JP6582782B2 - Pattern drawing device - Google Patents

Description

The present invention relates to Rupa turn drawing device to draw a pattern by scanning the spot light irradiated on the irradiation object.

  As a drawing apparatus using a rotating polygon mirror, for example, as disclosed in Patent Document 1 below, a beam from a laser diode (LD) is repeatedly deflected by a polygon mirror, and the deflected beam is passed through an fθ lens. An electrophotographic image forming apparatus that scans on a photoreceptor is known. In the image forming apparatus disclosed in Patent Document 1, a temperature change in a writing unit including a laser diode (LD), a rotating polygon mirror, an fθ lens, and the like is predicted from a change in driving current of the laser diode (LD). Then, in order to correct a magnification error of the fθ lens caused by a temperature change (a magnification error in the main scanning direction of the beam), a write-use that becomes a reference when controlling the lighting of the laser diode (LD) in response to an image signal. The frequency of the clock signal is changed. However, if the pattern of the image to be drawn is a pattern for an electronic device, even if the magnification error is corrected only by changing the frequency of the clock signal as in Patent Document 1, it is fine for high-precision magnification correction. I can not cope.

JP 2009-220489 A

In one embodiment of the present invention, a beam whose intensity changes according to a pattern is projected as a spot light on a substrate to scan in one dimension in the main scanning direction, and the substrate and the spot light intersect the main scanning direction. In the pattern drawing apparatus for relative movement in the sub-scanning direction, when the drawing range on the substrate by the main scanning of the spot light is divided by the arrangement of pixels of a predetermined size, the intensity of the beam for each pixel A drawing data storage unit that stores pixel data that changes the state of drawing to non-drawing, Vs is the velocity of the spot light in the main scanning direction, and Py is the dimension of the pixel in the main scanning direction. when a clock generator for generating a clock signal of N times higher frequency Fa with respect to the frequency determined by Vs / Py, frequency F in response to each clock pulse of the clock signal A pulse light source unit that generates a sharp pulsed first type light and a slow pulsed second type light that are generated in the above, and one of the first type light and the second type light, An optical modulator that outputs by polarization switching based on pixel data; a fiber amplifier that receives the first-type light or the second-type light output from the optical modulator; and the first optical amplifier that is amplified by the fiber amplifier. Among the plurality of pixels arranged along the drawing range, a specific position among a pulse light source device including a wavelength conversion element that converts one type of light into a wavelength region of ultraviolet light and outputs a pulse with the frequency Fa as the beam A correction pixel designating unit that designates at least one of the pixels arranged as a correction pixel and another pixel as a non-correction pixel, and the non-correction pixel during the main scanning of the spot light , Drawing N of one of the first-type light and the second-type light generated in response to N clock pulses of the clock signal in accordance with either the state or the non-drawing state of the fiber With respect to the correction pixel , N ± m of the clock signals (m is one or more having a relationship of m <N) according to either the drawing state or the non-drawing state of the pixel data. A beam controller for controlling N ± m of either one of the first type light and the second type light generated in response to an integer) clock pulse to be incident on the fiber amplifier ; Prepare.

It is a figure which shows schematic structure of the device manufacturing system containing the exposure apparatus which performs the exposure process to the board | substrate of 1st Embodiment. It is a block diagram which shows the structure of exposure apparatus. It is detail drawing which shows the state by which the board | substrate was wound around the rotating drum shown in FIG. It is a figure which shows the drawing line of the spot light scanned on a board | substrate, and the alignment mark formed on the board | substrate. It is a figure which shows the optical structure of the scanning unit shown in FIG. It is a block diagram of the beam switching part shown in FIG. It is a figure which shows the structure of the light source device shown in FIG. It is a time chart which shows the relationship between the clock signal which the signal generation part shown in FIG. 7 generate | occur | produces, drawing bit sequence data, and the beam inject | emitted from a polarization beam splitter. It is a figure which shows the structure of the signal generation part shown in FIG. 7 which has the function to expand / contract a correction pixel. It is a figure which shows the truth value table of the preset value which the preset part shown in FIG. 9 outputs. Each clock pulse of the clock signal generated by the clock generation unit shown in FIG. 9, the count value of the second frequency division counter circuit, the output timing of the pixel shift pulse, the pixel of the serial data input to the drive circuit shown in FIG. It is a time chart which shows the switching timing of logic information. FIG. 3 is a block diagram showing an electrical configuration of the exposure apparatus shown in FIG. 2. 13 is a time chart showing an origin signal output from the origin sensor of FIG. 5 provided in each scanning unit and an incident permission signal generated by the selection element drive control unit shown in FIG. 12 according to the origin signal. It is a figure which shows the structure of the drawing data output part shown in FIG. FIG. 15 is a time chart showing a pixel permission pulse generated by the drawing permission signal generated by the drawing permission signal generating unit shown in FIG. 14 and a pixel shift pulse output from the transmission timing switching unit of FIG. 9 during a period when the drawing permission signal is high. It is a figure which shows the relationship between the position of the drawing line expanded / contracted within the range of the maximum scanning length, and delay time. It is a figure which shows the structure of the light source device in the modification of 1st Embodiment. FIG. 18 is a diagram illustrating a configuration of a clock signal generation unit illustrated in FIG. 17. FIG. 19 is a timing chart for explaining the operation of the clock signal generation unit of FIG. 18. FIG. It is a figure which shows the structure of the signal generation part provided in the inside of the light source device in 2nd Embodiment. 21A is a diagram showing a first example of the configuration of the delay circuit shown in FIG. 20, and FIG. 21B is a diagram showing a second example of the configuration of the delay circuit shown in FIG. It is a time chart which shows the signal output from each part of the signal generation part shown in FIG. FIG. 23A is a diagram for describing a pattern drawn when local magnification correction is not performed, and FIG. 23B is a drawing when local magnification correction (reduction) is performed according to the time chart shown in FIG. It is a figure explaining the pattern to be performed. FIG. 11 is an explanatory diagram of Modification 1 of each of the above-described embodiments, and drawing optics instead of the electro-optic element that modulates the intensity of the spot light according to the pattern data described in each of the above-described embodiments (including the modification) It is a figure which shows the example of arrangement | positioning of the optical element for drawing at the time of using an element. It is explanatory drawing of the modification 4 of each said embodiment, The condensing lens in the beam switching part demonstrated in each said embodiment (a modification is also included), the optical element for selection, a collimating lens, and the unit side It is the figure which showed typically the relationship between arrangement | positioning of an incident mirror, and arrangement | positioning of the 2nd cylindrical lens in a scanning unit. It is explanatory drawing of the modification 5 of said each embodiment (a modification is also included), and is a figure which shows the principal part structure of the scanning unit which used the galvanometer mirror instead of the polygon mirror. It is explanatory drawing of the modification 6 of said each embodiment (a modification is also included), and is a perspective view of the scanning unit of the system which scans spot light in circular arc shape with a mechanical rotation mechanism.

DESCRIPTION OF EMBODIMENTS A pattern drawing method and a pattern drawing apparatus according to an aspect of the present invention will be described in detail below with reference to the accompanying drawings with preferred embodiments. In addition, the aspect of this invention is not limited to these embodiment, What added the various change or improvement is included. In other words, the configuration requirements (mechanism, structure, function) described below include those that can be easily assumed by those skilled in the art and substantially the same, and the configuration requirements (mechanism, structure, function) described below. Can be combined as appropriate. In addition, various omissions, substitutions, or changes in the configuration requirements (mechanism, structure, function) can be made without departing from the scope of the present invention.

[First Embodiment]
FIG. 1 is a diagram showing a schematic configuration of a device manufacturing system 10 including an exposure apparatus EX that performs an exposure process on a substrate (irradiated body) P according to the first embodiment. In the following description, unless otherwise specified, an XYZ orthogonal coordinate system in which the gravity direction is the Z direction is set, and the X direction, the Y direction, and the Z direction will be described according to the arrows shown in the drawing.

  The device manufacturing system 10 is a system (substrate processing apparatus) that manufactures an electronic device by performing predetermined processing (such as exposure processing) on the substrate P. In the device manufacturing system 10, for example, a manufacturing line for manufacturing a flexible display as an electronic device, a film-like touch panel, a film-like color filter for a liquid crystal display panel, a flexible wiring, or a flexible sensor is constructed. It is a manufacturing system. The following description is based on the assumption that a flexible display is used as the electronic device. Examples of the flexible display include an organic EL display and a liquid crystal display. The device manufacturing system 10 sends out the substrate P from a supply roll FR1 obtained by winding a flexible sheet-like substrate (sheet substrate) P in a roll shape, and continuously performs various processes on the delivered substrate P. After that, the substrate P after various treatments is wound up by the recovery roll FR2, and has a so-called roll-to-roll (Roll To Roll) structure. The substrate P has a belt-like shape in which the moving direction (transport direction) of the substrate P is the longitudinal direction (long) and the width direction is the short direction (short). In the first embodiment, the film-like substrate P includes at least a processing apparatus (first processing apparatus) PR1, a processing apparatus (second processing apparatus) PR2, an exposure apparatus (third processing apparatus) EX, An example of winding up to the collection roll FR2 through the processing device (fourth processing device) PR3 and the processing device (fifth processing device) PR4 is shown.

  In the first embodiment, the X direction is a direction (conveying direction) in which the substrate P is directed from the supply roll FR1 to the collection roll FR2 in the horizontal plane. The Y direction is a direction orthogonal to the X direction in the horizontal plane, and is the width direction (short direction) of the substrate P. The Z direction is a direction (upward direction) orthogonal to the X direction and the Y direction, and is parallel to the direction in which gravity acts.

  For the substrate P, for example, a resin film or a foil (foil) made of a metal or alloy such as stainless steel is used. Examples of the resin film material include polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, and vinyl acetate resin. Of these, one containing at least one may be used. Further, the thickness and rigidity (Young's modulus) of the substrate P may be in a range that does not cause folds or irreversible wrinkles due to buckling in the substrate P when passing through the conveyance path of the device manufacturing system 10. . As a base material of the substrate P, a film such as PET (polyethylene terephthalate) or PEN (polyethylene naphthalate) having a thickness of about 25 μm to 200 μm is typical of a suitable sheet substrate.

  Since the substrate P may receive heat in each process performed by the processing apparatus PR1, the processing apparatus PR2, the exposure apparatus EX, the processing apparatus PR3, and the processing apparatus PR4, the substrate P is made of a material whose thermal expansion coefficient is not remarkably large. It is preferable to select the substrate P. For example, the thermal expansion coefficient can be suppressed by mixing an inorganic filler with a resin film. The inorganic filler may be, for example, titanium oxide, zinc oxide, alumina, or silicon oxide. The substrate P may be a single layer of ultrathin glass having a thickness of about 100 μm manufactured by a float process or the like, or a laminate in which the above resin film, foil, or the like is bonded to the ultrathin glass. It may be.

  By the way, the flexibility of the substrate P means the property that the substrate P can be bent without being sheared or broken even when a force of its own weight is applied to the substrate P. . In addition, flexibility includes a property of bending by a force of about its own weight. The degree of flexibility varies depending on the material, size and thickness of the substrate P, the layer structure formed on the substrate P, the environment such as temperature or humidity, and the like. In any case, when the substrate P is correctly wound around the conveyance direction changing members such as various conveyance rollers and rotating drums provided in the conveyance path in the device manufacturing system 10 according to the first embodiment, If the substrate P can be smoothly transported without being bent and creased or damaged (breaking or cracking), it can be said to be a flexible range.

  The processing apparatus PR1 applies the coating process to the substrate P while transporting the substrate P transported from the supply roll FR1 toward the processing apparatus PR2 in a transport direction (+ X direction) along the longitudinal direction at a predetermined speed. It is the coating device which performs. The processing apparatus PR1 selectively or uniformly applies the photosensitive functional liquid to the surface of the substrate P. The substrate P having the photosensitive functional liquid applied on the surface thereof is conveyed toward the processing apparatus PR2.

  The processing apparatus PR2 is a drying apparatus that performs a drying process on the substrate P while transporting the substrate P transported from the processing apparatus PR1 toward the exposure apparatus EX in the transport direction (+ X direction) at a predetermined speed. . The processing apparatus PR2 removes the solvent or water contained in the photosensitive functional liquid with a blower, an infrared light source, a ceramic heater, or the like that blows drying air (hot air) such as hot air or dry air onto the surface of the substrate P, and performs photosensitivity. Dry sexual function liquid. Thereby, a film to be a photosensitive functional layer (photosensitive layer) is selectively or uniformly formed on the surface of the substrate P. The photosensitive functional layer may be formed on the surface of the substrate P by attaching a dry film to the surface of the substrate P. In this case, instead of the processing apparatus PR1 and the processing apparatus PR2, a pasting apparatus (processing apparatus) for sticking the dry film to the substrate P may be provided.

  Here, a typical one of the photosensitive functional liquid (layer) is a photoresist (liquid or dry film). However, as a material that does not require development processing, the lyophilic property of the part that has been irradiated with ultraviolet rays. There is a photosensitive silane coupling agent (SAM) that is modified, or a photosensitive reducing agent in which a plating reducing group is exposed in a portion irradiated with ultraviolet rays. When a photosensitive silane coupling agent is used as the photosensitive functional liquid (layer), the pattern portion exposed to ultraviolet rays on the substrate P is modified from lyophobic to lyophilic. Therefore, by selectively applying conductive ink (ink containing conductive nanoparticles such as silver or copper) or a liquid containing a semiconductor material on the lyophilic portion, a thin film transistor (TFT) or the like A pattern layer to be an electrode, a semiconductor, insulation, or a wiring for connection can be formed. When a photosensitive reducing agent is used as the photosensitive functional liquid (layer), the plating reducing group is exposed to the pattern portion exposed to ultraviolet rays on the substrate P. Therefore, after exposure, the substrate P is immediately immersed in a plating solution containing palladium ions or the like for a certain period of time, so that a pattern layer of palladium is formed (deposited). Such a plating process is an additive process, but may be based on an etching process as a subtractive process. In that case, the substrate P sent to the exposure apparatus EX is made of PET or PEN as a base material, and a metal thin film such as aluminum (Al) or copper (Cu) is deposited on the entire surface or selectively, and further, It may be a laminate of a photoresist layer thereon. In the first embodiment, a photosensitive reducing agent is used as the photosensitive functional liquid (layer).

  The exposure apparatus EX is a processing apparatus that performs exposure processing on the substrate P while transporting the substrate P transported from the processing apparatus PR2 toward the processing apparatus PR3 in the transport direction (+ X direction) at a predetermined speed. . The exposure apparatus EX uses a light corresponding to a pattern for an electronic device (for example, a pattern of an electrode or wiring of a TFT constituting the electronic device) on the surface of the substrate P (the surface of the photosensitive functional layer, that is, the photosensitive surface). Irradiate the pattern. Thereby, a latent image (modified portion) corresponding to the pattern is formed on the photosensitive functional layer.

  In the first embodiment, the exposure apparatus EX is a direct drawing type exposure apparatus that does not use a mask, that is, a so-called raster scan type exposure apparatus (pattern drawing apparatus). As will be described in detail later, the exposure apparatus EX transmits the spot light SP of the pulsed beam LB (pulse beam) for exposure to the substrate P while conveying the substrate P in the + X direction (sub-scanning direction). The intensity of the spot light SP is rapidly modulated (ON / OFF) according to the pattern data (drawing data) while one-dimensionally scanning (main scanning) in a predetermined scanning direction (Y direction) on the irradiated surface (photosensitive surface). Off). Thereby, a light pattern corresponding to a predetermined pattern such as an electronic device, a circuit, or a wiring is drawn and exposed on the irradiated surface of the substrate P. That is, the spot light SP is relatively two-dimensionally scanned on the irradiated surface of the substrate P by the sub-scanning of the substrate P and the main scanning of the spot light SP, and a predetermined pattern is drawn and exposed on the substrate P. . Further, since the substrate P is transported along the transport direction (+ X direction), the exposure region W where the pattern is exposed by the exposure apparatus EX is spaced at a predetermined interval along the longitudinal direction of the substrate P. A plurality are provided (see FIG. 4). Since an electronic device is formed in the exposure area W, the exposure area W is also a device formation area. Since the electronic device is configured by superimposing a plurality of pattern layers (layers on which patterns are formed), a pattern corresponding to each layer may be exposed by the exposure apparatus EX.

  The processing apparatus PR3 is a wet processing apparatus that performs wet processing on the substrate P while transporting the substrate P transported from the exposure apparatus EX toward the processing apparatus PR4 in the transport direction (+ X direction) at a predetermined speed. is there. In the first embodiment, the processing apparatus PR3 performs a plating process which is a kind of wet process on the substrate P. That is, the substrate P is immersed in a plating solution stored in the processing tank for a predetermined time. As a result, a pattern layer corresponding to the latent image is deposited (formed) on the surface of the photosensitive functional layer. That is, a predetermined material (for example, palladium) is selectively formed on the substrate P according to the difference between the irradiated portion and the non-irradiated portion of the spot light SP on the photosensitive functional layer of the substrate P, and this is the pattern layer. Become.

  When a photosensitive silane coupling agent is used as the photosensitive functional layer, a coating process or a plating process of a liquid (for example, a liquid containing conductive ink or the like) which is a kind of wet process is performed by the processing apparatus PR3. . Even in this case, a pattern layer corresponding to the latent image is formed on the surface of the photosensitive functional layer. That is, a predetermined material (for example, conductive ink or palladium) is selectively formed on the substrate P according to the difference between the irradiated portion of the spot light SP of the photosensitive functional layer of the substrate P and the irradiated portion, This is the pattern layer. Further, when a photoresist is employed as the photosensitive functional layer, development processing, which is a kind of wet processing, is performed by the processing apparatus PR3. In this case, a pattern corresponding to the latent image is formed on the photosensitive functional layer (photoresist) by this development processing.

  The processing apparatus PR4 performs cleaning / drying processing on the substrate P while transporting the substrate P transported from the processing apparatus PR3 toward the recovery roll FR2 in the transport direction (+ X direction) at a predetermined speed. It is a drying device. The processing apparatus PR4 cleans the substrate P that has been subjected to the wet processing with pure water, and then dries until the moisture content of the substrate P is equal to or lower than a predetermined value at a glass transition temperature or lower.

  When a photosensitive silane coupling agent is used as the photosensitive functional layer, the processing apparatus PR4 may be an annealing / drying apparatus that performs an annealing process and a drying process on the substrate P. In the annealing treatment, the substrate P is irradiated with, for example, high-intensity pulsed light from a strobe lamp in order to strengthen the electrical coupling between the nanoparticles contained in the applied conductive ink. When a photoresist is employed as the photosensitive functional layer, a processing apparatus (wet processing apparatus) PR5 that performs an etching process between the processing apparatus PR4 and the recovery roll FR2, and a substrate P that has been subjected to the etching process. A processing apparatus (cleaning / drying apparatus) PR6 for performing the cleaning / drying process may be provided. Thereby, when a photoresist is adopted as the photosensitive functional layer, a pattern layer is formed on the substrate P by performing an etching process. That is, a predetermined material (for example, aluminum (Al) or copper (Cu)) is selectively formed on the substrate P according to the difference between the irradiated portion of the spot light SP of the photosensitive functional layer of the substrate P and the irradiated portion. This is a pattern layer. The processing apparatuses PR5 and PR6 have a function of transporting the substrate P sent in the transport direction (+ X direction) at a predetermined speed toward the collection roll FR2. The function of the plurality of processing apparatuses PR1 to PR4 (including processing apparatuses PR5 and PR6 as necessary) to transfer the substrate P in the + X direction is configured as a substrate transfer apparatus.

  In this way, the substrate P that has been subjected to each process is recovered by the recovery roll FR2. One pattern layer is formed on the substrate P through at least each process of the device manufacturing system 10. As described above, since the electronic device is configured by superimposing a plurality of pattern layers, each process of the device manufacturing system 10 as illustrated in FIG. 1 is performed at least twice in order to generate the electronic device. Have to go through. Therefore, a pattern layer can be laminated | stacked by mounting | wearing the separate device manufacturing system 10 with the collection | recovery roll FR2 by which the board | substrate P was wound up as the supply roll FR1. Such an operation is repeated to form an electronic device. The processed substrate P is in a state in which a plurality of electronic devices are connected along the longitudinal direction of the substrate P with a predetermined interval. That is, the substrate P is a multi-sided substrate.

  The collection roll FR2 that collects the substrate P formed in a state where the electronic devices are connected may be mounted on a dicing apparatus (not shown). The dicing apparatus to which the recovery roll FR2 is attached divides (dices) the processed substrate P into electronic devices (exposure regions W that are device formation regions) to form electronic devices that are a plurality of single wafers. . Regarding the dimensions of the substrate P, for example, the dimension in the width direction (short direction) is about 10 cm to 2 m, and the dimension in the length direction (long direction) is 10 m or more. In addition, the dimension of the board | substrate P is not limited to an above-described dimension.

  FIG. 2 is a block diagram showing the configuration of the exposure apparatus EX. The exposure apparatus EX is stored in the temperature control chamber ECV. This temperature control chamber ECV keeps the inside at a predetermined temperature and a predetermined humidity, thereby suppressing a change in shape due to the temperature of the substrate P transported inside, and occurring along with the hygroscopicity and transport of the substrate P. The humidity is set in consideration of static charge. The temperature control chamber ECV is arranged on the installation surface E of the manufacturing factory via passive or active vibration isolation units SU1, SU2. The anti-vibration units SU1 and SU2 reduce vibration from the installation surface E. The installation surface E may be the floor surface of the factory itself, or may be a surface on an installation base (pedestal) that is exclusively installed on the floor surface in order to obtain a horizontal surface. The exposure apparatus EX includes a substrate transport mechanism 12, two light source devices LS (LSa, LSb) having the same configuration, a beam switching unit BDU, an exposure head 14, a control device 16, and a plurality of alignment microscopes AM1m, AM2m ( Note that m = 1, 2, 3, 4) and a plurality of encoders ENja, ENjb (j = 1, 2, 3, 4) are provided. The control device (control unit) 16 controls each part of the exposure apparatus EX. The control device 16 includes a computer and a recording medium on which the program is recorded, and functions as the control device 16 of the first embodiment when the computer executes the program.

  The substrate transport mechanism 12 constitutes a part of the substrate transport apparatus of the device manufacturing system 10, and after the substrate P transported from the processing apparatus PR2 is transported at a predetermined speed in the exposure apparatus EX, the processing is performed. It sends out to the apparatus PR3 at a predetermined speed. The substrate transport mechanism 12 defines a transport path for the substrate P transported in the exposure apparatus EX. The substrate transport mechanism 12 includes an edge position controller EPC, a driving roller R1, a tension adjusting roller RT1, a rotating drum (cylindrical drum) DR, a tension adjusting roller RT2, in order from the upstream side (−X direction side) in the transport direction of the substrate P. A driving roller R2 and a driving roller R3 are provided.

  The edge position controller EPC adjusts the position in the width direction (the Y direction and the short direction of the substrate P) of the substrate P transported from the processing apparatus PR2. That is, in the edge position controller EPC, the position at the end (edge) in the width direction of the substrate P being transported in a state where a predetermined tension is applied is about ± 10 to several tens μm with respect to the target position. The position of the substrate P in the width direction is adjusted by moving the substrate P in the width direction so that it falls within this range (allowable range). The edge position controller EPC includes a roller on which the substrate P is stretched in a state where a predetermined tension is applied, and an edge sensor (end detection unit) (not shown) that detects the position of the end portion (edge) in the width direction of the substrate P. And have. The edge position controller EPC adjusts the position of the substrate P in the width direction by moving the roller of the edge position controller EPC in the Y direction based on the detection signal detected by the edge sensor. The driving roller (nip roller) R1 rotates while holding both front and back surfaces of the substrate P conveyed from the edge position controller EPC, and conveys the substrate P toward the rotating drum DR. The edge position controller EPC appropriately adjusts the position in the width direction of the substrate P so that the longitudinal direction of the substrate P wound around the rotating drum DR is always orthogonal to the central axis AXo of the rotating drum DR. The parallelism between the rotation axis of the roller and the Y axis of the edge position controller EPC may be appropriately adjusted so as to correct the tilt error in the traveling direction of the substrate P.

  The rotary drum DR has a central axis AXo extending in the Y direction and extending in a direction intersecting with the direction in which gravity works, and a cylindrical outer peripheral surface having a constant radius from the central axis AXo. The rotating drum DR rotates around the central axis AXo while supporting (holding) a part of the substrate P by bending the outer surface (circumferential surface) into a cylindrical surface in the longitudinal direction. Transport P in the + X direction. The rotating drum DR supports an area (portion) on the substrate P onto which the beam LB (spot light SP) from the exposure head 14 is projected on its outer peripheral surface. The rotating drum DR supports (holds and holds) the substrate P from the surface (back surface) opposite to the surface on which the electronic device is formed (surface on which the photosensitive surface is formed). On both sides in the Y direction of the rotating drum DR, shafts Sft supported by annular bearings are provided so that the rotating drum DR rotates around the central axis AXo. The shaft Sft rotates at a constant rotational speed around the central axis AXo by receiving a rotational torque from a rotational drive source (not shown) (for example, a motor or a speed reduction mechanism) controlled by the control device 16. For convenience, a plane including the central axis AXo and parallel to the YZ plane is referred to as a central plane Poc.

  The driving rollers (nip rollers) R2 and R3 are arranged at a predetermined interval along the transport direction (+ X direction) of the substrate P, and give a predetermined slack (play) to the substrate P after exposure. Similarly to the drive roller R1, the drive rollers R2 and R3 rotate while holding both front and back surfaces of the substrate P, and transport the substrate P toward the processing apparatus PR3. The tension adjusting rollers RT1 and RT2 are urged in the −Z direction, and apply a predetermined tension in the longitudinal direction to the substrate P that is wound around and supported by the rotary drum DR. As a result, the longitudinal tension applied to the substrate P applied to the rotating drum DR is stabilized within a predetermined range. The control device 16 rotates the driving rollers R1 to R3 by controlling a rotation driving source (not shown) (for example, a motor, a speed reducer, etc.). Note that the rotation shafts of the drive rollers R1 to R3 and the rotation shafts of the tension adjustment rollers RT1 and RT2 are parallel to the central axis AXo of the rotation drum DR.

  The light source device LS (LSa, LSb) generates and emits a pulsed beam (pulse beam, pulsed light, laser) LB. This beam LB is ultraviolet light having a peak wavelength in a wavelength band of 370 nm or less, and the emission frequency (oscillation frequency, predetermined frequency) of the beam LB is Fa. The beam LB emitted from the light source device LS (LSa, LSb) is incident on the exposure head 14 via the beam switching unit BDU. The light source device LS (LSa, LSb) emits and emits the beam LB at the emission frequency Fa according to the control of the control device 16. The configuration of the light source device LS (LSa, LSb) will be described later in detail. In the first embodiment, a semiconductor laser element that generates pulsed light in the infrared wavelength region, a fiber amplifier, an amplified red light, and the like. Consists of a wavelength conversion element (harmonic generation element) that converts pulsed light in the outer wavelength range to pulsed light in the ultraviolet wavelength range, with an oscillation frequency Fa of several hundred MHz, and an emission time of one pulsed light of about picoseconds It is assumed that a fiber amplifier laser light source (harmonic laser light source) capable of obtaining high-intensity ultraviolet pulsed light is used. In order to distinguish the beam LB from the light source device LSa and the beam LB from the light source device LSb, the beam LB from the light source device LSa may be represented by LBa and the beam LB from the light source device LSb may be represented by LBb.

  The beam switching unit BDU includes two light source devices LS (LSa, LSb) in two scanning units Un among a plurality of scanning units Un (n = 1, 2,..., 6) constituting the exposure head 14. ) From which the beam LB (LBa, LBb) is incident and the scanning unit Un to which the beam LB (LBa, LBb) is incident is switched. Specifically, the beam switching unit BDU causes the beam LBa from the light source device LSa to enter one scanning unit Un among the three scanning units U1 to U3, and then enters one scanning unit Un among the three scanning units U4 to U6. The beam LBb from the light source device LSb is incident. Further, the beam switching unit BDU switches the scanning unit Un to which the beam LBa is incident in the scanning units U1 to U3, and switches the scanning unit Un to which the scanning beam LBb is incident in the scanning units U4 to U6.

  The beam switching unit BDU switches the scanning unit Un on which the beams LBa and LBb are incident so that the beam LBn is incident on the scanning unit Un that scans the spot light SP. That is, the beam switching unit BDU causes the beam LBa from the light source device LSa to enter one of the scanning units U1 to U3 that scans the spot light SP. Similarly, the beam switching unit BDU causes the beam LBb from the light source device LSb to enter one scanning unit Un that scans the spot light SP among the scanning units U4 to U6. The beam switching unit BDU will be described in detail later. For the scanning units U1 to U3, the scanning unit Un that scans the spot light SP switches in the order of U1 → U2 → U3, and for the scanning units U4 to U6, scanning that scans the spot light SP. Assume that the unit Un is switched in the order of U4 → U5 → U6.

The exposure head 14 is a so-called multi-beam type exposure head in which a plurality of scanning units Un (U1 to U6) having the same configuration are arranged. The exposure head 14 draws a pattern on a part of the substrate P supported by the outer peripheral surface (circumferential surface) of the rotary drum DR by a plurality of scanning units Un (U1 to U6). Since the exposure head 14 repeatedly performs pattern exposure for an electronic device on the substrate P, an exposure region (electronic device formation region) W where the pattern is exposed is a predetermined interval along the longitudinal direction of the substrate P. A plurality are provided (see FIG. 4). The plurality of scanning units Un (U1 to U6) are arranged in a predetermined arrangement relationship. The plurality of scanning units Un (U1 to U6) are arranged in a staggered arrangement in two rows in the transport direction of the substrate P with the center plane Poc interposed therebetween. The odd-numbered scanning units U1, U3, U5 are arranged in a line on the upstream side (−X direction side) in the transport direction of the substrate P with respect to the center plane Poc and at a predetermined interval along the Y direction. Has been placed. The even-numbered scanning units U2, U4, U6 are arranged in a line at a predetermined interval along the Y direction on the downstream side (+ X direction side) in the transport direction of the substrate P with respect to the center plane Poc. Yes. The odd-numbered scanning units U1, U3, and U5 and the even-numbered scanning units U2, U4, and U6 are symmetrical with respect to the central plane Poc when viewed in the XZ plane perpendicular to the Y axis from which the central axis AXo extends. Is provided.

  Each scanning unit Un (U1 to U6) projects the beam LB from the light source device LS (LSa, LSb) so as to converge on the spot light SP on the irradiated surface of the substrate P, and the spot light SP, One-dimensional scanning is performed by the rotating polygon mirror PM (see FIG. 5). The spot light SP is one-dimensionally scanned on the irradiated surface of the substrate P by the polygon mirror PM of each scanning unit Un (U1 to U6). By this scanning of the spot light SP, a linear drawing line (scanning line) SLn (n = 1, 2, n) on which a pattern for one line is drawn on the substrate P (on the irradiated surface of the substrate P). ..., 6) are defined. The configuration of the scanning unit Un will be described in detail later.

  The scanning unit U1 scans the spot light SP along the drawing line SL1, and similarly, the scanning units U2 to U6 scan the spot light SP along the drawing lines SL2 to SL6. The drawing lines SLn (SL1 to SL6) of the plurality of scanning units Un (U1 to U6) are not separated from each other in the Y direction (the width direction of the substrate P, the main scanning direction), as shown in FIGS. , Are set to be spliced. The beam LB from the light source device LS (LSa, LSb) that enters the scanning unit Un via the beam switching unit BDU may be represented as LBn. The beam LBn incident on the scanning unit U1 may be represented by LB1, and similarly, the beam LBn incident on the scanning units U2 to U6 may be represented by LB2 to LB6. The beam LBn incident on the scanning unit Un may be a linearly polarized beam (P-polarized light or S-polarized light) polarized in a predetermined direction, and is a P-polarized beam in the first embodiment.

  As shown in FIG. 4, each of the scanning units Un (U1 to U6) shares the scanning area so that the plurality of scanning units Un (U1 to U6) cover all of the exposure area W in the width direction. ing. Thereby, each scanning unit Un (U1-U6) can draw a pattern for every several area | region (drawing range) divided | segmented in the width direction of the board | substrate P. FIG. For example, when the scanning length in the Y direction (the length of the drawing line SLn) by one scanning unit Un is about 20 to 60 mm, three odd numbered scanning units U1, U3, U5 and even numbered scanning unit U2 are used. , U4, and U6, a total of six scanning units Un in the Y direction, the width in the Y direction that can be drawn is increased to about 120 to 360 mm. In principle, the length of each drawing line SLn (SL1 to SL6) (length of the drawing range) is the same. That is, the scanning distance of the spot light SP of the beam LBn scanned along each of the drawing lines SL1 to SL6 is basically the same. Note that it is possible to increase the width of the exposure region W by increasing the length of the drawing line SLn itself or increasing the number of scanning units Un arranged in the Y direction.

  Each actual drawing line SLn (SL1 to SL6) is set slightly shorter than the maximum length (maximum scanning length) that the spot light SP can actually scan on the irradiated surface. For example, if the scanning length of the drawing line SLn on which pattern drawing is possible is 30 mm when the drawing magnification in the main scanning direction (Y direction) is an initial value (no magnification correction), the maximum scanning on the irradiated surface of the spot light SP The length is set to about 31 mm with a margin of about 0.5 mm on each of the drawing start point (scanning start point) side and the drawing end point (scanning end point) side of the drawing line SLn. With this setting, the position of the 30 mm drawing line SLn can be finely adjusted in the main scanning direction and the drawing magnification can be finely adjusted within the maximum scanning length of 31 mm of the spot light SP. Become. The maximum scanning length of the spot light SP is not limited to 31 mm, and is mainly determined by the aperture of the fθ lens FT (see FIG. 5) provided after the polygon mirror (rotating polygon mirror) PM in the scanning unit Un.

  The plurality of drawing lines SLn (SL1 to SL6) are arranged in a staggered arrangement in two rows in the circumferential direction of the rotary drum DR with the center plane Poc interposed therebetween. The odd-numbered drawing lines SL1, SL3, and SL5 are located on the irradiated surface of the substrate P on the upstream side (−X direction side) in the transport direction of the substrate P with respect to the center plane Poc. The even-numbered drawing lines SL2, SL4, and SL6 are positioned on the irradiated surface of the substrate P on the downstream side (+ X direction side) in the transport direction of the substrate P with respect to the center plane Poc. The drawing lines SL1 to SL6 are substantially parallel to the width direction of the substrate P, that is, the central axis AXo of the rotary drum DR.

  The drawing lines SL1, SL3, and SL5 are arranged in a line on a straight line at a predetermined interval along the width direction (main scanning direction) of the substrate P. Similarly, the drawing lines SL2, SL4, and SL6 are arranged in a line on the straight line at a predetermined interval along the width direction (main scanning direction) of the substrate P. At this time, the drawing line SL2 is arranged between the drawing line SL1 and the drawing line SL3 in the width direction of the substrate P. Similarly, the drawing line SL3 is arranged between the drawing line SL2 and the drawing line SL4 in the width direction of the substrate P. The drawing line SL4 is arranged between the drawing line SL3 and the drawing line SL5 with respect to the width direction of the substrate P, and the drawing line SL5 is arranged between the drawing line SL4 and the drawing line SL6 with respect to the width direction of the substrate P. Has been.

  The main scanning direction of the spot light SP of the beams LB1, LB3, and LB5 scanned along each of the odd-numbered drawing lines SL1, SL3, and SL5 is a one-dimensional direction and is the same direction. The main scanning direction of the spot light SP of the beams LB2, LB4, and LB6 scanned along the even-numbered drawing lines SL2, SL4, and SL6 is a one-dimensional direction and is the same direction. The main scanning direction of the spot light SP of the beams LB1, LB3, LB5 scanned along the drawing lines SL1, SL3, SL5 and the beams LB2, LB4, LB6 scanned along the drawing lines SL2, SL4, SL6. The main scanning direction of the spot light SP may be opposite to each other. In the first embodiment, the main scanning direction of the spot light SP of the beams LB1, LB3, and LB5 scanned along the drawing lines SL1, SL3, and SL5 is the -Y direction. The main scanning direction of the spot light SP of the beams LB2, LB4, and LB6 scanned along the drawing lines SL2, SL4, and SL6 is the + Y direction. Thereby, the drawing start point side ends of the drawing lines SL1, SL3, SL5 and the drawing start point side ends of the drawing lines SL2, SL4, SL6 are adjacent or partially overlapped in the Y direction. Further, the end of the drawing lines SL3 and SL5 on the drawing end point side and the end of the drawing lines SL2 and SL4 on the drawing end point side are adjacent or partially overlap in the Y direction. When arranging each drawing line SLn so that the ends of the drawing lines SLn adjacent in the Y direction partially overlap, for example, the drawing start point or the drawing end with respect to the length of each drawing line SLn It is preferable to overlap within a range of several percent or less in the Y direction including points. Note that joining the drawing lines SLn in the Y direction means that the ends of the drawing lines SLn are adjacent to each other or partially overlap in the Y direction.

  Note that the width in the sub-scanning direction (dimension in the X direction) of the drawing line SLn is a thickness corresponding to the size (diameter) φ of the spot light SP. For example, when the size (dimension) φ of the spot light SP is 3 μm, the width of the drawing line SLn is also 3 μm. The spot light SP may be projected along the drawing line SLn so as to overlap by a predetermined length (for example, 7/8 of the size φ of the spot light SP). Also, when drawing lines SLn (for example, the drawing line SL1 and the drawing line SL2) adjacent in the Y direction are connected to each other, they are overlapped by a predetermined length (for example, 7/8 of the size φ of the spot light SP). It is good.

In the case of the first embodiment, since the beam LB (LBa, LBb) from the light source device LS (LSa, LSb) is pulsed light, the spot light SP projected onto the drawing line SLn during main scanning. Is discrete according to the oscillation frequency Fa (for example, 400 MHz) of the beam LB (LBa, LBb). Therefore, it is necessary to overlap the spot light SP projected by one pulse light of the beam LB and the spot light SP projected by the next one pulse light in the main scanning direction. The amount of overlap is set by the size φ of the spot light SP, the scanning speed (main scanning speed) Vs of the spot light SP, and the oscillation frequency Fa of the beam LB. The effective size φ of the spot light SP is determined by 1 / e ² (or 1/2) of the peak intensity of the spot light SP when the intensity distribution of the spot light SP is approximated by a Gaussian distribution. In the first embodiment, the scanning speed Vs and the oscillation frequency Fa of the spot light SP are set so that the spot light SP overlaps the effective size (dimension) φ by about φ × 7/8. Is done. Accordingly, the projection interval of the spot light SP along the main scanning direction is φ / 8. Therefore, also in the sub-scanning direction (direction orthogonal to the drawing line SLn), the substrate P is effective for the spot light SP between one scanning of the spot light SP along the drawing line SLn and the next scanning. It is desirable to set so as to move by a distance of about 1/8 of a large size φ. The exposure amount to the photosensitive functional layer on the substrate P can be set by adjusting the peak value of the beam LB (pulse light). However, the exposure amount can be increased in a situation where the intensity of the beam LB cannot be increased. In the case where the spot light SP is desired, the spot light SP is caused to fall by the decrease in the scanning speed Vs of the spot light SP in the main scanning direction, the increase in the oscillation frequency Fa of the beam LB, or the decrease in the transport speed Vt of the substrate P in the sub scanning direction. The overlap amount in the main scanning direction or the sub-scanning direction may be increased. The scanning speed Vs of the spot light SP in the main scanning direction increases in proportion to the rotational speed (rotational speed Vp) of the polygon mirror PM.

Each scanning unit Un (U1 to U6) irradiates each beam LBn toward the substrate P so that each beam LBn travels toward the central axis AXo of the rotary drum DR at least in the XZ plane. Thereby, the optical path (beam central axis) of the beam LBn traveling from each scanning unit Un (U1 to U6) toward the substrate P becomes parallel to the normal line of the irradiated surface of the substrate P in the XZ plane. Further, the scanning unit Un (U1 to U6), the beam LBn is irradiated to the drawing line SLn (SL1 to SL6) is such that the normal to the irradiated surface of the base plate P, the beam LBn the substrate P Irradiate toward. That is, the beam LBn (LB1 to LB6) projected onto the substrate P is scanned in a telecentric state with respect to the main scanning direction of the spot light SP on the irradiated surface. Here, a line perpendicular to the irradiated surface of the substrate P (also referred to as an optical axis) through each midpoint of a predetermined drawing line SLn (SL1 to SL6) defined by each scanning unit Un (U1 to U6). Is referred to as the irradiation center axis Len (Le1 to Le6).

  Each irradiation central axis Len (Le1 to Le6) is a line connecting the drawing lines SL1 to SL6 and the central axis AXo on the XZ plane. The irradiation center axes Le1, Le3, Le5 of the odd-numbered scanning units U1, U3, U5 are in the same direction in the XZ plane, and the irradiation center axes Le2 of the even-numbered scanning units U2, U4, U6. , Le4 and Le6 are in the same direction in the XZ plane. Further, the irradiation center axes Le1, Le3, Le5 and the irradiation center axes Le2, Le4, Le6 are set such that the angle is ± θ1 with respect to the center plane Poc in the XZ plane (see FIG. 2).

  A plurality of alignment microscopes AM1m (AM11 to AM14) and AM2m (AM21 to AM24) shown in FIG. 2 are for detecting a plurality of alignment marks MKm (MK1 to MK4) formed on the substrate P shown in FIG. And a plurality (four in the first embodiment) are provided along the Y direction. The plurality of alignment marks MKm (MK1 to MK4) are reference marks for relatively aligning (aligning) the substrate P with a predetermined pattern drawn in the exposure region W on the irradiated surface of the substrate P. It is. A plurality of alignment microscopes AM1m (AM11 to AM14) and AM2m (AM21 to AM24) are arranged on the substrate P supported by the outer peripheral surface (circumferential surface) of the rotating drum DR, and a plurality of alignment marks MKm (MK1 to MK4). Is detected. The plurality of alignment microscopes AM1m (AM11 to AM14) are more than the irradiated area (area surrounded by the drawing lines SL1 to SL6) on the substrate P by the spot light SP of the beam LBn (LB1 to LB6) from the exposure head 14. It is provided on the upstream side (−X direction side) in the transport direction of the substrate P. Further, the plurality of alignment microscopes AM2m (AM21 to AM24) are irradiated from the exposure head 14 by the spot light SP of the beam LBn (LB1 to LB6) on the substrate P (region surrounded by the drawing lines SL1 to SL6). Is also provided on the downstream side (+ X direction side) in the transport direction of the substrate P.

  The alignment microscopes AM1m (AM11 to AM14) and AM2m (AM21 to AM24) are a local region (observation region) Vw1m (Vw11) including a light source that projects illumination light for alignment onto the substrate P and an alignment mark MKm on the surface of the substrate P. To Vw14), an observation optical system (including an objective lens) for obtaining magnified images of Vw2m (Vw21 to Vw24), and while the substrate P is moving in the transport direction, the substrate P is moved at the transport speed Vt. And an image pickup device such as a CCD or a CMOS for picking up an image with a corresponding high-speed shutter. Imaging signals (image data) captured by each of the plurality of alignment microscopes AM1m (AM11 to AM14) and AM2m (AM21 to AM24) are sent to the control device 16. The mark position detection unit 106 (see FIG. 12) of the control device 16 performs image analysis of the plurality of image signals that have been sent, so that the position of the alignment mark MKm (MK1 to MK4) on the substrate P (mark position). Information). The alignment illumination light is light in a wavelength region that has little sensitivity to the photosensitive functional layer on the substrate P, for example, light having a wavelength of about 500 to 800 nm.

  The plurality of alignment marks MK1 to MK4 are provided around each exposure region W. A plurality of alignment marks MK1 and MK4 are formed on both sides of the exposure region W in the width direction of the substrate P at a constant interval Dh along the longitudinal direction of the substrate P. The alignment mark MK1 is formed on the −Y direction side in the width direction of the substrate P, and the alignment mark MK4 is formed on the + Y direction side in the width direction of the substrate P. Such alignment marks MK1 and MK4 are located at the same position in the longitudinal direction (X direction) of the substrate P when the substrate P is not deformed due to a large tension or a thermal process. Be placed. Furthermore, alignment marks MK2 and MK3 are between alignment mark MK1 and alignment mark MK4, and extend in the width direction (short direction) of substrate P at the margins of exposure region W between the + X direction side and the −X direction side. Is formed. The alignment marks MK2 and MK3 are formed between the exposure area W and the exposure area W. The alignment mark MK2 is formed on the −Y direction side in the width direction of the substrate P, and the alignment mark MK3 is formed on the + Y direction side of the substrate P.

  Further, the spacing in the Y direction between the alignment mark MK1 and the alignment mark MK2 in the blank portion arranged at the −Y direction end of the substrate P, the spacing in the Y direction between the blank alignment portion MK2 and the alignment mark MK3, and The interval in the Y direction between the alignment mark MK4 arranged at the end on the + Y direction side of the substrate P and the alignment mark MK3 in the margin is set to the same distance. These alignment marks MKm (MK1 to MK4) may be formed together when the first pattern layer is formed. For example, when the pattern of the first layer is exposed, the alignment mark pattern may be exposed around the exposure area W where the pattern is exposed. The alignment mark MKm may be formed in the exposure area W. For example, it may be formed in the exposure area W along the outline of the exposure area W. Further, a pattern portion at a specific position or a specific shape portion in the pattern of the electronic device formed in the exposure region W may be used as the alignment mark MKm.

  As shown in FIG. 4, the alignment microscopes AM11 and AM21 are arranged so as to image the alignment mark MK1 existing in the observation areas (detection areas) Vw11 and Vw21 by the objective lens. Similarly, the alignment microscopes AM12 to AM14 and AM22 to AM24 are arranged so as to image the alignment marks MK2 to MK4 existing in the observation areas Vw12 to Vw14 and Vw22 to Vw24 by the objective lens. Therefore, the plurality of alignment microscopes AM11 to AM14 and AM21 to AM24 correspond to the positions of the plurality of alignment marks MK1 to MK4, and the substrates P in the order of AM11 to AM14 and AM21 to AM24 from the −Y direction side of the substrate P. It is provided along the width direction. In FIG. 3, illustration of the observation region Vw2m (Vw21 to Vw24) of the alignment microscope AM2m (AM21 to AM24) is omitted.

  In the plurality of alignment microscopes AM1m (AM11 to AM14), the distance between the exposure position (drawing lines SL1 to SL6) and the observation region Vw1m (Vw11 to Vw14) is shorter than the length of the exposure region W in the X direction with respect to the X direction. It is provided to become. Similarly, in the plurality of alignment microscopes AM2m (AM21 to AM24), the distance between the exposure position (drawing lines SL1 to SL6) and the observation region Vw2m (Vw21 to Vw24) with respect to the X direction is longer than the length of the exposure region W in the X direction. Is also provided to be shorter. The number of alignment microscopes AM1m and AM2m provided in the Y direction can be changed according to the number of alignment marks MKm formed in the width direction of the substrate P. The sizes of the observation regions Vw1m (Vw11 to Vw14) and Vw2m (Vw21 to Vw24) on the irradiated surface of the substrate P are set according to the sizes of the alignment marks MK1 to MK4 and the alignment accuracy (position measurement accuracy). However, it is about 100 to 500 μm square.

  As shown in FIG. 3, scale portions SDa and SDb having scales formed in an annular shape over the entire circumferential direction of the outer peripheral surface of the rotary drum DR are provided at both ends of the rotary drum DR. The scale portions SDa and SDb are diffraction gratings in which concave or convex lattice lines are engraved at a constant pitch (for example, 20 μm) in the circumferential direction of the outer peripheral surface of the rotary drum DR, and are configured as incremental scales. The The scale portions SDa and SDb rotate integrally with the rotary drum DR around the central axis AXo. A plurality of encoders ENja, ENjb (j = 1, 2, 3, 4) as scale reading heads for reading the scale portions SDa, SDb are provided so as to face the scale portions SDa, SDb (see FIG. 2, see FIG. In FIG. 3, the encoders EN4a and EN4b are not shown.

  The encoders ENja and ENjb optically detect the rotational angle position of the rotary drum DR. Four encoders ENja (EN1a, EN2a, EN3a, EN4a) are provided to face the scale portion SDa provided at the end portion on the −Y direction side of the rotary drum DR. Similarly, four encoders ENjb (EN1b, EN2b, EN3b, EN4b) are provided so as to face the scale part SDb provided at the end on the + Y direction side of the rotary drum DR.

  The encoders EN1a and EN1b are provided on the upstream side (−X direction side) in the transport direction of the substrate P with respect to the center plane Poc, and are disposed on the installation direction line Lx1 (see FIGS. 2 and 3). . The installation azimuth line Lx1 is a line connecting the projection positions (reading positions) of the measurement light beams on the scale portions SDa and SDb of the encoders EN1a and EN1b and the central axis AXo on the XZ plane. Further, the installation orientation line Lx1 is a line connecting the observation region Vw1m (Vw11 to Vw14) of each alignment microscope AM1m (AM11 to AM14) and the central axis AXo on the XZ plane. That is, the plurality of alignment microscopes AM1m (AM11 to AM14) are also arranged on the installation direction line Lx1.

  The encoders EN2a and EN2b are provided on the upstream side (−X direction side) in the transport direction of the substrate P with respect to the center plane Poc, and downstream in the transport direction of the substrate P (+ X direction) from the encoders EN1a and EN1b. Side). The encoders EN2a and EN2b are disposed on the installation direction line Lx2 (see FIGS. 2 and 3). The installation azimuth line Lx2 is a line connecting the projection positions (reading positions) of the measurement light beams on the scale portions SDa and SDb of the encoders EN2a and EN2b and the central axis AXo on the XZ plane. The installation azimuth line Lx2 overlaps with the irradiation center axes Le1, Le3, Le5 at the same angular position in the XZ plane.

  The encoders EN3a and EN3b are provided on the downstream side (+ X direction side) in the transport direction of the substrate P with respect to the center plane Poc, and are disposed on the installation direction line Lx3 (see FIGS. 2 and 3). The installation azimuth line Lx3 is a line connecting the projection positions (reading positions) of the light beams for measurement of the encoders EN3a and EN3b onto the scale portions SDa and SDb and the central axis AXo on the XZ plane. This installation orientation line Lx3 overlaps with the irradiation center axes Le2, Le4, and Le6 at the same angular position in the XZ plane. Therefore, the installation azimuth line Lx2 and the installation azimuth line Lx3 are set so that the angle is ± θ1 with respect to the center plane Poc in the XZ plane (see FIG. 2).

  The encoders EN4a and EN4b are provided on the downstream side (+ X direction side) in the transport direction of the substrate P from the encoders EN3a and EN3b, and are disposed on the installation direction line Lx4 (see FIG. 2). The installation azimuth line Lx4 is a line connecting the projection positions (reading positions) of the measurement light beams on the scale portions SDa and SDb of the encoders EN4a and EN4b and the central axis AXo on the XZ plane. Further, the installation orientation line Lx4 is a line connecting the observation region Vw2m (Vw21 to Vw24) of each alignment microscope AM2m (AM21 to AM24) and the central axis AXo on the XZ plane. That is, the plurality of alignment microscopes AM2m (AM21 to AM24) are also arranged on the installation direction line Lx4. The installation azimuth line Lx1 and the installation azimuth line Lx4 are set such that the angle is ± θ2 with respect to the center plane Poc in the XZ plane (see FIG. 2).

  The encoders ENja (EN1a to EN4a) and ENjb (EN1b to EN4b) project a measurement light beam toward the scale portions SDa and SDb, and detect the reflected light beam (diffracted light) to detect a pulse signal. Is output to the control device 16. The rotational position detector 108 (see FIG. 12) of the control device 16 counts the detection signal (pulse signal), thereby measuring the rotational angular position and angular change of the rotary drum DR with submicron resolution. From the change in the angle of the rotating drum DR, the transport speed Vt of the substrate P can also be measured. The rotational position detector 108 individually counts detection signals from the encoders ENja (EN1a to EN4a) and ENjb (EN1b to EN4b).

  Specifically, the rotational position detection unit 108 includes a plurality of counter circuits CNja (CN1a to CN4a) and CNjb (CN1b to CN4b). The counter circuit CN1a counts the detection signal from the encoder EN1a, and the counter circuit CN1b counts the detection signal from the encoder EN1b. Similarly, the counter circuits CN2a to CN4a and CN2b to CN4b count detection signals from the encoders EN2a to EN4a and EN2b to EN4b. Each of the counter circuits CNja (CN1a to CN4a) and CNjb (CN1b to CN4b) includes the encoders ENja (EN1a to EN4a) and ENjb (EN1b to EN4b) formed in a part of the circumferential direction of the scale portions SDa and SDb. When the origin mark (origin pattern) ZZ shown in FIG. 3 is detected, the count values corresponding to the encoders ENja and ENjb that have detected the origin mark ZZ are reset to zero.

  One of the count values of the counter circuits CN1a and CN1b or the average value thereof is used as the rotation angle position of the rotary drum DR on the installation direction line Lx1, and either one of the count values of the counter circuits CN2a and CN2b or the average The value is used as the rotation angle position of the rotary drum DR on the installation direction line Lx2. Similarly, one or the average value of the count values of the counter circuits CN3a and CN3b is used as the rotation angle position of the rotary drum DR on the installation direction line Lx3, and either one of the count values of the counter circuits CN4a and CN4b or The average value is used as the rotation angle position of the rotary drum DR on the installation direction line Lx4. In principle, the count values of the counter circuits CN1a and CN1b are the same except when the rotary drum DR rotates eccentrically with respect to the central axis AXo due to a manufacturing error of the rotary drum DR. Similarly, the count values of the counter circuits CN2a and CN2b are the same, and the count values of the counter circuits CN3a and CN3b and the count values of the counter circuits CN4a and CN4b are also the same.

  As described above, alignment microscope AM1m (AM11-AM14) and encoders EN1a, EN1b are arranged on installation orientation line Lx1, and alignment microscope AM2m (AM21-AM24) and encoders EN4a, EN4b are installation orientation lines Lx4. Is placed on top. Therefore, the position detection of the alignment mark MKm (MK1 to MK4) by the image analysis of the mark position detection unit 106 of the plurality of imaging signals captured by the plurality of alignment microscopes AM1m (AM11 to AM14), and the moment when the alignment microscope AM1m images The position of the substrate P on the installation orientation line Lx1 can be measured with high accuracy based on the information on the rotational angle position of the rotary drum DR (the count value based on the encoders EN1a and EN1b). Similarly, the position detection of the alignment mark MKm (MK1 to MK4) by the image analysis of the mark position detection unit 106 of the plurality of imaging signals captured by the plurality of alignment microscopes AM2m (AM21 to AM24), and the moment when the alignment microscope AM2m images The position of the substrate P on the installation orientation line Lx4 can be measured with high accuracy based on the information on the rotational angle position of the rotary drum DR (the count value based on the encoders EN4a and EN4b).

  Also, the count values of the detection signals from the encoders EN1a and EN1b, the count values of the detection signals from the encoders EN2a and EN2b, the count values of the detection signals from the encoders EN3a and EN3b, and the detection signals from the encoders EN4a and EN4b The count value is reset to zero at the moment when each encoder ENja, ENjb detects the origin mark ZZ. Therefore, when the position on the installation orientation line Lx1 of the substrate P wound around the rotary drum DR when the count value based on the encoders EN1a and EN1b is the first value (for example, 100) is the first position. When the first position on the substrate P is transported to the position on the installation orientation line Lx2 (the positions of the drawing lines SL1, SL3, SL5), the count value based on the encoders EN2a, EN2b is the first value (for example, , 100). Similarly, when the first position on the substrate P is transported to the position on the installation direction line Lx3 (the positions of the drawing lines SL2, SL4, SL6), the count value of the detection signal based on the encoders EN3a, EN3b is the first. (For example, 100). Similarly, when the first position on the substrate P is transported to the position on the installation orientation line Lx4, the count value of the detection signal based on the encoders EN4a and EN4b becomes the first value (for example, 100).

  By the way, the board | substrate P is wound inside the scale parts SDa and SDb of the both ends of rotating drum DR. In FIG. 2, the radius from the central axis AXo of the outer peripheral surface of the scale portions SDa and SDb is set smaller than the radius from the central axis AXo of the outer peripheral surface of the rotary drum DR. However, as shown in FIG. 3, the outer peripheral surfaces of the scale portions SDa and SDb may be set so as to be flush with the outer peripheral surface of the substrate P wound around the rotary drum DR. That is, the radius (distance) from the central axis AXo of the outer peripheral surfaces of the scale portions SDa and SDb and the radius (distance) from the central axis AXo of the outer peripheral surface (irradiated surface) of the substrate P wound around the rotary drum DR May be set to be the same. Accordingly, each of the encoders ENja (EN1a to EN4a) and ENjb (EN1b to EN4b) can detect the scale portions SDa and SDb at the same radial position as the irradiated surface of the substrate P wound around the rotary drum DR. . Therefore, Abbe error caused by the difference between the measurement positions by the encoders ENja and ENjb and the processing positions (drawing lines SL1 to SL6) in the radial direction of the rotary drum DR can be reduced.

  However, since the thickness of the substrate P as the irradiated body is greatly different from 10 to several hundred μm, the radius of the outer peripheral surface of the scale portions SDa and SDb and the outer peripheral surface of the substrate P wound around the rotary drum DR are It is difficult to always make the radius the same. Therefore, in the case of the scale portions SDa and SDb shown in FIG. 3, the radius of the outer peripheral surface (scale surface) is set to coincide with the radius of the outer peripheral surface of the rotary drum DR. Furthermore, the scale portions SDa and SDb can be formed of individual disks, and the disks (scale disks) can be coaxially attached to the shaft Sft of the rotary drum DR. Even in this case, it is preferable to align the radius of the outer peripheral surface (scale surface) of the scale disk and the radius of the outer peripheral surface of the rotary drum DR so that the Abbe error falls within the allowable value.

  From the above, the position of the alignment mark MKm (MK1 to MK4) detected by the alignment microscope AM1m (AM11 to AM14) on the substrate P and the count value based on the encoders EN1a and EN1b (count values of the counter circuits CN1a and CN1b) The start position of the drawing exposure of the exposure region W in the longitudinal direction (X direction) of the substrate P is determined by the control device 16 based on any one of these or the average value. Since the length of the exposure area W in the X direction is known in advance, the control device 16 determines the drawing exposure start position every time a predetermined number of alignment marks MKm (MK1 to MK4) are detected. When the count value based on the encoders EN1a and EN1b when the exposure start position is determined is the first value (for example, 100), the count value based on the encoders EN2a and EN2b is the first value (for example, 100), the drawing exposure start position of the exposure region W in the longitudinal direction of the substrate P is located on the drawing lines SL1, SL3, SL5. Accordingly, the scanning units U1, U3, and U5 can start scanning the spot light SP based on the count values of the encoders EN2a and EN2b. When the count value based on the encoders EN3a and EN3b becomes a first value (for example, 100), the drawing exposure start position of the exposure region W in the longitudinal direction of the substrate P is positioned on the drawing lines SL2, SL4, and SL6. To do. Therefore, the scanning units U2, U4, and U6 can start scanning the spot light SP based on the count values of the encoders EN3a and EN3b.

  Normally, the tension adjusting rollers RT1 and RT2 apply a predetermined tension to the substrate P in the longitudinal direction, so that the substrate P is conveyed along with the rotation of the rotating drum DR while being in close contact with the rotating drum DR. . However, because the rotational speed Vp of the rotating drum DR is high, or the tension applied to the substrate P by the tension adjusting rollers RT1 and RT2 is too low or too high, the substrate P slips with respect to the rotating drum DR. May occur. When the substrate P does not slip with respect to the rotary drum DR, the encoders EN1a and EN1b at the moment when the count value based on the encoders EN4a and 4b images the alignment mark MKmA (a specific alignment mark MKm) by the alignment microscope AM1m. When the count value is the same as the count value based on (for example, 150), this alignment mark MKmA is detected by the alignment microscope AM2m.

  However, when the substrate P slips with respect to the rotary drum DR, the count value based on the encoders EN4a and EN4b is a count value based on the encoders EN1a and EN1b at the moment when the alignment mark AMKm images the alignment mark MKmA (for example, , 150), the alignment mark MKmA is not detected by the alignment microscope AM2m. In this case, after the count value based on the encoders EN4a and EN4b exceeds 150, for example, the alignment mark MKmA is detected by the alignment microscope AM2m. Therefore, based on the count value based on the encoders EN1a and EN1b at the moment when the alignment mark MKmA is imaged by the alignment microscope AM1m, and the count value of the encoders EN4a and EN4b at the moment when the alignment mark MKmA is imaged by the alignment microscope AM2m, It is possible to obtain the slip amount with respect to As described above, the slip amount of the substrate P can be measured by additionally installing the alignment microscope AM2m and the encoders EN4a and EN4b.

  Next, the optical configuration of the scanning units Un (U1 to U6) will be described with reference to FIG. In addition, since each scanning unit Un (U1-U6) has the same structure, only the scanning unit U1 is demonstrated and the description is abbreviate | omitted about the other scanning unit Un. In FIG. 5, the direction parallel to the irradiation center axis Len (Le1) is the Zt direction, and the substrate P is on the plane orthogonal to the Zt direction, and the substrate P passes from the processing apparatus PR2 through the exposure apparatus EX to the processing apparatus PR3. The direction going to the Xt direction is defined as the Yt direction, and the direction perpendicular to the Xt direction on the plane orthogonal to the Zt direction is defined as the Yt direction. That is, the three-dimensional coordinates of Xt, Yt, and Zt in FIG. 5 are the same as the three-dimensional coordinates of X, Y, and Z in FIG. 2, and the Z-axis direction is parallel to the irradiation center axis Len (Le1). The three-dimensional coordinates rotated as described above.

  As shown in FIG. 5, in the scanning unit U1, along the traveling direction of the beam LB1 from the incident position of the beam LB1 to the irradiated surface (substrate P), a reflection mirror M10, a beam expander BE, a reflection mirror M11, Polarization beam splitter BS1, reflection mirror M12, shift optical member (parallel plate) SR, deflection adjustment optical member (prism) DP, field aperture FA, reflection mirror M13, λ / 4 wavelength plate QW, cylindrical lens CYA, reflection mirror M14, A polygon mirror PM, an fθ lens FT, a reflection mirror M15, and a cylindrical lens CYb are provided. Further, in the scanning unit U1, an origin sensor (origin detector) OP1 that detects the timing at which the scanning unit U1 can start drawing, and reflected light from the irradiated surface (substrate P) are detected via the polarization beam splitter BS1. An optical lens system G10 and a photodetector DT are provided.

  The beam LB1 incident on the scanning unit U1 travels in the −Zt direction, and is incident on the reflection mirror M10 inclined by 45 ° with respect to the XtYt plane. The axis of the beam LB1 incident on the scanning unit U1 is incident on the reflection mirror M10 so as to be coaxial with the irradiation center axis Le1. The reflection mirror M10 functions as an incident optical member that causes the beam LB1 to enter the scanning unit U1, and the incident beam LB1 is moved from the reflection mirror M10 to the −Xt direction along the optical axis AXa set parallel to the Xt axis. Reflected in the -Xt direction toward the distant reflecting mirror M11. Therefore, the optical axis AXa is orthogonal to the irradiation center axis Le1 in a plane parallel to the XtZt plane. The beam LB1 reflected by the reflection mirror M10 passes through the beam expander BE arranged along the optical axis AXa and enters the reflection mirror M11. The beam expander BE expands the diameter of the transmitted beam LB1. The beam expander BE includes a condensing lens Be1 and a collimating lens Be2 that collimates the beam LB1 that diverges after being converged by the condensing lens Be1.

  The reflection mirror M11 is disposed with an inclination of 45 ° with respect to the YtZt plane, and reflects the incident beam LB1 (optical axis AXa) toward the polarization beam splitter BS1 in the −Yt direction. The polarization separation surface of the polarization beam splitter BS1 disposed away from the reflection mirror M11 in the -Yt direction is disposed at an angle of 45 ° with respect to the YtZt plane, reflects the P-polarized beam, and is orthogonal to the P-polarized light. It transmits a linearly polarized (S-polarized) beam polarized in the direction. Since the beam LB1 incident on the scanning unit U1 is a P-polarized beam, the polarization beam splitter BS1 reflects the beam LB1 from the reflection mirror M11 in the -Xt direction and guides it to the reflection mirror M12 side.

  The reflection mirror M12 is disposed with an inclination of 45 ° with respect to the XtYt plane, and reflects the incident beam LB1 in the −Zt direction toward the reflection mirror M13 that is separated from the reflection mirror M12 in the −Zt direction. The beam LB1 reflected by the reflection mirror M12 passes through the shift optical member SR, the deflection adjustment optical member DP, and the field aperture (field stop) FA along the optical axis AXc parallel to the Zt axis, and reaches the reflection mirror M13. Incident. The shift optical member SR two-dimensionally adjusts the center position in the cross section of the beam LB1 in a plane (XtYt plane) orthogonal to the traveling direction (optical axis AXc) of the beam LB1. The shift optical member SR is composed of two quartz parallel plates Sr1 and Sr2 arranged along the optical axis AXc. The parallel plate Sr1 can be tilted about the Xt axis, and the parallel plate Sr2 is Yt axis. Can be tilted around. The parallel plates Sr1 and Sr2 are inclined about the Xt axis and the Yt axis, respectively, so that the position of the center of the beam LB1 is shifted two-dimensionally by a minute amount on the XtYt plane orthogonal to the traveling direction of the beam LB1. The parallel plates Sr1 and Sr2 are driven by an actuator (drive unit) (not shown) under the control of the control device 16.

  The deflection adjusting optical member DP finely adjusts the inclination of the beam LB1 reflected by the reflecting mirror M12 and passing through the shift optical member SR with respect to the optical axis AXc. The deflection adjusting optical member DP is composed of two wedge-shaped prisms Dp1 and Dp2 arranged along the optical axis AXc, and each of the prisms Dp1 and Dp2 is provided so as to be able to rotate 360 ° about the optical axis AXc. It has been. By adjusting the rotational angle positions of the two prisms Dp1 and Dp2, the axis of the beam LB1 reaching the reflecting mirror M13 and the optical axis AXc are made parallel, or the axis of the beam LB1 reaching the irradiated surface of the substrate P and irradiation Parallelism with the central axis Le1 is performed. Note that the beam LB1 after the deflection adjustment by the two prisms Dp1 and Dp2 may be laterally shifted in a plane parallel to the cross section of the beam LB1, and the lateral shift is caused by the previous shift optical member SR. Can be returned to. The prisms Dp1 and Dp2 are driven by an actuator (drive unit) (not shown) under the control of the control device 16.

  Thus, the beam LB1 that has passed through the shift optical member SR and the deflection adjustment optical member DP passes through the circular aperture of the field aperture FA and reaches the reflection mirror M13. The circular aperture of the field aperture FA is a stop that cuts the skirt portion of the intensity distribution in the cross section of the beam LB1 expanded by the beam expander BE. If the circular aperture of the field aperture FA is a variable iris diaphragm whose diameter can be adjusted, the intensity (luminance) of the spot light SP can be adjusted.

  The reflection mirror M13 is arranged with an inclination of 45 ° with respect to the XtYt plane, and reflects the incident beam LB1 toward the reflection mirror M14 in the + Xt direction. The beam LB1 reflected by the reflection mirror M13 enters the reflection mirror M14 via the λ / 4 wavelength plate QW and the cylindrical lens CYa. The reflection mirror M14 reflects the incident beam LB1 toward the polygon mirror (rotating polygonal mirror, scanning deflection member) PM. The polygon mirror PM reflects the incident beam LB1 toward the + Xt direction toward the fθ lens FT having the optical axis AXf parallel to the Xt axis. The polygon mirror PM deflects (reflects) the incident beam LB1 one-dimensionally in a plane parallel to the XtYt plane in order to scan the spot light SP of the beam LB1 on the irradiated surface of the substrate P. Specifically, the polygon mirror PM has a rotation axis AXp extending in the Zt-axis direction and a plurality of reflection surfaces RP formed around the rotation axis AXp (in this embodiment, the number Np of reflection surfaces RP is eight). ). By rotating the polygon mirror PM around the rotation axis AXp in a predetermined rotation direction, the reflection angle of the pulsed beam LB1 irradiated on the reflection surface RP can be continuously changed. Thereby, the reflection direction of the beam LB1 is deflected by the single reflection surface RP, and the spot light SP of the beam LB1 irradiated on the irradiated surface of the substrate P is changed in the main scanning direction (width direction of the substrate P, Yt direction). Can be scanned along.

  That is, the spot light SP of the beam LB1 can be scanned along the main scanning direction by using one reflecting surface RP. For this reason, the number of drawing lines SL1 in which the spot light SP is scanned on the irradiated surface of the substrate P by one rotation of the polygon mirror PM is eight, which is the same as the number of the reflecting surfaces RP. The polygon mirror PM is rotated at a constant speed by a rotation drive source (for example, a motor, a speed reduction mechanism, etc.) RM under the control of the control device 16. As described above, the effective length (for example, 30 mm) of the drawing line SL1 is shorter than the maximum scanning length (for example, 31 mm) that allows the spot light SP to be scanned by the polygon mirror PM. In the initial setting (design), the center point of the drawing line SL1 (the point through which the irradiation center axis Le1 passes) is set at the center of the maximum scanning length.

  The cylindrical lens CYa converges the incident beam LB1 on the reflection surface RP of the polygon mirror PM in the non-scanning direction (Zt direction) orthogonal to the main scanning direction (rotation direction) by the polygon mirror PM. That is, the cylindrical lens CYa converges the beam LB1 in a slit shape (ellipse shape) extending in a direction parallel to the XtYt plane on the reflection surface RP. The case where the reflecting surface RP is inclined with respect to the Zt direction (the inclination of the reflecting surface RP with respect to the normal of the XtYt plane) due to the cylindrical lens CYa whose generating line is parallel to the Yt direction and the cylindrical lens CYb described later. Even if it exists, the influence can be suppressed. For example, it is possible to prevent the irradiation position of the beam LB1 (drawing line SL1) irradiated on the irradiated surface of the substrate P from shifting in the Xt direction due to a slight tilt error for each reflecting surface RP of the polygon mirror PM. it can.

  The fθ lens FT having the optical axis AXf extending in the Xt-axis direction is a telecentric scan lens that projects the beam LB1 reflected by the polygon mirror PM onto the reflection mirror M15 so as to be parallel to the optical axis AXf on the XtYt plane. It is. The incident angle θ of the beam LB1 to the fθ lens FT changes according to the rotation angle (θ / 2) of the polygon mirror PM. The fθ lens FT projects the beam LB1 to the image height position on the irradiated surface of the substrate P in proportion to the incident angle θ through the reflection mirror M15 and the cylindrical lens CYb. When the focal length is fo and the image height position is y, the fθ lens FT is designed so as to satisfy the relationship y = fo × θ (distortion aberration). Therefore, the fθ lens FT enables the beam LB1 to be scanned accurately at a constant speed in the Yt direction (Y direction). When the incident angle θ to the fθ lens FT is 0 degree, the beam LB1 incident on the fθ lens FT travels along the optical axis AXf.

  The reflection mirror M15 reflects the beam LB1 from the fθ lens FT in the −Zt direction toward the substrate P via the cylindrical lens CYb. By the fθ lens FT and the cylindrical lens CYb in which the generatrix is parallel to the Yt direction, the beam LB1 projected onto the substrate P is a minute spot light having a diameter of about several μm (for example, 3 μm) on the irradiated surface of the substrate P. Converged to SP. Further, the spot light SP projected on the irradiated surface of the substrate P is one-dimensionally scanned by the polygon mirror PM along the drawing line SL1 extending in the Yt direction. The optical axis AXf of the fθ lens FT and the irradiation center axis Le1 are on the same plane, and the plane is parallel to the XtZt plane. Therefore, the beam LB1 traveling on the optical axis AXf is reflected in the −Zt direction by the reflecting mirror M15, and is projected on the substrate P coaxially with the irradiation center axis Le1. In the first embodiment, at least the fθ lens FT functions as a projection optical system that projects the beam LB1 deflected by the polygon mirror PM onto the irradiated surface of the substrate P. At least the reflecting members (reflecting mirrors M11 to M15) and the polarizing beam splitter BS1 function as an optical path deflecting member that bends the optical path of the beam LB1 from the reflecting mirror M10 to the substrate P. By this optical path deflecting member, the incident axis of the beam LB1 incident on the reflecting mirror M10 and the irradiation center axis Le1 can be made substantially coaxial. With respect to the XtZt plane, the beam LB1 passing through the scanning unit U1 travels in the −Zt direction and is projected onto the substrate P after passing through a substantially U-shaped or U-shaped optical path.

  Thus, in a state where the substrate P is transported in the X direction, the spot light SP of the beam LBn (LB1 to LB6) is one-dimensionally in the main scanning direction (Y direction) by each scanning unit Un (U1 to U6). The spot light SP can be relatively two-dimensionally scanned on the irradiated surface of the substrate P.

  As an example, the effective length of the drawing lines SLn (SL1 to SL6) is 30 mm, and the effective size φ is 7/8 each of the spot light SP with 3 μm, that is, 2.625 (= 3 × 7 / 8) When the spot light SP is irradiated onto the irradiated surface of the substrate P along the drawing line SLn (SL1 to SL6) while overlapping each other by μm, the spot light SP is irradiated at an interval of 0.375 μm. Is done. Therefore, the number of spot lights SP irradiated in one scan is 80000 (= 30 [mm] /0.375 [μm]). Further, if the feed speed (conveyance speed) Vt of the substrate P in the sub-scanning direction is 0.6048 mm / sec and the scanning of the spot light SP is performed at intervals of 0.375 μm also in the sub-scanning direction, the drawing line SLn. The time difference Tpx between one scan start (drawing start) time and the next scan start time along the line is about 620 μsec (= 0.375 [μm] /0.6048 [mm / sec]). This time difference Tpx is a time required for the polygon mirror PM of the eight reflecting surfaces RP to rotate by one surface (45 degrees = 360 degrees / 8). In this case, since the time for one rotation of the polygon mirror PM needs to be set to be about 4.96 msec (= 8 × 620 [μsec]), the rotation speed Vp of the polygon mirror PM is about 201 per second. .613 rotations (= 1 / 4.96 [msec]), that is, about 12096.8 rpm.

  On the other hand, the maximum incident angle (corresponding to the maximum scanning length of the spot light SP) at which the beam LB1 reflected by one reflecting surface RP of the polygon mirror PM effectively enters the fθ lens FT is the focal length and the maximum scanning length of the fθ lens FT. It will be roughly decided by. As an example, in the case of a polygon mirror PM having eight reflecting surfaces RP, the ratio (scanning efficiency) of the rotation angle α that contributes to actual scanning out of the rotation angles 45 ° for one reflecting surface RP is expressed as α / 45 °. Is done. In the first embodiment, since the rotation angle α that contributes to actual scanning is 15 degrees, the scanning efficiency is 1/3 (= 15 degrees / 45 degrees), and the maximum incident angle of the fθ lens FT is 30 degrees. (± 15 degrees around the optical axis AXf). Therefore, the time Ts required to scan the spot light SP by the maximum scanning length (for example, 31 mm) of the drawing line SLn is Ts = Tpx × scanning efficiency. In the case of the above numerical example, the time Ts, About 206.666... Μsec (= 620 [μsec] / 3). Since the effective scanning length of the drawing lines SLn (SL1 to SL6) in the first embodiment is 30 mm, the scanning time Tsp of one scanning of the spot light SP along the drawing lines SLn is about 200 μsec ( = 206.666 (μsec) × 30 (mm) / 31 (mm)). Therefore, since it is necessary to irradiate 80000 spot light SP (pulse light) during this time Tsp, the emission frequency (oscillation frequency) Fa of the beam LB from the light source device LS (LSa, LSb) is Fa≈ 80000 times / 200 μsec = 400 MHz.

  The origin sensor OP1 shown in FIG. 5 generates an origin signal SZ1 when the rotational position of the reflection surface RP of the polygon mirror PM reaches a predetermined position where the scanning of the spot light SP by the reflection surface RP can be started. In other words, the origin sensor OP1 generates the origin signal SZ1 when the angle of the reflection surface RP from which the spot light SP is scanned becomes a predetermined angular position. Since the polygon mirror PM has eight reflecting surfaces RP, the origin sensor OP1 outputs the origin signal SZ1 eight times during the period in which the polygon mirror PM rotates once. The origin signal SZ1 generated by the origin sensor OP1 is sent to the control device 16. After the origin sensor OP1 generates the origin signal SZ1, scanning of the spot light SP along the drawing line SL1 is started after the delay time Td1 has elapsed. That is, the origin signal SZ1 is information indicating the drawing start timing (scanning start timing) of the spot light SP by the scanning unit U1.

  The origin sensor OP1 includes a beam transmission system opa for emitting a laser beam Bga in a wavelength region that is non-photosensitive to the photosensitive functional layer of the substrate P to the reflecting surface RP, and a laser beam Bga reflected by the reflecting surface RP. And a beam receiving system opb that receives the reflected beam Bgb and generates an origin signal SZ1. Although not shown, the beam transmission system opa includes a light source that emits a laser beam Bga and an optical member (such as a reflection mirror or a lens) that projects the laser beam Bga emitted from the light source onto the reflection surface RP. Although not shown, the beam receiving system opb includes a light receiving unit including a photoelectric conversion element that receives the received reflected beam Bgb and converts it into an electrical signal, and an optical member that guides the reflected beam Bgb reflected by the reflecting surface RP to the light receiving unit. (Reflection mirror, lens, etc.). The beam transmission system opa and the beam reception system opb emit the beam transmission system opa when the rotation position of the polygon mirror PM comes to a predetermined position immediately before the scanning of the spot light SP by the reflection surface RP is started. The reflected beam Bgb of the laser beam Bga is provided at a position where the beam receiving system opb can receive it. The origin sensors OPn provided in the scanning units U2 to U6 are represented by OP2 to OP6, and origin signals SZn generated by the origin sensors OP2 to OP6 are represented by SZ2 to SZ6. Based on the origin signal SZn (SZ1 to SZ6), the control device 16 manages which scanning unit Un will perform scanning of the spot light SP from now on. In addition, the delay time Tdn from when the origin signals SZ2 to SZ6 are generated until the scanning units U2 to U6 start scanning the spot light SP along the drawing lines SL2 to SL6 may be represented by Td2 to Td6.

  The photodetector DT illustrated in FIG. 5 includes a photoelectric conversion element that photoelectrically converts incident light. A predetermined reference pattern is formed on the surface of the rotary drum DR. The portion on the rotating drum DR on which the reference pattern is formed is made of a material having a low reflectance (10 to 50%) with respect to the wavelength region of the beam LB1, and on the rotating drum DR on which the reference pattern is not formed. The other part is made of a material having a reflectance of 10% or less or a material that absorbs light. Therefore, when the spot light SP of the beam LB1 is irradiated from the scanning unit U1 to the region where the reference pattern of the rotary drum DR is formed in a state where the substrate P is not wound (or a state where the substrate P is passed through the transparent portion), The reflected light is a cylindrical lens CYb, a reflection mirror M15, an fθ lens FT, a polygon mirror PM, a reflection mirror M14, a cylindrical lens CYa, a λ / 4 wavelength plate QW, a reflection mirror M13, a field aperture FA, a deflection adjusting optical member DP, The light passes through the shift optical member SR and the reflection mirror M12 and enters the polarization beam splitter BS1. Here, a λ / 4 wavelength plate QW is provided between the polarizing beam splitter BS1 and the substrate P, specifically, between the reflection mirror M13 and the cylindrical lens CYa. Thereby, the beam LB1 irradiated to the substrate P is converted from the P-polarized light to the circularly-polarized beam LB1 by the λ / 4 wavelength plate QW, and the reflected light incident on the polarizing beam splitter BS1 from the substrate P is converted to the λ / The circularly polarized light is converted to S polarized light by the four-wavelength plate QW. Accordingly, the reflected light from the substrate P passes through the polarization beam splitter BS1 and enters the photodetector DT via the optical lens system G10.

  At this time, with the pulsed beam LB1 continuously incident on the scanning unit U1, the rotating drum DR is rotated and the scanning unit U1 scans the spot light SP. The spot light SP is irradiated two-dimensionally. Therefore, the image of the reference pattern formed on the rotary drum DR can be acquired by the photodetector DT.

  Specifically, the change in the intensity of the photoelectric signal output from the photodetector DT is changed in response to a clock signal LTC (made by the light source device LS) for pulse emission of the beam LB1 (spot light SP). By sampling, it is acquired as one-dimensional image data in the Yt direction. Further, in response to the measurement values of the encoders EN2a and EN2b that measure the rotational angle position of the rotary drum DR on the drawing line SL1, every certain distance in the sub-scanning direction (for example, 1/8 of the size φ of the spot light SP). The two-dimensional image information on the surface of the rotating drum DR is obtained by arranging the one-dimensional image data in the Yt direction in the Xt direction. The control device 16 measures the inclination of the drawing line SL1 of the scanning unit U1 based on the acquired two-dimensional image information of the reference pattern of the rotating drum DR. The inclination of the drawing line SL1 may be a relative inclination between the scanning units Un (U1 to U6), or may be an inclination (absolute inclination) with respect to the central axis AXo of the rotary drum DR. . In addition, it cannot be overemphasized that the inclination of each drawing line SL2-SL6 can also be measured similarly.

  In addition, the plurality of scanning units Un (U1 to U6) are configured so that each of the plurality of scanning units Un (U1 to U6) can rotate (rotate) around the irradiation center axis Len (Le1 to Le6). It is held by a body frame (not shown). When each scanning unit Un (U1 to U6) rotates around the irradiation center axis Len (Le1 to Le6), each drawing line SLn (SL1 to SL6) also has an irradiation center axis Len on the irradiated surface of the substrate P. It rotates around (Le1 to Le6). Therefore, each drawing line SLn (SL1 to SL6) is inclined with respect to the Y direction. Even when each scanning unit Un (U1 to U6) rotates around the irradiation center axis Len (Le1 to Le6), the beam LBn (LB1 to LB6) passing through each scanning unit Un (U1 to U6). And the relative positional relationship between the scanning units Un (U1 to U6) and the optical members in each scanning unit Un (U1 to U6) remain unchanged. Therefore, each scanning unit Un (U1 to U6) can scan the spot light SP along the drawing line SLn (SL1 to SL6) rotated on the irradiated surface of the substrate P. The rotation of each scanning unit Un (U1 to U6) around the irradiation center axis Len (Le1 to Le6) is performed by an actuator (not shown) under the control of the control device 16.

  Therefore, the control device 16 rotates the scanning unit Un (U1 to U6) around the irradiation center axis Len (Le1 to Le6) in accordance with the measured inclination of each drawing line SLn, so that a plurality of drawing lines SLn are obtained. The parallel state of (SL1 to SL6) can be maintained. If the substrate P or the exposure region W is distorted (deformed) based on the position of the alignment mark MKm detected using the alignment microscopes AM1m and AM2m, the pattern to be drawn must be distorted accordingly. There is sex. Therefore, when the control device 16 determines that the substrate P and the exposure region W are distorted (deformed), the control unit 16 rotates the scanning unit Un (U1 to U6) around the irradiation center axis Len (Le1 to Le6). By moving, each drawing line SLn is slightly inclined with respect to the Y direction according to the distortion (deformation) of the substrate P and the exposure region W. At this time, in the present embodiment, as will be described later, a control for expanding and contracting a pattern drawn along each drawing line SLn according to a specified magnification (for example, ppm order), or Each drawing line SLn can be individually controlled to be slightly shifted in the sub-scanning direction (Xt direction in FIG. 5).

  Even if the irradiation center axis Len of the scanning unit Un and the axis (rotation center axis) in which the scanning unit Un actually rotates are not completely coincident with each other, they should be coaxial within a predetermined allowable range. That's fine. The predetermined allowable range is that the drawing start point (or drawing end point) of the actual drawing line SLn when the scanning unit Un is rotated by the angle θsm, the irradiation center axis Len, and the rotation center axis are completely set. When the scanning unit Un is rotated by a predetermined angle θsm when it is assumed that they match, the difference amount from the drawing start point (or drawing end point) of the designed drawing line SLn is the main scanning direction of the spot light SP. Is set to be within a predetermined distance (for example, the size φ of the spot light SP). Even if the optical axis of the beam LBn actually incident on the scanning unit Un does not completely coincide with the rotation center axis of the scanning unit Un, it is sufficient if it is coaxial within the predetermined allowable range.

  FIG. 6 is a configuration diagram of the beam switching unit BDU. The beam switching unit BDU includes a plurality of selection optical elements AOMn (AOM1 to AOM6), a plurality of condenser lenses CD1 to CD6, a plurality of reflection mirrors M1 to M14, a plurality of unit side incidence mirrors IM1 to IM6, It has a plurality of collimating lenses CL1 to CL6 and absorbers TR1 and TR2. The selection optical elements AOMn (AOM1 to AOM6) are transmissive to the beam LB (LBa, LBb), and are acousto-optic modulators (AOMs) driven by ultrasonic signals. is there. These optical members (selection optical elements AOM1 to AOM6, condensing lenses CD1 to CD6, reflecting mirrors M1 to M14, unit side incident mirrors IM1 to IM6, collimating lenses CL1 to CL6, and absorbers TR1 and TR2) Is supported by a plate-like support member IUB. The support member IUB supports these optical members from below (the −Z direction side) above the plurality of scanning units Un (U1 to U6) (+ Z direction side). Therefore, the support member IUB also has a function of insulating between the selection optical element AOMn (AOM1 to AOM6) serving as a heat generation source and the plurality of scanning units Un (U1 to U6).

  The light path from the light source device LSa is guided to the absorber TR1 by the reflection mirrors M1 to M6 having its optical path bent in a spiral shape. Similarly, the beam LBb from the light source device LSb is also bent into a spiral shape by the reflection mirrors M7 to M14 and guided to the absorber TR2. Hereinafter, the case where all the optical elements for selection AOMn (AOM1 to AOM6) are in an off state (a state where no ultrasonic signal is applied) will be described in detail.

  A beam LBa (parallel light beam) from the light source device LSa travels in the + Y direction in parallel with the Y axis and enters the reflection mirror M1 through the condenser lens CD1. The beam LBa reflected in the −X direction by the reflection mirror M1 passes straight through the first selection optical element AOM1 disposed at the focal position (beam waist position) of the condenser lens CD1, and is parallel again by the collimator lens CL1. It is made a luminous flux and reaches the reflection mirror M2. The beam LBa reflected in the + Y direction by the reflection mirror M2 is reflected in the + X direction by the reflection mirror M3 after passing through the condenser lens CD2.

  The beam LBa reflected in the + X direction by the reflection mirror M3 passes straight through the second selection optical element AOM2 disposed at the focal position (beam waist position) of the condenser lens CD2, and is parallel again by the collimating lens CL2. It is made a luminous flux and reaches the reflection mirror M4. The beam LBa reflected in the + Y direction by the reflection mirror M4 is reflected in the −X direction by the reflection mirror M5 after passing through the condenser lens CD3. The beam LBa reflected in the −X direction by the reflecting mirror M5 is transmitted straight through the third selection optical element AOM3 disposed at the focal position (beam waist position) of the condenser lens CD3, and again by the collimating lens CL3. The light beam is converted into a parallel light beam and reaches the reflection mirror M6. The beam LBa reflected in the + Y direction by the reflection mirror M6 enters the absorber TR1. The absorber TR1 is an optical trap that absorbs the beam LBa in order to suppress leakage of the beam LBa to the outside.

  A beam LBb (parallel light beam) from the light source device LSb travels in the + Y direction parallel to the Y axis and enters the reflection mirror M13, and the beam LBb reflected in the + X direction by the reflection mirror M13 is reflected in the + Y direction by the reflection mirror M14. Is done. The beam LBb reflected in the + Y direction by the reflection mirror M14 is reflected in the + X direction by the reflection mirror M7 after passing through the condenser lens CD4. The beam LBb reflected in the + X direction by the reflection mirror M7 is transmitted straight through the fourth selection optical element AOM4 disposed at the focal position (beam waist position) of the condenser lens CD4, and parallel again by the collimating lens CL4. It is made a luminous flux and reaches the reflection mirror M8. The beam LBb reflected in the + Y direction by the reflection mirror M8 passes through the condenser lens CD5 and then is reflected in the −X direction by the reflection mirror M9.

  The beam LBb reflected in the −X direction by the reflecting mirror M9 passes straight through the fifth selection optical element AOM5 disposed at the focal position (beam waist position) of the condenser lens CD5, and is again reflected by the collimating lens CL5. It is made a parallel light beam and reaches the reflection mirror M10. The beam LBb reflected in the + Y direction by the reflection mirror M10 passes through the condenser lens CD6 and then is reflected in the + X direction by the reflection mirror M11. The beam LBb reflected in the + X direction by the reflecting mirror M11 passes straight through the sixth selection optical element AOM6 disposed at the focal position (beam waist position) of the condenser lens CD6, and is parallel again by the collimating lens CL6. It is made a luminous flux and reaches the reflection mirror M12. The beam LBb reflected in the −Y direction by the reflection mirror M12 enters the absorber TR2. The absorber TR2 is an optical trap that absorbs the beam LBb in order to suppress leakage of the beam LBb to the outside.

  As described above, the selection optical elements AOM1 to AOM3 are arranged in series along the traveling direction of the beam LBa so as to sequentially transmit the beam LBa from the light source device LSa. The selection optical elements AOM1 to AOM3 are arranged so that the beam waist of the beam LBa is formed inside the selection optical elements AOM1 to AOM3 by the condensing lenses CD1 to CD3 and the collimating lenses CL1 to CL3. The As a result, the diameter of the beam LBa incident on the selection optical elements (acousto-optic modulation elements) AOM1 to AOM3 is reduced to increase the diffraction efficiency and increase the responsiveness. Similarly, the selection optical elements AOM4 to AOM6 are arranged in series along the traveling direction of the beam LBb so as to sequentially transmit the beam LBb from the light source device LSb. The selection optical elements AOM4 to AOM6 are arranged so that the beam waist of the beam LBb is formed inside the selection optical elements AOM4 to AOM6 by the condensing lenses CD4 to CD6 and the collimating lenses CL4 to CL6. The As a result, the diameter of the beam LBb incident on the optical elements for selection (acousto-optic modulation elements) AOM4 to AOM6 is reduced to increase the diffraction efficiency and improve the responsiveness.

  Each of the optical elements for selection AOMn (AOM1 to AOM6), when an ultrasonic signal (high frequency signal) is applied, the incident beam (0th order light) LB (LBa, LBb) is converted into a diffraction angle corresponding to the frequency of the high frequency. The first-order diffracted light diffracted in (2) is generated as an exit beam (beam LBn). In the first embodiment, the beams LBn emitted as first-order diffracted light from each of the plurality of selection optical elements AOMn (AOM1 to AOM6) are referred to as beams LB1 to LB6, and each of the selection optical elements AOMn (AOM1 to AOM6). ) Is treated as having the function of deflecting the optical path of the beam LB (LBa, LBb) from the light source devices LSa, LSb. However, in the actual acousto-optic modulation element, the generation efficiency of the first-order diffracted light is about 80% of the zero-order light, so that the beams LBn (LB1 to LB1) deflected by the respective selection optical elements AOMn (AOM1 to AOM6). LB6) is lower than the intensity of the original beam LB (LBa, LBb). In addition, when any one of the optical elements for selection AOMn (AOM1 to AOM6) is in the on state, about 20% of zero-order light that travels straight without being diffracted remains, which is finally absorbed by the absorbers TR1 and TR2. Is done.

  As shown in FIG. 6, each of the plurality of optical elements for selection AOMn (AOM1 to AOM6) applies a beam LBn (LB1 to LB6), which is a deflected first-order diffracted light, to an incident beam LB (LBa, LBb). On the other hand, it is installed so as to be deflected in the -Z direction. Beams LBn (LB1 to LB6) deflected and emitted from each of the selection optical elements AOMn (AOM1 to AOM6) are provided at positions separated from each of the selection optical elements AOMn (AOM1 to AOM6) by a predetermined distance. The light is projected onto the unit side incident mirrors IM1 to IM6, and is reflected so as to be coaxial with the irradiation central axes Le1 to Le6 in the -Z direction. The beams LB1 to LB6 reflected by the unit side incident mirrors IM1 to IM6 (hereinafter also simply referred to as mirrors IM1 to IM6) pass through each of the openings TH1 to TH6 formed in the support member IUB and pass through the irradiation center axis Le1. It is incident on each of the scanning units Un (U1 to U6) along -Le6.

  Since the optical element for selection AOMn is a diffraction grating that causes a periodic coarse / fine change in refractive index in a predetermined direction in the transmission member by ultrasonic waves, the incident beam LB (LBa, LBb) is linearly polarized light (P-polarized light). The polarization direction and the periodic direction of the diffraction grating are set so that the generation efficiency (diffraction efficiency) of the first-order diffracted light is the highest. As shown in FIG. 6, when the beam LB (LBa, LBs) on which each selection optical element AOMn is incident is diffracted and deflected in the −Z direction, the diffraction grating generated in the selection optical element AOMn Since the periodic direction is also the −Z direction, the polarization direction of the beam LB from the light source device LS (LSa, LSb) is set (adjusted) so as to match with the −Z direction.

  The configurations, functions, functions, etc. of the optical elements for selection AOMn (AOM1 to AOM6) may be the same. The plurality of optical elements for selection AOMn (AOM1 to AOM6) generate diffracted light by diffracting the incident beam LB (LBa, LBb) in accordance with on / off of a drive signal (high frequency signal) from the control device 16. Turn on / off. For example, when the driving optical signal (high frequency signal) from the control device 16 is not applied and the selection optical element AOM1 is in an off state, the selection optical element AOM1 transmits the incident beam LBa from the light source device LSa without diffracting it. Therefore, the beam LBa transmitted through the selection optical element AOM1 is transmitted through the collimator lens CL1 and enters the reflection mirror M2. On the other hand, the selection optical element AOM1 diffracts the incident beam LBa and directs it to the mirror IM1 when the drive signal (high frequency signal) from the control device 16 is applied and turned on. That is, the selection optical element AOM1 is switched by this drive signal. The mirror IM1 selects the beam LB1, which is the first-order diffracted light diffracted by the selection optical element AOM1, and reflects it to the scanning unit U1 side. The beam LB1 reflected by the selection mirror IM1 enters the scanning unit U1 along the irradiation center axis Le1 through the opening TH1 of the support member IUB. Therefore, the mirror IM1 reflects the incident beam LB1 so that the optical axis of the reflected beam LB1 is coaxial with the irradiation center axis Le1. In addition, when the selection optical element AOM1 is in the ON state, the 0th-order light (intensity of about 20% of the incident beam) of the beam LB that passes straight through the selection optical element AOM1 is the collimating lenses CL1 to CL3 thereafter. The light passes through the condenser lenses CD2 to CD3, the reflection mirrors M2 to M6, and the selection optical elements AOM2 to AOM3, and reaches the absorber TR1.

  Similarly, when the selection optical elements AOM2 and AOM3 are in an OFF state without being applied with a drive signal (high-frequency signal) from the control device 16, they do not diffract the incident beam LBa and do not diffract the incident beam LBa. The light passes through the reflection mirrors M4 and M6. On the other hand, the selection optical elements AOM2 and AOM3 are directed to the mirrors IM2 and IM3 by directing the beams LB2 and LB3, which are the first-order diffracted light of the incident beam LBa, when the drive signal from the control device 16 is applied and turned on. Dodge. The mirrors IM2 and IM3 reflect the beams LB2 and LB3 diffracted by the selection optical elements AOM2 and AOM3 toward the scanning units U2 and U3. The beams LB2 and LB3 reflected by the mirrors IM2 and IM3 enter the scanning units U2 and U3 through the openings TH2 and TH3 of the support member IUB and coaxial with the irradiation center axes Le2 and Le3.

  As described above, the control device 16 turns on / off (high / low) the drive signals (high frequency signals) to be applied to the selection optical elements AOM1 to AOM3, thereby enabling the selection optical elements AOM1 to AOM3. Either one is switched and the beam LBa goes to the subsequent selection optical element AOM2, AOM3 or absorber TR1, or one of the deflected beams LB1 to LB3 goes to the corresponding scanning unit U1 to U3 Switch.

  Further, when the selection optical element AOM4 is in an OFF state without being applied with a drive signal (high frequency signal) from the control device 16, the beam LBb from the incident light source device LSb is not diffracted and the collimating lens CL4 side. The light passes through (on the reflection mirror M8 side). On the other hand, the selection optical element AOM4 directs the beam LB4, which is the first-order diffracted light of the incident beam LBb, to the mirror IM4 when the drive signal from the control device 16 is applied and turned on. The mirror IM4 reflects the beam LB4 diffracted by the selection optical element AOM4 toward the scanning unit U4. The beam LB4 reflected by the mirror IM4 is coaxial with the irradiation center axis Le4 and enters the scanning unit U4 through the opening TH4 of the support member IUB.

  Similarly, when the selection optical elements AOM5 and AOM6 are in an off state without being applied with a drive signal (high frequency signal) from the control device 16, they do not diffract the incident beam LBb and are on the collimating lens CL5 and CL6 side. The light passes through the reflection mirrors M10 and M12. On the other hand, the selection optical elements AOM5 and AOM6 direct the beams LB5 and LB6, which are the first-order diffracted light of the incident beam LBb, to the mirrors IM5 and IM6 when the drive signal from the control device 16 is applied and turned on. . The mirrors IM5 and IM6 reflect the beams LB5 and LB6 diffracted by the selection optical elements AOM5 and AOM6 toward the scanning units U5 and U6. The beams LB5 and LB6 reflected by the mirrors IM5 and IM6 are coaxial with the irradiation center axes Le5 and Le6 and enter the scanning units U5 and U6 through the openings TH5 and TH6 of the support member IUB.

  As described above, the control device 16 turns on / off (high / low) the drive signals (high-frequency signals) to be applied to the selection optical elements AOM4 to AOM6, whereby the selection optical elements AOM4 to AOM6. Either one is switched and the beam LBb goes to the subsequent selection optical element AOM5, AOM6 or absorber TR2, or one of the deflected beams LB4 to LB6 goes to the corresponding scanning unit U4 to U6 Switch.

  As described above, the beam switching unit BDU includes the plurality of selection optical elements AOMn (AOM1 to AOM3) arranged in series along the traveling direction of the beam LBa from the light source device LSa, so that the optical path of the beam LBa And one scanning unit Un (U1 to U3) on which the beam LBn (LB1 to LB3) is incident can be selected. Therefore, the beams LBn (LB1 to LB3), which are the first-order diffracted lights of the beam LBa from the light source device LSa, can be sequentially incident on each of the three scanning units Un (U1 to U3). For example, when the beam LB1 is desired to be incident on the scanning unit U1, the control device 16 turns on only the selection optical element AOM1 among the plurality of selection optical elements AOM1 to AOM3, and applies the beam LB3 to the scanning unit U3. If it is desired to make the light incident, only the selection optical element AOM3 needs to be turned on.

  Similarly, the beam switching unit BDU includes a plurality of selection optical elements AOMn (AOM4 to AOM6) arranged in series along the traveling direction of the beam LBb from the light source device LSb, thereby switching the optical path of the beam LBb. Thus, one scanning unit Un (U4 to U6) on which the beam LBn (LB4 to LB6) is incident can be selected. Therefore, the beams LBn (LB4 to LB6), which are the first-order diffracted lights of the beam LBb from the light source device LSb, can be sequentially incident on each of the three scanning units Un (U4 to U6). For example, when the beam LB4 is desired to enter the scanning unit U4, the control device 16 turns on only the selection optical element AOM4 among the plurality of selection optical elements AOM4 to AOM6, and applies the beam LB6 to the scanning unit U6. If it is desired to make the light incident, only the selection optical element AOM6 needs to be turned on.

  The plurality of selection optical elements AOMn (AOM1 to AOM6) are provided corresponding to the plurality of scanning units Un (U1 to U6), and switch whether the beam LBn is incident on the corresponding scanning units Un. . In the first embodiment, the selection optical elements AOM1 to AOM3 are referred to as first optical element modules, and the selection optical elements AOM4 to AOM6 are referred to as second optical element modules. The scanning units U1 to U3 corresponding to the selection optical elements AOM1 to AOM3 of the first optical element module are referred to as first scanning modules and correspond to the selection optical elements AOM4 to AOM6 of the second optical element module. The scanning units U4 to U6 are referred to as a second scanning module. Therefore, the scanning of the spot light SP is performed in parallel by any one scanning unit Un of the first scanning module and any one scanning unit Un of the second scanning module.

  As described above, in the first embodiment, since the rotation angle α that contributes to the actual scanning of the polygon mirror PM of the scanning unit Un is set to 15 degrees, the scanning efficiency is ３. Therefore, for example, while one scanning unit Un rotates by an angle corresponding to one reflecting surface RP (45 degrees), the angle at which the spot light SP can be scanned is 15 degrees, and the other angle range (30 degrees) ), The spot light SP cannot be scanned, and the beam LBn incident on the polygon mirror PM during that time is wasted. Accordingly, while the rotation angle of the polygon mirror PM of one certain scanning unit Un is an angle that does not contribute to the actual scanning, the beam LBn is incident on the other scanning unit Un, so that the other scanning unit The spot light SP is scanned by the Un polygon mirror PM. Since the scanning efficiency of the polygon mirror PM is 1/3, the beam LBn is distributed to the other two scanning units Un between one scanning unit Un scanning the spot light SP and the next scanning. Thus, the spot light SP can be scanned. Therefore, in the first embodiment, the plurality of scanning units Un (U1 to U6) are divided into two groups (scanning modules), and the three scanning units U1 to U3 are used as the first scanning module. Units U4 to U6 were used as the second scanning module.

  Accordingly, for example, while the polygon mirror PM of the scanning unit U1 rotates 45 degrees (one reflection surface RP), the beam LBn (LB1 to LB3) is sequentially applied to any one of the three scanning units U1 to U3. It can be made incident. Therefore, each of the scanning units U1 to U3 can sequentially scan the spot light SP without wasting the beam LBa from the light source device LSa. Similarly, the beam LBn (LB4 to LB6) is sequentially incident on any one of the three scanning units U4 to U6 while the polygon mirror PM of the scanning unit U4 rotates 45 degrees (one reflection surface RP). be able to. Therefore, the scanning units U4 to U6 can sequentially scan the spot light SP without wasting the beam LBb from the light source device LSb. It should be noted that the polygon mirror PM is rotated exactly by an angle (45 degrees) corresponding to one reflecting surface RP after each scanning unit Un starts scanning the spot light SP and before starting the next scanning. become.

  In the first embodiment, each of the three scanning units Un (U1 to U3, U4 to U6) of each scanning module scans the spot light SP in a predetermined order. The control device 16 switches on the three selection optical elements AOMn (AOM1 to AOM3, AOM4 to AOM6) of each optical element module in a predetermined order, and the beams LBn (LB1 to LB3, LB4 to LB6) are incident. The scanning units Un (U1 to U3, U4 to U6) to be switched are sequentially switched. For example, when the order of scanning the spot light SP of the three scanning units U1 to U3 and U4 to U6 of each scanning module is U1 → U2 → U3, U4 → U5 → U6, the control device 16 Switches on the three optical elements AOMn (AOM1 to AOM3, AOM4 to AOM6) of each optical element module in the order of AOM1 → AOM2 → AOM3, AOM4 → AOM5 → AOM6, and the beam LBn is incident The scanning units Un to be switched are switched in the order of U1 → U2 → U3 and U4 → U5 → U6.

  In addition, while the polygon mirror PM rotates by an angle corresponding to one reflecting surface RP (45 degrees), the three scanning units Un (U1 to U3, U4 to U6) of each scanning module sequentially scan the spot light SP. For this purpose, each polygon mirror PM of the three scanning units Un (U1 to U3, U4 to U6) of each scanning module needs to satisfy the following conditions and rotate. The condition is that the polygon mirrors PM of the three scanning units Un (U1 to U3, U4 to U6) of each scanning module are synchronously controlled so as to have the same rotational speed Vp, and the polygon mirrors PM It is necessary to perform synchronous control so that the rotation angle position (angular position of each reflecting surface RP) has a predetermined phase relationship. The rotation with the same rotation speed Vp of the polygon mirror PM of the three scanning units Un of each scanning module is called synchronous rotation.

  Each selection optical element AOMn (AOM1 to AOM6) of the beam switching unit BDU is turned on only during one scanning period of the spot light SP by each polygon mirror PM of the scanning unit Un (U1 to U6). It only has to be. When the number of reflection surfaces of the polygon mirror PM is Np and the rotation speed of the polygon mirror PM is Vp (rpm), the time Tpx corresponding to the rotation angle of one reflection surface RP of the polygon mirror PM is Tpx = 60. / (Np × Vp) [seconds]. For example, when the number of reflection surfaces Np is 8 and the rotation speed Vp [rpm] is 1.209968 million, the time Tpx is about 0.62 milliseconds. This is about 1.6129 kHz in terms of frequency, compared to an acousto-optic modulation element for modulating a beam LB having a wavelength in the ultraviolet region at a high speed of about several tens of MHz in response to pattern data (drawing data). This means that an acousto-optic modulation element having a considerably low response frequency may be used. Therefore, the beams LB1 to LB6 (first order diffracted light) deflected with respect to the incident beam LB (0th order light) having a large diffraction angle can be used, and pass straight through the optical elements for selection AOM1 to AOM6. The arrangement of the mirrors IM1 to IM6 for separating the deflected beams LB1 to LB6 with respect to the path of the beam LB is facilitated.

  FIG. 7 is a diagram illustrating a configuration of a light source device (pulse light source device, pulse laser device) LSa (LSb). A light source device LSa (LSb) as a fiber laser device includes a pulsed light generation unit 20 and a control circuit 22. The pulse light generator 20 includes DFB semiconductor laser elements 30 and 32, a polarization beam splitter 34, an electro-optic element (intensity modulation section) 36 as a drawing optical modulator, a drive circuit 36a for the electro-optic element 36, and a polarization beam splitter. 38, an absorber 40, an excitation light source 42, a combiner 44, a fiber optical amplifier 46, wavelength conversion optical elements 48 and 50, and a plurality of lens elements GL. The control circuit 22 has a signal generator 22a that generates a clock signal LTC and a pixel shift pulse BSC. In order to distinguish the pixel shift pulse BSC output from the signal generation unit 22a of the light source device LSa from the pixel shift pulse BSC output from the signal generation unit 22a of the light source device LSb, the pixel shift pulse from the light source device LSa is distinguished. BSC may be represented by BSCa, and the pixel shift pulse BSC from the light source device LSb may be represented by BSCb.

  The DFB semiconductor laser element (first solid-state laser element) 30 generates sharp or sharp pulsed seed light (pulse beam, beam) S1 at an oscillation frequency Fa (for example, 400 MHz), which is a predetermined frequency, and is a DFB semiconductor. The laser element (second solid-state laser element) 32 generates a slow pulsed seed light (pulse beam, beam) S2 at an oscillation frequency Fa (for example, 400 MHz) which is a predetermined frequency. The seed light S1 generated by the DFB semiconductor laser element 30 and the seed light S2 generated by the DFB semiconductor laser element 32 are synchronized in emission timing. The seed lights S1 and S2 both have substantially the same energy per pulse, but have different polarization states, and the peak intensity of the seed light S1 is stronger. The seed light S1 and the seed light S2 are linearly polarized light, and their polarization directions are orthogonal to each other. In the first embodiment, the polarization state of the seed light S1 generated by the DFB semiconductor laser element 30 will be described as S-polarized light, and the polarization state of the seed light S2 generated by the DFB semiconductor laser element 32 will be described as P-polarized light. The seed lights S1 and S2 are light in the infrared wavelength region.

  The control circuit 22 controls the DFB semiconductor laser elements 30 and 32 so that the seed lights S1 and S2 emit light in response to the clock pulse of the clock signal LTC sent from the signal generator 22a. Thus, the DFB semiconductor laser elements 30 and 32 emit seed light S1 and S2 at a predetermined frequency (oscillation frequency) Fa in response to each clock pulse (oscillation frequency Fa) of the clock signal LTC. The control circuit 22 is controlled by the control device 16. The clock pulse period (= 1 / Fa) of the clock signal LTC is referred to as a reference period Ta. The seed lights S 1 and S 2 generated by the DFB semiconductor laser elements 30 and 32 are guided to the polarization beam splitter 34.

  As will be described in detail later, the clock signal LTC serving as the reference clock signal is a counter unit CONn (CON1 to CON6) for designating the row direction address in the memory circuit of the bitmap pattern data (FIG. 14). And a base of the pixel shift pulse BSC (BSCa, BSCb) supplied to each of them. Further, the signal generator 22a includes overall magnification correction information TMg for correcting the overall magnification of the drawing line SLn on the irradiated surface of the substrate P, and local magnification correction information for performing the local magnification correction of the drawing line SLn. CMgn (CMg1 to CMg6) is input from the control device 16. As will be described in detail later, this makes it possible to finely adjust the length (scanning length) of the drawing line SLn on the irradiated surface of the substrate P. The expansion / contraction of the drawing line SLn (fine adjustment of the scanning length) can be performed within the range of the maximum scanning length (for example, 31 mm) of the drawing line SLn. Note that the overall magnification correction in the first embodiment is simply described. Along the main scanning direction, the number of spot lights included in one pixel (1 bit) on the drawing data is kept constant. By uniformly finely adjusting the projection interval (that is, the oscillation frequency of the spot light) of the projected spot light SP, the magnification in the scanning direction of the entire drawing line SLn is uniformly corrected. Further, the local magnification correction in the first embodiment is simply described. One pixel (1 bit) located at each of a plurality of discrete correction points set on one drawing line is targeted. In addition, by increasing or decreasing the number of spot lights to be included in the pixel at the correction point with respect to the number of spot lights to be included in other adjacent pixels, the pixel at each correction point drawn on the substrate Is slightly expanded or contracted in the main scanning direction.

  The polarization beam splitter 34 transmits S-polarized light and reflects P-polarized light, and includes seed light S1 generated by the DFB semiconductor laser element 30 and seed light S2 generated by the DFB semiconductor laser element 32. Is guided to the electro-optic element 36. Specifically, the polarization beam splitter 34 transmits the S-polarized seed light S1 generated by the DFB semiconductor laser element 30 to guide the seed light S1 to the electro-optical element 36. The polarization beam splitter 34 reflects the P-polarized seed light S2 generated by the DFB semiconductor laser element 32 to guide the seed light S2 to the electro-optic element 36. The DFB semiconductor laser elements 30 and 32 and the polarization beam splitter 34 constitute a pulse light source unit 35 that generates seed lights S1 and S2.

  The electro-optic element (intensity modulation section) 36 is transmissive to the seed lights S1 and S2, and for example, an electro-optic modulator (EOM: Electro-Optic Modulator) is used. In response to the high / low state of the drawing bit string data SBa (SBb), the electro-optical element 36 switches the polarization states of the seed lights S1 and S2 by the drive circuit 36a. The drawing bit string data SBa is generated based on pattern data (bit pattern) corresponding to the pattern to be exposed by each of the scanning units U1 to U3, and the drawing bit string data SBb is each of the scanning units U4 to U6. Are generated based on pattern data (bit pattern) corresponding to the pattern to be exposed. Therefore, the drawing bit string data SBa is input to the drive circuit 36a of the light source device LSa, and the drawing bit string data SBb is input to the drive circuit 36a of the light source device LSb. The seed light S1 and S2 from each of the DFB semiconductor laser element 30 and the DFB semiconductor laser element 32 has a long wavelength range of 800 nm or more, and therefore, the electro-optic element 36 having a polarization state switching response of about GHz is used. Can do.

  The pattern data (drawing data) is provided for each scanning unit Un, and a pattern drawn by each scanning unit Un is divided by pixels having a dimension Pxy set according to the size φ of the spot light SP, and a plurality of pixels Are represented by logical information (pixel data) corresponding to the pattern. That is, this pattern data is two-dimensional so that the direction along the main scanning direction (Y direction) of the spot light SP is the row direction and the direction along the sub-transport direction (X direction) of the substrate P is the column direction. This is bitmap data composed of logical information of a plurality of pixels decomposed into two. The logical information of this pixel is 1-bit data of “0” or “1”. The logical information of “0” means that the intensity of the spot light SP irradiated on the substrate P is set to a low level (non-drawing), and the logical information of “1” is the spot light SP irradiated on the substrate P. This means that the intensity is set to a high level (drawing). Note that the pixel dimension Pxy in the main scanning direction (Y direction) is Py, and the sub-scanning direction (X direction) dimension is Px.

  The logical information of the pixels for one column of the pattern data corresponds to one drawing line SLn (SL1 to SL6). Therefore, the number of pixels for one column is determined in accordance with the pixel size Pxy on the irradiated surface of the substrate P and the length of the drawing line SLn. The size Pxy of one pixel is set to be equal to or larger than the size φ of the spot light SP. For example, when the effective size φ of the spot light SP is 3 μm, the size Pxy of one pixel is It is set to about 3 μm square or more. The intensity of the spot light SP projected onto the substrate P along one drawing line SLn (SL1 to SL6) is modulated according to the logical information of the pixels for one column. This logical information of the pixels for one column is called serial data DLn. That is, the pattern data is bitmap data in which serial data DLn are arranged in the column direction. Serial data DLn of the pattern data of the scanning unit U1 is represented by DL1, and similarly, serial data DLn of the pattern data of the scanning units U2 to U6 is represented by DL2 to DL6.

  Further, since the three scanning units U1 to U3 (U4 to U6) of the scanning module repeat the operation of scanning the spot light SP once in a predetermined order, the three scannings of the scanning module are correspondingly performed. The serial data DL1 to DL3 (DL4 to DL6) of the pattern data of the units U1 to U3 (U4 to U6) are also output to the drive circuit 36a of the light source device LSa (LSb) in a predetermined order. Serial data DL1 to DL3 sequentially output to the drive circuit 36a of the light source device LSa is referred to as drawing bit string data SBa, and serial data DL4 to DL6 sequentially output to the drive circuit 36a of the light source device LSb is referred to as drawing bit string data SBb. Call.

  For example, in the first scanning module, when the order of the scanning units Un that scan the spot light SP is U1 → U2 → U3, first, serial data DL1 for one column is the drive circuit 36a of the light source device LSa. The serial data DL1 to DL3 for one column constituting the drawing bit string data SBa is converted to DL1 → the serial data DL2 for one column is output to the drive circuit 36a of the light source device LSa. The signals are output to the drive circuit 36a of the light source device LSa in the order of DL2 → DL3. Thereafter, the serial data DL1 to DL3 of the next column is output to the drive circuit 36a of the light source device LSa as the drawing bit string data SBa in the order of DL1 → DL2 → DL3. Similarly, in the second scanning module, when the order of the scanning units Un that scan the spot light SP is U4 → U5 → U6, first, serial data DL4 for one column is the drive circuit of the light source device LSb. 36a, and subsequently serial data DL5 for one column is output to the drive circuit 36a of the light source device LSb, so that serial data DL4 to DL6 for one column constituting the drawing bit string data SBb is DL4. Output in the order of DL5 → DL6 to the drive circuit 36a of the light source device LSb. Thereafter, the serial data DL4 to DL6 of the next column are output to the drive circuit 36a of the light source device LSb as the drawing bit string data SBb in the order of DL4 → DL5 → DL6. A specific configuration for outputting the drawing bit string data SBa (SBb) to the drive circuit 36a of the light source device LSa (LSb) will be described in detail later.

  When the logical information for one pixel of the drawing bit string data SBa (SBb) input to the drive circuit 36a is in the low (“0”) state, the electro-optic element 36 remains as it is without changing the polarization state of the seed light S1 and S2. Guide to the polarization beam splitter 38. On the other hand, when the logical information for one pixel of the drawing bit string data SBa (SBb) input to the drive circuit 36a is in a high (“1”) state, the electro-optic element 36 is in the polarization state of the incident seed lights S1 and S2. Is changed, that is, the polarization direction is changed by 90 degrees and guided to the polarization beam splitter 38. In this way, the drive circuit 36a drives the electro-optic element 36 based on the drawing bit string data SBa (SBb), so that the logic information of the pixel of the drawing bit string data SBa (SBb) is high (“ 1 "), S-polarized seed light S1 is converted into P-polarized seed light S1, and P-polarized seed light S2 is converted into S-polarized seed light S2.

  The polarizing beam splitter 38 transmits P-polarized light and guides it to the combiner 44 via the lens element GL, and reflects S-polarized light to the absorber 40. The light (seed light) that passes through the polarization beam splitter 38 is represented by a beam Lse. The oscillation frequency of this pulsed beam Lse is Fa. The excitation light source 42 generates excitation light, and the generated excitation light is guided to the combiner 44 through the optical fiber 42a. The combiner 44 combines the beam Lse emitted from the polarization beam splitter 38 and the excitation light and outputs the combined light to the fiber optical amplifier 46. The fiber optical amplifier 46 is doped with a laser medium that is pumped by pumping light. Therefore, in the fiber optical amplifier 46 that transmits the synthesized beam Lse and the pumping light, the laser medium is pumped by the pumping light, so that the beam Lse as the seed light is amplified. As the laser medium doped in the fiber optical amplifier 46, rare earth elements such as erbium (Er), ytterbium (Yb), thulium (Tm) are used. The amplified beam Lse is emitted from the exit end 46 a of the fiber optical amplifier 46 with a predetermined divergence angle, converged or collimated by the lens element GL, and enters the wavelength conversion optical element 48.

The wavelength conversion optical element (first wavelength conversion optical element) 48 is configured to convert the incident beam Lse (wavelength λ) into the second half of the wavelength λ by the second harmonic generation (SHG). Convert to harmonics. As the wavelength conversion optical element 48, a PPLN (Periodically Poled LiNbO ₃ ) crystal which is a quasi phase matching (QPM) crystal is preferably used. It is also possible to use a PPLT (Periodically Poled LiTaO ₃ ) crystal or the like.

  The wavelength conversion optical element (second wavelength conversion optical element) 50 includes the second harmonic wave (wavelength λ / 2) converted by the wavelength conversion optical element 48 and the seed light remaining without being converted by the wavelength conversion optical element 48. A third frequency with a wavelength of 1/3 of λ is generated by sum frequency generation (SFG) with (wavelength λ). The third harmonic becomes ultraviolet light (beam LB) having a peak wavelength in a wavelength band of 370 mm or less (for example, 355 nm).

  As shown in FIG. 8, when the logic information for one pixel of the drawing bit string data SBa (SBb) applied to the drive circuit 36a is low (“0”), the electro-optical element (intensity modulation unit) 36 is incident. The seed lights S1 and S2 are guided to the polarization beam splitter 38 as they are without changing the polarization state. Therefore, the beam Lse that passes through the polarization beam splitter 38 becomes the seed light S2. Therefore, the P-polarized LBa (LBb) finally output from the light source device LSa (LSb) has the same oscillation profile (time characteristic) as the seed light S2 from the DFB semiconductor laser element 32. That is, in this case, the beam LBa (LBb) has a low pulse peak intensity and has a broad and dull characteristic. Since the fiber optical amplifier 46 has low amplification efficiency with respect to the seed light S2 having such a low peak intensity, the beam LBa (LBb) emitted from the light source device LSa (LSb) is not amplified to the energy required for exposure. Become. Therefore, from the viewpoint of exposure, the light source device LSa (LSb) substantially has the same result as not emitting the beam LBa (LBb). That is, the intensity of the spot light SP applied to the substrate P is at a low level. However, in a period during which the pattern is not exposed (non-exposure period), the ultraviolet light beam LBa (LBb) derived from the seed light S2 is continuously irradiated even if it has a slight intensity. Therefore, when the drawing lines SL1 to SL6 remain at the same position on the substrate P for a long time (for example, when the substrate P is stopped due to a trouble in the transport system), the light source device LSa (LSb) A movable shutter may be provided on the exit window (not shown) of the beam LBa (LBb) to close the exit window.

  On the other hand, as shown in FIG. 8, when the logic information for one pixel of the drawing bit string data SBa (SBb) applied to the drive circuit 36a is high (“1”), the electro-optic element (intensity modulation unit) 36 is The incident seed lights S1 and S2 are changed in polarization state and guided to the polarization beam splitter 38. Therefore, the beam Lse that passes through the polarization beam splitter 38 becomes the seed light S1. Therefore, the beam LBa (LBb) emitted from the light source device LSa (LSb) is generated from the seed light S1 from the DFB semiconductor laser element 30. Since the seed light S1 from the DFB semiconductor laser element 30 has a strong peak intensity, it is efficiently amplified by the fiber optical amplifier 46, and the P-polarized beam LBa (LBb) output from the light source device LSa (LSb) It has the energy necessary for exposure. That is, the intensity of the spot light SP applied to the substrate P is at a high level.

  As described above, since the electro-optical element 36 serving as the drawing light modulator is provided in the light source device LSa (LSb), the single optical-optical element (intensity modulation unit) 36 is controlled, so that the scanning module 3 The intensity of the spot light SP scanned by the two scanning units U1 to U3 (U4 to U6) can be modulated according to the pattern to be drawn. Therefore, the beam LBa (LBb) emitted from the light source device LSa (LSb) is a drawing beam whose intensity is modulated.

  Here, in the first embodiment, the seed light S2 is emitted from the light source devices LSa and LSb even during a period in which the drawing bit string data SBa (DL1 to DL3) and SBb (DL4 to DL6) are not applied to the drive circuit 36a. The beams LBa and LBb derived from the above are emitted. Therefore, even if the effective scanning length (for example, 30 mm) of the drawing line SLn is set within the range of the maximum scanning length (for example, 31 mm) capable of scanning with the spot light SP, actually, the spot light SP The light SP is scanned along the main scanning direction over the entire range of the maximum scanning length. However, the intensity of the spot light SP projected to a position other than the drawing line SLn is at a low level. Therefore, the drawing line SLn in the first embodiment refers to a scanning line that is scanned with the intensity of the spot light SP modulated by each serial data DL1 to DL6, that is, a drawing line. . Accordingly, the scanning period of the spot light SP along the drawing line SLn is substantially the same as the period during which the logical information of each pixel of the serial data DLn is output.

  In the configuration of FIG. 7, the DFB semiconductor laser element 32 and the polarization beam splitter 34 are omitted, and only the seed light S1 from the DFB semiconductor laser element 30 is converted into pattern data (drawing bit string data SBa, SBb, or serial data). It is also conceivable to guide the fiber optical amplifier 46 in a burst wave shape by switching the polarization state of the electro-optic element 36 based on DLn). However, when this configuration is adopted, the periodicity of incidence of the seed light S1 on the fiber optical amplifier 46 is greatly disturbed according to the pattern to be drawn. That is, when the seed light S1 from the DFB semiconductor laser element 30 does not enter the fiber optical amplifier 46 and then the seed light S1 enters the fiber optical amplifier 46, the seed light S1 immediately after the incident is more than normal. There is a problem that a beam is amplified with a large amplification factor and a beam having a greater intensity than specified is generated from the fiber optical amplifier 46. Therefore, in the first embodiment, as a preferable aspect, the seed light S2 (broad pulse light with low peak intensity) from the DFB semiconductor laser element 32 is used in a period in which the seed light S1 is not incident on the fiber optical amplifier 46. By entering the fiber optical amplifier 46, such a problem is solved.

  Further, although the electro-optic element 36 is switched, the DFB semiconductor laser elements 30 and 32 may be driven based on the pattern data (drawing bit string data SBa, SBb or serial data DLn). In this case, the DFB semiconductor laser elements 30 and 32 function as a drawing light modulator (intensity modulation unit). That is, the control circuit 22 controls the DFB semiconductor laser elements 30 and 32 based on the drawing bit string data SBa (DL1 to DL3) and SBb (DL4 to DL6), and oscillates in a pulse shape at a predetermined frequency Fa. Lights S1 and S2 are generated selectively (alternatively). In this case, the polarization beam splitters 34 and 38, the electro-optic element 36, and the absorber 40 are not necessary, and one of the seed lights S1 and S2 selectively pulse-oscillated from any one of the DFB semiconductor laser elements 30 and 32. Is directly incident on the combiner 44. At this time, the control circuit 22 prevents the seed light S1 from the DFB semiconductor laser element 30 and the seed light S2 from the DFB semiconductor laser element 32 from entering the fiber optical amplifier 46 at the same time. 32 drive is controlled. That is, when the substrate P is irradiated with the spot light SP of each beam LBn, the DFB semiconductor laser device 30 is controlled so that only the seed light S1 enters the fiber optical amplifier 46. When the substrate P is not irradiated with the spot light SP of each beam LBn (the intensity of the spot light SP is extremely low), the DFB semiconductor laser device 32 is set so that only the seed light S2 enters the fiber optical amplifier 46. Control. Thus, whether or not the substrate P is irradiated with the beam LBn is determined based on the logical information (high / low) of the pixel. In this case, the polarization states of the seed lights S1 and S2 may be P-polarized light.

Here, in the light source device LSa (LSb), during the scanning of the spot light SP, N spot lights SP (one main beam) are aligned along the main scanning direction with respect to one pixel of the dimension Pxy on the irradiated surface of the substrate P. In the first embodiment, the beam LBa (LBb) is emitted so as to be projected. The beam LBa (LBb) emitted from the light source device LSa (LSb) is generated in response to the clock pulse of the clock signal LTC generated by the signal generator 22a. Therefore, in order to project N spot lights SP (N is an integer of 2 or more) with respect to one pixel of the dimension Pxy, the relative scanning speed of the spot light SP with respect to the substrate P in the main scanning direction is set to Vs. At this time, the signal generator 22a needs to generate a clock pulse of the clock signal LTC with a reference period Ta (= 1 / Fa) determined by Pxy / (N × Vs) or Py / (N × Vs). That is, the clock signal LTC having a frequency N times higher than the frequency determined by the ratio Vs / Pxy (or Vs / Py) between the scanning speed Vs of the spot light SP and the pixel size Pxy (or Py) may be generated. become. For example, if the length of the effective drawing line SLn is 30 mm and the one scanning time Tsp is 200 μsec, the scanning speed Vs of the spot light SP is 150 m / sec. When the pixel size Pxy (Px and Py) is 3 μm which is the same as the effective size of the spot light SP and N is 8, the reference period Ta = 3 μm / (8 × 150 m / sec) = 0. The frequency Fa (= 1 / Ta) is 400 MHz.

  In principle, since N (= 8) spot lights SP correspond to one pixel, serial data to be output to the drive circuit 36a every time N (8) clock pulses of the clock signal LTC are output. The logical information of the pixels of the drawing bit string data SBa (SBb) composed of DL1 to DL3 (DL4 to DL6) is shifted by one in the row direction. As shown in FIG. 8, when eight clock pulses are output after the start of output of logical information (“1”) as pixel data of a certain pixel, “0” that is logical information of the next pixel is output. The And in order to carry out magnification correction of the length of each drawing line SL1-SL3 (SL4-SL6) locally, the correction object arrange | positioned discretely at equal intervals on each drawing line SL1-SL3 (SL4-SL6) N ± m (m is an integer of 1 or more having a relationship of m <N) corresponds to the pixels (hereinafter, correction pixels). For this reason, when N ± m clock pulses LTC are output to the correction pixel, one piece of logical information of the pixel of the drawing bit string data SBa (SBb) to be output to the drive circuit 36a is provided in the row direction. shift. For example, when N is 8 and m is 1, 7 or 9 spot lights SP are projected to the correction pixel. Therefore, the correction pixel expands and contracts in the main scanning direction, and as a result, each of the drawing lines SL1 to SL3 (SL4 to SL6) expands and contracts as a whole. Eight spot lights SP are projected to non-correction pixels other than the correction pixels. The correction pixel designation and the expansion / contraction rate (magnification) of the correction pixel in the main scanning direction include correction position information Nv for designating the correction pixel and magnification information SCA indicating the expansion / contraction rate (magnification) of the correction pixel in the main scanning direction. It is determined based on the included local magnification correction information (correction information) CMgn. The magnification information SCA is information indicating a value of “± m”. The local magnification correction information CMgn (CMg1 to CMg6) is provided for each scanning unit Un (U1 to U6).

  In the first embodiment, when local magnification correction is not performed, 80,000 spot lights SP per drawing line SLn are scanned along the main scanning direction, and eight spot lights SP per pixel are used. The number of pixels per drawing line SLn (the number of logical information of the serial data DLn) is 10,000 (= 80000/8). In addition, since “N” is 8 and “m” is 1, when the local magnification correction is performed, 7 or 9 (N ± m) spot lights SP are irradiated to the correction pixel. Since the number of pixels per drawing line SLn remains 10,000, the number of spot lights SP irradiated on one drawing line SLn is larger or smaller than 80000. For example, in the case of expansion, nine spot lights SP are projected onto the correction pixels. Therefore, when there are 40 correction pixels per drawing line SLn, the spot light SP irradiated on one drawing line SLn The number is 80040. In the case of reduction, since seven spot lights SP are projected to the correction pixels, if there are 40 correction pixels per drawing line SLn, the spot light SP irradiated on one drawing line SLn The number is 79960.

  FIG. 9 is a diagram illustrating a configuration of a signal generation unit 22a having a function of expanding and contracting correction pixels of the light source device LSa (LSb). The signal generation unit 22 a includes a clock generation unit (oscillator) 60, a correction pixel designation unit 62, and a transmission timing switching unit 64. The clock generation unit 60, the correction pixel designation unit 62, the transmission timing switching unit 64, and the like can be collectively configured by an FPGA (Field Programmable Gate Array).

  The clock generator 60 oscillates a clock signal (reference clock signal) LTC having an oscillation frequency Fa according to the overall magnification correction information TMg. In the first embodiment, when the overall magnification correction information TMg is 0, the clock generator 60 generates (generates) a clock pulse (clock signal LTC) at an oscillation frequency Fa of 400 MHz. Therefore, in this case, the light source device LS (LSa, LSb) emits a pulsed beam LB (LBa, LBb) at 400 MHz. In the first embodiment, when the oscillation frequency Fa is 400 MHz, the rotational speed Vp of the polygon mirror PM is such that 80000 spot lights SP are irradiated at intervals of 0.375 μm along the main scanning direction. Is set, the scanning length of the drawing line SLn is 30 mm. When the oscillation frequency Fa becomes higher than 400 MHz by the overall magnification correction information TMg, the projection interval in the main scanning direction of the spot light SP on the irradiated surface of the substrate P becomes shorter, and as a result, the drawing line SLn becomes shorter than 30 mm. Conversely, when the oscillation frequency Fa becomes lower than 400 MHz by the overall magnification correction information TMg, the projection interval in the scanning direction of the spot light SP on the irradiated surface of the substrate P becomes longer, and as a result, the drawing line SLn becomes longer than 30 mm. . Thus, the overall magnification of the drawing line SLn can be adjusted by the overall magnification correction information TMg. Although the length of the dimension Pxy in the main scanning direction of the pixel on the irradiated surface of the substrate P is expanded or contracted according to the overall magnification correction information TMg, the overall magnification correction information TMg is 0 in the first embodiment. Since (oscillation frequency Fa = 400 MHz), the pixel size Pxy is approximately the same as the size φ of the spot light SP. The clock signal LTC generated by the clock generation unit 60 is sent to the control circuit 22 and is also sent to the correction pixel designation unit 62 and the transmission timing switching unit 64.

  The correction pixel designating unit 62 designates at least one pixel arranged at a specific position as a correction pixel among a plurality of pixels arranged along each drawing line SLn (SL1 to SL6). The correction pixel specifying unit 62 specifies a correction pixel based on correction position information (set value) Nv that is a part of local magnification correction information (correction information) CMgn (CMg1 to CMg6). The correction position information Nv of the local magnification correction information (correction information) CMgn is on the drawing line SLn according to the drawing magnification of the pattern drawn along the drawing line SLn (or the magnification of the drawing line SLn in the main scanning direction). This is information for specifying a correction pixel at each of a plurality of discrete positions at equal intervals, and is information indicating a distance interval (equal interval) between the correction pixel and the correction pixel. Thereby, the correction pixel designation | designated part 62 can designate the some pixel arrange | positioned in the discrete position at equal intervals on drawing line SLn (SL1-SL6) as a correction pixel. Of the plurality of pixels arranged along the drawing lines SLn (SL1 to SL6), pixels that are not designated as correction pixels are non-correction pixels. Therefore, the correction pixel designation unit 62 designates correction pixels. It can be said that non-corrected pixels are also designated. When the value of “m” of “N ± m” is constant, the number of correction pixels to be specified increases as the expansion / contraction ratio of the drawing line SLn (SL1 to SL6) to be corrected increases.

  The transmission timing switching unit (transmission timing control unit) 64 includes the correction pixel specified by the correction pixel specifying unit 62 based on the correction position information Nv of the local magnification correction information CMgn (CMg1 to CMg6), and the local magnification correction information CMgn (CMg1). Based on the magnification information SCA of (˜CMg6), the transmission timing of the logical information of each pixel of the serial data DLn (DL1 to DL6) is controlled (switched). That is, when the pixel scanned with the spot light SP along the drawing line SLn (SL1 to SL6) is a correction pixel, the correction pixel expands and contracts based on the magnification information SCA of the local magnification correction information CMgn (CMg1 to CMg6). As described above, the transmission timing of the logical information of the pixels of the serial data DLn transmitted (supplied) to the drive circuit 36a (that is, the logical information for each pixel in the row direction of the pattern data) is switched.

  Specifically, the transmission timing switching unit 64 is configured to generate clock pulses (spots) of the clock signal LTC at the timing when the spot light SP scans pixels (normal pixels, non-correction pixels) that are not correction pixels on the drawing line SLn (SL1 to SL6). N of the light SP) corresponds to one pixel, and at the timing when the spot light SP scans the correction pixels on the drawing line SLn (SL1 to SL6), N ± m of the clock pulse (spot light SP) of the clock signal LTC. The transmission timing of the logical information of each pixel of the serial data DLn (DL1 to DL6) transmitted to the drive circuit 36a is switched so that each corresponds to one pixel. That is, when the spot light SP scans the normal pixels on the drawing line SLn (SL1 to SL6), the transmission timing switching unit 64 drives the logic information of the next pixel when N clock pulses of the clock signal LTC are generated. At the timing when the spot light SP scans the correction pixel on the drawing line SLn (SL1 to SL6), which is output to the circuit 36a, when N ± m clock pulses of the clock signal LTC are generated, the logic information of the next pixel is obtained. The transmission timing of the logical information of each pixel of the serial data DLn (DL1 to DL6) sent to the drive circuit 36a is switched (controlled) so as to be outputted to 36a. The value of “± m” is determined based on the magnification information SCA that is a part of the local magnification correction information CMgn (CMg1 to CMg6).

  The correction pixel designating unit 62 uses the correction position information Nv of the local magnification correction information CMgn corresponding to the scanning unit Un to which the beam LBn is incident by the beam switching unit BDU, on the drawing line SLn of the scanning unit Un to which the beam LBn is incident. A plurality of correction pixels to be arranged in is designated. The transmission timing switching unit 64 includes correction pixels on the drawing line SLn of the scanning unit Un on which the beam LBn specified by the correction pixel specifying unit 62 is incident and local magnification correction information CMgn corresponding to the scanning unit Un on which the beam LBn is incident. Based on the magnification information SCA, the transmission timing of the logical information of each pixel of the serial data DLn corresponding to the scanning unit Un on which the beam LBn is incident is switched.

  In the case of the light source device LSa, the beams LBa (LB1 to LB3) from the light source device LSa are changed to any of the first scanning modules (U1 to U3) by the first optical element modules (AOM1 to AOM3) of the beam switching unit BDU. Or one scanning unit Un. Therefore, the correction pixel designating unit 62 of the signal generation unit 22a of the light source device LSa uses the correction position information Nv of the local magnification correction information CMgn corresponding to one scanning unit Un incident with the beam LBn among the scanning units U1 to U3. Based on this, a correction pixel is designated. In addition, the transmission timing switching unit 64 of the signal generation unit 22a of the light source device LSa includes the magnification information SCA of the local magnification correction information CMgn of one scanning unit Un in which the beam LBn is incident among the scanning units U1 to U3, and the correction pixel. Based on the correction pixel designated by the designation unit 62, the transmission timing of logical information for each pixel of the serial data DLn corresponding to one scanning unit Un on which the beam LBn is incident is switched. For example, when the beam LB2 is incident on the scanning unit U2, the correction pixel specifying unit 62 of the light source device LSa is on the drawing line SL2 based on the correction position information Nv of the local magnification correction information CMg2 corresponding to the scanning unit U2. A plurality of pixels arranged at discrete positions at equal intervals are designated as correction pixels. The transmission timing switching unit 64 of the signal generation unit 22a of the light source device LSa scans based on the correction pixels on the drawing line SL2 specified by the correction pixel specification unit 62 and the magnification information SCA of the local magnification correction information CMg2. The transmission timing of the logical information of each pixel of the serial data DL2 corresponding to the unit U2 is switched.

  In the case of the light source device LSb, the beams LBb (LB4 to LB6) from the light source device LSb are converted into the second scanning modules (U4 to U6) by the second optical element modules (AOM4 to AOM6) of the beam switching unit BDU. To one of the scanning units Un. Therefore, the correction pixel designating unit 62 of the signal generation unit 22a of the light source device LSb uses the correction position information Nv of the local magnification correction information CMgn corresponding to one scanning unit Un incident with the beam LBn among the scanning units U4 to U6. Based on this, a correction pixel is designated. In addition, the transmission timing switching unit 64 of the signal generation unit 22a of the light source device LSb includes the magnification information SCA of the local magnification correction information CMgn of one scanning unit Un in which the beam LBn is incident among the scanning units U4 to U6, and the correction pixel. Based on the correction pixel designated by the designation unit 62, the transmission timing of the logical information for each pixel of the serial data DLn corresponding to one scanning unit Un on which the beam LBn is incident is switched. For example, when the beam LB6 is incident on the scanning unit U6, the correction pixel specifying unit 62 of the light source device LSb is on the drawing line SL6 based on the correction position information Nv of the local magnification correction information CMg6 corresponding to the scanning unit U6. A plurality of pixels arranged at discrete positions at equal intervals are designated as correction pixels. The transmission timing switching unit 64 of the light source device LSb corresponds to the scanning unit U6 based on the correction pixel on the drawing line SL6 specified by the correction pixel specifying unit 62 and the magnification information SCA of the local magnification correction information CMg6. The transmission timing of logic information of each pixel of the serial data DL6 is switched.

  The correction pixel specifying unit 62 will be described in detail. The correction pixel specifying unit 62 includes a first frequency division counter circuit 70 and delay elements 72 and 74. The first frequency division counter circuit 70 is a subtraction counter and receives a clock pulse (reference clock pulse) of the clock signal LTC. The first frequency division counter circuit 70 decrements the count value C1 every time the count value C1 is preset to the correction position information (set value) Nv and the clock pulse of the clock signal LTC is input. The first frequency division counter circuit 70 outputs a one-pulse coincidence signal Ida when the count value C1 becomes zero. That is, the first frequency division counter circuit 70 outputs the coincidence signal Ida when the clock pulse of the clock signal LTC is counted by the correction position information Nv. This coincidence signal Ida means that the next one pixel is a correction pixel, and the first frequency division counter circuit 70 designates the correction pixel by outputting the coincidence signal Ida. When the coincidence signal Ida is output, the spot light SP of the beam LBn emitted according to the next generated clock pulse is projected onto the correction pixel. The coincidence signal Ida output from the first frequency division counter circuit 70 is input to the first frequency division counter circuit 70 via the delay element 72. When the coincidence signal Ida is input, the first frequency dividing counter circuit 70 is in a presettable state. When a new clock pulse of the clock signal LTC is input, the first frequency dividing counter circuit 70 calculates the count value C1 as the correction position information (set value ) Preset to Nv. Thereby, a plurality of correction pixels can be designated at equal intervals along the drawing line SLn. A specific value of the correction position information Nv will be exemplified later.

  The coincidence signal Ida is output to the transmission timing switching unit 64 as a one-pulse setting signal Spp via the delay element 74. The delay elements 72 and 74 delay the input coincidence signal Ida for a predetermined time and output it. The delay time (fixed time) of the delay elements 72 and 74 is shorter than the reference period Ta of the clock signal LTC. By doing so, after the clock pulse of the clock signal LTC is input and the count value C1 becomes 0, the count value C1 of the first frequency division counter circuit 70 is corrected to the corrected position information Nv simultaneously with the input of the next clock pulse. Can be preset. In addition, after the clock pulse of the clock signal LTC is input and the count value C1 becomes 0, the setting signal Spp can be output to the transmission timing switching unit 64 before the next clock pulse is input.

  The transmission timing switching unit 64 will be specifically described. The transmission timing switching unit 64 includes a preset unit 76, a second frequency division counter circuit 78, and delay elements 80 and 82. The preset unit 76 divides the clock pulse (spot light SP) of the clock signal LTC generated continuously for each pixel, so that the number of clock pulses (spot light SP) of the clock signal LTC is the next pixel. A preset value indicating whether it corresponds is output. The preset unit 76 receives magnification information SCA (consisting of expansion / contraction information POL and expansion / contraction rate information REC), which is a part of the local magnification correction information CMgn. The expansion / contraction information POL is information indicating whether the correction pixel is expanded or contracted, and the expansion / contraction rate information REC is information indicating how much the correction pixel is expanded or contracted with respect to the normal pixel. As described above, the correction pixels correspond to N ± m spot lights SP (clock pulses of the clock signal LTC), and the magnification information SCA is information indicating “± m”. The polarity “±” of “± m” corresponds to the expansion / contraction information (polarity information) POL, and “m” corresponds to the expansion / contraction rate information REC. When the value of 1-bit expansion / contraction information POL is high (logical logic is “1”), it means polarity “+” (extends the correction pixel), and when low (logical value is “0”) , Polarity “−” (reducing the correction pixel). The same magnification information SCA is input during one scanning period of the spot light SP. Therefore, all the designated correction pixels on one drawing line SLn are expanded or reduced at the same magnification. In the first embodiment, m = 1 is set by the expansion / contraction rate information REC.

  During a period in which one pulse of the setting signal Spp is not generated (that is, a period in which the logical value of the setting signal Spp is “0”), the pixel through which the spot light SP scanned in the main scanning direction passes (scans) It becomes a normal pixel (normal pixel) other than the correction pixel. Therefore, since N (= 8) spot lights SP (clock pulse of the clock signal LTC) correspond to one pixel for the normal pixel, the preset unit 76 receives the one set of setting signal Spp. During a period when the preset value is not set, the preset value “7” is output to the second frequency division counter circuit 78. On the other hand, when the one-pulse setting signal Spp (logical value is “1”) is generated, the pixel through which the spot light SP will pass (scan) will be a correction pixel. Therefore, since N ± m (= 8 ± 1) spot lights SP (clock pulse of the clock signal LTC) correspond to one pixel for the correction pixel, the preset unit 76 sets one pulse. When the signal Spp is input, a preset value of 7 ± 1 is output to the second frequency division counter circuit 78. For example, when the expansion / contraction information POL is “+” (expansion), the preset unit 76 outputs a preset value of “8”, and when the expansion / contraction information POL is “−” (reduction), the preset unit 76 The preset value of “6” is output. Therefore, a truth table of preset values output by the preset unit 76 in the first embodiment is shown as in FIG.

  That is, as shown in the truth table of FIG. 10, the preset unit 76 is in the period when the one-pulse setting signal Spp is not input (that is, the period during which the logical value of the setting signal Spp is “0”). Regardless of POL, the preset value “7” is output to the second frequency division counter circuit 78. Further, when a one-pulse setting signal Spp (logical value is “1”) is input, the preset unit 76 divides the preset value (“6” or “8”) according to the expansion / contraction information POL by the second frequency division. It outputs to the counter circuit 78. When the expansion / contraction information POL is “1” (expansion), the preset unit 76 outputs a preset value of “8” to the second frequency division counter circuit 78, and when the expansion / contraction information POL is “0” (reduction). Outputs the preset value “6” to the second frequency division counter circuit 78.

  The second frequency division counter circuit 78 is a subtraction counter and receives a clock pulse of the clock signal LTC. The second frequency division counter circuit 78 presets the count value C2 to the preset value output from the preset unit 76, and decrements the count value C2 every time a clock pulse of the clock signal LTC is input. The second frequency division counter circuit 78 outputs a one-pulse coincidence signal Idb when the count value C2 becomes zero. That is, the second frequency division counter circuit 78 outputs the coincidence signal Idb when the clock pulse of the clock signal LTC is counted by the preset value. The coincidence signal Idb is information indicating a division of one pixel, and is output as a pixel shift pulse BSC (BSCa, BSCb) via the delay element 82. When this pixel shift pulse BSC (BSCa, BSCb) is generated, the logical information of the pixel of the serial data DLn output to the drive circuit 36a is shifted by one in the row direction. That is, when the pixel shift pulse BSC (BSCa, BSCb) is generated, the logical information of the next pixel in the row direction is input to the drive circuit 36a. When the pixel shift pulse BSCa is generated, the logical information of the pixels of the serial data DL1 to DL3 input to the drive circuit 36a of the light source device LSa is shifted by one in the row direction. Similarly, when the pixel shift pulse BSCb is generated, the light source The logical information of the pixels of the serial data DL4 to DL6 input to the drive circuit 36a of the device LSb is shifted by one in the row direction.

  The coincidence signal Idb output from the second frequency division counter circuit 78 is input to the second frequency division counter circuit 78 via the delay element 80. When the coincidence signal Idb is input, the second frequency division counter circuit 78 is in a presettable state. When a new clock pulse of the clock signal LTC is input, the count value C2 is output from the preset unit 76. Preset to the preset value. As a result, at the timing when the spot light SP scans the normal pixel, if eight clock pulses of the clock signal LTC are generated, the logic information of the next pixel is output, and at the timing when the spot light SP scans the correction pixel, When seven or nine clock pulses of the signal LTC are generated, the transmission timing of the logical information of each pixel of the serial data DLn can be switched so that the logical information of the next pixel is output.

  The delay elements 80 and 82 output the input coincidence signal Idb after being delayed for a predetermined time, and the delay time (predetermined time) is shorter than the reference period Ta of the clock signal LTC. By doing so, after the clock pulse of the clock signal LTC is inputted and the count value C2 becomes zero, the count value C2 of the second frequency division counter circuit 78 is simultaneously inputted from the preset unit 76 at the same time as the next clock pulse is inputted. It can be preset to the output preset value. Also, after the clock pulse of the clock signal LTC is input and the count value C2 becomes 0, the pixel shift pulse BSC (BSCa, BSCb) is output from the signal generator 22a before the next clock pulse is output. Can do.

  Thus, until the number of clock pulses of the clock signal LTC corresponding to the number of correction position information Nv is output, that is, until the spot light SP passes through the correction pixel, the one-pulse setting signal Spp is not generated. When the count value C2 reaches 0, the second frequency division counter circuit 78 presets the preset value “7” output from the preset unit 76. Therefore, every time eight clock pulses of the clock signal LTC are output, the pixel shift pulse BSC (BSCa, BSCb) is output from the signal generation unit 22a, and the logic of the pixel of the serial data DLn input to the drive circuit 36a. Information is shifted by one in the row direction. Therefore, at the timing when the spot light SP scanned in the main scanning direction passes through a pixel (normal pixel) that is not a correction target, eight spot lights SP are projected to one pixel.

  Each time the number of clock pulses of the clock signal LTC corresponding to the correction position information Nv is output, that is, every time the spot light SP passes through the correction pixel, the coincidence signal Ida from the first frequency division counter circuit 70 is output. A setting signal Spp of one pulse corresponding to is input to the preset unit 76. Therefore, the count value C2 of the second frequency division counter circuit 78 corresponds to the expansion / contraction information POL output from the preset unit 76 every time the number of clock pulses of the clock signal LTC corresponding to the number of correction position information Nv is output. It is preset to a preset value (“6” or “8”). Therefore, when the expansion / contraction information POL is “0”, the count value C2 of the second frequency division counter circuit 78 is preset to the preset value “6”, and thus seven clock pulses of the clock signal LTC are output. Then, the pixel shift pulse BSC (BSCa, BSCb) is output from the signal generator 22a. When the expansion / contraction information POL is “1”, the count value C2 of the second frequency division counter circuit 78 is preset to a preset value of “8”, so that nine clock pulses of the clock signal LTC are output. Then, the pixel shift pulse BSC (BSCa, BSCb) is output from the signal generator 22a. When the pixel shift pulse BSC (BSCa, BSCb) is output, the logical information of the pixel of the serial data DLn input to the drive circuit 36a is shifted by one in the row direction. Therefore, at the timing when the spot light SP scanned in the main scanning direction passes through the correction pixel, seven or nine spot lights SP are projected to one pixel. As a result, it is possible to expand and contract the correction pixels arranged on the drawing line SLn discretely at equal intervals (Nv intervals of clock pulses of the clock signal LTC).

  When the number of pixels of one drawing line SLn is 10,000 and the number of correction pixels is 40 on the drawing line SLn at equal intervals, the correction pixels are arranged at intervals of 250 pixels. In this case, there are 9960 pixels (normal pixels) other than the correction target. When the number of spot lights SP (clock pulses of the clock signal LTC) of the correction pixels is seven (when the expansion / contraction information POL is “0”), the number of spot lights SP projected on one drawing line SLn is 79960 ( = 80000-40 or = 9960 × 8 + 40 × 7), and the correction position information Nv is 1999 (= 79960/40). Accordingly, when viewed from one drawing line SLn, if the initial value of the scanning length (the length of the drawing line SLn) when there is no local magnification correction is 30 mm, the scanning length reduced by the local magnification correction is only 40. Since spot light SP is not irradiated, it is reduced by 15 μm (= 3 μm × 1/8 × 40), and the magnification is 0.9995 (= 29.985 / 30), that is, −500 ppm. When the number of spot lights SP (clock pulses of the clock signal LTC) of the correction pixels is nine (when the expansion / contraction information POL is “1”), the number of spot lights SP projected on one drawing line SLn is 80040 (= 80000 + 40 or = 9960 × 8 + 40 × 9), and the correction position information Nv is 2001 (= 80040/40). Accordingly, when viewed from one drawing line SLn, if the initial value of the scanning length (length of the drawing line SLn) when there is no local magnification correction is 30 mm, the scanning length expanded by the local magnification correction is only 40. Since the spot light SP is irradiated excessively, it is extended by 15 μm (= 3 μm × 1/8 × 40), and the magnification is 1.0005 (= 30.015 / 30), that is, +500 ppm. As described above, since the clock pulse of the clock signal LTC is generated at a predetermined frequency (oscillation frequency) Fa regardless of whether or not the local magnification correction is performed, the projection interval of the spot light SP along the drawing line SLn. In the first embodiment, the size φ of the spot light SP is 3 μm, and the spot light SP is projected while being overlapped by 7/8 along the main scanning direction. That is, the projection interval of the spot light SP is 0.375 μm, which is 1/8 of the size φ of the spot light SP, and the expansion / contraction amount per pixel in the correction pixel is also ± 0.375 μm.

  The correction position information (setting value) Nv of the local magnification correction information CMgn (CMg1 to CMg6) can be arbitrarily changed, and is appropriately set according to the magnification of the drawing line SLn. For example, the correction position information Nv may be set so that one correction pixel is positioned on the drawing line SLn. Although the drawing line SL can be expanded and contracted also by the overall magnification correction information TMg, the local magnification correction can perform finer magnification correction finer. For example, when the oscillation frequency Fa is 400 MHz and the initial value of the scanning length (drawing range) of the drawing line SLn is 30 mm, the scanning length of the drawing line SLn is expanded or contracted by 15 μm (ratio 500 ppm) based on the overall magnification correction information TMg. In this case, the oscillation frequency Fa must be increased or decreased by about 0.2 MHz (ratio 500 ppm), and adjustment thereof is difficult. Even if it can be adjusted, it switches to the adjusted oscillation frequency Fa with a certain delay (time constant), so that a desired magnification cannot be obtained during that time. Further, when the drawing magnification correction ratio is set to 500 ppm or less, for example, about several ppm to several tens of ppm, the discrete correction pixels are more effective than the overall magnification correction method for changing the oscillation frequency Fa of the light source device LSa (LSb). The local magnification correction method that increases or decreases the number of spot lights in the light source can easily perform correction with high resolution. Of course, if both the overall magnification correction method and the local magnification correction method are used in combination, there is an advantage that high-resolution correction can be performed while corresponding to a large drawing magnification correction ratio.

  Moreover, although m is set to 1 by the expansion / contraction rate information REC, m may be an integer of 1 or more having a relationship of m <N. Furthermore, although the value of the correction position information Nv is constant in one drawing line SLn, the correction position information Nv may be changed in one drawing line SLn. Even in this case, a plurality of correction pixels are designated at discrete positions on the drawing line SLn, but the interval between the correction pixels is not changed by changing the correction position information Nv. It can be made uniform. Furthermore, the position of the correction pixel may be varied without changing the number of correction pixels on the drawing line SLn for each scanning of the beam along the drawing line SLn or for each rotation of the polygon mirror PM. .

  Note that the clock pulse of the clock signal LTC generated by the clock generation unit 60 is supplied to the first frequency division counter circuit 70 of the correction pixel designation unit 62 and the second frequency division counter of the transmission timing switching unit 64 via the gate circuit GTa. It is input to the circuit 78. The gate circuit GTa is a gate that opens during a period in which a drawing permission signal SQn described later is high (logical value is 1). That is, the first frequency division counter circuit 70 and the second frequency division counter circuit 78 count the clock pulses of the clock signal LTC only while the drawing permission signal SQn is high. The drawing permission signal SQn (SQ1 to SQ6) is a signal indicating whether or not drawing by scanning of the spot light SP of the corresponding scanning unit Un (U1 to U6) is permitted, and drawing is permitted only during a high period. Is done. That is, while the drawing permission signal SQn (SQ1 to SQ6) is high, the spot light SP of the corresponding scanning unit Un (U1 to U6) is scanned along the drawing line SLn (SL1 to SL6) and serial. The intensity is modulated based on the data DLn (DL1 to DL6).

  Therefore, the three drawing permission signals SQ1 to SQ3 corresponding to the scanning units U1 to U3 are applied to the gate circuit GTa of the light source device LSa. The gate circuit GTa of the light source device LSa outputs a clock pulse of the clock signal LTC that is input while any of the drawing permission signals SQ1 to SQ3 is high (H). Similarly, three drawing permission signals SQ4 to SQ6 corresponding to the scanning units U4 to U6 are applied to the gate circuit GTa of the light source device LSb. The gate circuit GTa of the light source device LSb outputs a clock pulse of the clock signal LTC input during a period when any of the drawing permission signals SQ4 to SQ6 is high (H). As described above, the drawing line SLn means a range in which the intensity is modulated by the serial data DLn within the range of the maximum scanning length in which the spot light SP is scanned along the main scanning direction. As described above, the first frequency division counter circuit 70 accurately specifies the correction pixel located on the drawing line SLn by counting the clock pulse of the clock signal LTC only during the period when the drawing permission signal SQn is high. The second frequency division counter circuit 78 can accurately separate pixels located on the drawing line SL.

  FIG. 11 shows each clock pulse of the clock signal LTC, the count value C2 of the second frequency division counter circuit 78, the output timing of the pixel shift pulse BSC (BSCa, BSCb), and the pixel of the serial data DLn input to the drive circuit 36a. It is a time chart which shows the switching timing of this logic information. In FIG. 11, for the sake of convenience, the size φ of the spot light SP of the beam LB generated in response to the clock pulse of the clock signal LTC is displayed very small relative to the pixel size Pxy. As shown in FIG. 11, the second frequency division counter circuit 78 decrements the count value C2 every time the clock pulse of the clock signal LTC is input, and when the count value C2 becomes 0, the coincidence signal Idb (not shown). ) Is output. A pixel shift pulse BSC (BSCa, BSCb) is output in accordance with the coincidence signal Idb. The pixel shift pulse BSC (BSCa, BSCb) is output from the clock pulse when the count value C2 becomes 0 until the next clock pulse is input. In response to the pixel shift pulse BSC (BSCa, BSCb), the logical information of the pixel of the serial data DLn input to the drive circuit 36a is shifted by one in the row direction. That is, when the pixel shift pulse BSC (BSCa, BSCb) is output, the logical information of the pixel in the next row is output to the drive circuit 36a. FIG. 11 shows an example in which the logical information of the pixel is switched in the order of “0” → “1” → “1” → “0” in accordance with the output of the pixel shift pulse BSC (BSCa, BSCb). .

  Although not shown, the first frequency division counter circuit 70 decrements the count value C1 every time a clock pulse of the clock signal LTC is input, and outputs a coincidence signal Ida when the count value C1 becomes zero. In response to the coincidence signal Ida, a setting signal Spp (value is “1”) is generated and input to the preset unit 76. After the coincidence signal Ida is output, the first frequency division counter circuit 70 presets the count value C1 in the correction position information Nv when a new clock pulse of the clock signal LTC is input.

  When the count value C2 becomes 0, the second frequency division counter circuit 78 presets the count value C2 to the preset value output from the preset unit 76 simultaneously with the input of the clock pulse of the next clock signal LTC. The preset unit 76 outputs a preset value of “7” when the setting signal Spp (value is “1”) is not generated. For this reason, during the period in which one pulse of the setting signal Spp is not generated (the period in which the logical value of the setting signal Spp is “0”), the pixel shift from the signal generator 22a is performed every time eight clock pulses of the clock signal LTC are generated. Pulse BSC (BSCa, BSCb) is output. Therefore, in a period in which one pulse of the setting signal Spp is not generated, eight spot lights SP are projected along the main scanning direction with respect to one pixel (normal pixel).

  On the other hand, when the setting signal Spp (value “1”) is input to the preset unit 76 (when the count value C1 of the first frequency division counter circuit 70 becomes “0”), the preset value from the preset unit 76 is set. Is a value (“6” or “8”) corresponding to the expansion / contraction information POL. Therefore, when one pulse of the setting signal Spp (logical value “1”) is generated, the pixel shift pulse BSC (BSCa, BSCb) is generated from the signal generator 22a after the generation of seven or nine clock pulses of the clock signal LTC. Is output. Therefore, when one pulse of the setting signal Spp is generated, seven or nine spot lights SP are projected along one main scanning direction with respect to one pixel (correction pixel). In the example shown in FIG. 11, when the setting signal Spp is generated, the preset value is set to “6”. Therefore, when seven clock pulses are generated, the pixel shift pulse BSC (BSCa, BSCb) is output. Thereafter, until the count value C1 of the first frequency division counter circuit 70 becomes 0 again, the logic value of the setting signal Spp remains “0”, and therefore the count value C2 of the second frequency division counter circuit 78 The preset value is returned to “7”.

  Although the correction pixel designation unit 62 and the transmission timing switching unit 64 are provided inside the signal generation unit 22a, the correction pixel designation unit 62 and the transmission timing switching unit 64 are provided inside the control circuit 22 and are connected to the signal generation unit 22a. The correction pixel specifying unit 62 and the transmission timing switching unit 64 may be provided outside the control circuit 22. In this case, the correction pixel specifying unit 62 and the transmission timing switching unit 64 may be provided inside a beam control device 104 (to be described later) (for example, inside the drawing data output unit 114).

  FIG. 12 is a block diagram showing an electrical configuration of the exposure apparatus EX. The control device 16 of the exposure apparatus EX includes a polygon drive control unit 100, a selection element drive control unit 102, a beam control device 104, a mark position detection unit 106, and a rotation position detection unit 108. The origin signals SZn (SZ1 to SZ6) output from the origin sensors OPn (OP1 to OP6) of the scanning units Un (U1 to U6) are input to the polygon drive control unit 100 and the selection element drive control unit 102. In the example shown in FIG. 12, the beam LBa (LBb) from the light source device LSa (LSb) is diffracted by the selection optical element AOM2 (AOM5), and the beam LB2 (LB5) which is the first-order diffracted light is scanned unit U2. A state of being incident on (U5) is shown.

  The polygon drive control unit 100 drives and controls the rotation of the polygon mirror PM of each scanning unit Un (U1 to U6). The polygon drive control unit 100 has a rotation drive source (motor, speed reducer, etc.) RM that drives the polygon mirror PM of each scanning unit Un (U1 to U6), and drives and controls the rotation of the motor, thereby polygons. Drive and control the rotation of the mirror PM. The polygon drive control unit 100 performs three scans of each scan module so that the rotational angle positions of the polygon mirror PM of the three scan units Un (U1 to U3, U4 to U6) of each scan module have a predetermined phase relationship. Each polygon mirror PM of the unit Un (U1 to U3, U4 to U6) is rotated synchronously. Specifically, the polygon drive control unit 100 has the same rotational speed (number of rotations) Vp of the polygon mirror PM of the three scanning units Un (U1 to U3, U4 to U6) of each scanning module, and a constant angle. The rotation of the polygon mirror PM of the plurality of scanning units Un (U1 to U6) is controlled so that the phase of the rotation angle position is shifted by minutes. Note that the rotation speeds Vp of the polygon mirrors PM of the scanning units Un (U1 to U6) are all the same.

  In the first embodiment, as described above, the rotation angle α of the polygon mirror PM that contributes to actual scanning is set to 15 degrees, so that the scanning efficiency of the octagonal polygon mirror PM having eight reflecting surfaces RP is 1 / 3. In the first scanning module, the scanning of the spot light SP by the three scanning units Un is performed in the order of U1 → U2 → U3. Therefore, in this order, the polygons of each of the scanning units U1 to U3 are rotated at a constant speed so that the phase of the rotational angular position of each of the polygon mirrors PM of the three scanning units U1 to U3 is shifted by 15 degrees. The mirror PM is synchronously controlled by the polygon drive control unit 100. In the second scanning module, the scanning of the spot light SP by the three scanning units Un is performed in the order of U4 → U5 → U6. Therefore, in this order, each polygon mirror of each of the scanning units U4 to U6 is rotated so as to rotate at a constant speed with the phase of the rotational angle position of each polygon mirror PM of each of the three scanning units U4 to U6 being shifted by 15 degrees. PM is synchronously controlled by the polygon drive control unit 100.

  Specifically, as shown in FIG. 13, for example, for the first scanning module, the polygon drive control unit 100 uses the scanning unit U2 of the scanning unit U2 with reference to the origin signal SZ1 from the origin sensor OP1 of the scanning unit U1. The rotational phase of the polygon mirror PM of the scanning unit U2 is controlled so that the origin signal SZ2 from the origin sensor OP2 is delayed by the time Ts. The polygon drive control unit 100 uses the origin signal SZ1 as a reference so that the origin signal SZ3 from the origin sensor OP3 of the scan unit U3 is generated with a delay of 2 × time Ts, and the rotational phase of the polygon mirror PM of the scan unit U3. To control. This time Ts is a time during which the polygon mirror PM rotates by 15 degrees (maximum scanning time of the spot light SP). In the first embodiment, it is about 206.666... Μsec (= Tpx × 1/3). = 620 [μsec] / 3). Thereby, the phase difference of the rotation angle position of each polygon mirror PM of each of the scanning units U1 to U3 is shifted by 15 degrees in the order of U1, U2, U3. Therefore, the three scanning units U1 to U3 of the first scanning module can scan the spot light SP in the order of U1 → U2 → U3.

  Similarly, for the second scanning module, the polygon drive control unit 100 uses the origin signal SZ5 from the origin sensor OP4 of the scanning unit U5 as a reference for the origin signal SZ4 from the origin sensor OP4 of the scanning unit U4. The rotational phase of the polygon mirror PM of the scanning unit U5 is controlled so as to be delayed by Ts. The polygon drive control unit 100 uses the rotation origin of the polygon mirror PM of the scanning unit U6 so that the origin signal SZ6 from the origin sensor OP6 of the scanning unit U6 is delayed by 2 × time Ts with reference to the origin signal SZ4. To control. Thereby, the phase of the rotation angle position of each polygon mirror PM of each of the scanning units U4 to U6 is shifted by 15 degrees in the order of U4, U5, U6. Therefore, the three scanning units Un (U4 to U6) of the second scanning module can scan the spot light SP in the order of U4 → U5 → U6.

  The selection element drive control unit (beam switching drive control unit) 102 controls the selection optical elements AOMn (AOM1 to AOM3, AOM4 to AOM6) of each optical element module of the beam switching unit BDU, and controls one of the scanning modules. From the start of scanning of the spot light SP by the scanning unit Un until the start of the next scanning, the beam LB (LBa, LBb) from the light source device LS (LSa, LSb) is converted into three scanning units of each scanning module. It distributes to Un (U1-U3, U4-U6) in order. The polygon mirror PM rotates 45 degrees from the time when one scanning unit Un starts scanning the spot light SP until the next scanning starts, and the time interval is the time Tpx (= 3 × Ts). )

  Specifically, when the origin signal SZn (SZ1 to SZ6) is generated, the selection element drive control unit 102 generates the origin signal SZn (SZ1 to SZ6) for a certain time (on time Ton) after the origin signal SZn is generated. Drive signals (high-frequency signals) HFn (HF1 to HF6) are applied to the optical elements AOMn (AOM1 to AOM6) for selection corresponding to the scanning units Un (U1 to U6) that have generated. Thereby, the optical element AOMn for selection to which the drive signal (high frequency signal) HFn is applied is turned on for the on time Ton, and the beam LBn can be incident on the corresponding scanning unit Un. Further, since the beam LBn is incident on the scanning unit Un that has generated the origin signal SZn, the beam LBn can be incident on the scanning unit Un that can scan the spot light SP. The on-time Ton is a time equal to or shorter than the time Ts.

  Origin signals SZ1 to SZ3 generated in the three scanning units U1 to U3 of the first scanning module are generated in the order of SZ1 → SZ2 → SZ3 at time Ts intervals. Therefore, drive signals (high-frequency signals) HF1 to HF3 are applied to the selection optical elements AOM1 to AOM3 of the first optical element module in the order of AOM1 → AOM2 → AOM3 at time Ts intervals for the on time Ton. The Therefore, the first optical element modules (AOM1 to AOM3) are arranged in the order of U1 → U2 → U3 at a time Ts interval for one scanning unit Un on which the beam LBn (LB1 to LB3) from the light source device LSa is incident. Can be switched. As a result, the scanning unit Un that scans the spot light SP is switched in the order of U1 → U2 → U3 at time Ts intervals. In addition, the beam LBn (LB1 to LB3) from the light source device LSa is scanned three times during the time (Tpx = 3 × Ts) from when the scanning unit U1 starts scanning the spot light SP to the next scanning. The light can be incident on any one of the units Un (U1 to U3) in order.

  Similarly, origin signals SZ4 to SZ6 generated by the three scanning units U4 to U6 of the second scanning module are generated in the order of SZ4 → SZ5 → SZ6 at time Ts intervals. Therefore, drive signals (high frequency signals) HF4 to HF6 are applied to the selection optical elements AOM4 to AOM6 of the second optical element module in the order of AOM4 → AOM5 → AOM6 at time Ts intervals for the on time Ton. . Therefore, the second optical element module (AOM4 to AOM6) transmits one scanning unit Un incident with the beam LBn (LB4 to LB6) from the light source device LSb at time Ts intervals in the order of U4 → U5 → U6. Can be switched. As a result, the scanning unit Un that scans the spot light SP is switched in the order of U4 → U5 → U6 at time Ts intervals. In addition, during the time (Tpx = 3 × Ts) from when the scanning unit U4 starts scanning the spot light SP to when the next scanning is started, the beam LBn (LB4 to LB6) from the light source device LSb is scanned three times. The light can be incident on any one of the units Un (U4 to U6) in order.

  The selection element drive control unit 102 will be described in more detail. When the origin signal SZn (SZ1 to SZ6) is generated, the selection element drive control unit 102 generates the origin signal SZn (SZ1 to SZ6) as shown in FIG. After that, a plurality of incident permission signals LPn (LP1 to LP6) that become H (high) for a certain time (on time Ton) are generated. The plurality of incident permission signals LPn (LP1 to LP6) are signals that permit the corresponding selection optical elements AOMn (AOM1 to AOM6) to be turned on. That is, the incident permission signal LPn (LP1 to LP6) is a signal that permits the incidence of the beam LBn (LB1 to LB6) to the corresponding scanning unit Un (U1 to U6). Then, the selection element drive control unit 102 applies a drive signal (high frequency) to the corresponding selection optical element AOMn (AOM1 to AOM6) only during the ON time Ton when the incident permission signal LPn (LP1 to LP6) is H (high). Signal) HFn (HF1 to HF6) is applied to turn on the corresponding selection optical element AOMn (a state in which the first-order diffracted light is generated). For example, the selection element drive control unit 102 applies the drive signals HF1 to HF3 to the corresponding selection optical elements AOM1 to AOM3 for a certain time Ton when the incidence permission signals LP1 to LP3 are H (high). Thereby, the beams LB1 to LB3 from the light source device LSa are incident on the corresponding scanning units U1 to U3. Further, the selection element drive control unit 102 supplies drive signals (high frequency signals) HF4 to HF6 to the corresponding selection optical elements AOM4 to AOM6 for a certain time Ton when the incident permission signals LP4 to LP6 are H (high). Apply. As a result, the beams LB4 to LB6 from the light source device LSb enter the corresponding scanning units U4 to U6.

  As shown in FIG. 13, the incident permission signals LP1 to LP3 corresponding to the three selection optical elements AOM1 to AOM3 of the first optical element module have rise timings of LP1 → LP2 → LP3, which become H (high). The ON times Ton that are shifted by time Ts in this order and become H (high) do not overlap each other. Therefore, the scanning unit Un on which the beams LBn (LB1 to LB3) are incident is switched in the order of U1 → U2 → U3 at time Ts intervals. Similarly, the incident permission signals LP4 to LP6 corresponding to the three selection optical elements AOM4 to AOM6 of the second optical element module have the rising timings of H (high) in the order of LP4 → LP5 → LP6. The ON times Ton that are shifted by Ts and become H (high) do not overlap each other. Accordingly, the scanning unit Un on which the beam LBn (LB4 to LB6) is incident is switched in the order of U4 → U5 → U6 at time Ts intervals. The selection element drive control unit 102 outputs the generated plurality of incident permission signals LPn (LP1 to LP6) to the beam control device 104.

  The beam control device (beam control unit) 104 controls the emission frequency Fa of the beam LB (LBa, LBb, LBn), the magnification of the drawing line SLn on which the spot light SP of the beam LB is drawn, and the intensity modulation of the beam LB. To do. The beam control apparatus 104 includes an overall magnification setting unit 110, a local magnification setting unit 112, a drawing data output unit 114, and an exposure control unit 116. The overall magnification setting unit (overall magnification correction information storage unit) 110 stores the overall magnification correction information TMg sent from the exposure control unit 116 and controls the overall magnification correction information TMg of the light source device LS (LSa, LSb). The signal is output to the signal generator 22a of the circuit 22. The clock generator 60 of the signal generator 22a generates a clock signal LTC having an oscillation frequency Fa according to the overall magnification correction information TMg.

  The local magnification setting unit (local magnification correction information storage unit, correction information storage unit) 112 stores the local magnification correction information (correction information) CMgn sent from the exposure control unit 116 and also uses the local magnification correction information CMgn as a light source. It outputs to the signal generation part 22a of the control circuit 22 of apparatus LS (LSa, LSb). Based on the local magnification correction information CMgn, the position of the correction pixel on the drawing line SLn is designated (specified), and the magnification is determined. The signal generator 22a of the control circuit 22 outputs a pixel shift pulse BSC (BSCa, BSCb) according to the correction pixel determined based on the local magnification correction information CMg and the magnification. Note that the local magnification setting unit 112 stores local magnification correction information CMgn (CMg1 to CMg6) for each scanning unit Un (U1 to U6) sent from the exposure control unit 116. Then, the local magnification setting unit 112 outputs the local magnification correction information CMgn corresponding to the scanning unit Un that scans the spot light SP to the signal generation unit 22a of the light source device LS (LSa, LSb). That is, the local magnification setting unit 112 uses the local magnification correction information CMgn corresponding to the scanning unit Un that has generated the origin signal SZn (SZ1 to SZ6) as the light source device LSa that is a generation source of the beam LBn incident on the scanning unit Un. (LSa, LSb) is output to the signal generator 22a.

  For example, when the scanning unit Un that has generated the origin signal SZn (that is, the scanning unit Un that will perform scanning of the spot light SP from now on) is one of the scanning units U1 to U3, the local magnification setting unit 112 The local magnification correction information CMgn corresponding to the scanning unit Un that has generated SZn is output to the signal generator 22a of the light source device LSa. Similarly, when the scanning unit Un that generated the origin signal SZn is one of the scanning units U4 to U6, the local magnification setting unit 112 selects the local magnification correction information corresponding to the scanning unit Un that generated the origin signal SZn. CMgn is output to the signal generator 22a of the light source device LSb. Thereby, for each scanning module, the pixel shift pulse BSC (BSCa, BSCb) corresponding to the scanning unit Un (U1 to U3, U4 to U6) that scans the spot light SP of the light source device LS (LSa, LSb). Output from the transmission timing switching unit 64. Thereby, the scanning length can be individually adjusted for each drawing line SLn.

  The drawing data output unit 114 corresponds to the scanning unit Un that has generated the origin signal SZn (the scanning unit Un that will perform the scanning of the spot light SP) among the three scanning units Un (U1 to U3) of the first scanning module. The serial data DLn for one column is output as drawing bit string data SBa to the drive circuit 36a of the light source device LSa. Further, the drawing data output unit 114 is a scanning unit Un that has generated the origin signal SZn (scanning unit Un that will scan the spot light SP from now on) among the three scanning units Un (U4 to U6) of the second scanning module. The serial data DLn (DL4 to DL6) for one column corresponding to is output to the drive circuit 36a of the light source device LSb as the drawing bit string data SBb. Regarding the first scanning module, the order of the scanning units U1 to U3 that scan the spot light SP is U1 → U2 → U3. Therefore, the drawing data output unit 114 is DL1 → DL2 → DL3. Serial data DL1 to DL3 repeated in order is output as drawing bit string data SBa. Regarding the second scanning module, since the order of the scanning units U4 to U6 that scan the spot light SP is U4 → U5 → U6, the drawing data output unit 114 is DL4 → DL5 → DL6. Serial data DL4 to DL6 repeated in order are output as drawing bit string data SBb.

  The configuration of the drawing data output unit 114 will be described in detail with reference to FIG. The drawing data output unit 114 includes a first data output unit 114a that outputs the drawing bit string data SBa, and a second data output unit 114b that outputs the drawing bit string data SBb. The first data output unit 114a includes three generation circuits GE1, GE2, and GE3 corresponding to the scanning units U1 to U3 (selection optical elements AOM1 to AOM3), and a three-input OR gate unit GT1m. The generation circuit GE1 includes a memory unit BM1, a counter unit CON1, AND gates GT1a and GT1b with inputs, and a drawing permission signal generation unit OSM1. The generation circuit GE2 includes a memory unit BM2, a counter unit CON2, a 2-input AND gate unit GT2a and GT2b, and a drawing permission signal generation unit OSM2. The generation circuit GE3 includes a memory unit BM3, a counter unit CON3, two-input AND gate units GT3a and GT3b, and a drawing permission signal generation unit OSM3. The second data output unit 114b includes three generation circuits GE4, GE5, and GE6 corresponding to each of the scanning units U1 to U3 (selection optical elements AOM1 to AOM3), and a three-input OR gate unit GT2m. The generation circuit GE4 includes a memory unit BM4, a counter unit CON4, two-input AND gate units GT4a and GT4b, and a drawing permission signal generation unit OSM4. The generation circuit GE5 includes a memory unit BM5, a counter unit CON5, two-input AND gate units GT5a and GT5b, and a drawing permission signal generation unit OSM5. The generation circuit GE6 includes a memory unit BM6, a counter unit CON6, two-input AND gate units GT6a and GT6b, and a drawing permission signal generation unit OSM6.

  Each drawing permission signal generation unit OSMn (OSM1 to OSM6) is configured by a one-shot multivibrator or the like. Each drawing permission signal generation unit OSMn (OSM1 to OSM6) generates a drawing permission signal SQn (SQ1 to SQ6) for adjusting the drawing start timing of the spot light SP by the corresponding scanning unit Un (U1 to U6). Each drawing permission signal generation unit OSMn (OSM1 to OSM6) is supplied with the incident permission signals LPn (LP1 to LP6) of the corresponding scanning units Un (U1 to U6), and the input permission signals LPn (LP1 to LP1). Based on LP6), a drawing permission signal SQn (SQ1 to SQ6) is generated. For example, the drawing permission signal generation unit OSM1 receives the incidence permission signal LP1, and the drawing permission signal generation unit OSM1 generates the drawing permission signal SQ1 based on the input permission signal LP1. Similarly, the entrance permission signals LP2 to LP6 are input to the drawing permission signal generation units OSM2 to OSM6, and the drawing permission signal generation units OSM2 to OSM6 receive the drawing permission signal SQ2 based on the input permission signals LP2 to LP6. ~ SQ6 is generated. During the period when the drawing permission signal SQn (SQ1 to SQ6) is high (H), the serial data DLn (DL1 to DL6) of the corresponding scanning unit Un (U1 to U6) is output to the drive circuit 36a. The

  FIG. 15 is a time chart illustrating the drawing permission signal SQn generated by the drawing permission signal generation unit OSMn and the pixel shift pulse BSC that is output during a period when the drawing permission signal SQn is high (logical value is 1). As described above, when the origin signal SZn (SZ1 to SZ6) is generated, the incidence permission signal LPn (LP1 to LP6) which becomes high (H) for a certain time (on time Ton) after the origin signal SZn (SZ1 to SZ6) is generated. ) Is generated. Needless to say, the on-time Ton is equal to or shorter than the time Ts that is the maximum scanning time of the spot light SP of the scanning unit Un. The drawing permission signal generation unit OSMn (OSM1 to OSM6) has a delay time Tdn after the incidence permission signal LPn (LP1 to LP6) becomes high “1”, that is, after the origin signal SZn (SZ1 to SZ6) is generated. A drawing permission signal SQn (SQ1 to SQ6) that rises after (Td1 to Td6) has elapsed and falls at the same time as or before the incidence permission signal LPn (LP1 to LP6) becomes low “0” is generated. . For example, the drawing permission signal generation unit OSM3 rises after the delay time Td3 has elapsed since the incidence permission signal LP3 becomes high, and falls simultaneously with or before the incidence permission signal LP3 becomes low. SQ3 is generated. The drawing permission signals SQ1 to SQ3 become high (H) in the order of SQ1 → SQ2 → SQ3, and the time to become high (H) does not overlap each other. Similarly, the drawing permission signals SQ4 to SQ6 become high (H) in the order of SQ4.fwdarw.SQ5.fwdarw.SQ6, and the times when they become high (H) do not overlap each other. Drawing of the spot light SP is permitted on the irradiated surface of the substrate P during the period when the drawing permission signal SQn (SQ1 to SQ6) is actually high (H).

  By varying the delay time Tdn, the position of the drawing line SLn on the substrate P can be shifted along the main scanning direction (Y direction). That is, by shortening the delay time Td, the position of the drawing line SLn in the main scanning direction is shifted to the drawing start position side (the side opposite to the main scanning direction), and by increasing the delay time Td, the drawing line The position of SLn in the main scanning direction is shifted to the drawing end position side (main scanning direction side). In principle, the delay time Tdn is set such that the center point of the drawing line SLn is at the center (middle point) of the maximum scanning length (for example, 31 mm). Therefore, when the delay time Tdn remains constant and the scanning length of the drawing line SLn is expanded or contracted by at least one of the overall magnification correction information TMg and the local magnification correction information CMgn, the center point of the drawing line SLn is the center of the maximum scanning length. No longer located. Therefore, the delay time Tdn may be determined based on the overall magnification correction information TMg and the local magnification correction information CMgn. The drawing lines SLn (SL1 to SL6) can be individually shifted along the main scanning direction by the delay time Tdn (Td1 to Td6). The exposure control unit 116 generates delay information indicating the delay time Tdn (Td1 to Td6) based on the overall magnification correction information TMg and the local magnification correction information CMgn, and the generated delay information is used as the drawing permission signal generation unit OSMn (OSM1 to OSM1). To OSM6). The drawing permission signal generation unit OSMn (OSM1 to OSM6) determines the delay time Tdn (Td1 to Td6) of the drawing permission signal SQn (SQ1 to SQ6) to be generated based on the input delay information.

  FIG. 16 is a diagram illustrating the relationship between the position of the drawing line SLn expanded and contracted within the range of the maximum scanning length and the delay time Td. A symbol MSLn indicates a drawing line SLn having a maximum scanning length. The symbol SLna indicates an initial drawing line SLn that is not expanded or contracted, and the delay time Tdn in this case is represented by Tda. That is, the delay time Tda is set as an initial value so that the center point pa of the drawing line SLna is at the midpoint pm of the maximum scanning length. Symbol SLnb indicates the drawing line SLn when the initial value drawing line SLna is reduced by the overall magnification correction or the local magnification correction. The symbol SLnc indicates the initial value drawing line SLna by the overall magnification correction or the local magnification correction. The drawing line SLn when expanded by magnification correction is shown.

  When the delay time of the drawing line SLnb is set to the same delay time Tda as that of the drawing line SLna, the drawing start timing is the same as that of the drawing line SLna. Therefore, the drawing start point of the drawing line SLnb does not shift along the main scanning direction with respect to the drawing start point of the drawing line SLna. However, in this case, since the drawing line SLnb is reduced with respect to the drawing line SLna, the drawing end point of the drawing line SLnb is shifted from the drawing end point of the drawing line SLna toward the drawing start point. Therefore, the position of the center point pb of the drawing line SLnb is shifted to the drawing start point side from the position of the midpoint pm of the drawing line MSLn having the maximum scanning length. Therefore, in the case of the drawing line SLnb, the delay time Tdb may be determined based on the reduction rate of the drawing line SLnb so that the center point pb of the drawing line SLnb matches the midpoint pm of the drawing line MSLn. In this case, the delay time Tdb is longer than the delay time Tda, and the drawing start point of the drawing line SLnb is shifted to the drawing end point side (main scanning direction side) from the drawing start point of the drawing line SLna.

  When the delay time of the drawing line SLnc is set to the same delay time Tda as that of the drawing line SLna, the drawing start timing is the same as that of the drawing line SLna. Therefore, the drawing start point of the drawing line SLnc does not shift along the main scanning direction with respect to the drawing start point of the drawing line SLna. However, in this case, since the drawing line SLnb is extended with respect to the drawing line SLna, the drawing end point of the drawing line SLnc is closer to the drawing end point (main scanning direction side) than the drawing end point of the drawing line SLna. It will shift to. Therefore, the position of the center point pc of the drawing line SLnc is shifted to the drawing end point side from the position of the midpoint pm of the drawing line MSLn having the maximum scanning length. Therefore, in the case of the drawing line SLnc, the delay time Tdc may be determined based on the expansion rate of the drawing line SLnc so that the center point pc of the drawing line SLnc matches the midpoint pm of the drawing line MSLn. In this case, the delay time Tdc is shorter than the delay time Tda, and the drawing start point of the drawing line SLnc is shifted from the drawing start point of the drawing line SLna to the drawing start point side (opposite to the main scanning direction). It becomes.

  Returning to the description of FIG. 14, the drawing permission signals SQn (SQ1 to SQ6) generated by the respective drawing permission signal generation units OSMn (OSM1 to OSM6) are input to one input terminal of the AND gate unit GTnb (GT1b to GT6b). The Specifically, the drawing permission signal SQ1 is input to one input terminal of the AND gate portion GT1b, and similarly, the drawing permission signals SQ2 to SQ6 are input to one input terminal of the AND gate portions GT2b to GT6b. A pixel shift pulse BSC (BSCa, BSCb) is input to the other input terminal of the AND gate part GTnb (GT1b to GT6b). A pixel shift pulse BSCa from the signal generation unit 22a of the light source device LSa is simultaneously input to the AND gate units GT1b to GT3b, and a pixel shift pulse from the signal generation unit 22a of the light source device LSb is input to the AND gate units GT4b to GT6b. BSCb is input simultaneously. As shown in FIG. 15, the AND gate part GTnb (GT1b to GT6b) is inputted only when the drawing permission signal SQn (SQ1 to SQ6) input from the drawing permission signal generation part OSMn (OSM1 to OSM6) is high. The pixel shift pulse BSC (BSCa, BSCb) is output. Note that the pixel shift pulse BSCa (BSCb) is generated by the gate circuit GTa of FIG. 9 while the drawing permission signals SQ1 to SQ3 (SQ4 to SQ6) are high.

  The three AND gate portions GT1b to GT3b (GT4b to GT6b) include serial data of the scanning unit Un corresponding to the drawing permission signal SQn which is high among the three drawing permission signals SQ1 to SQ3 (SQ4 to SQ6). A pixel shift pulse BSCa (BSCb) for shifting DLn pixels is input. More specifically, during the period when the drawing permission signal SQ1 is high, the pixel shift pulse BSCa for shifting the pixel of the serial data DL1 of the scanning unit U1 corresponding to the drawing permission signal SQ1 is input to the three AND gate portions GT1b to GT3b. The Further, during the period when the drawing permission signals SQ2 and SQ3 are high, the pixel shift pulse BSCa for shifting the pixels of the serial data DL2 and DL3 of the scanning units U2 and U3 corresponding to the drawing permission signals SQ2 and SQ3 has three AND gate portions. It is input to GT1b to GT3b. Similarly, while the drawing permission signals SQ4 to SQ6 are high, the pixel shift pulse BSCb for shifting the pixels of the serial data DL4 to DL6 of the scanning units U4 to U6 corresponding to the drawing permission signals SQ4 to SQ6 is three AND. The signals are input to the gate portions GT4b to GT6b.

  Each memory unit (drawing data storage unit) BMn (BM1 to BM6) is a memory for storing pattern data (bitmap) corresponding to a pattern to be drawn and exposed by the corresponding scanning unit Un (U1 to U6). The counter unit CONn (CON1 to CON6) outputs the logical information of each pixel of the serial data DLn (DL1 to DL6) from the pattern data stored in the memory unit BMn (BM1 to BM6) pixel by pixel in the row direction. This is a counter for outputting in synchronization with the shift pulse BSC (BSCa, BSCb). Thereby, during the time when the drawing permission signal SQn (SQ1 to SQ6) is high (H), the logical information of each pixel of the serial data DLn (DL1 to DL6) of the corresponding scanning unit Un (U1 to U6) is Each pixel is output in synchronization with the pixel shift pulse BSC (BSCa, BSCb) in the row direction. For example, during the period when the drawing permission signal SQ1 (SQ2, SQ3) is high (H), the logical information of the serial data DL1 (DL2, DL3) is output in synchronization with the pixel shift pulse BSCa pixel by pixel. In addition, during the period when the drawing permission signal SQ4 (SQ5, SQ6) is high (H), the logic information of the serial data DL4 (DL5, DL6) is output pixel by pixel in synchronization with the pixel shift pulse BSCb.

  The serial data DLn (DL1 to DL6) of the pattern data stored in the memory unit BMn (BM1 to BM6) is shifted in the column direction by an address counter (not shown). That is, the columns read by the address counter (not shown) are shifted as the first column, the second column, the third column, and so on. For example, in the case of the memory unit BM1 corresponding to the scanning unit U1, after the serial data DL1 is output, the incident permission signal LP2 corresponding to the scanning unit U2 that performs the next scanning becomes high (H). Is performed at the timing when the origin signal SZ2 is generated. In the shift of the serial data DL2 of the pattern data stored in the memory unit BM2, after the serial data DL2 is output, the incident permission signal LP3 corresponding to the scanning unit U3 that performs the next scanning becomes high (H). At the timing (the timing when the origin signal SZ3 is generated). In addition, the serial data DL3 of the pattern data stored in the memory unit BM3 is shifted when the incident permission signal LP1 corresponding to the scanning unit U1 that performs the next scanning is high (H) after the serial data DL3 is output. Is performed at the timing when the origin signal SZ1 is generated. Note that the three scanning units U1 to U3 of the first scanning module perform scanning of the spot light SP in the order of U1 → U2 → U3.

  Similarly, the shift of the serial data DL4 to DL6 of the pattern data stored in the memory units BM4 to BM6 is performed by scanning units U5, U6, U4 that perform scanning next after the serial data DL4 to DL6 are output. Is performed at the timing when the entrance permission signals LP5, LP6, LP4 corresponding to (H) become high (the timing at which the origin signals SZ5, SZ6, SZ4 are generated). Note that the three scanning units U4 to U6 of the second scanning module scan the spot light SP in the order of U4 → U5 → U6.

  Serial data DLn (DL1 to DL6) output from the memory unit BMn (BM1 to BM6) is input to one input terminal of the AND gate unit GTna (GT1a to GT6a). An incident permission signal LPn (LP1 to LP6) is input to the other input terminal of the AND gate part GTna (GT1a to GT6a). Therefore, the AND gate part GTna (GT1a to GT6a) outputs the serial data DLn (DL1 to DL6) while the incident permission signal LPn (LP1 to LP6) is high (H) (during time Ton). As a result, the serial data DLn of the scanning unit Un that scans the spot light SP is output. As a result, the serial data DLn (DL1 to DL3) is output from the generation circuits GE1 to GE3 of the first data output unit 114a in the order of DL1 → DL2 → DL3 and input to the three-input OR gate part GT1m. . Similarly, serial data DLn (DL4 to DL6) is output in the order of DL4 → DL5 → DL6 from the generation circuits GE4 to GE6 of the second data output unit 114b, and is input to the 3-input OR gate unit GT2m. The

  The OR gate part GT1m outputs serial data DLn (DL1 → DL2 → DL3) repeatedly input in the order of DL1 → DL2 → DL3 as drawing bit string data SBa to the drive circuit 36a of the light source device LSa. As a result, the three scanning units U1 to U3 of the first scanning module can perform scanning of the spot light SP in the order of U1 → U2 → U3, and simultaneously draw and expose a pattern according to the pattern data. it can. Similarly, the OR gate part GT2m outputs the serial data DLn repeatedly input in the order of DL4 → DL5 → DL6 as the drawing bit string data SBb to the drive circuit 36a of the light source device LSb. As a result, the three scanning units U4 to U6 of the second scanning module can scan the spot light SP in the order of U4 → U5 → U6, and simultaneously draw and expose a pattern according to the pattern data. it can.

  In the first embodiment, pattern data is prepared for each scanning unit Un (U1 to U6), and pattern data for three scanning units Un (U1 to U3, U4 to U6) is provided for each scanning module. The serial data DL1 to DL3 and DL4 to DL6 are output in accordance with the order of the scanning units Un that scan the spot light SP (U1 → U2 → U3, U4 → U5 → U6). However, since the order of the scanning units Un that perform the scanning with the spot light SP is determined in advance, each serial data DLn ( One pattern data combining DL1 to DL3, DL4 to DL6) may be prepared. In other words, for each scanning module, the serial data DLn (DL1 to DL3, DL4 to DL6) of each column of the pattern data of the three scanning units Un (U1 to U3, U4 to U6) is scanned with the spot light SP. One pattern data arranged according to the order of the units Un may be constructed. In this case, serial data DLn of one pattern data constructed for each scanning module may be output in order from the first column in accordance with the drawing permission signal SQn (SQ1 to SQ3, SQ4 to SQ6).

  The exposure control unit 116 shown in FIG. 12 controls the overall magnification setting unit 110, the local magnification setting unit 112, and the drawing data output unit 114. The exposure control unit 116 includes positional information of the alignment marks MKm (MK1 to MK4) on the installation orientation lines Lx1 and Lx4 detected by the mark position detection unit 106, and installation orientation lines Lx1 to Lx4 detected by the rotational position detection unit 108. The rotation angle position information (count values based on the counter circuits CN1a to CN4a and CN1b to CN4b) of the upper rotary drum DR is input. The exposure control unit 116 detects the position information of the alignment mark MKm (MK1 to MK4) on the installation azimuth line Lx1 and the rotation angle position of the rotary drum DR (count values of the counter circuits CN1a and CN1b) on the installation azimuth line Lx1. Based on this, the drawing exposure start position of the exposure region W in the sub-scanning direction (X direction) of the substrate P is detected (determined).

  Then, the exposure control unit 116 detects the rotation angle position of the rotary drum DR on the installation azimuth line Lx1 when the drawing exposure start position is detected, and the rotation angle position on the installation azimuth line Lx2 (in the counter circuits CN2a and CN2b). Based on the count value), it is determined whether or not the drawing exposure start position of the substrate P has been transported to the drawing lines SL1, SL3, and SL5 on the installation orientation line Lx2. When the exposure control unit 116 determines that the drawing exposure start position has been conveyed to the drawing lines SL1, SL3, and SL5, the exposure control unit 116 controls the local magnification setting unit 112, the drawing data output unit 114, and the like to scan units U1, U3, U5 starts drawing by scanning the spot light SP.

  In this case, the exposure control unit 116 performs local magnification correction information CMg1 corresponding to the scanning units U1 and U3 that scan the spot light SP to the local magnification setting unit 112 at the timing when the scanning units U1 and U3 perform drawing exposure. CMg3 is output to the signal generator 22a of the light source device LSa. Thereby, the signal generation unit 22a of the light source device LSa converts the pixel shift pulse BSCa that shifts the pixels of the serial data DL1 and DL3 of the scanning units U1 and U3 that scan the spot light SP into the local magnification correction information CMg1 and CMg3. In response. In accordance with the pixel shift pulse BSCa, the drawing data output unit 114 shifts the logical information of each pixel of the serial data DL1 and DL3 corresponding to the scanning units U1 and U3 that scan the spot light SP pixel by pixel. . Similarly, the exposure control unit 116 causes the local magnification setting unit 112 to output local magnification correction information CMg5 corresponding to the scanning unit U5 to the signal generation unit 22a of the light source device LSb at the timing when the scanning unit U5 performs drawing exposure. . Thereby, the signal generator 22a of the light source device LSb generates a pixel shift pulse BSCb for shifting the pixel of the serial data DL5 corresponding to the scanning unit U5 that scans the spot light SP according to the local magnification correction information CMg5. . In accordance with the pixel shift pulse BSCb, the drawing data output unit 114 shifts the logical information of each pixel of the serial data DL5 of the scanning unit U5 that scans the spot light SP one pixel at a time.

  Thereafter, the exposure control unit 116 detects the rotation angle position of the rotary drum DR on the installation direction line Lx1 when the drawing exposure start position is detected, and the rotation angle position on the installation direction line Lx3 (of the counter circuits CN3a and CN3b). On the basis of the count value), it is determined whether or not the drawing exposure start position of the substrate P has been transported to the drawing lines SL2, SL4, SL6 on the installation orientation line Lx3. When the exposure control unit 116 determines that the drawing exposure start position has been conveyed onto the drawing lines SL2, SL4, and SL6, the exposure control unit 116 controls the local magnification setting unit 112 and the drawing data output unit 114, and further scan units U2 and U4. , U6 starts scanning the spot light SP.

  In this case, the exposure control unit 116 supplies the local magnification correction information CMg2 corresponding to the scanning unit U2 that scans the spot light SP to the local magnification setting unit 112 at the timing when the scanning unit U2 performs drawing exposure. The signal generator 22a outputs the signal. Thereby, the signal generation unit 22a of the light source device LSa generates a pixel shift pulse BSCa that shifts the pixels of the serial data DL2 of the scanning unit U2 that scans the spot light SP according to the local magnification correction information CMg2. In accordance with the pixel shift pulse BSCa, the drawing data output unit 114 shifts the logical information of each pixel of the serial data DL2 of the scanning unit U2 that scans the spot light SP one pixel at a time. Similarly, the exposure control unit 116 sends the local magnification correction information CMg4 and CMg6 corresponding to the scanning units U4 and U6 to the local magnification setting unit 112 at the timing when the scanning units U4 and U6 perform drawing exposure. The output is made to the generator 22a. As a result, the signal generator 22a of the light source device LSb converts the pixel shift pulse BSCb for shifting the pixels of the serial data DL4 and DL6 of the scanning units U4 and U6 that scan the spot light SP into the local magnification correction information CMg4 and CMg6. In response. In accordance with the pixel shift pulse BSCb, the drawing data output unit 114 shifts the logical information of each pixel of the serial data DL4 and DL6 of the scanning units U4 and U6 that scan the spot light SP one pixel at a time.

  As can be seen from FIG. 4, since the substrate P is transported in the + X direction, the drawing exposure in each of the drawing lines SL1, SL3, and SL5 precedes and the substrate P is further transported by a predetermined distance, and then the drawing line. Drawing exposure is performed in each of SL2, SL4, and SL6. On the other hand, the polygon mirrors PM of the three scanning units U1 to U3 of the first scanning module and the polygon mirrors PM of the three scanning units U4 to U6 of the second scanning module rotate with a predetermined phase difference. Since it is controlled, the origin signals SZ1 to SZ3 and SZ4 to SZ6 continue to be generated with a phase difference for the time Ts as shown in FIG. Therefore, an incidence permission signal LPn (LP1 to LP6) as shown in FIG. 13 is generated, and from the start of drawing exposure on the drawing lines SL1, SL3, SL5 to immediately before the start of drawing exposure on the drawing lines SL2, SL4, SL6. In the meantime, the AND gate portions GT2a, GT4a, and GT6a in FIG. 14 are opened, and serial data DL2, DL4, and DL6 are output. Therefore, before the drawing exposure start position of the exposure area W reaches the drawing lines SL2, SL4, SL6, a pattern is drawn by scanning the spot light SP by the scanning units U2, U4, U6.

  Therefore, in the configuration of FIG. 14, the exposure permission signal LPn (LP1 to LP6) is sent to the AND gate part GTna (GT1a to GT6a) and the drawing permission signal generation part OSMn (OSM1 to OSM6) under the control of the exposure controller 116. It is preferable to provide a selection gate circuit for selecting whether or not to be prohibited for each of the generation circuits GEn (GE1 to GE6). Thus, only when the selection gate circuit of each generation circuit GEn (GE1 to GE6) is open, the incident permission signal is sent to the AND gate part GTna (GT1a to GT6a) and the drawing permission signal generation part OSMn (OSM1 to OSM6). LPn (LP1 to LP6) is input. Therefore, the exposure control unit 116 prohibits the output of the serial data DL2, DL4, and DL6 by closing the selection gate circuits of the generation circuits GE2, GE4, and GE6 and opening the selection gate circuits of the generation circuits GE1, GE3, and GE5. be able to. Also, the drawing permission signals SQ2, SQ4, and SQ6 are not generated by closing the selection gate circuits of the generation circuits GE2, GE4, and GE6. Therefore, while the selection gate circuits of the generation circuits GE2, GE4, and GE6 are closed, the pixel shift pulse BSC (BSCa, BSCb) that shifts the pixels of the serial data DL2, DL4, DL6 by the gate circuit GTa (see FIG. 9). ) Is also prohibited.

  Note that, when the selection gate circuit is not provided in each of the generation circuits GEn (GE1 to GE6), the exposure control unit 116 serial data among the drawing bit string data SBa and SBb output to the drive circuit 36a of the light source devices LSa and LSb. By canceling all the logical information of the pixels corresponding to DL2, DL4, and DL6 to “0”, the drawing exposure by the scanning units U2, U4, and U6 can be substantially canceled. During the cancel period, the columns of serial data DL2, DL4, DL6 output from the memory units BM2, BM4, BM6 are not shifted and remain in the first column. Then, after the drawing exposure start position in the exposure area W reaches the drawing lines SL2, SL4, and SL6, output of the serial data DL2, DL4, and DL6 is started, and the serial data DL2, DL4, and DL6 are output in the column direction. Shifts are made.

  Similarly, the drawing exposure end position in the exposure area W first reaches the drawing lines SL1, SL3, and SL5, and then reaches the drawing lines SL2, SL4, and SL6 after a certain period of time. Therefore, after the drawing exposure end position reaches the drawing lines SL1, SL3, and SL5, the pattern drawing exposure is performed only by the scanning units U2, U4, and U6 until reaching the drawing lines SL2, SL4, and SL6. Become. Accordingly, the exposure control unit 116 closes the selection gate circuits of the generation circuits GE1, GE3, and GE5 and opens the selection gate circuits of the generation circuits GE2, GE4, and GE6, thereby prohibiting the output of the serial data DL1, DL3, and DL5. be able to. Further, by closing the selection gate circuits of the generation circuits GE1, GE3, and GE5, pixel shift pulses BSC (BSCa, BSCb) for shifting the pixels of the serial data DL1, DL3, DL5 by the gate circuit GTa shown in FIG. Generation is also prohibited. Note that, when the selection gate circuit is not provided in each of the generation circuits GEn (GE1 to GE6), the exposure control unit 116 serial data among the drawing bit string data SBa and SBb output to the drive circuit 36a of the light source devices LSa and LSb. By canceling all the logical information of the pixels corresponding to DL1, DL3, and DL5 to “0”, it is possible to substantially cancel the drawing exposure by the scanning units U1, U3, and U5.

  Further, the exposure control unit 116 detects the position information of the alignment marks MKm (MK1 to MK4) on the installation orientation lines Lx1 and Lx4 detected by the mark position detection unit 106, and the installation orientation line Lx1 detected by the rotational position detection unit 108. Based on the rotation angle position information of the rotary drum DR on Lx4, distortion (deformation) of the substrate P or the exposure region W is sequentially calculated. For example, when the substrate P is deformed by receiving a large tension in the longitudinal direction or undergoing a thermal process, the shape of the exposure region W is also distorted (deformed), and the alignment mark MKm (MK1 to MK4) The arrangement is not a rectangular shape as shown in FIG. 4 but is distorted (deformed). When the substrate P or the exposure region W is distorted, it is necessary to change the magnification of each drawing line SLn accordingly. Therefore, the exposure control unit 116 performs the entire process based on the calculated distortion of the substrate P or the exposure region W. At least one of magnification correction information TMg and local magnification correction information CMgn is generated. Then, at least one of the generated overall magnification correction information TMg and local magnification correction information CMgn is output to the overall magnification setting unit 110 or the local magnification setting unit 112. Thereby, the precision of overlay exposure can be improved. Further, the exposure control unit 116 may generate corrected tilt angle information for each drawing line SLn according to the distortion of the substrate P or the exposure region W. Based on the generated corrected tilt angle information, the actuator described above rotates each scanning unit Un (U1 to U6) about the irradiation center axis Len (Le1 to Le6). Thereby, the precision of overlay exposure is further improved. The exposure controller 116 scans the spot light SP by each scanning unit Un (U1 to U6), or scans the spot light SP a predetermined number of times, or the substrate P or the exposure area W. When the distortion tendency changes beyond the allowable range, at least one of the overall magnification correction information TMg and the local magnification correction information CMgn and the corrected inclination angle information may be generated again.

  As described above, the exposure apparatus EX of the first embodiment uses the spot light SP of the beam LB (Lse, LBa, LBb, LBn) generated by the seed lights S1, S2 from the pulse light source unit 35 as a pattern. The pattern is drawn on the substrate P by relatively scanning the spot light SP along the drawing line SLn on the substrate P while modulating the intensity accordingly. The exposure apparatus EX includes at least a memory unit BMn, a clock generation unit 60, a light source control unit, a correction pixel designation unit 62, and a transmission timing switching unit 64. As described above, the memory unit BMn stores pattern data drawn by scanning the spot light SP of the scanning unit Un. The clock generator 60 has a reference period Ta determined by Pxy / (N × Vs), and generates a clock signal LTC having N clock pulses per pixel size Pxy during scanning of the spot light SP. The light source control unit includes at least a control circuit 22, an electro-optic element 36, a drive circuit 36 a, and a drawing data output unit 114. The light source control unit controls the pulse light source unit 35 so as to generate the beam LB in response to the clock pulse of the clock signal LTC, and the pixels of the serial data DLn constituting the pattern data sequentially transmitted from the memory unit BMn The intensity of the beam LB is modulated based on each logical information. The correction pixel designating unit 62 designates at least one pixel arranged at a specific position as a correction pixel among the plurality of pixels arranged on the drawing line SLn. At the timing when the spot light SP scans the normal pixels other than the correction pixels on the drawing line SLn, the transmission timing switching unit 64 corresponds to one clock pulse corresponding to one pixel, and the spot light SP is corrected on the drawing line SLn. At the timing of scanning the pixel, the transmission timing of the logic information of the pixel from the memory unit BMn is switched so that N ± m clock pulses correspond to one pixel. Therefore, the magnification of the drawing line SLn (pattern to be drawn) can be finely corrected, and precise overlay exposure on the micron order can be performed.

  The exposure apparatus EX includes a polygon mirror PM that deflects the beam LB in one dimension, and an optical lens member that collects the beam LB deflected by the polygon mirror PM as a spot light SP on the substrate P (at least fθ). A plurality of scanning units Un having a lens FT and a cylindrical lens CYb). The exposure apparatus EX draws a pattern on the substrate P by the spot light SP projected from each of the plurality of scanning units Un. Thereby, the width of the exposure region W can be easily increased.

  The exposure apparatus EX includes a polygon drive control unit 100 that synchronously rotates each polygon mirror PM so that the rotation angle positions of the polygon mirror PM of each of the plurality of scanning units Un have a predetermined phase relationship, and a light source device LSa ( Or a beam switching unit BDU that switches the beam from LSb) to sequentially guide the beam from one of the plurality of scanning units Un according to the rotational angle position of the polygon mirror PM. Thus, each of the plurality of scanning units Un can sequentially scan the spot light SP after one scanning unit Un starts scanning the spot light SP until the next scanning is started. . As a result, the beam LB can be used effectively.

  The exposure apparatus EX stores local magnification correction information (correction information) CMgn for specifying a correction pixel to be corrected among a plurality of pixels located on the drawing line SLn for each of the plurality of scanning units Un. A magnification setting unit (correction information storage unit) 112 is provided. The correction pixel designating unit 62 is a correction pixel located on the drawing line SLn of the scanning unit Un guided by the beam LB based on the local magnification correction information CMgn corresponding to the scanning unit Un guided by the beam switching unit BDU. Is specified. Thereby, the magnification of the drawing line SLn (pattern to be drawn) can be finely corrected for each drawing line SLn (scanning unit Un). Therefore, the overlay accuracy of pattern exposure is improved.

  The local magnification correction information CMgn includes correction position information Nv for designating a correction pixel at each of a plurality of discrete positions on the drawing line SLn according to the drawing magnification of the pattern drawn along the drawing line SLn. . The correction pixel specifying unit 62 specifies a plurality of correction pixels discretely positioned on the drawing line SLn based on the correction position information Nv. The sending timing switching unit 64 is a logic information memory unit BMn so that clock pulses of N ± m clock signals LTC correspond to the correction pixels in each of the plurality of correction pixels located on the drawing line SLn. The transmission timing from is switched. Accordingly, the drawing line SLn (pattern to be drawn) can be corrected (expanded / contracted) without unevenness.

  The local magnification correction information CMgn includes the magnification information SCA for setting the above-described “± m” value according to the drawing magnification of the pattern drawn along the drawing line SLn. Thereby, the drawing line SLn (pattern to be drawn) can be expanded and contracted according to the drawing magnification.

  The beam switching unit BDU is arranged in series along the traveling direction of the beam LB from the light source device LSa (or LSb), and switches the optical path of the beam LB to select one scanning unit Un on which the beam LB enters. It has the optical element AOMn for selection. Therefore, the beam LB from the light source device LSa (or LSb) can be efficiently concentrated on one scanning unit Un to be subjected to drawing exposure, and a high exposure amount can be obtained. For example, a drawing sound in which one beam LB from the light source device LSa (or LSb) is amplitude-divided into three using a plurality of beam splitters, and each of the divided three beams LB is modulated by serial data DLn. When guided to the three scanning units Un through the optical modulation element (intensity modulation unit) AOM, the beam intensity attenuation in the acousto-optic modulation element for drawing is 20%, and the beam intensity in each scanning unit Un When the attenuation is 30%, the intensity of the spot light SP in one scanning unit Un is about 18.67% when the intensity of the original beam LB is 100%. On the other hand, as in the first embodiment, the beam LB from the light source device LSa (or LSb) is deflected by the three selection optical elements AOMn (AOM1 to AOM3, AOM4 to AOM6), and the three scanning units Un. In the case where it is incident on any one of (U1 to U3, U4 to U6), when the attenuation of the beam intensity at the optical element AOMn for selection is 20%, the spot light SP in one scanning unit Un The intensity is about 56% of the intensity of the original beam LB.

  The plurality of selection optical elements AOMn are provided corresponding to the plurality of scanning units Un, and switch whether to make the beam LB incident on the corresponding scanning units Un. Therefore, one scanning unit Un to which the beam LBn should be incident can be easily selected from the plurality of scanning units Un.

  In the first embodiment, since the scanning efficiency of the polygon mirror PM is 1/3 and the number of scanning units Un to which the beams LBa and LBb are distributed is three, the six selection optical elements AOMn (AOM1 to AOM1) AOM 6) was divided into two optical element modules (two sets), and six scanning units Un (U1 to U6) were correspondingly divided into two scanning modules (two sets). However, when the scanning efficiency of the polygon mirror PM is 1 / H and the number of the scanning unit Un and the selection optical element AOMn is Q, the Q selection optical elements AOMn are divided into Q / H optical element modules (Q / H). Then, Q scanning units Un may be divided into Q / H scanning modules. In this case, the number of optical elements AOMn for selection included in each of the Q / H optical element modules (Q / H sets) is equal, and the Q / H scanning modules (Q / H sets) The number of scanning units Un included in each is preferably equal. Note that Q / H is preferably a positive number. That is, Q is preferably a multiple of H. For example, when the scanning efficiency of the polygon mirror PM is ½ and the number of scanning units Un and selection optical elements AOMn is six, the six selection optical elements AOMn are equal to three optical element modules (three sets). The six scanning units Un may be equally divided into three scanning modules (three sets).

  In the first embodiment, the polygon mirror PM has an octagonal shape (eight reflecting surfaces RP). However, it may be a hexagonal or heptagonal shape or more than a hexagonal shape. It may be. This also changes the scanning efficiency of the polygon mirror PM. In general, when conditions other than the number of reflection surfaces Np of the polygon mirror PM having a polygonal shape (for example, conditions such as the aperture and focal length of the fθ lens FT) are the same, the larger the number of reflection surfaces Np, The scanning efficiency of the polygon mirror PM on one reflecting surface RP increases, and the scanning efficiency of the polygon mirror PM decreases as the number of reflecting surfaces decreases. Further, as the number of reflection surfaces Np increases, the outer shape of the polygon mirror PM becomes closer to a circle, so that windage loss during rotation is reduced and the polygon mirror PM can be rotated at a higher speed. For example, as in the previous example, when an 8-sided polygon mirror PM is used with a scanning efficiency of less than 1/3, it can be changed to a 24-sided (8-sided / 3) polygon mirror PM. However, in that case, in order to distribute the beam LBa (LBb) from one light source device LSa (LSb) to each of the three scanning units Un in a time division manner, the polygon mirrors on each of the 24 surfaces of the three scanning units Un. The PMs may be controlled to be synchronously rotated so as to have the same angular phase (the origin signal is generated at the same timing) and to be drawn once every two reflecting surfaces of the polygon mirror PM.

In the first embodiment, the pixel dimension Px and the dimension Py have the same length (for example, 3 μm), but the dimension Px and the dimension Py may be different. In short, the clock generator 60 has a reference period Ta determined by Py / (N × Vs), and generates a clock signal LTC having N clock pulses per pixel size Py during scanning of the spot light SP. do it. In other words, it means that the clock signal LTC having a frequency N times higher than the frequency determined by the ratio Vs / Py between the scanning speed Vs of the spot light SP and the dimension Py of the pixel in the main scanning direction is generated.

[Modification of First Embodiment]
The first embodiment may be modified as follows.

  In the first embodiment, N (= 8) spot lights SP (clock pulse of the clock signal LTC) correspond to the normal pixel, and N ± m (= 8 ± 1) to the correction pixel. ) Spot lights SP (clock pulse of clock signal LTC) correspond to each other. Further, since the size Pxy of one pixel is 3 μm, which is the same as the size φ of the spot light SP, and the oscillation frequency Fa of the clock signal LTC is 400 MHz, the projection interval of the spot light SP scanned along the main scanning direction is 0.375 μm. Therefore, the correction pixel has a size expanded and contracted by 0.375 μm with respect to a normal pixel having a dimension Pxy of 3 μm in the main scanning direction. That is, the rate at which the correction pixel expands and contracts is 12.5 (= 0.375 / 3)%. When the value of “± m” determined by the magnification information SCA is “± 2”, the correction pixel expands / contracts by 0.75 μm with respect to the normal pixel having the dimension Pxy of 3 μm, and the ratio is 25 (= 0.75 / 3)%.

  On the other hand, if the size Pxy of one pixel is 3 μm, which is the same as the size φ of the spot light SP, and the oscillation frequency Fa of the clock signal LTC is 800 MHz, which is twice 400 MHz, 16 spots for a normal pixel. The optical SP (clock pulse of the clock signal LTC) corresponds. Therefore, if the value of “± m” determined by the magnification information SCA is kept “± 1”, 16 ± 1 spot lights SP (clock pulse of the clock signal LTC) correspond to the correction pixel. In this case, the projection interval of the spot light SP scanned in the main scanning direction is 0.1875 (3 × 1/16) μm. Therefore, the correction pixel expands and contracts by 0.1875 μm with respect to the normal pixel having the dimension Pxy of 3 μm in the main scanning direction, and the ratio is 6.25 (= 0.1875 / 3)%. Further, when the value of “± m” determined by the magnification information SCA is “± 2”, the correction pixel expands and contracts by 0.375 μm with respect to the normal pixel of the dimension Pxy of 3 μm, and the ratio is 12 .5%. Therefore, finer magnification correction can be performed by increasing the oscillation frequency Fa of the clock signal LTC.

  However, even when the oscillation frequency Fa is increased from 400 MHz, the pulsed seed lights S1 and S2 are generated at the oscillation frequency Fa (for example, 800 MHz) increased by the DFB semiconductor laser elements 30 and 32 of the pulsed light generation unit 20. It may not occur. Further, when the DFB semiconductor laser elements 30 and 32 that can respond at the increased oscillation frequency Fa are used, there is a problem that the cost is increased. Therefore, in this modification, the frequency of the spot light SP is set to 800 MHz by synthesizing the beam LB generated at the oscillation frequency Fb of 400 MHz.

  In this modification, the effective length of the drawing lines SLn (SL1 to SL6) is set to 30 mm, and the spot light SP having an effective size φ of 3 μm is 15/16 each, that is, 2.8125 (= It is assumed that the spot light SP is irradiated onto the substrate P (on the irradiated surface of the substrate P) along the drawing lines SLn (SL1 to SL6) while being overlapped by 3 × 15/16) μm. Therefore, the projection interval of the spot light SP is 0.1875 μm, and the number of the spot light SP irradiated in one scan is 160000 (= 30 [mm] /0.1875 [μm]). Further, the frequency of the spot light SP (oscillation frequency Fa) is set to 800 MHz, and the spot light SP is irradiated 160000 times in one scan, so the time required for one scan of the spot light SP along the drawing line SLn. Tsp is 200 μsec (= 16000 [times] / 800 [MHz]), and the scanning speed Vs is 150 m / sec (= 30 [mm] / 200 [μsec]). Also, in the sub-scanning direction, if the scanning of the spot light SP is performed at an interval of 0.1875 μm, the substrate P needs to advance by 0.1875 μm per time Tpx (= 620 μsec). (Feeding speed) Vt is about 0.3024 mm / sec (= 0.1875 [μm] / 620 [μsec]). Note that the rotation speed Vp of the polygon mirror PM of the present modification is about 2096.8 rpm, the same as in the first embodiment.

  FIG. 17 is a diagram illustrating a configuration of the light source device LSa (LSb) in the present modification. In addition, the same code | symbol is attached | subjected about the structure same as the said 1st Embodiment, and only a different location is demonstrated. The light source device LSa (LSb) includes a clock signal generation unit 150, two control circuits 152a and 152b, two pulsed light generation units 20 (hereinafter, 20a and 20b), an OR gate unit (clock generation unit) GX1, and a synthesis unit. An optical member 154 is provided.

  The clock signal generation unit 150 has (Pxy × M) / () where Vs is the scanning speed of the spot light SP, N is an integer of 2 or more, and M is the number of pulse light generation units 20 (pulse light source units 35). A plurality of (M) clock signals (first clock signals) CK having a reference period Tb determined by (N × Vs) and having a phase for each correction time of 1 / M of the reference period Tb are generated. This M is an integer greater than or equal to 2 and smaller than N. In this modification, the number N of clock pulses (spot light SP) per pixel is 16, M is 2, Pxy is 3 μm, and Vs is 150 m / sec. Therefore, the reference period Tb = (3 μm × 2) / ( 16 × 150 m / sec) = 0.0025 μsec, and the frequency Fb (1 / Tc) is 400 MHz. Further, since the clock signal generator 150 generates a plurality (M) of clock signals to which the phase is given every 1 / M correction time of the reference period Tb, the phase is changed every 1/2 correction time of the reference period Tb. Two given clock signals CK are generated. These two clock signals CK are represented by CKa and CKb. That is, the clock signal generation unit 150 of the present modification generates 400 MHz clock signals CKa and CKb whose phases are shifted from each other by a half cycle. The clock signal CKa generated (generated) by the clock signal generation unit 150 is output to the control circuit 152a and the OR gate unit GX1, and the clock signal CKb is output to the control circuit 152b and the OR gate unit GX1.

  FIG. 18 is a diagram illustrating a configuration of the clock signal generation unit 150. The clock signal generation unit 150 includes a clock generation unit 60, a one-shot pulse generator LC, 2-input AND gate units GX2, GX3, and a NOT gate unit GX4. As described in the first embodiment, the clock generator 60 generates (generates) the clock signal CKs having the oscillation frequency Fc (cycle Tc = 1 / Fc) according to the overall magnification correction information TMg. In this modification, the clock generation unit 60 generates the clock signal CKs having an oscillation frequency (light emission frequency) Fc of 800 MHz when the overall magnification correction information TMg is 0 and the overall magnification correction information TMg is 0. . The clock signal CKs generated by the clock generator 60 is input to one input terminal of the AND gates GX1 and GX2 and the one-shot pulse generator LC.

  The one-shot pulse generator LC normally outputs a signal SDo having a logical value “0”, but when a clock pulse of the clock signal CKs is generated, a signal having a logical value “1” for a certain time Tdp from the falling edge of the clock pulse. Output SDo. That is, the one-shot pulse generator LC inverts the logic value for a certain time Tdp in accordance with the falling edge of the clock pulse of the clock signal CKs. The time Tdp is set to have a relationship of Tc <Tdp <2 × Tc, and is preferably set to Tdp≈1.5 × Tc. This signal SDo is input to the other input terminal of the AND gate portion GX3. The signal SDo is input to the other input terminal of the AND gate portion GX2 via the NOT gate portion GX4. That is, a signal obtained by inverting the signal SDo is input to the AND gate unit GX2. The AND gate unit GX2 outputs the clock signal CKa based on the input clock signal CKs and a signal obtained by inverting the value of the signal SDo. The AND gate unit GX3 outputs the clock signal CKb based on the input clock signal CKs and the signal SDo. Therefore, the AND gate unit GX2 outputs the clock pulse of the input clock signal CKs only when the logical value of the signal SDo is “0”, and the AND gate unit GX3 outputs the logical value of the signal SDo of “1”. Only when the clock pulse of the input clock signal CKs is output.

  FIG. 19 is a timing chart for explaining the operation of the clock signal generator 150 of FIG. When a clock pulse of the clock signal CKs (this clock pulse is referred to as the first clock pulse) is generated in a state where the logical value of the signal SDo is “0” (low), an output signal (clock signal CKb) of the AND gate unit GX3 is generated. ) Is “0” (low). That is, the AND gate unit GX3 does not output the input first clock pulse. On the other hand, when the logical value of the signal SDo is “0”, the value “1” obtained by inverting the value of the signal SDo by the NOT gate unit GX4 is input to the AND gate unit GX2, and therefore the output of the AND gate unit GX2 The value of the signal (clock signal CKa) is “1”. That is, the AND gate unit GX2 outputs the input first clock pulse.

  When the clock pulse of the clock signal CKs is generated in the state of the logical value “0” of the signal SDo, the one-shot pulse generator LC changes the logical value of the signal SDo to “1” for a certain time Tdp from the falling edge of the clock pulse. To. Since the clock pulse of the clock signal CKs is generated at a cycle Tc shorter than the time Tdp, the logical value of the signal SDo remains “1” at the timing when the next (second) clock pulse is generated. Therefore, the AND gate unit GX3 outputs the input second clock pulse, and the AND gate unit GX2 does not output the second clock pulse. Since the third clock pulse is generated after a certain time Tdp has elapsed from the fall of the first clock pulse, the logic of the signal SDo is “0” at the timing when the third clock pulse is generated. . Therefore, the AND gate unit GX3 does not output the input third clock pulse, and the AND gate unit GX2 outputs the input third clock pulse. By repeating such an operation, the AND gate unit GX2 generates a clock signal CKa in which every other clock pulse of the clock signal CKs having the oscillation frequency Fc of 800 MHz is thinned, and the AND gate unit GX3 generates the clock signal CKa. On the other hand, the clock signal CKb is generated by thinning out every other clock pulse of the clock signal CKs whose oscillation frequency Fc is 800 MHz so that the phase is shifted by a half cycle. That is, the clock signal generation unit 150 divides the clock signal CKs having the oscillation frequency Fc of 800 MHz by half and generates two clock signals CKa and CKb whose phases are shifted from each other by a half cycle. Therefore, the oscillation frequency (light emission frequency) Fb of the clock signals CKa and CKb is 400 MHz.

  The control circuit 152a emits the seed light S1 and S2 in response to each clock pulse of the clock signal CKa so that the pulse light source unit 35 (specifically, the DFB semiconductor laser elements 30 and 32) of the pulsed light generation unit 20a. ) To control. As a result, the frequency of the beam LBa1 (LBb1) emitted from the pulsed light generator 20a is 400 MHz. The control circuit 152b emits the seed light S1 and S2 in response to each clock pulse of the clock signal CKb, so that the pulse light source unit 35 (specifically, the DFB semiconductor laser elements 30, 32) of the pulsed light generation unit 20b. ) To control. As a result, the frequency of the beam LBa2 (LBb2) emitted from the pulsed light generation unit 20b is 400 MHz, and the phase of the emission timing is shifted by a half cycle with respect to the beam LBa1 (LBb1).

  In the present modification, the seed lights S1 and S2 emitted by the DFB semiconductor laser elements 30 and 32 of the pulse light generators 20a and 20b are linearly polarized light whose polarization directions are orthogonal to each other, and pulse light. The DFB semiconductor laser elements 30 and the DFB semiconductor laser elements 32 of the generators 20a and 20b are also linearly polarized light whose polarization directions are orthogonal to each other. As a result, the beam LBa1 (LBb1) emitted from the pulsed light generation unit 20a and the beam LBa2 (LBb2) emitted from the pulsed light generation unit 20b become linearly polarized light orthogonal to each other. In this modification, the polarization states of the seed light S1 emitted from the DFB semiconductor laser element 30 of the pulsed light generation unit 20a and the seed light S2 emitted from the DFB semiconductor laser element 32 of the pulsed light generation unit 20b are both S-polarized. Become. Also, the polarization state of the seed light S2 emitted from the DFB semiconductor laser element 32 of the pulsed light generation unit 20a and the seed light S1 emitted from the DFB semiconductor laser element 30 of the pulsed light generation unit 20b are both P-polarized. Therefore, in this modification, the beam LBa1 (LBb1) emitted from the pulsed light generation unit 20a becomes P-polarized light, and the beam LBa2 (LBb2) emitted from the pulsed light generation unit 20b becomes S-polarized light. The polarization beam splitter 34 of the pulsed light generation unit 20a transmits S-polarized light and reflects P-polarized light, and the polarization beam splitter 34 of the pulsed light generation unit 20b transmits P-polarized light. It is assumed that S-polarized light is reflected. The polarization beam splitter 38 of the pulsed light generation unit 20a transmits P-polarized light and reflects S-polarized light, and the polarization beam splitter 38 of the pulsed light generation unit 20b transmits S-polarized light. It is assumed that P-polarized light is reflected.

  The OR gate unit GX1 generates (generates) one clock signal (reference clock signal) LTC by synthesizing two clock signals CKa and CKb whose phases are shifted from each other by a half cycle. Thereby, each clock pulse (reference clock pulse) of the clock signal LTC is generated at an oscillation frequency Fa (cycle Ta = 1 / Fa) of 800 MHz. Since the clock signal LTC is the same in frequency and phase as the clock signal CKs generated by the clock generator 60 of the clock signal generator 150, the OR gate GX1 need not be provided. In this case, the clock signal CKs generated by the clock generator 60 may be used as the clock signal LTC.

  Further, the clock signal generation unit 150 may include a clock generation unit 60 and a variable delay circuit (not shown). In this case, the clock generation unit 60 generates (generates) the clock signal CKs at the oscillation frequency Fc of 400 MHz, and the variable delay circuit only ½ of the cycle Tc (= 1 / Fc) of the clock signal CKs. The clock signal CKs is delayed. The clock signal generation unit 150 outputs the clock signal CKs generated by the clock generation unit 60 as the clock signal CKa to the control circuit 152a and the OR gate unit GX1, and the clock delayed by the variable delay circuit by ½ period Tc. The signal CKs is output as a clock signal CKb to the control circuit 152b and the OR gate unit GX1.

  Although not shown, the clock signal LTC is input to the correction pixel designating unit 62 and the transmission timing switching unit 64 having the same configuration as shown in FIG. 9 via the gate circuit GTa. In this modification, a correction pixel is designated based on the 800 MHz clock signal LTC, and the transmission timing of the logical information of each pixel of the drawing bit string data SBa (SBb) or the serial data DL1 to DL3 (DL4 to DL6), that is, The timing of shifting the pixel of the logical information to be output, that is, the output timing of the pixel shift pulse SBCa (SBCb) is determined. The correction pixel designation unit 62 and the transmission timing switching unit 64 may be provided inside the light source device LSa (LSb) or may be provided outside the light source device LSa (LSb).

  The logical information of each pixel of the drawing bit string data SBa (SBb) or serial data DL1 to DL3 (DL4 to DL6) sequentially output in accordance with the pixel shift pulse BSCa (BSCb) output from the transmission timing switching unit 64 is obtained. , And output to the drive circuit 36a of the pulsed light generators 20a and 20b of the light source device LSa (LSb). Therefore, the intensity of the beams LBa1 (LBb1) and LBa2 (LBb2) emitted from the pulsed light generators 20a and 20b is based on the drawing bit string data SBa (SBb) or the serial data DL1 to DL3 (DL4 to DL6). Modulated. In addition, the emitted beams LBa1 (LBb1) and LBa2 (LBb2) are combined into one beam LBa (LBb) by the combining optical member 154. Since the beam LBa1 (LBb1) and the beam LBa2 (LB2b) have the same oscillation frequency Fb at 400 MHz and are out of phase by a half period, the combining optical member 154 generates an 800 MHz beam LBa (LBb). Will be. Therefore, the generated beam LBa (LBb) having the oscillation frequency Fa (= 800 MHz) is emitted from the light source device LSa (LSb).

  The combining optical member 154 includes a polarization beam splitter PBS that combines the P-polarized beam LBa1 (LBb1) emitted from the pulsed light generation unit 20a and the S-polarized beam LBa2 (LBb2) emitted from the pulsed light generation unit 20b. Mirrors M20 and M21 for guiding the beam LBa1 (LBb1) emitted by the pulsed light generation unit 20a to the polarization beam splitter PBS, and a mirror M22 for guiding the beam LBa2 (LBb2) emitted by the pulsed light generation unit 20b to the polarization beam splitter PBS. Have at least. Since the polarization beam splitter PBS has characteristics of transmitting P-polarized light and reflecting S-polarized light, it transmits the beam LBa1 (LBb1) and reflects the beam LBa2 (LBb2). At this time, the polarization separation plane of the polarization beam splitter PBS is inclined 45 degrees with respect to a plane orthogonal to the optical axis of the beam LBa1 (LBb1) incident on the polarization beam splitter PBS, and the beam LBa2 incident on the polarization beam splitter PBS. It is arranged so as to be inclined by 45 degrees with respect to a plane orthogonal to the optical axis of (LBb2). As a result, the beam LBa1 (LBb1) transmitted through the polarization beam splitter PBS and the beam LBa2 (LBb2) reflected by the polarization beam splitter are coaxial, so that the beam LBa1 (LBb1) and the beam LBa2 (LBb2) are combined. The

  Note that the beam LBa (LBb) emitted from the light source device LSa (LSb) includes the P-polarized beam LB1a (LB1b) and the S-polarized beam LB2a (LB2b). The optical lens system G10, the photodetector DT, and the λ / 4 wavelength plate QW in the unit Un may be omitted. In this case, the inclination of the drawing line SLn cannot be detected. When it is desired to detect the inclination of the drawing line SLn, the deflection states of the beams LB1a (LB1b) and LB2a (LB2b) are made the same (for example, linear P deflection or circular polarization) by a polarizing plate or the like. The combining optical member 154 may combine the two beams LB1a (LB1b) and the beam LB2a (LB2b) so as to be coaxial with each other.

  Thus, in the exposure apparatus EX of this modification, the light source device LSa (LSb) emits the beams LBa1 (LBb1) and LBa2 (LBb2) emitted at 400 MHz by the two pulsed light generators 20 (20a, 20b). The intensity modulation is performed, and the intensity-modulated beams LBa1 (LBb1) and LBa2 (LBb2) are combined and emitted as a beam LBa (LBb). Therefore, compared to the first embodiment, the drawing line SLn (drawing) The pattern) can be finely corrected.

  If the intensity per unit area of the beams LBa1 (LBb1) and LBa2 (LBb2) is strong, the polarization beam splitter PBS or the like will be burnt accordingly. Therefore, in order to reduce the intensity per unit area, the magnifying lenses G20a and G20b for enlarging the diameters of the beams LBa1 (LBb1) and LBa2 (LBb2) and the expanded beams LBa1 (LBb1) and LBa2 (LBb2) are converted into parallel light. Collimating lenses CL20a and CL20b may be provided. Reference numeral 160 denotes a light guide member including a reflecting mirror and the like for guiding the combined beam LBa (LBb) to the beam profiler 162. The light guide member 160 condenses (converges) the beam LBa (LBb) so that the beam LBa (LBb) becomes spot light on the measurement surface of the beam profiler 162. The beam profiler 162 measures the two-dimensional light intensity distribution of the spot light of the focused beam LBa (LBb) with high accuracy. Thereby, the coaxiality of the beam LBa1 (LBb1) and the beam LBa2 (LBb2) of the combined beam LBa (LBb) can be accurately measured. The light guide member 160 is configured to be retractable from the optical axis position (optical path) of the beam LBa (LBb) by moving the reflecting mirror or the like.

  In this modification, 16 spot lights SP (clock pulse of the clock signal LTC) correspond to one pixel. However, eight spot lights SP (clock signal LTC of the clock signal LTC) correspond to one pixel. Clock pulse) may correspond. As in the present modification, if the projection interval of the spot light SP is 0.1875 μm, the eight spot lights SP correspond to one pixel, so the size Pxy of one pixel is 1.5 (= 0.1875). X8) μm. Therefore, in this case, the size φ of the spot light SP is also set to be equal to or smaller than the dimension Pxy, that is, 1.5 μm or less. Even in this case, the same effect as in the present modification can be obtained, and the size of the pixel can be reduced, so that the resolution and resolution of the pattern can be remarkably fined, resulting in higher definition. Various patterns can be drawn and exposed.

  The pixel dimension Px and the dimension Py have the same length (for example, 3 μm), but the lengths of the dimension Px and the dimension Py may be different. In short, the clock signal generation unit 150 has a reference period Tb determined by (Py × M) / (N × Vs), and a plurality (M) of phases each having a correction time of 1 / M of the reference period Tb. The clock signal (first clock signal) CK may be generated.

[Second Embodiment]
Next, a second embodiment will be described. In the first embodiment (including the modification), the projection interval of the spot light SP in the main scanning direction is made constant, and the spot light SP (clock pulse of the clock signal LTC) per pixel of the correction pixel is locally provided. The scanning length of the drawing line SLn was expanded / contracted by changing the number of. In contrast, in the second embodiment, the number of spot lights SP (clock pulse of the clock signal LTC) per pixel is all the same, and the projection interval of the spot light SP in the main scanning direction is locally set. By changing, the scanning length of the drawing line SLn is expanded or contracted.

  In the second embodiment, the effective length of the drawing lines SLn (SL1 to SL6) is 30 mm, the size φ of the spot light SP is 3 μm, and in principle, the projection of the spot light SP in the main scanning direction. The interval is ½ of the size φ of the spot light SP, that is, 1.5 μm. Therefore, the number of spot lights SP irradiated in one scan is 20000 (= 30 [mm] /1.5 [μm]). Further, if the feed speed (conveyance speed) Vt of the substrate P in the sub-scanning direction is 2.419 mm / sec and the spot light SP is also scanned in the sub-scanning direction at intervals of 1.5 μm, the drawing line SLn. The time difference Tpx between the first scan start (drawing start) time along the next scan start time and the next scan start time is about 620 μsec (= 1.5 [μm] /2.419 [mm / sec]). This time difference Tpx is a time required for the polygon mirror PM of the eight reflecting surfaces RP to rotate by one surface (45 degrees = 360 degrees / 8). In this case, since the time for one rotation of the polygon mirror PM needs to be set to be about 4.96 msec (= 8 × 620 [μsec]), the rotation speed Vp of the polygon mirror PM is about 201 per second. .613 rotations (= 1 / 4.96 [msec]), that is, about 12096.8 rpm.

  Further, the number Np of reflection surfaces of the polygon mirror PM is set to 8, and the scanning efficiency is set to 1/3. Therefore, the time Ts necessary for scanning the spot light SP by the maximum scanning length (for example, 31 mm) of the drawing line SLn is Ts = Tpx × scanning efficiency. In the above numerical example, the time Ts is , Approximately 206.666... Μsec (620 [μsec] / 3). Since the effective scanning length when the drawing line SLn (SL1 to SL6) is not expanded or contracted (when the magnification is 1) is set to 30 mm, the scanning time Tsp of one scan of the spot light SP along the drawing line SLn is , Approximately 200 μsec (= 206.666... [Μsec] × 30 [mm] / 31 [mm]). Accordingly, when the drawing line SLn is not expanded or contracted, it is necessary to irradiate 20000 spot light SP (pulse light) during this time Tsp. Therefore, the emission frequency (oscillation frequency) Fe of the beam LB from the light source device LS is required. Is Fe≈20000 [times] / 200 [μsec] = 100 MHz. Further, the scanning speed Vs of the spot light SP is 30 [mm] / 200 [μsec] = 150 m / sec. In the second embodiment, the size Pxy of one pixel is 3 μm, which is the same as the effective size φ of the spot light SP, and two spot lights SP (clock pulse of the clock signal LTC) for one pixel. Is supported.

  FIG. 20 is a diagram illustrating a configuration of the signal generation unit 22a provided in the light source device LSa (LSb) according to the second embodiment. In addition, the same code | symbol is attached | subjected about the structure similar to the said 1st Embodiment (a modification is also included), and only a different part is demonstrated. The signal generator 22a is provided inside the control circuit 22 as in the first embodiment, but may be provided outside the control circuit 22. Further, the signal generator 22a may be provided outside the light source device LSa (LSb). In the second embodiment, the local magnification correction information CMgn ′ having the correction position information Nv ′ and the expansion / contraction information (polarity information) POL ′ from the local magnification setting unit 112 shown in FIG. 12 is sent to the signal generation unit 22a. Shall be sent. The local magnification setting unit 112 stores local magnification correction information CMgn ′ (CMg1 ′ to CMg6 ′) for each scanning unit Un (U1 to U6). As in the first embodiment, the local magnification setting unit 112 generates local magnification correction information CMgn ′ corresponding to the scanning unit Un that performs scanning with the spot light SP, as a signal generation unit of the light source device LS (LSa, LSb). To 22a. The local magnification correction information CMgn ′ is information for performing local magnification correction.

The signal generation unit 22 a includes a clock signal generation unit 200, a correction point designation unit 202, and a clock switching unit 204. The clock signal generation unit 200, the correction point designating unit 202, the clock switching unit 204, and the like can be configured collectively by an FPGA (Field Programmable Gate Array). The clock signal generation unit 200 has a plurality of (N) clock signals CK _p having a reference period Te shorter than a period determined by φ / Vs and giving a phase difference by a correction time of 1 / N of the reference period Te. (P = 0, 1, 2,..., N−1) is generated. φ is an effective size of the spot light SP, and Vs is a relative speed of the spot light SP with respect to the substrate P in the main scanning direction. If the reference period Te is longer than the period determined by φ / Vs, the spot light SP irradiated along the main scanning direction is discretely irradiated onto the irradiated surface of the substrate P with a predetermined interval. Will be. On the contrary, when the reference period Te is shorter than the period determined by φ / Vs, the spot lights SP are irradiated onto the irradiated surface of the substrate P so as to overlap each other in the main scanning direction. In the second embodiment, in principle, the pulsed spot light SP with the oscillation frequency Fe of 100 MHz is irradiated so that the spot light SP overlaps by half of the size φ, so that the reference period Te is 1 / Fe = 1/100 [MHz] = 10 [nsec], and φ / Vs = 3 [μm] / 150 [mm / sec] = 20 nsec. Further, since N = 50, the clock signal generation unit 200 generates 50 clock signals CK _{0 to} CK ₄₉ to which a phase difference of 0.2 nsec (= 10 [nsec] / 50) is given.

Specifically, the clock signal generator 200 includes a clock generator (oscillator) 60 and a plurality (N−1) of delay circuits De (De01 to De49). The clock generation unit 60 generates a clock signal CK ₀ composed of a clock pulse that oscillates at an oscillation frequency Fe (= 1 / Te) corresponding to the overall magnification correction information TMg. In the second embodiment, the overall magnification correction information TMg is set to 0, and the clock generator 60 generates the clock signal CK ₀ at the oscillation frequency Fe (reference period Te = 10 nsec) of 100 MHz.

The clock signal (output signal) CK ₀ from the clock generation unit 60 is input to the first delay circuit De01 of the plurality of delay circuits De (De01 to De49) connected in series and the clock switching unit 204. To the first input terminal. The delay circuit De (De01~De049) a predetermined time the clock signal CK _p is the input signal (Te / N = 0.2nsec) only delays outputs. Therefore, the first-stage delay circuit De01 is a clock having the same reference period Te (10 nsec) as the clock signal CK ₀ generated by the clock generator 60 and having a delay of 0.2 nsec with respect to the clock signal CK ₀ . A signal (output signal) CK ₁ is output. Similarly, the second stage of the delay circuit De02, a clock signal from the preceding delay circuit De01 (output signal) CK ₁ and the same reference period Te (10 nsec), and, 0 the clock signal CK _1. A clock signal (output signal) CK ₂ having a delay of 2 nsec is output. Similarly, the delay circuits De03 to De49 in the third and subsequent stages have the same reference period Te (10 nsec) as the clock signals (output signals) CK _{2 to} CK ₄₈ from the delay circuits De02 to De48 in the previous stage, and the clock signal Clock signals (output signals) CK _{3 to} CK ₄₉ having a delay of 0.2 nsec with respect to CK _{2 to} CK ₄₈ are output.

Since the clock signals CK _{0 to} CK ₄₉ are signals having a phase difference of 0.2 nsec, the clock signal CK ₀ has the same reference period Te (10 nsec) as the clock signal CK ₄₉ and A clock signal having a further delay of 0.2 nsec with respect to the signal CK ₄₉ and a signal shifted by exactly one cycle. Therefore, the clock signal CK ₀ can be regarded as a clock signal delayed by 0.2 nsec substantially with respect to each clock pulse of the clock signal CK ₄₉ . Clock signals CK _{1 to} CK ₄₉ from the delay circuits De 01 to De ₄₉ are input to the second to 50th input terminals of the clock switching unit 204.

As each delay circuit De (De01 to De49), for example, a gate circuit (logic circuit) as shown in FIG. 21A or 21B is used. In FIG. 21A, an input signal (clock signal CK _p ) is input to one input terminal In1, and a high (logical value is 1) signal is applied to the other input terminal In2. . The AND gate circuit GT10 outputs an output signal (clock signal CK _{p + 1} ) having a delay of 0.2 nsec with respect to the input signal (clock signal CK _p ). Further, in FIG. 21B, an input signal (clock signal CK _p ) is input to one input terminal In1, and a low (logical value is 0) signal is applied to the other input terminal In2. Is done. The OR gate circuit GT11 outputs an output signal (clock signal CK _{p + 1} ) having a delay of 0.2 nsec with respect to the input signal (clock signal CK _p ). As described above, each delay circuit De (De01 to De49) may obtain a desired delay time by a gate circuit (logic circuit) formed by a plurality of transistors, or one or two transistors are connected. It may be simple.

Clock switching unit 204, among the 50 pieces of the clock signal CK _p input (CK ₀ ~CK _49), one of the selected clock signal CK _p, clock signal (a reference clock of the clock signal CK _p selected Signal) A multiplexer (selection circuit) that outputs as LTC. Therefore, the oscillation frequency Fa (= 1 / Ta) of the clock signal LTC is basically the same as the oscillation frequency Fe (= 1 / Ta) of the clock signals CK _{0 to} CK ₄₉ , that is, 100 MHz. The control circuit 22 controls the DFB semiconductor laser elements 30 and 32 so that the seed lights S1 and S2 emit light in response to each clock pulse of the clock signal LTC output from the clock switching unit 204. Therefore, the oscillation frequency Fa of the pulsed beam LBa (LBb) emitted from the light source device LSa (LSb) is 100 MHz in principle.

The clock switching unit 204 is a clock resulting from the generation of the clock signal CK _p output as the clock signal LTC, that is, the beam LBa (LBb) at the timing when the spot light SP passes through the specific correction point CPP located on the scanning line. The signal CK _p is switched to another clock signal CK _p having a different phase difference. The clock switching unit 204 sets the clock signal CK _p to be selected as the clock signal LTC at the timing when the spot light SP passes through the correction point CPP to 0.2 nsec with respect to the clock signal CK _p currently selected as the clock signal LTC. Is switched to the clock signal CK _{p ± 1} having a phase difference of only. The direction of the phase difference of the clock signal CK _{p ± 1 to be} switched, that is, whether the phase is delayed by 0.2 nsec or the phase is advanced by 0.2 nsec, is local magnification correction information (correction information) CMgn ′ (CMg1′˜ It is determined in accordance with 1-bit expansion / contraction information (polarity information) POL 'which is a part of CMg6').

If distortion information POL' is high "1" (stretching), the clock switching unit 204, the clock signal CK _p of 0.2nsec only the phase is delayed with respect to clock signal CK _p being output as the current clock signal LTC ₊₁ is selected and output as the clock signal LTC. On the other hand, when the expansion / contraction information POL ′ is low “0” (reduction), the clock switching unit 204 is a clock signal whose phase is advanced by 0.2 nsec with respect to the clock signal CK _p currently output as the clock signal LTC. CK _p-1 is selected and output as the clock signal LTC. For example, when the clock signal CK _p currently output as the clock signal LTC is CK ₁₁ and the expansion / contraction information POL ′ is high (H), the clock switching unit 204 outputs the clock signal CK as the clock signal LTC. switch the _p clock signal CK _12, when distortion information POL' is low (L), switches the clock signal CK _p to be output as a clock signal LTC in the clock signal CK _10. The same expansion / contraction information POL ′ is input during one scanning period of the spot light SP.

The clock switching unit 204 uses the expansion / contraction information POL ′ of the local magnification correction information CMgn ′ corresponding to the scanning unit Un to which the beam LBn is incident by the beam switching unit BDU, and uses the phase of the clock signal CK _p output as the clock signal LTC. The direction in which the phase shifts (whether the phase advances or is delayed) is determined. The beam LBa (LB1 to LB3) from the light source device LSa is guided to any one of the scanning units U1 to U3. Therefore, the clock switching unit 204 of the signal generation unit 22a of the light source device LSa includes the expansion / contraction information POL ′ of the local magnification correction information CMgn ′ corresponding to one scanning unit Un incident to the beam LBn among the scanning units U1 to U3. Based on this, the direction in which the phase of the clock signal CK _p output as the clock signal LTC is shifted is determined. For example, when the beam LB2 is incident on the scanning unit U2, the clock switching unit 204 of the light source device LSa outputs the clock signal LTC based on the expansion / contraction information POL ′ of the local magnification correction information CMg2 ′ corresponding to the scanning unit U2. The direction in which the phase of the clock signal CK _p to be shifted is shifted is determined.

Further, the beam LBb (LB4 to LB6) from the light source device LSb is guided to any one of the scanning units U4 to U6. Therefore, the clock switching unit 204 of the signal generation unit 22a of the light source device LSb uses the expansion / contraction information POL ′ of the local magnification correction information CMgn ′ corresponding to one scanning unit Un incident with the beam LBn among the scanning units U4 to U6. Based on this, the direction in which the phase of the clock signal CK _p output as the clock signal LTC is shifted is determined. For example, when the beam LB6 is incident on the scanning unit U6, the clock switching unit 204 of the light source device LSb outputs the clock signal LTC based on the expansion / contraction information POL ′ of the local magnification correction information CMg6 ′ corresponding to the scanning unit U6. The direction in which the phase of the clock signal CK _p to be shifted is shifted is determined.

  The correction point designating unit 202 designates a specific point on each drawing line SLn (SL1 to SL6) as the correction point CPP. The correction point designating unit 202 performs correction based on correction position information (set value) Nv ′ for designating a correction point CPP which is a part of local magnification correction information (correction information) CMgn ′ (CMg1 ′ to CMg6 ′). Specify the point CPP. The correction position information Nv ′ of the local magnification correction information CMgn ′ is equal to the drawing line SLn according to the drawing magnification of the pattern drawn along the drawing line SLn (or the magnification of the drawing line SLn in the main scanning direction). This is information for designating a correction point CPP at each of a plurality of discrete positions, and is information indicating a distance interval (equal interval) between the correction point CPP and the correction point CPP. Thereby, the correction point designation | designated part 202 can designate the position arrange | positioned discretely at equal intervals on drawing line SLn (SL1-SL6) as the correction point CPP. This correction point CPP is set between the projection positions of the two adjacent spot lights SP projected along the drawing line SLn (the center position of the spot light SP).

  The correction point designation unit 202 designates the correction point CPP using the correction position information Nv ′ of the local magnification correction information CMgn ′ corresponding to the scanning unit Un on which the beam LBn is incident by the beam switching unit BDU. Since the beam LBa (LB1 to LB3) from the light source device LSa is guided to any one of the scanning units U1 to U3, the correction point designating unit 202 of the signal generating unit 22a of the light source device LSa is not connected to the scanning units U1 to U3. Among them, the correction point CPP is designated based on the correction position information Nv ′ of the local magnification correction information CMgn ′ corresponding to one scanning unit Un on which the beam LBn is incident. For example, when the beam LB2 is incident on the scanning unit U2, the correction point designating unit 202 of the light source device LSa uses the drawing line SLn2 based on the correction position information Nv ′ of the local magnification correction information CMg2 ′ corresponding to the scanning unit U2. A plurality of positions discretely arranged on the top at equal intervals are designated as correction points CPP.

  Further, since the beam LBb (LB4 to LB6) from the light source device LSb is guided to any one of the scanning units U4 to U6, the correction point designating unit 202 of the signal generation unit 22a of the light source device LSb includes the scanning units U4 to U4. Among U6, the correction point CPP is designated based on the correction position information Nv ′ of the local magnification correction information CMgn ′ corresponding to one scanning unit Un on which the beam LBn is incident. For example, when the beam LB6 is incident on the scanning unit U6, the correction point designating unit 202 of the light source device LSb performs the drawing line SLn6 based on the correction position information Nv ′ of the local magnification correction information CMg6 ′ corresponding to the scanning unit U6. A plurality of positions discretely arranged on the top at equal intervals are designated as correction points CPP.

  The correction point designating unit 202 will be specifically described. The correction point designating unit 202 includes a frequency division counter circuit 212 and a shift pulse output unit 214. The frequency division counter circuit 212 is a subtraction counter, and receives a clock pulse (reference clock pulse) of the clock signal LTC output from the clock switching unit 204. The clock pulse of the clock signal LTC output from the clock switching unit 204 is input to the frequency division counter circuit 212 via the gate circuit GTa. The gate circuit GTa is a gate that opens during a period when the drawing permission signal SQn described in the first embodiment is high (H). That is, the frequency division counter circuit 212 counts the clock pulse of the clock signal LTC only during the period when the drawing permission signal SQn is high. Three drawing permission signals SQ1 to SQ3 corresponding to the scanning units U1 to U3 are applied to the gate circuit GTa of the signal generator 22a of the light source device LSa. Therefore, the gate circuit GTa of the light source device LSa outputs the clock pulse of the clock signal LTC input during the period when one of the drawing permission signals SQ1 to SQ3 is high (H) to the frequency division counter circuit 212. Similarly, three drawing permission signals SQ4 to SQ6 corresponding to the scanning units U4 to U6 are applied to the gate circuit GTa of the signal generator 22a of the light source device LSb. Therefore, the gate circuit GTa of the light source device LSb outputs the clock pulse of the clock signal LTC input during the period when any of the drawing permission signals SQ4 to SQ6 is high (H) to the frequency division counter circuit 212.

  The frequency division counter circuit 212 presets the count value C3 to the correction position information (set value) Nv ′ and decrements the count value C3 every time a clock pulse of the clock signal LTC is input. The frequency division counter circuit 212 outputs a one-pulse coincidence signal Idc to the shift pulse output unit 214 when the count value C3 becomes zero. That is, the frequency division counter circuit 212 outputs the coincidence signal Idc when the clock pulse of the clock signal LTC is counted by the correction position information Nv ′. The coincidence signal Idc is information indicating that the correction point CPP exists before the next clock pulse is generated. Further, when the next clock pulse is input after the count value C3 becomes 0, the frequency division counter circuit 212 presets the count value C3 in the corrected position information Nv ′. Thereby, a plurality of correction points CPP can be designated at equal intervals along the drawing line SLn. The specific value of the correction position information Nv ′ will be exemplified later.

The shift pulse output unit 214 outputs the shift pulse CS to the clock switching unit 204 when the coincidence signal Idc is input. When the shift pulse CS is generated, the clock switching unit 204 switches the clock signal CK _p to be output as a clock signal LTC. The shift pulse CS is information indicating the correction point CPP, and is generated after the count value C3 of the frequency division counter circuit 212 becomes 0 and before the next clock pulse is input. Therefore, the position on the substrate P of the spot light SP of the beam LBa (LBb) generated in response to the clock pulse in which the count value C3 of the frequency division counter circuit 212 is zero, and the beam LBa generated in response to the next clock pulse. The correction point CPP exists between the position (LBb) of the spot light SP on the substrate P.

  As described above, in the second embodiment, when 20000 spot lights SP are projected per drawing line SLn and 40 correction points CPP are discretely arranged at equal intervals on the drawing line SLn, Correction points CPP are arranged at intervals of 500 optical SPs (clock pulses of the clock signal LTC). Therefore, the corrected position information Nv ′ is 500.

FIG. 22 is a time chart showing signals output from each part of the signal generator 22a shown in FIG. All of the 50 clock signals CK _{0 to} CK ₄₉ generated by the clock signal generation unit 200 have the same period Te as the clock signal CK ₀ output by the clock generation unit 60, but their phases are delayed by 0.2 nsec. It has become a thing. Therefore, for example, the clock signal CK ₃ has a phase delayed by 0.6 nsec with respect to the clock signal CK ₀ , and the clock signal CK ₄₉ has a phase delayed by 9.8 nsec with respect to the clock signal CK ₀ . ing.

  When the frequency division counter circuit 212 counts the clock pulse of the clock signal LTC output from the clock switching unit 204 by the correction position information (set value) Nv ′, it outputs a coincidence signal Idc (not shown). The shift pulse output unit 214 outputs the shift pulse CS. The shift pulse output unit 214 normally outputs a high (logical value of 1) signal, but when the coincidence signal Idc is output, the shift pulse output unit 214 falls to low (logical value of 0), and the reference of the clock signal CKp. When half the period Te (half period) has elapsed, a shift pulse CS that rises to high (logic value is 1) is output. Thus, the shift pulse CS rises before the next clock pulse is input after the frequency division counter circuit 212 counts the clock pulse of the clock signal LTC by the correction position information (set value) Nv ′.

Clock switching unit 204 in response to the rising edge of the shift pulse CS, a clock signal CK _p to be output as a clock signal LTC, the clock signal CK _p to shift pulse CS is not output until immediately before the occurrence, distortion information POL' Is switched to the clock signal CK _{p ± 1} whose phase is shifted by 0.2 nsec. In the example of FIG. 22, since the clock signal CK _p output as the clock signal LTC immediately before the generation of the shift pulse CS is CK ₀ and the expansion / contraction information POL ′ is “0” (reduction), the rising edge of the shift pulse CS In response to this, the clock signal CK ₄₉ is switched. Thus, when the expansion / contraction information POL ′ is “0”, the clock switching unit 204 has a phase of 0 each time the spot light SP passes through the correction point CPP (that is, every time the shift pulse CS is generated). to proceed by .2nsec switching the clock signal CK _p to be output as a clock signal LTC. Therefore, the clock signal CK _p output (selected) as the clock signal LTC is switched in the order of CK ₀ → CK ₄₉ → CK ₄₈ → CK ₄₇ →. At the position of the correction point CPP where the shift pulse CS is generated, the period of the clock signal LTC is 0.2 nsec shorter than the reference period Te (= 10 nsec) (9.8 nsec), and thereafter, the spot light SP Until the next correction point CPP passes (until the next shift pulse CS is generated), the cycle of the clock signal LTC is the reference cycle Te (= 10 nsec).

On the contrary, when the expansion / contraction information POL ′ is “1”, every time the spot light SP passes through the correction point CPP (that is, every time the shift pulse CS is generated), the clock switching unit 204 has a phase of 0. as delayed by 2nsec switching the clock signal CK _p to be output (selected) as the clock signal LTC. Therefore, the clock signal CK _p output (selected) as the clock signal LTC is switched in the order of CK ₀ → CK ₁ → CK ₂ → CK ₃ →. At the position of the correction point CPP where the shift pulse CS is generated, the period of the clock signal LTC is 0.2 nsec longer than the reference period Te (= 10 nsec) (10.2 nsec), and thereafter, the spot light SP Until the next correction point CPP passes (until the next shift pulse CS is generated), the cycle of the clock signal LTC is the reference cycle Te (= 10 nsec).

  In the second embodiment, since the spot light SP having an effective size φ of 3 μm is projected along the main scanning direction so as to overlap each other by 1.5 μm, the period of the clock signal LTC at the correction point CPP is corrected. The time (± 0.2 nsec) corresponds to 0.03 μm (= 1.5 [μm] × (± 0.2 [nsec] / 10 [nsec])), and is expanded and contracted by ± 0.03 μm per pixel. become. Therefore, finer magnification correction can be performed as compared with the first embodiment (including modifications).

  FIG. 23A is a diagram illustrating a pattern PP drawn when local magnification correction is not performed, and FIG. 23B is a diagram when local magnification correction (reduction) is performed according to the time chart shown in FIG. It is a figure explaining pattern PP to be drawn. The spot light SP having a high intensity is represented by a solid line, and the spot light SP having a low intensity or zero is represented by a broken line.

  As shown in FIGS. 23A and 23B, the pattern PP is drawn by the spot light SP generated in response to each clock pulse of the clock signal LTC. In order to distinguish between the clock signal LTC of FIG. 23A and FIG. 23B and the pattern PP, the clock signal LTC and the pattern PP of FIG. 23A (when local magnification correction is not performed) are represented by LTC1 and PP1, and FIG. The clock signal LTC and the pattern PP when the magnification correction is performed are represented by LTC2 and PP2.

  When local magnification correction is not performed, as shown in FIG. 23A, the dimension Pxy of each pixel to be drawn has a constant length in the main scanning direction. Note that the length of the pixel in the sub-scanning direction (X direction) is represented by Px, and the length of the main scanning direction (Y direction) is represented by Py. When the local magnification correction (reduction) is performed according to the time chart as shown in FIG. 22, the pixel size Pxy including the correction point CPP is reduced by the pixel length Py by ΔPy (= 0.03 μm). Become. On the contrary, when the local magnification correction for expansion is performed, the pixel size Pxy including the correction point CPP is in a state where the pixel length Py is extended by ΔPy (= 0.03 μm).

  Although the pixel shift of the serial data DLn is not particularly mentioned, every time two clock pulses of the clock signal LTC are output from the clock switching unit 204, the drawing data output unit 114 shown in FIG. The logical information of the pixels of the serial data DLn output to the (LSb) drive circuit 36a is shifted by one in the row direction. As a result, two spot lights SP (clock pulse of the clock signal LTC) correspond to one pixel.

As described above, the exposure apparatus EX of the second embodiment uses the spot light SP of the beam LB (Lse, LBa, LBb, LBn) generated according to the seed light S1, S2 from the pulse light source unit 35. The pattern is drawn on the substrate P by relatively scanning the spot light SP along the drawing line SLn on the substrate P while modulating the intensity according to the pattern data. The exposure apparatus EX includes at least a clock signal generation unit 200, a control circuit (light source control unit) 22, and a clock switching unit 204. As described above, the clock signal generator 200 has a reference period Te (for example, 10 nsec) shorter than the period determined by φ / Vs, and a correction time (for example, 0.2 nsec) that is 1 / N of the reference period Te. A plurality (N = 50) of clock signals CK _p (CK _{0 to} CK ₄₉ ) each having a phase difference are generated. Control circuit (light source control unit) 22, a pulse light source unit 35 so that the beam LB is generated in response to each clock pulse of one of the clock signal CK _p among the plurality of clock signals CK _p (clock signal LTC) To control. The clock switching unit 204 is output as the clock signal CK _p resulting from the generation of the beam LB, that is, the clock signal LTC at the timing when the spot light SP passes through the specific correction point CPP designated on the drawing line SLn. the clock signal CK _p, switch to other different clock signal CK _p phase difference. Therefore, the magnification of the drawing line SLn (pattern to be drawn) can be finely corrected, and precise overlay exposure on the micron order can be performed.

The clock switching unit 204 corrects the correction time (± Te / N = 0) with respect to the clock signal CK _p currently input to the control circuit 22 when the spot light SP passes through the correction point CPP on the drawing line SLn. .2 nsec) to the clock signal CK _p having a phase difference. Thereby, the magnification of the drawing line SLn (pattern to be drawn) can be corrected more finely.

The exposure apparatus EX stores local magnification correction information (correction information) CMgn ′ for designating the correction point CPP on the drawing line SLn for each of the plurality of scanning units Un. Is provided. Clock switching unit 204, beam switch the clock signal CK _p Based on the switching unit BDU local magnification correction information CMgn' corresponding to the scanning unit Un the beam LB is guided by. Thereby, the magnification of the drawing line SLn (pattern to be drawn) can be finely corrected for each drawing line SLn (scanning unit Un). Therefore, the overlay accuracy of pattern exposure is improved.

The local magnification correction information CMgn ′ is correction position information for designating a correction point CPP at each of a plurality of discrete positions on the drawing line SLn according to the drawing magnification of the pattern drawn along the drawing line SLn. Nv ′ is included. Clock switching unit 204, at each of a plurality of correction points CPP on the drawing line SLn on the basis of the corrected position information Nv' switching the clock signal CK _p. Accordingly, the drawing line SLn (pattern to be drawn) can be corrected (expanded / contracted) without unevenness.

The local magnification correction information CMgn ′ is based on the drawing magnification of the pattern drawn along the drawing line SLn, and the clock signal CK _{p to} be switched is phase-shifted with respect to the clock signal CK _p currently input to the control circuit 22. Includes expansion / contraction information (polarity information) POL ′ indicating whether the direction is delayed or advanced. Thereby, the drawing line SLn (pattern to be drawn) can be expanded or reduced according to the expansion / contraction information POL ′.

Note that the clock switching unit 204 sets the clock signal CK _p output as the clock signal LTC to q × Te / N = q × 0 with respect to the clock signal CK _p output as the currently output clock signal LTC. The clock signal CK _p ± _q having a phase difference of .2 nsec may be switched. However, q is an integer of 1 or more having a relationship of q <N. Therefore, for example, when q is 2 and the clock signal CK _p output as the currently output clock signal LTC is the clock signal CK ₁₁ , the expansion / contraction information POL ′ is “1”. At this time, the clock switching unit 204 switches to the clock signal CK ₁₃ whose phase is delayed by 0.4 nsec with respect to the clock signal CK ₁₁ . When the expansion / contraction information POL ′ is “1”, the clock switching unit 204 switches to the clock signal CK ₉ whose phase is advanced by 0.4 nsec with respect to the clock signal CK ₁₁ . Information indicating the value of “q” is input from the local magnification setting unit 112 (see FIG. 12) to the clock switching unit 204 as expansion / contraction rate information REC ′. The expansion / contraction rate information REC ′ is included in a part of the local magnification correction information CMgn ′. The same expansion / contraction rate information REC ′ is input during one scanning period of the spot light SP.

  The correction position information (setting value) Nv ′ of the local magnification correction information CMgn ′ (CMg1 ′ to CMg6 ′) can be arbitrarily changed and is appropriately set according to the magnification of the drawing line SLn. For example, the correction position information Nv ′ may be set so that there is one correction point CPP located on the drawing line SLn. Further, although the value of the correction position information Nv ′ is constant in one drawing line SLn, the correction position information Nv ′ may be changed in one drawing line SLn. Even in this case, the plurality of correction points CPP are designated at discrete positions on the drawing line SLn, but the interval between the correction points CPP is changed by changing the correction position information Nv. Can be non-uniform. Further, the correction pixel (correction point CPP) is not changed without changing the number of correction pixels on the drawing line SLn for each scanning of the beam LBn (spot light SP) along the drawing line SLn or for each rotation of the polygon mirror PM. ) May be made different.

[Modification of First and Second Embodiments]
Each of the above embodiments (including modifications) can be modified as follows. In addition, the same code | symbol is attached | subjected about the same structure as said each embodiment (a modification is also included), and only a different location is demonstrated.

  (Modification 1) In each of the above-described embodiments (including modifications), an electro-optic element (intensity modulation section) 36 serving as a drawing light modulator provided in the pulsed light generation section 20 of the light source devices LSa and LSb is provided. The switching is performed using the drawing bit string data SBa (serial data DL1 to DL3) and SBb (serial data DL4 to DL6). However, in the first modification, the drawing optical element AOM is used instead of the electro-optic element 36 as the drawing optical modulator. The drawing optical element AOM is an acousto-optic modulator (AOM).

  For example, as shown in FIG. 24, among the selection optical elements AOM1 to AOM3 of the beam switching unit BDU, between the selection optical element AOM1 to which the beam LBa from the light source device LSa first enters and the light source device LSa, A drawing optical element (intensity modulation unit) AOMa is disposed. Similarly, among the selection optical elements AOM4 to AOM6 of the beam switching unit BDU, a drawing optical element (intensity) is provided between the selection optical element AOM4 and the light source apparatus LSb on which the beam LBb from the light source device LSb first enters. A modulation unit) AOMb is arranged. The drawing optical element AOMa is switched according to the drawing bit string data SBa (serial data DL1 to DL3) output from the first data output unit 114a of the drawing data output unit 114 shown in FIG. AOMb is switched by drawing bit string data SBb (serial data DL4 to DL6) output from the second data output unit 114b. When the logical information of the pixel is “0”, the drawing optical element AOMa (AOMb) transmits the incident beam LBa (LBb) to the absorber (not shown), and the logical information of the pixel is “1”. Generates first-order diffracted light that diffracts the incident beam LBa (LBb). The generated first-order diffracted light is guided to the selection optical element AOM1 (AOM4). Therefore, when the logical information of the pixel is “0”, the spot light SP is not projected onto the irradiated surface of the substrate P, so the intensity of the spot light SP is low (zero), and the logical information of the pixel is “ In the case of “1”, the intensity of the spot light SP is at a high level. Thereby, the intensity of the spot light SP scanned by the scanning units U1 to U3 (U4 to U6) can be modulated according to the serial data DL1 to DL3 (DL4 to DL6). Even in this case, the same effects as those of the above-described embodiments and the like can be obtained.

  Further, a drawing optical element (intensity modulation unit) AOMcn (AOMc1 to AOMc6) may be provided for each scanning unit Un (U1 to U6). In this case, the drawing optical element AOMcn may be provided in front of the reflection mirror M14 (see FIG. 5) of each scanning unit Un. The drawing optical elements AOMcn (AOMc1 to AOMc6) of the scanning units Un (U1 to U6) are switched according to the serial data DLn (DL1 to DL6). The drawing optical element AOMc1 provided in the scanning unit U1 is switched according to the serial data DL1. Similarly, the drawing optical elements AOMc2 to AOMc6 provided in the scanning units U2 to U6 are switched according to the serial data DL2 to DL6. Further, the drawing optical element AOMcn of each scanning unit Un guides the incident beam LBn to an absorber (not shown) when the pixel logical information is “0”, and enters when the pixel logical information is “1”. First order diffracted light is generated by diffracting the beam LBn. The generated first-order diffracted light (beam LBn) is guided to the reflection mirror M14 and projected onto the substrate as spot light SP.

  In the first modification, since it is not necessary to modulate the intensity of the beam LB in the light source device LSa (LSb), the DFB semiconductor laser element 32, the polarization beam splitters 34 and 38, the electro-optic element 36, and the absorber 40 are used. Is no longer necessary. Therefore, the seed light S 1 emitted from the DFB semiconductor laser element 30 is directly guided to the combiner 44.

  (Modification 2) Each of the beams LB from the light source device LS is divided into three or six using a plurality of beam splitters, and each of the divided three or six beams LB is divided into three or six. You may make it inject into the scanning unit Un. In this case, the intensity of each divided beam LB incident on the scanning unit Un is modulated using the serial data DLn.

  (Modification 3) In each of the above-described embodiments (including modifications), a plurality of sheets P are formed on the surface of the substrate P curved in a cylindrical surface in a state where the sheet-like substrate P is in close contact with the outer peripheral surface of the rotary drum DR. A pattern is drawn along the drawing line SLn by each of the scanning units Un. However, for example, as disclosed in the pamphlet of International Publication No. WO2013 / 150677, a configuration may be adopted in which exposure processing is performed while feeding the substrate P in the longitudinal direction while supporting the substrate P in a planar shape. In this case, if the surface of the substrate P is set parallel to the XY plane, for example, the irradiation center axes Le1, Le3, Le5 of the odd-numbered scanning units U1, U3, U5 shown in FIGS. And the irradiation center axes Le2, Le4, Le6 of the even-numbered scanning units U2, U4, U6 are parallel to the Z axis when viewed in a plane parallel to the XZ plane, and at a constant interval in the X direction. A plurality of scanning units U1 to U6 may be arranged so as to be positioned at.

  (Modification 4) In the first embodiment, the second embodiment, or each modification thereof, each scanning unit Un has a reflection surface of the polygon mirror PM as shown in FIG. A first cylindrical lens (toric lens) CYa that converges the beam LBn that travels in a one-dimensional direction (Zt direction in FIG. 5) and a beam LBn that is reflected by one reflecting surface of the polygon mirror PM and passes through the fθ lens FT. Is provided with a second cylindrical lens (toric lens) CYb that converges in a one-dimensional direction (Xt direction in FIG. 5), thereby rendering a drawing line SLn (spot light SP) due to slight tilting of each reflecting surface of the polygon mirror PM. Is suppressed in the sub-scanning direction (Xt direction). In this case, the rear focal point of the first cylindrical lens CYa is set to be the position of the reflection surface of the polygon mirror PM when viewed in a plane orthogonal to the generatrix of the first cylindrical lens CYa. Furthermore, when viewed in a plane orthogonal to the generatrix of the second cylindrical lens CYb, the synthesis system of the fθ lens FT and the second cylindrical lens CYb is such that the reflective surface of the polygon mirror PM and the irradiated surface of the substrate P are It is set to have an optically conjugate relationship (imaging relationship). That is, the reflective surface of the polygon mirror PM is set within a predetermined tolerance range at or near the front focal point of the fθ lens FT, and the substrate P is positioned at the rear focal point of the second cylindrical lens CYb. The irradiated surface is set so as to be positioned within a predetermined depth of focus range (Depth of Focus).

  Further, under such a relationship, the optical elements for selection AOMn (AOM1 to AOM6) provided in the beam switching unit BDU of FIG. 6 or FIG. 24, the optical elements for drawing AOMa, AOMb, or each scanning unit Un. The direction (X) in which the drawing optical element AOMcn (AOMc1 to AOMc6) provided diffracts the incident beam (0th order light) as a drawing beam (first order diffracted light) intersects the drawing line SLn on the substrate P (X Direction or Xt direction) is set optically conjugate with each of the irradiated surface of the substrate P and the reflecting surface of the polygon mirror PM. That is, the deflection direction of the drawing beam (first-order diffracted light) by these optical elements AOM corresponds to the direction in which the optical power is optically orthogonal (or intersecting) with the direction of the generatrix of the cylindrical lens CYb (or CYa). Set to do.

  This type of optical element AOM (acousto-optic modulation element) has a problem that the deflection angle (diffraction angle) varies depending on the temperature of an optical member that generates a diffraction grating inside by ultrasonic vibration. However, as described above, the deflection direction of the drawing beam (first-order diffracted light) by the optical element AOM is set to match the direction in which the refractive power of the second cylindrical lens CYb (or the first cylindrical lens CYa) is exhibited. By doing so, it is possible to suppress the fluctuation in the sub-scanning direction (Xt direction) of the drawing line SLn (spot light SP) caused by the fluctuation of the deflection angle (diffraction angle) caused by the temperature change of the optical element AOM.

  This will be described with reference to FIG. FIG. 25 shows the arrangement of the condensing lens (condenser lens) CD1, the selection optical element AOM1, the collimating lens CL1, and the unit side incident mirror IM1 in the beam switching unit BDU shown in FIG. 6 or FIG. It is the figure which abbreviate | omitted the optical path in the middle and showed typically the relationship with arrangement | positioning of the 2nd cylindrical lens CYb in U1. The beam LBa incident on the condenser lens CD1 is, for example, a parallel light beam having a circular cross section with a diameter of several millimeters, and is converged by the condenser lens CD1 so as to have a beam waist (minimum diameter) at the position of the rear focal point. The deflection position Pdf of the selection optical element AOM1 is set at the beam waist position. When the selection optical element AOM1 is in the on state (the incidence permission signal LP1 is in the H state), the beam (first-order diffracted light) whose direction is changed by the deflection angle (diffraction angle) θdf with respect to the incident beam LBa at the deflection position Pdf. LB1 is generated. When the selection optical element AOM1 is in the off state (incident permission signal LP1 is in the L state), the beam LBa is not diffracted at the deflection position Pdf, so that the beam LBa becomes a divergent light beam as it is from the deflection position Pdf. Head toward lens CL1. Since the position of the front focal point of the collimating lens CL1 is also aligned with the deflection position Pdf of the selecting optical element AOM1, the beam LBa that has passed through the collimating lens CL1 becomes a parallel beam again, and the condenser lens CD2 in the next stage, It goes to the optical element for selection AOM2.

  The beam LB1 deflected (diffracted) by the selection optical element AOM1 is reflected by the unit-side incident mirror IM1 and travels toward the scanning unit U1. Although not shown in FIGS. 6 and 24, a collimator lens CL1 ′ similar to the collimator lens CL1 is provided after the mirror IM1, and a beam LB1 traveling as a divergent light beam from the optical element AOM1 for selection is provided. Use parallel light flux. Therefore, the position of the front focal point of the collimating lens CL1 'is set to the deflection position Pdf of the selection optical element AOM1. The beam LB1 that has passed through the collimator lens CL1 ′ is incident on the scanning unit U1 in FIG. 5 and passes through the first cylindrical lens CYa, the polygon mirror PM, the fθ lens FT, the reflection mirror M15, and the like, and the bus line in the Yt direction. After entering the extended second cylindrical lens CYb, the light is condensed on the drawing line SL1 on the substrate P as the spot light SP. In FIG. 25, the drawing line SL1 extends linearly in the Yt direction, and the spot light SP is scanned in the Yt direction. Here, the direction in which the second cylindrical lens CYb exhibits refractive power is the Xt direction.

  When the deflection angle θdf of the beam LB1 deflected by the selection optical element AOM1 varies by Δθdf due to the temperature change of the selection optical element AOM1, the beam LB1 emitted from the collimating lens CL1 ′ is translated (drifted) in the lateral direction. ) Beam LB1 ′. When the drifted beam LB1 ′ exits from the fθ lens FT, it drifts in the Xt direction from the original exit position, but the beam LB1 ′ is collected as the spot light SP by the refractive power of the second cylindrical lens CYb. The position in the Xt direction where light shines hardly changes from the position before drift. In this way, the deflection position Pdf of the selection optical element AOM1 and the irradiated surface of the substrate P are set in an optically conjugate relationship, and the bus line of the second cylindrical lens CYb (or the first cylindrical lens CYa). The deflection position Pdf of the selection optical element AOM1 and the reflection surface of the polygon mirror PM are set in an optically conjugate relationship within a plane orthogonal to the plane (that is, a plane parallel to the XtZt plane in FIG. 25). Then, by setting the deflection direction (diffraction direction) of the beam LB1 by the selection optical element AOM1 to be in a plane parallel to the XtZt plane, the deflection angle θdf depends on the temperature change of the selection optical element AOM1. Even if the fluctuation occurs, the fluctuation of the position of the drawing line SL1 (spot light SP) due to the fluctuation is suppressed to a negligible level. The relationship as described above indicates that the selection optical elements AOM2 to AOM6 and the drawing optical elements AOMa and AOMb for the other scanning units U2 to U6, or the drawing optical elements AOMcn (AOMc1 to AOMc1) provided in each scanning unit Un. The same is set in AOMc6).

  By the way, in the first embodiment (including modifications), since the light source device LS (LSa, LSb) is a pulse laser light source, a clock corresponding to one correction pixel designated on the drawing line SLn. The readout of drawing data (bit string) is controlled so that the number of pulses of the signal LTC (the number of pulses of the spot light SP) is different from the number of pulses of the clock signal LTC corresponding to other non-correction pixels. In response to the pulse, the beam LB from the light source device LS (LSa, LSb) was pulsed. However, the light source device LS (LSa, LSb) is provided in each of the plurality of scanning units Un as a semiconductor laser light source capable of continuous light emission or a semiconductor light source such as a light emitting diode (LED), and a beam from the semiconductor light source In the case where the spot light SP is directly generated, the light emission time of the semiconductor light source may be controlled to be slightly different between the correction pixel and another pixel (non-correction pixel). In such control, the semiconductor light source may be continuously lit only during a period when the drawing bit string data SBa (SBb) shown in FIG. Of course, the semiconductor light source may be pulsed in response to a clock pulse obtained by a logical product (AND) of the clock signal LTC and the drawing bit string data SBa (SBb) as shown in FIG.

  (Modification 5) In each of the above embodiments and modifications, the spot light SP is scanned in the main scanning direction by the polygon mirror PM. Instead of the polygon mirror PM, a galvanometer mirror (as shown in FIG. (Vibrating mirror) GM can also be used. FIG. 26 shows a planar arrangement of the galvanometer mirror GM and the fθ lens FT of the scanning unit Ua1 of the fifth modification. The optical axis AXf of the fθ lens FT is arranged parallel to the X axis of the orthogonal coordinate system XYZ, and the rotation (vibration) central axis Cg of the galvano mirror GM is arranged parallel to the Z axis. The reflection plane of the galvanometer mirror GM is parallel to the Z axis and is set to have an angle of 45 degrees in the XY plane with respect to the optical axis AXf of the fθ lens FT at the neutral position of the vibration around the central axis Cg. ing. The beam LB1 from the light source device LS that has entered the reflection surface of the galvanometer mirror GM through the beam transmission system (a parallel light beam whose intensity is modulated according to the drawing data has a circular cross section) is reflected by the reflection surface in the + X direction. Is done. The beam LB1 reflected by the galvanometer mirror GM is incident on the fθ lens FT within the range of a predetermined deflection angle θg, and is condensed as the spot light SP on the drawing line SL1 on the substrate P.

  When the galvano mirror GM is used as a main scanning deflection member, the scanning speed of the spot light SP in the main scanning direction is not constant, and a slight speed difference may occur between the central portion and the peripheral portion of the drawing line SL1. . This is because there is a portion where the change in the deflection angle of the beam LB1 due to the reciprocal vibration of the galvanometer mirror GM is not linear with respect to the time axis. Such speed unevenness of the spot light SP appears as a partial drawing magnification error of the drawing pattern along the main scanning direction, particularly as a magnification error in the central portion and the peripheral portion of the drawing line SLn. According to the first embodiment or the second embodiment, it is possible to easily correct such a partial magnification error.

  (Modification 6) FIG. 27 shows an example in which the angle of the reflecting surface that reflects the beam LB1 from the light source device LS is changed and the beam LB1 is deflected and scanned in the main scanning direction as in the polygon mirror PM and the galvanometer mirror GM. FIG. 6 is a perspective view of a scanning unit UR1 that scans the spot light SP of the beam LB1 in an arc shape on the irradiated body (substrate P) by a mechanical rotation mechanism. In FIG. 27, the substrate P is arranged in parallel with the XY plane of the orthogonal coordinate system XYZ, and moves at a predetermined speed in the X direction for sub-scanning. The scanning unit UR1 is parallel to the mirrors MR1 and XY which fold the beam LB1 (parallel light beam having a circular cross section) incident along the optical axis AXu of the beam transmission system set parallel to the Z axis at 90 degrees. A condensing lens G30 having an optical axis AXv and coaxially incident on the beam LB1 reflected by the mirror MR1 along the optical axis AXv, and an optical axis AXv parallel to the XY plane as an optical axis AXw parallel to the Z axis And a mirror MR2 that bends in a straight line. The condensing lens G30 condenses the incident beam LB1 as spot light SP 'on the surface (irradiated surface) of the substrate P. The housing of the scanning unit UR1 holds the mirrors MR1 and MR2 and the condenser lens G30 as a unit, and has a single optical axis AXu parallel to the Z axis as a central axis as indicated by an arrow AR in a plane parallel to the XY plane. It rotates at high speed in the direction at a predetermined speed.

  Assuming that a point that intersects the extended line of the optical axis AXu serving as the rotation center axis on the irradiated surface is a rotation center point CR, the spot light SP ′ is length Lam from the rotation center point CR by the rotation of the scanning unit UR1. Is scanned along a circle with a radius of. In the configuration of the scanning unit UR1, the spot light SP 'can be projected onto the irradiated surface over 360 degrees on a circle having a radius Lam. However, in actuality, in consideration of the curvature of the circle with the sub-scanning direction and the radius Lam, the spot light SP ′ whose intensity is modulated according to the drawing data is received only when the scanning unit UR1 is in a certain angular range θu. A pattern is drawn along the arcuate drawing line SL1 ′ corresponding to the angle range θu. In the case of this modification, it is preferable that the positions in the sub-scanning direction (X direction) of the scanning start point Js and the scanning end point Je of the arc-shaped drawing line SL1 'by the spot light SP' are aligned.

  In the case of this modification, since the drawing line SL1 ′ is not a straight line parallel to the Y axis, the intensity modulation control (timing) of the spot light SP ′ according to the drawing data is performed in two-dimensional pixels of the drawing data. The arc-shaped drawing line SL1 ′ is superimposed on the map, and the pixel bit corresponding to the scanning position of the spot light SP ′ (the rotation angle position of the scanning unit UR1) is in the drawing state (“1”) or the non-drawing state. The intensity of the spot light SP ′ (beam LB1) may be modulated according to whether it is (“0”). In order to accurately measure the scanning position of the spot light SP 'in real time, it is preferable that a scale disk for a rotary encoder having a radius of Lam be provided coaxially with the optical axis AXu in the casing of the scanning unit UR1. In FIG. 27, the casing of the scanning unit UR1 is shown as a prismatic shape extending in the radial direction from the optical axis AXu (rotation center point CR). However, in order to reduce axial blurring during rotation and obtain stable rotation characteristics. It is desirable that the mirror MR1 and MR2 have a disk shape with a thickness in the Z direction for holding the condenser lens G30.

DESCRIPTION OF SYMBOLS 10 ... Device manufacturing system 12 ... Substrate conveyance mechanism 14 ... Exposure head 16 ... Control apparatus 20 ... Pulse light generation part 22, 152a, 152b ... Control circuit 30, 32 ... DFB semiconductor laser element 34, 38 ... Polarizing beam splitter 35 ... Pulse Light source 36 ... Electro-optic element 36a ... Drive circuit 42 ... Excitation light source 44 ... Combiner 46 ... Fiber optical amplifier 48, 50 ... Wavelength conversion optical element 60 ... Clock generator 62 ... Correction pixel designation part 64 ... Transmission timing switching part 70 ... First frequency division counter circuit 72, 74, 80, 82 ... Delay element 76 ... Preset unit 78 ... Second frequency division counter circuit 100 ... Polygon drive control unit 102 ... Selection element drive control unit 104 ... Beam control device 110 ... Overall magnification setting unit 112 ... Local magnification setting unit 114 ... Drawing data output unit 114a ... First Data output unit 114b ... Second data output unit 116 ... Exposure control unit 150, 200 ... Clock signal generation unit 154 ... Synthetic optical member 160 ... Light guide member 162 ... Beam profiler 202 ... Correction point designation unit 204 ... Clock switching unit 212 ... frequency division counter circuit 214 ... shift pulse output units AM1m, AM11 to AM14, AM2m, AM21 to AM24 ... alignment microscopes AOMa, AOMb, AOMcn, AOMc1 to AOMc6 ... drawing optical elements AOMn, AOM1 to AOM6 ... selection optical elements AXo ... central axis BDU ... beam switching unit BMn, BM1~BM6 ... memory unit BSC, BSCa, BSCb ... pixel shift pulse _{CKa, CKb, CKs, CK p} , LTC ... clock signal CMgn, CMgn' ... local magnification correction information CYa, CYb ... Sylind Rical lens De01 to De49 ... delay circuit DLn, DL1 to DL6 ... serial data DR ... rotating drum ENja, EN1a to EN4a, ENjb, EN1b to EN4b ... encoder EX ... exposure apparatus FT ... fθ lens GT1m, GT2m, GX1 ... OR gate LB, LBa, LBb, LBn, Lse, LB1 to LB6, LB1 '... Beam Len, Le1 to Le6 ... Irradiation center axis LPn, LP1 to LP6 ... Incident permission signals LS, LSa, LSb ... Light source device Lx1 to Lx4 ... Installation orientation Lines MKm, MK1 to MK4 ... Alignment marks Nv, Nv '... Correction position information OPn, OP1-OP6 ... Origin sensors OSMn, OSM1-OSM6 ... Drawing permission signal generator P ... Substrate PM ... Polygon mirror POL, POL' ... Expansion / contraction information PR1 to PR4 ... Processing device Pxy φ ... Dimensions SBa, SBb ... Drawing bit string data SCA ... Magnification information SDa, SDb ... Scale portions SLn, SL1-SL6, SL1 '... Drawing lines SP, SP' ... Spot light SQn, SQ1-SQ6 ... Drawing permission signals SZn, SZ1 ~ SZ6 ... Origin signal Un, U1-U6, Ua1, UR1 ... Scanning unit Vs ... Scanning speed W ... Exposure area

Claims (7)

A beam whose intensity changes according to the pattern is projected onto the substrate as a spot light and scanned one-dimensionally in the main scanning direction, and the substrate and the spot light are relatively moved in the sub-scanning direction intersecting the main scanning direction. A pattern drawing device for causing
Pixel data that changes the intensity of the beam for each pixel between drawing and non-drawing when the drawing range on the substrate by the main scanning of the spot light is divided by an arrangement of pixels of a predetermined size A drawing data storage unit storing
Clock generation for generating a clock signal having a frequency Fa that is N times higher than the frequency determined by Vs / Py, where Vs is the velocity of the spot light in the main scanning direction and Py is the size of the pixel in the main scanning direction. And
A pulse light source unit that generates sharp pulsed first type light and slow pulsed second type light generated at a frequency Fa in response to each clock pulse of the clock signal; and the first type light And an optical modulator that outputs one of the second type light by polarization switching based on the pixel data, and the first type light or the second type light output from the optical modulator is incident A pulse light source device comprising: a fiber amplifier; and a wavelength conversion element that converts the first-type light amplified by the fiber amplifier into an ultraviolet wavelength region and outputs a pulse as the beam at a frequency Fa;
A correction pixel designating unit that designates at least one pixel arranged at a specific position as a correction pixel and other pixels as non-correction pixels among the plurality of pixels arranged along the drawing range;
During the main scanning of the spot light, the non-corrected pixels are generated in response to N clock pulses of the clock signal in accordance with either the drawing state or non-drawing state of the pixel data. N of one of the first-type light and the second-type light is incident on the fiber amplifier, and the correction pixel has the above- described correction state according to either the drawing state or the non-drawing state of the pixel data. One of the first-type light and the second-type light generated in response to N ± m clock pulses (m is an integer of 1 or more having a relationship of m <N). A beam controller for controlling N ± m to be incident on the fiber amplifier ;
A pattern drawing apparatus. The pattern drawing apparatus according to claim 1 ,
The main scanning direction dimension of the kiss pot light before being projected on the substrate are substantially the same, the size Py of the pixel or is set to be smaller than the dimension Py, the pattern writing apparatus. The pattern drawing apparatus according to claim 1 or 2 ,
The correction pixel designating unit designates each pixel at a plurality of discrete positions separated by a predetermined number of pixels as a correction pixel from among the plurality of pixels arranged along the drawing range. . It is a pattern drawing apparatus of any one of Claims 1-3 ,
In a state where the number of the plurality of pixels arranged along the drawing range is constant, the clock generation unit sets the frequency Fa of the clock signal to expand and contract the length of the drawing range in the main scanning direction. A pattern drawing apparatus that increases or decreases by a predetermined ratio. It is a pattern drawing apparatus of any one of Claims 1-4,
The pulse light source device is
A first pulse light source device that emits a first beam generated as pulsed light in the ultraviolet wavelength range of the frequency Fa; and generated as pulsed light in the ultraviolet wavelength range of the frequency Fa; A second pulse light source device that emits a second beam generated so that the phase of the pulse period is shifted by a half period with respect to the beam of
A combining optical member that synthesizes the first beam and the second beam coaxially to generate a beam that is pulsed at a frequency of 2 Fa;
A pattern drawing apparatus, further comprising: It is a pattern drawing apparatus of any one of Claims 1-4,
The pattern drawing apparatus in which the frequency Fa of the clock signal generated from the clock generator is set to any one of 100 MHz, 400 MHz, and 800 MHz. It is a pattern drawing apparatus of any one of Claims 1-6 ,
The pattern drawing apparatus, wherein N is set to 8 or 16, and m is set to 1.

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