LB, and for example, an acousto-optic modulation element (AOM) is used. The optical element 140 for selection irradiates the incident light beam LB to the optical element 66 for selection when the drive signal from the control device 18 is OFF, and when the drive signal (high frequency signal) from the control device 18 is ON, the The light beam LB4 that is the primary diffracted light that diffracts the incident light beam LB is irradiated to the mirror 142. The reflecting mirror 142 reflects the incident light beam LB4 and irradiates it to the collimator lens 100 of the scanning unit U4. That is, the control device 18 switches the optical element 140 for selection ON/OFF, and the optical element 140 for selection switches whether or not the light beam LB4 is incident on the scanning unit U4. The collimator 144 makes the light beam LB irradiated to the optical element 66 for selection into parallel light, and the condenser lens 146 makes the light beam LB made into parallel light by the collimator lens 144 condense into the optical element 66 for selection into a beam waist .

By arranging the plurality of selective optical elements (AOM) 50, 58, 66, 132, 140 in series (in-line), the light beam LBn can be incident on any one of the plurality of scanning units U1 to U5. The control device 18 controls a plurality of options by periodically switching the scanning unit Un incident by the light beam LBn in the order of, for example, scanning unit U1→scanning unit U2→scanning unit U3→scanning unit U4→scanning unit U5→scanning unit U1 Use optical elements 50, 132, 58, 140, 66. That is, the switching is performed in such a way that the light beam LBn sequentially enters each of the plurality of scanning units U1 to U5 at a predetermined scanning time. In addition, the polygon mirror PM of each scanning unit U1~U5 is controlled by the control device 18 in synchronization with the period when the light beam LBn is incident, so that the point light SP of the incident light beam LBn is scanned along the drawing line SL1~SL5 This way deflects the beam LBn. In addition, the control device 18, in a way that each scanning unit Un can draw a pattern based on the pattern data on the substrate FS along the drawing line SLn, according to the pattern data (from "0", "0", The sequence data DLn composed of "1" controls the drawing optical element (AOM) 106 of the scanning unit Un.

That is, in the case of this modified example, the polygon mirrors PM of the five scanning units U1 to U5 are synchronously rotated in such a manner that the rotation angle position is shifted one by one by a certain angle. In the case of this embodiment, the light beam (laser light) LB is distributed to the five scanning units U1 to U5 in a time-sharing manner, so the light beam LBn can be irradiated to the angle range of one reflecting surface RP of the polygon mirror PM (Figure 7 The rotation angle β) and the maximum deflection angle of the light beam LBn reflected by the reflecting surface RP entering the fθ lens FT (angle 2α in Fig. 7) satisfy β≧5α. Set the focal length of the fθ lens FT or the polygon mirror The number of reflective surfaces of PM Np.

As described above, in this modification, the light beam LB is not useless, and the utilization efficiency of the light beam LB from the light source device 14 can be improved, and the scanning efficiency can be improved. In addition, in this modification, although the light beam LB from one light source device 14 is distributed to five scanning units Un, the light beam LB from one light source device 14 may be distributed to two scanning units Un, or it may be distributed to four scanning units Un. One or more than six scanning units Un. In this case, if the number of assigned scanning units is n, the angle range (rotation angle β in Fig. 7) that can be irradiated to a reflecting surface RP of the polygon mirror PM with the light beam LBn and the light beam reflected by the reflecting surface RP The maximum deflection angle of the LB incident fθ lens FT (angle 2α in Fig. 7) satisfies β≧n×α, and the focal length of the front side of the fθ lens FT or the number of reflecting surfaces Np of the polygon mirror PM is set. Moreover, as explained in the first embodiment, the case where the light beams LB from the two light source devices 14 (14a, 14b) are distributed to a plurality of scanning units Un is not limited to three, and may be distributed to any number. Scan unit Un. For example, the light beam LB from the light source device 14a may be distributed to five scanning units Un, and the light beam LB from the light source device 14b may be distributed to four scanning units Un.

(Second Embodiment) In the first embodiment described above, since the drawing optical element (AOM) 106 is provided in front of the polygon mirror PM in each scanning unit Un, the number of drawing optical elements 106 used increases and the cost becomes higher. Therefore, in the second embodiment, one drawing light modulator (AOM) is provided on the optical path of the light beam LB from one light source device 14, and the one drawing light modulator is used to modulate the plurality of scanning units Un The intensity of the light beam LBn irradiated to the substrate FS and the pattern are drawn. That is, in the second embodiment, only one light modulator (AOM) for drawing that requires high responsiveness is placed in front of the plurality of scanning units Un, and the low responsiveness can be selected on the side of each scanning unit Un. Optical components (AOM).

FIG. 11 is a diagram showing the structure of the drawing head 16 of the second embodiment. FIG. 12 is a diagram showing the light introduction optical system 40a shown in FIG. 11. The same reference numerals are given to the same components as those of the above-mentioned first embodiment, and only different parts will be described. In addition, in FIG. 11, the cylindrical lens CYb shown in FIG. 3 is omitted from the illustration. The light introduction optical systems 40a and 40b have the same configuration, so the light introduction optical system 40a is described here, and the description of the light introduction optical system 40b is omitted. As shown in FIG. 12, the light introduction optical system 40a, except for the condenser lens 42, collimator lens 44, reflecting mirror 46, condenser lens 48, selective optical element 50, reflecting mirror 52, and collimator shown in FIG. In addition to the mirror 54, the condenser lens 56, the selective optical element 58, the reflecting mirror 60, the collimator 62, the condenser lens 64, the selective optical element 66, the reflecting mirror 68, and the absorber 70, it is further equipped for drawing. The drawing optical element (AOM) 150, the collimator lens 152, the condenser lens 154, and the absorber 156 of the light modulator. In this second embodiment, as shown in FIG. 11, the optical element 106 for drawing of the first embodiment is not provided in each of the scanning units U1 to U6.

The drawing optical element 150, the collimator lens 152, and the condenser lens 154 are provided between the condenser lens 48 and the selective optical element 50 in this order. Therefore, in the second embodiment, the reflecting mirror 46 reflects the light beam LB that has become parallel light by the collimator lens 44 and then faces the drawing optical element 150. The condenser lens 48 condenses (converges) the light beam LB that has entered the drawing optical element 150 to a beam waist width in the drawing optical element 150.

The drawing optical element 150 is transmissive to the light beam LB, and, for example, an acousto-optic modulation element (AOM) is used. The drawing optical element 150 is provided on the light source device 14 (14a) side of the selection optical element 50, which is located at the initial stage closest to the light source device 14 (14a) side among the selection optical elements 50, 58, 66. The optical element 150 for drawing makes the incident light beam LB irradiate the absorber 156 when the drive signal (high frequency signal) from the control device 18 is OFF, and when the drive signal (high frequency signal) from the control device 18 is ON At this time, the light beam (drawing light beam) LB that is the primary diffracted light that diffracts the incident light beam LB is irradiated to the optical element 50 for selection in the initial stage. The collimator lens 152 makes the light beam LB irradiated to the optical element 50 for selection into parallel light, and the condenser lens 154 makes the light beam LB made into parallel light by the collimator lens 152 converge (converge) into light in the optical element 50 for selection. Waist wide.

As shown in Fig. 11, the scanning units U1 to U6 have a collimator lens 100, a mirror 102, a mirror 110, a cylindrical lens CYa, a mirror 114, a polygon mirror PM, an fθ lens FT, and a cylindrical lens CYb (in Fig. 11 (Illustration omitted), and the mirror 122 further have a first shaping lens 158a and a second shaping lens 158b as beam shaping lenses. That is, in this second embodiment, instead of the condenser lens 104 and the collimator lens 108 of the first embodiment, the scanning units U1 to U6 are provided with a first molded lens 158a and a second molded lens 158b.

FIG. 13 is a schematic diagram of the optical path of the light guiding optical system 40a of FIG. 12 and a plurality of scanning units U1, U3, U5. The control device 18 uses the light beams LB1, LB3, and LB5 irradiated from the scanning units U1, U3, and U5 according to the regulations. The pattern data of the pattern drawn on the substrate FS (consisting of "0" and "1") The serial data DL1, DL3, DL6) output the ON/OFF driving signal (high frequency signal) to the drawing optical element 150 of the light introduction optical system 40a. Thereby, the drawing optical element 150 of the light introducing optical system 40a can diffract the incident light beam LB according to the ON/OFF driving signal, and modulate (ON/OFF) the intensity of the spot light SP.

In detail, the control device 18 inputs an ON/OFF drive signal to the drawing optical element 150 based on the pattern data of the scanning unit Un that the light beam LBn enters. When the drawing optical element 150 is input with an ON drive signal (high frequency signal), the incident light beam LB is diffracted and irradiated to the selection optical element 50 (the intensity of the light beam LB incident on the selection optical element 50 becomes higher ). On the other hand, when the drawing optical element 150 receives an OFF drive signal (high-frequency signal), the incident light beam LB is irradiated to the absorber 156 (FIG. 12) (the light beam LB incident on the selection optical element 50) The intensity becomes 0). Therefore, the scanning unit Un incident by the light beam LBn can irradiate the substrate FS with the light beam LB whose intensity has been adjusted along the drawing line SLn, and draw a pattern based on the pattern data on the substrate FS.

For example, when the light beam LB3 enters the scanning unit U3, the control device 18 switches ON/OFF the drawing optical element 150 of the light introduction optical system 40a based on the pattern data of the scanning unit U3. Thereby, the scanning unit U3 can irradiate the substrate FS with the light beam LB whose intensity has been adjusted along the drawing line SL3, and draw a pattern based on the pattern data on the substrate FS. The scanning unit Un incident by the light beam LBn is sequentially switched in the manner of, for example, scanning unit U1→scanning unit U3→scanning unit U5→scanning unit U1. Therefore, the control device 18, in the same way, switches the pattern data of the scanning unit U1→the pattern data of the scanning unit U3→the pattern data of the scanning unit U5→the pattern data of the scanning unit U1 in order to determine the transmission to the light guide optics. The pattern data of the ON/OFF signal of the optical element 150 for drawing of the system 40a. Next, the control device 18 controls the drawing optical element 150 of the light introducing optical system 40a according to the pattern data that is sequentially switched. Thereby, each scanning unit U1, U3, U5 can irradiate the light beam LB with the intensity adjusted to the substrate FS along the drawing lines SL1, SL3, SL5, and draw a pattern based on the pattern data on the substrate FS.

Above, the structure and operation of a part of the control system to which the second embodiment is applied has been described in detail with reference to FIGS. 14 to 16. In addition, the configuration and operation described below can also be applied to the first embodiment. Fig. 14 is a block diagram of the rotation control system of the polygon mirror PM of each of the three scanning units U1, U3, U5 in Fig. 11 and Fig. 13 as an example. Since the scanning units U1, U3, U5 have the same composition, Therefore, the same symbols are given to the same members. Each of the scanning units U1, U3, U5 is equipped with photoelectric detection of the origin sensors OP1, OP3 for the scanning start timing of the drawing lines (scanning lines) SL1, SL3, SL5 generated on the substrate FS by the polygon mirror PM , OP5. The origin sensors OP1, OP3, OP5 are photodetectors that project light to the reflecting surface RP of the polygon mirror PM and receive the reflected light. Whenever the point light SP comes to the scanning start point next to the drawing line SL1, SL3, SL5 In the previous position, pulse-shaped origin signals SZ1, SZ3, SZ5 are output respectively.

The timing measurement unit 180 inputs the origin signals SZ1, SZ3, SZ5, and measures whether the generation timing of each of the origin signals SZ1, SZ3, SZ5 is within a predetermined allowable range (time interval). If an error within the allowable range occurs, the The deviation information corresponding thereto is output to the servo control device 182. The servo control device 182 outputs a command value based on the deviation information to each servo drive circuit part of the motor Mp that drives the polygon mirror PM in each scanning unit U1, U3, U5 to rotate. Each servo drive circuit part of the motor Mp inputs the lift pulse signal (hereinafter referred to as the encoder signal) from the encoder EN installed on the rotating shaft of the motor Mp and outputs the speed signal corresponding to the rotation speed of the polygon mirror PM The return circuit part FBC is composed of a servo drive circuit (amplifier) SCC that inputs the command value from the servo control device 182 and the speed signal from the return circuit part FBC and drives the motor Mp at a rotation speed corresponding to the command value. In addition, the servo drive circuit unit (return circuit unit FBC, servo drive circuit SCC), the timing measurement unit 180, and the servo control device 182 constitute part of the control device 18.

In the second embodiment, each polygon mirror PM in the three scanning units U1, U3, U5 must maintain a certain phase difference in the rotation angle position and rotate at the same speed at the same time. In order to achieve this, the timing measurement unit 180 inputs the original Point signals SZ1, SZ3, SZ5, for example, perform the measurement shown in the timing diagram of Figure 15.

Fig. 15 schematically shows various signal waveforms generated by the three polygon mirrors PM when the rotation angle is rotated with a phase difference within a predetermined allowable range. Immediately after rotating each polygon mirror PM, the relative phase difference of the origin signal SZ1, SZ3, SZ5 is different, but the timing measurement unit 180, for example, takes the origin signal SZ1 as a reference and uses the same frequency as the origin signal SZ1 (Period) Generate other origin signals SZ3, SZ5, and take the time interval Ts1, Ts2, Ts3 between the three origin signals SZ1, SZ3, SZ5 as the reference value, and measure the correction corresponding to the error News. The timing measurement unit 180 outputs the correction information to the servo control device 182, thereby performing servo control on the motors Mp of the scanning units U3 and U5. The generation timing of the three origin signals SZ1, SZ3, SZ5 is controlled as shown in the figure Ts1=Ts2=Ts3 is generally stable.

If the origin signals SZ1, SZ3, and SZ5 are generated with stable timing, the timing measurement unit 180 draws the enable (ON) signal SPP1, the respective output of the selection optical elements 50, 58, 66 shown in Figure 11 to Figure 13 above. SPP3, SPP5. Depicting the enable (ON) signals SPP1, SPP3, SPP5, here only during the H-level period, the corresponding selection optical elements 50, 58, 66 are modulated (light deflection switching operation). The three origin signals SZ1, SZ3, SZ5 maintain a certain phase difference stably (here is 1/3 of the period of the origin signal SZ1), so each of the enable signals SPP1, SPP3, SPP5 rises (L→H) ) Also maintain a certain phase difference. This drawing enable signal SPP1, SPP3, SPP5 corresponds to the drive signal (high frequency signal) used to switch the optical element 50, 58, 66 for selection.

The timing of the falling (H→L) of the drawing enable signals SPP1, SPP3, SPP5 is measured by the counter in the timing measurement section 180 to turn on/off the point light in each drawing line SL1, SL3, SL5 Set by the clock signal CLK. The clock signal CLK controls the ON/OFF timing of the drawing optical element 150 (or the drawing optical element 106 in FIG. 3), which is determined by the length of the drawing line SLn (SL1, SL3, SL5) and the point light on the substrate FS The size, the scanning speed Vs of the spot light SP, etc. are determined. For example, if the length of the traced line is 30mm, the size (diameter) of the spot light is 6μm, and the spot light is overlapped by 3μm in the scanning direction and turned on/off, the counter in the timing measurement unit 180, if the counting clock signal CLK reaches For 100 times (30mm/3μm), the drawing enable signals SPP1, SPP3, SPP5 can be reduced (H→L).

Also, assuming that the reflecting surface of the polygon mirror PM is 10 surfaces and the rotation speed is Vp (rpm), the frequency of each origin signal SZ1, SZ3, SZ5 becomes 10Vp/60 (Hz). Therefore, the time interval Ts1=Ts2=Ts3 is stable, and the time interval Ts1 becomes 60/(30Vp) second. As an example, if the reference rotation speed Vp of the polygon mirror PM is 8000 rpm, the time interval Ts1 becomes 60/(30·8000) seconds=250 μS.

As shown in Figure 15, the ON time (H level duration) of the enable signals SPP1, SPP3, SPP5 is depicted as the period during which the light beam (laser light) LB from the polygon mirror PM is projected onto the substrate FS ( Projection period), but must be set shorter than the time interval Ts1. Therefore, for example, if the ON time Toa is set to 200 μS, the frequency of the clock signal CLK for counting 10000 times during this period becomes 10000/200=50 (MHz). In synchronization with the above-mentioned clock signal CLK, the drawing bit row data or serial data DLn (for example, 10000 bits) Sdw corresponding to the drawing line SLn generated from the pattern data ("0" or "1" on the bitmap) Output to optical element 150 for drawing. In addition, as shown in FIG. 3, each of the scanning units U1, U3, U5 is provided with a drawing optical element 106, and the drawing bit row data Sdw or serial data DL1 corresponding to the drawing line SL1 is sent to the scanning unit U1 for drawing The optical element 106, corresponding to the drawing bit row data Sdw or the serial data DL3 of the drawing line SL3, is sent to the scanning unit U3, and the drawing bit row data Sdw or the serial data DL5 corresponding to the drawing line SL5 is sent to the scanning unit. U5 is an optical element 106 for drawing.

In the second embodiment, the drawing bit row data Sdw or sequence data DLn generated from the pattern data corresponding to each of the three drawing lines Sl1, SL3, SL5, and the drawing enable signal SPP1, SPP3, SPP5 (or origin The signals SZ1, SZ3, SZ5) are synchronously and sequentially supplied to the ON/OFF of the drawing optical element 150.

FIG. 16 shows an example of a circuit for generating the above described bit row data Sdw. The circuit has generating circuits (pattern data generating circuits) 301, 303, 305 and an OR circuit GT8. The generating circuit 301 includes a memory section BM1, a counter section CN1, and a gate section GT1. The generating circuit 303 includes a memory section BM3, a counter section CN3, and a gate section GT3. The generating circuit 305 includes a memory section BM5, a counter section CN5, and Gate GT5. The generating circuits 301, 303, 305 and the OR circuit GT8 constitute a part of the control device 18.

The memory parts BM1, BM3, and BM5 are memories that once store the bitmap data (pattern data) corresponding to the patterns to be drawn and exposed by each scanning unit U1, U3, U5. The counter parts CN1, CN3, CN5 are each bitmap data (pattern data) in each memory part BM1, BM3, BM5, and then a bit row to be drawn (for example, 10000 bits) to be drawn one by one The ground is used as a counter to output the sequence data DL1, DL3, and DL5 synchronized with the clock signal CLK during the period when the drawing enable signals SPP1, SPP3, and SPP5 are ON.

The image data in each memory unit BM1, BM3, BM5 is offset by a drawing line by an address counter (not shown). This offset, for example, if it is the memory portion BM1, after the output of the sequence data DL1 of one drawing line is finished, it is followed by the timing of the generation of the origin signal SZ3 of the active scanning unit U3. Similarly, the offset of the image data in the memory portion BM3 is performed after the output of the sequence data DL3 is completed, followed by the timing of the generation of the origin signal SZ5 of the active scanning unit U5, and the offset of the image data in the memory portion BM5 After the output of the sequence data DL5 is completed, the sequence of generating the origin signal SZ1 of the active scanning unit U1 follows.

The sequence data DL1, DL3, and DL5 generated in the above manner are applied to the 3-input OR circuit GT8 through the gates GT1, GT3, GT5 that are opened during the ON period of the drawing enable signals SPP1, SPP3, and SPP5. The OR circuit GT8 repetitively synthesizes the sequence data DL1→DL3→DL5→DL1... and outputs the bit data row as the drawing bit row data Sdw to the drawing optical element 150 for ON/OFF. In addition, as shown in Fig. 3, each of the scanning units U1, U3, U5 is provided with a drawing optical element 106, so long as the sequence data DL1 output from the gate GT1 is transmitted to the drawing optical element 106 in the scanning unit U1 The sequence data DL3 output from the gate GT3 is sent to the drawing optical element 106 in the scanning unit U3, and the sequence data DL5 output from the gate GT5 is sent to the drawing optical element 106 in the scanning unit U5.

As mentioned above, the ON/OFF of the drawing optical element 150 (or 106) must respond to the high-speed clock signal CLK (for example, 50MHz), but the optical element 50, 58, 66 should only be used with the drawing enable signal SPP1, SPP3, SPP5 (or origin signal SZ1, SZ3, SZ5) can be turned ON/OFF synchronously, and its response frequency, in the case of the above numerical example, the time interval Toa (or Ts1) is 200μs, so it is about 10KHz. Use high transmittance and low price. In addition, if the frequency of the clock signal CLK counted by the counter in the timing measurement unit 180 or by the counter units CN1, CN3, CN5 in FIG. 16 is Fcc, the basic frequency of the pulse oscillation of the light beam LB from the light source device 14 If it is Fs, set n to be an integer greater than or equal to 1 (preferably n≧2), and set it to satisfy the relationship of n·Fcc=Fs.

Above, the operation of using the light introduction optical system 40a of FIG. 13 and the plurality of scanning units U1, U3, U5 and the drawing timing of each scanning unit U1, U3, U5 of FIGS. 14 to 16 have been described, but regarding the light The introduction optical system 40b is also the same as the plurality of scanning units U2, U4, U6. Briefly, the scanning unit Un that the light beam LB enters is switched in the order of, for example, scanning unit U2→scanning unit U4→scanning unit U6→scanning unit U2. Therefore, the control device 18, in the same way, switches the pattern data of the scanning unit U2→the pattern data of the scanning unit U4→the pattern data of the scanning unit U6→the pattern data of the scanning unit U2 in order to determine the transmission to the light guide optics. The pattern data of the ON/OFF signal of the optical element 150 for drawing of the system 40b. Next, the control device 18 controls the drawing optical element 150 of the light introducing optical system 40b according to the pattern data that is sequentially switched. In addition, the drawing bit row data Sdw synthesized by the pattern data of the three drawing lines is generated by the circuit configuration shown in FIG. 16 and sent to the drawing optical element 150. Thereby, each scanning unit U2, U4, U6 can irradiate the substrate FS with the light beam LB whose intensity has been adjusted along the drawing lines SL2, SL4, SL6, and draw a pattern based on the pattern data on the substrate FS.

In the second embodiment described above, in addition to the effects of the first embodiment described above, the following effects can be obtained. That is, one drawing optical element 150 is provided in the light introduction optical system 40a, and the drawing optical element 150 is arranged on the light source device 14a side of the selection optical element 50 in the early stage, and one drawing optical element 150 is patterned according to the pattern. The intensity of the light beams LB1, LB3, LB5 irradiated from the plurality of scanning units U1, U3, U5 to the substrate FS is modulated. Similarly, a drawing optical element 150 is provided in the light introduction optical system 40b, and the drawing optical element 150 is placed on the light source device 14b side of the selection optical element 50 in the early stage, and a drawing optical element 150 is used according to the pattern. The intensity of the light beams LB2, LB4, LB6 irradiated from the plurality of scanning units U2, U4, U6 to the substrate FS is modulated. Thereby, the number of acousto-optic modulation elements can be reduced, and the cost can be reduced.

In addition, in the above-mentioned second embodiment, the description is made with the drawing head 16 which divides the light beam LB into three strips. However, as explained in the modification of the above-mentioned first embodiment, the drawing head 16 ( Refer to Figure 9 and Figure 10). In addition, in the case of FIGS. 9 and 10, since there is one light source device 14, there is also one optical element 150 for drawing.

(Modification of the second embodiment) The second embodiment described above can also be modified as follows. In the second embodiment described above, the drawing optical element 150 is provided in the light introducing optical systems 40a, 40b as the light modulator for drawing. However, in this modification, instead of the drawing optical element 150, the light source device 14 (14a , 14b) respectively set the light modulator for drawing. In addition, the same reference numerals are assigned to the same configuration as the second embodiment described above, or the illustration is omitted, and only the different parts are described. In addition, the light source devices provided with light modulators for drawing in the light source devices 14a and 14b are referred to as light source devices 14A and 14B, respectively. Since the light source device 14A and the light source device 14B have the same configuration, only the light source device 14A will be described.

FIG. 17 is a diagram showing the structure of a light source device (pulse light source device, laser light source device) 14A of this modification. The light source device 14A as an optical fiber laser device includes a DFB semiconductor laser element 200, a DFB semiconductor laser element 202, a polarization beam splitter 204, an electro-optical element 206 as a light modulator for drawing, and a driving of the electro-optical element 206 Circuit 206a, polarizing beam splitter 208, absorber 210, excitation light source 212, combiner 214, fiber optical amplifier 216, wavelength conversion optical element 218, wavelength conversion optical element 220, plural lens elements GL, and clock generation The control circuit 222 of the device 222a.

The DFB semiconductor laser element (the first solid-state laser element, the first semiconductor laser light source) 200 generates a steep or sharp pulse-like seed light (lightning) at a predetermined frequency (oscillation frequency, fundamental frequency) Fs. Irradiation light) S1, DFB semiconductor laser element (second solid-state laser element, second semiconductor laser light source) 202 generates gentle (time-wide) pulsed seed light (laser light) S2 at a predetermined frequency Fs. A pulse of the seed light S1 generated by the DFB semiconductor laser element 200 and a pulse of the seed light S2 generated by the DFB semiconductor laser element 202 have approximately the same energy, but the polarization states are different from each other, and the peak intensity of the seed light S1 is stronger. In this modification example, the polarization state of the seed light S1 generated by the DFB semiconductor laser element 200 is S-polarized light, and the polarization state of the seed light S2 generated by the DFB semiconductor laser element 202 is P-polarized light. The DFB semiconductor laser device 200, 202 responds to the clock signal LTC (predetermined frequency Fs) generated by the clock generator 222a, and is controlled by the electrical control of the control circuit 222 to generate seed light S1, S2 at the oscillation frequency Fs. This control circuit 222 is controlled by the control device 18.

In addition, the clock signal LTC becomes the base frequency of the clock signal CLK supplied to each of the counter units CN1, CN3, CN5 shown in FIG. 16, so the clock signal LTC is divided by n (n is preferably 2 or more) (Integer) is the clock signal CLK. In addition, the clock generator 222a also has the function of adjusting the basic frequency Fs of the clock signal LTC by ±ΔF, that is, the function of fine-tuning the time interval of the pulse oscillation of the light beam LB. In this way, for example, even if the scanning speed Vs of the spot light SP slightly changes, by fine-tuning the basic frequency Fs, the size of the pattern drawn by the drawing line (drawing magnification) can be accurately maintained.

The polarizing beam splitter 204 transmits the S-polarized light, reflects the P-polarized light, and guides the seed light S1 generated by the DFB semiconductor laser element 200 and the seed light S2 generated by the DFB semiconductor laser element 202 to the electro-optical element 206. In detail, the polarizing beam splitter 204 transmits the seed light S1 of the S-polarized light generated by the DFB semiconductor laser element 200, guides the seed light S1 to the electro-optical element 206, and reflects the P-polarized light generated by the DFB semiconductor laser element 202 The seed light S2 guides the seed light S2 to the electro-optical element 206. The DFB semiconductor laser elements 200, 202 and the polarization beam splitter 204 constitute a laser light source section (light source section) 205 that generates seed light S1, S2.

The electro-optical element 206 is transparent to the seed lights S1 and S2, and for example, an electro-optical modulator (EOM: Electro-Optic Modulator) is used. The EOM responds to the ON/OFF state (high/low) of the bit row data Sdw (or serial data DLn) shown in FIG. 16, and the seed light S1 from the polarizing beam splitter 204 is replaced by the driving circuit 206a. The polarization state of S2. The wavelength range of the seed light S1, S2 from each of the DFB semiconductor laser element 200 and the DFB semiconductor laser element 202 is longer than 800 nm. Therefore, as the electro-optical element 206, the switching response of the polarization state can be used at GHz level. .

When the 1-bit pixel data of the drawing bit row data Sdw (or serial data DLn) input to the driving circuit 206a is OFF (low, "0"), the electro-optical element 206 does not change the incident seed light S1 or The polarization state of S2 is directly led to the polarization beam splitter 208. On the other hand, when the drawing bit row data Sdw (or serial data DLn) input to the driving circuit 206a is in the ON state (high, "1"), the electro-optical element 206 changes the polarization state of the seed light S1 or S2. (Change the polarization direction by 90 degrees), lead to the polarization beam splitter 208. As mentioned above, by driving the electro-optical element 206, the electro-optical element 206 converts the seed light S1 of S-polarized light into P when the pixel data of the bit row data Sdw (or serial data DLn) is in the ON state (high). The seed light S1 of polarized light converts the seed light S2 of P-polarized light into the seed light S2 of S-polarized light.

The polarizing beam splitter 208 transmits the P-polarized light, passes through the lens element GL and guides it to the coupler 214, and reflects the S-polarized light to the absorber 210. The excitation light source 212 generates excitation light, and the generated excitation light is guided to the coupler 214 through the optical fiber 212a. The combiner 214 combines the seed light irradiated from the polarization beam splitter 208 with the excitation light, and outputs it to a fiber optical amplifier (optical amplifier) 216. The optical fiber amplifier 216 is doped with the laser medium excited by the excitation light. Therefore, in the fiber optical amplifier 216 where the synthesized seed light and excitation light are transmitted, the laser medium is excited by the excitation light to amplify the seed light. As the laser medium doped in the optical fiber amplifier 216, rare earth elements such as erbium (Er), ytterbium (Yb), and thium (Tm) are used. The amplified seed light is emitted from the emission end 216a of the optical fiber amplifier 216 at a predetermined divergence angle, is converged by the lens element GL or collimated, and then enters the wavelength conversion optical element 218.

The wavelength conversion optical element (the first wavelength conversion optical element) 218 uses the second harmonic generation (Second Harmonic Generation (SHG)) to convert the incident seed light (wavelength λ) into 1/2 of the wavelength λ 2nd harmonic. As the wavelength conversion optical element 218, Quasi Phase Matching (QPM) crystals, namely PPLN (Periodically Poled LiNbO ₃ ) crystals can be preferably used. In addition, PPLT (Periodically Poled LiTaO ₃ ) crystals can also be used.

The wavelength conversion optical element (the second wavelength conversion optical element) 220 uses the second harmonic (wavelength λ/2) converted by the wavelength conversion optical element 218 and the remaining seed light (wavelength λ) not converted by the wavelength conversion optical element 218 ) Sum frequency generation (Sum Frequency Generation: SFG), which generates the third harmonic whose wavelength is 1/3 of λ. This third harmonic becomes ultraviolet light (light beam LB) having a peak wavelength in the wavelength band below 370 nm.

As described above, in the case where the drawing bit row data Sdw (or DLn) sent from the pattern data generating circuit shown in FIG. 16 is applied to the configuration of the electro-optical element 206 in FIG. 17, the bit row data Sdw (or DLn) is drawn When the 1-bit pixel data is in the OFF state (low, “0”), the electro-optical element 206 does not change the polarization state of the incident seed light S1 or S2, and directly leads to the polarization beam splitter 208. Therefore, the seed light transmitted through the polarizing beam splitter 208 becomes the seed light S2 from the DFB semiconductor laser element 202. Therefore, the light beam LB finally output from the light source device 14A has the same oscillation profile (time characteristic) as the seed light S2 from the DFB semiconductor laser element 202. That is, in this case, the light beam LB has a low pulse peak intensity and a blunt characteristic that is broad in time. The fiber optical amplifier 216 has low amplifying efficiency for the above-mentioned low peak intensity seed light S2, so the light beam LB output from the light source device 14A becomes light that is not amplified to the energy required for exposure. Therefore, in this case, from the viewpoint of exposure, the result is substantially the same as that of the light source device 14A not emitting the light beam LB. That is, the intensity of the spot light SP irradiated to the substrate FS becomes a low level. However, during the period (non-projection period, non-exposure period) during which the pattern is not drawn along each drawing line SLn (SL1~SL6), even if the light beam LB of the ultraviolet rays from the seed light S2 has a slight intensity, it continues to emit, so the drawing line When SLn (SL1~SL6) is located at the same position on the substrate FS for a long time (for example, the substrate FS is urgently stopped due to a failure of the transport system, etc.), it is only necessary to install a movable light on the exit window of the light beam LB of the light source device 14A Gate, close the injection window.

On the other hand, when the 1-bit pixel data of the drawing bit row data Sdw (or DLn) applied to the electro-optical element 206 of FIG. 17 is in the ON state (high, "1"), the electro-optical element 206 changes the incident The polarization state of the seed light S1 or S2 is guided to the polarization beam splitter 208. Therefore, the seed light transmitted through the polarizing beam splitter 208 becomes the seed light S1 from the DFB semiconductor laser element 200. Therefore, the light beam LB finally output from the light source device 14A is generated by the seed light S1 from the DFB semiconductor laser element 200. Since the peak intensity of the seed light S1 from the DFB semiconductor laser element 200 is strong, it is effectively amplified by the optical fiber amplifier 216, and the light beam LB output from the light source device 14A has the energy required for the exposure of the substrate FS. That is, the intensity of the spot light SP irradiated to the substrate FS becomes a high level.

As described above, since the electro-optical element 206 as the light modulator for drawing is provided in the light source device 14A, it is the same as the control of the drawing optical element 150 in the second embodiment described above. By controlling the electro-optical element 206, The same effect as the second embodiment described above. That is, the electro-optical element 206 is switched (driven) to ON/OFF according to the pattern data of the scanning unit Un that the light beam LB enters (or the bit row data Sdw in FIG. 15 and FIG. 16). The drawing pattern modulates the intensity of the light beam LB incident on the selection optical element 50 in the initial stage, that is, the intensity of the spot light SP of the light beam LB irradiated on the substrate FS by each scanning unit Un (U1~U6).

In addition, in the configuration of FIG. 17, the DFB semiconductor laser element 202 and the polarizing beam splitter 204 are omitted, and only the seed light S1 from the DFB semiconductor laser element 200 is passed through the electro-optical element based on the pattern data (drawing data) The switching of 206, the burst wave is guided to the fiber optical amplifier 216, which is also considered. However, if this configuration is adopted, the incident periodicity of the seed light S1 to the fiber optical amplifier 216 is greatly disturbed according to the pattern to be drawn. That is, after the state where the seed light S1 from the DFB semiconductor laser element 200 does not enter the fiber optical amplifier 216 continues, if the seed light S1 enters the fiber optical amplifier 216, the seed light S1 at a moment after the incident is more general When it is amplified by a larger amplification rate, there will be a problem that the optical fiber optical amplifier 216 generates a light beam with a larger intensity above the specified level. Therefore, in this modification, as a preferred form, the seed light S2 (broad pulse light with low peak intensity) from the DFB semiconductor laser element 202 is incident while the seed light S1 does not enter the fiber optical amplifier 216 The fiber optic amplifier 216 solves the above-mentioned problem.

In addition, although the electro-optical element 206 is switched, it is also possible to drive the DFB semiconductor laser elements 200, 202 according to the pattern data (depicting bit row data Sdw or serial data DLn). That is, the control circuit 222 controls the DFB semiconductor laser elements 200, 202 according to the pattern data (depicting the bit row data Sdw or DLn) to selectively (alternatively) generate the seed light S1 that oscillates in pulses at a predetermined frequency Fs , S2. In this case, there is no need for polarizing beam splitters 204, 208, electro-optical element 206, and absorber 210, and one of the seed light S1, S2 that is selectively pulsed from any of the DFB semiconductor laser elements 200, 202 Inject directly into the coupler 214. At this time, the control circuit 222 controls each DFB semiconductor laser in such a way that the seed light S1 from the DFB semiconductor laser element 200 and the seed light S2 from the DFB semiconductor laser element 202 do not enter the fiber optical amplifier 216 at the same time. Driver for components 200, 202. That is, when the spot light SP of each beam LBn is irradiated to the substrate FS, the DFB semiconductor laser element 200 is controlled so that only the seed light S1 enters the optical fiber optical amplifier 216. Moreover, when the spot light SP of the light beam LBn is not irradiated to the substrate FS (the intensity of the spot light SP is extremely low), the DFB semiconductor laser element 202 is controlled so that only the seed light S2 is incident on the optical fiber optical amplifier 216. As mentioned above, whether to irradiate the light beam LBn to the substrate FS is determined based on the pixel data (high/low) of the pattern data (H or L of the drawing bit row data Sdw). In addition, the deflection states of the seed light S1 and S2 in this case can also be P deflection.

As mentioned above, in this modification, the number of acousto-optic modulating elements can be reduced, and the cost can be lowered.

In addition, the light source devices 14A, 14B of this modification 1 can also be used in the light source devices 14a, 14b of the above-mentioned first embodiment. In this case, it is also possible to control the output timing of the seed light S1 from the DFB semiconductor laser device 200 output from the light source devices 14A, 14B according to the pattern data (drawing bit row data Sdw), and the drawing of each scanning unit U1~U6. Switching of optical element 106.

(Third Embodiment) Next, the third embodiment will be described with reference to FIG. 18. However, in the third embodiment, it is assumed that the light source devices 14A (refer to FIG. 17) and 14B described in the modification of the second embodiment are used. However, in order to be suitable for the third embodiment, the clock generator 222a in the control circuit 222 of the light source device 14A of FIG. 17 is equipped with the magnification correction information from the control unit (control circuit 500) for drawing control shown in FIG. CMg partially (discretely) stretches the time interval of the clock signal LTC. Similarly, the clock generator 222a in the control circuit 222 of the light source device 14B also has the function of partially (discretely) expanding and contracting the time interval of the clock signal LTC according to the magnification correction information CMg. In addition, the operations of the light source device 14B, the light introducing optical system 40b, and the scanning units U2, U4, U6 are the same as the operations of the light source device 14A, the light introducing optical system 40a, and the scanning units U1, U3, U5, so regarding the light source device 14B The operation of the light introduction optical system 40b and the scanning units U2, U4, U6 will not be described. In addition, the same reference numerals are assigned to the same configuration as the modification of the second embodiment described above or the illustration is omitted, and only the different parts are described.

In Fig. 18, the light beam (laser light) LB from one light source device 14A has the same structure as the above-mentioned Figs. 12 and 13, and is supplied to three scanning units U1, U3, U5 through selection optical elements 50, 58, 66, respectively . Each of the selective optical elements 50, 58, 66 responds to the depiction enable (ON) signals SPP1, SPP3, SPP5 described in Figure 14 and Figure 15 to selectively deflect (switch) the light beam LB, and guide the light beam LB to the scanning unit Any one of U1, U3, U5. In addition, as described above, during the period when the pattern is not drawn along each drawing line (non-projection period), even if the light beam LB of the ultraviolet light from the seed light S2 has a slight intensity, it continues to be emitted. When the situation of the same position on the substrate FS occurs, a movable shutter SST is provided in the exit window of the light beam LB of the light source device 14A.

As shown in Figure 14, the origin signals SZ1, SZ3, and SZ5 from the origin sensors OP1, OP3, OP5 of each scanning unit U1, U3, U5 are supplied to generate pattern data of each scanning unit U1, U3, U5 Generating circuits (pattern data generating circuits) 301, 303, 305. The generating circuit 301 includes the gate portion GT1, the memory portion BM1, the counter portion CN1, etc. in FIG. 16. The counter portion CN1 is based on the clock signal LTC output from the control circuit 222 (clock generator 222a) of the light source device 14A. The clock signal CLK1 produced frequently is counted.

Similarly, the generating circuit 303 includes the gate portion GT3, the memory portion BM3, the counter portion CN3, etc. in FIG. 16. The counter portion CN3 counts the clock signal CLK3 produced with the clock signal LTC as the base frequency, and the generating circuit 305 includes In Figure 16, the gate part GT5, the memory part BM5, the counter part CN5, etc., the counter part CN5 counts the clock signal CLK5 produced with the clock signal LTC as the base frequency.

These clock signals CLK1, CLK3, CLK5 are divided into 1/n by the control circuit 500 having the function of the interface between the generating circuits 301, 303, 305 and the light source device 14A. Integer above). The clock signal CLK1, CLK3, CLK5 supplies each counter section CN1, CN3, CN5, and responds to the drawing enable (ON) signal SPP1, SPP3, SPP5 (refer to Figure 15), which is limited to any one. That is, when the drawing enable signal SPP1 is ON (high), only the clock signal CLK1 whose clock signal LTC is divided into 1/n is supplied to the counter part CN1. When the drawing enable signal SPP3 is ON (high), only The clock signal CLK3 divided into 1/n of the clock signal LTC is supplied to the counter section CN3. When the enable signal SPP5 is ON (high), only the clock signal CLK5 divided into 1/n of the clock signal LTC is supplied To the counter section CN5.

Thereby, the sequence data DL1, DL3, and DL5 sequentially output from each of the generating circuits 301, 303, and 305 are respectively provided in the 3-input OP circuit GT8 in the control circuit 500 through the gates GT1, GT3, and GT5 (refer to Fig. 16) After adding, the drawing bit row data Sdw is supplied to the electro-optical element 206 in the light source device 14A. In addition, the generating circuits 301, 303, 305 and the control circuit 500 constitute part of the control device 18.

The above configuration is basically the same as the utilization method of the light source device 14A explained using FIG. 17, but in this embodiment, the drawing line (scanning line) SL1, SL3, SL5 of each of the three scanning units U1, U3, U5 is provided. The function of individually fine-tuning the drawing magnification of the dot scanning direction (Y direction) of the drawn pattern. Due to this function, in this embodiment, the scanning units U1, U3, U5 are provided with memory portions BM1a, BM3a, BM5a that temporarily store the information mg1, mg3, mg5 about the correction amount of the drawing magnification. Although the memory portions BM1a, BM3a, and BM5a are separately provided in FIG. 18, they can also be part of the memory portions BM1, BM3, and BM5 provided in each of the generating circuits 301, 303, and 305. Information about this correction amount mg1, mg3, mg5 also forms part of the scan information.

The information mg1, mg3, mg5 of the correction amount, for example, corresponds to the ratio (ppm) at which the Y-direction dimension of the pattern drawn by each drawing line SL1, SL3, SL5 is expanded or contracted. As an example, suppose that the length of the Y-direction area that can be drawn by each drawing line SL1, SL3, SL5 is 30mm, if you want to make it stretch ±200ppm (equivalent to ±6μm), set ±200 in the information mg1, mg3, mg5 The value. In addition, the information mg1, mg3, mg5 can be set not by ratio but by direct expansion (±ρμm). In addition, the information mg1, mg3, mg5 can also be reset successively for the pattern data (sequence data DLn) along each of the drawing lines SL1, SL3, SL5, or for the pattern data of multiple lines (sequence data DLn) ) To send and reset. As described above, in this embodiment, the drawing magnification in the Y direction can be dynamically changed during the pattern drawing along each of the drawing lines SL1, SL3, SL5 while the substrate FS is being transported in the X direction (long side direction). When it is known that the substrate FS is deformed or in-plane irregularities, it is possible to suppress the deterioration of the drawing position accuracy due to this. Furthermore, during the overlap exposure, the overlap accuracy can be greatly improved in response to the deformation of the formed underlying pattern.

19 is a time chart showing the signal state of each part and the oscillation state of the light beam LB when the scanning unit U1 performs standard pattern drawing in the drawing device shown in FIG. 18. In Fig. 19, the two-dimensional matrix Gm represents the bit pattern PP of the pattern data to be drawn. A grid (one pixel unit) on the substrate FS is set to, for example, the size in the Y direction Py is 3μm and the size in the X direction Px is 3 μm. Also, in FIG. 19, SL1-1, SL1-2, SL1-3, ...SL1-6 shown by arrows indicate that the line SL1 is drawn along with the movement of the substrate FS in the X direction (sub-scanning in the longitudinal direction) The drawing lines for sequential drawing are set so that the interval of each drawing line SL1-1, SL1-2, SL1-3, ...SL1-6 in the X direction becomes, for example, 1/2 of the size Px(3μm) of a pixel unit The conveying speed of the substrate FS.

Furthermore, the size of the spot light SP projected on the substrate FS in the XY direction (the spot light size ø) is the same as or slightly larger than one pixel unit. Therefore, the spot light size ø, as the effective diameter (1/e ² width of the Gaussian distribution, or full width at half maximum of the peak intensity) is set to about 3~4μm, and the spot light SP is continuously projected along the drawing line SL1 At this time, the oscillation frequency Fs (pulse time interval) of the light beam LB and the scanning speed Vs of the spot light SP by the polygon mirror PM are set in such a way that 1/2 of the effective diameter of the spot light SP overlaps. That is, if the seed light emitted from the polarization beam splitter 208 in the light source device 14A shown in FIG. 17 is the light beam Lse (FIG. 18), this light Lse responds to the slave control circuit 222 (clock generator 222a) Each clock pulse of the emitted clock signal LTC is emitted as shown in Figure 19.

The clock signal LTC and the clock signal CLK1 supplied to the counter section CN1 in the generating circuit 301 in FIG. 18 are set to a frequency ratio of 1:2, and the clock signal LTC is 100MHz. The 1/2 frequency divider of the control circuit 500 sets the clock signal CLK1 to 50 MHz. In addition, the frequency ratio between the clock signal LTC and the clock signal CLK1 only needs to be an integer multiple. For example, it can also be set to reduce the set frequency of the clock signal CLK1 to 1/4 of 25MHz, and the scanning speed of the spot light SP Vs is reduced to half.

The drawing bit string data Sdw shown in FIG. 19 is equivalent to the sequence data DL1 output from the generating circuit 301, where, for example, the pattern on the drawing line SL1-2 of the pattern PP corresponds. The electro-optical element 206 in the light source device 14A switches the polarization state in response to the drawing bit row data Sdw, so the seed light Lse, during the period when the drawing bit row data Sdw is in the ON state (high, "1"), by means of Figure 17 The seed light S1 of the DFB semiconductor laser device 200 is generated by the seed light from the DFB semiconductor laser device 202 in FIG. 17 during the period when the bit row data Sdw is in the OFF state (low, "0"). S2 is produced. The drawing and exposure operation of the scanning unit U1 shown in FIG. 19 above is the same in the other scanning units U2 to U6.

In addition, the control circuit 222 in the light source device 14A is provided with a response to the clock signal LTC to generate seed light S1 from the DFB semiconductor laser element 200 during the period when the drawing bit row data Sdw is in the ON state (high, "1"). (Rapidly rising and falling pulsed light). During the period when the bit row data Sdw is in the OFF state (low, "0"), in response to the clock signal LTC generates seed light S2 (wide pulsed light) from the DFB semiconductor laser element 202 In the case of the driving circuit, the electro-optical element 206 shown in FIG. 17 and FIG. 18, the polarization beam splitter 208 and the absorber 210 shown in FIG. 17 can be omitted.

As mentioned above, each pulse light of the seed light Lse is output in response to each clock pulse of the clock signal LTC generated by the clock generator 222a shown in FIG. 17. Therefore, in this embodiment, the clock generator 222a is provided It is used to partially increase or decrease the time (period) between pulses of the clock signal LTC. The circuit configuration is provided with a reference (standard) clock generator, a frequency division counter circuit, and a variable delay circuit as the source of the clock signal LTC.

Fig. 20 is a time chart showing the relationship between the reference clock signal TC0 and the clock signal LTC from the reference clock generator in the clock generator 222a. The magnification correction information CMg shown in Figs. 17 and 18 is shown as The state where the correction based on the basis has not been carried out. The variable delay circuit in the clock generator 222a enables the reference clock signal TC0 generated at a constant frequency Fs (a certain time Td0) to be delayed by a time DT0 corresponding to the preset value and output as the clock signal LTC. Therefore, for example, if the reference clock signal TC0 is 100MHz (Td0=10ns), the clock signal will continue to be generated at 100MHz (Td0=10ns) without changing the preset value (delay time DT0) LTC.

Therefore, the frequency division counter circuit in the clock generator 222a counts the reference clock signal TC0, and if the count value reaches the predetermined value Nv, the preset value set in the variable delay circuit is changed by a certain amount . This situation is illustrated by the timetable in Figure 21. In FIG. 21, the reference clock signal TC0 is counted to Nv by the frequency dividing counter circuit, and the preset value set in the variable delay circuit is the delay time DT0. After that, with a clock pulse Kn of the reference clock signal TC0, the frequency dividing counter circuit counts to Nv, and the preset value set in the variable delay circuit is immediately changed to the delay time DT1. Therefore, each clock pulse of the clock signal LTC (after K'n+1) is generated according to the clock pulse Kn followed by the clock pulse Kn of the reference clock signal TC0. It is always generated with a delay time DT1.

Thereby, only when the preset value set in the variable delay circuit is changed by a certain amount, that is, the time interval between the clock pulse K'n and the clock pulse K'n+1 of the clock signal LTC is changed Td1, the time interval of the clock pulse of the subsequent clock signal LTC becomes Td0. In FIG. 21, although the delay time DT1 is increased more than the delay time DT0, and the time between the two clock pulses of the clock signal LTC is increased more than Td0, it can also be reduced in the same way. In addition, if the frequency divider counter circuit counts the reference clock signal TC0 to Nv, it returns to zero and restarts counting up to Nv.

If the initial value of the preset value set in the variable delay circuit is the delay time DT0, the change of the delay time is ±ΔDh, the number of times the frequency division counter circuit returns to zero is Nz, and the frequency division counter circuit counts to Nv Set the delay time of the preset value in the variable delay circuit as DTm in sequence (every time it returns to zero), then set the delay time DTm to the relationship of DTm=DT0+Nz·(±ΔDh). Therefore, as shown in Figure 21, the delay time DT1 during the period when the number of zeroing Nz is set to 1 (m=1) becomes DTm=DT1=DT0±ΔDh, and the next zeroing (Nz=2, m=2) is generated The delay time DT2 set later becomes DTm=DT2=DT0+2·(±ΔDh). Therefore, the variation of the delay time ±ΔDh corresponds to the difference between the reference time Td0 of the time Td1 between the clock pulse K'n and the clock pulse K'n+1 of the clock signal LTC.

As mentioned above, the action of changing the time interval between two specific clock pulses of the clock signal LTC is based on the predetermined value Nv set in the frequency division counter circuit, which is multiple in the total length of a drawing line (SL1~SL6) Implementation of discrete locations. Figure 22 shows this situation. FIG. 22 shows the correction point CPP at a plurality of positions that return to zero every time the count value of the frequency dividing counter circuit reaches the predetermined value Nv along the entire length of the drawing line SL1. At each of the correction points CPP, only the specified two clock pulses of the clock signal LTC are stretched by ±ΔDh relative to the time Td0.

Therefore, if the reference clock signal TC0 is set to 100MHz (Td0=10ns), the effective size of the main scanning direction of the spot light SP is 3μm, the length of the drawing line SL1 (SL2~SL6 is the same) is 30mm, and the light beam LB The two continuous pulsed lights projected to the substrate FS are drawn by half of the spot light SP (1.5 μm) overlapping in the main scanning direction, and the number of clocks of the reference clock signal TC0 generated at the length of the drawing line L1 becomes 20000. In addition, the change amount ΔDh of the delay time is very small with respect to the reference time interval Td0, and is set at about 2%, for example. Under this condition, when the pattern drawn along the drawing line SL1 is expanded and contracted by 150 ppm in the main scanning direction (Y direction), the length of the drawing line L1 is 30 mm and 150 pm is equivalent to 4.5 μm. Information about the ratio of the rendering magnification ratio of 150 ppm or the actual size length of 4.5 μm is stored in the memory portion BM1a in FIG. 18 as information mg1.

Therefore, the number of correction points CPP (Figure 22) in the 20000 clock pulse train of the clock signal LTC relative to the time Td0 stretch time ΔDh becomes 4.5μm/(1.5μm×2%)=150, set in the figure The maximum predetermined value Nv of the frequency division counter circuit shown in 22 becomes approximately 133 by 20000/150.

Also, assuming that the delay time change ΔDh is 5%, the number of correction points CPP becomes 4.5μm/(1.5μm×5%)=60, which is set at the maximum predetermined value Nv of the frequency division counter circuit, by 20,000 /60 becomes approximately 333. As mentioned above, since the delay time change ΔDh10% is less than 10%, even if there is a pattern to be drawn at the correction point CPP, the size of the pattern is larger than the size of the spot light SP, so the difference at the correction point CPP can be ignored The point light SP has a slight position shift in the main scanning direction caused by a drawing error.

The amount of change ΔDh of the delay time, the number of correction points CPP, the setting of the predetermined value Nv performed by the frequency division counter circuit, etc., are based on the magnification correction information CMg(ppm) output from the control circuit 500 of FIG. 18 as shown in FIG. 17 The operation in the control circuit 222 shown is set in the frequency division counter circuit or variable delay circuit in the clock generator 222a.

According to the above-mentioned embodiment, the light beam LB from the light source device 14A can be sequentially supplied to each of the three scanning units U1, U3, U5 in a time-sharing manner, and can be sequentially and individually performed along each scanning unit U1, U3, U5 The drawing action of the drawing lines SL1, SL3, SL5, so as shown in Figure 18, the scanning unit U1, U3, U5 can set the information about the correction amount of drawing magnification mg1, mg3, mg5. As a result, the amount of expansion and contraction of the substrate FS in the Y direction is different. Even if the expansion and contraction rates of certain areas divided in the Y direction are different, the correction amount of the optimal drawing magnification can be set in each scanning unit Un accordingly, and the same It can correspond to the advantages of the non-linear deformation of the substrate FS.

Above, the light source device 14A connected to the device that scans the spot light SP condensed on the irradiated body (substrate FS) to draw a pattern and emits the light beam (laser light) LB that becomes the spot light SP, as shown in FIG. 17, FIG. As shown in Figure 18, it is equipped with: the first semiconductor laser light source (200), which responds to the clock pulse (clock signal LTC) of the predetermined period (Td0), and produces the first light-emitting time which is shorter than the predetermined period and the peak intensity is high. 1 pulsed light (seed light S1); the second semiconductor laser light source (202), in response to the clock pulse, produces a light-emitting time shorter than the predetermined period, longer than the first pulsed light (seed light S1), and has a smaller peak intensity The broad second pulsed light (seed light S2); the optical fiber amplifier (216) for the first pulsed light (seed light S1) or the second pulsed light (seed light S2) to enter; and the switching device, according to the The input of drawing pattern information (drawing bit row data Sdw) is used to make the first pulse light (seed light S1) enter the fiber optical amplifier when the spot light is projected on the illuminated object, and the spot light SP is not The method of making the second pulsed light (seed light S2) into the fiber optical amplifier (216) during the non-drawing projected on the irradiated body is switched. The switching device selects the electro-optical element (206) of either the first pulsed light (seed light S1) or the second pulsed light (seed light S2) according to the pattern information to be drawn, or generates the first pulsed light A circuit that controls the driving of the first semiconductor laser light source (200) and the second semiconductor laser light source (202) according to the pattern information to be drawn by either method of (seed light S1) or second pulsed light (seed light S2) constitute.

This third embodiment can also be applied to the above-mentioned first embodiment or its modification, and the above-mentioned second embodiment. That is, the clock generator 222a in the control circuit 222 of the light source device 14A described in the third embodiment can be used based on the magnification correction information CMg from the control unit (control circuit 500) for drawing control shown in FIG. 18 The function of partially (discretely) expansion and contraction of the time interval of the clock signal LTC is applicable to the light source device 14 of the above-mentioned first embodiment or its modification, and the light source device 14 of the above-mentioned second embodiment. In this case, the light source device 14 may not have the DFB semiconductor laser element 202, the polarizing beam splitter 204, the electro-optical element 206, the polarizing beam splitter 208, and the absorber 210. That is, the light source device 14 may also be a fiber optic amplifier 216 amplifies the pulse-shaped seed light S1 emitted by the DFB semiconductor laser element 200 and emits it as a light beam LB. In this case, since the light source device 14 does not have the electro-optical element 206, the sequence data DL1, DL3, and DL5 generated by the generating circuits 301, 303, 305 are sent to the drawing optical element 106 or the drawing optical element 150 of the scanning unit Un.

(Fourth Embodiment) FIG. 23 is a diagram showing a schematic configuration of an element manufacturing system 10 including an exposure apparatus EX for applying exposure processing to a substrate (irradiated body) FS according to the fourth embodiment. In addition, if not specifically limited, the same code|symbol is attached|subjected or illustration is attached|subjected to the same structure as the said 1st-3rd embodiment (including modification), and only a different part is demonstrated.

In this fourth embodiment, similar to the first to third embodiments (including modifications), the exposure device EX as a scanning device is a direct drawing method that does not use a mask, that is, the so-called line-by-line scanning method. The exposure device. The exposure apparatus EX is provided with a beam switching member 20 and an exposure head 22 instead of the drawing head 16 described in the above-mentioned first to third embodiments (including modifications). In addition, the exposure device EX also has a plurality of alignment microscopes AMm (AM1 to AM4). Although not specifically described in the first to third embodiments (including the modification examples), the exposure apparatus EX of the first to third embodiments described above also includes a plurality of alignment microscopes AMm (AM1 to AM4). In addition, the exposure apparatus EX of the fourth embodiment is of course provided with a substrate transport mechanism 12, a light source device 14', and a control device 18. In addition, the light source device 14' of the fourth embodiment is based on the premise that the light source device 14 (14A, 14B) described in the modification of the second embodiment has the same configuration (see FIG. 17). The light beam LB emitted from the light source device 14' passes through the light beam switching member 20 and enters the exposure head 22.

The light beam switching member 20 switches the light beam LB so that one scanning unit Un that performs one-dimensional scanning of the spot light SP among the plurality of scanning units Un (U1~U6) constituting the exposure head 22 enters the light beam LB from the light source device 14' The light path. The beam switching member 20 will be described in detail later.

The exposure head 22 is equipped with a plurality of scanning units Un (U1 to U6) into which the light beams LB respectively enter. The exposure head 22 draws a pattern on a part of the substrate FS supported by the circumferential surface of the rotating drum DR by a plurality of scanning units Un (U1 to U6). The exposure head 22 is a so-called multi-beam type exposure head in which a plurality of scanning units Un (U1 to U6) of the same configuration are arranged. As shown in FIG. 23, the odd-numbered scanning units U1, U3, U5 are arranged on the upstream side (-X direction side) in the conveying direction of the substrate FS with respect to the center plane Poc and arranged along the Y direction. The even-numbered scanning units U2, U4, U6 are arranged on the downstream side (+X direction side) in the conveying direction of the substrate FS with respect to the center plane Poc and arranged along the Y direction. The odd-numbered scanning units U1, U3, U5 and the even-numbered scanning units U2, U4, U6 are symmetrical with respect to the center plane Poc. That is, in the fourth embodiment, the arrangement of the odd-numbered scanning units U1, U3, U5 and the even-numbered scanning units U2, U4, U6 is opposite to that described in the first to third embodiments (including modifications).

The scanning unit Un projects the light beam LB from the light source device 14' to the illuminated surface of the substrate FS by converging into a spot light SP, while using the rotating polygon mirror PM (refer to FIG. 28) to make the spot light SP in The irradiated surface of the substrate FS performs one-dimensional scanning along a predetermined straight line (scanning line) SLn.

The multiple scanning units Un (U1~U6) are arranged in a predetermined configuration relationship. In the fourth embodiment, the scanning units Un (U1~U6) are arranged as the drawing lines SLn (SL1~SL6) of the scanning units Un(U1~U6) in the Y direction as shown in Figure 24 and Figure 25 (The width direction of the substrate FS, the main scanning direction) are connected without separation from each other. In addition, as described in the first to third embodiments (modified examples), there are cases in which the light beams LB incident on the scanning units Un (U1 to U6) are represented by LB1 to LB6, respectively. The light beam LB that enters the scanning unit Un is a linearly polarized (P-polarized or S-polarized) light beam that is polarized in a predetermined direction. In the fourth embodiment, it is a P-polarized light beam. In addition, there are cases where the light beams LB1 to LB6 incident on each of the six scanning units U1 to U6 are expressed as light beams LBn.

As shown in FIG. 25, each scanning unit Un (U1 to U6) shares the scanning area in such a way that a plurality of scanning units Un (U1 to U6) all cover the entire width direction of the exposure area W. Thereby, each scanning unit Un (U1 to U6) can draw a pattern on a plurality of regions divided in the width direction of the substrate FS. For example, if the scanning length of a scanning unit Un in the Y direction (the length of the drawing line SLn) is about 30~60mm, then three odd-numbered scanning units U1, U3, U5 and three even-numbered scanning units U2 , U4, U6, a total of six scanning units Un are arranged in the Y direction, and the width of the Y direction that can be drawn is expanded to 180~360mm. The length (scanning length, scanning width in the main scanning direction) of each drawing line SL1~SL6 is the same in principle.

In addition, as mentioned above, the actual drawing lines SLn (SL1~SL6) are set to be shorter than the maximum length that the spot light SP can actually scan on the illuminated surface. By setting in the above manner, within the range of the maximum scanning length (for example, 31 mm) of the spot light SP, the position of the drawing line SLn (for example, the scanning length of 30 mm) or the drawing magnification can be finely adjusted in the main scanning direction. The maximum scanning length of the spot light SP is mainly determined by the aperture of the fθ lens FT (refer to FIG. 28) behind the polygon mirror (rotating polygon mirror) PM provided in the scanning unit Un.

A plurality of drawing lines (scanning lines) SL1 to SL6 are arranged in two rows in the circumferential direction of the rotating drum DR with the center plane Poc interposed therebetween. The odd-numbered drawing lines SL1, SL3, SL5 are located on the irradiated surface of the substrate FS on the upstream side (-X direction side) of the substrate FS in the conveying direction with respect to the center plane Poc. The even-numbered drawing lines SL2, SL4, SL6 are located on the irradiated surface of the substrate FS on the downstream side (+X direction side) in the conveying direction of the substrate FS with respect to the center plane Poc. The drawing lines SL1 to SL6 are approximately parallel to the width direction of the substrate FS, that is, the central axis AXo of the rotating drum DR.

The drawing lines SL1, SL3, and SL5 are arranged on a straight line at a predetermined interval along the width direction (scanning direction) of the substrate FS. The drawing lines SL2, SL4, and SL6 are also arranged on a straight line at a predetermined interval along the width direction (scanning direction) of the substrate FS. The scanning direction of the spot light SP of the light beam LBn scanned along the odd-numbered drawing lines SL1, SL3, SL5 is a one-dimensional direction, which is the -Y direction. The scanning direction of the spot light SP of the light beam LBn scanned along the even-numbered drawing lines SL2, SL4, SL6 is a one-dimensional direction, which is the +Y direction.

In the fourth embodiment, a plurality of scanning units Un (U1 to U6) repeatedly scan the spot light SP of the light beam LBn according to a predetermined order (predetermined order). For example, the order of the scanning unit Un for scanning the spot light SP is U1→U2→U3→U4→U5→U6. First, the scanning unit U1 performs a scan of the spot light SP. Then, after the scanning of the spot light SP of the scanning unit U1 is completed, the scanning unit U2 performs a scanning of the spot light SP, and after the scanning is completed, the scanning unit U3 performs a scanning of the spot light SP. In the above manner, a plurality of scanning units Un (U1~U6) Scan the spot light SP one by one in a predetermined order. Then, after the scanning of the spot light SP of the scanning unit U6 is completed, the scanning of the spot light SP of the scanning unit U1 is returned. As mentioned above, a plurality of scanning units Un (U1~U6) repeat the scanning of the spot light SP in a predetermined order.

Each scanning unit Un (U1 to U6) irradiates each light beam LBn toward the substrate FS in such a way that each light beam LBn travels toward the central axis AXo of the rotating drum DR in at least the XZ plane. Thereby, the optical path (beam center axis) of the light beam LBn traveling from each scanning unit Un (U1 to U6) toward the substrate FS is coaxial (parallel) with the normal line of the illuminated surface of the substrate FS in the XZ plane. In addition, each scanning unit Un (U1~U6) faces the substrate FS in such a way that the light beam LBn irradiated to the drawing line SLn (SL1~SL6) is perpendicular to the illuminated surface of the substrate FS in a plane parallel to the YZ plane Irradiation beam LBn. That is, in the main scanning direction of the light beam SP on the illuminated surface, the light beam LBn (LB1 to LB6) projected to the substrate FS is scanned in a telecentric state. Here, the line (or called the optical axis) perpendicular to the illuminated surface of the substrate FS through each midpoint of the drawing line SLn (SL1~SL6) defined by each scanning unit Un (U1~U6) is called irradiation Center axis Len (Le1~Le6) (refer to Figure 24).

The central axis Len (Le1~Le6) of each irradiation is a line connecting the drawing line SL1~SL6 and the central axis AXo in the XZ plane. The irradiation center axes Le1, Le3, Le5 of the odd-numbered scanning units U1, U3, U5 are in the same direction on the XZ plane, and the even-numbered scanning units U2, U4, U6 have the irradiation center axes Le2, Le4, Le6 on the XZ plane. For the same direction. In addition, the irradiation center axes Le1, Le3, Le5 and the irradiation center axes Le2, Le4, Le6 are set in the XZ plane so that the Poc angle with respect to the center plane becomes ±θ (refer to FIG. 23).

The alignment microscope AMm (AM1~AM4) shown in Fig. 23, as shown in Fig. 25, is used to detect the alignment marks MKm (MK1~MK4) formed on the substrate FS. 4 There are four embodiments). The alignment marks MKm (MK1~MK4) are reference marks for aligning the predetermined pattern drawn on the exposed area W on the illuminated surface of the substrate FS and the substrate FS relatively. Align the microscope AMm (AM1~AM4), and detect the alignment marks MKm (MK1~MK4) on the substrate FS supported by the circumferential surface of the rotating drum DR. The alignment microscope AMm (AM1~AM4) is set on the irradiated area (the area surrounded by the drawing lines SL1~SL6) on the substrate FS formed by the spot light SP of the light beam LBn (LB1~LB6) from the exposure head 22. The upstream side (-X direction side) of the substrate FS in the conveying direction.

Alignment microscope AMm (AM1~AM4) has a light source that projects the illumination light for alignment to the substrate FS, and obtains the observation optics of the magnified image of the local area (observation area) including the alignment mark MKm (MK1~MK4) on the surface of the substrate FS A system (including an objective lens), and a CCD, CMOS, and other imaging elements that capture the enlarged image with a high-speed shutter while the substrate FS is moving in the conveying direction. The photographic signals (image data) ig (ig1 to ig4) shot by the microscope AMm (AM1~AM4) are sent to the control device 18. The control device 18 detects according to the image analysis of the photography signal ig (ig1~ig4) and the information of the rotation position of the rotating drum DR at the moment of shooting (read the measurement values of the encoders EN1a, EN1b of the scale part SD shown in FIG. 24) Align the position of the mark MKm (MK1~MK4), and measure the position of the substrate FS with high precision. In addition, the illuminating light for alignment is light in a wavelength range that is hardly sensitive to the photosensitive function layer on the substrate FS, for example, light with a wavelength of about 500 to 800 nm.

The alignment marks MK1~MK4 are arranged around each exposure area W. Alignment marks MK1 and MK4 are formed on both sides of the width direction of the substrate FS in the exposure area W, and a plurality of them are formed along the longitudinal direction of the substrate FS at a certain interval DI. The alignment mark MK1 is formed on the -Y direction side of the width direction of the substrate FS, and the alignment mark MK4 is formed on the +Y direction side of the width direction of the substrate FS. The above-mentioned alignment marks MK1 to MK4 are arranged to be the same position in the longitudinal direction (X direction) of the substrate FS when the substrate FS is not deformed under a large tension or thermal process. Furthermore, the alignment marks MK2, MK3 are formed between the alignment mark MK1 and the alignment mark MK4 along the width direction (short-side direction) of the substrate FS, that is, the +X direction side and the -X direction of the exposure area W The left side of the white department. The alignment marks MK2, MK3 are formed between the exposure area W and the exposure area W. The alignment mark MK2 is formed on the -Y direction side of the width direction of the substrate FS, and the alignment mark MK3 is formed on the +Y direction side of the substrate FS.

Furthermore, the distance between the alignment mark MK1 and the alignment mark MK2 of the margin part arranged on the side end of the substrate FS in the -Y direction in the Y direction, the alignment mark MK2 and the alignment mark MK3 of the margin part in the Y direction The spacing and the spacing in the Y direction between the alignment mark MK4 arranged on the side end of the +Y direction of the substrate FS and the alignment mark MK3 of the margin portion are set to the same distance. These alignment marks MKm (MK1~MK4) can also be formed together when the pattern of the first layer is formed. For example, when exposing the pattern of the first layer, the pattern for the alignment mark may be exposed together around the exposure area W of the pattern exposure. In addition, the alignment mark MKm may also be formed in the exposure area W. For example, it may be formed along the outline of the exposure area W in the exposure area W. In addition, when the alignment mark MKm is formed in the exposure area W, a pattern portion or a portion of a specific form in the pattern of the electronic component formed in the exposure area W can also be used as the alignment mark MKm.

The alignment microscope AM1 is configured to photograph the alignment mark MK1 existing in the observation area (detection area) Vw1 of the objective lens. Similarly, the alignment microscopes AM2~AM4 are configured to capture the alignment marks MK2~MK4 existing in the observation area Vw2~Vw4 of the objective lens. Therefore, a plurality of alignment microscopes AM1~AM4, corresponding to the positions of the plurality of alignment marks MK1~MK4, are set in the order of the alignment microscopes AM1~AM4 from the -Y direction side of the substrate FS. The alignment microscope AMm (AM1~AM4) is set to the exposure position (drawing line SL1~SL6) and the observation area Vw (Vw1~Vw4) of the alignment microscope AMm in the X direction compared to the length of the exposure area W in the X direction short. The number of alignment microscopes AMm set in the Y direction can be changed according to the number of alignment marks MKm formed in the width direction of the substrate FS. Moreover, although the size of the observation area Vw1~Vw4 on the illuminated surface of the substrate FS is set according to the size of the alignment marks MK1~MK4 or the alignment accuracy (position measurement accuracy), it is about 100~500μm square. In addition, although there is no particular description in the first to third embodiments (including modifications), the substrate FS used in the first to third embodiments is also formed with a plurality of alignment marks MKm.

As shown in FIG. 24, at both ends of the rotating drum DR, there are provided scale portions SD (SDa, SDb) having scales formed in a ring shape in the circumferential direction of the outer peripheral surface of the rotating drum DR as a whole. The scale portion SD (SDa, SDb) is a diffraction grating in which concave or convex grid lines are engraved at a certain pitch (for example, 20 μm) in the circumferential direction of the outer peripheral surface of the rotating drum DR, and constitutes an incremental scale. This scale part SD (SDa, SDb) rotates around the central axis AXo integrally with the rotating drum DR. In addition, a plurality of encoders (scale reading heads) ENn are provided so as to face the scale portion SD (SDa, SDb). The encoder ENn optically detects the rotation position of the rotating drum DR. Three encoders ENn (EN1a, EN2a, EN3a) are provided opposite to the scale portion SDa provided at the end of the -Y direction of the rotating drum DR. Similarly, three encoders ENn (EN1b, EN2b, EN3b) are provided opposite to the scale portion SDb provided at the end on the +Y direction side of the rotating drum DR. In addition, although there is no special description in the first to third embodiments (including modifications), scale portions SD (SDa, SDb) are provided at both ends of the rotating drum DR in the first to third embodiments. There are multiple encoders ENn (EN1a~EN3a, EN1b~EN2b) in the opposite way.

The encoder ENn (EN1a~EN3a, EN1b~EN3b) projects the measuring beam toward the scale part SD (SDa, SDb), detects the reflected beam (diffracted light) photoelectrically, and outputs the pulse signal, the detection signal, to the control device 18. The control device 18 counts the detection signal (pulse signal) with the counter circuit 356a (refer to FIG. 33), thereby being able to measure the rotation angle position and angle change of the rotating drum DR with sub-micron resolution. The counter circuit 356a counts the detection signals of each encoder ENn (EN1a~EN3a, EN1b~EN3b) individually. The control device 18 can also measure the conveying speed of the substrate FS from the angle change of the rotating drum DR. The counter circuit 356a, which counts the detection signals of each encoder ENn (EN1a~EN3a, EN1b~EN3b) individually, is formed in the scale parts SDa, SDb by detecting each encoder ENn (EN1a~EN3a, EN1b~EN3b) After the origin mark (origin pattern) ZZ in a part of the circumferential direction, reset the count value corresponding to the encoder ENn to 0.

Encoders EN1a, EN1b are arranged on the set bearing line Lx1. The setting azimuth line Lx1 is the line connecting the projection position (reading position) of the measuring beam of the encoder EN1a, EN1b on the scale part SD (SDa, SDb) and the central axis AXo in the XZ plane. In addition, the setting azimuth line Lx1 is a line connecting the observation area Vw (Vw1~Vw4) of each alignment microscope AMm (AM1~AM4) and the central axis AXo on the XZ plane.

Encoders EN2a, EN2b are arranged on the upstream side (-X direction side) of the substrate FS in the conveying direction with respect to the center plane Poc, and are arranged on the downstream side (+X direction side) of the substrate FS in the conveying direction than the encoders EN1a, EN1b . Encoders EN2a, EN2b are arranged on the set bearing line Lx2. The setting azimuth line Lx2 is the line connecting the projection position of the encoder EN2a, EN2b on the scale part SD (SDa, SDb) and the central axis AXo in the XZ plane. This setting azimuth line Lx2, in the XZ plane, overlaps with the irradiation center axis Le1, Le3, Le5 at the same angular position.

The encoders EN3a and EN3b are provided on the downstream side (+X direction side) in the conveying direction of the substrate FS with respect to the center plane Poc. Encoders EN3a, EN3b are arranged on the set bearing line Lx3. The setting azimuth line Lx3 is the line connecting the projection position of the encoder EN3a, EN3b on the scale part SD (SDa, SDb) and the central axis AXo in the XZ plane. This setting azimuth line Lx3, in the XZ plane, overlaps with the irradiation center axis Le2, Le4, Le6 at the same angular position.

The count value of the detection signal from the encoder EN1a, EN1b (rotation angle position), the count value of the detection signal from the encoder EN2a, EN2b (rotation angle position), and the count value of the detection signal from the encoder EN3a, EN3b (Rotation angle position), reset to 0 at the moment when each encoder ENn detects the origin mark ZZ attached to one of the rotation directions of the rotating drum DR. Therefore, assuming that the count value based on the encoder EN1a and EN1b is the first value (for example, 100), the position of the substrate FS wound on the rotating drum DR on the setting azimuth line Lx1 (aligned with the microscope AM1~AM4) When the position of each observation area Vw1~Vw4 is the first position, the first position on the substrate FS is transferred to the position on the set azimuth line Lx2 (the position of the drawing line SL1, SL3, SL5), and then the encoder EN2a, The count value based on EN2b becomes the first value (for example, 100). Similarly, after the first position on the substrate FS is transferred to the position on the set azimuth line Lx3 (the position of the drawing line SL2, SL4, SL6), the count value of the detection signal based on the encoder EN3a, EN3b becomes the first value (For example, 100).

However, the substrate FS is wound on the inner side of the scale portions SDa and SDb at the two ends of the rotating drum DR. In FIG. 23, the radius of the central axis AXo from the outer peripheral surface of the scale portion SD (SDa, SDb) is set to be smaller than the radius of the central axis AXo from the outer peripheral surface of the rotating cylinder DR. However, as shown in FIG. 24, the outer peripheral surface of the scale portion SD (SDa, SDb) may be set to be the same surface as the outer peripheral surface of the substrate FS wound around the rotating drum DR. That is, it can also be set to the radius (distance) from the central axis AXo of the outer peripheral surface of the scale part SD (SDa, SDb) and the central axis from the outer peripheral surface (irradiated surface) of the substrate FS wound around the rotating drum DR The radius (distance) of AXo becomes the same. Thereby, the encoder ENn (EN1a, EN1b, EN2a, EN2b, EN3a, EN3b) can detect the scale portion SD (SDa, SDb) at the same radial direction as the irradiated surface of the substrate FS wound on the rotating drum DR, It can reduce the Abbe error caused by the difference between the measurement position of the encoder ENn and the processing position (drawing line SL1~SL6) in the radial direction of the rotating drum DR.

According to the above description, according to the position of the alignment mark MKm (MK1~MK4) detected by the alignment microscope AMm (AM1~AM4) (encoder EN1a, EN1b technical values), the length of the substrate FS is determined by the control device 18 The side direction (X direction) is at the start position of the drawing exposure of the exposure area W. At this time, the count value based on the encoders EN1a and EN1b is set to the first value (for example, 100). In this case, after the count value based on the encoder EN2a, EN2b becomes the first value (for example, 100), the long side direction of the substrate FS is located on the drawing line SL1, SL3, SL5 at the start position of the drawing exposure in the exposure area W . Therefore, the scanning unit U1, U3, U5 can start the scanning of the spot light SP according to the count value of the encoder EN2a, EN2b. Furthermore, after the count value based on the encoders EN3a and EN3b becomes the first value (for example, 100), the longitudinal direction of the substrate FS is located on the drawing lines SL2, SL4, and SL6 at the start position of the drawing exposure in the exposure area W. Therefore, the scanning unit U2, U4, U6 can start the scanning of the spot light SP according to the count value of the encoder EN3a, EN3b. In addition, although there is no special description in the first to third embodiments (including modifications), the exposure apparatus EX of the first to third embodiments described above also includes encoders ENn (EN1a to EN3a, EN1b to EN3b) and a scale unit SD (SDa, SDb).

FIG. 26 is a configuration diagram of the light beam switching member 20. The beam switching member 20 has a plurality of selection optical elements AOMn (AOM1~AOM6), a plurality of condenser lenses CD1~CD6, a plurality of reflecting mirrors M1~M12, a plurality of unit side incident mirrors IM1~IM6, and a plurality of collimating lenses CL1~CL6, and absorber TR. The optical element AOMn (AOM1~AOM6) is selected to be transmissive to the beam LB, and is an acousto-optic modulator (AOM: Acousto-Optic Modulator) driven by ultrasonic signals. These optical components (optical elements AOM1~AOM6, condenser lens CD1~CD6, mirror M1~M12, unit side incident mirror IM1~IM6, collimator lens CL1~CL6, and absorber TR) are plate-shaped. The support member IUB supports. This supporting member IUB supports these optical members from below (-Z direction side) above the plurality of scanning units Un (U1 to U6). Therefore, the supporting member IUB also has the function of insulating the optical element AOMn (AOM1~AOM6) used as the heat source for selection and the plurality of scanning units Un (U1~U6).

The light path of the light beam LB is bent into a zigzag shape from the light source device 14' by the mirrors M1~M12, and is guided to the absorber TR. Hereinafter, the case where the optical elements AOMn (AOM1~AOM6) for selection are all in the OFF state (the state where the ultrasonic signal is not applied) will be described in detail. The light beam LB (parallel light beam) from the light source device 14' travels in the +Y direction parallel to the Y axis, and then enters the mirror M1 through the condenser lens CD1. The light beam LB reflected by the mirror M1 in the -X direction linearly transmits through the first selective optical element AOM1 arranged at the focal position (beam waist position) of the condenser lens CD1, and becomes again by the collimator CL1 The parallel beam reaches the mirror M2. The light beam LB reflected by the mirror M2 to the +Y direction side passes through the condenser lens CD2 and then is reflected by the mirror M3 to the +X direction side.

The light beam LB reflected by the mirror M3 linearly transmits through the second selective optical element AOM2 arranged at the focal position (beam waist position) of the condenser lens CD2, and becomes a parallel beam again by the collimator CL2, and reaches the reflection Mirror M4. The light beam LB reflected by the mirror M4 to the +Y direction side passes through the condenser lens CD3 and then is reflected by the mirror M5 to the -X direction side. The light beam LB reflected by the mirror M5 in the -X direction linearly transmits through the third selective optical element AOM3 arranged at the focal position (beam waist position) of the condenser lens CD3, and becomes again by the collimator CL3 The parallel beam reaches the mirror M6. The light beam LB reflected by the mirror M6 toward the +Y direction side passes through the condenser lens CD4 and is reflected by the mirror M7 toward the +X direction side.

The light beam LB reflected by the mirror M7 linearly transmits through the fourth selective optical element AOM4 arranged at the focal position (beam waist position) of the condenser lens CD4, and becomes a parallel beam again by the collimator CL4, and reaches the reflection Mirror M8. The light beam LB reflected by the mirror M8 to the +Y direction side passes through the condenser lens CD5 and then is reflected by the mirror M9 to the -X direction side. The light beam LB reflected by the mirror M9 in the -X direction linearly transmits through the fifth selective optical element AOM5 arranged at the focal position (beam waist position) of the condenser lens CD5, and becomes again by the collimator CL5 The parallel beam reaches the mirror M10. The light beam LB reflected toward the +Y direction by the mirror M10 passes through the condenser lens CD6 and is reflected toward the +X direction by the mirror M11. The beam LB reflected by the mirror M11 linearly transmits through the sixth selective optical element AOM6 arranged at the focal position (beam waist position) of the condenser lens CD6, and becomes a parallel beam again by the collimator CL6 and is reflected The mirror M12 reflects to the -Y direction side and reaches the absorber TR. The absorber TR is a light absorber for preventing the light beam LB from leaking to the outside and absorbing the light beam LB.

As mentioned above, the selection optical elements AOM1~AOM6 are arranged in such a way that the light beam LB from the light source device 14' is transmitted sequentially, and is configured to be used in each selection by the condenser lenses CD1~CD6 and the collimator lenses CL1~CL6 Optical elements AOM1~AOM6 form the beam waist width of beam LB. As a result, the diameter of the light beam LB incident on the optical elements AOM1 to AOM6 (acousto-optic modulation element) for selection is reduced, the diffraction efficiency is improved, and the response is improved.

For each optional optical element AOMn (AOM1~AOM6), if an ultrasonic signal (high frequency signal) is applied, the incident light beam LB (0-order light) will be diffracted once at the diffraction angle corresponding to the high-frequency frequency The diffracted light is generated as an outgoing beam (light beam LBn). In the fourth embodiment, it is assumed that the light beam LBn emitted from each of the plurality of selection optical elements AOMn (AOM1~AOM6) as primary diffracted light is the light beam LB1~LB6, and each selection optical element AOMn (AOM1~AOM6) has The function of deflecting the optical path of the light beam LB from the light source device 14'. However, as mentioned above, in the actual acousto-optic modulating element, the generation efficiency of the first-order diffracted light is about 80% of the zero-order light. Therefore, the optical element AOMn (AOM1~AOM6) is selected to use the beams LB1~LB6 in each direction. The intensity is lower than the original beam LB. In addition, when any of the optical elements AOMn (AOM1 to AOM6) for selection is in the ON state, the zero-order light that is not diffracted and goes straight may remain about 20%, but is finally absorbed by the absorber TR.

In addition, the optical element AOMn for selection is a diffraction grating that produces periodic coarse changes in refractive index in a predetermined direction in the transmission member by ultrasonic waves. Therefore, when the incident light beam LB is linearly polarized light (P polarized light or S polarized light), The polarization direction and the periodic direction of the diffraction grating are set so that the generation efficiency (diffraction efficiency) of primary diffracted light becomes the highest. As shown in Figure 26, the selective optical element AOMn is set to deflect the incident light beam LB in the Z direction. The periodic direction of the diffraction grating generated in the selective optical element AOMn is also the Z direction, so it matches with it The method sets (adjusts) the polarization direction of the light beam LB from the light source device 14'.

Furthermore, as shown in Fig. 26, each of the plural selection optical elements AOMn (AOM1~AOM6) is set so that the deflected light beams LB1~LB6 (primary diffracted light) are in the -Z direction relative to the incident light beam LB Biased. The beams LB1~LB6 emitted from each deflection direction of the selective optical element AOMn (AOM1~AOM6) are projected to the unit side incident mirror IM1~ which is set at a position separated by a predetermined distance from each of the selective optical element AOMn (AOM1~AOM6) IM6, therefore, reflects so that it is parallel (coaxial) with the irradiation center axis Le1~Le6 in the -Z direction. The light beams LB1 to LB6 reflected by the unit-side incident mirrors IM1 to IM6 (hereinafter referred to as mirrors IM1 to IM6) pass through each of the openings TH1 to TH6 formed in the support member IUB to illuminate along the central axis Le1 to Le6 It is injected into each of the scanning unit Un (U1~U6).

It is also possible to use those with the same configuration, function, and function of each optional optical element AOMn (AOM1~AOM6). The plurality of optical elements AOMn (AOM1~AOM6) for selection turn ON/OFF the generation of the diffracted light that diffracts the incident light beam LB according to the ON/OFF of the driving signal (high frequency signal) from the control device 18. For example, when the optical element AOM1 for selection is in the OFF state without applying the drive signal (high-frequency signal) from the control device 18, the incident light beam LB is not diffracted but transmitted. Therefore, the light beam LB transmitted through the selection optical element AOM1 transmits through the collimator CL1 and then enters the mirror M2. On the other hand, when the optical element AOM1 for selection is in an ON state by applying a drive signal from the control device 18, the incident light beam LB is diffracted and directed toward the mirror IM1. That is, the optical element AOM1 for selection is switched by this driving signal. The mirror IM1 reflects the light beam LB1 diffracted by the optical element AOM1 for selection to the side of the scanning unit U1. The light beam LB1 reflected by the mirror IM1 enters the scanning unit U1 along the irradiation center axis Le1 through the opening TH1 of the support member IUB. Therefore, the reflecting mirror IM1 reflects the incident light beam LB1 so that the optical axis of the reflected light beam LB1 and the irradiation center axis Le1 are coaxial. In addition, when the selection optical element AOM1 is in the ON state, the zero-order light (intensity of about 20% of the incident beam) of the light beam LB linearly transmitted through the selection optical element AOM1 passes through the subsequent collimator CL1~ CL6, condenser lens CD2~CD6, mirror M2~M12, and optional optical elements AOM2~AOM6.

FIG. 27A is a diagram of the optical path switching of the light beam LB by the selection optical element AOM1 viewed from the +Z direction side, and FIG. 27B is a diagram of the optical path switching of the light beam LB performed by the selection optical element AOM1 viewed from the -Y direction side. When the driving signal is OFF, the optical element AOM1 for selection does not diffract the incident light beam LB but directly transmits it toward the mirror M2 side. On the other hand, when the drive signal is in the ON state, the selective optical element AOM1 generates the light beam LB1 that diffracts the incident light beam LB toward the -Z direction side, and directs it toward the mirror IM1. Therefore, in the XY plane, the traveling direction of the light beam LB (0-order light) and the deflected light beam LB1 (first-order diffracted light) emitted from the selection optical element AOM1 are not changed. In the Z direction, the light beam LB1 (1 time) The direction of travel of the diffracted light. As mentioned above, the control device 18 switches the optical element AOM1 for selection by turning the drive signal (high-frequency signal) to be applied to the optical element AOM1 for selection ON/OFF (high/low), and switches whether the light beam LB is directed toward the subsequent selection The optical element AOM2 and whether the deflected light beam LB1 faces the scanning unit U1.

Similarly, the optical element AOM2 for selection does not cause the incident light beam LB (it is not diffracted by the optical element AOM1 for selection but is transmitted through when the drive signal (high frequency signal) from the control device 18 is OFF. The light beam LB) is diffracted and transmitted to the collimator CL2 side (mirror M4 side), and when the driving signal from the control device 18 is in the ON state, the diffracted light of the incident light beam LB, that is, the light beam LB2 is directed toward the mirror IM2 . This mirror IM2 reflects the light beam LB2 diffracted by the optical element AOM2 for selection to the side of the scanning unit U2. The light beam LB2 reflected by the mirror IM2 passes through the opening TH2 of the support member IUB and becomes coaxial with the irradiation center axis Le2, and enters the scanning unit U2. Furthermore, the optical elements AOM3~AOM6 for selection, when the drive signal (high frequency signal) from the control device 18 is in the OFF state, the incident light beam LB is not diffracted and transmitted to the collimator lens CL3~CL6 side ( The mirrors M6, M8, M10, and M12 sides), when the driving signal from the control device 18 is in the ON state, the primary diffracted light of the incident light beam LB, that is, the light beams LB3~LB6, is directed towards the mirrors IM3~IM6. The mirrors IM3~IM6 reflect the light beams LB3~LB6 diffracted by the selective optical elements AOM3~AOM6 to the side of the scanning unit U3~U6. The light beams LB3 to LB6 reflected by the mirrors IM3 to IM6 pass through the openings TH3 to TH6 of the support member IUB and become coaxial with the irradiation center axis Le3Le6 and enter the scanning units U3 to U6. As described above, the control device 18 switches any one of the selection optical elements AOM2 to AOM6 by turning on/off (high/low) the drive signal (high frequency signal) to be applied to each of the selection optical elements AOM2~AOM6 , Switch whether the light beam LB is directed toward the subsequent selection optical element AOM3~AOM6 or the absorber TR, and whether one of the deflected light beams LB2~LB6 is directed toward the corresponding scanning unit U2~U6.

As described above, the light beam switching member 20 is provided with a plurality of selection optical elements AOMn (AOM1~AOM6) arranged in series along the traveling direction of the light beam LB from the light source device 14', whereby the optical path of the light beam LB can be switched to select one light beam LBn Scan unit Un of injection. For example, when the light beam LB1 is to be incident on the scanning unit U1, the selection optical element AOM1 is turned on, and when the light beam LB3 is to be incident on the scanning unit U3, the selection optical element AOM3 may be turned on. The plurality of optical elements AOMn (AOM1~AOM6) for selection are set corresponding to the plurality of scanning units Un (U1~U6), and switch whether to make the light beam LBn enter the corresponding scanning unit Un.

A plurality of scanning units Un (U1~U6) repeatedly perform the scanning action of the spot light SP in a predetermined order, so the beam switching member 20 also corresponds to this, switching the scanning units U1~U6 into which any one of the light beams LB1~LB6 enters. For example, the order of the scanning unit Un for scanning the spot light SP is U1→U2→...→U6, and the beam switching member 20 also corresponds to this, switching the scanning of the beam LBn in the order of U1→U2→...→U6 Unit Un.

According to the above description, the optical elements AOMn (AOM1~AOM6) for selection of the beam switching member 20 are ON as long as they are in the ON state during one scan of the point light SP performed by each polygon mirror PM of the scanning unit Un (U1~U6) can. The details will be described later, but if the number of reflection surfaces of the polygon mirror PM is Np and the rotation speed of the polygon mirror PM is Vp (rpm), then the time Tss corresponding to the rotation angle of one of the reflection surfaces RP of the polygon mirror PM becomes Tss= 60/(Np・Vp) second. For example, when the number of reflecting surfaces is 8 and the rotation speed Vp is 30,000, one of the polygon mirrors PM rotates for 2 milliseconds, and the time Tss becomes 0.25 milliseconds. If it is converted into a frequency, it is 4kHz, which means that compared to the acousto-optic modulating element that modulates the light beam LB response profile data with a high speed of tens of MHz, it is a very low response frequency. Change the components. Therefore, the light beams LB1~LB6 (first-order diffracted light) that can be deflected with respect to the incident light beam LB (0-order light) have a larger diffraction angle, which will pass through one of the selective optical elements AOM1~AOM6 relative to a straight line. The arrangement of mirrors IM1~IM6 (Figure 26, Figure 27A, Figure 27B) that separates the beams LB1~LB6 in the direction of the beam LB is easier.

In addition, a plurality of scanning units U1 to U6 repeatedly perform the scanning of the spot light SP in a predetermined order, so correspondingly, the sequence data DLn of the pattern data of each scanning unit Un is output to the driving circuit of the light source device 14' in a predetermined order 206a. The sequence data DLn sequentially output to the driving circuit 206a is called the drawing bit row data Sdw. For example, in the case where the predetermined sequence is U1→U2→...→U6, firstly, one row of serial data DL1 is output to the driving circuit 206a, and then one row of serial data DL2 is output to the driving circuit 206a, in this way, a drawing bit is formed The row data Sdw and the row sequence data DL1 to DL6 are sequentially output to the driving circuit 206a. After that, the sequence data DL1 to DL6 in the next row are sequentially output to the driving circuit 206a as the drawing bit row data Sdw. The specific structure of the driving circuit 206a outputting the drawing bit string data Sdw will be described in detail later.

The configuration of the scanning unit Un (U1 to U6) can be used in the first to third embodiments described above, but in the fourth embodiment, the scanning unit Un of the configuration shown in FIG. 28 is used. In addition, the scanning unit Un described below can also be used as the scanning unit of the first to third embodiments described above.

Hereinafter, the optical configuration of the scanning unit Un (U1 to U6) used in the fourth embodiment will be described with reference to FIG. 28. In addition, each scanning unit Un (U1 to U6) has the same configuration, so only the scanning unit U1 is described, and the description of the other scanning units Un is omitted. 28, it is assumed that the direction parallel to the irradiation center axis Len (Le1) is the Zt direction, and the direction of the substrate FS on the plane orthogonal to the Zt direction from the sequencer PR1 to the sequencer PR2 via the exposure device EX is Xt The direction is the Yt direction on the plane orthogonal to the Zt direction and orthogonal to Xt. That is, the three-dimensional coordinates of Xt, Yt, and Zt in Fig. 28 are rotated into the three-dimensional coordinates of X, Y, and Z in Fig. 23 into the Z-axis direction, centered on the Y-axis and the irradiation central axis Len (Le1) is parallel to the three-dimensional coordinate.

As shown in Figure 28, in the scanning unit U1, along the direction of travel of the beam LB1 from the incident position of the beam LB1 to the illuminated surface of the substrate FS, a mirror M20, a beam amplifier BE, a mirror M21, and a polarization splitter are provided BS, mirror M22, image shifting optical component SR, field stop FA, mirror M23, λ/4 wave plate QW, cylindrical lens CYa, mirror M24, polygon mirror PM, fθ lens FT, mirror M25 , Cylindrical lens CYb. Furthermore, the scanning unit U1 is provided with an optical lens G10 and a photodetector DT1 for detecting the reflected light from the illuminated surface of the substrate FS through the polarization beam splitter BS.

The light beam LB1 incident on the scanning unit U1 travels in the -Zt direction, and incident on the mirror M20 inclined 45° with respect to the XtYt plane. The axis of the light beam LB1 entering the scanning unit U1 enters the mirror M20 so as to be coaxial with the irradiation center axis Le1. The mirror M20 functions as an incident optical member that causes the light beam LB1 to enter the scanning unit U1, and reflects the incident light beam LB1 in the -Xt direction toward the mirror M21 along an optical axis set parallel to the Xt axis. Therefore, the optical axis of the light beam LB1 traveling parallel to the Xt axis is orthogonal to the irradiation center axis Le1 in a plane parallel to the XtZt plane. The light beam LB1 reflected by the mirror M20 passes through the beam amplifier BE arranged along the optical axis of the light beam LB1 traveling parallel to the Xt axis, and enters the mirror M21. The beam amplifier BE amplifies the diameter of the transmitted beam LB1. The beam amplifier BE has a condensing lens Be1 and a collimator Be2 that makes the scattered light beam LB1 converged by the condensing lens Be1 become parallel light.

The mirror M21 is arranged at an angle of 45° with respect to the YtZt plane, so that the incident light beam LB1 is reflected toward the polarizing beam splitter BS in the -Yt direction. The polarization separation surface of the polarization beam splitter BS is arranged at an angle of 45° with respect to the YtZt plane to reflect the P-polarized light beam, and transmit the linearly polarized light (S-polarized light) polarized in the direction orthogonal to the P polarization. Since the light beam LB1 incident on the scanning unit U1 is a P-polarized light beam, the polarizing beam splitter BS reflects the light beam LB1 from the mirror M21 in the -X direction and guides it to the mirror M22 side.

The mirror M22 is arranged at an angle of 45° with respect to the XtYt plane, so that the incident light beam LB1 is reflected in the -Zt direction toward the mirror M23 separated from the mirror M22 in the -Zt direction. The light beam LB1 reflected by the mirror M22 enters the mirror M23 through the image shifting optical member SR and the field stop (field stop) FA along the optical axis parallel to the Zt axis. The image-shifting optical member SR two-dimensionally adjusts the center position in the cross section of the light beam LB1 in a plane (XtYt plane) orthogonal to the traveling direction of the light beam LB1. The moving optical member SR is composed of two quartz parallel plates Sr1, Sr2 arranged along the optical axis of the beam LB1 traveling parallel to the Zt axis. The parallel plate Sr1 can be tilted around the Xt axis, and the parallel plate Sr2 can be around Yt. The axis is tilted. The parallel flat plates Sr1 and Sr2 are respectively inclined around the Xt axis and the Yt axis, whereby the position of the center of the light beam LB1 is slightly offset in two dimensions on the XtYt plane orthogonal to the traveling direction of the light beam LB1. The parallel plates Sr1 and Sr2 are driven by an actuator (driving part) not shown under the control of the control device 18.

The light beam LB1 passing through the image shifting optical member SR passes through the circular opening of the field stop FA to reach the mirror M23. The circular opening of the field stop FA shields the peripheral part of the intensity distribution in the cross-section of the beam LB1 amplified by the beam amplifier BE. If the diameter of the circular opening of the field diaphragm FA is an adjustable iris diaphragm, the intensity (brightness) of the spot light SP can be adjusted.

The mirror M23 is arranged at an angle of 45° with respect to the XtYt plane, so that the incident light beam LB1 is reflected in the +Zt direction toward the mirror M24 separated from the mirror M23 in the +Zt direction. The light beam LB1 reflected by the mirror M23 transmits through the λ/4 wavelength plate QW and the cylindrical lens CYa and enters the mirror M24. The mirror M24 reflects the incident light beam LB1 toward the polygon mirror (rotating polygon mirror, deflecting member for scanning) PM. The polygon mirror PM reflects the incident light beam LB1 toward the fθ lens FT having an optical axis AXf parallel to the Xt axis in the +Xt direction. The polygon mirror PM deflects (reflects) the incident light beam LB1 in a plane parallel to the XtYt plane in order to scan the spot light SP of the light beam LB1 on the illuminated surface of the substrate FS. Specifically, the polygon mirror PM has a rotation axis AXp extending in the Zt axis direction and a plurality of reflection surfaces RP (eight reflection surfaces RP in the fourth embodiment) formed around the rotation axis AXp. By rotating the polygon mirror PM in a predetermined rotation direction centered on the rotation axis AXp, the incident angle of the pulse-shaped light beam LB1 irradiated to the reflection surface RP can be continuously changed. Thereby, the reflection direction of the light beam LB1 is deflected by a reflective surface RP, and the spot light SP of the light beam LB1 irradiated on the illuminated surface of the substrate FS can be scanned along the scanning direction (the width direction of the substrate FS, the Yt direction) .

The spot light SP of the light beam LB1 can be scanned along the drawing line SL1 by a reflecting surface RP. Therefore, with one rotation of the polygon mirror PM, the maximum number of drawing lines scanned by the spot light SP on the illuminated surface of the substrate FS is the same as the number of the reflecting surface RP, which becomes eight. The polygon mirror PM is rotated at a constant speed by a polygon mirror drive part RM including a motor and the like. The rotation of the polygon mirror PM by the polygon mirror drive unit RM is controlled by the control device 18. As mentioned above, the effective length of the drawing line SL1 (for example, 30mm) is set to a length below the maximum scanning length (for example, 31mm) that can be scanned by the polygon mirror PM for the spot light SP. In the initial setting (design), The center point of the drawing line SL1 (the irradiation center axis Le1 passes through) is set at the center of the maximum scan length.

In addition, as an example, assuming that the effective length of the drawing line SL1 is 30mm, the spot light SP with the effective size ø of 3μm is overlapped by 1.5μm one by one, while the spot light SP is irradiated to the illuminated surface of the substrate FS along the drawing line SL1 At the time of up, the number of spot lights SP (the number of pulses of the light beam LB from the light source device 14') illuminated by one scan becomes 20000 (30mm/1.5μm). In addition, if the scanning time of the spot light SP along the drawing line SL1 is 200μsec, the pulse-shaped spot light SP must be irradiated 20000 times during this period. Therefore, the emission frequency Fs of the light source device 14' becomes Fs≧20000 times/200μsec =100MHz.

The cylindrical lens CYa converges the incident light beam LB1 into a slit shape on the reflecting surface RP of the polygon mirror PM in the non-scanning direction (Z direction) orthogonal to the scanning direction (rotation direction) of the polygon mirror PM. With the cylindrical lens CYa whose generatrix is parallel to the Yt direction, even if the reflecting surface RP is inclined with respect to the Zt direction (the inclination of the reflecting surface RP with respect to the normal of the XtYt plane), its influence can be suppressed and the irradiation can be suppressed The irradiation position of the light beam LB1 on the irradiated surface of the substrate FS is staggered in the Xt direction.

The fθ lens FT with the optical axis AXf extending in the Xt axis direction projects the light beam LB1 reflected by the polygon mirror PM to the telecentric scanning lens of the mirror 25 in the XtYt plane parallel to the optical axis AXf. The incident angle θ of the light beam LB1 to the fθ lens FT changes according to the rotation angle (θ/2) of the polygon mirror PM. The fθ lens FT transmits the mirror M25 and the cylindrical lens CYb to project the light beam LB1 to the image height position on the illuminated surface of the substrate FS which is proportional to the incident angle θ. Suppose the focal distance is fo and the image height position is y, the fθ lens FT is designed to satisfy the relationship of y=fo·θ. Therefore, the light beam LB1 (spot light SP) can be scanned accurately and uniformly in the Yt direction (Y direction) by the fθ lens FT. When the incident angle θ to the fθ lens FT is 0 degrees, the light beam LB1 entering the fθ lens FT travels along the optical axis AXf.

The mirror M25 reflects the incident light beam LB1 through the cylindrical lens CYb toward the substrate FS in the -Zt direction. By the fθ lens FT and the cylindrical lens CYb whose generatrix is parallel to the Yt direction, the light beam LB1 transmitted to the substrate FS converges on the illuminated surface of the substrate FS into a tiny spot light SP with a diameter of several μm (for example, 3 μm). In addition, the point light SP transmitted to the illuminated surface of the substrate FS is scanned one-dimensionally by the drawing line SL1 extending in the Yt direction by the polygon mirror PM. In addition, the optical axis AXf of the fθ lens FT and the irradiation center axis Le1 are located on the same plane, which is parallel to the XtZt plane. Therefore, the light beam LB1 traveling on the optical axis AXf is reflected in the -Zt direction by the mirror M25, becomes coaxial with the irradiation center axis Le1, and is projected to the substrate FS. In the fourth embodiment, at least the fθ lens FT has a function of a projection optical system that projects the light beam LB1 deflected by the polygon mirror PM onto the illuminated surface of the substrate FS. In addition, at least the reflective members (mirrors M21 to M25) and the polarization beam splitter BS have an optical path deflection member that bends the optical path of the light beam LB1 from the reflector M20 to the substrate FS. With this optical path deflection member, the incident axis of the light beam LB1 entering the mirror M20 and the irradiation center axis Le1 can be substantially coaxial. In the XtZt plane, the light beam LB1 in the scanning unit U1 passes through a substantially U-shaped or U-shaped optical path, and then travels in the -Zt direction and is projected onto the substrate FS.

As described above, when the substrate FS is transported in the X direction, the spot light SP of the light beam LBn is scanned one-dimensionally in the scanning direction (Y direction) by each scanning unit Un (U1~U6), thereby enabling the spot light The SP scans relatively two-dimensionally on the illuminated surface of the substrate FS. Therefore, the exposure predetermined pattern can be drawn on the exposure area W of the substrate FS.

The photodetector DT1 has a photoelectric conversion element for photoelectric conversion of incident light. A predetermined reference pattern is formed on the surface of the rotating drum DR. The part on the rotating drum DR formed with this reference pattern is made of materials with low reflectivity (10~50%) to the wavelength range of the light beam LB1, and the other parts on the rotating drum DR without forming the reference pattern are made of reflectivity It is composed of materials below 10% or materials that absorb light. Therefore, when the substrate FS is not wound (or through the transparent part of the substrate FS), the spot light SP of the beam LB1 is irradiated from the scanning unit U1 to the area where the reference pattern of the rotating drum DR is formed, and the reflected light Through cylindrical lens CYb, mirror M25, fθ lens FT, polygon mirror PM, mirror M24, cylindrical lens CYa, λ/4 wavelength plate QW, mirror M23, field stop FA, image shifting optical member SR, And the mirror M22 is incident on the polarizing beam splitter BS. Here, between the polarization beam splitter BS and the substrate FS, specifically, a λ/4 wavelength plate QW is provided between the mirror M23 and the cylindrical lens CYa. Thereby, the light beam LB1 irradiated to the substrate FS is converted from P-polarized light to circularly polarized light by the λ/4 wavelength plate QW, and the reflected light from the substrate FS into the polarization beam splitter BS is transmitted from the λ/4 wavelength plate QW Circular polarization is converted to S polarization. Therefore, the reflected light from the substrate FS transmits through the polarization beam splitter BS, and enters the photodetector DT1 through the optical lens system G10.

At this time, in a state where the pulse-shaped light beam LB1 (preferably, the light beam LB1 from the seed light S1) continuously enters the scanning unit U1, by rotating the rotating drum DR, the scanning unit U1 scans the spot light SP. The light SP is two-dimensionally irradiated to the outer peripheral surface of the rotating drum DR. Therefore, the image of the reference pattern formed on the rotating drum DR can be obtained by the photodetector DT1. Specifically, the intensity change of the photoelectric signal output from the photodetector DT1 responds to the clock pulse signal (generated in the light source device 14') for the pulse emission of the spot light SP, and digital sampling is performed for each scanning time to obtain It is one-dimensional image data in the Yt direction. Furthermore, it responds to the measurement value of the encoder ENn measuring the rotation angle position of the rotating drum DR, at a certain distance in the sub-scanning direction (for example, the size of the spot light SP is 1/2 of ø) , Arrange the one-dimensional image data in the Yt direction in the Xt direction to obtain the two-dimensional image information of the surface of the rotating drum DR. The control device 18 measures the tilt of the drawing line SL1 of the scanning unit U1 based on the obtained two-dimensional image information of the reference pattern of the rotating drum DR. The inclination of the drawing line SL1 may be the relative inclination between the scanning units Un (U1~U6), or the inclination (absolute inclination) with respect to the central axis AXo of the rotating drum DR. In addition, of course, the inclination of each drawing line SL2 to SL6 can also be measured in the same manner.

Around the polygon mirror PM of the scanning unit U1, as shown in FIG. 29, an origin sensor (origin detector) OP1 is provided. The origin sensor OP1 outputs a pulse-shaped origin signal SZ indicating the start of scanning of the spot light SP of each reflecting surface RP. The origin sensor OP1 outputs the origin signal SZ after the rotation position of the polygon mirror PM reaches the predetermined position just before the scanning of the spot light SP of the reflecting surface RP starts. The polygon mirror PM can deflect the light beam LB1 projected to the substrate FS in the scanning angle range θs. Therefore, if the reflection direction (deflection direction) of the light beam LB1 reflected by the polygon mirror PM falls within the scanning angle range θs, the reflected light beam LB1 Enter the fθ lens FT. Therefore, the origin sensor OP1 outputs the origin signal SZ after the reflection direction of the light beam LB1 reflected by the reflecting surface RP enters the predetermined position within the scanning angle range θs at the rotation position of the polygon mirror PM. In addition, the scanning angle range θs and the maximum scanning rotation angle range α shown in FIG. 7 have a relationship of θs=2×α.

Since the polygon mirror PM has eight reflecting surfaces RP, the origin sensor OP1 outputs the origin signal SZ eight times during one rotation of the polygon mirror PM. The origin signal SZ detected by the origin sensor OP1 is sent to the control device 18. After the origin sensor OP1 outputs the origin signal SZ, the spot light SP starts to scan along the drawing line SL1.

The origin sensor OP1 uses the reflective surface RP adjacent to the reflective surface RP that is then scanned for the spot light SP (deflection of the beam LB1) (in the fourth embodiment, the reflective surface RP is one before the rotation direction of the polygon mirror PM) The origin signal SZ is output. In order to distinguish the reflecting surfaces RP, for convenience, in Figure 29, RPa represents the reflecting surface RP that is currently deflecting the light beam LB1, and the other reflecting surfaces RP are rotated in a counterclockwise direction (around the direction opposite to the direction of rotation of the polygon mirror PM) Expressed in RPb~RPh.

The origin sensor OP1 has a light beam delivery system Opa, which has a light source unit 312 that emits a laser beam Bga of a non-photosensitive wavelength range such as a semiconductor laser, and the laser beam from the light source unit 312 Bga is reflected and projected to the projection mirrors 314, 316 of the reflecting surface RPb of the polygon mirror PM. In addition, the origin sensor OP1 has a light beam receiving system Opb. The light beam receiving system Opb includes a light receiving section 318, and the reflected light of the laser beam Bga (reflected beam Bgb) reflected by the reflecting surface RPb is guided to the light receiving section 318 for reflection Mirrors 320, 322, and a lens system 324 that condenses the reflected light beam Bgb reflected by the mirror 322 into tiny spot light. The light receiving unit 318 has a photoelectric conversion element that converts the spot light of the reflected light beam Bgb condensed by the lens system 324 into an electrical signal. Here, the position where the laser beam Bga is projected onto each reflection surface RP of the polygon mirror PM is set to be the pupil surface (focus position) of the lens 324.

The light beam delivery system Opa and the light beam receiving system Opb are set at a predetermined position just before the scanning of the point light SP of the reflecting surface RP at the rotating position of the polygon mirror PM, the light beam receiving system Opb can accept the light beam delivery system Opb The position of the reflected beam Bgb of the emitted laser beam Bga. That is, the light beam delivery system Opa and the light beam receiving system Opb are set at a position that can accept the reflected light beam Bgb of the laser beam Bga emitted by the light delivery system Opa when the angle of the reflective surface RP is a predetermined angle. In addition, the symbol Msf in FIG. 29 is the shaft of the rotation motor of the polygon mirror drive part RM (refer to FIG. 28) arranged coaxially with the rotation axis AXp.

Just before the light-receiving surface of the photoelectric conversion element in the light-receiving portion 318, a light-shielding body (not shown) is provided with a small and wide slit opening. While the angular position of the reflective surface RPb is within the predetermined angular range, the reflected light beam Bgb enters the lens system 324, and the spot light of the reflected light beam Bgb scans in a certain direction on the light-shielding body in the light receiving portion 318. In this scanning, the spot light of the reflected light beam Bgb transmitted through the slit opening of the light shield is received by the photoelectric conversion element of the light receiving portion 318, and the received light signal is amplified by the amplifier and output as a pulse-like origin signal SZ.

The origin sensor OP1, as described above, detects the origin signal SZ by deflecting the light beam LB1 (to scan the spot light SP) on the reflecting surface RPa, and using the reflecting surface RPb before the rotation direction to detect the origin signal SZ. Therefore, if the angle ηj between adjacent reflecting surfaces RP (for example, reflecting surface RPa and reflecting surface RPb) has an error with respect to the design value (135 degrees in the case of eight reflecting surfaces RP), the deviation of this error , As shown in Figure 30, there may be cases where the origin signal SZ generation timing is different from the reflective surface RP.

In FIG. 30, the origin signal SZ generated using the reflecting surface RPb is SZb. Similarly, the origin signal SZ generated by using reflective surfaces RPc, RPd, RPe, ... is SZc, SZd, SZe, .... When the angle ηj between the adjacent reflecting surfaces RP of the polygon mirror PM is a design value, the interval of the generation timing of each origin signal SZ (SZb, SZc, SZd, ...) becomes the time Tpx. This predetermined time Tpx is the time required for one of the reflecting surfaces RP of the polygon mirror PM to rotate. However, in FIG. 30, due to the error of the included angle ηj of the reflecting surface RP of the polygon mirror PM, the timing of the origin signals SZc and SZd generated using the reflecting surfaces RPc and RPd is offset from the normal timing. In addition, the time intervals Tp1, Tp2, Tp3,… of the origin signals SZb, SZc, SZd, SZe,… are not always at the μsec level due to the manufacturing error of the polygon mirror PM. In the timetable shown in Fig. 30, Tp1<Tpx, Tp2>Tpx, Tp3<Tpx. In addition, assuming that the number of reflecting surfaces RP is Np and the rotation speed of the polygon mirror PM is Vp, Tpx is represented by Tpx=60/(Np×Vp) second. For example, if Vp is 30,000 rpm, and Np is set to 8, Tpx becomes 250 μsec.

Therefore, due to the error of the angle ηj between the adjacent reflecting surfaces RP of the polygon mirror PM, the point light SP drawn by each reflecting surface RP (RPa~RPh) is drawn on the irradiated surface of the substrate FS. The position of the starting point (scanning starting point) is shifted to the main scanning direction. Thereby, the position of the drawing end point of the drawing line SL is also shifted to the main scanning direction. That is, the position of the drawing line SL1 of the point light SP drawn by each reflecting surface RP is shifted along the scanning direction (Y direction), so the position of the drawing start point and drawing end point of each drawing line SLn will not be along X The direction becomes a straight line. The main reason why the position of the drawing start point and the drawing end point of the drawing line SL1 of the spot light SP deviates to the main scanning direction is that it does not become Tp1, Tp2, Tp3, ...=Tpx.

Therefore, in the fourth embodiment, as shown in the timetable shown in FIG. 30, the time Tpx after the generation of a pulse-like origin signal SZ is used as the drawing start point, and the drawing of the light SP is started. That is, the control device 18, after the time Tpx has elapsed after the origin signal SZ is generated, controls the beam switching member 20 so that the beam LB1 enters the scanning unit U1, and outputs the following to the driving circuit 206a of the light source device 14' shown in FIG. 26 The drawing bit row data Sdw of the scanning unit U1 for scanning is the serial data DL1. Thereby, the reflective surface RPb used for the detection of the origin signal SZ and the reflective surface RP actually scanned by the spot light SP can be made the same reflective surface.

Specifically, the control device 18, after the time Tpx has elapsed after the origin sensor OP1 of the scanning unit U1 outputs the origin signal SZb, the optical element AOM1 for selecting the beam switching member 20 outputs ON for a certain period of time (ON time Ton) The drive signal. The certain time (ON time Ton) when the optical element for selection AOM1 turns ON is a predetermined time, and it is set to cover the point light SP by a reflecting surface RP of the polygon mirror PM to scan once along the drawing line SL (scan period ). Then, the control device 18 outputs a specific row, such as the first row of serial data DL1, to the driving circuit 206a of the light source device 14'. Thereby, during the scanning time when the scanning unit U1 performs the scanning of the spot light SP, the light beam LB1 enters the scanning unit U1, so the scanning unit U1 can draw a pattern corresponding to a specific row (for example, the first row) sequence data DL1. As mentioned above, after the time Tpx has elapsed after the origin sensor OP1 of the scanning unit U1 outputs the origin signal SZb, the scanning unit U1 performs the scanning of the spot light SP, so the reflective surface RPb used for the detection of the origin signal SZb can be used Scan the spot light SP caused by the origin signal SZb.

Next, the control device 18, after the time Tpx has elapsed after the origin sensor OP1 of the scanning unit U1 outputs the origin signal SZd, the optical element AOM1 for the selection of the beam switching member 20 outputs ON for a certain period of time (ON time Ton) Drive signal. Then, the control device 18 outputs the next row, for example, the second row of serial data DL1, to the driving circuit 206a of the light source device 14'. Thereby, in the scanning time including the time required for the scanning unit U1 to scan the spot light SP, the light beam LB1 enters the scanning unit U1, so the scanning unit U1 can draw a pattern corresponding to the next row (for example, the second row) of the sequence data DL1 . As mentioned above, after the time Tpx has elapsed after the origin sensor OP1 of the scanning unit U1 outputs the origin signal SZd, the scanning unit U1 scans the spot light SP, so the reflective surface RPb used for detection of the origin signal SZd can be used Perform scanning of the spot light SP caused by the origin signal SZd. In addition, in the case where the scanning of the spot light SP is not performed on the continuous reflecting surface RP of the polygon mirror PM but performed by skipping one surface, the origin signal SZ is used for drawing processing by skipping one (every other). The reason for the above-mentioned skipping of the drawing process will be explained in detail later.

In the above manner, after the time Tpx has elapsed after the origin sensor OP1 of the scanning unit U1 outputs the origin signal SZ, the control device 18 controls the beam switching member 20 in such a way that the scanning unit U1 scans the spot light SP, and controls the light source device The driving circuit 206a of 14' outputs the serial signal DL1. Furthermore, the control device 18 shifts the rows of the output sequence data DL1 in the row direction in the manner of the first row, the second row, the third row, the fourth row, ... every time the scanning of the scanning unit U1 starts. In addition, during the period from one scan of the spot light SP performed by the scanning unit U1 to the next scan, the scanning of the spot light SP performed by the other scanning units Un (scanning units U2~U6) is sequentially performed. The scanning of the spot light SP performed by the other scanning units Un (U2~U6) is the same as the scanning of the scanning unit U1. In addition, the origin sensor OPn (OP1~OP6) is set for each scanning unit Un (U1~U6).

As mentioned above, the reflective surface RP used for the detection of the origin signal SZb of the scanning unit U1 is used to scan the spot light SP, so that even if the angle ηj between the adjacent reflective surfaces RP of the polygon mirror PM is incorrect It is also possible to prevent the position of the point light SP drawn by each reflecting surface RP (RPa~RPh) from shifting in the main scanning direction of the drawing start point and drawing end point on the illuminated surface of the substrate FS.

For this reason, the time Tpx for the rotation of the polygon mirror PM by 45 degrees must be correct in μs, that is, the speed of the polygon mirror PM must be uniformly and precisely rotated at a constant speed. As mentioned above, in the case of precisely rotating the polygon mirror PM at a constant speed, the reflection surface RP used for the generation of the origin signal SZ is always the angle at which the beam LB1 is reflected toward the fθ lens FT by correctly rotating only 45 degrees after the time Tpx . Therefore, by improving the rotational isokinetic properties of the rotating polygon mirror PM, the speed unevenness in one rotation is also reduced as much as possible, so that the position of the reflecting surface RP used for the generation of the origin signal SZ and the beam LB1 can be deflected so that The position of the reflective surface RP used for spot light SP scanning is different. That is, since the generation timing of the origin signal SZ is delayed by the time Tpx, as a result, it has the same effect as detecting the origin signal SZ using the reflective surface RP for scanning the spot light SP. As a result, the degree of freedom of arrangement of the origin sensor OP1 (OPn) can be improved, and an origin sensor with a relatively high rigidity and stable structure can be installed. In addition, although the reflecting surface RP as the detection target of the origin sensor OP1 (OPn) is one before the rotation direction of the reflecting surface RP that deflects the light beam LB1 (LBn), as long as it is before the rotation direction of the polygon mirror PM However, it is not limited to the previous one. In this case, suppose that the reflection surface RP as the detection object of the origin sensor OP is n (an integer greater than 1) before the rotation direction of the reflection surface RP that deflects the light beam LB1 (LBn), as long as the origin signal SZ It is sufficient to set the drawing start point after n×time Tpx has passed after generation.

Furthermore, for each of the origin signals SZb, SZd, ... generated at intervals from the origin sensor OP1 (OPn), the drawing start point is set after n×time Tpx, thereby allowing ample generation of corresponding drawing lines SL1 is the processing time of the reading action of drawing data, data transmission (communication) action, or correction calculation. Therefore, the transmission error of the pixel data row, the error or the partial disappearance of the pixel data row can be reliably avoided.

In addition, as in the above-mentioned FIG. 29, it is not necessary to provide a reflection surface RP adjacent to the reflection surface RP (in the fourth embodiment, before the rotation direction of the polygon mirror PM) for scanning the spot light SP (deflection of the light beam LB1). An origin sensor OPn of a reflective surface RP), and an origin sensor that detects the same reflective surface RP as the subsequent scanning of the spot light SP (deflection of the beam LB1). In this case, as illustrated in Figure 30, since the time interval deviation of the origin signal (pulse-like) SZ generated by each reflecting surface RPa~RPh of the polygon mirror PM, the time corresponding to the deviation amount must be added to each reflecting surface RPa~RPh Offset.

Here, as illustrated in FIG. 7, when there are eight reflecting surfaces RP of the polygon mirror PM, and the maximum scanning angle range α is 15 degrees, the scanning efficiency (α/β) becomes 1/3. For example, during the period from scanning the spot light SP from the scanning unit U1 to the next scanning, the light beam LBn can be distributed to two scanning units Un other than the scanning unit U1 to scan the spot light SP. That is, during the period when the polygon mirror PM of the scanning unit U1 rotates one side, the corresponding light beam LBn can be distributed to each of the three scanning units Un including the scanning unit U1 to scan the spot light SP.

However, since the scanning efficiency of the polygon mirror PM is 1/3, when each scanning unit Un scans the spot light SP with the maximum scanning rotation angle range α (15 degrees), the polygon mirror rotating reflection surface RP of the scanning unit U1 During one plane (β=45 degrees), the light beam LBn cannot be distributed to three or more scanning units Un (U2~U6) other than the scanning unit U1. That is, during the period from the start of scanning of the spot light SP of the scanning unit U1 to the start of the next scanning of the spot light SP, the light beam LBn cannot be distributed to more than three scanning units Un (U2~U6) other than the scanning unit U1. Therefore, during the period from the start of scanning of the spot light SP of the scanning unit U1 to the start of the next scan, in order to distribute the beam LBn to each of the other five scanning units Un (U2~U6), the scanning of the spot light SP can be considered The following method.

Even when the maximum scanning rotation angle range α is 15 degrees, the scanning rotation angle range α'of the polygon mirror PM that can actually be scanned by the spot light SP is set to be larger than the maximum scanning rotation angle range α (α=15 degrees) small. Specifically, during the period when each polygon mirror PM of the scanning unit Un (U1~U6) rotates one of the reflecting surfaces RP (β=45 degrees), the number of scanning units to be distributed to the beam LBn is six, so the scanning The rotation angle range α'is α'=45/6=7.5 degrees. That is, the oscillation angle centered on the optical axis AXf of the light beam LBn incident on the fθ lens FT in FIG. 28 is limited to ±7.5 degrees. Thereby, during the period when the polygon mirror PM of each scanning unit Un rotates 45 degrees (the period when one of the reflecting surfaces RP is rotated), the light beam LBn can be distributed and incident to any one of the six scanning units Un (U1~U6) in sequence , The scanning unit Un (U1~U6) can scan the spot light SP in sequence. However, in this case, the scanable scanning rotation angle range α'of the spot light SP will actually become too small, and the maximum scanning range length of the spot light SP scanning, that is, the maximum scanning length of the drawing line SLn will become too short. problem. In order to avoid the above-mentioned problems, the fθ lens FT with a long focal length is prepared in such a way that the maximum scanning length of the spot light SP scans is unchanged, and the distance from the reflecting surface RP of the polygon mirror PM to the fθ lens FT (working distance) is set to be longer. In this case, there may also be concerns that the fθ lens FT becomes larger, the size of the scanning unit Un (U1~U6) in the Xt direction becomes larger, and the operating distance is longer, which may reduce the stability of the beam scanning.

On the other hand, it can be considered to reduce the number of reflecting surfaces RP of the polygon mirror PM and increase the rotation angle β of one of the rotating reflecting surfaces RP of the polygon mirror PM. In this case, it is possible to prevent the drawing line SLn from becoming shorter or the scanning unit Un (U1~U6) from becoming larger, while the polygon mirror PM of the scanning unit Un (U1~U6) rotates during one of the reflection surfaces RP (rotation angle β) , The light beam LBn is distributed, and the six scanning units Un (U1~U6) sequentially scan the spot light SP. For example, when the number of reflection surfaces RP of the polygon mirror PM is four, that is, when the shape of the polygon mirror PM is square, the rotation angle β of one surface of the polygon mirror PM rotating the reflection surface RP becomes 90 degrees. Therefore, during the period when the polygon mirror PM of the scanning unit U1 rotates one of the reflecting surfaces RP, the light beam LBn is distributed and the spot light SP is scanned by six scanning units Un (U1~U6). Actually, the spot light SP is The scanning rotation angle range α'of the scannable polygon mirror PM becomes α'=90/6=15 degrees, which is equal to the above-mentioned maximum scanning rotation angle range α.

However, if a polygonal mirror PM of a polygonal shape with a small number of reflective surfaces Np like a triangle or a square is rotated at a high speed, the air resistance (wind resistance) becomes too large, and the rotation speed and number of rotations decrease (regularly). For example, even if the polygon mirror PM is to be rotated at a high speed at tens of thousands of rpm (rotation per minute), the rotation speed is reduced by about 20 to 30% due to air resistance, and the desired high speed rotation and high number of rotations cannot be obtained. In addition, a method of increasing the outer dimension of the polygon mirror PM is also considered, but the weight of the polygon mirror PM becomes too large, and the desired high-speed rotation speed and high rotation number cannot be obtained. In addition, as a method to reduce the wind resistance during rotation even if the number of reflecting surfaces Np of the polygon mirror PM is reduced, it can be considered to install the polygon mirror PM in a vacuum environment or in an environment with a gas (helium, etc.) with a smaller molecular weight than air. . In this case, an airtight structure for making the above-mentioned environment is arranged around the polygon mirror PM, and the scanning unit Un (U1~U6) becomes larger correspondingly.

Therefore, in the fourth embodiment, a polygon mirror PM with a larger number of reflection surfaces Np, that is, an octagonal polygon mirror that is closer to a circle, is used, and at the same time, the polygon mirror PM that can actually be scanned by the point light SP is used The scanning rotation angle range α'is the maximum scanning rotation angle range α (α=15 degrees), and the reflecting surface RP of the polygon mirror PM that performs the scanning of the spot light SP (the deflection of the light beam LBn) is set to every other. That is, the scanning of the spot light SP performed by each scanning unit Un (U1~U6) is repeated on every other side (skipping one side) of the reflecting surface RP of the polygon mirror PM. Therefore, when the scanning unit U1 scans the spot light SP until the next scan, the light beams LB2 ~ LB6 can be distributed to each of the five scanning units U2 ~ U6 other than the scanning unit U1 in order to perform the spot light SP. scanning. That is, during the period when the polygon mirror PM of one scanning unit Un of the six scanning units Un (U1~U6) is turned on two sides, the light beams LB1~LB6 are distributed to the six scanning units Un(U1~U6) Each of the six scanning units Un (U1~U6) can perform spotlight SP scanning. In this case, before each scanning unit Un (U1~U6) starts the scanning of the spot light SP and before starting the scanning of the next spot light SP, the polygon mirror PM becomes two sides of rotation (90 degrees). In order to perform the above drawing operation, the polygon mirror PM of each of the six scanning units Un (U1~U6) is synchronously controlled so that the rotation speed becomes the same, and the angular position of the reflecting surface RP of each polygon mirror PM is synchronously controlled to become a predetermined one Phase relationship.

In addition, since the reflecting surface RP of the polygon mirror PM that performs the scanning of the spot light SP (the deflection of the light beam LBn) is separated from each other, the polygon mirror PM of each scanning unit Un (U1~U6) rotates once, along The number of scanning of each spot light SP of the drawing lines SLn (SL1 to SL6) becomes four. Therefore, compared to the scanning of the spot light SP (the deflection of the light beam LBn) in the case where the continuous reflecting surface RP of the polygon mirror PM is repeated, that is, the case in which the reflecting surfaces RP of the polygon mirror PM are performed, the number of lines SLn is drawn Therefore, it is preferable that the transfer speed of the substrate FS is also reduced to half. It is not desired to make the transfer speed of the substrate FS half, so that the rotation speed of the polygon mirror PM of each scanning unit Un (U1~U6) and the oscillation frequency Fs are doubled. For example, when the continuous reflecting surface RP of the polygon mirror PM repetitively scans the spot light SP (the deflection of the beam LBn), the rotation speed of the polygon mirror PM is 20,000 rpm, and the oscillation frequency Fs of the beam LB from the light source device 14' is In the case of 200MHz, when every other reflecting surface RP of the polygon mirror PM repeats the scanning of the spot light SP (deflection of the beam LBn), the rotation speed of the polygon mirror PM is set to 40,000 rpm, and the beam LB from the light source device 14' The oscillation frequency Fs is set to 400MHz.

Here, the control device 18 manages which scanning unit Un of the plurality of scanning units Un (U1 to U6) performs scanning of the spot light SP according to the origin signal SZ. However, the origin sensor OPn of each scanning unit Un (U1~U6) generates an origin signal SZ after each reflecting surface RP becomes a predetermined angular position. Therefore, if the origin signal SZ is directly used, the control device 18 determines Each scanning unit Un (U1~U6) scans the spot light SP on the continuous reflecting surface RP. Therefore, the light beam LBn cannot be distributed to the other five scanning units Un before scanning the spot light SP in one scanning unit Un until the next scanning. Therefore, in order to set the reflecting surface RP of the polygon mirror PM for scanning the spot light SP to be one apart, it is necessary to generate a secondary origin signal (secondary origin pulse signal) ZP separated from the origin signal SZ. Also, as mentioned above, the origin signal SZ is detected using the reflecting surface RP before the rotation direction of the reflecting surface RP for scanning (deflection) of the spot light SP. Therefore, it is necessary to generate a time delay Tpx that delays the generation of the origin signal SZ. Sub-origin signal ZP. Hereinafter, the structure of the secondary origin generating circuit CA that generates the secondary origin signal ZP will be described.

FIG. 31 is a configuration diagram of a secondary origin generating circuit CA for generating a secondary origin signal ZP separated from the origin signal SZ to generate a timing delay of a predetermined time Tpx. FIG. 32 shows a timing chart of the secondary origin signal ZP generated by the secondary origin generating circuit CA of FIG. 31. The secondary origin generating circuit CA has a frequency divider 330 and a delay circuit 332. The frequency divider 330 divides the frequency of the generation timing of the origin signal SZ into 1/2 and outputs it to the delay circuit 332 as the origin signal SZ'. The delay circuit 332 delays the transmitted origin signal SZ' by the time Tpx, and outputs it as the secondary origin signal ZP. The secondary origin generating circuit CA is provided with a plurality of origin sensors OPn corresponding to each scanning unit Un (U1~U6).

In addition, there may be cases where CAn represents the secondary origin generating circuit CA of the origin sensor OPn corresponding to the scanning unit Un. That is, there will be CA1 representing the secondary origin generating circuit CA corresponding to the origin sensor OP1 of the scanning unit U1, and CA2~CA6 representing the secondary origin corresponding to the origin sensor OP2~OP6 of the scanning unit U2~U6 Point generating circuit CA. In addition, there may be cases where SZn represents the origin signal SZ output from the origin sensor OPn of the scanning unit Un. That is, there will be SZ1 representing the origin signal SZ output from the origin sensor OP1 of the scanning unit U1, and SZ2~SZ6 representing the origin output from the origin sensor OP2~OP6 of the scanning unit U2~U6 The situation of the signal SZ. In addition, there may be cases where SZn' and ZPn represent the origin signal SZ' and the secondary origin signal ZP generated based on the origin signal SZn. That is, there will be cases where SZ1', ZP1 represents the origin signal SZ' and the secondary origin signal ZP generated based on the origin signal SZ1. Similarly, there will be SZ2'~SZ6', ZP2~ZP6 representing the original The origin signal SZ' and the secondary origin signal ZP generated by the point signals SZ2~SZ6.

Fig. 33 is a block diagram showing the electrical structure of the exposure device EX. Fig. 34 is a time chart showing the timing of the output origin signal SZ1~SZ6, the secondary origin signal ZP1~ZP6, and the sequence data DL1~DL6. The control device 18 of the exposure device EX includes a rotation control unit 350, a beam switching control unit 352, a drawing data output control unit 354, and an exposure control unit 356. In addition, the exposure apparatus EX is equipped with motor drive circuits Drm1 to Drm6 that drive a polygon mirror drive unit RM including a motor of each scanning unit Un (U1 to U6).

The rotation control unit 350 controls the rotation of the polygon mirror PM of each scanning unit Un (U1 to U6) by controlling the motor drive circuits Drm1 to Drm6. The rotation control unit 350 controls the motor drive circuits Drm1~Drm6 so that the rotation angle positions of the polygon mirrors PM of the plurality of scanning units Un(U1~U6) are in a predetermined phase relationship, so that the plurality of scanning units Un(U1 ~U6) The polygon mirror PM rotates synchronously. In detail, the rotation control unit 350 controls the plurality of scanning units Un in such a way that the rotation speed (number of rotation) of the polygon mirror PM of the plurality of scanning units U1 to U6 is the same and the phases of the rotation angle positions are shifted by a certain angle one by one. (U1~U6) The rotation of the polygon mirror PM. In addition, reference signs PD1 to PD6 in FIG. 33 indicate control signals output from the rotation control unit 350 to the motor drive circuits Drm1 to Drm6.

In the fourth embodiment, the rotation speed Vp of the polygon mirror PM is 39,000 rpm (650 rps). In addition, since the number of reflection surfaces Np is set to 8, the scanning efficiency (α/β) is 1/3, and the reflection surface RP for scanning the spot light SP is separated from each other, the rotation angle position phase between the six polygon mirrors PM The difference is the maximum scanning rotation angle range α, that is, 15 degrees. The scanning of the spotlight SP is performed in the order of U1→U2→…→U6. Therefore, the rotation angle position of the polygon mirror PM of each of the six scanning units U1 to U6 rotates at a constant speed while the phases of the rotation angle positions of each of the polygon mirrors PM are sequentially shifted by 15 degrees, and are synchronously controlled by the rotation control unit 350. Thereby, the phase shift between the rotation angle positions of the scanning unit U1 and the scanning unit U4 becomes 45 degrees corresponding to the rotation angle of the exact side. Therefore, the phases of the rotation angle positions of the scanning unit U1 and the scanning unit U4, that is, the generation timing of the origin signals SZ1 and SZ4 can also be consistent. Similarly, the rotation angle position of the scanning unit U2 and the scanning unit U5 and the phase offset of the rotation angle position of the scanning unit U3 and the scanning unit U6 are all 45 degrees, so the origin signal from each of the scanning unit U2 and the scanning unit U5 The generation timing of SZ2, SZ5 and the generation timing of each origin signal SZ3, SZ6 from the scanning unit U3 and the scanning unit U6 can also be consistent on the time axis.

Specifically, the rotation control unit 350 uses the rotation of the polygon mirror PM of the scanning unit U1 and the scanning unit U4, the rotation of the polygon mirror PM of the scanning unit U2 and the scanning unit U5, and the polygon mirror PM of the scanning unit U3 and the scanning unit U6 Each of the rotations becomes the first control state, and the rotation of the polygon mirror PM of each scanning unit U1~U6 is controlled through each motor drive circuit Drm1~Drm6. This first control state is a state where the phase difference of the output spiral pulse signal is 0 (zero) every time the polygon mirror PM rotates once. That is, the rotation of the polygon mirror PM of the scanning unit U1 and the scanning unit U4 is controlled so that the phase difference of the output spiral pulse signal becomes 0 (zero) every time the polygon mirror PM of the scanning unit U1 and the scanning unit U4 rotates once. . Similarly, when the scanning unit U2 and the scanning unit U5 and the polygon mirror PM of the scanning unit U3 and the scanning unit U6 rotate once, the phase difference of the output spiral pulse signal becomes 0 (zero), and the scanning unit U2 and the scanning are controlled. The rotation of the polygon mirror PM of the unit U5 and the scanning unit U3 and the scanning unit U6.

The spiral pulse signal can also be a signal outputted by a frequency divider (not shown) every time the origin signal SZn of the scanning unit Un is output eight times. In addition, the spiral pulse signal may also be a signal output from an encoder (not shown) of the polygon mirror drive part RM provided in each scanning unit Un (U1~U6). The sensor for detecting the spiral pulse signal can also be arranged near the polygon mirror PM. In the example shown in FIG. 34, the spiral pulse signal is output once every time the origin signal SZn of the scanning unit Un is output eight times, and the dotted line represents a part of the origin signal SZn corresponding to the generation of the spiral pulse signal. In addition, each origin signal SZ1 and each origin signal SZ4, if the error of the angle ηj between the adjacent reflecting surfaces RP (for example, the reflecting surface RPa and the reflecting surface RPb) is not considered (refer to Figure 29), on the time axis All are in phase. Similarly, each origin signal SZ2 and each origin signal SZ5, and each origin signal SZ3 and each origin signal SZ6, if the error of the angle ηj between the adjacent reflecting surfaces RP is not considered (refer to Figure 29), the time All phases on the axis are the same. In addition, in FIG. 34, for convenience of description, it is assumed that there is no error in the included angle ηj between adjacent reflecting surfaces RP.

Next, the rotation control unit 350, while maintaining the first control state, shifts the rotation angle position of the polygon mirror PM of the scanning unit U2, U5 by 15 degrees relative to the rotation angle position of the polygon mirror PM of the scanning unit U1, U4 Way, control the rotation of the polygon mirror PM of the scanning unit U2, U5. Similarly, the rotation control unit 350, while maintaining the first control state, shifts the rotation angle position of the polygon mirror PM of the scanning units U3 and U6 by 30 degrees relative to the rotation angle position of the polygon mirror PM of the scanning unit U1 and U4 In this way, the rotation of the polygon mirror PM of the scanning unit U3, U6 is controlled. Let the time for the polygon mirror PM to rotate 15 degrees (the maximum scanning time of the light beam LBn) as Ts.

Specifically, the rotation control unit 350 controls the polygon mirrors PM of the scanning units U2, U5 by generating the delay time Ts of the spiral pulse signals obtained by the scanning units U2 and U5 relative to the spiral pulse signals obtained by the scanning units U1 and U4. Rotate (refer to Figure 34). Similarly, the rotation control unit 350 controls the polygon mirror PM of the scanning units U3 and U6 by generating the spiral pulse signal obtained by the scanning units U3 and U6 with respect to the spiral pulse signal obtained by the scanning units U1 and U4 by a delay time of 2×Ts. The rotation (refer to Figure 34). If the rotation speed Vp of the polygon mirror PM is 39,000 rpm (650rps), the time Ts is Ts=[1/(Vp×Np)]×(α/β)=1/(650×8×3) seconds [ About 64.1μsec]. In the above manner, by controlling the rotation of the polygon mirror PM of each scanning unit U1~U6, the scanning of the spot light SP of each scanning unit U1~U6 can be performed in a time-sharing manner in the order of U1→U2→...→U6.

The beam switching control unit 352 controls the optical elements AOMn (AOM1~AOM6) for selection of the beam switching member 20, and distributes the beam LB from the light source device 14' to six scans before one scanning unit Un starts scanning to the next scanning Unit Un (U1~U6). Therefore, the light beam switching control section 352 uses the scanning (deflection) of the light beam LBn of the polygon mirror PM of each scanning unit Un (U1~U6) to overlap every other reflecting surface RP of the polygon mirror PM by selecting the optical The components AOM1 to AOM6 make any one of the light beams LB1 to LB6 generated from the light beam LB enter each scanning unit Un (U1 to U6) in a time-sharing manner.

Specifically, the beam switching control unit 352 is provided with the sub-origin generating circuit CAn (CA1 to CA6) shown in FIG. 31 that generates the sub-origin signal ZPn (ZP1 to ZP6) based on the origin signal SZn (SZ1 to SZ6). After the secondary origin generating circuit CAn (CA1~CA6) generates the secondary origin signal ZPn (ZP1~ZP6), the corresponding scanning unit Un(U1~U6) generated by the secondary origin signal ZPn (ZP1~ZP6) ) The optical element AOMn (AOM1~AOM6) is ON for a certain period of time (ON time Ton). For example, after the secondary origin signal ZP1 is generated, the optical element AOM1 for the selection of the corresponding scanning unit U1 due to the generation of the secondary origin signal ZP1 is turned on for a certain time (ON time Ton). This secondary origin signal ZPn is generated based on the origin signal SZn output from the origin sensor OPn, and divides the frequency of the origin signal SZn into 1/2, that is, is separated from the origin signal SZn by half And the delay time Tpx. This certain time (ON time Ton) corresponds to the period from the time when the secondary origin signal ZPn is generated to the time when the secondary origin signal ZPn from the scanning unit Un that is scanned next is generated, that is, the time required for the polygon mirror PM to rotate 15 degrees Time Ts. If the ON time Ton of the selective optical element AOMn is set to be longer than the time Ts, there will be a period in which two of the selective optical elements AOMn become ON at the same time, and the light beams LB1~LB6 cannot be correctly guided to the point light SP for drawing. The scanning unit Un of the action. Therefore, the ON time Ton is set to Ton≦Ts.

At this time, each origin signal SZ1 and each origin signal SZ4, if the error of the angle ηj between adjacent reflecting surfaces RP (for example, reflecting surface RPa and reflecting surface RPb) is not considered, they are all synchronized on the time axis and set The phases of the sub-origin signal ZP1 and the sub-origin signal ZP4 are shifted by about a half period (refer to FIG. 34). The phase shift of the sub-origin signal ZP1 and the sub-origin signal ZP4 by about a half period is performed by the frequency divider 330 of the sub-origin generating circuit CAn (CA1~CA6). That is, the frequency divider 330 staggers the timing separated from the origin signal SZ1 and the timing separated from the origin signal SZ4 by approximately a half period.

The relationship between the sub-origin signal ZP2 and the sub-origin signal ZP5 is also the same. The frequency divider 330 sets the sub-origin signal ZP2 and the sub-origin signal ZP5 to be out of phase by about a half period (refer to FIG. 34). Also, the relationship between the sub-origin signal ZP3 and the sub-origin signal ZP6 is similarly set by the frequency divider 330 so that the phases of the sub-origin signal ZP3 and the sub-origin signal ZP6 are shifted by about a half period (refer to FIG. 34).

Therefore, as shown in FIG. 34, the generation timings of the secondary origin signals ZP1 to ZP6 generated by the scanning units U1 to U6 are staggered by the time Ts one by one. In the fourth embodiment, the order of the scanning unit Un for scanning the spot light SP is U1→U2→…→U6, so the secondary origin signal ZPn will generate the secondary origin after the time Ts has passed after the secondary origin signal ZP1 is generated. The point signal ZP2 is also generated at intervals of time Ts in the order of ZP1→ZP2→…→ZP6. Therefore, the beam switching control unit 352, corresponding to the generated secondary origin signal ZPn (ZP1~ZP6), controls the optical element AOMn (AOM1~AOM6) for the selection of the beam switching member 20, so that it can use U1→U2→…→ The sequence of U6 makes the corresponding light beams LB1~LB6 enter each of the scanning units Un. That is, the scanning (deflection) of the light beam LBn performed by the polygon mirror PM of each scanning unit Un (U1~U6) can be repeated in a way that every other reflecting surface RP of the polygon mirror PM is switched in a time-sharing manner. The light beam LBn of the scanning unit Un (U1~U6).

The drawing data output control unit 354 outputs the row sequence data DLn corresponding to the pattern of one drawing line SLn scanned by the spot light SP by the scanning unit Un as the drawing bit row data Sdw to the driving circuit 206a of the light source device 14'. The order of the scanning unit Un for scanning the spotlight SP is U1→U2→...→U6, so the drawing data output control unit 354 outputs a row of serial data DLn to draw bit row data repeatedly in the order of DL11→DL2→…→DL6 Sdw.

The configuration of the drawing data output control unit 354 will be described in detail with reference to FIG. 35. The drawing data output control unit 354 has six generating circuits 360, 362, 364, 366, 368, 370 and an OR circuit GT8 corresponding to each of the scanning units U1 to U6. The generating circuits 360 to 370 have the same configuration. Specifically, the generating circuit 360 includes a memory portion BM1, a counter portion CN1, and a gate portion GT1, and the generating circuit 362 includes a memory portion BM2, a counter portion CN2, and a gate portion GT2. The generating circuit 364 includes a memory unit BM3, a counter unit CN3, and a gate unit GT3, and the generating circuit 366 includes a memory unit BM4, a counter unit CN4, and a gate unit GT4. The generating circuit 368 includes a memory unit BM5, a counter unit CN5, and a gate unit GT5, and the generating circuit 370 includes a memory unit BM6, a counter unit CN6, and a gate unit GT6. The configuration of the generating circuits 360-370 can also be the same as the generating circuits 301, 303, and 305 shown in FIG. 16.

The memory portion BM1~BM6 is a memory for storing pattern data (bit image data) corresponding to the pattern to be drawn and exposed for each scanning unit Un (U1~U6). The counter parts CN1~CN6 are counters that are stored in the pattern data of each memory part BM1~BM6 and then output the sequence data DL1~DL6 of a drawing line SLn to be drawn pixel by pixel in synchronization with the clock signal CLK. The counter units CN1 to CN6, as shown in FIG. 34, output a sequence of data DL1 to DL6 after outputting the sub origin signals ZP1 to ZP6 from the sub origin generating circuits CA1 to CA6 of the beam switching control unit 352.

The map data stored in each memory unit BM1~BM6 is offset in the row direction by the output sequence data DL1~DL6 by the address counter not shown. That is, the rows read by the address counter (not shown) are shifted in the first row, second row, third row, .... This offset, for example, if it corresponds to the memory portion BM1 of the scanning unit U1, after the output of the sequence data DL1 is finished, it is performed corresponding to the timing of the generation of the secondary origin signal ZP2 of the scanning unit U2 to be scanned next. Similarly, the offset of the sequence data DL2 of the pattern data stored in the memory part BM2 is performed after the output of the sequence data DL2 is finished, corresponding to the timing of the generation of the secondary origin signal ZP3 of the scanning unit U3 that is scanned next. Similarly, the offset of the sequence data DL3~DL6 of the pattern data stored in the memory part BM3~BM6, after the sequence data DL3~DL6 output is finished, it corresponds to the secondary origin of the scanning unit U4~U6, U1 that is scanned next The signals ZP4~ZP6, ZP1 are generated in the timing sequence. In addition, the scanning of the spotlight SP is performed in the order of U1→U2→...→U6.

The sequence data DL1~DL6 output in the above-mentioned manner are applied to the 6-input OR circuit GT8 through the gates GT1~GT6 opened in a certain time (ON time Ton) after the secondary origin signal ZP1~ZP6 is applied. The OR circuit GT8 repetitively synthesizes the sequence data DL1→DL2→DL3→DL4→DL5→DL6→DL1... and outputs the sequence data DLn as the drawing bit row data Sdw to the driving circuit 206a of the light source device 14'. In the above manner, each scanning unit Un (U1~U6) can draw a pattern corresponding to the pattern data for exposure at the same time as the scanning of the spot light SP.

In this fourth embodiment, pattern data is prepared for the scanning unit Un (U1~U6), and the sequence data is output from the pattern data of each scanning unit Un (U1~U6) according to the order of the scanning unit Un that performs the scanning of the spot light SP DL1~DL6. However, since the sequence of the scanning unit Un for scanning the spot light SP is determined in advance, it is also possible to prepare one pattern data after the combination of the sequence data DL1 to DL6 of the pattern data of each scanning unit Un (U1 to U6). That is, it is also possible to construct a pattern data in which the sequence data DLn (DL1 to DL6) of each row of the pattern data of each scanning unit Un (U1 to U6) are arranged according to the order of the scanning unit Un that performs the scanning of the spot light SP. In this case, as long as the secondary origin signal ZPn (ZP1~ZP6) based on the origin sensor OPn of each scanning unit Un (U1~U6) is used, the sequence data DLn of a pattern data is sequentially output from the first row OK.

However, the exposure control unit 356 shown in FIG. 33 controls the rotation control unit 350, the beam switching control unit 352, the drawing data output control unit 354, and the like. The exposure control unit 356 analyzes the imaging signal ig (ig1~ig4) taken by the alignment microscope AMm (AM1~AM4), and detects the position of the alignment mark MKm (MK1~MK4) on the substrate FS. Next, the exposure control unit 356 detects (determines) the start position of the drawing exposure of the exposure area W on the substrate FS based on the positions of the detected alignment marks MKm (MK1 to MK4). The exposure control unit 356 includes a counter circuit 356a, and the counter circuit 356a counts the detection signals detected by the encoders EN1a~EN3a, EN1b~EN3b shown in FIG. 24. The exposure control section 356 is based on the count value (mark detection position) based on the encoder EN1a, EN1b when the start position of the drawing exposure is detected, and the count value based on the encoder EN2a, EN2b (the odd-numbered drawing line SLn) Position) to determine whether the starting position of the drawing exposure of the substrate FS is located on the drawing lines SL1, SL3, SL5. If the exposure control unit 356 determines that the starting position of the drawing exposure is on the drawing lines SL1, SL3, SL5, it controls the drawing data output control unit 354 to make the scanning units U1, U3, U5 start scanning of the spot light SP. In addition, the rotation control unit 350 and the beam switching member 352, under the control of the exposure control unit 356, control the polygon mirror PM of each scanning unit Un (U1~U6) according to the spiral pulse signal and the sub-origin signal ZPn (ZP1~ZP6) The rotation and distribution of the light beam LBn performed by the beam switching member 20.

The exposure control section 356 is based on the count value (mark detection position) based on the encoder EN1a and EN1b when the start position of the drawing exposure is detected, and the count value based on the encoder EN3a, EN3b (the position of the even-numbered drawing line) ) To determine whether the starting position of the drawing exposure of the substrate FS is located on the drawing lines SL2, SL4, SL6. If the exposure control unit 356 determines that the starting position of the drawing exposure is located on the drawing lines SL2, SL4, SL6, it controls the drawing data output control unit 354 so that the scanning units U2, U4, U6 start scanning of the spot light SP.

As shown in Fig. 25 above, according to the conveying direction (+X direction) of the substrate FS, the drawing exposure on each of the drawing lines SL1, SL3, SL5 is first performed. After the substrate FS is conveyed a predetermined distance, the drawing exposure is performed on the drawing lines SL2, SL4. , The depiction and exposure of each SL6. On the other hand, since the polygon mirrors PM of the six scanning units U1~U6 maintain a certain angle and phase to each other for rotation control, the secondary origin signals ZP1~ZP6, as shown in Figure 34, have the phase difference of the sequential time Ts and continue to generate . Therefore, during the period from the beginning of the drawing exposure on the drawing lines SL1, SL3, SL5 to the moment before the beginning of the drawing exposure on the drawing lines SL2, SL4, SL6, the sub-origin signal ZP2, ZP4, ZP6 is turned on In the gate part GT2, GT4, GT6 in Fig. 35, the optical components AOM2, AOM4, and AOM6 for repeated selection are turned ON for a certain period of time. Therefore, in the configuration of FIG. 33, a selector gate circuit is provided in the beam switching control unit 352, and the selector circuit is based on the count value of the encoder EN1a, EN1b determined by the exposure control unit 356, or the count value of the encoder EN2a, EN2b The numerical value selects whether to prohibit sending each of the generated secondary origin signals ZP1 to ZP6 to the drawing data output control unit 354. At the same time, the driver circuits DRVn (DRV1~DRV6) (refer to Figure 38) of the optical elements for selection AOM1~AOM6 corresponding to each of the scanning units U1~U6 are also given the sub-origin signal ZP1 through the selection gate circuit ~ZP6.

Here, as described above, since the drawing lines SL1, SL3, SL5 are located on the upstream side of the drawing lines SL2, SL4, SL6 in the conveying direction of the substrate FS, the starting position of the drawing exposure of the exposure area W of the substrate FS reaches the drawing line first SL1, SL3, SL5, and after a certain time, reach the drawing lines SL2, SL4, SL6. Therefore, before the start position of the drawing exposure reaches the drawing lines SL2, SL4, SL6, only the scanning units U1, U3, U5 perform pattern drawing exposure. Therefore, when the selector circuit of the secondary origin signals ZP1~ZP6 as described above is not provided in the beam switching control section 352, the exposure control section 356 causes the output to the drive circuit 206a of the light source device 14' The part of the pixel data corresponding to the sequence data DL2, DL4, and DL6 in the drawing bit row data Sdw all become low "(0)", essentially canceling the drawing exposure of the scanning units U2, U4, U6. During the cancellation period, the sequence data DL2, DL4, DL6 output from the memory unit BM2, BM4, BM6 will not shift and maintain the first row. Then, after the starting position of the drawing exposure of the exposure area W reaches the drawing lines SL2, SL4, SL6, the output of the sequence data DL2, DL4, DL6 is started, and the sequence data DL2, DL4, DL6 are shifted in the column direction.

Also, similarly, the end position of the drawing exposure of the exposure area W first reaches the drawing lines SL1, SL3, SL5, and then reaches the drawing lines SL2, SL4, SL6 within a certain time. Therefore, after the end position of the drawing exposure reaches the drawing lines SL1, SL3, SL5 and before reaching the drawing lines SL2, SL4, SL6, only the scanning units U2, U4, U6 perform pattern drawing exposure. Therefore, in the case where the selector circuit of the sub-origin signals ZP1~ZP6 as described above is not provided in the beam switching control section 352, the exposure control section 356 makes the output to the driving circuit 206a of the light source device 14' The part of the pixel data corresponding to the sequence data DL1, DL3, and DL5 in the bit row data Sdw all become low "(0)", essentially canceling the drawing exposure of the scanning units U1, U3, U5. In addition, if the selection gate circuit is not set, even when the drawing exposure is canceled, the light beams LB1, LB3, LB5 are introduced to the scanning units U1, U3, U5 whose drawing exposure is canceled, and the optical components AOM1, AOM3, AOM5 repeatedly responds to the sub-origin signals ZP1, ZP3, and ZP5 to selectively turn on Ton for a certain period of time.

As described above, in the fourth embodiment, the light beam switching control unit 352 repeats the scanning (deflection) of the polygon mirror PM on every other reflecting surface RP of the polygon mirror PM of each scanning unit Un (U1~U6). The light beam switching member 20 is controlled so that each of the plurality of scanning units Un (U1~U6) sequentially performs one-dimensional scanning of the spot light SP. Thereby, without shortening the length of the drawing line SLn (SL1~SL6) scanned by the spot light SP, one light beam LB can be distributed to a plurality of scanning units Un (U1~U6), and the light beam LB can be effectively utilized. In addition, since the shape of the polygon mirror PM (polygonal shape) can be made close to a circle, the rotation speed of the polygon mirror PM can be prevented from decreasing, and the polygon mirror PM can be rotated at a high speed.

The light beam switching member 20 has a selection optical element AOMn (AOM1~AOM6), and the selection optical element AOMn (AOM1~AOM6) is arranged in line along the traveling direction of the light beam LB from the light source device 14'. Any one of the n light beams LBn deflected backward by the LB diffraction is guided to the corresponding scanning unit Un. Therefore, any one of the scanning units Un (U1~U6) to be incident on the light beam LBn can be simply selected, so that the light beam LB from the light source device 14' can be effectively concentrated on the scanning unit Un to be drawn and exposed, and a high exposure amount can be obtained . For example, a plurality of beam splitters are used to divide the beam LB emitted from the light source device 14' into six amplitudes, and each of the six beams LBn (LB1~LB6) after the division is transmitted through the serial data DL1~DL6 of the drawing data. When the acousto-optic modulating element for drawing is modulated to the six scanning units U1~U6, if the attenuation of the beam intensity of the acousto-optic modulating element for drawing is set to 20%, the beam intensity in the scanning unit Un When the attenuation is 30%, the intensity of the spot light SP of a scanning unit Un is about 9.3% when the intensity of the original light beam LB is set to 100%. On the other hand, as in the fourth embodiment, when the light beam LB from the light source device 14' is deflected by the selection optical element AOMn and is to be incident on any one of the six scanning units Un, the selection optical element When the attenuation of the beam intensity of AOMn is 20%, the intensity of the spot light SP in a scanning unit Un becomes about 56% of the intensity of the original beam LB.

The rotation control unit 350 controls the rotation of the polygon mirror PM of the plurality of scanning units Un (U1~U6) in such a way that the rotation speeds are the same and the phases of the rotation angle positions are shifted by a certain angle one by one. Thereby, during the period from the one-dimensional scanning of the spot light SP performed by one scanning unit Un to before the next one-dimensional scanning, the one-dimensional scanning of the spot light SP performed by the other plural scanning units Un can be sequentially performed.

In addition, in the above-mentioned fourth embodiment, although one light beam LB is described in the form of distributing one light beam LB to six scanning units Un, it is also possible to distribute one light beam LB from the light source device 14' to nine scanning units Un (U1~ U9). In this case, if the scanning efficiency (α/β) of the polygon mirror PM is 1/3, the light beam LBn can be distributed to the nine scanning units U1~U9 while the polygon mirror PM rotates the three reflecting surfaces RP. The scanning of the spot light SP is performed every second reflection surface RP. Thereby, from the scanning of the spot light SP performed by one scanning unit Un to the scanning of the next spot light SP, the other eight scanning units Un can sequentially perform the scanning of the spot light SP. Moreover, if the scanning efficiency of the polygon mirror PM is set to 1/3, the polygon mirror PM rotates three reflecting surfaces RP, and one beam LB can be distributed to nine scanning units Un. Therefore, the frequency divider of the secondary origin generating circuit CAn 330 divides the frequency of the generation sequence of the origin signal SZn into 1/3. In this case, the spiral pulse signals of the scanning units U1, U4, U7 are synchronized (the same phase on the time axis). Similarly, the spiral pulse signals of the scanning units U2, U5, U8 are synchronized, and the spiral pulse signals of the scanning units U3, U6, U9 are synchronized. In addition, the spiral pulse signal of the scanning unit U2, U5, U8 is generated by the delay time Ts relative to the spiral pulse signal of the scanning unit U1, U4, U7, and the spiral pulse signal of the scanning unit U3, U6, U9 is relative to the scanning unit U1, U4, The spiral pulse signal of U7 is generated after a delay of 2×time Ts. Also, the generation timings of the secondary origin signals ZP1, ZP4, and ZP7 of the scanning units U1, U4, U7 are staggered by 1/3 phase of 1 cycle one by one. Similarly, the secondary origin signals ZP2 of the scanning units U2, U5, U8, The generation timings of ZP5 and ZP8 and the generation timings of the secondary origin signals ZP3, ZP6, and ZP9 of scanning units U3, U6, U9 are also staggered by 1/3 of the phase of 1 cycle. In addition, the time Ts is the time when the polygon mirror PM rotates to scan the scanning rotation angle range α'of the polygon mirror PM that can scan the spot light SP. The angle β of the polygon mirror PM rotating a reflective surface RP multiplied by the scanning efficiency is the value of scanning Rotation angle range α'.

The scanning efficiency of the polygon mirror PM is 1/3. When one beam LB is distributed to the twelve scanning units Un (U1~U12), the beam LBn can be distributed to the four reflecting surfaces RP during the rotation of the polygon mirror PM. There are twelve scanning units U1~U12, so the scanning of the spot light SP is performed every three reflective surfaces RP. In addition, if the scanning efficiency of the polygon mirror PM is set to 1/3, the polygon mirror PM rotates four reflecting surfaces RP, and the twelve optional optical elements AOMn (AOM1~AOM12) arranged in series can be made from the light source device 14 The light beam LB of'beam LB chooses a deflection beam LBn (LB1 ~ LB12) to enter the corresponding scanning unit Un (U1 ~ U12), so the frequency divider 330 of the secondary origin generating circuit CAn will generate the timing of the origin signal SZn The frequency is divided into 1/4. In this case, the spiral pulse signals of the scanning units U1, U4, U7, U10 are synchronized (the same phase on the time axis). Similarly, the spiral pulse signals of the scanning units U2, U5, U8, U11 are synchronized, and the spiral pulse signals of the scanning units U3, U6, U9, and U12 are synchronized. In addition, the spiral pulse signal of the scanning unit U2, U5, U8, U11 is generated by the delay time Ts relative to the spiral pulse signal of the scanning unit U1, U4, U7, U10, and the spiral pulse signal of the scanning unit U3, U6, U9, U12 is relative to The spiral pulse signals of the scanning units U1, U4, U7, U10 are generated after a delay of 2×time Ts. In addition, the generation timings of the secondary origin signals ZP1, ZP4, ZP7, and ZP10 of the scanning units U1, U4, U7, and U10 are staggered by 1/4 phase of 1 cycle one by one. Similarly, the scanning units U2, U5, U8, U11 The generation timings of the secondary origin signals ZP2, ZP5, ZP8, ZP11 and the generation timings of the secondary origin signals ZP3, ZP6, ZP9, and ZP12 of the scanning units U3, U6, U9, U12 are also shifted one by one by 1/4 phase of 1 cycle.

Furthermore, in the fourth embodiment described above, although the scanning efficiency of the polygon mirror PM of the scanning unit Un is 1/3, the scanning efficiency may be 1/2 or 1/4. When the scanning efficiency is 1/2, the light beam LBn can be distributed to two scanning units Un while the polygon mirror PM rotates a reflecting surface RP. Therefore, when one light beam LBn is to be distributed to six scanning units Un, the spot light The scanning of SP is performed on every second reflection surface RP of the polygon mirror PM. That is, when the scanning efficiency of the polygon mirror PM is 1/2, the light beam LBn can be distributed to the six scanning units Un during the period when the polygon mirror PM rotates the three reflecting surfaces RP. Thereby, before the scanning of the spot light SP performed by one scanning unit Un to the scanning of the next spot light SP, the other five scanning units Un can sequentially perform the scanning of the spot light SP. Moreover, if the scanning efficiency of the polygon mirror PM is set to 1/2, the polygon mirror PM rotates three reflecting surfaces RP, and one beam LB can be distributed to six scanning units Un, so the frequency divider of the secondary origin generating circuit CAn 330 divides the frequency of the generation sequence of the origin signal SZn into 1/3. In this case, the spiral pulse signals of the scanning units U1, U3, U5 are synchronized. Similarly, the spiral pulse signals of the scanning units U2, U4, U6 are synchronized. In addition, the spiral pulse signals of the scanning units U2, U4, U6 are generated with a delay time Ts relative to the spiral pulse signals of the scanning units U1, U3, U5. In addition, the generation timings of the secondary origin signals ZP1, ZP3, and ZP5 of the scanning units U1, U3, U5 are shifted by 1/3 phase of 1 cycle one by one, and the secondary origin signals of the scanning units U2, U4, U6 are ZP2, ZP4, ZP6 The generation sequence is also staggered one-third of the phase of a cycle.

When the scanning efficiency of the polygon mirror PM is 1/4, the light beam LBn can be distributed to the four scanning units Un while the polygon mirror PM rotates one reflecting surface RP, so it is necessary to distribute one light beam LB to the eight scanning units Un At this time, the scanning of the spot light SP is performed on every other reflecting surface RP of the polygon mirror PM. That is, when the scanning efficiency of the polygon mirror PM is 1/4, the light beam LBn can be distributed to the eight scanning units Un while the polygon mirror PM rotates the two reflecting surfaces RP. Thereby, before the scanning of the spot light SP performed by one scanning unit Un to the scanning of the next spot light SP, the other seven scanning units Un can sequentially perform the scanning of the spot light SP. Furthermore, if the scanning efficiency of the polygon mirror PM is set to 1/4, the polygon mirror PM rotates two reflecting surfaces RP, and one beam LB can be distributed to eight scanning units Un, so the frequency divider of the secondary origin generating circuit CAn 330 divides the frequency of the generation sequence of the origin signal SZn into 1/2. In this case, the spiral pulse signals of the scanning units U1 and U5 are synchronized, and the spiral pulse signals of the scanning units U2 and U6 are synchronized. Similarly, the spiral pulse signals of the scanning units U3 and U7 are synchronized, and the spiral pulse signals of the scanning units U4 and U8 are synchronized. In addition, the spiral pulse signals of the scanning units U2 and U6 are generated by a delay time Ts relative to the spiral pulse signals of the scanning units U1 and U5. The spiral pulse signal of the scanning unit U3, U7 is generated by a delay time of 2×Ts relative to the spiral pulse signal of the scanning unit U1, U5, and the spiral pulse signal of the scanning unit U4, U8 is delayed by the spiral pulse signal of the scanning unit U1, U5. ×Ts is generated. In addition, the generation timings of the secondary origin signals ZP1, ZP5 of the scanning units U1 and U5 are shifted by 1/2 phase of 1 cycle one by one, and the generation timings of the secondary origin signals ZP2, ZP6 of the scanning units U2 and U6 are also shifted one cycle by one. The 1/2 phase. Similarly, the generation timings of the secondary origin signals ZP3 and ZP7 of the scanning units U3 and U7 and the generation timings of the secondary origin signals ZP4 and ZP8 of the scanning units U4 and U8 are respectively shifted by 1/2 phase of 1 cycle.

In addition, in the fourth embodiment described above, although the shape of the polygon mirror PM is an octagon (eight reflecting surfaces RP), it may be hexagonal, heptagonal, or more than nine-sided. As a result, the scanning efficiency of the polygon mirror PM also changes. Generally speaking, the more the number of reflecting surfaces Np of the polygon mirror PM, the greater the scanning efficiency of a reflecting surface RP of the polygon mirror PM, the smaller the number of reflecting surfaces Np, the greater the scanning efficiency of the polygon mirror PM The smaller.

The maximum scanning rotation angle range α of the polygon mirror PM that can project and scan the spot light SP on the substrate FS is based on the incident angle of the fθ lens FT (equivalent to the angle θs in Fig. 32). Therefore, the most appropriate incident angle can be selected The polygon mirror PM with the number of reflecting surfaces Np. As in the above example, in the case of the fθ lens FT with the incident angle (θs) less than 30 degrees, it can also be a twenty-four-sided polygon mirror PM where the reflective surface RP is rotated at half of 15 degrees, or the reflective surface RP is The 12-sided polygon mirror PM that can be rotated by 30 degrees. In this case, in the twenty-four-sided polygon mirror PM, the scanning efficiency (α/β) is greater than 1/2 and less than 1.0, so the twenty-four-sided polygon mirror of each of the six scanning units U1~U6 PM skips five sides to control the scanning mode of spotlight SP. Moreover, in the twelve-sided polygon mirror PM, the scanning efficiency is greater than 1/3 and less than 1/2. Therefore, the twelve-sided polygon mirror PM of each of the six scanning units U1~U6 skips two sides Control the scanning mode of spotlight SP.

(Fifth Embodiment) In the fourth embodiment described above, the scanning (deflection) of the spot light SP is always repeated on every other reflecting surface RP of the polygon mirror PM. However, in the fifth embodiment, the scanning (deflection) of the spot light SP can be arbitrarily switched to achieve the first state where the continuous reflecting surface RP of the polygon mirror PM repeats, and the second state where every other reflecting surface RP of the polygon mirror PM repeats. status. That is, the scanning unit U1 can switch to distribute the light beam LB to the three scanning units Un in a time-sharing manner and to the six scanning units Un in a time-sharing manner before starting the scanning of the spot light SP until the next scan.

Since the scanning efficiency of the polygon mirror PM is 1/3, the scanning of the spot light SP is repeated on the continuous reflecting surface RP of the polygon mirror PM. For example, the scanning unit U1 scans the spot light SP until the next scan During this period, the light beam LB can only be distributed to two scanning units Un other than the scanning unit U1. Therefore, two light beams LB are prepared, and the first light beam LB is distributed to the three scanning units Un in a time-sharing manner, and the second light beam LB is distributed to the remaining three scanning units Un in a time-sharing manner. Therefore, the scanning of the spot light SP is performed by the two scanning units Un in parallel. It is also possible to generate two light beams LB by arranging two light source devices 14', or split the light beam LB from one light source device 14' by a beam splitter or the like to generate two light beams LB. The exposure apparatus EX of the fifth embodiment shown in FIGS. 36 to 40 includes two light source devices 14' (14A', 14B') (refer to FIG. 38). In addition, in the fifth embodiment, the same reference numerals are given to the same configuration as the fourth embodiment described above, and only the different parts are described.

Fig. 36 is a configuration diagram of the beam switching member (beam delivery unit) 20A of the fifth embodiment. The beam switching member 20A, similar to the beam switching member 20 of FIG. 26, has a plurality of selection optical elements AOMn (AOM1~AOM6), a plurality of condenser lenses CD1~CD6, a plurality of mirrors M1~M12, and a plurality of reflections Mirrors IM1~IM6, and a plurality of collimating mirrors CL1~CL6, in addition, there are mirrors M13, M14 and absorbers TR1, TR2. In addition, the absorber TR1 corresponds to the absorber TR of FIG. 26 shown in the fourth embodiment, and absorbs the light beam LB reflected by the mirror M12.

The optical elements AOM1~AOM3 are selected to form an optical element module (first optical element module) OM1, and the optical elements AOM4 to AOM6 are selected to form an optical element module (second optical element module) OM2. The optical elements AOM1 to AOM3 for selection of the first optical element module OM1, as described in the above-mentioned fourth embodiment, are arranged in series along the traveling direction of the light beam LB. Similarly, the optical elements AOM4 to AOM6 for selection of the second optical element module OM2 are also arranged in series along the traveling direction of the light beam LB. In addition, the scanning units U1 to U3 corresponding to the selective optical elements AOM1 to AOM3 of the first optical element module OM1 are set as the first scanning module. In addition, the scanning units U4 to U6 corresponding to the selective optical elements AOM4 to AOM6 of the second optical element module OM2 are set as the second scanning module. The scanning units U1 to U3 of the first scanning module and the scanning units U4 to U6 of the second scanning module are arranged in a predetermined configuration relationship as explained in the fourth embodiment.

In the fifth embodiment, the mirrors M6, M13, and M14 constitute a configuration switching member (movable member) SWE in the traveling direction of the light beam LB, and the configuration switching member (movable member) SWE switches the first optical element module OM1 and the second optical The first arrangement state where the element modules OM2 are arranged side by side, the second arrangement state where the first optical element module OM1 and the second optical element module OM2 are arranged in line. The configuration switching member SWE has a sliding member SE supporting the mirrors M6, M13, M14, and the sliding member SE can move in the X direction relative to the supporting member IUB. The movement of the sliding member SE (configuration switching member SWE) in the X direction is performed by the actuator AC (refer to FIG. 38). This actuator AC is driven by the control of the drive control part 352a (refer to FIG. 38) of the light beam switching member 352.

In the first arrangement state, the light beams LB from the two light source devices 14' (14A', 14B') enter each of the first optical element module OM1 and the second optical element module OM2 in parallel. In the second arrangement state, the light beam LB from one light source device 14' (14A') enters the first optical element module OM1 and the second optical element module OM2. That is, in the second arrangement state, the light beam LB transmitted through the first optical element module OM1 enters the second optical element module OM2. FIG. 36 shows the state when the first optical element module OM1 and the second optical element module OM2 are arranged in a second arrangement state in line by the arrangement switching member SWE. That is, in the second arrangement state, all the optical elements AOM1 to AOM6 for selection of the first optical element module OM1 and the second optical element module OM2 are arranged in series along the traveling direction of the light beam LB. Fig. 26 shown in the fourth embodiment is the same. Therefore, similar to the above-mentioned fourth embodiment, the optical elements AOMn (AOM1~AOM6) for selection of the first optical element module OM1 and the second optical element module OM2 arranged in series can be selected from the first scanning module And the second scanning module (U1~U6) selects a scanning unit Un in which any deflection beam LBn is incident. In addition, the position of the arrangement switching member SWE at the time of FIG. 36 is referred to as the second position. In the first arrangement state, the light beam LB that enters the first optical element module OM1 (AOM1~AOM3) is referred to as the light beam LBa from the first light source device 14A'. In the first arrangement state, it will enter The light beam of the second optical element module OM2 (AOM4~AOM6) is called the light beam LBb from the second light source device 14B'.

After the arrangement switching member SWE moves to the -X direction side to the first position, the first optical element module OM1 and the second optical element module OM2 are placed in a first arrangement state in which they are arranged side by side. Fig. 37 is a diagram showing the optical paths of the light beams LBa and LBb when the position where the switching member SWE is arranged becomes the first position. In the first arrangement state, the light beam LBa enters the first optical element module OM1, and the light beam LBb enters the second optical element module OM2. In order to distinguish the light beams LB incident on the first optical element module OM1 and the second optical element module OM2, the light beam LB incident on the first optical element module OM1 is represented by LBa, and the light beam LB incident on the second optical element directly is represented by LBb. The beam LB of the component module OM2.

As shown in Fig. 37, after the configuration switching member SWE is moved to the first position, the position of the mirror M6 is shifted in the -X direction, so the light beam LBa reflected by the mirror M6 is not incident on the mirror M7 but incident on the absorber TR2. Therefore, the light beam LBa from the first light source device 14A' that enters the first optical element module OM1 only enters the first optical element module OM1 (optical elements AOM1~AOM3 for selection), and will not enter the second optical element. Component module OM2. That is, the light beam LBa can only pass through the optical elements AOM1 to AOM3 for selection. In addition, after the position where the switching member SWE is arranged becomes the first position, the light beam LBb that is emitted from the second light source device 14B' and travels toward the mirror M13 in the +Y direction is guided to the mirror M7 by the mirrors M13 and M14. Therefore, the light beam LBb can only pass through the second optical element module OM2 (optical elements AOM4 to AOM6 for selection).

Therefore, the first optical element module OM1 can be arranged in-line with three optional optical elements AOM1~AOM3 to make any one of the beams LB1~LB3 deflected from the beam LBa enter the three scans of the first scanning module One of the units U1~U3. In addition, the second optical element module OM2 can make any one of the light beams LB4~LB6 deflected from the light beam LBb enter the three scanning units of the second scanning module by using three optional optical elements AOM4~AOM6 arranged in series. One of U4~U6. Therefore, by arranging the first optical element module OM1 (selective optical elements AOM1~AOM3) and the second optical element module OM2 (selective optical elements AOM4~AOM6) in parallel, the scanning module ( U1~U3) and the second scanning module (U4~U6) respectively select a scanning unit Un that the beam LB enters. In this case, any scanning unit Un of the first scanning module and any scanning unit Un of the second scanning module perform the exposure operation of scanning along the drawing line SLn of the spot light SP in parallel.

The beam switching control unit 352 controls the actuator AC to arrange the arrangement switching member SWE when the scanning (deflection) of the spot light SP overlaps the continuous reflecting surface RP of the polygon mirror PM in the first state (first drawing mode) In the first position. In addition, the light beam switching control unit 352 controls the actuator AC to arrange the arrangement switching member SWE at the second position in the second state (second drawing mode) in which every other reflecting surface RP of the polygon mirror PM is repeated.

FIG. 38 is a diagram showing the configuration of the optical path switching control unit 352 of the fifth embodiment. In Fig. 38, the optical elements AOM1 to AOM6 and the light source devices 14' (14A', 14B') for selection as the control target of the optical path switching control unit 352 are also shown. 14A' denotes the light source device 14' that injects the light beam LBa from the first optical element module OM1, and 14B' denotes the light source device 14' that directly enters the light beam LBb from the second optical element module OM2.

When the switching member SWE is placed in the second position, as shown in Fig. 38, the light beam LBa(LB) from the light source device 14A' can pass (transmit) the optical element for selection in the order of AOM1→AOM2→AOM3→…→AOM6 AOMn, the light beam LBa of the selective optical element AOM6 is incident on the absorber TR1. Furthermore, after the arrangement switching member SWE is moved to the first position, the light beam LBa can pass through the selection optical element AOMn from the light source device 14A' in the order of AOM1→AOM2→AOM3, and enter the absorber TR2 through the light beam LBa of the selection optical element AOM3 . Furthermore, in the state where the configuration switching member SWE is moved to the first position, the light beam LBb from the light source device 14B' can pass through the selection optical element AOMn in the order of AOM4→AOM5→AOM6, and pass the light beam LB of the selection optical element AOM6. Into the absorber TR1. In addition, the configuration switching member SWE in FIG. 38 is a conceptual diagram, and the actual configuration of the configuration switching member SWE shown in FIGS. 36 and 37 is different. In the example shown in FIG. 38, the arrangement switching member SWE is located at the second position, that is, in the second arrangement state in which the first optical element module OM1 and the second optical element module OM2 are arranged in series, indicating the optical element AOM5 for selection When it is ON. Thereby, the light beam LBa from the light source device 14A' enters the scanning unit U5 by the light beam LB5 deflected by diffraction.

The beam switching control unit 352 has a driver circuit DRVn (DRV1~DRV6) for driving each of the optical elements AOM1~AOM6 for selection with ultrasonic (high frequency) signals, and based on the origin sensing from each scanning unit Un (U1~U6) The origin signal SZn (SZ1~SZ6) of the OPn generates the secondary origin signal ZPn (ZP1~ZP6) and the secondary origin generation circuit CAan (CAa1~CAa6). The exposure control unit 356 transmits to the driver circuit DRVn (DRV1~DRV6) the information of the ON time Ton for a certain period of time after receiving the sub-origin signal ZPn (ZP1~ZP6) to turn on the selection optical elements AOM1~AOM6. The driver circuit DRV1, after the sub-origin signal ZP1 is transmitted from the sub-origin generating circuit CAa1, turns the selection optical element AOM1 into the ON state during the ON time Ton. Similarly, the driver circuits DRV2~DRV6, after the sub-origin signals ZP2~ZP6 are transmitted from the sub-origin generating circuits CAa2~CAa6, the optical elements for selection AOM2~AOM6 are turned on during the ON time Ton. The exposure control unit 356 changes the length of the ON time Ton accordingly when changing the rotation speed of the polygon mirror PM. In addition, the driver circuits DRVn (DRV1 to DRV6) are similarly provided in the beam switching control unit 352 in FIG. 33 of the above-mentioned fourth embodiment.

The secondary origin generating circuit CAan (CAa1 to CAa6) has a logic circuit LCC and a delay circuit 332. The logic circuit LCC of the secondary origin generating circuit CAan (CAa1~CAa6) is input with the origin signal SZn (SZ1~SZ6) from the origin sensor OPn of each scanning unit Un (U1~U6). That is, the logic circuit LCC of the secondary origin generating circuit CAa1 is input with the origin signal SZ1, and similarly, the logic circuit LCC of the secondary origin generating circuits CAa2 to CAa6 is input with the origin signals SZ2 to SZ6. In addition, a status signal STS is input to the logic circuit LCC of each secondary origin generating circuit CAan (CAa1~CAa6). This state signal (logical value) STS is set to "1" when the continuous reflecting surface RP of the polygon mirror PM repeats in the first state, and when every other reflecting surface RP of the polygon mirror PM repeats the second state In the case of status, set it to "0". This status signal STS is transmitted from the exposure control unit 356.

Each logic circuit LCC generates an origin signal SZn' (SZ1'~SZ6') according to the input origin signal SZn (SZ1~SZ6), and outputs it to each delay circuit 332. Each delay circuit 332 delays the input origin signal SZn' (SZ1'~SZ6') by the time Tpx, and outputs the secondary origin signal ZPn (ZP1~ZP6).

Figure 39 is a diagram showing the composition of the logic circuit LCC that inputs the origin signal SZn (SZ1~SZ6) and the status signal STS. The logic circuit LCC is composed of a 2-input OR gate LC1, a 2-input AND gate LC2, and a single-shot pulse generator LC3. The status signal STS is applied as an input signal of one of the OR gate LC1. The output signal (logical value) of the OR gate LC1 is applied as the input signal of one side of the AND gate LC2, and the origin signal SZn is applied as the input signal of the other side of the AND gate LC2. The output signal (logical value) of the AND gate LC2 is input to the delay circuit 332 as the origin signal SZn'. The single-shot pulse generator LC3 generally outputs the signal SDo with the logical value "1", but if the origin signal SZn' (SZ1'~SZ6') is generated, the signal SDo with the logical value "0" will be output for a certain time Tdp . That is, if the origin signal SZn' (SZ1'~SZ6') is generated in the single-shot pulse generator LC3, the logical value of the signal SDo will be reversed for a certain period of time Tdp. The time Tdp is set to a relationship of 2×Tpx>Tdp>Tpx, and preferably, set to Tdp≒1.5×Tpx.

FIG. 40 is a timing diagram illustrating the operation of the logic circuit LCC of FIG. 39. The left half of Fig. 40 shows the scanning of the spot light SP performed by each scanning unit Un (U1~U6) without skipping the surface but the first state of the continuous reflective surface RP, and the right half shows each scan The scanning of the spot light SP performed by the unit Un (U1~U6) skips the second state of a reflective surface RP. In addition, in FIG. 40, for the convenience of description, it is assumed that the angles ηj between the adjacent reflecting surfaces RP (for example, the reflecting surface RPa and the reflecting surface RPb) of the polygon mirror PM have no error, and the origin signal SZn is correctly generated at intervals of time Tpx. .

When the scanning of the spot light SP does not skip the surface and the reflective surface RP is in the first state, since the state signal STS is "1", the output signal of the OR gate LC1, regardless of the state of the signal SDo, is always "1" . Therefore, the output signal (origin signal SZn') output from the AND gate LC2 and the origin signal SZn are output at the same timing. That is, in the first state, the origin signal SZn and the origin signal SZn' can be regarded as the same. In the first state, the time interval Tpx of the origin signal SZn' applied to the single-shot pulse generator LC3 is less than the time Tpd. Therefore, the signal SDo from the single-shot pulse generator LC3 remains "0". In addition, even if the angles ηj between the reflecting surfaces RP of the polygon mirror PM are different, the time interval of the origin signal SZn' will not change if it is less than the time Tpd.

If it becomes the second state where the scanning of the spot light SP skips a reflective surface RP, the state signal STS is switched to "0". Therefore, the output signal of the OR gate LC1 becomes "1" only when the signal SDo is "1". When the signal SDo is "1" (in this case, the output signal of the OR gate LC1 is also "1"), if the origin signal SZn is applied (for convenience, this origin signal SZn is called the first The origin signal SZn), in response to this, the AND gate LC2 also outputs the origin signal SZn'. However, if the origin signal SZn' is generated, the signal SDo from the single-shot pulse generator LC3 changes to "0" only for the time Tpd. Therefore, during the time Tpd, both outputs of the OR gate LC1 become "0" signals, so the output signal of the OR gate LC1 remains "0". Therefore, during the time Tpd, the output signal of the AND gate LC2 also maintains "0". Therefore, even if the second origin signal SZn is applied to the AND gate LC2 before the time Tpd has elapsed, the AND gate LC2 will not output the origin signal SZn'.

Then, after the time Tpd has elapsed, the signal SDo from the single-shot pulse generator LC3 is inverted to "1", so it is the same as the situation of the first origin signal SZn mentioned above, and the third origin is applied after the time Tpd has elapsed. The origin signal SZn' corresponding to the point signal SZn is output from the AND gate LC2. By repeating the above actions, the logic circuit LCC converts the origin signal SZn repeatedly generated by the time Tpx into a 2×time Tpx origin signal SZn' repeatedly generated. From another point of view, the logic circuit LCC generates the origin signal SZn' separated by the pulse of the origin signal SZn repeatedly generated at the time Tpx, that is, the frequency of the origin signal SZn generation sequence is divided Frequency becomes 1/2. In addition, the logic circuit LCC of the sub-origin generating circuit CAan may be replaced with the frequency divider 330 (FIG. 31) of the sub-origin generating circuit CAn described in the fourth embodiment. In the case of replacing the frequency divider 330, the frequency divider 330 only needs to divide the frequency of the origin signal SZn to 1/2 in the second state, and does not divide the origin signal SZn in the first state. Furthermore, the sub-origin generating circuit Can of the fourth embodiment described above may be replaced with the sub-origin generating circuit CAan of the fifth embodiment. In addition, in the second state, the origin signal SZ1' output from the logic circuit LCC of the secondary origin generating circuit CAa1 and the origin signal SZ4' output from the logic circuit LCC of the secondary origin generating circuit CAa4 are out of phase by a half cycle. Similarly, the origin signals SZ2', SZ3' output from the logic circuits LCC of the secondary origin generating circuits CAa2, CAa3 and the origin signals SZ5', SZ6' output from the logic circuits LCC of the secondary origin generating circuits CAa5, CAa6 Stagger the half-cycle phase.

As mentioned above, only by inverting the value of the status signal STS of the logic circuit LCC of each of the secondary origin generating circuits CAa1~CAa6 of the input beam switching control unit 352, the continuous reflection surface RP of the polygon mirror PM can be switched arbitrarily. The first state of the drawing exposure performed by the scanning of the spot light SP, and the second state of the drawing exposure performed by the scanning of the spot light SP over every other reflecting surface RP of the polygon mirror PM.

In addition, in the fifth embodiment, the rotation control of the polygon mirror PM of each scanning unit Un (U1 to U6) is the same as the fourth embodiment described above. That is, the origin signal SZn (SZ1~SZ6) output from the origin sensor OPn of each scanning unit Un(U1~U6) has the relationship shown in Fig. 34, and each scanning unit Un(U1~ U6) The rotation of the polygon mirror PM. Therefore, the scanning unit U1~U3 can scan the spot light SP repeatedly in the order of U1→U2→U3 when the scanning of the spot light SP does not skip the surface and the reflective surface RP is in the first state. The scanning unit U4~ U6 can scan the point light SP repeatedly in the order of U4→U5→U6.

Preferably, the time Tpd set in the single-shot pulse generator LC3 can be changed according to the information of the rotation speed of the polygon mirror PM from the exposure control unit 356. Also, it is not limited to skipping one side. Even if the spot light SP is scanned by skipping two sides, if it is the configuration of Fig. 39, only the time Tpd is set to the relationship of (n+1)×Tpx>Tdp>n×Tpx. Can correspond. In addition, n represents the number of skipped reflective surfaces RP. For example, the case where n is 2 means that the scanning of the point light SP is performed every two reflection surfaces RP, and the case where n is 3 means that the scanning of the point light SP is performed every three reflection surfaces RP.

Next, in the first state where the scanning of the spot light SP is performed on the reflective surface RP without jumping the surface, the drawing data output control unit 354 performs the drawing bit of the driving circuit 206a of the light source device 14A', 14B'. Output control of column data Sdw. In the first state, the first scanning module (scanning units U1~U3) and the second scanning module (scanning units U4~U6) are used to scan the spot light SP in parallel. Therefore, the drawing data output control unit 354 outputs the sequence data DL1 to DL3 corresponding to each of the scanning units U1 to U3 to the drive circuit 206a of the light source device 14A' that emits the light beam LBa that enters the first scanning module. The drawing bit row data Sdw is combined with the sequence data DL4~DL6 corresponding to each of the scanning units U4~U6 to the drive circuit 206a of the light source device 14B' that emits the light beam LBb that enters the second scanning module. Draw bit row data Sdw.

In addition, the drawing data output control unit 354 shown in FIG. 35 can be used almost as it is when the status signal STS is either "1" or "0". In the first state where the scanning of the spot light SP does not jump and the reflective surface RP is performed, after the secondary origin signal ZP1 is generated, the secondary origin signal ZP2 is generated after the time Ts, and then the secondary origin signal is generated after the time Ts. Signal ZP3. Therefore, the sequence data DL1~DL3 are output repeatedly in the order of DL1→DL2→DL3 by the counter parts CN1~CN3. The sequence data DL1 to DL3 output in sequence from the gates GT1 to GT3 that are opened in a certain time (ON time Ton) after the application of the secondary origin signals ZP1 to ZP3 are input to the first light source device 14A as the drawing bit row data Sdw 'The drive circuit 206a. Similarly, when the scanning of the spot light SP does not skip the surface and the reflective surface RP is in the first state, after the secondary origin signal ZP4 is generated, the secondary origin signal ZP5 is generated after the time Ts, and then the secondary origin signal ZP5 is generated after the time Ts The secondary origin signal is ZP6. Therefore, the counter parts CN4~CN6 repeatedly output the sequence data DL4~DL6 in the order of DL4→DL5→DL6. The sequence data DL4~DL6 output sequentially by the gates GT4~GT6 that are opened in a certain time (ON time Ton) after the application of the secondary origin signals ZP4~ZP6 are input to the second light source device 14B as the drawing bit row data Sdw 'The drive circuit 206a.

Next, the offset of sequence data DL1~DL6 in the first state will be briefly explained. The shift of the sequence data DL1 in the row direction is performed after the sequence data DL1 is sent out, and then the scanning unit U2 corresponding to the scanning unit U2 is performed at the timing of the generation of the secondary origin signal ZP2. The shift of the sequence data DL2 in the row direction is performed after the sequence data DL2 is sent out, and then the scanning unit U3 corresponding to the scanning unit U3 generates the secondary origin signal ZP3. The shift of the sequence data DL3 in the row direction is performed after the sequence data DL3 is sent out, and then the scanning unit U1 corresponding to the scanning unit U1 generates the secondary origin signal ZP1. In addition, the shift of the sequence data DL4 in the column direction is performed after the sequence data DL4 is sent out, and then the scanning unit U5 corresponding to the scanning unit U5 generates the timing sequence of the secondary origin signal ZP5. The shift of the sequence data DL5 in the row direction is performed after the sequence data DL5 is sent out, and then the scanning unit U6 corresponding to the scanning unit U6 generates the time sequence of the secondary origin signal ZP6. The shift of the sequence data DL6 in the row direction is performed after the sequence data DL6 is sent out, and then the scanning unit U4 corresponding to the scanning unit U4 generates the secondary origin signal ZP4. In addition, the output control of the drawing bit string data Sdw in the second state is the same as that of the fourth embodiment, so the description is omitted. In addition, the output control of the drawing bit string data Sdw in the first state is the same as the control principle of the first to third embodiments, except that the sequence of the output sequence data DLn is different. That is, the sequence data DLn is output in the order of DL1→DL3→DL5, DL2→DL4→DL6, or the sequence data DLn is output in the order of DL1→DL2→DL3, DL4→DL5→DL6.

In addition, in the second state where the scanning of the spot light SP skips a reflective surface RP, compared to the first state where the reflective surface RP does not jump, the spot light of each scanning unit Un (U1~U6) The scan start interval of SP is longer. For example, in the case of skipping a reflective surface RP to scan the spot light SP, the scanning start interval of the spot light SP of each scanning unit Un (U1~U6) is doubled compared to the case of no surface jumping. Furthermore, in the case of skipping the two reflecting surfaces RP, the scanning start interval of the spot light SP becomes three times as compared with the case of not performing the surface skipping. Therefore, if the rotation speed of the polygon mirror PM and the transport speed of the substrate FS are made the same in the first state and the second state, the exposure results will be different in the first state and the second state.

Therefore, the exposure control section 356 may also have the ability to change (correct) at least one of the rotation speed of the polygon mirror PM and the conveyance speed of the substrate FS in the first state and the second state, so that the first state and the second state The exposure result becomes the same control mode. For example, when the scanning start interval of the spot light SP in the first state and the scanning start interval of the spot light SP in the second state are 1:2, the exposure control section 356 uses the rotation speed of the polygon mirror PM in the first state The rotation control unit 350 is controlled so that the ratio of the rotation speed of the polygon mirror PM in the second state becomes 1:2. Specifically, the rotation speed of the polygon mirror PM in the first state is 20,000 rpm, and the rotation speed of the polygon mirror PM in the second state is 40,000 rpm. At the same time, the light-emitting frequency FS of the light beam LB (LBa, LBb) of the light source device 14' (14A', 14B') is set to, for example, 200 MHz in the first state and 400 MHz in the second state. Thereby, the interval of the generation timing of the secondary origin signal ZPn in the first state can be substantially the same as the interval of the generation timing of the secondary origin signal ZPn in the second state.

Also, for example, the exposure control unit 356 may have a case where the scanning start interval of the spot light SP in the first state and the scanning start interval of the spot light SP in the second state is 1:2, or in the first state The ratio of the transfer speed of the substrate FS to the transfer speed of the substrate FS in the second state becomes a control mode of 2:1 to control the rotation speed of the driving rollers R1~R3 and the rotating drum DR. Either the control mode (scanning correction mode) that corrects the rotation speed of the polygon mirror PM or the luminous frequency Fs (the frequency of the clock signal LTC), or the control mode that corrects the transfer speed of the substrate FS (transfer correction mode) ，It can make the X-direction space between the drawing lines SLn (SL1~SL6) on the substrate FS in the first state and the X-direction space between the drawing lines SLn (SL1~SL6) on the substrate FS in the second state It becomes the same interval (for example, 1.5 μm). Furthermore, in the first state and the second state, the pattern data (bit data) of each of the memory sections BM1 to BM6 stored in the drawing data output control section 354 can be used directly without modification.

In addition, it is also possible to use both of the scanning correction mode and the conveyance correction mode to perform correction so that the pattern drawn on the substrate FS in the first state and the pattern drawn on the substrate FS in the second state become equivalent. For example, in the first state (when beam scanning is performed on each reflecting surface RP of the polygon mirror PM), the rotation speed of the polygon mirror PM is 20,000 rpm, and the light beam LB of the light source device 14' (14A', 14B') When the luminous frequency Fs is 200MHz and the transfer speed of the substrate FS is 5mm/sec, the transfer speed of the substrate FS can also be set in the second state (when every other reflecting surface RP of the polygon mirror PM performs beam scanning) It is not a half deceleration but a -25% deceleration of 3.75mm/sec. The rotation speed of the polygon mirror PM is set to 1.5 times 30,000 rpm, and the light beam LB's luminous frequency Fs is set to 1.5 times 300MHz. As described above, if both of the scanning correction mode and the conveying correction mode are combined, in the second state, it is not necessary to reduce the conveying speed of the substrate FS to half, and it is possible to suppress an extreme decrease in productivity.

In addition, in the fifth embodiment, as explained in the above-mentioned fourth embodiment, the number of scanning units Un that distributes the light beams LBa and LBb may be arbitrarily changed. In addition, the scanning efficiency of more mirrors PM can be arbitrarily changed. Furthermore, in the fifth embodiment, the scanning efficiency of the polygon mirror PM is 1/3 and the number of scanning units Un is six, so the six optional optical elements AOMn (AOM1~AOM6) are divided into two optical element modules OM1, OM2, correspondingly divide the six scanning units Un (U1~U6) into two scanning modules. However, when the scanning efficiency of the polygon mirror PM is 1/M, and the number of the scanning unit Un and the optional optical element AOMn is Q, only the Q optional optical elements AOMn can be divided into Q/M optical element modules OM1, OM2 , …, just divide the Q scanning units Un into Q/M scanning modules. In this case, it is preferable that the number of optical elements AOMn contained in each of the optical element modules OM1, OM2, ... is equal, and the number of scanning units Un contained in each of the Q/M scanning modules Are also equal. In addition, this Q/M is preferably a positive number. That is, it is preferable that Q is a multiple of M.

For example, if the scanning efficiency of the polygon mirror PM is 1/2, and the number of scanning units Un and optional optical elements AOMn is six, the six optional optical elements AOMn can be equally divided into three optical element modules OM1, OM2 , OM3, just divide the six scanning units Un into three scanning modules. In addition, in the first state, as long as three optical element modules OM1, OM2, OM3 are arranged in parallel, the light beams LB (in this case, LBa, LBb, LBc) from the three light source devices 14' are injected into three in parallel Each of the optical element modules OM1, OM2, OM3 is sufficient. In the second state, as long as three optical element modules OM1, OM2, OM3 are arranged in series, the light beam LB from one light source device 14' passes through and enters sequentially Three optical component modules OM1, OM2, OM3 are enough.

As described above, in the fifth embodiment, the light beam switching control unit 352 switches the deflection (scanning) of the light beam LBn (point light SP) by the polygon mirror PM of the scanning unit Un to the continuous reflecting surface RP of the polygon mirror PM Control the light beam switching member 20A in either of the repeated first state (first drawing mode) and the second state (second drawing mode) repeated for every at least one reflecting surface RP of the polygon mirror PM, in order Perform one-dimensional scanning of each spot light SP of a plurality of scanning units Un. Thereby, the same effect as the above-mentioned fourth embodiment can be obtained, and it is possible to switch between scanning the spot light SP by jumping the surface or scanning the spot light SP without jumping the surface.

In the first state, when the scanning efficiency (α/β) of the polygon mirror PM is less than 1/2, the scanning unit Un corresponding to the inverse number of the scanning efficiency is grouped into one scanning module, and the grouping is used For the plural scanning modules, one scanning unit Un within each scanning module performs one-dimensional scanning of the spot light SP. Thereby, the same number of the drawing lines SLn among the plurality of drawing lines SLn can be scanned with the spot light SP at the same time as the number of scanning modules. Also, in the second state, since the control is performed to scan every at least one reflecting surface RP of the polygon mirror PM, even if it is a number that is the inverse of the scanning efficiency (α/β) of the corresponding polygon mirror PM A large number of scanning units Un can also effectively utilize the light beam LB, and at the same time, all the scanning units Un scan the spot light SP along the drawing line SLn.

In the above first state, the light beams LBa, LBb from the light source devices 14A', 14B' are incident on the two scanning modules in parallel, so the optical elements AOM1~AOM6 for selection in the beam switching member 20A Each of them is switched ON/OFF by the light beam switching control unit 352 in a grouped scanning module unit to inject the light beams LB1 to LB6 corresponding to the scanning units U1 to U6 in a time-sharing manner.

The arrangement switching means SWE provided in the beam switching means 20A switches the first arrangement state and the second arrangement state, and the first arrangement state distributes the light beam LBa from the first light source device 14A' as light beams LB1 to LB3 to six scans In the unit U1~U6, each of the three scanning units U1~U3, and the light beam LBb from the second light source device 14B' is distributed as the light beam LB4~LB6 to each of the other three scanning units U4~U6, three options The optical elements AOM1~AOM3 are connected in series along the optical path of the light beam LBa and the selective optical elements AOM4~AOM6 are connected in series along the optical path of the light beam LBb. This second configuration state allows the light beam LBa from a first light source device 14A' As a way of distributing the light beams LB1 to LB6 to each of the six scanning units U1 to U6, the six selective optical elements AOM1 to AOM6 are connected in series along the optical path of the light beam LBa.

Therefore, in the first state, the first configuration state is set by the configuration switching member SWE, and each of the scanning units U1~U6 can repeat the scanning of the spot light SP on the continuous reflecting surface RP of the polygon mirror PM, and six Two of the scanning units U1~U6 can scan the spot light SP almost simultaneously. In the second state, the second placement state is set by the placement switching member SWE. Although the light beam scans every at least one reflecting surface RP of the polygon mirror PM, it can be all repeated by six scanning units U1~U6. Point light SP scan.

Therefore, according to the fifth embodiment, in the initial installation of the drawing device, it is necessary to use a light source device 14A' to set the configuration switching member SWE in the second configuration state, and then increase the transfer speed of the substrate FS , As long as the second light source device 14B' is added, the configuration switching member SWE can be set to become the first configuration state. On the hardware, the drawing device can be easily operated by adding the light source device and switching the configuration switching member SWE. upgrade.

In addition, in each of the above embodiments, the reflection surface RP, which is deviated from the light beam LBn of the polygon mirror PM, is used to detect the origin signal SZn. However, the reflection surface RP is used to detect the origin signal SZn. The deflection reflecting surface RP of LBn performs detection of the origin signal SZn. In this case, it is not necessary to delay the origin signal SZn or the origin signal SZn' obtained from the origin signal SZn by the time Tpx, so it is only necessary to make the origin signal SZn or the origin signal SZn' as the sub origin signal ZPn.

In addition, in the above-mentioned fourth and fifth embodiments, the drawing bit row data Sdw is used to switch the electro-optical element 206 as the drawing light modulator of the light source device 14' (14A', 14B'), but it may be as 2 As in the embodiment, the drawing optical element AOM is used as the drawing light modulator. This drawing optical element AOM is an acousto-optic modulator (AOM: Acousto-Optic Modulator). That is, in the above-mentioned fourth embodiment, the drawing optical element AOM may be arranged between the light source device 14' and the initial selection optical element AOM1, so that the light beam from the light source device 14' transmitted through the drawing optical element AOM LB injection selection optical element AOM1. In this case, the drawing optical element AOM is switched according to the drawing bit row data Sdw. Even in this case, the same effect as the above-mentioned fourth embodiment can be obtained.

In addition, in the above-mentioned fifth embodiment, between the first light source device 14A' and the first optical element module OM1 for the selection optical element AOM1, between the second light source device 14B' and the second optical element module OM2 In the initial stage, the optical elements AOM (AOMa, AOMb) for drawing are arranged between the optical elements AOM4 for selection. That is, the light beam LBa from the light source device 14A' transmitted through the drawing optical element AOMa is incident on the selection optical element AOM1, and the light beam LBb from the light source device 14B' transmitted through the drawing optical element AOMb is incident on the selection optics Component AOM4. In this case, in the first state, the drawing optical element AOMa is switched based on the drawing bit row data Sdw composed of serial data DL1~DL3, and the drawing optical element AOMb is based on the drawing bit row data Sdw composed of serial data DL4~DL6. Switch. In the second state, only the optical element AOMa for drawing is switched based on the drawing bit row data Sdw composed of the serial data DL1 to DL6.

Moreover, as in the first embodiment, the scanning unit Un may be provided with a drawing optical element AOM as a drawing light modulator. In this case, the drawing optical element AOM may be provided on the front side of the mirror M20 (refer to FIG. 28) of each scanning unit Un. The drawing optical element AOM of each scanning unit Un (U1~U6) is switched according to each sequence data DLn (DL1~DL6). For example, the drawing optical element AOM of the scanning unit U3 is switched according to the serial data DL3.

(The sixth embodiment) Fig. 41 shows the configuration of the beam switching member (beam delivery unit) 20B of the sixth embodiment. Here, it is assumed that the beam LBw (LB) that is emitted from one light source device 14' and then enters the beam switching member 20B becomes parallel circularly polarized light beam. The beam switching member 20B is provided with six selective optical elements AOM1~AOM6, two absorbers TR1, TR2, six lens systems CG1~CG6, mirrors M30, M31, M32, condenser lens CG0, and polarization splitter BS1 and two drawing optical elements (acousto-optic modulating elements) AOMa, AOMb. In addition, the same reference numerals are given to the same configuration as the fourth embodiment or the fifth embodiment.

The light beam LBw incident on the light beam switching member 20B passes through the condenser lens CG0 and then is split into a linear P-polarized light beam LBp and a linear S-polarized light beam LBs by the polarization beam splitter BS1. The S-polarized light beam LBs reflected by the polarization beam splitter BS1 enters the drawing optical element AOMa. The light beam LBs incident on the drawing optical element AOMa is condensed into the beam waist width in the drawing optical element AOMa by the condensing action of the condenser lens CG0. The drawing bit row data Sdw(DLn) shown in FIG. 19 is applied to the drawing optical element AOMa through the driver circuit DRVn. This drawing bit row data Sdw, here is the sequence data DL1, DL3, DL5 corresponding to each of the odd-numbered scanning units U1, U3, and U5 to synthesize the latter. Therefore, the drawing optical element AOMa turns ON when the drawing bit row data Sdw(DLn) is "1", so that the primary diffracted light of the incident light beam LBs is used as a deflection drawing light beam (intensity adjustment The beam) is emitted toward the mirror M31. The drawing light beam reflected by the mirror M31 enters the selection optical element AOM1 through the lens system CG1. Moreover, when the drawing bit row data Sdw(DLn) is "0", the zero-order light (LBs) emitted from the drawing optical element AOMa is reflected by the mirror M31, but it will not enter the subsequent lens system CG1 Angle travel. In addition, the lens system CG1 condenses the drawing light beam scattered and emitted from the drawing optical element AOMa by the diffraction part of the selection optical element AOM1 into a beam waist width.

The drawing light beam transmitted through the selection optical element AOM1 passes through the lens system CG3 which is the same as the lens system CG1 and enters the selection optical element AOM3, and the drawing light beam transmitted through the selection optical element AOM3 is transmitted through the lens system CG5 which is the same as the lens system CG1 Optical element AOM5 for injection selection. Figure 41 shows the following state, that is, three selection optical elements AOM1, AOM3, AOM5 are arranged in line along the beam path, of which only the selection optical element AOM3 is turned on, and the drawing optical element AOMa intensity modulation is drawn The light beam enters the corresponding scanning unit U3 as the light beam LB3. In addition, the lens systems CG1, CG3, and CG5 are equivalent to the combination of a collimator lens CL and a condenser lens CD in Fig. 26 or Fig. 36.

On the other hand, the P-polarized light beam LBp transmitted through the polarization beam splitter BS1 is reflected by the mirror M30 and then enters the drawing optical element AOMb. The light beam LBp incident on the drawing optical element AOMb is condensed into the beam waist width in the drawing optical element AOMb by the condensing action of the condenser lens CG0. The drawing bit row data Sdw(DLn) shown in FIG. 19 is applied to the drawing optical element AOMb through the driver circuit DRVn. The bit row data Sdw is drawn, and the sequence data DL2, DL4, DL6 corresponding to each of the even-numbered scanning units U2, U4, U6 are synthesized into the latter. Therefore, the drawing optical element AOMb is turned on when the drawing bit row data Sdw(DLn) is "1", and the primary diffracted light of the incident light beam LBp is used as the deflection drawing light beam (intensity adjustment The beam) is emitted toward the mirror M32. The drawing light beam reflected by the mirror M32 enters the selection optical element AOM2 through the same lens system CG2 as the lens system CG1. Also, when the drawing bit row data Sdw(DLn) is "0", the zero-order light (LBp) emitted from the drawing optical element AOMb is reflected by the mirror M32, but it will not enter the subsequent lens system CG2 Angle travel. In addition, the lens system CG2 condenses the drawing light beam scattered and emitted from the drawing optical element AOMb by the diffraction part of the selection optical element AOM2 into a beam waist width.

The drawing light beam transmitted through the selection optical element AOM2 passes through the lens system CG4 which is the same as the lens system CG1 and enters the selection optical element AOM4, and the drawing light beam transmitted through the selection optical element AOM4 is transmitted through the lens system CG6 which is the same as the lens system CG1 Optical element AOM6 for injection selection. Figure 41 shows the following state, that is, three selection optical elements AOM2, AOM4, AOM6 are arranged in line along the beam path, of which only the selection optical element AOM2 is turned on, and the drawing optical element AOMb intensity modulation is drawn The light beam enters the corresponding scanning unit U2 as a light beam LB2. In addition, the lens systems CG2, CG4, CG6 are equivalent to the combination of a collimator lens CL and a condenser lens CD in Fig. 26 or Fig. 36.

If the beam switching member (beam delivery unit) 20B of FIG. 41 is used, the light beam LBw from one light source device 14' can be split into two by the polarizing beam splitter BS1, and the light beam LBs from one of them can be drawn by the optical The drawing light beams (LB1, LB3, LB5) generated by the element AOMa are sequentially incident on any one of the odd-numbered scanning units U1, U3, U5, so that the light beam LBp from the other side divided by the polarization beam splitter BS1 is made by the drawing optics The drawing beams (LB2, LB4, LB6) generated by the component AOMb are sequentially incident on any one of the even-numbered scanning units U2, U4, U6.

In this sixth embodiment, the polarizing beam splitter BS1 divides the light beam LBw from the light source device 14' into two, and then uses the drawing optical elements AOMa, AOMb to modulate the intensity of the light beam LB based on the pattern data. If it is assumed that the attenuation of the point light SP of each of the six scanning units U1~U6 at the polarizing beam splitter BS1 is -50%, the attenuation of the optical elements AOMa, AOMb and each selection optical element AOMn is -20 %. The attenuation in each scanning unit U1~U6 is -30%, which becomes about 22.4% of the intensity (100%) of the original beam LBw. However, when the scanning efficiency of the polygon mirror PM of each of the six scanning units U1~U6 is less than 1/3, when the light beam LBw from one light source device 14' is used, one reflecting surface RP of the polygon mirror PM will not be skipped The beam scanning can be performed with the pattern drawing of the scanning of the spot light SP in each of the six drawing lines SLn.

(Modification 1) As in the sixth embodiment, when the polarization directions of the light beams LBs incident on the odd-numbered optical elements AOM1, AOM3, and AOM5 and the light beams LBp incident on the even-numbered optical elements AOM2, AOM4, AOM6 are orthogonal, the odd number The optical element AOMn for number selection and the optical element AOMn for even number selection must be arranged to be relatively rotated by 90 degrees around the beam incident axis. FIG. 42 shows, for example, a configuration in which the selection optical element AOM3 of the odd-numbered selection optical elements AOM1, AOM3, and AOM5 is rotated by 90 degrees relative to the even-numbered selection optical element AOMn. The optical element AOM3 for selection injects the drawing beam of S-polarized light passing through the lens system CG3, so the direction with high diffraction efficiency becomes the Y direction parallel to the XY plane. That is, the selection optical element AOM3 is rotated by 90 degrees so that the periodic direction of the diffraction grating generated in the selection optical element AOM3 becomes the Y direction.

With the arrangement of the optical element AOM3 for selection described above, when the optical element AOM3 for selection is in the ON state, the emitted light beam LB3 is deflected and travels obliquely in the Y direction with respect to the traveling direction of the zero-order light. Therefore, a mirror IM3a, which separates the light beam LB3 from the optical path of the 0-order light, and the light beam LB3 passes through the opening TH3 of the support member IUB in the Z direction, is provided to reflect the light beam LB3 from the selection optical element AOM3 in the XY plane, And a mirror IM3b that reflects in the -Z direction so that the light beam LB3 reflected by the mirror IM3a passes through the opening TH3. Regarding each of the other odd-numbered optical elements AOM1 and AOM5, similarly, a group of mirrors IM1a and IM1b, and a group of mirrors IM5a and IM5b are provided. Furthermore, in the configuration of FIG. 41, since the polarization directions of the light beams LBs, LBp incident on the drawing optical elements AOMa, AOMb are orthogonal, the drawing optical elements AOMa, AOMb are relatively rotated by 90 degrees around the beam incident axis Relationship configuration.

However, if the polarization beam splitter BS1 in FIG. 41 is an amplitude split beam splitter or a half mirror, if the polarization direction of the light beam LBw is only one direction (for example, P polarization), the drawing optical element is not required One of AOMa, AOMb, odd number selection optical element AOMn and even number selection optical element AOMn are arranged to be relatively rotated by 90 degrees as shown in FIG. 42.

(Modification 2) In the sixth embodiment, the scanning units U1~U6 corresponding to each of the six selection optical elements AOM1~AOM6 all scan all the reflecting surfaces RP of the polygon mirror PM along each of the drawing lines SL1~SL6. . Therefore, the light beams (the light beams modulated by the drawing optical element AOMa) that pass through the odd-numbered selection optical elements AOM1, AOM3, AOM5 in sequence are incident, the selection optical element AOM5 and the absorber in Fig. 41 Three optional optical elements AOM7, AOM9, and AOM11 are further arranged in series between TR2, so that the light beams from the even-numbered optional optical elements AOM2, AOM4, AOM6 (the light beam modulated by the drawing optical element AOMb) are emitted in sequence. In this way, three optional optical elements AOM8, AOM10, and AOM12 are further arranged in series between the selective optical element AOM6 and the absorber TR1. In addition, six scanning units U7~U12 introduced by the light beams LB7~LB12 of each deflection (switching) of the optical elements AOM7~AOM12 are added, and a total of 12 scanning units U1~U12 are arranged in the width direction of the substrate FS (Y direction). Thereby, continuous drawing exposure of 12 drawing lines SL1~SL12 can be performed, and the maximum exposure width in the Y direction can be doubled.

In this case, when the scanning efficiency of the polygon mirror PM of each scanning unit U1~U12 is less than 1/3, the grouping is the odd-numbered scanning unit U1, U3, U5, U7, U9, U11 of the first drawing module And grouped into even-numbered scanning units U2, U4, U6, U8, U10, U12 of the second drawing module all make the light beam LB scan every reflection surface RP of the polygon mirror PM. In this way, even when the width of the substrate FS in the Y direction is increased, only the scanning unit U7~U12, the optional optical elements AOM7~AOM12, etc. can be added to draw the pattern on the larger exposure area W (Figure 5, Figure 25) . As mentioned above, adding six scanning units U7~U12 and optional optical elements AOM7~AOM12 to form a configuration of 12 scanning units U1~U12, the same can be applied to the description using the above fifth embodiment (Figure 36~Figure 38) The case of two light source devices 14A', 14B'.

(Modification 3) Fig. 43 shows the transfer form of the substrate FS of the modification 3 and the arrangement relationship of the scanning unit Un (drawing line SLn). Here, as in the modification 2, 12 scanning units U1 to U12 are provided to enable each scanning unit The drawing lines SL1~SL12 of Un continue to draw and expose in the Y direction, and are arranged on the rotating drum DR. Furthermore, assuming that the length of the rotating drum DR or various rollers R1~R3, RT1, RT2, etc. in the rotation axis direction (Y direction) of the substrate transport mechanism 12 shown in FIG. 23 is Hd, the continuous drawing of the 12 scanning units Un can be exposed The maximum drawing width in the Y direction is Sh (Sh<Hd), and the maximum support width of the exposed substrate FS is Td. In Modification 3, each of the 12 scanning units U1 to U12 corresponding to each of the 12 drawing lines SL1 to SL12, from one light source using a beam splitter or a half mirror as shown in Figure 41 (the sixth embodiment) The light beam LBw of the device 14' is divided into two beam switching means (beam delivery unit) 20B, or the light beam LBa from each of the two light source devices 14A' 14B' is used as shown in FIG. 38 (fifth embodiment), The beam switching member (beam delivery unit) 20A of the LBb method makes the corresponding 12 beams LB1~LB12 incident in a time-sharing manner. Therefore, for example, when the length of each drawing line SL1 to SL12 in the Y direction is 50 mm, the maximum drawing width becomes 600 mm. As an example, the width of the substrate FS0 with the maximum support width Td can be 650 mm, and the length Hd of the rotating drum DR It becomes about 700mm.

Except for the four alignment microscopes AM1~AM4 (observation area Vw1~Vw4) shown in Figure 24 and Figure 25, the exposure of the substrate FS0 with the same width as the maximum support width Td by the drawing device of Figure 43 , Add three alignment microscopes AM5~AM7 (observation area Vw5~Vw7) in the Y direction. In this case, the alignment microscope AM1 (observation area Vw1) and the alignment microscope AM7 (observation area Vw7) located on both sides of the substrate FS0 in the width direction detect the alignment marks formed on both sides of the substrate FS0 at a certain interval in the X direction. In addition, the alignment microscope AM4 (observation area Vw4) is arranged so as to be located approximately in the center of the maximum support width Td.

Moreover, the drawing lines SL1 to SL6 of each of the 6 scanning units U1 to U6 described in the above embodiments can be used to draw the patterned substrate FS1 in the exposure area W, and the width Td1 is the maximum support width Td of the rotating drum DR About half of the time, the substrate FS1 is approached and transported, for example, toward the -Y direction side of the outer peripheral surface of the rotating drum DR. At this time, each of the alignment marks MK1~MK4 (FIG. 25) on the substrate FS1 can be detected by the observation areas Vw1~Vw4 of the four alignment microscopes AM1~AM4. In addition, in the case of exposure of the substrate FS1, only 6 scanning units U1~U6 can be used. Therefore, each of the scanning units U1~U6 is scanned by the continuous reflecting surface RP of the polygon mirror PM or every other polygon mirror PM. In any mode of the beam scanning of a reflecting surface RP, the point scanning along each drawing line SL1~SL6 can be performed.

For example, as in the fifth embodiment, when the light beams LBa and LBb from each of the two light source devices 14A' and 14B' are used, the light beam LBa from the light source device 14A' is transmitted through the odd-numbered scanning unit U1 in series. , U3, U5, U7, U9, U11 corresponding to each of the selection optical elements AOM1, AOM3, AOM5, AOM7, AOM9, AOM11, grouped in the beam switching member 20A, and from the light source device 14A' The light beam LBa is transmitted through the even-numbered scanning units U2, U4, U6, U8, U10, U12 and corresponding to the selection optical elements AOM2, AOM4, AOM6, AOM8, AOM10, AOM12 in a way, in the beam switching member 20A. Grouping. In addition, during the exposure of the substrate FS1, the three origin signals SZ1, SZ3, SZ5 output from the continuous reflecting surface RP of the polygon mirror PM are repeated in the order of the odd-numbered scanning units U1, U3, U5 to form multiple surfaces The beam scanning mode of the continuous reflecting surface RP of the mirror PM is controlled by the three origin signals SZ2, SZ4, SZ6 outputted by the continuous reflecting surface RP of the polygon mirror PM, and the even numbered scanning units U2, U4 , The sequence of U6 is repeatedly controlled by the beam scanning mode of the continuous reflecting surface RP of the polygon mirror PM.

Furthermore, when exposing the substrate FS which is smaller than the maximum support width Td and larger than the width Td1 of the substrate FS1 and the width Td2, the substrate FS2 is transported in accordance with the center portion of the maximum support width Td of the rotating drum DR. At this time, the exposure area W on the substrate FS2 is drawn by the drawing lines SL3~SL10 of each of the eight continuous scanning units U3~U10 in the Y direction. In this case, the four odd-numbered optical elements AOM3, AOM5, AOM7, AOM9 incident on the light beam LBa (intensity-modulated light beam) from the light source device 14A' sequentially generate light beams LB3, LB5, Any one of LB7, LB9, the even number of the four optional optical elements AOM4, AOM6, AOM8, AOM10 from the light beam LBb (intensity modulated beam) from the light source device 14B', which sequentially generates the beam LB4 in a time-sharing manner , LB6, LB8, LB10 any one of the ways to control. Therefore, each of at least eight scanning units U3~U10 is set in the beam scanning mode of every reflection surface RP of the polygon mirror PM.

Then, when the substrate FS2 is exposed, the four secondary origin signals ZP3, ZP5, ZP7, ZP3, ZP5, ZP7, ZP9, in the order of odd-numbered scanning units U3, U5, U7, U9, controls the repetitive beam scanning of every other reflecting surface RP of the polygon mirror PM, so as to control only every even-numbered scanning unit U4, U6, U8, The four secondary origin signals ZP4, ZP6, ZP8, ZP10 output by one reflecting surface RP of each polygon mirror PM of U10, in the order of even-numbered scanning units U4, U6, U8, U10, repeat every polygon mirror PM The beam scanning mode of the reflective surface RP is controlled. In addition, in FIG. 43, the alignment marks (equivalent to the alignment marks MK1, MK4 in FIG. 25) formed on both sides of the substrate FS2 in the width direction are arranged in the respective observation areas Vw2, Vw6 of the alignment microscope AM2, AM6. The detection relationship is configured, but depending on the size of the exposure area W in the Y direction, there may be situations where the above relationship configuration is not required. In this case, just set some of the seven alignment microscopes AM1~AM7 to be movable in the Y direction, and the position interval of the observation area Vw1~Vw7 in the Y direction can be adjusted.

According to modification 3 above, it is possible to perform high-efficiency exposure using only the necessary scanning unit Un according to the width of the substrate FS to be exposed or the size of the exposure area W in the Y direction. Also, as shown in Fig. 43, when the scanning efficiency of the polygon mirror PM of each of the 12 scanning units U1 to U12 is less than 1/3, for example, if the beam scanning is performed every three reflecting surfaces RP of each polygon mirror PM , Even if it is a light beam from one light source device 14', the pattern can be drawn well at the maximum drawing width Sh.

In addition, when nine scanning units U1~U9 constitute the drawing device, five odd-numbered scanning units U1, U3, U5, U7, U9 and four even-numbered scanning units U2, U4, U6, U8 are used. Therefore, when the pattern is drawn in the exposure area W by all the drawing lines SL1~SL9 of the nine scanning units U1~U9, the scanning efficiency of the polygon mirror PM is less than 1/3, for example, as long as every polygon mirror PM Only one reflective surface RP can be scanned by the beam. However, in this case, as long as iteratively refers to the secondary origin signals ZP1, ZP3, ZP5, ZP7, ZP9 generated from the respective origin signals SZn of the odd-numbered scanning units U1, U3, U5, U7, and U9 in sequence, proceed Scanning the points of the odd-numbered drawing lines SL1, SL3, SL5, SL7, SL9, iteratively refer to the secondary origin signal ZP2 generated from the origin signal SZn of the even-numbered scanning unit U2, U4, U6, and U8 repeatedly. , ZP4, ZP6, ZP8, scan the points on the even-numbered drawing lines SL2, SL4, SL6, SL8.

As described above, in Modification 3, a pattern drawing method is provided, using a drawing device that scans the spot light SP of the light beam from the light source device 14' along the drawing line SLn and arranges a plurality of scanning units Un to each drawing line The pattern drawn by SLn continues on the substrate FS in the direction of the drawing line SLn (main scanning direction), so that the plurality of scanning units Un and the substrate FS are relatively moved in the sub-scanning direction intersecting the main scanning direction, which is characterized by including: Among the plurality of scanning units Un, select the action of a specific scanning unit corresponding to the width of the substrate FS in the main scanning direction, or the width of the exposure area of the pattern drawn on the substrate FS in the main scanning direction or the position of the exposure area; and The light beams that are intensity-modulated according to the pattern data of each drawing of the specific scanning unit are selectively supplied to the respective actions of the specific scanning unit through the beam distribution unit that distributes the light beam from the light source device 14'. Therefore, in Modification 3, even if the width of the substrate FS is changed, or the width or position of the exposure area W on the substrate FS is changed, by appropriately positioning the transport position of the substrate FS in the Y direction, it is possible to maintain high splicing accuracy. Precision pattern depiction. In addition, at this time, the rotation speed or the rotation angle phase is not synchronized between all the polygon mirrors PM of a plurality of scanning units, but the rotation speed or rotation angle is only set between the polygon mirrors PM of the specific scanning unit that contributes to pattern drawing. The rotation angle and phase can be synchronized.

(Modification 4) Moreover, as another configuration of the drawing device using nine scanning units U1 to U9, it is not grouped by odd numbers and even numbers, but can be divided into two groups simply according to the arrangement order of the scanning units Un. That is, it can be divided into the first scanning module of six scanning units U1~U6 and the second scanning module of three scanning units U7~U9, and the first scanning module is supplied with the light beam from the first light source device 14A' LBa supplies the light beam LBb from the second light source device 14B' to the second scanning module. In this case, if the scanning efficiency (α/β) of the polygon mirror PM is 1/4<(α/β)≦1/3, then each of the six scanning units U1~U6 in the first scanning module is the same as the above Similarly to the fourth embodiment (FIG. 33), the spot light SP along each drawing line SL1 to SL6 is scanned by light beam scanning every one reflecting surface RP of the polygon mirror PM.

In contrast, each of the three scanning units U7 to U9 in the second scanning module can perform beam scanning on all the reflecting surfaces RP of the polygon mirror PM. Therefore, if each of the three scanning units U7~U9 directly performs beam scanning on all the reflecting surfaces RP of the polygon mirror PM, then the spot light SP is scanned on the drawing lines SL1~SL6 of each of the six scanning units U1~U6 The repetition time interval ΔTc1 and the repetition time interval ΔTc2 of the scanning of each of the three scanning units U7~U9 on the drawing lines SL7~SL9 of the spot light SP become ΔTc1=2ΔTc2, and the drawing lines SL1~SL6 are on the substrate FS The pattern drawn on the above is different from the pattern drawn on the substrate FS by the drawing lines SL7 to SL9, and it is impossible to perform good continuous exposure.

Therefore, each of the three scanning units U7 to U9 that can perform beam scanning on all the reflective surfaces RP of the polygon mirror PM is also controlled in a manner of performing beam scanning every other reflective surface RP of the polygon mirror PM. The above-mentioned control can be realized by the following actions, that is, the origin signals SZ7~SZ9 generated from each of the scanning units U7~U9 are input into the circuit of Fig. 31 or the auxiliary origin generating circuit CAan in Fig. 38 to generate the auxiliary origin signal The actions of ZP7~ZP9, and respond to the secondary origin signal ZP7~ZP9, make each of the corresponding selection optical elements AOM7~AOM9 turn ON in sequence at a certain time, and will correspond to each of the lines SL7~SL9 to be drawn Each of the serial data DL7 to DL9 for drawing of the drawn pattern is sequentially transmitted to the operation of the driving circuit 206a of the electro-optical element 206 in the second light source device 14B'.

(Modification 5) FIG. 44 shows the configuration of the driver circuit DRVn of the optical element AOMn for selection in Modification 5. As described in each of the above-mentioned embodiments or modification examples, when each of the plurality of scanning units Un scans the light beam at intervals of more than one reflecting surface RP of the polygon mirror PM, the light beam emitted from the light source device 14' (14A', 14B') LB (LBa, LBb) or light beams LBs, LBp emitted from the drawing optical elements AOMa, AOMb pass through a plurality of selective optical elements AOMn arranged along the optical path. In FIG. 44, the light beam LB, after passing through the selection optical elements AOM1, AOM2, is switched by the selection optical element AOM3, and the light beam LB3 directed toward the scanning unit U3 is generated. Generally speaking, the optical material in the optical element AOMn is selected to have a higher transmittance to the light beam LB in the ultraviolet wavelength range (for example, a wavelength of 355nm), but an attenuation rate of several%.

Assuming that the transmittance of each optical element AOMn for selection is 95%, as shown in Fig. 44, when the optical element AOM3 for selection is turned on, the intensity of the light beam LB that enters the optical element AOM3 for selection is subjected to two selection optics The attenuation of the components AOM1 and AOM2 is about 90% (0.95 ² ) compared to the original beam intensity (100%) of the optical component AOM1 for selection. Furthermore, when the six optional optical elements AOM1~AOM6 are connected, the intensity of the beam LB that enters the last optional optical element AOM6 is attenuated by the five optional optical elements AOM1~AOM5, so it is relative to the original beam (100%) becomes approximately 77% (0.95 ⁵ ).

Therefore, the intensity of the light beam LB incident on each of the six selective optical elements AOM1 to AOM6 becomes 100%, 95%, 90%, 85%, 81%, 77% in order. This means that the intensity of the light beams LB1 to LB6 emitted from each deflection of the selected optical elements AOM1 to AOM6 is also changed by the ratio. Therefore, in this modification 5, the driver circuits DRVn of each of the plurality of selection optical elements AOMn shown in FIG. 38 adjust the driving conditions of the selection optical elements AOM1~AOM6 to control the intensity of the light beams LB1~LB6 Changes are reduced.

In FIG. 44, since the driver circuits DRV1 to DRV6 (DRV5 and DRV6 are not shown) have the same configuration, only the driver circuit DRV1 will be described in detail. As shown in Figure 38 above, the information of the ON state time Ton of each of the optical elements AOM1~AOM6 (in Figure 44, the icons of AOM5 and AOM6 are omitted) for each input setting selection of the driver circuits DRV1~DRV6 and the secondary source Point signals ZP1~ZP6. In the configuration of FIG. 44, a high-frequency signal source 400 for applying ultrasonic waves to each of the selection optical elements AOM1 to AOM6 is commonly provided. The driver circuit DRV1 has a switching element 401 that receives the high-frequency signal from the high-frequency signal source 400 and switches whether to transmit it to the amplifier 402 that amplifies the amplitude to a high voltage at a high speed, and is controlled by the information of the set time Ton and the sub-origin signal ZP1 The logic circuit 403 that switches the switching element 401 on and off, and the gain adjuster 404 that adjusts the amplification rate (gain) of the amplifier 402 to adjust the amplitude of the high-voltage high-frequency signal applied to the optical element AOM1 for selection.

If the amplitude of the high-voltage high-frequency signal applied to the selective optical element AOM1 is changed within the allowable range, the diffraction efficiency of the selective optical element AOM1 can be fine-tuned, and the beam LB1 (primary diffracted light) emitted after the deflection can be changed strength. Therefore, in this modification 5, the driver circuit DRV1 of the optical element AOM1 for selection on the side close to the light source device 14' to the driver circuit DRV6 of the optical element AOM6 for selection on the side away from the light source device 14' are applied to each The gain adjuster 404 is adjusted to increase the amplitude of the high-voltage high-frequency signal of the optical element AOMn. For example, set the amplitude of the high-frequency signal of the high-voltage high-frequency signal of the optical element AOM6 applied to the optical path end of the light beam LB to the value Va6 with the highest diffraction efficiency, and apply the high voltage of the optical element AOM1 for the initial optical path of the light beam LB The amplitude of the high-frequency signal is set to a value Va1 at which the diffraction efficiency is reduced within the allowable range. The amplitude Va2~Va5 of the high-voltage high-frequency signal applied to the optical element AOM2~AOM5 for the selection between is set to Va1<Va2<Va3<Va4<Va5<Va6.

According to the above setting, the intensity deviation of the light beams LB1~LB6 emitted from each of the six selection optical elements AOM1~AOM6 can be alleviated or suppressed. Thereby, the deviation of the exposure amount of the pattern drawn by each of the drawing lines SL1 to SL6 can be suppressed, and high-precision pattern drawing can be performed. In addition, the amplitude Va1~Va6 of the high-voltage high-frequency signal set by the driver circuits DRV1~DRV6 does not need to be increased in sequence, and the relationship may be, for example, Va1=Va2<Va3=Va4<Va5=Va6. In addition to the method of adjusting the intensity of the drawing beams LB1 to LB6 of each scanning unit U1 to U6 to the spot light SP, in addition to the method of Modification 5, it is also possible to install a predetermined light path in each scanning unit U1 to U6. The transmittance of the dimming filter (ND filter) method.

In addition, in the driver circuit DRVn of FIG. 44, the switching element 401 is used to switch whether to transmit the high-frequency signal from the high-frequency signal source 400 to the amplifier 402. However, in order to improve the responsiveness (rising characteristics) when the optical element AOMn is selected for ON/OFF switching, the diffraction efficiency can also be regarded as substantially zero. For example, the intensity of the primary diffracted light can be compared with The low-level high-frequency signal whose intensity becomes less than 1/1000 is constantly applied to the selection optical element AOMn, and the appropriate high-level high-frequency signal is applied to the selection optical element AOMn only in the ON state. FIG. 45 shows the configuration of the above-mentioned driver circuit DRVn. Here, the configuration of the driver circuit DRV1 is representatively shown, and the same components as those in FIG. 44 are given the same symbols.

In the configuration shown in Figure 45, two resistors RE1 and RE2 in series are added. The in-line circuit of the resistors RE1 and RE2 is inserted into the high-frequency signal source 400 in parallel before the switching element 401, and the high-frequency signal from the high-frequency signal source 400 divided by the resistance ratio RE2/(RE1+RE2) is constantly applied to the amplifier 402. Assuming that the resistor RE2 is a variable resistor and the switching element 401 is in the OFF (non-conductive) state, the intensity of the primary diffracted light emitted from the selection optical element AOM1, that is, the light beam LB1 becomes a sufficiently small value (for example, the original intensity (Under 1/1000), adjust the level of the high-frequency signal applied to the selective optical element AOM1. As mentioned above, the resistors RE1 and RE2 apply a high-frequency signal bias (rise) to the selective optical element AOM1, thereby improving the response. In addition, in this case, the intensity is extremely weak when the switching element 401 is in the OFF (non-conduction) state, but because the light beam LB1 is incident on the corresponding scanning unit U1, the substrate FS is transported during the drawing operation due to some problems When the speed is reduced or stopped, close the shutter provided at the exit of the light source device 14' (14A', 14B') or insert a dimming filter.

(Modification 6) In each of the above embodiments and modifications, in a state where the sheet substrate FS is in close contact with the outer peripheral surface of the rotating drum DR, the surface of the substrate FS curved into a cylindrical surface runs along each of the plurality of scanning units Un The drawing line SLn is used for pattern drawing. However, for example, as disclosed in International Publication No. WO2013/150677, the substrate FS may be supported in a planar shape while being transported in the longitudinal direction while performing exposure processing. In this case, if the surface of the substrate FS is set to be parallel to the XY plane, for example, only the odd-numbered scanning units U1, U3, U5 shown in Fig. 23 and Fig. 24 can be used to illuminate the central axis Le1, Le3, Le5 and even-numbered scanning When viewing in a plane parallel to the XZ plane, the irradiation center axes Le2, Le4, and Le6 of the units U2, U4, and U6 are parallel to the Z axis and are located in the X direction at a certain interval. It is enough to arrange a plurality of scanning units U1~U6. .

AXp: Rotation axis CYa, CYb: Cylindrical lens DR: rotating drum FS: Substrate FT: fθ lens LB: beam PM: Polygonal mirror RP: reflective surface U1~U6: Scanning unit 14, 14a, 14b: light source device 16: depict the head 40a, 40b: Light guide optical system 42, 104: Condenser lens 44, 100, 108: collimating lens 46, 52, 60, 68, 102, 110, 114, 122: mirror 50, 58, 66: Optics for selection 70: Absorber 106: Optical elements for drawing

Fig. 1 is a diagram showing a schematic configuration of a device manufacturing system including an exposure device for applying exposure processing to a substrate according to the first embodiment. [Fig. 2] is a diagram showing the support frame supporting the drawing head and the rotating drum shown in Fig. 1. [Fig. 3] is a diagram showing the structure of the drawing head of Fig. 1. [Fig. 4] is a detailed configuration diagram of the light introduction optical system shown in Fig. 3. [Fig. 5] is a diagram showing the traced lines of the spot light scanned by each scanning unit shown in Fig. 3. [Fig. 6] is a diagram showing the relationship between the polygon mirror of each scanning unit shown in Fig. 3 and the scanning direction of the drawing line. [Fig. 7] is a diagram for explaining the rotation angle of the polygon mirror that can deflect (reflect) laser light by the way the reflecting surface of the polygon mirror shown in Fig. 3 enters the f-θ lens. [Fig. 8] is a schematic diagram of the optical path of the light introduction optical system and a plurality of scanning units shown in Fig. 3. [Fig. 9] A diagram showing the structure of a drawing head in a modification of the above-mentioned first embodiment. [Fig. 10] is a detailed configuration diagram of the light introduction optical system shown in Fig. 9. [Fig. 11] A diagram showing the structure of the drawing head of the second embodiment. [Fig. 12] is a diagram showing the light introduction optical system shown in Fig. 11. [Fig. 13] is a schematic diagram of the optical path of the light introduction optical system and a plurality of scanning units shown in Fig. 12. [FIG. 14] A block diagram showing an example of a control circuit for the rotation drive of each polygon mirror of the plurality of scanning units shown in FIG. 13. [FIG. 15] A timing chart showing an example of the operation of the control circuit shown in FIG. 14. [Fig. 16] is a block diagram showing an example of a circuit for generating the drawing bit row data supplied to the drawing optical element shown in Figs. 11-13. Fig. 17 is a diagram showing the structure of a light source device according to a modification of the second embodiment. [Fig. 18] is a block diagram showing the structure of a control unit for drawing control in the third embodiment. [Fig. 19] is a time chart showing the signal state of each part and the oscillation state of the laser light when the pattern is drawn in the control unit of Fig. 18. [FIG. 20] A time chart showing the clock signal for pulsed light oscillation made by the control circuit of the light source device of FIG. 17. [Fig. 21] is a time chart explaining how the clock signal of Fig. 20 is corrected in order to correct the drawing magnification. [FIG. 22] A diagram illustrating the correction method of the drawing magnification in a drawing line (scanning line). [FIG. 23] A diagram showing the schematic configuration of a device manufacturing system including an exposure device for applying exposure processing to a substrate in the fourth embodiment. [Fig. 24] A detailed view of the rotating drum of Fig. 23 with the substrate wound around. [Fig. 25] A diagram showing the drawing line of the point light and the alignment mark formed on the substrate. [Fig. 26] A configuration diagram of the beam switching member. [Fig. 27] A is a diagram of the optical path switching of the light beam by the selection optical element viewed from the +Z direction side, and Fig. 27B is a diagram of the optical path switching of the light beam performed by the selection optical element viewed from the -Y direction side. [Figure 28] is a diagram showing the optical structure of the scanning unit. [Fig. 29] is a diagram showing the structure of the origin sensor arranged around the polygon mirror of Fig. 28. [Figure 30] A diagram showing the relationship between the origin signal generation timing and the drawing start timing. [Figure 31] A circuit diagram of the secondary origin generating circuit used to generate the secondary origin signal separated from the origin signal so that its timing delays a predetermined time. [Figure 32] is a time chart showing the secondary origin signal generated by the secondary origin generating circuit of Figure 31. [Figure 33] A block diagram showing the electrical configuration of the exposure device. [Figure 34] is a time chart showing the timing of output origin signal, secondary origin signal, and sequence data. [FIG. 35] A diagram showing the structure of the drawing data output control unit shown in FIG. 33. [Fig. 36] is a configuration diagram of the beam switching member of the fifth embodiment. [Fig. 37] is a diagram showing the optical path when the position of the arrangement switching member of Fig. 36 is the first position. [Fig. 38] A diagram showing the configuration of the optical path switching control unit of the fifth embodiment. [FIG. 39] A diagram showing the structure of the logic circuit in FIG. 38. [FIG. 40] A timing diagram illustrating the operation of the logic circuit in FIG. 39 is shown. [Fig. 41] is a configuration diagram of the beam switching member of the sixth embodiment. [Fig. 42] A diagram showing a configuration in which the arrangement of the optical element for selection (acousto-optic modulation element) in the sixth embodiment is rotated by 90 degrees. [FIG. 43] A diagram showing the relationship between the transportation form of the substrate and the arrangement of drawing lines in Modification 3. [FIG. 44] A diagram showing the configuration of a driver circuit of an optical element for selection (acousto-optic modulation element) of Modification 5. [FIG. 45] A diagram showing a modification of the driver circuit in FIG. 44.

AXp: Rotation axis CYa, CYb: Cylindrical lens DR: rotating drum FS: Substrate FT: fθ lens LB: beam PM: Polygonal mirror RP: reflective surface U1~U6: Scanning unit 14, 14a, 14b: light source device 16: depict the head 40a, 40b: Light guide optical system 42, 104: Condenser lens 44, 100, 108: collimator lens 46, 52, 60, 68, 102, 110, 114, 122: mirror 50, 58, 66: Optics for selection 70: Absorber 106: Optical elements for drawing

Claims (10)

A pattern exposure device, from each of a plurality of drawing units arranged along a second direction orthogonal to the first direction in which a substrate to be pattern exposed moves, and project a light beam whose intensity is adjusted according to the drawing data of the pattern to On the aforementioned substrate, it has: The light source device includes the light beam whose intensity is adjusted according to the drawing data in order to supply each of the plurality of drawing units, and the intensity of the light beam is switched to the On state of the first intensity based on the drawing data, and the light beam becomes the first intensity. 1. The light modulator in the Off state of the second intensity with low intensity; A plurality of acousto-optic modulating elements are provided corresponding to each of the plurality of drawing units in order to sequentially supply the light beam from the aforementioned light source device to any of the aforementioned plurality of drawing units in a time-sharing manner, and The light beams from the light source device are arranged to pass through in series, and a response driving signal is generated to deflect the light beams from the light source device at a predetermined diffraction angle to emit the light beams; and A plurality of reflecting mirrors are arranged along the traveling direction of the light beam from the light source device, and reflect the emitted light beam generated from each of the plurality of acousto-optic modulating elements toward the corresponding drawing unit; When each of the plurality of acousto-optic modulating elements is set as the first, second... acousto-optic modulating element in the order in which the light beam from the light source device passes, the odd-numbered acousto-optic modulating element is generated The deflection direction of the outgoing light beam and the deflection direction of the outgoing light beam generated by the even-numbered acousto-optic modulating element are opposite directions across the optical path of the light beam. The pattern exposure device of claim 1, which is provided with a condenser lens and a collimator lens, and the condenser lens and the collimator lens are respectively provided on the odd-numbered acousto-optic modulating element and the even-numbered acousto-optic The modulation elements are arranged in such a way that the odd-numbered acousto-optic modulation element and the even-numbered acousto-optic modulation element become focal positions together. As in the pattern exposure device of claim 2, when the direction of gravity is the Z direction and the plane orthogonal to the Z axis extending in the Z direction is the XY plane, the light beam from the light source device is set to lie on the XY plane The parallel state passes through each of the aforementioned plural acousto-optic modulating elements in series, The deflection direction of the outgoing light beam generated by the odd-numbered acousto-optic modulating element and the deflection direction of the outgoing light beam generated by the even-numbered acousto-optic modulating element are set so as to intersect the optical path. The planes parallel to the aforementioned XY plane are in opposite directions. Such as the pattern exposure device of claim 3, wherein the aforementioned light source device includes: The laser light source unit outputs sharp pulse-like first light generated in response to each of the clocks of the frequency Fs, and gentle pulses generated in response to each of the aforementioned clocks with the same energy as the first light The second kind of light; The electro-optical element is provided as the light modulator, and enters the first light and the second light together, and switches the polarization state of the first light and the second light according to the drawing data to output; A polarizing beam splitter, which selectively outputs any one of the first light and the second light from the electro-optical element according to the polarization state; An optical fiber amplifier that injects the first light or the second light from the polarization beam splitter; and The wavelength conversion element converts the first light amplified by the fiber amplifier into a wavelength region of ultraviolet rays, outputs the light beam as pulsed light in the On state of the first intensity, and outputs the second light amplified by the fiber amplifier. The seed light is converted into a wavelength region of ultraviolet rays, and the light beam is output as pulsed light in the Off state of the second intensity. Such as the pattern exposure device of claim 4, wherein each of the plurality of drawing units has: The rotating polygon mirror reflects the outgoing light beam supplied by the deflection of the acousto-optic modulation element within a predetermined deflection angle range; A projection optical system, injecting the outgoing beam reflected by the rotating polygon mirror, and condensing it as a scanning spot light on the substrate; The origin sensor outputs a pulse-shaped origin signal representing the point at which the scanning of the scanning spot light is started for each reflecting surface of the rotating polygon mirror. For example, the pattern exposure device of claim 5, wherein the drawing data irradiates the pixel corresponding to a point of the pattern to be drawn on the On state of the scanning spot light and the Off state of not irradiating the scanning spot light on the pixel Bitmap data represented by dual-value data; The electro-optical element of the light source device switches the polarization direction of the first light and the second light according to the value of the binary data of the pixel of the bitmap data. The pattern exposure apparatus of claim 6, wherein the size of the scanning spot light on the substrate is set to Ds, and the scanning speed of the scanning spot light generated by the rotating polygon mirror on the substrate is set to Vs At this time, the aforementioned frequency Fs of the aforementioned clock is set to a relationship of Fs≧Vs/Ds. The pattern exposure device of claim 7, wherein the aforementioned frequency Fs is set to any one of 100MHz, 200MHz, 300MHz, and 400MHz. The pattern exposure device according to any one of claims 3 to 8, wherein the pattern exposure device is arranged above the plurality of drawing units in the Z direction, and the plurality of acousto-optic modulating elements, the plurality of mirrors, and the aforementioned Each of the condenser lens and the collimator lens is a plate-shaped support member supported on the XY plane. The pattern exposure apparatus of claim 9, wherein the reflecting mirror is composed of a first mirror and a second mirror, and the first mirror reflects the emitted light beam from the acousto-optic modulating element in the XY plane, and The second mirror reflects the emitted light beam reflected by the first mirror in the Z direction toward the corresponding drawing unit through the opening formed in the supporting member.

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