CN108291933B

CN108291933B - Inspection aid, substrate inspection device, and substrate inspection method

Info

Publication number: CN108291933B
Application number: CN201680068765.6A
Authority: CN
Inventors: 加藤穰; 冈本圭弘; 林明生; 山岸拓平
Original assignee: Nidec Read Corp
Current assignee: Nidec Read Corp
Priority date: 2015-11-25
Filing date: 2016-11-01
Publication date: 2020-11-03
Anticipated expiration: 2036-11-01
Also published as: JP2017096788A; TW201728912A; JP6613844B2; TWI710776B; CN108291933A; WO2017090385A1

Abstract

The invention provides an inspection aid, a substrate inspection device and a substrate inspection method, which can easily and accurately perform substrate inspection even if a substrate expands and contracts. The inspection aid comprises a plate-shaped fixing plate (31) and first and second opposing members (30a, 30b) mounted on the fixing plate and provided with probes, wherein the fixing plate is provided with a plurality of fixing-side positioning holes (211, 217) for inserting positioning pins (36) therethrough, the second opposing member is provided with moving-side positioning holes (221, 227) paired with the plurality of fixing-side positioning holes, respectively, and the fixing-side positioning holes and the moving-side positioning holes form pairs located at positions offset in the X-axis direction in a state where the fixing plate and the second opposing member are positioned by inserting the positioning pins into the fixing-side positioning holes and the moving-side positioning holes.

Description

Inspection aid, substrate inspection device, and substrate inspection method

Technical Field

The present invention relates to an inspection aid for bringing a probe into contact with a substrate, a substrate inspection apparatus including the inspection aid, and a substrate inspection method.

Background

The following techniques have been known: a plurality of unit substrates to be inspected are formed in a matrix of a plurality of rows and a plurality of columns to form a collective substrate, a plurality of inspection aids are arranged corresponding to inspection points of a plurality of adjacent unit substrates, and the plurality of unit substrates in the collective substrate are inspected at one time (see patent document 1).

Documents of the prior art

Patent document

Patent document 1: japanese laid-open patent publication No. H8-21867

Disclosure of Invention

However, in a collective substrate in which a plurality of unit substrates are arranged and collected on one substrate, inspection points of the unit substrates in the collective substrate are shifted from ideal positions in design in a manufacturing process of the collective substrate. This is because there are the following cases: when the substrates manufactured by the build-up structure are laminated, the substrates are fixed by high-temperature pressure welding, and the base materials constituting the substrates shrink. In particular, in the case of an aggregate substrate made of flexible substrates, since a thin and flexible material is used, the substrate tends to be elongated during the production thereof.

As described above, when the substrate contracts or expands, the positional relationship between the position of the inspection point to which the probe should be brought into contact and the probe attached to the inspection aid is shifted, and the substrate cannot be accurately inspected. In particular, in the case of the collective substrate, since the collective substrate includes a plurality of unit substrates, the substrate area is large. As a result, there are the following drawbacks: the positional displacement amount of the inspection point in the case where the substrate contracts or expands is likely to become large, and the possibility that the substrate inspection cannot be accurately performed increases.

The invention aims to provide an inspection aid, a substrate inspection device and a substrate inspection method, which can easily and accurately perform substrate inspection even under the condition that a substrate contracts or extends.

An inspection aid according to an aspect of the present invention is mounted to an inspection apparatus main body that inspects a substrate to be inspected as an inspection object, for bringing probes into contact with a plurality of inspection points provided on the substrate to be inspected, respectively, the inspection aid including: a plate-shaped fixing plate having a first surface and a second surface; and a first opposing member and a second opposing member that are attached to the fixed plate, the first opposing member being configured to dispose the probes so as to correspond to a configuration of inspection points provided in a first region of a part of the substrate to be inspected, and including: a first opposing surface configured to be disposed opposite to the first region; and a first mounting surface mounted to the second surface of the fixed plate, wherein the second opposing member is configured to dispose the probes so as to correspond to a configuration of inspection points provided in a second region of the inspected substrate different from the first region, and includes: a second opposing face for being disposed opposite the second region; and a second mounting surface that is mounted to the second surface of the fixing plate, wherein the first surface of the fixing plate is a surface for mounting to the inspection apparatus main body, a plurality of fixing-side positioning holes that penetrate the fixing plate vertically are formed in a region of the fixing plate where the second opposing member is mounted to the second surface, the plurality of fixing-side positioning holes being used for insertion of positioning pins for positioning, and a moving-side positioning hole for positioning is formed in the second opposing member, so that the fixing-side positioning holes and the moving-side positioning holes form a plurality of pairs, wherein the moving-side positioning holes and the plurality of fixing-side positioning holes respectively correspond to each other and form pairs and are capable of receiving end sides of the positioning pins, and the plurality of pairs include: the fixing-side positioning hole and the moving-side positioning hole are located in a pair at a position offset in a predetermined first direction in a state where the fixing plate and the second counterpart member are positioned by inserting the positioning pin into at least one pair of the fixing-side positioning hole and the moving-side positioning hole of the plurality of pairs.

According to this configuration, the first and second counter members, in which the probes are arranged so as to correspond to the arrangement of the inspection points provided on the substrate to be inspected, are mounted on the fixed plate. Further, a plurality of fixing-side positioning holes are formed in a region of the fixing plate to which the second counterpart is mounted. On the other hand, the second opposing member is formed with a moving-side positioning hole that is aligned in correspondence with each of the plurality of fixing-side positioning holes and that can receive the distal end side of the positioning pin. Then, if the fixing plate and the second counterpart member are positioned by inserting the positioning pin into at least one pair of the fixing-side positioning hole and the moving-side positioning hole among the plurality of pairs of fixing-side positioning hole and moving-side positioning hole, the pair of fixing-side positioning hole and moving-side positioning hole is provided as a pair arranged so as to be located at a position offset along the predetermined first direction.

When the positioning pin is inserted into the fixing-side positioning hole and the moving-side positioning hole of the pair located at the offset position, the second opposing member moves relative to the fixing plate so that the position of the fixing-side positioning hole located at the offset position coincides with the position of the moving-side positioning hole. If the second counterpart member is moved relative to the fixing plate, the positional relationship between the first counterpart member and the second counterpart member is changed. That is, according to this configuration, by inserting the positioning pin into the pair of the fixed-side positioning hole and the moving-side positioning hole having an appropriate offset amount, the positional relationship between the first opposing member and the second opposing member, that is, the positional relationship between the probe arranged by the first opposing member and the probe arranged by the second opposing member can be adjusted. Therefore, even when the substrate to be inspected contracts or expands, the probe can be easily brought into proper contact with the inspection point provided on the substrate to be inspected. As a result, the substrate inspection is easily and accurately performed.

Preferably, the first direction is a direction along an arrangement direction of the first opposing member and the second opposing member.

According to this configuration, when the positioning pin is inserted into the fixed-side positioning hole and the movable-side positioning hole of the pair located at the offset position, the second opposing member can be moved along the arrangement direction of the first opposing member and the second opposing member, that is, the interval between the probe arranged by the first opposing member and the probe arranged by the second opposing member can be adjusted. Therefore, even when the substrate to be inspected contracts or expands, the probe can be easily brought into proper contact with the inspection point provided on the substrate to be inspected. As a result, the substrate inspection is easily and accurately performed.

Preferably, the pair located at the offset position is a plurality of pairs, and the offset amounts of the plurality of pairs along the first direction are different from each other.

According to this configuration, by appropriately selecting the pair into which the positioning pin is inserted, the amount of movement by which the second opposing member is moved can be changed. This improves the degree of freedom in adjusting the position of the second opposing member. As a result, the probe pin can be easily brought into contact with the inspection point provided on the substrate to be inspected, and the substrate inspection can be easily and accurately performed.

Preferably, the at least one pair is a plurality of pairs having an offset amount equal to each other in the first direction, and the pair at the offset position is a plurality of pairs having an offset amount equal to each other in the first direction.

According to this configuration, the positioning pin can be inserted into the plurality of pairs of the fixing-side positioning hole and the moving-side positioning hole formed at different positions from each other of the second opposing member. As a result, the direction of the second opposing member attached to the fixed plate can be defined. Therefore, the probe pin can be easily brought into proper contact with the inspection point provided on the substrate to be inspected. As a result, the substrate inspection is easily and accurately performed.

Preferably, the pair located at the offset position includes a plurality of groups, each of the plurality of groups includes a plurality of pairs having an offset amount along the first direction equal to each other, and the plurality of groups have offset amounts along the first direction different from each other.

According to this configuration, by appropriately selecting the plurality of pairs into which the positioning pins are inserted, the direction of the second opposing member attached to the fixed plate can be defined, and the amount of movement for moving the second opposing member can be changed. This can regulate the direction of the second opposing member attached to the fixed plate, and can improve the degree of freedom in adjusting the position of the second opposing member. As a result, the probe pin can be easily brought into contact with the inspection point provided on the substrate to be inspected, and the substrate inspection can be easily and accurately performed.

Preferably, the tip end portion of the positioning pin is formed with an inclined surface inclined from the outer periphery of the positioning pin toward the axial center and forming an angle of 45 degrees or less with respect to the axis of the positioning pin, and an amount of deviation along the first direction of the pair at the position of the deviation is smaller than a width of the inclined surface along a direction perpendicular to the axis.

According to this structure, when the positioning pin is inserted into the pair located at the offset position, the second counterpart member is moved by the inclined surface in a direction to eliminate the offset between the fixing-side positioning hole and the moving-side positioning hole of the inserted pair. As a result, the second counterpart member can be moved by inserting the positioning pin.

Also, preferably, the positioning pin includes: a threaded portion formed on a rear end side; and a cylindrical positioning portion having a diameter smaller than that of the threaded portion and extending from a tip of the threaded portion along the axis, wherein the inclined surface is formed at a tip portion of the positioning portion, an internal thread portion for screwing with the threaded portion is formed in the vicinity of an opening portion on the first surface side of the fixing-side positioning hole, and a length in the axis direction from a rear end of the positioning portion to a tip of the inclined surface is shorter than a thickness of the fixing plate.

According to this structure, when the positioning pin is inserted into the fixing-side positioning hole and the threaded portion is screwed into the internal threaded portion, the positioning portion of the positioning pin is inserted into the moving-side positioning hole. Here, since the length in the axial direction from the rear end of the positioning portion to the tip end of the inclined surface is shorter than the thickness of the fixing plate, when the positioning pin is inserted into the pair of the fixing-side positioning hole and the moving-side positioning hole, the screw portion of the positioning pin reaches the internal thread portion of the fixing-side positioning hole and the threads of the positioning pin interfere with each other before the inclined surface reaches the opening peripheral edge of the moving-side positioning hole. When the positioning pin is rotated in the screw tightening direction in this state, the positioning pin moves forward in the direction of the shift-side positioning hole, and the inclined surface abuts against the opening periphery of the shift-side positioning hole. When the positioning pin is further rotated in the screw fastening direction to advance the positioning pin, the inclined surface slides along the periphery of the opening portion of the moving-side positioning hole, and the second counterpart member moves in a direction in which the position of the fixing-side positioning hole coincides with the position of the moving-side positioning hole as the positioning pin advances, so that the positioning portion of the positioning pin is inserted into the moving-side positioning hole, and the fixing-side positioning hole and the moving-side positioning hole are positioned. Therefore, the second opposing member is easily moved to perform positioning.

Preferably, the distal end portion of the positioning pin has a spherical shape, a part of the spherical shape is an inclined surface inclined from an outer periphery of the positioning pin toward an axial center, and an amount of displacement along the first direction of the pair of the displaced positions is smaller than a distance along a direction perpendicular to the axis from a tangent point position where an angle formed by a tangent to the inclined surface and the axis of the positioning pin is 45 degrees to the outer periphery of the positioning pin.

According to this structure, when the positioning pin is inserted into the center located at the offset position, the second counterpart member is moved by the inclined surface in a direction to eliminate the offset between the inserted fixing-side positioning hole and the moving-side positioning hole. As a result, the second counterpart member can be moved by inserting the positioning pin.

Also, preferably, the positioning pin includes: a threaded portion formed on a rear end side; and a cylindrical positioning portion having a diameter smaller than that of the threaded portion and extending from a tip of the threaded portion along the axis, wherein the inclined surface is formed at a distal end portion of the positioning portion, an internal thread portion for screwing with the threaded portion is formed in the vicinity of the first surface side opening portion of the fixing side positioning hole, and a length in the axis direction from a rear end of the positioning portion to the tangent point position is shorter than a thickness of the fixing plate.

According to this configuration, the positioning pin is inserted into the pair of the fixing-side positioning hole and the moving-side positioning hole to be screwed, and the second counterpart member is easily moved to be positioned. Further, since the angle formed by the inclined surface and the axial direction becomes smaller as the inclined surface becomes farther from the axial position of the positioning pin by making the inclined surface spherical, the force for advancing the positioning pin by screwing is efficiently converted into a force for moving the second opposing member. As a result, the force required for screw fastening can be reduced.

Also, a substrate inspection apparatus according to an aspect of the present invention includes: the inspection aid described above; and the inspection device main body to which the inspection aid is attached.

According to this configuration, even when the substrate to be inspected contracts or expands, the probe can be easily brought into proper contact with the inspection point provided on the substrate to be inspected, and as a result, the substrate inspection apparatus can be obtained in which the substrate inspection can be easily and accurately performed.

Preferably, the inspection apparatus main body includes a plurality of unit regions provided on the inspection target substrate, the plurality of unit regions including the first region and the second region, the inspection points being arranged in substantially the same arrangement as each other, and the inspection apparatus main body includes: a driving unit that moves the substrate to be inspected and the inspection jig relative to each other; and a movement control unit that moves the substrate to be inspected and the inspection aid relatively by the driving unit so that the probes are brought into contact with the inspection points of the unit regions in sequence.

According to this configuration, even when the interval between the plurality of unit regions changes due to contraction or expansion of the substrate to be inspected, the inspection aid can be moved to the position of each unit region. Therefore, even when the substrate to be inspected contracts or expands, the probe can be easily brought into proper contact with the inspection point provided on the substrate to be inspected. As a result, a substrate inspection apparatus that can easily and accurately perform substrate inspection can be obtained.

Further, a substrate inspection method according to an aspect of the present invention is a substrate inspection method for inspecting the inspected substrate on which a plurality of unit regions are provided, the plurality of unit regions being regions including the first region and the second region, and the inspection points being arranged in substantially the same arrangement as each other, using the inspection aid described above, the substrate inspection method including: a plate positioning step of inserting the positioning pins into at least one pair of the fixing-side positioning holes and the moving-side positioning holes of the plurality of pairs of fixing-side positioning holes and moving-side positioning holes to position the fixing plate and the second counterpart member; and a moving step of relatively moving the substrate to be inspected and the inspection jig so that the probes are brought into contact with the inspection points of the unit regions in sequence.

According to this substrate inspection method, even when the distance between the plurality of unit regions and the positional relationship between the first region and the second region in each unit region change due to contraction or expansion of the substrate to be inspected, the position of the second opposing member relative to the fixed plate can be appropriately positioned by the plate positioning step in accordance with the positional change between the first region and the second region, that is, the positional relationship between the first opposing member and the second opposing member can be adjusted. In addition, the inspection aid can be moved to the position of each unit region by the moving step with respect to the change in the interval between the unit regions. As a result, even when the substrate to be inspected contracts or expands, the probe can be easily brought into proper contact with the inspection point provided on the substrate to be inspected. As a result, the substrate inspection is easily and accurately performed.

Preferably, the plurality of unit regions are arranged in a matrix along the first direction and a second direction perpendicular to the first direction, the moving step relatively moves the substrate to be inspected and the inspection aid so that the probes are brought into contact with the inspection points of the unit regions in a row arranged in the second direction in order, the plate positioning step selects one of the plurality of pairs of fixing-side positioning holes and moving-side positioning holes corresponding to the unit regions in a row adjacent to the row in the first direction, the positioning pins are inserted into the fixing-side positioning holes and moving-side positioning holes of the selected pair to position the fixing plate and the second facing member, and the moving step relatively moves the substrate to be inspected and the inspection aid so that the probes are brought into contact with the inspection points of the unit regions in a row adjacent to the row in the first direction in order Point contact.

According to this configuration, when the plurality of unit regions are arranged in a matrix, it is easy to bring the probe into proper contact with the inspection point provided on the substrate to be inspected.

The inspection aid, the substrate inspection apparatus, and the substrate inspection method having such a configuration easily and accurately perform substrate inspection even when the substrate contracts or expands.

Drawings

Fig. 1 is a front view schematically showing the configuration of a substrate inspection apparatus that executes a substrate inspection method according to an embodiment of the present invention.

Fig. 2 is an explanatory view showing an example of the substrate shown in fig. 1.

Fig. 3 is a conceptual diagram conceptually showing an example of the structures of the inspection section driving mechanism and the inspection section shown in fig. 1.

Fig. 4 is a plan view showing a state where the mounting plate is attached to the fixing plate.

Fig. 5 is a cross-sectional view taken along line V-V of fig. 4.

Fig. 6 is an explanatory diagram for explaining the operation of the positioning pin when the positioning pin is inserted into the pair of the fixing-side positioning hole and the moving-side positioning hole shown in fig. 5.

Fig. 7 is an explanatory view showing a state in which a positioning pin is inserted in the pair of the fixing-side positioning hole and the moving-side positioning hole shown in fig. 5.

Fig. 8 is an explanatory view for explaining a positioning pin having a spherical inclined surface.

Detailed Description

Embodiments according to the present invention will be described below with reference to the drawings. Note that the same reference numerals denote the same components in the drawings, and a description thereof will be omitted. Fig. 1 is a front view schematically showing the configuration of a substrate inspection apparatus 1 that executes a substrate inspection method according to an embodiment of the present invention. The substrate inspection apparatus 1 shown in fig. 1 is an apparatus for inspecting a circuit pattern formed on a substrate 100 as an inspection target substrate. In fig. 1, the substrate inspection apparatus 1 is shown with the X-axis direction as the left-right direction of the drawing, the Y-axis direction as the depth direction of the drawing, and the Z-axis direction as the up-down direction of the drawing.

The substrate 100 may be, for example, a flexible substrate, a rigid substrate such as a glass epoxy plate, an electrode plate for a liquid crystal display or a plasma display, a package substrate for semiconductor packaging, a film carrier, or other various substrates. A wiring pattern is formed on the substrate 100, and inspection points for inspecting conduction, disconnection, short circuit, and the like of the wiring pattern are set. As the inspection point, a predetermined portion of the wiring pattern, a pad (pad), a land (land), an electrode, and the like are appropriately set.

Fig. 2 is an explanatory diagram illustrating an example of the substrate 100 shown in fig. 1. The substrate 100 shown in fig. 2 is, for example, a flexible substrate, and is an aggregate substrate in which a plurality of circuit boards are aggregated into one. The substrate 100 shown in fig. 2 includes a plurality of unit regions a11 to a14, unit regions a21 to a24, and unit regions a31 to a34, which are a set of a circuit board P1 and a circuit board P2. The unit regions a11 to a14, the unit regions a21 to a24, and the unit regions a31 to a34 include a first region a1 and a second region a2, respectively. Note that in each drawing, description of wiring patterns and inspection points formed on the circuit boards P1 and P2 is omitted. Hereinafter, the unit regions a11 to a14, the unit regions a21 to a24, and the unit regions a31 to a34 are collectively referred to as a unit region a.

The first region a1 is disposed so as to include a check point formed on the circuit board P1, and the second region a2 is disposed so as to include a check point formed on the circuit board P2. In the example shown in fig. 2, the circuit board P1 is the same circuit board as the circuit board P2. The circuit board P2 is configured by rotating the circuit board P1 by 180 degrees in consideration of the shapes of the circuit boards P1, P2, so that the circuit boards P1, P2 can be efficiently obtained from the substrate 100.

The circuit boards P1 and P2 may be different circuit boards, or the same circuit board may be arranged in the same direction.

The substrate inspection apparatus 1 shown in fig. 1 includes an inspection apparatus main body 2, inspection aids 3U, 3D. That is, the inspection device main body 2 corresponds to a portion where the inspection aids 3U and 3D are removed from the substrate inspection device 1. The inspection apparatus main body 2 mainly includes

inspection units

4U and 4D, inspection

aid driving mechanisms

5U and 5D, a substrate fixing device 6, inspection unit driving mechanisms 7U and 7D, a control unit 9, and a case 8 accommodating these components. The inspection

aid driving mechanisms

5U and 5D and the inspection unit driving mechanisms 7U and 7D correspond to an example of the driving unit. The substrate fixing device 6 is configured to fix the substrate 100 to be inspected at a predetermined position.

The control unit 9 is configured by using, for example, a power supply circuit for supplying a current and a voltage for inspection to the probes Pr, a detection circuit for detecting a voltage signal or a current signal detected by the probes Pr, a microcomputer, or the like, and executes a predetermined control program to control operations of the respective units of the substrate inspection apparatus 1 to inspect the substrate 100. The control unit 9 supplies a voltage or a current to each inspection point via the probe Pr, for example, detects a voltage signal or a current signal detected from each inspection point by the probe Pr, and compares the detected value or a resistance value calculated from the detected value with a reference value stored in advance, thereby inspecting the substrate 100.

The inspection unit 4U is located above the substrate 100 fixed to the substrate fixing device 6. The inspection unit 4D is located below the substrate 100 fixed to the substrate fixing device 6. The inspection unit driving mechanism 7U is a moving mechanism that moves the inspection unit 4U in the X-axis direction and the Y-axis direction. The inspection unit driving mechanism 7D is a moving mechanism that moves the inspection unit 4D in the X-axis direction and the Y-axis direction. The inspection unit driving mechanisms 7U and 7D can move the

inspection units

4U and 4D to arbitrary positions on the X-Y plane in accordance with control signals from the control unit 9. Hereinafter, the inspection unit driving mechanisms 7U and 7D are collectively referred to as the inspection unit driving mechanism 7. The control unit 9 corresponds to an example of a movement control unit.

The

inspection units

4U and 4D are configured to be attachable to and detachable from inspection aids 3U and 3D for inspecting circuit patterns formed on the substrate 100. Since the inspection unit 4U and the inspection unit 4D are configured in the same manner except that they are turned upside down, the

inspection units

4U and 4D will be hereinafter collectively referred to as the inspection unit 4, the inspection

aid driving mechanisms

5U and 5D will be hereinafter collectively referred to as the inspection aid driving mechanism 5, the inspection aids 3U and 3D will be hereinafter collectively referred to as the inspection aid 3, and the configurations of the respective parts of the

inspection units

4U and 4D will be hereinafter collectively described by the general terms.

Fig. 3 is a conceptual diagram conceptually showing an example of the structures of the inspection unit drive mechanism 7 and the inspection unit 4 shown in fig. 1. The inspection unit 4 shown in fig. 3 is configured by mounting the inspection aid 3 on the inspection aid driving mechanism 5.

The inspection aid 3 includes a fixing plate 31, a first opposing member 30a, and a second opposing member 30 b. The fixing plate 31 has a plate-like shape, and one plate surface thereof is a first surface 31a and the other plate surface is a second surface 31 b. The first surface 31a of the fixing plate 31 is detachably attached to the inspection aid driving mechanism 5. The fixing plate 31 may be fixedly attached to the detection accessory drive mechanism 5.

The first opposing member 30a and the second opposing member 30b are attached to the second surface 31b of the fixed plate 31.

The first opposing member 30a is configured by sequentially laminating a lower plate: a plate-like attachment plate 32a attached to the second surface 31b of the fixed plate 31; an electrode plate 33a on which an electrode for contacting the probe Pr is formed; and an opposing plate 34a disposed opposite to the substrate 100. The attachment plate 32a, the electrode plate 33a, and the counter plate 34a are integrated with each other by fasteners such as bolts, adhesives, or the like.

The mounting plate 32a is mounted to the fixed plate 31 by a plurality of bolts 35. A through hole 351 into which a driver for screwing the bolt 35 is inserted is formed in the electrode plate 33a and the counter plate 34 a. The plate surface of the mounting plate 32a on the fixed plate 31 side is the first mounting surface 320 a. Thereby, the first opposing member 30a is integrally attached to the fixed plate 31.

The plate surface of the opposing plate 34a on the side opposing the substrate 100 is a first opposing surface 341 a. Through holes for holding the probes Pr are formed in the counter plate 34a so as to correspond to the arrangement of the inspection points provided in the first region a 1. The probe Pr is inserted into the through hole, and a distal end portion of the probe Pr slightly protrudes from the first opposing surface 341 a.

An electrode 37 is formed on the surface of the electrode plate 33a on the side of the opposing plate 34a, and the electrode 37 is disposed so as to correspond to each through hole formed in the opposing plate 34 a. Thereby, the rear end portions of the probes Pr inserted into the respective through holes are brought into contact with the respective electrodes 37. Each electrode 37 is connected to the control unit 9 by a cable not shown in the figure.

The second counter member 30b is formed by sequentially laminating a lower plate: a plate-like attachment plate 32b attached to the second surface 31b of the fixed plate 31; an electrode plate 33b on which an electrode for contacting the probe Pr is formed; and an opposing plate 34b disposed opposite the substrate 100. The attachment plate 32b, the electrode plate 33b, and the counter plate 34b are integrated with each other by fasteners such as bolts, adhesives, or the like.

The mounting plate 32b is mounted to the fixed plate 31 by a plurality of bolts 35. A through hole 351 into which a driver for screwing the bolt 35 is inserted is formed in the electrode plate 33b and the counter plate 34 b. The plate surface of the mounting plate 32b on the fixed plate 31 side is the second mounting surface 320 b. Thereby, the second counter member 30b is integrally attached to the fixed plate 31.

Fixing-side positioning holes 211 to 217 penetrating the fixing plate 31 vertically are formed in a region of the fixing plate 31 where the second counterpart 30b is attached to the second surface 31 b. The fixing-side positioning holes 211 to 217 are through holes for inserting the positioning pins 36 for positioning.

The mounting plate 32b of the second facing member 30b is formed with moving-side positioning holes 221 to 227 for positioning, and these moving-side positioning holes 221 to 227 are paired in correspondence with the respective fixing-side positioning holes 211 to 217 and can receive the distal end sides of the positioning pins 36. Although fig. 3 shows an example in which the moving-side positioning holes 221 to 227 penetrate the mounting plate 32b, the moving-side positioning holes 221 to 227 need only receive the distal end portions of the positioning pins 36, and need not penetrate the mounting plate 32 b.

The plate surface of the opposing plate 34b on the side opposing the substrate 100 is a second opposing surface 341 b. Through holes for holding the probes Pr are formed in the counter plate 34b so as to correspond to the arrangement of the inspection points provided in the second region a 2. The probe Pr is inserted into the through hole, and the distal end portion of the probe Pr slightly protrudes from the second opposing surface 341 b.

An electrode 37 is formed on the surface of the electrode plate 33b on the side of the opposing plate 34b so as to correspond to each through hole formed in the opposing plate 34 b. Thereby, the rear end portions of the probes Pr inserted into the respective through holes are brought into contact with the respective electrodes 37. Each electrode 37 is connected to the control unit 9 by a cable not shown in the figure.

Fig. 4 is a plan view showing a state in which the mounting plate 32a and the mounting plate 32b are mounted on the fixing plate 31. Fig. 4 shows a plan view of the fixing plate 31 viewed from the first surface 31a side. The mounting plate 32a has a shape corresponding to the first area a1 so as to cover the first area a 1. The mounting plate 32b has a shape corresponding to the second area a2 so as to cover the second area a 2. In the example shown in fig. 4, the arrangement direction of the mounting

plates

32a and 32b is along the X-axis direction, that is, the arrangement direction of the first opposing member 30a and the second opposing member 30b is along the X-axis direction. The X-axis direction corresponds to an example of the first direction, and the Y-axis direction corresponds to an example of the second direction.

The mounting

plates

32a and 32b are mounted to the fixed plate 31 near the corners thereof by bolts 35. Fixing-side positioning holes 211 to 217 are provided at three positions on the fixing plate 31 where the mounting plate 32b is mounted.

Fig. 5 is a cross-sectional view taken along line V-V of fig. 4. In a state where the mounting plate 32b is mounted to the fixing plate 31 by the bolts 35, moving-side positioning holes 221 to 227 are formed in the second mounting surface 320b of the mounting plate 32b so as to pair with the fixing-side positioning holes 211 to 217 of the fixing plate 31 at positions corresponding to the fixing-side positioning holes 211 to 217, respectively. Fig. 5 shows one of the three fixed-side positioning holes 211 to 217 and the three moving-side positioning holes 221 to 227, but the other two positions are also configured similarly, and therefore the description thereof is omitted.

Fig. 6 is an explanatory diagram for explaining the operation of the positioning pin 36 when the positioning pin 36 is inserted into the pair of the fixing-side positioning hole 214 and the moving-side positioning hole 224 shown in fig. 5. Next, an example of the structure of the positioning pins 36, the fixing-side positioning holes 211 to 217 and the moving-side positioning holes 221 to 227 will be described with reference to fig. 5 and 6.

The positioning pin 36 includes a columnar positioning portion 361, an inclined surface 362 provided at the tip of the positioning portion 361, and a screw portion 363 having a diameter larger than that of the positioning portion 361 and having a thread formed on the outer periphery thereof. The screw portion 363 is formed with an auxiliary hole or an auxiliary groove for screwing with a screwdriver.

Inclined surface 362 is inclined from the outer periphery of positioning portion 361 toward the axial center, and has, for example, a conical shape. The angle R formed by the inclined surface 362 and the axis of the positioning portion 361 is 45 degrees or less. The inclined surface 362 is not limited to a conical shape, and may be, for example, a truncated conical shape, a spherical shape, or other shapes.

Three positioning pins 36 are prepared corresponding to the three fixing side positioning holes 211 to 217 and the moving side positioning holes 221 to 227. Hereinafter, the fixing side positioning holes 211 to 217 are collectively referred to as fixing side positioning holes 21, and the moving side positioning holes 221 to 227 are collectively referred to as moving side positioning holes 22.

The fixing-side positioning holes 211 to 217 are respectively formed with a circular hole B capable of accurately receiving the positioning portion 361 and a female screw C formed to be screwed with the screw portion 363. The moving-side positioning holes 221 to 227 have a circular hole shape having the same diameter as the hole B. The length L2 of the hole B is shorter than the length Lb of the positioning portion 361 of the positioning pin 36, and when the positioning pin 36 is inserted into the fixing-side positioning holes 211 to 217 and the threaded portion 363 is screwed into the internal threaded portion C, the positioning portion 361 of the positioning pin 36 is inserted into the moving-side positioning holes 221 to 227.

In the example shown in fig. 5, a state is shown in which the positioning pin 36 is inserted into the pair of the fixing-side positioning hole 211 and the moving-side positioning hole 221. Although not shown in fig. 5, the positioning pins 36 are inserted into the other two pairs of the fixing-side positioning holes 211 and the moving-side positioning holes 221 out of the three pairs of the fixing-side positioning holes 211 and the moving-side positioning holes 221. In the following, when the positioning pins 36 are inserted into any one of the pairs of the fixing-side positioning holes 211 to 217 and the moving-side positioning holes 221 to 227, it is assumed that the positioning pins 36 are inserted into corresponding pairs of the three marks that are the same as each other.

In a state where the positioning pin 36 is inserted into the pair of the fixing-side positioning hole 211 and the moving-side positioning hole 221, the center axis of the fixing-side positioning hole 211 coincides with the center axis of the moving-side positioning hole 221. In this state, in the other pairs than the fixed-side positioning hole 211 and the moving-side positioning hole 221, the fixed-side positioning holes 212 to 217 and the moving-side positioning holes 222 to 227 forming each pair are located at positions shifted in the X-axis direction, that is, in the arrangement direction of the first opposing member 30a and the second opposing member 30 b.

Specifically, for example, the moving-side positioning hole 222 is located at a position shifted by 20 μm in the-X direction (left direction of the drawing) with respect to the fixed-side positioning hole 212. Hereinafter, a "-" mark is given to the offset amount in the-X direction, and a "+" mark is given to the offset amount in the + X direction. Moving-side positioning hole 223 is located at a position shifted by-40 μm from fixing-side positioning hole 213, moving-side positioning hole 224 is located at a position shifted by-60 μm from fixing-side positioning hole 214, moving-side positioning hole 225 is located at a position shifted by +20 μm from fixing-side positioning hole 215, moving-side positioning hole 226 is located at a position shifted by +40 μm from fixing-side positioning hole 216, and moving-side positioning hole 227 is located at a position shifted by +60 μm from fixing-side positioning hole 217.

That is, each pair of the fixing-side positioning holes 212 to 217 and the moving-side positioning holes 222 to 227 provided at three positions at the position where the hole positions are shifted includes a plurality of sets (a set constituted by a pair of the fixing-side positioning holes 212 and the moving-side positioning holes 222 at three positions, a set constituted by a pair of the fixing-side positioning holes 213 and the moving-side positioning holes 223 at three positions, … …, a set constituted by a pair of the fixing-side positioning holes 217 and the moving-side positioning holes 227 at three positions), the plurality of sets including a plurality of pairs whose shift amounts in the X-axis direction are equal to each other (a pair of the fixing-side positioning holes 212 and the moving-side positioning holes 222 at three positions, a pair of the fixing-side positioning holes 213 and the moving-side positioning holes 223 at three positions, … …, a pair of the fixing-side positioning holes 217 and the moving-side positioning holes 227 at three positions), the shift amounts in the X-axis direction of.

The offset D along the X-axis direction of the pairs of the fixed-side positioning holes 212 to 217 and the moving-side positioning holes 222 to 227 at the hole position offset position is smaller than the width W along the direction perpendicular to the axial center of the inclined surface 362 of the positioning pin 36. Thus, when the positioning pins 36 are inserted into the centers of the fixing-side positioning holes 212 to 217 and the moving-side positioning holes 222 to 227, the mounting plate 32b is moved by the inclined surface 362 in a direction to eliminate the offset between the inserted fixing-side positioning holes and moving-side positioning holes.

Here, the bolt 35 is provided with a predetermined play with respect to a direction perpendicular to the axial direction of the bolt 35. The play of the bolt 35 is not less than the maximum offset amount among the offset amounts of the respective pairs, and in the example shown in fig. 5, 60 μm or more play is provided for each of the + X direction and the-X direction. Thus, when the positioning pin 36 is inserted in a state where the bolt 35 is slightly loosened, the mounting plate 32b can move within the range of the play of the bolt 35.

As shown in fig. 6, the total length La of the positioning pin 36, which is the length La in the axial direction from the rear end of the positioning portion 361 to the tip of the inclined surface 362, is shorter than the depth of the fixing-side positioning hole 21, that is, the thickness L1 of the fixing plate 31. Thus, for example, as shown in fig. 6, when the positioning pin 36 is inserted into the alignment of the fixing-side positioning hole 214 and the moving-side positioning hole 224, the screw portion 363 of the positioning pin 36 reaches the internal thread portion C of the fixing-side positioning hole 21 before the inclined surface 362 reaches the opening peripheral edge of the moving-side positioning hole 22, and the threads interfere with each other, so that linear insertion is not possible.

When the positioning pin 36 is rotated in the screwing direction using the auxiliary tool in this state, the positioning pin 36 moves forward in the direction of the movement-side positioning hole 224, and the inclined surface 362 abuts against the opening peripheral edge of the movement-side positioning hole 22. When the positioning pin 36 is further rotated in the screw fastening direction to advance the positioning pin 36, the inclined surface 362 slides on the opening portion peripheral edge of the moving-side positioning hole 22, the attachment plate 32b moves in a direction in which the position of the fixing-side positioning hole 214 coincides with the position of the moving-side positioning hole 224 in accordance with the advance of the positioning pin 36, the positioning portion 361 of the positioning pin 36 is inserted into the moving-side positioning hole 224, and the fixing-side positioning hole 214 and the moving-side positioning hole 224 are positioned.

When the total length La of the positioning portion 361 and the inclined surface 362 is longer than the thickness L1 of the fixing plate 31, even if the positioning pin 36 is intended to be linearly inserted into the pair of the fixed-side positioning hole 21 and the moving-side positioning hole 22, the inclined surface 362 abuts against the opening peripheral edge of the moving-side positioning hole 22, and when the positioning pin 36 is pushed in and inserted in this state, a very large pushing force is required.

However, as shown in fig. 6, since the total length La of the positioning portion 361 and the inclined surface 362 is shorter than the thickness L1 of the fixing plate 31, even if the inclined surface 362 abuts against the opening peripheral edge of the moving-side positioning hole 22, and then the positioning pin 36 is rotated by using an auxiliary tool such as a screwdriver, the positioning pin 36 can be inserted while the mounting plate 32b is moved, and the fixing plate 31 and the mounting plate 32b can be positioned. Therefore, the total length La of the positioning portion 361 and the inclined surface 362 is shorter than the thickness L1 of the fixed plate 31, so that the mounting plate 32b can be easily moved and positioned.

Fig. 7 is an explanatory diagram showing a state where the positioning pin 36 is inserted into the pair of the fixing-side positioning hole 214 and the moving-side positioning hole 224 shown in fig. 5. The mounting plate 32b is moved by inserting the positioning pin 36 in the centering of the fixing-side positioning hole 214 and the moving-side positioning hole 224 shown in fig. 5, and as shown in fig. 7, the position of the fixing-side positioning hole 214 coincides with the position of the moving-side positioning hole 224. Then, the positioning pins 36 are inserted over the fixing-side positioning holes 214 and the moving-side positioning holes 224, whereby the mounting plate 32b is positioned with respect to the fixed plate 31, that is, the second opposing member 30b is positioned with respect to the first opposing member 30a fixed to the fixed plate 31.

As shown in fig. 5, when the fixing-side positioning hole 211 and the moving-side positioning hole 221 are aligned, the moving-side positioning hole 224 is arranged to be shifted by 60 μm in the-X direction with respect to the fixing-side positioning hole 214. Therefore, when the position of the fixing-side positioning hole 214 is matched with the position of the moving-side positioning hole 224, the mounting plate 32b on which the moving-side positioning hole 224 is formed is moved by 60 μm in the + X direction as shown in fig. 7.

Here, the offset amounts of the pair of the fixing-side positioning hole 211 and the moving-side positioning hole 221 (the offset amount is zero), the pair of the fixing-side positioning hole 212 and the moving-side positioning hole 222, the pair of the fixing-side positioning hole 213 and the moving-side positioning hole 223, the pair of the fixing-side positioning hole 214 and the moving-side positioning hole 224, the pair of the fixing-side positioning hole 215 and the moving-side positioning hole 225, the pair of the fixing-side positioning hole 216 and the moving-side positioning hole 226, and the pair of the fixing-side positioning hole 217 and the moving-side positioning hole 227 are different. Therefore, the amount of movement of the attachment plate 32b, that is, the distance between the first opposing member 30a and the second opposing member 30b can be appropriately set according to which pair is selected as the pair into which the positioning pin 36 is to be inserted. In this case, since the amount of movement of the attachment plate 32b is the amount of offset between the fixed-side positioning hole and the moving-side positioning hole into which the positioning pin 36 is inserted, the interval between the first opposing member 30a and the second opposing member 30b can be set with high accuracy.

Thus, even when the substrate 100 contracts or expands such that the interval between the circuit board P1 and the circuit board P2 changes from the design interval, by appropriately selecting the pair of the fixed-side positioning hole and the moving-side positioning hole in accordance with the amount of change and inserting the positioning pin 36, the first opposing member 30a and the second opposing member 30b can be arranged to face the circuit board P1 and the circuit board P2 with high accuracy, and the probes Pr provided on the first opposing member 30a and the second opposing member 30b can be brought into contact with the inspection points provided on the circuit board P1 and the circuit board P2 with high accuracy, whereby the substrate inspection can be performed easily and accurately.

Fig. 8 is an explanatory diagram for explaining positioning pin 36 in which inclined surface 362 is spherical, for example, hemispherical. The length La in the axial direction from the tangent point position Px of the positioning pin 36 shown in fig. 8, which is a line in the plane including the axis of the positioning pin 36, to the rear end of the positioning portion 361, is shorter than the thickness L1 of the fixing plate 31, and the angle R formed by the tangent 364 to the spherical inclined surface 362 and the axis is 45 degrees. And, the offset D is set to: in a plane including a tangent point position Px where an angle R formed by the tangent line 364 and the axis is 45 degrees and the axis, a distance W1 in a direction perpendicular to the axis from the tangent point position Px to the outer periphery of the positioning portion 361 is equal to or less than.

Thus, as with the positioning pin 36 shown in fig. 6, the positioning pin 36 is inserted into the fixed-side positioning hole 214 and the moving-side positioning hole 224 and screwed, thereby facilitating the movement of the attachment plate 32b for positioning. Further, since the inclined surface 362 is spherical, the angle formed by the inclined surface 362 and the axis becomes smaller as the distance from the axial position becomes larger, and therefore the force for advancing the positioning pin 36 by screwing is efficiently converted into a force for moving the mounting plate 32 b. As a result, the force required for screw fastening can be reduced as compared with the case where the inclined surface 362 is conical or truncated conical.

On the other hand, in the case where the inclined surface 362 is conical as in the positioning pin 36 shown in fig. 6, the angle R formed between the inclined surface 362 and the axial center is easily 45 degrees or less up to the axial center position. Therefore, since the offset amount between the fixing-side positioning hole 21 and the moving-side positioning hole 22 can be set to a value close to the radius of the positioning portion 361, if the inclined surface 362 is formed in a conical shape, the offset amount between the fixing-side positioning hole 21 and the moving-side positioning hole 22 can be easily increased.

Referring to fig. 3, the inspection aid driving mechanism 5 is constituted by: an X-aid driving unit 5X for moving the inspection aid 3 in the X-axis direction with respect to the inspection apparatus main body 2; a Y-accessory drive unit 5Y connected to the X-accessory drive unit 5X and moving the inspection accessory 3 in the Y-axis direction; a theta aid driving unit 5 theta connected to the Y aid driving unit 5Y and configured to rotationally move the inspection aid 3 about the Z axis; and a Z-accessory drive unit 5Z connected to the θ -accessory drive unit 5 θ and moving the inspection accessory 3 in the Z-axis direction.

Thus, the inspection aid driving mechanism 5 is configured to be able to position the inspection aid 3 relative to the substrate 100 or to move the inspection aid 3 up and down (Z-axis direction) in the vertical direction to bring the probe Pr attached to the inspection aid 3 into contact with or separate from the inspection point formed on the wiring pattern of the substrate 100, in accordance with a control signal from the control unit 9.

Next, a substrate inspection method using the substrate inspection apparatus 1 mounted with the inspection aid 3 according to an embodiment of the present invention will be described. Since the inspection unit 4U operates in the same manner as the inspection unit 4D, the operation of the inspection unit 4D will be omitted and the operation of the inspection unit 4U will be described.

Referring to fig. 2, the substrate 100 may have a variation in the distance between the unit regions a due to manufacturing variations, and may have a variation in the distance between the first region a1 and the second region a2 in each unit region a. Therefore, in order to accurately bring the probe Pr into contact with each inspection point in each unit region a, it is necessary to adjust the contact position of the probe Pr in accordance with the deviation.

Therefore, in the substrate inspection method according to the present invention, the adjustment of the position between the unit areas a is performed by the following moving step: the inspection aid 3 is moved by the inspection unit driving mechanism 7 and the inspection aid driving mechanism 5 so that the probes Pr sequentially come into contact with the inspection points of the unit regions a. The adjustment of the position between the first area a1 and the second area a2 is performed by the following plate positioning process: the distance between the first opposing member 30a and the second opposing member 30b is adjusted by inserting the positioning pin 36 into the fixing-side positioning hole 21 and the moving-side positioning hole 22 of any one of the plurality of pairs of fixing-side positioning holes 21 and moving-side positioning holes 22 to position the fixing plate 31 and the second opposing member 30 b.

In the moving step, for example, a camera for imaging the surface of the substrate 100 may be provided, and the control unit 9 may control the driving of the inspection unit driving mechanism 7 and the inspection aid driving mechanism 5 based on the image of the unit area a (the circuit boards P1 and P2) imaged by the camera to move the inspection aid 3 so that the probe Pr comes into contact with each inspection point provided in the unit area a to be inspected.

The board positioning process is performed, for example, as follows. First, the user measures the interval between the circuit board P1 and the circuit board P2 in the substrate 100 as an inspection object, and calculates the difference between the interval and a reference value in design. Then, the user first loosens the bolt 35 of the second opposing member 30b, selects a pair of the fixing-side positioning hole 21 and the moving-side positioning hole 22 in which the offset amount D that can cancel the calculated difference is set, inserts the positioning pin 36 into the pair and screws the pair to adjust and position the position of the second opposing member 30b, and then fastens the bolt 35 of the second opposing member 30b to fix the member.

Thus, the displacement of the interval between the circuit boards P1 and P2 due to the expansion and contraction of the board 100 is corrected, and the probe Pr mounted on the first opposing member 30a and the probe Pr mounted on the second opposing member 30b can be brought into contact with the inspection point of the circuit board P1 and the inspection point of the circuit board P2, respectively, appropriately.

The plate positioning process may be appropriately performed at any timing. For example, the deviation of the interval between the circuit boards P1 and P2 may vary depending on the manufacturing lot of the substrate 100. Therefore, the plate positioning process may be performed for each manufacturing lot of the substrate 100.

Further, for example, in the substrate 100 shown in fig. 2, a stretching system may be adopted in which the variation in stretching in the X-axis direction is increased. In this case, the inspection of the unit areas a11 to a14 may be performed by sequentially moving the inspection aid 3 to the unit areas a11 to a14 in a row arranged in the Y axis direction (second direction) in the moving step, and then the board positioning step may be performed in accordance with the interval between the first area a1 and the second area a2 in the unit areas a21 to a24 arranged in a row adjacent to the row of the unit areas a11 to a14 in the X axis direction to adjust the interval between the first opposing member 30a and the second opposing member 30b, and then the inspection of the unit areas a21 to a24 may be performed by sequentially moving the inspection aid 3 to the unit areas a21 to a24 in the moving step.

Further, although the example in which the second facing member 30b is configured by stacking the mounting plate 32b, the electrode plate 33b, and the facing plate 34b is shown, the second facing member 30b is not limited to the stacked structure, and may be integrally configured. Further, although the moving-side positioning hole 22 is a through hole penetrating the attachment plate 32b, the moving-side positioning hole 22 may not penetrate the attachment plate 32b, or may be a through hole penetrating the entire second counter member 30 b.

Also, an example is shown in which the first and second regions a1 and a2 correspond to the circuit boards P1 and P2, respectively, and the circuit boards P1 and P2 are the same substrates, but the circuit boards P1 and P2 may also be substrates different from each other. Also, an example in which the circuit board P1 and the circuit board P2 are included in the unit area a is shown, but a structure including only one circuit board in the unit area a may be also possible. Further, the first area a1 and the second area a2 may be provided in the one circuit board.

Further, an example is shown in which two regions, i.e., the first region a1 and the second region a2, are set in the unit region a and the first opposing member 30a corresponding to the first region a1 and the second opposing member 30b corresponding to the second region a2 are provided, but the first region a1 and the plurality of second regions a2 may be set in the unit region a and the first opposing member 30a corresponding to the first region a1 and the plurality of second opposing members 30b corresponding to the plurality of second regions a2 may be provided.

Further, although the example in which the fixed-side positioning holes 211 to 217 and the moving-side positioning holes 221 to 227 are provided at three positions is shown, two or more positions may be provided. The fixed-side positioning holes 211 to 217 and the moving-side positioning holes 221 to 227 may be one. However, in order to accurately define the mounting angle of the mounting plate 32b to the fixed plate 31 by the plurality of positioning pins 36, it is more preferable to provide a plurality of fixing-side positioning holes 211 to 217 and moving-side positioning holes 221 to 227.

Further, although the example in which the inclined surface 362 is formed at the tip end of the positioning pin 36 is shown, the inclined surface 362 may not be provided. However, by including the inclined surface 362, it is possible to smoothly insert the positioning pin 36 into the alignment of the fixing-side positioning hole 21 and the moving-side positioning hole 22, and it is possible to convert the force for inserting the positioning pin 36 into the force for moving the mounting plate 32b, which is more preferable in this point.

Further, although the screw portion 363 is provided in the positioning pin 36 and the female screw portion C is provided in the fixing plate 31, the screw portion 363 and the female screw portion C may not be provided.

Further, although the inspection

aid driving mechanisms

5U and 5D and the inspection aid driving mechanisms 7U and 7D are shown as examples of the driving unit to move the inspection aid 3 to move the substrate 100 and the inspection aid 3 relative to each other, the driving unit may move the substrate 100 or both the substrate 100 and the inspection aid 3 to move the substrate 100 and the inspection aid 3 relative to each other.

Further, the fixing-side positioning hole 21 may be formed also in the region of the fixing plate 31 to which the first opposing member 30a is attached, and the moving-side positioning hole 22 may be formed also in the first opposing member 30a (the attachment plate 32 a).

Description of the symbols

1: a substrate inspection device;

2: inspecting the apparatus main body;

3, 3U, 3D: checking an auxiliary tool;

4, 4U, 4D: an inspection unit;

5, 5U, 5D: an inspection aid drive mechanism;

5X: an X auxiliary tool driving part;

5Y: a Y auxiliary tool driving part;

5Z: a Z auxiliary tool driving part;

5 theta: a theta auxiliary tool driving part;

6: a substrate fixing device;

7, 7U, 7D: an inspection unit drive mechanism;

8: a housing;

9: a control unit;

21, 211-217: fixing side positioning holes;

22, 221 to 227: moving the side positioning hole;

30 a: a first opposing member;

30 b: a second opposing member;

31: a fixing plate;

31 a: a first side;

31 b: a second face;

32a, 32 b: mounting a plate;

33a, 33 b: an electrode plate;

34a, 34 b: an opposing plate;

35: a bolt;

36: positioning pins;

37: an electrode;

100: a substrate (movement control unit);

320 a: a first mounting surface;

320 b: a second mounting surface;

341 a: a first opposing face;

341 b: a second opposing face;

351: a through hole;

361: a positioning part;

362: an inclined surface;

363: a threaded portion;

364: cutting a line;

a, A11-A14, A21-A24, A31-A34: a unit area;

a1: a first region;

a2: a second region;

b: a hole portion;

c: an internal thread portion;

d: an offset;

l1: thickness;

l2, La, Lb: a length;

p1, P2: a circuit board;

pr: a probe;

px: the position of the tangent point;

r: an angle;

w: a width;

w1: distance.

Claims

1. An inspection aid mounted to an inspection apparatus main body that inspects a substrate to be inspected as an inspection object, for bringing probes into contact with a plurality of inspection points provided on the substrate to be inspected, respectively, the inspection aid comprising:

a plate-shaped fixing plate having a first surface and a second surface; and

a first opposing member and a second opposing member mounted to the fixing plate,

the first opposing member disposes the probes so as to correspond to the arrangement of inspection points provided in a first region of a part of the substrate to be inspected, and includes: a first opposing surface for being disposed opposite to the first region; and a first mounting surface mounted to the second surface of the fixing plate,

the second opposing member disposes the probes so as to correspond to a disposition of inspection points provided in a second region of the inspected substrate different from the first region, and has: a second opposing face for being disposed opposite the second region; and a second mounting surface mounted to the second surface of the fixing plate,

the first surface of the fixing plate is a surface to be attached to the inspection apparatus main body, a plurality of fixing-side positioning holes for inserting positioning pins for positioning are formed in a region of the fixing plate where the second counterpart member is attached to the second surface, the plurality of fixing-side positioning holes vertically penetrating the fixing plate,

a moving-side positioning hole for positioning is formed in the second opposing member so that the fixing-side positioning hole and the moving-side positioning hole form a plurality of pairs, wherein the moving-side positioning hole and the fixing-side positioning hole are paired in correspondence with each other and are capable of receiving a distal end side of the positioning pin,

the plurality of pairs includes the following pairs: the fixing-side positioning hole and the moving-side positioning hole are located at positions offset in a predetermined first direction in a state where the fixing plate and the second counterpart member are positioned by inserting the positioning pin into at least one pair of the fixing-side positioning hole and the moving-side positioning hole of the plurality of pairs,

an inclined surface inclined from the outer periphery of the positioning pin toward the axial center and forming an angle of 45 degrees or less with respect to the axis of the positioning pin is formed at the tip end portion of the positioning pin,

an amount of displacement in the first direction of the pair located at the position of the displacement is smaller than a width of the inclined surface in a direction perpendicular to the axis.

2. The inspection aid of claim 1,

the first direction is a direction along an arrangement direction of the first opposing member and the second opposing member.

3. The inspection aid of claim 1 or 2, wherein,

the pair at the offset position is a plurality of pairs whose offset amounts in the first direction are different from each other.

4. The inspection aid of claim 1 or 2, wherein,

the at least one pair is a plurality of pairs having an offset amount along the first direction equal to each other,

the pair at the offset position is a plurality of pairs in which the amounts of offset in the first direction are equal to each other.

5. The inspection aid of claim 4,

the pair at the offset position includes a plurality of groups, each of the plurality of groups includes a plurality of pairs whose offset amounts in the first direction are equal to each other, and the offset amounts in the first direction of the plurality of groups are different from each other.

6. The inspection aid of claim 1,

the locating pin includes: a threaded portion formed on a rear end side; and a cylindrical positioning portion having a diameter smaller than that of the threaded portion and extending from a tip of the threaded portion along the axis,

the inclined surface is formed at a distal end portion of the positioning portion,

a female screw portion for screwing with the screw portion is formed in the vicinity of an opening portion on the first surface side of the fixing-side positioning hole,

the length in the axial direction from the rear end of the positioning portion to the tip of the inclined surface is shorter than the thickness of the fixing plate.

7. An inspection aid mounted to an inspection apparatus main body that inspects a substrate to be inspected as an inspection object, for bringing probes into contact with a plurality of inspection points provided on the substrate to be inspected, respectively, the inspection aid comprising:

a plate-shaped fixing plate having a first surface and a second surface; and

the end part of the positioning pin is spherical, a part of the spherical surface is an inclined surface inclined from the periphery of the positioning pin to the axis,

an amount of displacement of the pair at the position of the displacement in the first direction is smaller than a distance in a direction perpendicular to the axis of the positioning pin from a tangent point position where an angle formed by a tangent to the inclined surface and the axis of the positioning pin is 45 degrees to an outer periphery of the positioning pin.

8. The inspection aid of claim 7,

a female screw portion for screwing with the screw portion is formed in the vicinity of the first surface side opening portion of the fixing side positioning hole,

the length of the positioning portion in the axial direction from the rear end to the tangent point position is shorter than the thickness of the fixing plate.

9. The inspection aid of claim 7,

10. The inspection aid of claim 7 or 9, wherein,

11. The inspection aid of claim 7 or 9, wherein,

12. The inspection aid of claim 11,

13. A substrate inspection apparatus, comprising:

the examination aid of any one of claims 1 to 12; and

the inspection device main body to which the inspection aid is attached.

14. The substrate inspection apparatus according to claim 13,

a plurality of unit regions including the first region and the second region are provided on the substrate to be inspected, and the inspection points are arranged in substantially the same arrangement with each other,

the inspection apparatus main body includes:

a driving unit that moves the substrate to be inspected and the inspection jig relative to each other; and

and a movement control unit that moves the substrate to be inspected and the inspection aid relatively by the driving unit so that the probes are brought into contact with the inspection points of the unit regions in sequence.

15. A substrate inspection method for inspecting the inspected substrate using the inspection aid of any one of claims 1 to 12,

the substrate inspection method includes:

a plate positioning step of inserting the positioning pins into at least one pair of the fixing-side positioning holes and the moving-side positioning holes of the plurality of pairs of fixing-side positioning holes and moving-side positioning holes to position the fixing plate and the second counterpart member; and

and a moving step of relatively moving the substrate to be inspected and the inspection jig so that the probes are brought into contact with the inspection points of the unit regions in sequence.

16. The substrate inspection method according to claim 15,

the plurality of unit regions are arranged in a matrix along the first direction and a second direction perpendicular to the first direction,

in the moving step, the substrate to be inspected and the inspection aid are relatively moved so that the probes are brought into contact with the inspection points of the unit regions in a row arranged in the second direction in this order, then in the plate positioning step, one of the pairs of fixing-side positioning holes and moving-side positioning holes is selected corresponding to the unit regions in a row adjacent to the row in the first direction, and the positioning pins are inserted into the selected pair of fixing-side positioning holes and moving-side positioning holes to position the fixing plate and the second opposing member, and then in the moving step, the substrate to be inspected and the inspection aid are relatively moved so that the probes are brought into contact with the inspection points of the unit regions in a row adjacent to each other in the first direction in this order.