TWI710776B - Inspection jig, substrate inspecting device and substrate inspecting method - Google Patents

Abstract

Provided are an inspection jig, a substrate inspecting device and a substrate inspecting method easily enabling correct inspection of substrate even when the substrate is under expansion or contraction. The inspection jig of this invention includes a plate-shaped fixing plate 31, and first and second opposing members 30a, 30b installed on the fixing plate 31 and arranged with probes Pr, wherein a plurality of fixing-side positioning holes 21 though which positioning pins 36 are inserted are formed in the fixing plate 31, moving-side positioning holes 22 are formed in the second opposing member 30b each of which forms a pair with the corresponding one of the plurality of fixing-side positioning holes 21 respectively, and in the state that the positioning pins 36 are inserted into the fixing-side positioning hole 211 and the moving-side positioning hole 221 to position the fixing plate 31 and the second opposing member 30b, pairs (pair of 212 and 222, …, pair of 217 and 227) of the fixing-side positioning holes 21 and the moving-side positioning holes 22 which are positioned so as to misalign with each other in a x-axis direction are formed.

Description

Inspection aid, substrate inspection device and substrate inspection method

The present invention relates to an inspection aid for bringing a probe into contact with a substrate, a substrate inspection device having the inspection aid, and a substrate inspection method.

Conventionally, it is known that a plurality of unit substrates to be inspected are formed into a matrix of plural rows and plural columns to form a collective substrate, and a plurality of inspection aids are arranged corresponding to the inspection points of the adjacent plural unit substrates. A technique for inspecting multiple unit substrates in a substrate at once (refer to Patent Document 1)

(Prior technical literature) (Patent Document)

Patent Document 1: Japanese Patent Laid-Open No. 8-21867

However, if it is a collective substrate in which a plurality of unit substrates are arranged and assembled on a single substrate, in the manufacturing step of the collective substrate, The inspection point of each unit substrate in the assembly substrate may deviate from the ideal position in the design. This is because the substrate manufactured by the build-up structure is fixed by high-temperature compression bonding when the layers are laminated, and the base material constituting the substrate may shrink. In particular, in the case of a collective substrate composed of a flexible substrate, since a thin and sufficiently flexible material is used, the tendency of the substrate to stretch during manufacturing is significant.

As mentioned above, when the substrate shrinks or stretches, the position of the inspection point that should be contacted by the probe and the positional relationship between the probe mounted on the inspection aid will deviate, and the substrate cannot be inspected correctly. Especially in the case of a collective substrate, since a plurality of unit substrates are included, the substrate area becomes larger. As a result, when the substrate shrinks or stretches, the amount of positional deviation of the inspection point tends to increase, and therefore, there is a defect that the possibility that the substrate cannot be inspected correctly increases.

An object of the present invention is to provide an inspection aid, a substrate inspection device, and a substrate inspection method that can easily and accurately perform substrate inspection even when the substrate expands and contracts.

The inspection aid of the present invention is installed in the inspection device body for inspecting the inspected substrate as the inspection object, and the probes are respectively arranged in contact with a plurality of inspection points of the inspected substrate, and the inspection aid is provided with: A plate-shaped fixing plate with a surface and a second surface, and first and second facing members installed on the fixing plate; the first facing member has a first facing surface and a first mounting surface, the first facing The facing surface is the same as the inspection point set in the first area of a part of the substrate to be inspected. The probe is configured in a corresponding configuration and is configured to face the first area. The first mounting surface is mounted on the second surface of the fixing plate; the second facing member has a second facing surface And a second mounting surface. The second facing surface is configured to correspond to the arrangement of the inspection points in the second area of the substrate to be inspected, which is different from the first area, and is used to The second area is arranged opposite to each other. The second mounting surface is mounted on the second surface of the fixing plate; the first surface of the fixing plate is used to be mounted on the surface of the inspection device body in the second surface In the area where the second opposite member is installed, there are formed a plurality of fixed-side positioning holes perpendicularly penetrating the fixed plate, and the plurality of fixed-side positioning holes are used to insert positioning pins for positioning; A moving-side positioning hole for positioning is formed on the component. The moving-side positioning hole corresponds to the plurality of fixed-side positioning holes to form a hole pair, and can accept the front end side of the positioning pin, and the fixed-side positioning hole and The moving-side positioning hole is set as a plurality of hole pairs; the fixed-side positioning hole and the moving-side positioning hole of at least one of the fixed-side positioning hole and the moving-side positioning hole of the plurality of hole pairs are inserted into the positioning pin , And in the state where the fixed plate and the second facing member are positioned, the fixed-side positioning hole and the movable-side positioning hole are located at positions shifted along the predetermined first direction, and the hole pairs are included in the plurality of holes Centering.

According to this configuration, the first and second facing members where the probes are arranged are mounted on the fixed plate in a manner corresponding to the arrangement of the inspection points provided on the substrate to be inspected. In addition, a plurality of fixing-side positioning holes are formed in the area of the fixing plate where the second facing member is installed. On the other hand, the second phase The opposing member is formed with a moving-side positioning hole, and the moving-side positioning hole corresponds to a plurality of fixed-side positioning holes to form a pair of holes and can accept the front end side of the positioning pin. Furthermore, it is provided with: the fixed side positioning hole and the moving side positioning hole of at least one of the fixed side positioning hole and the moving side positioning hole of the plurality of hole pairs inserted into the positioning pin, and the fixed plate and the second opposite member In the case of positioning, the pair of holes are arranged in such a way that the fixed-side positioning hole and the moving-side positioning hole are located at positions shifted along the predetermined first direction.

Here, when the positioning pin is inserted into the fixed-side positioning hole and the moving-side positioning hole forming a hole pair at the aforementioned offset position, the second opposing member is at the position of the fixed-side positioning hole at the offset position Move relative to the fixed plate in a manner consistent with the position of the positioning hole on the moving side. If the second facing member moves relative to the fixed plate, the positional relationship between the first facing member and the second facing member changes. That is, according to this configuration, by inserting the positioning pin into the position of the fixed-side positioning hole and the moving-side positioning hole forming the hole pair with an appropriate offset, the first facing member and the second facing member can be adjusted The positional relationship between the probes arranged by the first facing member and the probes arranged by the second facing member can be adjusted. Therefore, even when the substrate to be inspected shrinks or stretches, it can be easily adjusted. The probes are properly contacted and set on the inspection points of the substrate to be inspected. As a result, it is easy to accurately inspect the substrate.

Furthermore, it is preferable that the first direction is along the direction in which the first facing member and the second facing member are arranged.

According to this structure, when the positioning pin is inserted into the fixed-side positioning hole and the moving-side positioning hole forming a hole pair at the aforementioned offset position At this time, the second facing member will move along the arrangement direction of the first facing member and the second facing member, that is, the probe arranged by the first facing member and the second facing member can be adjusted. The distance between the arranged probes makes it easy to appropriately contact the probes at the inspection points provided on the inspected substrate even when the inspected substrate shrinks or stretches. As a result, it is easy to accurately inspect the substrate.

Furthermore, the hole pairs located at the aforementioned offset positions are a plurality of hole pairs, and it is preferable that the offset amounts of the plurality of hole pairs along the aforementioned first direction are different from each other.

According to this configuration, by appropriately selecting the pair of holes into which the positioning pin is inserted, the amount of movement for moving the second opposing member can be changed. Thereby, the degree of freedom of position adjustment of the second opposed member is improved. As a result, the probe can be easily brought into proper contact with the inspection point provided on the substrate to be inspected, and the substrate inspection can be easily and accurately performed.

Furthermore, the at least one hole pair is a plurality of hole pairs whose offsets along the first direction are equal to each other, and the hole pairs located at the offset positions have the same offsets along the first direction. A plurality of holes is better.

According to this configuration, the positioning pin can be inserted into the fixed-side positioning hole and the movable-side positioning hole with a plurality of holes formed at mutually different positions in the second opposite configuration. As a result, the direction of the second opposing member mounted on the fixing plate can be specified. Therefore, the probe can be easily brought into proper contact with the inspection point provided on the substrate to be inspected. As a result, the substrate inspection can be easily and accurately performed.

Furthermore, the hole pairs located at the aforementioned offset positions include a plurality of groups, wherein each group includes a plurality of hole pairs whose offsets along the first direction are equal to each other, and the plurality of groups are along the first It is preferable that the offset amount in one direction is different from each other.

According to this configuration, by appropriately selecting a plurality of pairs of holes for inserting the positioning pins, the direction of the second facing member attached to the fixed plate can be specified, and the amount of movement for moving the second facing member can be changed. Thereby, the direction of the second facing member attached to the fixing plate can be specified and the degree of freedom of position adjustment of the second facing member can be improved. As a result, the probe can be easily brought into proper contact with the inspection point provided on the substrate to be inspected, and the substrate inspection can be easily and accurately performed.

Furthermore, the front end portion of the positioning pin is formed with an inclined surface inclined from the outer periphery of the positioning pin toward the shaft center and an angle formed with the axis of the positioning pin of 45 degrees or less, and a pair of holes located at the offset position The amount of offset along the first direction is preferably smaller than the width of the inclined surface along the direction orthogonal to the axis.

According to this structure, when the positioning pin is inserted into the pair of holes located at the aforementioned offset position, by the inclined surface, the second facing member will be offset toward the fixed-side positioning hole to be inserted and the moving-side positioning hole. Move in the direction of elimination. As a result, the second opposed member can be moved by inserting the positioning pin.

Furthermore, the positioning pin has a threaded portion formed on the rear end side, and a cylindrical positioning portion that is smaller in diameter than the threaded portion and extends from the front end of the threaded portion along the axis, and the inclined surface is formed At the front end of the positioning portion, a female thread portion screwed with the threaded portion is formed near the opening on the first surface side of the fixed side positioning hole, from the rear end of the positioning portion to the front end of the inclined surface The length in the axial direction is preferably shorter than the thickness of the fixing plate.

According to this configuration, when the positioning pin is inserted into the positioning hole on the fixed side and the threaded portion and the female threaded portion are screwed together, the positioning portion of the positioning pin is inserted into the positioning hole on the moving side. The axial length from the rear end of the positioning portion to the front end of the inclined surface is shorter than the thickness of the fixed plate. Therefore, when a positioning pin is inserted into the fixed-side positioning hole and the movable-side positioning hole forming a pair of holes, the Before the inclined surface reaches the periphery of the opening of the positioning hole on the moving side, the threaded part of the positioning pin will reach the female threaded part of the positioning hole on the fixed side, and the threads of each other will interfere with each other. In this state, when the positioning pin is rotated in the screw locking direction, the positioning pin will move toward the positioning hole on the moving side so that the inclined surface abuts against the periphery of the opening of the positioning hole on the moving side. Furthermore, when the positioning pin is rotated in the screw locking direction to move the positioning pin, the inclined surface and the periphery of the opening of the moving-side positioning hole will slide. As the positioning pin advances, the second opposing member will move toward The position of the fixed-side positioning hole moves in the same direction as the position of the moving-side positioning hole, and the positioning portion of the positioning pin is inserted into the moving-side positioning hole to position the fixed-side positioning hole and the moving-side positioning hole. Therefore, the second opposing member can be easily moved and positioned.

Furthermore, the front end of the positioning pin is formed in a spherical shape, and a part of the spherical shape forms an inclined surface inclined from the outer periphery of the positioning pin toward the axis. The pair of holes located at the offset position is along the first The deviation of the direction is compared with the tangent to the aforementioned inclined surface and the aforementioned positioning pin It is preferable that the distance between the tangent point of 45 degrees and the outer circumference of the positioning pin in the direction orthogonal to the axis is small.

According to this configuration, when the positioning pin is inserted into the pair of holes located at the aforementioned offset position, by the inclined surface, the second facing member will be offset toward the fixed-side positioning hole to be inserted and the movable-side positioning hole. Move in the direction of elimination. As a result, the second opposed member can be moved by inserting the positioning pin.

Furthermore, the positioning pin has a threaded portion formed on the rear end side, and a cylindrical positioning portion having a smaller diameter than the threaded portion and extending from the front end of the threaded portion along the axis, and the inclined surface is formed on At the front end of the positioning portion, a female thread portion for screwing with the threaded portion is formed near the opening portion on the first surface side of the fixed-side positioning hole, from the rear end of the positioning portion to the tangent point. The length in the axial direction is preferably shorter than the thickness of the aforementioned fixing plate.

According to this configuration, by inserting the positioning pin into the fixed-side positioning hole and the moving-side positioning hole forming the hole pair and tightening the screw, the second opposite member can be easily moved for positioning. Moreover, by making the inclined surface into a spherical shape, the angle formed by the inclined surface and the axis becomes smaller as the position of the axis of the locating pin is farther away. Therefore, the locating pin is moved by tightening the screw. The force of is effectively transformed into a force that moves the second opposing member. As a result, the force required to tighten the screw can be reduced.

Furthermore, the substrate inspection apparatus of the present invention has the above-mentioned inspection aid and the inspection apparatus equipped with the above-mentioned inspection aid Ontology.

According to this configuration, even when the substrate to be inspected is contracted or stretched, it is easy to appropriately contact the probe to the inspection point provided on the substrate to be inspected. As a result, a substrate inspection apparatus that can easily and accurately perform substrate inspection can be obtained.

Furthermore, a plurality of unit areas are provided on the substrate to be inspected, and the plurality of unit areas includes areas of the first area and the second area, and the inspection points are arranged in substantially the same arrangement. The main body of the device has: a driving part for relatively moving the substrate to be inspected and the inspection aid, and by the driving part, the probes are sequentially contacted with the inspection points of the unit areas, so that the A movement control unit in which the substrate to be inspected and the aforementioned inspection aid move relative to each other is preferable.

According to this structure, even if the distance between the plurality of unit areas is changed due to the shrinkage or expansion of the inspected substrate, the inspection aid can be moved to the appropriate position of each unit area. Therefore, even if the inspected substrate shrinks or extends In the case of, it is easy to appropriately contact the probe to the inspection point provided on the substrate to be inspected. As a result, a substrate inspection device that can easily and accurately perform substrate inspection can be obtained.

Furthermore, the substrate inspection method of the present invention uses the above-mentioned inspection aid to inspect the substrate to be inspected, and the substrate to be inspected is provided with a plurality of unit areas, and the plurality of unit areas includes the first area and the second area And the aforementioned inspection points are arranged in substantially the same configuration; the substrate inspection method includes: a board positioning step, The positioning pin is inserted into the fixed-side positioning hole and the moving-side positioning hole of at least one of the fixed-side positioning holes and the moving-side positioning holes of the plurality of hole pairs, and the fixed plate and the second facing member Positioning; and the moving step is to move the inspected substrate and the inspection aid relative to the inspection aid in such a way that the probes sequentially contact the inspection points of the unit areas.

According to this substrate inspection method, even if the distance between a plurality of unit areas and the positional relationship between the first area and the second area in each unit area are changed due to the shrinkage or expansion of the inspected substrate, it can correspond to the first The position between one area and the second area is changed, and the position of the second facing member of the fixed plate is appropriately positioned by the plate positioning step, that is, the first facing member and the second facing member can be adjusted The positional relationship of the components. Furthermore, with respect to the change in the distance between the unit areas, the inspection aid can be moved to the appropriate position of each unit area by the moving step. As a result, even when the substrate to be inspected shrinks or stretches, it is easy to appropriately contact the probe to the inspection point provided on the substrate to be inspected, and it is easy to accurately perform the substrate inspection.

Furthermore, the plurality of unit regions are arranged in a matrix along the first direction and a second direction perpendicular to the first direction, and in the moving step, the probes are arranged in order in contact with each other. In the manner of the inspection points of each unit area in a row in the second direction, after the substrate to be inspected and the inspection aid are moved relative to each other, in the board positioning step, it corresponds to the row adjacent to the first direction For the aforementioned unit area in the column, select the aforementioned plural holes A pair of holes between the fixed side positioning hole and the moving side positioning hole, the positioning pin is inserted into the selected fixed side positioning hole and the moving side positioning hole forming the hole pair to connect the fixed plate and the second facing member Positioning, in the subsequent moving step, so that the respective probes sequentially contact the inspection points of the respective unit areas adjacent in the first direction, so that the inspected substrate and the inspection assistant Relative movement is better.

According to this configuration, when a plurality of unit areas are arranged in a matrix, it is easy to appropriately bring the probe into contact with the inspection point provided on the substrate to be inspected.

The inspection aid, the substrate inspection apparatus, and the substrate inspection method configured as described above can easily and accurately perform the substrate inspection even when the substrate shrinks or stretches.

1‧‧‧Substrate inspection device

2‧‧‧Inspect the device body

3, 3U, 3D‧‧‧ inspection aids

4, 4U, 4D‧‧‧Inspection Department

5, 5U, 5D‧‧‧Drive mechanism of inspection aids

5X‧‧‧X Auxiliary Drive

5Y‧‧‧Y Auxiliary Drive

5Z‧‧‧Z Auxiliary Drive

5 θ‧‧‧θ auxiliary device drive part

6‧‧‧Substrate fixing device

7, 7U, 7D‧‧‧Drive mechanism of inspection department

8‧‧‧Frame

9‧‧‧Control Department

21, 211 to 217‧‧‧Fixed side positioning hole

22、221 to 227‧‧‧Locating acupuncture points on the mobile side

30a‧‧‧The first opposite member

30b‧‧‧The second opposite member

31‧‧‧Fixed plate

31a‧‧‧First side

31b‧‧‧Second side

32a, 32b‧‧‧Mounting plate

33a, 33b‧‧‧electrode plate

34a, 34b‧‧‧ facing plate

35‧‧‧Bolt

36‧‧‧Locating pin

37‧‧‧electrode

100‧‧‧Substrate (movement control unit)

320a‧‧‧First mounting surface

320b‧‧‧Second mounting surface

341a‧‧‧The first opposite surface

341b‧‧‧The second opposite surface

351‧‧‧through hole

361‧‧‧Positioning part

362‧‧‧inclined part

363‧‧‧Threaded part

364‧‧‧Tangling

A, A11 to A14, A21 to A24, A31 to A34‧‧‧Unit area

A1‧‧‧First area

A2‧‧‧Second area

B‧‧‧Kongbu

C‧‧‧Female thread

D‧‧‧offset

L1‧‧‧Thickness

L2, La, Lb‧‧‧Length

P1, P2‧‧‧Circuit board

Pr‧‧‧Probe

Px‧‧‧Cut point position

R‧‧‧angle

W‧‧‧Width

W1‧‧‧Distance

Fig. 1 is a front view schematically showing the structure of a substrate inspection apparatus for performing a substrate inspection method according to an embodiment of the present invention.

Fig. 2 is an explanatory diagram showing an example of the substrate shown in Fig. 1.

Fig. 3 is a conceptual diagram conceptually showing an example of the structure of the inspection unit drive mechanism and the inspection unit shown in Fig. 1.

Figure 4 is a plan view showing the state where the mounting plate is installed on the fixed plate.

Fig. 5 is a sectional view taken along the line V-V in Fig. 4.

Figure 6 is an explanatory diagram for explaining the role of the positioning pin when the positioning pin is inserted into the positioning hole on the fixed side and the positioning hole on the moving side forming the hole pair shown in Figure 5.

Fig. 7 is an explanatory diagram showing a state where the positioning pin is inserted into the fixed-side positioning hole and the moving-side positioning hole forming the hole pair shown in Fig. 5.

Fig. 8 is an explanatory diagram for explaining the positioning pin whose inclined surface is spherical.

Hereinafter, the embodiments of the present invention will be described in detail based on the drawings. In addition, in each figure, the structure which attached|subjected the same code|symbol means the same structure, and abbreviate|omits the description. Fig. 1 is a front view schematically showing the structure of a substrate inspection apparatus 1 for executing a substrate inspection method according to an embodiment of the present invention. The substrate inspection apparatus 1 shown in FIG. 1 is an apparatus for inspecting the circuit pattern of the substrate 100 formed on the inspection target substrate. In Fig. 1, the horizontal direction of the paper surface of the substrate inspection apparatus 1 is the X axis direction, the depth direction of the paper surface is the Y axis direction, and the vertical direction of the paper surface is the Z width direction.

The substrate 100 may be various substrates such as flexible substrates, rigid substrates such as epoxy resin glass fiber materials, electrode plates for liquid crystal displays or plasma displays, packaging substrates for semiconductor packaging, and film carriers. A wiring pattern is formed on the substrate 100, and inspection points are set to check the continuity, disconnection, short circuit, etc. of the wiring pattern. The predetermined locations of the wiring patterns, conductive pads, solder pads, electrodes, etc. can be appropriately set as inspection points.

Figure 2 shows an example of the substrate 100 shown in Figure 1 Illustration. The substrate 100 shown in FIG. 2 is, for example, a flexible substrate, and is an assembly substrate in which a plurality of circuit boards are assembled into one sheet. A plurality of unit areas A11 to A14, unit areas A21 to A24, and unit areas A31 to A34 of the circuit board P1 and the circuit board P2 are formed on the substrate 100 shown in FIG. The unit areas A11 to A14, the unit areas A21 to A24, and the unit areas A31 to A34 each include a first area A1 and a second area A2. In addition, the drawing of the wiring patterns and inspection points formed on the circuit substrates P1 and P2 is omitted in each figure. Hereinafter, the unit areas A11 to A14, the unit areas A21 to A24, and the unit areas A31 to A34 are collectively referred to as the unit area A.

The first area A1 is provided so as to include the inspection points formed on the circuit board P1, and the second area A2 is provided so as to include the inspection points formed on the circuit board P2. In the example shown in FIG. 2, the circuit board P1 and the circuit board P2 are the same circuit board. Considering the shape of the circuit boards P1 and P2, the circuit board P1 is rotated by 180 degrees and arranged so that the circuit boards P1 and P2 can be effectively obtained from the substrate 100.

In addition, the circuit board P1 and the circuit board P2 may be different circuit boards, or may be configured by arranging the same circuit boards in the same direction.

The substrate inspection apparatus 1 shown in FIG. 1 has an inspection apparatus body 2, an inspection aid 3U, and 3D. That is, the inspection apparatus main body 2 corresponds to the part after the inspection aids 3U and 3D are removed from the substrate inspection apparatus 1. The inspection device body 2 mainly includes: inspection parts 4U, 4D; inspection aids drive The moving mechanisms 5U, 5D; the substrate fixing device 6; the inspection section drive mechanisms 7U, 7D; the control section 9; and the housing 8 that houses these sections. The inspection aid drive mechanisms 5U, 5D and the inspection unit drive mechanisms 7U, 7D correspond to an example of the drive unit. The substrate fixing device 6 is configured to fix the substrate 100 to be inspected to a predetermined position.

The control unit 9 is composed of, for example, a power supply circuit that supplies current and voltage for inspection to the probe Pr, a detection circuit that detects the voltage and current signal detected by the probe, and a microcomputer, and executes a predetermined control program. The operation of each part of the substrate inspection apparatus 1 is controlled to perform the inspection of the substrate 100. The control unit 9 supplies voltage or current to, for example, each inspection point through the probe Pr, detects the voltage signal or current signal detected from each inspection point by the probe Pr, and compares the detected values from the detected values. The calculated resistance value and the like are compared with a reference value stored in advance, thereby performing an inspection of the substrate 100.

The inspection unit 4U is provided above the substrate 100 fixed to the substrate inspection device 6. The inspection part 4D is provided under the substrate 100 fixed to the substrate inspection device 6. The inspection unit driving mechanism 7U is a moving mechanism that moves the inspection unit 4U in the X-axis direction and the Y-axis direction. The inspection unit driving mechanism 7D is a moving mechanism that moves the inspection unit 4D in the X-axis direction and the Y-axis direction. The inspection unit driving mechanisms 7U, 7D can move the inspection units 4U, 4D to any position on the X-Y plane in accordance with a control signal from the control unit 9. Hereinafter, the inspection unit drive mechanisms 7U and 7D are collectively referred to as the inspection unit drive mechanism 7. The control unit 9 corresponds to an example of a movement control unit.

The inspection unit 4U, 4D is configured to be removable for inspection The inspection aids 3U and 3D that form the circuit pattern on the substrate 100. The inspection unit 4U and the inspection unit 4D have the same structure except that they are reversed up and down. Therefore, the inspection units 4U and 4D are collectively referred to as the inspection unit 4, and the inspection aid drive mechanisms 5U and 5D are collectively referred to as the inspection aid drive. In the mechanism 5, the inspection aids 3U and 3D are collectively referred to as the inspection aids 3. Hereinafter, the configuration of each part of the inspection units 4U and 4D will be collectively described by the collective term.

Fig. 3 is a conceptual diagram conceptually showing an example of the configuration of the inspection unit driving mechanism 7 and the inspection unit 4 shown in Fig. 1. The inspection unit 4 shown in FIG. 3 is configured by attaching the inspection aid 3 to the inspection aid driving mechanism 5.

The inspection aid 3 includes a fixing plate 31, a first facing member 30a, and a second facing member 30b. The fixing plate 31 has a plate-like shape, and one of its plate surfaces is set as a first surface 31a, and the other surface is set as a second surface 31b. The first surface 31a of the fixing plate 31 is installed in a manner that can be detached from the inspection aid driving mechanism 5. In addition, the fixed plate 31 may also be fixedly installed with respect to the inspection aid driving mechanism 5.

The first facing member 30 a and the second facing member 30 b are mounted on the second surface 31 b of the fixing plate 31.

The first facing member 30a is laminated in this order with: a plate-shaped mounting plate 32a mounted on the second surface 31b of the fixing plate 31, an electrode plate 33a formed with electrodes for contact with the probe Pr, and facing the substrate 100 It is constituted by the facing plate 34a arranged in the direction. The mounting plate 32a, the electrode plate 33a, and the opposing plate 34a are integrated by, for example, a locking device such as a bolt (not shown), an adhesive, or the like.

The mounting plate 32a is mounted to the fixing plate 31 by a plurality of bolts 35. The electrode plate 33a and the opposite plate 34a are formed with a through hole 351 for inserting a screwdriver for locking the bolt 35. The surface of the mounting plate 32a on the side of the fixed plate 31 is referred to as a first mounting surface 320a. Thereby, the first facing member 30a is integrally attached to the fixing plate 31.

The plate surface of the opposed plate 34a that is disposed opposite to the substrate 100 is referred to as a first opposed surface 341a. The facing plate 34a is formed with through holes for holding the probe Pr in a manner corresponding to the arrangement of the inspection points provided in the first area A1. The probe Pr is inserted into the through hole, and the tip of the probe Pr slightly protrudes from the first facing plate 341a.

The electrode plate 33a has electrodes 37 arranged corresponding to the through holes formed in the opposed plate 34a on the plate surface on the opposed plate 34a side. Thereby, the rear end of the probe Pr inserted into each through hole comes into contact with each electrode 37. Each electrode 37 is connected to the control unit 9 by a wire (not shown).

The second facing member 30b is laminated in this order: a plate-shaped mounting plate 32b mounted on the second surface 31b of the fixing plate 31, an electrode plate 33b formed with electrodes for contact with the probe Pr, and facing the substrate 100 The opposed plate 34b is arranged. The mounting plate 32b, the electrode plate 33b, and the opposing plate 34b are integrally formed by, for example, a locking device such as a bolt (not shown), an adhesive, or the like.

The mounting plate 32b is mounted to the fixing plate 31 by a plurality of bolts 35. The electrode plate 33b and the facing plate 34b are formed with a through hole 351 for inserting a screwdriver for locking the bolt 35. Mounting plate 32b to The plate surface on the side of the fixed plate 31 is referred to as the second mounting surface 320b. Thereby, the second facing member 30b is integrally attached to the fixing plate 31.

In the area where the second facing member 30b is installed on the second surface 31b of the fixing plate 31, fixed side positioning holes 211 to 217 are formed perpendicularly penetrating the fixing plate 31, and the fixed side positioning holes 211 to 217 are provided for The positioning pin 36 is inserted through.

The mounting plate 32b of the second opposite member 30b is formed with moving-side positioning holes 221 to 227 for positioning. The moving-side positioning holes 221 to 227 correspond to each of the fixed-side positioning holes 211 to 217 to form a hole pair. , And can accept the front end side of the positioning pin 36. In addition, although Fig. 3 shows an example in which the moving-side positioning holes 221 to 227 penetrate the mounting plate 32b, it is only necessary that the moving-side positioning holes 221 to 227 can receive the front end of the positioning pin 36 and do not have to penetrate the mounting plate 32b. .

The plate surface of the opposing plate 34b that is disposed opposite to the substrate 100 is referred to as a second opposing surface 341b. The opposing plate 34b is formed with through holes for holding the probe Pr in a manner corresponding to the arrangement of the inspection points provided in the second area A2. The probe Pr is inserted into the through hole, and is configured such that the tip of the probe Pr slightly protrudes from the second facing plate 341b.

The electrode plate 33b has electrodes 37 arranged corresponding to the through holes formed in the opposed plate 34b on the plate surface on the side of the opposed plate 34b. Thereby, the rear end of the probe Pr inserted into each through hole comes into contact with each electrode 37. Each electrode 37 is connected to the control unit 9 by a wire (not shown).

Figure 4 shows the mounting plate 32a installed on the fixed plate 31 A plan view of the state of the mounting plate 32b. FIG. 4 is a plan view viewed from the side of the first surface 31a of the fixing plate 31. FIG. The mounting plate 32a is formed in a shape corresponding to the first area A1 in a manner that can cover the first area A1. The mounting plate 32b is formed into a shape corresponding to the second area A2 in a manner that can cover the second area A2. In the example shown in Fig. 4, the arrangement direction of the mounting plate 32a and the mounting plate 32b is along the X axis direction, that is, the arrangement direction of the first facing member 30a and the second facing member 30b is along the X axis direction. The X-axis direction corresponds to an example of the first direction, and the Y-axis direction corresponds to an example of the second direction.

The mounting plates 32a and 32b are mounted to the fixing plate 31 by bolts 35 near the corners thereof. The fixing plate 31 is provided with fixing-side positioning holes 211 to 217 at three positions where the mounting plate 32b is installed.

Fig. 5 is a sectional view taken along the line V-V in Fig. 4. When the mounting plate 32b is mounted on the fixed plate 31 by bolts 35, on the second mounting surface 320b of the mounting plate 32b, the movable side positioning holes 221 to 227 are formed in a manner of forming a hole pair with the fixed side positioning holes 211 to 217 Positions corresponding to the positioning holes 211 to 217 on the fixing side of the fixing plate 31 respectively. In FIG. 5, although only one of the fixed-side positioning holes 211 to 217 and the movable-side positioning holes 221 to 227 provided at three locations is shown, since the other two locations have the same structure, the description thereof is omitted.

FIG. 6 is an explanatory diagram for explaining the function of the positioning pin 36 when the positioning pin 36 is inserted into the fixed-side positioning hole 214 and the movable-side positioning hole 224 forming the hole pair shown in FIG. 5. With reference to Figures 5 and 6, the positioning pins 36 and the fixed-side positioning holes 211 to 217 will be described below. And an example of the configuration of the moving-side positioning holes 221 to 227.

The positioning pin 36 has a cylindrical positioning portion 361, an inclined surface 362 provided at the front end of the positioning portion 361, and a threaded portion 363 having a larger diameter than the positioning portion 361 and a thread formed on the outer periphery. The threaded portion 363 is formed with a tool hole or tool groove for tightening a screw with a screwdriver.

The inclined surface 362 is inclined from the outer periphery of the positioning portion 361 toward the axis to form a cone shape, for example. The angle R formed by the inclined surface 362 and the axis of the positioning portion 361 is 45 degrees or less. In addition, the inclined surface 362 is not limited to a conical shape, and may be, for example, a truncated cone shape, a spherical shape, or other shapes.

Three positioning pins 36 are prepared corresponding to the three fixed-side positioning holes 211 to 217 and the moving-side positioning holes 221 to 227. Hereinafter, the fixed-side positioning holes 211 to 217 are collectively referred to as fixed-side positioning holes 21, and the mobile-side positioning holes 221 to 227 are collectively referred to as moving-side positioning holes 22.

Each of the fixed side positioning holes 211 to 217 is formed with a round hole portion B that can receive the positioning portion 361 with good accuracy, and a female thread portion C formed for screwing with the thread portion 363. The moving-side positioning holes 221 to 227 are formed in a circular hole shape with the same diameter as the hole B. The length L2 of the hole B is shorter than the length Lb of the positioning portion 361 of the positioning pin 36. Insert the positioning portion 361 of the positioning pin 36 into the fixed-side positioning holes 211 to 217, and screw the threaded portion 363 with the female threaded portion C, The positioning portion 361 of the positioning pin 36 is inserted into the positioning holes 221 to 227 on the moving side.

The example shown in Figure 5 shows that the positioning pin 36 has been inserted into the fixed side positioning hole 211 and the movable side positioning hole 221 forming a hole pair. state. Although the description is omitted in Figure 5, among the three fixed-side positioning holes 211 and moving-side positioning holes 221 that form a hole pair, the other two are fixed-side positioning holes 211 and moving-side positioning holes that form a hole pair. The hole 221 is also inserted into the positioning pin 36. In the following description, if the positioning pin 36 is inserted into a certain pair of the fixed-side positioning hole 211 and the movable-side positioning hole 221, it means that the designated positioning pin is inserted into the corresponding hole pair with the same symbol in all three places.

In a state where the positioning pin 36 is inserted into the fixed side positioning hole 211 and the moving side positioning hole 221 forming a hole pair, the central axis of the fixed side positioning hole 211 is consistent with the central axis of the moving side positioning hole 221. In this state, the pairs of holes other than the fixed-side positioning hole 211 and the moving-side positioning hole 221 become each pair of fixed-side positioning holes 211 to 217 and the moving-side positioning holes 221 to 227 located along the X direction. That is, a position shifted along the arrangement direction of the first facing member 30a and the second facing member 30b.

Specifically, for example, the moving-side positioning hole 222 is located at a position shifted by 20 μm in the −X direction (the left direction of the paper) with respect to the fixed-side positioning hole 212. In the following, the offset in the -X direction is given a "-" sign, and the offset in the +X direction is given a "+" sign to indicate. The moving side positioning hole 223 is located at a position offset by -40 μm relative to the fixed side positioning hole 213, the moving side positioning hole 224 is located at a position offset by -60 μm relative to the fixed side positioning hole 214, and the moving side positioning hole 225 is relative to The fixed-side positioning hole 215 is located at an offset of +20μm, the moving-side positioning hole 226 is located at an offset of +40μm relative to the fixed-side positioning hole 216, and the moving-side positioning hole 227 is located at an offset relative to the fixed-side positioning hole 217 +60μm position.

That is, each hole pair of the three fixed side positioning holes 212 to 217 and the moving side positioning holes 222 to 227 located at the positions shifted by the hole position includes a plurality of groups (the three fixed side holes forming the hole pair A set of positioning holes 212 and a moving-side positioning hole 222, a group of three fixed-side positioning holes 213 forming a hole pair and a moving-side positioning hole 223, ..., three fixed-side positioning holes forming a hole pair 217 and the moving-side positioning hole 227). These plural groups include a plurality of hole pairs (three fixed-side positioning holes 212 forming a hole pair) whose offsets along the X-axis direction are equal to each other. The fixed-side positioning holes 217 and the moving-side positioning holes 227 forming a hole pair with the moving-side positioning holes 222,..., and the offset amounts along the X-axis direction of these plural groups are different from each other.

The offset D of the fixed-side positioning holes 212 to 217 and the movable-side positioning holes 222 to 227 in the X-axis direction at the positions where the hole positions are offset is set to be along the inclined surface 362 of the positioning pin 36 The width W in the direction orthogonal to the axis is still small. Thereby, by inserting the positioning pins 36 into the fixed-side positioning holes 212 to 217 and the moving-side positioning holes 222 to 227 forming a hole pair, the inclined surface 362 causes the mounting plate 32b to face the fixed-side positioning hole and Move in the offset direction of the positioning point on the moving side.

Here, the bolt 35 is provided with a predetermined clearance with respect to the direction orthogonal to the axial direction of the bolt 35. The clearance of the bolt 35 is set to be greater than or equal to the largest displacement amount among the displacement amounts of the respective hole pairs. The example shown in FIG. 5 is provided with a clearance of 60 μm or more with respect to the +X direction and the -X direction. Therefore, when the positioning pin 36 is inserted with the bolt 35 slightly loosened, the mounting plate 32b can move within the range of the clearance of the bolt 35.

As shown in Figure 6, the total length La of the positioning portion 361 of the positioning pin 36 and the inclined surface 362, that is, the axial length La from the rear end of the positioning portion 361 to the tip of the inclined surface 362, is longer than the fixed side positioning hole 21 The depth is shorter, that is, shorter than the thickness L1 of the fixing plate 31. Thereby, for example, as shown in Fig. 6, when the positioning pin 36 is inserted into the fixed side positioning hole 214 and the moving side positioning hole 224 forming a pair of holes, the positioning pin 36 is positioned before the inclined surface 362 reaches the periphery of the opening of the moving side positioning hole 22 The threaded portion 363 will reach the female threaded portion C of the fixed side positioning hole 21, and the threads will interfere with each other and cannot be inserted linearly.

In this state, when a tool is used to rotate the positioning pin 36 in the direction of the locking screw, the positioning pin 36 will travel toward the moving side positioning hole 224, and the inclined surface 362 will abut against the periphery of the opening of the moving side positioning hole 22. Further, if the positioning pin 36 is rotated in the direction of the locking screw to move the positioning pin 36, the inclined surface 362 and the periphery of the opening of the moving-side positioning hole 22 will slide, and as the positioning pin 36 moves, the mounting plate 32b Will move in the direction that the position of the fixed side positioning hole 214 is consistent with the position of the mobile side positioning hole 224, the positioning portion 361 of the positioning pin 36 is inserted into the mobile side positioning hole 224 to position the fixed side positioning hole 214 and the mobile side positioning hole 224 .

When the total length La of the positioning portion 361 and the inclined surface 362 is longer than the thickness L1 of the fixed plate 31, even if the positioning pin 36 is linearly inserted into the fixed-side positioning hole 21 and the moving-side positioning hole forming a hole pair that are offset in position 22. The inclined surface 362 also abuts against the periphery of the opening of the positioning hole 22 on the moving side. If this state is to be maintained to push the positioning pin 36 for insertion, a very large pushing force is required.

However, as shown in FIG. 6, the total length La of the positioning portion 361 and the inclined surface 362 is shorter than the thickness L1 of the fixed plate 331. Therefore, even if the inclined surface 362 abuts on the periphery of the opening of the moving-side positioning hole 22, thereafter In a state where the positioning pin 36 is rotated with a tool such as a screwdriver, the fixing plate 31 and the mounting plate 32b can be positioned while moving the mounting plate 32b while inserting the positioning pin 36. Therefore, when the total length La of the positioning portion 361 and the inclined surface 362 is shorter than the thickness L1 of the fixing plate 31, the positioning by moving the mounting plate 32b becomes easy.

FIG. 7 is an explanatory diagram showing a state where the positioning pin 36 is inserted into the fixed-side positioning hole 214 and the moving-side positioning hole 224 forming the hole pair shown in FIG. 5. By inserting the positioning pins 36 into the fixed-side positioning holes 214 and the moving-side positioning holes 224 that form a hole pair as shown in FIG. 5, the mounting plate 32b can be moved. As shown in FIG. 7, the fixed-side positioning holes 214 and The positions of the positioning holes 224 on the moving side are the same. Then, the positioning pin 36 is inserted across the fixed-side positioning hole 214 and the moving-side positioning hole 224, and the mounting plate 32b is positioned relative to the fixed plate 31, that is, the second facing member 30b is fixed to the fixed plate The first facing member 30a of 31 is positioned.

As shown in FIG. 5, when the fixed-side positioning hole 211 is aligned with the movable-side positioning hole 221, the movable-side positioning hole 224 is arranged to be offset from the fixed-side positioning hole 214 in the −X direction by 60 μm. Therefore, if the positions of the fixed-side positioning hole 214 and the moving-side positioning hole 224 are aligned, as shown in FIG. 7, the mounting plate 32b formed with the moving-side positioning hole 224 is shifted by 60 μm in the +X direction.

Herein, the fixed side positioning hole 211 forming the hole pair With the moving side positioning hole 221 (the offset is zero), the fixed side positioning hole 212 and the moving side positioning hole 222 forming a hole pair, the fixed side positioning hole 213 and the moving side positioning hole 223 forming a hole pair, the hole forming the hole pair The fixed-side positioning hole 214 and the moving-side positioning hole 224, the fixed-side positioning hole 215 and the moving-side positioning hole 225 forming a hole pair, the fixed-side positioning hole 216 and the moving-side positioning hole 226 forming a hole pair, and the fixing of the hole pair The side positioning hole 217 and the moving side positioning hole 227 have different offsets. Therefore, the hole pair of a certain hole pair can be selected as the hole pair to be inserted into the positioning pin 36 to appropriately set the movement of the mounting plate 32b. The amount is the distance between the first facing member 30b and the second facing member 30b. In this case, the amount of movement of the mounting plate 32b is the offset between the fixed-side positioning hole and the moving-side positioning hole after the positioning pin 36 is inserted. Therefore, the first facing member 30b and the second facing member can be set with high accuracy. 30b interval.

In this way, even when the substrate 100 shrinks or stretches and the distance between the circuit substrate P1 and the circuit substrate P2 is changed from the design interval, the appropriate fixed side positioning for forming the hole pair can be selected according to the amount of change. Hole and the moving side positioning hole, and by inserting the positioning pin 36, the first facing member 30a and the second facing member 30b are accurately arranged on the circuit board P1 and the circuit board P2, so that the The probes Pr of the facing member 30a and the second facing member 30b are accurately arranged in contact with the inspection points of the circuit board P1 and the circuit board P2, and the board inspection can be easily and accurately performed.

FIG. 8 is an explanatory diagram for explaining the positioning pin 36 in which the inclined surface 362 is provided in a spherical shape, for example, a hemispherical shape. The positioning pin shown in Figure 8 In 36, from the line in the plane including the axis of the positioning pin 36 and the tangent line 364 to the spherical inclined surface 362 and the tangent point position Px where the angle R formed by the axis is 45 degrees, to the rear end of the positioning portion 361 The distance up to the direction along the axis, that is, the length La, is shorter than the thickness L1 of the fixing plate 31. Furthermore, the offset D is set to be: in a plane containing the tangent point position Px where the angle R formed by the tangent line 364 and the axis line is 45 degrees and the axis line, relative to the axis line from the tangent point position Px to the positioning portion 361 The distance in the orthogonal direction is less than W1.

In this way, similar to the positioning pin 36 shown in FIG. 6, by inserting the positioning pin 36 into the fixed-side positioning hole 214 and the moving-side positioning hole 224 and tightening the screws, the mounting plate 32b can be easily moved and positioned. Furthermore, by setting the inclined surface 362 into a spherical shape, the angle formed by the inclined surface 362 and the axis becomes smaller as the distance from the axis position becomes smaller. Therefore, the positioning pin 36 is moved by the locking screw. The force is efficiently converted into a force for moving the mounting plate 32b. As a result, compared to the case where the inclined surface 362 is in the shape of a cone or truncated cone, the force necessary to tighten the screw can be reduced.

On the other hand, when the inclined surface 362 has a conical shape like the positioning pin 36 shown in FIG. 6, the angle R formed by the positioning pin 36 and the shaft center can be easily set to 45 degrees up to the shaft center position. the following. Therefore, the offset amount of the fixed-side positioning hole 21 and the movable-side positioning hole 22 can be set to a value close to the radius of the positioning portion 361. Therefore, if the inclined surface 362 is formed in a conical shape, the fixed-side positioning hole 21 can be easily formed. The offset from the positioning hole 22 on the moving side increases.

Referring to Figure 3, the inspection aid drive mechanism 5 is from the bottom Column configuration: X-assisted device driving section 5X that moves the inspection aid 3 in the X-axis direction relative to the inspection device body 2, and Y-assisted device that is connected to the X-assisted device drive section 5X and moves the inspection aid 3 in the Y-axis direction The driving part 5Y, the θ assist driving part 5 θ connected to the Y assist driving part 5Y and rotating the inspection assist 3 around the Z axis, and the θ assist driving part 5 θ connected to the inspection assist 3 along the Z axis The Z-assisted device drive unit 5Z that moves in the direction.

Based on the above structure, the inspection aid drive mechanism 5 is constructed to be capable of positioning the inspection aid 3 relative to the substrate 100 in response to the control signal from the control unit 9 and position the inspection aid 3 in the vertical direction (Z direction) The probe Pr mounted on the inspection aid 3 is moved up and down to contact and separate the inspection point formed on the wiring pattern of the substrate 100.

Next, a description will be given of a substrate inspection method using the substrate inspection apparatus 1 equipped with the inspection aid 3 according to one embodiment of the present invention. In addition, since the inspection unit 4U performs the same operation as the inspection unit 4D, the description of the operation of the inspection unit 4D is omitted and the operation of the inspection unit 4U will be described.

Referring to FIG. 2, the substrate 100 is uneven in the distance between the unit areas A due to manufacturing tolerances, and in each unit area A, there is also a distance between the first area A1 and the second area A2. Produce unevenness. Therefore, in order for the probe Pr to correctly contact each inspection point in each unit area A, it is necessary to adjust the contact position of the probe according to the unevenness.

In this regard, in the substrate inspection method of the present invention, for the mutual position adjustment of the unit areas A, the inspection unit drive mechanism 7 and the inspection aid drive mechanism 5 are used to sequentially make each probe Pr contact each unit The method of the inspection point of the area A is adjusted by the movement step in which the inspection aid 3 moves. In addition, for the position adjustment between the first area A1 and the second area A2, the adjustment is performed by the plate positioning step. The plate positioning step is to insert the positioning pin 36 into the fixed side positioning hole 21 and the positioning hole 21 of the plurality of hole pairs. The fixed plate 31 and the second facing member 30b are positioned by a pair of the fixed side positioning hole 21 and the mobile side positioning hole 22 in the movable side positioning hole 22, thereby adjusting the first facing member 30a and the second facing member 30a. The distance to the member 30b.

For the moving step, for example, a camera is installed on the surface of the photographic substrate 100, and the control unit 9 controls the inspection unit drive mechanism 7 and the inspection aid drive based on the image of the unit area A (circuit board P1, P2) captured by the camera The driving of the mechanism 5 moves the inspection aid 3 so that the probe Pr contacts each inspection point provided in the unit area A of the inspection object.

The board positioning step is performed in the following manner, for example. First, the user measures the distance between the circuit board P1 and the circuit board P2 in the board 100 to be inspected, and calculates the difference from the design reference value. Then, the user first loosens the bolt 35 of the second facing member 30b, and selects the fixed-side positioning hole 21 and the moving-side positioning hole that form a hole pair that is set to an offset D that will cancel the calculated difference. 22. After inserting the positioning pin 36 into the hole pair and tightening the screw to adjust and position the position of the second opposing member 30b, lock the bolt 35 of the second opposing member 30b to fix it.

Through the above method, the expansion and contraction caused by the substrate 100 can be corrected. The resulting shift in the distance between the circuit board P1 and the circuit board P2 enables the probe Pr mounted on the first opposed member 30a and the probe Pr mounted on the second opposed member 30b to appropriately contact the circuit board P1. Check point and check point of circuit board P2.

The board positioning step can be performed appropriately at any timing. For example, the deviation of the interval between the circuit board P1 and the circuit board P2 usually varies depending on the manufacturing lot of the board 100. Therefore, the board positioning step can be performed for the manufacturing lot of the substrate 100.

Furthermore, for example, in the substrate 100 shown in FIG. 2, there may be an expansion and contraction method in which the unevenness of expansion and contraction in the X-axis direction becomes large. In this case, the inspection aid 3 can also be sequentially moved to the unit areas A11 to A14 arranged in a row along the Y-axis direction (the second direction) through the moving step, and after the inspection of the unit areas A11 to A14 is performed, cooperate with The interval between the first area A1 and the second area A2 of the unit areas A21 to A24 of the unit areas A11 to A14 arranged adjacently in the X-axis direction, the board positioning step is performed to adjust the first opposing member 30a and the second The distance between the two opposing members 30b, and the inspection aid 3 is sequentially moved to the unit areas A21 to A24 through the subsequent moving steps to perform the inspection of the unit areas A21 to A24.

In addition, although the second facing member 30b is shown as an example in which the mounting plate 32b, the electrode plate 33b, and the facing plate 34b are laminated, the second facing member 30b is not limited to the laminated structure, but may be integrated constitute. In addition, although an example is shown in which the moving-side positioning hole 22 is a through hole that penetrates the mounting plate 32b, the moving-side positioning hole 22 may not penetrate the mounting plate 32b, or may be a hole that penetrates the second opposing member 30b. Through hole.

Furthermore, although it is shown that the first area A1 and the second area A2 correspond to the circuit substrate P1 and the circuit substrate P2, respectively, and the circuit substrate P1 and the circuit substrate P2 are the same substrate, but the circuit substrate P1 and the circuit substrate P2 may also be based on Different substrates. In addition, although it is shown that the unit area A includes the circuit board P1 and the circuit board P2, it may be a configuration including only one circuit board. And for this one circuit substrate, the first area A1 and the second area A2 can also be set.

Furthermore, although it is shown that the first area A1 and the second area A2 are set, and the first facing member 30a corresponding to the first area A1 and the second facing member 30b corresponding to the second area A2 are provided, it is also The unit area A may be provided with a first area A and a plurality of second areas A2, and a first opposed member 30a corresponding to the first area A1 and a plurality of second opposed members corresponding to the plurality of second areas A2 may be provided Component 30b.

Furthermore, although it is shown that the fixed-side positioning holes 211 to 217 and the moving-side positioning holes 221 to 227 are provided at three places, they can also be provided at two or more places. Furthermore, the fixed side positioning holes 211 to 217 and the moving side positioning holes 221 to 227 may also be provided at one place. However, when the fixed-side positioning holes 211 to 217 and the moving-side positioning holes 221 to 227 are provided in a plurality of places, it is preferable that a plurality of positioning pins 36 can accurately determine the installation angle of the mounting plate 32b relative to the fixed plate 31 .

Furthermore, although an example in which the inclined surface 362 is formed at the tip of the positioning pin 36 is shown, it may be a configuration in which the inclined surface 362 is not provided. However, by having the inclined surface 362, the positioning pin 36 can be smoothly inserted into the shape The fixed-side positioning hole 21 and the moving-side positioning hole 22 are formed into a hole pair, and the force of inserting the positioning pin 36 can be converted into the force of moving the mounting plate 32b.

Furthermore, although an example is shown in which the positioning pin 36 is provided with the threaded portion 363 and the fixing plate 31 is provided with the female threaded portion C, the threaded portion 363 and the female threaded portion C may not be provided.

Furthermore, although an example is shown in which the inspection aid drive mechanisms 5U, 5D and the inspection aid drive mechanisms 7U, 7D, which are an example of the drive unit, move the inspection aid 3 to move the substrate 100 and the inspection aid 3 relative to each other, However, the substrate 100 and the inspection aid 3 may be moved relatively by moving the substrate 100 or both the substrate 100 and the inspection aid 3.

Furthermore, it is also possible to form a fixed-side positioning hole 21 in the area of the fixed plate 31 where the first facing member 30a is provided, and also form a movable-side positioning hole 22 in the first facing member 30a (mounting plate 32a) .

3‧‧‧Checking aids

4‧‧‧Inspection Department

5‧‧‧Examination aid drive mechanism

5X‧‧‧X Auxiliary Drive

5Y‧‧‧Y Auxiliary Drive

5Z‧‧‧Z Auxiliary Drive

5 θ‧‧‧θ auxiliary device drive part

7‧‧‧Drive mechanism of inspection department

211, 212, 217‧‧‧Fixed side positioning hole

221, 227‧‧‧Moving side positioning point

30a‧‧‧The first opposite member

30b‧‧‧The second opposite member

31‧‧‧Fixed plate

31a‧‧‧First side

31b‧‧‧Second side

32a, 32b‧‧‧Mounting plate

33a, 33b‧‧‧electrode plate

34a, 34b‧‧‧ facing plate

35‧‧‧Bolt

36‧‧‧Locating pin

37‧‧‧electrode

320a‧‧‧First mounting surface

320b‧‧‧Second mounting surface

341a‧‧‧The first opposite surface

341b‧‧‧The second opposite surface

351‧‧‧through hole

Pr‧‧‧Probe

Claims (12)

An inspection aid is installed in the inspection device body for inspecting the inspected substrate as the inspection object, and the probes are arranged in contact with a plurality of inspection points on the inspected substrate. The inspection aid is provided with: And a plate-shaped fixing plate on the second surface, and first and second facing members installed on the fixing plate; the first facing member has a first facing surface and a first mounting surface, the first facing The surface is configured to correspond to the arrangement of the inspection points in the first area of a part of the substrate to be inspected, and to be arranged opposite to the first area. The first mounting surface is installed on the The second surface of the fixed plate; the second facing member has a second facing surface and a second mounting surface, and the second facing surface is set on the substrate to be inspected and is different from the first area The above-mentioned probes are arranged corresponding to the arrangement of the inspection points of the two areas, and are arranged to be opposite to the above-mentioned second area. The second mounting surface is installed on the second surface of the fixing plate; One surface is used for mounting on the surface of the inspection device body. In the area where the second facing member is mounted on the second surface, a plurality of fixed side positioning holes are formed perpendicularly penetrating the fixing plate. The fixed-side positioning hole is used to insert a positioning pin for positioning; a movable-side positioning hole for positioning is formed on the second opposite member, and the movable-side positioning hole is connected to the plurality of fixed-side positioning holes A pair of holes are formed corresponding to each other, and can accept the front end side of the aforementioned positioning pin, and the aforementioned fixed-side positioning hole and the aforementioned movable-side positioning hole are set as a plurality of hole pairs; when the aforementioned positioning pin is inserted into the aforementioned plurality of hole pairs, The fixed-side positioning hole and the moving-side positioning hole of at least one of the side positioning hole and the moving-side positioning hole are paired, and the fixed-side positioning hole and the moving-side positioning hole are in a state where the fixed plate and the second facing member are positioned. The side positioning hole is located at a position shifted along the predetermined first direction. The hole pair is included in the plurality of hole pairs; the front end portion of the positioning pin is formed to be inclined from the outer periphery of the positioning pin to the shaft center relative to the foregoing The angle formed by the axis of the positioning pin is an inclined surface of 45 degrees or less; the offset of the hole pair at the aforementioned offset position along the aforementioned first direction is greater than that of the aforementioned inclined surface along orthogonal to the aforementioned axis The width of the direction is still small. The inspection aid described in claim 1, wherein the positioning pin has a threaded portion formed on the rear end side, and a diameter smaller than the threaded portion and extending from the front end of the threaded portion along the axis In the cylindrical positioning portion, the inclined surface is formed at the front end of the positioning portion, and a female threaded portion screwed with the threaded portion is formed near the opening on the first surface side of the fixed-side positioning hole. The length in the axial direction from the rear end of the positioning portion to the front end of the inclined surface is shorter than the thickness of the fixing plate. An inspection aid is installed in the inspection device body for inspecting the inspected substrate as the inspection object, and the probes are arranged in contact with a plurality of inspection points on the inspected substrate. The inspection aid is provided with: And a plate-shaped fixing plate on the second surface, and first and second facing members installed on the fixing plate; the first facing member has a first facing surface and a first mounting surface, the first facing The surface is configured to correspond to the arrangement of the inspection points in the first area of a part of the substrate to be inspected, and to be arranged opposite to the first area. The first mounting surface is installed on the The second surface of the fixed plate; the second facing member has a second facing surface and a second mounting surface, and the second facing surface is set on the substrate to be inspected and is different from the first area The above-mentioned probes are arranged corresponding to the arrangement of the inspection points of the two areas, and are arranged to be opposite to the above-mentioned second area. The second mounting surface is installed on the second surface of the fixing plate; One surface is used for mounting on the surface of the inspection device body. In the area where the second facing member is mounted on the second surface, a plurality of fixed side positioning holes are formed perpendicularly penetrating the fixing plate. The fixed-side positioning hole is used to insert a positioning pin for positioning; a movable-side positioning hole for positioning is formed on the second opposite member, and the movable-side positioning hole is formed corresponding to the plurality of fixed-side positioning holes. A pair of holes, and can accept the front end of the aforementioned positioning pin Side, and the fixed side positioning hole and the moving side positioning hole are set as a plurality of hole pairs; when the positioning pin is inserted into the fixed side positioning hole and the moving side positioning hole of the plurality of hole pairs, at least one hole pair Fixed-side positioning holes and moving-side positioning holes, and in a state where the fixed plate and the second facing member are positioned, the fixed-side positioning holes and the moving-side positioning holes are located at positions shifted along a predetermined first direction The hole pair is included in the plurality of hole pairs; the front end of the positioning pin is formed in a spherical shape, and a part of the spherical shape forms an inclined surface inclined from the outer circumference of the positioning pin to the axis, and is located at the offset The offset of the position of the hole pair along the first direction is greater than the tangent point at the angle formed by the tangent to the inclined surface and the axis of the positioning pin of 45 degrees to the outer circumference of the positioning pin The distance in the direction orthogonal to the aforementioned axis is still small. The inspection aid described in claim 3, wherein the positioning pin has: a threaded portion formed on the rear end side, and a diameter smaller than the threaded portion and extending from the front end of the threaded portion along the axis In the cylindrical positioning portion, the inclined surface is formed at the front end of the positioning portion, and a female threaded portion for screwing with the threaded portion is formed near the opening portion of the first surface side of the fixed side positioning hole. The length of the axial direction from the rear end of the positioning portion to the position of the tangent point is shorter than the thickness of the fixing plate. Inspection assistance as described in any one of items 1 to 4 in the scope of patent application A device, wherein the first direction is a direction along the arrangement direction of the first facing member and the second facing member. The inspection aid according to any one of items 1 to 4 in the scope of the patent application, wherein the hole pairs located at the aforementioned offset positions are a plurality of hole pairs, and the plurality of hole pairs are along the aforementioned first direction The offsets are different from each other. The inspection aid according to any one of items 1 to 4 in the scope of the patent application, wherein the at least one hole pair is a plurality of hole pairs whose offsets along the first direction are equal to each other, and are located in the offset The hole pairs at the shifted positions are a plurality of hole pairs whose offsets along the aforementioned first direction are equal to each other. The inspection aid described in item 7 of the scope of patent application, wherein the pair of holes at the aforementioned offset position includes a plurality of groups, and each group includes a plurality of equal offsets along the first direction. For each pair of holes, the offsets of the plurality of groups along the first direction are different from each other. A substrate inspection device is provided with the inspection aid described in any one of items 1 to 8 in the scope of patent application, and the inspection device body with the inspection aid installed thereon. The substrate inspection device described in claim 9, wherein a plurality of unit areas are provided on the substrate to be inspected, and the plurality of unit areas include areas of the first area and the second area, and are mutually related Roughly the same configuration but with the aforementioned checkpoints, The inspection device body has: a driving part that relatively moves the inspected substrate and the inspection aid; and the driving part allows the probes to sequentially contact the inspection points of the unit areas, A movement control unit that relatively moves the inspection substrate and the inspection aid. A substrate inspection method, which uses the inspection aid described in any one of items 1 to 8 of the scope of patent application to inspect the aforementioned substrate to be inspected. The substrate to be inspected is provided with a plurality of unit areas, the plurality of unit areas including The areas of the first area and the second area are arranged with the inspection points in substantially the same configuration; the substrate inspection method includes: a board positioning step, which is to insert the positioning pins into the plurality of hole pairs to fix The fixed side positioning hole and the moving side positioning hole of at least one of the side positioning hole and the moving side positioning hole are positioned, and the fixed plate and the second facing member are positioned; and the moving step is to make each probe By sequentially touching the inspection points of the respective unit areas, the inspected substrate and the inspection aid are moved relatively. The substrate inspection method described in claim 11, wherein the plurality of unit areas are arranged in a matrix along the first direction and a second direction perpendicular to the first direction, and in the moving step , So that the aforementioned probes sequentially contact the inspection points of the unit areas arranged in a row in the second direction In this way, after the substrate to be inspected and the inspection aid are moved relatively, in the plate positioning step, the plurality of hole pairs are selected for fixing corresponding to the unit area adjacent to the row in the first direction One of the side positioning holes and the moving side positioning holes, the positioning pin is inserted into the fixed side positioning hole and the moving side positioning hole forming the selected hole pair to position the fixed plate and the second opposite member In the subsequent moving step, the probes are sequentially contacted with the inspection points of the unit areas adjacent to the first direction, so that the substrate to be inspected and the inspection aid Move relatively.

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