JPH10332763A - Continuity inspection method for b, g, and a ic package substrates - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase the efficiency of a continuity inspection at low cost. SOLUTION: Lower and upper side image-pickup parts 4 and 3 are moved from a reference position T to between upper and lower probe jigs 1 and 2, respectively, the upper and lower probe units 11 and 12 of the upper and lower side probe jigs 1 and 2 are picked up by the lower and upper side image-pickup parts 4 and 3, respectively, the picked up data is image-analyzed (binary), and the coordinate data V of the reference points of the upper probe unit 11 and the coordinate data W of the reference points of the lower probe unit 12 are stored. At the time of inspection, the front and rear surfaces of an IC package substrate 100 are picked up at the reference point T by the upper and lower image-pickup parts 3 and 4, respectively, and analyzed. Also the coordinate data V' of the front surface reference point of the IC package substrate 100 and the coordinate data W' of the rear surface reference point of the IC package substrate 100 are obtained, and the amounts of correction for X-, U-, and Θ-axis are calculated from the coordinate data V', V, W', and W.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a continuity inspection apparatus for a B, G, and A IC package substrate.

[0002]

2. Description of the Related Art A BGA (ball grid array) IC package is electrically connected to a surface of a substrate having electrode patterns on the front and back sides, and a semiconductor chip, an LSI chip and the like are mounted thereon and electrically connected. Then, the chip or the like is sealed with a resin, and the solder balls on the back surface are electrically connected and mounted on a printed circuit board or the like. The arrangement pattern of the electrodes on the IC package substrate in B, G, and A is highly accurate, and the arrangement pattern is provided with a reference point with high accuracy. In general, a cutting error peculiar to the external dimensions is generated. The technique shown in FIG. 12 is already known as a continuity inspection device for such an IC package substrate. The prior art shown in FIG.
Means 900 for transporting the IC package substrate 100 transported by the transport means 900, and the X-axis, Y-axis, Z-axis, and θ-directions which can be controlled and controlled respectively at the upper and lower positions of the IC package substrate 100. It comprises probe jigs 1 and 2 and two image pickup units 3 and 4 which are provided between the upper and lower probe jigs 1 and 2 so as to be able to enter and exit. The two imaging units 3 and 4 are fed between the upper and lower probe jigs 1 and 2, and the upper imaging unit 3 and the surface of the IC package substrate 100 are used in the upper imaging unit 3, and the lower probe unit is used in the lower imaging unit 4. 12 and the back surface of the IC package substrate 100 are respectively imaged, and a reference point of the upper probe unit 11 and an IC are analyzed by image analysis (analysis of a binarized image).
The upper probe jig 1 is corrected and moved in the X-axis, Y-axis, and θ directions based on the reference point on the surface of the package substrate 100 to center the IC package substrate 100, and image analysis (binarization) is performed similarly. The lower probe jig 2 is similarly corrected and moved in the X-axis, Y-axis, and θ directions based on the reference point of the lower probe unit 12 and the reference point on the back surface of the IC package substrate 100 by image analysis).
After centering with respect to the package substrate 100, the upper and lower probe jigs 1 and 2 are moved up and down so that the probes 1 'and 2'
The electrodes are brought into contact with the electrodes on the front and back of the C package substrate 100, and continuity and the like are inspected by a continuity inspection device (not shown) connected thereto.

[0003]

By the way, in the above-mentioned prior art, every time the IC package substrate 100 is transferred between the upper and lower probe jigs 1 and 2 by the transfer means 900, two ICs are provided between the upper and lower probe jigs 1 and 2. After entering the two imaging units 3 and 4 and taking an image, the two imaging units 3 and 4 must be released to the original positions again before the upper and lower probes 1 ′ and 2 ′ come into contact with the IC package substrate 100. In this manner, in the method in which the two image pickup units 3 and 4 are put in and out of the upper and lower probe jigs 1 and 2 every time the inspection is performed, the inspection cannot be performed speedily, and the inspection becomes inefficient as well as the timing delay. Also,
The image pickup units 3 and 4 have rotatable half mirrors 53 and 54 attached to the ends of camera arms 43 and 44 having a CCD camera and capable of moving in the X-axis and Y directions. Probe unit 11 of jig 1 and IC
A special imaging unit structure for imaging the package substrate 100, the probe unit 12 of the lower probe jig 2, and the IC package substrate 100, respectively, was not advantageous in terms of equipment cost.

[0004] The present invention has been made in view of the circumstances in the past, and an object thereof is to enable the continuity inspection efficiency to be increased at a low cost.

[0005]

The technical means taken to achieve the above object is a three-dimensional and θ-controllable upper and lower probe jig in which probe units are arranged facing each other, and a reference position. The upper and lower two imaging units that are vertically opposed to each other and that can move in and out of the upper and lower probe jigs, and that the IC package substrate is clamped from the front and back and fixed between the upper and lower probe jigs from the reference position A lower image pickup unit that horizontally moves the upper probe unit directly below the upper probe unit, and an upper imager that horizontally moves the lower probe unit directly above the lower probe unit. Each part captures and analyzes the image, and the coordinate data (V) of the upper probe unit reference point and the coordinate data (W) of the lower probe unit reference point
Each of them is stored, and at the time of inspection, the front and back surfaces of the IC package substrate fed by the work feed mechanism are individually imaged by upper and lower imaging units on the reference position, image-analyzed, and the reference points on the IC package substrate surface are analyzed. The coordinate data (V ') and the coordinate data (W') of the reference point on the surface of the IC package substrate are obtained, and the coordinate data (V ') and the coordinate data (V), the coordinate data (W') and the coordinate data (W ') are obtained. The coordinate data (W) is compared with each other to calculate the correction amount of the upper probe jig and the correction amount of the lower probe jig for the front and back surfaces of each IC package substrate, and feed the IC package substrate from the reference position to the workpiece. After the constant feed by the mechanism, the upper probe jig and the lower probe jig are individually corrected and moved in the X-axis, Y-axis and θ directions with the correction amount, and the upper probe jig and the lower probe jig are Z-moved. For IC package And gist contacting the probe to the plate sides of the electrode.

According to the above technical means, the following effects are obtained. The lower imaging unit and the upper imaging unit are each moved horizontally from the reference position between the upper and lower probe jigs, and the upper probe unit of the upper probe jig is similarly moved by the lower imaging unit, and the upper imaging unit is similarly moved by the upper imaging unit. The lower probe unit is imaged, and the image data is image-analyzed (binarized) to perform coordinate data (V) on the upper probe unit reference point and coordinate data (W) on the lower probe unit reference point. Each is stored. The coordinate data (V) and (W) are reference point data of the upper probe unit and the lower probe unit in the standby state, and are set as pre-setup. At the time of inspection, the front and back surfaces of the IC package substrate clamped to the work feeding mechanism on the reference position are individually imaged by the above-described upper and lower imaging units, and image analysis (binarization) is performed to perform IC image substrate reference. The coordinate data (V ') of the point and the coordinate data (W') of the IC package substrate surface reference point are obtained, and the coordinate data (V ') and the coordinate data (V) are obtained.
The coordinate data (W ′) is compared with the coordinate data (W) to calculate the correction amount of the probe jig with respect to the front surface of the IC package substrate and the correction amount of the lower probe jig with respect to the back surface of the IC package substrate, respectively. After calculating and feeding the IC package substrate from the reference position to the upper and lower probe jigs by the work feed mechanism, the upper and lower probe jigs are individually moved in the X-axis, Y-axis, and θ directions with the correction amount. The upper probe unit and the lower probe unit coincide with the electrode patterns on the front and back surfaces of the IC package substrate, and the upper probe unit and the lower probe unit are relatively Z-moved to move the probe on the front and back surfaces. Make contact with the electrode pattern. Therefore, the continuity inspection can be performed by correcting the external dimension error inherent in the IC package substrate and the mounting accuracy of the upper and lower probe jigs without having to insert and remove the two imaging units between the upper and lower probe jigs for each inspection of each IC package substrate. .

[0007]

Next, an embodiment of the present invention will be described with reference to the drawings. 1 to 11 illustrate the present invention BG
1 shows an embodiment of a continuity inspection device for performing a continuity inspection method of an IC package substrate shown in FIG. Symbol A is the continuity inspection device.

This continuity inspection device A is a probe unit 1
The upper and lower probe jigs 1 and 2 are arranged vertically opposed to each other and controlled to move three-dimensionally and in the θ direction, and the upper and lower probe jigs 1 and 2 are arranged vertically opposed with a reference position T interposed therebetween. Two upper and lower imaging units 3, 4 that can move in and out of the horizontal direction
And the upper and lower probe jigs 1,
The apparatus includes a reciprocally movable work feed mechanism 5 for feeding between the two, a control unit 6, an image processing device 7, and the like.

The upper and lower parts of the probe jigs 1 and 2 are shown in FIG.
As shown in FIG. 5, the base plates 21 and 22, pedestals 31, 32, and the probe unit attached to the top surfaces of the pedestals 31, 32
11 and 21. This probe jig 1, 2
Is a three-dimensional measuring device B which is a presetter as shown in FIG.
Probe unit 1 for base plates 21 and 22 using
The pedestals 31, 32 having 1, 21 are mounted with high precision. This three-dimensional measuring device B has a CCD camera b1 at the tip and a measuring arm b which can be moved on the Z-axis for focusing by a magnet scale (not shown).
The axis and the Y axis can be moved, and the movement is controlled by a linear guide (not shown) and a magnet sensor (not shown). The three-dimensional measuring device B has a reference point b ′ provided on each of the base plates 21 and 22 while manually moving the measurement arm b, two reference points 11a arranged at diagonal corners of the probe units 11 and 21, 11a, 12a, and 12a are measured, compared with a predetermined value stored in advance, and the X
The correction amount in the axis, Y axis, and θ directions is displayed on a monitor, and the bolts 8 for attaching the pedestals 31 and 32 to the base plates 21 and 22 are adjusted by tightening and loosening, and the reference points b ′, 11a, 11a, and b are again adjusted. The pedestals 31, 32 are attached to the base plates 21, 22 with high precision by measuring the three members 12 ', 12a, 12a and continuing the fine adjustment until a predetermined value is obtained.

A pedestal 31 having probe units 11 and 21
The base plate (the base plate of the upper probe jig and the base plate of the lower probe jig) to which 32 is attached with high accuracy
As shown in FIG. 5, two knock holes 9, 9 are formed at a position separated from the reference point b 'by a predetermined distance as shown in FIG. 5 in a symmetric manner sandwiching the pedestals 31, 32, and the knock holes 9, 9 are formed. The upper and lower mounting seats (described later) 200 on the apparatus body side are positioned with the knock pins 10, 10 in a state of being fitted to the two knock holes 200a, 200a respectively opened in the mounting seats 200, 200.
0 Individually screwed (screwed).

The pedestals 31, 32 with respect to the base plates 21, 22 as described above.
Is mounted with high precision by image processing using a three-dimensional measuring device B, and the base plates 21, 22 are mounted on the mounting seats 200, 200 on the apparatus body side with high precision. The upper and lower probe jigs 1 and 2 are attached to the main body of the apparatus with high accuracy by being screwed into the dowel holes 9 and 200a with the dowel pins 10 being positioned.

Each of the mounting seats 200, 200 is shown in FIGS.
As shown in FIG. 6, it has a disk shape in which the insertion openings 200b, 200b of the cord drawers 41, 42 of the probe jigs 1, 2 are opened at the center, and the Z-axis movement mechanism 300, the X-axis movement mechanism
400, each mounting board linked to the Y-axis moving mechanism 500
The mounting substrates 201, 201 are rotatably supported on opposing surfaces of the mounting substrates 201, 201 and can be controlled and moved in the θ direction by a θ moving mechanism 600 with respect to each of the mounting substrates 201, 201.

As shown in FIG. 6, the θ moving mechanism 600 has a spring 600a provided on one of two arms 200c protruding from the mounting seat 200 and the mounting substrate 201, and a cam follower provided on the other. 600b is rotated by a plate cam 600d which is rotated by a driving source 600c such as a servo motor or a pulse motor.
0a by pushing against the pulling force of a
200 is controlled in the θ direction.

As shown in FIGS. 1 and 6, the Z-axis moving mechanism 300 has a guide slot 300 formed in the upper half and the lower half of the front plate a1 'constituting the hollow column a1 of the machine frame a. a, 300a
The two guide longitudinal axes 300b, 300b are arranged in a row in the upper and lower rows at the front position of the guide plate, and the supporting plates 300c, 300c inserted into the two guide longitudinal axes 300b, 300b are respectively set to the respective guide lengths. Hole 300a,
The upper and lower two ball screws 300d, 300d, which are arranged to be vertically movable on the rear side of the front plate portion a1 'and are screwed into the respective support plates 300c, 300c in a penetrating manner, Drive sources 300e, 300e such as pulse motors and servomotors are directly connected to the upper and lower two ball screws 300d, 300d, respectively, and the support plate 30 is driven by the drive sources 300e, 300e.
0c and 300c each have an X axis moving mechanism 400 and a Y axis moving mechanism 50
The upper and lower control movements (Z movements) of the mounting substrates 201, 201 connected via the “0” are individually enabled.

As shown in FIG. 6, the X-axis moving mechanism 400 connects two parallel horizontal shafts 400a, 400a supported by the support plate 300c and capable of moving back and forth in the X-axis direction by an erecting body 400b. The nut body 400c provided on the erection body 400b is
d, and the drive source 40 directly connected to the ball screw 400d.
By driving a servo motor, a pulse motor, or the like, which is an e-axis, the Y-axis moving mechanism is attached to the tip of the horizontal axis 400a, 400a.
The mounting substrate 201 connected via the link 500 can be controlled and moved in the X-axis direction.

As shown in FIG. 6, the Y-axis moving mechanism 500 includes a vertical plate 201a at the rear end of the mounting board 201 and a guide rail in the Y-axis direction.
A drive source 500d such as a servo motor or a pulse motor is mounted on a fixed plate 500b which is fixed to the tip of the horizontal shafts 400a and 400a and has an engaging portion 500c with the guide rail 500a. And plate cam 500 directly connected to drive source 500d
e, a cam follower 500f guided by a plate cam 500e is provided on the vertical plate 201a, and a fixed plate 500b is provided.
Stupid hole 50 with pin 500h installed on vertical plate 201a
0 i is inserted and positioned above the mounting board 201, and its pin
500h and the vertical plate 201a are connected by a spring 500g, and when the drive source 500d is driven, the mounting board 201 is fixed to the fixed plate 500b via the plate cam 500e and the cam follower 500f.
Can be controlled and moved relatively in the Y-axis direction.

As described above, the upper and lower mounting substrates 201 can be controlled and moved in the X-axis and Z-axis directions.
The mounting seats 200, 200, which are mounted on the upper and lower probe jigs 1, 2 and supported by 1, 201, can be controlled and moved in the Y-axis and θ directions.

The work feeding mechanism 5 includes a clamper 15 for holding the IC package substrate 100 to be inspected from front and rear,
15 is moved from the loading / unloading position of the IC package substrate to the space between the upper and lower probe jigs 1 and 2 via the reference position T, and a pair of the clampers are inserted into a circular opening 25a. A base table 25 provided with 15, 15 can be reciprocated in the X-axis direction.

The clampers 15, 15 each have a right-angled clamping surface.
15a, 15a are provided on the inner surface and the outer surface is formed as an arcuate surface. One is fixed and the other is movable by a driving source 85 such as a cylinder.

The details of the feed mechanism 5 are shown in FIGS. 2 and 3. A parallel horizontal shaft 35 having one end connected to a standing plate 25a behind the base table 25 is connected to the front side plate part a1 'and the hollow part as shown in FIGS. A nut body 55 is inserted into a bearing provided on the rear plate portion a1 "of the column a1 so as to be able to advance and retreat in the X-axis direction, and is screwed into a ball screw 45 provided between the front plate portion a1 'and the rear plate portion a1". When the ball screw 45 is rotated by the driving of a drive source 75 such as a servomotor or a pulse motor, the horizontal shafts 35 and 35 are connected to the parallel horizontal shafts 35 and 35 together with the nut body 55.
Move forward or backward in the X-axis direction.

The upper and lower two image pickup units 3 and 4 are connected to connecting bodies 33 and 34 which are horizontally connected between two ball screws 23, 23, 24 and 24 directly connected to driving sources 13 and 14 such as servo motors and pulse motors. It is supported and can be individually moved in and out of the upper and lower probe jigs 1 and 2 from the reference position T.

The control unit 6 is connected to an image processing device 7 and the like associated with the upper imaging unit 3 and the lower imaging unit 4, and the control unit 6 captures images by the lower imaging unit 4 and performs image analysis. To store the coordinate data (V) of the reference points 11a and 11a of the upper probe unit 11 and the coordinate data (W) of the reference points 12a and 12a of the lower probe unit 12 to be imaged and analyzed by the upper imaging unit 3. (Not shown) and the upper and lower imaging units 3 and 4 positioned above the reference position T to individually image the front and back surfaces of the IC package substrate 100 moved by the work feeding mechanism 5 during inspection. The coordinate data (V ') of the reference points 100a and 100a on the front surface of the IC package substrate 100 and the coordinate data (W') of the reference points 100b and 100b on the back surface are obtained by the coordinate data ( V ') and coordinate data (W') are individually compared and calculated. A calculation unit (not shown) for calculating the correction amount of the upper probe jig 1 and the correction amount of the lower probe jig 2 with respect to the front and back surfaces of the substrate 100 is built in. Reference numeral 700 denotes a monitor.

FIGS. 7A and 7B are enlarged views of an IC package substrate 100 to be inspected, wherein FIG. 7A is a front surface, FIG. 7B is a rear surface, and reference numeral 100 'is an electrode, 100a, 100a, 100b, Ten
0b is a reference point on the front surface and the back surface arranged on a diagonal line.

The details of the continuity test of the substrate of the IC package using the apparatus having the above structure are described below. First, the pedestals 31 and 32 are connected to the base plate 21 and the base plate 21 using the three-dimensional measuring device B.
The upper and lower probe jigs 1 and 2 in which the pedestals 31 and 32 are attached to the base plates 21 and 22 with high accuracy by being attached to the base plate 22 are formed (see FIG. 4). The base plates 21, 22 of the upper and lower probe jigs 1, 2 are positioned on the mounting seats 200, 200 using the knock pins 10 and mounted with high precision (see FIG. 5). A pair of clampers 15 and 15 are released from the upper and lower probe jigs 1 and 2 by the work feed mechanism 5 to lower the upper probe jig 1 until it coincides with a predetermined focus surface height. The imaging unit 4 is horizontally moved to just below the upper probe jig 1 to image the upper probe unit 11 (see FIGS. 3 and 8A). In the present embodiment, the imaging is performed using the space between the parallel horizontal axes 35. FIG.
(B) shows a monitor screen displaying the coordinate data (V) of the reference points 11a, 11a of the upper probe unit 11, and the black points are the coordinate values of the reference points 11a, 11a. Similarly, the lower probe jig 2 is raised until the lower probe jig 2 coincides with a predetermined focus surface height, and the upper imaging unit 3 on the reference position T is horizontally moved to just above the lower probe jig 2 so that the lower probe unit 12 (FIG. 9A). FIG.
(B) shows a monitor screen displaying coordinate data (W) of the reference points 12a, 12a of the lower probe unit 12, and black points are the coordinate values of the reference points 12a, 12a. After the upper probe unit 11 and the lower probe unit 12 have taken an image, they descend or rise and stand by, and the upper and lower imaging units 3 and 4 return to the reference position T and stand by. These are preparations for inspection, and the coordinate data (V) and coordinate data (W) are data for attaching the upper and lower probe jigs 1 and 2 to the apparatus main body side, that is, data at the time of standby. At the time of inspection, the work feeding mechanism 5 is set at the loading / unloading position.
For IC package to be inspected clamped to
100 is moved to the reference position T (forward movement), and its front surface is imaged by the upper imaging unit 3, and its back surface is imaged by the lower imaging unit 4, and the coordinate data (V) of the reference points 100 a and 100 a is obtained. ') And the coordinate data (W') of the reference points 100b, 100b are obtained (FIG. 10 (a)). Subsequently, the coordinate data (V ') is compared with the coordinate data (V), and the coordinate data (W') is compared with the coordinate data (W).
The correction amount of the upper probe jig 1 and the correction amount of the lower probe jig 2 with respect to the front and back surfaces of the package substrate 100 during the standby are calculated. This comparison operation is performed by the control unit 6. FIG. 10B shows coordinate data (V) (W) (V ′).
It is a monitor screen showing (W '). Then, after the IC package substrate 100 is fixedly fed from the reference position T by the work feeding mechanism 5, the upper probe jig 1 and the lower probe jig 2 are moved by the X-axis moving mechanism 400 and the Y-axis moving mechanism 500 with the correction amount. The θ moving mechanism 600 moves the correction individually in the X-axis, Y-axis, and θ-directions respectively.
And the lower probe jig 2 is Z-moved by the Z-axis moving mechanism 300 to bring the electrodes 100 ′ on the front and back of the IC package substrate 100 and the probes 1 ′ and 2 ′ into contact with each other and connect them to the probes 1 ′ and 2 ′. A predetermined inspection is performed by the inspection device C (FIG. 1).
1).

In the present invention, the upper and lower imaging units 3,
4 by upper probe unit 11 and lower probe unit
Since the coordinate data (V) of the reference point 11a of the upper probe unit 11 and the coordinate data (W) of the reference point 12a of the lower probe unit 12 are obtained by capturing an image of 12, the details of this embodiment will be described. As described above, assembling of the upper and lower probe jigs 1 and 2 and the mounting seat 200 of the upper and lower probe jigs 1 and 2
It is not necessary to make the mounting on the 200 high precision.

Reference numeral 800 denotes an IC package substrate 10.
Robotic arm (vacuum arm) for the loader and unloader that picks up the IC 0, and clamps the IC package substrate 100 at the loading position during inspection.
15 and 15 and return to the same position after the end of the continuity test.
The C package substrate 100 is removed from the clampers 15 and 15. Also, mark 10 on the IC package substrate 100.
It is also possible to provide a dispenser 800a marked "0" on the unloading robot arm 800. As a result of the continuity test, the dispenser 800a
When the IC package substrate 100 is defective, a mark 100 "is attached to the IC package substrate 100. This makes it easy to distinguish defective products from non-defective products based on the presence or absence of the mark 100". It is done conveniently and is convenient.

[0027]

According to the present invention, as described above, the upper probe jig,
The coordinate data (V) and (W) of the reference point positions of the upper probe unit and the lower probe unit, which are the mounting data for mounting the lower probe jig on the apparatus body side, are obtained in advance setup.
Every time the IC package substrate is inspected, the upper image pickup unit on the reference position captures an image of the IC package substrate surface and analyzes the image to obtain coordinate data (V ′) of the IC package substrate surface reference point and obtain the lower-side coordinate data. Similarly, the imaging unit captures the back surface of the IC package substrate, analyzes the image, obtains coordinate data (W ′) of the reference point of the back surface of the IC package substrate, and obtains the coordinate data (V) and the coordinate data (V ′). And a comparison operation between the coordinate data (W) and the coordinate data (W ′) to calculate the correction amount of the upper probe jig and the correction amount of the lower probe jig for the IC package substrate to be inspected. Since the upper and lower probe jigs are individually controlled and moved in the X-axis, Y-axis, and θ directions, there is no need to move the imaging unit between the upper and lower probe jigs for each IC package board inspection. Two Eliminating the continuity test inefficiencies by the inspection cycle delay with out of the imaging unit, it is possible to perform speedy continuity test, test a high efficiency. In addition, since the imaging unit may be a simple CCD camera, there is no problem in structure, and the correction amount corrects the mounting accuracy of the upper and lower probe jigs with respect to the apparatus main body. It is not necessary to attach by high-precision means as shown in the embodiment, it is possible to simplify the attachment means, and it is possible to provide at a low cost, and every time the inspection, the upper and lower imaging unit Since the upper and lower probe jigs are corrected with respect to the reference point of the IC package substrate to be imaged, the continuity test can be accurately performed even if a cutting error inherent in the external dimensions of the IC package substrate occurs.

[Brief description of the drawings]

FIG. 1 is a side cross-sectional view of a continuity inspection device that performs the continuity inspection method, showing a state in which a substrate for an IC package is quantitatively fed between upper and lower probe jigs by a work feeding mechanism.

FIG. 2 is a cross-sectional view of FIG. 1, showing a relationship between a work feeding mechanism and a lower imaging unit.

FIG. 3 is a cross-sectional view of FIG. 1 showing a state in which a lower imaging unit is imaging a probe unit of an upper probe jig;
The probe unit of the upper probe jig is imaged from between the parallel horizontal axes (reference numerals 35, 35) in the work feed mechanism.

FIG. 4 is a perspective view showing a state where a pedestal provided with a probe jig is mounted on a base plate.

FIG. 5 is a perspective view showing a state in which upper and lower probe jigs are mounted on a mounting substrate on the apparatus main body side.

FIG. 6 is an enlarged sectional view of a mounting board portion to which a lower probe jig is mounted.

FIG. 7 is an enlarged plan view of an IC package substrate, and FIG.
Is an enlarged plan view of the front surface, and (b) is an enlarged plan view of the back surface.

8A and 8B show a state in which the lower imaging unit captures an image of the upper probe jig, wherein FIG. 8A is a side view thereof, and FIG. 8B is a monitor displaying coordinate data (V) of a reference point of the upper probe unit; Show the screen.

FIGS. 9A and 9B show a state in which an upper imaging unit captures an image of a lower probe jig, wherein FIG. 9A is a side view thereof, and FIG. 9B is a monitor screen displaying coordinate data (W) of a reference point of the lower probe unit; Is shown.

10A and 10B show a state in which the front and back surfaces of the IC package substrate are individually imaged by an upper imaging unit and a lower imaging unit to obtain a correction amount, FIG. 10A is a side view thereof, and FIG. (V ') (W') Monitor screen showing (V) (W).

FIG. 11 shows a state in which the upper and lower probe jigs are corrected and moved in the X-axis, Y-axis, and θ directions with the correction amounts to bring the upper and lower probes into contact with the front and back electrodes of the IC package substrate.

FIG. 12 is a schematic diagram of a conventional continuity inspection device.

[Explanation of symbols]

1: Probe jig (upper probe jig) 2: Probe jig (lower probe jig) 5: Work feed mechanism 11: Upper probe unit 12: Lower probe unit 3: Upper imaging unit 4: Lower imaging unit 100: IC package substrate 11a: Reference point of upper probe unit 12a: Reference point of lower probe unit 100a, 100b: Reference point of IC package substrate A: Continuity inspection device 7: Control unit 1 ', 2': Probe 100 ': Electrode T: Reference position C: Continuity tester

Claims (1)

[Claims] 1. An upper and lower probe jig which can be controlled in a three-dimensional and θ direction in which probe units are arranged opposite to each other, and which enters and exit between the upper and lower probe jigs which are arranged vertically above and below a reference position. An upper and lower two imaging units movable in the horizontal direction, and a work feeding mechanism for clamping the IC package substrate from the front and rear and feeding a fixed amount from the reference position to the upper and lower probe jigs; , And the lower probe unit is horizontally imaged by the upper imaging unit that horizontally moves directly above the lower probe unit, and the image is analyzed and coordinate data of the upper probe unit reference point ( V),
Each of the coordinate data (W) of the lower probe unit reference point is stored, and at the time of inspection, I is sent by the work feeding mechanism.
The top and bottom surfaces of the C package substrate are individually imaged by the upper and lower imaging units on the reference position, and image analysis is performed to obtain coordinate data (V ') of the reference point on the IC package substrate surface and the reference point of the IC package substrate surface. The coordinate data (W ') is obtained, and the coordinate data (V') is compared with the coordinate data (V), and the coordinate data (W ') is compared with the coordinate data (W). The correction amount of the upper probe jig and the correction amount of the lower probe jig for the front and back sides are calculated,
After a fixed amount of the substrate for C package is fed from the reference position by the work feeding mechanism, the upper probe jig and the lower probe jig are individually corrected and moved in the X-axis, Y-axis, and θ-directions with the correction amount. And move the lower probe jig Z
A method for inspecting continuity of a B, G, and A IC package substrate, wherein a probe is brought into contact with electrodes on the front and back of the C package substrate.