TWI695187B - Pattern exposure device - Google Patents

Abstract

(無)

Description

Pattern exposure device

The present invention relates to a beam scanning device and a beam scanning method for scanning spot light of a light beam irradiated on an irradiated body, a pattern drawing device and a pattern drawing method for scanning a spot light to draw a predetermined pattern on an irradiated body, and using the same Element manufacturing method for pattern drawing method, laser light source device for pattern drawing device and beam scanning device.

As disclosed in Japanese Patent Laid-Open No. 61-134724 and Japanese Patent Laid-Open No. 2001-133710, there is known a laser irradiation device and a laser drawing device. The laser irradiation device and the laser drawing device use semi-reflection The mirror divides the laser beam from a laser oscillator (laser beam light source) into two, so that each of the divided laser beams enters two polygon mirrors (rotating polygon mirror), thereby making the two lasers The light beam is scanned on the object to be depicted. In addition, Japanese Patent Application Laid-Open No. 2001-133710 also discloses that the response drawing data of the two divided laser beams incident on the two polygon mirrors is modulated by the ON/OFF AOM (Acousto-optic Modulation Element).

However, depending on the number of reflection surfaces of the polygon mirror and the incident conditions of the optical system (fθ lens, etc.) behind the polygon mirror, there may be laser beams that cannot be incident during the rotation of the polygon mirror. The situation in which the light beam is effectively reflected toward the depicted object. Therefore, even if the laser beam is divided into two by the half mirror as usual and enters the two polygon mirrors, there will be a period when the laser beam cannot effectively illuminate the object to be drawn, that is, non-drawing During this period, the laser beam from the light source cannot be effectively used.

The pattern drawing device of the first aspect of the present invention draws a predetermined pattern on the irradiated body by the scanning point of laser light, and is characterized by comprising: a light source device that emits the laser light; a plurality of drawing units, in order to make the laser The scanning point is generated by the incident light, and includes a light scanning member and an optical lens system for scanning the laser light, which are arranged to scan the scanning point in different areas on the irradiated body; and a plurality of selection optical elements, in order to It is switched whether the laser light from the light source device enters the selected drawing unit of the plurality of drawing units, and is arranged in line along the traveling direction of the laser light from the light source device.

The pattern drawing device of the second aspect of the present invention draws a predetermined pattern on the irradiated body by the scanning point of the laser light, and is characterized by comprising: a light source device that emits the laser light; a plurality of drawing units, in order to make the laser The scanning point is generated by the incident light, including the light scanning member and the optical lens system for scanning the laser light, which are arranged to scan the scanning point in different areas on the irradiated body; a plurality of selection optical elements, in order to make The laser light from the light source device selectively enters the plurality of drawing units and is arranged in line along the traveling direction of the laser light from the light source device; and a light modulator for drawing is to be passed by the scanning according to regulations Pointing the drawing data of each of the plurality of drawing units of the pattern drawn on the illuminated body, modulates the intensity of the laser light incident on the plurality of selection optical elements.

A pattern drawing device according to a third aspect of the present invention includes: a pulse light source device that generates a pulsed light beam with an adjustable oscillation period; and a first drawing unit that projects the light beam from the pulse light source device as spot light onto the object to be irradiated, And deflect the beam with the predetermined period of the projection period and non-projection period of the spot light on the irradiated body, and scan the spot light along the first drawing line on the irradiated body during the projection period; The second drawing unit projects the light beam from the pulsed light source device as spot light onto the irradiated body, and deflects the light beam in a predetermined cycle in the projection period and the non-projection period, and deflects the beam during the projection period Spot light scans along the second drawing line on the illuminated body different from the first drawing line; the first control system is to correspond to the non-projection on the second drawing unit during the projection of the first drawing unit Period, and during the projection period of the second drawing unit corresponds to the non-projection period of the first drawing unit, the first drawing unit and the second drawing unit are synchronously controlled; and the second control system is used to The projection period of the first drawing unit controls the oscillation of the light beam according to the first drawing information of the pattern to be drawn by the first drawing line, and the projection period of the second drawing unit is based on the 2 The second drawing information of the pattern drawn by the line controls the way the light beam oscillates, and controls the pulsed light source device.

The pattern drawing device of the fourth aspect of the present invention is to adjust the intensity of the spot light of the ultraviolet laser light condensed on the irradiated body according to the drawing data while scanning the spot light relative to the irradiated body, thereby A pattern is drawn on the irradiated body, which is characterized by comprising: a laser light source device including a light source unit that generates seed light as a source of the ultraviolet laser light, a light amplifier that enters and amplifies the light, and A wavelength conversion optical element that generates the ultraviolet laser light from the amplified light; and a modulation device for drawing, in order to modulate the intensity of the spot light, modulate the light generated from the light source according to the drawing data The intensity.

The pattern drawing method of the fifth aspect of the present invention is to scan the spot light relative to the irradiated body while adjusting the intensity of the spot light of the ultraviolet laser light condensed on the irradiated body according to the drawing data Drawing a pattern on the irradiated body, characterized by comprising: a conversion step of amplifying the seed light as the source of the ultraviolet laser light by an optical amplifier, and converting the amplified light by a wavelength conversion optical element Into the ultraviolet laser light; and a modulation step, in order to adjust the intensity of the spot light, according to the drawing data, the intensity of the light incident on the optical amplifier is modulated.

A sixth aspect of the present invention is a device manufacturing method comprising: moving the photosensitive substrate prepared as the irradiated body in the first direction while using the pattern drawing method of the fifth aspect on the photosensitive layer of the substrate The action of drawing a pattern for an element; and the action of selectively forming a predetermined pattern material according to the difference between the irradiated part and the non-irradiated part of the spot light of the photosensitive layer.

A laser light source device according to a seventh aspect of the present invention is connected to a device for drawing a pattern by spot light condensed on an irradiated body, and emits a light beam as the spot light, which is characterized by comprising: a first semiconductor light source, In response to a clock pulse of a predetermined period, the first pulse light with a shorter luminescence time than the predetermined period and a sharp rise and fall of the peak intensity is generated; the second semiconductor light source, which responds to the clock pulse, generates a luminescence time shorter and longer than the predetermined period A broad second pulsed light with a long luminous time and a small peak intensity of the first pulsed light; an optical fiber optical amplifier for the first pulsed light or the second pulsed light to enter; and a switching member according to the pattern information to be drawn Input to cause the first pulsed light to enter the fiber optic amplifier when the spot light is projected on the irradiated body, and to cause the second pulsed light when the spot light is not projected on the irradiated body The way of entering the optical fiber optical amplifier is optically switched.

The beam scanning device of the eighth aspect of the present invention is provided with a plurality of scanning units in a predetermined positional relationship, the scanning unit having a rotating polygon mirror that deflects the light beam from the light source device repeatedly, and the deflected light beam is incident and focused The projection optical system of spot light which is one-dimensionally scanned on the irradiated body is characterized by comprising: a beam switching member that switches the optical path of the beam so that the beam from the light source device enters the plurality of scanning units One of the scanning units that performs one-dimensional scanning of the spot light; and a beam switching control section that deflects the beam by the rotating polygon mirror of the scanning unit over every at least one reflecting surface of the rotating polygon mirror Control the light beam switching member in a manner such that each of the plurality of scanning units sequentially performs one-dimensional scanning of the spot light.

A beam scanning device according to a ninth aspect of the present invention has a plurality of scanning modules in which a plurality of scanning units are arranged in a predetermined positional relationship, and the scanning unit is provided with a rotating polyhedral surface that rotates at a certain rotation speed in order to deflect the light beam from the light source device repeatedly A mirror, and a projection optical system for deflecting the beam into and condensing it into spot light that is scanned one-dimensionally on the irradiated body, characterized by including: a beam switching member that switches the optical path of the beam so that The light beam of the light source device is incident on the scanning units to perform one-dimensional scanning of the spot light in the plurality of scanning units; and the beam switching control unit deflects the beam by the rotating polygon mirror of each scanning unit The beam switching member is controlled in such a manner that the first state of the continuous reflection surface of the rotating polygon mirror is repeated and the second state of every at least one reflection surface of the rotating polygon mirror is switched so that a plurality of Each of the scanning units sequentially performs one-dimensional scanning of the spot light.

A beam scanning method according to a tenth aspect of the present invention is to arrange a plurality of scanning units in a predetermined positional relationship to scan an irradiated body. The scanning unit is provided with a beam that is repeatedly deflected by a rotating polygon mirror and condensed into A projection optical system for spot light scanned one-dimensionally on the irradiated body, characterized in that it includes: synchronously rotating a plurality of the rotating polygon mirrors, so that the rotation angle of the rotating polygon mirror of each of the plurality of scanning units The operations where the positions become a predetermined phase relationship with each other; and in order to sequentially perform the one-dimensional scanning of the point light performed by each of the plurality of scanning units, the deflection of the light beam by the rotating polygonal mirror changes every time the rotating polygonal mirror At least one reflecting surface switches the action of the scanning unit into which the light beam enters repeatedly.

The beam scanning method of the eleventh aspect of the present invention is to perform beam scanning on an irradiated body by a beam scanning device in which a plurality of scanning units are arranged in a predetermined positional relationship, the scanning unit is provided with a rotating polyhedron for rotating by a certain rotation speed A projection optical system in which a deflecting light beam of a mirror is repeatedly incident and condensed into spot light that is scanned one-dimensionally on the irradiated body, characterized in that it includes: rotating a plurality of the rotating polygon mirrors synchronously to make the plurality of scans The rotation angle positions of the rotating polygon mirrors of each unit become an action with a predetermined phase relationship; the deflection of the light beam by the rotating polygon mirror switches the incident of the light beam in a manner that the continuous reflection surface of the rotating polygon mirror is repeated The scanning unit, thereby, each of the plurality of scanning units sequentially performs the first scanning step of the one-dimensional scanning of the spot light; the deflection of the light beam by the rotating polygonal mirror is at least every second of the rotating polygonal mirror A reflective surface switches the scanning unit into which the light beam enters in a repetitive manner, whereby each of the plurality of scanning units sequentially performs the second scanning step of the one-dimensional scanning of the spot light; and switches the first scanning step and The switching step of the second scanning step.

The pattern drawing method of the twelfth aspect of the present invention uses a drawing device that configures a plurality of scanning units that perform main scanning of spot light of a light beam from a light source device along a drawing line such that the pattern drawn by each drawing line is The main scanning direction of the drawing line is continued on the substrate, so that the plurality of scanning units and the substrate are relatively moved in the sub-scanning direction crossing the main scanning direction, which is characterized by including: selecting among the plurality of scanning units The action of a specific scanning unit corresponding to the width of the substrate in the main scanning direction, or the width or position of the exposed area of the pattern drawn on the substrate in the main scanning direction; The pattern data adjusts the intensity of the light beam, and the beam distribution unit that distributes the light beam from the light source device is sequentially and sequentially supplied to each action of the specific scanning unit.

With respect to the pattern drawing device, pattern drawing method, beam scanning device, beam scanning method, device manufacturing method, and laser light source device according to the aspect of the present invention, preferred embodiments are disclosed and described in detail below with reference to the drawings. In addition, the form of the present invention is not limited to these embodiments, and includes various modifications or improvements. That is, the constituent elements described below include those that can be easily thought of by those having ordinary knowledge in the technical field to which the present invention belongs and are substantially the same, and the constituent elements described below can be combined as appropriate. In addition, various omissions, substitutions, or changes of constituent elements can be made without departing from the gist of the present invention.

(First embodiment) 1 is a diagram showing a schematic configuration of a device manufacturing system 10 including an exposure apparatus EX that applies an exposure process to a substrate (irradiated body) FS according to the first embodiment. In addition, in the following description, without particular limitation, an XYZ orthogonal coordinate system with the gravity direction as the Z direction is set, and the X direction, the Y direction, and the Z direction will be described based on the arrows in the illustration.

The component manufacturing system 10 is, for example, a manufacturing system in which production lines for manufacturing flexible displays, flexible wiring, and flexible sensors as electronic components are constructed. Hereinafter, as an electronic component, a flexible display will be described. Examples of flexible displays include organic EL displays and liquid crystal displays. The component manufacturing system 10 has a so-called roll-to-roll (Roll To Roll) structure, that is, it is fed from a supply roll (not shown) in which a flexible sheet substrate (sheet substrate) FS is wound in a roll shape After the substrate FS is continuously subjected to various treatments on the substrate FS to be sent out, the various processed substrates FS are wound in a recovery reel (not shown). The substrate FS has a strip shape in which the moving direction of the substrate FS becomes the long-side direction (long strip), and the width direction becomes the short-side direction. The substrate FS sent from the supply reel is sequentially subjected to various processes by the processing device PR1, the exposure device (pattern drawing device, beam scanning device) EX, and the processing device PR2, and is wound by the recovery reel.

In addition, the X direction is a direction (transport direction) from the programming device PR1 through the exposure device EX toward the programming device PR2 in the horizontal plane. The Y direction is the direction orthogonal to the X direction in the horizontal plane, and is the width direction (short side direction) of the substrate FS. The Z direction is a direction (upward direction) orthogonal to the X direction and the Y direction, and is parallel to the direction of gravity.

For the substrate FS, for example, a resin film or a foil made of metal or alloy such as stainless steel is used. As the material of the resin film, for example, polyethylene resin, polypropylene resin, polyester resin, vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, At least one of polycarbonate resin, polystyrene resin, and ethyl acetate resin. In addition, the thickness or rigidity (Young's coefficient) of the substrate FS may be a range that does not cause creases or irreversible wrinkles caused by bending of the substrate FS when passing through the conveyance path of the exposure device EX. As the base material of the substrate FS, films such as PET (polyethylene terephthalate) or PEN (polyethylene naphthalate) having a thickness of about 25 μm to 200 μm are typical of the preferred sheet substrates.

The substrate FS may be heated by each process applied by the processing device PR1, the exposure device EX, and the processing device PR2, so it is preferable to select a substrate FS with a material whose thermal expansion coefficient is not significantly large. For example, the thermal expansion coefficient can be suppressed by mixing an inorganic filler with a resin film. The inorganic filler may also be, for example, titanium oxide, zinc oxide, aluminum oxide, or silicon oxide. In addition, the substrate FS may be an ultra-thin glass single layer body with a thickness of about 100 μm manufactured by a float method or the like, or a laminate body in which the above-mentioned resin film, foil, etc. are bonded to the ultra-thin glass.

However, the flexibility of the substrate FS refers to the property that the substrate FS will not be sheared or broken even if the force of the self-weight is applied to the substrate FS, and the substrate FS can be flexed. In addition, the nature of bending by the force of self-weight also includes flexibility. In addition, the material, size, and thickness of the substrate FS vary depending on the degree of flexibility according to the layer structure, temperature, humidity, etc. of the film formed on the substrate FS. In any case, when the substrate FS is correctly wound on various conveyance reels, rotating drums, and other conveyance direction conversion members provided on the conveyance path provided in the component manufacturing system 10 of the first embodiment, as long as the folds are not bent, It can be said that the substrate FS can be smoothly transported if it is scratched or damaged (teared or cracked), which is within the range of flexibility.

The programming device PR1 performs a pre-step process on the substrate FS that is exposed to the exposure device EX. The programming device PR1 transports the substrate FS that has undergone the pre-processing to the exposure device EX. By this pre-process, the substrate FS transferred to the exposure device EX becomes a substrate (photosensitive substrate) in which a photosensitive functional layer (photosensitive layer, photosensitive layer) is formed on the surface.

This photosensitive functional layer is a layer (film) coated with a solution on the substrate FS and dried. The photosensitive functional layer is typically photoresist (liquid or dry film), but as a material that does not need to be developed, there is a liquid-modified photosensitive silane coupling agent (SAM) that is exposed to ultraviolet light. Or a photosensitive reducing agent such as a plating-reducing group appears on the part that receives ultraviolet radiation. When a photosensitive silane coupling agent is used as the photosensitive functional layer, the pattern portion on the substrate FS exposed to ultraviolet light is changed from liquid repellent to lyophilic. Therefore, liquids containing conductive inks (inks containing conductive nanoparticles such as silver or copper) or semiconductor materials are selectively coated on the lyophilic parts, whereby thin-film transistors (TFTs) etc. can be formed Electrodes, semiconductors, wiring for insulation or connection, or pattern layers as electrodes. When a photosensitive reducing agent is used as the photosensitive functional layer, a plating reducing group appears on the patterned portion exposed to ultraviolet rays on the substrate. Therefore, immediately after exposure, the substrate FS is immersed in a plating solution containing palladium ions or the like for a certain period of time, thereby forming (precipitating) a palladium pattern layer. This plating process is an additive process, but in addition, in the case where the etching process as a subtractive process is the premise, the substrate FS transferred to the exposure device EX may also be PET or PEN. A base material, a metal thin film such as aluminum (Al) or copper (Cu) that is selectively vapor-deposited on the entire surface, or a photoresist layer is further deposited thereon.

In the first embodiment, the exposure device EX is an exposure device of a direct drawing method that does not use a reticle, that is, an exposure device of a so-called line scan method. The exposure device EX irradiates a light pattern corresponding to a predetermined pattern for display electronic components, circuits, wiring, or the like to the illuminated surface (photosensitive surface) of the substrate FS supplied from the programming device PR1. Although it will be described in detail later, the exposure device EX transports the substrate FS in the +X direction (sub-scanning direction) while placing the spot light SP of the exposure beam (laser light, irradiation light) LB on the substrate FS (substrate FS) The irradiated surface is scanned one-dimensionally in a predetermined scanning direction (Y direction), and at the same time, the intensity of the spot light SP is highly adjusted (ON/OFF) according to the pattern data (drawing data and drawing information). In this way, a light pattern that exposes a predetermined pattern corresponding to electronic components, circuits, wiring, or the like is drawn on the surface (photosensitive surface) that is the irradiated surface of the substrate FS. That is, the sub-scanning of the substrate FS and the main scanning of the spot light SP cause the spot light SP to relatively scan two-dimensionally on the illuminated surface of the substrate FS, and draw a predetermined exposure pattern on the substrate FS. In addition, since the substrate FS is transported in the transport direction (+X direction), a plurality of exposure areas W of the pattern exposed by the exposure device EX are provided at predetermined intervals along the longitudinal direction of the substrate FS (see FIG. 5) . Since the electronic component is formed in the exposure area W, the exposure area W is also an electronic component formation area. In addition, the electronic device is formed by overlapping a plurality of pattern layers (layers with patterns), so that the pattern corresponding to each layer can be exposed by the exposure device EX.

The programming device PR2 performs the subsequent step processing (for example, plating processing, development, etching processing, etc.) on the substrate FS after the exposure processing by the exposure device EX. Through the processing in the subsequent steps, the pattern layer of the device is formed on the substrate FS.

As described above, the electronic component is formed by overlapping a plurality of pattern layers. Therefore, at least one process layer is generated by at least each process of the device manufacturing system 10. Therefore, in order to produce electronic components, each process of the component manufacturing system 10 shown in FIG. 1 must be performed at least twice. Therefore, the collection reel on which the substrate FS is wound as a supply reel is mounted on another component manufacturing system 10, whereby the pattern can be laminated. Repeat the above actions to form an electronic component. Therefore, the processed substrate FS is in a state where a plurality of electronic components (exposure regions W) are connected along the longitudinal direction of the substrate FS at predetermined intervals. That is, the substrate FS becomes a substrate for multiple surfaces.

The recycling reel of the substrate FS formed by recycling electronic components in a connected state can also be installed in a cutting device (not shown). A cutting device equipped with a recovery reel divides the processed substrate FS into electronic components (electronic component forming regions W) (cut), thereby forming a plurality of electronic components. The size of the substrate FS is, for example, about 10 cm to 2 m in the width direction (the direction of the short side) and 10 m or more in the length direction (the direction of the long side). In addition, the size of the substrate FS is not limited to the above-mentioned size.

Next, the exposure device EX will be described in detail. The exposure device EX is housed in the temperature adjustment chamber ECV. The temperature control chamber ECV maintains a predetermined temperature inside and controls the shape change caused by the temperature of the substrate FS transported inside. The temperature-adjusting chamber ECV is arranged on the installation surface E of the manufacturing plant through passive or active anti-vibration units SU1 and SU2. The anti-vibration units SU1 and SU2 reduce the vibration from the installation surface E. The installation surface E may be the ground of the factory itself, or the surface on the installation platform (pedestal) installed on the ground to expose the horizontal plane. The exposure device EX includes a substrate transport mechanism 12, a light source device (pulse light source device, laser light source device) 14, a drawing head 16, and a control device 18.

The substrate transfer mechanism 12 transfers the substrate FS transferred from the program device PR1 at a predetermined speed in the exposure device EX, and then sends it to the program device PR2 at a predetermined speed. By this substrate transfer mechanism 12, the transfer path of the substrate FS transferred in the exposure device EX is defined. The substrate conveying mechanism 12 includes an edge position controller EPC, a driving roller R1, a tension adjusting roller RT1, a rotating drum (cylinder) DR, and a tension adjusting roller RT2 in order from the upstream side (-X direction side) of the substrate FS in the conveying direction , Drive roller R2, and drive roller R3.

The edge position controller EPC adjusts the position of the substrate FS transferred from the programming device PR1 in the width direction (Y direction, short side direction of the substrate FS). That is, the edge position controller EPC is to position the end (edge) of the width direction of the substrate FS transferred with a predetermined tension applied to the target position within the range of ± tens μm to tens μm (Allowable range), the substrate FS is moved in the width direction, and the position of the substrate FS in the width direction is adjusted. The edge position controller EPC has a roller on which the substrate FS is mounted, and an unillustrated edge sensor (end detection portion) that detects the position of the end (edge) of the substrate FS in the width direction, according to the edge sensor The detected detection signal moves the roller of the edge position controller EPC in the Y direction to adjust the position of the substrate FS in the width direction. The drive roller R1 rotates while holding both the front and back surfaces of the substrate FS transported from the edge position controller EPC, and transports the substrate FS toward the rotating drum DR. In addition, the edge position controller EPC can also be appropriately adjusted to the width direction of the substrate FS by winding the longitudinal direction of the substrate FS of the rotary drum DR with the orthogonal direction with respect to the central axis (rotation axis) AXo of the rotary drum DR. Position, and the parallelism of the rotation axis of the aforementioned roller of the edge position controller EPC and the Y axis is appropriately adjusted in a manner of correcting the tilt error of the traveling direction of the substrate FS.

The rotating drum DR has a central axis AXo extending in the Y direction and extending in a direction crossing the direction of gravity, and a cylindrical outer peripheral surface having a certain radius from the central axis AXo, while imitating the outer peripheral surface (circumferential surface) of the substrate FS A part is supported in the long-side direction while rotating around the central axis AXo to transport the substrate FS in the +X direction. The rotating drum DR supports the exposure area (portion) on the substrate FS on which the light beam LB (spot light SP) from the drawing head 16 is projected with its circumferential surface. On both sides in the Y direction of the rotating drum DR, there are provided shafts Sft supported by an annular bearing so that the rotating drum DR rotates around the central axis AXo. This axis Sft rotates about the central axis AXo by a rotational torque given from a not-shown rotational driving source (for example, constituted by a motor or a speed reduction mechanism) controlled by the control device 18. In addition, for convenience, a plane including the central axis AXo and parallel to the YZ plane is called a central plane Poc.

The driving rollers R2 and R3 are arranged at predetermined intervals along the conveyance direction (+X direction) of the substrate FS, and a predetermined slack state is given to the substrate FS after exposure. The drive rollers R2 and R3 rotate in the same manner as the drive roller R1 while holding both the front and back surfaces of the substrate FS, and transport the substrate FS toward the programming device PR2. The driving rollers R2 and R3 are provided on the downstream side (+X direction side) with respect to the rotating drum DR, and the driving roller R2 is provided on the upstream side (-X direction side) with respect to the driving roller R3. The tension adjusting rollers RT1 and RT2 apply a force in the -Z direction to apply a predetermined tension to the substrate FS wound around the rotating drum DR and supported in the longitudinal direction. As a result, the tension applied to the longitudinal direction of the substrate FS of the rotating drum DR is stabilized within a predetermined range. In addition, the control device 18 rotates the drive rollers R1 to R3 by controlling a rotation drive source (not shown) (for example, constituted by a motor or a speed reduction mechanism).

The light source device 14 has a light source (pulse light source), and emits a pulsed light beam (pulse light, laser light) LB. This light beam LB is ultraviolet light having a peak wavelength in a wavelength band below 370 nm, and the oscillation frequency (emission frequency) of the light beam LB is Fs. The light beam LB emitted by the light source device 14 enters the drawing head 16. According to the control of the control device 18, the light source device 14 causes the light beam LB to emit light and emit at the light emitting frequency Fs. The structure of the light source device 14 will be described in detail later, but it is a semiconductor laser element that generates pulsed light in the infrared wavelength range, an optical fiber amplifier, and converts the pulsed light in the infrared wavelength range into pulsed light in the ultraviolet wavelength range For wavelength conversion optical elements (harmonic generating elements) and the like, it is also possible to use a fiber amplifier laser light source that can obtain high-brightness ultraviolet pulsed light with an oscillation frequency Fs of several hundred MHz and a pulsed light emission time of picoseconds.

The drawing head 16 includes a plurality of scanning units Un (U1 to U6) into which the light beam LB is incident. The drawing head 16 draws a predetermined pattern by a plurality of scanning units (drawing units) U1 to U6 on a part of the substrate FS supported by the circumferential surface of the rotating drum DR of the substrate transfer mechanism 12. The drawing head 16 is a so-called multi-beam type drawing head 16 in which a plurality of scanning units U1 to U6 of the same configuration are arranged. The drawing head 16 repeatedly exposes the substrate FS with a pattern for electronic components. Therefore, the exposure area (electronic component formation area) W of the exposed pattern is provided at a predetermined interval along the long side of the substrate FS (see FIG. 5) ). The control device 18 controls each part of the exposure device EX so that each part executes processing. The control device 18 includes a computer and a memory medium storing a program. When the computer executes the program stored in the memory medium, it has the function of the control device 18 of the first embodiment.

FIG. 2 is a view showing a support frame (device column) 30 that supports a plurality of scanning units (drawing units) Un of the drawing head 16 and a rotating drum DR. The support frame 30 has a body frame 32, a three-point support portion 34, and a drawing head support portion 36. The support frame 30 is accommodated in the temperature adjustment chamber ECV. The main body frame 32 rotatably supports the rotating drum DR, the tension adjusting rollers RT1 (not shown), and RT2 through an annular bearing. The three-point support portion 34 is provided at the upper end of the main body frame 32, and supports the drawing head support portion 36 provided above the rotary drum DR at three points.

The drawing head support section 36 supports the scanning unit Un (U1 to U6) of the drawing head 16 The drawing head support section 36 places the scanning units U1, U3, U5 with respect to the central axis AXo of the rotary drum DR on the downstream side (+X side) in the conveying direction ) And supported in parallel along the width direction of the substrate FS (see FIG. 1 ). Also, the drawing head support portion 36 supports the scanning units U2, U4, and U6 in parallel with the central axis AXo on the upstream side (-X side) in the conveyance direction and along the width direction (Y direction) of the substrate FS (refer to FIG. 1 ). In addition, here, the scanning width of one scanning unit Un in the Y direction (the scanning range of the spot light SP, the drawing line SLn), as an example, if it is about 20 to 50 mm, by three odd scanning units U1, The three scanning units U3, U5 and the even-numbered three scanning units U2, U4 and U6 are arranged in a total of six scanning units Un in the Y direction, so that the width of the Y direction that can be drawn is expanded to 120mm~300mm.

FIG. 3 shows a diagram depicting the structure of the head 16. In the first embodiment, the exposure device EX includes two light source devices 14 (14a, 14b). The drawing head 16 has a plurality of scanning units U1 to U6, guides the light beam LB from the light source device 14a to the plurality of scanning units U1, U3, U5 into the optical system (beam switching member) 40a, and guides the light beam from the light source device 14b The light from the LB is guided to a plurality of scanning units U2, U4, and U6 to be introduced into the optical system (beam switching member) 40b.

First, the light introduction optical system (beam switching member) 40a will be described using FIG. 4. In addition, since the light introduction optical systems 40a and 40b have the same configuration, the light introduction optical system 40a will be described here, and the description of the light introduction optical system 40b will be omitted.

The light introduction optical system 40a has a condenser lens 42, a collimating mirror 44, a reflecting mirror 46, a condenser lens 48, a selection optical element 50, a reflecting mirror 52, and a collimating mirror 54 from the light source device 14 (14a) side , A condenser lens 56, an optical element for selection 58, a reflecting mirror 60, a collimator lens 62, a condenser lens 64, an optical element for selection 66, a reflecting mirror 68, and an absorber 70.

The condenser lens 42 and the collimator lens 44 magnify the light beam LB emitted from the light source device 14a. In detail, first, the condenser lens 42 converges the light beam LB at the focal position behind the condenser lens 42, and the collimator 44 makes the light beam LB scattered by the condenser lens 42 converge to a predetermined beam diameter (for example, the number mm) of parallel light.

The reflecting mirror 46 reflects the light beam LB that is collimated by the collimating mirror 44 and irradiates the selection optical element 50. The condenser lens 48 condenses (converges) the light beam LB incident on the selection optical element 50 so as to become the beam waist width in the selection optical element 50. The optical element 50 for selection has transparency to the light beam LB, and for example, an acousto-optic modulator (AOM: Acousto-Optic Modulator) is used. AOM, if an ultrasonic signal (high-frequency signal) is applied, the incident light beam LB (zero-order light) will be diffracted at the diffraction angle corresponding to the high-frequency frequency as the outgoing light beam (beam LBn) . In addition, in the first embodiment, each of the plurality of selection optical elements 50, 58, 66 is emitted as primary diffracted light and then enters the corresponding scanning units U1, U3, U5. The light beam LBn is LB1, LB3, LB5 indicates that each of the selection optical elements 50, 58, 66 functions to deflect the optical path of the light beam LB from the light source device 14 (14a). The configuration, functions, functions, etc. of the optical elements 50, 58, 66 for selection may be the same as each other. The selection optical elements 50, 58, 66 turn ON/OFF the diffracted light diffracted by the incident light beam LB according to the ON/OFF of the drive signal (high frequency signal) from the control device 18.

In detail, the selection optical element 50 irradiates the incident light beam LB to the selection optical element 58 of the next stage when the drive signal (high-frequency signal) from the control device 18 is OFF. On the other hand, when the drive signal (high frequency signal) from the control device 18 is ON, the optical element 50 is selected to diffract the incident light beam LB, and the first diffracted light, that is, the light beam LB1, is irradiated to the mirror 52 . The reflecting mirror 52 reflects the incident light beam LB1 and irradiates the collimating mirror 100 of the scanning unit U1. That is, the control device 18 switches (drives) the selection optical element 50 to ON/OFF, and the selection optical element 50 switches whether the light beam LB1 is incident on the scanning unit U1.

Between the selection optical element 50 and the selection optical element 58, a collimating mirror 54 that sequentially returns the light beam LB irradiated to the selection optical element 58 to parallel light, and the collimating mirror 54 becomes parallel light are provided in order. The light beam LB is condensed (converged) again into a condenser lens 56 that becomes the beam waist width in the selection optical element 58.

The selection optical element 58 has translucency to the light beam LB in the same manner as the selection optical element 50. For example, an acousto-optic modulation element (AOM) is used. The selection optical element 58 transmits the incident light beam LB directly to the selection optical element 66 when the drive signal (high-frequency signal) transmitted from the control device 18 is OFF, and transmits it to the selection optical element 66. When the driving signal (high-frequency signal) is ON, the incident light beam LB is diffracted, and the first diffracted light, that is, the light beam LB3, is irradiated to the reflecting mirror 60. The reflecting mirror 60 reflects the incident light beam LB3 and irradiates the collimating mirror 100 of the scanning unit U3. That is, the control device 18 switches the selection optical element 58 to ON/OFF, and the selection optical element 58 switches whether or not the light beam LB3 is incident on the scanning unit U3.

Between the selection optical element 58 and the selection optical element 66, a collimating mirror 62 that sequentially returns the light beam LB irradiated to the selection optical element 66 to parallel light, and the collimating mirror 62 becomes parallel light are provided in order. The light beam LB is condensed (converged) again into a condenser lens 64 that becomes the beam waist width in the selection optical element 66.

The optical element 66 for selection has translucency to the light beam LB like the optical element 50 for selection, for example, an acousto-optic modulation element (AOM) is used. The selection optical element 66 makes the incident light beam LB irradiate toward the absorber 70 when the driving signal (high-frequency signal) from the control device 18 is OFF, and the driving signal (high-frequency signal) from the control device 18 is In the ON state, the incident light beam LB is diffracted, and the first diffracted light, that is, the light beam LB5 is irradiated toward the reflecting mirror 68. The reflecting mirror 68 reflects the incident light beam LB5 and irradiates the collimating mirror 100 of the scanning unit U5. That is, the control device 18 switches the optical element 66 for selection to ON/OFF, and the optical element 66 for selection switches whether the light beam LB5 is incident on the scanning unit U5. The absorber 70 is a light absorber for suppressing the absorption of the light beam LB to the outside of the light beam LB.

The light introduction optical system 40b will be briefly described. The selection optical elements 50, 58, 66 of the light introduction optical system 40b switch whether the light beam LB is incident on the scanning units U2, U4, U6. In this case, the light-reflecting mirrors 52, 60, 68 of the optical system 40b reflect the light beams LB2, LB4, LB6 emitted from the selection optical elements 50, 58, 66 and then illuminate the collimating mirrors of the scanning units U2, U4, U6 100.

In addition, for the actual acousto-optic modulation element (AOM), the generation efficiency of the first-order diffracted light is about 80% of that of the zero-order light. Therefore, the beams LB1 (LB2) of each deflected optical element 50, 58, 66 are selected. The intensity of LB3 (LB4) and LB5 (LB6) is lower than that of the original beam LB. In addition, when any one of the selection optical elements 50, 58, 66 is in the ON state, the 0th-order light that travels straight without diffracting remains about 20%, but is finally absorbed by the absorber 70.

Next, the plurality of scanning units Un (U1 to U6) shown in FIG. 3 will be described. The scanning unit Un projects the light beam LBn from the light source device 14 (14a, 14b) onto the irradiated surface of the substrate FS by converging into the spot light SP, and makes the spot light SP on the substrate by the rotating polygon mirror PM The irradiated surface of the FS is scanned one-dimensionally along the drawing line (scanning line) SLn of a predetermined straight line. In addition, the drawing line SLn of the scanning unit U1 is represented by SL1, and similarly, the drawing line SLn of the scanning units U2 to U6 is represented by SL2 to SL6.

FIG. 5 is a diagram showing the drawing line SLn (SL1 to SL6) of the spot light SP scanned by each scanning unit Un (U1 to U6). As shown in FIG. 5, each scanning unit Un (U1 to U6) shares the scanning area in such a manner that a plurality of scanning units Un (U1 to U6) all cover the entire width direction of the exposure area W. With this, each scanning unit Un (U1 to U6) can draw a pattern on a plurality of regions divided in the width direction of the substrate FS. The length of each drawing line SLn (SL1 to SL6) is in principle the same. That is, the scanning distance of the spot light SP of the light beam LBn of each scan along the drawing lines SL1 to SL6 is basically the same. In addition, to increase the width of the exposure area W, the length of the drawing line SLn itself can be increased or the number of scanning units Un provided in the Y direction can be increased.

In addition, the actual drawing lines SLn (SL1 to SL6) are set to be shorter than the maximum length that the spot light SP can actually scan on the illuminated surface. For example, if the drawing magnification in the main scanning direction (Y direction) is the initial value (without magnification correction), the maximum length of the drawing line SLn that can draw the pattern is 30 mm, the maximum scanning length of the spot light SP on the illuminated surface Each of the scanning start point side and the scanning end point side of the drawing line SLn has a space of approximately 0.5 mm, and is set to approximately 31 mm. By setting in the above manner, within the range of the maximum scanning length of the spot light SP of 31 mm, the position of the drawing line SLn of 30 mm or the drawing magnification can be finely adjusted in the main scanning direction. The maximum scanning length of the spot light SP is not limited to 31 mm. It is mainly determined by the aperture of the fθ lens FT (refer to FIG. 3) after the polygon mirror (rotating polygon mirror) PM provided in the scanning unit Un, and may be 31 mm or more.

A plurality of drawing lines (scanning lines) SL1 to SL6 are arranged in two rows across the center plane Poc in the circumferential direction of the rotating drum DR. The drawing lines SL1, SL3, SL5 are located on the substrate FS on the downstream side (+X direction side) of the conveying direction with respect to the central plane Poc. The drawing lines SL2, SL4, SL6 are located on the substrate FS on the upstream side (-X direction side) in the conveying direction with respect to the center plane Poc. Each drawing line SLn (SL1 to SL6) is substantially parallel along the width direction of the substrate FS, that is, the central axis AXo of the rotating drum DR, and is shorter than the width direction length of the substrate FS.

The drawing lines SL1, SL3, SL5 are arranged at predetermined intervals along the width direction of the substrate FS (scanning direction, Y direction), and the drawing lines SL2, SL4, SL6 are also along the width direction of the substrate FS (scanning direction, Y direction) ) Configured at regular intervals. At this time, the drawing line SL2 is arranged between the drawing line SL1 and the drawing line SL3 in the width direction of the substrate FS. Similarly, the drawing line SL3 is arranged between the drawing line SL2 and the drawing line SL4 in the width direction of the substrate FS. The drawing line SL4 is arranged between the drawing line SL3 and the drawing line SL5 in the width direction of the substrate FS. The drawing line SL5 is arranged between the drawing line SL4 and the drawing line SL6 in the width direction of the substrate FS. That is, the drawing lines SL1 to SL6 are arranged so as to cover the entire width direction of the exposure area W drawn on the substrate FS.

The scanning direction of the spot light SP of the light beams LBn (LB1, LB3, LB5) of each scan along the odd-numbered drawing lines SL1, SL3, SL5 is a one-dimensional direction and the same direction. The scanning direction of the spot light SP of the light beams LBn (LB2, LB4, LB6) of each scan along the even-numbered drawing lines SL2, SL4, SL6 is a one-dimensional direction and the same direction. The scanning direction of the light beam LBn (spot light SP) scanned along the drawing lines SL1, SL3, SL5 and the scanning direction of the light beam LBn (spot light SP) scanning along the drawing lines SL2, SL4, SL6 are opposite directions. In detail, the scanning direction of the light beam LBn (spot light SP) scanned along the drawing lines SL2, SL4, SL6 is the +Y direction, and the light beam LBn (spot light SP) scanning along the drawing lines SL1, SL3, SL5 The scanning direction is the -Y direction. This is due to the polygon mirror PM rotating in the same direction as the polygon mirror PM of the scanning units U1 to U6. As a result, the drawing start position of the drawing lines SL1, SL3, SL5 (the position of the drawing start point (scanning start point)) and the drawing start position of the drawing lines SL2, SL4, SL6 are adjacent (or partially repeated) in the Y direction. In addition, the drawing end positions of the drawing lines SL3 and SL5 (the positions of drawing end points (scanning end points)) are adjacent to the drawing end positions of the drawing lines SL2 and SL4 in the Y direction (or part of them are repeated). When each drawing line SLn is arranged so that the ends of drawing lines SLn adjacent in the Y direction partially overlap each other, for example, as long as the length of each drawing line SLn includes the drawing start position or drawing end position in the Y direction, Repeat within a few percent.

In addition, the width of the drawing line SLn in the sub-scanning direction corresponds to the thickness (diameter) of the spot light SP. For example, when the size ø of the spot light SP is 3 μm, the width of the drawing line SLn in the sub-scanning direction is also 3 μm. The spot light SP may also be projected along the drawing line SLn in such a manner as to overlap a predetermined length (for example, the size of the spot light SP ½). In addition, when drawing lines SLn (for example, drawing line SL1 and drawing line SL2) adjacent to each other in the Y direction are adjacent to each other (continuous case), similarly, as long as a predetermined length (for example, the size of spot light SP Half).

In the case of the first embodiment, since the light beam LB from the light source device 14 is pulsed light, the spot light SP projected on the drawing line SLn during the main scan is discrete according to the oscillation frequency of the light beam LB. Therefore, the spot light SP projected by one pulse light of the light beam LB and the spot light SP projected by the next pulse light must be repeated in the main scanning direction. The repetition amount is set according to the size ø of the spot light SP, the scanning speed Vs of the spot light SP, and the oscillation frequency Fs of the light beam LB, but in the case where the intensity distribution of the spot light SP is approximately Gaussian, as long as it is relative to the spot light SP The effective diameter size determined by 1/e ² (or 1/2) of the peak intensity can be overlapped by ø/2. Therefore, even in the sub-scanning direction (direction orthogonal to the drawing line SLn), it is preferable to set the substrate FS to move only between one scan and the next scan of the spot light SP along the drawing line SLn The effective size of spot light SP is approximately 1/2 of the distance below. In addition, the exposure amount of the photosensitive functional layer on the substrate FS can be adjusted by the peak value of the light beam LB (pulse light), but if the intensity of the light beam LB cannot be increased, if the exposure amount needs to be increased, Any one of the decrease in the scanning speed Vs in the main scanning direction of the spot light SP, the increase in the oscillation frequency Fs of the light beam LB, or the decrease in the transport speed in the sub-scanning direction of the substrate FS makes the spot light SP in the main scanning direction Or the overlap amount in the sub-scanning direction can be increased to more than 1/2 of the effective size ø.

Next, the configuration of the scanning unit Un shown in FIG. 3 will be described. In addition, since the scanning units U1 to U6 have the same configuration, only the scanning unit U1 will be described here. The scanning unit U1 includes a collimating mirror 100, a reflecting mirror 102, a condenser lens 104, a drawing optical element 106, a collimating mirror 108, a reflecting mirror 110, a cylindrical lens CYa, and a reflecting mirror after the reflecting mirror 52 shown in FIG. 114. Polygon mirror (light scanning member, deflection member) PM, fθ lens FT, cylindrical lens CYb, and reflecting mirror 122. The collimating mirrors 100, 108, reflecting mirrors 102, 110, 114, 122, condenser lens 104, cylindrical lenses CYa, CYb, and fθ lens FT constitute an optical lens system.

The reflecting mirror 102 reflects the light beam LB1 incident from the collimating mirror 100 in the -Z direction in FIG. 3 and enters the drawing optical element 106 as a drawing optical modulator. The condenser lens 104 condenses (converges) the light beam LB1 (parallel light beam) incident on the drawing optical element 106 so that it becomes the beam waist width in the drawing optical element 106. The optical element 106 for drawing has transmissivity to the light beam LB1, for example, an acousto-optic modulation element (AOM) is used. The drawing optical element 106 irradiates the incident light beam LB1 to a shielding plate or absorber (not shown) when the drive signal (high-frequency signal) from the control device 18 is OFF, and the drive signal from the control device 18 When the (high-frequency signal) is in the ON state, the incident light beam LB1 is diffracted, and the primary diffracted light (the drawing light beam, that is, the light beam LB1 whose intensity is adjusted according to the pattern data) is irradiated to the mirror 110. The shielding plate and the absorber are used to suppress leakage of the light beam LB1 to the outside.

A collimating mirror 108 is provided between the mirror 110 and the optical element 106 for drawing to make the light beam LB1 incident on the mirror 110 parallel. The mirror 110 reflects the incident light beam LB1 toward the mirror 114 in the -X direction, and the mirror 114 reflects the incident light beam LB1 toward the polygon mirror PM. The polygon mirror (rotating polygon mirror) 116 reflects the incident light beam LB1 toward the -X direction side toward the fθ lens having an optical axis parallel to the X axis. In the polygon mirror PM, in order to scan the spot light SP of the light beam LB1 on the illuminated surface of the substrate FS, the incident light beam LB1 is deflected (reflected) in a plane parallel to the XY plane. Specifically, the polygon mirror PM has a rotation axis AXp extending in the Z direction, and a plurality of reflection surfaces RP formed around the rotation axis AXp (eight reflection surfaces RP in the first embodiment). The polygon mirror PM is rotated in a predetermined rotation direction with the rotation axis AXp as a center, whereby the reflection angle of the pulse beam LB1 irradiated to the reflection surface RP can be continuously changed. With this, the reflection direction of the light beam LB1 is deflected by one reflection surface RP, so that the spot light SP of the light beam LB1 irradiated on the irradiated surface of the substrate FS can be scanned in the scanning direction (the width direction and the Y direction of the substrate FS). That is, the polygon mirror PM deflects the incident light beam LB1 and scans the spot light SP along the drawing line (scanning line) SL1 shown in FIG. 5. In addition, the polygon mirror PM is rotated at a constant speed by a rotational drive source (not shown) (for example, constituted by a motor or a speed reduction mechanism). The rotation driving source is controlled by the control device 18.

Since the spot light SP of the light beam LB1 can be scanned along the drawing line SL1 by a reflecting surface RP of the polygon mirror PM, the drawing line of the spot light SP is scanned on the illuminated surface of the substrate FS with one rotation of the polygon mirror PM The maximum number of SL1 becomes eight equal to the number of reflecting surfaces RP. As described above, the effective length of the drawing line SL1 (for example, 30 mm) is set to a length that can be scanned by the polygon mirror PM to the maximum scanning length of the spot light SP (for example, 31 mm). At the initial setting (design), in The center point of the drawing line SL1 is set in the center of the maximum scan length.

In addition, as an example, the effective length of the drawing line SL1 is set to 30 mm, and while the spot light SP having an effective size ø of 3 μm is superimposed one by one at 1.5 μm, the spot light SP is irradiated to the irradiated surface of the substrate FS along the drawing line SL1 At the time of up, the number of spot light SP irradiated by one scan (the number of pulses of the light beam LB from the light source device 14) becomes 20000 (30mm/1.5μm). In addition, if the scanning time of the spot light SP along the drawing line SL1 is 200 μsec, it is necessary to irradiate the pulsed spot light SP 20,000 times during this period, so the light emitting frequency Fs of the light source device 14 becomes Fs≧20000 times/200 μsec= 100MHz.

Returning to the description of the configuration of the scanning unit U1, the cylindrical lens CYa provided between the mirror 110 and the mirror 114 makes the light beam LB1 on the reflecting surface of the polygon mirror PM in the Z direction (non-scanning direction) orthogonal to the scanning direction The light is condensed (converged) on the RP into an oblong shape (slit shape) extending parallel to the XY plane. With the cylindrical lens CYa, even if the reflection surface RP is inclined with respect to the Z direction (Z axis) (there is a surface falling error), its influence can be suppressed, and the formation of the light beam LB1 irradiated on the substrate FS can be suppressed The irradiation position of the spot light is shifted in the transport direction (X direction) of the substrate FS.

The light beam LB1 reflected by the polygon mirror PM is irradiated to the fθ lens FT including the condenser lens. The fθ lens FT having an optical axis extending in the X-axis direction is a telecentric scanning lens that projects the light beam LB1 reflected by the polygon mirror PM to the mirror 122 in a plane parallel to the XY plane and parallel to the X axis. The incident angle θ of the light beam LB1 to the fθ lens FT varies according to the rotation angle (θ/2) of the polygon mirror PM. The fθ lens FT projects the light beam LB1 to an image height position on the illuminated surface of the substrate FS that is proportional to its incident angle θ. If the focal distance is fo and the image height position is y, then the fθ lens FT has a relationship of y=fo·θ. Therefore, the light beam LB1 (spot light SP) can be accurately and uniformly scanned in the Y direction by the fθ lens FT. When the incident angle to the fθ lens FT is 0 degrees, the light beam LB1 incident on the fθ lens FT travels along the fθ lens FT.

The light beam LB1 irradiated from the fθ lens FT passes through the mirror 122 and is irradiated as spot light SP on the substrate FS. The cylindrical lens CYb provided between the fθ lens FT and the reflection mirror 122 makes the spot light SP of the light beam LB1 condensed on the substrate FS into a tiny circle with a diameter of several μm (for example, 3 μm), and its generatrix is in the Y direction parallel. As a result, the drawing line SL1 (refer to FIG. 5) extending in the Y direction formed by the spot light (scanning point) SP is defined on the substrate FS. When there is no cylindrical lens CYb, the spot light condensed on the substrate FS is extended in the direction (X direction) orthogonal to the scanning direction (Y direction) by the cylindrical lens CYa in front of the polygon mirror PM Oval.

As described above, in a state where the substrate FS is transported in the X direction, the spot light SP of the light beam LB is scanned in the scanning direction (Y direction) by the scanning units U1 to U6 to draw a predetermined pattern on the substrate FS. The scanning units U1 to U6 are arranged on the drawing head support 36 so as to scan different areas on the substrate FS. In addition, when the size of the scanning direction of the spot light SP on the substrate FS (the length of the drawn line) is Ds, and the scanning speed (relative scanning speed) of the spot light SP on the substrate FS is Vs, the oscillation frequency of the light beam LB Fs must satisfy the relationship of Fs≧Vs/Ds. Since the light beam LB is pulsed light, if the oscillation frequency Fs does not satisfy the relationship of Fs≧Vs/Ds, the spot light SP of the light beam LB will be irradiated onto the substrate FS at a predetermined interval (gap). If the oscillation frequency Fs satisfies the relationship of Fs≧Vs/Ds, the spot light SP can be irradiated onto the substrate FS so as to overlap each other in the scanning direction, so that even the pulsed light beam LB can be substantially continuous in the scanning direction The straight line pattern is well drawn on the substrate FS. In addition, the scanning speed Vs of the spot light SP and the rotation speed of the polygon mirror PM become faster.

6 is a diagram showing the relationship between the polygon mirror PM of each scanning unit U1 to U6 and the scanning directions of a plurality of drawing lines SLn (SL1 to SL6). The plurality of scanning units U1, U3, U5 and the plurality of scanning units U2, U4, U6, the reflecting mirror 114, the polygon mirror PM, and the fθ lens FT are symmetrical with respect to the central plane Poc. Therefore, by rotating the polygon mirror PM of each scanning unit U1~U6 in the same direction (to the left), each scanning unit U1, U3, U5 moves the point of the light beam LB in the -Y direction from the drawing start position to the drawing end position In the light SP scanning, each scanning unit U2, U4, U6 scans the spot light SP of the light beam LB from the drawing start position toward the drawing end position in the +Y direction. In addition, the rotation direction of the polygon mirror PM of each scanning unit U2, U4, U6 can be opposite to the rotation direction of the polygon mirror PM of each scanning unit U1, U3, U5, so that each scanning unit U1~U6 The scanning direction of the spot light SP of the light beam LB coincides in the same direction (+Y direction or -Y direction).

Here, since the polygon mirror PM rotates, the angle of the reflection surface RP also changes with time. Therefore, the rotation angle α of the polygonal mirror PM that allows the light beam LB incident on the specific reflection surface RP of the polygonal mirror PM to enter the fθ lens FT is restricted.

7 is a diagram for explaining the rotation angle α of the polygon mirror PM that can deflect (reflect) the light beam LBn toward the fθ lens FT by the reflection surface RP of the polygon mirror PM of the scanning unit Un. This rotation angle α is the maximum scanning rotation angle range of the polygon mirror PM that the polygon mirror PM of the scanning unit Un can scan the spot light SP on the illuminated surface of the substrate FS through a reflective surface RP. Hereinafter, the rotation angle α is referred to as the maximum scanning rotation angle range. The period during which the polygon mirror PM rotates the maximum scanning rotation angle range α becomes the effective scanning period (maximum scanning time) of the spot light SP. The maximum scan rotation angle range α corresponds to the maximum scan length of the above-mentioned drawing line SLn. The larger the maximum scan rotation angle range α, the longer the maximum scan length. The rotation angle β represents the rotation angle from the angle of the polygon mirror PM when the light beam LB starts to enter a specific reflection surface RP to the angle of the polygon mirror PM when the incidence to the specific reflection surface RP ends. That is, the rotation angle β is the angle at which the polygon mirror PM rotates one of the reflection surfaces RP. The rotation angle β is defined by the number Np of the reflection surface RP of the polygon mirror PM, and can be expressed by β≒360/Np. Therefore, the specific reflection surface RP of the polygon mirror PM of the scanning unit Un cannot make the spot light SP scan on the illuminated surface of the substrate FS, that is, the reflected light reflected by the specific reflection surface RP of the polygon mirror PM cannot The non-scanning rotation angle range r of the polygon mirror PM incident on the fθ lens FT is expressed by the relational expression of r=β-α. The period during which the polygon mirror PM rotates the non-scanning rotation angle range r becomes the invalid scanning period of the spot light SP. In this non-scanning rotation angle range r, the scanning unit Un cannot irradiate the light beam LBn onto the substrate FS. The rotation angle α and the non-scanning rotation angle range r have a relationship of formula (1). r=(360°/Np)-α …(1) (Where N is the number of polygonal mirror PM with reflective surface RP)

In the first embodiment, since the polygon mirror PM has eight reflection surfaces RP, N=8. Therefore, the formula (1) can be expressed by the formula (2). r=45 degrees-α …(2)

The maximum scanning rotation angle range α is changed according to conditions such as the distance between the polygon mirror PM and the fθ lens FT. For example, if the maximum scanning rotation angle range α is 15 degrees, the non-scanning rotation angle range r becomes 30 degrees, and the scanning efficiency of the polygon mirror PM becomes α/β=1/3 in FIG. 7. That is, while the polygon mirror PM of the scanning unit Un rotates the non-scanning rotation angle range r (30 degrees), the light beam LBn incident on the polygon mirror PM is useless.

Therefore, in the first embodiment, the scanning unit Un that causes the light beam LB from one light source device 14 to enter is switched, and the light beam LB is periodically distributed to the three scanning units Un, thereby improving the scanning efficiency. That is, by shifting the drawing periods of the three scanning units Un (the scanning period for scanning the spot light SP) from each other, the light beam LB from the light source device 14 is not useless, and the scanning efficiency can be improved.

In addition, the effective scanning period (effective drawing period), that is, the maximum scanning rotation angle range α is the range where the spot light SP can be effectively scanned on the drawing line SLn after the light beam LBn enters the fθ lens FT, but the maximum scanning rotation angle range α also depends on The focal length and the like on the front side of the fθ lens FT change. In the case of the same eight-sided polygon mirror PM as above, the maximum scanning rotation angle range α is 10 degrees, according to equation (2), the non-scanning rotation angle r is 35 degrees during the non-drawing period, and the scanning efficiency of the drawing at this time It becomes approximately 1/4 (10/45). Conversely, when the maximum scanning rotation angle range α is 20 degrees, according to equation (2), the non-scanning rotation angle r is 25 degrees during the non-drawing period, and the scanning efficiency of the drawing at this time becomes about 1/2(20/ 45). In addition, when the scanning efficiency is more than 1/2, the number of scanning units Un allocated to the light beam LB may also be two. That is, the number of scanning units Un that can distribute the light beam LB is limited by the scanning efficiency.

FIG. 8 is a schematic diagram of optical paths for introducing light into the optical system 40a and a plurality of scanning units U1, U3, and U5. When the drive signal (high-frequency signal) applied to the selection optical element (AOM) 50 from the control device 18 is ON and the drive signal applied to the selection optical elements 58, 66 is OFF, the selection optical element 50 makes the incident The light beam LB is diffracted. As a result, the first diffracted light diffracted by the selected optical element 50, that is, the light beam LB1 passes through the mirror 52 and enters the scanning unit U1, and the light beam LB does not enter the scanning units U3 and U5. Similarly, when the drive signal applied to the selection optical element (AOM) 58 from the control device 18 is ON and the drive signal applied to the selection optical elements 50, 66 is OFF, the selection optical element 50 in the ON state is transmitted The light beam LB enters the selection optical element 58, and the selection optical element 58 diffracts the incident light beam LB. As a result, the first diffracted light diffracted by the selected optical element 58, that is, the light beam LB3 passes through the mirror 60 and enters the scanning unit U3, and the light beam LB does not enter the scanning units U1 and U5. In addition, when the drive signal applied to the selection optical element (AOM) 66 from the control device 18 is ON and the drive signal applied to the selection optical element 50, 58 is OFF, the selection optical element 50 in the OFF state is transmitted, The light beam LB of 58 enters the selection optical element 66, and the selection optical element 66 diffracts the incident light beam LB. As a result, the first diffracted light diffracted by the optical element 66, that is, the light beam LB5 enters the scanning unit U5 through the mirror 68, and the light beam LB does not enter the scanning units U1 and U3.

As described above, by introducing light into the plurality of selection optical elements 50, 58, 66 in the optical system 40a, they are arranged in line along the traveling direction of the light beam LB from the light source device 14, and the plurality of selection optical elements 50, 58, 66 may be Switch whether to make the light beam LBn (LB1, LB3, LB5) enter any one of the scanning units U1, U3, U5. The control device 18 controls the plurality of selection optical elements 50, 58, 66 by periodically switching the scanning unit Un into which the light beam LB enters in the order of, for example, scanning unit U1 → scanning unit U3 → scanning unit U5 → scanning unit U1 . That is, the light beam LBn (LB1, LB3, LB5) is sequentially switched into a plurality of scanning units U1, U3, U5 at a predetermined scanning time.

During the polygon mirror PM of the scanning unit U1, while the light beam LB1 enters the scanning unit U1, its rotation is controlled by the control device 18, and the incident light beam LB1 can be reflected toward the fθ lens FT. That is, the period during which the light beam LB1 enters the scanning unit U1 is synchronized with the scanning period (the maximum scanning rotation angle range α in FIG. 7) of the spot light SP of the light beam LB1 performed by the scanning unit U1. That is, the polygon mirror PM of the scanning unit U1 deflects the light beam LB1 in such a manner that the spot light SP of the light beam LB1 incident on the scanning unit U1 scans along the drawing line SL1 in synchronization with the period during which the light beam LB1 enters. Similarly, the polygon mirror PM of the scanning units U3, U5 is controlled by the control device 18 while the light beams LB3, LB5 are incident on the scanning units U3, U5, so that the incident light beams LB3, LB5 are reflected to the fθ lens FT . That is, the period during which the light beams LB3, LB5 enter the scanning units U3, U5 is synchronized with the scanning period of the spot light SP of the light beams LB3, LB5 performed by the scanning units U3, U5. That is, the polygon mirror PM of the scanning units U3, U5 is synchronized with the period during which the light beams LB3, LB5 are incident, so that the spot light SP of the light beam LB incident on the scanning units U3, U5 scans along the drawing lines SL3, SL5 The way to deflect the light beams LB3, LB5.

As described above, the light beam LB from one light source device 14a is supplied to any one of the three scanning units U1, U3, U5 in a time-sharing manner. Therefore, the polygon mirror PM of each of the scanning units U1, U3, U5 is The rotation speed is controlled to keep the rotation speed uniform while keeping the rotation angle position at a certain angle difference (maintaining the phase difference). Specific examples of its control will be described later.

Further, the control device 18 controls the supply of the pattern data (drawing data) of the pattern drawn on the substrate FS by the light beams LB1, LB3, LB5 irradiated from the scanning units U1, U3, U5 according to the regulations. The driving signals (high-frequency signals) of the optical elements 106 for drawing of the scanning units U1, U3, U5 are turned on/off. Thereby, the drawing optical elements 106 of the scanning units U1, U3, U5 diffract the incident light beams LB1, LB3, LB5 according to the ON/OFF driving signal, and can adjust the intensity of the spot light SP. This pattern data is, for example, set one point (pixel) of the drawing pattern to be 3×3 μm, which will be “1” when the driving signal is ON (drawing) for each point and “0” when the driving signal is OFF (non-drawing) The double-valued data is generated as bitmap data, and each scanning unit Un is temporarily stored in the memory (RAM).

Further detailing the pattern data set for each scanning unit Un, the pattern data (drawing data) are taken along the scanning direction of the spot light SP (main scanning direction, Y direction) as the row direction, and along the substrate FS The direction of the conveying direction (sub-scanning direction, X direction) is bitmap data composed of a plurality of pixel data (hereinafter, referred to as pixel data) decomposed two-dimensionally like a column direction. This pixel data is 1-bit data of "0" or "1". The pixel data of "0" means that the intensity of the spot light SP irradiated to the substrate FS is at a low level, and the pixel data of "1" means that the intensity of the spot light SP irradiated to the substrate FS is at a high level. The pixel data in one row of the pattern data corresponds to a drawing line SLn (SL1~SL6), and the intensity of the spot light SP projected onto the substrate FS along the one drawing line SLn (SL1~SL6) is modulated according to the pixel data in a row. The pixel data in this row is called sequence data (drawing information). That is, the pattern data is bitmap data in which the sequence data DLn is arranged in the row direction. DL1 represents the serial data DLn of the pattern data of the scanning unit U1. Similarly, there may be cases where DL2 to DL6 represent the serial data DLn of the pattern data of the scanning units U2 to U6.

The control device 18 inputs the ON/OFF driving signal into the drawing of the scanning unit Un into which the light beam LBn enters based on the pattern data of the scanning unit Un into which the light beam LBn enters (sequence data DLn composed of "0" and "1") With optical elements (AOM) 106. The drawing optical element 106 diffracts the incident light beam LBn and irradiates the reflecting mirror 110 if the driving signal of ON is input, and irradiates the incident light beam LBn to the above-mentioned reflecting plate (not shown) if the driving signal of OFF is input. Or the above absorber. As a result, the scanning unit Un into which the light beam LBn enters, and if the drive signal of ON is input to the drawing optical element 106, the spot light SP of the light beam LBn is irradiated onto the substrate FS (the intensity of the spot light SP becomes higher), and if the drive is OFF When the signal is input to the optical element 106 for drawing, the spot light of the light beam LBn is not irradiated on the substrate FS (the intensity of the spot light SP becomes 0). Therefore, the scanning unit Un into which the light beam LBn enters can draw a pattern based on the pattern data on the substrate FS along the drawing line SLn.

For example, when the light beam LB3 enters the scanning unit U3, the control device 18 switches ON/OFF (drives) the drawing optical element 106 of the scanning unit U3 based on the pattern data of the scanning unit U3. Thereby, the scanning unit U3 can draw a pattern based on the pattern data on the substrate FS along the drawing line SL3. In the above manner, each scanning unit U1, U3, U5 can modulate the intensity of the spot light (scanning spot light) SP along the drawing lines SL1, SL3, SL5, and draw a pattern based on the pattern data on the substrate FS.

In addition, although the operation of the light introducing optical system 40a and the plurality of scanning units U1, U3, U5 is described using FIG. 8, the same applies to the light introducing optical system 40b and the plurality of scanning units U2, U4, U6. Briefly, the control device 18 controls the multiple selections in such a manner that the scanning unit Un of the even number that the light beam LBn from the light source device 14b enters is switched in the order of, for example, scanning unit U2 → scanning unit U4 → scanning unit U6 → scanning unit U2 With optical elements 50, 58, 66. That is, the switching is performed in such a manner that the light beam LB sequentially enters each of the plurality of scanning units U2, U4, and U6 at a predetermined scanning time. The polygon mirror PM of each scanning unit U2, U4, U6, under the control of the control device 18, is synchronized with the period during which the light beam LBn is incident, so that the spot light SP of the incident light beam LBn is along the drawing lines SL2, SL4, The SL6 scanning mode deflects the light beam LBn. In addition, the control device 18 draws a pattern based on the pattern data on the substrate FS along the drawing lines SL2, SL4, and SL6 with the scanning units U2, U4, and U6, according to the light beam LBn(LB2, LB4, LB6) The pattern data (sequence data DLn(DL2, DL4, DL6) composed of "0" and "1") of the scanning unit Un(U2, U4, U6) injected is used to control the scanning unit Un(U2, U4, U6) ) For drawing optical elements (AOM) 106.

As described above, in the above-described first embodiment, a plurality of selection optical elements 50, 58, 66 are arranged in-line along the traveling direction of the light beam LB from the light source device 14a (14b). The optical elements 50, 58, 66 enable the light beam LBn to selectively enter any one of the scanning units U1, U3, U5 (scanning units U2, U4, U6) in a time-sharing manner, and the light beam LB will not be useless, The utilization efficiency of the light beam LB can be improved.

In addition, the rotation speed and rotation phase of each polygon mirror PM of the plurality (three in this case) of the scanning unit Un are synchronized with each other, and the light beam LBn is incident through the plurality of selection optical elements 50, 58, 66 The periods of the scanning units Un are synchronized, and the polygon mirror PM deflects the light beam LBn by scanning the spot light SP on the substrate FS. Therefore, the light beam LB is not useless, and the scanning efficiency can be improved.

In addition, the optical elements (AOM) 50, 58, 66 may be selected to be in the ON state during one scan of the spot light SP performed by each polygon mirror PM of the scanning unit Un. For example, if the number of reflecting surfaces of the polygon mirror PM is Np and the rotational speed Vp of the polygon mirror PM is (rpm), the time Tss corresponding to the rotation angle β of one of the reflecting surfaces RP of the polygon mirror PM becomes Tss=60/( Np·Vp) seconds. For example, in the case where the number of reflecting surfaces Np is 8 and the rotation speed Vp is 30,000, one of the polygon mirrors PM rotates for 2 milliseconds and the time Tss is 0.25 milliseconds. This is converted into a frequency of 4kHz, that is, compared to the acousto-optic modulation element (drawing optical element 106) that modulates the beam LB of the ultraviolet wavelength in response to the pattern data at a high speed of tens of MHz, as long as it is very A low response frequency acousto-optic modulating element is sufficient. Therefore, the selection of optical elements (AOM) 50, 58, 66 can use the first diffracted light that is deflected relative to the incident light beam LB (0th order light), that is, the larger diffracted angle of LBn (LB1~LB6). Therefore, the light beam LBn (LB1 to LB6) deflected with respect to the path of the light beam LB linearly transmitted through the selection optical elements 50, 58, 66 is guided to the mirror 52, 60, 68 of the scanning unit Un (refer to FIG. 3 , Figure 4) configuration becomes easy.

(Modification of the first embodiment described above) The first embodiment described above may be modified as follows. In the first embodiment described above, the light beam LB is distributed to three scanning units Un. However, in this modification, the light beam LB from one light source device 14 is distributed to five scanning units Un.

FIG. 9 is a diagram showing the configuration of the drawing head 16 according to a modification of the first embodiment. In this modification, there is one light source device 14 and the drawing head 16 has five scanning units Un (U1 to U5). In addition, the same components as those in the above-described first embodiment are given the same symbols or are not shown, and only different parts will be described. In addition, in FIG. 9, the cylindrical lens CYb shown in FIG. 3 is omitted.

In this modification, instead of the light introduction optical systems 40a, 40b, the light introduction optical system (beam switching member) 130 is used. The light introduction optical system 130, as shown in FIG. 10, except the condensing lens 42, collimating mirror 44, reflecting mirror 46, condensing lens 48, selection optical element 50, reflecting mirror 52, collimating shown in FIG. In addition to the mirror 54, the condenser lens 56, the selection optical element 58, the reflection mirror 60, the collimator lens 62, the condenser lens 64, the selection optical element 66, the reflection mirror 68, and the absorber 70, further includes a selection optics Element 132, reflector 134, collimator lens 136, condenser lens 138, selection optical element 140, reflector 142, collimator lens 144, and condenser lens 136.

The selection optical element 132, the collimator lens 136, and the condenser lens 138 are sequentially provided between the condenser lens 56 and the selection optical element 58. Therefore, in this modification, the selection optical element 50, when the drive signal (high-frequency signal) from the control device 18 is OFF, transmits the incident light beam LB directly to the selection optical element 132, and condenses the light The lens 56 condenses the light beam LB incident on the selection optical element 132 in the selection optical element 132 into a beam waist width.

The selection optical element 132 has transparency to the light beam LB, and for example, an acousto-optic modulation element (AOM) is used. The selection optical element 132 transmits the incident light beam LB directly to the selection optical element 58 when the drive signal from the control device 18 is OFF, and turns on the drive signal (high frequency signal) from the control device 18 At this time, the first diffracted light diffracting the incident light beam LB, that is, the light beam LB2 is irradiated to the reflecting mirror 134. The reflecting mirror 134 reflects the incident light beam LB2 and enters the collimating mirror 100 of the scanning unit U2. That is, the control device 18 switches the selection optical element 132 to ON/OFF, and the selection optical element 132 switches whether the light beam LB2 is incident on the scanning unit U2. The collimator lens 136 makes the light beam LB irradiated to the selection optical element 58 into parallel light, and the condenser lens 138 condenses the light beam LB made parallel by the collimator lens 136 into the selection optical element 58 to form the beam waist width .

The selection optical element 140, the collimator lens 144, and the condenser lens 146 are sequentially provided between the condenser lens 64 and the selection optical element 66. Therefore, in this modification, when the drive signal from the control device 18 is OFF, the selection optical element 58 directly transmits the incident light beam LB and irradiates the selection optical element 140, and the condenser lens 64 causes the incidence The light beam LB of the selection optical element 140 is condensed in the selection optical element 140 to form a beam waist width.

The selection optical element 140 has transparency to the light beam LB, and for example, an acousto-optic modulation element (AOM) is used. The selection optical element 140 irradiates the incident optical beam LB to the selection optical element 66 when the drive signal from the control device 18 is OFF. When the drive signal (high frequency signal) from the control device 18 is ON, the The first diffracted light diffracted by the incident light beam LB, that is, the light beam LB4 is irradiated to the reflecting mirror 142. The reflecting mirror 142 reflects the incident light beam LB4 and irradiates the collimating mirror 100 of the scanning unit U4. That is, the control device 18 switches the selection optical element 140 to ON/OFF, and the selection optical element 140 switches whether or not the light beam LB4 is incident on the scanning unit U4. The collimator lens 144 collimates the light beam LB irradiated to the selection optical element 66 into parallel light, and the condenser lens 146 condenses the light beam LB collimated by the collimator lens 144 into the selection optical element 66 to form a beam waist width .

By arranging the plurality of selective optical elements (AOM) 50, 58, 66, 132, and 140 in series (in-line), the light beam LBn can be incident on any one of the plurality of scanning units U1 to U5. The control device 18 controls the plurality of selections by periodically switching the scanning unit Un into which the light beam LBn enters, such as the scanning unit U1→scanning unit U2→scanning unit U3→scanning unit U4→scanning unit U5→scanning unit U1 With optical elements 50, 132, 58, 140, 66. That is, the light beam LBn is sequentially switched into each of the plurality of scanning units U1 to U5 at a predetermined scanning time. In addition, the polygon mirror PM of each scanning unit U1 to U5 is controlled by the control device 18 in synchronization with the period during which the light beam LBn is incident, so that the spot light SP of the incident light beam LBn is scanned along the drawing lines SL1 to SL5 This way, the light beam LBn is deflected. In addition, the control device 18 draws the pattern data based on the pattern data on the substrate FS along the drawing line SLn by each scanning unit Un, according to the pattern data of the scanning unit Un (from "0", The sequence data DLn composed of "1" controls the drawing optical element (AOM) 106 of the scanning unit Un.

That is, in the case of this modified example, each polygon mirror PM of the five scanning units U1 to U5 rotates synchronously at a certain angle with phase shifted by a certain angle. Furthermore, in the case of this embodiment, the light beam (laser light) LB is distributed to the five scanning units U1 to U5 in a time-sharing manner, so the angle range of one reflection surface RP of the polygon mirror PM can be irradiated with the light beam LBn (FIG. 7 The rotation angle β in) and the maximum deflection angle of the light beam LBn reflected by the reflection surface RP into the fθ lens FT (angle 2α in FIG. 7) satisfy β≧5α, set the focal distance or polygon mirror in front of the fθ lens FT PM reflection surface number Np.

As described above, in this modified example, the light beam LB is not useless, and the utilization efficiency of the light beam LB from the light source device 14 can be improved to improve the scanning efficiency. In addition, in this modification, although the light beam LB from one light source device 14 is distributed to five scanning units Un, the light beam LB from one light source device 14 may also be distributed to two scanning units Un or four One or more than six scanning units Un. In this case, if the number of allocated scanning units is n, the angle range (rotation angle β in FIG. 7) of one reflection surface RP of the polygon mirror PM can be irradiated with the light beam LBn and the light beam reflected by the reflection surface RP The maximum deflection angle of LB incident on the fθ lens FT (angle 2α in FIG. 7) satisfies β≧n×α, and the focal length in front of the fθ lens FT or the number Np of reflection surfaces of the polygon mirror PM is set. Moreover, as described in the first embodiment described above, the case where the light beam LB from the two light source devices 14 (14a, 14b) is distributed to the plurality of scanning units Un is not limited to three, and may be distributed to any number of Scanning unit Un. For example, the light beam LB from the light source device 14a may be distributed to five scanning units Un, and the light beam LB from the light source device 14b may be distributed to four scanning units Un.

(Second embodiment) In the first embodiment described above, since the optical element for drawing (AOM) 106 is provided in front of the polygon mirror PM in each scanning unit Un, the number of optical elements for drawing 106 used is increased and the cost is increased. Therefore, in the second embodiment, a drawing optical modulator (AOM) is provided on the optical path of the light beam LB from one light source device 14, and the scanning optical unit Un is modulated using the one drawing optical modulator The intensity of the light beam LBn irradiated to the substrate FS and a pattern are drawn. That is, in the second embodiment, only one optical modulator (AOM) for drawing that requires high responsiveness is arranged before the plurality of scanning units Un, and a selection with low responsiveness can be arranged on each scanning unit Un side. Optical components (AOM).

FIG. 11 is a diagram showing the configuration of the drawing head 16 in the second embodiment. FIG. 12 is a diagram showing the light introduction optical system 40a shown in FIG. The same components as those in the first embodiment described above are given the same symbols, and only the different parts will be described. In addition, in FIG. 11, the cylindrical lens CYb shown in FIG. 3 is omitted. Since the light introduction optical systems 40a and 40b have the same configuration, the light introduction optical system 40a will be described here, and the description of the light introduction optical system 40b will be omitted. As shown in FIG. 12, the light is introduced into the optical system 40a, except for the condenser lens 42, collimator lens 44, reflector 46, condenser lens 48, selection optical element 50, reflector 52, and collimator shown in FIG. 4 described above The mirror 54, the condenser lens 56, the selection optical element 58, the reflection mirror 60, the collimator lens 62, the condenser lens 64, the selection optical element 66, the reflection mirror 68, and the absorber 70 are further provided for drawing An optical element (AOM) 150 for drawing an optical modulator, a collimator lens 152, a condenser lens 154, and an absorber 156. In the second embodiment, as shown in FIG. 11, the scanning optical elements 106 of the first embodiment are not included in the scanning units U1 to U6.

The drawing optical element 150, the collimator lens 152, and the condenser lens 154 are provided between the condenser lens 48 and the selection optical element 50 in this order. Therefore, in the second embodiment, the reflecting mirror 46 reflects the light beam LB that is collimated by the collimator 44 and then faces the optical element 150 for drawing. The condenser lens 48 condenses (converges) the light beam LB incident on the drawing optical element 150 into a beam waist width in the drawing optical element 150.

The optical element 150 for drawing has transmissivity to the light beam LB, and uses, for example, an acousto-optic modulation element (AOM). The optical element 150 for drawing is provided on the light source device 14 (14a) side at the initial stage of the optical element 50, 58, 66 which is positioned closest to the light source device 14 (14a) side. The drawing optical element 150 irradiates the incident light beam LB to the absorber 156 when the driving signal (high-frequency signal) from the control device 18 is off, and turns on the driving signal (high-frequency signal) from the control device 18 At this time, the first diffracted light beam (drawing light beam) LB, which is the diffracted light beam LB, is irradiated to the selection optical element 50 at the initial stage. The collimator lens 152 makes the light beam LB irradiated to the selection optical element 50 into parallel light, and the condenser lens 154 condenses (converges) the light beam LB which becomes parallel light by the collimator lens 152 into the selection optical element 50 Waist width.

As shown in FIG. 11, the scanning units U1 to U6 have a collimating mirror 100, a reflecting mirror 102, a reflecting mirror 110, a cylindrical lens CYa, a reflecting mirror 114, a polygon mirror PM, a fθ lens FT, and a cylindrical lens CYb (in FIG. 11 (Not shown), and the mirror 122 further have a first shaping lens 158a and a second shaping lens 158b as beam shaping lenses. That is, in the second embodiment, instead of the condenser lens 104 and the collimator lens 108 of the first embodiment, the scanning units U1 to U6 are provided with a first shaped lens 158a and a second shaped lens 158b.

FIG. 13 is a schematic diagram of the optical path of introducing the light of FIG. 12 into the optical system 40a and a plurality of scanning units U1, U3, U5. The control device 18, according to regulations, pattern data of the pattern drawn on the substrate FS by the light beams LB1, LB3, LB5 irradiated from the scanning units U1, U3, U5 (composed of "0", "1" Serial data DL1, DL3, DL6), the ON/OFF drive signal (high frequency signal) is output to the drawing optical element 150 of the light introduction optical system 40a. With this, the drawing optical element 150 of the light introduction optical system 40a can diffract the incident light beam LB according to the ON/OFF driving signal, and modulate (ON/OFF) the intensity of the spot light SP.

In detail, the control device 18 inputs the ON/OFF driving signal to the drawing optical element 150 based on the pattern data of the scanning unit Un into which the light beam LBn enters. The drawing optical element 150, when the drive signal (high frequency signal) of ON is input, diffracts the incident light beam LB and irradiates the selection optical element 50 (the intensity of the light beam LB incident on the selection optical element 50 becomes higher) ). On the other hand, the drawing optical element 150, when the OFF drive signal (high-frequency signal) is input, irradiates the incident light beam LB to the absorber 156 (FIG. 12) (the light beam LB incident on the selection optical element 50) The intensity becomes 0). Therefore, the scanning unit Un into which the light beam LBn enters can irradiate the light beam LB whose intensity is adjusted to the substrate FS along the drawing line SLn, and draw a pattern based on the pattern data on the substrate FS.

For example, when the light beam LB3 is incident on the scanning unit U3, the control device 18, based on the pattern data of the scanning unit U3, switches the light introduction optical element 150 of the optical system 40a to ON/OFF. Thereby, the scanning unit U3 can irradiate the substrate FS with the modulated light beam LB along the drawing line SL3, and draw a pattern based on the pattern data on the substrate FS. The scanning unit Un into which the light beam LBn enters is switched sequentially, for example, in the manner of scanning unit U1→scanning unit U3→scanning unit U5→scanning unit U1. Therefore, the control device 18 similarly switches the pattern data of the scanning unit U1 → the pattern data of the scanning unit U3 → the pattern data of the scanning unit U5 → the pattern data of the scanning unit U1 sequentially to determine the transmission to the light-introducing optics It is the pattern data of the ON/OFF signal of the optical element 150 for drawing 40a. Next, the control device 18 controls the drawing optical element 150 of the light introduction optical system 40a based on the sequentially switched pattern data. Thereby, each scanning unit U1, U3, U5 can irradiate the substrate FS with the light beam LB whose intensity is adjusted along the drawing lines SL1, SL3, SL5, and draw a pattern based on the pattern data on the substrate FS.

The configuration and operation of a part of the control system to which the second embodiment is applied have been described in detail above with reference to FIGS. 14 to 16. In addition, the configuration and operation described below can also be applied to the first embodiment. FIG. 14 is a block diagram of the rotation control system of the polygon mirror PM of each of the three scanning units U1, U3, U5 provided in FIGS. 11 and 13 as an example. Therefore, the same symbols are given to the same members. Each of the scanning units U1, U3, U5 is provided with a photoelectric detection origin sensor OP1, OP3 of the scanning start timing (scanning line) SL1, SL3, SL5 of the scan line (scan line) generated on the substrate FS by the polygon mirror PM , OP5. The origin sensors OP1, OP3, OP5 are photodetectors that project light on the reflective surface RP of the polygon mirror PM and receive the reflected light. Whenever the spot light SP comes to the scanning start point next to the drawing lines SL1, SL3, SL5 At the previous position, the pulse-shaped origin signals SZ1, SZ3 and SZ5 are output respectively.

The timing measurement part 180 inputs the origin signals SZ1, SZ3, SZ5, and measures whether the timing of the origin signals SZ1, SZ3, SZ5 is within a predetermined allowable range (time interval). The deviation information corresponding to it is output to the servo control device 182. The servo control device 182 outputs a command value based on the deviation information to each servo drive circuit portion of the motor Mp that drives the polygon mirror PM in each scanning unit U1, U3, U5. Each servo drive circuit part of the motor Mp receives the up-down pulse signal (hereinafter referred to as an encoder signal) from the encoder EN mounted on the rotation axis of the motor Mp and outputs a speed signal corresponding to the rotation speed of the polygon mirror PM The return circuit part FBC and a servo drive circuit (amplifier) SCC that inputs the command value from the servo control device 182 and the speed signal from the return circuit part FBC and drives the motor Mp so as to become the rotation speed corresponding to the command value. In addition, the servo drive circuit section (return circuit section FBC, servo drive circuit SCC), timing measurement section 180, and servo control device 182 constitute a part of the control device 18.

In the second embodiment, each polygon mirror PM in the three scanning units U1, U3, U5 must maintain a certain phase difference in its rotation angle position and rotate at the same speed at the same time. In order to achieve this, the timing measurement unit 180 inputs the original Point signals SZ1, SZ3, SZ5, for example, the measurements shown in the timing diagram of FIG. 15.

FIG. 15 schematically shows various signal waveforms generated when the three polygon mirrors PM rotate at a rotation angle with a phase difference within a predetermined allowable range. Immediately after rotating each polygon mirror PM, the relative phase differences of the origin signals SZ1, SZ3, SZ5 are different, but the timing measurement part 180, for example, takes the origin signal SZ1 as a reference and the same frequency as the origin signal SZ1 (Period) Generate other origin signals SZ3, SZ5, and take the time interval Ts1, Ts2, Ts3 between the three origin signals SZ1, SZ3, SZ5 as the reference value, measure the correction corresponding to the error relative to it News. The timing measurement part 180 outputs the correction information to the servo control device 182, thereby performing servo control on the motors Mp of the scanning units U3, U5, and the generation timing of the three origin signals SZ1, SZ3, SZ5 is controlled as shown in the figure 15 generally stable as Ts1=Ts2=Ts3.

If the timing of generating the origin signals SZ1, SZ3, and SZ5 is stable, the timing measurement unit 180 draws the enable signal SPP1 for each output of the selection optical elements 50, 58, 66 shown in FIGS. 11 to 13 above. SPP3, SPP5. Describe the enable (ON) signals SPP1, SPP3, SPP5. Here, only during the H level period, the corresponding selection optical elements 50, 58, 66 are used to perform the modulation operation (light deflection switching operation). The three origin signals SZ1, SZ3, SZ5 maintain a certain phase difference steadily (here is 1/3 of the period of the origin signal SZ1), therefore depict the rise of the enable signals SPP1, SPP3, SPP5 (L→H ) Also maintains a certain phase difference. This depiction enable signal SPP1, SPP3, SPP5 corresponds to the drive signal (high frequency signal) for switching the selection optical elements 50, 58, 66.

The timing of drawing down (H→L) of the enabling signals SPP1, SPP3, SPP5 is measured by the counter in the timing measuring section 180 in each drawing line SL1, SL3, SL5 to turn on/off the spot light The clock signal CLK is set. The clock signal CLK controls the ON/OFF timing of the drawing optical element 150 (or the drawing optical element 106 in FIG. 3). The length of the drawing line SLn (SL1, SL3, SL5) and the spot light on the substrate FS The size and scanning speed Vs of the spot light SP are determined. For example, if the length of the trace line is 30 mm and the size (diameter) of the spot light is 6 μm, the spot light is turned on and off by 3 μm one by one in the scanning direction and turned on/off. If the counter in the timing measurement section 180 counts the clock signal CLK 100 times (30mm/3μm), the drawing enable signals SPP1, SPP3, SPP5 can be decreased (H→L).

In addition, if the reflection surface of the polygon mirror PM is 10 and the rotation speed is Vp (rpm), the frequency of each origin signal SZ1, SZ3, SZ5 becomes 10Vp/60 (Hz). Therefore, the time interval Ts1=Ts2=Ts3 is stable, and the time interval Ts1 becomes 60/(30Vp) seconds. As an example, if the reference rotational speed Vp of the polygon mirror PM is 8000 rpm, the time interval Ts1 becomes 60/(30·8000) seconds=250 μS.

As shown in Fig. 15, the ON time (duration of H level) of the enabling signals SPP1, SPP3, SPP5 is depicted as the period during which the light beam (laser light) LB from the polygon mirror PM is projected onto the substrate FS as spot light ( Projection period), but it must be set shorter than the time interval Ts1. Therefore, for example, if the ON time Toa is set to 200 μS, the frequency of the clock signal CLK used to count 10000 times during this period becomes 10000/200=50 (MHz). Synchronized with the above-mentioned clock signal CLK, the drawing bit row data or sequence data DLn (for example, 10000 bits) Sdw corresponding to the drawing line SLn generated from the pattern data ("0" or "1" on the bitmap) Output to the optical element 150 for drawing. In addition, as shown in FIG. 3, each of the scanning units U1, U3, U5 is provided with a drawing optical element 106, and the drawing bit row data Sdw or sequence data DL1 corresponding to the drawing line SL1 is transmitted to the scanning unit U1 for drawing The optical element 106 transmits the drawing bit row data Sdw or the sequence data DL3 corresponding to the drawing line SL3 to the drawing optical element 106 corresponding to the drawing line SL5, and transmits the drawing bit row data Sdw or the sequence data DL5 corresponding to the drawing line SL5 to the scanning unit Optical element 106 for drawing of U5.

In the second embodiment, the drawing bit row data Sdw or the sequence data DLn generated from the pattern data corresponding to each of the three drawing lines Sl1, SL3, SL5, and the drawing enable signals SPP1, SPP3, SPP5 (or origin) The signals SZ1, SZ3, SZ5) are sequentially supplied to ON/OFF of the drawing optical element 150 in sequence.

FIG. 16 shows an example of a circuit for generating the above described bit row data Sdw, which has generating circuits (pattern data generating circuits) 301, 303, 305 and an OR circuit GT8. The generating circuit 301 includes a memory portion BM1, a counter portion CN1, and a gate portion GT1, the generating circuit 303 includes a memory portion BM3, a counter portion CN3, and a gate portion GT3, and the generating circuit 305 includes a memory portion BM5, a counter portion CN5, and Gate part GT5. The generating circuits 301, 303, 305 and the OR circuit GT8 constitute a part of the control device 18.

The memory parts BM1, BM3, and BM5 are memories that store bitmap data (pattern data) corresponding to the exposed patterns of the scanning units U1, U3, and U5 at a time. The counter parts CN1, CN3, CN5 are the bitmap data (pattern data) in each memory part BM1, BM3, BM5, followed by a bit row to be drawn (for example, 10,000 bits) bit by bit The ground is used as the counter for the serial data DL1, DL3, DL5 synchronized with the clock signal CLK during the period when the enabling signals SPP1, SPP3, SPP5 are drawn ON.

The drawing data in each memory part BM1, BM3, BM5 is offset by a drawing line by an unillustrated address counter or the like. This offset, for example, if it is the memory part BM1, after the output of the sequence data DL1 of a drawing line is completed, followed by the timing of generating the origin signal SZ3 of the active scanning unit U3. Similarly, the offset of the image data in the memory unit BM3 is performed after the timing data generated by the origin signal SZ5 of the active scanning unit U5 after the output of the sequence data DL3 ends, and the offset of the image data in the memory unit BM5 After the output of the sequence data DL5 is completed, the timing of generating the origin signal SZ1 of the active scanning unit U1 is followed.

The sequence data DL1, DL3, DL5 sequentially generated in the above manner are applied to the 3-input OR circuit GT8 through the gates GT1, GT3, GT5 which are opened during the ON period of the drawing enable signals SPP1, SPP3, SPP5. The OR circuit GT8 repeatedly outputs the sequence of bit data of the sequence data DL1→DL3→DL5→DL1... as drawing bit row data Sdw to ON/OFF of the drawing optical element 150. In addition, as shown in FIG. 3, each of the scanning units U1, U3, and U5 is provided with a drawing optical element 106, as long as the sequence data DL1 output from the gate GT1 is transmitted to the drawing optical element 106 in the scanning unit U1 The sequence data DL3 output from the gate GT3 is transmitted to the drawing optical element 106 in the scanning unit U3, and the sequence data DL5 output from the gate GT5 is transmitted to the drawing optical element 106 in the scanning unit U5.

As described above, the ON/OFF of the rendering optical element 150 (or 106) must respond to the high-speed clock signal CLK (for example, 50MHz), but the optical elements 50, 58, 66 are selected as long as they are in line with the rendering enable signals SPP1, SPP3, SPP5 (or origin signal SZ1, SZ3, SZ5) can be turned ON/OFF synchronously, and its response frequency. In the case of the above numerical example, the time interval Toa (or Ts1) is 200μs, so it is enough to be about 10KHz. Use those with high transmittance and low prices. In addition, if the frequency of the clock signal CLK counted by the counter in the timing measurement part 180 or counted by the counter parts CN1, CN3, CN5 in FIG. 16 is Fcc, the basic frequency of the pulse oscillation of the light beam LB from the light source device 14 For Fs, set n to an integer of 1 or more (preferably n≧2), and set it to satisfy the relationship of n·Fcc=Fs.

The above has described the operation of using the light introduction optical system 40a of FIG. 13 and a plurality of scanning units U1, U3, U5, and the timing of drawing using the scanning units U1, U3, U5 of FIGS. 14 to 16, etc. The introduction optical system 40b is also the same as the plural scanning units U2, U4, U6. Briefly, the scanning unit Un into which the light beam LB enters is switched in the order of, for example, scanning unit U2→scanning unit U4→scanning unit U6→scanning unit U2. Therefore, the control device 18 similarly switches the pattern data of the scanning unit U2 → the pattern data of the scanning unit U4 → the pattern data of the scanning unit U6 → the pattern data of the scanning unit U2 sequentially to determine the transmission to the light-introducing optics It is the pattern data of the ON/OFF signal of the optical element 150 for drawing 40b. Next, the control device 18 controls the drawing optical element 150 of the light introduction optical system 40b based on the sequentially switched pattern data. In addition, with the circuit configuration shown in FIG. 16, the drawing bit row data Sdw synthesized by generating the pattern data of three drawing lines is transmitted to the drawing optical element 150. In this way, each scanning unit U2, U4, U6 can irradiate the substrate FS with the light beam LB whose intensity has been adjusted along the drawing lines SL2, SL4, SL6, and draw a pattern based on the pattern data on the substrate FS.

In the above second embodiment, in addition to the effects of the above first embodiment, the following effects can be obtained. That is, a drawing optical element 150 is provided in the light introduction optical system 40a, and the drawing optical element 150 is disposed on the light source device 14a side of the first-stage selection optical element 50, and a drawing optical element 150 is used according to the pattern The intensity of the light beams LB1, LB3, LB5 irradiated from the plurality of scanning units U1, U3, U5 to the substrate FS is modulated. Similarly, an optical element 150 for drawing is provided in the light introduction optical system 40b, and the optical element 150 for drawing is arranged on the light source device 14b side of the optical element 50 for selection in the initial stage, and a single optical element 150 for drawing is used according to the pattern The intensity of the light beams LB2, LB4, LB6 irradiated from the plurality of scanning units U2, U4, U6 to the substrate FS is modulated. Thereby, the number of acousto-optic modulation components can be reduced, and the cost can be reduced.

In addition, in the second embodiment described above, the drawing head 16 that distributes the light beam LB into three is described. However, as described in the modification of the first embodiment described above, the drawing head 16 that distributes the light beam LB into five may also be used. (See Figures 9 and 10). In the case of FIGS. 9 and 10, since there is only one light source device 14, there is also one optical element for drawing 150.

(Modification of the second embodiment) The second embodiment described above may be modified as follows. In the second embodiment described above, the optical element 150 for drawing is provided in the light introduction optical systems 40a, 40b as the optical modulator for drawing. However, in this modification, instead of the optical element 150 for drawing, the light source device 14 (14a , 14b) respectively set up light modulators for drawing. In addition, the same components as those in the second embodiment described above are given the same symbols or are not shown, and only different parts will be described. The light source devices provided with light modulators for drawing on the light source devices 14a and 14b are referred to as light source devices 14A and 14B. Since the light source device 14A and the light source device 14B have the same configuration, only the light source device 14A will be described.

FIG. 17 is a diagram showing the configuration of a light source device (pulse light source device, laser light source device) 14A of this modification. The light source device 14A as an optical fiber laser device includes a DFB semiconductor laser element 200, a DFB semiconductor laser element 202, a polarizing beam splitter 204, an electro-optical element 206 as an optical modulator for drawing, and driving of the electro-optical element 206 Circuit 206a, polarizing beam splitter 208, absorber 210, excitation light source 212, combiner 214, fiber optic amplifier 216, wavelength conversion optical element 218, wavelength conversion optical element 220, a plurality of lens elements GL, and including clock generation The control circuit 222 of the device 222a.

The DFB semiconductor laser element (the first solid-state laser element and the first semiconductor laser light source) 200 generates pulsed seed light (laser) that sharply rises or sharps at a predetermined frequency (oscillation frequency, fundamental frequency) Fs (Light beam) S1, the DFB semiconductor laser element (second solid-state laser element, second semiconductor laser light source) 202 generates pulsed seed light (laser light) S2 that is gentle (wide in time) at a predetermined frequency Fs. One pulse of the seed light S1 generated by the DFB semiconductor laser element 200 and one pulse of the seed light S2 generated by the DFB semiconductor laser element 202 have approximately the same energy, but the polarization states are different from each other, and the peak intensity is that the seed light S1 is stronger. In this modification, the polarization state of the seed light S1 generated by the DFB semiconductor laser element 200 is S polarization, and the polarization state of the seed light S2 generated by the DFB semiconductor laser element 202 is P polarization. The DFB semiconductor laser devices 200, 202 respond to the clock signal LTC (predetermined frequency Fs) generated by the clock generator 222a, and are electrically controlled by the control circuit 222 to generate seed light S1, S2 at the oscillation frequency Fs. This control circuit 222 is controlled by the control device 18.

In addition, at this time, the pulse signal LTC becomes the base frequency of the clock signal CLK supplied to the counter parts CN1, CN3, CN5 shown in FIG. 16, so the clock signal LTC is divided by n (n is preferably 2 or more Integer) is the clock signal CLK. Moreover, the clock generator 222a also has a function of adjusting the basic frequency Fs of the clock signal LTC by ±ΔF, that is, a function of finely adjusting the time interval of the pulse oscillation of the light beam LB. With this, for example, even if the scanning speed Vs of the spot light SP is slightly changed, by fine-tuning the basic frequency Fs, the size (drawing magnification) of the pattern drawn by the drawing line can be precisely maintained.

The polarizing beam splitter 204 transmits the S polarized light, reflects the P polarized light, and guides the seed light S1 generated by the DFB semiconductor laser element 200 and the seed light S2 generated by the DFB semiconductor laser element 202 to the electro-optical element 206. In detail, the polarizing beam splitter 204 transmits the S-polarized seed light S1 generated by the DFB semiconductor laser element 200, guides the seed light S1 to the electro-optical element 206, and reflects the P-polarized light generated by the DFB semiconductor laser element 202 The seed light S2 guides the seed light S2 to the electro-optical element 206. The DFB semiconductor laser elements 200, 202 and the polarizing beam splitter 204 constitute a laser light source section (light source section) 205 that generates seed light S1, S2.

The electro-optical element 206 has transparency to the seed lights S1 and S2, for example, an electro-optic modulator (EOM: Electro-Optic Modulator) is used. EOM responds to the ON/OFF state (high/low) of the depicted bit row data Sdw (or sequence data DLn) shown in FIG. 16 above, and replaces the seed light S1 from the polarizing beam splitter 204 by the driving circuit 206a, Polarized state of S2. The wavelength range of the seed light S1, S2 from each of the DFB semiconductor laser element 200 and the DFB semiconductor laser element 202 is longer than 800 nm. Therefore, as the electro-optical element 206, the switching response of the polarization state can be used in the degree of GHz .

When the 1-bit pixel data of the drawing bit row data Sdw (or sequence data DLn) input to the driving circuit 206a is in the OFF state (low, "0"), the electro-optical element 206 does not change the incident seed light S1 or The polarization state of S2 is directly directed to the polarization beam splitter 208. On the other hand, when the drawing bit row data Sdw (or sequence data DLn) input to the driving circuit 206a is in the ON state (high, "1"), the electro-optical element 206 changes the polarization state of the incident seed light S1 or S2 (Changes the direction of polarized light by 90 degrees) and leads to polarized beam splitter 208. As described above, by driving the electro-optical element 206, the electro-optical element 206 converts the S-polarized seed light S1 to P when the pixel data of the bit row data Sdw (or sequence data DLn) is ON (high) The polarized seed light S1 converts the P-polarized seed light S2 into the S-polarized seed light S2.

The polarizing beam splitter 208 transmits the light of the P-polarized light, passes through the lens element GL and leads to the combiner 214, and reflects the light of the S-polarized light to the absorber 210. The excitation light source 212 generates excitation light, and the generated excitation light is guided to the coupler 214 through the optical fiber 212a. The combiner 214 synthesizes the seed light irradiated from the polarizing beam splitter 208 and the excitation light, and outputs it to the optical fiber optical amplifier (optical amplifier) 216. The optical fiber optical amplifier 216 is doped with a laser medium excited by excitation light. Therefore, in the optical fiber optical amplifier 216 transmitted by the combined seed light and excitation light, the laser light is excited by the excitation light to amplify the seed light. As the laser medium doped in the optical fiber optical amplifier 216, rare earth elements such as erbium (Er), ytterbium (Yb), and thulium (Tm) are used. The amplified light is radiated from the output end 216a of the optical fiber optical amplifier 216 at a predetermined divergence angle, is converged by the lens element GL or collimated, and then enters the wavelength conversion optical element 218.

The wavelength conversion optical element (first wavelength conversion optical element) 218, by the second harmonic generation (Second Harmonic Generation (SHG)), converts the incident seed light (wavelength λ) into a wavelength of 1/2 of λ 2nd harmonic. As the wavelength conversion optical element 218, a pseudo phase matching (Quasi Phase Matching: QPM) crystal, that is, a PPLN (Periodically Poled LiNbO ₃ ) crystal can be preferably used. In addition, PPLT (Periodically Poled LiTaO ₃ ) crystals or the like can also be used.

The wavelength conversion optical element (second wavelength conversion optical element) 220, the second harmonic (wavelength λ/2) converted by the wavelength conversion optical element 218 and the seed light (wavelength λ) that is not converted by the wavelength conversion optical element 218 ) Sum Frequency Generation (SFG) generates the third harmonic with a wavelength of 1/3 of λ. This third harmonic becomes ultraviolet light (beam LB) having a peak wavelength in the wavelength band below 370 nm.

As described above, when drawing bit row data Sdw (or DLn) sent from the pattern data generating circuit shown in FIG. 16 is applied to the configuration of the electro-optical element 206 of FIG. 17, drawing bit row data Sdw (or DLn) When the 1-bit pixel data is in the OFF state (low, "0"), the electro-optical element 206 does not change the polarization state of the incident seed light S1 or S2, and directly leads to the polarization beam splitter 208. Therefore, the seed light transmitted through the polarizing beam splitter 208 becomes the seed light S2 from the DFB semiconductor laser element 202. Therefore, the light beam LB finally output from the light source device 14A has the same oscillation profile (time characteristic) as the seed light S2 from the DFB semiconductor laser element 202. That is, in this case, the light beam LB has a blunt characteristic that the peak intensity of the pulse is low and the time is broad. The optical fiber optical amplifier 216 has low amplification efficiency for the seed light S2 having a low peak intensity as described above, so the light beam LB output from the light source device 14A becomes light that is not amplified to the energy required for exposure. Therefore, in this case, from the viewpoint of exposure, it is substantially the same result as that the light source device 14A does not emit the light beam LB. That is, the intensity of the spot light SP irradiated to the substrate FS becomes a low level. However, during the period (non-projection period, non-exposure period) in which pattern drawing is not performed along the respective drawing lines SLn (SL1 to SL6), the light beam LB of the ultraviolet light from the seed light S2 is continuously emitted at a slight intensity, so the drawing line When SLn (SL1~SL6) is located at the same position on the substrate FS for a long time (for example, the emergency stop of the substrate FS due to the failure of the transport system), as long as the movable light is provided in the exit window of the light beam LB of the light source device 14A Brake, close the injection window.

On the other hand, when the 1-bit pixel data applied to the drawing bit row data Sdw (or DLn) of the electro-optical element 206 of FIG. 17 is in the ON state (high, "1"), the electro-optical element 206 changes the incidence The polarization state of the light S1 or S2 is directed to the polarization beam splitter 208. Therefore, the seed light transmitted through the polarizing beam splitter 208 becomes the seed light S1 from the DFB semiconductor laser element 200. Therefore, the light beam LB finally output from the light source device 14A is generated by the seed light S1 from the DFB semiconductor laser element 200. Since the peak intensity of the seed light S1 from the DFB semiconductor laser element 200 is strong, it is efficiently amplified by the fiber optic amplifier 216, and the light beam LB output from the light source device 14A has the energy required for the exposure of the substrate FS. That is, the intensity of the spot light SP irradiated to the substrate FS becomes a high level.

As described above, since the electro-optical element 206 as the light modulator for drawing is provided in the light source device 14A, it is the same as the control of the optical element for drawing 150 in the second embodiment described above. By controlling the electro-optical element 206, it is possible to obtain The same effect as the second embodiment described above. That is, the electro-optical element 206 is switched (driven) to ON/OFF according to the pattern data of the scanning unit Un (or the depicted bit row data Sdw in FIG. 15 and FIG. 16) that the light beam LB enters. The intensity of the light beam LB incident on the selective optical element 50 at the beginning of the drawing pattern modulation, that is, the intensity of the spot light SP of the light beam LB irradiated onto the substrate FS by each scanning unit Un (U1 to U6).

In addition, in the configuration of FIG. 17, the DFB semiconductor laser element 202 and the polarizing beam splitter 204 are omitted, and only the seed light S1 from the DFB semiconductor laser element 200 is used as an electro-optical element based on pattern data (drawing data) The switching of 206 leads to the undulating wave to the optical fiber optical amplifier 216, which is also considered. However, if this configuration is adopted, the incidence period of the seed light S1 to the fiber optical amplifier 216 is greatly disturbed according to the pattern to be drawn. That is, after the state where the seed light S1 from the DFB semiconductor laser element 200 does not enter the optical fiber optical amplifier 216 continues, if the seed light S1 enters the optical fiber optical amplifier 216, the seed light S1 immediately after the incidence is more general When it is amplified by a large amplification rate, there is a problem that a light beam with a larger intensity above a prescribed value is generated from the optical fiber optical amplifier 216. Therefore, in this modification, as a preferred form, the seed light S2 (broad pulse light with low peak intensity) from the DFB semiconductor laser element 202 is incident while the seed light S1 is not incident on the fiber optical amplifier 216 The optical fiber optical amplifier 216 solves the above problem.

Furthermore, although the electro-optical element 206 is switched, the DFB semiconductor laser elements 200, 202 may be driven based on pattern data (drawing bit row data Sdw or sequence data DLn). That is, the control circuit 222 controls the DFB semiconductor laser elements 200, 202 according to the pattern data (drawing bit row data Sdw or DLn) to selectively (alternatively) generate the seed light S1 that oscillates at a predetermined frequency Fs in a pulse shape , S2. In this case, the polarizing beam splitters 204, 208, the electro-optical element 206, and the absorber 210 are not required, and one of the seed light S1, S2 which is selectively pulsed from any one of the DFB semiconductor laser elements 200, 202 Direct injection into the combiner 214. At this time, the control circuit 222 controls each DFB semiconductor laser in such a manner that the seed light S1 from the DFB semiconductor laser element 200 and the seed light S2 from the DFB semiconductor laser element 202 do not enter the optical fiber optical amplifier 216 at the same time Drive of components 200, 202. That is, when the spot light SP of each light beam LBn is irradiated to the substrate FS, the DFB semiconductor laser element 200 is controlled in such a manner that only the seed light S1 enters the optical fiber optical amplifier 216. In addition, when the spot light SP of the light beam LBn (the intensity of the spot light SP is extremely low) is not irradiated to the substrate FS, the DFB semiconductor laser element 202 is controlled in such a manner that only the seed light S2 enters the optical fiber optical amplifier 216. As described above, whether to irradiate the light beam LBn to the substrate FS is determined based on the pixel data (high/low) of the pattern data (H or L of the drawing bit row data Sdw). In addition, in this case, the bias states of the seed lights S1 and S2 may also be P bias.

As described above, in this modification, the number of acousto-optic modulation elements can be reduced, and the cost is reduced.

In addition, the light source devices 14A and 14B of the first modification may be used in the light source devices 14a and 14b of the first embodiment. In this case, it is also possible to control the output timing of the seed light S1 from the DFB semiconductor laser element 200 output from the light source devices 14A, 14B according to the pattern data (drawing bit row data Sdw), and to draw each scanning unit U1 to U6 Switching of the optical element 106.

(Third Embodiment) Next, the third embodiment will be described with reference to FIG. 18. However, in the third embodiment, it is assumed that the light source devices 14A (see FIG. 17) and 14B described in the modification of the second embodiment are used. However, in order to be suitable for the third embodiment, the clock generator 222a in the control circuit 222 of the light source device 14A of FIG. 17 includes magnification correction information based on the control unit (control circuit 500) for drawing control shown in FIG. CMg is a function to partially (discretely) stretch the time interval of the clock signal LTC. Similarly, the clock generator 222a in the control circuit 222 of the light source device 14B also has the function of partially (discretely) expanding and contracting the time interval of the clock signal LTC according to the magnification correction information CMg. In addition, the operation of the light source device 14B, the light introducing optical system 40b, and the scanning units U2, U4, U6 is the same as the operation of the light source device 14A, the light introducing optical system 40a, and the scanning units U1, U3, U5, so regarding the light source device 14B The operation of the light introduction optical system 40b and the scanning units U2, U4, U6 will be omitted. In addition, the same configuration as the modification of the second embodiment described above is denoted by the same symbol or omitted, and only the different parts will be described.

In FIG. 18, the light beam (laser light) LB from one light source device 14A has the same configuration as the above FIGS. 12 and 13, and is supplied to the three scanning units U1, U3, U5 through the selection optical elements 50, 58, 66, respectively. . Each of the optical components 50, 58, 66 for selection responds to the description of the enabling signals SPP1, SPP3, SPP5 described in FIGS. 14 and 15 to deflect (switch) the light beam LB to guide the light beam LB to the scanning unit. Any one of U1, U3, U5. In addition, as described above, during the period when the pattern drawing is not performed along each drawing line (non-projection period), even the light beam LB of the ultraviolet ray from the seed light S2 is continuously emitted at a slight intensity, so it is considered that each drawing line is irradiated for a long time until When the situation at the same position on the substrate FS occurs, a movable shutter SST is provided in the exit window of the light beam LB of the light source device 14A.

As shown in FIG. 14, the origin signals SZ1, SZ3, SZ5 from the origin sensors OP1, OP3, OP5 of each scanning unit U1, U3, U5 are supplied to generate the pattern data of each scanning unit U1, U3, U5 Generating circuits (pattern data generating circuits) 301, 303, 305. The generating circuit 301 includes a gate portion GT1, a memory portion BM1, a counter portion CN1, etc. in FIG. 16. The counter portion CN1 is based on the clock signal LTC output from the control circuit 222 (clock generator 222a) of the light source device 14A Frequency signal CLK1 is counted.

Similarly, the generating circuit 303 includes the gate portion GT3, the memory portion BM3, the counter portion CN3, etc. in FIG. 16, the counter portion CN3 counts the clock signal CLK3 produced using the clock signal LTC as the fundamental frequency, and the generating circuit 305 includes In FIG. 16, the gate portion GT5, the memory portion BM5, the counter portion CN5, etc., the counter portion CN5 counts the clock signal CLK5 produced using the clock signal LTC as the fundamental frequency.

The clock signals CLK1, CLK3, CLK5 are divided into 1/n (n is 2) by the control circuit 500 having the function of the interface between each generating circuit 301, 303, 305 and the light source device 14A Above integer). At this time, the supply of the pulse signals CLK1, CLK3, CLK5 to the counter parts CN1, CN3, CN5, in response to the drawing enable (ON) signals SPP1, SPP3, SPP5 (refer to FIG. 15), is limited to any one. That is, when the enable signal SPP1 is ON (high), only the clock signal CLK1 divided by the clock signal LTC divided by 1/n is supplied to the counter CN1, and when the enable signal SPP3 is ON (high), only When the clock signal LTC is divided into 1/n, the clock signal CLK3 is supplied to the counter part CN3. When the enable signal SPP5 is ON (high), only the clock signal LTC divided into 1/n is provided. To the counter part CN5.

By this, the sequence data DL1, DL3, DL5 sequentially output from each of the generating circuits 301, 303, 305 are respectively provided through the gates GT1, GT3, GT5 in the 3-input OP circuit GT8 in the control circuit 500 (refer to FIG. 16) Addition is performed to describe the bit array data Sdw supplied to the electro-optical element 206 in the light source device 14A. In addition, the generating circuits 301, 303, 305 and the control circuit 500 constitute a part of the control device 18.

The above configuration is basically the same as the use method of the light source device 14A described using FIG. 17, but in this embodiment, three drawing units U1, U3, U5 are provided with drawing lines (scanning lines) SL1, SL3, SL5. The function of fine adjustment of the drawing magnification of the dot scanning direction (Y direction) of the drawn pattern. Due to this function, in this embodiment, the memory units BM1a, BM3a, BM5a of the scanning units U1, U3, U5 are temporarily stored with information about the correction amount of the drawing magnification mg1, mg3, mg5. Although the memory parts BM1a, BM3a, and BM5a are shown as being provided independently in FIG. 18, they may also be a part of the memory parts BM1, BM3, and BM5 provided in the generating circuits 301, 303, and 305. Information about this correction amount mg1, mg3, mg5 also forms part of the scan information.

The information about the correction amount mg1, mg3, mg5, for example, corresponds to the ratio (ppm) at which the dimension of the pattern drawn by each drawing line SL1, SL3, SL5 expands and contracts in the Y direction. As an example, if the length of the Y-direction area that can be drawn by each drawing line SL1, SL3, SL5 is 30mm, if you want to expand or contract ±200ppm (equivalent to ±6μm), set ±200 in the information mg1, mg3, mg5 Of the value. In addition, the information mg1, mg3, mg5 can be set not by the ratio but by the direct expansion and contraction amount (±ρμm). Also, the information mg1, mg3, mg5 can be reset one by one for the pattern data (sequence data DLn) of one of the lines along the drawing lines SL1, SL3, SL5, or for the pattern data of multiple lines (sequence data DLn) ) To send to reset. As described above, in this embodiment, while the substrate FS is transferred in the X direction (longitudinal direction) while pattern drawing is performed along each of the drawing lines SL1, SL3, SL5, the drawing magnification in the Y direction can be dynamically changed, When it is known that the substrate FS is deformed or in-plane uneven, the deterioration of the accuracy of the drawing position due to this can be suppressed. Furthermore, during overlay exposure, the overlay accuracy can be greatly improved in response to the deformation of the formed underlying pattern.

FIG. 19 is a time chart showing the signal state of each part and the oscillation state of the light beam LB when the scanning unit U1 representatively draws a standard pattern in the drawing device shown in FIG. 18. In FIG. 19, the two-dimensional matrix Gm represents the bit pattern PP of the pattern data to be drawn, and a grid (a pixel (pixel) unit) on the substrate FS is set to, for example, a dimension Py of 3 μm in the Y direction and a dimension in the X direction Px is 3 μm. In addition, in FIG. 19, SL1-1, SL1-2, SL1-3, ... SL1-6 indicated by arrows indicate that the line SL1 is drawn along with the movement of the substrate FS in the X direction (sub-scanning in the longitudinal direction) The drawing lines drawn sequentially are set in such a way that the spacing of the drawing lines SL1-1, SL1-2, SL1-3, ... SL1-6 in the X direction becomes, for example, 1/2 of the size Px (3 μm) of one pixel unit Transfer speed of substrate FS.

Furthermore, the size of the spot light SP projected on the substrate FS in the XY direction (spot light size ø) is the same as a pixel unit or slightly larger than a pixel unit. Therefore, the spot light size ø, which is the effective diameter (the width of 1/e ² of the Gaussian distribution, or the full width at half maximum of the peak intensity) is set to about 3 to 4 μm, and the spot light SP is continuously projected along the drawing line SL1 At this time, the oscillation frequency Fs (pulse time interval) of the light beam LB and the scanning speed Vs of the spot light SP by the polygon mirror PM are set such that, for example, the 1/2 of the effective diameter of the spot light SP overlaps. That is, if the light emitted from the polarizing beam splitter 208 in the light source device 14A shown in FIG. 17 is the light beam Lse (FIG. 18), this light Lse responds to the slave control circuit 222 (clock generator 222a) Each clock pulse of the shot clock signal LTC is shot as shown in FIG. 19.

The clock signal LTC and the clock signal CLK1 supplied to the counter part CN1 in the generating circuit 301 in FIG. 18 are set to a frequency ratio of 1:2, and the clock signal LTC is 100 MHz. The 1/2 frequency divider of the control circuit 500 sets the clock signal CLK1 to 50 MHz. In addition, the frequency ratio of the clock signal LTC and the clock signal CLK1 only needs to be an integer multiple, for example, it can be set such that the set frequency of the clock signal CLK1 is reduced to 1/4 of 25 MHz, and the scanning speed of the spot light SP Vs is reduced to half.

The drawing bit row data Sdw shown in FIG. 19 corresponds to the sequence data DL1 output from the generating circuit 301. Here, for example, the pattern on the drawing line SL1-2 corresponding to the pattern PP. The electro-optical element 206 in the light source device 14A switches the polarization state in response to the drawing bit row data Sdw, so the seed light Lse is during the period when the drawing bit row data Sdw is in the ON state (high, "1"). The seed light S1 of the DFB semiconductor laser element 200 in the middle is generated, and the seed light from the DFB semiconductor laser element 202 in FIG. 17 is generated during the period when the drawing bit row data Sdw is in the OFF state (low, "0"). S2 is generated. The scanning exposure operation of the scanning unit U1 shown in FIG. 19 above is the same for the other scanning units U2 to U6.

In addition, the control circuit 222 in the light source device 14A is provided with a period of time when the drawing bit row data Sdw is in the ON state (high, "1"), in response to the clock signal LTC, the seed light S1 is generated from the DFB semiconductor laser device 200 (Abruptly rising and falling pulse light), during the period when the drawing bit row data Sdw is OFF (low, "0"), in response to the clock signal LTC, the seed light S2 (broad pulse light) is generated from the DFB semiconductor laser device 202 In the case of a driving circuit, the electro-optical element 206 shown in FIGS. 17 and 18, the polarizing beam splitter 208 shown in FIG. 17, and the absorber 210 can be omitted.

As described above, each pulse light of the seed light Lse is output in response to each clock pulse of the clock signal LTC generated by the clock generator 222a shown in FIG. 17, so in this embodiment, it is provided in the clock generator 222a A circuit structure for partially increasing or decreasing the time (cycle) between pulses of the clock signal LTC. The circuit configuration is provided with a reference (standard) clock generator as a source of the clock signal LTC, a frequency division counter circuit, a variable delay circuit, and the like.

FIG. 20 is a time chart showing the relationship between the reference clock signal TC0 and the clock signal LTC from the reference clock generator in the clock generator 222a, and the magnification correction information CMg shown in FIGS. 17 and 18 is The state in which the correction is not performed. The variable delay circuit in the clock generator 222a delays the reference clock signal TC0 generated at a certain frequency Fs (a certain time Td0) by delaying the time DT0 corresponding to a preset value and outputs the clock signal LTC. Therefore, for example, if the reference clock signal TC0 is 100MHz (Td0=10ns), the clock signal is continuously generated at 100MHz (Td0=10ns) without changing the preset value (delay time DT0) LTC.

Therefore, the reference clock signal TC0 is counted by the frequency division counter circuit in the clock generator 222a, and if the count value reaches the predetermined value Nv, the preset value set in the variable delay circuit is changed by a certain amount . The situation will be explained by the time chart of FIG. 21. In FIG. 21, the reference clock signal TC0 is counted by the frequency divider counter circuit to Nv, and the preset value set in the variable delay circuit is the delay time DT0. After that, by a clock pulse Kn of the reference clock signal TC0, the frequency division counter circuit counts up to Nv, and the preset value set in the variable delay circuit is immediately changed to the delay time DT1. Therefore, each clock pulse of the clock signal LTC (after K'n+1) generated by the clock pulse Kn+1 after the clock pulse Kn+1 generated after the clock pulse Kn of the reference clock signal TC0, All are generated with a delay time DT1.

Thereby, only when the preset value set in the variable delay circuit is changed by a certain amount, that is, the time interval between the clock pulse K'n and the clock pulse K'n+1 of the clock signal LTC is changed Td1, the time interval of the clock pulse of the subsequent clock signal LTC becomes Td0. In FIG. 21, although the delay time DT1 is increased more than the delay time DT0, and the time between two clock pulses of the clock signal LTC is increased more than Td0, it can also be reduced in the same way. In addition, if the frequency-dividing counter circuit counts the reference clock signal TC0 to Nv, it returns to zero and starts counting up to Nv again.

If the initial value of the preset value set in the variable delay circuit is the delay time DT0, the amount of change in the delay time is ±ΔDh, the number of times the divider counter circuit returns to zero is Nz, and whenever the divider counter circuit counts to Nv When the time (when reset to zero) is set in sequence to the delay time of the preset value of the variable delay circuit as DTm, the delay time DTm is set to the relationship of DTm=DT0+Nz·(±ΔDh). Therefore, as shown in FIG. 21, the delay time DT1 during the period when the number of zeroings Nz is set to 1 (m=1) becomes DTm=DT1=DT0±ΔDh, and the next zeroing (Nz=2, m=2) occurs The delay time DT2 set afterward becomes DTm=DT2=DT0+2·(±ΔDh). Therefore, the change amount of the delay time ±ΔDh corresponds to the difference between the reference time Td0 of the time Td1 between the clock pulse K'n and the clock pulse K'n+1 of the clock signal LTC.

As described above, the action of changing the time interval between specific two clock pulses of the clock signal LTC is based on the predetermined value Nv set in the frequency divider counter circuit, and a plurality of within the total length of a drawing line (SL1~SL6) The parts are implemented discretely. Figure 22 shows this situation. FIG. 22 shows the plurality of positions where the count value of the frequency division counter circuit returns to zero every time the count value of the frequency divider counter circuit reaches the predetermined value Nv as the correction point CPP. At each of the correction points CPP, only the specific two clock pulses of the clock signal LTC expand and contract with respect to the time Td0 by the time ±ΔDh.

Therefore, if the reference clock signal TC0 is 100 MHz (Td0=10ns), the effective size of the spot light SP in the main scanning direction is 3 μm, the length of the drawing line SL1 (the same for SL2 to SL6) is 30 mm, and the light beam LB The second continuous pulse light is projected on the substrate FS by the point light SP overlapping by half (1.5 μm) in the main scanning direction, and the number of reference clock signals TC0 generated by the length of the drawing line L1 becomes 20000. In addition, the change amount ΔDh of the delay time is very small with respect to the reference time interval Td0, and is set to, for example, about 2%. Under this condition, when the pattern drawn along the drawing line SL1 is expanded and contracted by 150 ppm in the main scanning direction (Y direction), the length of the drawing line L1 of 30 mm to 150 pm corresponds to 4.5 μm. The information about these drawing magnification ratios of 150 ppm or the actual size length of 4.5 μm is stored as information mg1 in the memory portion BM1a in FIG. 18.

Therefore, the number of correction points CPP (Figure 22) in the 20000 clock pulse trains of the clock signal LTC with respect to the time Td0 stretching time ΔDh becomes 4.5μm/(1.5μm×2%)=150, set in the figure The maximum predetermined value Nv of the frequency division counter circuit shown in 22 becomes approximately 133 by 20000/150.

In addition, when the change amount of the delay time ΔDh is 5%, the number of correction points CPP becomes 4.5 μm/(1.5 μm×5%)=60, which is set at the maximum predetermined value Nv of the frequency division counter circuit, by 20000 /60 becomes about 333. As described above, since the change amount of the delay time ΔDh is less than 10%, even if there is a pattern to be drawn at the correction point CPP, the size of the pattern is larger than the size of the spot light SP, so it can be ignored at the correction point CPP A drawing error caused by a slight position shift of the spot light SP in the main scanning direction.

The change amount ΔDh of the above delay time, the number of correction points CPP, the setting of the predetermined value Nv by the frequency division counter circuit, etc. are based on the magnification correction information CMg (ppm) output from the control circuit 500 of FIG. 18 in FIG. 17 The calculation in the control circuit 222 shown is set in a frequency division counter circuit or a variable delay circuit in the clock generator 222a.

According to the above-described embodiment, the light beam LB from the light source device 14A can be sequentially supplied to each of the three scanning units U1, U3, U5 in a time-sharing manner, and can be sequentially performed individually along the scanning units U1, U3, U5 The drawing operations of the drawing lines SL1, SL3, SL5, therefore, as shown in FIG. 18, information about the correction amount of the drawing magnification mg1, mg3, mg5 can be set for the scanning units U1, U3, U5. As a result, the amount of expansion and contraction of the substrate FS in the Y direction is different. Even if the expansion and contraction rates of some regions divided in the Y direction are different, the correction amount of the optimal drawing magnification can be set correspondingly in each scanning unit Un, Can correspond to the advantages of non-linear deformation of the substrate FS.

Above, the light source device 14A connected to the device that scans the spot light SP condensed on the irradiated body (substrate FS) to draw a pattern and emits the light beam (laser light) LB that becomes the spot light SP, as shown in FIG. 17 and FIG. As shown in 18, it is equipped with: a first semiconductor laser light source (200), which responds to a clock pulse (clock signal LTC) of a predetermined period (Td0), and generates a sharp rise and fall of shorter luminous time than the predetermined period and a large peak intensity 1 pulse light (seed light S1); the second semiconductor laser light source (202), in response to the clock pulse, generates a light emitting time shorter than the predetermined period and longer than the first pulse light (seed light S1), and the peak intensity is smaller The broad second pulsed light (seed light S2); fiber optic amplifier (216) for the first pulsed light (seed light S1) or the second pulsed light (seed light S2); and the switching device, according to the waiting Input of drawing pattern information (drawing bit sequence data Sdw), so that when the spot light is projected onto the irradiated body, the first pulse light (seed light S1) is incident on the optical fiber optical amplifier, and the spot light SP is not When the non-drawing projected on the irradiated object is made, the mode in which the second pulse light (seed light S2) is incident on the optical fiber optical amplifier (216) is switched. This switching device is used to select the electrical optical element (206) of either the first pulse light (seed light S1) and the second pulse light (seed light S2) according to the pattern information to be drawn, or to generate the first pulse light (Seed light S1) and the second pulsed light (seed light S2), a circuit for controlling the driving of the first semiconductor laser light source (200) and the second semiconductor laser light source (202) according to the pattern information to be drawn constitute.

The third embodiment can also be applied to the above-mentioned first embodiment or its modification, and the above-mentioned second embodiment. That is, the clock generator 222a in the control circuit 222 of the light source device 14A described in the third embodiment can be adjusted based on the magnification correction information CMg from the control unit (control circuit 500) for drawing control shown in FIG. The function of partially (discretely) expanding and contracting the time interval of the clock signal LTC is applicable to the light source device 14 of the above-mentioned first embodiment or its modification, and the light source device 14 of the above-mentioned second embodiment. In this case, the light source device 14 may not include the DFB semiconductor laser element 202, the polarizing beam splitter 204, the electro-optical element 206, the polarizing beam splitter 208, and the absorber 210, that is, the light source device 14 may also be an optical fiber optical amplifier 216 Amplifies the pulsed seed light S1 that emits light from the DFB semiconductor laser element 200 and emits it as a light beam LB. In this case, since the light source device 14 does not have the electro-optical element 206, the sequence data DL1, DL3, DL5 generated by the generating circuits 301, 303, 305 are transmitted to the drawing optical element 106 or the drawing optical element 150 of the scanning unit Un.

(Fourth embodiment) 23 is a diagram showing a schematic configuration of a device manufacturing system 10 including an exposure apparatus EX that applies exposure processing to a substrate (irradiated body) FS according to the fourth embodiment. In addition, unless otherwise specified, the same configurations as those in the above-mentioned first to third embodiments (including modified examples) are given the same symbols or omitted in the drawings, and only different parts will be described.

In the fourth embodiment, similar to the above-mentioned first to third embodiments (including modification examples), the exposure device EX as a scanning device is an exposure device of a direct drawing method that does not use a mask, that is, a so-called line-by-line scanning method Of the exposure device. The exposure apparatus EX includes a beam switching member 20 and an exposure head 22 instead of the drawing head 16 described in the first to third embodiments (including modified examples) described above. In addition, the exposure device EX also includes a plurality of alignment microscopes AMm (AM1 to AM4). Although not specifically described in the first to third embodiments (including modification examples), the exposure apparatus EX of the above first to third embodiments also includes a plurality of alignment microscopes AMm (AM1 to AM4). In addition, the exposure apparatus EX of the fourth embodiment naturally includes the substrate transport mechanism 12, the light source device 14', and the control device 18. The light source device 14' of the fourth embodiment assumes the same configuration as the light source device 14 (14A, 14B) described in the modification of the second embodiment (see FIG. 17). The light beam LB emitted by the light source device 14' is incident on the exposure head 22 through the light beam switching member 20.

The light beam switching member 20 switches the light beam LB in such a manner that one scanning unit Un that performs one-dimensional scanning of the spot light SP among the plurality of scanning units Un (U1 to U6) constituting the exposure head 22 enters the light beam LB from the light source device 14' Light path. This beam switching member 20 will be described in detail later.

The exposure head 22 includes a plurality of scanning units Un (U1 to U6) into which the light beam LB is incident. The exposure head 22 draws a pattern by a plurality of scanning units Un (U1 to U6) on a part of the substrate FS supported by the circumferential surface of the rotary drum DR. The exposure head 22 is a so-called multi-beam exposure head in which a plurality of scanning units Un (U1 to U6) of the same configuration are arranged. As shown in FIG. 23, the odd-numbered scanning units U1, U3, and U5 are arranged on the upstream side (-X direction side) in the conveyance direction of the substrate FS with respect to the center plane Poc and along the Y direction. The even-numbered scanning units U2, U4, and U6 are arranged on the downstream side (+X direction side) of the substrate FS in the conveyance direction with respect to the center plane Poc and are arranged along the Y direction. The odd-numbered scanning units U1, U3, U5 and the even-numbered scanning units U2, U4, U6 are set symmetrically with respect to the central plane Poc. That is, in the fourth embodiment, the arrangement of the odd-numbered scanning units U1, U3, U5 and the even-numbered scanning units U2, U4, U6 is opposite to those described in the first to third embodiments (including modifications) described above.

The scanning unit Un projects the light beam LB from the light source device 14' onto the irradiated surface of the substrate FS so as to converge into the spot light SP, and the spot light SP is turned on by the rotating polygon mirror PM (see FIG. 28). The irradiated surface of the substrate FS performs one-dimensional scanning along a predetermined straight line (scanning line) SLn.

The plural scanning units Un (U1~U6) are arranged in a predetermined arrangement relationship. In the fourth embodiment, the plurality of scanning units Un (U1 to U6) are arranged as the drawing lines SLn (SL1 to SL6) of the plurality of scanning units Un (U1 to U6) in the Y direction as shown in FIGS. 24 and 25 (The width direction of the substrate FS, the main scanning direction) are connected without being separated from each other. In addition, as described in the first to third embodiments (modifications), the light beam LB incident on each scanning unit Un (U1 to U6) may be represented by LB1 to LB6, respectively. The light beam LB incident on the scanning unit Un is a linearly polarized light beam (P-polarized light or S-polarized light) polarized in a predetermined direction. In the fourth embodiment, it is a P-polarized light beam. In addition, there are cases where light beams LB1 to LB6 incident on each of the six scanning units U1 to U6 are represented as light beams LBn.

As shown in FIG. 25, each scanning unit Un (U1 to U6) shares the scanning area in such a manner that a plurality of scanning units Un (U1 to U6) all cover the entire width direction of the exposure area W. With this, each scanning unit Un (U1 to U6) can draw a pattern on a plurality of regions divided in the width direction of the substrate FS. For example, if the scanning length of the Y direction of one scanning unit Un (the length of the drawing line SLn) is about 30 to 60 mm, by dividing three odd-numbered scanning units U1, U3, U5 and three even-numbered scanning units U2 , U4, U6, a total of six scanning units Un are arranged in the Y direction, the width of the Y direction can be extended to 180 ~ 360mm. In principle, the lengths of the drawing lines SL1 to SL6 (scanning length, scanning width in the main scanning direction) are basically the same.

In addition, as described above, the actual drawing lines SLn (SL1 to SL6) are set to be shorter than the maximum length that the spot light SP can actually scan on the illuminated surface. By setting in the above manner, within the range of the maximum scanning length of the spot light SP (for example, 31 mm), the position of the drawing line SLn (for example, scanning length of 30 mm) or the drawing magnification can be finely adjusted in the main scanning direction. The maximum scanning length of the spot light SP is mainly determined by the aperture of the fθ lens FT (refer to FIG. 28) after the polygon mirror (rotating polygon mirror) PM provided in the scanning unit Un.

A plurality of drawing lines (scanning lines) SL1 to SL6 are arranged in two rows across the center plane Poc in the circumferential direction of the rotating drum DR. The odd-numbered drawing lines SL1, SL3, SL5 are located on the irradiated surface of the substrate FS with respect to the central plane Poc on the upstream side (-X direction side) of the substrate FS in the transport direction. The even-numbered drawing lines SL2, SL4, SL6 are located on the irradiated surface of the substrate FS on the downstream side (+X direction side) of the substrate FS in the conveying direction with respect to the central plane Poc. The drawing lines SL1 to SL6 are substantially parallel to the width direction of the substrate FS, that is, the central axis AXo of the rotating drum DR.

The drawing lines SL1, SL3, SL5 are arranged on a straight line at predetermined intervals along the width direction (scanning direction) of the substrate FS. The drawing lines SL2, SL4, and SL6 are also arranged on the straight line at predetermined intervals along the width direction (scanning direction) of the substrate FS. The scanning direction of the spot light SP of each scanning beam LBn along the odd-numbered drawing lines SL1, SL3, SL5 is a one-dimensional direction, which is the -Y direction. The scanning direction of the spot light SP of each scanning beam LBn along the even-numbered drawing lines SL2, SL4, SL6 is a one-dimensional direction, which is the +Y direction.

In the fourth embodiment, a plurality of scanning units Un (U1 to U6) repeatedly scan the spot light SP of the light beam LBn according to a predetermined order (predetermined order). For example, in the case where the order of the scanning unit Un for scanning the spot light SP is U1→U2→U3→U4→U5→U6, first, the scanning unit U1 scans the spot light SP once. Then, after the scanning of the spot light SP of the scanning unit U1 is completed, the scanning unit U2 performs a scanning of the spot light SP. After the scanning, the scanning unit U3 performs a scanning of the spot light SP. In the above manner, a plurality of scanning units Un (U1~U6) Scan the spot light SP one by one in the predetermined order. Then, after the scanning of the spot light SP of the scanning unit U6 is completed, it returns to the scanning of the spot light SP of the scanning unit U1. As described above, the plural scanning units Un (U1 to U6) repeatedly scan the spot light SP in a predetermined order.

Each scanning unit Un (U1 to U6) irradiates each light beam LBn toward the substrate FS such that each light beam LBn travels toward the central axis AXo of the rotating drum DR in at least the XZ plane. As a result, the optical path (beam central axis) of the light beam LBn traveling from each scanning unit Un (U1 to U6) toward the substrate FS is coaxial (parallel) to the normal of the illuminated surface of the substrate FS in the XZ plane. In addition, each scanning unit Un (U1 to U6) faces the substrate FS such that the light beam LBn irradiated to the drawing line SLn (SL1 to SL6) is perpendicular to the irradiated surface of the substrate FS in a plane parallel to the YZ plane Irradiate the light beam LBn. That is, in the main scanning direction of the light beam SP in the illuminated surface, the light beam LBn (LB1 to LB6) projected onto the substrate FS is scanned in a telecentric state. Here, a line (or optical axis) perpendicular to the illuminated surface of the substrate FS through each midpoint of the drawing line SLn (SL1 to SL6) defined by each scanning unit Un (U1 to U6) is called irradiation. The central axis Len (Le1 to Le6) (refer to FIG. 24).

Each of the irradiation central axes Len (Le1 to Le6) is a line connecting the drawing lines SL1 to SL6 and the central axis AXo in the XZ plane. The irradiation central axes Le1, Le3, Le5 of the odd-numbered scanning units U1, U3, U5 are in the same direction in the XZ plane, and the irradiation central axes Le2, Le4, Le6 of the even-numbered scanning units U2, U4, U6 are in the XZ plane For the same direction. In addition, the irradiation center axes Le1, Le3, Le5 and the irradiation center axes Le2, Le4, Le6 are set to ±θ with respect to the center plane Poc angle in the XZ plane (see FIG. 23).

The alignment microscope AMm (AM1~AM4) shown in FIG. 23, as shown in FIG. 25, is used to detect the alignment marks MKm (MK1~MK4) formed on the substrate FS. 4 Embodiments are four). The alignment marks MKm (MK1 to MK4) are reference marks for aligning a predetermined pattern drawn on the exposed area W of the illuminated surface of the substrate FS relative to the substrate FS. Align the microscope AMm (AM1~AM4), and detect the alignment mark MKm (MK1~MK4) on the substrate FS supported by the circumferential surface of the rotating drum DR. The alignment microscope AMm (AM1~AM4) is located closer to the illuminated area (the area surrounded by the drawing lines SL1~SL6) on the substrate FS formed by the spot light SP of the light beam LBn (LB1~LB6) from the exposure head 22 The upstream side (-X direction side) of the substrate FS in the transport direction.

The alignment microscope AMm (AM1~AM4) has observation optics for projecting the illumination light for alignment onto the substrate FS and obtaining an enlarged image of the local area (observation area) including the alignment marks MKm (MK1~MK4) on the surface of the substrate FS (Including the objective lens), and the CCD, CMOS, and other photographic elements that capture the magnified image with the high-speed shutter while the substrate FS is moving in the transport direction. The photographic signals (image data) ig (ig1~ig4) taken by the alignment microscope AMm (AM1~AM4) are sent to the control device 18. The control device 18 detects based on the image analysis of the photographic signal ig (ig1~ig4) and the information of the rotational position of the rotary drum DR at the moment of shooting (reading the measured values of the encoders EN1a and EN1b of the scale part SD shown in FIG. 24) and detecting Align the positions of the marks MKm (MK1~MK4) to measure the position of the substrate FS with high accuracy. In addition, the illuminating light for alignment is light in a wavelength range with little sensitivity to the photosensitive functional layer on the substrate FS, for example, light with a wavelength of about 500 to 800 nm.

The alignment marks MK1 to MK4 are provided around each exposure area W. A plurality of alignment marks MK1, MK4 are formed on the both sides of the substrate FS in the exposure area W in the width direction along the long side direction of the substrate FS at a certain interval DI. The alignment mark MK1 is formed on the −Y direction side in the width direction of the substrate FS, and the alignment mark MK4 is formed on the +Y direction side in the width direction of the substrate FS. The alignment marks MK1 to MK4 are arranged in the same position in the longitudinal direction (X direction) of the substrate FS when the substrate FS is subjected to a large tension or undergoes a thermal process without being deformed. Furthermore, the alignment marks MK2, MK3 are formed between the alignment mark MK1 and the alignment mark MK4 along the width direction (short side direction) of the substrate FS, that is, the +X direction side and the -X direction of the exposure area W Side of the white department. The alignment marks MK2 and MK3 are formed between the exposure area W and the exposure area W. The alignment mark MK2 is formed on the -Y direction side of the substrate FS in the width direction, and the alignment mark MK3 is formed on the +Y direction side of the substrate FS.

Furthermore, the distance between the alignment mark MK1 and the alignment mark MK2 of the white part arranged in the Y direction of the substrate FS in the Y direction, and the alignment mark MK2 and the alignment mark MK3 of the white part in the Y direction The interval and the interval between the alignment marks MK4 and the alignment marks MK3 arranged on the side of the +Y direction of the substrate FS in the Y direction are set to the same distance. These alignment marks MKm (MK1~MK4) can also be formed together during the patterning of the first layer. For example, when exposing the pattern of the first layer, the alignment mark pattern may be exposed together around the exposure area W where the pattern is exposed. In addition, the alignment mark MKm may also be formed in the exposure area W. For example, the exposure area W may be formed along the outline of the exposure area W. In addition, when the alignment mark MKm is formed in the exposure area W, a pattern portion or a specific shape portion at a specific position in the pattern of the electronic component formed in the exposure area W may also be used as the alignment mark MKm.

The alignment microscope AM1 is configured to photograph the alignment mark MK1 existing in the observation area (detection area) Vw1 of the objective lens. Similarly, the alignment microscopes AM2 to AM4 are configured to capture the alignment marks MK2 to MK4 existing in the observation area Vw2 to Vw4 of the objective lens. Therefore, a plurality of alignment microscopes AM1 to AM4 corresponding to the positions of the plurality of alignment marks MK1 to MK4 are arranged in the order of alignment microscopes AM1 to AM4 from the -Y direction side of the substrate FS. The alignment microscope AMm (AM1~AM4) is set to the distance between the exposure position (drawing lines SL1~SL6) and the observation area Vw (Vw1~Vw4) of the alignment microscope AMm in the X direction compared to the length of the exposure area W in the X direction short. The number of alignment microscopes AMm provided in the Y direction can be changed according to the number of alignment marks MKm formed in the width direction of the substrate FS. Moreover, the size of the observation areas Vw1 to Vw4 on the illuminated surface of the substrate FS is set according to the size of the alignment marks MK1 to MK4 or the alignment accuracy (position measurement accuracy), but it is about 100 to 500 μm square. In addition, although not particularly described in the first to third embodiments (including modified examples), a plurality of alignment marks MKm are also formed in the substrate FS used in the above first to third embodiments.

As shown in FIG. 24, at both ends of the rotating drum DR, scale parts SD (SDa, SDb) having scales formed in a ring shape in the circumferential direction of the outer circumferential surface of the rotating drum DR as a whole are provided. The scale portion SD (SDa, SDb) is a diffraction grating in which concave or convex lattice lines are engraved at a certain pitch (for example, 20 μm) in the circumferential direction of the outer peripheral surface of the rotating drum DR, and constitutes an incremental scale. The scale part SD (SDa, SDb) rotates about the central axis AXo integrally with the rotating drum DR. In addition, a plurality of encoders (scale reading heads) ENn are provided so as to face the scale parts SD (SDa, SDb). This encoder ENn optically detects the rotational position of the rotary drum DR. Three encoders ENn (EN1a, EN2a, EN3a) are provided opposite to the scale part SDa provided at the end of the -Y direction side of the rotating drum DR. Similarly, three encoders ENn (EN1b, EN2b, EN3b) are provided opposite to the scale part SDb provided at the end of the +Y direction side of the rotating drum DR. In addition, although not specifically described in the first to third embodiments (including modified examples), scale parts SD (SDa, SDb) are provided at both ends of the rotating drum DR in the above first to third embodiments, to A plurality of encoders ENn (EN1a~EN3a, EN1b~EN2b) are provided in the opposite way.

The encoder ENn (EN1a~EN3a, EN1b~EN3b) projects the measuring beam toward the scale SD (SDa, SDb), and the reflected beam (diffracted light) is detected by photoelectricity, and the pulse signal, that is, the detection signal, is output to the control device 18. The control device 18 counts the detection signal (pulse signal) with a counter circuit 356a (refer to FIG. 33), whereby the rotation angle position and angle change of the rotary drum DR can be measured by submicron resolution. The counter circuit 356a counts the detection signals of each encoder ENn (EN1a~EN3a, EN1b~EN3b) individually. The control device 18 may also measure the transfer speed of the substrate FS from the angle change of the rotating drum DR. A counter circuit 356a that counts the detection signals of each encoder ENn (EN1a~EN3a, EN1b~EN3b) individually, and detects that each encoder ENn (EN1a~EN3a, EN1b~EN3b) is formed in the scale part SDa, SDb After a part of the origin mark (origin pattern) ZZ in the circumferential direction, the count value corresponding to the encoder ENn is reset to 0.

The encoders EN1a, EN1b are arranged on the set azimuth line Lx1. The azimuth line Lx1 is a line connecting the projection position (reading position) on the scale part SD (SDa, SDb) and the central axis AXo of the measuring beams of the encoders EN1a and EN1b in the XZ plane. In addition, the azimuth line Lx1 is a line connecting the observation area Vw (Vw1 to Vw4) of each alignment microscope AMm (AM1 to AM4) and the central axis AXo in the XZ plane.

Encoders EN2a, EN2b are located on the upstream side of the substrate FS in the transport direction (-X direction side) with respect to the center plane Poc, and are located downstream of the substrate FS in the transport direction (+X direction side) than the encoders EN1a, EN1b . The encoders EN2a, EN2b are arranged on the set azimuth line Lx2. The azimuth line Lx2 is a line connecting the projection position on the scale part SD (SDa, SDb) and the central axis AXo of the measuring beams of the encoders EN2a and EN2b in the XZ plane. This setting azimuth line Lx2, in the XZ plane, overlaps the irradiation central axes Le1, Le3, Le5 at the same angular position.

The encoders EN3a and EN3b are provided on the downstream side (+X direction side) of the substrate FS in the transport direction with respect to the center plane Poc. The encoders EN3a, EN3b are arranged on the set azimuth line Lx3. The azimuth line Lx3 is a line connecting the projection position on the scale part SD (SDa, SDb) and the central axis AXo of the measuring beams of the encoders EN3a and EN3b in the XZ plane. This setting azimuth line Lx3, in the XZ plane, overlaps the irradiation central axes Le2, Le4, Le6 at the same angular position.

The count value (rotation angle position) of the detection signal from the encoder EN1a, EN1b, the count value (rotation angle position) of the detection signal from the encoder EN2a, EN2b, and the count value of the detection signal from the encoder EN3a, EN3b (Rotation angle position), when each encoder ENn detects the origin mark ZZ attached to one of the rotation directions of the rotary drum DR, it resets to 0. Therefore, suppose that the count value based on the encoders EN1a, EN1b is the first value (for example, 100) when the position of the substrate FS wound on the rotating drum DR on the set azimuth line Lx1 (aligned with the microscope AM1~AM4) The position of each observation area Vw1~Vw4) is the first position. After the first position on the substrate FS is transferred to the position on the azimuth line Lx2 (the position of the drawing lines SL1, SL3, SL5), the encoder EN2a, The count value based on EN2b becomes the first value (for example, 100). Similarly, after the first position on the substrate FS is transferred to the position on the azimuth line Lx3 (the position of the drawing lines SL2, SL4, SL6), the count value of the detection signal based on the encoders EN3a, EN3b becomes the first value (For example, 100).

However, the substrate FS is wound inside the scale portions SDa, SDb at both ends of the rotating drum DR. In FIG. 23, the radius of the central axis AXo from the outer peripheral surface of the scale portion SD (SDa, SDb) is set to be smaller than the radius of the central axis AXo of the outer peripheral surface of the self-rotating drum DR. However, as shown in FIG. 24, the outer peripheral surface of the scale portion SD (SDa, SDb) may be set to be the same as the outer peripheral surface of the substrate FS wound around the rotating drum DR. That is, the radius (distance) from the central axis AXo of the outer peripheral surface of the scale portion SD (SDa, SDb) and the central axis of the outer peripheral surface (irradiated surface) of the substrate FS wound around the rotating drum DR can also be set The radius (distance) of AXo becomes the same. By this, the encoder ENn (EN1a, EN1b, EN2a, EN2b, EN3a, EN3b) can detect the scale part SD (SDa, SDb) at the same radial direction as the irradiated surface of the substrate FS wound on the rotating drum DR, The Abbe error caused by the difference between the measurement position and the processing position of the encoder ENn (drawing lines SL1 to SL6) in the radial direction of the rotary drum DR can be reduced.

According to the above description, the length of the substrate FS is determined by the control device 18 according to the position of the alignment marks MKm (MK1 to MK4) detected by the alignment microscope AMm (AM1 to AM4) (technical values of the encoders EN1a, EN1b) The side direction (X direction) is at the start position of the drawing exposure of the exposure area W. At this time, the count value based on the encoders EN1a and EN1b is set to the first value (for example, 100). In this case, after the count value based on the encoders EN2a, EN2b becomes the first value (for example, 100), the starting position of the drawing exposure of the long side direction of the substrate FS in the exposure area W is on the drawing lines SL1, SL3, SL5 . Therefore, the scanning units U1, U3, U5 can start the scanning of the spot light SP according to the count values of the encoders EN2a, EN2b. In addition, after the count value based on the encoders EN3a and EN3b becomes the first value (for example, 100), the starting position of the drawing exposure of the longitudinal direction of the substrate FS in the exposure area W is on the drawing lines SL2, SL4, and SL6. Therefore, the scanning units U2, U4, U6 can start the scanning of the spot light SP according to the count values of the encoders EN3a, EN3b. In addition, although not specifically described in the first to third embodiments (including modified examples), the exposure apparatus EX of the above first to third embodiments also includes an encoder ENn (EN1a to EN3a, EN1b to EN3b) and a scale section SD (SDa, SDb).

26 is a configuration diagram of the beam switching member 20. The beam switching member 20 has a plurality of selection optical elements AOMn (AOM1~AOM6), a plurality of condenser lenses CD1~CD6, a plurality of reflection mirrors M1~M12, a plurality of unit side incident mirrors IM1~IM6, a plurality of collimating mirrors CL1~CL6, and absorber TR. The optical element AOMn (AOM1~AOM6) is transmissive to the light beam LB and is an acousto-optic modulator (AOM: Acousto-Optic Modulator) driven by ultrasonic signals. These optical components (selection optical elements AOM1~AOM6, condenser lenses CD1~CD6, reflecting mirrors M1~M12, unit side entrance mirrors IM1~IM6, collimating mirrors CL1~CL6, and absorber TR) are plate-shaped The support member IUB is supported. This supporting member IUB supports these optical members from below (-Z direction side) above a plurality of scanning units Un (U1 to U6). Therefore, the supporting member IUB also has the function of insulating the optical element AONn (AOM1~AOM6) for selection as a heat source and the plurality of scanning units Un(U1~U6).

The light path of the light beam LB is bent into a zigzag shape from the light source device 14' by the reflecting mirrors M1 to M12, and then led to the absorber TR. In the following, the case where the optical elements for selection AOMn (AOM1 to AOM6) are all OFF (the state where no ultrasonic signal is applied) will be described in detail. The light beam LB (parallel light beam) from the light source device 14' travels in the +Y direction parallel to the Y axis, and then enters the mirror M1 through the condenser lens CD1. The light beam LB reflected toward the -X direction side by the mirror M1 linearly passes through the first selection optical element AOM1 disposed at the focal position (beam waist width position) of the condenser lens CD1, and becomes the collimator lens CL1 again The parallel beam reaches the mirror M2. The light beam LB reflected by the mirror M2 toward the +Y direction passes through the condenser lens CD2 and is reflected by the mirror M3 toward the +X direction.

The light beam LB reflected by the mirror M3 linearly passes through the second selection optical element AOM2 disposed at the focal position (beam waist width position) of the condenser lens CD2, and becomes a parallel beam again by the collimator CL2, and reaches the reflection Mirror M4. The light beam LB reflected by the mirror M4 toward the +Y direction side is reflected by the mirror M5 toward the −X direction side after passing through the condenser lens CD3. The light beam LB reflected by the mirror M5 toward the -X direction side linearly passes through the third selection optical element AOM3 disposed at the focal position (beam waist width position) of the condenser lens CD3, and becomes the collimator lens CL3 again The parallel beam reaches the mirror M6. The light beam LB reflected by the mirror M6 toward the +Y direction side is reflected by the mirror M7 toward the +X direction side after passing through the condenser lens CD4.

The light beam LB reflected by the mirror M7 linearly passes through the fourth selection optical element AOM4 disposed at the focal position (beam waist width position) of the condenser lens CD4, and becomes a parallel beam again by the collimator CL4, reaching the reflection Mirror M8. The light beam LB reflected by the mirror M8 toward the +Y direction side is reflected by the mirror M9 toward the −X direction side after passing through the condenser lens CD5. The light beam LB reflected by the mirror M9 toward the -X direction side linearly passes through the fifth selection optical element AOM5 disposed at the focal position (beam waist width position) of the condenser lens CD5, and becomes the collimator lens CL5 again The parallel beam reaches the mirror M10. The light beam LB reflected by the mirror M10 toward the +Y direction side passes through the condenser lens CD6 and is reflected by the mirror M11 toward the +X direction side. The light beam LB reflected by the mirror M11 linearly passes through the sixth selection optical element AOM6 disposed at the focal position (beam waist width position) of the condenser lens CD6, and becomes a parallel beam again by the collimator CL6 and is reflected The mirror M12 reflects toward the -Y direction and reaches the absorber TR. The absorber TR is a light absorber for suppressing leakage of the light beam LB to the outside and absorbing the light beam LB.

As described above, the selection optical elements AOM1~AOM6 are arranged in such a manner that the light beam LB from the light source device 14' is sequentially transmitted through, and are configured to be used for each selection by the condenser lenses CD1~CD6 and the collimator lenses CL1~CL6. The optical elements AOM1~AOM6 form the beam waist width of the beam LB. As a result, the diameter of the light beam LB incident on the selection optical elements AOM1 to AOM6 (acousto-optic modulation element) is reduced, thereby improving diffraction efficiency and responsiveness.

Each selection optical element AOMn (AOM1~AOM6), if an ultrasonic signal (high frequency signal) is applied, the incident light beam LB (0th order light) is diffracted at a diffraction angle corresponding to the high frequency frequency. The diffracted light is generated as an outgoing light beam (beam LBn). In the fourth embodiment, it is assumed that the light beam LBn emitted from the plurality of selection optical elements AOMn (AOM1 to AOM6) as primary diffracted light is the light beams LB1 to LB6, and each selection optical element AOMn (AOM1 to AOM6) has The function of deflecting the optical path of the light beam LB from the light source device 14'. However, as mentioned above, the actual acousto-optic modulation element produces primary diffracted light with an efficiency of about 80% of that of the zero-order light. Therefore, it is chosen to use each of the deflected beams LB1~LB6 of the optical element AONn (AOM1~AOM6) The intensity is lower than the original beam LB. In addition, when any one of the optical elements for selection AOMn (AOM1 to AOM6) is in the ON state, the 0th-order light that goes straight without being diffracted remains about 20%, but is eventually absorbed by the absorber TR.

In addition, the optical element for selection AONn is a diffraction grating that generates periodic and coarse changes in the refractive index in a predetermined direction in the transmission member by ultrasonic waves. Therefore, when the incident light beam LB is linearly polarized (P-polarized or S-polarized), The polarization direction and the periodic direction of the diffraction grating are set so that the generation efficiency (diffraction efficiency) of primary diffraction light becomes the highest. As shown in FIG. 26, when the optical element AONn for selection is set to deflect the incident light beam LB in the Z direction, the periodic direction of the diffraction grating generated in the optical element AONn for selection is also the Z direction, so match To set (adjust) the polarization direction of the light beam LB from the light source device 14'.

Furthermore, as shown in FIG. 26, each of the plurality of selective optical elements AOMn (AOM1~AOM6) is arranged so that the deflected light beams LB1~LB6 (first-order diffracted light) are in the -Z direction with respect to the incident light beam LB Biased. The light beams LB1~LB6 emitted from each deflection of the selection optical element AOMn (AOM1~AOM6) are projected to the unit side incident mirror IM1~ located at a position separated from each of the selection optical element AOMn(AOM1~AOM6) by a predetermined distance. IM6 is therefore reflected in such a way that it is parallel (coaxial) with the irradiation central axes Le1 to Le6 in the -Z direction. The light beams LB1~LB6 reflected by the unit-side incident mirrors IM1~IM6 (hereinafter, simply referred to as mirrors IM1~IM6) pass through the openings TH1~TH6 formed in the support member IUB to follow the irradiation center axis Le1~Le6 Into the scanning units Un (U1~U6).

It is also possible to use the same configuration, function, function, etc. of the optical elements for selection AOMn (AOM1~AOM6). A plurality of selection optical elements AOMn (AOM1~AOM6) turn ON/OFF the diffracted light diffracted by the incident light beam LB according to the ON/OFF of the driving signal (high frequency signal) from the control device 18. For example, when the optical element AOM1 for selection is turned off without applying a driving signal (high-frequency signal) from the control device 18, the incident light beam LB is not diffracted and transmitted. Therefore, the light beam LB transmitted through the selection optical element AOM1 is transmitted through the collimating mirror CL1 and enters the reflecting mirror M2. On the other hand, the selection optical element AOM1 diffracts the incident light beam LB toward the mirror IM1 when the drive signal from the control device 18 is applied and turns on. That is, the optical element AOM1 for selection is switched by this drive signal. The mirror IM1 reflects the light beam LB1 diffracted by the selective optical element AOM1 to the scanning unit U1 side. The light beam LB1 reflected by the mirror IM1 enters the scanning unit U1 along the irradiation center axis Le1 through the opening TH1 of the support member IUB. Therefore, the reflecting mirror IM1 reflects the incident light beam LB1 in such a manner that the optical axis of the reflected light beam LB1 and the irradiation center axis Le1 become coaxial. In addition, when the optical element for selection AOM1 is in the ON state, the 0th order light (the intensity of about 20% of the incident light beam) of the light beam LB of the optical element for selection AOM1 is linearly transmitted, and then passes through the collimating mirror CL1~ CL6, condenser lenses CD2~CD6, reflectors M2~M12, and optional optical components AOM2~AOM6.

FIG. 27A is a view of the optical path switching of the light beam LB by the selection optical element AOM1 viewed from the +Z direction side, and FIG. 27B is a view of the optical path switching of the light beam LB by the selection optical element AOM1 viewed from the -Y direction side. When the driving signal is OFF, the selection optical element AOM1 does not diffract the incident light beam LB but transmits it directly toward the mirror M2 side. On the other hand, when the drive signal is ON, the selection optical element AOM1 generates the light beam LB1 that diffracts the incident light beam LB toward the -Z direction side, and makes it face the mirror IM1. Therefore, in the XY plane, the traveling directions of the light beam LB (0th order light) and the deflected light beam LB1 (1st diffracted light) emitted from the selection optical element AOM1 are not changed, and the light beam LB1 (1st order) is changed in the Z direction Diffraction light). As described above, the control device 18 switches ON/OFF (high/low) the drive signal (high frequency signal) to be applied to the selection optical element AOM1, switches the selection optical element AOM1, and switches whether the light beam LB is directed to the subsequent selection With the optical element AOM2, whether the deflected light beam LB1 faces the scanning unit U1.

Similarly, the selection optical element AOM2 does not transmit the incident light beam LB (which is not diffracted by the selection optical element AOM1 and passes through when the drive signal (high-frequency signal) from the control device 18 is OFF. The light beam LB) is diffracted and transmitted to the collimator CL2 side (mirror M4 side). When the drive signal from the control device 18 is ON, the diffracted light of the incident light beam LB, that is, the light beam LB2 is directed toward the mirror IM2 . This reflecting mirror IM2 reflects the light beam LB2 diffracted by the selective optical element AOM2 to the scanning unit U2 side. The light beam LB2 reflected by the mirror IM2 passes through the opening TH2 of the support member IUB and becomes coaxial with the irradiation center axis Le2 and enters the scanning unit U2. Furthermore, when the optical components AOM3~AOM6 are selected, when the driving signal (high frequency signal) from the control device 18 is OFF, the incident light beam LB is not diffracted and transmitted to the collimator CL3~CL6 side ( (Mirrors M6, M8, M10, M12 sides), when the drive signal from the control device 18 is ON, the first diffracted light of the incident light beam LB, that is, the light beams LB3~LB6 are directed toward the mirrors IM3~IM6. The mirrors IM3~IM6 reflect the light beams LB3~LB6 diffracted by the selective optical elements AOM3~AOM6 to the scanning unit U3~U6 side. The light beams LB3 to LB6 reflected by the mirrors IM3 to IM6 pass through the openings TH3 to TH6 of the support member IUB and are coaxial with the irradiation center axis Le3Le6 and enter the scanning units U3 to U6. As described above, the control device 18 switches any one of the selection optical elements AOM2 to AOM6 by turning ON/OFF (high/low) the drive signals (high frequency signals) to be applied to the selection optical elements AOM2 to AOM6 , Whether the light beam LB is directed to the subsequent selection optical elements AOM3~AOM6 or the absorber TR, and whether one of the deflected light beams LB2~LB6 is directed to the corresponding scanning unit U2~U6.

As described above, the light beam switching member 20 includes a plurality of selection optical elements AOMn (AOM1 to AOM6) arranged in line along the traveling direction of the light beam LB from the light source device 14', whereby the optical path of the light beam LB can be switched to select one light beam LBn The scanning unit Un is injected. For example, when the light beam LB1 is to be incident on the scanning unit U1, the selection optical element AOM1 is turned on, and when the light beam LB3 is to be incident on the scanning unit U3, the selection optical element AOM3 may be turned on. The plurality of selection optical elements AOMn (AOM1~AOM6) are set corresponding to the plurality of scanning units Un (U1~U6), and switch whether the light beam LBn is incident on the corresponding scanning unit Un.

A plurality of scanning units Un(U1~U6) repeatedly scan the spot light SP in a predetermined order, so the beam switching member 20 also corresponds to this, and switches any one of the scanning beams LB1~LB6 into the scanning units U1~U6. For example, in the case where the order of the scanning unit Un for scanning the spot light SP is U1→U2→...→U6, the beam switching member 20 also corresponds to this, and switches the scanning in which the light beam LBn enters in the order of U1→U2→...→U6 Unit Un.

According to the above description, each selection optical element AOMn (AOM1~AOM6) of the beam switching member 20 is ON as long as the spot light SP of each polygon mirror PM of the scanning unit Un(U1~U6) is ON during one scan can. The details will be described later, but if the number of reflection surfaces of the polygon mirror PM is Np and the rotation speed of the polygon mirror PM is Vp (rpm), the time Tss corresponding to the rotation angle of one of the reflection surfaces RP of the polygon mirror PM becomes Tss= 60/(Np·Vp) seconds. For example, in the case where the number of reflecting surfaces is 8 and the rotation speed Vp is 30,000, one of the polygonal mirrors PM rotates for 2 milliseconds, and the time Tss becomes 0.25 milliseconds. If it is converted into frequency, it is 4kHz, which means that it is an acousto-optic modulating element that is modulated at a high speed of several tens of MHz in response to the light beam LB of the ultraviolet wavelength in response to the drawing data. Change components. Therefore, it is possible to use the light beams LB1 to LB6 (first-order diffracted light) that have a larger diffraction angle with respect to the incident light beam LB (zero-order light) to pass the selection optical elements AOM1 to AOM6 with respect to the straight line The configuration of the mirrors IM1 to IM6 (FIG. 26, FIG. 27A, and FIG. 27B) in which the light beams LB1 to LB6 whose beams are deflected by the light path LB is separated becomes easier.

In addition, a plurality of scanning units U1 to U6 repeatedly scan the spot light SP in a predetermined order, so correspondingly, the sequence data DLn of the pattern data of each scanning unit Un is output to the driving circuit of the light source device 14' in a predetermined order 206a. The sequence data DLn sequentially output to the driving circuit 206a is called drawing bit row data Sdw. For example, in a case where the predetermined order is U1→U2→...→U6, first, a row of sequence data DL1 is output to the driving circuit 206a, and then, a row of sequence data DL2 is output to the driving circuit 206a, in this way, a drawing bit is formed The serial data DL1 to DL6 of the serial data Sdw are sequentially output to the driving circuit 206a. After that, the sequence data DL1 to DL6 in the next row are sequentially output as the drawing bit row data Sdw to the driving circuit 206a. The specific structure of the drive circuit 206a outputting drawing bit sequence data Sdw will be described in detail later.

The configuration of the scanning unit Un (U1 to U6) may be the user in the first to third embodiments described above, but in the fourth embodiment, the scanning unit Un with the configuration shown in FIG. 28 is used. In addition, the scanning unit Un described below may be used as the scanning unit in the first to third embodiments described above.

The optical configuration of the scanning unit Un (U1 to U6) used in the fourth embodiment will be described below with reference to FIG. 28. In addition, since each scanning unit Un (U1 to U6) has the same configuration, only the scanning unit U1 will be described, and the description of other scanning units Un will be omitted. Moreover, in FIG. 28, let the direction parallel to the irradiation center axis Len (Le1) be the Zt direction, and the direction on the plane orthogonal to the Zt direction and the substrate FS from the process device PR1 to the process device PR2 via the exposure device EX is Xt The direction, the direction on the plane orthogonal to the Zt direction and orthogonal to Xt is the Yt direction. That is, the three-dimensional coordinates of Xt, Yt, and Zt in FIG. 28 rotate the three-dimensional coordinates of X, Y, and Z in FIG. 23 into a Z-axis direction. The Y axis is the center and the irradiation center axis Len (Le1) becomes a three-dimensional parallel coordinate.

As shown in FIG. 28, in the scanning unit U1, along the traveling direction of the light beam LB1 from the incident position of the light beam LB1 to the illuminated surface of the substrate FS, a reflecting mirror M20, a beam amplifier BE, a reflecting mirror M21, and a polarization beam splitting are provided BS, mirror M22, image shifting optical member SR, field diaphragm FA, mirror M23, λ/4 wavelength plate QW, cylindrical lens CYa, mirror M24, polygon mirror PM, fθ lens FT, mirror M25 , Cylindrical lens CYb. Furthermore, the scanning unit U1 is provided with an optical lens G10 and a photodetector DT1 for detecting the reflected light from the illuminated surface of the substrate FS through the polarizing beam splitter BS.

The light beam LB1 incident on the scanning unit U1 travels in the -Zt direction and enters the mirror M20 inclined by 45° with respect to the XtYt plane. The axis of the light beam LB1 incident on the scanning unit U1 enters the mirror M20 so as to be coaxial with the irradiation central axis Le1. The reflection mirror M20 functions as an incident optical member that causes the light beam LB1 to enter the scanning unit U1, and reflects the incident light beam LB1 toward the reflection mirror M21 along the optical axis set parallel to the Xt axis in the -Xt direction. Therefore, the optical axis of the light beam LB1 traveling parallel to the Xt axis is orthogonal to the irradiation center axis Le1 in a plane parallel to the XtZt plane. The light beam LB1 reflected by the mirror M20 transmits the beam amplifier BE disposed along the optical axis of the light beam LB1 traveling parallel to the Xt axis and enters the mirror M21. The beam amplifier BE amplifies the diameter of the transmitted beam LB1. The beam amplifier BE has a condenser lens Be1, and a collimator lens Be2 that makes the beam LB1 scattered by the condenser lens Be1 converge into parallel light.

The reflecting mirror M21 is arranged at an angle of 45° with respect to the YtZt plane, and reflects the incident light beam LB1 toward the polarizing beam splitter BS in the -Yt direction. The polarization separation surface of the polarizing beam splitter BS is inclined at 45° with respect to the YtZt plane to reflect the beam of P-polarized light and transmit the beam of linearly polarized light (S-polarized light) polarized in a direction orthogonal to the P-polarized light. Since the light beam LB1 entering the scanning unit U1 is a P-polarized light beam, the polarization beam splitter BS reflects the light beam LB1 from the mirror M21 toward the -X direction and guides it to the mirror M22 side.

The reflecting mirror M22 is arranged at an angle of 45° with respect to the XtYt plane, so that the incident light beam LB1 reflects toward the reflecting mirror M23 separated from the reflecting mirror M22 in the -Zt direction in the -Zt direction. The light beam LB1 reflected by the mirror M22 enters the mirror M23 through the image shifting optical member SR and the field diaphragm (field diaphragm) FA along the optical axis parallel to the Zt axis. The image-shifting optical member SR adjusts the center position in the cross section of the light beam LB1 two-dimensionally in a plane (XtYt plane) orthogonal to the traveling direction of the light beam LB1. The image-shifting optical member SR is composed of two quartz parallel flat plates Sr1 and Sr2 arranged along the optical axis of the light beam LB1 traveling parallel to the Zt axis. The parallel flat plate Sr1 can be tilted around the Xt axis and the parallel flat plate Sr2 can be wrapped around Yt The axis is tilted. The parallel flat plates Sr1, Sr2 are inclined around the Xt axis and the Yt axis, respectively, thereby slightly shifting the position of the center of the light beam LB1 two-dimensionally on the XtYt plane orthogonal to the traveling direction of the light beam LB1. The parallel plates Sr1 and Sr2 are driven by an actuator (driving unit) not shown under the control of the control device 18.

The light beam LB1 passing through the image shifting optical member SR passes through the circular opening of the field diaphragm FA and reaches the mirror M23. The circular opening of the field diaphragm FA shields the peripheral portion of the intensity distribution in the cross section of the beam LB1 amplified by the beam amplifier BE. If the aperture of the circular opening of the field diaphragm FA is an adjustable variable iris diaphragm, the intensity (brightness) of the spot light SP can be adjusted.

The reflecting mirror M23 is arranged at an angle of 45° with respect to the XtYt plane, so that the incident light beam LB1 reflects toward the reflecting mirror M24 separated from the reflecting mirror M23 in the +Zt direction in the +Zt direction. The light beam LB1 reflected by the mirror M23 passes through the λ/4 wavelength plate QW and the cylindrical lens CYa and enters the mirror M24. The reflecting mirror M24 reflects the incident light beam LB1 toward the polygon mirror (rotating polygon mirror, scanning deflection member) PM. The polygon mirror PM reflects the incident light beam LB1 toward the +Xt direction toward the fθ lens FT having an optical axis AXf parallel to the Xt axis. In the polygon mirror PM, in order to scan the spot light SP of the light beam LB1 on the illuminated surface of the substrate FS, the incident light beam LB1 is deflected (reflected) in a plane parallel to the XtYt plane. Specifically, the polygon mirror PM has a rotation axis AXp extending in the Zt axis direction, and a plurality of reflection surfaces RP formed around the rotation axis AXp (eight reflection surfaces RP in the fourth embodiment). By rotating the polygon mirror PM in the predetermined rotation direction about the rotation axis AXp, the incident angle of the pulsed light beam LB1 irradiated to the reflection surface RP can be continuously changed. By this, the reflection direction of the light beam LB1 is deflected by one reflection surface RP, so that the spot light SP of the light beam LB1 irradiated on the irradiated surface of the substrate FS can be scanned along the scanning direction (the width direction of the substrate FS, the Yt direction) .

The spot light SP of the light beam LB1 can be scanned along the drawing line SL1 by a reflecting surface RP. Therefore, with one rotation of the polygon mirror PM, the maximum number of trace lines scanned by the spot light SP on the illuminated surface of the substrate FS is the same as the number of reflection surfaces RP, which becomes eight. The polygon mirror PM is rotated at a constant speed by a polygon mirror drive part RM including a motor or the like. The rotation of the polygon mirror PM by the polygon mirror drive unit RM is controlled by the control device 18. As described above, the effective length (for example, 30 mm) of the drawing line SL1 is set to a length that is less than the maximum scanning length (for example, 31 mm) by which the polygonal mirror PM can scan the spot light SP, at the initial setting (design), A center point of the drawing line SL1 (the irradiation center axis Le1 passes) is set in the center of the maximum scan length.

In addition, as an example, the effective length of the drawing line SL1 is set to 30 mm, and while the spot light SP having an effective size ø of 3 μm is superimposed one by one at 1.5 μm, the spot light SP is irradiated to the irradiated surface of the substrate FS along the drawing line SL1 At the time of the above, the number of spot light SP irradiated by one scan (the number of pulses of the light beam LB from the light source device 14') becomes 20000 (30mm/1.5μm). Also, if the scanning time of the spot light SP along the drawing line SL1 is 200 μsec, it is necessary to irradiate the pulsed spot light SP 20,000 times during this period, so the light emission frequency Fs of the light source device 14 ′ becomes Fs≧20000 times/200 μsec =100MHz.

The cylindrical lens CYa converges the incident light beam LB1 into a slit shape on the reflection surface RP of the polygon mirror PM in a non-scanning direction (Z direction) orthogonal to the scanning direction (rotation direction) of the polygon mirror PM. With the cylindrical lens CYa whose generatrix is parallel to the Yt direction, even if the reflecting surface RP is inclined with respect to the Zt direction (the inclination of the reflecting surface RP with respect to the normal of the XtYt plane), its influence can be suppressed and the irradiation to the The irradiation position of the light beam LB1 on the illuminated surface of the substrate FS is shifted in the Xt direction.

The fθ lens FT having an optical axis AXf extending in the Xt axis direction is a telecentric scanning lens that projects the light beam LB1 reflected by the polygon mirror PM on the XtYt plane to the mirror 25 in a manner parallel to the optical axis AXf. The incident angle θ of the light beam LB1 to the fθ lens FT varies according to the rotation angle (θ/2) of the polygon mirror PM. The fθ lens FT projects the light beam LB1 through the mirror M25 and the cylindrical lens CYb to the image height position on the illuminated surface of the substrate FS proportional to its incident angle θ. Assuming that the focal distance is fo and the image height position is y, the fθ lens FT is designed to satisfy the relationship of y=fo·θ. Therefore, the light beam LB1 (spot light SP) can be accurately and uniformly scanned in the Yt direction (Y direction) by the fθ lens FT. When the incident angle θ to the fθ lens FT is 0 degrees, the light beam LB1 incident on the fθ lens FT travels along the optical axis AXf.

The mirror M25 reflects the incident light beam LB1 through the cylindrical lens CYb toward the substrate FS in the -Zt direction. With the fθ lens FT and the cylindrical lens CYb whose generatrix is parallel to the Yt direction, the light beam LB1 transmitted to the substrate FS converges to a spot light SP having a diameter of several μm (for example, 3 μm) on the illuminated surface of the substrate FS. The spot light SP transmitted to the illuminated surface of the substrate FS is scanned one-dimensionally by the polygon mirror PM and by the drawing line SL1 extending in the Yt direction. In addition, the optical axis AXf of the fθ lens FT is on the same plane as the irradiation center axis Le1, which is parallel to the XtZt plane. Therefore, the light beam LB1 traveling on the optical axis AXf is reflected by the mirror M25 in the -Zt direction, and is coaxial with the irradiation central axis Le1 and is projected onto the substrate FS. In the fourth embodiment, at least the fθ lens FT has the function of a projection optical system that projects the light beam LB1 deflected by the polygon mirror PM to the illuminated surface of the substrate FS. Furthermore, at least the reflecting member (reflecting mirrors M21 to M25) and the polarizing beam splitter BS have an optical path deflecting member that bends the optical path of the light beam LB1 from the reflecting mirror M20 to the substrate FS. With this optical path deflecting member, the incident axis of the light beam LB1 incident on the mirror M20 can be substantially coaxial with the irradiation center axis Le1. In the XtZt plane, the light beam LB1 passing through the scanning unit U1 passes through a substantially U-shaped or U-shaped optical path, and then travels toward the -Zt direction and is projected onto the substrate FS.

As described above, in a state where the substrate FS is transported in the X direction, the spot light SP of the light beam LBn is scanned one-dimensionally in the scanning direction (Y direction) by each scanning unit Un (U1 to U6), thereby enabling spot light SP scans relatively two-dimensionally on the illuminated surface of the substrate FS. Therefore, a predetermined exposure pattern can be drawn on the exposure area W of the substrate FS.

The photodetector DT1 has a photoelectric conversion element that photoelectrically converts incident light. A predetermined reference pattern is formed on the surface of the rotating drum DR. The part on the rotating drum DR on which the reference pattern is formed is composed of a material with a lower reflectivity (10 to 50%) to the wavelength range of the light beam LB1, and the other part on the rotating drum DR on which the reference pattern is not formed is on the reflectance It is composed of less than 10% of materials or materials that absorb light. Therefore, in a state where the substrate FS is not wound (or a state passing through the transparent portion of the substrate FS), the spot light SP of the light beam LB1 is irradiated from the scanning unit U1 to the area of the rotating drum DR where the reference pattern is formed, and the reflected light Cylindrical lens CYb, mirror M25, fθ lens FT, polygon mirror PM, mirror M24, cylindrical lens CYa, λ/4 wavelength plate QW, mirror M23, field diaphragm FA, image shifting optical member SR, And the mirror M22 enters the polarizing beam splitter BS. Here, a λ/4 wavelength plate QW is provided between the polarizing beam splitter BS and the substrate FS, specifically, between the mirror M23 and the cylindrical lens CYa. Thereby, the light beam LB1 irradiated to the substrate FS is converted from P-polarized light to circularly polarized light by the λ/4 wavelength plate QW, and the reflected light entering the polarizing beam splitter BS from the substrate FS is converted by the λ/4 wavelength plate QW from Circular polarized light is converted into S polarized light. Therefore, the reflected light from the substrate FS passes through the polarizing beam splitter BS, and enters the photodetector DT1 through the optical lens system G10.

At this time, in a state where the pulsed light beam LB1 (preferably, the light beam LB1 from the seed light S1) continuously enters the scanning unit U1, the scanning unit U1 scans the spot light SP by rotating the rotating cylinder DR The light SP is irradiated to the outer peripheral surface of the rotating drum DR two-dimensionally. Therefore, the image of the reference pattern formed on the rotating drum DR can be obtained by the photodetector DT1. Specifically, the intensity change of the photoelectric signal output from the photodetector DT1 responds to the clock pulse signal (generated in the light source device 14') used for the point light SP to emit light, and digitally samples each scanning time to obtain It is one-dimensional image data in the Yt direction. Furthermore, in response to the measurement value of the encoder ENn that measures the rotation angle position of the rotating cylinder DR, a certain distance in the sub-scanning direction (for example, 1/2 of the size ø of the spot light SP) , Arrange the one-dimensional image data in the Yt direction in the Xt direction, thereby obtaining the two-dimensional image information on the surface of the rotating drum DR. The control device 18 measures the inclination of the drawing line SL1 of the scanning unit U1 based on the two-dimensional image information of the reference pattern of the rotating drum DR thus obtained. The inclination of the drawing line SL1 may be a relative inclination between the scanning units Un (U1 to U6), or an inclination (absolute inclination) with respect to the central axis AXo of the rotating drum DR. In addition, in the same manner, of course, the inclination of each drawing line SL2 to SL6 can also be measured.

Around the polygon mirror PM of the scanning unit U1, as shown in FIG. 29, an origin sensor (origin detector) OP1 is provided. The origin sensor OP1 outputs a pulse-shaped origin signal SZ indicating that the scanning of the spot light SP of each reflection surface RP starts. The origin sensor OP1 outputs the origin signal SZ after the rotation position of the polygon mirror PM comes to the predetermined position immediately before the scanning of the spot light SP of the reflection surface RP starts. The polygon mirror PM can deflect the light beam LB1 projected onto the substrate FS in the scanning angle range θs. Therefore, if the reflection direction (deflection direction) of the light beam LB1 reflected by the polygon mirror PM becomes within the scanning angle range θs, the reflected light beam LB1 Enter the fθ lens FT. Therefore, the origin sensor OP1 comes to the origin position signal SZ after the reflection direction of the light beam LB1 reflected by the reflection surface RP enters the predetermined position within the scan angle range θs at the rotation position of the polygon mirror PM. In addition, the scan angle range θs and the maximum scan rotation angle range α shown in FIG. 7 have a relationship of θs=2×α.

Since the polygon mirror PM has eight reflection surfaces RP, the origin sensor OP1 outputs eight origin signals SZ during one rotation of the polygon mirror PM. The origin signal SZ detected by the origin sensor OP1 is sent to the control device 18. After the origin sensor OP1 outputs the origin signal SZ, the scanning of the spot light SP along the drawing line SL1 is started.

The origin sensor OP1 uses the reflection surface RP adjacent to the reflection surface RP that performs the scanning of the spot light SP (the deviation of the light beam LB1) (in the fourth embodiment, the reflection surface RP before the rotation direction of the polygon mirror PM) The origin signal SZ is output. In order to distinguish each reflection surface RP, for convenience, in FIG. 29, the reflection surface RP which is now deflected by the light beam LB1 is represented by RPa, and the other reflection surface RP is wound counterclockwise (around the direction opposite to the rotation direction of the polygon mirror PM) Expressed as RPb~RPh.

The origin sensor OP1 has a light beam transmission system Opa, and the light beam transmission system Opa includes a light source section 312 that emits a laser beam Bga in a non-photosensitive wavelength region such as a semiconductor laser, and a laser beam from the light source section 312 After the bga is reflected, the projection mirrors 314 and 316 are projected to the reflection surface RPb of the polygon mirror PM. In addition, the origin sensor OP1 has a light beam receiving system Opb, and the light beam receiving system Opb includes a light receiving unit 318, and reflects the reflected light (reflected light beam Bgb) of the laser beam Bga reflected by the reflection surface RPb to the reflection of the light receiving unit 318 The mirrors 320, 322, and the lens system 324 that condenses the reflected light beam Bgb reflected by the mirror 322 into minute spot light. The light receiving unit 318 has a photoelectric conversion element that converts the spot light of the reflected light beam Bgb condensed by the lens system 324 into an electrical signal. Here, the position where the laser beam Bga is projected onto each reflection surface RP of the polygon mirror PM is set to become the pupil plane (focus position) of the lens 324.

The beam receiving system Opa and the beam receiving system Opb are set at a predetermined position immediately before the scanning of the spot light SP at the rotation position of the polygon mirror PM is the reflection surface RP, the beam receiving system Opb can accept the beam transmitting system Opa The position of the reflected beam Bgb of the emitted laser beam Bga. That is, the light beam transmitting system Opa and the light beam receiving system Opb are set at positions where the reflected beam Bgb of the laser beam Bga emitted from the beam transmitting system Opa is acceptable when the angle of the reflection surface RP is a predetermined angular position. In addition, the symbol Msf in FIG. 29 is the axis of the rotation motor of the polygon mirror drive part RM (refer FIG. 28) arrange|positioned coaxially with the rotation axis AXp.

In front of the light-receiving surface of the photoelectric conversion element in the light-receiving portion 318, a light-shielding body (not shown) having a slit opening with a small width is provided. While the angular position of the reflecting surface RPb is within a predetermined angle range, the reflected light beam Bgb enters the lens system 324, and the spot light of the reflected light beam Bgb scans in a certain direction on the light-shielding body in the light receiving portion 318. In this scan, the spot light of the reflected light beam Bgb transmitted through the slit opening of the light-shielding body is received by the photoelectric conversion element of the light-receiving part 318, and the light-receiving signal is amplified by an amplifier and output as a pulse-shaped origin signal SZ.

The origin sensor OP1, as described above, detects the origin signal SZ by deflecting the light beam LB1 to the reflective surface RPa (scanning the spot light SP) using the one reflective surface RPb before the rotation direction. Therefore, if the angle ηj between adjacent reflecting surfaces RP (for example, reflecting surface RPa and reflecting surface RPb) has an error with respect to the design value (135 degrees in the case of eight reflecting surfaces RP), the deviation due to the error As shown in FIG. 30, there may be a case where the generation timing of the origin signal SZ differs on the reflection surface RP.

In FIG. 30, it is assumed that the origin signal SZ generated using the reflection surface RPb is SZb. Similarly, the origin signal SZ generated by using the reflective surfaces RPc, RPd, RPe,… is SZc, SZd, SZe, …. When the angle ηj between the adjacent reflection surfaces RP of the polygon mirror PM is the design value, the interval of the generation timing of each origin signal SZ (SZb, SZc, SZd, …) becomes the time Tpx. This predetermined time Tpx is the time required for one of the reflection surfaces RP of the polygon mirror PM to rotate. However, in FIG. 30, due to the error of the angle ηj of the reflection surface RP of the polygon mirror PM, the timing of the origin signals SZc, SZd generated using the reflection surfaces RPc, RPd is shifted from the normal timing. In addition, the origin signals SZb, SZc, SZd, SZe, ... the time intervals Tp1, Tp2, Tp3, ..., due to the manufacturing error of the polygon mirror PM, are not necessarily in the μ-second level. In the schedule shown in FIG. 30, Tp1<Tpx, Tp2>Tpx, and Tp3<Tpx. In addition, if the number of reflection surfaces RP is Np and the rotation speed of the polygon mirror PM is Vp, Tpx is represented by Tpx=60/(Np×Vp) seconds. For example, Vp is 30,000 rpm, and if Np is 8, Tpx becomes 250 μsec.

Therefore, due to the error of the included angle ηj between the adjacent reflecting surfaces RP of the polygon mirror PM, the point light SP depicted by each reflecting surface RP (RPa~RPh) is depicted by the drawing line SL1 on the illuminated surface of the substrate FS The position of the start point (scanning start point) is shifted toward the main scanning direction. As a result, the position of the drawing end point of the drawing line SL is also shifted in the main scanning direction. That is, the position of the drawing line SL1 of the spot light SP drawn by each reflection surface RP is shifted along the scanning direction (Y direction), so the positions of the drawing start point and drawing end point of each drawing line SLn do not follow X The direction becomes a straight line. The main reason for the position of the drawing start point and drawing end point of the drawing line SL1 of this spot light shifting to the main scanning direction is that it will not become Tp1, Tp2, Tp3, …=Tpx.

Therefore, in the fourth embodiment, as shown in FIG. 30, the time period Tpx after the generation of one pulse-shaped origin signal SZ is taken as the drawing start point, and the drawing of the spot light SP is started. That is, the control device 18 controls the beam switching member 20 so that the light beam LB1 enters the scanning unit U1 after the time Tpx has elapsed after the origin signal SZ is generated, and outputs to the drive circuit 206a of the light source device 14' shown in FIG. 26. The drawing bit row data Sdw of the scanning unit U1 performing the scanning, that is, the sequence data DL1. Thereby, the reflection surface RPb used for the detection of the origin signal SZ and the reflection surface RP that actually scans the spot light SP can be the same reflection surface.

Specifically, the control device 18, after the origin signal SZb of the scanning unit U1 outputs the origin signal SZb, a time Tpx passes, and the optical element AOM1 for selecting the beam switching member 20 outputs ON at a certain time (ON time Ton) Drive signal. The certain time that the optical element AOM1 for this selection turns ON (ON time Ton) is a predetermined time set to cover the period during which the spot light SP is scanned once along the drawing line SL by one reflecting surface RP of the polygon mirror PM (scanning period ). Next, the control device 18 outputs a specific row, for example, the first row of sequence data DL1 to the driving circuit 206a of the light source device 14'. In this way, during the scanning time when the scanning unit U1 scans the spot light SP, the light beam LB1 enters the scanning unit U1, so the scanning unit U1 can draw a pattern corresponding to a specific row (for example, the first row) sequence data DL1. As described above, after the origin signal SZb of the scanning unit U1 outputs the origin signal SZb and the time Tpx passes, the scanning unit U1 scans the spot light SP, so the reflection surface RPb used for the detection of the origin signal SZb can be used The spot light SP caused by the origin signal SZb is scanned.

Then, after the time Tpx elapses after the origin sensor OP1 of the scanning unit U1 outputs the origin signal SZd, the control device 18 outputs ON to the optical element AOM1 for selection of the beam switching member 20 at a certain time (ON time Ton) Drive signal. Next, the control device 18 outputs the next column, for example, the second column of sequence data DL1 to the drive circuit 206a of the light source device 14'. Thereby, in the scanning time including the time required for the scanning unit U1 to scan the spot light SP, the light beam LB1 is incident on the scanning unit U1, so the scanning unit U1 can draw a pattern corresponding to the sequence data DL1 of the next row (for example, the second row) . As described above, after the origin signal SZd of the scanning unit U1 outputs the origin signal SZd and the time Tpx passes, the scanning unit U1 scans the spot light SP, so the reflection surface RPb used for the detection of the origin signal SZd can be used The scanning of the spot light SP caused by the origin signal SZd is performed. In addition, in the case where the scanning of the spot light SP is not performed on the continuous reflection surface RP of the polygon mirror PM but is skipped on one side, the origin signal SZ is used to perform the drawing process in a skipped (one by one) manner. The reason for the above-mentioned skip drawing process will be described in detail later.

In the above manner, after a time Tpx elapses after the origin sensor OP1 of the scanning unit U1 outputs the origin signal SZ, the control device 18 controls the beam switching member 20 in such a manner that the scanning unit U1 scans the spot light SP, and controls the light source device The 14' drive circuit 206a outputs the serial signal DL1. Moreover, the control device 18 shifts the column of the output sequence data DL1 in the column direction in the manner of the first column, the second column, the third column, the fourth column, ... every time the scanning of the scanning unit U1 starts. In addition, during the period from one scan of the spot light SP by the scanning unit U1 to the next scan, the spot light SP by other scanning units Un (scanning units U2 to U6) is sequentially scanned. The scanning of the spot light SP by the other scanning units Un (U2~U6) is the same as the scanning of the scanning unit U1. In addition, the origin sensors OPn (OP1~OP6) are provided for each scanning unit Un(U1~U6).

As described above, the reflection surface RP used for the detection of the origin signal SZb of the scanning unit U1 is used to scan the spot light SP, thereby, even in the case where the angle ηj between adjacent reflection surfaces RP of the polygon mirror PM is in error It is also possible to suppress the position of the drawing start point and the drawing end point of the spot light SP drawn by the reflection surfaces RP (RPa~RPh) on the illuminated surface of the substrate FS from shifting in the main scanning direction.

For this reason, the time Tpx at which the polygon mirror PM rotates 45 degrees must be correct in the order of μ seconds, that is, the speed of the polygon mirror PM must rotate uniformly and precisely at an equal speed. As described above, in the case where the polygon mirror PM is precisely rotated at an equal speed, the reflection surface RP used for the generation of the origin signal SZ is always an angle that correctly rotates only 45 degrees after the time Tpx to reflect the light beam LB1 toward the fθ lens FT . Therefore, by improving the rotational isokinetics of the rotating polygonal mirror PM, the speed unevenness in one rotation is also reduced as much as possible, so that the position of the reflecting surface RP used for generating the origin signal SZ and the light beam LB1 can be deflected so that The position of the reflective surface RP used for the spot light SP scanning is different. That is, since the origin signal SZ is generated with a timing delay time Tpx, the result has the same effect as the origin signal SZ detected using the reflection surface RP that performs scanning of the spot light SP. Thereby, the degree of freedom of the configuration of the origin sensor OP1 (OPn) can be improved, and the origin sensor with a high rigidity and a stable structure can be provided. In addition, although the reflection surface RP as the detection target of the origin sensor OP1 (OPn) is one before the rotation direction of the reflection surface RP that deflects the light beam LB1 (LBn), as long as it is before the rotation direction of the polygon mirror PM Yes, not limited to the previous one. In this case, let the reflection surface RP that is the detection target of the origin sensor OP be n (an integer greater than 1) before the rotation direction of the reflection surface RP that deflects the light beam LB1 (LBn), as long as the origin signal SZ It is sufficient to set the drawing start point after n×time Tpx after generation.

In addition, for each of the origin signals SZb, SZd, ... generated from the origin sensor OP1 (OPn) one by one, the drawing start point is set after n×time Tpx, thereby generating a corresponding line for each drawing generously Processing time of SL1 drawing data reading operation, data transmission (communication) operation, or correction calculation, etc. Therefore, the transmission error of the pixel data row, the error of the pixel data row, or a part of the disappearance can be reliably avoided.

In addition, as shown in FIG. 29 described above, it is not necessary to provide a reflection surface RP adjacent to the reflection surface RP that detects and then performs scanning of the spot light SP (deflection of the light beam LB1) (in the fourth embodiment, before the rotation direction of the polygon mirror PM An origin sensor OPn of a reflection surface RP) is provided with an origin sensor that detects the reflection surface RP which is the same as the reflection surface RP of the scanning of the spot light SP (deflection of the light beam LB1). In this case, as illustrated in FIG. 30, since the time interval deviation of the origin signal (pulse-like) SZ generated on each reflection surface RPa~RPh of the polygon mirror PM, the time corresponding to the deviation amount must be added to each reflection surface RPa~RPh Offset.

Here, as illustrated in FIG. 7, when the reflection surface RP of the polygon mirror PM is eight, and the maximum scanning angle range α is 15 degrees, the scanning efficiency (α/β) becomes 1/3. For example, during the period from the scanning unit U1 scanning the spot light SP to the next scanning, the light beam LBn can be distributed to two scanning units Un other than the scanning unit U1 to perform the scanning of the spot light SP. That is, while the polygon mirror PM of the scanning unit U1 rotates by one side, the corresponding light beam LBn can be distributed to each of the three scanning units Un including the scanning unit U1 to scan the spot light SP.

However, since the scanning efficiency of the polygon mirror PM is 1/3, in the case where each scanning unit Un scans the spot light SP within the maximum scanning rotation angle range α (15 degrees), the polygon mirror of the scanning unit U1 rotates the reflection surface RP During one side (β=45 degrees), the light beam LBn cannot be distributed to three or more scanning units Un (U2 to U6) other than the scanning unit U1. That is, from the start of the scanning of the spot light SP of the scanning unit U1 to the start of the next scanning of the spot light SP, the light beam LBn cannot be distributed to three or more scanning units Un (U2 to U6) other than the scanning unit U1. Therefore, in order to distribute the light beam LBn to each of the other five scanning units Un (U2~U6) to scan the spot light SP from the start of the scanning of the spot light SP of the scanning unit U1 to the start of the next scan, consider The following method.

Even in the case where the maximum scan rotation angle range α is 15 degrees, the scan rotation angle range α′ of the polygon mirror PM that can actually be scanned by the spot light SP is set to be larger than the maximum scan rotation angle range α (α=15 degrees) small. Specifically, during the period when each polygon mirror PM of the scanning unit Un (U1 to U6) rotates one surface (β=45 degrees) of the reflection surface RP, the number of scanning units that want to distribute the light beam LBn is six, so the scanning The rotation angle range α'is α'=45/6=7.5 degrees. That is, the oscillation angle centered on the optical axis AXf of the light beam LBn incident on the fθ lens FT in FIG. 28 is limited to ±7.5 degrees. Thereby, during the period when the polygon mirror PM of each scanning unit Un rotates by 45 degrees (the period during which one of the reflection surfaces RP is rotated), the light beam LBn can be sequentially distributed to enter any one of the six scanning units Un (U1 to U6) , Scanning unit Un (U1~U6) can scan the spot light SP in sequence. However, if this is the case, the scanning rotation angle range α′ of the scannable spot light SP becomes too small, and the maximum scan range length of the spot light SP scan, that is, the maximum scan length of the drawing line SLn becomes too short problem. In order to avoid the above problem, the fθ lens FT with a long focal distance is prepared in such a way that the maximum scanning length of the spot light SP scan does not change, and the distance (actuation distance) from the reflection surface RP of the polygon mirror PM to the fθ lens FT is set to be longer. In this case, there is also a concern that the stability of the beam scanning may be reduced due to the larger fθ lens FT, the larger Xt dimension of the scanning unit Un (U1~U6) and the longer actuation distance.

On the other hand, it may be considered to reduce the number of reflection surfaces RP of the polygon mirror PM and increase the rotation angle β of one of the surfaces of the rotation reflection surface RP of the polygon mirror PM. In this case, while the drawing line SLn becomes shorter or the scanning unit Un (U1 to U6) becomes larger, the polygon mirror PM of the scanning unit Un (U1 to U6) rotates one of the reflection surfaces RP (rotation angle β) , Distribute the light beam LBn, and the six scanning units Un (U1~U6) sequentially scan the spot light SP. For example, when the number of reflecting surfaces RP of the polygon mirror PM is four, that is, the shape of the polygon mirror PM is square, the rotation angle β of one surface of the polygon mirror PM rotating the reflecting surface RP becomes 90 degrees. Therefore, during the period when the polygon mirror PM of the scanning unit U1 rotates one of the reflection surfaces RP, the light beam LBn is distributed and the spot light SP is scanned by the six scanning units Un (U1 to U6). In fact, the spot light SP The scan rotation angle range α′ of the scanable polygon mirror PM becomes α′=90/6=15 degrees, which is equal to the above-mentioned maximum scan rotation angle range α.

However, if a polygonal mirror PM with a small number of reflective surfaces Np, such as triangles or squares, is rotated at high speed, the air resistance (air resistance) becomes too large, and the rotation speed and the number of rotations decrease (regularly). For example, even in the case where the polygonal mirror PM is to be rotated at a high speed of tens of thousands of rpm (rotation per minute), the rotation speed is reduced by 20% to 30% due to the air resistance, and the desired high speed rotation speed and high rotation number cannot be obtained. In addition, a method of increasing the outer dimension of the polygon mirror PM is also considered, but the weight of the polygon mirror PM becomes too large, and the desired high-speed rotation speed and high rotation number cannot be obtained. In addition, as a method of reducing the wind resistance during rotation even if the number of reflecting surfaces Np of the polygon mirror PM is reduced, it may be considered to install the entire polygon mirror PM in a vacuum environment or an environment with a gas (helium, etc.) having a smaller molecular weight than air. . In this case, an airtight structure for manufacturing the above environment is provided around the polygon mirror PM, and accordingly the scanning units Un (U1 to U6) become larger.

Therefore, in the fourth embodiment, a polygonal mirror PM with a large number of reflecting surfaces Np, that is, an octagonal shape that is closer to a circle is used, and at the same time, a polygonal mirror PM that can actually scan the spot light SP The scan rotation angle range α′ is the maximum scan rotation angle range α (α=15 degrees), and the reflection surface RP of the polygon mirror PM that performs the scanning of the spot light SP (the deviation of the light beam LBn) is set to be separated by one. That is, the scanning of the spot light SP by each scanning unit Un (U1 to U6) is repeated on every other surface (skip side) of the reflective surface RP of the polygon mirror PM. Therefore, during the period that the scanning unit U1 scans the spot light SP to the next scan, the light beams LB2~LB6 can be sequentially distributed to each of the five scanning units U2~U6 other than the scanning unit U1 to perform the spot light SP scanning. That is, by distributing the light beams LB1~LB6 to the six scanning units Un(U1~U6) while the polygon mirror PM of the one scanning unit Un paying attention to the six scanning units Un(U1~U6) rotates on both sides Each of the six scanning units Un (U1~U6) can scan the spot light SP. In this case, before each scanning unit Un (U1 to U6) starts scanning of the spot light SP to start scanning of the next spot light SP, the polygon mirror PM becomes a two-sided rotation (90 degrees). In order to perform the above-described drawing operation, the polygon mirrors PM of each of the six scanning units Un (U1 to U6) are synchronously controlled so that the rotational speed becomes the same, and the angular positions of the reflection surfaces RP of the polygon mirrors PM are synchronously controlled to become predetermined Phase relationship.

In addition, since the reflection surface RP of the polygon mirror PM performing the scanning of the spot light SP (the deviation of the light beam LBn) is separated by one surface, during the period when the polygon mirror PM of each scanning unit Un (U1 to U6) rotates once, along the The number of scans of the spot light SP of each of the drawing lines SLn (SL1 to SL6) becomes four. Therefore, compared with the scanning of the spot light SP (the deviation of the light beam LBn) on the continuous reflection surface RP of the polygon mirror PM, that is, the case where each reflection surface RP of the polygon mirror PM is performed, the number of lines SLn is drawn Since it becomes half, it is preferable that the transfer speed of the substrate FS is also reduced to half. In order not to reduce the transfer speed of the substrate FS by half, the rotation speed and the oscillation frequency Fs of the polygon mirror PM of each scanning unit Un (U1 to U6) are doubled. For example, when the continuous reflection surface RP of the polygon mirror PM repeatedly scans the spot light SP (the deviation of the light beam LBn), the rotation speed of the polygon mirror PM is 20,000 rpm, and the oscillation frequency Fs of the light beam LB from the light source device 14' is In the case of 200 MHz, the rotation speed of the polygon mirror PM is set to 40,000 rpm, and the light beam LB from the light source device 14 ′ is set to the rotation speed of the polygon mirror PM at every other reflection surface RP of the polygon mirror PM (the deviation of the light beam LBn). The oscillation frequency Fs is set to 400MHz.

Here, the control device 18 manages which one of the plurality of scanning units Un (U1 to U6) performs scanning of the spot light SP according to the origin signal SZ. However, the origin sensor OPn of each scanning unit Un (U1~U6) generates the origin signal SZ after each reflection surface RP becomes a predetermined angular position, so if the origin signal SZ is directly used, the control device 18 determines Each scanning unit Un (U1 to U6) scans the spot light SP on the continuous reflection surface RP. Therefore, before the scanning of the spot light SP by one scanning unit Un until the next scanning, the light beam LBn cannot be distributed to the other five scanning units Un. Therefore, in order to set the reflection surface RP of the polygon mirror PM that scans the spot light SP to be separated by one, a sub-origin signal (sub-origin pulse signal) ZP separated from the origin signal SZ must be generated. Also, as described above, the detection of the origin signal SZ is performed using the one reflection surface RP before the rotation direction of the reflection surface RP that scans (deflects) the spot light SP, so it is necessary to generate a timing delay time Tpx that causes the origin signal SZ to be generated Deputy origin signal ZP. Hereinafter, the configuration of the sub-origin generating circuit CA that generates this sub-origin signal ZP will be described.

FIG. 31 is a configuration diagram of a sub-origin generating circuit CA for generating a sub-origin signal ZP separated from the origin signal SZ so that its timing is delayed by a predetermined time Tpx. FIG. 32 is a timing chart showing the sub-origin signal ZP generated by the sub-origin generating circuit CA of FIG. 31. The secondary origin generating circuit CA has a frequency divider 330 and a delay circuit 332. The frequency divider 330 divides the frequency of the generation timing of the origin signal SZ into 1/2 and outputs it to the delay circuit 332 as the origin signal SZ'. The delay circuit 332 delays the transmitted origin signal SZ' for a time Tpx and outputs it as the secondary origin signal ZP. The secondary origin generating circuit CA is provided with a plurality of origin sensors OPn corresponding to the scanning units Un (U1 to U6).

In addition, there may be a case where CAn denotes a sub-origin generating circuit CA corresponding to the origin sensor OPn of the scanning unit Un. That is, there will be CA1 representing the secondary origin generating circuit CA corresponding to the origin sensor OP1 of the scanning unit U1, and CA2~CA6 representing the secondary origin of the origin sensors OP2~OP6 corresponding to the scanning unit U2~U6 Point generation circuit CA. In addition, there may be a case where SZn represents the origin signal SZ output from the origin sensor OPn of the scanning unit Un. That is, there will be SZ1 representing the origin signal SZ output from the origin sensor OP1 of the scanning unit U1, and SZ2~SZ6 representing the origin point output from the origin sensors OP2~OP6 of the scanning unit U2~U6 Signal SZ. In addition, there may be cases where SZn’, ZPn represent the origin signal SZ’ generated from the origin signal SZn and the secondary origin signal ZP. That is, there will be cases where SZ1', ZP1 indicate the origin signal SZ' generated according to the origin signal SZ1 and the secondary origin signal ZP. Similarly, there will be SZ2'~SZ6', ZP2~ZP6 indicating The situation of the origin signal SZ' generated by the point signals SZ2~SZ6 and the secondary origin signal ZP.

Fig. 33 is a block diagram showing the electrical structure of the exposure device EX, and Fig. 34 is a time chart showing the timing of outputting the origin signals SZ1~SZ6, the secondary origin signals ZP1~ZP6, and the sequence data DL1~DL6. The control device 18 of the exposure device EX includes a rotation control unit 350, a beam switching control unit 352, a drawing data output control unit 354, and an exposure control unit 356. In addition, the exposure device EX includes motor drive circuits Drm1 to Drm6 that drive a polygon mirror drive unit RM including a motor of each scanning unit Un (U1 to U6).

The rotation control unit 350 controls the rotation of the polygon mirror PM of each scanning unit Un (U1 to U6) by controlling the motor drive circuits Drm1 to Drm6. The rotation control unit 350 controls the motor drive circuits Drm1 to Drm6 so that the rotation angle positions of the polygon mirrors PM of the plurality of scanning units Un (U1 to U6) become a predetermined phase relationship with each other, so that the plurality of scanning units Un (U1 ~U6) The polygon mirror PM rotates synchronously. In detail, the rotation control unit 350 controls the plurality of scanning units Un in such a manner that the rotation speeds (the number of rotations) of the polygon mirrors PM of the plurality of scanning units U1 to U6 are the same with each other and the phases of the rotation angle positions of a certain angle are shifted one by one. (U1~U6) The rotation of the polygon mirror PM. In addition, reference symbols PD1 to PD6 in FIG. 33 represent control signals output from the rotation control unit 350 to the motor drive circuits Drm1 to Drm6.

In the fourth embodiment, the rotational speed Vp of the polygon mirror PM is set to 39,000 rpm (650 rps). In addition, since the number of reflection surfaces Np is set to 8, the scanning efficiency (α/β) is 1/3, and the reflection surface RP for scanning the spot light SP is separated by one surface, the rotational angle position phase between the six polygon mirrors PM The difference is the maximum scan rotation angle range α, that is, 15 degrees. The scanning of the spot light SP is performed in the order of U1→U2→...→U6. Therefore, the rotation control unit 350 controls the rotation control unit 350 synchronously in such a manner that the phases of the rotation angle positions of the polygon mirrors PM of the six scanning units U1 to U6 are sequentially shifted by 15 degrees one by one. As a result, the phase shift of the rotation angle position of the scanning unit U1 and the scanning unit U4 becomes 45 degrees corresponding to the rotation angle of exactly one side. Therefore, the phases of the rotation angle positions of the scanning unit U1 and the scanning unit U4, that is, the generation timings of the origin signals SZ1 and SZ4 may also be consistent. Similarly, the phase shifts of the rotational angle positions of the scanning unit U2 and the scanning unit U5 and the rotational angle positions of the scanning unit U3 and the scanning unit U6 become 45 degrees, so the origin signals from each of the scanning unit U2 and the scanning unit U5 The generation timing of SZ2 and SZ5 and the origin signals SZ3 and SZ6 from the scanning unit U3 and the scanning unit U6 can also be consistent on the time axis.

Specifically, the rotation control unit 350 uses the rotation of the polygon mirror PM of the scanning unit U1 and the scanning unit U4, the rotation of the polygon mirror PM of the scanning unit U2 and the scanning unit U5, and the polygon mirror PM of the scanning unit U3 and the scanning unit U6 Each rotation of the rotation becomes the first control state, and the rotation of the polygon mirror PM of each scanning unit U1 to U6 is controlled by each motor drive circuit Drm1 to Drm6. This first control state is a state where the phase difference of the winding pulse signal output when the polygon mirror PM rotates once is 0 (zero). That is, the rotation of the polygonal signal PM of the scanning unit U1 and the scanning unit U4 is controlled in such a manner that the phase difference of the rotation pulse signal output when the polygonal PM of the scanning unit U1 and the scanning unit U4 rotates once becomes 0 (zero) . Similarly, the scanning unit U2 and the scanning unit are controlled in such a manner that the phase difference of the convolution pulse signal output when the polygon mirror PM of the scanning unit U2 and the scanning unit U5 and the scanning unit U3 and the scanning unit U6 rotates once becomes 0 (zero) The rotation of the polygon mirror PM of the unit U5 and the scanning unit U3 and the scanning unit U6.

The convolution pulse signal may also be a signal output once when the origin signal SZn of the scanning unit Un is output eight times by a frequency divider (not shown). In addition, the rotation pulse signal may also be a signal output from an encoder (not shown) of the polygon mirror drive unit RM provided in each scanning unit Un (U1 to U6). The sensor for detecting the rotating pulse signal can also be located near the polygon mirror PM. In the example shown in FIG. 34, each time the origin signal SZn of the scanning unit Un is output eight times, the convolution pulse signal is output once, and a part of the origin signal SZn corresponding to the generation of the convolution pulse signal is indicated by a dotted line. In addition, if the origin signal SZ1 and the origin signal SZ4 do not consider the error of the included angle ηj between the adjacent reflection surfaces RP (for example, the reflection surface RPa and the reflection surface RPb) (see FIG. 29), the time axis All phases are consistent. Similarly, for each origin signal SZ2 and each origin signal SZ5 and each origin signal SZ3 and each origin signal SZ6, if the error of each included angle ηj between adjacent reflection surfaces RP is not taken into account (see FIG. 29), at time All phases on the axis are consistent. In addition, in FIG. 34, for convenience of explanation, it is assumed that there is no error between the angles ηj between adjacent reflection surfaces RP.

Next, while maintaining the first control state, the rotation control unit 350 shifts the phase angle of the rotation angle position of the polygon mirror PM of the scanning units U2, U5 relative to the rotation angle position of the polygon mirror PM of the scanning units U1, U4 by 15 degrees Mode, control the rotation of polygon mirror PM of scanning unit U2, U5. Similarly, while maintaining the first control state, the rotation control unit 350 shifts the phase angle of the rotation angle position of the polygon mirror PM of the scanning units U3, U6 with respect to the rotation angle position of the polygon mirror PM of the scanning units U1, U4 by 30 degrees In this way, the rotation of the polygon mirror PM of the scanning units U3 and U6 is controlled. The time for the polygon mirror PM to rotate 15 degrees (the maximum scanning time of the light beam LBn) is Ts.

Specifically, the rotation control unit 350 controls the polygon mirror PM of the scanning units U2, U5 in such a manner that the rotation pulse signals obtained by the scanning units U2, U5 are generated with respect to the delay time Ts of the rotating pulse signals obtained by the scanning units U1, U4. Rotate (refer to Figure 34). Similarly, the rotation control unit 350 controls the polygon mirror PM of the scanning units U3, U6 in such a way that the rotation pulse signals obtained by the scanning units U3, U6 are delayed by 2×Ts relative to the rotation pulse signals obtained by the scanning units U1, U4. Rotation (see Figure 34). If the rotation speed Vp of the polygon mirror PM is 39,000 rpm (650 rps), the time Ts is Ts=[1/(Vp×Np)]×(α/β)=1/(650×8×3) seconds[ About 64.1μsec]. In the above manner, by controlling the rotation of the polygon mirror PM of each scanning unit U1~U6, the spot light SP of each scanning unit U1~U6 can be scanned in a time-sharing manner in the order of U1→U2→...→U6.

The beam switching control section 352 controls the selection optical elements AOMn (AOM1 to AOM6) of the beam switching member 20, and distributes the light beam LB from the light source device 14' to six scans before one scanning unit Un starts scanning until the next scan starts Unit Un (U1~U6). Therefore, the beam switching control unit 352 repeats the scanning (deflection) of the light beam LBn of the polygon mirror PM of each scanning unit Un (U1 to U6) with respect to every other reflection surface RP of the polygon mirror PM by selecting the optical The elements AOM1 to AOM6 make any one of the light beams LB1 to LB6 generated from the light beam LB enter the scanning units Un (U1 to U6) in a time-sharing manner.

Specifically, the beam switching control unit 352 includes a secondary origin generating circuit CAn (CA1~CA6) shown in FIG. 31 that generates a secondary origin signal ZPn (ZP1~ZP6) based on the origin signal SZn (SZ1~SZ6). By generating the secondary origin signal ZPn (ZP1~ZP6) by this secondary origin generation circuit CAn (CA1~CA6), the corresponding scanning unit Un(U1~U6) generated by the secondary origin signal ZPn (ZP1~ZP6) is generated ) The optical element AOMn (AOM1~AOM6) is selected to be ON at a certain time (ON time Ton). For example, after the secondary origin signal ZP1 is generated, the optical element AOM1 for selection corresponding to the scanning unit U1 due to the secondary origin signal ZP1 is turned on at a certain time (ON time Ton). The secondary origin signal ZPn is based on the origin signal SZn output from the origin sensor OPn, and divides the frequency of the origin signal SZn into 1/2, that is, separated from one half of the origin signal SZn And the delay time Tpx. This certain time (ON time Ton) corresponds to the period from the time when the sub-origin signal ZPn is generated to the time when the sub-origin signal ZPn from the scanning unit Un that is scanned next is generated, that is, the polygon PM needs to rotate 15 degrees Time Ts. If the ON time Ton of the selection optical element AOMn is set to be longer than the time Ts, a period occurs in which two of the selection optical elements AONn are simultaneously turned ON, and the light beams LB1 to LB6 cannot be correctly introduced into the spot light SP for drawing Action scanning unit Un. Therefore, the ON time Ton is set to Ton≦Ts.

At this time, if each origin signal SZ1 and each origin signal SZ4, regardless of the error of each included angle ηj between adjacent reflecting surfaces RP (for example, reflecting surface RPa and reflecting surface RPb), all are synchronized on the time axis and set The phase of the secondary origin signal ZP1 and the secondary origin signal ZP4 are shifted by about half a period (refer to FIG. 34). The phase shift of the secondary origin signal ZP1 and the secondary origin signal ZP4 by about half of the cycle is performed by the frequency divider 330 of the secondary origin generation circuit CAn (CA1~CA6). That is, the frequency divider 330 shifts the timing separated from the origin signal SZ1 and the timing separated from the origin signal SZ4 by approximately half a cycle.

The relationship between the sub-origin signal ZP2 and the sub-origin signal ZP5 is similarly set by the frequency divider 330 so that the phases of the sub-origin signal ZP2 and the sub-origin signal ZP5 are shifted by about half a period (refer to FIG. 34). In addition, the relationship between the sub-origin signal ZP3 and the sub-origin signal ZP6 is similarly set by the frequency divider 330 so that the phases of the sub-origin signal ZP3 and the sub-origin signal ZP6 are shifted by about half a period (refer to FIG. 34).

Therefore, as shown in FIG. 34, the generation timings of the secondary origin signals ZP1~ZP6 generated by the scanning units U1~U6 are shifted one by one by the time Ts. In the fourth embodiment, the sequence of the scanning unit Un for scanning the spot light SP is U1→U2→...→U6, so the secondary origin signal ZPn generates the secondary origin after the time Ts elapses after the secondary origin signal ZP1 is generated The point signal ZP2 is also generated at the time Ts interval in the order of ZP1→ZP2→...→ZP6. Therefore, the beam switching control unit 352 controls the optical element AOMn (AOM1~AOM6) for selection of the beam switching member 20 in response to the generated secondary origin signal ZPn (ZP1~ZP6), whereby U1→U2→…→ The sequence of U6 causes the corresponding beams LB1~LB6 to enter each of the scanning units Un. That is, the scanning (deflection) of the light beam LBn by the polygon mirror PM of each scanning unit Un (U1~U6) can be switched into the time-sharing manner to switch to each time the reflection surface RP of the polygon mirror PM is repeated The light beam LBn of the scanning unit Un (U1~U6).

The drawing data output control section 354 outputs the row sequence data DLn corresponding to the pattern of one drawing line SLn scanned by the scanning unit Un by the scanning unit Un as the drawing bit row data Sdw to the driving circuit 206a of the light source device 14'. The sequence of the scanning unit Un that performs the scanning of the spot light SP is U1→U2→...→U6, so the drawing data output control unit 354 outputs a series of serial data DLn in the order of DL11→DL2→...→DL6 to repeatedly draw the bit row data Sdw.

The configuration of the drawing data output control unit 354 will be described in detail using FIG. 35. The drawing data output control section 354 has six generating circuits 360, 362, 364, 366, 368, 370 corresponding to each of the scanning units U1 to U6 and an OR circuit GT8. The generating circuits 360 to 370 have the same configuration. Specifically, the generating circuit 360 includes a memory unit BM1, a counter unit CN1, and a gate unit GT1, and the generating circuit 362 includes a memory unit BM2, a counter unit CN2, and a gate unit GT2. The generating circuit 364 includes a memory unit BM3, a counter unit CN3, and a gate unit GT3, and the generating circuit 366 includes a memory unit BM4, a counter unit CN4, and a gate unit GT4. The generating circuit 368 includes a memory unit BM5, a counter unit CN5, and a gate unit GT5. The generating circuit 370 includes a memory unit BM6, a counter unit CN6, and a gate unit GT6. The configuration of the generating circuits 360 to 370 may be the same as the generating circuits 301, 303, and 305 shown in FIG.

The memory parts BM1~BM6 are memories for storing pattern data (bitmap data) corresponding to the patterns to be drawn by each scanning unit Un (U1~U6). The counter sections CN1~CN6 are counters that output the sequence data DL1~DL6 stored in the pattern data of each memory section BM1~BM6 and then one drawing line SLn to be synchronized with the clock signal CLK pixel by pixel. As shown in FIG. 34, the counter parts CN1 to CN6 output the sub-origin signals ZP1 to ZP6 from the sub-origin generating circuits CA1 to CA6 of the beam switching control part 352, and then output a sequence of data DL1 to DL6.

The map data stored in each memory part BM1~BM6 is shifted in the column direction by the output sequence data DL1~DL6 by an unillustrated address counter or the like. That is, the column read by the address counter (not shown) is shifted in the manner of the first column, the second column, the third column,... This offset, for example, if it corresponds to the memory portion BM1 of the scanning unit U1, after the output of the sequence data DL1 is completed, corresponds to the timing of the generation of the secondary origin signal ZP2 of the scanning unit U2 that is to be scanned next. Similarly, the offset of the sequence data DL2 of the pattern data stored in the memory portion BM2 is performed in accordance with the timing of the generation of the sub-origin signal ZP3 of the scanning unit U3 that is subsequently scanned. Similarly, the offset of the sequence data DL3~DL6 of the pattern data stored in the memory part BM3~BM6, after the output of the sequence data DL3~DL6, corresponds to the sub-origin of the scanning unit U4~U6, U1 which is then scanned The timing of signal ZP4~ZP6, ZP1 is generated. In addition, the scanning of the spot light SP is performed in the order of U1→U2→...→U6.

The sequence data DL1 to DL6 sequentially output in the above manner are applied to the 6-input OR circuit GT8 by applying the gate signals GT1 to GT6 that are opened within a certain time (ON time Ton) after applying the sub-origin signals ZP1 to ZP6. The OR circuit GT8 repeatedly outputs the sequence data DL1 → DL2 → DL3 → DL4 → DL5 → DL6 → DL1 ... in sequence and synthesizes the sequence data DLn as the drawing bit row data Sdw to the driving circuit 206a of the light source device 14'. In the above manner, each scanning unit Un (U1 to U6) can draw a pattern of exposure corresponding pattern data simultaneously with the scanning of the spot light SP.

In the fourth embodiment, pattern data is prepared for the scanning units Un (U1 to U6), and sequence data is output from the pattern data of each scanning unit Un (U1 to U6) according to the order of the scanning units Un for scanning the spot light SP DL1~DL6. However, since the order of the scanning units Un for scanning the spot light SP is determined in advance, it is also possible to prepare one pattern data after the combination of the sequence data DL1 to DL6 of the pattern data of each scanning unit Un (U1 to U6). That is, it is also possible to construct a pattern data in which the sequence data DLn (DL1 to DL6) of each row of the pattern data of each scanning unit Un (U1 to U6) are arranged according to the order of the scanning units Un to scan the spot light SP. In this case, as long as the secondary origin signal ZPn (ZP1~ZP6) based on the origin sensor OPn of each scanning unit Un (U1~U6) is output, a sequence data DLn of pattern data is sequentially output from the first row That's it.

However, the exposure control unit 356 shown in FIG. 33 controls the rotation control unit 350, the beam switching control unit 352, the drawing data output control unit 354, and the like. The exposure control unit 356 analyzes the photographic signals ig (ig1 to ig4) captured by the alignment microscope AMm (AM1 to AM4), and detects the position of the alignment marks MKm (MK1 to MK4) on the substrate FS. Next, the exposure control unit 356 detects (determines) the starting position of the drawing exposure of the exposure area W on the substrate FS based on the position of the detected alignment marks MKm (MK1 to MK4). The exposure control unit 356 includes a counter circuit 356a, and the counter circuit 356a counts the detection signals detected by the encoders EN1a to EN3a, EN1b to EN3b shown in FIG. The exposure control unit 356 is based on the count value (mark detection position) based on the encoders EN1a, EN1b when the start position of the drawing exposure is detected, and the count value based on the encoders EN2a, EN2b (the odd numbered drawing line SLn Position), to determine whether the starting position of the drawing exposure of the substrate FS is on the drawing lines SL1, SL3, SL5. If the exposure control unit 356 determines that the starting position of the drawing exposure is on the drawing lines SL1, SL3, SL5, it controls the drawing data output control unit 354 to cause the scanning units U1, U3, U5 to start scanning of the spot light SP. In addition, the rotation control unit 350 and the beam switching member 352, under the control of the exposure control unit 356, control the polygon mirror PM of each scanning unit Un (U1 to U6) according to the rotation pulse signal and the secondary origin signal ZPn (ZP1 to ZP6) The rotation and distribution of the light beam LBn by the light beam switching member 20.

The exposure control unit 356 calculates the count value (mark detection position) based on the encoders EN1a and EN1b when the start position of the drawing exposure is detected, and the count value (position of the even-numbered drawing lines) based on the encoders EN3a and EN3b ), determine whether the starting position of the drawing exposure of the substrate FS is on the drawing lines SL2, SL4, SL6. If the exposure control unit 356 determines that the start position of the drawing exposure is on the drawing lines SL2, SL4, SL6, it controls the drawing data output control unit 354 to cause the scanning units U2, U4, U6 to start scanning of the spot light SP.

As shown in FIG. 25 above, according to the transport direction (+X direction) of the substrate FS, firstly perform the drawing exposure on each of the drawing lines SL1, SL3, SL5, and after the substrate FS is transported a predetermined distance, perform the drawing on the drawing lines SL2, SL4 , SL6's individual depiction exposure. On the other hand, since the polygon mirrors PM of the six scanning units U1 to U6 maintain a certain angular phase with each other for rotation control, the secondary origin signals ZP1 to ZP6 have a phase difference of sequential time Ts as shown in FIG. 34 and continue to be generated . Therefore, during the period from the start of the drawing exposure of the drawing lines SL1, SL3, SL5 to the moment before the start of the drawing exposure of the drawing lines SL2, SL4, SL6, the sub-origin signals ZP2, ZP4, ZP6 are turned on The gate parts GT2, GT4, GT6 in Fig. 35, and the optical elements AOM2, AOM4, AOM6 for repeated selection are turned ON for a certain period of time. Therefore, in the configuration of FIG. 33, a selection gate circuit is provided in the beam switching control section 352 based on the count values of the encoders EN1a, EN1b determined by the exposure control section 356, or the calculation of the encoders EN2a, EN2b The numerical value selects whether to prohibit transmission of each of the generated sub-origin signals ZP1 to ZP6 to the drawing data output control section 354. Together, each driver circuit DRVn (DRV1~DRV6) of the selection optical elements AOM1~AOM6 corresponding to each of the scanning units U1~U6 (refer to FIG. 38) is given a sub-origin signal ZP1 through the selection gate circuit ~ZP6.

Here, as described above, since the drawing lines SL1, SL3, SL5 are located on the upstream side of the transport direction of the substrate FS from the drawing lines SL2, SL4, SL6, the starting position of the drawing exposure of the exposure area W of the substrate FS first reaches the drawing line SL1, SL3, SL5, and then at a certain time, reach the drawing lines SL2, SL4, SL6. Therefore, before the start position of the drawing exposure reaches the drawing lines SL2, SL4, SL6, only the scanning units U1, U3, U5 perform the drawing exposure of the pattern. Therefore, in the case where the selection gate circuits of the sub-origin signals ZP1 to ZP6 as described above are not provided in the beam switching control section 352, the exposure control section 356 makes the output to the driving circuit 206a of the light source device 14' Part of the pixel data corresponding to the sequence data DL2, DL4, DL6 in the drawing bit row data Sdw all becomes low "(0)", substantially canceling the drawing exposure of the scanning units U2, U4, U6. During the cancellation period, the rows of the sequence data DL2, DL4, DL6 output from the memory section BM2, BM4, BM6 will not be shifted and the first row will be maintained. Then, after the starting position of the drawing exposure of the exposure area W reaches the drawing lines SL2, SL4, SL6, the output of the sequence data DL2, DL4, DL6 is started, and the sequence data DL2, DL4, DL6 are shifted in the column direction.

Also, similarly, the end position of the drawing exposure of the exposure area W first reaches the drawing lines SL1, SL3, SL5, and then reaches the drawing lines SL2, SL4, SL6 at a certain time. Therefore, after the drawing exposure end position reaches the drawing lines SL1, SL3, SL5, and before reaching the drawing lines SL2, SL4, SL6, only the scanning units U2, U4, U6 perform the drawing exposure of the pattern. Therefore, in the case where the selection gate circuits of the secondary origin signals ZP1 to ZP6 as described above are not provided in the beam switching control section 352, the exposure control section 356 draws the output of the driving circuit 206a to the light source device 14' Part of the pixel data corresponding to the sequence data DL1, DL3, DL5 in the bit row data Sdw all becomes low "(0)", which substantially cancels the drawing exposure of the scanning units U1, U3, U5. In addition, when the selection gate circuit is not provided, the optical elements AOM1, AOM3 are selected by introducing light beams LB1, LB3, LB5 to the scanning units U1, U3, U5 whose drawing exposure is canceled, even during the drawing exposure cancellation. AOM5 repeatedly responds to the sub-origin signals ZP1, ZP3, ZP5 to selectively turn ON at a certain time.

As described above, in the fourth embodiment, the beam switching control unit 352 repeats the scanning (deflection) of the polygon mirror PM on every other reflection surface RP of the polygon mirror PM of each scanning unit Un (U1 to U6). The beam switching member 20 is controlled so that each of the plurality of scanning units Un (U1 to U6) sequentially performs one-dimensional scanning of the spot light SP. Thus, without shortening the length of the drawing line SLn (SL1 to SL6) scanned by the spot light SP, one light beam LB can be distributed to the plurality of scanning units Un (U1 to U6), and the light beam LB can be effectively used. In addition, since the shape of the polygon mirror PM (polygonal shape) can be made close to a circle, the rotation speed of the polygon mirror PM can be prevented from decreasing, and the polygon mirror PM can be rotated at high speed.

The beam switching member 20 has a selection optical element AOMn (AOM1~AOM6). The selection optical element AOMn(AOM1~AOM6) is arranged in parallel along the traveling direction of the light beam LB from the light source device 14', and the light beam is selected Any one of the n light beams LBn after the LB diffraction is deflected is introduced into the corresponding scanning unit Un. Therefore, it is possible to simply select any one of the scanning units Un (U1 to U6) where the light beam LBn is to be incident, so that the light beam LB from the light source device 14' is effectively concentrated on the one scanning unit Un to be exposed for exposure, and a high exposure amount is obtained . For example, a plurality of beam splitters are used to divide the light beam LB emitted from the light source device 14' into six amplitudes, and each of the six divided light beams LBn (LB1~LB6) is transmitted through the sequence data DL1~DL6 of the drawing data. In the case where the acousto-optic modulating element for modulation drawing leads to the six scanning units U1~U6, if the attenuation of the beam intensity of the acousto-optic modulating element for drawing is 20%, the intensity of the beam in the scanning unit Un When the attenuation is 30%, the intensity of the spot light SP of a scanning unit Un will be approximately 9.3% when the intensity of the original light beam LB is set to 100%. On the other hand, as in the fourth embodiment, when the optical element AONn for selection is used to deflect the light beam LB from the light source device 14' to be incident on any of the six scanning units Un, it is provided in the optical element for selection When the attenuation of the beam intensity of AOMn is 20%, the intensity of the spot light SP in one scanning unit Un becomes about 56% of the intensity of the original beam LB.

The rotation control unit 350 controls the rotation of the polygon mirror PM of the plurality of scanning units Un (U1 to U6) in such a manner that the rotation speeds are the same and the phases of the rotation angle positions are shifted by a certain angle one by one. In this way, between the one-dimensional scanning of the spot light SP performed by one scanning unit Un and the time before the next one-dimensional scanning is performed, the one-dimensional scanning of the spot light SP performed by the plurality of other scanning units Un can be sequentially performed.

In the fourth embodiment described above, although one beam LB is distributed to six scanning units Un, one beam LB from the light source device 14' may be distributed to nine scanning units Un(U1~ U9). In this case, if the scanning efficiency (α/β) of the polygon mirror PM is set to 1/3, the light beam LBn can be distributed to the nine scanning units U1 to U9 while the polygon mirror PM rotates three reflection surfaces RP. The scanning of the spot light SP is performed every two reflection surfaces RP. Thereby, from the scanning of the spot light SP by one scanning unit Un to the scanning of the next spot light SP, the other eight scanning units Un can be sequentially scanned by the spot light SP. In addition, if the scanning efficiency of the polygon mirror PM is set to 1/3, the polygon mirror PM rotates three reflection surfaces RP, and a light beam LB can be distributed to the nine scanning units Un, so the frequency divider of the secondary origin generating circuit CAn 330 divides the frequency of the timing of generating the origin signal SZn into 1/3. In this case, the rotating pulse signals of the scanning units U1, U4, U7 are synchronized (the same phase on the time axis). Similarly, the rotation pulse signals of the scanning units U2, U5, U8 are synchronized, and the rotation pulse signals of the scanning units U3, U6, U9 are synchronized. In addition, the rotation pulse signals of the scanning units U2, U5, U8 are generated with respect to the rotation pulse signal delay time Ts of the scanning units U1, U4, U7, and the rotation pulse signals of the scanning units U3, U6, U9 are relative to the scanning units U1, U4, The convolution pulse signal of U7 is generated with a delay of 2×time Ts. In addition, the generation timing of the secondary origin signals ZP1, ZP4, ZP7 of the scanning units U1, U4, U7 are staggered one-third of the phase of one cycle. Similarly, the secondary origin signals ZP2 of the scanning units U2, U5, U8, The timing of generating ZP5, ZP8 and the timing of generating the secondary origin signals ZP3, ZP6, and ZP9 of the scanning units U3, U6, U9 are also staggered one-third of the phase of one cycle. In addition, the time Ts is the time when the polygonal mirror PM rotates to scan the spot light SP and the polygonal mirror PM has a scanning rotation angle range α′. The angle β of the polygonal mirror PM rotating a reflection surface RP times the scanning efficiency becomes the scan Rotation angle range α'.

The scanning efficiency of the polygon mirror PM is 1/3. When one beam LB is distributed to the twelve scanning units Un (U1~U12), the beam LBn can be distributed to Twelve scanning units U1 to U12, so the scanning of the spot light SP is performed every three reflection surfaces RP. In addition, if the scanning efficiency of the polygon mirror PM is set to 1/3, the polygon mirror PM rotates the four reflection surfaces RP, and the twelve selection optical elements AOMn (AOM1 to AOM12) arranged in line can be brought from the light source device 14 The beam LB of the alternative beam LBn (LB1~LB12) is incident on a corresponding scanning unit Un (U1~U12), so the frequency divider 330 of the sub-origin generating circuit CAn will generate the timing of the origin signal SZn The frequency is divided into 1/4. In this case, the rotating pulse signals of the scanning units U1, U4, U7, U10 are synchronized (the same phase on the time axis). Similarly, the rotation pulse signals of the scanning units U2, U5, U8, U11 are synchronized, and the rotation pulse signals of the scanning units U3, U6, U9, U12 are synchronized. In addition, the rotation pulse signals of the scanning units U2, U5, U8, U11 are generated relative to the rotation pulse signal delay time Ts of the scanning units U1, U4, U7, U10, and the rotation pulse signals of the scanning units U3, U6, U9, U12 are relative to The rotating pulse signals of the scanning units U1, U4, U7, U10 are generated with a delay of 2×time Ts. In addition, the generation timing of the secondary origin signals ZP1, ZP4, ZP7, ZP10 of the scanning units U1, U4, U7, U10 are staggered one by one 1/4 phase of one cycle. Similarly, the scanning units U2, U5, U8, U11 The timing of generating the secondary origin signals ZP2, ZP5, ZP8, ZP11 and the timing of generating the secondary origin signals ZP3, ZP6, ZP9, ZP12 of the scanning units U3, U6, U9, U12 are also staggered by 1/4 phase of one cycle one by one.

In addition, in the fourth embodiment described above, although the scanning efficiency of the polygon mirror PM of the scanning unit Un is 1/3, the scanning efficiency may be 1/2 or 1/4. When the scanning efficiency is 1/2, while the polygon mirror PM rotates one reflection surface RP, the light beam LBn can be distributed to the two scanning units Un, so when one beam LBn is to be distributed to the six scanning units Un, the spot light The scanning of SP becomes every two reflection surfaces RP of the polygon mirror PM. That is, in the case where the scanning efficiency of the polygon mirror PM is 1/2, while the polygon mirror PM rotates three reflection surfaces RP, the light beam LBn can be distributed to the six scanning units Un. Thereby, before the scanning of the spot light SP by one scanning unit Un to the scanning of the next spot light SP, the other five scanning units Un can be sequentially scanned by the spot light SP. In addition, if the scanning efficiency of the polygon mirror PM is set to 1/2, the polygon mirror PM rotates three reflection surfaces RP, and one beam LB can be distributed to the six scanning units Un, so the frequency divider of the secondary origin generating circuit CAn 330 divides the frequency of the timing of generating the origin signal SZn into 1/3. In this case, the rotating pulse signals of the scanning units U1, U3, U5 are synchronized. Similarly, the scanning pulse signals of the scanning units U2, U4, U6 are synchronized. In addition, the convolution pulse signals of the scanning units U2, U4, U6 are generated with respect to the convolution pulse signals of the scanning units U1, U3, U5 with a delay time Ts. In addition, the generation timing of the secondary origin signals ZP1, ZP3, ZP5 of the scanning units U1, U3, U5 are staggered one-third of the phase of one cycle, and the secondary origin signals ZP2, ZP4, ZP6 of the scanning units U2, U4, U6 The generation timing is also staggered one-third of one cycle.

When the scanning efficiency of the polygon mirror PM is 1/4, while the polygon mirror PM rotates one reflection surface RP, the light beam LBn can be distributed to four scanning units Un, so one beam LB is to be distributed to eight scanning units Un At this time, the scanning of the spot light SP is performed on every other reflecting surface RP of the polygon mirror PM. That is, when the scanning efficiency of the polygon mirror PM is 1/4, the light beam LBn can be distributed to the eight scanning units Un while the polygon mirror PM rotates the two reflection surfaces RP. Thereby, before the scanning of the spot light SP by one scanning unit Un to the scanning of the next spot light SP, the other seven scanning units Un can be sequentially scanned by the spot light SP. In addition, if the scanning efficiency of the polygon mirror PM is set to 1/4, the polygon mirror PM rotates two reflection surfaces RP, and one beam LB can be distributed to the eight scanning units Un, so the frequency divider of the sub-origin generating circuit CAn 330 Divide the frequency of the timing of generating the origin signal SZn into 1/2. In this case, the rotation pulse signals of the scanning units U1 and U5 are synchronized, and the rotation pulse signals of the scanning units U2 and U6 are synchronized. Similarly, the rotating pulse signals of the scanning units U3 and U7 are synchronized, and the rotating pulse signals of the scanning units U4 and U8 are synchronized. In addition, the convolution pulse signals of the scanning units U2 and U6 are generated with respect to the convolution pulse signals of the scanning units U1 and U5 with a delay time Ts. The rotation pulse signals of the scanning units U3 and U7 are generated with respect to the rotation pulse signals of the scanning units U1 and U5 with a delay time of 2×Ts, and the rotation pulse signals of the scanning units U4 and U8 are delayed with respect to the rotation pulse signals of the scanning units U1 and U5 by 3 ×Ts generated. In addition, the timing of generating the secondary origin signals ZP1 and ZP5 of the scanning units U1 and U5 are shifted one-by-one by one-half of a cycle, and the timing of generating the secondary origin signals ZP2 and ZP6 of the scanning units U2 and U6 are also shifted by one cycle 1/2 phase. Similarly, the timing of generating the secondary origin signals ZP3, ZP7 of the scanning units U3, U7 and the timing of generating the secondary origin signals ZP4, ZP8 of the scanning units U4, U8 are also shifted by 1/2 phase of one cycle respectively.

In addition, in the fourth embodiment described above, although the shape of the polygon mirror PM is octagonal (eight reflection surfaces RP are eight), it may be hexagonal, heptagonal, or more than a pentagonal. With this, the scanning efficiency of the polygon mirror PM also changes. Generally speaking, the more the number of reflecting surfaces Np of the polygon mirror PM, the greater the scanning efficiency of one reflecting surface RP of the polygon mirror PM, and the smaller the number of reflecting surfaces Np, the scanning efficiency of the polygon mirror PM The smaller.

The maximum scanning rotation angle range α of the polygon mirror PM that can project and scan the spot light SP on the substrate FS is the angle of incidence of the fθ lens FT (equivalent to the angle θs in FIG. 32), so the most appropriate angle of incidence can be selected The reflection surface number Np is the polygon mirror PM. As in the above example, in the case of an fθ lens FT with an incident angle (θs) less than 30 degrees, it can also be a twenty-four polygon mirror PM whose reflection surface RP changes at a rotation of 15 degrees of its half, or the reflection surface RP is at Twelve-sided polygon mirror PM with 30 degree rotation change. In this case, in the twenty-four polygon mirror PM, the scanning efficiency (α/β) is greater than 1/2 and less than 1.0, so the twenty-four polygon mirror of each of the six scanning units U1 to U6 PM skips the five sides to control the scanning mode of the spot light SP. In addition, in the twelve-sided polygon mirror PM, the scanning efficiency is greater than 1/3 and less than 1/2, so the twelve-sided polygon mirror PM of each of the six scanning units U1 to U6 skips the two sides Control the scanning mode of spot light SP.

(Fifth Embodiment) In the fourth embodiment described above, the scanning (deflection) of the spot light SP is repeated on every other reflection surface RP of the polygon mirror PM. However, in the fifth embodiment, the scanning (deflection) of the spot light SP can be arbitrarily switched to the first state where the continuous reflection surface RP of the polygon mirror PM is repeated, and the second state is repeated for every other reflection surface RP of the polygon mirror PM status. That is, the scanning unit U1 starts scanning of the spot light SP until the start of the next scanning, and can switch to distribute the light beam LB to the three scanning units Un in a time-sharing manner and to the six scanning units Un in a time-sharing manner.

Since the scanning efficiency of the polygon mirror PM is 1/3, the scanning of the spot light SP is repeated by the continuous reflection surface RP of the polygon mirror PM. For example, the scanning unit U1 scans the spot light SP to the next scan. During this period, only the light beam LB can be distributed to the two scanning units Un other than the scanning unit U1. Therefore, two light beams LB are prepared, the first light beam LB is distributed to the three scanning units Un in a time-sharing manner, and the second light beam LB is distributed to the remaining three scanning units Un in a time-sharing manner. Therefore, the scanning of the spot light SP is performed by the two scanning units Un in parallel. It is also possible to generate two light beams LB by arranging two light source devices 14', or to split the light beam LB from one light source device 14' by a beam splitter or the like to generate two light beams LB. The exposure apparatus EX of the fifth embodiment shown in FIGS. 36 to 40 includes two light source devices 14' (14A', 14B') (see FIG. 38). In addition, in the fifth embodiment, the same reference numerals are given to the same configuration as the fourth embodiment described above, and only the different parts will be described.

Fig. 36 is a configuration diagram of a beam switching member (beam distribution unit) 20A of the fifth embodiment. The beam switching member 20A, like the beam switching member 20 of FIG. 26, has a plurality of selection optical elements AOMn (AOM1 to AOM6), a plurality of condenser lenses CD1 to CD6, a plurality of mirrors M1 to M12, and a plurality of reflections The mirrors IM1~IM6, and a plurality of collimating mirrors CL1~CL6, in addition, have mirrors M13, M14 and absorbers TR1, TR2. In addition, the absorber TR1 corresponds to the absorber TR of FIG. 26 shown in the fourth embodiment described above, and absorbs the light beam LB reflected by the mirror M12.

The optical elements AOM1 to AOM3 for selection constitute the optical element module (first optical element module) OM1, and the optical elements AOM4 to AOM6 for selection constitute the optical element module (second optical element module) OM2. The selection optical elements AOM1 to AOM3 of the first optical element module OM1 are in a state of being arranged in line along the traveling direction of the light beam LB as described in the fourth embodiment described above. Similarly, the selection optical elements AOM4 to AOM6 of the second optical element module OM2 are also arranged in a line along the traveling direction of the light beam LB. In addition, the scanning units U1 to U3 corresponding to the selection optical elements AOM1 to AOM3 corresponding to the first optical element module OM1 are set as the first scanning module. In addition, the scanning units U4 to U6 of the selection optical elements AOM4 to AOM6 corresponding to the second optical element module OM2 are set as the second scanning module. The scanning units U1 to U3 of the first scanning module and the scanning units U4 to U6 of the second scanning module are arranged in a predetermined arrangement relationship as described in the fourth embodiment above.

In the fifth embodiment, the mirrors M6, M13, and M14 constitute an arrangement switching member (movable member) SWE in the traveling direction of the light beam LB, and the arrangement switching member (movable member) SWE switches the first optical element module OM1 and the second optical The first arrangement state in which the element modules OM2 are arranged in parallel, and the second arrangement state in which the first optical element modules OM1 and the second optical element modules OM2 are arranged in line. The configuration switching member SWE has a sliding member SE that supports the mirrors M6, M13, and M14. The sliding member SE can move in the X direction relative to the supporting member IUB. The movement of the sliding member SE (configuration switching member SWE) in the X direction is performed by an actuator AC (refer to FIG. 38). This actuator AC is driven by the control of the drive control section 352a (see FIG. 38) of the beam switching member 352.

In the first arrangement state, the light beam LB from the two light source devices 14' (14A', 14B') enters the first optical element module OM1 and the second optical element module OM2 in parallel. In the second arrangement state, the light beam LB from one light source device 14' (14A') enters the first optical element module OM1 and the second optical element module OM2. That is, in the second arrangement state, the light beam LB transmitted through the first optical element module OM1 enters the second optical element module OM2. FIG. 36 shows a state where the second switching state in which the first optical element module OM1 and the second optical element module OM2 are arranged in line by the arrangement switching member SWE. That is, in the second arrangement state, all the selection optical elements AOM1 to AOM6 of the first optical element module OM1 and the second optical element module OM2 are arranged in parallel along the traveling direction of the light beam LB, and Fig. 26 shown in the fourth embodiment is the same. Therefore, as in the fourth embodiment described above, the optical elements for selection AOMn (AOM1 to AOM6) of the first optical element module OM1 and the second optical element module OM2 arranged in line can be selected from the first scanning module In the second scanning module (U1~U6), select any scanning unit Un where any deflected light beam LBn enters. In addition, the position where the arrangement switching member SWE in FIG. 36 is referred to as the second position. In the first arrangement state, the light beam LB incident on the first optical element module OM1 (AOM1~AOM3) is referred to as the light beam LBa from the first light source device 14A', and in the first arrangement state, it will be incident The light beam of the second optical element module OM2 (AOM4~AOM6) is called the light beam LBb from the second light source device 14B'.

After the arrangement switching member SWE moves to the -X direction side to the first position, the first optical element module OM1 and the second optical element module OM2 are placed in the first arrangement state of the parallel arrangement. FIG. 37 is a diagram showing the optical paths of the light beams LBa and LBb when the position where the switching member SWE is arranged becomes the first position. In the first arrangement state, the light beam LBa enters the first optical element module OM1, and the light beam LBb enters the second optical element module OM2. In order to distinguish the light beam LB incident on each of the first optical element module OM1 and the second optical element module OM2, the light beam LB incident on the first optical element module OM1 is represented by LBa, and the second optics is directly incident on LBb Beam LB of component module OM2.

As shown in FIG. 37, after the arrangement switching member SWE moves to the first position, the position of the mirror M6 shifts to the -X direction, so the light beam LBa reflected by the mirror M6 does not enter the mirror M7 but enters the absorber TR2. Therefore, the light beam LBa from the first light source device 14A' entering the first optical element module OM1 only enters the first optical element module OM1 (selection optical elements AOM1 to AOM3), and does not enter the second optical element Component module OM2. That is, the light beam LBa can only pass through the selection optical elements AOM1 to AOM3. Further, after the position where the switching member SWE is arranged becomes the first position, the light beam LBb emitted from the second light source device 14B' and traveling in the +Y direction toward the mirror M13 is guided to the mirror M7 by the mirrors M13 and M14. Therefore, the light beam LBb can only pass through the second optical element module OM2 (selection optical elements AOM4 to AOM6).

Therefore, the first optical element module OM1 can make any one of the light beams LB1 to LB3 deflected from the light beam LBa enter the three scans constituting the first scan module by the three selection optical elements AOM1 to AOM3 arranged in line One of the units U1~U3. In addition, the second optical element module OM2 can make any one of the light beams LB4 to LB6 deflected from the light beam LBb enter the three scanning units constituting the second scanning module by three in-line arranged optical elements AOM4 to AOM6 One of U4~U6. Therefore, by arranging the first optical element module OM1 (selection optical elements AOM1~AOM3) and the second optical element module OM2 (selection optical elements AOM4~AOM6) in parallel, the first scanning module ( U1~U3) and the second scanning module (U4~U6) respectively select a scanning unit Un into which the light beam LB enters. In this case, any scanning unit Un of the first scanning module and any scanning unit Un of the second scanning module perform the exposure operation of scanning along the drawing line SLn of the spot light SP in parallel.

The beam switching control section 352 controls the actuator AC to arrange the switching member SWE when the first state (first drawing mode) of the continuous reflection surface RP of the polygon mirror PM is repeated by the scanning (deflection) of the spot light SP In position 1. In addition, the beam switching control unit 352 controls the actuator AC to arrange the arrangement switching member SWE at the second position when the second state (second drawing mode) of every other reflection surface RP of the polygon mirror PM is repeated.

FIG. 38 is a diagram showing the configuration of the optical path switching control unit 352 of the fifth embodiment. In FIG. 38, the selection optical elements AOM1 to AOM6 and the light source devices 14' (14A', 14B') as the control targets of the optical path switching control section 352 are also shown. 14A' indicates the light source device 14' that enters the light beam LBa from the first optical element module OM1, and 14B' indicates the light source device 14' that directly enters the light beam LBb from the second optical element module OM2.

When the configuration switching member SWE is in the second position, as shown in FIG. 38, the light beam LBa (LB) from the light source device 14A' can pass (transmitted) the selection optical element in the order of AOM1→AOM2→AOM3→...→AOM6 AOMn enters the absorber TR1 through the light beam LBa of the selective optical element AOM6. After the arrangement switching member SWE is moved to the first position, the light beam LBa can pass from the light source device 14A' in the order of AOM1→AOM2→AOM3 through the selection optical element AOMn, and the light beam LBa through the selection optical element AOM3 enters the absorber TR2 . Furthermore, in a state where the arrangement switching member SWE is moved to the first position, the light beam LBb from the light source device 14B′ can pass through the selection optical element AOMn in the order of AOM4→AOM5→AOM6, and the light beam LB from the selection optical element AOM6入absorbing body TR1. In addition, the configuration switching member SWE of FIG. 38 is a conceptual diagram, which is different from the actual configuration of the configuration switching member SWE shown in FIGS. 36 and 37. In the example shown in FIG. 38, the arrangement switching member SWE is located at the second position, that is, in the second arrangement state in which the first optical element module OM1 and the second optical element module OM2 are arranged in line, indicating that the optical element for selection AOM5 In the ON state. Thereby, the light beam LBa from the light source device 14A' is incident on the scanning unit U5 by the deflecting light beam LB5.

The beam switching control unit 352 has a driver circuit DRVn (DRV1~DRV6) that drives each of the selection optical elements AOM1~AOM6 with an ultrasonic (high frequency) signal, and senses the origin based on the scanning unit Un(U1~U6) The origin signal SZn (SZ1~SZ6) of the OPn generates the secondary origin signal circuit CAan (CAa1~CAa6) of the secondary origin signal ZPn (ZP1~ZP6). The exposure control unit 356 transmits information to the driver circuit DRVn (DRV1 to DRV6) to receive the sub-origin signal ZPn (ZP1 to ZP6) for a certain period of time to turn ON the selection optical elements AOM1 to AOM6 to the ON time Ton. The driver circuit DRV1, after the sub-origin signal ZP1 is transmitted from the sub-origin generating circuit CAa1, turns the selection optical element AOM1 into the ON state at the ON time Ton. Similarly, the driver circuits DRV2 to DRV6, after the sub-origin signals ZP2 to ZP6 are transmitted from the sub-origin generating circuits CAa2 to CAa6, turn on the selection optical elements AOM2 to AOM6 at the ON time Ton. The exposure control unit 356 changes the length of the ON time Ton correspondingly when the rotation speed of the polygon mirror PM is changed. In addition, the driver circuits DRVn (DRV1 to DRV6) are similarly provided in the beam switching control unit 352 of FIG. 33 of the fourth embodiment described above.

The secondary origin generating circuit CAan (CAa1~CAa6) has a logic circuit LCC and a delay circuit 332. The origin signal SZn(SZ1~SZ6) from the origin sensor OPn of each scanning unit Un(U1~U6) is input to the logic circuit LCC of the secondary origin generating circuit CAan (CAa1~CAa6). That is, the origin signal SZ1 is input to the logic circuit LCC of the secondary origin generating circuit CAa1, and similarly, the origin signals SZ2 to SZ6 are input to the logic circuit LCC of the secondary origin generating circuits CAa2 to CAa6. In addition, a state signal STS is input to the logic circuit LCC of each sub-origin generating circuit CAan (CAa1~CAa6). This state signal (logical value) STS is set to "1" in the first state where the continuous reflection surface RP of the polygon mirror PM is repeated, and the second state is repeated on every other reflection surface RP of the polygon mirror PM In case of status, set to "0". This status signal STS is transmitted from the exposure control section 356.

Each logic circuit LCC generates an origin signal SZn' (SZ1'~SZ6') according to the input origin signal SZn (SZ1~SZ6), and outputs it to each delay circuit 332. Each delay circuit 332 delays the input origin signal SZn' (SZ1'~SZ6') by the time Tpx, and outputs the secondary origin signal ZPn (ZP1~ZP6).

Fig. 39 is a diagram showing the structure of the logic circuit LCC that inputs the origin signal SZn (SZ1~SZ6) and the status signal STS. The logic circuit LCC is composed of a 2-input OR gate LC1, a 2-input AND gate LC2, and a single irradiation pulse generator LC3. The status signal STS is applied as an input signal to one side of the OR gate LC1. The output signal (logic value) of the OR gate LC1 is applied as the input signal of one side of the AND gate LC2, and the origin signal SZn is applied as the input signal of the other side of the AND gate LC2. The output signal (logic value) of the AND gate LC2 is input to the delay circuit 332 as the origin signal SZn'. The single-shot pulse generator LC3 generally outputs the signal SDo of the logical value "1", but if the origin signal SZn' (SZ1'~SZ6') is generated, the signal SDo of the logical value "0" is output at a certain time Tdp . That is, if the pulse signal generator LC3 is irradiated once, if the origin signal SZn' (SZ1'~SZ6') is generated, the logic value of the signal SDo is reversed for a certain period of time Tdp. The time Tdp is set to a relationship of 2×Tpx>Tdp>Tpx, preferably Tdp≒1.5×Tpx.

40 is a timing diagram illustrating the operation of the logic circuit LCC of FIG. 39. The left half of FIG. 40 shows the scanning of the spot light SP performed by each scanning unit Un (U1~U6) without jumping, and the first state of the continuous reflection surface RP is performed. The right half shows each scan The case where the scanning of the spot light SP by the unit Un (U1~U6) skips over the second state of a reflective surface RP. In addition, in FIG. 40, for convenience of description, it is assumed that the angle ηj between adjacent reflection surfaces RP (for example, reflection surface RPa and reflection surface RPb) of the polygon mirror PM has no error, and the origin signal SZn is correctly generated at time Tpx intervals .

When the scanning of the spot light SP does not skip the surface and the first state is performed on the reflecting surface RP, since the state signal STS is "1", the output signal of the OR gate LC1 is always "1" regardless of the state of the signal SDo . Therefore, the output signal (origin signal SZn') output from the AND gate LC2 is output at the same timing as the origin signal SZn. That is, in the first state, the origin signal SZn and the origin signal SZn' can be regarded as the same. In the first state, the time interval Tpx of the origin signal SZn' applied to the single irradiation pulse generator LC3 is less than the time Tpd. Therefore, the signal SDo from the single irradiation pulse generator LC3 remains "0". In addition, even if the angle ηj between the reflection surfaces RP of the polygon mirror PM is in error, the time interval of the origin signal SZn' is less than the time Tpd will not change.

If it becomes the second state where the scanning of the spot light SP skips over one reflecting surface RP, the state signal STS is switched to "0". Therefore, the output signal of the OR gate LC1 becomes "1" only when the signal SDo is "1". In the state where the signal SDo is "1" (in this case, the output signal of the OR gate LC1 is also "1"), if the origin signal SZn is applied (for convenience, this origin signal SZn is called the first Origin signal SZn), then respond to this, AND gate LC2 also outputs origin signal SZn'. However, if the origin signal SZn' is generated, the signal SDo from the single irradiation pulse generator LC3 changes to "0" only for the time Tpd. Therefore, during the time Tpd, both outputs of the OR gate LC1 become "0" signals, so the output signal of the OR gate LC1 remains "0". Thus, during the time Tpd, the output signal of the AND gate LC2 also maintains "0". Therefore, even if the second origin signal SZn is applied to the AND gate LC2 before the elapsed time Tpd, the AND gate LC2 will not output the origin signal SZn'.

Then, after the time Tpd has elapsed, the signal SDo from the single irradiation pulse generator LC3 is inverted to "1", so it is the same as the case of the first origin signal SZn described above, and the third source applied after the time Tpd The origin signal SZn' corresponding to the point signal SZn is output from the AND gate LC2. By repeating the above actions, the logic circuit LCC will convert the origin signal SZn generated repeatedly over time Tpx into the origin signal SZn’ generated repeatedly over 2×time Tpx. If viewed from another point of view, the logic circuit LCC repeatedly generates pulses of the origin signal SZn that are repeatedly generated for the time Tpx to generate the origin signal SZn' separated, that is, to divide the frequency of the timing of the origin signal SZn generation Frequency is 1/2. In addition, the logic circuit LCC of the sub-origin generating circuit CAan may be replaced with the frequency divider 330 of the sub-origin generating circuit CAn described in the fourth embodiment (FIG. 31). In the case of replacing the frequency divider 330, as long as the frequency divider 330 divides the origin signal SZn into 1/2 in the second state, and does not divide the origin signal SZn in the first state. In addition, the sub-origin generating circuit Can of the fourth embodiment described above may be replaced with the sub-origin generating circuit CAan of the fifth embodiment. In the second state, the origin signal SZ1' output from the logic circuit LCC of the secondary origin generating circuit CAa1 and the origin signal SZ4' output from the logic circuit LCC of the secondary origin generating circuit CAa4 are shifted by a half-cycle phase. Similarly, the origin signals SZ2', SZ3' output from the logic circuit LCC of the secondary origin generating circuits CAa2, CAa3 and the origin signals SZ5', SZ6' output from the logic circuit LCC of the secondary origin generating circuits CAa5, CAa6 Stagger the half-cycle phase.

As described above, by simply inverting the value of the state signal STS of the logic circuits LCC of the sub-origin generating circuits CAa1 to CAa6 of the input beam switching control section 352, the continuous reflection surface RP of the polygon mirror PM can be switched arbitrarily The first state of drawing exposure performed by scanning of the spot light SP, and the second state of drawing exposure performed by scanning scanning of the spot light SP on every other reflective surface RP of the polygon mirror PM.

In addition, in the fifth embodiment, the rotation control of the polygon mirror PM of each scanning unit Un (U1 to U6) is the same as the fourth embodiment described above. That is, each scanning unit Un(U1~ is controlled in such a way that the origin signal SZn(SZ1~SZ6) output from the origin sensor OPn of each scanning unit Un(U1~U6) has the relationship shown in FIG. 34 U6) The rotation of the polygon mirror PM. Therefore, when the scanning of the spot light SP does not skip the surface and the first state is performed on the reflecting surface RP, the scanning units U1~U3 can repeatedly scan the spot light SP in the order of U1→U2→U3, and the scanning unit U4~ U6 can scan the spot light SP repeatedly in the order of U4→U5→U6.

Preferably, the time Tpd set in this single irradiation pulse generator LC3 can be changed according to the information of the rotation speed of the polygon mirror PM from the exposure control section 356. Furthermore, it is not limited to skipping one side, even if the two sides are skipped to scan the spot light SP, if it is the configuration of FIG. 39, only the time Tpd is set to the relationship of (n+1)×Tpx>Tdp>n×Tpx Available. In addition, n represents the number of skipped reflection surfaces RP. For example, when n is 2, it means that the scanning of the spot light SP is performed every two reflective surfaces RP, and when n is 3, it means that the scanning of the spot light SP is performed every three reflective surfaces RP.

Next, the drawing bit of the driving circuit 206a of the light source device 14A', 14B' by the drawing data output control unit 354 when the scanning of the spot light SP does not jump to the surface and the reflection surface RP is in the first state is briefly described. Output control of listed data Sdw. In the first state, the spot light SP is scanned in parallel with the first scanning module (scanning units U1 to U3) and the second scanning module (scanning units U4 to U6). Therefore, the drawing data output control section 354 outputs the sequence data DL1 to DL3 corresponding to each of the scanning units U1 to U3 in time sequence synthesis for the driving circuit 206a of the light source device 14A' that emits the light beam LBa entering the first scanning module The drawing bit row data Sdw outputs the sequence data DL4 to DL6 corresponding to each of the scanning units U4 to U6 in time sequence synthesis for the driving circuit 206a of the light source device 14B' that emits the light beam LBb that enters the second scanning module Describe the bit row data Sdw.

Also, the drawing data output control unit 354 shown in FIG. 35 can be used almost directly when the status signal STS is either "1" or "0". When the scanning of the spot light SP does not skip the surface and the first state is performed on the reflective surface RP, after the secondary origin signal ZP1 is generated, the secondary origin signal ZP2 is generated after the time Ts, and then the secondary origin is generated after the time Ts Signal ZP3. Therefore, the counter parts CN1~CN3 repeatedly output the sequence data DL1~DL3 in the order of DL1→DL2→DL3. The sequence data DL1 to DL3 sequentially output by the gates GT1 to GT3 that are turned on within a certain time (ON time Ton) after applying the sub-origin signals ZP1 to ZP3 are input to the first light source device 14A as the drawing bit row data Sdw ''S drive circuit 206a. Similarly, when the scanning of the spot light SP does not jump and the first state is performed on the reflecting surface RP, after the secondary origin signal ZP4 is generated, the secondary origin signal ZP5 is generated after the time Ts, and then generated after the time Ts Deputy origin signal ZP6. Therefore, the counter parts CN4~CN6 repeatedly output the sequence data DL4~DL6 in the order of DL4→DL5→DL6. The sequence data DL4 to DL6 sequentially output by the gates GT4 to GT6 that are opened within a certain time (ON time Ton) after the application of the sub-origin signals ZP4 to ZP6 are input to the second light source device 14B as the drawing bit row data Sdw ''S drive circuit 206a.

Next, the deviation of the sequence data DL1 to DL6 in the first state will be briefly described. The sequence data DL1 is shifted in the column direction at the timing of generation of the secondary origin signal ZP2 corresponding to the scanning unit U2 that performs scanning after the sequence data DL1 is sent out. The sequence data DL2 is shifted in the column direction at the timing of generation of the secondary origin signal ZP3 corresponding to the scanning unit U3 that performs scanning after the sequence data DL2 is sent out. The sequence data DL3 is shifted in the column direction at the timing when the secondary origin signal ZP1 corresponding to the scanning unit U1 that performs scanning after the sequence data DL3 is sent is completed. In addition, the sequence data DL4 is shifted in the column direction at the timing when the secondary origin signal ZP5 corresponding to the scanning unit U5 that performs scanning after the sequence data DL4 is sent is completed. The offset of the sequence data DL5 in the column direction is performed at the timing of generation of the secondary origin signal ZP6 corresponding to the scanning unit U6 that performs scanning after the sequence data DL5 is sent out. The sequence data DL6 is shifted in the column direction at the timing of generation of the secondary origin signal ZP4 corresponding to the scanning unit U4 that performs scanning after the sequence data DL6 is sent out. In addition, the output control of the drawing bit sequence data Sdw in the second state is the same as in the fourth embodiment, so the description is omitted. In addition, the output control of the drawing bit sequence data Sdw in the first state is the same as the control principle of the above-mentioned first to third embodiments, only the sequence of the output sequence data DLn is different. That is, the sequence data DLn is respectively output in the order of DL1→DL3→DL5, DL2→DL4→DL6 or the sequence data DLn is respectively output in the order of DL1→DL2→DL3, DL4→DL5→DL6.

In addition, in the case where the scanning of the spot light SP skips over the second state of one reflective surface RP, the spot light of each scanning unit Un (U1 to U6) is compared to the first state of the reflective surface RP without skipping the surface The SP scanning interval is longer. For example, in the case of skipping a reflective surface RP to scan the spot light SP, compared to the case of not skipping the plane, the scanning start interval of the spot light SP of each scanning unit Un (U1 to U6) becomes twice. In addition, when the two reflection surfaces RP are skipped, the scanning start interval of the spot light SP becomes 3 times as compared with the case where no reflection surface is skipped. Therefore, in the first state and the second state, if the rotation speed of the polygon mirror PM and the transfer speed of the substrate FS are made the same, the exposure results will be different between the first state and the second state.

Therefore, the exposure control section 356 may have at least one of changing (correcting) at least one of the rotation speed of the polygon mirror PM and the transfer speed of the substrate FS in the first state and the second state so that the first state and the second state The exposure result becomes the control mode in the same state. For example, when the scanning start interval of the spot light SP in the first state and the scanning start interval of the spot light SP in the second state are 1:2, the exposure control unit 356 uses the rotation speed of the polygon mirror PM in the first state The rotation control unit 350 is controlled so that the ratio of the rotation speed of the polygon mirror PM in the second state becomes 1:2. Specifically, the rotation speed of the polygon mirror PM in the first state is 20,000 rpm, and the rotation speed of the polygon mirror PM in the second state is 40,000 rpm. At the same time, the light emission frequency FS of the light beam LB (LBa, LBb) of the light source device 14' (14A', 14B') is set to, for example, 200 MHz in the first state and 400 MHz in the second state. Thereby, the interval of the generation timing of the secondary origin signal ZPn in the first state and the interval of the generation timing of the secondary origin signal ZPn in the second state can be made substantially the same.

Also, for example, the exposure control unit 356 may have a scanning start interval of the spot light SP in the first state and a scanning start interval of the spot light SP in the second state of 1:2, when the first state The control mode in which the ratio of the conveying speed of the substrate FS to the conveying speed of the substrate FS in the second state becomes 2:1 is such that the rotational speeds of the driving rollers R1 to R3 and the rotating drum DR are controlled. Either the control mode (scan correction mode) that corrects the rotation speed of the polygon mirror PM or the light emission frequency Fs (frequency of the clock signal LTC), or the control mode (transport correction mode) that corrects the transport speed of the substrate FS , The interval between the X direction of the drawing line SLn (SL1~SL6) on the substrate FS in the first state and the X direction of the drawing line SLn (SL1~SL6) on the substrate FS in the second state At the same interval (for example, 1.5 μm). Furthermore, in the first state and the second state, the pattern data (bit data) of each of the memory sections BM1 to BM6 stored in the drawing data output control section 354 can be used directly without modification.

In addition, both of the scan correction mode and the transport correction mode described above may be used to correct the pattern drawn on the substrate FS in the first state to be the same as the pattern drawn on the substrate FS in the second state. For example, in the first state (in the case of performing beam scanning on each reflection surface RP of the polygon mirror PM), the rotation speed of the polygon mirror PM is 20,000 rpm, and the light beam LB of the light source device 14' (14A', 14B') When the luminous frequency Fs is 200 MHz and the substrate FS transfer speed is 5 mm/sec, the substrate FS transfer speed can also be set in the second state (in the case of beam scanning at every other reflective surface RP of the polygon mirror PM) It is not decelerated by half, but decelerated by -25% of 3.75mm/sec. The rotation speed of the polygon mirror PM is set to 1.5 times 30,000 rpm, and the light emitting frequency Fs of the light beam LB is set to 1.5 times 300MHz. As described above, if both the scan correction mode and the transfer correction mode are combined, in the second state, there is no need to reduce the transfer speed of the substrate FS to half, and it is possible to suppress an extremely low productivity.

In addition, in the fifth embodiment, as described in the fourth embodiment described above, the number of scanning units Un that distribute the light beams LBa, LBb may be arbitrarily changed. In addition, the scanning efficiency of the mirror PM can be changed arbitrarily. Furthermore, in the fifth embodiment, the scanning efficiency of the polygon mirror PM is 1/3 and the number of scanning units Un is six, so the six selection optical elements AONn (AOM1~AOM6) are divided into two optical element modules OM1, OM2, correspondingly divide the six scanning units Un (U1~U6) into two scanning modules. However, when the scanning efficiency of the polygon mirror PM is 1/M, the number of the scanning unit Un and the selection optical element AOMn is Q, as long as the Q selection optical elements AOMn are divided into Q/M optical element modules OM1, OM2 , …, the Q scanning units Un can be divided into Q/M scanning modules. In this case, it is preferable that each of the optical element modules OM1, OM2, ... has the same number of selection optical elements AOMn, and the number of scanning units Un included in each of the Q/M scanning modules Also equal. In addition, this Q/M is preferably a positive number. That is, it is preferable that Q is a multiple of M.

For example, when the scanning efficiency of the polygon mirror PM is 1/2, the number of the scanning unit Un and the selection optical element AOMn is six, as long as the six selection optical elements AOMn are equally divided into three optical element modules OM1, OM2 , OM3, divide the six scanning units Un into three scanning modules. In addition, in the first state, as long as three optical element modules OM1, OM2, OM3 are arranged in parallel, the light beam LB (in this case, LBa, LBb, LBc) from the three light source devices 14' is incident on three in parallel Each of the optical element modules OM1, OM2, and OM3 is sufficient. In the second state, as long as three optical element modules OM1, OM2, and OM3 are arranged in line, the light beams LB from one light source device 14' are sequentially passed through Three optical element modules OM1, OM2, OM3 are sufficient.

As described above, in the fifth embodiment, the light beam switching control unit 352 switches the deflection (scanning) of the light beam LBn (spot light SP) by the polygon mirror PM of the scanning unit Un to the continuous reflection surface RP of the polygon mirror PM The beam switching member 20A is controlled in any one of the first state (the first drawing mode) of the repetition and the second state (the second drawing mode) of the polygon mirror PM every other at least one reflecting surface RP. One-dimensional scanning of each spot light SP of a plurality of scanning units Un is performed. Thereby, the same effect as that of the fourth embodiment described above can be obtained, and the scanning of the spot light SP can be performed by switching the jumping plane or the scanning of the spot light SP without jumping the plane.

In the case of the first state, when the scanning efficiency (α/β) of the polygon mirror PM is less than 1/2, the scanning unit Un corresponding to the reciprocal number of the scanning efficiency is grouped into a scanning module, and the grouping is used For a plurality of scanning modules, each scanning module and one of its scanning units Un perform one-dimensional scanning of spot light SP. With this, it is possible to simultaneously scan the plurality of drawing lines SLn among the plurality of drawing lines SLn with the number of scanning modules by the spot light SP. Furthermore, in the second state, since the beam scanning is performed on every at least one reflecting surface RP of the polygon mirror PM, the number of reciprocals of the scanning efficiency (α/β) of the polygon mirror PM is even greater The plural scanning units Un can also effectively utilize the light beam LB, and at the same time, the plural scanning units Un all scan the spot light SP along the drawing line SLn.

In the case of the first state described above, the light beams LBa, LBb from the light source devices 14A', 14B' are incident on the two scanning modules in parallel, so the optical elements for selection AOM1~AOM6 in the beam switching member 20A Each of the beam switching control unit 352 switches the ON/OFF state in a time-sharing manner into the scanning units U1 to U6 corresponding to the light beams LB1 to LB6 by the grouped scanning module units.

The arrangement switching member SWE provided in the beam switching member 20A switches the first arrangement state and the second arrangement state in which the light beam LBa from the first light source device 14A' is distributed as the light beams LB1 to LB3 to six scans Each of the three scanning units U1 to U3 in the units U1 to U6, and the method of distributing the light beam LBb from the second light source device 14B' as the light beams LB4 to LB6 to each of the remaining three scanning units U4 to U6, three options The optical elements AOM1 to AOM3 are connected in line along the optical path of the light beam LBa and the optical elements AOM4 to AOM6 are connected in line along the optical path of the light beam LBb. The second configuration state is to connect the light beam LBa from a first light source device 14A' As a method of distributing the light beams LB1 to LB6 to each of the six scanning units U1 to U6, the six selection optical elements AOM1 to AOM6 are connected in series along the optical path of the light beam LBa.

In this way, in the case of the first state, the first configuration state is set by the configuration switching member SWE, each of the scanning units U1 to U6 can repeatedly scan the spot light SP on the continuous reflection surface RP of the polygon mirror PM, and six The two scanning units of the scanning units U1 to U6 can scan the spot light SP almost simultaneously. Moreover, in the case of the second state, the second arrangement state is set by the arrangement switching member SWE. Although it scans the beam of every at least one reflection surface RP of the polygon mirror PM, it can be repeated with all six scanning units U1 to U6 Spot light SP scanning.

Therefore, according to the fifth embodiment, when installing the initial setting of the drawing device, one light source device 14A' is used to set the configuration switching member SWE to become the second configuration state, and then the transfer speed of the substrate FS is increased , As long as the second light source device 14B' is added, and the configuration switching member SWE is set so as to become the first configuration state, on the hardware, the drawing device can be made by simple operations such as the addition of the light source device and the switching of the configuration switching member SWE upgrade.

In addition, in the above embodiments, a reflection surface RP that is located before the rotation direction of the polygon mirror PM relative to the deflecting reflection surface RP of the light beam LBn of the polygon mirror PM is used to detect the origin signal SZn, but it is also possible to use a light beam The reflective surface RP of the LBn bias detects the origin signal SZn. In this case, it is not necessary to make the origin signal SZn or the origin signal SZn' obtained from the origin signal SZn delay time Tpx, so it is only necessary to make the origin signal SZn or the origin signal SZn' as the secondary origin signal ZPn.

In the fourth and fifth embodiments described above, the drawing bit sequence data Sdw is used to switch the electro-optical element 206 of the light modulator 14' (14A', 14B') for drawing, but it can also be 2 As in the embodiment, the optical element for drawing AOM is used as the optical modulator for drawing. The optical element AOM for drawing is an acousto-optic modulator (AOM: Acousto-Optic Modulator). That is, in the fourth embodiment described above, the optical element AOM for drawing may be arranged between the light source device 14' and the optical element for selection AOM1 at the initial stage so that the light beam from the light source device 14' transmitted through the optical element for drawing AOM LB injection selection optical element AOM1. In this case, the drawing optical element AOM is switched according to the drawing bit row data Sdw. Even in this case, the same effect as the fourth embodiment described above can be obtained.

Moreover, in the above-described fifth embodiment, between the first light source device 14A' and the first-stage selection optical element AOM1 of the first optical element module OM1, between the second light source device 14B' and the second optical element module OM2 At the beginning of the selection, optical elements AOM (AOMa, AOMb) for drawing are arranged between the optical elements for selection AOM4. That is, the light beam LBa from the light source device 14A' transmitted through the drawing optical element AOMa is incident on the selection optical element AOM1, and the light beam LBb from the light source device 14B' transmitted through the drawing optical element AOMb is incident on the selection optical element Component AOM4. In this case, in the first state, the drawing optical element AOMa is switched based on the drawing bit row data Sdw composed of the sequence data DL1 to DL3, and the drawing optical element AOMb is based on the drawing bit row data Sdw composed of the sequence data DL4 to DL6 Switch. In the second state, only the optical element AOMa for drawing is switched based on the drawing bit row data Sdw composed of the sequence data DL1 to DL6.

In addition, as in the first embodiment, the scanning unit Un may be provided with a drawing optical element AOM as a drawing light modulator. In this case, the optical element AOM for drawing may be provided in front of the mirror M20 (see FIG. 28) of each scanning unit Un. The optical element AOM for drawing of each scanning unit Un (U1~U6) is switched according to the sequence data DLn (DL1~DL6). For example, the optical element AOM for drawing of the scanning unit U3 is switched according to the sequence data DL3.

(Sixth embodiment) FIG. 41 shows the configuration of the beam switching member (beam delivery unit) 20B of the sixth embodiment. Here, it is assumed that the light beam LBw (LB) that enters the beam switching member 20B after being emitted from one light source device 14' becomes parallel to the circularly polarized light. beam. The beam switching member 20B is provided with six selection optical elements AOM1~AOM6, two absorbers TR1, TR2, six lens systems CG1~CG6, reflectors M30, M31, M32, condenser lens CG0, and polarization beam splitting BS1 and two optical elements for drawing (acousto-optic modulation elements) AOMa, AOMb. In addition, the same reference numerals are given to the same configurations as the above-mentioned fourth embodiment or the above-mentioned fifth embodiment.

The light beam LBw incident on the light beam switching member 20B passes through the condenser lens CG0 and is split into a linear P-polarized light beam LBp and a linear S-polarized light beam LBs by the polarizing beam splitter BS1. The S-polarized light beam LBs reflected by the polarizing beam splitter BS1 enters the drawing optical element AOMa. The light beam LBs incident on the optical element for drawing AOMa is converged to become the waist width of the optical beam in the optical element for drawing AOMa by the condensing action of the condenser lens CG0. The drawing bit row data Sdw(DLn) shown in FIG. 19 is applied to the drawing optical element AOMa through the driver circuit DRVn. This depicted bit row data Sdw, here is the sequence data DL1, DL3, DL5 corresponding to the odd-numbered scanning units U1, U3, U5 to synthesize the latter. Therefore, when the drawing optical element AOMa, when the drawing bit row data Sdw(DLn) is "1", it is turned ON, the primary diffracted light of the incident light beam LBs is used as a deflected drawing light beam (intensity modulation) The light beam) is emitted toward the mirror M31. The drawing beam reflected by the mirror M31 enters the selection optical element AOM1 through the lens system CG1. In addition, when the drawing bit row data Sdw (DLn) is "0", the zero-order light (LBs) emitted from the drawing optical element AOMa is reflected by the mirror M31, but it does not enter the subsequent lens system CG1 Travel at an angle. In addition, the diffractive part of the lens system CG1 in the selective optical element AOM1 condenses the drawing beam scattered from the drawing optical element AOMa into a beam waist width.

The drawing beam transmitted through the selection optical element AOM1 passes through the same lens system CG3 as the lens system CG1 and enters the selection optical element AOM3, and transmits the drawing beam passing through the selection optical element AOM3, and passes through the same lens system CG5 as the lens system CG1 Injection selection optical element AOM5. Fig. 41 shows the state in which three selection optical elements AOM1, AOM3, and AOM5 are arranged in line along the optical path of the beam, in which only the selection optical element AOM3 is turned ON, and the intensity of the optical element AOMa for drawing is modulated. The light beam enters the corresponding scanning unit U3 as the light beam LB3. In addition, the lens systems CG1, CG3, and CG5 correspond to a combination of one collimator lens CL and one condenser lens CD in FIG. 26 or 36.

On the other hand, the P-polarized light beam LBp transmitted through the polarizing beam splitter BS1 is reflected by the mirror M30 and enters the drawing optical element AOMb. The light beam LBp incident on the optical element for drawing AOMb is converged to become the waist width of the optical beam in the optical element for drawing AOMb by the condensing action of the condenser lens CG0. The drawing bit row data Sdw(DLn) shown in FIG. 19 is applied to the drawing optical element AOMb through the driver circuit DRVn. Depicting the bit row data Sdw is the sequence data DL2, DL4, DL6 corresponding to each of the even-numbered scanning units U2, U4, U6 to synthesize the latter. Therefore, the drawing optical element AOMb becomes ON when the drawing bit row data Sdw(DLn) is "1", and the primary diffracted light of the incident light beam LBp is used as a deflected drawing light beam (intensity modulation) The light beam) is emitted toward the mirror M32. The drawing beam reflected by the mirror M32 enters the selection optical element AOM2 through the same lens system CG2 as the lens system CG1. In addition, when the drawing bit row data Sdw (DLn) is "0", the zero-order light (LBp) emitted from the drawing optical element AOMb is reflected by the mirror M32, but it does not enter the subsequent lens system CG2 Travel at an angle. In addition, the diffractive part of the lens system CG2 in the selective optical element AOM2 condenses the drawing beam scattered from the drawing optical element AOMb into a beam waist width.

The drawing beam transmitted through the selection optical element AOM2, enters the selection optical element AOM4 through the same lens system CG4 as the lens system CG1, and transmits the drawing beam transmitted through the selection optical element AOM4, and passes through the same lens system CG6 as the lens system CG1 Injection selection optical element AOM6. Fig. 41 shows the state in which the three selection optical elements AOM2, AOM4, and AOM6 are arranged in line along the beam optical path, in which only the selection optical element AOM2 is turned ON, and the intensity of the optical element AOMb is drawn. The light beam enters the corresponding scanning unit U2 as the light beam LB2. In addition, the lens systems CG2, CG4, and CG6 are equivalent to the combination of one collimator lens CL and one condenser lens CD in FIG. 26 or 36.

If the beam switching member (beam distribution unit) 20B of FIG. 41 described above is used, the light beam LBw from one light source device 14' can be divided into two by the polarization beam splitter BS1, and the light beam LBs from one of them can be drawn by the optical The drawing beams (LB1, LB3, LB5) generated by the element AOMa are sequentially incident on any one of the odd-numbered scanning units U1, U3, and U5, so that the beam LBp from the other side split by the polarizing beam splitter BS1 is used for drawing optically The drawing beams (LB2, LB4, LB6) generated by the element AOMb are sequentially incident on any of the even-numbered scanning units U2, U4, U6.

In the sixth embodiment, the light beam LBw from the light source device 14' is divided into two by the polarizing beam splitter BS1, and the intensity of the light beam LB based on the pattern data is modulated by the drawing optical elements AOMa, AOMb. If the intensity of the spot light SP of each of the six scanning units U1 to U6 is set at -50% at the polarization beam splitter BS1, the attenuation at the optical elements for drawing AOMa, AOMb and AOMn for each selection is -20 %, the attenuation in each scanning unit U1~U6 is -30%, then it becomes about 22.4% of the intensity (100%) of the original light beam LBw. However, the scanning efficiency of the polygon mirror PM of each of the six scanning units U1 to U6 is 1/3 or less. In the case of using the light beam LBw from one light source device 14', one reflection surface RP of the polygon mirror PM will not be skipped By performing beam scanning, the pattern of scanning the spot light SP with each of the six drawing lines SLn can be drawn.

(Modification 1) As in the sixth embodiment, when the polarizing directions of the light beams LBs entering the odd-number selection optical elements AOM1, AOM3, AOM5 and the even-number selection optical elements AOM2, AOM4, AOM6 are orthogonal, the odd number The optical element AONn for number selection and the optical element AONn for even number selection must be arranged to rotate relative to each other about the beam incident axis by 90 degrees. FIG. 42 shows, for example, a configuration in which the selection optical elements AOM3 among the odd number selection optical elements AOM1, AOM3, and AOM5 are rotated by 90 degrees with respect to the even number selection optical elements AOMn. The optical element AOM3 for selection causes the S-polarized drawing beam passing through the lens system CG3 to enter, so the direction of high diffraction efficiency becomes the Y direction parallel to the XY plane. That is, the selection optical element AOM3 is arranged to rotate 90 degrees so that the periodic direction of the diffraction grating generated in the selection optical element AOM3 becomes the Y direction.

With the above arrangement of the selection optical element AOM3, when the selection optical element AOM3 is in the ON state, the deflecting light beam LB3 travels obliquely to the Y direction with respect to the traveling direction of the zero-order light. Therefore, a mirror IM3a is provided to reflect the light beam LB3 from the selection optical element AOM3 in the XY plane so that the light beam LB3 is separated from the optical path of the 0th order light beam and the light beam LB3 passes through the opening TH3 of the support member IUB in the Z direction. And the reflecting mirror IM3b reflected in the -Z direction so that the light beam LB3 reflected by the reflecting mirror IM3a passes through the opening TH3. Regarding each of the odd-number selection optical elements AOM1 and AOM5, the group of mirrors IM1a and IM1b and the group of mirrors IM5a and IM5b are also provided in the same manner. Furthermore, in the configuration of FIG. 41, since the polarization directions of the light beams LBs and LBp incident on the drawing optical elements AOMa and AOMb are orthogonal, the drawing optical elements AOMa and AOMb are relatively rotated by 90 degrees about the beam incident axis. Relationship configuration.

However, in the case where the polarization beam splitter BS1 in FIG. 41 is an amplitude-splitting beam splitter or a half mirror, if the polarization direction of the light beam LBw is only one direction (for example, P polarization), there is no need to draw the optical element for drawing One side of AOMa, AOMb, one of odd number selection optical element AOMn and one of even number selection optical element AONn are arranged to rotate relatively 90 degrees as shown in FIG. 42.

(Modification 2) In the sixth embodiment, the scanning units U1 to U6 corresponding to each of the six selection optical elements AOM1 to AOM6 scan the spot light SP along the drawing lines SL1 to SL6 on all the reflection surfaces RP of the polygon mirror PM . Therefore, in order to enter the light beams through the odd-numbered selection optical elements AOM1, AOM3, AOM5 in order (the beam modulated by the optical element AOMa for drawing), the selective optical element AOM5 and the absorber in FIG. 41 Three selection optical elements AOM7, AOM9, AOM11 are further arranged in-line between TR2, in order to pass the light beams from the even-numbered selection optical elements AOM2, AOM4, AOM6 (to describe the beam modulated by the optical element AOMb) In this way, three selection optical elements AOM8, AOM10, and AOM12 are further arranged in-line between the selection optical element AOM6 and the absorber TR1. In addition, six scanning units U7 to U12 introduced with the beams LB7 to LB12 for each deflection (switching) of the optical elements AOM7 to AOM12 are added, and a total of 12 scanning units U1 to U12 are arranged in the width direction of the substrate FS (Y direction). In this way, successive drawing exposures of 12 drawing lines SL1 to SL12 can be performed, and the maximum exposure width in the Y direction can be doubled.

In this case, when the scanning efficiency of each polygon mirror PM of the scanning units U1 to U12 is 1/3 or less, the odd-numbered scanning units U1, U3, U5, U7, U9, U11 of the first drawing module are grouped together And the even-numbered scanning units U2, U4, U6, U8, U10, U12 grouped into the second drawing module scan the light beam LB every one reflecting surface RP of the polygon mirror PM. In this way, even in the case where the width of the substrate FS in the Y direction becomes larger, by simply adding the scanning units U7 to U12, the selection optical elements AOM7 to AOM12, etc., a pattern can be drawn on the large exposure area W (FIGS. 5 and 25) . As described above, the addition of six scanning units U7 to U12 and the selection optical elements AOM7 to AOM12 constitutes the structure of twelve scanning units U1 to U12, and the same can be applied to the description using the above fifth embodiment (FIGS. 36 to 38) The case of two light source devices 14A', 14B'.

(Modification 3) FIG. 43 shows the arrangement relationship between the transport form of the substrate FS and the scanning unit Un (drawing line SLn) in Modification 3. Here, as in Modification 2, 12 scanning units U1 to U12 are provided to enable each scanning unit The drawing lines SL1 to SL12 of Un are successively drawn and exposed in the Y direction, and are arranged on the rotating drum DR. Moreover, the length of the rotation axis direction (Y direction) of the rotating drum DR or various rollers R1 to R3, RT1, RT2, etc. of the substrate transport mechanism 12 shown in FIG. 23 is Hd, and the continuous drawing of the 12 scanning units Un can be exposed The maximum drawing width in the Y direction is Sh (Sh<Hd), and the maximum supporting width of the exposed substrate FS is Td. Each of the 12 scanning units U1 to U12 corresponding to each of the 12 drawing lines SL1 to SL12 in Modification 3 will come from a light source using a beam splitter or a half mirror as shown in FIG. 41 (the sixth embodiment). The beam LBw of the device 14' is divided into two beam switching means (beam distribution unit) 20B, or as shown in FIG. 38 (Fifth Embodiment), each beam LBa from the two light source devices 14A'14B' is used, The beam switching member (beam distribution unit) 20A of the LBb mode makes the corresponding 12 beams LB1 to LB12 incident in a time-sharing manner. Therefore, for example, when the length of each drawing line SL1 to SL12 in the Y direction is 50 mm, the maximum drawing width becomes 600 mm. As an example, the width of the substrate FS0 with the maximum support width Td can be 650 mm, and the length Hd of the rotating drum DR It becomes about 700mm.

Except for the four alignment microscopes AM1~AM4 (observation area Vw1~Vw4) shown in Figs. 24 and 25, the exposure device FS0 of the same width as the maximum support width Td is exposed by the drawing device of Fig. 43 , Add three alignment microscopes AM5~AM7 (observation area Vw5~Vw7) in Y direction. In this case, the alignment microscope AM1 (observation area Vw1) and the alignment microscope AM7 (observation area Vw7) located on both sides of the substrate FS0 in the width direction detect alignment marks formed at a certain pitch in the X direction on both sides of the substrate FS0. In addition, the alignment microscope AM4 (observation area Vw4) is arranged substantially in the center of the maximum support width Td.

In addition, the drawing lines SL1 to SL6 of each of the six scanning units U1 to U6 described in the above embodiments can draw the patterned substrate FS1 in the exposure area W, and the width Td1 is the maximum support width Td of the rotating drum DR The substrate FS1 is approached and transported toward the −Y direction side of the outer peripheral surface of the rotating drum DR, for example, to a certain degree. At this time, each of the alignment marks MK1 to MK4 (FIG. 25) on the substrate FS1 can be detected by each observation area Vw1 to Vw4 of the four alignment microscopes AM1 to AM4. In addition, for the exposure of the substrate FS1, as long as six scanning units U1 to U6 are used, each of the scanning units U1 to U6 scans the beam of the continuous reflection surface RP of the polygon mirror PM or every other polygon PM Any mode of beam scanning of a reflective surface RP can perform point scanning along each drawing line SL1~SL6.

For example, as in the fifth embodiment, when the light beams LBa and LBb from each of the two light source devices 14A′ and 14B′ are used, the light beam LBa from the light source device 14A′ is transmitted in-line through the odd-numbered scanning unit U1 , U3, U5, U7, U9, U11 corresponding to the selection of optical elements AOM1, AOM3, AOM5, AOM7, AOM9, AOM11, grouped in the beam switching member 20A, from the light source device 14A' The light beam LBa is transmitted in-line through the even-numbered scanning units U2, U4, U6, U8, U10, U12, and the corresponding selection optical elements AOM2, AOM4, AOM6, AOM8, AOM10, AOM12 are grouped in the beam switching member 20A Grouping. In addition, during the exposure of the substrate FS1, the three origin signals SZ1, SZ3, SZ5 output based on the continuous reflection surface RP of the polygon mirror PM are repeated in the order of odd-numbered scanning units U1, U3, U5. The beam scanning mode of the continuous reflection surface RP of the mirror PM is controlled so as to scan the units U2 and U4 with even numbers according to the three origin signals SZ2, SZ4, SZ6 output from the continuous reflection surface RP of the polygon mirror PM , The sequence of U6 is repeated to control the beam scanning mode of the continuous reflection surface RP of the polygon mirror PM.

Furthermore, in the case of exposing the substrate FS smaller than the maximum support width Td and larger than the width Td1 of the substrate FS1 and the width Td2, the substrate FS2 is transported in cooperation with the central portion of the maximum support width Td of the rotating drum DR. At this time, the exposure area W on the substrate FS2 is drawn by the drawing lines SL3 to SL10 of each of the eight scanning units U3 to U10 continuous in the Y direction. In this case, the four selective optical elements AOM3, AOM5, AOM7, and AOM9 of the odd number incident with the light beam LBa (intensity-modulated light beam) from the light source device 14A' generate the light beams LB3, LB5 sequentially in a time-sharing manner. Any one of LB7, LB9, the four even-numbered selection optical elements AOM4, AOM6, AOM8, AOM10 of the even-numbered light beam LBb (intensity-modulated light beam) from the light source device 14B' generates the light beam LB4 in a time-sharing manner , LB6, LB8, LB10 any one way to control. Therefore, each of the at least eight scanning units U3~U10 is set to the beam scanning mode of one reflecting surface RP of every polygon mirror PM.

Then, during the exposure of the substrate FS2, the four sub-origin signals ZP3, ZP5, ZP7 are output based on only one reflecting surface RP of each polygon mirror PM of each odd-numbered scanning unit U3, U5, U7, U9, ZP9, in the order of odd-numbered scanning units U3, U5, U7, U9, is controlled by the repeated beam scanning of every other reflective surface RP of the polygon mirror PM, only based on every even-numbered scanning units U4, U6, U8, The four sub-origin signals ZP4, ZP6, ZP8, and ZP10 output from one reflecting surface RP of each polygon mirror PM of U10, and the scanning units U4, U6, U8, U10 of the even number are repeated one by one every polygon mirror PM. The way of scanning the light beam of the reflecting surface RP is controlled. In addition, in FIG. 43, the alignment marks (equivalent to the alignment marks MK1 and MK4 in FIG. 25) formed on both sides of the substrate FS2 in the width direction are aligned in the observation areas Vw2 and Vw6 of the alignment microscopes AM2 and AM6. The relationship of detection is configured, but depending on the size of the exposure area W in the Y direction, there may be cases where it is not necessary to configure the relationship. In this case, as long as several of the seven alignment microscopes AM1 to AM7 are set to be movable in the Y direction, the position interval of the observation areas Vw1 to Vw7 in the Y direction can be adjusted.

According to Modification 3 above, high-efficiency exposure using only the necessary scanning unit Un can be performed according to the width of the substrate FS to be exposed or the size of the exposure area W in the Y direction. Moreover, as shown in FIG. 43, when the scanning efficiency of the polygon mirror PM of each of the 12 scanning units U1 to U12 is 1/3 or less, for example, if the beam scanning is performed every three reflection surfaces RP of each polygon mirror PM , Even if it is a light beam from one light source device 14', the pattern can be drawn well at the maximum drawing width Sh.

Furthermore, in the case where nine scanning units U1 to U9 constitute the drawing device, five scanning units U1, U3, U5, U7, U9 of odd numbers and four scanning units U2, U4, U6, U8 of even numbers are used. Therefore, when the pattern is drawn in the exposure area W by all the drawing lines SL1 to SL9 of the nine scanning units U1 to U9, the scanning efficiency of the polygon mirror PM is 1/3 or less, for example, as long as every polygon mirror PM One of the reflecting surfaces RP can be scanned by the beam. However, in this case, as long as the reference signals ZP1, ZP3, ZP5, ZP7, ZP9 generated from the origin signals SZn of each of the odd-numbered scanning units U1, U3, U5, U7, U9 are sequentially referred to Odd number trace lines SL1, SL3, SL5, SL7, SL9 are scanned at each point, and only refer to the sub-origin signal ZP2 generated from the origin signals SZn of the even-numbered scanning units U2, U4, U6, U8 in turn. , ZP4, ZP6, ZP8, just scan the points of the even-numbered drawing lines SL2, SL4, SL6, SL8.

As described above, in Modification 3, a pattern drawing method is provided by using a drawing device that arranges a plurality of scanning units Un that scan the spot light SP of the light beam from the light source device 14' along the drawing line SLn into each drawing line The pattern drawn by SLn is continued on the substrate FS in the direction of the drawing line SLn (main scanning direction), so that the plurality of scanning units Un and the substrate FS are relatively moved in the sub-scanning direction crossing the main scanning direction, which is characterized by including: In the plurality of scanning units Un, the action of selecting a specific scanning unit corresponding to the width of the substrate FS in the main scanning direction, or the width of the exposure area of the pattern drawn on the substrate FS in the main scanning direction, or the position of the exposure area; and The beams whose intensity is adjusted according to the pattern data to be drawn by each specific scanning unit will be sequentially supplied to the specific scanning units through the beam distribution unit that distributes the beams from the light source device 14'. Thus, in Modification 3, even if the width of the substrate FS changes or the width or position of the exposure area W on the substrate FS changes, by appropriately positioning the transport position of the substrate FS in the Y direction, it is possible to maintain high connection accuracy Precise pattern depiction. In addition, at this time, the rotation speed or the rotation angle phase is not synchronized between the polygon mirrors PM of all of the plurality of scanning units, but the rotation speed or the rotation speed or rotation angle of the polygon mirror PM of the specific scanning unit that contributes to the pattern drawing. The rotation angle and phase can be synchronized.

(Modification 4) Furthermore, as another configuration of the drawing device using nine scanning units U1 to U9, it is not grouped by odd and even numbers, but can also be simply divided into two groups according to the arrangement order of the scanning units Un. That is, the first scanning module of six scanning units U1 to U6 and the second scanning module of three scanning units U7 to U9 can also be divided into the first scanning module to supply the light beam from the first light source device 14A' LBa supplies the light beam LBb from the second light source device 14B' to the second scanning module. In this case, if the scanning efficiency (α/β) of the polygon mirror PM is 1/4<(α/β)≦1/3, each of the six scanning units U1 to U6 in the first scanning module is the same as the above In the fourth embodiment (FIG. 33 ), the spot light SP along each drawing line SL1 to SL6 is scanned by scanning the light beam on every reflection surface RP of the polygon mirror PM.

In contrast, each of the three scanning units U7 to U9 in the second scanning module can perform beam scanning on all the reflection surfaces RP of the polygon mirror PM. Therefore, if each of the three scanning units U7~U9 directly performs beam scanning on all the reflection surfaces RP of the polygon mirror PM, the spot light SP scans the drawing lines SL1~SL6 of each of the six scanning units U1~U6 The repetitive time interval ΔTc1 and the point light SP in the three scanning units U7~U9 each of the scanning lines SL7~SL9 scanning repetitive time interval ΔTc2 becomes ΔTc1=2ΔTc2, by drawing lines SL1~SL6 on the substrate FS The pattern drawn above is different from the pattern drawn on the substrate FS by the drawing lines SL7 to SL9, and a good continuous exposure cannot be performed.

Therefore, each of the three scanning units U7 to U9 that can scan the light beams of all the reflection surfaces RP of the polygon mirror PM is also controlled in such a way that the light beams are scanned every one reflection surface RP of the polygon mirror PM. The above control can be realized by the action that the origin signals SZ7 to SZ9 generated from each of the scanning units U7 to U9 are input to the circuit in FIG. 31 or the secondary origin generating circuit CAan in FIG. 38 to generate the secondary origin signal The actions of ZP7~ZP9 and the response to the secondary origin signals ZP7~ZP9, so that the corresponding selection optical elements AOM7~AOM9 will be turned ON in sequence at a certain time and will correspond to the lines SL7~SL9 to be drawn. The drawn sequence data DL7 to DL9 are sequentially transmitted to the driving circuit 206a of the electrical optical element 206 in the second light source device 14B'.

(Modification 5) FIG. 44 shows the configuration of the driver circuit DRVn of the optical element for selection AONn in Modification 5. FIG. As described in the above embodiments or modified examples, when each of the plurality of scanning units Un performs beam scanning above one reflection surface RP of the polygon mirror PM, the light beam emitted from the light source device 14' (14A', 14B') LB (LBa, LBb) or light beams LBs, LBp emitted from the optical elements for drawing AOMa, AOMb are transmitted through a plurality of optical elements for selection AONn arranged along their optical paths. In FIG. 44, the light beam LB, after passing through the selection optical elements AOM1 and AOM2, is switched by the selection optical element AOM3 to generate the light beam LB3 toward the scanning unit U3. Generally speaking, the optical material in the optical element AOMn is selected to have a high transmittance to the light beam LB in the ultraviolet wavelength range (for example, a wavelength of 355 nm), but an attenuation rate of about several percent.

Assuming that the transmittance of each selection optical element AOMn is 95%, as shown in FIG. 44, when the selection optical element AOM3 is turned on, the intensity of the light beam LB incident on the selection optical element AOM3 is subjected to two selection optics The attenuation of the elements AOM1 and AOM2 is about 90% (0.95 ² ) relative to the original beam intensity (100%) of the incident selection optical element AOM1. Furthermore, in the case where the six selection optical elements AOM1~AOM6 are connected, the intensity of the light beam LB incident on the final selection optical element AOM6 is attenuated by the five selection optical elements AOM1~AOM5, so it is relative to the original beam intensity (100%) becomes approximately 77% (0.95 ⁵ ).

Therefore, the intensity of the light beam LB incident on each of the six selection optical elements AOM1 to AOM6 becomes 100%, 95%, 90%, 85%, 81%, 77% in sequence. This means that the intensities of the beams LB1~LB6 emitted backward by each of the selected optical elements AOM1~AOM6 also change at their ratios. Therefore, in this modification 5, in the driver circuits DRVn of each of the plurality of selection optical elements AOMn shown in FIG. 38, the driving conditions of the selection optical elements AOM1 to AOM6 are adjusted to control the intensity of the light beams LB1 to LB6 Changes are reduced.

In FIG. 44, since the driver circuits DRV1 to DRV6 (DRV5 and DRV6 are not shown) have the same configuration, only the driver circuit DRV1 will be described in detail. As shown in FIG. 38 described above, the information on the time Ton of each ON state of the selection optical elements AOM1 to AOM6 (the illustrations of AOM5 and AOM6 are omitted in FIG. 44) of each input of the driver circuits DRV1 to DRV6 is set to the information and sub-origin Point signal ZP1~ZP6. In addition, in the configuration of FIG. 44, a high-frequency transmission source 400 for applying ultrasonic waves to each of the selection optical elements AOM1 to AOM6 is provided in common. The driver circuit DRV1 is provided with a switching element 401 that receives a high-frequency signal from a high-frequency source 400 and switches at high speed to an amplifier 402 that amplifies it to a high-voltage amplitude, controls information based on the set time Ton, and controls the secondary origin signal ZP1 A logic circuit 403 that opens and closes the switching element 401, and a gain adjuster 404 that adjusts the amplification rate (gain) of the amplifier 402 to adjust the amplitude of the high-frequency signal applied to the selection optical element AOM1.

If the amplitude of the high-frequency high-frequency signal applied to the selection optical element AOM1 changes within the allowable range, the diffraction efficiency of the selection optical element AOM1 can be fine-tuned to change the beam LB1 (first-order diffracted light) emitted backward strength. Therefore, in this modification 5, the driver circuit DRV1 of the selection optical element AOM1 close to the light source device 14' side to the driver circuit DRV6 of the selection optical element AOM6 far from the light source device 14' side are applied to each Select the way in which the amplitude of the high-frequency high-frequency signal of the optical element AOMn becomes higher, and adjust the gain adjuster 404. For example, the amplitude of the high-frequency signal of the high voltage applied to the selection optical element AOM6 of the optical path terminal of the light beam LB is set to the highest diffraction efficiency Va6, and the high voltage applied to the optical element AOM1 of the initial selection of the optical path of the light beam LB The amplitude of the high-frequency signal is set to a value Va1 where the diffraction efficiency becomes a reduced state within the allowable range. The amplitude Va2~Va5 of the high-frequency high-frequency signal applied to the selective optical elements AOM2~AOM5 in between is set to Va1<Va2<Va3<Va4<Va5<Va6.

According to the above settings, the intensity deviation of the light beams LB1 to LB6 emitted from each of the six selection optical elements AOM1 to AOM6 can be alleviated or suppressed. By this, the deviation of the exposure amount of the patterns drawn by the drawing lines SL1 to SL6 can be suppressed, and pattern drawing with high accuracy can be performed. In addition, the amplitudes Va1 to Va6 of the high-frequency high-frequency signals set by the driver circuits DRV1 to DRV6 do not need to be increased in order, and may also be, for example, the relationship of Va1=Va2<Va3=Va4<Va5=Va6. In addition, in addition to the method of Modification 5, the intensity method of adjusting the scanning beams LB1 to LB6 of the spot light SP to the scanning units U1 to U6 can also be set in the optical path of each scanning unit U1 to U6 with a predetermined Transmittance reduction filter (ND filter) method.

In addition, in the driver circuit DRVn of FIG. 44, the switching element 401 switches whether to transmit the high-frequency signal from the high-frequency signal source 400 to the amplifier 402. However, in order to improve the responsiveness (rising characteristic) when the ON/OFF switching of the optical element AOMn is selected, the diffraction efficiency may be substantially regarded as 0, for example, the intensity of the first-order diffracted light relative to ON The low-frequency high-frequency signal whose intensity becomes 1/1000 or less is continuously applied to the selection optical element AONM, and the appropriate high-level high-frequency signal is applied to the selection optical element AONM only in the ON state. FIG. 45 shows the configuration of the driver circuit DRVn. Here, the configuration of the driver circuit DRV1 is representatively shown, and the same symbols as those of the components in FIG. 44 are attached.

In the configuration of FIG. 45, two resistors RE1 and RE2 connected in series are added. The in-line circuit of the resistors RE1 and RE2 is inserted in parallel with the high-frequency source 400 before the switching element 401, and the high-frequency signal from the high-frequency source 400 divided by the resistance ratio RE2/(RE1+RE2) is constantly applied to the amplifier 402. When the resistance RE2 is a variable resistance and the switching element 401 is in the OFF (non-conducting) state, the intensity of the primary diffracted light emitted from the selection optical element AOM1, that is, the light beam LB1 becomes a sufficiently small value (for example, the original intensity 1/1000 or less), adjust the level of the high-frequency signal applied to the optical element AOM1 for selection. As described above, the resistors RE1 and RE2 apply a bias (rise) of a high-frequency signal to the selection optical element AOM1, thereby improving responsiveness. In addition, in this case, when the switching element 401 is in the OFF (non-conducting) state, the intensity is extremely weak. However, since the light beam LB1 enters the corresponding scanning unit U1, the substrate FS is transferred during the drawing operation due to some problems When the speed is reduced or stopped, close the shutter at the exit of the light source device 14' (14A', 14B') or insert a dimming filter.

(Modification 6) In each of the above embodiments and modifications, in a state where the sheet-like substrate FS is closely attached to the outer peripheral surface of the rotating drum DR, the surface of the substrate FS curved into a cylindrical surface is along each of the plurality of scanning units Un The drawing line SLn performs pattern drawing. However, for example, as disclosed in International Publication No. WO2013/150677, it may be configured to perform exposure processing while supporting the substrate FS in a planar shape and simultaneously transporting it in the longitudinal direction. In this case, if the surface of the substrate FS is set to be parallel to the XY plane, for example, as long as the odd-numbered scanning units U1, U3, U5 shown in FIGS. 23 and 24 are irradiated to the central axes Le1, Le3, Le5 and even-numbered scans When the irradiation central axes Le2, Le4, Le6 of the units U2, U4, U6 are viewed in a plane parallel to the XZ plane, they are parallel to the Z axis and are located in the X direction at a certain interval. .

AXp: axis of rotation CYa, CYb: cylindrical lens DR: rotating drum FS: substrate FT: fθ lens LB: light beam PM: polygon mirror RP: reflective surface U1~U6: Scanning unit 14, 14a, 14b: light source device 16: Draw the head 40a, 40b: Light introduction optical system 42, 104: Condenser lens 44, 100, 108: Collimating lens 46, 52, 60, 68, 102, 110, 114, 122: reflector 50, 58, 66: optional optical components 70: Absorber 106: Optical element for drawing

FIG. 1 is a diagram showing a schematic configuration of a device manufacturing system including an exposure apparatus that applies exposure processing to a substrate according to the first embodiment. FIG. 2 is a diagram showing a support frame supporting the drawing head and the rotating cylinder shown in FIG. 1. FIG. Fig. 3 is a diagram showing the configuration of the drawing head of Fig. 1. 4 is a detailed configuration diagram of the light introduction optical system shown in FIG. 3. FIG. 5 is a diagram showing trace lines of spot light scanned by each scanning unit shown in FIG. 3. 6 is a diagram showing the relationship between the polygon mirror of each scanning unit shown in FIG. 3 and the scanning direction of the drawing line. FIG. 7 is a diagram for explaining the rotation angle of a polygon mirror capable of deflecting (reflecting) laser light in such a manner that the reflection surface of the polygon mirror shown in FIG. 3 enters the f-θ lens. FIG. 8 is a schematic diagram of introducing the light shown in FIG. 3 into the optical system and the optical paths of a plurality of scanning units. Fig. 9 is a diagram showing the configuration of a drawing head according to a modification of the first embodiment. FIG. 10 is a detailed configuration diagram of the light introduction optical system shown in FIG. 9. FIG. 11 is a diagram showing the configuration of the drawing head in the second embodiment. FIG. 12 is a diagram showing the light introduction optical system shown in FIG. 11. FIG. 13 is a schematic diagram of introducing the light shown in FIG. 12 into the optical system and the optical paths of a plurality of scanning units. 14 is a block diagram showing an example of a control circuit for rotationally driving the polygon mirrors of the plurality of scanning units shown in FIG. FIG. 15 is a timing chart showing an operation example of the control circuit shown in FIG. 14. 16 is a block diagram showing an example of a circuit for generating drawing bit row data supplied to the drawing optical elements shown in FIGS. 11 to 13. FIG. 17 is a diagram showing the configuration of a light source device according to a modification of the second embodiment. 18 is a block diagram showing the structure of a control unit for drawing control in the third embodiment. FIG. 19 is a time chart showing the signal state of each part and the oscillation state of laser light of the control unit of FIG. 18 during pattern drawing. FIG. 20 is a timing chart showing the clock signal used for pulse light oscillation by the control circuit of the light source device of FIG. 17. FIG. 21 is a time chart illustrating the case of correcting the clock signal of FIG. 20 in order to correct the drawing magnification. FIG. 22 is a diagram illustrating a correction method of drawing magnification in one drawing line (scanning line). FIG. 23 is a diagram showing a schematic configuration of a device manufacturing system including an exposure apparatus that applies exposure processing to a substrate according to the fourth embodiment. 24 is a detailed view of the rotating drum of FIG. 23 with the substrate wound. FIG. 25 is a diagram showing trace lines of spot light and alignment marks formed on the substrate. Fig. 26 is a configuration diagram of a beam switching member. FIG. 27A is a view of the optical path switching of the light beam by the selection optical element viewed from the +Z direction side, and FIG. 27B is a view of the optical path switching of the light beam by the selection optical element viewed from the -Y direction side. FIG. 28 is a diagram showing the optical configuration of the scanning unit. FIG. 29 is a diagram showing the structure of an origin sensor provided around the polygon mirror of FIG. 28. FIG. FIG. 30 is a diagram showing the relationship between the timing of origin signal generation and the timing of start of drawing. FIG. 31 is a sub-origin generating circuit diagram for generating a sub-origin signal that is separated from the origin signal so that its timing is delayed by a predetermined time. FIG. 32 is a timing chart of the secondary origin signal generated by the secondary origin generation circuit of FIG. 31. Fig. 33 is a block diagram showing the electrical configuration of the exposure apparatus. Fig. 34 is a timing chart showing the timing of outputting the origin signal, sub-origin signal, and sequence data. FIG. 35 is a diagram showing the configuration of the drawing data output control unit shown in FIG. 33. Fig. 36 is a configuration diagram of a beam switching member according to the fifth embodiment. 37 is a diagram showing the optical path when the position of the arrangement switching member of FIG. 36 is the first position. Fig. 38 is a diagram showing the configuration of the optical path switching control unit in the fifth embodiment. FIG. 39 is a diagram showing the structure of the logic circuit of FIG. 38. FIG. 40 is a timing diagram illustrating the operation of the logic circuit of FIG. 39. Fig. 41 is a configuration diagram of a beam switching member according to the sixth embodiment. FIG. 42 is a diagram showing a configuration in a case where the arrangement of the selection optical element (acousto-optic modulation element) in the sixth embodiment is rotated by 90 degrees. FIG. 43 is a diagram showing the arrangement relationship between the transfer form of the substrate of Modification 3 and the drawing lines. 44 is a diagram showing the configuration of a driver circuit of a selection optical element (acousto-optic modulation element) of Modification 5. FIG. FIG. 45 is a diagram showing a modification of the driver circuit in FIG. 44. FIG.

AXp: axis of rotation CYa, CYb: cylindrical lens DR: rotating drum FS: substrate FT: fθ lens LB: light beam PM: polygon mirror RP: reflective surface U1~U6: Scanning unit 14, 14a, 14b: light source device 16: Draw the head 40a, 40b: Light introduction optical system 42, 104: Condenser lens 44, 100, 108: Collimating lens 46, 52, 60, 68, 102, 110, 114, 122: reflector 50, 58, 66: optional optical components 70: Absorber 106: Optical element for drawing

Claims (10)

A pattern exposure device that exposes a pattern on the substrate by an ON state and a non-projected OFF state of projecting pulsed light of an ultraviolet wavelength on a photosensitive substrate, and includes a light source section that generates a first type of light and The second type of light, the first type of light is pulse oscillated in the first polarized state at a predetermined frequency Fs so as to become the first peak intensity, and the second type of light has a second peak lower than the aforementioned first peak intensity Intensity, and has almost the same energy as the first type of light, in the second polarized state in which the polarization direction is changed by 90 degrees with respect to the first polarized state, synchronized with the first type of light at the predetermined frequency Fs Pulse oscillation is performed; the photoelectric modulator causes the first light to enter together with the second light, and when in the ON state, changes the first light from the first polarized state to the second polarized state , And the second light is emitted from the second polarized state to the first polarized state; a polarizing beam splitter is emitted from the first light and the second light emitted from the photoelectric modulator 1. Become the seed light in the second polarized state; optical amplifier to amplify the seed light emitted from the polarizing beam splitter into the second polarized state; wavelength conversion optical member to enter the aforementioned light emitted from the optical amplifier The seed light emits the first light emitted from the optical amplifier as ultraviolet pulse light with high peak intensity in the ON state, and emits the second light emitted from the optical amplifier in the OFF state Ultraviolet pulse light with a low peak intensity is emitted; and the drive circuit section is configured to cause the first type of light to enter the optical amplifier through the polarizing beam splitter when in the ON state, and to cause the light to be amplified when in the OFF state The method in which the second type of light is incident on the optical amplifier through the polarizing beam splitter drives the photoelectric modulator. The pattern exposure apparatus according to claim 1, wherein the light source section includes: a first semiconductor laser light source that generates the first light, a second semiconductor laser light source that generates the second light, and A control circuit unit that simultaneously oscillates the first semiconductor laser light source and the second semiconductor laser light source in response to the clock signal of the predetermined frequency Fs. The pattern exposure device according to claim 2, wherein the control circuit section makes the energy of the 1 pulse of the first light generated in response to the clock pulse of the clock signal and the foregoing generated in response to the clock pulse The energy of one pulse of the second type of light is controlled in substantially the same manner as the first semiconductor laser light source and the second semiconductor laser light source. The pattern exposure apparatus according to claim 2, wherein the control circuit section includes setting the period of the clock pulse corresponding to the predetermined frequency Fs of the clock signal as the reference time Td0 (=1/Fs) A circuit in which the time interval between two consecutive clock pulses in the clock signal changes by ±ΔDh relative to the aforementioned reference time Td0, where ΔDh<Td0. The pattern exposure apparatus according to any one of claims 1 to 4, wherein the optical amplifier is incident on the seed light emitted from the polarizing beam splitter to become the second polarized state and the excitation light from the excitation light source. An optical fiber optical amplifier that increases the intensity of the aforementioned light. The pattern exposure apparatus according to any one of claims 1 to 4, wherein the photosensitive substrate is a flexible long sheet-shaped substrate; the pattern exposure apparatus further includes: a rotary cylinder having the sheet-shaped substrate One part is wound around the cylindrical outer peripheral surface in the longitudinal direction and can be rotated around the central axis; and the exposure head is arranged around the rotating cylinder, and exposes the light beam of the pulsed light of the ultraviolet wavelength according to the pattern Projected on the aforementioned sheet substrate. The pattern exposure apparatus according to claim 6, wherein the optical amplifier is incident on the seed light emitted from the polarizing beam splitter to become the second polarized state and the excitation light from the excitation light source to increase the intensity of the seed light Optical fiber optical amplifier. The pattern exposure device according to claim 6, wherein the aforementioned exposure head includes a scanning unit, The scanning unit condenses the exposure light beam as spot light on the sheet substrate, and scans the spot light one-dimensionally in a direction substantially parallel to the central axis of the rotating cylinder. The pattern exposure apparatus according to claim 8, wherein when the effective size of the spot light projected on the sheet substrate is Ds and the scanning speed of the spot light is Vs, the predetermined frequency Fs is set by Above the frequency determined by Vs/Ds. The pattern exposure apparatus according to claim 9, wherein the scanning unit includes: a rotating polygon mirror for deflecting the exposure light beam for the scanning of the spot light, and each time each reflection surface of the rotating polygon mirror becomes a predetermined angle An origin sensor that generates an origin signal; the drive circuit section starts the modulation operation of the photoelectric modulator based on drawing data based on the generation of the origin signal, and the drawing data divides the pattern into Each pixel represents the aforementioned ON state or the aforementioned OFF state.

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