KR20100045388A - Printed circuit board testing fixture and printed circuit board testing system with the same - Google Patents
Printed circuit board testing fixture and printed circuit board testing system with the same Download PDFInfo
- Publication number
- KR20100045388A KR20100045388A KR1020090100184A KR20090100184A KR20100045388A KR 20100045388 A KR20100045388 A KR 20100045388A KR 1020090100184 A KR1020090100184 A KR 1020090100184A KR 20090100184 A KR20090100184 A KR 20090100184A KR 20100045388 A KR20100045388 A KR 20100045388A
- Authority
- KR
- South Korea
- Prior art keywords
- inspection
- substrate
- inspection jig
- unit
- jig
- Prior art date
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
The present invention can more accurately solve the positional shift of the inspection point, and at the same time can inspect more unit inspection substrates at once.
The inspection jig includes an inspection jig head for inspecting the wiring pattern of each unit inspection substrate on the sheet substrate, and the inspection jig head performs inspection of the wiring pattern by contacting corresponding to the inspection points on the wiring pattern of the unit inspection substrate. A plurality of inspection probes, a probe head holding a plurality of inspection probes, a base holding the probe head, and a base provided on the base and parallel to the surface of the unit inspection substrate. First moving means for moving the probe head in one direction, and second moving means for moving the probe head in a second direction different from the first direction in a plane parallel to the surface of the unit inspection substrate. Include. By functioning one or both of the first and second moving means, it is possible to correct the deviation of the corresponding position between the plurality of inspection probes and the inspection point.
Description
BACKGROUND OF THE
In the present invention, the test substrate is not limited to a printed circuit board, and for example, various substrates such as a flexible substrate, a multilayer wiring substrate, an electrode plate for a liquid crystal display or a plasma display, and a package substrate or film carrier for a semiconductor package. The present invention can be applied to the inspection of electrical wiring formed on a semiconductor wafer or the like. In this specification, such various wiring boards are collectively referred to as a 'substrate'.
In
However, when manufacturing a sheet substrate in which a plurality of unit inspection substrates are arranged in a matrix, the inspection point of each unit inspection substrate may shift from the target design position in the lamination step. In the substrate manufactured by the build-up structure, a shrinkage error occurs when laminating each layer by fixing the substrate constituting the substrate by high temperature bonding, whereby the inspection point is shifted from the target design position. Because there is.
If there is such a misalignment of the inspection point, the inspection probe may not be in proper contact with the inspection point, and the inspection may not be performed accurately, or the normal substrate may be judged as a defective product. In particular, such a misalignment has become a more serious problem with the miniaturization of wiring patterns.
[Patent Document 1] Japanese Patent Application Laid-Open No. 8-21867
[Patent Document 2] Japanese Unexamined Patent Publication No. 2008-17036
Correction of the shrinkage error is insufficient only by adjusting the position of the inspection jig head corresponding to the distance between adjacent unit inspection substrates. Therefore, it is necessary to adjust the position by moving the inspection jig head in other directions. There is.
In addition, with the refinement of the wiring pattern, it is necessary to more accurately resolve the positional shift between the set position and the inspection point for arranging the individual inspection jig heads.
Further, since a plurality of unit inspection substrates are formed on the sheet substrate, it is preferable that more unit inspection substrates can be inspected at the same time.
In order to solve the above problems, the inspection jig according to the present invention includes an inspection jig head for inspecting the wiring pattern of each unit inspection substrate on the sheet substrate, and moves the inspection jig to the inspection jig head on the unit inspection substrate on the sheet substrate. This is used for the board | substrate test | inspection apparatus which test | inspects a wiring pattern. The inspection jig head holds a plurality of inspection probes for inspecting the wiring pattern, a probe head holding a plurality of inspection probes, and a probe head by contacting corresponding to the inspection points on the wiring pattern of the unit inspection substrate. The first moving means for moving the probe head in a first direction in a plane parallel to the plane of the unit inspection substrate, the base being provided on the base, and the base. And a second moving means for moving the probe head in a second direction different from the first direction in a plane parallel to the surface, and by functioning one or both of the first and second moving means, It is characterized in that the deviation of the corresponding position with the inspection point can be corrected.
In the inspection jig, the first moving means and the second moving means can move the inspection jig in a direction orthogonal to each other. In addition, in a plane parallel to the surface of the unit inspection substrate, a rotation means for rotating the inspection jig may be provided. Each of the first moving means and the second moving means may include protruding and tensioning means for advancing and retracting the inspection jig. The moving means may comprise a piezo motor. A plurality of inspection jig heads may be provided. A plurality of inspection jig heads are arranged in a matrix, so that individual inspection jig heads can correspond to each of the unit inspection substrates of the sheet substrate on which the unit inspection substrate is arranged in a matrix. The plurality of inspection jig heads are arranged in a column so as to correspond to the unit substrates arranged in a partial column of the unit inspection substrates arranged in a matrix, and when the inspection of the corresponding unit inspection substrate is finished, the next unit The unit boards arranged in part of the thermal inspection boards may be separately provided. Unit inspection substrates are arranged in a matrix on the sheet substrate, and a plurality of inspection jig heads are arranged at intervals, and inspection jig heads are disposed at intervals from unit inspection substrates which are not adjacent to each other on the sheet substrate. You may respond.
Further, the substrate inspection apparatus includes the inspection jig, the substrate conveying means for conveying the sheet substrate to the inspection position, the position detecting means for detecting the position of the unit inspection substrate on the sheet substrate, and the inspection jig for moving the inspection jig to the inspection position. Substrate inspection signals are transmitted and received between the inspection jig moving means and the plurality of inspection probes of the inspection jig head to acquire electrical characteristics of the unit inspection substrate, and each first moving means of the plurality of inspection jig heads. And a control device for controlling the movement of the second moving means and the rotating means, wherein the control device shifts the design position of the unit inspection substrate of the sheet substrate from the detection position of the unit inspection substrate detected by the position detecting means. Calculate the size of and determine the position of the predetermined inspection jig head by controlling the first moving means, the second moving means and the rotating means, Thus, the inspection probe of the inspection jig head can be brought into proper contact with the inspection point of the unit inspection substrate.
According to the present invention, it is possible to provide an inspection jig capable of freely changing the position of each inspection jig head in various directions, and a substrate inspection apparatus having the same.
Moreover, according to this invention, the inspection jig which can adjust the position of each inspection jig head more precisely, and the board | substrate inspection apparatus provided with the same can be provided.
Further, according to the present invention, it is possible to provide an inspection jig capable of inspecting more unit inspection substrates in a sheet substrate at once and a substrate inspection apparatus having the same.
Hereinafter, an inspection jig according to a preferred embodiment of the present invention and a substrate inspection apparatus having the same can be provided based on the accompanying drawings.
In the accompanying drawings, the thickness, length, shape, spacing between members, and the like have been enlarged, reduced, deformed, simplified, and the like for easy understanding. In addition, in each figure, each direction is shown by the rectangular coordinate system by the XYZ axis. In the Cartesian coordinate system, the direction indicated by 'x' is the forward direction from the front side of the drawing sheet to the inner side, and the axis indicated by '·' is the forward direction from the inside of the drawing sheet to the front side. Moreover, as needed, it is assumed that the angle θ is displayed at clockwise rotation (for example, leftward turning toward the ground in FIG. 1) toward the positive direction of the axis perpendicular to the ground in the drawing.
[Summary of Sheet Substrate]
1 is a plan view illustrating an example of a sheet substrate. As shown in FIG. 1, in the
2 is a partially enlarged plan view of the
As shown in Fig. 2,
In Fig. 2, two
Structure of Inspection Jig
3 is a simplified front view of the
As shown in Fig. 3, the
The plurality of inspection probes 31p and 41p are connected to a control device of a substrate inspection apparatus (not shown) via the
The
An
Moreover, the
Therefore, in order to stop the
As shown in FIG. 4A, two moving
The moving
When the
4B shows a state in which the position of the
Usually, the position of the
In that case, in FIG. 4B, the front end part 48tx of the stem 48sx of the
FIG. 5 is a sheet substrate composed of two rows of 2-A and 2-B, for example, of a unit inspection substrate such as the
As shown in FIG. 5, the sheet | seat board |
The
FIG. 6 is a side view showing a state in which inspection jig heads 30A and 30B of the
[Adjustment of Inspection Jig Head Position]
FIG. 7 is a flowchart showing a procedure for adjusting the positions of the inspection jig heads 30A and 30B and arranging them with respect to the unit inspection substrates 2-A and 2-B of the
As described above, the
In Step S71, first, as described with reference to FIG. 5, the
Next, in step S72, the position where the position of the
When the position of the
When the above position is set, when the
In such a case, it is necessary to finely adjust the position of the
By this step S73, the correction position which the
Next, in step S74, the position on the
Next, in step S75, the
As described above, in step S74, the inspection jig is moved by the moving
For example, according to the data obtained in step S71, a predetermined inspection point on the unit inspection substrate 2-B is in the Y-axis direction from the tip position of the
When correcting a misalignment in the above situation, it is necessary to first move the
In addition, it is necessary to move the
As described above, when the
On the other hand, as another situation, in FIG. 4A, the case where the deviation between the inspection point and the tip position of the inspection probe is eliminated by moving the
Next, in order to move the
As a result of their movement, the
The
Board inspection
As described above, when the
Thereafter, a predetermined current flows through the inspection probe by the control device of the substrate inspection apparatus, and the voltage between the inspection probes is measured to examine the electrical characteristics of the predetermined wiring pattern.
[Other Embodiments]
In the above embodiment, the case where the
Moreover, although the example which used the piezo motor and the micrometer head was shown as a movement means, you may freely reciprocate the inspection jig head directly, for example using only a piezo motor. Moreover, you may use another linear reciprocating means.
In addition, in the above embodiment, an example in which a guide rail is used to move the inspection jig head in the X-axis direction and the Y-axis direction is shown. In addition, for example, a rotary table is disposed between the
For example, in FIG. 8A and FIG. 8B, the
8A is a plan view of the
Unlike the
The
The rotating
As shown in Fig. 8A, each of the inspection jig heads 82-1 and 82-2 includes three moving devices 82-1X, 82-1Y1, 81-1Y2, and 82-2X, 82-2Y1, 82. -2Y2) is installed. These movers are fixed to the base 145 through the
The moving device 82-1X moves the inspection jig head 82-1 along the X-axis, and includes a
In this configuration, when the driving
The
The moving device 82-1Y1 and the moving device 82-1Y2 are used to move the inspection jig head 82-1 along the Y axis, and the inspection jig head 82-1 about the central axis 82C. ) Is used to rotate a predetermined angle. The structures and functions of the
In the case where the inspection jig head 82-1 is linearly moved along the Y axis using the moving device 82-1Y1 and the moving device 82-1Y2, the moving device 82-1Y1 and the moving device 82 The
For example, when two stems 85 protrude at the same time, the two protrusions 85m are pressed in the same direction in parallel by the two stems 85 by the protruding portions. As a result, the
On the other hand, in order to rotate the inspection jig head 82-1 by a predetermined angle around the
8A and 8B show the
10A and 10B show the unit inspection substrate using the
FIG. 10A is for explaining the case of the common expectation of FIG. 8, and corresponds to the case where the
Instead of the above example, the
FIG. 10B is for explaining the case of the separation expectation in FIG. 9, which corresponds to the case of inspecting a sheet substrate having unit inspection substrates 1-9 in three rows by three columns indicated by broken lines. In the embodiment of the figure, each of the inspection jig heads 82-1, 82-2 on the separated
In the case of the separation base of FIG. 9, in the case of the inspection by the above arrangement, the
Next, referring to FIGS. 11 and 12, for example, four inspection jigs are provided to face the inspection jig heads on each of the four
For example, the inspection jig 80-4 is arranged in parallel with two inspection jig 80-2 in FIG. 9 and spaced apart by a distance corresponding to the width or length of one unit inspection substrate. In other words, the inspection jig 80-4 is arranged by emptying a space corresponding to one unit inspection substrate between the inspection jig heads adjacent to each other of the four inspection jig heads. The four inspection jig heads thus arranged can be moved between the unit inspection substrates in the state of the arrangement by the inspection jig head moving means (not shown).
Specifically, as shown in FIG. 11, the sheet | seat board |
First, in Fig. 11, the inspection jig 80-4 is moved to indicate respective positions of the unit inspection substrates A-1, B-1, C-1, and D-1, each of which is indicated by a broken circle. Match the inspection jig head. Thereby, four unit inspection substrates A-1, B-1, C-1, and D-1 can be inspected at one time and simultaneously.
Next, in Fig. 11, the unit inspection boards A-2 and B-2 in which the inspection jig 80-4 is moved to the right (forward direction of the X axis) and the inspection jig heads are shown with broken dashed triangles next to each other. , C-2, D-2). As a result, the unit inspection substrates are inspected.
Next, in Fig. 11, the inspection jig 80-4 is moved to the lower left oblique side (simultaneously in the negative directions of the X axis and the Y axis line), and the broken dash inverted triangle of the left oblique side of each inspection jig head is displayed. It corresponds to one unit inspection board (A-3, B-3, C-3, D-3). As a result, the unit inspection substrates are inspected.
In addition, in Fig. 11, the unit inspection boards A-4 and B-4 which move the inspection jig 80-4 to the right (forward direction of the X-axis) and mark each inspection jig head by broken lines next to each other. , C-4, D-4). As a result, the unit inspection substrates are inspected.
As described above, according to this moving method, by inspecting the inspection jig 80-4 three times, all 16 unit inspection substrates can be inspected.
FIG. 12 illustrates a case of the
As in the case of Fig. 11, in this case as well, the inspection jig 80-4 is arranged so as to have a space corresponding to one unit inspection substrate between the four inspection jig heads adjacent to each other. do.
First, in Fig. 11, the inspection jig heads of the inspection jig 80-4 are associated with each of the four
In the case of FIG. 11, as shown in the figure, there are a plurality of numbers on one unit inspection substrate. It means that the inspection was done in duplicate. For example, the unit inspection substrate with the numbers '1, 3, 9, 11' is inspected at the time of the first, third, ninth and eleventh inspection.
In that case, arbitrary processing can be performed with respect to data, for example using only the initial test value, not using another test value, or using the average value of a plurality of test values.
As described above, even if a part of the unit inspection substrates is duplicated, in the embodiment of FIG. 12, all 36 unit inspection substrates can be inspected in 16 inspections.
9, 10B, 11 and 12, the inspection jig is arranged so as to have a space corresponding to one unit inspection substrate between the inspection jig heads adjacent to each other of the four inspection jig heads. Although the inspection jig was used, the size of the space may not correspond to one unit inspection substrate, but may correspond to the size of a plurality of unit inspection substrates. Doing so will allow you to check the unit test board sparsely.
As mentioned above, although the preferable embodiment of the inspection jig which concerns on this invention and the board | substrate inspection apparatus provided with it was demonstrated, this invention is not restrict | limited to the embodiment, Addition, deletion, and alteration which can be easily achieved by a person skilled in the art And the like are included in the present invention, and it is to be understood that the technical scope of the present invention is determined by the description of the appended claims.
1 is a plan view illustrating an example of a sheet substrate.
FIG. 2 is a partially enlarged plan view of the sheet substrate shown in FIG. 1.
3 is a simplified side view of an inspection jig according to an embodiment of the present invention.
4A is a simplified plan view of the inspection jig according to one embodiment of the present invention shown in FIG. 3.
4B is a simplified plan view for explaining an example of adjusting the position of one inspection jig head of the inspection jig.
5 is a partially enlarged side view illustrating a state in which a sheet substrate is placed at an inspection position of the substrate inspection apparatus.
Fig. 6 is a side view showing a state in which an inspection jig having two inspection jig heads is disposed below the sheet substrate.
7 is a flowchart showing a procedure when adjusting the position of the inspection jig head.
8A is a simplified plan view of an inspection jig according to another embodiment of the present invention.
8B is a simplified front view of the inspection jig according to the embodiment of FIG. 8A.
9 is a simplified plan view of an inspection jig according to another embodiment of the present invention.
It is a top view for demonstrating the difference at the time of use in the case of the common base shown in FIG. 8A, and the case of the separated base shown in FIG.
It is a top view for demonstrating the difference at the time of use in the case of the common base shown in FIG. 8A, and the case of the separation base shown in FIG.
It is a top view for demonstrating the state which inspects a sheet | seat board | substrate using the inspection jig of embodiment shown in FIG.
It is a top view for demonstrating the state which examines another sheet board | substrate using the inspection jig of embodiment shown in FIG.
<Description of the code>
1, 100 sheet substrate
2 unit inspection board
10 imaging camera
20 positioning mark
30 inspection jig
30A, 30B Inspection Jig Head
31, 41 probe head
42 vehicles
42X, 42Y shifter
45 expectations
47X, 47Y Piezo Motor
48X, 48Y micrometer head
48tx, 48ty tip
50X, 50Y turning
52X, 52Y Coil Springs
80, 80-2, 80-4 Inspection Jig
82-1, 82-2 Inspection Jig Head
82-1X, 82-1Y1, 82-1Y2 and other mobile devices
82s support
82m moving part
82r rotating part
144S, 144Y Guide Rails
Claims (10)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008273200 | 2008-10-23 | ||
| JPJP-P-2008-273200 | 2008-10-23 | ||
| JP2009095333A JP2010122202A (en) | 2008-10-23 | 2009-04-09 | Substrate inspection fixture and substrate inspection device using the same |
| JPJP-P-2009-095333 | 2009-04-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20100045388A true KR20100045388A (en) | 2010-05-03 |
Family
ID=42273129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020090100184A KR20100045388A (en) | 2008-10-23 | 2009-10-21 | Printed circuit board testing fixture and printed circuit board testing system with the same |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR20100045388A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105467258A (en) * | 2015-12-10 | 2016-04-06 | 苏州世纪福智能装备股份有限公司 | PCBA test apparatus |
| CN109541439A (en) * | 2018-12-10 | 2019-03-29 | 通富微电子股份有限公司 | A kind of method of adjustment of chip testing feedstock direction, detection device, adjustment system |
-
2009
- 2009-10-21 KR KR1020090100184A patent/KR20100045388A/en not_active Application Discontinuation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105467258A (en) * | 2015-12-10 | 2016-04-06 | 苏州世纪福智能装备股份有限公司 | PCBA test apparatus |
| CN105467258B (en) * | 2015-12-10 | 2018-06-19 | 苏州世纪福智能装备股份有限公司 | A kind of PCBA jigsaw test device |
| CN109541439A (en) * | 2018-12-10 | 2019-03-29 | 通富微电子股份有限公司 | A kind of method of adjustment of chip testing feedstock direction, detection device, adjustment system |
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