CN109343214B - Pattern drawing device - Google Patents

Abstract

A pattern drawing device for drawing a predetermined pattern on an irradiation object by a scanning spot of a laser beam, comprising: a light source device (14) that emits the laser beam; a plurality of drawing units (U1-U6) for generating the scanning spot by entering the laser beam, including an optical scanning unit for scanning the laser beam and an optical lens system, and arranged to scan the scanning spot on different regions of the irradiation object; and a plurality of optical elements (50, 58, 66) for selection, which are arranged in series along the traveling direction of the laser beam from the light source device, in order to switch whether or not the laser beam from the light source device is incident on the selected drawing unit of the plurality of drawing units.

Description

Pattern drawing device

The present invention is a divisional application of inventions of the invention application having an international application date of 2015, 27/04, an international application number of PCT/JP2015/062692, a national application number of 201580034744.8 at the stage of entering china, and an invention name of "pattern drawing device, pattern drawing method, device manufacturing method, laser light source device, light beam scanning device, and light beam scanning method".

Technical Field

The present invention relates to a light beam scanning device and a light beam scanning method for scanning a spot light of a light beam irradiated on an object to be irradiated, a pattern drawing device and a pattern drawing method for drawing a predetermined pattern on the object to be irradiated by scanning the spot light, a device manufacturing method using the pattern drawing method, and a laser light source device used in the pattern drawing device and the light beam scanning device.

Background

As disclosed in japanese patent application laid-open nos. 61-134724 and 2001-133710, there are known a laser irradiation device and a laser drawing device as follows: a laser beam from one laser oscillator (laser beam source) is divided into two by a half mirror, and the divided laser beams are made to enter two polygon mirrors (rotating polygon mirrors) respectively, whereby the two laser beams are scanned on a drawing target. Further, it is also disclosed in japanese patent laid-open No. 2001-133710 that two divided laser beams incident to two polygon mirrors are each modulated by passing an AOM (acousto-optic modulation element) that is turned On/Off (On/Off) in response to drawing data.

Disclosure of Invention

However, in the light beam scanning by the polygon mirror, there is a case where there is a period during which the incident laser beam cannot be efficiently reflected toward the object to be drawn during the rotation of the polygon mirror, depending on the number of reflection surfaces of the polygon mirror, the incident condition of an optical system (e.g., f θ lens) behind the polygon mirror, and the like. Therefore, even if the laser beam is divided into two by the half mirror and made incident on the two polygon mirrors as in the conventional art, there is a period in which the laser beam cannot be effectively irradiated to the object to be drawn, that is, a non-drawing period, and the laser beam from the light source cannot be effectively used in some cases.

A 1 st aspect of the present invention is a pattern drawing device for drawing a predetermined pattern on an irradiation object by a scanning spot of laser light, comprising: a light source device that emits the laser beam; a plurality of drawing units for generating the scanning spot by inputting the laser beam, including an optical scanning member and an optical lens system for scanning with the laser beam, and arranged to scan the scanning spot on different regions on the irradiation object; and a plurality of optical elements for selection, which are arranged in series along a traveling direction of the laser beam from the light source device, in order to switch whether or not the laser beam from the light source device is incident on the selected drawing unit of the plurality of drawing units.

A 2 nd aspect of the present invention is a pattern drawing device for drawing a predetermined pattern on an irradiation object by a scanning spot of laser light, comprising: a light source device that emits the laser beam; a plurality of drawing units including an optical scanning unit and an optical lens system for scanning with the laser beam so as to generate the scanning spot, the plurality of drawing units being arranged so that the scanning spot scans different regions on the irradiation object; a plurality of optical elements for selection, which are arranged in series along a traveling direction of the laser beam from the light source device so that the laser beam from the light source device is selectively incident on the plurality of drawing units; and a drawing optical modulator for modulating intensities of the laser light incident on the plurality of optical elements for selection based on drawing data of each of the plurality of drawing units defining a pattern to be drawn on the irradiation object by the scanning spot.

The 3 rd aspect of the present invention comprises: a pulse light source device for generating a pulse-shaped light beam with an adjustable oscillation period; a 1 st drawing unit configured to project a light beam from the pulse light source device as spot light onto an object to be irradiated, and to deflect the light beam so that a projection period and a non-projection period of the spot light onto the object are repeated at a predetermined cycle, and to scan the spot light along a 1 st drawing line on the object to be irradiated during the projection period; a 2 nd drawing unit configured to project a light beam from the pulse light source device as spot light onto the irradiation object, and deflect the light beam so that the projection period and the non-projection period repeat at a predetermined cycle, and to scan the spot light along a 2 nd drawing line on the irradiation object different from the 1 st drawing line during the projection period; a 1 st control system that synchronously controls the 1 st drawing unit and the 2 nd drawing unit such that the projection period of the 1 st drawing unit corresponds to the non-projection period of the 2 nd drawing unit, and the projection period of the 2 nd drawing unit corresponds to the non-projection period of the 1 st drawing unit; and a 2 nd control system that controls the pulse light source device so that oscillation of the light beam is controlled based on 1 st drawing information of a pattern to be drawn by the 1 st drawing line in the projection period of the 1 st drawing unit, and oscillation of the light beam is controlled based on 2 nd drawing information of a pattern to be drawn by the 2 nd drawing line in the projection period of the 2 nd drawing unit.

A 4 th aspect of the present invention is a pattern drawing device that draws a pattern on an irradiation object by relatively scanning a spot light of an ultraviolet laser beam focused on the irradiation object and the irradiation object while modulating the intensity of the spot light based on drawing data, the pattern drawing device including: a laser light source device including a light source unit that generates seed light that is a source of the ultraviolet laser light, an optical amplifier that receives and amplifies the seed light, and a wavelength conversion optical element that generates the ultraviolet laser light from the amplified seed light; and a modulator for modulating intensity of the light of the kind generated from the light source unit in accordance with the drawing data, in order to modulate the intensity of the spot light.

A 5 th aspect of the present invention is a pattern drawing method for drawing a pattern on an irradiation object by relatively scanning a spot light of an ultraviolet laser beam condensed on the irradiation object and the irradiation object while modulating the intensity of the spot light based on drawing data, the pattern drawing method including: a conversion step of amplifying seed light, which is a source of the ultraviolet laser light, by an optical amplifier and converting the amplified seed light into the ultraviolet laser light by a wavelength conversion optical element; and a modulation step of modulating the intensity of the seed light incident on the optical amplifier in accordance with the drawing data, in order to modulate the intensity of the spot light.

A 6 th aspect of the present invention is a device manufacturing method including: drawing a device pattern on the photosensitive layer of the substrate by the pattern drawing method according to claim 5 while moving a photosensitive substrate prepared as the irradiation object in a 1 st direction; and selectively forming a predetermined pattern material according to a difference between an irradiated portion and a non-irradiated portion of the point light in the photosensitive layer.

A 7 th aspect of the present invention is a laser light source device connected to a device for drawing a pattern by spot light condensed on an irradiation object and emitting a light beam as the spot light, comprising: a 1 st semiconductor light source that generates a 1 st pulse light having a short emission time and a high peak intensity in response to a clock pulse of a predetermined period; a 2 nd semiconductor light source for generating a 2 nd pulse light having a light emission time shorter than the predetermined period, longer than the light emission time of the 1 st pulse light, and having a low peak intensity in response to the clock pulse; a fiber optical amplifier into which the 1 st pulse light or the 2 nd pulse light is incident; and a switching member that performs optical switching based on input of pattern information to be drawn so as to cause the 1 st pulse light to enter the fiber optical amplifier when the spot light is projected onto the irradiation target, and to cause the 2 nd pulse light to enter the fiber optical amplifier when the spot light is not projected onto the irradiation target.

An 8 th aspect of the present invention is an optical beam scanning device in which a plurality of scanning units each including a rotary polygon mirror that repeatedly deflects a light beam from a light source device and a projection optical system that receives the deflected light beam and focuses the light beam into a spot light that is one-dimensionally scanned on an irradiation target are arranged in a predetermined positional relationship, the optical beam scanning device including: a light beam switching unit that switches an optical path of the light beam so that the light beam from the light source device is incident on one of the scanning units that performs one-dimensional scanning of the spot light; and a beam switching control unit that controls the beam switching member so that deflection of the beam by the rotating polygon mirror of the scanning unit is repeated for every other reflecting surface of the rotating polygon mirror, and that causes each of the plurality of scanning units to sequentially perform one-dimensional scanning of the spot light.

A 9 th aspect of the present invention is an optical beam scanning device including a plurality of scanning modules in which a plurality of scanning units having a rotary polygon mirror that rotates at a constant rotational speed to repeatedly deflect a light beam from a light source device and a projection optical system that receives the deflected light beam and focuses the light beam into a spot light that is one-dimensionally scanned on an irradiation target are arranged in a predetermined positional relationship, the optical beam scanning device including: a light beam switching unit that switches an optical path of the light beam so that the light beam from the light source device is incident on the scanning unit that performs one-dimensional scanning of the spot light among the plurality of scanning units; and a light flux switching control unit that controls the light flux switching member so that the deflection of the light flux by the rotating polygon mirror of each of the scanning units is switched to either one of a 1 st state that is repeated for each continuous reflection surface of the rotating polygon mirror and a 2 nd state that is repeated for every other reflection surface of the rotating polygon mirror, and that causes each of the plurality of scanning units to sequentially perform one-dimensional scanning of the spot light.

A 10 th aspect of the present invention is a beam scanning method for scanning a beam of light on an irradiation target by arranging a plurality of scanning units in a predetermined positional relationship, the scanning units including a projection optical system on which a beam of light repeatedly deflected by a rotary polygon mirror is incident and which condenses the beam of light into a spot light for one-dimensional scanning on the irradiation target, the beam scanning method including: synchronously rotating the plurality of rotary polygon mirrors so that rotational angular positions of the rotary polygon mirrors of the plurality of scanning units have a predetermined phase relationship with each other; and a scanning unit configured to switch the light beam to be incident on the scanning unit so that the deflection of the light beam by the rotating polygon mirror is repeated every other reflecting surface of the rotating polygon mirror so that the one-dimensional scanning of the spot light by each of the plurality of scanning units is sequentially performed.

An 11 th aspect of the present invention is a beam scanning method for performing beam scanning on an irradiation target by a beam scanning device in which a plurality of scanning units including a projection optical system on which a beam repeatedly deflected by a rotating polygon mirror rotating at a constant rotational speed is incident and which converges the beam into a spot light for performing one-dimensional scanning on the irradiation target are arranged in a predetermined positional relationship, the beam scanning method including: synchronously rotating the plurality of rotary polygon mirrors so that rotational angular positions of the rotary polygon mirrors of the plurality of scanning units have a predetermined phase relationship with each other; a 1 st scanning step of switching the scanning unit on which the light beam is incident so that the deflection of the light beam by the rotating polygon mirror is repeated for each of consecutive reflection surfaces of the rotating polygon mirror, thereby sequentially performing one-dimensional scanning of the spot light by each of the plurality of scanning units; a 2 nd scanning step of switching the scanning unit on which the light beam is incident so that deflection of the light beam by the rotating polygon mirror is repeated every other reflecting surface of the rotating polygon mirror, thereby sequentially performing one-dimensional scanning of the spot light by each of the plurality of scanning units; and a switching step of switching between the 1 st scanning step and the 2 nd scanning step.

A 12 th aspect of the present invention is a pattern drawing method using a drawing apparatus in which a plurality of scanning units that perform main scanning along drawing lines with spot light of a light beam from a light source apparatus are arranged so as to be joined to a substrate in a main scanning direction of the drawing lines in accordance with a pattern drawn by each of the drawing lines, and the plurality of scanning units and the substrate are relatively moved in a sub-scanning direction intersecting the main scanning direction, the pattern drawing method including: selecting a specific scanning unit corresponding to the width of the substrate in the main scanning direction or the width or position of an exposure area on the substrate, on which a pattern is to be drawn, in the main scanning direction, from among the plurality of scanning units; and a light beam distribution unit that transmits the light beam from the light source device after modulating the intensity of the light beam based on pattern data to be drawn by each of the specific scanning units, and that alternately supplies the light beam to each of the specific scanning units in sequence.

Drawings

Fig. 1 is a diagram showing a schematic configuration of a device manufacturing system including an exposure apparatus for performing exposure processing on a substrate according to embodiment 1.

Fig. 2 is a view showing a support frame for supporting the drawing head and the rotary cylinder shown in fig. 1.

Fig. 3 is a diagram showing a structure of the drawing head of fig. 1.

Fig. 4 is a detailed configuration diagram of the light introducing optical system shown in fig. 3.

Fig. 5 is a diagram showing a drawing line obtained by scanning the spot light by each scanning unit shown in fig. 3.

Fig. 6 is a diagram showing a relationship between the polygon mirror of each scanning unit shown in fig. 3 and the scanning direction of the drawing line.

Fig. 7 is a view for explaining a rotation angle of the polygon mirror of which the reflection surface of the polygon mirror shown in fig. 3 can deflect (reflect) the laser light so as to be incident on the f- θ lens.

Fig. 8 is a view schematically illustrating optical paths between the light-introducing optical system shown in fig. 3 and a plurality of scanning units.

Fig. 9 is a diagram showing a configuration of a drawing head in a modification of embodiment 1.

Fig. 10 is a detailed structural view of the light introducing optical system shown in fig. 9.

Fig. 11 is a diagram showing a configuration of a drawing head according to embodiment 2.

Fig. 12 is a view showing the light-guiding optical system shown in fig. 11.

Fig. 13 is a view schematically illustrating optical paths between the light-guiding optical system shown in fig. 12 and a plurality of scanning units.

Fig. 14 is a block diagram showing an example of a control circuit for driving the rotation of each polygon mirror of the plurality of scanning units shown in fig. 13.

Fig. 15 is a timing chart showing an operation example of the control circuit shown in fig. 14.

Fig. 16 is a block diagram showing an example of a circuit for generating drawing bit (bit) string data to be supplied to the drawing optical element shown in fig. 11 to 13.

Fig. 17 is a diagram showing a configuration of a light source device according to a modification of embodiment 2.

Fig. 18 is a block diagram showing a configuration of a control unit for drawing control according to embodiment 3.

Fig. 19 is a timing chart showing signal states of respective portions and an oscillation state of laser light when the control unit of fig. 18 draws a pattern.

Fig. 20 is a timing chart showing clock signals for pulsed light oscillation generated by the control circuit of the light source device of fig. 17.

Fig. 21 is a timing chart for explaining a case where the clock signal of fig. 20 is corrected in order to correct the drawing magnification.

Fig. 22 is a diagram for explaining a method of correcting the drawing magnification for one drawing line (scanning line).

Fig. 23 is a diagram showing a schematic configuration of a device manufacturing system including an exposure apparatus for performing exposure processing on a substrate according to embodiment 4.

Fig. 24 is a detailed view of the rotary cylinder of fig. 23 with the base plate wound thereon.

Fig. 25 is a diagram showing a drawing line of spot light and an alignment mark formed on a substrate.

Fig. 26 is a structural diagram of a light beam switching member.

Fig. 27A is a view of optical path switching of the light beam by the optical element for selection as viewed from the + Z direction side, and fig. 27B is a view of optical path switching of the light beam by the optical element for selection as viewed from the-Y direction side.

Fig. 28 is a diagram showing an optical structure of the scanning unit.

Fig. 29 is a diagram showing a configuration of an origin sensor provided around the polygon mirror of fig. 28.

Fig. 30 is a timing chart showing a relationship between the generation timing of the origin signal and the drawing start timing.

Fig. 31 is a configuration diagram of a sub-origin generating circuit for generating a sub-origin signal in which the generation timing is delayed by a predetermined time by dividing the origin signal.

Fig. 32 is a timing chart showing a sub-origin signal generated by the sub-origin generating circuit of fig. 31.

Fig. 33 is a block diagram showing an electrical configuration of the exposure apparatus.

Fig. 34 is a timing chart showing the timings of outputting the origin signal, the sub-origin signal, and the serial data.

Fig. 35 is a diagram showing a configuration of the drawing data output control unit shown in fig. 33.

Fig. 36 is a structural diagram of a light flux switching member according to embodiment 5.

Fig. 37 is a diagram showing an optical path when the position of the arrangement switching member in fig. 36 is the 1 st position.

Fig. 38 is a diagram showing the configuration of a beam switching control unit according to embodiment 5.

Fig. 39 is a diagram showing a configuration of the logic circuit of fig. 38.

Fig. 40 is a timing chart for explaining the operation of the logic circuit of fig. 39.

Fig. 41 is a structural diagram of a light flux switching member according to embodiment 6.

Fig. 42 is a diagram showing a configuration in a case where the arrangement of the optical elements for selection (acousto-optic modulation elements) in embodiment 6 is rotated by 90 degrees.

Fig. 43 is a diagram showing the arrangement relationship between the substrate transfer mode and the drawing lines in modification 3.

Fig. 44 is a diagram showing a configuration of a driver circuit of the optical element for selection (acousto-optic modulation element) according to modification 5.

Fig. 45 is a diagram showing a modification of the driver circuit in fig. 44.

Detailed Description

Hereinafter, preferred embodiments of a pattern drawing device, a pattern drawing method, a light beam scanning device, a light beam scanning method, a device manufacturing method, and a laser light source device according to the embodiments of the present invention will be described in detail with reference to the drawings. The embodiments of the present invention are not limited to these embodiments, and include embodiments to which various changes and modifications are applied. That is, the following constituent elements include elements that can be easily conceived by those skilled in the art and substantially the same elements, and the following constituent elements can be appropriately combined. Various omissions, substitutions, and changes in the components can be made without departing from the spirit of the invention.

[ embodiment 1 ]

Fig. 1 is a diagram showing a schematic configuration of a device manufacturing system 10 including an exposure apparatus EX for performing an exposure process on a substrate (irradiation target) FS according to embodiment 1. In the following description, unless otherwise specified, an XYZ rectangular coordinate system in which the direction of gravity is the Z direction is set, and the X direction, the Y direction, and the Z direction are described in accordance with arrows shown in the drawings.

The device manufacturing system 10 is a manufacturing system in which a production line for manufacturing a flexible display, a flexible wiring, a flexible sensor, and the like, which are electronic devices, is built. Hereinafter, a flexible display will be described as an electronic device. As the flexible display, for example, an organic EL display, a liquid crystal display, and the like are available. The device manufacturing system 10 has a so-called Roll-To-Roll (Roll To Roll) structure in which a substrate FS in a flexible sheet form (sheet-like substrate) is fed from a supply Roll (not shown) around which the substrate FS is wound, various processes are continuously performed on the fed substrate FS, and thereafter, the substrate FS after the various processes is wound around a recovery Roll (not shown). The substrate FS has a belt-like shape in which the moving direction of the substrate FS is a long side direction (long side) and the width direction is a short side direction (short side). The substrate FS sent from the supply roller is subjected to various processes by the processing apparatus PR1, the exposure apparatus (pattern drawing apparatus, beam scanning apparatus) EX, and the processing apparatus PR2 in this order, and then wound up by the recovery roller.

The X direction is a direction (conveyance direction) from the processing apparatus PR1 to the processing apparatus PR2 via the exposure apparatus EX in the horizontal plane. The Y direction is a direction orthogonal to the X direction in the horizontal plane, and is a width direction (short side direction) of the substrate FS. The Z direction is a direction (upward direction) orthogonal to the X direction and the Y direction, and is parallel to the direction in which gravity acts.

For the substrate FS, for example, a resin film, a foil (foil) made of a metal such as stainless steel or an alloy, or the like is used. As the material of the resin film, for example, at least one or more of a polyethylene resin, a polypropylene resin, a polyester resin, an ethylene-vinyl alcohol copolymer resin, a polyvinyl chloride resin, a cellulose resin, a polyamide resin, a polyimide resin, a polycarbonate resin, a polystyrene resin, and a vinyl acetate resin can be used. The thickness and rigidity (young's modulus) of the substrate FS may be in such a range that no crease or irreversible wrinkle due to bending occurs in the substrate FS when the substrate FS passes through the transfer path of the exposure apparatus EX. Films of PET (polyethylene terephthalate), PEN (polyethylene naphthalate), and the like having a thickness of about 25 to 200 μm are typical of preferable sheet-like substrates as the base material of the substrate FS.

The substrate FS is preferably selected from a material having a significantly large thermal expansion coefficient because the substrate FS may be heated in each process performed by the processing apparatus PR1, the exposure apparatus EX, and the processing apparatus PR 2. For example, the coefficient of thermal expansion can be suppressed by mixing an inorganic filler in a resin film. The inorganic filler may be, for example, titanium oxide, zinc oxide, aluminum oxide, silicon oxide, or the like. The substrate FS may be a single layer of an extra thin glass having a thickness of about 100 μm manufactured by a float method or the like, or may be a laminate in which the above resin film, foil, or the like is bonded to the extra thin glass.

The flexibility (flexibility) of the substrate FS means a property that the substrate FS can be flexed without being sheared or broken even if a force of a self weight is applied to the substrate FS. In addition, flexibility is also included in the property of bending by a force of the degree of its own weight. The degree of flexibility varies depending on the material, size, and thickness of the substrate FS, the layer structure formed on the substrate FS, and the environment such as temperature and humidity. In either case, the substrate FS can be said to be in the flexible range as long as it is smoothly conveyed without buckling and causing a crease or a damage (a crack or a crack) when the substrate FS is accurately wound around a conveying direction switching member such as various conveying rollers and rotary drums provided on a conveying path in the device manufacturing system 10 according to embodiment 1.

The processing apparatus PR1 performs the pre-process on the substrate FS to be exposed by the exposure apparatus EX. The processing apparatus PR1 conveys the substrate FS subjected to the previous process to the exposure apparatus EX. By the processing in the preceding step, the substrate FS conveyed to the exposure apparatus EX becomes a substrate (photosensitive substrate) having a photosensitive functional layer (photosensitive layer ) formed on the surface thereof.

The photosensitive functional layer is applied as a solution onto the substrate FS and dried to form a layer (film). The photosensitive functional layer is typically a photoresist (liquid or dry film), but as a material which does not require development treatment, there are a photosensitive silane coupling agent (SAM) in which lyophobicity of a portion irradiated with ultraviolet rays is modified, a photosensitive reducing agent in which a plating reducing group is developed on a portion irradiated with ultraviolet rays, and the like. When a photosensitive silane coupling agent is used as the photosensitive functional layer, the pattern portion exposed to ultraviolet light on the substrate FS is modified from lyophobic to lyophilic. Therefore, by selectively applying a conductive ink (ink containing conductive nanoparticles of silver, copper, or the like) or a liquid containing a semiconductor material or the like to the portion having lyophilic properties, a pattern layer which constitutes an electrode of a Thin Film Transistor (TFT) or the like, a semiconductor, an insulating layer, or a wiring or an electrode for connection can be formed. When a photosensitive reducing agent is used as the photosensitive functional layer, a plating reducing group appears on a pattern portion exposed to ultraviolet light on the substrate. Therefore, immediately after the exposure, the substrate FS is immersed in a plating solution containing palladium ions or the like for a certain period of time, whereby a pattern layer based on palladium is formed (deposited). Such plating treatment is an additive (additive) process, but in addition to this, when an etching process as a subtractive (subtractive) process is assumed, the base material of the substrate FS transported to the exposure apparatus EX may be PET or PEN, and a metallic thin film of aluminum (Al), copper (Cu), or the like may be selectively or entirely deposited on the surface thereof, and a photoresist layer may be further deposited thereon.

In embodiment 1, the exposure apparatus EX is an exposure apparatus of a direct writing system, i.e., an exposure apparatus of a so-called raster scan (raster scan) system, which does not use a mask. The exposure apparatus EX irradiates an irradiated surface (photosensitive surface) of the substrate FS supplied from the processing apparatus PR1 with a light pattern corresponding to a predetermined pattern for electronic devices, circuits, wirings, and the like for display. Although described in detail later, the exposure apparatus EX one-dimensionally scans a spot light SP of an exposure beam (laser light, irradiation light) LB On a substrate FS (On an irradiated surface of the substrate FS) in a predetermined scanning direction (Y direction) while conveying the substrate FS in the + X direction (sub-scanning direction), and modulates the intensity of the spot light SP at high speed based On pattern data (drawing data and drawing information). As a result, a light pattern corresponding to a predetermined pattern of an electronic device, a circuit, a wiring, or the like is drawn and exposed on the surface (light-receiving surface) of the substrate FS, which is the surface to be irradiated. That is, the sub-scanning of the substrate FS and the main scanning of the spot light SP cause the spot light SP to relatively perform two-dimensional scanning on the irradiated surface of the substrate FS, thereby drawing and exposing a predetermined pattern on the substrate FS. Since the substrate FS is conveyed along the conveyance direction (+ X direction), a plurality of exposure areas W, on which patterns are exposed by the exposure apparatus EX, are provided at predetermined intervals along the longitudinal direction of the substrate FS (see fig. 5). Since an electronic device is formed in this exposure region W, the exposure region W is also an electronic device formation region. Further, since the electronic device is configured by stacking a plurality of pattern layers (layers having patterns formed thereon), patterns corresponding to the respective layers may be exposed by the exposure apparatus EX.

The processing apparatus PR2 performs a subsequent process (for example, plating, development, etching, or the like) on the substrate FS subjected to the exposure process by the exposure apparatus EX. By the subsequent process, a device pattern layer is formed on the substrate FS.

As described above, since the electronic device is configured by stacking a plurality of pattern layers, one pattern layer is generated through at least each process of the device manufacturing system 10. Therefore, in order to produce an electronic device, each process of the device manufacturing system 10 as shown in fig. 1 must be performed at least twice. Therefore, the recovery roll wound with the substrate FS is mounted to the other device manufacturing system 10 as a supply roll, and the pattern layers can be stacked. By repeating such operations, an electronic device is formed. Therefore, the processed substrate FS is in a state where a plurality of electronic components (exposure areas W) are connected at predetermined intervals along the longitudinal direction of the substrate FS. That is, the substrate FS is a substrate for simultaneous processing of a plurality of substrates.

The recovery roller that recovers the substrate FS formed in a state where the electronic components are connected may be attached to a cutting device not shown. The dicing apparatus having the recovery roller mounted thereon divides (cuts) the processed substrate FS into a plurality of electronic components (electronic component forming regions W) for each electronic component. The dimension of the substrate FS is, for example, about 10cm to 2m in the width direction (the direction of the short side) and 10m or more in the length direction (the direction of the long side). The size of the substrate FS is not limited to the above size.

Next, the exposure apparatus EX will be described in detail. The exposure apparatus EX is housed in a temperature-controlled chamber ECV. The temperature control chamber ECV maintains the inside at a predetermined temperature, thereby suppressing a change in shape of the substrate FS conveyed therein due to the temperature. The temperature-control chamber ECV is disposed on the installation surface E of the production plant via passive or active vibration-proof units SU1 and SU 2. The vibration isolation units SU1 and SU2 reduce vibration from the installation surface E. The installation surface E may be a floor surface of a factory, or may be a surface installed on an installation table (pedestal) on the floor surface to form a horizontal surface. The exposure apparatus EX includes a substrate conveyance mechanism 12, a light source device (pulse light source device, laser light source device) 14, a drawing head 16, and a control device 18.

The substrate transfer mechanism 12 transfers the substrate FS transferred from the processing apparatus PR1 at a predetermined speed in the exposure apparatus EX, and then, transfers the substrate FS at a predetermined speed to the processing apparatus PR 2. The substrate conveyance mechanism 12 defines a conveyance path of the substrate FS conveyed in the exposure apparatus EX. The substrate conveyance mechanism 12 includes an edge position controller EPC, a drive roller R1, a dancer roller RT1, a rotary drum (cylindrical drum) DR, a dancer roller RT2, a drive roller R2, and a drive roller R3 in this order from the upstream side (the-X direction side) in the conveyance direction of the substrate FS.

The edge position controller EPC adjusts the position of the substrate FS transferred from the processing apparatus PR1 in the width direction (Y direction, short side direction of the substrate FS). That is, the edge position controller EPC moves the substrate FS in the width direction so as to make the position at the end (edge) in the width direction of the substrate FS, which is conveyed in a state where a predetermined tension is applied, converge within a range (allowable range) of about ± ten μm to several tens μm with respect to the target position, thereby adjusting the position in the width direction of the substrate FS. The edge position controller EPC includes a roller on which the substrate FS is hung, and an edge sensor (edge detection unit), not shown, that detects the position of an edge (edge) of the substrate FS in the width direction, and adjusts the position of the substrate FS in the width direction by moving the roller of the edge position controller EPC in the Y direction based on a detection signal detected by the edge sensor. The driving rollers R1 rotate while holding both front and back surfaces of the substrate FS conveyed from the edge position controller EPC, and convey the substrate FS toward the rotary drum DR. The edge position controller EPC may also appropriately adjust the position of the substrate FS in the width direction so that the longitudinal direction of the substrate FS wound around the rotary drum DR is always orthogonal to the central axis (rotation axis) AXo of the rotary drum DR, and may appropriately adjust the parallelism between the rotation axis of the roller of the edge position controller EPC and the Y axis so that the tilt error in the traveling direction of the substrate FS is corrected.

The rotary drum DR has a center axis AXo extending in the Y direction and extending in a direction intersecting the direction of action of gravity, and a cylindrical outer peripheral surface having a constant radius from the center axis AXo, and rotates about the center axis AXo while supporting a part of the substrate FS in the longitudinal direction along the outer peripheral surface (circumferential surface) to convey the substrate FS in the + X direction. The rotary drum DR supports, on its circumferential surface, an exposure area (portion) on the substrate FS on which the light beam LB (spot light SP) from the drawing head 16 is projected. On both sides of the rotary drum DR in the Y direction, shafts Sft supported by annular bearings so as to rotate the rotary drum DR about the central shaft AXo are provided. The shaft Sft is rotated around the center axis AXo by torque applied thereto from a not-shown rotation drive source (for example, a motor, a speed reduction mechanism, or the like) controlled by the control device 18. For convenience of description, a plane including the central axis AXo and parallel to the YZ plane is referred to as a central plane Poc.

The driving rollers R2 and R3 are disposed at a predetermined interval along the conveyance direction (+ X direction) of the substrate FS, and apply a predetermined slack (play) to the exposed substrate FS. The driving rollers R2 and R3 rotate while holding both front and back surfaces of the substrate FS, similarly to the driving roller R1, and convey the substrate FS toward the processing apparatus PR 2. The driving rollers R2 and R3 are provided on the downstream side (+ X direction side) in the conveyance direction with respect to the rotary drum DR, and the driving roller R2 is provided on the upstream side (-X direction side) in the conveyance direction with respect to the driving roller R3. The tension adjusting rollers RT1 and RT2 are biased in the-Z direction, and apply a predetermined tension to the substrate FS wound around the rotary drum DR and supported in the longitudinal direction. This stabilizes the longitudinal tension applied to the substrate FS hung on the rotary drum DR within a predetermined range. The controller 18 controls a rotation driving source (not shown) (for example, a motor, a speed reducer, or the like) to rotate the driving rollers R1 to R3.

The light source device 14 has a light source (pulse light source) and emits a pulse-shaped light beam (pulse light, laser light) LB. The light beam LB is ultraviolet light having a peak wavelength in a wavelength band of 370nm or less, and the oscillation frequency (light emission frequency) of the light beam LB is Fs. The light beam LB emitted from the light source device 14 is incident on the drawing head 16. The light source device 14 emits the light beam LB at the emission frequency Fs and emits it, in accordance with the control of the control device 18. The configuration of the light source device 14 will be described in detail later, but a fiber amplifier laser light source that obtains a pulsed light of high-brightness ultraviolet rays having an oscillation frequency Fs of several hundreds MHz and an emission time of one pulsed light of picoseconds may be used, the fiber amplifier laser light source being configured by a semiconductor laser element that generates a pulsed light of an infrared wavelength band, a fiber amplifier, a wavelength conversion element (harmonic generation element) that converts the amplified pulsed light of an infrared wavelength band into a pulsed light of an ultraviolet wavelength band, and the like.

The drawing head 16 includes a plurality of scanning units Un (U1 to U6) on which the light beam LB is incident. The drawing head 16 draws a predetermined pattern on a part of the substrate FS supported by the circumferential surface of the rotary drum DR of the substrate conveyance mechanism 12 by a plurality of scanning units (drawing units) U1 to U6. The drawing head 16 is a so-called multi-beam type drawing head 16 in which a plurality of scanning units U1 to U6 having the same configuration are arranged. Since the drawing head 16 repeatedly performs pattern exposure for electronic components on the substrate FS, a plurality of exposure regions (electronic component forming regions) W of the exposed pattern are provided at predetermined intervals along the longitudinal direction of the substrate FS (see fig. 5). The controller 18 controls each part of the exposure apparatus EX to cause each part to execute processing. The control device 18 includes a computer that functions as the control device 18 according to embodiment 1 by executing a program stored in a storage medium, and the storage medium storing the program.

Fig. 2 is a diagram showing a plurality of scanning units (drawing units) Un supporting the drawing head 16 and a support frame (apparatus column) 30 for the rotary drum DR. The support frame 30 includes a body frame 32, a three-point support 34, and a drawing head support 36. The support frame 30 is housed in the tempering chamber ECV. The main body frame 32 rotatably supports the rotary drum DR, the dancer roller RT1 (not shown), and the RT2 via an annular bearing. The three-point support 34 is provided at the upper end of the body frame 32, and supports a drawing head support 36 provided above the rotary cylinder DR at three points.

The drawing head support 36 supports the scanning units Un (U1 to U6) of the drawing head 16. The drawing head support 36 supports the scanner units U1, U3, and U5 (see fig. 1) at the downstream side in the conveyance direction (+ X direction side) with respect to the center axis AXo of the rotary drum DR and aligned in the width direction of the substrate FS. The drawing head support 36 supports the scanner units U2, U4, and U6 (see fig. 1) at the upstream side (the "X direction side") in the conveyance direction with respect to the central axis AXo and aligned in the width direction (Y direction) of the substrate FS. Here, if the scanning width in the Y direction (scanning range of the spot light SP, drawing line SLn) realized by one scanning unit Un is about 20 to 50mm as an example, the total of six scanning units Un including the odd-numbered three scanning units U1, U3, and U5 and the even-numbered three scanning units U2, U4, and U6 is arranged in the Y direction, and the width in the Y direction that can be drawn can be increased to about 120 to 300 mm.

Fig. 3 is a diagram showing the structure of the drawing head 16. In embodiment 1, the exposure apparatus EX includes two light source devices 14(14a and 14 b). The drawing head 16 includes a plurality of scanning units U1 to U6, a light introduction optical system (light beam switching means) 40a for guiding the light beam LB from the light source device 14a to the plurality of scanning units U1, U3, and U5, and a light introduction optical system (light beam switching means) 40b for guiding the light beam LB from the light source device 14b to the plurality of scanning units U2, U4, and U6.

First, the light introduction optical system (light flux switching member) 40a will be described with reference to fig. 4. Since the light introducing optical systems 40a and 40b have the same configuration, the light introducing optical system 40a will be described here, and the description of the light introducing optical system 40b will be omitted.

The light introducing optical system 40a includes, from the light source device 14(14a) side, a condenser lens 42, a collimator lens 44, a mirror 46, a condenser lens 48, an optical element 50 for selection, a mirror 52, a collimator lens 54, a condenser lens 56, an optical element 58 for selection, a mirror 60, a collimator lens 62, a condenser lens 64, an optical element 66 for selection, a mirror 68, and an absorber 70.

The condenser lens 42 and the collimator lens 44 are used to magnify the light beam LB emitted from the light source device 14 a. Specifically, the condenser lens 42 converges the light beam LB at a focal position on the rear side of the condenser lens 42, and the collimator lens 44 makes the light beam LB converged and diverged by the condenser lens 42 into parallel light having a predetermined beam diameter (for example, several mm).

The mirror 46 reflects the light beam LB collimated by the collimator lens 44 and irradiates the light beam LB to the selective optical element 50. The condenser lens 48 condenses (converges) the light beam LB incident on the selection optical element 50 so as to form a beam waist in the selection optical element 50. The optical element 50 for selection has transmissivity with respect to the light beam LB, and for example, an Acousto-Optic Modulator (AOM) is used. When an ultrasonic signal (high-frequency signal) is applied to the AOM, first-order diffracted light is generated as an outgoing beam, the first-order diffracted light being diffracted by an incident beam LB (zero-order light) at a diffraction angle corresponding to a high-frequency (beam LBn). In embodiment 1, the light beam LBn emitted from each of the plurality of selective optical elements 50, 58, and 66 as primary diffracted light and incident on the corresponding scanning units U1, U3, and U5 is represented by LB1, LB3, and LB5, and each of the selective optical elements 50, 58, and 66 is treated as an element functioning to deflect the optical path of the light beam LB from the light source device 14(14 a). The structures, functions, actions, etc. of the respective optical elements 50, 58, 66 for selection may be identical to each other. The selection optical elements 50, 58, and 66 generate On/Off of diffracted light that diffracts the incident light beam LB in accordance with On/Off of a drive signal (high-frequency signal) from the control device 18.

More specifically, when the drive signal (high-frequency signal) from the control device 18 is Off, the selection optical element 50 irradiates the incident light beam LB to the selection optical element 58 of the next stage. On the other hand, when the drive signal (high-frequency signal) from the controller 18 is On, the selection optical element 50 diffracts the incident light beam LB and irradiates the mirror 52 with the light beam LB1, which is the first-order diffracted light. The mirror 52 reflects the incident light beam LB1 and irradiates the collimated lens 100 of the scanning unit U1. That is, the control device 18 switches (drives) the optical element 50 for selection to On/Off, and the optical element 50 for selection switches whether or not the light beam LB1 is incident On the scanning unit U1.

Between the selection optical element 50 and the selection optical element 58, a collimator lens 54 that returns the light beam LB irradiated to the selection optical element 58 to a parallel beam and a condenser lens 56 that condenses (converges) the light beam LB that has been made into a parallel beam by the collimator lens 54 again so as to form a beam waist in the selection optical element 58 are provided in this order.

The optical selection element 58 has transmissivity with respect to the light beam LB, and is, for example, an acousto-optic modulator (AOM) as in the optical selection element 50. The selection optical element 58 transmits the incident light beam LB directly to the selection optical element 66 when the drive signal (high-frequency signal) sent thereto from the control device 18 is Off, and diffracts the incident light beam LB to send the light beam LB3 as the first-order diffracted light to the mirror 60 when the drive signal (high-frequency signal) sent thereto from the control device 18 is On. The mirror 60 reflects the incident light beam LB3 and irradiates the collimated lens 100 of the scanning unit U3. That is, the control device 18 switches the selection optical element 58 to On/Off, and the selection optical element 58 switches whether or not the light beam LB3 is incident On the scanning unit U3.

Between the selection optical element 58 and the selection optical element 66, a collimator lens 62 that returns the light beam LB irradiated to the selection optical element 66 to a parallel beam and a condenser lens 64 that condenses (converges) the light beam LB that has been made into a parallel beam by the collimator lens 62 again so as to form a beam waist in the selection optical element 66 are provided in this order.

The optical selection element 66 has transmissivity with respect to the light beam LB, and for example, uses an acousto-optic modulator (AOM) as in the optical selection element 50. The optical element 66 for selection irradiates the incident light beam LB toward the absorber 70 when the drive signal (high frequency signal) from the controller 18 is in the Off state, and diffracts the incident light beam LB and irradiates the light beam LB5, which is the first-order diffracted light, toward the mirror 68 when the drive signal (high frequency signal) from the controller 18 is in the On state. The mirror 68 reflects the incident light beam LB5 and irradiates the collimated lens 100 of the scanning unit U5. That is, the controller 18 switches the selection optical element 66 to On/Off, and the selection optical element 66 switches whether or not the light beam LB5 is incident On the scanner unit U5. The absorber 70 is a light absorber (light trap) for suppressing the leakage of the light beam LB to the outside and absorbing the light beam LB.

To briefly explain the light introduction optical system 40b, the selection optical elements 50, 58, and 66 of the light introduction optical system 40b switch whether or not the light beam LB enters the scanning units U2, U4, and U6. In this case, the mirrors 52, 60, and 68 of the light guide optical system 40b reflect the light beams LB2, LB4, and LB6 emitted from the optical elements 50, 58, and 66 for selection, and irradiate the light beams onto the collimator lenses 100 of the scanning units U2, U4, and U6.

In addition, since the efficiency of generating the first order diffracted light of the actual acousto-optic modulation element (AOM) is about 80% of the zero order light, the intensities of the light beams LB1(LB2), LB3(LB4), and LB5(LB6) deflected by the selective optical elements 50, 58, and 66 are lower than the original light beam LB. When any of the optical elements 50, 58, and 66 for selection is in the On state, approximately 20% of the zero-order light that travels straight without being diffracted remains, but is finally absorbed by the absorber 70.

Next, a plurality of scan cells Un (U1 to U6) shown in fig. 3 will be described. The scanning unit Un projects the light flux LBn from the light source device 14(14a, 14b) so as to converge to the spot light SP on the irradiated surface of the substrate FS, and the spot light SP is one-dimensionally scanned along a predetermined linear drawing line (scanning line) SLn on the irradiated surface of the substrate FS by the rotating polygon mirror PM. The drawing line SLn of the scan cell U1 is denoted by SL1, and similarly, the drawing lines SLn of the scan cells U2 to U6 are denoted by SL2 to SL 6.

Fig. 5 is a diagram showing drawing lines SLn (SL1 to SL6) on which the spot light SP is scanned by the scanning units Un (U1 to U6). As shown in fig. 5, the scanning area is divided by the scanning units Un (U1 to U6) such that the entire width direction of the exposure area W is covered by all of the scanning units Un (U1 to U6). Thus, each of the scanning units Un (U1 to U6) can draw a pattern for each of a plurality of regions divided in the width direction of the substrate FS. The lengths of the drawing lines SLn (SL1 to SL6) are basically the same. That is, the scanning distances of the spot light SP of the light beam LBn scanned along the scanning lines SL1 to SL6 are the same in principle. In addition, when the width of the exposure field W is to be increased, the length of the scanning line SLn itself can be increased, or the number of scanning units Un provided in the Y direction can be increased.

Each of the drawing lines SLn (SL1 to SL6) is set to be slightly shorter than the maximum length that the spot light SP can actually scan on the irradiation surface. For example, assuming that the maximum length of the drawing line SLn on which a pattern can be drawn is 30mm when the drawing magnification in the main scanning direction (Y direction) is an initial value (no magnification correction), the maximum scanning length of the spot light SP on the irradiated surface is set to be about 31mm by providing the drawing line SLn with a margin of about 0.5mm on the scanning start point side and the scanning end point side, respectively. By setting in this manner, the position of the drawing line SLn of 30mm in the main scanning direction can be finely adjusted or the drawing magnification can be finely adjusted within the range of the maximum scanning length 31mm of the spot light SP. The maximum scanning length of the spot light SP is not limited to 31mm, and is determined mainly by the aperture of an f θ lens FT (see fig. 3) provided behind a polygon mirror (rotary polygon mirror) PM in the scanning unit Un, and may be 31mm or more.

The plurality of scanning lines (scanning lines) SL1 to SL6 are arranged in two rows in the circumferential direction of the rotary drum DR with the center plane Poc interposed therebetween. The drawing lines SL1, SL3, and SL5 are located on the substrate FS on the downstream side in the conveyance direction (+ X direction side) with respect to the center plane Poc. The drawing lines SL2, SL4, and SL6 are located on the substrate FS on the upstream side in the conveyance direction (on the (-X direction side) with respect to the center plane Poc. The drawing lines SLn (SL1 to SL6) are substantially parallel to each other along the width direction of the substrate FS, that is, the central axis AXo of the rotary drum DR, and are shorter than the width direction length of the substrate FS.

The drawing lines SL1, SL3, and SL5 are disposed at predetermined intervals along the width direction (scanning direction, Y direction) of the substrate FS, and similarly, the drawing lines SL2, SL4, and SL6 are disposed at predetermined intervals along the width direction (scanning direction, Y direction) of the substrate FS. At this time, the drawing line SL2 is disposed between the drawing line SL1 and the drawing line SL3 in the width direction of the substrate FS. Similarly, the drawing line SL3 is disposed between the drawing line SL2 and the drawing line SL4 in the width direction of the substrate FS. The drawing line SL4 is disposed between the drawing line SL3 and the drawing line SL5 in the width direction of the substrate FS. The drawing line SL5 is disposed between the drawing line SL4 and the drawing line SL6 in the width direction of the substrate FS. That is, the drawing lines SL1 to SL6 are arranged to cover the entire width direction of the exposure field W drawn on the substrate FS.

The scanning directions of the spot lights SP of the light beam LBn (LB1, LB3, LB5) scanned along the odd-numbered drawing lines SL1, SL3, SL5 are one-dimensional directions and are the same direction. The scanning directions of the spot lights SP of the light beam LBn (LB2, LB4, LB6) scanned along each of the even-numbered drawing lines SL2, SL4, and SL6 are one-dimensional directions and are the same direction. The scanning direction of the light beam LBn (spot light SP) that scans along the scanning lines SL1, SL3, and SL5 and the scanning direction of the light beam LBn (spot light SP) that scans along the scanning lines SL2, SL4, and SL6 are opposite to each other. Specifically, the scanning direction of the light beam LBn (spot light SP) that scans along the scanning lines SL2, SL4, and SL6 is the + Y direction, and the scanning direction of the light beam LBn (spot light SP) that scans along the scanning lines SL1, SL3, and SL5 is the-Y direction. This is caused by using the polygon mirror PM rotating in the same direction as the polygon mirrors PM of the scanning units U1 to U6. Thus, the drawing start positions (positions of the drawing start points (scanning start points)) of the drawing lines SL1, SL3, and SL5 are adjacent to (or partially overlap with) the drawing start positions of the drawing lines SL2, SL4, and SL6 in the Y direction. The drawing end positions (positions of the drawing end points (scanning end points)) of the drawing lines SL3 and SL5 are adjacent to (or partially overlap with) the drawing end positions of the drawing lines SL2 and SL4 in the Y direction. When each of the drawing lines SLn is disposed so that a part of each of the end portions of the drawing lines SLn adjacent to each other in the Y direction overlaps, for example, the drawing lines SLn may overlap in the Y direction in a range of several% or less including the drawing start position or the drawing end position with respect to the length of each of the drawing lines SLn.

The width of the scanning line SLn in the sub-scanning direction is equal to the size (diameter) of the spot light SP

The corresponding size. For example, the size of the spot light SP

In the case of 3 μm, the width of the scanning line SLn in the sub-scanning direction is also 3 μm. The spot light SP may be overlapped (over lap) by a predetermined length (for example, the size of the spot light SP)

Half of) along the delineation line SLn. In addition, even when the drawing lines SLn (for example, the drawing line SL1 and the drawing line SL2) adjacent to each other in the Y direction are adjacent to each other (in a case where they are connected to each other), a predetermined length (for example, the size of the spot light SP) may be overlapped with each other

Half of that) is used.

In the case of embodiment 1, since the light beam LB from the light source device 14 is a pulsed light, the spot light SP projected on the drawing line SLn during the main scanning is dispersed according to the oscillation frequency Fs of the light beam LB. Therefore, it is necessary to make the point light SP projected by one pulse light of the light beam LB and the point light SP projected by the next pulse light mainOverlapping in the scan direction. The overlapping amount is based on the size of the spot light SP

The scanning speed Vs of the spot light SP and the oscillation frequency Fs of the light beam LB are set, but when the intensity distribution of the spot light SP is approximately gaussian, the intensity distribution of the spot light SP may be 1/e of the peak intensity of the spot light SP ²(or 1/2) determining effective diameter size

To be overlapped with

The method is suitable for the left and the right. Therefore, it is desirable that the substrate FS is set to move the effective size of the spot light SP between one scan and the next scan of the spot light SP along the scanning line SLn in the sub-scanning direction (the direction orthogonal to the scanning line SLn)

Approximately 1/2 or less. The setting of the exposure amount to the photosensitive functional layer on the substrate FS can be realized by adjusting the peak value of the beam LB (pulsed light), but when the exposure amount is to be increased without increasing the intensity of the beam LB, the overlap amount of the spot light SP in the main scanning direction or the sub-scanning direction is increased to an effective size by one of a decrease in the scanning speed Vs in the main scanning direction of the spot light SP, an increase in the oscillation frequency FS of the beam LB, a decrease in the conveyance speed in the sub-scanning direction of the substrate FS, and the like

Above 1/2.

Next, the structure of the scanning unit Un shown in fig. 3 will be explained. Since the scan cells U1 to U6 have the same structure, only the scan cell U1 will be described here. The scanning unit U1 includes a collimator lens 100, a mirror 102, a condenser lens 104, a drawing optical element 106, a collimator lens 108, a mirror 110, a cylindrical lens CYa, a mirror 114, a polygon mirror (light scanning means, deflecting means) PM, an f θ lens FT, a cylindrical lens CYb, and a mirror 122, which are provided behind the mirror 52 shown in fig. 4. The collimator lenses 100, 108, the mirrors 102, 110, 114, 122, the condenser lens 104, the cylindrical lenses CYa, CYb, and the f θ lens FT constitute an optical lens system.

In fig. 3, the mirror 102 reflects the light beam LB1 incident from the collimator lens 100 in the-Z direction and enters the drawing optical element 106 as a drawing light modulator. The condenser lens 104 condenses (converges) the light beam LB1 (parallel light beam) incident on the drawing optical element 106 so as to form a beam waist in the drawing optical element 106. The rendering optical element 106 is transmissive with respect to the light beam LB1, for example, using an acousto-optic modulating element (AOM). The drawing optical element 106 irradiates the incident light beam LB1 to a shield plate or an absorber (not shown) when the drive signal (high frequency signal) from the controller 18 is Off, and diffracts the incident light beam LB1 and irradiates the first-order diffracted light (drawing light beam, that is, the light beam LB1 intensity-modulated according to pattern data) to the mirror 110 when the drive signal (high frequency signal) from the controller 18 is On. The shielding plate and the absorber are used to prevent the light beam LB1 from leaking to the outside.

A collimator lens 108 for collimating the light beam LB1 incident on the mirror 110 is provided between the mirror 110 and the drawing optical element 106. The mirror 110 reflects the incident light beam LB1 in the-X direction toward the mirror 114, and the mirror 114 reflects the incident light beam LB1 toward the polygon mirror PM. The polygon mirror (rotary polygon mirror) PM reflects the incident light beam LB1 toward the f θ lens FT having an optical axis parallel to the X axis along the-X direction side. The polygon mirror PM deflects (reflects) the incident light beam LB1 in a plane parallel to the XY plane in order to scan the spot light SP of the light beam LB1 on the irradiated surface of the substrate FS. Specifically, the polygon mirror PM has a rotation axis AXp extending in the Z direction, and a plurality of reflection surfaces RP (eight reflection surfaces RP in the present embodiment 1) formed around the rotation axis AXp. By rotating the polygon mirror PM in a predetermined rotational direction about the rotational axis AXp, the reflection angle of the pulse-shaped luminous flux LB1 irradiated on the reflection surface RP can be continuously changed. Thus, the spot beam SP of the beam LB1 irradiated on the irradiated surface of the substrate FS can be scanned in the scanning direction (the width direction of the substrate FS, the Y direction) by deflecting the reflection direction of the beam LB1 by the one reflection surface RP. That is, the polygon mirror PM deflects the incident light beam LB1, and causes the spot light SP to scan along the scanning line (scanning line) SL1 shown in fig. 5. The polygon mirror PM is rotated at a constant speed by a rotation drive source (not shown) (for example, a motor, a reduction mechanism, or the like). The rotary drive source is controlled by a control device 18.

Since the spot light SP of the light beam LB1 can be scanned along the scanning line SL1 by the one reflection surface RP of the polygon mirror PM, the number of the scanning lines SL1 scanned on the irradiated surface of the substrate FS by the spot light SP is eight at most as many as the reflection surface RP in one rotation of the polygon mirror PM. As described above, the effective length (for example, 30mm) of the drawing line SL1 is set to a length equal to or less than the maximum scanning length (for example, 31mm) by which the spot light SP can be scanned by the polygon mirror PM, and the center point of the drawing line SL1 is set at the center of the maximum scanning length in the initial setting (in design).

In addition, as an example, the effective length of the drawing line SL1 is set to 30mm, and the effective size is set

When the 3 μm spot light SP is irradiated onto the irradiated surface of the substrate FS along the scanning line SL1 while overlapping 1.5 μm spot light SP, the number of spot light SP irradiated in one scan (the number of pulses of the light beam LB from the light source device 14) is 20000(30mm/1.5 μm). When the scanning time of the spot light SP along the scanning line SL1 is set to 200 μ sec, 20000 times of pulse-shaped spot light SP must be irradiated during this period, and therefore the emission frequency Fs of the light source device 14 is set to Fs ≧ 20000 times/200 μ sec, which is 100 MHz.

Returning to the description of the configuration of the scanning unit U1, the cylindrical lens CYa provided between the mirror 110 and the mirror 114 converges (converges) the light beam LB1 on the reflection surface RP of the polygon mirror PM into an oblong shape (slit shape) extending in a direction parallel to the XY plane in the Z direction (non-scanning direction) orthogonal to the scanning direction. With this cylindrical lens CYa, even when the reflection surface RP is inclined with respect to the Z direction (Z axis) (when there is a plane tilt error), the influence thereof can be suppressed, and the irradiation position of the spot beam by the beam LB1 irradiated onto the substrate FS can be suppressed from being shifted in the conveyance direction (X direction) of the substrate FS.

The light beam LB1 reflected by the polygon mirror PM is irradiated to an f θ lens FT including a condenser lens. The f θ lens FT having an optical axis extending in the X axis direction is a telecentric scanning lens that projects the light beam LB1 reflected by the polygon mirror PM toward the reflecting mirror 122 in a plane parallel to the XY plane so as to be parallel to the X axis. The incident angle θ of the light beam LB1 to the f θ lens FT varies according to the rotation angle (θ/2) of the polygon mirror PM. The f θ lens FT projects the light beam LB1 to an image height position on the irradiated surface of the substrate FS in proportion to the incident angle θ. When the focal length is fo and the image height position is y, the f θ lens FT has a relationship of y being fo · θ. Therefore, the f θ lens FT can scan the light beam LB1 (spot light SP) accurately and at a constant speed in the Y direction. When the incident angle to the f θ lens FT is 0 degrees, the light beam LB1 incident on the f θ lens FT travels along the optical axis of the f θ lens FT.

The light beam LB1 irradiated from the f θ lens FT is irradiated as a spot light SP on the substrate FS via the mirror 122. The cylindrical lens CYb provided between the f θ lens FT and the mirror 122 makes the spot light SP of the light beam LB1 focused on the substrate FS into a minute circle having a diameter of about several μm (for example, 3 μm), and a generatrix thereof is parallel to the Y direction. Thus, a trace line SL1 extending in the Y direction by the spot light (scanning spot) SP is defined on the substrate FS (see fig. 5). In the case where the cylindrical lens CYb is not provided, the spot light SP condensed on the substrate FS becomes an oblong shape extending in a direction (X direction) orthogonal to the scanning direction (Y direction) by the action of the near-front cylindrical lens CYa of the polygon mirror PM.

In this manner, in a state where the substrate FS is conveyed in the X direction, the spot light SP of the beam LB is scanned in the scanning direction (Y direction) by the scanning units U1 to U6, whereby a predetermined pattern is drawn on the substrate FS. The scanning units U1 to U6 are disposed on the head support 36 so as to scan different regions on the substrate FS. When the size (length of a scanning line) of the spot light SP in the scanning direction on the substrate FS is Ds and the scanning speed (speed of relative scanning) of the spot light SP on the substrate FS is Vs, the oscillation frequency Fs of the beam LB needs to satisfy the relationship of Fs ≧ Vs/Ds. This is because, since the beam LB is pulsed light, if the oscillation frequency Fs does not satisfy the relationship of Fs ≧ Vs/Ds, the spot light SP of the beam LB is irradiated onto the substrate FS with a predetermined interval (gap). When the oscillation frequency Fs satisfies the relationship of Fs ≧ Vs/Ds, the spot light SP can be irradiated onto the substrate FS so as to overlap each other in the scanning direction, and therefore, even with the pulsed oscillation beam LB, a linear pattern which is substantially continuous in the scanning direction can be favorably drawn on the substrate FS. Further, the faster the rotational speed of the polygon mirror PM becomes, the faster the scanning speed Vs of the spot light SP becomes.

Fig. 6 is a diagram showing the relationship between the polygon mirror PM of each of the scanning units U1 to U6 and the scanning directions of the plurality of scanning lines SLn (SL1 to SL 6). The plurality of scanning units U1, U3, and U5 and the reflection mirror 114, the polygon mirror PM, and the f θ lens FT in the plurality of scanning units U2, U4, and U6 are configured to be symmetrical with respect to the center plane Poc. Therefore, by rotating the polygon mirror PM of each of the scanning units U1 to U6 in the same direction (leftward), each of the scanning units U1, U3, and U5 scans the spot light SP of the light beam LB in the-Y direction from the drawing start position toward the drawing end position, and each of the scanning units U2, U4, and U6 scans the spot light SP of the light beam LB in the + Y direction from the drawing start position toward the drawing end position. Further, the scanning directions of the spot lights SP of the light beams LB of the scanning units U1 to U6 may be adjusted to the same direction (+ Y direction or-Y direction) by setting the rotation direction of the polygon mirror PM of the scanning units U2, U4, and U6 to be opposite to the rotation direction of the polygon mirror PM of the scanning units U1, U3, and U5.

Here, since the polygon mirror PM rotates, the angle of the reflection surface RP also changes with time. Therefore, the rotation angle α at which the light beam LB incident on the specific reflection surface RP of the polygon mirror PM can be incident on the polygon mirror PM of the f θ lens FT is limited.

Fig. 7 is a diagram for explaining a rotation angle α of the polygon mirror PM at which the reflection surface RP of the polygon mirror PM of the scanning unit Un can deflect (reflect) the light beam LBn so as to be incident on the f θ lens FT. The rotation angle α is a maximum scanning rotation angle range of the polygon mirror PM in which the polygon mirror PM of the scanning unit Un can scan the spot light SP on the irradiated surface of the substrate FS via one reflection surface RP. Hereinafter, the rotation angle α is referred to as a maximum scanning rotation angle range. A period during which the polygon mirror PM rotates in the maximum scanning rotation angle range α is an effective scanning period (maximum scanning time) of the spot light SP. The maximum scanning rotation angle range α corresponds to the maximum scanning length of the above-described scanning line SLn, and the larger the maximum scanning rotation angle range α, the longer the maximum scanning length. The rotation angle β represents a rotation angle from an angle of the polygon mirror PM when the light beam LB starts to enter the specific one of the reflection surfaces RP to an angle of the polygon mirror PM when the light beam LB ends to enter the specific one of the reflection surfaces RP. That is, the rotation angle β is an angle by which the polygon mirror PM rotates by one face of the reflection face RP. The rotation angle β is defined by the number Np of the reflection surfaces RP of the polygon mirror PM, and can be represented by β ≈ 360/Np. Therefore, the non-scanning rotation angle range γ of the polygon mirror PM in which the specific reflection surface RP of the polygon mirror PM of the scanning unit Un cannot cause the spot light SP to scan the irradiated surface of the substrate FS, that is, the reflected light reflected by the specific reflection surface RP of the polygon mirror PM cannot enter the f θ lens FT, is expressed by a relational expression of γ — α. The period in which the polygon mirror PM rotates in the non-scanning rotation angle range γ becomes an invalid scanning period of the spot light SP. In the non-scanning rotation angle range γ, the scanning unit Un cannot irradiate the light beam LBn onto the substrate FS. The rotation angle α has a relationship with the non-scanning rotation angle range γ as shown in equation (1).

γ ═ (360 degrees/Np) - α … (1)

(wherein N is the number of reflecting surfaces RP of the polygon mirror PM)

In embodiment 1, since the polygon mirror PM has eight reflecting surfaces RP, N is 8. Therefore, equation (1) can be expressed by equation (2).

Gamma-alpha … (2) at 45 degree

The maximum scanning rotation angle range α varies depending on conditions such as the distance between the polygon mirror PM and the f θ lens FT. For example, if the maximum scanning rotation angle range α is set to 15 degrees, the non-scanning rotation angle range γ is 30 degrees, and the scanning efficiency of the polygon mirror PM is α/β 1/3 in fig. 7. That is, while the polygon mirror PM of the scanning unit Un is rotating by the amount of the non-scanning rotational angle range γ (30 degrees), the light beam LBn incident on the polygon mirror PM is useless.

Therefore, in embodiment 1, the scanning units Un on which the light beam LB from one light source device 14 is incident are switched, and the light beam LB is periodically distributed to the three scanning units Un, thereby improving the scanning efficiency. That is, by shifting the drawing periods (scanning periods for scanning the spot light SP) of the three scanning units Un from each other, the light beam LB from the light source device 14 is not wasted, and the scanning efficiency is improved.

The maximum scanning rotation angle range α which is an effective scanning period (effective drawing period) is a range in which the light beam LBn can be made incident on the f θ lens FT and the spot light SP can be effectively scanned on the drawing line SLn, but the maximum scanning rotation angle range α also changes depending on the focal distance on the front side of the f θ lens FT and the like. When the maximum scanning rotation angle range α of the octahedral polygon mirror PM is 10 degrees as described above, the non-drawing period, i.e., the non-scanning rotation angle range γ, is 35 degrees according to equation (2), and the scanning efficiency in the drawing at this time is about 1/4 (10/45). On the contrary, when the maximum scanning rotation angle range α is 20 degrees, the non-scanning rotation angle range γ, which is the non-drawing period, is 25 degrees according to equation (2), and the scanning efficiency in drawing at this time is about 1/2 (20/45). In addition, in the case where the scanning efficiency is 1/2 or more, the number of scanning units Un to which the light beams LB are distributed may be two. That is, the number of scanning units Un that can distribute the light beam LB is limited by the scanning efficiency.

Fig. 8 is a diagram schematically illustrating optical paths between the light-introducing optical system 40a and the plurality of scanning units U1, U3, U5. When the drive signal (high-frequency signal) applied from the control device 18 to the selective optical element (AOM)50 is On and the drive signals applied to the selective optical elements 58 and 66 are Off, the selective optical element 50 diffracts the incident light beam LB. Thus, the light beam LB1, which is the first order diffracted light diffracted by the selection optical element 50, is incident on the scanning unit U1 via the mirror 52, and the light beam LB is not incident on the scanning units U3 and U5. Similarly, when the drive signal applied from the control device 18 to the selective optical element (AOM)58 is On and the drive signals applied to the selective optical elements 50 and 66 are Off, the light beam LB transmitted from the selective optical element 50 in the Off state is incident On the selective optical element 58, and the selective optical element 58 diffracts the incident light beam LB. Thus, the light beam LB3, which is the first order diffracted light diffracted by the selection optical element 58, is incident on the scanning unit U3 via the mirror 60, and the light beam LB is not incident on the scanning units U1 and U5. When the drive signal applied from the control device 18 to the selective optical element (AOM)66 is On and the drive signal applied to the selective optical elements 50 and 58 is Off, the light beam LB transmitted through the selective optical elements 50 and 58 in the Off state is incident On the selective optical element 66, and the selective optical element 66 diffracts the incident light beam LB. Thus, the light beam LB5, which is the first order diffracted light diffracted by the selection optical element 66, is incident on the scanning unit U5 via the mirror 68, and the light beam LB does not enter the scanning units U1 and U3.

As described above, by arranging the plurality of optical elements for selection 50, 58, and 66 of the light guiding optical system 40a in series along the traveling direction of the light beam LB from the light source device 14a, the plurality of optical elements for selection 50, 58, and 66 can select whether or not the light beam LBn (LB1, LB3, and LB5) is incident on any one of the plurality of scanning units U1, U3, and U5 in a switchable manner. The control device 18 controls the plurality of optical elements for selection 50, 58, 66 in such a manner that the scanning unit Un, on which the light beam LB is incident, is periodically switched in the order of, for example, the scanning unit U1 → the scanning unit U3 → the scanning unit U5 → the scanning unit U1. That is, the scanning time is switched so that the light beam LBn (LB1, LB3, LB5) sequentially enters the scanning units U1, U3, and U5 for a predetermined time.

The polygon mirror PM of the scanning unit U1 has its rotation controlled by the control device 18 during the incident of the light beam LB1 to the scanning unit U1, so that the incident light beam LB1 can be reflected toward the f θ lens FT. That is, the period in which the light beam LB1 is incident on the scanning unit U1 is synchronized with the scanning period (the maximum scanning rotational angle range α in fig. 7) of the spot light SP of the light beam LB1 by the scanning unit U1. In other words, the polygon mirror PM of the scanning unit U1 deflects the light beam LB1 in synchronization with the period in which the light beam LB1 is incident, so that the spot light SP of the light beam LB1 incident to the scanning unit U1 is scanned along the scanning line SL 1. Similarly, the polygon mirror PM of the scanning units U3 and U5 is controlled by the control device 18 to rotate while the light beams LB3 and LB5 are incident on the scanning units U3 and U5, so that the incident light beams LB3 and LB5 can be reflected by the f θ lens FT. That is, the period during which the light beams LB3, LB5 are incident on the scanning units U3, U5 is synchronized with the scanning period of the spot light SP by the light beams LB3, LB5 by the scanning units U3, U5. In other words, the polygon mirror PM of the scanning units U3, U5 deflects the light beams LB3, LB5 in synchronization with the period in which the light beams LB3, LB5 are incident, so that the spot light SP of the light beam LB incident on the scanning units U3, U5 scans along the scanning lines SL3, SL 5.

As described above, since the light beam LB from the one light source device 14a is supplied to any one of the scanning units Un of the three scanning units U1, U3, and U5 in a time-division manner, the polygon mirror PM of each of the scanning units U1, U3, and U5 is controlled to be rotationally driven so that the rotational speeds of the polygon mirror PM are made equal and the rotational angle positions thereof are kept at a certain angular difference (phase difference is kept). Specific examples of the control will be described later.

The controller 18 controls On/Off of the driving signal (high-frequency signal) supplied to the drawing optical element 106 of each of the scanning units U1, U3, and U5 based On pattern data (drawing data) defining a pattern to be drawn On the substrate FS by the spot light SP of the light beams LB1, LB3, and LB5 irradiated from each of the scanning units U1, U3, and U5. Accordingly, the drawing optical element 106 of each of the scanning units U1, U3, and U5 can diffract the incident light beams LB1, LB3, and LB5 based On the On/Off drive signals, thereby modulating the intensity of the spot light SP. The pattern data is generated as bitmap (bit map) data by setting one dot (pixel) of a drawing pattern to 3 × 3 μm, setting 2-value data of "1" when the drive signal is On (drawing) and "0" when the drive signal is Off (non-drawing) for each dot, and temporarily stored in the memory (RAM) for each scanning unit Un.

To describe in more detail the pattern data provided for each scanning unit Un, the pattern data (drawing data) is bitmap data composed of a plurality of pixels (hereinafter, referred to as pixel data) which are two-dimensionally decomposed in a row direction along a scanning direction (main scanning direction, Y direction) of the spot light SP and in a column direction along a transport direction (sub scanning direction, X direction) of the substrate FS. The pixel data is 1-bit data of "0" or "1". The pixel data of "0" indicates that the intensity of the spot light SP irradiated on the substrate FS is at a low level (low level), and the pixel data of "1" indicates that the intensity of the spot light SP irradiated on the substrate FS is at a high level (high level). The pixel data of one line of the pattern data corresponds to one drawing line SLn (SL1 to SL6), and the intensity of the spot light SP projected onto the substrate FS along one drawing line SLn (SL1 to SL6) is modulated in accordance with the pixel data of one line. This pixel data of one column is referred to as serial data (drawing information) DLn. That is, the pattern data is bitmap data in which serial data DLn is arranged in the column direction. The serial data DLn of the pattern data of the scan cell U1 may be represented by DL1, and similarly, the serial data DLn of the pattern data of the scan cells U2 to U6 may be represented by DL2 to DL 6.

The controller 18 inputs On/Off drive signals to the drawing optical element (AOM)106 of the scanning unit Un On which the light beam LBn enters, based On pattern data (serial data DLn constituted by "0" and "1") of the scanning unit Un On which the light beam LBn enters. When the On drive signal is input, the drawing optical element 106 diffracts the incident light flux LBn and irradiates the mirror 110 with the incident light flux LBn, and when the Off drive signal is input, the incident light flux LBn irradiates the unshown shield plate or the absorber. As a result, in the scanning unit Un On which the light flux LBn enters, when the On drive signal is input to the drawing optical element 106, the spot light SP of the light flux LBn is irradiated onto the substrate FS (the intensity of the spot light SP is high), and when the Off drive signal is input to the drawing optical element 106, the spot light of the light flux LBn is not irradiated onto the substrate FS (the intensity of the spot light SP is 0). Therefore, the scanning unit Un on which the light beam LBn is incident can draw a pattern based on the pattern data on the substrate FS along the drawing line SLn.

For example, when the light beam LB3 enters the scanning unit U3, the controller 18 switches (drives) the optical element 106 for drawing of the scanning unit U3 to On/Off based On the pattern data of the scanning unit U3. Thus, the scanner unit U3 can draw a pattern based on the pattern data on the substrate FS along the drawing line SL 3. In this manner, the scanning units U1, U3, and U5 can modulate the intensity of the spot light (scanning spot) SP along the scanning lines SL1, SL3, and SL5 and draw a pattern based on pattern data on the substrate FS.

Although the operations of the light introduction optical system 40a and the plurality of scanning units U1, U3, and U5 are described with reference to fig. 8, the same applies to the light introduction optical system 40b and the plurality of scanning units U2, U4, and U6. To explain briefly, the controller 18 controls the plurality of optical elements 50, 58, and 66 for selection in such a manner that the even-numbered scanning units Un on which the light beam LBn from the light source device 14b is incident are sequentially switched, for example, between the scanning unit U2 → the scanning unit U4 → the scanning unit U6 → the scanning unit U2. That is, the switching is performed such that the light beam LB is sequentially incident on each of the plurality of scanning units U2, U4, and U6 for a predetermined scanning time. The polygon mirror PM of each of the scanning units U2, U4, and U6 deflects the light beam LBn in synchronization with the period in which the light beam LBn enters under the control of the control device 18, so that the spot light SP of the incident light beam LBn scans along the scanning lines SL2, SL4, and SL 6. The controller 18 controls the drawing optical element (AOM)106 of the scanning unit Un (U2, U4, U6) based on the pattern data (dlserial data n (DL2, DL4, DL6) constituted by "0" and "1") of the scanning unit Un (U2, U4, U6) on which the light beam LBn (LB2, LB4, LB6) enters, so that the scanning units U2, U4, U6 can draw a pattern based on the pattern data on the substrate FS along the drawing lines SL2, SL4, SL 6.

As described above, in the above-described embodiment 1, since the plurality of optical elements for selection 50, 58, and 66 are arranged in series along the traveling direction of the light beam LB from the light source device 14a (14b), the light beam LBn can be selectively incident on one of the plurality of scanning units U1, U3, and U5 (scanning units U2, U4, and U6) by time division by the plurality of optical elements for selection 50, 58, and 66, and the utilization efficiency of the light beam LB can be improved without making the light beam LB useless.

Further, since the rotational speed and the rotational phase of the polygon mirror PM of each of the plurality of (here, three) scanning units Un are synchronized with each other and the polygon mirror PM deflects the light flux LBn so that the spot light SP scans the substrate FS in synchronization with the period in which the light flux LBn is incident on each scanning unit Un by the plurality of selection optical elements 50, 58, 66, the light flux LB is not wasted and the scanning efficiency can be improved.

The optical elements (AOMs) 50, 58, and 66 for selection may be in an On state only during one scanning of the spot light SP by the polygon mirror PM of each of the scanning units Un. For example, assuming that the number of reflecting surfaces of the polygon mirror PM is Np and the rotational speed Vp of the polygon mirror PM is (rpm), the time Tss corresponding to the rotational angle β corresponding to one surface of the reflecting surface RP of the polygon mirror PM becomes Tss 60/(Np · Vp) (sec). For example, when the number Np of reflecting surfaces is 8 and the rotation speed Vp is 3 ten thousand, one rotation of the polygon mirror PM is 2 milliseconds, and the time Tss is 0.25 milliseconds. This is 4kHz in terms of frequency, which means that the acoustic-optical modulation element can have a considerably lower response frequency than the acoustic-optical modulation element (optical element for drawing 106) for modulating the light beam LB of the ultraviolet region wavelength at a high speed on the order of several tens MHz in response to the pattern data. Therefore, the selective optical elements (AOMs) 50, 58, and 66 can use selective optical elements having a large diffraction angle of LBn (LB1 to LB6), which is the first-order diffracted light deflected with respect to the incident light beam LB (zero-order light). Therefore, the arrangement of the mirrors 52, 60, and 68 (see fig. 3 and 4) for guiding the light beam LBn (LB1 to LB6) deflected with respect to the traveling path of the light beam LB linearly transmitted through the optical elements 50, 58, and 66 to the scanning unit Un is facilitated.

[ modification of embodiment 1 ] above

The above embodiment 1 can be modified as follows. In the above-described embodiment 1, the light beams LB are assigned to three scanning units Un, but in the present modification, the light beams LB from one light source device 14 are assigned to five scanning units Un.

Fig. 9 is a diagram showing a configuration of the drawing head 16 in the modification of embodiment 1. In the present modification, there is one light source device 14, and the drawing head 16 includes five scanning units Un (U1 to U5). Note that the same components as those in embodiment 1 are denoted by the same reference numerals or omitted from illustration, and only different portions will be described. In addition, in fig. 9, the illustration of the cylindrical lens CYb shown in fig. 3 is omitted.

In the present modification, a light introduction optical system (light flux switching member) 130 is used instead of the light introduction optical systems 40a and 40 b. As shown in fig. 10, the light-guiding optical system 130 includes a selection optical element 132, a reflecting mirror 134, a collimating lens 136, a condensing lens 138, a selection optical element 140, a reflecting mirror 142, a collimating lens 144, and a condensing lens 146, in addition to the condenser lens 42, the collimating lens 44, the reflecting mirror 46, the condenser lens 48, the selection optical element 50, the reflecting mirror 52, the collimating lens 54, the condensing lens 56, the selection optical element 58, the reflecting mirror 60, the collimating lens 62, the condensing lens 64, the selection optical element 66, the reflecting mirror 68, and the absorber 70, which are described above in fig. 4.

The selection optical element 132, the collimator lens 136, and the condenser lens 138 are provided between the condenser lens 56 and the selection optical element 58 in this order. Therefore, in the present modification, when the drive signal (high-frequency signal) from the control device 18 is Off, the selection optical element 50 directly transmits the incident light beam LB and irradiates the selection optical element 132 with the light beam LB, and the condenser lens 56 condenses the light beam LB incident on the selection optical element 132 so as to form a beam waist in the selection optical element 132.

The optical element 132 is selected to be transmissive with respect to the light beam LB, for example, using an acousto-optic modulating element (AOM). The selection optical element 132 transmits the incident light beam LB as it is when the drive signal from the control device 18 is Off, and irradiates the selection optical element 58, and irradiates the mirror 134 with the light beam LB2, which is the first-order diffracted light that diffracts the incident light beam LB, when the drive signal (high-frequency signal) from the control device 18 is On. The mirror 134 reflects the incident light beam LB2 and enters the collimator lens 100 of the scanning unit U2. That is, the controller 18 switches the selection optical element 132 to On/Off, thereby switching the selection optical element 132 whether or not the light beam LB2 is incident On the scanner unit U2. The collimator lens 136 collimates the light beam LB irradiated to the selection optical element 58, and the condenser lens 138 condenses the light beam LB collimated by the collimator lens 136 so as to form a beam waist in the selection optical element 58.

The selection optical element 140, the collimator lens 144, and the condenser lens 146 are provided between the condenser lens 64 and the selection optical element 66 in this order. Therefore, in the present modification, when the drive signal from the control device 18 is Off, the selection optical element 58 transmits the incident light beam LB directly and irradiates the selection optical element 140 with the light beam LB, and the condenser lens 64 condenses the light beam LB incident on the selection optical element 140 so as to form a beam waist in the selection optical element 140.

The optical element 140 for selection has a transmissivity with respect to the light beam LB, for example, an acousto-optic modulating element (AOM) is used. The selection optical element 140 irradiates the incident light beam LB to the selection optical element 66 when the drive signal from the control device 18 is Off, and irradiates the light beam LB4, which is the first-order diffracted light that diffracts the incident light beam LB, to the mirror 142 when the drive signal (high-frequency signal) from the control device 18 is On. The mirror 142 reflects the incident light beam LB4 and irradiates the collimated lens 100 of the scanning unit U4. That is, the controller 18 switches the selection optical element 140 to On/Off, thereby switching the selection optical element 140 whether or not the light beam LB4 is incident On the scanner unit U4. The collimator lens 144 collimates the light beam LB irradiated to the selection optical element 66, and the condenser lens 146 condenses the light beam LB collimated by the collimator lens 144 so as to form a beam waist in the selection optical element 66.

By arranging the plurality of optical elements for Selection (AOMs) 50, 58, 66, 132, and 140 in series (in series), the light beam LBn can be made to enter any one of the plurality of scanning units U1 to U5. The control device 18 controls the plurality of optical elements for selection 50, 132, 58, 140, 66 so that the scanning unit Un, on which the light beam LBn is incident, is periodically switched in the order of, for example, the scanning unit U1 → the scanning unit U2 → the scanning unit U3 → the scanning unit U4 → the scanning unit U5 → the scanning unit U1. That is, the scanning time is switched so that the light beam LBn is sequentially incident on each of the plurality of scanning units U1 to U5. Under the control of the control device 18, the polygon mirror PM of each of the scanning units U1 to U5 deflects the light beam LBn in synchronization with the period in which the light beam LBn is incident, so that the spot light SP of the incident light beam LBn scans along the scanning lines SL1 to SL 5. The controller 18 controls the drawing optical element (AOM)106 of each scanning unit Un based on the pattern data (serial data DLn constituted by "0" and "1") of the scanning unit Un on which the light beam LBn is incident, so that the scanning unit Un can draw a pattern based on the pattern data on the substrate FS along the drawing line SLn.

That is, in the case of the present modification, the polygon mirrors PM of the five scanning units U1 to U5 rotate synchronously so that the rotational angle positions thereof are out of phase by a certain angle amount. In the case of the present modification, since the light beam (laser light) LB is divided into five scanning units U1 to U5, the front focal length of the f θ lens FT and/or the number Np of the reflection surfaces of the polygon mirror PM are set so that the angle range (rotation angle β in fig. 7) in which the light beam LBn can be irradiated on one reflection surface RP of the polygon mirror PM and the maximum deflection angle (angle 2 α in fig. 7) at which the light beam LBn reflected by the reflection surface RP enters the f θ lens FT satisfy β ≧ 5 α.

As described above, in the present modification, the utilization efficiency of the light beam LB from the light source device 14 can be improved without making the light beam LB useless, and the scanning efficiency can be improved. In addition, in the present modification, the light beam LB from one light source device 14 is assigned to five scanning units Un, but the light beam LB from one light source device 14 may be assigned to two scanning units Un, or may be assigned to four or more than six scanning units Un. In this case, if the number of the assigned scanning units Un is n, the front focal length of the f θ lens FT and/or the number Np of the reflection surfaces of the polygon mirror PM are set so that an angular range (rotation angle β in fig. 7) in which the light flux LBn can be irradiated onto one reflection surface RP of the polygon mirror PM and a maximum deflection angle (angle 2 α in fig. 7) at which the light flux LB reflected by the reflection surface RP is incident on the f θ lens FT satisfy β ≧ n × α. In addition, as described in embodiment 1 above, in the case where the light beams LB from the two light source devices 14(14a, 14b) are allocated to a plurality of scanning units Un, the light beams LB are not limited to being allocated to three scanning units Un, and may be allocated to any number of scanning units Un. For example, the light beam LB from the light source device 14a may be assigned to five scanning units Un, and the light beam LB from the light source device 14b may be assigned to four scanning units Un.

[ 2 nd embodiment ]

In the above-described embodiment 1, since the drawing optical element (AOM)106 is provided in front of the polygon mirror PM in each scanning unit Un, the number of drawing optical elements 106 used increases, and the cost increases. In the present embodiment 2, one drawing light modulator (AOM) is provided on the optical path of the light beam LB from one light source device 14, and the intensity of the light beam LBn irradiated from the plurality of scanning units Un toward the substrate FS is modulated by the one drawing light modulator to draw a pattern. That is, in embodiment 2, only one drawing optical modulator (AOM) requiring high responsiveness is disposed in front of a plurality of scanning units Un, and an optical selection element (AOM) capable of having low responsiveness is disposed on the scanning unit Un side.

Fig. 11 is a diagram showing the configuration of the drawing head 16 according to embodiment 2, and fig. 12 is a diagram showing the light-guiding optical system 40a shown in fig. 11. The same components as those of embodiment 1 are denoted by the same reference numerals, and only different portions will be described. In fig. 11, the cylindrical lens CYb shown in fig. 3 is not shown, and the light introducing optical systems 40a and 40b have the same configuration, and therefore, the light introducing optical system 40a will be described here, and the light introducing optical system 40b will be described here. As shown in fig. 12, the light-guiding optical system 40a includes a drawing optical element (AOM)150, a collimator lens 152, a condenser lens 154, and an absorber 156 as a drawing optical modulator, in addition to the condenser lens 42, the collimator lens 44, the mirror 46, the condenser lens 48, the selection optical element 50, the mirror 52, the collimator lens 54, the condenser lens 56, the selection optical element 58, the mirror 60, the collimator lens 62, the condenser lens 64, the selection optical element 66, the mirror 68, and the absorber 70, which are described above with reference to fig. 4. In embodiment 2, as shown in fig. 11, the optical element 106 for drawing as in embodiment 1 is not provided in each of the scanning units U1 to U6.

The drawing optical element 150, the collimator lens 152, and the condenser lens 154 are provided between the condenser lens 48 and the selection optical element 50 in this order. Therefore, in embodiment 2, the mirror 46 reflects the light beam LB collimated by the collimator lens 44 and directs the reflected light beam LB to the optical element 150 for drawing. The condenser lens 48 condenses (converges) the light beam LB incident on the drawing optical element 150 so as to form a beam waist in the drawing optical element 150.

The rendering optical element 150 is transmissive with respect to the light beam LB, for example, using an acousto-optic modulating element (AOM). The drawing optical element 150 is provided on the light source device 14(14a) side with respect to the first-stage optical element 50 located closest to the light source device 14(14a) among the optical elements 50, 58, 66 for selection. The drawing optical element 150 irradiates the incident light beam LB to the absorber 156 when the drive signal (high frequency signal) from the control device 18 is Off, and irradiates the first-order selection optical element 50 with the light beam (drawing beam) LB as the first-order diffracted light that diffracts the incident light beam LB when the drive signal (high frequency signal) from the control device 18 is On. The collimator lens 152 collimates the light beam LB irradiated to the selection optical element 50, and the condenser lens 154 condenses (converges) the light beam LB collimated by the collimator lens 152 so as to form a beam waist in the selection optical element 50.

As shown in fig. 11, the scanning units U1 to U6 include a collimator lens 100, a mirror 102, a mirror 110, a cylindrical lens CYa, a mirror 114, a polygon mirror PM, an f θ lens FT, a cylindrical lens CYb (not shown in fig. 11), and a mirror 122, and further include a 1 st shaping lens 158a and a 2 nd shaping lens 158b as beam shaping lenses. That is, in embodiment 2, a 1 st forming lens 158a and a 2 nd forming lens 158b are provided in the scanning units U1 to U6, instead of the condenser lens 104 and the collimator lens 108 of embodiment 1.

Fig. 13 is a diagram schematically illustrating optical paths between the light-introducing optical system 40a of fig. 12 and the plurality of scanning units U1, U3, U5. The controller 18 outputs On/Off drive signals (high-frequency signals) to the drawing optical elements 150 of the optical waveguide system 40a based On pattern data (serial data DL1, DL3, and DL6 including "0" and "1") defining a pattern to be drawn On the substrate FS by the spot light SP of the light beams LB1, LB3, and LB5 irradiated from the respective scanning units U1, U3, and U5. Thus, the drawing optical element 150 of the light introduction optical system 40a can diffract the incident light beam LB based On the On/Off drive signal to modulate the intensity of the spot light SP (make it On/Off).

More specifically, the controller 18 inputs On/Off drive signals to the drawing optical element 150 based On the pattern data of the scanning unit Un On which the light beam LBn is incident. When the On drive signal (high-frequency signal) is input, the drawing optical element 150 diffracts the incident light beam LB and irradiates the selection optical element 50 with the light beam LB (the intensity of the light beam LB incident On the selection optical element 50 increases). On the other hand, when the Off drive signal (high-frequency signal) is input, the drawing optical element 150 irradiates the absorber 156 (fig. 12) with the incident light beam LB (the intensity of the light beam LB incident on the selective optical element 50 becomes 0). Therefore, the scanning unit Un on which the light beam LBn is incident can irradiate the intensity-modulated light beam LB toward the substrate FS along the scanning line SLn, and can draw a pattern based on the pattern data on the substrate FS.

For example, when the light beam LB3 enters the scanning unit U3, the control device 18 switches the drawing optical element 150 of the light-guiding optical system 40a to On/Off based On the pattern data of the scanning unit U3. Thus, the scanner unit U3 can irradiate the intensity-modulated light beam LB to the substrate FS along the scanning line SL3, and can draw a pattern based on the pattern data on the substrate FS. The scanning unit Un, on which the light beam LBn is incident, is sequentially switched in such a manner as scanning unit U1 → scanning unit U3 → scanning unit U5 → scanning unit U1. Therefore, similarly, the controller 18 sequentially switches the pattern data for determining the On/Off signal to be transmitted to the drawing optical element 150 of the light introduction optical system 40a so that the pattern data of the scan unit U1 → the pattern data of the scan unit U3 → the pattern data of the scan unit U5 → the pattern data of the scan unit U1. Then, the control device 18 controls the drawing optical element 150 of the light introduction optical system 40a based on the pattern data sequentially switched. Thus, the respective scanning units U1, U3, and U5 can draw a pattern corresponding to the pattern data on the substrate FS by irradiating the intensity-modulated light beam LB to the substrate FS along the drawing lines SL1, SL3, and SL 5.

As described above, the configuration of a part of the control system applied to embodiment 2 and its operation are described in detail with reference to fig. 14 to 16. The configuration and operation described below can be applied to embodiment 1. Fig. 14 is a block diagram of a rotation control system of the polygon mirror PM provided in each of the three scanning units U1, U3, and U5 in fig. 11 and 13 as an example, and since the scanning units U1, U3, and U5 have the same configuration, the same components are denoted by the same reference numerals. Each of the scanning units U1, U3, and U5 is provided with an origin sensor OP1, OP3, or OP5 that photoelectrically detects a scanning start timing of a scanning line (scanning line) SL1, SL3, or SL5 generated on the substrate FS by the polygon mirror PM. The origin sensors OP1, OP3, and OP5 are photodetectors that project light onto the reflection surface RP of the polygon mirror PM and receive the reflected light thereof, and output pulse-shaped origin signals SZ1, SZ3, and SZ5, respectively, whenever the spot light SP reaches a position immediately before the scanning start point of the scanning lines SL1, SL3, and SL 5.

The timing measurement unit 180 receives the origin signals SZ1, SZ3, and SZ5 as input, measures whether or not the generation timings of the origin signals SZ1, SZ3, and SZ5 are within a predetermined allowable range (time interval), and outputs deviation information corresponding to the error when the error is generated, to the servo controller 182. The servo control device 182 outputs a command value based on the deviation information to each servo drive circuit section of the motor Mp (the motor Mp rotationally drives the polygon mirror PM in each of the scanning units U1, U3, and U5). Each servo drive circuit unit of the motor Mp is configured by a feedback circuit unit FBC that receives a lift pulse signal (hereinafter referred to as an encoder signal) from an encoder EN attached to the rotation shaft of the motor Mp and outputs a speed signal corresponding to the rotation speed of the polygon mirror PM, and a servo drive circuit (amplifier) SCC that receives a command value from the servo control device 182 and a speed signal from the feedback circuit unit FBC and drives the motor Mp to a rotation speed corresponding to the command value. The servo drive circuit unit (feedback circuit unit FBC, servo drive circuit SCC), timing measurement unit 180, and servo control device 182 constitute a part of control device 18.

In embodiment 2, each polygon mirror PM in the three scanning units U1, U3, and U5 needs to rotate at the same speed with a constant phase difference at the rotational angle position, and in order to achieve this, the timing measurement unit 180 inputs the origin signals SZ1, SZ3, and SZ5 and performs measurement as shown in the timing chart of fig. 15, for example.

Fig. 15 schematically illustrates various signal waveforms generated in a case where the three polygon mirrors PM rotate with a phase difference within a prescribed allowable range with respect to the rotation angle. Immediately after the polygon mirrors PM are rotated, the relative phase differences of the origin signals SZ1, SZ3, and SZ5 are different from each other, but the timing measurement unit 180 generates other origin signals SZ3 and SZ5 at the same frequency (cycle) as the origin signal SZ1 with reference to the origin signal SZ1, and measures correction information corresponding to an error with respect to the value with reference to a state where the time intervals Ts1, Ts2, and Ts3 between the three origin signals SZ1, SZ3, and SZ5 are equal to each other. The timing measurement unit 180 outputs the correction information to the servo control device 182, thereby servo-controlling the motors Mp of the scanning units U3 and U5, and controlling the generation timings of the three origin signals SZ1, SZ3, and SZ5 so that Ts1 is stabilized at Ts2 and Ts3 as shown in fig. 15.

When the generation timings of the origin signals SZ1, SZ3, and SZ5 are stable, the timing measurement unit 180 outputs the rendering enable (On) signals SPP1, SPP3, and SPP5 to the selection optical elements 50, 58, and 66 shown in fig. 11 to 13. The drawing enable (On) signals SPP1, SPP3, and SPP5 cause the corresponding selection optical elements 50, 58, and 66 to perform a modulation operation (light deflection switching operation) only during the H-level period. Since the three origin signals SZ1, SZ3, and SZ5 maintain a constant phase difference after they are stabilized (here, 1/3 of the period of the origin signal SZ 1), the rises (L → H) of the rendering enable signals SPP1, SPP3, and SPP5 also have a constant phase difference. The drawing enable signals SPP1, SPP3, SPP5 correspond to drive signals (high frequency signals) for switching the optical elements 50, 58, 66 for selection.

The timing of the falling (H → L) of the drawing enable signals SPP1, SPP3, and SPP5 is set by measuring the clock signal CLK for the dot light On/Off in the drawing lines SL1, SL3, and SL5 with a counter in the timing measurement unit 180. The clock signal CLK controls the On/Off timing of the drawing optical element 150 (or the drawing optical element 106 in fig. 3), and is determined by the length of the drawing line SLn (SL1, SL3, SL5), the size of the spot light SP On the substrate FS, the scanning speed Vs of the spot light SP, and the like. For example, when the length of the drawing line is 30mm, the size (diameter) of the spot light SP is 6 μm, and the spot light SP is On/Off so as to overlap 3 μm in the scanning direction, the counter in the timing measurement unit 180 may count the clock signal CLK to 10000(30mm/3 μm) times and then lower the drawing enable signals SPP1, SPP3, and SPP5 (H → L).

When the reflection surface of the polygon mirror PM is ten surfaces and the rotation speed thereof is Vp (rpm), the frequencies of the origin signals SZ1, SZ3, and SZ5 are 10Vp/60 (Hz). Therefore, when the time interval is stable at Ts 1-Ts 2-Ts 3, the time interval Ts1 is 60/(30Vp) seconds. For example, when the reference rotational speed Vp of the polygon mirror PM is 8000rpm, the time interval Ts1 is 60/(30 · 8000) seconds, which is 250 μ S.

As shown in fig. 15, the On time (duration of H level) Toa of the enable signals SPP1, SPP3, and SPP5 is a period (projection period) during which the light beam (laser light) LB from the polygon mirror PM is projected onto the substrate FS as spot light, but needs to be set shorter than the time interval Ts 1. Then, for example, when the On time Toa is set to 200 μ S, the frequency of the clock signal CLK for counting 10000 times during this period becomes 10000/200-50 (MHz). In synchronization with such a clock signal CLK, drawing bit string data Sdw or serial data DLn (for example, 10000 bits) corresponding to the drawing line SLn generated from the pattern data (bit map "0" or "1") is output to the drawing optical element 150. In the configuration in which the drawing optical element 106 is provided in each of the scanning units U1, U3, and U5, as shown in fig. 3, the drawing bit string data Sdw or serial data DL1 corresponding to the drawing line SL1 is transmitted to the drawing optical element 106 in the scanning unit U1, the drawing bit string data Sdw or serial data DL3 corresponding to the drawing line SL3 is transmitted to the drawing optical element 106 in the scanning unit U3, and the drawing bit string data Sdw or serial data DL5 corresponding to the drawing line SL5 is transmitted to the drawing optical element 106 in the scanning unit U5.

In embodiment 2, the drawing bit string data Sdw or serial data DLn generated from the pattern data corresponding to each of the three drawing lines SL1, SL3, and SL5 is sequentially supplied to the On/Off for the drawing optical element 150 in synchronization with the drawing enable signals SPP1, SPP3, and SPP5 (or the origin signals SZ1, SZ3, and SZ 5).

Fig. 16 shows an example of a circuit for generating bit string data Sdw including generation circuits (pattern data generation circuits) 301, 303, and 305 and an OR circuit GT 8. The generation circuit 301 includes a memory BM1, a counter CN1, and a gate GT1, the generation circuit 303 includes a memory BM3, a counter CN3, and a gate GT3, and the generation circuit 305 includes a memory BM5, a counter CN5, and a gate GT 5. The generation circuits 301, 303, 305 and the OR circuit GT8 constitute a part of the control device 18.

The memory units BM1, BM3, BM5 are memories for temporarily storing bitmap data (pattern data) corresponding to patterns to be subjected to exposure drawing in the respective scan cells U1, U3, U5. The counter units CN1, CN3, and CN5 are counters for outputting bit strings (for example, 10000 bits) of one drawing line to be drawn next among the bitmap data (pattern data) in the memory units BM1, BM3, and BM5 bit by bit as serial data DL1, DL3, and DL5 synchronized with the clock signal CLK in a period in which the drawing enable signals SPP1, SPP3, and SPP5 are On.

The bitmap data in the memory units BM1, BM3, and BM5 are shifted by data corresponding to one drawn line by an address counter or the like, not shown. For example, in the case of the memory unit BM1, the shift is performed at a timing when the origin signal SZ3 of the active scan cell U3 is generated after the serial data DL1 corresponding to one scan line is output. Similarly, the shift of the bitmap data in the memory unit BM3 is performed at the timing when the origin signal SZ5 of the scan cell U5 which is active next to the end of the output of the serial data DL3 is generated, and the shift of the bitmap data in the memory unit BM5 is performed at the timing when the origin signal SZ1 of the scan cell U1 which is active next to the end of the output of the serial data DL5 is generated.

The serial data DL1, DL3, and DL5 sequentially generated in this way are applied to the three-input OR circuit GT8 through gates GT1, GT3, and GT5 that are opened while the drawing enable signals SPP1, SPP3, and SPP5 are On. The OR circuit GT8 outputs a bit data sequence repeatedly synthesized in the order of the serial data DL1 → DL3 → DL5 → DL1 · · as drawing bit sequence data Sdw for On/Off of the drawing optical element 150. In the configuration in which the drawing optical element 106 is provided in each of the scanner units U1, U3, and U5 as shown in fig. 3, the serial data DL1 output from the gate GT1 may be transmitted to the drawing optical element 106 in the scanner unit U1, the serial data DL3 output from the gate GT3 may be transmitted to the drawing optical element 106 in the scanner unit U3, and the serial data DL5 output from the gate GT5 may be transmitted to the drawing optical element 106 in the scanner unit U5.

As described above, the On/Off of the drawing optical element 150 (or 106) needs to respond to a high-speed clock signal CLK (e.g., 50MHz), but the selection optical elements 50, 58, 66 may be On/Off in synchronization with the drawing enable signals SPP1, SPP3, SPP5 (or the origin signal SZ1, SZ3, SZ5), and the response frequency thereof may be about 10KHz because the time interval Toa (or Ts1) is 200 μ S in the case of the previous numerical example, and thus inexpensive elements having high transmittance can be used. Note that, when the frequency of the clock signal CLK counted by the counter in the timer measurement unit 180 or counted by the counter units CN1, CN3, and CN5 in fig. 16 is Fcc and the fundamental frequency of the pulse oscillation of the light beam LB from the light source device 14 is Fs, n may be an integer equal to or greater than 1 (preferably, n ≧ 2) and set so as to satisfy the relationship of n · Fcc ═ Fs.

The operations of the light introducing optical system 40a and the plurality of scanning units U1, U3, and U5 in fig. 13 and the drawing timings of the scanning units U1, U3, and U5 in fig. 14 to 16 have been described above, but the same applies to the light introducing optical system 40b and the plurality of scanning units U2, U4, and U6. To briefly explain, the scanning unit Un, on which the light beam LB is incident, is sequentially switched in such a manner as to, for example, the scanning unit U2 → the scanning unit U4 → the scanning unit U6 → the scanning unit U2. Therefore, similarly, the controller 18 sequentially switches the pattern data for determining the On/Off signal to be transmitted to the drawing optical element 150 of the light introduction optical system 40b so as to make the pattern data of the scan unit U2 → the pattern data of the scan unit U4 → the pattern data of the scan unit U6 → the pattern data of the scan unit U2. Then, the control device 18 controls the drawing optical element 150 of the light introduction optical system 40b based on the pattern data sequentially switched. Alternatively, by the circuit configuration shown in fig. 16, drawing bit string data Sdw obtained by synthesizing pattern data corresponding to three drawing lines is generated and supplied to the drawing optical element 150. Thus, the respective scanning units U2, U4, and U6 can draw a pattern based on pattern data on the substrate FS by irradiating the intensity-modulated light beam LB to the substrate FS along the scanning lines SL2, SL4, and SL 6.

In the above embodiment 2, the following effects can be obtained in addition to the effects of the above embodiment 1. That is, one drawing optical element 150 is provided in the light introduction optical system 40a, the drawing optical element 150 is disposed closer to the light source device 14a side than the primary optical element 50 for selection, and the intensities of the light beams LB1, LB3, LB5 irradiated from the plurality of scanning units U1, U3, U5 to the substrate FS are modulated in accordance with the pattern by the one drawing optical element 150. Similarly, one drawing optical element 150 is provided in the light introduction optical system 40b, the drawing optical element 150 is disposed closer to the light source device 14b side than the primary optical element 50 for selection, and the intensities of the light beams LB2, LB4, LB6 irradiated from the plurality of scanning units U2, U4, U6 to the substrate FS are modulated by the one drawing optical element 150 according to the pattern. Therefore, the number of acousto-optic modulation elements can be reduced, and the cost can be reduced.

In addition, although the description has been given of the drawing head 16 that divides the light beam LB into three in the above-described embodiment 2, the drawing head 16 that divides the light beam LB into five may be used as described in the modification of the above-described embodiment 1 (see fig. 9 and 10). In the case of fig. 9 and 10, since there is one light source device 14, there is also one drawing optical element 150.

[ modification of embodiment 2 ]

The above embodiment 2 can be modified as follows. In the above-described embodiment 2, the optical element 150 for drawing is provided as the optical modulator for drawing in the light introducing optical systems 40a and 40b, but in the present modification, the optical modulator for drawing is provided in the light source device 14(14a and 14b) instead of the optical element 150 for drawing. Note that the same components as those in embodiment 2 are denoted by the same reference numerals or omitted from illustration, and only different portions will be described. The light source devices 14A and 14B provided with the drawing light modulators are referred to as light source devices 14A and 14B, respectively, and since the light source device 14A and the light source device 14B have the same configuration, only the light source device 14A will be described.

Fig. 17 is a diagram showing a configuration of a light source device (pulse light source device, laser light source device) 14A according to this modification. The light source device 14A as a fiber laser device includes a DFB semiconductor laser element 200, a DFB semiconductor laser element 202, a polarization beam splitter 204, an electro-optical element 206 as a drawing light modulator, a drive circuit 206a of the electro-optical element 206, a polarization beam splitter 208, an absorber 210, an excitation light source 212, a combiner 214, a fiber optical amplifier 216, a wavelength conversion optical element 218, a wavelength conversion optical element 220, a plurality of lens elements GL, and a control circuit 222 including a clock generator 222 a.

The DFB semiconductor laser device (1 st solid-state laser device, 1 st semiconductor laser light source) 200 generates a pulse-like seed light (laser light) S1 having a steep or sharp (sharp) peak at a predetermined frequency (oscillation frequency, fundamental frequency) Fs, and the DFB semiconductor laser device (2 nd solid-state laser device, 2 nd semiconductor laser light source) 202 generates a gentle (temporally wide) pulse-like seed light (laser light) S2 at a predetermined frequency Fs. One pulse of the seed light S1 generated by the DFB semiconductor laser device 200 and one pulse of the seed light S2 generated by the DFB semiconductor laser device 202 have substantially the same energy, but have different polarization states and a strong peak intensity of the seed light S1. In this modification, the polarization state of the seed light S1 generated by the DFB semiconductor laser device 200 is S polarization, and the polarization state of the seed light S2 generated by the DFB semiconductor laser device 202 is P polarization. The DFB semiconductor laser elements 200 and 202 are controlled to emit seed lights S1 and S2 at an oscillation frequency Fs by electrical control of the control circuit 222 in response to a clock signal LTC (predetermined frequency Fs) generated by the clock generator 222 a. The control circuit 222 is controlled by the control device 18.

The clock signal LTC has a fundamental frequency of the clock signal CLK supplied to each of the counter units CN1, CN3, and CN5 shown in fig. 16, and is divided by n (preferably, n is an integer of 2 or more) to be the clock signal CLK. The clock generator 222a also has a function of adjusting the fundamental frequency Fs of the clock signal LTC by ± Δ F, that is, a function of finely adjusting the time interval of the pulse oscillation of the light beam LB. Thus, for example, even if the scanning speed Vs of the spot light SP slightly varies, the size (drawing magnification) of the pattern drawn within the drawing line can be precisely secured by fine-adjusting the fundamental frequency Fs.

The polarization beam splitter 204 transmits the S-polarized light and reflects the P-polarized light, and guides the seed light S1 generated by the DFB semiconductor laser device 200 and the seed light S2 generated by the DFB semiconductor laser device 202 to the electro-optical device 206. Specifically, the polarization beam splitter 204 transmits the S-polarized seed light S1 generated by the DFB semiconductor laser device 200 to guide the seed light S1 to the electro-optical device 206, and reflects the P-polarized seed light S2 generated by the DFB semiconductor laser device 202 to guide the seed light S2 to the electro-optical device 206. The DFB semiconductor laser elements 200 and 202 and the polarization beam splitter 204 constitute a laser light source section (light source section) 205 that generates the seed lights S1 and S2.

The Electro-optical element 206 has transmissivity with respect to the seed lights S1 and S2, and an Electro-optical Modulator (EOM) is used, for example. The EOM switches the polarization states of the seed lights S1, S2 passing from the polarization beam splitter 204 by the drive circuit 206a in response to the On/Off state (high/low) of the depiction bit string data Sdw (or serial data DLn) shown in the previous fig. 16. Since the wavelength bands of the seed lights S1 and S2 from the DFB semiconductor laser device 200 and the DFB semiconductor laser device 202 are 800nm or more and long, an electro-optical device having a response of switching the polarization state of GHz can be used as the electro-optical device 206.

When one bit of pixel data representing the bit string data Sdw (or the serial data DLn) input to the driving circuit 206a is in the Off state (low, 0), the electrooptic element 206 directly guides the incident seed light S1 or S2 to the polarization beam splitter 208 without changing the polarization state thereof. On the other hand, when the drawing bit string data Sdw (or the serial data DLn) input to the driving circuit 206a is in an On state (high, "1"), the electro-optical element 206 changes the polarization state of the incident seed light S1 or S2 (changes the polarization direction by 90 degrees) and guides the changed seed light to the polarization beam splitter 208. By driving the electro-optical element 206 in this manner, when the pixel data for drawing the bit string data Sdw (or the serial data DLn) is in the On state (high), the electro-optical element 206 converts the S-polarized seed light S1 into the P-polarized seed light S1, and converts the P-polarized seed light S2 into the S-polarized seed light S2.

The polarization beam splitter 208 transmits the P-polarized light and guides the light to the combiner 214 via the lens element GL, and reflects the S-polarized light and guides the light to the absorber 210. The excitation light source 212 generates excitation light, which is guided to the combiner 214 via the optical fiber 212 a. The combiner 214 combines the seed light irradiated from the polarization beam splitter 208 with the excitation light, and outputs the resultant to the fiber optical amplifier (optical amplifier) 216. The fiber optic amplifier 216 is doped with a lasing medium that can be excited by the excitation light. Therefore, in the fiber optical amplifier 216 to which the combined seed light and excitation light are transmitted, the seed light is amplified by exciting the laser medium with the excitation light. As a laser medium to be doped in the fiber optical amplifier 216, a rare earth element such as erbium (Er), ytterbium (Yb), and thulium (Tm) is used. The amplified seed light is emitted from the emission end 216a of the fiber optical amplifier 216 at a predetermined divergence angle, converged or collimated by the lens element GL, and then enters the wavelength conversion optical element 218.

The wavelength conversion optical element (1 st wavelength conversion optical element) 218 converts the incident seed light (wavelength λ) into a Second Harmonic having a wavelength of λ/2 by Second Harmonic Generation (SHG). As the wavelength conversion optical element 218, PPLN (periodic Poled LiNbO) as a Quasi-Phase Matching (QPM) crystal is suitably used₃: periodically poled lithium niobate) crystal. In addition, PPLT (periodic Poled LiTaO) can also be used₃: periodically poled lithium tantalate) crystals, and the like.

The wavelength conversion optical element (2 nd wavelength conversion optical element) 220 generates a third harmonic having a wavelength of λ/3 by Sum Frequency Generation (SFG) of the second harmonic (wavelength of λ/2) converted by the wavelength conversion optical element 218 and the seed light (wavelength of λ) remaining without being converted by the wavelength conversion optical element 218. The third harmonic becomes ultraviolet light (beam LB) having a peak wavelength in a wavelength band of 370nm or less.

As described above, in the case of the configuration in which the bit string data Sdw (or DLn) sent from the pattern data generation circuit shown in fig. 16 is applied to the electro-optical element 206 in fig. 17, when the pixel data of one bit of the bit string data Sdw (or DLn) is in the Off state (low or 0), the electro-optical element 206 directly leads the polarization beam splitter 208 without changing the polarization state of the incident seed light S1 or S2. Therefore, the seed light transmitted from the polarization beam splitter 208 becomes the seed light S2 from the DFB semiconductor laser element 202. Therefore, the light beam LB finally output from the light source device 14A has the same oscillation curve (temporal characteristic) as the seed light S2 from the DFB semiconductor laser element 202. That is, in this case, the light beam LB has relaxation characteristics in which the peak intensity of the pulse is low and the pulse is wide in time. Since the optical fiber amplifier 216 has low amplification efficiency for the seed light S2 having such a low peak intensity, the light beam LB output from the light source device 14A becomes light which is not amplified to the energy required for exposure. Therefore, in this case, from the viewpoint of exposure, the result is substantially the same as that in the case where the light source device 14A does not emit the light beam LB. That is, the intensity of the spot light SP irradiated on the substrate FS is low. However, in a period (non-projection period, non-exposure period) in which pattern drawing is not performed along each of the drawing lines SLn (SL1 to SL6), since the light beam LB in the ultraviolet region from the seed light S2 continues to be emitted at a slight intensity, when a state occurs in which the drawing lines SLn (SL1 to SL6) continue to be at the same position on the substrate FS for a long time (for example, an emergency stop of the substrate FS due to a failure of the conveyance system, or the like), the emission window may be closed by providing a movable shutter for the light beam LB of the light source device 14A.

On the other hand, when one bit of pixel data representing bit string data Sdw (or DLn) applied to the electro-optical element 206 of fig. 17 is in an On state (high, "1"), the electro-optical element 206 changes the polarization state of the incident seed light S1 or S2 and guides the changed seed light to the polarization beam splitter 208. Therefore, the seed light transmitted from the polarization beam splitter 208 becomes the seed light S1 from the DFB semiconductor laser device 200. Therefore, the light beam LB output from the light source device 14A is generated by the seed light S1 from the DFB semiconductor laser element 200. The seed light S1 from the DFB semiconductor laser device 200 has a strong peak intensity and is therefore efficiently amplified by the fiber optical amplifier 216, and the light beam LB output from the light source device 14A has energy required for exposure of the substrate FS. That is, the intensity of the spot light SP irradiated on the substrate FS is high.

Since the electro-optical element 206 as a drawing optical modulator is provided in the light source device 14A in this manner, the same effects as those of the above-described embodiment 2 can be obtained by controlling the electro-optical element 206, as in the case of controlling the drawing optical element 150 in the above-described embodiment 2. That is, by switching (driving) the electro-optical element 206 On/Off based On the pattern data of the scanning unit Un On which the light beam LB is incident (or the drawing bit string data Sdw in fig. 15 and 16), the intensity of the light beam LB incident On the first-stage optical element 50 for selection, that is, the intensity of the spot light SP of the light beam LB irradiated onto the substrate FS by the scanning units Un (U1 to U6) can be modulated according to the pattern to be drawn.

In the configuration of fig. 17, it is also conceivable to omit the DFB semiconductor laser element 202 and the polarization beam splitter 204 and to guide only the seed light S1 pulse train (Burst) from the DFB semiconductor laser element 200 in a wave form to the optical fiber amplifier 216 by switching the electro-optical element 206 based on pattern data (drawing data). However, with this configuration, the incident periodicity of the seed light S1 to the fiber optical amplifier 216 is greatly disturbed depending on the pattern to be drawn. That is, after the state where the seed light S1 from the DFB semiconductor laser element 202 does not enter the optical fiber amplifier 216 continues, if the seed light S1 enters the optical fiber amplifier 216, the seed light S1 immediately after the entrance is amplified at a larger amplification factor than in the normal state, and a light beam having a large intensity equal to or higher than a predetermined value is generated from the optical fiber amplifier 216. In the present modification, the seed light S2 (broad pulse light with low peak intensity) from the DFB semiconductor laser element 202 is preferably made to enter the optical fiber amplifier 216 while the seed light S1 is not made to enter the optical fiber amplifier 216, thereby solving the problem.

The electro-optical element 206 is switched, but the DFB semiconductor laser elements 200 and 202 may be driven based on pattern data (drawing bit string data Sdw or serial data DLn). That is, the control circuit 222 controls the DFB semiconductor laser elements 200 and 202 based on the pattern data (drawing bit string data Sdw or DLn) to selectively (alternatively) generate the seed lights S1 and S2 oscillating in a pulse-like manner at the predetermined frequency Fs. In this case, the polarization beam splitters 204 and 208, the electro-optical element 206, and the absorber 210 are not required, and one of the seed lights S1 and S2 that are selectively pulsed from one of the DFB semiconductor laser elements 200 and 202 is directly incident on the combiner 214. At this time, the control circuit 222 controls the driving of the DFB semiconductor laser devices 200 and 202 so that the seed light S1 from the DFB semiconductor laser device 200 and the seed light S2 from the DFB semiconductor laser device 202 do not enter the fiber optical amplifier 216 at the same time. That is, when the spot light SP of each beam LBn is irradiated onto the substrate FS, the DFB semiconductor laser device 200 is controlled so that only the seed light S1 enters the fiber optical amplifier 216. In the case where the spot light SP of the beam LBn is not irradiated to the substrate FS (the intensity of the spot light SP is extremely low), the DFB semiconductor laser element 202 is controlled so that only the seed light S2 enters the fiber optical amplifier 216. In this manner, whether or not to irradiate the substrate FS with the light flux LBn is determined based on the pixel data (high/low) of the pattern data (H or L of the drawing bit string data Sdw). In this case, the polarization states of the seed lights S1 and S2 may be both P-polarized.

As described above, in the present modification, the number of acoustic-optical modulation elements can be reduced, and the cost can be reduced.

The light source devices 14A and 14B according to this modification may be used for the light source devices 14A and 14B according to embodiment 1. In this case, the output timing of the seed light S1 from the DFB semiconductor laser device 200 output from the light source devices 14A and 14B and the switching of the drawing optical element 106 of each of the scanning units U1 to U6 can be controlled according to the pattern data (drawing bit string data Sdw).

[ embodiment 3 ]

Next, embodiment 3 will be described with reference to fig. 18, and it is assumed that the light source device 14A (see fig. 17) and 14B described in the modification of embodiment 2 are used in embodiment 3. However, in order to be suitable for embodiment 3, the clock generator 222a in the control circuit 222 of the light source device 14A shown in fig. 17 has a function of locally (discretely) extending and contracting the time interval of the clock signal LTC based on the magnification correction information CMg from the control unit (control circuit 500) for drawing control shown in fig. 18. Similarly, the clock generator 222a in the control circuit 222 of the light source device 14B also has a function of locally (discretely) extending and contracting the time interval of the clock signal LTC based on the magnification correction information CMg. Note that the operations of the light source device 14B, the light introduction optical system 40B, and the scanning units U2, U4, and U6 are the same as those of the light source device 14A, the light introduction optical system 40a, and the scanning units U1, U3, and U5, and therefore, the operations of the light source device 14B, the light introduction optical system 40B, and the scanning units U2, U4, and U6 are not described. The same components as those in the modification example of embodiment 2 are denoted by the same reference numerals or omitted from illustration, and only different portions will be described.

In fig. 18, the light beam (laser beam) LB from one light source device 14A is supplied to three scanning units U1, U3, and U5 via the selection optical elements 50, 58, and 66, respectively, in the same manner as in the configuration of fig. 12 and 13. The optical elements 50, 58, and 66 for selection selectively deflect (switch) the light beam LB in response to the rendering enable (On) signals SPP1, SPP3, and SPP5 described in fig. 14 and 15, respectively, and guide the light beam LB to any one of the scanning units U1, U3, and U5. As described above, in the period (non-projection period) in which pattern drawing is not performed along each drawing line, the light beam LB from the seed light S2 in the ultraviolet region continues to be emitted with a minute intensity, and the movable shutter SST is provided in the emission window of the light beam LB of the light source device 14A in consideration of a situation in which each drawing line is irradiated to the same position on the substrate FS for a long time.

As shown in fig. 14, the origin signals SZ1, SZ3, SZ5 from the origin sensors OP1, OP3, OP5 of the respective scanning units U1, U3, U5 are supplied to the generation circuits (pattern data generation circuits) 301, 303, 305 that generate pattern data of each of the scanning units U1, U3, U5. The generation circuit 301 includes a gate GT1, a memory BM1, a counter CN1, and the like in fig. 16, and the counter CN1 is configured to count a clock signal CLK1 generated with a fundamental frequency of a clock signal LTC output from the control circuit 222 (clock generator 222a) of the light source device 14A.

Similarly, the generation circuit 303 includes a gate GT3, a memory BM3, a counter CN3, and the like in fig. 16, the counter CN3 is configured to count a clock signal CLK3 generated with the clock signal LTC as a fundamental frequency, the generation circuit 305 includes a gate GT5, a memory BM5, a counter CN5, and the like in fig. 16, and the counter CN5 is configured to count a clock signal CLK5 generated with the clock signal LTC as a fundamental frequency.

These clock signals CLK1, CLK3, and CLK5 are generated by dividing the clock signal LTC by 1/n (n is an integer equal to or greater than 2) by the control circuit 500 functioning as an interface between the generation circuits 301, 303, and 305 and the light source device 14A. The supply of the clock signals CLK1, CLK3, and CLK5 to the counter units CN1, CN3, and CN5 is limited to any one of the above in response to the drawing enable (On) signals SPP1, SPP3, and SPP5 (see fig. 15). That is, when the drawing enable signal SPP1 is On (high), only the clock signal CLK1 obtained by dividing the clock signal LTC by 1/n is supplied to the counter unit CN1, when the drawing enable signal SPP3 is On (high), only the clock signal CLK3 obtained by dividing the clock signal LTC by 1/n is supplied to the counter unit CN3, and when the drawing enable signal SPP5 is On (high), only the clock signal CLK5 obtained by dividing the clock signal LTC by 1/n is supplied to the counter unit CN 5.

Thus, the serial data DL1, DL3, and DL5 sequentially output from each of the generating circuits 301, 303, and 305 are added by a three-input OR circuit GT8 (see fig. 16) provided in the control circuit 500 via gates GT1, GT3, and GT5, respectively, to become drawing bit string data Sdw, and are supplied to the electro-optical element 206 in the light source device 14A. The generation circuits 301, 303, and 305 and the control circuit 500 form a part of the control device 18.

The above configuration is basically the same as the method of using the light source device 14A described with reference to fig. 17, but in the present embodiment, a function of individually fine-adjusting the drawing magnification in the dot scanning direction (Y direction) of the pattern drawn by the drawing lines (scanning lines) SL1, SL3, and SL5 of the three scanning units U1, U3, and U5, respectively, is provided. In order to realize this function, in the present embodiment, memory units BM1a, BM3a, BM5a that temporarily store information mg1, mg3, mg5 on the correction amount of the drawing magnification are provided for each of the scan cells U1, U3, U5. Although the memory portions BM1a, BM3a, BM5a are shown as independent portions in fig. 18, the memory portions BM1, BM3, BM5 provided in the generating circuits 301, 303, 305 may be part of each other. The information mg1, mg3, and mg5 relating to the correction amount also constitute a part of the drawing information.

The information mg1, mg3, and mg5 regarding the correction amount correspond to, for example, the ratio (ppm) at which the size in the Y direction of the pattern drawn by the drawing lines SL1, SL3, and SL5 expands and contracts at a certain ratio. For example, when the length of the region in the Y direction that can be drawn by each of the drawing lines SL1, SL3, and SL5 is 30mm, if the information is to be expanded or contracted by ± 200ppm (corresponding to ± 6 μm), a value of ± 200 is set in the information mg1, mg3, and mg 5. The information mg1, mg3, and mg5 may be set by a direct expansion/contraction amount (± ρ μm) without a ratio. The information mg1, mg3, and mg5 may be reset sequentially for each piece of pattern data (serial data DLn) corresponding to one line along each of the drawing lines SL1, SL3, and SL5, or may be reset for each piece of pattern data (serial data DLn) corresponding to a plurality of lines. As described above, in the present embodiment, while the substrate FS is being transported in the X direction (longitudinal direction), pattern drawing is performed along each of the drawing lines SL1, SL3, and SL5, the drawing magnification in the Y direction can be dynamically changed, and when deformation and in-plane distortion of the substrate FS are known, deterioration in the drawing position accuracy due to the change can be suppressed. In addition, the method can deal with the deformation of the formed bottom layer pattern during the superposition exposure, thereby greatly improving the superposition precision.

Fig. 19 is a timing chart showing signal states of respective portions and an oscillation state of the light beam LB in the drawing device shown in fig. 18 typically when drawing a standard pattern by the scanning unit U1. In fig. 19, a two-dimensional matrix Gm shows a bit pattern PP of pattern data to be drawn, and one grid (1 pixel) unit) on a substrate FS is set such that, for example, a dimension Py in the Y direction is 3 μm and a dimension Px in the X direction is 3 μm. In fig. 19, SL1-1, SL1-2, SL1-3, and · SL1-6 shown by arrows indicate drawn lines drawn in sequence by the drawing line SL1 in accordance with the movement of the substrate FS in the X direction (sub-scanning in the longitudinal direction), and the conveyance speed of the substrate FS is set so that the interval in the X direction of each of the drawn lines SL1-1, SL1-2, SL1-3, · · · · · SL · and SL1-6 becomes 1/2 of the size Px (3 μm) of 1 pixel unit, for example.

Then, the size (spot size) in the XY direction of the spot light SP to be projected onto the substrate FS

) To the same extent as 1 pixel unitOr slightly larger than it. Thereby, the size of the spot light SP

Diameter as effective (1/e of Gaussian distribution)²Width of (b) or full width at half maximum of peak intensity) of the spot light SP is set to about 3 to 4 μm, and when the spot light SP is continuously projected along the drawing line SL1, the oscillation frequency Fs (pulse time interval) of the light beam LB and the scanning speed Vs of the spot light SP by the polygon mirror PM are set so as to overlap with, for example, 1/2 of the effective diameter of the spot light SP. That is, when the seed light emitted from the polarization beam splitter 208 in the light source device 14A shown in fig. 17 is used as the light beam Lse (fig. 18), the seed light is emitted as shown in fig. 19 in response to each clock pulse of the clock signal LTC output from the control circuit 222 (clock generator 222 a).

The clock signal LTC and the clock signal CLK1 supplied to the counter unit CN1 in the generating circuit 301 in fig. 18 are set to 1: a frequency ratio of 2, when the clock signal LTC is 100MHz, the clock signal CLK1 is set to 50MHz by the 1/2 frequency divider of the control circuit 500 in fig. 18. The frequency ratio between the clock signal LTC and the clock signal CLK1 may be an integral multiple, and may be set such that, for example, the set frequency of the clock signal CLK1 is reduced to 1/4 to 25MHz, and the scanning speed Vs of the spot light SP is also reduced to half.

The drawing bit string data Sdw shown in fig. 19 corresponds to the serial data DL1 output from the generating circuit 301, and here corresponds to a pattern on the drawing line SL1-2 of the pattern PP, for example. Since the electro-optical element 206 in the light source device 14A switches the polarization state in response to the drawing bit string data Sdw, the seed light beam Lse is generated by the seed light S1 from the DFB semiconductor laser device 200 in fig. 17 while the drawing bit string data Sdw is in the On state (high, "1"), and is generated by the seed light S2 from the DFB semiconductor laser device 202 in fig. 17 while the drawing bit string data Sdw is in the Off state (low, "0"). The above-described drawing exposure operation of the scan cell U1 shown in fig. 19 is the same for the other scan cells U2 to U6.

In addition, when a driver circuit (which generates seed light S1 (pulsed light that rapidly rises and falls) from the DFB semiconductor laser element 200 in response to a clock signal LTC while bit string data Sdw is drawn in an On state (high, "1") and generates seed light S2 (broad pulsed light) from the DFB semiconductor laser element 202 in response to the clock signal LTC while bit string data Sdw is drawn in an Off state (low, "0") is provided in the control circuit 222 of the light source device 14A, the electro-optical element 206 shown in fig. 17 and 18, the polarization beam splitter 208 shown in fig. 17, and the absorber 210 can be omitted.

As described above, since each pulse light of the seed light beam Lse is output in response to each clock pulse of the clock signal LTC generated by the clock generator 222a shown in fig. 17, in the present embodiment, a circuit configuration for locally increasing or decreasing the time (period) between pulses of the clock signal LTC is provided in the clock generator 222 a. In this circuit configuration, a reference (standard) clock generator, a frequency division counter circuit, a variable delay circuit, and the like are provided as sources of the clock signal LTC.

Fig. 20 is a timing chart showing a relationship between the clock signal LTC and the reference clock signal TC0 from the reference clock generator in the clock generator 222a, and shows a state where correction based on the magnification correction information CMg shown in fig. 17 and 18 is not performed. The variable delay circuit in the clock generator 222a always delays the reference clock signal TC0 generated at the fixed frequency Fs (fixed time Td0) by the delay time DT0 corresponding to the preset value, and outputs it as the clock signal LTC. Therefore, for example, if the reference clock signal TC0 is 100MHz (Td0 ═ 10nS), the clock signal LTC is continuously generated at 100MHz (Td0 ═ 10nS) as long as the preset value (delay time DT0) does not change.

Therefore, the following structure is provided: the reference clock signal TC0 is counted by a frequency division counter circuit in the clock generator 222a, and the preset value set for the variable delay circuit is changed by a fixed amount after the counted value reaches a predetermined value Nv. This situation is illustrated by the timing chart of fig. 21. In fig. 21, the preset value set to the variable delay circuit before the reference clock signal TC0 is counted to Nv by the division counter circuit is the delay time DT 0. After that, when the frequency division counter circuit counts Nv by one clock pulse Kn of the reference clock signal TC0, the preset value set for the variable delay circuit is immediately changed to the delay time DT 1. Therefore, each clock pulse (K' n +1 and thereafter) of the clock signal LTC generated based on the clock pulse Kn +1 and thereafter generated next to the clock pulse Kn of the reference clock signal TC0 is uniformly generated with the delay time DT 1.

Thus, the time interval Td1 is changed only when the preset value set for the variable delay circuit is changed by a certain amount, that is, only between the clock pulse K 'n and the clock pulse K' n +1 of the clock signal LTC, and the time interval of the clock pulse of the subsequent clock signal LTC becomes Td 0. In fig. 21, the delay time DT1 is increased as compared with the delay time DT0, and the time between two clock pulses of the clock signal LTC is increased as compared with Td 0. The frequency division counter circuit counts the reference clock signal TC0 to Nv, returns to zero, and starts counting up to Nv again.

When the initial value of the preset value set for the variable delay circuit is set as the delay time DT0, the variation amount of the delay time is set as ± Δ Dh, the number of times the frequency division counter circuit is reset to zero is set as Nz, and the delay times of the preset values sequentially set for the variable delay circuit every time the frequency division counter circuit counts up to Nv (every time it is reset to zero) are set as DTm, the delay time DTm is set to a relationship of DT0+ Nz · (±. Δ Dh). Therefore, as shown in fig. 21, the delay time DT1 set during the period in which the number Nz of zero resetting is 1(m is 1) is DTm DT1 DT0 ± Δ Dh, and the delay time DT2 set after the next zero resetting (Nz is 2, m is 2) occurs is DTm DT2 DT0+2 (± Δ Dh). Therefore, the variation ± Δ Dh of the delay time corresponds to a difference of the time Td1 between the clock pulse K 'n and the clock pulse K' n +1 of the clock signal LTC with respect to the reference time Td 0.

As described above, the operation of changing the time interval between two specific clock pulses of the clock signal LTC is discretely performed at a plurality of positions over the entire length of one trace line (SL1 to SL6) based on the predetermined value Nv set to the frequency division counter circuit. Fig. 22 shows this situation. Fig. 22 shows, as correction points CPP, a plurality of positions that are reset to zero each time the count value of the frequency-division counter circuit reaches a predetermined value Nv over the entire length of a drawing line SL 1. At each of the correction points CPP, only specific two clock pulses of the clock signal LTC are stretched by ± Δ Dh with respect to the time Td 0.

Therefore, assuming that the reference clock signal TC0 is 100MHz (Td0 is 10nS), the effective size of the spot light SP in the main scanning direction is 3 μm, the length of the drawing line SL1 (the same applies to SL2 to SL 6) is 30mm, and the spot light SP projected onto the substrate FS by two continuous pulse lights of the light beam LB is drawn while being overlapped by about half (1.5 μm) in the main scanning direction, the number of clocks of the reference clock signal TC0 generated within the length range of the drawing line SL1 becomes 20000. The delay time variation Δ Dh is sufficiently small relative to the reference time interval Td0, and is set to about 2%, for example. Under this condition, when the pattern drawn along the drawing line SL1 was extended and contracted by 150ppm in the main scanning direction (Y direction), 150ppm of the drawing line SL1 having a length of 30mm corresponded to 4.5 μm. Information on the ratio of drawing magnifications of 150ppm or the actual size of 4.5 μm is stored as information mg1 in the memory portion BM1a in fig. 18.

Therefore, the number of correction points CPP (fig. 22) extending and retracting by a time Δ Dh with respect to the time Td0 in 20000 clock pulse trains of the clock signal LTC is 4.5 μm/(1.5 μm × 2%) equal to 150, and the maximum predetermined value Nv set in the frequency division counter circuit shown in fig. 22 is 20000/150 and approximately 133.

When the delay time variation Δ Dh is set to 5%, the number of correction points CPP is 4.5 μm/(1.5 μm × 5%) to 60, and the maximum predetermined value Nv set in the frequency divider counter circuit is 20000/60 and about 333. Since the delay time variation Δ Dh is less than 10% and small in this manner, even if a pattern to be drawn exists at the correction point CPP, the size of the pattern is larger than that of the spot light SP, and therefore, a drawing error caused by a slight displacement of the spot light SP in the main scanning direction at the correction point CPP can be ignored.

The above-described amount of change Δ Dh in delay time, the number of correction points CPP, the setting of the predetermined value Nv of the frequency divider counter circuit, and the like are calculated in the control circuit 222 shown in fig. 17 based on the magnification correction information cmg (ppm) output from the control circuit 500 shown in fig. 18, and the frequency divider counter circuit, the variable delay circuit, and the like in the clock generator 222a are set.

According to the above embodiment, the light beam LB from the light source device 14A can be sequentially supplied to, for example, each of the three scanning units U1, U3, and U5 in a time-division manner, and the drawing operation along the drawing lines SL1, SL3, and SL5 of the respective scanning units U1, U3, and U5 can be individually performed in sequence, so that the information mg1, mg3, and mg5 relating to the correction amount of the drawing magnification can be set for each of the scanning units U1, U3, and U5, as shown in fig. 18. Accordingly, even if the expansion and contraction in the Y direction of the substrate FS are different and the expansion and contraction ratios of the plurality of regions divided in the Y direction are different, the correction amount of the optimum drawing magnification can be set for each scanning unit Un so as to correspond to the expansion and contraction in the Y direction, and an advantage that the nonlinear deformation of the substrate FS can be also dealt with can be obtained.

As described above, the light source device 14A, which is connected to a device for drawing a pattern by scanning a spot light SP focused on an irradiation object (substrate FS) and emits a light beam (laser light) LB serving as the spot light SP, is provided with, as shown in fig. 17 and 18: a 1 st semiconductor laser light source (200) that generates a 1 st pulse light (seed light S1) having a short emission time and a high peak intensity, and that rapidly rises and falls in response to a clock pulse (clock signal LTC) of a predetermined period (Td 0); a 2 nd semiconductor laser light source (202) that generates a 2 nd pulse light (seed light S2) having a light emission time shorter than a predetermined period, longer than the light emission time of the 1 st pulse light (seed light S1), and having a low peak intensity in response to a clock pulse; a fiber optical amplifier (216) on which the 1 st pulse light (seed light S1) or the 2 nd pulse light (seed light S2) is incident; and a switching device for switching, based on information (drawing bit string data Sdw) of a pattern to be drawn, the 1 st pulse light (seed light S1) to be incident on the optical fiber optical amplifier when drawing the point light SP projected on the irradiation object, and the 2 nd pulse light (seed light S2) to be incident on the optical fiber optical amplifier (216) when non-drawing the point light SP not projected on the irradiation object. The switching device is configured by an electro-optical element (206) which selects either one of the 1 st pulse light (seed light S1) and the 2 nd pulse light (seed light S2) based on pattern information to be drawn, or a circuit which controls the driving of the 1 st semiconductor laser light source (200) and the 2 nd semiconductor laser light source (202) based on the pattern information to be drawn so as to generate either one of the 1 st pulse light (seed light S1) and the 2 nd pulse light (seed light S2).

Embodiment 3 can be applied to embodiment 1, a modification thereof, or embodiment 2. That is, the function of the clock generator 222a in the control circuit 222 of the light source device 14A described in embodiment 3 to locally (discretely) expand and contract the time interval of the clock signal LTC based on the magnification correction information CMg from the control unit (control circuit 500) for drawing control shown in fig. 18 can be applied to the light source device 14 of embodiment 1 or its modified example, and the light source device 14 of embodiment 2. In this case, the light source device 14 may not include the DFB semiconductor laser element 202, the polarization beam splitter 204, the electro-optical element 206, the polarization beam splitter 208, and the absorber 210, that is, the light source device 14 may amplify the pulse-shaped seed light S1 emitted from the DFB semiconductor laser element 200 by the fiber optical amplifier 216 and emit the amplified seed light as the light beam LB. In this case, since the light source device 14 does not include the electro-optical element 206, the serial data DL1, DL3, and DL5 generated by the generation circuits 301, 303, and 305 are transmitted to the drawing optical element 106 or the drawing optical element 150 of the scan unit Un.

[ 4 th embodiment ]

Fig. 23 is a diagram showing a schematic configuration of a device manufacturing system 10 including an exposure apparatus EX for performing an exposure process on a substrate (irradiation target) FS according to embodiment 4. Note that, unless otherwise specified, the same components as those in embodiments 1 to 3 (including modified examples) are given the same reference numerals or omitted from illustration, and only different portions thereof will be described.

In embodiment 4, as in embodiments 1 to 3 (including the modifications), the exposure apparatus EX as the light beam scanning apparatus is an exposure apparatus of a direct drawing system, i.e., a so-called raster scanning system, which does not use a mask. The exposure apparatus EX includes a light flux switching member 20 and an exposure head 22 instead of the drawing head 16 described in embodiments 1 to 3 (including the modifications). The exposure apparatus EX further includes a plurality of alignment microscopes AMm (AM1 to AM 4). Although not particularly described in embodiments 1 to 3 (including modifications), the exposure apparatus EX according to embodiments 1 to 3 also includes a plurality of alignment microscopes AMm (AM1 to AM 4). The exposure apparatus EX according to embodiment 4 is naturally provided with the substrate conveyance mechanism 12, the light source device 14', and the control device 18. The light source device 14' according to embodiment 4 is premised on the same configuration (see fig. 17) as the light source device 14 ( light source devices 14A and 14B) described in the modification of embodiment 2. The light beam LB emitted from the light source device 14' is incident on the exposure head 22 via the light beam switching member 20.

The light beam switching member 20 switches the optical path of the light beam LB so that the light beam LB from the light source device 14' is incident on one of the plurality of scanning units Un (U1 to U6) constituting the exposure head 22, which performs one-dimensional scanning of the spot light SP. The beam switching section 20 will be described in detail later.

The exposure head 22 includes a plurality of scanning units Un (U1 to U6) into which the light beam LB is incident, respectively. The exposure head 22 draws a pattern on a part of the substrate FS supported by the circumferential surface of the rotary drum DR by the plurality of scanning units Un (U1 to U6). The exposure head 22 is a so-called multi-beam type exposure head in which a plurality of scanning units Un (U1 to U6) having the same configuration are arranged. As shown in fig. 23, the odd-numbered scan units U1, U3, and U5 are arranged upstream (on the (-X direction side) in the conveyance direction of the substrate FS with respect to the center plane Poc and along the Y direction. The even-numbered scan units U2, U4, and U6 are disposed on the downstream side (+ X direction side) of the conveyance direction of the substrate FS with respect to the center plane Poc and are disposed along the Y direction. The odd-numbered scan cells U1, U3, U5 and the even-numbered scan cells U2, U4, U6 are disposed symmetrically about the center plane Poc. That is, in embodiment 4, the arrangement of the odd-numbered scan cells U1, U3, and U5 and the even-numbered scan cells U2, U4, and U6 is reverse to that described in embodiments 1 to 3 (including the modified examples).

The scanning unit Un projects the light beam LB from the light source device 14' so as to converge to the spot light SP on the irradiated surface of the substrate FS, and the spot light SP is one-dimensionally scanned along a predetermined straight drawing line (scanning line) SLn on the irradiated surface of the substrate FS by a rotating polygon mirror PM (see fig. 28).

The plurality of scanning units Un (U1 to U6) are arranged in a predetermined arrangement relationship. In embodiment 4, the plurality of scan cells Un (U1 to U6) are arranged such that the drawing lines SLn (SL1 to SL6) of the plurality of scan cells Un (U1 to U6) are joined without being separated from each other in the Y direction (the width direction of the substrate FS, the main scanning direction) as shown in fig. 24 and 25. Further, as described in embodiments 1 to 3 (modifications), the light beam LB incident on each scanning unit Un (U1 to U6) may be represented as LB1 to LB6, respectively. The light beam LB incident on the scanning unit Un is a linearly polarized (P-polarized or S-polarized) light beam polarized in a predetermined direction, and in embodiment 4, is a P-polarized light beam. In addition, the light beams LB1 to LB6 incident on the six scanning units U1 to U6 may be represented as light beams LBn.

As shown in fig. 25, the scanning area is shared by the scanning units Un (U1 to U6) such that the entire range of the exposure area W in the width direction is covered by all of the scanning units Un (U1 to U6). Thus, each of the scanning units Un (U1 to U6) can draw a pattern for each of a plurality of regions divided in the width direction of the substrate FS. For example, if the Y-direction scanning length (the length of the drawing line SLn) achieved by one scanning unit Un is about 30 to 60mm, the Y-direction width that can be drawn is extended to about 180 to 360mm by arranging three scanning units, i.e., the odd-numbered scanning units U1, U3, and U5, three scanning units, i.e., the even-numbered scanning units U2, U4, and U6, and six scanning units Un in total in the Y direction. The lengths (scanning length and scanning width in the main scanning direction) of the respective scanning lines SL1 to SL6 are basically the same.

As described above, each of the actually scanned lines SLn (SL1 to SL6) is set to be slightly shorter than the maximum length that the spot light SP can actually scan on the irradiation surface. By setting in this manner, the position of the drawing line SLn (for example, the scanning length is 30mm) in the main scanning direction can be finely adjusted or the drawing magnification can be finely adjusted within the range of the maximum scanning length (for example, 31mm) of the spot light SP. The maximum scanning length of the spot light SP is mainly determined by the aperture of an f θ lens FT (refer to fig. 28) provided behind a polygon mirror (rotating polygon mirror) PM within the scanning unit Un.

The plurality of drawing lines SLn (SL1 to SL6) are arranged in two rows in the circumferential direction of the rotary drum DR with the center plane Poc therebetween. The odd-numbered drawing lines SL1, SL3, and SL5 are located on the irradiated surface of the substrate FS on the upstream side (the (-X direction side) in the conveyance direction of the substrate FS with respect to the central plane Poc. The even drawing lines SL2, SL4, and SL6 are located on the irradiated surface of the substrate FS on the downstream side (+ X direction side) in the conveyance direction of the substrate FS with respect to the center plane Poc. The drawing lines SL1 to SL6 are substantially parallel to the width direction of the substrate FS, i.e., the central axis AXo of the rotary drum DR.

The scanning lines SL1, SL3, and SL5 are arranged on a straight line with a predetermined interval in the width direction (scanning direction) of the substrate FS. Similarly, the scanning lines SL2, SL4, and SL6 are arranged on a straight line at predetermined intervals along the width direction (scanning direction) of the substrate FS. The scanning direction of the spot light SP of the light beam LBn scanned along each of the odd-numbered drawing lines SL1, SL3, and SL5 is a one-dimensional direction and is the-Y direction. The scanning direction of the spot light SP of the light beam LBn scanned along each of the even drawing lines SL2, SL4, and SL6 is the one-dimensional direction and the + Y direction.

In embodiment 4, the plurality of scanning units Un (U1 to U6) repeatedly scan the spot light SP of the light beam LBn in a predetermined order (predetermined order). For example, in the case where the order of the scanning unit Un performing the scanning of the spot light SP is U1 → U2 → U3 → U4 → U5 → U6, first, the scanning unit U1 performs the scanning of the spot light SP once. When the scanning of the spot light SP by the scanning unit U1 is completed, the scanning unit U2 performs the scanning of the spot light SP once, and when the scanning is completed, the scanning unit U3 performs the scanning of the spot light SP once, and in this way, the plurality of scanning units Un (U1 to U6) perform the scanning of the spot light SP once in a predetermined order. Further, when the scanning of the spot light SP by the scanning unit U6 ends, the scanning of the spot light SP by the scanning unit U1 is returned. In this manner, the plurality of scanning units Un (U1 to U6) repeatedly scan the spot light SP in a predetermined order.

Each of the scanning units Un (U1 to U6) irradiates each of the beams LBn toward the substrate FS such that each of the beams LBn travels toward the central axis AXo of the rotary drum DR in at least the XZ plane. Thus, the optical path (beam center axis) of the light beam LBn traveling from each scanning unit Un (U1 to U6) toward the substrate FS is coaxial (parallel) with the normal line of the irradiated surface of the substrate FS in the XZ plane. Further, each of the scanning units Un (U1 to U6) irradiates the light beam LBn toward the substrate FS so that the light beam LBn irradiated to the drawing lines SLn (SL1 to SL6) is perpendicular to the irradiated surface of the substrate FS in a plane parallel to the YZ plane. That is, the light beam LBn (LB1 to LB6) projected onto the substrate FS is scanned in a telecentric state with respect to the main scanning direction of the spot light SP on the irradiated surface. Here, a line (or also referred to as an optical axis) passing through the midpoint of each of the drawing lines SLn (SL1 to SL6) defined by the scanning units Un (U1 to U6) and perpendicular to the surface to be irradiated of the substrate FS is referred to as an irradiation central axis Len (Le1 to Le6) (see fig. 24).

The irradiation central axes Len (Le1 to Le6) are lines connecting the drawing lines SL1 to SL6 and the central axis AXo in the XZ plane. The irradiation central axes Le1, Le3, Le5 of the odd-numbered scanning units U1, U3, U5 are the same direction in the XZ plane, and the irradiation central axes Le2, Le4, Le6 of the even-numbered scanning units U2, U4, U6 are the same direction in the XZ plane. The irradiation center axes Le1, Le3, Le5 and the irradiation center axes Le2, Le4, Le6 are set to have an angle ± θ with respect to the center plane Poc in the XZ plane (see fig. 23).

As shown in fig. 25, the alignment microscope AMm (AM1 to AM4) shown in fig. 23 is provided in plural numbers (four in embodiment 4) along the Y direction for detecting alignment marks MKm (MK1 to MK4) formed on the substrate FS. The alignment marks MKm (MK1 to MK4) are reference marks for aligning (aligning) a predetermined pattern to be drawn on the exposure field W on the irradiated surface of the substrate FS with respect to the substrate FS. The alignment microscope AMm (AM1 to AM4) detects alignment marks MKm (MK1 to MK4) on the substrate FS supported by the circumferential surface of the rotating cylinder DR. The alignment microscopes AMm (AM1 to AM4) are provided upstream (on the X direction side) in the substrate FS conveyance direction from the irradiation region (the region surrounded by the drawing lines SL1 to SL 6) formed on the substrate FS by the spot light SP of the light beam LBn (LB1 to LB6) from the exposure head 22.

The alignment microscope AMm (AM1 to AM4) has: a light source for projecting illumination light for alignment toward the substrate FS, an observation optical system (including an objective lens) for obtaining an enlarged image of a local region (observation region) including the alignment mark MKm (MK1 to MK4) on the surface of the substrate FS, and an image pickup device such as a CCD or a CMOS for picking up an image of the enlarged image with a high-speed shutter while the substrate FS is moving in the conveyance direction. The imaging signals (image data) ig (ig1 to ig4) obtained by the imaging by the alignment microscopes AMm (AM1 to AM4) are transmitted to the control device 18. The controller 18 detects the positions of the alignment marks MKm (MK1 to MK4) based on the image analysis of the imaging signals ig (ig1 to ig4) and the information of the rotational position of the rotary drum DR at the moment of imaging (based on the measurement values obtained by the encoders EN1a and EN1b of the scale reading unit SD shown in fig. 24), thereby detecting the position of the substrate FS with high accuracy. The alignment illumination light is light in a wavelength band having little sensitivity to the photosensitive functional layer on the substrate FS, and has a wavelength of about 500 to 800nm, for example.

Alignment marks MK 1-MK 4 are provided around each exposure field W. The alignment marks MK1, MK4 are formed at a constant interval DI on both sides of the exposure field W in the width direction of the substrate FS along the longitudinal direction of the substrate FS. Alignment mark MK1 is formed on the-Y direction side in the width direction of substrate FS, and alignment mark MK4 is formed on the + Y direction side in the width direction of substrate FS. The alignment marks MK1 and MK4 are arranged so as to be located at the same position in the longitudinal direction (X direction) of the substrate FS in a state where the substrate FS is not deformed by a large tension or thermal process. Alignment marks MK2 and MK3 are formed between alignment mark MK1 and alignment mark MK4, and the margin portions on the + X direction side and the-X direction side of exposure field W are formed along the width direction (short side direction) of substrate FS. Alignment marks MK2, MK3 are formed between exposure area W and exposure area W. Alignment mark MK2 is formed on the-Y direction side in the width direction of substrate FS, and alignment mark MK3 is formed on the + Y direction side of substrate FS.

Further, the distance between the alignment mark MK1 arranged at the side end in the-Y direction of the substrate FS and the alignment mark MK2 of the margin portion in the Y direction, the distance between the alignment mark MK2 of the margin portion and the alignment mark MK3 in the Y direction, and the distance between the alignment mark MK4 arranged at the side end in the + Y direction of the substrate FS and the alignment mark MK3 of the margin portion in the Y direction are set to be the same. These alignment marks MKm (MK1 to MK4) may be formed together at the time of formation of the pattern layer of the layer 1. For example, when the pattern of the 1 st layer is exposed, the pattern for the alignment mark may be exposed together with the periphery of the exposure area W of the pattern to be exposed. In addition, the alignment mark MKm may also be formed in the exposure area W. For example, it may be formed along the contour of the exposure area W within the exposure area W. In addition, when the alignment mark MKm is formed in the exposure area W, a pattern portion at a specific position or a portion having a specific shape in the pattern of the electronic device formed in the exposure area W may be used as the alignment mark MKm.

The alignment microscope AM1 is arranged to take an image of the alignment mark MK1 present in the observation region (detection region) Vw1 of the objective lens. Similarly, the alignment microscopes AM2 to AM4 are arranged to capture images of alignment marks MK2 to MK4 existing in observation regions Vw2 to Vw4 of the objective lens. Therefore, the alignment microscopes AM1 to AM4 are provided in the order of the alignment microscopes AM1 to AM4 from the-Y direction side of the substrate FS in accordance with the positions of the alignment marks MK1 to MK 4. The alignment microscopes AMm (AM1 to AM4) are arranged such that the distance in the X direction between the exposure position (the drawing lines SL1 to SL6) and the observation region Vw (Vw1 to Vw4) of the alignment microscope AMm is shorter than the length of the exposure region W in the X direction. The number of the alignment microscopes AMm provided in the Y direction can be changed according to the number of the alignment marks MKm formed in the width direction of the substrate FS. The size of the observation regions Vw1 to Vw4 on the irradiated surface of the substrate FS is set to a size of about 100 to 500 μm square, depending on the size and/or alignment accuracy (position measurement accuracy) of the alignment marks MK1 to MK 4. Although not specifically described in embodiments 1 to 3 (including modifications), a plurality of alignment marks MKm are also formed on the substrate FS used in embodiments 1 to 3.

As shown in fig. 24, at both ends of the rotary drum DR, scale portions SD (SDa, SDb) having scale marks formed in a ring shape over the entire circumferential range of the outer circumferential surface of the rotary drum DR are provided. The scale portions SD (SDa, SDb) are incremental scales formed by diffraction gratings in which concave or convex grid lines are engraved at a constant pitch (for example, 20 μm) in the circumferential direction of the outer peripheral surface of the rotary drum DR. The scale portion SD (SDa, SDb) rotates around the central axis AXo integrally with the rotary drum DR. Further, a plurality of encoders (scale reading heads) ENn are provided so as to face the scale portions SD (SDa, SDb). The encoder ENn optically detects the rotational position of the rotary drum DR. Three encoders ENn (EN1a, EN2a, EN3a) are provided opposite to the scale portion SDa provided at the end of the rotary drum DR on the-Y direction side. Similarly, three encoders ENn (EN1b, EN2b, and EN3b) are provided to face the scale portion SDb provided at the end of the rotary drum DR on the + Y direction side. Although not particularly described in embodiments 1 to 3 (including modifications), scale portions SD (SDa, SDb) are provided at both ends of the rotary drum DR in embodiments 1 to 3, and a plurality of encoders En (En1a to En3a, En1b to En3b) are provided so as to face the scale portions SD.

The encoder ENn (EN1a to EN3a, EN1b to EN3b) projects the measuring light beam toward the scale unit SD (SDa, SDb), and outputs a detection signal as a pulse signal to the controller 18 by photoelectrically detecting the reflected light beam (diffracted light). The controller 18 counts the detection signals (pulse signals) by the counter circuit 356a (see fig. 33), thereby measuring the rotation angle position and the angle change of the rotary drum DR with a submicron resolution. The counter circuit 356a counts the detection signals of the encoders ENn (EN1a to EN3a, EN1b to EN3b) individually. The controller 18 can also measure the conveyance speed of the substrate FS from the change in the angle of the rotary drum DR. The counter circuit 356a that individually counts the detection signals of the encoders ENn (EN1a to EN3a, EN1b to EN3b) resets the count value corresponding to the encoders ENn to 0 when the encoders ENn (EN1a to EN3a, EN1b to EN3b) detect the origin marks (origin patterns) ZZ formed in the circumferential portions of the scale portions SDa and SDb.

Encoders EN1a and EN1b are disposed on set azimuth line Lx 1. The set azimuth line Lx1 is a line connecting the projection position (reading position) of the light beams for measurement by the encoders EN1a and EN1b onto the scale portions SD (SDa and SDb) and the central axis AXo in the XZ plane. The azimuth line Lx1 is a line connecting the observation region Vw (Vw1 to Vw4) of each alignment microscope AMm (AM1 to AM4) and the central axis AXo in the XZ plane.

The encoders EN2a, EN2b are provided upstream (on the (-X direction side) in the conveyance direction of the substrate FS with respect to the center plane Poc, and are provided downstream (on the + X direction side) in the conveyance direction of the substrate FS than the encoders EN1a, EN1 b. Encoders EN2a and EN2b are disposed on set azimuth line Lx 2. The set azimuth line Lx2 is a line connecting the projection positions of the light beams for measurement by the encoders EN2a and EN2b on the scale portions SD (SDa and SDb) to the central axis AXo in the XZ plane. The installation direction line Lx2 overlaps the irradiation center axes Le1, Le3, Le5 at the same angular position in the XZ plane.

The encoders EN3a, EN3b are provided on the downstream side (+ X direction side) of the center plane Poc in the conveyance direction of the substrate FS. Encoders EN3a and EN3b are disposed on set azimuth line Lx 3. The set azimuth line Lx3 is a line connecting the projection positions of the light beams for measurement by the encoders EN3a and EN3b on the scale portions SD (SDa and SDb) to the central axis AXo in the XZ plane. The installation direction line Lx3 overlaps the irradiation center axes Le2, Le4, Le6 at the same angular position in the XZ plane.

The count values (rotational angle positions) of the detection signals from the encoders EN1a, EN1b, the count values (rotational angle positions) of the detection signals from the encoders EN2a, EN2b, and the count values (rotational angle positions) of the detection signals from the encoders EN3a, EN3b are reset to zero at the moment when the respective encoders EN detect the origin mark ZZ attached to one position in the rotational direction of the rotary drum DR. Therefore, when the position of the substrate FS wound around the rotary drum DR on the set azimuth line Lx1 (the positions of the observation regions Vw1 to Vw4 of the alignment microscopes AM1 to AM 4) is set to the 1 st position when the count value by the encoders EN1a, EN1b is the 1 st value (e.g., 100), the count value by the encoders EN2a, EN2b becomes the 1 st value (e.g., 100) when the 1 st position on the substrate FS is conveyed to the position on the set azimuth line Lx2 (the position of the drawn lines SL1, SL3, SL 5). Similarly, when the 1 st position on the substrate FS is conveyed to a position on the set orientation line Lx3 (position of the drawn lines SL2, SL4, and SL 6), the count value of the detection signal by the encoders EN3a and EN3b becomes the 1 st value (for example, 100).

However, the substrate FS is wound inside the scale portions SDa and SDb at both ends of the rotary drum DR. In fig. 23, the radius of the outer peripheral surface of the scale portion SD (SDa, SDb) from the central axis AXo is set smaller than the radius of the outer peripheral surface of the spin basket DR from the central axis AXo. However, as shown in fig. 24, the outer peripheral surface of the scale portion SD (SDa, SDb) may be flush with the outer peripheral surface of the substrate FS wound around the rotary drum DR. That is, the radius (distance) from the center axis AXo of the outer peripheral surface of the scale portion SD (SDa, SDb) may be set to be the same as the radius (distance) from the center axis AXo of the outer peripheral surface (irradiated surface) of the substrate FS wound around the rotary drum DR. Accordingly, the encoder ENn (EN1a, EN1b, EN2a, EN2b, EN3a, EN3b) can detect the scale portions SD (SDa, SDb) at the same radial position as the irradiated surface of the substrate FS wound around the rotary drum DR, and can reduce the abbe error caused by the difference between the measurement position of the encoder ENn and the processing position (drawn lines SL1 to SL6) in the radial direction of the rotary drum DR.

As described above, the controller 18 determines the start position of the drawing exposure of the exposure field W in the longitudinal direction (X direction) of the substrate FS based on the positions of the alignment marks MKm (MK1 to MK4) detected by the alignment microscopes AMm (AM1 to AM4) (based on the count values obtained by the encoders EN1a and EN1 b), and at this time, the count values obtained by the encoders EN1a and EN1b are set to the 1 st value (for example, 100). In this case, when the count value by the encoders EN2a, EN2b becomes the 1 st value (for example, 100), the start position of the drawing exposure of the exposure field W in the longitudinal direction of the substrate FS is located on the drawing lines SL1, SL3, SL 5. Accordingly, the scanning units U1, U3, U5 can start scanning of the spot light SP based on the count values of the encoders EN2a, EN2 b. When the count value by the encoders EN3a, EN3b becomes the 1 st value (for example, 100), the start position of the drawing exposure of the exposure field W in the longitudinal direction of the substrate FS is located on the drawing lines SL2, SL4, SL 6. Accordingly, the scanning units U2, U4, U6 can start scanning of the spot light SP based on the count values of the encoders EN3a, EN3 b. Although not particularly described in embodiments 1 to 3 (including modifications), the exposure apparatus EX according to embodiments 1 to 3 also includes an encoder ENn (EN1a to EN3a, EN1b to EN3b) and a scale portion SD (SDa, SDb).

Fig. 26 is a structural diagram of light flux switching member 20. The beam switching member 20 includes a plurality of optical elements AOMn for selection (AOM1 to AOM6), a plurality of condenser lenses CD1 to CD6, a plurality of reflection mirrors M1 to M12, a plurality of cell-side incident mirrors IM1 to IM6, a plurality of collimator lenses CL1 to CL6, and an absorber TR. The optical selection elements AOMn (AOM1 to AOM6) are Acousto-Optic modulators (AOM: Acousto-optical Modulator) that are transmissive to the light beam LB and driven by an ultrasonic signal. These optical components (selective optical elements AOM1 to AOM6, condenser lenses CD1 to CD6, mirrors M1 to M12, cell-side incident mirrors IM1 to IM6, collimator lenses CL1 to CL6, and absorbers TR) are supported by a plate-shaped support member IUB. The support member IUB supports these optical members from below (the side of the-Z direction) above the plurality of scanning units Un (U1 to U6). Therefore, the support member IUB also has a function of thermally insulating the optical element AOMn (AOM1 to AOM6) for selection, which is a heat generation source, from the plurality of scanning units Un (U1 to U6).

The light path of the light beam LB is bent in a zigzag shape from the light source device 14' by the mirrors M1 to M12, and the light beam LB is guided to the absorber TR. Hereinafter, the optical elements AOMn for selection (AOM1 to AOM6) are all in the Off state (state where no ultrasonic signal is applied). The light beam LB (parallel light beam) from the light source device 14' travels in the + Y direction parallel to the Y axis, passes through the condenser lens CD1, and enters the mirror M1. The light beam LB reflected to the-X direction side by the mirror M1 is linearly transmitted through the 1 st selective optical element AOM1 arranged at the focal position (beam waist position) of the condenser lens CD1, and is again made into a parallel light beam by the collimator lens CL1 to reach the mirror M2. The light beam LB reflected by the mirror M2 to the + Y direction side passes through the condenser lens CD2 and is reflected by the mirror M3 to the + X direction side.

The light beam LB reflected by the mirror M3 is linearly transmitted through the 2 nd selective optical element AOM2 arranged at the focal position (beam waist position) of the condenser lens CD2, and is again made into a parallel light beam by the collimator lens CL2 to reach the mirror M4. The light beam LB reflected by the mirror M4 to the + Y direction side passes through the condenser lens CD3 and is reflected by the mirror M5 to the-X direction side. The light beam LB reflected to the-X direction side by the mirror M5 is linearly transmitted from the 3 rd selective optical element AOM3 arranged at the focal position (beam waist position) of the condenser lens CD3, and is again made into a parallel light beam by the collimator lens CL3 to reach the mirror M6. The light beam LB reflected by the mirror M6 to the + Y direction side passes through the condenser lens CD4 and is reflected by the mirror M7 to the + X direction side.

The light beam LB reflected by the mirror M7 is linearly transmitted through the 4 th selective optical element AOM4 arranged at the focal position (beam waist position) of the condenser lens CD4, and is again made into a parallel light beam by the collimator lens CL4 to reach the mirror M8. The light beam LB reflected by the mirror M8 to the + Y direction side passes through the condenser lens CD5 and is reflected by the mirror M9 to the-X direction side. The light beam LB reflected to the-X direction side by the mirror M9 is linearly transmitted from the 5 th selective optical element AOM5 arranged at the focal position (beam waist position) of the condenser lens CD5, and is again made into a parallel light beam by the collimator lens CL5 to reach the mirror M10. The light beam LB reflected by the mirror M10 to the + Y direction side passes through the condenser lens CD6 and is reflected by the mirror M11 to the + X direction side. The light beam LB reflected by the mirror M11 is linearly transmitted through the 6 th selective optical element AOM6 arranged at the focal position (beam waist position) of the condenser lens CD6, is again made into a parallel beam by the collimator lens CL6, is reflected to the-Y direction side by the mirror M12, and reaches the absorber TR. The absorber TR is a light absorber that absorbs the light beam LB to suppress leakage of the light beam LB to the outside.

As described above, the selective optical elements AOM1 to AOM6 are arranged so as to sequentially transmit the light beam LB from the light source device 14', and are arranged so as to form the beam waist of the light beam LB inside the selective optical elements AOM1 to AOM6 by passing through the condenser lenses CD1 to CD6 and the collimator lenses CL1 to CL 6. This reduces the diameter of the light beam LB incident on the selective optical elements AOM1 to AOM6 (acousto-optic modulation elements), thereby improving diffraction efficiency and responsiveness.

When an ultrasonic signal (high-frequency signal) is applied to each of the optical elements for selection AOMn (AOM1 to AOM6), first-order diffracted light, which causes incident light beam LB (zero-order light) to be diffracted at a diffraction angle corresponding to a high-frequency, is generated as an outgoing light beam (light beam LBn). In embodiment 4, the light beam LBn emitted as primary diffracted light from each of the plurality of selective optical elements AOMn (AOM1 to AOM6) is referred to as light beams LB1 to LB6, and the respective selective optical elements AOMn (AOM1 to AOM6) function to deflect the optical path of the light beam LB from the light source device 14'. However, since the efficiency of generating the first order diffracted light of the actual acousto-optic modulation element is about 80% of the zero order light as described above, the intensities of the beams LB1 to LB6 deflected by the selective optical elements AOMn (AOM1 to AOM6) are lower than the intensity of the original beam LB. When any of the selective optical elements AOMn (AOM1 to AOM6) is in an On state, approximately 20% of zero-order light that travels straight without being diffracted remains, but is finally absorbed by the absorber TR.

Further, since the selective optical element AOMn is a diffraction grating that generates a periodic coarse change in refractive index in a predetermined direction in the transmission member by the ultrasonic wave, when the incident beam LB is linearly polarized light (P-polarized light or S-polarized light), the polarization direction and the periodic direction of the diffraction grating are set so that the generation efficiency (diffraction efficiency) of the first-order diffracted light is highest. In the case where the selective optical element AOMn is provided so as to diffract and deflect the incident light beam LB in the Z direction as shown in fig. 26, the polarization direction of the light beam LB from the light source device 14' is set (adjusted) so as to match the periodic direction of the diffraction grating generated in the selective optical element AOMn, which is also in the Z direction.

As shown in fig. 26, the plurality of optical elements for selection AOMn (AOM1 to AOM6) are provided so as to deflect the deflected light beams LB1 to LB6 (first order diffracted light) in the-Z direction with respect to the incident light beam LB. The light beams LB1 to LB6 deflected and emitted from the selective optical elements AOMn (AOM1 to AOM6) are projected onto the cell-side incidence mirrors IM1 to IM6 provided at positions separated by a predetermined distance from the selective optical elements AOMn (AOM1 to AOM6), and are reflected in the-Z direction so as to be parallel to (coaxial with) the irradiation central axes Le1 to Le 6. The light beams LB1 to LB6 reflected by the unit-side incident mirrors IM1 to IM6 (hereinafter, also referred to simply as mirrors IM1 to IM6) pass through openings TH1 to TH6 formed in the support member IUB, and enter the scanning units Un (U1 to U6) along the irradiation center axes Le1 to Le 6.

The structures, functions, actions, and the like of the respective optical elements for selection AOMn (AOM1 to AOM6) can be made the same. The plurality of optical elements AOMn (AOM1 to AOM6) generate On/Off of diffracted light that diffracts the incident light beam LB, in accordance with On/Off of a drive signal (high-frequency signal) from the control device 18. For example, when the optical element for selection AOM1 is in the Off state without a drive signal (high-frequency signal) from the control device 18 being applied thereto, the incident light beam LB is transmitted without being diffracted. Therefore, the light beam LB transmitted from the selective optical element AOM1 is transmitted through the collimator lens CL1 and enters the mirror M2. On the other hand, when the optical element AOM1 is in the On state by the application of the drive signal from the controller 18, the incident light beam LB is diffracted and directed to the mirror IM 1. That is, the optical element for selection AOM1 is switched by the drive signal. The mirror IM1 reflects the light beam LB1 diffracted by the optical element AOM1 for selection toward the scanning unit U1 side. The light beam LB1 reflected by the mirror IM1 passes through the opening TH1 of the support member IUB and enters the scanning unit U1 along the irradiation center axis Le 1. Therefore, the mirror IM1 reflects the incident beam LB1 so that the optical axis of the reflected beam LB1 is coaxial with the irradiation center axis Le 1. When the selective optical element AOM1 is in the On state, the zero-order light (intensity of about 20% of the incident light flux) of the light beam LB linearly transmitted through the selective optical element AOM1 is transmitted through the subsequent collimator lenses CL1 to CL6, condenser lenses CD2 to CD6, mirrors M2 to M12, and selective optical elements AOM2 to AOM6 to reach the absorber TR.

Fig. 27A is a view of optical path switching of the light beam LB by the selective optical element AOM1 as viewed from the + Z direction side, and fig. 27B is a view of optical path switching of the light beam LB by the selective optical element AOM1 as viewed from the-Y direction side. When the drive signal is Off, the selection optical element AOM1 transmits the incident light beam LB directly toward the mirror M2 without diffracting it. On the other hand, when the drive signal is in the On state, the selection optical element AOM1 generates a light beam LB1 that diffracts the incident light beam LB toward the-Z direction, and directs the light beam to the mirror IM 1. Therefore, the traveling direction of the light beam LB1 (first order diffracted light) is changed in the Z direction in the XY plane without changing the traveling direction of the light beam LB (zero order light) emitted from the optical element AOM1 for selection and the deflected light beam LB1 (first order diffracted light). In this manner, the controller 18 switches the selection optical element AOM1 by turning On/Off (high/low) the drive signal (high frequency signal) to be applied to the selection optical element AOM1, thereby switching whether the light beam LB is directed to the subsequent selection optical element AOM2 or the deflected light beam LB1 is directed to the scanning unit U1.

Similarly, the selective optical element AOM2 transmits the incident light beam LB (the light beam LB transmitted without being diffracted by the selective optical element AOM 1) to the collimator lens CL2 side (the mirror M4 side) without diffracting it when the drive signal (high frequency signal) from the control device 18 is in the Off state, and directs the light beam LB2, which is the diffracted light of the incident light beam LB, to the mirror IM2 when the drive signal (high frequency signal) from the control device 18 is in the On state. The mirror IM2 reflects the light beam LB2 diffracted by the optical element AOM2 for selection toward the scanning unit U2 side. The light beam LB2 reflected by the mirror IM2 passes through the opening TH2 of the support member IUB and enters the scanning unit U2 coaxially with the irradiation center axis Le 2. The optical elements AOM3 to AOM6 transmit the incident light beam LB to the collimator lenses CL3 to CL6 (the mirrors M6, M8, M10, and M12) without diffracting it when the drive signal (high-frequency signal) from the controller 18 is in the Off state, and direct the light beams LB3 to LB6, which are the primary diffracted lights of the incident light beam LB, toward the mirrors IM3 to IM6 when the drive signal from the controller 18 is in the On state. The mirrors IM3 to IM6 reflect the light beams LB3 to LB6 diffracted by the selective optical elements AOM3 to AOM6 toward the scanning units U3 to U6. The light fluxes LB3 to LB6 reflected by the mirrors IM3 to IM6 pass through the openings TH3 to TH6 of the support member IUB coaxially with the irradiation center axes Le3 to Le6 and enter the scanning units U3 to U6, respectively. In this manner, the controller 18 switches any one of the selection optical elements AOM2 to AOM6 by setting the drive signal (high frequency signal) to be applied to each of the selection optical elements AOM2 to AOM6 to On/Off, thereby switching whether the light beam LB is directed to the subsequent selection optical elements AOM3 to AOM6 or the absorber TR, or one of the deflected light beams LB2 to LB6 is directed to the corresponding scanning units U2 to U6.

As described above, the beam switching member 20 includes the plurality of optical elements AOMn for selection (AOM1 to AOM6) arranged in series along the traveling direction of the light beam LB from the light source device 14', and can switch the optical path of the light beam LB to select one scanning unit Un into which the light beam LBn enters. For example, when the light beam LB1 is to be incident On the scanning unit U1, the selective optical element AOM1 may be turned On, and when the light beam LB3 is to be incident On the scanning unit U3, the selective optical element AOM3 may be turned On. The plurality of optical elements for selection AOMn (AOM1 to AOM6) are provided in correspondence with the plurality of scanning units Un (U1 to U6), and switch whether or not the light beam LBn is incident on the corresponding scanning unit Un.

Since the plurality of scanning units Un (U1 to U6) repeat the scanning operation of the spot light SP in a predetermined order, the beam switching member 20 also switches the scanning units U1 to U6 into which any one of the beams LB1 to LB6 enters, correspondingly to the scanning units. For example, when the order of the scanning unit Un performing the scanning of the spot light SP is U1 → U2 → · · · → · · → U6, the light flux switching member 20 switches the scanning unit Un on which the light flux LBn enters in the order of U1 → U2 → · · · → U6 accordingly.

As described above, the optical elements AOMn (AOM1 to AOM6) for selection of the beam switching unit 20 may be On only during one scanning of the spot light SP by the polygon mirror PM in each of the scanning units Un (U1 to U6). As will be described in detail later, when the number of reflecting surfaces of the polygon mirror PM is Np and the rotational speed of the polygon mirror PM is Vp (rpm), the time Tss corresponding to the rotational angle of one surface of the reflecting surface RP of the polygon mirror PM becomes Tss 60/(Np · Vp) (sec). For example, when the number Np of reflecting surfaces is 8 and the rotation speed Vp is 3 ten thousand, one rotation of the polygon mirror PM is 2 milliseconds, and the time Tss is 0.25 milliseconds. This is 4kHz in terms of frequency, which means that the acousto-optic modulation element can have a considerably lower response frequency than an acousto-optic modulation element for modulating the light beam LB having a wavelength in the ultraviolet region at a high speed on the order of several tens MHz in response to the drawing data. Therefore, the arrangement of the mirrors IM1 to IM6 (fig. 26, 27A, and 27B) which are separated from the beams LB1 to LB6 deflected from the traveling routes of the beams LB linearly passing through the selective optical elements AOM1 to AOM6 can be facilitated by using the acousto-optic modulation element having a large diffraction angle of the beams LB1 to LB6 (primary diffracted light) deflected with respect to the incident beam LB (zero-order light).

Since the plurality of scanning units U1 to U6 repeat the operation of scanning the spot light SP in a predetermined order, the serial data DLn of the pattern data of each scanning unit Un is output to the driving circuit 206a of the light source device 14' in a predetermined order in accordance with the operation. The serial data DLn sequentially output to the drive circuit 206a is referred to as drawing bit string data Sdw. For example, when the predetermined sequence is U1 → U2 → · · · · · → U6, first, serial data DL1 of one column is output to the drive circuit 206a, and next, serial data DL2 of one column is output to the drive circuit 206a, and in this way, serial data DL1 to DL6 of one column constituting bit string data Sdw are sequentially output to the drive circuit 206 a. Then, the serial data DL1 to DL6 in the next column are sequentially output to the drive circuit 206a as drawing bit string data Sdw. A specific configuration for outputting the drawing bit string data Sdw to the driver circuit 206a will be described later in detail.

The configuration of the scanning unit Un (U1 to U6) may be the configuration used in the above-described 1 st to 3 rd embodiments, but in the present 4 th embodiment, the scanning unit Un having the configuration shown in fig. 28 is used. The scanning unit Un described below may be used as the scanning unit of the above-described embodiments 1 to 3.

The optical structure of the scanning unit Un (U1 to U6) used in embodiment 4 will be described below with reference to fig. 28. Since each of the scan cells Un (U1 to U6) has the same configuration, only the scan cell U1 will be described, and the description of the other scan cells Un will be omitted. In fig. 28, a direction parallel to the irradiation center axis Len (Le1) is a Zt direction, a direction on a plane orthogonal to the Zt direction and in which the substrate FS is directed from the processing apparatus PR1 to the processing apparatus PR2 through the exposure apparatus EX is an Xt direction, and a direction on a plane orthogonal to the Zt direction and orthogonal to the Xt direction is a Yt direction. That is, the three-dimensional coordinates of Xt, Yt, and Zt in fig. 28 are three-dimensional coordinates obtained by rotating the three-dimensional coordinate of X, Y, Z in fig. 23 around the Y axis so that the Z axis direction is parallel to the irradiation center axis Len (Le 1).

As shown in fig. 28, in the scanning unit U1, a mirror M20, a beam expander (beam expander) BE, a mirror M21, a polarization beam splitter BS, a mirror M22, an image shift optical unit SR, a field stop FA, a mirror M23, a λ/4 wave plate QW, a cylindrical lens CYa, a mirror M24, a polygon mirror PM, an f θ lens FT, a mirror M25, and a cylindrical lens CYb are provided along the traveling direction of the beam LB1 from the incident position of the beam LB1 to the irradiated surface of the substrate FS. In the scanner unit U1, an optical lens system G10 and a photodetector DTS are provided for detecting the reflected light from the surface of the substrate FS to be irradiated via the polarization beam splitter BS.

The light beam LB1 incident on the scanning unit U1 travels in the-Zt direction and is incident on the mirror M20 inclined at 45 ° with respect to the XtYt plane. The beam LB1 entering the scanning unit U1 enters the mirror M20 so that the axis thereof is coaxial with the irradiation center axis Le 1. The mirror M20 functions as an incident optical member that causes the light beam LB1 to enter the scanning unit U1, and reflects the incident light beam LB1 in the-Xt direction toward the mirror M21 along an optical axis set parallel to the Xt axis. Therefore, the optical axis of the light beam LB1 traveling parallel to the Xt axis is orthogonal to the irradiation center axis Le1 in a plane parallel to the XtZt plane. The light beam LB1 reflected by the mirror M20 is transmitted from the beam expander BE arranged along the optical axis of the light beam LB1 traveling parallel to the Xt axis and is incident on the mirror M21. The beam expander BE expands the diameter of the transmitted light beam LB 1. The beam expander BE includes a condenser lens BE1 and a collimator lens BE2 for making the beam LB1 converged and diverged by the condenser lens BE1 into parallel light.

The mirror M21 is disposed to be inclined at 45 ° to the YtZt plane, and reflects the incident light beam LB1 in the-Yt direction toward the polarization beam splitter BS. The polarization beam splitter BS has a polarization splitting surface arranged at an angle of 45 ° with respect to the YtZt plane, reflects the P-polarized light beam, and transmits a linearly polarized (S-polarized) light beam polarized in a direction orthogonal to the P-polarization. The light beam LB1 incident on the scanning unit U1 is a P-polarized light beam, and therefore the polarization beam splitter BS reflects the light beam LB1 from the mirror M21 in the-Xt direction and guides the light beam to the mirror M22 side.

The mirror M22 is disposed inclined at 45 ° with respect to the XtYt plane, and reflects the incident light beam LB1 in the-Zt direction toward the mirror M23 that is separated from the mirror M22 in the-Zt direction. The light beam LB1 reflected by the mirror M22 passes through the image shift optical unit SR and the field stop (field stop) FA along the optical axis parallel to the Zt axis, and enters the mirror M23. The image shift optical member SR two-dimensionally adjusts the center position within the cross section of the light beam LB1 in a plane (XtYt plane) orthogonal to the traveling direction of the light beam LB 1. The image shift optical member SR is composed of two quartz parallel flat plates SR1 and SR2 arranged along the optical axis of the light beam LB1 running parallel to the Zt axis, the parallel flat plate SR1 is tiltable around the Xt axis, and the parallel flat plate SR2 is tiltable around the Yt axis. By tilting the parallel flat plates Sr1, Sr2 about the Xt axis and Yt axis, respectively, the center position of the beam LB1 is slightly displaced two-dimensionally in the XtYt plane orthogonal to the traveling direction of the beam LB 1. The parallel flat plates Sr1, Sr2 are driven by an actuator (driving unit), not shown, under the control of the controller 18.

The light beam LB1 having passed through the relay optical unit SR passes through the circular opening of the field stop FA and reaches the mirror M23. The circular opening of the field stop FA is a stop that shields the peripheral portion of the intensity distribution in the cross section of the light beam LB1 amplified by the beam expander BE. The intensity (brightness) of the spot light SP can be adjusted by setting the aperture of the circular opening of the field stop FA to be an adjustable variable iris stop.

The mirror M23 is disposed inclined at 45 ° with respect to the XtYt plane, and reflects the incident light beam LB1 in the + Xt direction toward the mirror M24 that is separated from the mirror M23 in the + Xt direction. The light beam LB1 reflected by the mirror M23 is transmitted through the λ/4 plate QW and the cylindrical lens CYa and enters the mirror M24. The mirror M24 reflects the incident light beam LB1 toward a polygon mirror (a rotating polygon mirror, a deflecting member for scanning) PM. The polygon mirror PM reflects the incident light beam LB1 in the + Xt direction toward an f θ lens FT having an optical axis AXf parallel to the Xt axis. The polygon mirror PM deflects (reflects) the incident light flux LB1 in a plane parallel to the XtYt plane in order to scan the spot light SP of the light flux LB1 on the irradiated surface of the substrate FS. Specifically, the polygon mirror PM has a rotation axis AXp extending in the Zt-axis direction, and a plurality of reflection surfaces RP (eight reflection surfaces RP in the present embodiment 4) formed around the rotation axis AXp. By rotating the polygon mirror PM in a predetermined rotational direction about the rotational axis AXp, the reflection angle of the pulse-shaped luminous flux LB1 irradiated on the reflection surface RP can be continuously changed. Thus, the spot light SP of the beam LB1 irradiated on the irradiated surface of the substrate FS can be scanned in the scanning direction (the width direction of the substrate FS, the Yt direction) by deflecting the reflection direction of the beam LB1 by the one reflection surface RP.

The spot light SP of the light beam LB1 can be scanned along the scanning line SL1 by one reflection surface RP. Therefore, the number of drawing lines SL1 scanned by the spot light SP on the irradiated surface of the substrate FS is eight at the maximum as the number of reflection surfaces RP in one rotation of the polygon mirror PM. The polygon mirror PM is rotated at a constant speed by a polygon mirror driving section RM including a motor and the like. The rotation of the polygon mirror PM based on the polygon mirror driving section RM is controlled by the control device 18. As described above, the effective length (for example, 30mm) of the drawing line SL1 is set to a length equal to or less than the maximum scanning length (for example, 31mm) that the dot light SP can scan by the polygon mirror PM, and the center point (the point through which the irradiation center axis Le1 passes) of the drawing line SL1 is set at the center of the maximum scanning length in the initial setting (in design).

In addition, as an example, the effective dimension is set to 30mm while the effective length of the drawing line SL1 is set to 30mm

When the spot light SP of 3 μm is irradiated onto the irradiated surface of the substrate FS along the scanning line SL1 while overlapping the spot light SP by 1.5 μm, the number of the spot lights SP irradiated in one scan (the number of pulses of the light beam LB from the light source device 14') is 20000(30mm/1.5 μm). When the scanning time of the spot light SP along the scanning line SL1 is set to 200 μ sec, 20000 times of pulse-shaped spot light SP must be irradiated during this period, and therefore the emission frequency Fs of the light source device 14' is set to Fs ≧ 20000 times/200 μ sec, which is 100 MHz.

The cylindrical lens CYa converges the incident light beam LB1 in a slit shape on the reflection surface RP of the polygon mirror PM in a non-scanning direction (Zt direction) orthogonal to the scanning direction (rotation direction) by the polygon mirror PM. Even if the reflection surface RP is inclined with respect to the Zt direction (the reflection surface RP is inclined with respect to the normal to the XtYt plane) by the cylindrical lens CYa having the generatrix thereof parallel to the Yt direction, the influence thereof can be suppressed, and the irradiation position of the beam LB1 irradiated on the irradiated surface of the substrate FS can be suppressed from being shifted in the Xt direction.

The f θ lens FT having the optical axis AXf extending in the Xt-axis direction is a telecentric scanning lens that projects the light beam LB1 reflected by the polygon mirror PM toward the mirror M25 in parallel with the optical axis AXf in the XtYt plane. The incident angle θ of the light beam LB1 to the f θ lens FT varies according to the rotation angle (θ/2) of the polygon mirror PM. The f θ lens FT projects the light beam LB1 to an image height position on the irradiated surface of the substrate FS, which is proportional to the incident angle θ thereof, via the mirror M25 and the cylindrical lens CYb. When the focal length is fo and the image height position is y, the f θ lens FT is designed to satisfy the relationship of y being fo · θ. Therefore, the f θ lens FT can scan the light beam LB1 (spot light SP) accurately and at a constant speed in the Yt direction (Y direction). When the incident angle θ to the f θ lens FT is 0 degree, the light beam LB1 incident on the f θ lens FT travels along the optical axis AXf.

The mirror M25 reflects the incident light beam LB1 in the-Zt direction toward the substrate FS via the cylindrical lens CYb. The light beam LB1 projected onto the substrate FS is converged into a minute spot light SP having a diameter of about several μm (for example, 3 μm) on the surface to be irradiated of the substrate FS by the f θ lens FT and the cylindrical lens CYb having a bus line parallel to the Yt direction. The spot light SP projected onto the irradiated surface of the substrate FS is one-dimensionally scanned by the polygon mirror PM along the drawing line SL1 extending in the Yt direction. The optical axis AXf of the f θ lens FT and the irradiation center axis Le1 are located on the same plane, which is parallel to the XtZt plane. Therefore, the light beam LB1 traveling on the optical axis AXf is reflected in the-Zt direction by the mirror M25, and is projected on the substrate FS coaxially with the irradiation center axis Le 1. In embodiment 4, at least the f θ lens FT functions as a projection optical system that projects the light beam LB1 deflected by the polygon mirror PM onto the surface to be irradiated of the substrate FS. At least the reflecting members (the mirrors M21 to M25) and the polarization beam splitter BS function as an optical path deflecting member for bending the optical path of the luminous flux LB1 from the mirror M20 to the substrate FS. The optical path deflecting member can make the incident axis of the light beam LB1 incident on the mirror M20 substantially coaxial with the irradiation center axis Le 1. On the XtZt plane, the light beam LB1 passing through the scanning unit U1 passes through a substantially U-shaped or コ -shaped optical path, travels in the-Zt direction, and is projected onto the substrate FS.

In this manner, in a state where the substrate FS is conveyed in the X direction, the spot light SP of the light beam LBn is one-dimensionally scanned in the scanning direction (Y direction) by the scanning units Un (U1 to U6), whereby the spot light SP can be relatively two-dimensionally scanned on the irradiation surface of the substrate FS. Therefore, a predetermined pattern can be drawn and exposed in the exposure area W of the substrate FS.

The photodetector DTS has a photoelectric conversion element that photoelectrically converts incident light. A predetermined reference pattern is formed on the surface of the rotary drum DR. The portion of the rotary drum DR on which the reference pattern is formed is made of a material having a low reflectance (10 to 50%) with respect to the wavelength band of the light beam LB1, and the other portion of the rotary drum DR on which the reference pattern is not formed is made of a material having a reflectance of 10% or less or a material that absorbs light. Therefore, when the spot light SP of the light beam LB1 is irradiated from the scanner unit U1 to the region of the rotary drum DR where the reference pattern is formed in a state where the substrate FS is not wound (or in a state where the spot light passes through the transparent portion of the substrate FS), the reflected light passes through the cylindrical lens CYb, the mirror M25, the f θ lens FT, the polygon mirror PM, the mirror M24, the cylindrical lens CYa, the λ/4 wave plate QW, the mirror M23, the field stop FA, the relay optical unit SR, and the mirror M22 and enters the polarization beam splitter BS. Here, a λ/4 wave plate QW is provided between the polarization beam splitter BS and the substrate FS, specifically, between the mirror M23 and the cylindrical lens CYa. Thus, the light beam LB1 irradiated on the substrate FS is converted from P-polarized light to circularly polarized light by the λ/4 plate QW, and the reflected light incident on the polarization beam splitter BS from the substrate FS is converted from circularly polarized light to S-polarized light by the λ/4 plate QW. Therefore, the reflected light from the substrate FS is transmitted from the polarization beam splitter BS, and is incident on the photodetector DTS via the optical lens system G10.

At this time, in a state where the pulsed light beam LB1 (preferably, the light beam LB1 from the seed light S1) is continuously incident on the scanning unit U1, the rotary drum DR rotates and the scanning unit U1 scans the spot light SP, thereby two-dimensionally irradiating the spot light SP onto the outer peripheral surface of the rotary drum DR. Accordingly, an image of the reference pattern formed on the rotary drum DR can be acquired by the photodetector DTS. Specifically, the change in the intensity of the photoelectric signal output from the photodetector DTS is digitally sampled for each scanning time in response to a clock pulse signal (generated in the light source device 14') for pulse emission of the spot light SP, thereby obtaining one-dimensional image data in the Yt direction, and the distance in the sub-scanning direction (for example, the size of the spot light SP) is determined in response to the measurement value of the encoder ENn for measuring the rotational angle position of the rotary drum DR

1/2) of the rotating cylinder DR, two-dimensional image information of the surface of the rotating cylinder DR is obtained by aligning one-dimensional image data in the Yt direction in the Xt direction. The controller 18 measures the inclination of the drawing line SL1 of the scanner unit U1 based on the acquired two-dimensional image information of the reference pattern of the rotary drum DR. The slope of the drawing line SL1 may be a relative slope between the scanning units Un (U1 to U6) or a slope (absolute slope) with respect to the central axis axon of the rotary drum DR. Similarly, the slopes of the drawing lines SL2 to SL6 can be measured.

In the periphery of the polygon mirror PM of the scanning unit U1, an origin sensor (origin detector) OP1 is provided as shown in fig. 29. The origin sensor OP1 outputs a pulse-like origin signal SZ indicating the start of scanning of the spot light SP by each reflection surface RP. The origin sensor OP1 outputs an origin signal SZ when the rotational position of the polygon mirror PM reaches a predetermined position immediately before scanning of the spot light SP by the reflection surface RP starts. Since the polygon mirror PM can deflect the light flux LB1 projected onto the substrate FS in the scanning angle range θ s, if the reflection direction (deflection direction) of the light flux LB1 reflected by the polygon mirror PM is within the scanning angle range θ s, the reflected light flux LB1 enters the f θ lens FT. Therefore, the origin sensor OP1 outputs the origin signal SZ when the rotational position of the polygon mirror PM comes to a predetermined position immediately before the reflection direction of the light beam LB1 reflected by the reflection surface RP comes within the scanning angle range θ s. Further, the scanning angle range θ s has a relationship of θ s being 2 × α with the maximum scanning rotation angle range α shown in fig. 7.

Since the polygon mirror PM has eight reflection surfaces RP, the origin sensor OP1 outputs the origin signal SZ eight times during one rotation of the polygon mirror PM. The origin signal SZ detected by the origin sensor OP1 is transmitted to the control device 18. After the origin sensor OP1 outputs the origin signal SZ, scanning of the spot light SP along the scanning line SL1 is started.

The origin sensor OP1 outputs an origin signal SZ using the adjacent reflection surface RP (in the present embodiment, the previous reflection surface RP in the rotational direction of the polygon mirror PM) of the reflection surfaces RP which thereafter performs scanning of the spot light SP (deflection of the light beam LB 1) next. For convenience of distinguishing the reflection surfaces RP, the reflection surface RP currently deflecting the light beam LB1 is represented by RPa, and the other reflection surfaces RP are represented by RPb to RPh in the counterclockwise direction (in the direction opposite to the rotation direction of the polygon mirror PM) in fig. 29.

The origin sensor OP1 includes a light beam transmission system Opa including a light source unit 312 that emits a laser beam Bga in a non-photosensitive wavelength band such as a semiconductor laser beam, and mirrors 314 and 316 that reflect the laser beam Bga from the light source unit 312 and project the reflected laser beam onto the reflection surface RPb of the polygon mirror PM. The origin sensor OP1 includes a beam receiving system Opb, and the beam receiving system Opb includes a light receiving portion 318, mirrors 320 and 322 for guiding the reflected light (reflected light beam Bgb) of the laser beam Bga reflected by the reflection surface RPb to the light receiving portion 318, and a lens system 324 for converging the reflected light beam Bgb reflected by the mirror 322 into a minute spot light. The light receiving portion 318 has a photoelectric conversion element that converts the point light of the reflected light beam Bgb condensed by the lens system 324 into an electrical signal. Here, the position at which the laser beam Bga is projected onto each reflection surface RP of the polygon mirror PM is set as a pupil plane (position of the focal point) of the lens system 324.

The light beam transmitting system Opa and the light beam receiving system Opb are provided at positions where the reflected light beam Bgb of the laser beam Bga emitted from the light beam transmitting system Opa can be received by the light beam receiving system Opb when the rotational position of the polygon mirror PM is a predetermined position immediately before the scanning of the spot light SP by the reflection surface RP is started. That is, the light beam transmitting system Opa and the light beam receiving system Opb are provided at positions capable of receiving the reflected light beam Bgb of the laser beam Bga emitted from the light beam transmitting system Opa when the angle of the reflection surface RP is at a predetermined angular position. Reference numeral Msf in fig. 29 denotes a shaft of a rotation motor of the polygon mirror driving unit RM (see fig. 28) disposed coaxially with the rotation shaft AXp.

A light-shielding body (not shown) having a slit opening with a small width is provided immediately before the light-receiving surface of the photoelectric conversion element in the light-receiving portion 318. While the angular position of the reflection surface RPb is within the predetermined angular range, the reflected light beam Bgb enters the lens system 324, and the spot light of the reflected light beam Bgb scans the light-blocking body in the light-receiving unit 318 in a predetermined direction. In this scanning, the spot light of the reflected light beam Bgb transmitted through the slit opening of the light-shielding body is received by the photoelectric conversion element of the light-receiving unit 318, and the received light signal is amplified by the amplifier and output as the pulse-shaped origin signal SZ.

The origin sensor OP1 detects the origin signal SZ by using the reflection surface RPa (which scans the spot light SP) that deflects the light beam LB1 and the previous reflection surface RPb in the rotation direction, as described above. Therefore, if the angle η j formed between the adjacent reflection surfaces RP (for example, the reflection surfaces RPa and RPb) has an error with respect to the design value (135 degrees in the case where the reflection surfaces RP are eight), the timing of generating the origin signal SZ may differ for each reflection surface RP due to the deviation of the error, as shown in fig. 30.

In fig. 30, the origin signal SZ generated using the reflection surface RPb is SZb. Similarly, the origin signal SZ generated using the reflection surfaces RPc, RPd, RPe, · · · is denoted by SZc, SZd, SZe, · · -. When the angle η j formed by the adjacent reflection surfaces RP of the polygon mirror PM is the design value, the interval of the generation timing of each origin signal SZ (SZb, SZc, SZd, ·) becomes the time Tpx. The prescribed time Tpx is a time required for the polygon mirror PM to rotate one face of the reflection face RP. However, in fig. 30, due to an error in the angle η j formed by the reflection surface RP of the polygon mirror PM, the timing of the origin signals SZc and SZd generated using the reflection surfaces RPc and RPd is shifted from the normal generation timing. Further, the time intervals Tp1, Tp2, Tp3, · · generated by the origin signals SZb, SZc, SZd, SZe, · · are not fixed on the order of microseconds due to manufacturing errors of the polygon mirror PM. In the time chart shown in FIG. 30, Tp1 < Tpx, Tp2 > Tpx, and Tp3 < Tpx. When the number of the reflection surfaces RP is Np and the rotational speed of the polygon mirror PM is Vp, Tpx is expressed as Tpx 60/(Np × Vp) (sec). For example, if Vp is 3 ten thousand rpm and Np is 8, Tpx is 250. mu.s.

Therefore, the position of the drawing start point (scanning start point) of the drawing line SL1 on the surface to be irradiated of the substrate FS of the spot light SP drawn by the respective reflection surfaces RP (RPa to RPh) is shifted in the main scanning direction due to the error in the angle η j formed by the adjacent reflection surfaces RP of the polygon mirror PM. Thus, the position of the drawing end point of the drawing line SL1 is also shifted in the main scanning direction. That is, since the position of the drawing line SL1 of the spot light SP drawn by each reflection surface RP is displaced in the scanning direction (Y direction), the positions of the drawing start point and the drawing end point of each drawing line SLn do not become a straight line in the X direction. The cause of the displacement of the positions of the drawing start point and the drawing end point of the drawing line SL1 of the spot light SP in the main scanning direction is that Tp1, Tp2, Tp3, · · · · · · · Tpx are not established.

Therefore, in embodiment 4, as shown in the timing chart of fig. 30, the drawing of the spot light SP is started with the lapse of time Tpx from the generation of one pulse-shaped origin signal SZ as the drawing start point. That is, after the time Tpx has elapsed after the generation of the origin signal SZ, the control device 18 controls the light beam switching means 20 so that the light beam LB1 enters the scanning unit U1, and outputs drawing bit string data Sdw of the scanning unit U1 to be scanned next, that is, serial data DL1 to the drive circuit 206a of the light source device 14' shown in fig. 26. This makes it possible to make the reflection surface RPb for detecting the origin signal SZ and the reflection surface RP for actually scanning the spot light SP the same.

Specifically, the controller 18 outputs the On drive signal to the selection optical element AOM1 of the beam switching member 20 for a certain time (On time Ton) after the time Tpx elapses after the origin sensor OP1 of the scanning unit U1 outputs the origin signal SZb. The fixed time (On time Ton) during which the selection optical element AOM1 is On is a predetermined time and is set to cover a period (scanning period) during which the spot light SP is scanned once along the scanning line SL1 by one reflection surface RP of the polygon mirror PM. Next, the controller 18 outputs the serial data DL1 in a specific column, for example, the 1 st column, to the driving circuit 206a of the light source device 14'. Thus, in the scanning time during which the scanning unit U1 scans the spot light SP, the light beam LB1 is incident on the scanning unit U1, and therefore the scanning unit U1 can draw a pattern corresponding to the serial data DL1 of a certain specific column (for example, the 1 st column). In this manner, since the scanning unit U1 scans the spot light SP after the time Tpx has elapsed after the origin sensor OP1 of the scanning unit U1 has outputted the origin signal SZb, the scanning of the spot light SP by the origin signal SZb can be performed by the reflection surface RPb for detecting the origin signal SZb.

Next, after the time Tpx elapses after the origin sensor OP1 of the scanning unit U1 outputs the origin signal SZd, the controller 18 outputs an On drive signal to the selection optical element AOM1 of the beam switching member 20 for a certain time (On time Ton). Then, the control device 18 outputs serial data DL1 of the next column, for example, the 2 nd column, to the drive circuit 206a of the light source device 14'. Thus, the light beam LB1 is incident on the scanning unit U1 in a time period including the time period required for the scanning unit U1 to scan the spot light SP, and therefore the scanning unit U1 can draw a pattern corresponding to the serial data DL1 of the next column (for example, the 2 nd column). In this manner, since the scanning unit U1 scans the spot light SP after the elapse of the time Tpx after the origin sensor OP1 of the scanning unit U1 outputs the origin signal SZd, the scanning of the spot light SP by the origin signal SZd can be performed by the reflection surface RPb for detecting the origin signal SZd. Note that, when scanning of the spot light SP is performed not for each continuous reflection surface RP of the polygon mirror PM but for one surface, the drawing process is performed using the origin signal SZ so as to skip one (every other). The reason why the drawing process is performed by skipping one will be described in detail later.

In this manner, after the time Tpx has elapsed after the origin sensor OP1 of the scanning unit U1 outputs the origin signal SZ, the control device 18 controls the light flux switching member 20 so that the scanning unit U1 scans the spot light SP, and outputs the serial data DL1 to the drive circuit 206a of the light source device 14'. Further, each time scanning by the scanning unit U1 is started, the controller 18 shifts the columns of the serial data DL1 to be output in the column direction so as to be 1 st, 2 nd, 3 rd, and 4 th columns. During the period from one scan of the spot light SP by the scanner unit U1 to the next scan, the scans of the spot light SP by the other scanner units Un (scanner units U2 to U6) are sequentially performed. The scanning of the spot light SP by the other scanning units Un (U2 to U6) is the same as the scanning by the scanning unit U1. The origin sensors OPn (OP1 to OP6) are provided for each of the scanning units Un (U1 to U6).

As described above, by scanning the spot light SP using the reflection surface RP for detecting the origin signal SZb of the scanning unit U1, even when the angles η j formed by the adjacent reflection surfaces RP of the polygon mirror PM have errors, it is possible to suppress the positions of the drawing start point and the drawing end point of the spot light SP drawn by the respective reflection surfaces RP (RPa to RPh) on the irradiation surface of the substrate FS from being shifted in the main scanning direction.

Therefore, the time Tpx for which the polygon mirror PM rotates by 45 degrees needs to be accurate on the μ second level, that is, the velocity of the polygon mirror PM needs to be rotated at a constant velocity uniformly and precisely. When the polygon mirror PM is rotated at a constant speed precisely as described above, the reflection surface RP for generating the origin signal SZ is always rotated by exactly 45 degrees after the time Tpx to reflect the light beam LB1 toward the f θ lens FT. Therefore, by increasing the constant rotational speed of the polygon mirror PM and also reducing the speed unevenness during one rotation as much as possible, the position of the reflection surface RP for generating the origin signal SZ can be made different from the position of the reflection surface RP for deflecting the light beam LB1 and scanning the spot light SP. That is, the generation timing of the origin signal SZ is delayed by the time Tpx, and therefore, the operation is equivalent to the case where the origin signal SZ is detected using the reflection surface RP that scans the spot light SP. This improves the degree of freedom in the arrangement of the origin sensor OP1(OPn), and enables the installation of a highly rigid and structurally stable origin sensor. The reflection surface RP to be detected by the origin sensor OP1(OPn) is the one before the rotation direction of the reflection surface RP that deflects the light beam LB1(LBn), but is not limited to the one before the rotation direction of the polygon mirror PM. In this case, when the reflection surface RP to be detected by the origin sensor OP is set to be n (an integer equal to or greater than 1) times before the rotation direction of the reflection surface RP that deflects the light beam LB1(LBn), the drawing start point may be set after n × time Tpx has elapsed after the origin signal SZ is generated.

Then, by setting the drawing start point after n × time Tpx for each of the origin signals SZb, SZd, · generated from the origin sensor OP1(OPn) every other, a margin is generated in the processing time of the reading operation, the data transfer (communication) operation, the correction calculation, and the like of the pixel data sequence corresponding to each drawing line SL 1. Therefore, a transfer error of the pixel data column, an error of the pixel data column, and/or a partial loss can be reliably avoided.

Note that, instead of providing the origin sensor OPn for detecting the adjacent reflection surface RP (in the present embodiment 4, the previous reflection surface RP in the rotational direction of the polygon mirror PM) of the reflection surface RP for performing the scanning (the deflection of the light beam LB 1) of the spot light SP next as shown in fig. 29, the origin sensor for detecting the same reflection surface RP as the reflection surface RP for performing the scanning (the deflection of the light beam LB 1) of the spot light SP next may be provided. In this case, as described with reference to fig. 30, since the time intervals of the origin signals (pulse-like) SZ generated for the respective reflection surfaces RPa to RPh of the polygon mirror PM vary, it is necessary to add a time offset amount corresponding to the variation amount for each of the reflection surfaces RPa to RPh.

Here, as also described in fig. 7, when the number Np of the reflection surfaces RP of the polygon mirror PM is eight and the maximum scanning rotation angle range α is 15 degrees, the scanning efficiency (α/β) becomes 1/3. For example, during a period from when the scanning unit U1 scans the spot light SP to when the next scanning is performed, the scanning of the spot light SP can be performed by distributing the light beam LBn to two scanning units Un other than the scanning unit U1. That is, while the polygon mirror PM of the scanning unit U1 rotates by one surface, the corresponding light beam LBn can be distributed to each of the three scanning units Un including the scanning unit U1 to perform scanning of the spot light SP.

However, since the scanning efficiency of the polygon mirror PM is 1/3, when each scanning unit Un scans the spot light SP in the maximum scanning rotation angle range α (15 degrees), the light beam LBn cannot be distributed to three or more scanning units Un (U2 to U6) other than the scanning unit U1 while the polygon mirror PM of the scanning unit U1 rotates by the amount of one surface of the reflection surface RP (β ═ 45 degrees). That is, the light beam LBn cannot be distributed to three or more scanning units Un (U2 to U6) other than the scanning unit U1 from the start of scanning of the spot light SP by the scanning unit U1 to the start of scanning of the next spot light SP. Therefore, the following method can be considered in order to perform scanning by the spot light SP by distributing the light beam LBn to each of the other five scanning units Un (U2 to U6) from the start of scanning by the spot light SP of the scanning unit U1 to the start of the next scanning.

Even when the maximum scanning rotational angle range α is 15 degrees, the scanning rotational angle range α' of the polygon mirror PM that can be actually scanned by the spot light SP is set to be smaller than the maximum scanning rotational angle range α (α is 15 degrees). Specifically, while the polygon mirror PM of each of the scanning units Un (U1 to U6) rotates one surface of the reflection surface RP by an amount (β ═ 45 degrees), the number of scanning units Un to which the light beam LBn is distributed is six, and therefore the scanning rotation angle range α 'is set to α' ═ 45/6 ═ 7.5 degrees. That is, the oscillation angle centered on the optical axis AXf of the light flux LBn incident on the f θ lens FT in fig. 28 is limited to ± 7.5 degrees. Thus, during a period in which the polygon mirror PM of each scanning unit Un rotates by 45 degrees (a period in which the reflection surface RP rotates by one surface), the light beam LBn can be sequentially distributed and incident on any one of the six scanning units Un (U1 to U6), and the scanning units Un (U1 to U6) can sequentially perform scanning by the spot light SP. However, in this case, there is a problem that the scanning rotation angle range α' which can be actually scanned by the spot light SP becomes too small, and the maximum scanning range length scanned by the spot light SP, that is, the maximum scanning length of the scanning line SLn becomes too short. To avoid such a problem, an f θ lens FT having a long focal length is prepared so as not to change the maximum scan length of the spot light SP, and the distance (working distance) from the reflection surface RP of the polygon mirror PM to the f θ lens FT is set to be long. In this case, there is a possibility that the f θ lens FT is increased in size, the size of the scanning unit Un (U1 to U6) in the Xt direction is increased in size, and the stability of the beam scanning is lowered due to the long working distance.

On the other hand, in view of reducing the number of the reflection surfaces RP of the polygon mirror PM, the rotation angle β by which the polygon mirror PM rotates one surface of the reflection surfaces RP is increased. In this case, while the drawing line SLn is suppressed from being shortened and the scanning units Un (U1 to U6) are prevented from being enlarged, the spot light SP can be sequentially scanned by the six scanning units Un (U1 to U6) while the beam LBn is distributed by the amount (rotation angle β) by which the polygon mirror PM of the scanning unit Un (U1 to U6) rotates one surface of the reflection surface RP. For example, when the number of the reflection surfaces RP of the polygon mirror PM is four, that is, when the shape of the polygon mirror PM is square, the rotation angle β by which the reflection surfaces RP of the polygon mirror PM rotate one surface is 90 degrees. Therefore, when the spot light SP is scanned by six scanning units Un (U1 to U6) while the light beam LBn is distributed by the scanning unit U1 that the polygon mirror PM rotates by the amount of one surface of the reflection surface RP, the scanning rotation angle range α' of the polygon mirror PM that the spot light SP can actually scan is equal to the maximum scanning rotation angle range α described above, i.e., equal to 15 degrees — 90/6.

However, when the polygonal polygon mirror PM having a small number Np of reflection surfaces such as a triangle and a square is rotated at a high speed, air resistance (wind resistance) becomes excessively large, and the rotation speed and the number of rotations are reduced (regular). For example, even when the polygon mirror PM is intended to rotate at a high speed of several tens of thousands of rpm (rotation per minute), the rotational speed is reduced by about 2 to 3 due to air resistance, and the desired high rotational speed and high rotational speed cannot be obtained. In addition, a method of increasing the outer shape size of the polygon mirror PM is also conceivable, but the weight of the polygon mirror PM becomes too large to obtain a desired high rotational speed and a desired high rotational speed. As a method for reducing the wind resistance during rotation even if the number Np of reflecting surfaces of the polygon mirror PM is reduced, it is conceivable to provide the entire polygon mirror PM in a vacuum environment or in an environment of a gas (helium gas or the like) having a smaller molecular weight than air. In this case, an airtight structure for creating such an environment is provided around the polygon mirror PM, and the scanning unit Un (U1 to U6) is increased in size accordingly.

Therefore, in embodiment 4, the polygon mirror PM having a polygon with a relatively large number of reflection surfaces Np, that is, the polygon mirror PM having an octagonal shape which is more approximate to a circular shape is used, the scanning rotation angle range α' of the polygon mirror PM which can be actually scanned by the spot light SP is set to the maximum scanning rotation angle range α (α is 15 degrees), and the reflection surfaces RP of the polygon mirror PM which perform scanning of the spot light SP (deflection of the light beam LBn) are set to every other reflection surface RP. That is, scanning of the spot light SP by the scanning units Un (U1 to U6) is repeated every one surface (one surface is skipped) of the reflection surface RP of the polygon mirror PM. Therefore, during the period from when the scanning unit U1 scans the spot light SP to when the next scan is performed, the scanning of the spot light SP can be performed by sequentially allocating the light beams LB2 to LB6 to each of the five scanning units U2 to U6 other than the scanning unit U1. That is, the light beams LB1 to LB6 are distributed to each of the six scanning units Un (U1 to U6) while the polygon mirror PM of the focused one of the six scanning units Un (U1 to U6) rotates by the amount of both sides, whereby the six scanning units Un (U1 to U6) are all capable of scanning the spot light SP. In this case, the polygon mirror PM rotates by the amount of both surfaces (90 degrees) from the start of scanning of the spot light SP by each scanning unit Un (U1 to U6) to the start of the next scanning of the spot light SP. In order to perform such a drawing operation, the polygon mirrors PM of the six scanning units Un (U1 to U6) are synchronously controlled so that the rotational speeds thereof are the same, and the angular positions of the reflection surfaces RP of the polygon mirrors PM are synchronously controlled so as to have a predetermined phase relationship with each other.

Further, since the reflection surfaces RP of the polygon mirror PM on which the scanning of the spot light SP (the deflection of the light beam LBn) is performed are arranged on every other plane, the number of times of scanning of the spot light SP along each of the scanning lines SLn (SL1 to SL6) is four times while the polygon mirror PM of each scanning unit Un (U1 to U6) rotates once. Therefore, the number of drawing lines SLn is half as compared with a case where the scanning of the spot light SP (the deflection of the light beam LBn) is repeated for each continuous reflection surface RP of the polygon mirror PM, that is, as compared with a case where the scanning of the spot light SP (the deflection of the light beam LBn) is performed for each reflection surface RP of the polygon mirror PM, and therefore, it is preferable to reduce the conveyance speed of the substrate FS to half as well. When the conveyance speed of the substrate FS is not to be reduced to half, the rotational speed and the oscillation frequency FS of the polygon mirror PM of each scanning unit Un (U1 to U6) are increased to two times. For example, when the rotational speed of the polygon mirror PM is 2 ten thousand rpm and the oscillation frequency Fs of the beam LB from the light source device 14 'is 200MHz when scanning of the spot light SP (deflection of the beam LBn) is repeated for each continuous reflection surface RP of the polygon mirror PM, the rotational speed of the polygon mirror PM is set to 4 ten thousand rpm and the oscillation frequency Fs of the beam LB from the light source device 14' is set to 400MHz when scanning of the spot light SP (deflection of the beam LBn) is repeated for each reflection surface RP of each surface of the polygon mirror PM.

Here, the controller 18 manages which scanning unit Un among the plurality of scanning units Un (U1 to U6) performs scanning of the spot light SP based on the origin signal SZ. However, since the origin sensor OPn of each scanning unit Un (U1 to U6) generates the origin signal SZ when each reflecting surface RP is at a predetermined angular position, the controller 18 determines that each scanning unit Un (U1 to U6) scans the spot light SP for each reflecting surface RP in succession, by using the origin signal SZ as it is. Therefore, the light beam LBn cannot be distributed to the other five scanning units Un until the scanning unit Un scans the spot light SP until the next scanning is performed. Therefore, in order to set the reflection surface RP of the polygon mirror PM for scanning the spot light SP every other, it is necessary to generate the sub-origin signal (sub-origin pulse signal) ZP excluding the origin signals SZ. Further, as described above, since the origin signal SZ is detected using the previous reflection surface RP in the rotation direction of the reflection surface RP on which the spot light SP is scanned (deflected), it is necessary to generate the sub-origin signal ZP for delaying the generation timing of the origin signal SZ by the time Tpx. The configuration of the sub-origin generating circuit CA for generating the sub-origin signal ZP will be described below.

Fig. 31 is a configuration diagram of a sub-origin generating circuit CA for generating a sub-origin signal ZP by dividing the origin signal SZ to generate a timing delay time Tpx, and fig. 32 is a timing chart showing the sub-origin signal ZP generated by the sub-origin generating circuit CA of fig. 31. The sub-origin generating circuit CA has a frequency divider 330 and a delay circuit 332. The frequency divider 330 divides the frequency of the generation timing of the origin signal SZ into 1/2 and outputs the result to the delay circuit 332 as the origin signal SZ'. The delay circuit 332 delays the transmitted origin signal SZ' by the time Tpx and outputs the delayed signal as the sub-origin signal ZP. The plurality of sub-origin generating circuits CA are provided corresponding to the origin sensors OPn of the respective scanning units Un (U1 to U6).

Note that the sub-origin generating circuit CA corresponding to the origin sensor OPn of the scanning unit Un may be denoted by CAn. That is, the sub-origin generating circuit CA corresponding to the origin sensor OP1 of the scanning unit U1 may be represented by CA1, and the sub-origin generating circuits CA corresponding to the origin sensors OP2 to OP6 of the scanning units U2 to U6 may be represented by CA2 to CA 6. In addition, there is a case where the origin signal SZ output from the origin sensor OPn of the scanning unit Un is denoted by SZn. That is, there are cases where the origin signal SZ output from the origin sensor OP1 of the scanning unit U1 is represented by SZ1, and the origin signal SZ output from the origin sensors OP2 to OP6 of the scanning units U2 to U6 is represented by SZ2 to SZ 6. Further, the origin signal SZ 'and the sub-origin signal ZP generated based on the origin signal SZn may be represented by SZn' and ZPn. That is, the origin signal SZ ' generated based on the origin signal SZ1 and the sub-origin signal ZP may be represented by SZ1 ' and ZP1, and the origin signal SZ ' generated based on the origin signals SZ2 to SZ6 and the sub-origin signal ZP may be represented by SZ2 ' to SZ6 ' and ZP2 to ZP 6.

Fig. 33 is a block diagram showing an electrical configuration of the exposure apparatus EX, and fig. 34 is a timing chart showing timings of outputting the origin signals SZ1 to SZ6, the sub-origin signals ZP1 to ZP6, and the serial data DL1 to DL 6. The control device 18 of the exposure apparatus EX includes a rotation control unit 350, a beam switching control unit 352, a drawing data output control unit 354, and an exposure control unit 356. The exposure apparatus EX includes motor drive circuits Drm1 to Drm6 that drive the polygon mirror drive unit RM including the motors of the scanning units Un (U1 to U6).

The rotation controller 350 controls the rotation of the polygon mirror PM of each scanning unit Un (U1 to U6) by controlling the motor drive circuits Drm1 to Drm 6. The rotation controller 350 controls the motor drive circuits Drm1 to Drm6 to synchronously rotate the polygon mirrors PM of the plurality of scanning units Un (U1 to U6) such that the rotational angle positions of the polygon mirrors PM of the plurality of scanning units Un (U1 to U6) have a predetermined phase relationship with each other. Specifically, the rotation controller 350 controls the rotation of the polygon mirror PM in the plurality of scanning units Un (U1 to U6) such that the rotational speeds (numbers of rotations) of the polygon mirrors PM in the plurality of scanning units U1 to U6 are equal to each other and the phases of the rotational angle positions are shifted by a certain angle amount each time. Further, reference numerals PD1 to PD6 in fig. 33 denote control signals output from the rotation control unit 350 to the motor drive circuits Drm1 to Drm 6.

In embodiment 4, the rotational speed Vp of the polygon mirror PM is set to 3.9 ten thousand rpm (650 rps). Further, since the number Np of the reflection surfaces is set to 8, the scanning efficiency (α/β) is set to 1/3, and the reflection surfaces RP on which the spot light SP is scanned are set on every other surface, the phase difference of the rotational angle positions between the six polygon mirrors PM can be set to 15 degrees which is the maximum scanning rotational angle range α. The scanning of the spot light SP is performed in the order of U1 → U2 → U6. Therefore, the rotation controller 350 performs synchronous control so as to rotate the polygon mirror PM at a constant speed while shifting the phase of the rotational angle position of each of the six scanning units U1 to U6 by 15 degrees in this order. Thus, the phase deviation of the rotational angle positions of the scanning unit U1 and the scanning unit U4 is exactly 45 degrees corresponding to the rotational angle of one surface. Therefore, the phases of the rotational angle positions of the scanning unit U1 and the scanning unit U4, that is, the generation timings of the origin signals SZ1 and SZ4 may also coincide. Similarly, since the rotational angle positions of the scanning unit U2 and the scanning unit U5 and the rotational angle positions of the scanning unit U3 and the scanning unit U6 are both shifted by 45 degrees, the generation timings of the origin signals SZ2 and SZ5 from the scanning unit U2 and the scanning unit U5, and the generation timings of the origin signals SZ3 and SZ6 from the scanning unit U3 and the scanning unit U6 may be matched on the time axis.

Specifically, the rotation controller 350 controls the rotation of the polygon mirror PM of each of the scanning units U1 to U6 via the motor drive circuits Drm1 to Drm6 so that the rotation of the polygon mirror PM of the scanning unit U1 and the scanning unit U4, the rotation of the polygon mirror PM of the scanning unit U2 and the scanning unit U5, and the rotation of the polygon mirror PM of the scanning unit U3 and the scanning unit U6 are in the 1 st control state, respectively. The 1 st control state is a state in which the phase difference of the spiral pulse signal output every time the polygon mirror PM rotates once is 0 (zero). That is, the rotations of the polygon mirror PM of the scanning unit U1 and the scanning unit U4 are controlled so that the phase difference of the spiral pulse signals output every time the polygon mirror PM of the scanning unit U1 and the scanning unit U4 rotates once becomes 0 (zero). Similarly, the rotations of the polygon mirror PM of the scanning units U2 and U5, and U3 and U6 are controlled so that the phase difference of the spiral pulse signals output every time the scanning unit U2 and U5, and the scanning unit U3 and the polygon mirror PM of the scanning unit U6 rotate once becomes 0 (zero).

The spiral pulse signal may be a signal that is output once every eight times the origin signal SZn of the scanning unit Un is output by a frequency divider not shown. The spiral pulse signal may be a signal output from an encoder (not shown) provided in the polygon mirror driving unit RM of each scanning unit Un (U1 to U6). A sensor that detects the convolute pulse signal may be provided in the vicinity of the polygon mirror PM. In the example shown in fig. 34, each time the origin signal SZn of the scanning unit Un is output eight times, the convolution pulse signal is generated once, and a part of the origin signal SZn corresponding to the generation of the convolution pulse signal is indicated by a broken line. Note that, if the error of the angle η j formed between the adjacent reflection surfaces RP (for example, the reflection surface RPa and the reflection surface RPb) is not considered (see fig. 29), the origin signals SZ1 and SZ4 are all in phase on the time axis. Similarly, the origin signals SZ2 and SZ5, and the origin signals SZ3 and SZ6 all have the same phase on the time axis regardless of the error of the angle η j formed between the adjacent reflection surfaces RP (see fig. 29). In fig. 34, for easy understanding of the description, it is assumed that there is no error in the angle η j formed by the adjacent reflection surfaces RP.

Then, the rotation control unit 350 controls the rotation of the polygon mirror PM of the scanning units U2 and U5 so that the phase of the rotational angle position of the polygon mirror PM of the scanning units U2 and U5 is shifted by 15 degrees from the rotational angle position of the polygon mirror PM of the scanning units U1 and U4, while maintaining the 1 st control state. Similarly, the rotation controller 350 controls the rotations of the scanning units U3 and U6 so that the phases of the rotational angle positions of the polygon mirrors PM of the scanning units U3 and U6 are shifted by 30 degrees from the rotational angle positions of the polygon mirrors PM of the scanning units U1 and U4, while maintaining the 1 st control state. A time during which the polygon mirror PM rotates by 15 degrees (maximum scanning time of the light beam LBn) is set to Ts.

Specifically, the rotation control unit 350 controls the rotation of the polygon mirror PM in the scanning units U2 and U5 so that the spiral pulse signals obtained from the scanning units U2 and U5 are delayed by a time Ts from the spiral pulse signals obtained from the scanning units U1 and U4 (see fig. 34). Similarly, the rotation control unit 350 controls the rotation of the polygon mirror PM in the scanning units U3 and U6 so that the winding pulse signals obtained from the scanning units U3 and U6 are delayed by 2 × Ts with respect to the winding pulse signals obtained from the scanning units U1 and U4 (see fig. 34). When the rotational speed Vp of the polygon mirror PM is 3.9 ten thousand rpm (650rps), the time Ts is [ 1/(Vp × Np) ] × ([ α/β) ] 1/(650 × 8 × 3) seconds (about 64.1 μ sec). In this manner, by controlling the rotation of the polygon mirror PM of each of the scanning units U1 to U6, the spot light SP can be scanned by each of the scanning units U1 to U6 in time division in the order of U1 → U2 → U6.

The beam switching controller 352 controls the selection optical elements AOMn (AOM1 to AOM6) of the beam switching member 20 to distribute the light beam LB from the light source device 14' to the six scanning units Un (U1 to U6) before the next scanning is started after the scanning of one scanning unit Un is started. Therefore, the beam switching controller 352 causes any one of the beams LB1 to LB6 generated from the beam LB to enter each of the scanning units Un (U1 to U6) by the selective optical elements AOM1 to AOM6 in a time-division manner so that the scanning (deflection) of the beam LBn of the polygon mirror PM of each of the scanning units Un (U1 to U6) is repeated for every reflection surface RP of the polygon mirror PM.

Specifically, the beam switching control unit 352 includes a sub-origin generating circuit CAn (CA1 to CA6) as shown in fig. 31 that generates a sub-origin signal ZPn (ZP1 to ZP6) based on the origin signal SZn (SZ1 to SZ 6). When the sub-origin generation circuits CAn (CA1 to CA6) generate the sub-origin signals ZPn (ZP1 to ZP6), the optical elements AOMn (AOM1 to AOM6) for selection corresponding to the scanning units Un (U1 to U6) resulting from the generation of the sub-origin signals ZPn (ZP1 to ZP6) are turned On for a predetermined time (On time Ton). For example, when the sub origin signal ZP1 is generated, the optical element AOM1 for selection corresponding to the scanning unit U1 resulting from the generation of the sub origin signal ZP1 is set to On for a certain time (On time Ton). The sub-origin signal ZPn is generated based on the origin signal SZn output from the origin sensor OPn, and the frequency of the origin signal SZn is divided into 1/2, that is, the origin signal SZn is divided into half and the time delay Tpx is set. The fixed time (On time Ton) corresponds to a period from a time point of generation of the sub origin signal ZPn to a time point of generation of the sub origin signal ZPn from the scanning unit Un which performs scanning next, that is, corresponds to a time Ts required for the polygon mirror PM to rotate by 15 degrees. When the On time Ton of the selective optical element AOMn is set to be longer than the time Ts, a period in which two of the selective optical elements AOMn are simultaneously in the On state occurs, and the light beams LB1 to LB6 cannot be accurately introduced into the scanning unit Un in which the spot light SP is to be scanned. Thus, the On time Ton is set to Ton ≦ Ts.

At this time, the origin signals SZ1 and SZ4 are all synchronized on the time axis without considering the error of the angle η j formed by the adjacent reflection surfaces RP (for example, the reflection surface RPa and the reflection surface RPb), and are set so that the phases of the sub-origin signal ZP1 and the sub-origin signal ZP4 are shifted by about half a cycle (see fig. 34). The deviation of the sub-origin signal ZP1 from the sub-origin signal ZP4 by about a half cycle is performed by the frequency divider 330 of the sub-origin generating circuit CAn (CA1 to CA 6). That is, the frequency divider 330 shifts the timing of dividing the origin signal SZ1 by approximately half a cycle from the timing of dividing the origin signal SZ4 by half a cycle.

Similarly, the relationship between the ZP2 and ZP5 is set by the frequency divider 330 such that the ZP2 and ZP5 are out of phase by about half a cycle (see fig. 34). Similarly, the relationship between the sub-origin signal ZP3 and the sub-origin signal ZP6 is set by the frequency divider 330 such that the phases of the sub-origin signal ZP3 and the sub-origin signal ZP6 are shifted by about a half cycle (see fig. 34).

Therefore, as shown in fig. 34, the generation timings of the sub-origin signals ZP1 to ZP6 generated by the scanning units U1 to U6 are shifted by the time Ts. In embodiment 4, since the order of the scanning unit Un performing the scanning of the spot light SP is U1 → U2 → U6, when the sub origin signal ZP2 is generated after the lapse of time Ts after the generation of the sub origin signal ZP1, the sub origin signal ZPn is also generated at time Ts intervals in the order of ZP1 → ZP2 → ZP 6. Therefore, the beam switching control unit 352 controls the optical elements AOMn for selection (AOM1 to AOM6) of the beam switching member 20 in accordance with the generated sub-origin signal ZPn (ZP1 to ZP6), and thereby can cause the corresponding beams LB1 to LB6 to enter the scanning unit Un in the order of U1 → U2 → · · → U6. That is, the light flux LBn incident on each scanning unit Un (U1 to U6) can be switched in time division so that the scanning (deflection) of the light flux LBn by the polygon mirror PM of each scanning unit Un (U1 to U6) is repeated every other reflection surface RP of the polygon mirror PM.

The drawing data output control unit 354 outputs serial data DLn corresponding to one column corresponding to the pattern of one drawing line SLn on which the dot light SP is scanned by the scanning unit Un to the drive circuit 206a of the light source device 14' as drawing bit string data Sdw. Since the order of the scanning unit Un performing the scanning of the spot light SP is U1 → U2 → · · · · → U6, the drawing data output control unit 354 outputs the drawing bit string data Sdw in which the serial data DLn of one line size is repeated in the order of DL1 → DL2 → · · → DL 6.

The configuration of the drawing data output control unit 354 will be described in detail with reference to fig. 35. The drawing data output control unit 354 includes six generation circuits 360, 362, 364, 366, 368, 370 corresponding to the respective scan cells U1 to U6, and an OR circuit GT 8. The generating circuits 360 to 370 have the same configuration, specifically, the generating circuit 360 includes a memory BM1, a counter CN1, and a gate GT1, and the generating circuit 362 includes a memory BM2, a counter CN2, and a gate GT 2. The generation circuit 364 includes a memory BM3, a counter CN3, and a gate GT3, and the generation circuit 366 includes a memory BM4, a counter CN4, and a gate GT 4. The generating circuit 368 includes a memory BM5, a counter CN5, and a gate GT5, and the generating circuit 370 includes a memory BM6, a counter CN6, and a gate GT 6. The generation circuits 360 to 370 may have the same configuration as the generation circuits 301, 303, and 305 shown in fig. 16.

The memory units BM1 to BM6 are memories for storing pattern data (bitmaps) corresponding to patterns to be exposed by the respective scan cells Un (U1 to U6). The counter units CN1 to CN6 are counters for outputting the serial data DL1 to DL6, which are the next drawing line SLn among the pattern data stored in the memory units BM1 to BM6, in synchronization with the clock signal CLK for each pixel. As shown in fig. 34, the counter units CN1 to CN6 output the sub-origin signals ZP1 to ZP6 from the sub-origin generation circuits CA1 to CA6 of the beam switching control unit 352, and then output one serial data DL1 to DL 6.

The pattern data stored in the memory units BM1 to BM6 are shifted (shift) in the column direction by an address counter (not shown) or the like, which outputs serial data DL1 to DL 6. That is, the columns read by the address counter, not shown, are shifted so as to be the 1 st, 2 nd, and 3 rd columns. For example, if the shift is performed at the memory BM1 corresponding to the scan cell U1, the timing at which the sub-origin signal ZP2 corresponding to the scan cell U2 that performs the scan is generated after the serial data DL1 is output. Similarly, the shift of the serial data DL2 of the pattern data stored in the memory BM2 is performed at the timing when the sub-origin signal ZP3 corresponding to the scanning cell U3 that performs scanning after the serial data DL2 is output. Similarly, the serial data DL3 to DL6 of the pattern data stored in the memory units BM3 to BM6 are shifted at the timing when the sub-origin signals ZP4 to ZP6 and ZP1 corresponding to the scanning cells U4 to U6 and U1 to be scanned are generated after the serial data DL3 to DL6 are output. Further, the scanning of the spot light SP is performed in the order of U1 → U2 → U3 → · → U6.

In this manner, serial data DL1 to DL6 sequentially output are applied to a six-input OR circuit GT8 by gates GT1 to GT6 that are opened for a certain time (On time Ton) after application of the sub origin signals ZP1 to ZP 6. The OR circuit GT8 outputs serial data DLn repeatedly synthesized in the order serial data DL1 → DL2 → DL3 → DL4 → DL5 → DL6 → DL1 · · · to the drive circuit 206a of the light source device 14' as drawing bit string data Sdw. In this manner, each of the scanning units Un (U1 to U6) can draw and expose a pattern corresponding to the pattern data simultaneously with the scanning of the spot light SP.

In embodiment 4, pattern data is prepared for each of the scanning units Un (U1 to U6), and serial data DL1 to DL6 are output from the pattern data of the scanning units Un (U1 to U6) in the order of the scanning unit Un in which the spot light SP is scanned. However, since the order of the scanning units Un for scanning the spot light SP is predetermined, one pattern data may be prepared by combining the serial data DL1 to DL6 of the pattern data of the scanning units Un (U1 to U6). That is, it is possible to construct one pattern data in which the serial data DLn (DL1 to DL6) of each column of the pattern data of each scanning unit Un (U1 to U6) is arranged in accordance with the order of the scanning units Un that perform scanning of the spot light SP. In this case, serial data DLn of one pattern data may be sequentially output from the first column based on the sub-origin signal ZPn (ZP1 to ZP6) of the origin sensor OPn of each scanning unit Un (U1 to U6).

The exposure control unit 356 shown in fig. 33 is used to control the rotation control unit 350, the beam switching control unit 352, the drawing data output control unit 354, and the like. The exposure control unit 356 analyzes the imaging signals ig (ig1 to ig4) obtained by imaging the alignment microscope AMm (AM1 to AM4), and detects the positions of the alignment marks MKm (MK1 to MK4) on the substrate FS. Then, the exposure control unit 356 detects (specifies) the start position of the writing exposure of the exposure field W on the substrate FS based on the detected positions of the alignment marks MKm (MK1 to MK 4). The exposure control unit 356 includes a counter circuit 356a, and the counter circuit 356a counts detection signals detected by the encoders EN1a to EN3a and EN1b to EN3b shown in fig. 24. The exposure control unit 356 determines whether or not the start position of the drawing exposure of the substrate FS is located on the drawing lines SL1, SL3, and SL5, based on the count values (mark detection positions) obtained by the encoders EN1a and EN1b when the start position of the drawing exposure is detected, and the count values (positions of the odd-numbered drawing lines SLn) obtained by the encoders EN2a and EN2 b. When the exposure control unit 356 determines that the start position of the drawing exposure is located on the drawing lines SL1, SL3, and SL5, the exposure control unit 356 controls the drawing data output control unit 354 to start scanning of the spot light SP by the scanning units U1, U3, and U5. Under the control of the exposure control unit 356, the rotation control unit 350 and the beam switching control unit 352 control the rotation of the polygon mirror PM of each scanning unit Un (U1 to U6) and the distribution of the beam LBn by the beam switching member 20, based on the convolution pulse signal and the sub-origin signal ZPn (ZP1 to ZP 6).

The exposure control unit 356 determines whether or not the start position of the drawing exposure of the substrate FS is located on the drawing lines SL2, SL4, and SL6, based on the count values (mark detection positions) obtained by the encoders EN1a and EN1b when the start position of the drawing exposure is detected, and the count values (positions of even-numbered drawing lines) obtained by the encoders EN3a and EN3 b. When the exposure control unit 356 determines that the start position of the drawing exposure is located on the drawing lines SL2, SL4, and SL6, the exposure control unit 356 controls the drawing data output control unit 354 to start scanning of the spot light SP by the scanning units U2, U4, and U6.

As shown in fig. 25, the drawing exposure of the drawing lines SL1, SL3, and SL5 is performed in accordance with the conveyance direction (+ X direction) of the substrate FS, and after the substrate FS is conveyed a predetermined distance, the drawing exposure of the drawing lines SL2, SL4, and SL6 is performed. On the other hand, since the polygon mirrors PM of the six scanning units U1 to U6 are rotation-controlled while maintaining a constant angular phase with each other, the sub origin signals ZP1 to ZP6 are continuously generated with a phase difference time Ts in order as shown in fig. 34. Therefore, during a period from the start time point of the drawing exposure of the drawing lines SL1, SL3, and SL5 to immediately before the start of the drawing exposure of the drawing lines SL2, SL4, and SL6, the gates GT2, GT4, and GT6 in fig. 35 are opened by the sub-origin signals ZP2, ZP4, and ZP6, and the operations of the selection optical elements AOM2, AOM4, and AOM6 being in the On state for a certain time Ton are repeated. Therefore, in the configuration of fig. 33, a selection gate circuit may be provided in the beam switching control unit 352, the selection gate circuit selecting whether to transmit or prohibit the generated sub-origin signals ZP1 to ZP6 to the drawing data output control unit 354 based on the count values of the encoders EN1a and EN1b or the count values of the encoders EN2a and EN2b determined by the exposure control unit 356. In addition, the sub-origin signals ZP1 to ZP6 may be applied to the driver circuits DRVn (DRV1 to DRV6) (see fig. 38) of the selection optical elements AOM1 to AOM6 corresponding to the respective scan cells U1 to U6 via the selection gate circuits.

Here, as described above, since the drawing lines SL1, SL3, and SL5 are located on the upstream side in the conveyance direction of the substrate FS than the drawing lines SL2, SL4, and SL6, the start position of the drawing exposure of the exposure area W of the substrate FS reaches the drawing lines SL1, SL3, and SL5 first, and then reaches the drawing lines SL2, SL4, and SL6 after a certain time. Therefore, before the start position of the drawing exposure reaches the drawing lines SL2, SL4, and SL6, the drawing exposure of the pattern is performed only by the scanning units U1, U3, and U5. Therefore, when the selector circuits of the sub-origin signals ZP1 to ZP6 as described above are not provided in the light beam switching control unit 352, the exposure control unit 356 sets all the pixel data corresponding to the serial data DL2, DL4, and DL6 in the drawing bit string data Sdw output to the drive circuit 206a of the light source device 14' to low "(0)", thereby substantially canceling the drawing exposure by the scanning units U2, U4, and U6. During the cancel period, the columns of the serial data DL2, DL4, and DL6 output from the memory units BM2, BM4, and BM6 are not shifted and the 1 st column is held. Then, when the start position of the drawing exposure in the exposure field W reaches the drawing lines SL2, SL4, and SL6, the serial data DL2, DL4, and DL6 start to be output, and the serial data DL2, DL4, and DL6 are shifted in the column direction.

Similarly, the end position of the drawing exposure of the exposure field W reaches the drawing lines SL1, SL3, and SL5, and then reaches the drawing lines SL2, SL4, and SL6 after a certain time. Therefore, after the end position of the drawing exposure reaches the drawing lines SL1, SL3, and SL5 and before the end position reaches the drawing lines SL2, SL4, and SL6, the drawing exposure of the pattern is performed only by the scanning units U2, U4, and U6. Therefore, when the selector circuits of the sub-origin signals ZP1 to ZP6 as described above are not provided in the light beam switching control unit 352, the exposure control unit 356 sets all the pixel data corresponding to the serial data DL1, DL3, and DL5 in the drawing bit string data Sdw output to the drive circuit 206a of the light source device 14' to low "(0)", thereby substantially canceling the drawing exposure by the scanning units U1, U3, and U5. In addition, when the select gate circuit is not provided, even during cancellation of the plotting exposure, the optical elements for selection AOM1, AOM3, and AOM5 repeat an operation of selectively turning to the On state for a certain time Ton in response to the sub-origin signals ZP1, ZP3, and ZP5 so that the light beams LB1, LB3, and LB5 are introduced into the scanning units U1, U3, and U5 from which the plotting exposure has been cancelled.

As described above, in embodiment 4, the beam switching member 20 is controlled by the beam switching controller 352 so that the deflection (scanning) of the polygon mirror PM is repeated for every reflection surface RP of the polygon mirror PM of the scanning unit Un (U1 to U6), and the plurality of scanning units Un (U1 to U6) are each sequentially subjected to the one-dimensional scanning of the spot light SP. Thus, one light beam LB can be distributed to the plurality of scanning units Un (U1 to U6) without shortening the length of the drawing line SLn (SL1 to SL6) scanned by the spot light SP, and the light beam LB can be effectively used. Further, since the shape (polygonal shape) of the polygon mirror PM can be made approximately circular, the reduction in the rotational speed of the polygon mirror PM can be prevented, and the polygon mirror PM can be rotated at high speed.

The beam switching member 20 includes optical elements AOMn for selection (AOM1 to AOM6) in which n beams LBn are arranged in series in the traveling direction of the beam LB from the light source device 14', and any one of the n beams LB diffracted and deflected is selected and introduced into the corresponding scanning unit Un. Therefore, any one of the scanning units Un (U1 to U6) into which the light beam LBn is incident can be easily selected, and the light beam LB from the light source device 14' can be efficiently concentrated on one scanning unit Un on which the plotting exposure is to be performed, thereby obtaining a high exposure amount. For example, when the light beam LB emitted from the light source device 14' is amplitude-divided into six light beams by using a plurality of beam splitters, and the six divided light beams LBn (LB1 to LB6) are introduced into the six scanning units U1 to U6 via the drawing acousto-optic modulation elements that are modulated in accordance with the serial data DL1 to DL6 of the drawing data, respectively, the intensity of the spot light SP in one scanning unit Un becomes about 9.3% when the original intensity of the light beam LB is 100% when the attenuation of the light beam intensity in the drawing acousto-optic modulation element is set to 20% and the attenuation of the light beam intensity in the scanning unit Un is set to 30%. On the other hand, as in embodiment 4, when the light beam LB from the light source device 14' is deflected by the selective optical element AOMn and made incident on one of the six scanning units Un, the intensity of the spot light SP in one scanning unit Un becomes about 56% of the original intensity of the light beam LB when the attenuation of the beam intensity in the selective optical element AOMn is set to 20%.

The rotation controller 350 controls the rotation of the polygon mirror PM of the plurality of scanning units Un (U1 to U6) such that the rotation speeds are equal to each other and the phases of the rotational angle positions are shifted by a certain angle amount each time. Thus, while the one-dimensional scanning of the spot light SP by one scanning unit Un is performed until the next one-dimensional scanning is performed, the one-dimensional scanning of the spot light SP by the other plural scanning units Un can be sequentially performed.

In addition, in the above-described embodiment 4, the description has been given of the mode in which one light beam LB is assigned to six scanning units Un, but one light beam LB from the light source device 14' may be assigned to nine scanning units Un (U1 to U9). In this case, if the scanning efficiency (α/β) of the polygon mirror PM is 1/3, the light beam LBn can be distributed to nine scanning units U1 to U9 while the polygon mirror PM rotates by three reflection surfaces RP, and therefore the spot light SP is scanned on every two reflection surfaces RP. Thus, before scanning of the spot light SP by one scanning unit Un is started and the next scanning of the spot light SP is started, the other eight scanning units Un can be sequentially scanned by the spot light SP. Further, when the scanning efficiency of the polygon mirror PM is 1/3, the polygon mirror PM CAn rotate by three reflection surfaces RP to distribute one light beam LB to nine scanning units Un, and therefore, the frequency divider 330 of the sub origin generating circuit CAn divides the frequency of the generation timing of the origin signal SZn into 1/3. In this case, the convolution pulse signals of the scan cells U1, U4, and U7 are synchronized (in phase on the time axis). Similarly, the convolution pulse signals of the scan units U2, U5, and U8 are synchronized, and the convolution pulse signals of the scan units U3, U6, and U9 are synchronized. The convolution pulse signals of the scanning units U2, U5, and U8 are generated with a delay time Ts with respect to the convolution pulse signals of the scanning units U1, U4, and U7, and the convolution pulse signals of the scanning units U3, U6, and U9 are generated with a delay time Ts of 2 × time with respect to the convolution pulse signals of the scanning units U1, U4, and U7. Note that the phases of the generation timings of the sub-origin signals ZP1, ZP4, and ZP7 of the scanning units U1, U4, and U7 are shifted by 1/3 in one cycle, and similarly, the phases of the generation timings of the sub-origin signals ZP2, ZP5, and ZP8 of the scanning units U2, U5, and U8 and the phases of the generation timings of the sub-origin signals ZP3, ZP6, and ZP9 of the scanning units U3, U6, and U9 are also shifted by 1/3 in one cycle. The time Ts is a time during which the polygon mirror PM rotates within the scanning rotation angle range α 'of the polygon mirror PM in which the spot light SP can be scanned, and a value obtained by multiplying the scanning efficiency by the angle β by which the polygon mirror PM rotates by one reflection surface RP becomes the scanning rotation angle range α'.

When the scanning efficiency of the polygon mirror PM is 1/3 and one light beam LB is allocated to 12 scanning units Un (U1 to U12), the light beam LBn can be allocated to 12 scanning units U1 to U12 while the polygon mirror PM rotates by the amount of four reflection surfaces RP, and therefore, the scanning of the spot light SP is performed on every three reflection surfaces RP. When the scanning efficiency of the polygon mirror PM is 1/3, the polygon mirror PM CAn rotate by the four reflection surfaces RP to cause the light beam LBn (LB1 to LB12, a light beam in which the light beam LB from the light source device 14' is alternatively deflected by the 12 selection optical elements AOMn (AOM1 to AOM12) arranged in series) to enter the corresponding one of the scanning units Un (U1 to U12), and therefore the frequency divider 330 of the sub-origin generation circuit CAn divide the frequency of the generation timing of the origin signal SZn into 1/4. In this case, the convolution pulse signals of the scan cells U1, U4, U7, and U10 are synchronized (in phase on the time axis). Similarly, the convolution pulse signals of the scan units U2, U5, U8 and U11 are synchronized, and the convolution pulse signals of the scan units U3, U6, U9 and U12 are synchronized. The convolution pulse signals of the scanning units U2, U5, U8, and U11 are generated with a delay time Ts with respect to the convolution pulse signals of the scanning units U1, U4, U7, and U10, and the convolution pulse signals of the scanning units U3, U6, U9, and U12 are generated with a delay time Ts of 2 × time Ts with respect to the convolution pulse signals of the scanning units U1, U4, U7, and U10. Further, the phases of the generation timings of the sub-origin signals ZP1, ZP4, ZP7, and ZP10 in the scanning units U1, U4, U7, and U10 are shifted by 1/4 periods, and similarly, the phases of the generation timings of the sub-origin signals ZP2, ZP5, ZP7, and ZP11 in the scanning units U2, U5, U8, and U11 and the phases of the generation timings of the sub-origin signals ZP3, ZP6, ZP9, and ZP12 in the scanning units U3, U6, U9, and U12 are also shifted by 1/4 periods.

In addition, in the above-described embodiment 4, the scanning efficiency of the polygon mirror PM of the scanning unit Un was explained as 1/3, but the scanning efficiency may be 1/2 or 1/4. In the case where the scanning efficiency is 1/2, the light beam LBn can be allocated to two scanning units Un during the period in which the polygon mirror PM rotates by the amount of one reflection surface RP, and thus, in the case where one light beam LBn is to be allocated to six scanning units Un, the scanning of the spot light SP is performed by every other two reflection surfaces RP of the polygon mirror PM. That is, in the case where the scanning efficiency of the polygon mirror PM is 1/2, the light beam LBn can be distributed to six scanning units Un during the period in which the polygon mirror PM rotates by the amount of three reflection surfaces RP. Thus, before the scanning of the spot light SP by one scanning unit Un is started and the next scanning of the spot light SP is performed, the other five scanning units Un can be sequentially scanned by the spot light SP. Further, when the scanning efficiency of the polygon mirror PM is 1/2, the polygon mirror PM CAn rotate by three reflection surfaces RP to distribute one light beam LB to six scanning units Un, and therefore, the frequency divider 330 of the sub-origin generating circuit CAn divides the frequency of the generation timing of the origin signal SZn into 1/3. In this case, the convolution pulse signals of the scan cells U1, U3, and U5 are synchronized. Similarly, the convolution pulse signals of the scan cells U2, U4, U6 are synchronized. The convolution pulse signals of the scanning units U2, U4, and U6 are generated with a delay time Ts with respect to the convolution pulse signals of the scanning units U1, U3, and U5. The phases of the generation timings of the sub-origin signals ZP1, ZP3, and ZP5 of the scanning units U1, U3, and U5 are shifted by 1/3 cycles, and the phases of the generation timings of the sub-origin signals ZP2, ZP4, and ZP6 of the scanning units U2, U4, and U6 are also shifted by 1/3 cycles.

In the case where the scanning efficiency of the polygon mirror PM is 1/4, the light beam LBn can be distributed to four scanning units Un during the period in which the polygon mirror PM rotates by the amount of one reflection surface RP, and thus, in the case where one light beam LB is to be distributed to eight scanning units Un, the scanning of the spot light SP is performed for every other reflection surface RP of the polygon mirror PM. That is, in the case where the scanning efficiency of the polygon mirror PM is 1/4, the light beams LBn can be distributed to eight scanning units Un during the period in which the polygon mirror PM rotates by the amount of two reflection surfaces RP. Thus, the other seven scanning units Un can sequentially scan the spot light SP before the scanning of the spot light SP by one scanning unit Un is started until the next scanning of the spot light SP is performed. Further, when the scanning efficiency of the polygon mirror PM is 1/4, since the polygon mirror PM rotates by two reflection surfaces RP and one light beam LB CAn be distributed to eight scanning units Un, the frequency divider 330 of the sub origin generating circuit CAn divide the frequency of the generation timing of the origin signal SZn into 1/2. In this case, the convolution pulse signals of the scan cells U1 and U5 are synchronized, and the convolution pulse signals of the scan cells U2 and U6 are synchronized. Similarly, the convolution pulse signals of the scan cells U3 and U7 are synchronized, and the convolution pulse signals of the scan cells U4 and U8 are synchronized. The convolution pulse signals of the scanning units U2 and U6 are generated with a delay time Ts from the convolution pulse signals of the scanning units U1 and U5. The convolution pulse signals of the scan cells U3 and U7 are generated with a delay of 2 × time Ts with respect to the convolution pulse signals of the scan cells U1 and U5, and the convolution pulse signals of the scan cells U4 and U8 are generated with a delay of 3 × time Ts with respect to the convolution pulse signals of the scan cells U1 and U5. The phases of the generation timings of the sub-origin signals ZP1 and ZP5 in the scanning units U1 and U5 are shifted by 1/2 cycles, and the phases of the generation timings of the sub-origin signals ZP2 and ZP6 in the scanning units U2 and U6 are also shifted by 1/2 cycles. Similarly, the phases of the generation timings of the ZP3 and ZP7 of the sub-origin signals U3 and U7 and the phases of the ZP4 and ZP8 of the sub-origin signals U4 and U8 are shifted by 1/2 cycles.

In embodiment 4, the shape of the polygon mirror PM is an octagon (eight reflection surfaces RP), but may be a hexagon, a heptagon, or an nonagon or more. Thereby, the scanning efficiency of the polygon mirror PM also varies. In general, the scanning efficiency in one reflection surface RP of the polygon mirror PM is larger as the number Np of reflection surfaces of the polygon mirror PM is larger, and the scanning efficiency of the polygon mirror PM is smaller as the number Np of reflection surfaces is smaller.

Since the maximum scanning rotation angle range α of the polygon mirror PM that can scan the spot light SP projected onto the substrate FS is determined by the incident angle of the f θ lens FT (corresponding to the scanning angle range θ s in fig. 29), the polygon mirror PM having the optimum number of reflection surfaces Np can be selected according to the incident angle. In the case of the f θ lens FT having the incident angle (θ s) less than 30 degrees as in the previous example, the 24-plane polygon mirror PM whose reflection surface RP changes by 15 degrees of rotation, which is a half of the angle, or the 12-plane polygon mirror PM whose reflection surface RP changes by 30 degrees of rotation may be used. In this case, since the scanning efficiency (α/β) is in a state of being greater than 1/2 and less than 1.0 in the 24-plane polygon mirror PM, the scanning of the spot light SP is performed by controlling the 24-plane polygon mirror PM of each of the six scanning units U1 to U6 to skip five planes. In the 12-surface polygon mirror PM, since the scanning efficiency is greater than 1/3 and less than 1/2, the 12-surface polygon mirror PM is controlled so as to skip both surfaces and scan the spot light SP for each of the six scanning units U1 to U6.

[ 5 th embodiment ]

In the above-described embodiment 4, the scanning (deflection) of the spot light SP is repeated at every one reflection surface RP of the polygon mirror PM at all times. However, in embodiment 5, the scanning (deflection) of the spot light SP can be arbitrarily switched to the 1 st state repeated for each continuous reflection surface RP of the polygon mirror PM or the 2 nd state repeated for each one reflection surface RP of the polygon mirror PM. That is, until the scanning unit U1 starts scanning of the spot light SP to start the next scanning, it is possible to switch to time-divisionally allocate the light beam LB to three scanning units Un, or time-divisionally allocate to six scanning units Un.

Since the scanning efficiency of the polygon mirror PM is 1/3, when the scanning of the spot light SP is repeated for each successive reflection surface RP of the polygon mirror PM, for example, during a period from when the scanning unit U1 scans the spot light SP to when the next scanning is performed, the light beam LB can be distributed to only two scanning units Un other than the scanning unit U1. Thus, two beams LB are prepared, the first beam LB being time-divisionally assigned to the three scanning units Un, and the second beam LB being time-divisionally assigned to the remaining three scanning units Un. Therefore, the scanning of the spot light SP is performed in parallel by the two scanning units Un. The two light beams LB may be generated by providing two light source devices 14 ', or may be generated by dividing the light beam LB from one light source device 14' by a beam splitter or the like. The exposure apparatus EX according to embodiment 5 shown in fig. 36 to 40 includes two light source devices 14 ' (14A ', 14B ') (see fig. 38). In embodiment 5, the same components as those in embodiment 4 are denoted by the same reference numerals, and only different portions will be described.

Fig. 36 is a structural diagram of a light flux switching member (light flux distributing unit) 20A according to embodiment 5. The beam switching member 20A includes a plurality of optical elements for selection AOMn (AOM1 to AOM6), a plurality of condenser lenses CD1 to CD6, a plurality of mirrors M1 to M12, a plurality of mirrors IM1 to IM6, and a plurality of collimator lenses CL1 to CL6, as with the beam switching member 20 of fig. 26, and further includes mirrors M13 and M14, and absorbers TR1 and TR 2. The absorber TR1 corresponds to the absorber TR shown in fig. 26 described in embodiment 4, and absorbs the light beam LB reflected by the mirror M12.

The optical element module (1 st optical element module) OM1 is constituted by the selective optical elements AOM1 to AOM3, and the optical element module (2 nd optical element module) OM2 is constituted by the selective optical elements AOM4 to AOM 6. As described in embodiment 4, the optical elements AOM1 to AOM3 for selecting the 1 st optical element module OM1 are arranged in series along the traveling direction of the light beam LB. Similarly, the optical elements AOM4 to AOM6 for selection of the 2 nd optical element module OM2 are also arranged in series along the traveling direction of the light beam LB. In addition, the 1 st scanning module is defined as scanning units U1 to U3 corresponding to the optical elements AOM1 to AOM3 for selecting of the 1 st optical element module OM 1. In addition, the 2 nd scanning module is defined as scanning units U4 to U6 corresponding to the optical elements AOM4 to AOM6 for selecting of the 2 nd optical element module OM 2. The scan cells U1 through U3 of the 1 st scan module and the scan cells U4 through U6 of the 2 nd scan module are arranged in a predetermined arrangement relationship as described in the above embodiment 4.

In embodiment 5, the mirrors M6, M13, and M14 constitute an arrangement switching member (movable member) SWE that can be switched between a 1 st arrangement state in which the 1 st optical element module OM1 and the 2 nd optical element module OM2 are arranged in parallel in the traveling direction of the light beam LB and a 2 nd arrangement state in which the 1 st optical element module OM1 and the 2 nd optical element module OM2 are arranged in series in the traveling direction of the light beam LB. The arrangement switching member SWE includes a slide member SE that supports the mirrors M6, M13, and M14, and the slide member SE is movable in the X direction with respect to the support member IUB. The movement of the slide member SE (arrangement switching member SWE) in the X direction is performed by an actuator AC (see fig. 38). The actuator AC is driven under the control of a drive control unit 352a (see fig. 38) of the beam switching control unit 352.

In the 1 st arrangement state, the light fluxes LB from the two light source devices 14 ' (14A ', 14B ') enter the 1 st optical element module OM1 and the 2 nd optical element module OM2 in parallel, and in the 2 nd arrangement state, the light fluxes LB from the one light source device 14 ' (14A ') enter the 1 st optical element module OM1 and the 2 nd optical element module OM 2. That is, in the 2 nd arrangement state, the light beam LB transmitted from the 1 st optical element module OM1 is incident on the 2 nd optical element module OM 2. Fig. 36 shows a state in which the 1 st optical element module OM1 is placed in series with the 2 nd optical element module OM2 in the 2 nd placement state by the placement switching member SWE. That is, in the 2 nd arrangement state, all the optical elements AOM1 to AOM6 for selection of the 1 st optical element module OM1 and the 2 nd optical element module OM2 are arranged in series along the traveling direction of the light beam LB, which is the same as fig. 26 shown in the above-described embodiment 4. Therefore, as in the above-described embodiment 4, one scanning unit Un on which the deflected light beam LBn enters can be selected from the 1 st and 2 nd scanning modules (U1 to U6) by the optical elements AOMn for selection (AOM1 to AOM6) of the 1 st and 2 nd optical element modules OM1 and OM2 arranged in series. The position of the arrangement switching member SWE in fig. 36 is referred to as "position 2". In the 1 st arrangement state, the light beam LB incident on the 1 st optical element module OM1(AOM1 to AOM3) is referred to as a light beam LBa from the 1 st light source device 14A ', and in the 1 st arrangement state, the light beam LB incident on the 2 nd optical element module OM2(AOM4 to AOM6) is referred to as a light beam LBb from the 2 nd light source device 14B'.

When the arrangement switching member SWE moves to the-X direction side to reach the 1 st position, the 1 st optical element module OM1 and the 2 nd optical element module OM2 are in the 1 st arrangement state arranged in parallel. Fig. 37 is a diagram showing the optical paths of the light beams LBa, LBb when the position of the arrangement switching member SWE is the 1 st position. In the 1 st configuration state, the light beam LBa is incident to the 1 st optical element module OM1, and the light beam LBb is incident to the 2 nd optical element module OM 2. In order to distinguish the light beam LB incident on each of the 1 st optical element module OM1 and the 2 nd optical element module OM2, the light beam LB incident on the 1 st optical element module OM1 is denoted by LBa, and the light beam LB directly incident on the 2 nd optical element module OM2 is denoted by LBb.

As shown in fig. 37, when the configuration switching member SWE is moved to the 1 st position, the position of the mirror M6 is displaced in the-X direction, and therefore the light beam LBa reflected by the mirror M6 is incident on the absorber TR2 without being incident on the mirror M7. Therefore, the light beam LBa from the 1 st light source device 14A' incident on the 1 st optical element module OM1 is incident only on the 1 st optical element module OM1 (selective optical elements AOM1 to AOM3), and is not incident on the 2 nd optical element module OM 2. That is, the light beam LBa can be transmitted only from the selective optical elements AOM1 to AOM 3. When the position at which the switching member SWE is disposed is the 1 st position, the light flux LBb emitted from the 2 nd light source device 14B' and traveling in the + Y direction toward the mirror M13 is guided to the mirror M7 by the mirrors M13 and M14. Therefore, the light beam LBb can be transmitted only from the 2 nd optical element module OM2 (selective optical elements AOM4 to AOM 6).

Therefore, the 1 st optical element module OM1 can cause any one of the light beams LB1 to LB3 deflected from the light beam LBa to enter one of the three scanning units U1 to U3 constituting the 1 st scanning module through the three optical elements AOM1 to AOM3 for selection arranged in series. In addition, the 2 nd optical element module OM2 can make any one of the light beams LB4 to LB6 deflected from the light beam LBb incident on one of the three scanning units U4 to U6 constituting the 2 nd scanning module through the three optical elements AOMs 4 to AOM6 for selection arranged in series. Therefore, one scanning unit Un into which the light beam LB is incident can be selected from the 1 st scanning module (U1 to U3) and the 2 nd scanning module (U4 to U6) by the 1 st optical element module OM1(AOM1 to AOM3) and the 2 nd optical element module OM2(AOM4 to AOM6) which are arranged in parallel. In this case, the exposure operation in the scanning of the spot light SP along the drawing line SLn is performed in parallel by one of the scanning units Un in the 1 st scanning module and one of the scanning units Un in the 2 nd scanning module.

The beam switching control unit 352 controls the actuator AC to place the placement switching member SWE at the 1 st position in the 1 st state (1 st drawing mode) in which scanning (deflection) of the spot light SP is repeated for each of the continuous reflection surfaces RP of the polygon mirror PM. In the case of the 2 nd state (the 2 nd drawing mode) in which light flux switching control unit 352 repeats every one reflection surface RP of polygon mirror PM, actuator AC is controlled so that arrangement switching member SWE is arranged at the 2 nd position.

Fig. 38 is a diagram showing the configuration of beam switching control unit 352 according to embodiment 5. Fig. 38 also shows optical elements AOM1 to AOM6 for selection, which are targets to be controlled by the beam switching control unit 352, and the light source devices 14 ' (14A ', 14B '). The light source device 14 'that makes the light beam LBa incident from the 1 st optical element module OM1 is denoted by 14A', and the light source device 14 'that makes the light beam LBb directly incident only to the 2 nd optical element module OM2 is denoted by 14B'.

When the arrangement switching member SWE is at the 2 nd position, as shown in fig. 38, the light beam LBa (lb) from the light source device 14A' can pass (transmit) through the selective optical element AOMn in the order of AOM1 → AOM2 → AOM3 → AOM6, and can enter the absorber TR1 through the light beam LBa having passed through the selective optical element AOM 6. When the arrangement switching member SWE moves to the 1 st position, the light beam LBa can pass through the optical element for selection AOMn from the light source device 14A' in the order of AOM1 → AOM2 → AOM3, and the light beam LBa having passed through the optical element for selection AOM3 can enter the absorber TR 2. In the state where the arrangement switching member SWE has moved to the 1 st position, the light beam LBb from the light source device 14B' can pass through the selective optical element AOMn in the order of AOM4 → AOM5 → AOM6, and the light beam LB having passed through the selective optical element AOM6 can enter the absorber TR 1. The arrangement switching section SWE in fig. 38 is a conceptual diagram, and is different from the actual configuration of the arrangement switching section SWE shown in fig. 36 and 37. In the example shown in fig. 38, the arrangement switching member SWE is in the 2 nd position, that is, in the 2 nd arrangement state in which the 1 st optical element module OM1 and the 2 nd optical element module OM2 are arranged in series, and the optical element AOM5 for selection is in the On state. Thereby, the light beam LB5 deflected by diffraction by the light beam LBa from the light source device 14A' is incident on the scanning unit U5.

The beam switching control unit 352 includes driver circuits DRVn (DRV1 to DRV6) for driving the selection optical elements AOM1 to AOM6 with ultrasonic (high frequency) signals, and a sub-origin generation circuit CAan (CAa1 to CAa6) for generating sub-origin signals ZPn (ZP1 to ZP6) from origin signals SZn (SZ1 to SZ6) from the origin sensors OPn of the respective scanning units Un (U1 to U6). Information On the On time Ton for which the selection optical elements AOM1 to AOM6 are brought into the On state for a certain period of time after receiving the sub-origin signal ZPn (ZP1 to ZP6) is transmitted from the exposure control unit 356 to the driver circuits DRVn (DRV1 to DRV 6). When the sub origin signal ZP1 is transmitted from the sub origin generating circuit CAa1, the driver circuit DRV1 sets the selective optical element AOM1 to the On state for the On time Ton. Similarly, the driver circuits DRV2 to DRV6 set the optical elements for selection AOM2 to AOM6 to the On state at the On time Ton when the child origin signals ZP2 to ZP6 are transmitted from the child origin generation circuits CAa2 to CAa 6. When the rotational speed of the polygon mirror PM is changed, the exposure control unit 356 changes the length of the On time Ton in accordance with the change. Similarly, the driver circuit DRVn (DRV1 to DRV6) is provided in the beam switching control unit 352 of fig. 33 in embodiment 4.

The sub-origin generation circuit CAan (CAa1 to CAa6) includes a logic circuit LCC and a delay circuit 332. The logic circuit LCC of the sub-origin generating circuit CAan (CAa1 to CAa6) receives the origin signal SZn (SZ1 to SZ6) from the origin sensor OPn of each scanning unit Un (U1 to U6). That is, the origin signal SZ1 is input to the logic circuit LCC of the subordinate origin generating circuit CAa1, and similarly, the origin signals SZ2 to SZ6 are input to the logic circuits LCC of the subordinate origin generating circuits CAa2 to CAa 6. The state signal STS is input to the logic circuit LCC of each of the subordinate origin generation circuits CAan (CAa1 to CAa 6). The status signal (logical value) STS is set to "1" in the case of the 1 st state repeated for each continuous reflection surface RP of the polygon mirror PM, and is set to "0" in the case of the 2 nd state repeated for every one reflection surface RP of the polygon mirror PM. The exposure control unit 356 transmits the status signal STS.

Each logic circuit LCC generates an origin signal SZn '(SZ 1' to SZ6 ') based on the input origin signal SZn (SZ1 to SZ6), and outputs the origin signal SZn' to each delay circuit 332. Each delay circuit 332 delays the input origin signal SZn ' (SZ1 ' to SZ6 ') by the time Tpx and outputs a sub-origin signal ZPn (ZP1 to ZP 6).

Fig. 39 is a diagram showing the configuration of a logic circuit LCC to which the origin signal SZn (SZ1 to SZ6) and the status signal STS are input. The logic circuit LCC is composed of a two-input OR gate LC1, a two-input AND gate LC2, AND a one-shot pulse generator LC 3. The status signal STS is applied as one input signal of the OR gate LC 1. The output signal (logical value) of the OR gate LC1 is applied as one input signal of the AND gate LC2, AND the origin signal SZn is applied as the other input signal of the AND gate LC 2. The output signal (logical value) of the AND gate LC2 is input to the delay circuit 332 as the origin signal SZn'. The one-shot pulse generator LC3 normally outputs the signal SDo having a logic value of "1", but outputs the signal SDo having a logic value of "0" only for a certain time Tdp when generating the origin signal SZn ' (SZ1 ' to SZ6 '). That is, the one shot pulse generator LC3 inverts the logic value of the signal SDo only for a certain time Tdp when generating the origin signal SZn ' (SZ1 ' to SZ6 '). The time Tdp is set in a relationship of 2 × Tpx > Tdp > Tpx, preferably Tdp ≈ 1.5 × Tpx.

Fig. 40 is a diagram illustrating a sequence of operations of the logic circuit LCC of fig. 39. The left half of fig. 40 shows a 1 st state in which the scanning of the spot light SP by the scanning units Un (U1 to U6) is performed for each of the successive reflection surfaces RP without skipping, and the right half shows a 2 nd state in which the scanning of the spot light SP by the scanning units Un (U1 to U6) is performed with skipping of one reflection surface RP. In fig. 40, for ease of explanation, the angles η j formed by the adjacent reflection surfaces RP (for example, the reflection surfaces RPa and RPb) of the polygon mirror PM are set to have no error, and the origin signal SZn is generated accurately at the time Tpx intervals.

In the 1 st state where the spot light SP is scanned without skipping on the reflection surface RP, the state signal STS is "1", and therefore, the output signal of the OR gate LC1 is always "1" regardless of the state of the signal SDo. Therefore, the output signal (origin signal SZn') output from the AND gate LC2 is output at the same timing as the origin signal SZn. That is, in the 1 st state, the origin signal SZn and the origin signal SZn' can be regarded as the same. In the 1 st state, the time interval Tpx of the origin signal SZn' applied to the one-shot pulse generator LC3 is less than the time Tpd. Therefore, the signal SDo from the single shot pulse generator LC3 is maintained at "0". Even when there is an error in the angle η j formed by the reflection surfaces RP of the polygon mirror PM, the time interval between the origin signals SZn' is not changed to be shorter than the time Tpd.

When the spot light SP is scanned in the 2 nd state while skipping one reflection surface RP, the state signal STS is switched to "0". Therefore, the output signal of the OR gate LC1 becomes "1" only when the signal SDo is "1". When the origin signal SZn is applied in a state where the signal SDo is "1" (in this case, the output signal of the OR gate LC1 is also "1") (for convenience of explanation, this origin signal SZn is referred to as the first origin signal SZn), the AND gate LC2 outputs the origin signal SZn' in response thereto. However, if the origin signal SZn' is generated, the signal SDo from the one-shot pulse generator LC3 changes to "0" within the time Tpd. Therefore, during the time Tpd, since both inputs of the OR gate LC1 are signals of "0", the output signal of the OR gate LC1 is maintained at "0". Thus, the output signal of the AND gate LC2 is also maintained at "0" during the time Tpd. Therefore, even if the second origin signal SZn is applied to the AND gate LC2 before the time Tpd elapses, the AND gate LC2 does not output the origin signal SZn'.

Then, after the lapse of the time Tpd, the signal SDo from the one-shot pulse generator LC3 is inverted to "1", AND thus the origin signal SZn' corresponding to the third origin signal SZn applied after the lapse of the time Tpd is output from the AND gate LC2, as in the case of the previous first origin signal SZn. By repeating such operations, the logic circuit LCC converts the origin signal SZn repeatedly generated at the time Tpx into the origin signal SZn' repeatedly generated at 2 × time Tpx. From another point of view, the logic circuit LCC generates the origin signal SZn' that divides every other pulse of the origin signal SZn repeatedly generated at the time Tpx, that is, divides the frequency of the generation timing of the origin signal SZn into 1/2. Note that the logic circuit LCC of the sub-origin generating circuit CAan may be replaced with the frequency divider 330 (fig. 31) of the sub-origin generating circuit CAn described in embodiment 4. When the frequency divider 330 is replaced, the frequency divider 330 may divide the frequency of the origin signal SZn to 1/2 in the 2 nd state, and may not divide the frequency of the origin signal SZn in the 1 st state. The sub-origin generating circuit CAn be replaced with the sub-origin generating circuit CAn of embodiment 4 described above as well as the sub-origin generating circuit CAn of embodiment 5. In the 2 nd state, the origin signal SZ1 'output from the logic circuit LCC of the sub-origin generation circuit CAa1 is shifted from the origin signal SZ 4' output from the logic circuit LCC of the sub-origin generation circuit CAa4 by a half-cycle phase. Similarly, the origin signals SZ2 'and SZ 3' output from the logic circuits LCC of the sub-origin generating circuits CAa2 and CAa3 are shifted from the origin signals SZ5 'and SZ 6' output from the logic circuits LCC of the sub-origin generating circuits CAa5 and CAa6 by half-cycle phases.

As described above, by merely inverting the value of the state signal STS input to the logic circuit LCC of each of the sub-origin generating circuits CAa1 to CAa6 of the beam switching control unit 352, it is possible to arbitrarily switch between the 1 st state in which the drawing exposure by the scanning of the spot light SP is repeated for each of the continuous reflection surfaces RP of the polygon mirror PM and the 2 nd state in which the drawing exposure by the scanning of the spot light SP is repeated for each of the one reflection surfaces RP of the polygon mirror PM.

In embodiment 5, the control of the rotation of the polygon mirror PM in each scanning unit Un (U1 to U6) is also the same as in embodiment 4. That is, the rotation of the polygon mirror PM of each scanning unit Un (U1 to U6) is controlled such that the origin signals SZn (SZ1 to SZ6) output from the origin sensor OPn of each scanning unit Un (U1 to U6) have the relationship shown in fig. 34. Therefore, in the 1 st state in which the scanning of the spot light SP is performed for each reflection surface RP without skipping the surface, the scanning units U1 to U3 can repeat the scanning of the spot light SP in the order of U1 → U2 → U3, and the scanning units U4 to U6 can repeat the scanning of the spot light SP in the order of U4 → U5 → U6.

Preferably, the time Tpd set for the one-shot pulse generator LC3 can be changed in accordance with information on the rotational speed of the polygon mirror PM from the exposure control section 356. Note that, even when the spot light SP is scanned while skipping one side, the configuration shown in fig. 39 can be adopted by setting the time Tpd to a relationship of (n +1) × Tpx > Tdp > n × Tpx. Further, n represents the number of skipped reflection surfaces RP. For example, when n is 2, it indicates that the spot light SP is scanned every two reflection surfaces RP, and when n is 3, it indicates that the spot light SP is scanned every three reflection surfaces RP.

Next, the output control of the drawing bit string data Sdw by the drawing data output control unit 354 for the drive circuit 206a of the light source devices 14A 'and 14B' in the 1 st state where the scanning of the spot light SP is performed for each reflection surface RP without skipping over the surface will be briefly described. In the 1 st state, the spot light SP is scanned in parallel by the 1 st scan module (scan cells U1 to U3) and the 2 nd scan module (scan cells U4 to U6). Therefore, the drawing data output control unit 354 outputs drawing bit string data Sdw obtained by synthesizing the serial data DL1 to DL3 corresponding to the scanning units U1 to U3 in time series to the drive circuit 206a of the light source device 14A 'that emits the light beam LBa incident to the 1 st scanning module, and outputs drawing bit string data Sdw obtained by synthesizing the serial data DL4 to DL6 corresponding to the scanning units U4 to U6 in time series to the drive circuit 206a of the light source device 14B' that emits the light beam LBb incident to the 2 nd scanning module.

The drawing data output control unit 354 shown in fig. 35 can be almost used as it is regardless of whether the status signal STS is "1" or "0". In the 1 st state in which the spot light SP is scanned on a reflection surface RP-by-reflection surface RP basis without skipping over the surface, the sub-origin signal ZP2 is generated after the sub-origin signal ZP1 is generated, and the sub-origin signal ZP3 is generated after the time Ts. Therefore, the serial data DL1 to DL3 are repeatedly output from the counter units CN1 to CN3 in the order DL1 → DL2 → DL 3. The serial data DL1 to DL3 sequentially output from the gates GT1 to GT3 opened for a certain time (On time Ton) after the application of the sub-origin signals ZP1 to ZP3 are input to the drive circuit 206a of the 1 st light source device 14A' as the drawn bit string data Sdw. Similarly, in the 1 st state in which the spot light SP is scanned on a reflection surface RP-by-reflection surface RP basis without skipping over the surface, the sub-origin signal ZP4 is generated, the sub-origin signal ZP5 is generated after the time Ts, and the sub-origin signal ZP6 is generated after the time Ts. Therefore, the serial data DL4 to DL6 are repeatedly output from the counter units CN4 to CN6 in the order DL4 → DL5 → DL 6. The serial data DL4 to DL6 sequentially output from the gates GT4 to GT6 opened for a certain time (On time Ton) after the application of the sub-origin signals ZP4 to ZP6 are input to the drive circuit 206a of the 2 nd light source device 14B' as the drawing bit string data Sdw.

Next, the offset of the serial data DL1 to DL6 in the 1 st state will be briefly described. The shift of the serial data DL1 in the column direction is performed at the timing when the serial data DL1 is output and the sub-origin signal ZP2 corresponding to the scanning unit U2 which performs scanning next. The shift of the serial data DL2 in the column direction is performed at the timing when the serial data DL2 is output and the sub-origin signal ZP3 corresponding to the scanning unit U3 which performs scanning next. The shift of the serial data DL3 in the column direction is performed at the timing when the serial data DL3 is output and the sub-origin signal ZP1 corresponding to the scanning unit U1 which performs scanning next. The shift of the serial data DL4 in the column direction is performed at the timing when the serial data DL4 is output and the sub-origin signal ZP5 corresponding to the scanning cell U5 which performs scanning next occurs. The shift of the serial data DL5 in the column direction is performed at the timing when the serial data DL5 is output and the sub-origin signal ZP6 corresponding to the scanning unit U6 which performs scanning next. The shift of the serial data DL6 in the column direction is generated at the timing of the generation of the sub-origin signal ZP4 corresponding to the scanning unit U4 that scans after the output of the serial data DL6 is completed. The output control of the drawing bit string data Sdw in the 2 nd state is the same as that in embodiment 4, and therefore, the description thereof is omitted. The control of outputting the drawing bit string data Sdw in the 1 st state is the same as the control principle of the above-described embodiments 1 to 3, and only the order of the serial data DLn to be output is different. That is, the difference is whether serial data DLn is output in the order of DL1 → DL3 → DL5, DL2 → DL4 → DL6, or in the order of DL1 → DL2 → DL3, DL4 → DL5 → DL6, respectively.

In the case of the 2 nd state in which the scanning of the spot light SP is performed while skipping one reflection surface RP, the scanning start interval of the spot light SP in each scanning unit Un (U1 to U6) is longer than that in the 1 st state in which the scanning of the spot light SP is performed for each reflection surface RP without skipping the surface. For example, when scanning the spot light SP while skipping one reflection surface RP, the scanning start interval of the spot light SP in each scanning unit Un (U1 to U6) is 2 times as large as that in the case of not skipping the surface. In addition, when the two reflection surfaces RP are skipped, the scanning start interval of the spot light SP is 3 times as large as that when the surfaces are not skipped. Therefore, if the rotational speed of the polygon mirror PM and the conveyance speed of the substrate FS are made the same in the 1 st state and the 2 nd state, the exposure results are different in the 1 st state and the 2 nd state.

Therefore, the exposure control unit 356 may have a control mode in which at least one of the rotational speed of the polygon mirror PM and the conveyance speed of the substrate FS is changed (corrected) in the 1 st state and the 2 nd state so that the exposure results in the 1 st state and the 2 nd state are in the same state. For example, the scanning start interval of the spot light SP in the 1 st state and the scanning start interval of the spot light SP in the 2 nd state are 1: in case 2, the exposure control unit 356 sets the ratio of the rotational speed of the polygon mirror PM in the 1 st state to the rotational speed of the polygon mirror PM in the 2 nd state to 1: mode 2, the rotation control unit 350 is controlled. Specifically, the rotational speed of the polygon mirror PM in the 1 st state is set to 2 ten thousand rpm, and the rotational speed of the polygon mirror PM in the 2 nd state is set to 4 ten thousand rpm. Accordingly, the light emission frequency Fs of the light beam LB (LBa, LBb) of the light source device 14 ' (14A ', 14B ') is set to 400MHz in the 1 st state and 200MHz in the 2 nd state, for example. This makes it possible to make the interval of the generation timing of the sub-origin signal ZPn in the 1 st state substantially equal to the interval of the generation timing of the sub-origin signal ZPn in the 2 nd state.

For example, the exposure control unit 356 may have a scanning start interval of the spot light SP in the 1 st state and a scanning start interval of the spot light SP in the 2 nd state of 1: 2, so that the ratio of the conveyance speed of the substrate FS in the 1 st state to the conveyance speed of the substrate FS in the 2 nd state is 2: the mode 1 is a control mode for controlling the rotation speeds of the driving rollers R1 to R3 and the rotary drum DR. By either the control mode (the scanning correction mode) for correcting the rotation speed and/or the light emission frequency Fs (the frequency of the clock signal LTC) of the polygon mirror PM and the control mode (the conveyance correction mode) for correcting the conveyance speed of the substrate Fs as described above, the interval in the X direction of the drawing lines SLn (SL1 to SL6) on the substrate Fs in the 1 st state and the interval in the X direction of the drawing lines SLn (SL1 to SL6) on the substrate Fs in the 2 nd state can be made to be the same interval (for example, 1.5 μm). In the 1 st state and the 2 nd state, the pattern data (bitmap) stored in each of the memory units BM1 to BM6 in the drawing data output control unit 354 can be used as it is without any correction.

In addition, both the scan correction mode and the conveyance correction mode described above may be used to perform correction so that the pattern drawn on the substrate FS in the 1 st state is equivalent to the pattern drawn on the substrate FS in the 2 nd state. For example, in the 1 st state (in the case of beam scanning for each reflecting surface RP of the polygon mirror PM), when the rotational speed of the polygon mirror PM is 2 ten thousand rpm, the emission frequency Fs of the beam LB of the light source device 14 ' (14A ', 14B ') is 200MHz, and the transport speed of the substrate Fs is 5 mm/sec, in the 2 nd state (in the case of skipping beam scanning for one reflecting surface RP of the polygon mirror PM), the transport speed of the substrate Fs may be set to be 3.75 mm/sec at a deceleration of-25% instead of half, the rotational speed of the polygon mirror PM may be set to be 1.5 times and 3 ten thousand rpm, and the emission frequency Fs of the beam LB may be set to be 1.5 times and 300 MHz. In this way, if the scanning correction mode and the conveyance correction mode are combined, in the case of the 2 nd state, it is not necessary to reduce the conveyance speed of the substrate FS to half, and thus an extreme decrease in productivity is suppressed.

In embodiment 5 as well, the number of scanning units Un to which the light beams LBa, LBb are assigned may be arbitrarily changed as described in embodiment 4. The scanning efficiency of the polygon mirror PM may be arbitrarily changed. In embodiment 5, since the scanning efficiency of the polygon mirror PM is 1/3 and the number of scanning units Un is six, the six optical elements for selection AOMn (AOM1 to AOM6) are divided into two optical element modules OM1 and OM2, and the six scanning units Un (U1 to U6) are divided into two scanning modules in accordance with the two optical element modules OM1 and OM 2. However, when the scanning efficiency of the polygon mirror PM is 1/M and the number of the scanning units Un and the selecting optical elements AOMn is Q, the Q selecting optical elements AOMn may be divided into Q/M optical element modules OM1, OM2, · · · · · · · · · · and the Q scanning units Un may be divided into Q/M scanning modules. In this case, it is preferable that the number of the optical elements AOMn for selection included in each of the optical element modules OM1, OM2, and · · be equal, and that the number of the scanning units Un included in each of Q/M scanning modules be equal. Further, Q/M is preferably a positive number (integer). That is, Q is preferably a multiple of M.

For example, when the scanning efficiency of the polygon mirror PM is 1/2, and the number of the scanning units Un and the optical elements for selection AOMn is six, the six optical elements for selection AOMn may be equally divided into three optical element modules OM1, OM2, and OM3, and the six scanning units Un may be equally divided into three scanning modules. In the case of the 1 st state, the three optical element modules OM1, OM2, and OM3 may be arranged in parallel, and the light beams LB from the three light source devices 14 '(in this case, LBa, LBb, and LBc) may be incident on the three optical element modules OM1, OM2, and OM3 in parallel, respectively, and in the case of the 2 nd state, the three optical element modules OM1, OM2, and OM3 may be arranged in series, and the light beams LB from the one light source device 14' may be incident sequentially through the three optical element modules OM1, OM2, and OM 3.

As described above, in the present embodiment 5, the beam switching control unit 352 controls the beam switching member 20A to sequentially perform one-dimensional scanning of the spot light SP by each of the plurality of scanning units Un such that the deflection (scanning) of the beam LBn (spot light SP) by the polygon mirror PM of the scanning unit Un is switched to either the 1 st state (1 st drawing mode) which is repeated for each of the continuous reflection surfaces RP of the polygon mirror PM or the 2 nd state (2 nd drawing mode) which is repeated for every other reflection surface RP of at least one surface of the polygon mirror PM. This makes it possible to switch between scanning of the spot light SP over a surface and scanning of the spot light SP without skipping over a surface, while obtaining the same effect as in embodiment 4.

In the case of the 1 st state, when the scanning efficiency (α/β) of the polygon mirror PM is less than 1/2, the scanning units Un whose number corresponds to the reciprocal of the scanning efficiency are grouped into one scanning module, and one of the scanning units Un is caused to perform one-dimensional scanning of the spot light SP for each scanning module by using a plurality of the grouped scanning modules. This allows the same number of drawing lines SLn as the number of scanning modules among the plurality of drawing lines SLn to be simultaneously scanned by the spot light SP. In the case of the 2 nd state, since the control is performed so that the light beam scanning is performed for every reflection surface RP of at least one surface of the polygon mirror PM, even if there are a plurality of scanning units Un whose number is larger than the reciprocal of the scanning efficiency (α/β) of the polygon mirror PM, the light beam LB can be effectively used, and the plurality of scanning units Un all scan the spot light SP along the scanning line SLn.

In the case of the above-described state 1, since the light beams LBa and LBb from the light source devices 14A 'and 14B' are incident in parallel On the two grouped scanning modules, the optical elements AOM1 to AOM6 in the light beam switching member 20A are switched On/Off in such a manner that the light beams are incident On the scanning units U1 to U6 corresponding to the light beams LB1 to LB6 in units of the grouped scanning modules by the light beam switching control unit 352.

Configuration switching section SWE provided in beam switching section 20A switches the 1 st configuration state and the 2 nd configuration state, in the 1 st configuration state, the three optical elements for selection AOMs 1 to AOM3 are connected in series along the optical path of the light beam LBa in such a manner that the light beam LBa from the 1 st light source device 14A 'is allocated as the light beams LB1 to LB3 to each of the three scanning units U1 to U3 out of the six scanning units U1 to U6, and the light beam LBb from the 2 nd light source device 14B' is allocated as the light beams LB4 to LB6 to each of the remaining three scanning units U4 to U6, and optical elements AOM 4-AOM 6 are optionally connected in-line along the optical path of beam LBb, in the 2 nd arrangement state, the six optical elements AOM1 to AOM6 for selection are connected in series along the optical path of the light beam LBa in such a manner that the light beam LBa from one light source device 14A' is allocated as the light beams LB1 to LB6 to each of the six scanning units U1 to U6.

Thus, in the case of the 1 st state, by setting the switching member SWE to the 1 st arrangement state, the scanning units U1 to U6 can repeat scanning by the spot light SP for each continuous reflection surface RP of the polygon mirror PM, and two scanning units of the six scanning units U1 to U6 can perform scanning by the spot light SP at substantially the same time. In the case of the 2 nd state, by setting the switching member SWE to the 2 nd arrangement state, although the beam scanning is performed on the reflection surface RP of at least one surface of the polygon mirror PM, the scanning by the spot light SP can be repeated by all of the six scanning units U1 to U6.

Therefore, according to the present embodiment 5, when the configuration switching member SWE is set to be in the 2 nd arrangement state using one light source device 14A 'and then the conveyance speed of the substrate FS is to be increased in mounting the drawing device at the time of initial setting, the configuration switching member SWE may be set to be in the 1 st arrangement state by adding the 2 nd light source device 14B', and the drawing device can be upgraded by a simple operation such as addition of the light source device and switching of the configuration switching member SWE in hardware.

In each of the above embodiments, the origin signal SZn is detected using the reflection surface RP located at the front in the rotational direction of the polygon mirror PM with respect to the reflection surface RP of the polygon mirror PM that deflects the light flux LBn, but the origin signal SZn may be detected using the reflection surface RP itself that deflects the light flux LBn. In this case, the delay time Tpx of the origin signal SZn or the origin signal SZn 'obtained from the origin signal SZn is not required, and therefore, the origin signal SZn or the origin signal SZn' may be the sub-origin signal ZPn.

In the above-described embodiments 4 and 5, the electro-optical element 206 as the drawing optical modulator of the light source device 14 ' (14A ', 14B ') is switched using the drawing bit string data Sdw, but the drawing optical element AOM may be used as the drawing optical modulator as in the embodiment 2. The drawing optical element AOM is an Acousto-Optic Modulator (AOM). That is, in embodiment 4, the drawing optical element AOM may be disposed between the light source device 14 'and the primary selective optical element AOM1, and the light beam LB from the light source device 14' transmitted through the drawing optical element AOM may be made incident on the selective optical element AOM 1. In this case, the drawing optical element AOM switches according to the drawing bit string data Sdw. Even in this case, the same effects as those of embodiment 4 can be obtained.

In the above-described embodiment 5, the drawing optical elements AOMs (AOMa, AOMb) are respectively arranged between the 1 st light source device 14A 'and the primary selective optical element AOM1 of the 1 st optical element module OM1, and between the 2 nd light source device 14B' and the primary selective optical element AOM4 of the 2 nd optical element module OM 2. That is, light beam LBa from light source apparatus 14A 'transmitted through drawing optical element AOMa is incident on selective optical element AOM1, and light beam LBb from light source apparatus 14B' transmitted through drawing optical element AOMb is incident on selective optical element AOM 4. In this case, in the 1 st state, the drawing optical element AOMa switches according to the drawing bit string data Sdw composed of the serial data DL1 to DL3, and the drawing optical element AOMb switches according to the drawing bit string data Sdw composed of the serial data DL4 to DL 6. In the 2 nd state, the drawing optical element AOMa only switches from the drawing bit string data Sdw composed of the serial data DL1 to DL 6.

As in embodiment 1, the drawing optical element AOM as a drawing optical modulator may be provided for each scanning unit Un. In this case, the drawing optical element AOM may be provided in front of the mirror M20 (see fig. 28) of each scanning unit Un. The drawing optical elements AOM of the scanning units Un (U1 to U6) are switched according to the serial data DLn (DL1 to DL 6). For example, the drawing optical element AOM of the scan cell U3 is switched according to the serial data DL 3.

[ 6 th embodiment ]

Fig. 41 shows a structure of a light flux switching member (light flux distributing unit) 20B of embodiment 6, in which a light flux lbw (lb) emitted from one light source device 14' and incident on the light flux switching member 20B is set to be a circularly polarized parallel light flux. The beam switching member 20B includes six optical elements AOM1 to AOM6 for selection, two absorbers TR1 and TR2, six lens systems CG1 to CG6, mirrors M30, M31, M32, a condenser lens CG0, a polarization beam splitter BS1, and two optical elements (acousto-optic modulation elements) AOMa and AOMb for drawing. Note that the same reference numerals are given to the same components as those in embodiment 4 or embodiment 5.

The light beam LBw incident to the beam switching section 20B passes through the condenser lens CG0 and is separated into a linear P-polarized light beam LBp and a linear S-polarized light beam LBs by the polarization beam splitter BS 1. The S-polarized light beam LBs reflected by the polarization beam splitter BS1 is incident on the drawing optical element AOMa. The light beam LBs incident on the drawing optical element AOMa is converged to a beam waist within the drawing optical element AOMa by the condensing action of the condenser lens CG 0. The drawing optical element AOMa is applied with drawing bit string data sdw (dln) as shown in fig. 19 via the driver circuit DRVn. The drawing bit string data Sdw is obtained by synthesizing serial data DL1, DL3, and DL5 corresponding to the odd-numbered scan cells U1, U3, and U5, respectively. Therefore, when the drawing bit string data sdw (dln) is "1", the drawing optical element AOMa is in an On state, and emits the first order diffracted light of the incident light flux LBs as a deflected drawing light flux (intensity-modulated light flux) toward the mirror M31. The tracing light beam reflected by the mirror M31 passes through the lens system CG1 and is incident on the optical element for selection AOM 1. When the drawing bit string data sdw (dln) is "0", the zero-order Light (LBs) emitted from the drawing optical element AOMa is reflected by the mirror M31, but travels at an angle not incident on the subsequent lens system CG 1. Further, the lens system CG1 converges the drawing beam divergently emitted from the drawing optical element AOMa into a beam waist at the diffraction portion of the selection optical element AOM 1.

The drawing light beam transmitted through the selective optical element AOM1 enters the selective optical element AOM3 through the same lens system CG3 as the lens system CG1, and the drawing light beam transmitted through the selective optical element AOM3 enters the selective optical element AOM5 through the same lens system CG5 as the lens system CG 1. The following state is shown in fig. 41: the three optical elements AOM1, AOM3, and AOM5 are arranged in series along the beam optical path, and only one of the optical elements AOM3 is On, and the drawing beam intensity-modulated by the drawing optical element AOMa is incident On the corresponding scanning unit U3 as a beam LB 3. Further, the lens systems CG1, CG3, and CG5 correspond to a combination of one collimator lens CL and one condenser lens CD in fig. 26 or fig. 36.

On the other hand, the P-polarized light beam LBp transmitted from the polarization beam splitter BS1 is reflected by the mirror M30 and enters the drawing optical element AOMb. The light flux LBp incident on the drawing optical element AOMb is converged to a beam waist within the drawing optical element AOMb by the condensing action of the condenser lens CG 0. In the drawing optical element AOMb, drawing bit string data sdw (dln) as shown in fig. 19 is applied via the driver circuit DRVn. The drawing bit string data Sdw is obtained by synthesizing serial data DL2, DL4, and DL6 corresponding to even-numbered scan cells U2, U4, and U6, respectively. Therefore, when the drawing bit string data sdw (dln) is "1", the drawing optical element AOMb is in an On state, and emits the first order diffracted light of the incident light flux LBp as a deflected drawing light flux (intensity-modulated light flux) toward the mirror M32. The tracing light beam reflected by the mirror M32 passes through the same lens system CG2 as the lens system CG1 and is incident on the optical element for selection AOM 2. When the drawing bit string data sdw (dln) is "0", the zero-order light (LBp) emitted from the drawing optical element AOMb is reflected by the mirror M32, but travels at an angle not incident on the subsequent lens system CG 2. Further, the lens system CG2 converges the drawing beam divergently emitted from the drawing optical element AOMb into a beam waist at the diffraction portion of the selection optical element AOM 2.

The drawing light beam transmitted through the selective optical element AOM2 enters the selective optical element AOM4 through the same lens system CG4 as the lens system CG1, and the drawing light beam transmitted through the selective optical element AOM4 enters the selective optical element AOM6 through the same lens system CG6 as the lens system CG 1. In fig. 41, the following state is shown: the three optical elements AOM2, AOM4, and AOM6 are arranged in series along the optical path of the light beam, only the optical element AOM2 is On, and the drawing light beam intensity-modulated by the drawing optical element AOMb is incident On the corresponding scanning unit U2 as the light beam LB 2. Further, the lens systems CG2, CG4, and CG6 correspond to a combination of one collimator lens CL and one condenser lens CD in fig. 26 or fig. 36.

By using the light flux switching member (light flux distributing unit) 20B as shown in fig. 41, the light flux LBw from one light source device 14' can be divided into two by the polarization beam splitter BS1, and the drawing light flux (LB1, LB3, LB5) generated by passing one light flux LBs through the drawing optical element AOMa is sequentially made incident on one of the odd-numbered scanning units U1, U3, U5, and the drawing light flux (LB2, LB4, LB6) generated by passing the other light flux LBp divided by the polarization beam splitter BS1 through the drawing optical element AOMb is sequentially made incident on one of the even-numbered scanning units U2, U4, U6.

In embodiment 6, the light beam LBw from the light source device 14' is split into two beams by the polarization beam splitter BS1, and then intensity modulation of the light beam LB based on the pattern data is performed by the drawing optical elements AOMa and AOMb, so that attenuation of the spot light SP of each of the six scanning units U1 to U6 in the polarization beam splitter BS1 is-50%, attenuation in the drawing optical elements AOMa, AOMb and the selection optical elements AOMn is-20%, and attenuation in the scanning units U1 to U6 is-30%, which is about 22.4% of the original intensity (100%) of the light beam LBw. However, when the scanning efficiency of the polygon mirror PM of each of the six scanning units U1 to U6 is 1/3 or less and the light beam LBw from one light source device 14' is used, the light beam scanning is performed without skipping over one reflection surface RP of the polygon mirror PM, and the pattern drawing by the scanning of the spot light SP can be performed on each of the six scanning lines SLn.

[ modification 1 ]

As in embodiment 6, when the polarization direction of the light beam LBs incident on the odd-numbered selective optical elements AOM1, AOM3, and AOM5 is orthogonal to the polarization direction of the light beam LBp incident on the even-numbered selective optical elements AOM2, AOM4, and AOM6, it is necessary to arrange the odd-numbered selective optical elements AOMn and the even-numbered selective optical elements AOMn so as to be rotated by 90 degrees about the light beam incident axis. Fig. 42 shows a structure in a case where, for example, the optical element for selection AOM3 among the optical elements for selection AOM1, AOM3, and AOM5 of odd numbers is arranged to be rotated by 90 degrees with respect to the optical element for selection AOMn of even numbers. Since the optical element for selection AOM3 makes the S-polarized drawing light beam passing through the lens system CG3 incident, the direction in which the diffraction efficiency is high becomes the Y direction parallel to the XY plane. That is, the selective optical element AOM3 is disposed so as to be rotated by 90 degrees so that the periodic direction of the diffraction grating generated in the selective optical element AOM3 becomes the Y direction.

With such arrangement of the optical element for selection AOM3, the light beam LB3 deflected to be emitted when the optical element for selection AOM3 is in the On state travels obliquely in the Y direction with respect to the traveling direction of the zero-order light. Therefore, a mirror IM3a that reflects the light beam LB3 from the selective optical element AOM3 in the XY plane so as to separate the light beam LB3 from the optical path of the zero-order light and pass the light beam LB3 in the Z direction through the opening TH3 of the support member IUB, and a mirror IM3b that reflects the light beam LB3 reflected by the mirror IM3a in the-Z direction so as to pass through the opening TH3 are provided. Similarly, the group of mirrors IM1a and IM1b and the group of mirrors IM5a and IM5b are provided for the other odd-numbered optical elements for selection AOM1 and AOM5, respectively. In the configuration of fig. 41, the polarization directions of the beams LBs and LBp incident on the drawing optical elements AOMa and AOMb are orthogonal to each other, and therefore the drawing optical elements AOMa and AOMb are arranged in a relationship of being rotated by 90 degrees about the beam incident axis.

However, when the polarization beam splitter BS1 in fig. 41 is an amplitude-splitting beam splitter or half mirror, if the polarization direction of the light beam LBw is set to only one direction (for example, P polarization), it is not necessary to arrange one of the drawing optical elements AOMa and AOMb, one of the odd-numbered selection optical elements AOMn and the even-numbered selection optical elements AOMn so as to be relatively rotated by 90 degrees as shown in fig. 42.

[ modification 2 ]

In embodiment 6, all of the scanning units U1 to U6 corresponding to the six optical elements AOM1 to AOM6 for selection can scan the spot light SP along the drawing lines SL1 to SL6 on the entire reflection surface RP of the polygon mirror PM. Therefore, the light beams (light beams modulated by the drawing optical element AOMa) sequentially passing through the odd-numbered selective optical elements AOM1, AOM3, and AOM5 are incident, the three selective optical elements AOM7, AOM9, and AOM11 are further arranged in line between the selective optical element AOM5 and the absorber TR2 in fig. 41, and the three selective optical elements AOM8, AOM10, and AOM12 are further arranged in line between the selective optical element AOM6 and the absorber TR1, such that the light beams (light beams modulated by the drawing optical element AOMb) sequentially passing through the even-numbered selective optical elements AOM2, AOM4, and AOM6 are incident. In addition, six scanning units U7 to U12 into which the beams LB7 to LB12 deflected (switched) by the optical elements AOM7 to AOM12 for selection are introduced are added, and a total of 12 scanning units U1 to U12 are arranged in the width direction (Y direction) of the substrate FS. This enables the bonding drawing exposure of 12 drawing lines SL1 to SL12, and the maximum exposure width in the Y direction can be increased by 2 times.

In this case, when the scanning efficiency of the polygon mirror PM of each of the scanning units U1 to U12 is 1/3 or less, the odd-numbered scanning units U1, U3, U5, U7, U9, and U11 grouped as the 1 st drawing module and the even-numbered scanning units U2, U4, U6, U8, U10, and U12 grouped as the 2 nd drawing module each scan the light beam LBn on one reflection surface RP of the polygon mirror PM. Even when the width of the substrate FS in the Y direction is increased in this manner, a large exposure area W (fig. 5 and 25) can be pattern-drawn only by adding the scanning units U7 to U12, the optical elements for selection AOM7 to AOM12, and the like. In this manner, the configuration in which six scan cells U7 to U12 and the selection optical elements AOM7 to AOM12 are added to form 12 scan cells U1 to U12 can be similarly applied to the case where the two light source devices 14A 'and 14B' are used as described in embodiment 5 (fig. 36 to 38).

[ modification 3 ]

Fig. 43 shows the arrangement relationship between the substrate FS transport mode of modification 3 and the scanning units Un (scanning lines SLn), and here, as in modification 2, 12 scanning units U1 to U12 are provided, and the scanning units Un are arranged on the rotary drum DR so that the scanning lines SL1 to SL12 can be joined in the Y direction for the drawing exposure. Further, the length in the rotation axis direction (Y direction) of the rotary drum DR and the various rollers R1 to R3, RT1, RT2, and the like in the substrate conveyance mechanism 12 shown in fig. 23 is Hd, the maximum scan width in the Y direction that can be exposed by joint drawing of the 12 scan units Un is Sh (Sh < Hd), and the maximum support width of the substrate FS0 that can be exposed is Tf. The 12 scanning units U1 to U12 corresponding to the 12 drawing lines SL1 to SL12 in modification 3 are configured such that the corresponding 12 light fluxes LB1 to LB12 are incident in time division from a light flux switching member (light flux distributing unit) 20B of a system in which the light flux LBw from one light source device 14 ' is divided into two by a beam splitter or a half mirror as in fig. 41 (embodiment 6), or from a light flux switching member (light flux distributing unit) 20A of a system in which the light fluxes LBa, LBb from the two light source devices 14A ', 14B ' are used as in fig. 38 (embodiment 5). Therefore, for example, when the lengths of the respective drawing lines SL1 to SL12 in the Y direction are 50mm, the maximum scanning width Sh is 600mm, and as an example, the width of the substrate FS0 that becomes the maximum support width Tf can be 650mm, and the length Hd of the rotary drum DR can be about 700 mm.

When exposure of the substrate FS0 having the same width as the maximum support width Tf is performed by the drawing device shown in fig. 43, three alignment microscopes AM5 to AM7 (observation regions Vw5 to Vw7) are added in the Y direction in addition to the four alignment microscopes AM1 to AM4 (observation regions Vw1 to Vw4) shown in fig. 24 and 25. In this case, the alignment microscopes AM1 (observation region Vw1) and AM7 (observation region Vw7) located on both sides in the width direction of the substrate FS0 detect alignment marks formed at a certain pitch in the X direction on both sides of the substrate FS 0. The alignment microscope AM4 (observation region Vw4) is disposed so as to be located at the substantially center of the maximum support width Tf.

In the case of the substrate FS1 that can draw a pattern on the exposure field W by the drawing lines SL1 to SL6 of the six scan units U1 to U6 as described in the above embodiments, the substrate FS1 is conveyed toward the-Y direction side of the outer peripheral surface of the rotary drum DR, for example, because the width Tf1 is about half of the maximum support width Tf of the rotary drum DR. At this time, the alignment marks MK1 to MK4 (fig. 25) on the substrate FS1 can be detected by the observation regions Vw1 to Vw4 of the four alignment microscopes AM1 to AM4, respectively. In addition, in the case of exposure of the substrate FS1, since only six scanning units U1 to U6 are required, the scanning units U1 to U6 can perform point scanning along the respective drawing lines SL1 to SL6 both in a beam scanning mode for each continuous reflection surface RP of the polygon mirror PM and in a beam scanning mode for each single reflection surface RP of the polygon mirror PM.

For example, in the case where the light beams LBa, LBb from the two light source devices 14A ', 14B' are set to be used simultaneously as in embodiment 5, the light beams LBa from the light source device 14A 'are grouped in the beam switching section 20A so that the optical elements AOM1, AOM3, AOM5, AOM7, AOM9, AOM11 for selection corresponding to the odd-numbered scanning units U1, U3, U5, U7, U9, U11 are transmitted in line through the optical elements AOM1, AOM3, AOM5, AOM7, AOM9, AOM11 for selection corresponding to the even-numbered scanning units U2, U4, U6, U8, U10, U12, and the optical elements AOM2, AOM9, 686m 695m 6, AOM8, U10, AOM12 are transmitted in line through the optical elements LBa from the light source device 14A'. In the exposure of the substrate FS1, the control is performed such that the beam scanning for each successive reflection surface RP of the polygon mirror PM is repeated in the order of odd-numbered scanning units U1, U3, and U5 only based on the three origin signals SZ1, SZ3, and SZ5 output for each successive reflection surface RP of the polygon mirror PM, and the control is performed such that the beam scanning for each successive reflection surface RP of the polygon mirror PM is repeated in the order of even-numbered scanning units U2, U4, and U6 only based on the three origin signals SZ2, SZ4, and SZ6 output for each successive reflection surface RP of the polygon mirror PM.

When exposing a substrate FS2 having a width Tf2 smaller than the maximum support width Tf and larger than the width Tf1 of the substrate FS1, the substrate FS2 is aligned with the center portion of the maximum support width Tf of the rotary drum DR and conveyed. At this time, the exposure area W on the substrate FS2 can be drawn by the drawing lines SL3 to SL10 of the eight scanning units U3 to U10 connected in the Y direction, respectively. In this case, the control is performed such that the odd-numbered four selection optical elements AOM3, AOM5, AOM7, and AOM9 of the light beam LBa (intensity-modulated light beam) incident from the light source device 14A 'sequentially generate one of the light beams LB3, LB5, LB7, and LB9 in a time-division manner, and the even-numbered four selection optical elements AOM4, AOM6, AOM8, and AOM10 of the light beam LBb (intensity-modulated light beam) incident from the light source device 14B' sequentially generate one of the light beams LB4, LB6, LB8, and LB10 in a time-division manner. Accordingly, each of the at least eight scanning units U3 to U10 is set to a pattern of beam scanning every other one reflection surface RP of the polygon mirror PM.

In the exposure of the substrate FS2, the light beam scanning for each polygon mirror PM is controlled so that the light beam scanning for each polygon mirror PM is repeated in the order of the odd-numbered scan cells U3, U5, U7, and U9 based on the four sub origin signals ZP3, ZP5, ZP7, and ZP9 output for each polygon mirror PM on the reflection surface RP of each odd-numbered scan cell U3, U5, U7, and U9, the light beam scanning for each polygon mirror PM is controlled so that the light beam scanning for each sub origin signal ZP4, ZP6, ZP8, and ZP10 output for each polygon mirror PM on the reflection surface RP of each even-numbered scan cell U4, U6, U8, and U10 is repeated in the order of the even-numbered scan cells U4, U6, U8, and U10. In fig. 43, alignment marks (corresponding to alignment marks MK1, MK4 in fig. 25) formed on both sides of the substrate FS2 in the width direction are arranged in a relationship detectable in the observation regions Vw2, Vw6 of the alignment microscopes AM2, AM6, but depending on the size of the exposure region W in the Y direction, it may not be necessary to arrange them in such a relationship. In this case, it is sufficient to make several of the seven alignment microscopes AM1 to AM7 movable in the Y direction and to adjust the position intervals in the Y direction of the observation regions Vw1 to Vw 7.

According to modification 3 described above, efficient exposure using only the necessary scanning unit Un can be performed according to the width of the substrate FS to be exposed and/or the size of the exposure field W in the Y direction. In addition, when the scanning efficiency of the polygon mirror PM of each of the 12 scanning units U1 to U12 is 1/3 or less as shown in fig. 43, for example, if the light beam is scanned on each of the three reflection surfaces RP of each polygon mirror PM, even the light beam from one light source device 14' can be used to perform pattern drawing well within the range of the maximum scanning width Sh.

In the case where the drawing apparatus is configured by nine scan units U1 to U9, odd-numbered five scan units U1, U3, U5, U7, and U9 and even-numbered four scan units U2, U4, U6, and U8 are used. Therefore, when the pattern is drawn on the exposure field W by the drawing lines SL1 to SL9 of all the nine scanning units U1 to U9, when the scanning efficiency of the polygon mirror PM is 1/3 or less, for example, the light beam scanning may be performed for every one reflection surface RP of each polygon mirror PM. However, in this case, it is sufficient to repeat the dot scanning on the odd-numbered drawing lines SL1, SL3, SL5, SL7, and SL9 by sequentially referring to only the sub-origin signals ZP1, ZP3, ZP5, ZP7, and ZP9 generated from the origin signals SZn of the odd-numbered scanning cells U1, U3, U5, U7, and U9, and to repeat the dot scanning on the even-numbered drawing lines SL2, SL4, SL6, and SL8 by sequentially referring to only the sub-origin signals ZP2, ZP4, ZP6, and ZP8 generated from the origin signals SZn of the even-numbered scanning cells U2, U4, U6, and U8.

As described above, in modification 3, there is provided a pattern drawing method using a drawing apparatus in which a plurality of scanning units Un that scan spot light SP of a light beam from a light source device 14' along a drawing line SLn are arranged such that a pattern drawn by each drawing line SLn is joined to a substrate FS in a direction of the drawing line SLn (main scanning direction), and the plurality of scanning units and the substrate FS are relatively moved in a sub-scanning direction intersecting the main scanning direction, the pattern drawing method including: selecting a specific scanning unit corresponding to the width of the substrate FS in the main scanning direction, the width of an exposure area to be pattern-drawn on the substrate FS in the main scanning direction, or the position of the exposure area, among the plurality of scanning units Un; and a light beam distribution unit for distributing the light beam from the light source device 14', wherein the light beam intensity-modulated based on the pattern data to be drawn by each of the specific scanning units is selectively and sequentially supplied to each of the specific scanning units. Thus, in modification 3, even if the width of the substrate FS is changed, or the width or position of the exposure field W on the substrate FS is changed, by appropriately determining the conveyance position of the substrate FS in the Y direction, precise pattern drawing can be performed while maintaining high bonding accuracy. In this case, the rotational speed and the rotational angle phase may be synchronized only between the polygon mirrors PM of the specific scanning units contributing to the pattern drawing, instead of synchronizing the rotational speed and the rotational angle phase between the polygon mirrors PM of all the plurality of scanning units.

[ modification 4 ]

In addition, as another configuration of the drawing apparatus using the nine scanning units U1 to U9, the scanning units Un may be simply divided into two groups in the order of their arrangement, instead of being grouped into odd-numbered and even-numbered groups. That is, the scanning device may be divided into a 1 st scanning module including six scanning units U1 to U6 and a 2 nd scanning module including three scanning units U7 to U9, and the 1 st scanning module may be supplied with the light beam LBa from the 1 st light source device 14A 'and the 2 nd scanning module may be supplied with the light beam LBb from the 2 nd light source device 14B'. In this case, when the scanning efficiency (α/β) of the polygon mirror PM is 1/4 ≦ 1/3, the six scanning units U1 to U6 in the 1 st scanning module perform scanning of the spot light SP along the drawing lines SL1 to SL6 by beam scanning performed on every other reflection surface RP of the polygon mirror PM, as in the case of the foregoing embodiment 4 (fig. 33).

In contrast, the three scanning units U7 to U9 in the 2 nd scanning module are each capable of performing beam scanning for each of all the reflection surfaces RP of the polygon mirror PM. Therefore, when the three scanning units U7 to U9 directly perform the beam scanning on each of all the reflection surfaces RP of the polygon mirror PM, the repetition time interval Δ Tc1 of the scanning of the spot light SP on each of the scanning lines SL1 to SL6 of the six scanning units U1 to U6 and the repetition time interval Δ Tc2 of the scanning of the spot light SP on each of the scanning lines SL7 to SL9 of the three scanning units U7 to U9 are in the relationship of Δ Tc1 ═ 2 Δ Tc2, and the pattern drawn on the substrate FS by the scanning lines SL1 to SL6 and the pattern drawn on the substrate FS by the scanning lines SL7 to SL9 are different from each other, and thus a good joint exposure cannot be performed.

Therefore, in each of the three scanning units U7 to U9 capable of performing the beam scanning for each of all the reflection surfaces RP of the polygon mirror PM, the beam scanning is also controlled so as to be performed for every other reflection surface RP of the polygon mirror PM. Such control can be achieved by the following actions: the origin signals SZ7 to SZ9 generated from the scanning units U7 to U9 are input to the circuit of fig. 31 or the sub-origin generating circuit CAan in fig. 38, and the like, to generate sub-origin signals ZP7 to ZP 9; in response to the sub-origin signals ZP7 to ZP9, the corresponding selection optical elements AOM7 to AOM9 are sequentially brought into an On state for a fixed time Ton, and the drawing serial data DL7 to DL9 corresponding to the patterns to be drawn by the drawing lines SL7 to SL9 are sequentially sent to the drive circuit 206a of the electro-optical element 206 in the 2 nd light source device 14B'.

[ modification 5 ]

Fig. 44 shows a configuration of a driver circuit DRVn of the optical element for selection AOMn according to modification 5. As described in the foregoing embodiments and modifications, when the plurality of scanning units Un perform the beam scanning on the one or more reflection surfaces RP of the polygon mirror PM, the beams LB (LBa, LBb) emitted from the light source device 14 ' (14A ', 14B ') and the beams LBs, LBp emitted from the drawing optical elements AOMa, AOMb are transmitted through the plurality of selection optical elements AOMn arranged along the optical paths thereof. In fig. 44, the light beam LB is switched by the optical element for selection AOM3 after being transmitted from the optical elements for selection AOM1, AOM2, and a light beam LB3 is generated toward the scanning unit U3. In general, the optical material in the optical element AOMn for selection has a relatively high transmittance with respect to the light beam LB in the ultraviolet band (for example, a wavelength of 355nm), but has an attenuation rate of several% or so.

When the transmittance of each selective optical element AOMn is set to 95%, when the selective optical element AOM3 is turned On as shown in fig. 44, the intensity of the light beam LB incident On the selective optical element AOM3 is attenuated by the two selective optical elements AOM1 and AOM2, and therefore is about 90% (0.95%) of the original light beam intensity (100%) incident On the selective optical element AOM1²). When six selective optical elements AOM1 to AOM6 are connected, the intensity of the beam LB entering the last selective optical element AOM6 is attenuated by the five selective optical elements AOM1 to AOM5, and therefore becomes about 77% (0.95%) of the original beam intensity (100%)⁵)。

Thus, the intensities of the light beams LB incident on the six optical selection elements AOM1 to AOM6 are 100%, 95%, 90%, 85%, 81%, and 77% in this order. This means that the intensities of the light beams LB1 to LB6 emitted by the selective optical elements AOM1 to AOM6 being deflected individually also change stepwise at this ratio. Therefore, in modification 5, in the driver circuit DRVn for each of the plurality of selection optical elements AOMn shown in fig. 38, the drive conditions of the selection optical elements AOM1 to AOM6 are adjusted so that the variation in the intensities of the beams LB1 to LB6 is reduced.

In fig. 44, since the driver circuits DRV1 to DRV6(DRV5 and DRV6 are not shown) have the same configuration, only the driver circuit DRV1 will be described in detail. As shown in fig. 38, the driver circuits DRV1 to DRV6 are inputted with information for setting the On time Ton of the On state of the selection optical elements AOM1 to AOM6 (in fig. 44, the AOM5 and AOM6 are not shown), and the sub-origin signals ZP1 to ZP 6. In the configuration of fig. 44, the high-frequency transmitters 400 for applying ultrasonic waves to the optical selection elements AOM1 to AOM6 are provided in common. The driver circuit DRV1 includes: a switching element 401 that receives a high-frequency signal from the high-frequency transmitter 400 and switches at high speed whether or not the signal is transmitted to an amplifier 402 that amplifies the signal to a high voltage amplitude; a logic circuit 403 for controlling the opening and closing of the switching element 401 based On the information for setting the On time Ton and the sub-origin signal ZP 1; and a gain adjuster 404 for adjusting the amplification factor (gain) of the amplifier 402 to adjust the amplitude of the high-frequency signal applied to the selective optical element AOM 1.

When the amplitude of the high-frequency signal applied to the selective optical element AOM1 is changed within the allowable range, the diffraction efficiency of the selective optical element AOM1 can be finely adjusted, and the intensity of the deflected and emitted beam LB1 (primary diffracted light) can be changed. Therefore, in the present modification 5, the gain adjuster 404 is adjusted so that the amplitude of the high-frequency signal of the high voltage applied to each optical element for selection AOMn is increased in the order from the driver circuit DRV1 of the optical element for selection AOM1 on the side close to the light source device 14 'to the driver circuit DRV6 of the optical element for selection AOM6 on the side far from the light source device 14'. For example, the amplitude of the high-frequency signal of the high voltage applied to the optical element AOM6 for selection at the end of the optical path of the beam LB is set to the value Va6 at which the diffraction efficiency is highest, and the amplitude of the high-frequency signal of the high voltage applied to the optical element AOM1 for selection at the beginning of the optical path of the beam LB is set to the value Va1 at which the diffraction efficiency is reduced within the allowable range. The amplitudes Va2 to Va5 of the high-frequency signals of the high voltages applied to the optical elements AOM2 to AOM5 for selection therebetween are set to Va1 < Va2 < Va3 < Va4 < Va5 < Va 6.

With the above setting, it is possible to alleviate or suppress the intensity deviation of the light beams LB1 to LB6 emitted from the six selective optical elements AOM1 to AOM6, respectively. This can suppress variations in the exposure amount of the pattern drawn by each of the drawing lines SL1 to SL6, and can perform high-precision pattern drawing. Further, it is not necessary to sequentially increase the amplitudes Va1 to Va6 of the high-frequency signals of high voltage set by the driver circuits DRV1 to DRV6, and for example, Va1 — Va2 < Va3 — Va4 < Va5 — Va6 may be used. Further, in addition to the method of modification example 5, the intensity of the light beams LB1 to LB6 for drawing the spot light SP may be adjusted for each of the scanning units U1 to U6 by providing a light reduction filter (ND filter) having a predetermined transmittance in the optical path in each of the scanning units U1 to U6.

In the driver circuit DRVn in fig. 44, whether or not the high-frequency signal from the high-frequency transmission source 400 is transmitted to the amplifier 402 is switched by the switching element 401. However, in order to improve the On/Off switching responsiveness (rising characteristic) of the selective optical element AOMn, in a state where the diffraction efficiency is substantially regarded as 0, for example, a low-level high-frequency signal in which the intensity of the primary diffracted light is 1/1000 or less with respect to the intensity in the On state may be constantly applied to the selective optical element AOMn, and a high-level high-frequency signal may be appropriately applied to the selective optical element AOMn only in the On state. Fig. 45 shows the structure of such a driver circuit DRVn, and here representatively shows the structure of a driver circuit DRV1, and the same components as those in fig. 44 are denoted by the same reference numerals.

In the configuration of fig. 45, two resistors RE1 and RE2 connected in series are added. In the series circuit of the resistors RE1 and RE2, the high-frequency transmitter 400 is inserted in parallel with the switching element 401 in front of the switching element 401, and a high-frequency signal from the high-frequency transmitter 400 divided by a resistance ratio RE2/(RE1+ RE2) is always applied to the amplifier 402. When the resistance RE2 is a variable resistor and the switching element 401 is in an Off (non-conductive) state, the level of the high-frequency signal applied to the selective optical element AOM1 is adjusted so that the intensity of the light beam LB1, which is the first-order diffracted light emitted from the selective optical element AOM1, becomes a sufficiently small value (for example, 1/1000 or less of the original intensity). In this manner, a bias (rise) of a high-frequency signal is applied to the selective optical element AOM1 through the resistors RE1 and RE2, thereby improving the response. In this case, although the intensity is extremely weak while the switching element 401 is in the Off state, the light beam LB1 is incident on the corresponding scanning unit U1, and therefore, when the conveyance speed of the substrate FS is reduced or stopped during the drawing operation due to some trouble, the shutter provided at the exit of the light source device 14 ' (14A ', 14B ') is closed, or a light-reducing filter sheet is inserted.

[ modification 6 ]

In the above embodiments and modifications, the sheet-shaped substrate FS and the outer peripheral surface of the rotary drum DR are brought into close contact with each other, and the surface of the substrate FS curved in the cylindrical surface shape is subjected to pattern drawing along the drawing line SLn by each of the plurality of scanning units Un. However, for example, as disclosed in pamphlet of international publication No. 2013/150677, the substrate FS may be supported in a planar manner and subjected to exposure processing while being conveyed in the longitudinal direction. In this case, if the surface of the substrate FS is set to be parallel to the XY plane, for example, the plurality of scanning units U1 to U6 may be arranged such that the irradiation central axes Le1, Le3, and Le5 of the odd-numbered scanning units U1, U3, and U5 and the irradiation central axes Le2, Le4, and Le6 of the even-numbered scanning units U2, U4, and U6 are parallel to the Z axis and are positioned in the X direction at a constant interval when viewed in a plane parallel to the XZ plane.

Claims (14)

1. A pattern drawing device is characterized by comprising:

a pulse light source device for generating a pulse-shaped light beam with an adjustable oscillation period;

a 1 st drawing unit configured to project a light beam from the pulsed light source device as spot light onto an object to be irradiated, and to deflect the light beam so that a projection period and a non-projection period of the spot light onto the object to be irradiated are repeated at a predetermined cycle, the spot light being scanned along a 1 st drawing line on the object to be irradiated during the projection period;

A 2 nd drawing unit configured to project the light beam from the pulsed light source device onto the irradiation object as spot light, and deflect the light beam so that the projection period and the non-projection period repeat at a predetermined cycle, and to scan the spot light along a 2 nd drawing line on the irradiation object different from the 1 st drawing line during the projection period;

a 1 st control system that synchronously controls the 1 st drawing unit and the 2 nd drawing unit such that the projection period of the 1 st drawing unit corresponds to the non-projection period of the 2 nd drawing unit, and the projection period of the 2 nd drawing unit corresponds to the non-projection period of the 1 st drawing unit; and

a 2 nd control system that controls the pulsed light source device so that oscillation of the light beam is controlled based on 1 st drawing information of a pattern to be drawn by the 1 st drawing line in the projection period of the 1 st drawing unit, and oscillation of the light beam is controlled based on 2 nd drawing information of a pattern to be drawn by the 2 nd drawing line in the projection period of the 2 nd drawing unit,

the 2 nd control system includes a clock generator that generates a clock signal for causing the light beam from the pulse light source device to pulse-oscillate at a fundamental frequency Fs that is equal to or greater than Vs/Ds at least during the projection period when the size of the spot light is Ds and the scanning speed of the spot light is Vs,

The pulse light source device is a fiber laser device comprising a fiber optical amplifier and a wavelength conversion optical element,

the fiber laser device includes:

a 1 st solid-state laser element that generates 1 st light in a pulse shape at the fundamental frequency Fs in response to the clock signal;

a 2 nd solid-state laser element that generates 2 nd type light in a pulse shape having a longer emission time and a lower peak intensity than the 1 st type light at the fundamental frequency Fs in response to the clock signal; and

and a control circuit that switches to selectively enter either one of the 1 st light and the 2 nd light into the optical fiber amplifier based on drawing data corresponding to a pattern to be drawn on the irradiation object by the scanning spot.

2. The pattern rendering apparatus of claim 1,

the 1 st drawing unit includes a 1 st deflecting member that deflects the light beam, the 2 nd drawing unit includes a 2 nd deflecting member that deflects the light beam,

the 1 st deflecting member and the 2 nd deflecting member are each set so that the time of the non-projection period is 2 times or more of the time of the projection period.

3. The pattern rendering apparatus of claim 1,

The 1 st drawing information includes 1 st magnification correction information for extending and contracting a pattern to be drawn within a length range of the 1 st drawing line in a scanning direction of the spot light, and the 2 nd drawing information includes 2 nd magnification correction information for extending and contracting a pattern to be drawn within a length range of the 2 nd drawing line in the scanning direction of the spot light,

the clock generator locally expands and contracts a cycle of the clock signal so that an oscillation cycle of the pulsed light flux that is pulsed at the fundamental frequency Fs is locally expanded and contracted based on the 1 st magnification correction information during the projection period of the 1 st drawing unit, and the oscillation cycle of the pulsed light flux that is pulsed at the fundamental frequency Fs is locally expanded and contracted based on the 2 nd magnification correction information during the projection period of the 2 nd drawing unit.

4. The pattern rendering apparatus of claim 1,

the pulsed light beam emitted through the wavelength conversion optical element of the fiber laser device is ultraviolet light having a peak wavelength in a wavelength band of 370mm or less.

5. The pattern rendering apparatus of claim 1,

The control circuit controls light emission of the 1 st solid-state laser element and the 2 nd solid-state laser element in response to the clock signal so that energy of the 1 st light and energy of the 2 nd light are substantially the same.

6. The pattern rendering apparatus of claim 5,

the fiber laser device includes an electro-optical modulator that simultaneously receives the 1 st light and the 2 nd light, and controls the fiber laser device so that either one of the 1 st light and the 2 nd light is selectively received by the fiber optical amplifier according to switching of a polarization state based on the pattern data.

7. The pattern rendering device of any of claims 1 to 6,

the clock signal is set so that the fundamental frequency Fs of pulse oscillation of the light beam emitted from the fiber laser device is several hundred MHz.

8. The pattern rendering apparatus of claim 7,

the fundamental frequency Fs is set to one of 100MHz, 200MHz, 300MHz, and 400 MHz.

9. The pattern drawing device according to claim 2 or 3,

The pulsed light beam emitted through the wavelength conversion optical element of the fiber laser device is ultraviolet light having a peak wavelength in a wavelength band of 370mm or less.

10. The pattern drawing device according to claim 2 or 3,

the control circuit controls light emission of the 1 st solid-state laser element and the 2 nd solid-state laser element in response to the clock signal so that energy of the 1 st light and energy of the 2 nd light are substantially the same.

11. The pattern rendering apparatus of claim 10,

the fiber laser device includes an electro-optical modulator that simultaneously receives the 1 st light and the 2 nd light, and controls the fiber laser device so that either one of the 1 st light and the 2 nd light is selectively received by the fiber optical amplifier according to switching of a polarization state based on the pattern data.

12. The pattern rendering apparatus of claim 9,

the fundamental frequency Fs is set to one of 100MHz, 200MHz, 300MHz, and 400 MHz.

13. The pattern rendering apparatus of claim 11,

The fundamental frequency Fs is set to one of 100MHz, 200MHz, 300MHz, and 400 MHz.

14. The pattern rendering apparatus of claim 2,

the 1 st deflecting element and the 2 nd deflecting element are respectively a rotary polygon mirror that deflects the light beam one-dimensionally to scan,

the 1 st control system performs rotation control of the rotary polygon mirrors, respectively, in a state where rotational speeds and rotational angles of the rotary polygon mirrors are phase-synchronized with each other.

Images