JP2013164381A - Alignment method of substrate inspection device, and substrate inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an alignment method of a substrate inspection device which enables an efficient alignment of an inspection jig with an inspected substrate with an inexpensive constitution even when many inspection pins are disposed on the inspection jig.SOLUTION: When jig position information for a first inspection jig 13 is obtained based on an image taken by a first jig camera 21, a position of the jig is obtained in consideration of: a pin deviation average that is an average of deviations, from design positions, of positions in the XY direction of a part or all of a plurality of inspection pins 131 of the first inspection jig 13; and a jig position mark deviation that is a deviation, from a design position, of a position in the XY direction of a jig position mark disposed on the first inspection jig 13.

Description

  The present invention relates to an alignment method for a substrate inspection apparatus and a substrate inspection apparatus for adjusting a positional relationship between an inspection jig and a substrate to be inspected.

  As this type of prior art, for example, there is one described in Patent Document 1. In the technique described in Patent Document 1, positional information of a substrate to be inspected is acquired based on a captured image obtained by imaging the substrate to be inspected with a camera for a substrate, and the inspection jig is acquired with a camera for a jig. Based on the captured image obtained by imaging the tip of the inspection pin, the positional information of the inspection pin tip of the inspection jig is obtained, and based on the positional information, the positional relationship between the substrate to be inspected and the inspection jig is It is automatically requested (see abstract, etc.).

There's a problem.

JP 2000-346896 A

  However, the technique described in Patent Document 1 is a technique when only two inspection pins are provided on the inspection jig. For this reason, if the inspection jig is provided with a large number of inspection pins (for example, thousands of scales), the resolution is high and high in order to accurately acquire the position information of the tip of each inspection pin. There is a problem that an accurate imaging facility is required and the facility cost is too high.

  Further, in the conventional substrate inspection apparatus, the operator sets the movement distance in the Z direction when the inspection jig is brought close to the substrate to be inspected by the operator. For this reason, there is variation in the setting of the moving distance of the inspection jig, and the pressing force when the inspection pin of the inspection jig is brought into contact with the substrate to be inspected becomes too strong. May be insufficient. If the pressing force at the time of contact with the inspection jig becomes too strong, the substrate to be inspected will be warped when the inspection jig is in contact with it, so that the position of the inspection point provided on the substrate to be inspected will be delicate in the XY direction There is a case where a displacement or a displacement between the inspection pin of the inspection jig and the inspection point of the substrate to be inspected occurs.

  Therefore, the first problem to be solved by the present invention is that the alignment of the inspection jig and the substrate to be inspected can be performed with an inexpensive configuration even when the inspection jig is provided with a large number of inspection pins. In addition, the present invention provides an alignment method for a substrate inspection apparatus and a substrate inspection apparatus that can be performed efficiently.

  In addition, the second problem to be solved by the present invention is that the movement distance in the Z direction when the inspection jig is brought close to the substrate to be inspected can be stably set to an optimum value, and the inspection pin of the inspection jig is covered. It is an object of the present invention to provide an alignment method for a substrate inspection apparatus and a substrate inspection apparatus that can be brought into stable contact with inspection points on the inspection substrate.

  In order to solve the above-described problems, in the first aspect of the present invention, the inspection jig installed in the jig installation unit of the substrate inspection apparatus approaches and separates from the inspected substrate installed in the substrate installation unit. A substrate inspection that has a plurality of inspection pins that are in contact with a plurality of inspection points set on the substrate to be inspected, and that adjusts the positional relationship between the inspection jig and the substrate to be inspected. An alignment method for an apparatus, wherein a part or all of the plurality of inspection pins provided in the inspection jig installed in the jig installation portion from a design position of a pin position in the XY direction The deviation is measured, and the measured deviation is averaged to obtain the average pin deviation, and the deviation of the jig position mark provided on the inspection jig from the design position in the XY direction is measured to obtain the jig. The stage to acquire position mark deviation The step of registering the obtained pin deviation average and the jig position mark deviation individually or in combination with the board inspection apparatus, and the jig installation by the jig camera provided in the board inspection apparatus An image of the jig position mark of the inspection jig installed in the section, and the position of the jig position detected based on the position of the jig position mark in the captured image individually or A step of acquiring jig position information relating to the position of the inspection jig in the XY direction based on the pin deviation average and the jig position mark deviation which are pre-registered by combining; and provided in the substrate inspection apparatus. Imaging the substrate to be inspected installed in the substrate installation unit by the substrate camera, and obtaining substrate position information related to the position in the XY direction of the substrate to be inspected based on the captured image; Based on the jig position information and the substrate position information, the inspection jig and the inspection target are so arranged that the position of the inspection jig in the XY direction corresponds to the position of the inspection substrate in the XY direction. Adjusting the position of at least one of the substrates.

  According to a second aspect of the present invention, in the alignment method for a substrate inspection apparatus according to the first aspect, the pin deviation average and the jig position mark deviation acquired in advance are registered in the substrate inspection apparatus. The step is performed as the inspection jig installed in the jig installation unit is replaced.

  According to a third aspect of the present invention, in the alignment method for a substrate inspection apparatus according to the first or second aspect, a height along the Z direction of the inspection jig installed in the jig installation portion. Registering height information on the substrate inspection apparatus, and detecting a position of the surface of the substrate to be inspected installed in the substrate installation unit by a substrate surface position detection unit provided in the substrate inspection apparatus And the inspection jig when the inspection jig is brought into close contact with the inspection substrate based on the detected position information of the surface of the inspection substrate and the registered height information. Determining a movement distance in the Z direction.

  According to a fourth aspect of the present invention, there is provided a substrate inspection apparatus for inspecting electrical characteristics of a wiring pattern provided on a substrate to be inspected, each of which is in contact with a plurality of inspection points set on the substrate to be inspected. An inspection jig having a plurality of inspection pins, and a jig lifting / lowering driving mechanism for moving the inspection jig up and down in the Z-axis direction so as to approach and separate from the substrate to be inspected installed in a predetermined substrate installation portion. A jig camera that images a jig position mark provided on the inspection jig, a substrate camera that images the substrate to be inspected, and at least one of the inspection jig and the substrate to be inspected in the XY directions A position adjusting mechanism for adjusting the position; an electric characteristic detecting unit for detecting an electric characteristic of the wiring pattern of the substrate to be inspected via the inspection pin of the inspection jig; the jig lifting / lowering driving mechanism; Camera, substrate board And a control unit that controls the position adjustment mechanism and the electrical property detection unit, and performs pass / fail determination of the substrate to be inspected based on a detection result of the electrical property detection unit, and the control unit includes the inspection The pin deviation average obtained by measuring deviations from the design position of the pin positions in the XY direction of some or all of the plurality of inspection pins provided on the jig and averaging the measured deviations. And the jig position mark deviation obtained by measuring the deviation of the position of the jig position mark provided in the inspection jig from the design position in the X and Y directions individually or in combination and registered in advance. , The position in the X and Y directions of the inspection jig detected based on the position of the jig position mark in the image taken by the jig camera, and the pin deviation average and the jig registered in advance individually or in combination. Ingredients The jig position information related to the position of the inspection jig in the XY direction is acquired based on the displacement of the placement mark, and the substrate position related to the position of the inspection board in the XY direction based on the captured image of the substrate position correction camera. Information is acquired, and based on the acquired jig position information and the substrate position information, the position adjustment is performed so that the position in the XY direction of the inspection jig corresponds to the position in the XY direction of the substrate to be inspected. The position of at least one of the inspection jig and the substrate to be inspected is adjusted via a mechanism.

  According to the alignment method of the substrate inspection apparatus according to the first to third aspects of the present invention, the jig camera images the tip of the inspection pin of the inspection jig as in the technique described in Patent Document 1. Instead, since the jig position mark is provided on the inspection jig, it is not necessary to use an expensive camera such as a high-resolution camera for the jig camera.

  Further, when acquiring jig position information related to the position of the inspection jig based on the captured image of the jig camera, a part or all of the plurality of inspection pins of the inspection jig may be in the XY direction. The jig position is determined in consideration of the pin deviation average obtained by averaging the deviation of the pin position from the design position and the jig position mark deviation that is the deviation of the position of the jig position mark in the XY direction from the design position. . For this reason, even when a large number of inspection pins are randomly deviated from the design positions, the positional relationship between the inspection jig and the substrate to be inspected is made so that all inspection pins are brought into contact with the corresponding inspection points on the substrate to be inspected Can be reliably aligned in a possible state.

  In addition, the registration of the average pin deviation and the jig position mark deviation to the board inspection device does not require re-registration unless the inspection jig installed in the jig installation section is replaced. There will be no increase in burden.

  As a result, even when a large number of inspection pins are provided in the inspection jig, the alignment between the inspection jig installed in the jig installation section and the substrate to be inspected installed in the board installation section is performed. It can be performed efficiently with an inexpensive configuration.

  According to the alignment method of the substrate inspection apparatus according to the third aspect of the present invention, the inspection treatment is performed on the substrate to be inspected based on the detected position information of the surface of the substrate to be inspected and the registered height information. The movement distance in the Z direction of the inspection jig when the tool is brought into close contact with each other is determined. Therefore, it is possible to stably set the movement distance in the Z direction of the inspection jig when approaching the substrate to be inspected to an optimum value, and to stably contact the inspection pin of the inspection jig to the inspection point of the substrate to be inspected. be able to.

  According to the substrate inspection apparatus according to the fourth aspect of the present invention, substantially the same effect as the alignment method of the substrate inspection apparatus according to the first aspect of the present invention described above can be obtained.

It is a side view showing typically the partial composition of the substrate inspection device to which the alignment method of the substrate inspection device concerning one embodiment of the present invention is applied. It is a block diagram which shows the electrical structure of the board | substrate inspection apparatus of FIG. It is a side view showing the composition of the 1st inspection jig typically. It is a figure which shows the structure of the lower surface of the 1st pin holding member of a 1st test jig. It is a figure which shows the alignment procedure etc. It is a figure which shows typically the example of distribution of the shift | offset | difference from the design position of the 1st through-hole in which the test | inspection pin provided in the test | inspection jig | tool is inserted. It is a figure which shows typically the example of the position with respect to the design position of the pin deviation average obtained by averaging the deviation | shift of the 1st through-hole of FIG. It is a figure which shows typically the example of the shift | offset | difference of a jig position mark.

  A substrate inspection apparatus to which an alignment method for a substrate inspection apparatus according to an embodiment of the present invention is applied will be described with reference to FIGS.

  The substrate inspection apparatus 1 is for inspecting the electrical characteristics of a plurality of wiring patterns provided on a substrate 2 to be inspected. As shown in FIGS. 1 and 2, the substrate installation unit 11 and the substrate transport mechanism 12 are used. , First and second inspection jigs 13, 14, first and second jig installation portions 15, 16, first and second jig position adjusting mechanisms 17, 18, first and second jig lifting mechanisms 19. , 20, first and second jig cameras 21, 22, substrate camera 23, first and second substrate surface position detection units 24, 25, first and second connection switching units 31, 32, electrical characteristic detection unit 33. , An input receiving unit 34, a display unit 35, and a control unit 36.

  A plurality of wiring patterns are provided on the inspected substrate 2, and the inspection pins 131 and 141 of the first and second inspection jigs 13 and 14 are brought into contact with the upper and lower surfaces of the inspected substrate 2. Inspection points are set. The inspection contents for the inspected substrate 2 will be described later.

  The substrate installation unit 11 is provided with a plurality of holders 111 and 112 for holding the substrate 2 to be inspected. The inspected substrate 2 placed on the substrate placement unit 11 is transported by the substrate transport mechanism 12 together with the substrate placement unit 11. The substrate transport mechanism 12 is controlled by a mechanism control unit 361 of the control unit 36 described later.

  The first and second inspection jigs 13 and 14 are so-called collective contact jigs, and a plurality of inspection pins 131 and 141 that are brought into contact with inspection points set on the upper and lower surfaces of the substrate 2 to be inspected, respectively. And is replaceably attached to first and second jig installation portions 15 and 16 provided in the apparatus main body. The first inspection jig 13 is provided on the upper side of the inspected substrate 2 and is in contact with the upper surface of the inspected substrate 2. The second inspection jig 14 is provided below the substrate 2 to be inspected and is in contact with the lower surface of the substrate 2 to be inspected. The first and second inspection jigs 13 and 14 are inspected installed in the substrate installation section 11 by being driven up and down in the Z direction by first and second jig elevating mechanisms 19 and 20 described later. It approaches and separates from the upper and lower surfaces of the substrate 2.

  The rear ends of the inspection pins 131 and 141 of the inspection jigs 13 and 14 are in electrical contact with the electrode portions provided in the inspection jigs 13 and 14, and the electrode portions, lead wires, and a later-described first electrode. The electrical characteristic detection unit 33 is electrically connected via the first and second connection switching units 31 and 32.

  Here, with reference to FIG.3 and FIG.4, the structure of the 1st and 2nd inspection jigs 13 and 14 is further demonstrated. The first inspection jig 13 and the second inspection jig 14 are substantially the same except that the first inspection jig 13 has a smaller pin diameter and arrangement pitch of the inspection pins 131. Since this is the same, only the first inspection jig 13 will be described here for convenience of description.

  As shown in FIG. 3, the first inspection jig 13 includes a head portion 132 that holds a plurality of inspection pins 131 and an electrode unit 133 provided with the above-described electrode portions. The head portion 132 includes an inspection pin 131 and substantially plate-like first and second pin holding members 134 and 135 that hold the inspection pin 131. The first and second pin holding members 134 and 135 are connected to each other by a plurality of rod-like connecting members (for example, metal bars) 136 with a space in the longitudinal direction (Z direction) of the inspection pin 131. .

  As shown in FIG. 4, the first pin holding member 134 is provided with a plurality of first through holes 137 into which the distal end side of the inspection pin 131 is inserted and held, and the distal end portion of the connecting member 136 is inserted therein. Four second through holes 138 are provided. The second through holes 138 are provided at the four corners of the first pin holding member 134. Similarly, the second pin holding member 135 is also provided with a plurality of first through holes that are inserted and held at the rear end side of the inspection pin 131 and the rear end portion of the connecting member 136 is inserted and fixed. Four second through holes are provided.

  Further, on the opposing surfaces 13a, 14a of the first and second inspection jigs 13, 14 with the substrate 2 to be inspected, the position information of the first and second inspection jigs 13, 14 using camera images is acquired. The jig position mark 13b (see FIG. 8) is provided. In the present embodiment, the front surfaces of the four connecting members 136 are substantially flush with the opposing surfaces 13 a and 14 a of the first pin holding member 134 facing the substrate 2 to be inspected via the second through holes 138. Since the four connecting members 136 are exposed, the front end surfaces of the two connecting members 136 that face each other in the diagonal direction are set as the jig position mark 13b. In this way, by using a part of the structural member (here, the front end surface of the connecting member 136) constituting the first and second inspection jigs 13 and 14 as the jig position mark 13b, the jig position mark 13b is The jig position member 13b can be formed or set at an accurate position as compared with the case where it is provided by printing or the like. As a modified example, instead of the front end surface of the connecting member 136, two second through holes 138 that face each other diagonally out of the four second through holes 138 provided in the first pin holding member 134 are cured. The tool position mark 13b may be used.

  The first and second jig position adjusting mechanisms 17 and 18 are configured to include an XY drive mechanism and the like, and are controlled by a mechanism control unit 211 of the control unit 22 to be described later, so that the first and second jig installation units are arranged. The first and second inspection jigs 13 and 14 attached to 15 and 16 are driven in the X and Y directions within a two-dimensional plane to adjust their positions. As a modification, the first and second jig placement adjusting mechanisms 17 and 18 have a function of driving and adjusting the first and second inspection jigs 13 and 14 in the Z direction, and the first and second inspection jigs. One or both of the functions of driving the tools 13 and 14 in the rotational direction around the Z axis and adjusting their rotational positions may be provided.

  The first and second jig lifting / lowering mechanisms 19 and 20 include a drive unit having a cylinder mechanism and the like, and are controlled by the mechanism control unit 221 of the control unit 22 to be attached to the first and second jig installation units 15 and 16. The attached first and second inspection jigs 13 and 13 are moved up and down in the Z direction together with the first and second jig position adjusting mechanisms 17 and 18.

  The first and second jig cameras 21 and 22 respectively acquire positional information in the XY directions of the first and second inspection jigs 13 and 14 installed in the first and second jig installation parts 15 and 16, respectively. The lower surface of the first inspection jig 13 (the surface facing the substrate 2 to be inspected) and the upper surface of the second inspection jig 14 (the surface facing the substrate 2 to be inspected) can be imaged. Each of them is installed at a preset position. Then, the first and second jig cameras 21 are controlled by the mechanism control unit 361 of the control unit 36 as described later on the lower surface 13a of the first inspection jig 13 and the upper surface 14a of the second inspection jig 14. The tool position mark 13a is imaged, and the captured image information is given to the mechanism control unit 361. Note that the positions of the first and second jig cameras 21 and 22 (for example, positions in the XY directions) may be adjustable by a jig camera position adjustment unit that is driven by the control of the mechanism control unit 361. A method for acquiring position information and the like of the first inspection jig 13 using the captured images of the first and second jig cameras 21 and 22 will be described later.

  The substrate camera 23 is for acquiring positional information in the X and Y directions of the substrate 2 to be inspected installed on the substrate installation unit 11, and the upper surface (first surface) of the substrate 2 to be inspected installed on the substrate installation unit 11. The surface on the one inspection jig 13 side) is installed at a preset position where imaging can be performed. The board camera 23 takes an image of a position information acquisition index section (to be described later) of the board to be inspected 2 under the control of the mechanism control section 361 of the control section 36, and provides the captured image information to the mechanism control section 361. The position of the substrate camera 23 (for example, the position in the XY direction) may be adjustable by a substrate camera position adjustment unit that is driven by the control of the mechanism control unit 361. A method for acquiring the position information of the substrate 2 to be inspected using the captured image of the substrate camera 23 will be described later.

  The first and second substrate surface position detectors 24 and 25 are for detecting the positions in the Z direction of the upper surface and the lower surface of the substrate 2 to be inspected installed in the substrate placement unit 11, and are laser displacements. It is configured using a meter. The first and second substrate surface position detection units 24 and 25 are installed at preset positions, and are controlled by the mechanism control unit 361 of the control unit 36 to detect the upper surface and the lower surface of the inspected substrate 2. The position in the Z direction is detected, and the detection result is given to the mechanism control unit 361.

  More specifically, for example, the first and second substrate surface position detection units 24 and 25 are connected to the first and second substrate surface position detection units 24 and 25 and the upper surface and lower surface of the substrate 22 to be inspected. The distance in the Z direction is measured, and the measurement result is given to the mechanism control unit 361. The mechanism control unit 361 includes the first and second substrate surface position detection units 24 and 25 provided from the first and second substrate surface position detection units 24 and 25, and the upper and lower surfaces of the inspected substrate 22. And the Z direction relative to a preset reference position in the substrate inspection apparatus 1 of the first and second substrate surface position detection units 24 and 25 input in advance via the input receiving unit 34 Based on the position information (for example, the Z coordinate), the positions in the Z direction (for example, the Z coordinate) of the upper surface and the lower surface of the substrate 2 to be inspected are acquired.

  The first and second connection switching units 31 and 32 are configured to include a plurality of switching elements, and the corresponding first and second inspection jigs 13 are controlled by an inspection control unit 362 of the control unit 36 described later. , 14 and the electrical connection relationship between the power supply unit and the measurement unit (current measurement unit, potential difference measurement unit) in the electrical characteristic detection unit 33 are switched.

  The electrical characteristic detection unit 33 is controlled by the inspection control unit 362 of the control unit 22 and the electrical characteristics of the wiring pattern of the inspected substrate 2 via the inspection pins 131 and 141 of the first and second inspection jigs 13 and 14. And the detection result is given to the inspection control unit 362. More specifically, the electrical characteristic detection unit 33 includes a power source for applying a potential difference for inspection between wiring patterns or wiring patterns of the substrate 2 to be inspected, and a current flowing between the power source and the wiring pattern. And a potential difference measuring unit for measuring a potential difference applied between the wiring patterns or between the wiring patterns by the power supply unit.

  The input receiving unit 34 is for receiving an operation input and an information input, and includes an operation unit, an information reading unit for reading information from a disk type recording medium or a recording medium of a semiconductor memory type recording medium, and a local area network. An information fetching unit for fetching information via a network such as From the input receiving unit 34, jig information relating to the configuration of the first and second inspection jigs 13, 14, substrate information relating to the configuration of the substrate 2 to be inspected, and inspection contents and inspection procedures for the substrate 2 to be inspected. Information is entered. The jig information includes pin deviation average information and jig mark position deviation information of the first inspection jig 13 and height information of the first and second inspection jigs 13 and 14 to be described later.

  The display unit 35 is for displaying information for performing operation or setting, and displaying inspection results and the like, and is controlled by the control unit 22.

  The control unit 36 controls the substrate inspection apparatus 1, and as a functional element, a mechanism control unit 361 that mainly controls each mechanism part of the substrate inspection apparatus 1 and an inspection process for the substrate 2 to be inspected. The inspection control unit 362 is mainly provided. The role of the mechanism control unit 361 is to control the alignment between the inspected substrate 2 and the inspection jig 13 and to move the first and second inspection jigs 13 and 14 in the Z direction during inspection. The determination process of the moving distance of the 1st and 2nd inspection jigs 13 and 14 at the time of making it contact the upper surface and lower surface of the to-be-inspected board 2 is included. The positioning control and movement distance determination processing will be described with reference to FIG.

  As will be described below, the first inspection jig 13 is connected to the inspected substrate 2 in consideration of the deviation of the inspection pin 131 and the jig position mark 13b provided on the first inspection jig 13 from the design position. However, the second inspection jig 14 is aligned with the inspected substrate 2 without considering the deviation of the inspection pin 141 and the jig position mark from the design position. This is because the area and arrangement pitch of the inspection points on the lower surface of the substrate 2 to be in contact with the second inspection jig 14 are much larger than the area and arrangement pitch of the inspection points on the upper surface, Correspondingly, the inspection pin 141 of the second inspection pin 141 has a large pin diameter, an arrangement pitch, and the like, and each inspection pin 141 and the inspection point can be checked without considering a slight deviation between the inspection pin 141 and the jig position mark. This is because the positioning can be made so that the touches. However, as a modification, the position of the second inspection jig 14 with respect to the inspected substrate 2 in consideration of the deviation from the design position of the inspection pin 141 and the jig position mark as in the first inspection jig 13. You may make it match.

  As shown in FIG. 5, in step S <b> 1, information on the deviation of the inspection pin 131 and the jig position mark 13 b provided in the first inspection jig 13 from the design position is acquired, and the first and second inspection jigs are obtained. Height information along the Z direction of 13 is acquired. Information on the deviation and height information are acquired at the manufacturing stage or product completion of the first and second inspection jigs 13 and 14. Further, the acquisition of the information on the deviation and the height information does not need to be performed at a time such as measurement, and may be performed in separate steps as appropriate.

  Specifically, first, acquisition of deviation information of the inspection pin 131 and the jig position mark 13b provided in the first inspection jig 13 will be described. In the present embodiment, instead of measuring the deviation of the inspection pin 131 itself and the jig position mark itself from the design position, the inspection pin 131 and the connecting member 136 provided on the first pin holding member 134 are inserted. And the deviation from the design position of the 2nd through-holes 137 and 138 is measured, and pin deviation average and jig position mark deviation are acquired based on those deviations.

  More specifically, the acquisition of the average pin deviation and the jig position mark deviation is performed when the formation of the first through hole 137 in the first pin holding member 134 is completed. First, acquisition of an average pin deviation will be described. Measure the deviations (more specifically, the XY component of deviation) of the positions in the XY directions of all the first through holes 137 provided in the first pin holding member 134 into which the inspection pins 131 are inserted. Then, the average of the deviations is calculated. At this time, the average deviation is calculated by adding the X components and Y components of the deviation of each first through-hole 137, and calculating the average for each XY component. For example, the average pin deviation is obtained as an X component deviation displacement Ep1x and a Y component deviation displacement Ep1y based on the design position (origin) of each first through-hole 137.

  Here, FIG. 6 shows a distribution example of the deviation Ep with respect to each design position Dp1 of the first through-hole 137. FIG. 7 shows an example of the position of the pin deviation average Epa calculated as described above with respect to the design position Dp1.

  In the present embodiment, the average of the pin deviation is calculated by averaging the deviations of all the first through holes 137 into which the inspection pins 131 are inserted, but the first through holes provided in the first pin holding member 134 are calculated. An average pin deviation may be obtained by extracting some through holes 137 from 137 and measuring and averaging deviations from the design positions of the extracted through holes 137.

  Next, acquisition of jig position mark deviation will be described. The actual positions in the XY direction of the two through holes 138 corresponding to the jig position mark 13b of the second through holes 138 provided in the first pin holding member 134 are measured, as shown in FIG. A center position Mpc of a line segment connecting the two measured positions Mp is derived. On the other hand, the center position Dpc of the line segment connecting the design positions in the XY direction of the two through holes 138 corresponding to the jig position mark 13b is derived from the design information. Then, a deviation of the center position Mpc corresponding to the actual position of the through hole 138 from the center position Dpc corresponding to the design position is calculated, and the calculated deviation is set as a jig position mark deviation. At this time, the jig position mark deviation is calculated for each of the X component and the Y component. For example, the jig position mark displacement is obtained as an X component displacement displacement Ep2x and a Y component displacement displacement Ep2y with the center position Dpc of the center position Mpc as a reference (origin). Note that the method of acquiring the jig position mark deviation is not limited to the method described here, and various methods can be employed.

  Next, acquisition of the height information of the first and second inspection jigs 13 and 14 will be described. For obtaining the height information of the first and second inspection jigs 13 and 14, the height of the first and second inspection jigs 13 and 14 along the Z direction is set to the first and second inspection jigs 13 and 14. This is performed by obtaining the design information or by actually measuring the heights of the first and second inspection jigs 13 and 14 along the Z direction.

  In the subsequent step S2, the pin deviation average information, jig position mark deviation information, and height information of the first and second inspection jigs 13 and 14 acquired in step S1 are obtained from the substrate inspection. The data is input via the input receiving unit 34 of the apparatus 1 and registered in the mechanism control unit 361 of the control unit 36. The registration of the pin deviation average information and the like is normally performed along with replacement of the first and second inspection jigs 13 and 14. In the present embodiment, the registration of the pin deviation average and the jig position mark deviation is individually registered as separate information. However, the pin deviation average and the jig position mark deviation are combined to obtain 1 It may be registered as two composite deviations. At this time, the synthesis of the pin deviation average and the jig position mark deviation is performed by adding the X component deviation displacement and the Y component deviation displacement of each deviation.

  In subsequent step S3, jig position information regarding the positions of the first and second inspection jigs 13 and 14 is acquired. First, acquisition of jig position information of the first inspection jig 13 will be described. First, the jig position mark 13b on the lower surface 13a of the first inspection jig 13 installed in the first jig installation unit 15 is imaged by the first jig camera 21, and the jig position mark in the captured image is captured. Based on the position of 13b and position information (for example, XY coordinate information) of the first jig camera 21 with respect to a preset reference position in the board inspection apparatus 1, the inspection pin 131 and the jig position The position in the XY direction of the first inspection jig 13 that does not consider the deviation of the mark 13b is detected. At this time, the detected position of the first inspection jig 13 is represented by an X coordinate and a Y coordinate with respect to a reference position in the substrate inspection apparatus 1. The position information of the first jig camera 21 is input in advance via the input receiving unit 34 or automatically acquired by the substrate inspection apparatus 1.

  Subsequently, the position of the first inspection jig 13 detected based on the captured image is shifted and adjusted in the XY directions by the jig position mark deviation and pin deviation average registered in step S2, and this is adjusted. Thus, the position information in the XY directions of the first inspection jig 13 in consideration of the deviation between the inspection pin 131 and the jig position mark 13b is obtained. At this time, either the position shift due to the jig position mark deviation or the position shift due to the pin deviation average may be performed first, or the jig position mark deviation and the pin deviation average are pre-combined as one synthetic deviation. In addition, the position may be shifted at a time by the amount of the composition deviation.

  Next, acquisition of jig position information of the second inspection jig 14 will be described. As described above, since the positional accuracy required for the second inspection jig 14 when contacting the inspected substrate 2 is lower than that of the first inspection jig 13, the inspection pins 141 and the jig position marks The jig position information is acquired without considering the deviation. That is, the jig position mark on the lower surface 14a of the second inspection jig 14 installed in the second jig installation unit 16 is imaged by the second jig camera 22, and the jig position mark in the captured image is captured. Based on the position and position information (for example, XY coordinate information) of the second jig camera 22 with respect to a preset reference position in the board inspection apparatus 1 in the XY direction. The position of is detected. At this time, the detected position of the second inspection jig 14 is represented by an X coordinate and a Y coordinate with respect to a reference position in the substrate inspection apparatus 1. The position information of the second jig camera 22 is input in advance via the input receiving unit 34 or automatically acquired by the board inspection apparatus 1.

  In subsequent step S <b> 4, the inspected substrate 2 is sent to the inspection position facing the first and second inspection jigs 13 and 14 in a state where the inspected substrate 2 is installed on the substrate installation unit 11 by the substrate transport mechanism 12. The inspected substrate 2 sent to the inspection position is unloaded by the substrate transport mechanism 12 when the inspection described later is completed, and the next inspected substrate 2 is sent to the inspection position.

  In subsequent step S5, an index portion (for example, a mark or the like) for acquiring position information on the upper surface of the inspected substrate 2 set in advance in step S4 by the substrate camera 23 of the inspected substrate 2 is set. Based on the position of the index portion in the captured image and the position information (for example, XY coordinate information) of the substrate camera 23 with respect to the preset reference position in the substrate inspection apparatus 1 in the XY direction. The position in the XY direction of the inspection substrate 2 is detected. At this time, the detected position of the inspected substrate 2 is represented by an X coordinate and a Y coordinate with respect to a reference position in the substrate inspection apparatus 1. The position information of the substrate camera 23 is input in advance via the input receiving unit 34 or automatically acquired by the substrate inspection apparatus 1.

  In step S5, the positions of the upper surface and lower surface of the substrate 2 to be inspected set in the inspection position in the Z direction (for example, the Z coordinate) are the first and second substrate surfaces as described above. Detection is performed using the detection results of the position detectors 24 and 25.

  In subsequent step S6, based on the jig position information regarding the first and second inspection jigs 13 and 14 acquired in step S3 and the substrate position information regarding the substrate 2 to be inspected acquired in step S5, the inspection target is performed. First and second jig position adjustment so that the inspection pins 131 and 141 of the first and second inspection jigs 13 and 14 are aligned with the inspection points on the upper surface and the lower surface of the substrate 2 in the Z direction. The positions of the first and second inspection jigs 13 and 14 in the XY directions are adjusted by the mechanisms 17 and 18. In this alignment, the positions of the inspected substrate 2 and the second inspection jig 14 may be adjusted using the position of the first inspection jig 13 as a reference, or the second inspection jig 14 may be adjusted. The positions of the inspected substrate 2 and the first inspection jig 13 may be adjusted on the basis of

  In step S6, the height information of the first and second inspection jigs 13 and 14 registered in step S2 and the installation of the first and second jigs with respect to a preset reference position in the substrate inspection apparatus 1 are provided. The position information (for example, Z coordinate) of the parts 13 and 14 and the position in the Z direction (for example, Z coordinate) of the upper surface and the lower surface of the inspected substrate 2 acquired in step S5. Based on this, in order to bring the first and second inspection jigs 13 and 14 into contact with the substrate 2 to be inspected at the time of inspection, the moving distance for moving the first and second inspection jigs 13 and 14 in the Z direction is determined. .

  Of the processes in steps S1 to S6, the process in step S1 is performed in principle in the manufacturing stage of the first and second inspection substrates 13 and 14. The processes of steps S2 and S3 are performed in principle with the replacement of the first and second inspection jigs 13 and 14, respectively. The processes of steps S5 and S6 are performed each time a new inspected substrate 2 is introduced into the inspection position in principle. However, the processes in steps S5 and S6 are also performed only once when the first inspected substrate 2 is introduced into the inspection position when the first and second inspection jigs 13 and 14 are replaced. You may make it divert the setting content which was done also to the to-be-inspected board | substrate 2 introduce | transduced after that.

  Next, a control operation for inspection by the inspection control unit 222 of the control unit 22 will be described. At the time of inspection, the first and second inspection jigs 13 and 13 are driven in the Z direction by the first and second jig lifting mechanisms 19 and 20, and the inspection pins 131 and 14 of the first and second inspection jigs 13 and 14 are driven. The tip portion of 141 is brought into contact with the inspection points on the upper surface and the lower surface of the inspected substrate 2 set at the inspection position. The moving distance when the first and second inspection jigs 13 and 14 are moved in the Z direction at this time is the moving distance determined in step S6 of FIG. In this state, the inspection of the inspected substrate 2 is performed. After the inspection is completed, the first and second inspection jigs 13 and 14 are separated from the inspected substrate 2 and returned to their original positions.

  Examples of the inspection performed on the inspected substrate 2 by the substrate inspection apparatus 1 include a continuity inspection for inspecting the continuity of each wiring pattern and an insulation inspection for inspecting the insulation between the wiring patterns.

  In the continuity test, for example, any one of a plurality of wiring patterns is sequentially set as an inspection target. A potential difference is applied to the wiring pattern set as the inspection target in each inspection step by the inspection pins 131 and 141 of the first and second inspection jigs 13 and 14 through the inspection point, and the wiring pattern is applied to the wiring pattern. Measure the current that flows. And the quality determination regarding the electroconductivity of a wiring pattern is performed based on the resistance value derived | led-out based on the electric current value which flows through a wiring pattern at that time, or a current value.

  In the insulation inspection, for example, any one of the plurality of wiring patterns is sequentially set as the attention wiring pattern. In each inspection step, a potential difference is applied via an inspection point between the target wiring pattern and a relative wiring pattern including a part or all of the wiring patterns other than the target wiring pattern. To do. Then, the insulation between the target wiring pattern and the relative wiring pattern is inspected by measuring the presence or absence of a current flowing between the target wiring pattern and the relative wiring pattern.

  As described above, according to the present embodiment, the first jig camera 21 captures an image, not the tip of the inspection pin 131 of the first inspection jig 13 as in the technique described in Patent Document 1. In addition to the jig position mark 13b provided on the first and second inspection jigs 13, the imaging target may be one or two (in this embodiment, two) jig position marks 13b. It is not necessary to use an expensive camera such as a high resolution camera for the first and second jig cameras 21.

  Further, when acquiring jig position information related to the position of the first inspection jig 13 based on the captured image of the first jig camera 21, a part of the plurality of inspection pins 131 of the first inspection jig 13 or From all the inspection pins 131 (all in this embodiment), the average of pin deviations obtained by averaging the deviations from the design positions of the pin positions in the XY directions, and the design positions of the positions of the jig position marks 13b in the XY directions. The jig position is determined in consideration of the deviation of the jig position mark, which is a deviation of. For this reason, even when a large number of inspection pins 131 are randomly displaced from the respective design positions, the positional relationship between the first inspection jig 13 and the substrate 2 to be inspected, and all the inspection pins 131 correspond to the substrate 2 to be inspected. It is possible to reliably align with a state where it can be brought into contact with the inspection point.

  In addition, the registration of the pin deviation average and the jig position mark deviation to the substrate inspection apparatus 1 does not require re-registration unless the first inspection jig 13 installed in the first jig installation unit 15 is replaced. In practice, the burden on the operator is not increased.

  As a result, even when a large number of inspection pins 131 are provided on the first inspection jig 13, the first inspection jig 13 installed on the first jig installation portion 15 is set at the inspection position. The alignment with the substrate 2 to be inspected can be performed efficiently with an inexpensive configuration.

  Further, according to the present embodiment, the upper surface and the lower side of the inspected substrate 2 obtained by detecting the positions in the Z direction of the upper surface and the lower surface of the inspected substrate 2 set at the inspection position. Based on the position information of the surface and the height information of the first and second inspection jigs 13 and 14 registered in advance, the first and second inspection jigs 13 and 14 are brought into contact with the inspected substrate 2 at the time of inspection. In order to make this happen, the movement distance for moving the first and second inspection jigs 13 and 14 in the Z direction is determined. Therefore, the movement distance in the Z direction when the first and second inspection jigs 13 and 14 are brought close to the substrate 2 to be inspected can be stably set to an optimum value, and the first and second inspection jigs 13 and 14 The 14 inspection pins 131 and 141 can be stably brought into contact with the inspection points of the substrate 2 to be inspected.

  In the above-described embodiment, in the alignment of the first and second inspection jigs 13 and 14 with respect to the inspected substrate 2 using the captured images of the first and second jig cameras 21 and 22 and the substrate camera 23, Although only the alignment in the XY directions is performed, the alignment in the θ direction around the Z axis may also be performed. In this case, the first and second inspection jigs 13 and 14 are aligned with respect to the inspected substrate 2 in the θ direction by the first and second jig position adjusting mechanisms 17 and 18 with respect to the inspected substrate 2. This is performed by rotating the first and second inspection jigs 13 and 14 in the θ direction.

  DESCRIPTION OF SYMBOLS 1 Board | substrate inspection apparatus, 2 to-be-inspected board, 11 board | substrate installation part, 111,112 holder, 12 board | substrate conveyance mechanism, 13 1st inspection jig, 13b jig position mark, 131 inspection pin, 132 head part, 133 electrode unit, 134 1st pin holding member, 135 2nd pin holding member, 136 connecting member, 137 1st through hole, 138 2nd through hole, 14 2nd inspection jig, 141 inspection pin, 15 1st jig installation part , 16 2nd jig installation part, 17 1st jig position adjustment mechanism, 18 2nd jig position adjustment mechanism, 19 1st jig raising / lowering mechanism, 20 2nd jig raising / lowering mechanism, 21 1st jig camera, 22 second jig camera, 23 substrate camera, 24 first substrate surface position detection unit, 25 second substrate surface position detection unit, 31 first connection switching unit, 32 second connection switching unit, 33 electrical characteristic detection unit, 4 input receiving unit, 35 display unit, 36 control unit, 361 unit controller, 362 test controller.

Claims (4)

The inspection jig installed in the jig installation part of the board inspection apparatus can be moved close to and away from the board to be inspected installed in the board installation part, and a plurality of inspection points set on the board to be inspected A substrate inspection apparatus alignment method for adjusting a positional relationship between the inspection jig and the substrate to be inspected, each having a plurality of inspection pins in contact with each other,
The deviation from the design position of the pin position in the XY direction of a part or all of the plurality of inspection pins provided in the inspection jig installed in the jig installation unit was measured and measured. Averaging the deviations to obtain an average pin deviation, and measuring the deviation of the position of the jig position mark provided in the inspection jig from the design position in the XY direction to obtain the jig position mark deviation; ,
Registering the obtained pin deviation average and the jig position mark deviation individually or in combination with the substrate inspection apparatus;
The jig position mark of the inspection jig installed in the jig installation unit is imaged by a jig camera provided in the substrate inspection apparatus, and based on the position of the jig position mark in the captured image. The position of the inspection jig in the X and Y directions based on the position of the jig position detected in the X and Y directions and the pin deviation average and jig position mark deviation individually or combined and registered in advance. Obtaining jig position information;
The substrate camera provided in the substrate inspection apparatus images the substrate to be inspected installed in the substrate installation unit, and acquires substrate position information related to the position in the XY direction of the substrate to be inspected based on the captured image. Stages,
Based on the acquired jig position information and the substrate position information, the inspection jig and the object to be inspected so that the position in the XY direction of the inspection jig corresponds to the position in the XY direction of the inspected substrate. Adjusting the position of at least one of the inspection substrates;
A substrate inspection apparatus alignment method comprising: In the alignment method of the board | substrate inspection apparatus of Claim 1,
The step of registering the pin deviation average and the jig position mark deviation acquired in advance in the substrate inspection apparatus is performed as the inspection jig installed in the jig installation unit is replaced. An alignment method for a substrate inspection apparatus. In the alignment method of the board | substrate inspection apparatus of Claim 1 or Claim 2,
Registering height information regarding the height along the Z direction of the inspection jig installed in the jig installation unit in the substrate inspection apparatus;
Detecting the position of the surface of the substrate to be inspected installed in the substrate installation unit by the substrate surface position detection unit provided in the substrate inspection apparatus;
Based on the detected position information of the surface of the substrate to be inspected and the registered height information, Z of the inspection jig when the inspection jig is brought into close contact with the substrate to be inspected. Determining the direction travel distance;
An alignment method for a substrate inspection apparatus, further comprising: A substrate inspection apparatus for inspecting electrical characteristics of a wiring pattern provided on a substrate to be inspected,
An inspection jig having a plurality of inspection pins respectively brought into contact with a plurality of inspection points set on the substrate to be inspected;
A jig lifting / lowering driving mechanism that moves the inspection jig up and down in the Z-axis direction to approach and separate from the substrate to be inspected installed in a predetermined substrate installation unit;
A jig camera for imaging a jig position mark provided on the inspection jig;
A substrate camera for imaging the substrate to be inspected;
A position adjusting mechanism that adjusts the position in the XY direction of at least one of the inspection jig and the substrate to be inspected;
An electrical characteristic detector that detects electrical characteristics of the wiring pattern of the substrate to be inspected via the inspection pins of the inspection jig;
The jig lifting / lowering drive mechanism, the jig camera, the substrate camera, the position adjusting mechanism, and the electrical property detection unit are controlled, and the quality determination of the substrate to be inspected is performed based on the detection result of the electrical property detection unit. A control unit to perform,
With
The controller is
A pin obtained by measuring a deviation from a design position of a pin position in the XY direction of some or all of the plurality of inspection pins provided in the inspection jig and averaging the measured deviations The deviation average and the jig position mark deviation obtained by measuring the deviation of the position in the XY direction of the jig position mark provided on the inspection jig from the design position are registered in advance individually or in combination. And
The position in the XY direction of the inspection jig detected based on the position of the jig position mark in the image taken by the jig camera, and the pin deviation average and the jig registered in advance individually or in combination. Based on the position mark deviation, while obtaining jig position information regarding the position in the XY direction of the inspection jig,
Obtaining substrate position information related to the position of the inspected substrate in the X and Y directions based on the image captured by the substrate position correcting camera;
Based on the acquired jig position information and the substrate position information, the position of the inspection jig is adjusted via the position adjustment mechanism so that the position of the inspection jig in the XY direction corresponds to the position of the inspection substrate in the XY direction. A substrate inspection apparatus for adjusting a position of at least one of an inspection jig and the substrate to be inspected.

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