JP5752474B2 - Circuit board inspection apparatus and circuit board inspection method - Google Patents

Description

  The present invention relates to a circuit board inspection apparatus and a circuit board inspection method for performing an electrical inspection on a substrate based on an electric signal input / output via an inspection probe probed on the substrate.

  As this type of circuit board inspection apparatus, a circuit board inspection apparatus (in-circuit tester) disclosed by the applicant in Japanese Patent Application Laid-Open No. 11-344539 is known. The circuit board inspection apparatus includes a circuit board holding unit, an inspection jig, an XY movement mechanism, a photo sensor, a control unit, and the like, and is configured to be able to perform an electrical inspection on the circuit board. In this circuit board inspection device, a circuit is formed by contacting (probing) a pin probe with circuit patterns formed on both the upper surface and the lower surface of the circuit board and conducting current to the circuit pattern via the pin probe. It is possible to perform an electrical inspection of the circuit patterns formed on both sides of the substrate, and thereby determine the quality of the circuit substrate.

Japanese Patent Laid-Open No. 11-344539 (page 5-6, FIG. 1)

  However, this type of conventional circuit board inspection apparatus including the circuit board inspection apparatus has the following problems. That is, in a circuit board in which circuit patterns are formed on both surfaces to be inspected by this type of circuit board inspection apparatus, the circuit pattern forming area on the upper surface and the circuit pattern forming area on the lower surface are relatively Misalignment may occur. When the amount of misalignment (the amount of misalignment) is large, for example, it may be difficult to connect the circuit pattern on the upper surface to the circuit pattern on the lower surface (connection through a through hole or the like). It is necessary to inspect whether or not it exceeds the allowable value. However, since the conventional circuit board inspection apparatus does not have a function for inspecting such misalignment, for example, the position of the circuit pattern on both sides is measured by using a three-dimensional measurement device or the like, and the circuit on both sides is measured. It is necessary to specify the amount of positional deviation of the pattern and separately inspect whether or not the amount of positional deviation is an allowable value or more, and it is difficult to improve the inspection efficiency.

  The present invention has been made in view of such problems, and a main object of the present invention is to provide a circuit board inspection apparatus and a circuit board inspection method capable of improving inspection efficiency.

In order to achieve the above object, a circuit board inspection apparatus according to claim 1, wherein a circuit board holding part for holding a circuit board and each pattern formed on one surface of the circuit board held by the board holding part are provided. A first imaging unit that images a first reference pattern specified in advance, and a second image that captures a second reference pattern specified in advance among the patterns formed on the other surface of the circuit board. An imaging unit; a first probing mechanism for probing an inspection probe with respect to each pattern formed on the one surface while correcting a probing position based on an imaging result of the first imaging unit; and the second A second probe for probing the inspection probe for each pattern formed on the other surface while correcting the probing position based on the imaging result of the imaging unit. A circuit board inspection apparatus comprising: a bing mechanism; and an inspection unit that performs an electrical inspection on the circuit board based on an electrical signal input and output through each of the inspection probes. A processing unit that executes a process of specifying a relative displacement amount between the pattern formation region and the pattern formation region on the other surface, and the specified displacement amount and a predetermined reference value. And a determination unit that determines whether the circuit board is good or bad. The first imaging unit and the second imaging unit each include a camera and a moving mechanism that moves the camera, and the processing unit includes: the or imaging results of said controls the moving mechanism respectively moves the camera of the first image pickup unit to a plurality of said first reference pattern the camera of the first image pickup unit With measuring the position of each of said first reference pattern based on the moving distance of the identified said camera, said second said by controlling the moving mechanism to a plurality of the second reference pattern the second imaging of the imaging unit part of the camera by moving respectively measure the position of each of said second reference pattern based on the movement distance of the camera identified from the imaging results of the camera, the measurement of each of said first reference pattern the measurement identifying the positional deviation amount at a plurality of locations based on the position and the respective measurement positions of each of said second reference pattern.

Also, provisions circuit board inspection apparatus according to claim 2, wherein, in the circuit board inspection apparatus according to claim 1 Symbol placement, wherein the processing unit, wherein the circuit board is held in a predefined position by the substrate holding portion The circuit board is configured to calculate a first separation distance between a first reference position that is predetermined as a position where the first reference pattern should be positioned in the holding state and the measurement position of the first reference pattern. Calculating a second separation distance between a second reference position determined in advance as a position where the second reference pattern is to be positioned when the second reference pattern is located and the measurement position of the second reference pattern, A difference value between the first separation distance and the second separation distance is specified as the positional deviation amount.

The circuit board inspection apparatus according to claim 3, wherein, in the circuit board inspection apparatus according to claim 1, wherein the processing unit, fiducial marks formed on the circuit board and the first reference pattern The positional deviation amount is specified based on the imaging result of the fiducial mark when designated as at least one of the second reference patterns.

Further, the circuit board inspection method according to claim 5 images the first reference pattern designated in advance among each pattern formed on one surface of the circuit board held by the board holding unit, and The second reference pattern designated in advance is picked up from each pattern formed on the other surface of the circuit board, and the probing position is corrected based on the image pickup result of the first reference pattern. Probing an inspection probe for each formed pattern, correcting the probing position based on the imaging result of the second reference pattern, and for each pattern formed on the other surface Circuit board inspection method for performing electrical inspection on the circuit board based on electric signals input / output via the inspection probes A is, each of the first reference on the basis of the movement distance of the camera to identify the camera that captures said first reference pattern respectively is moved to a plurality of said first reference pattern from the imaging result by the camera with measuring the position of the pattern, based on the movement distance of the camera identified said second reference pattern is moved respectively towards the camera that captures a plurality of the second reference pattern from the imaging result by the camera each Each first reference pattern in which the position of the second reference pattern is measured, and the relative displacement amount between the pattern formation region on the one surface and the pattern formation region on the other surface is measured. specified based on the respective measurement position of each measurement position and each of the second reference pattern, was previously determined with the specified position deviation amount Determining the quality of the circuit board by comparing a reference value.

The circuit board inspection apparatus according to claim 1 and the circuit board inspection method according to claim 4 , wherein the positions of the first reference pattern and the second reference pattern are measured based on the imaging results of the first reference pattern and the second reference pattern. Then, the relative displacement amount of the pattern formation region on one surface and the other surface is specified based on the measurement positions of the first reference pattern and the second reference pattern, and the specified displacement amount and the reference value are determined. The quality of the circuit board is determined by comparison. Therefore, according to this circuit board inspection apparatus and circuit board inspection method, unlike a conventional circuit board inspection apparatus that does not have such a function, an apparatus different from a circuit board inspection apparatus such as a three-dimensional measurement apparatus Can be used to measure the positions of the first reference pattern and the second reference pattern and specify the relative displacement amount of the pattern formation region based on the measurement result (process / inspection). As a result, the inspection efficiency can be sufficiently improved.

Moreover, in this circuit board inspection apparatus and this circuit board inspection method , the amount of misalignment at a plurality of locations is specified based on the measurement positions of the plurality of first reference patterns and the measurement positions of the plurality of second reference patterns. For this reason, according to this circuit board inspection apparatus, for example, it is determined that the circuit board is defective when one or more of the positional deviation amounts at a plurality of locations are equal to or larger than a reference value, thereby increasing the positional deviation amount. Even when the length varies depending on the location, if the amount of misalignment at any location is greater than or equal to the reference value, it can be reliably determined that the circuit board is defective.

The circuit board inspection apparatus according to claim 2 , wherein the first separation distance between the first reference position and the measurement position of the first reference pattern is calculated, and the measurement position of the second reference position and the second reference pattern is calculated. The second separation distance is calculated, and the difference value between the first separation distance and the second separation distance is specified as the positional deviation amount. In this case, generally, the first separation distance and the second separation distance calculated in this way are used for correcting the probing position when the probe for inspection is probed to perform the electrical inspection on the circuit board. That is, in this circuit board inspection apparatus, the first separation distance and the second separation distance used for correcting the probing position are also used for specifying the positional deviation amount. For this reason, according to this circuit board inspection apparatus, the processing is sufficiently performed in comparison with the configuration in which the value used for specifying the positional deviation amount is calculated separately from the first separation distance and the second separation distance used for correcting the probing position. It can be simplified.

In the circuit board inspection apparatus according to claim 3, when the fiducial mark formed on the circuit board is designated as at least one of the first reference pattern and the second reference pattern, the fiducial mark A positional deviation amount is specified based on the imaging result. In this case, the position of the fiducial mark in the pattern formation region is predetermined at the time of manufacturing the circuit board. For this reason, according to this circuit board inspection apparatus, a pattern (for example, a circuit pattern) other than the fiducial mark is selected from the patterns formed on one surface and the other surface as the first reference pattern and the second reference pattern. Unlike the configuration designated as, for example, the step of measuring the reference position of the designated pattern on a non-defective circuit board can be omitted, so that the inspection efficiency can be further improved.

1 is a configuration diagram showing a configuration of a circuit board inspection device 1. FIG. 2 is a plan view showing a configuration on the surface 201 side of the circuit board 100. FIG. 2 is a plan view showing the configuration of the back surface 202 side of the circuit board 100. FIG. 2 is a configuration diagram showing a configuration of a substrate holding unit 11. FIG. It is a block diagram which shows the structure of 1st imaging part 12a, 12b and 1st probing mechanism 13a, 13b. FIG. 5 is a first explanatory view illustrating an inspection method for the circuit board 100. FIG. 6 is a second explanatory view for explaining an inspection method for the circuit board 100. FIG. 10 is a third explanatory diagram illustrating an inspection method for the circuit board 100. FIG. 10 is a fourth explanatory view for explaining the inspection method of the circuit board 100. FIG. 10 is a fifth explanatory view for explaining the inspection method of the circuit board 100; FIG. 10 is a sixth explanatory view for explaining an inspection method for the circuit board 100; FIG. 10 is a seventh explanatory view for explaining an inspection method for the circuit board 100; FIG. 10 is an eighth explanatory view for explaining the inspection method of the circuit board 100. FIG. 10 is a ninth explanatory view for explaining the inspection method of the circuit board 100. FIG. 10 is a tenth explanatory view illustrating the inspection method of the circuit board 100. FIG. 12 is an eleventh explanatory view illustrating the inspection method of the circuit board 100. FIG. 12 is a twelfth explanatory view for explaining the inspection method of the circuit board 100. FIG. 14 is a thirteenth explanatory view illustrating the method for inspecting the circuit board 100. FIG. 14 is a fourteenth explanatory view explaining the inspection method of the circuit board 100. 3 is a plan view showing a configuration of a circuit board 300. FIG.

  Hereinafter, an embodiment of a circuit board inspection apparatus and a circuit board inspection method will be described with reference to the accompanying drawings.

  First, the configuration of a circuit board inspection apparatus 1 as an example of a circuit board inspection apparatus will be described with reference to the drawings. A circuit board inspection apparatus 1 shown in FIG. 1 is configured to be able to perform an electrical inspection on a circuit board 100 shown in FIGS. 2 and 3 as an example of a circuit board.

  In this case, as shown in FIGS. 2 and 3, pattern formation of the pattern formation region 201 a (the region indicated by the alternate long and short dash line in FIG. 2) and the back surface (the other surface) 202 of the circuit board 100. A plurality of circuit patterns 101 are formed in the region 202a (region indicated by a two-dot chain line in FIG. 3). In addition, in a pair of corners facing each other in the pattern formation region 201a (for example, corners located at a pair of corners 100a and 100b facing each other among the four corners 100a to 100d in the circuit board 100), Fiducial marks 102a and 102b (hereinafter also referred to as “fiducial marks 102” when not distinguished) corresponding to the first reference pattern are formed. Further, a fiducial mark 103a corresponding to the second reference pattern is formed on a pair of opposite corners in the pattern formation region 202a (a corner located on the pair of opposite corners 100a and 100b in the circuit board 100). , 103b (hereinafter also referred to as “fiducial mark 103” when not distinguished).

  In this case, the fiducial mark 102 is a mark (pattern) used for correction of the probing position when the inspection probe 41 (see FIG. 5) of the fixture 31a is probed, and is within the pattern formation region 201a. The position is predetermined. The fiducial mark 103 is also a mark (pattern) used for correcting the probing position when probing the inspection probe 41 (see the figure) of the fixture 31b, like the fiducial mark 102. Thus, the position in the pattern formation region 202a is determined in advance.

  On the other hand, as shown in FIG. 1, the circuit board inspection apparatus 1 does not distinguish between the board holding unit 11, the first imaging unit 12a, and the second imaging unit 12b (hereinafter, the first imaging unit 12a and the second imaging unit 12b). (Also referred to as “imaging unit 12”), first probing mechanism 13a, second probing mechanism 13b (hereinafter also referred to as “probing mechanism 13” when the first probing mechanism 13a and second probing mechanism 13b are not distinguished), and inspection unit 14 The display unit 15, the storage unit 16, and the control unit 17 are provided.

  As shown in FIG. 4, the board holding unit 11 includes a holding plate 11 a and a clamp mechanism 11 b and is configured to hold the circuit board 100. The holding plate 11a is configured in a substantially rectangular plate shape. A substantially rectangular opening 11c is formed at the center of the holding plate 11a.

  As shown in FIG. 5, the first imaging unit 12a includes a camera 21a and a moving mechanism 22a, and the second imaging unit 12b includes a camera 21b and a moving mechanism 22b (hereinafter referred to as a camera). When not distinguishing 21a and 21b, it is also referred to as “camera 21”, and when not distinguishing between the moving mechanisms 22a and 22b, it is also referred to as “moving mechanism 22”). The first imaging unit 12 a images the fiducial mark 102 formed on the surface 201 of the circuit board 100 held by the board holding unit 11 under the control of the control unit 17. Further, the second imaging unit 12 b images the fiducial mark 103 formed on the back surface 202 of the circuit board 100 held by the board holding unit 11 according to the control of the control unit 17.

  As shown in FIG. 5, the first probing mechanism 13a is configured to include a fixture 31a and a moving mechanism 32a, and the second probing mechanism 13b is configured to include a fixture 31b and a moving mechanism 32b (hereinafter referred to as “the first probing mechanism 13a”). When the fixtures 31a and 31b are not distinguished from each other, they are also referred to as “fixtures 31”, and when the movement mechanisms 32a and 32b are not distinguished from each other, they are also referred to as “movement mechanisms 32”. The first probing mechanism 13a corrects the probing position based on the imaging result of the first imaging unit 12a, and the inspection probe 41 of the fixture 31a for each circuit pattern 101 formed on the surface 201 of the circuit board 100. Probing The second probing mechanism 13b corrects the probing position based on the imaging result of the second imaging unit 12b, and the inspection probe 41 of the fixture 31b for each circuit pattern 101 formed on the back surface 202 of the circuit board 100. Probing

  The inspection unit 14 performs an electrical inspection on the circuit board 100 based on the electrical signal S input via the fixture 31 of the probing mechanism 13 under the control of the control unit 17. The display unit 15 displays a result of pass / fail determination of the circuit board 100 executed by the control unit 17 according to the control of the control unit 17.

  The storage unit 16 is a non-defective circuit board 100 (there is no relative displacement between the pattern formation regions 201a and 202a, and each pattern formation region 201a and 202a is accurately positioned at a predetermined position on the front surface 201 and the back surface 202. Positions where the fiducial marks 102a and 102b should be positioned when the provided circuit board 100) is positioned at a predetermined position and held by the board holding portion 11 (prescribed holding state). First reference positions Pr1a and Pr1b determined in advance (see FIGS. 11 and 13: Specifically, the XY coordinates of the first reference positions Pr1a and Pr1b when the initial position Ps1 of the camera 21a shown in FIG. 6 is used as the origin. ) Is stored.

  The storage unit 16 also has second reference positions Pr2a and Pr2b that are determined in advance as positions where the fiducial marks 103a and 103b should be positioned when the circuit board 100 is in the prescribed holding state (see FIGS. 12 and 14). Specifically, position data Dp2 indicating the XY coordinates of the second reference positions Pr2a and Pr2b when the initial position Ps2 of the camera 21b shown in FIG. 6 is set as the origin is stored. In this example, as shown in FIG. 17, the first reference position Pr1a and the second reference position Pr2a are defined at the same position, and as shown in FIG. 18, the first reference position Pr1b and the second reference position Pr2b are It shall be specified in the same position. That is, in the non-defective circuit board 100, as shown in FIGS. 2 and 3, the fiducial mark 102a and the fiducial mark 103a face each other, and the fiducial mark 102b and the fiducial mark 103b face each other. It is assumed that it is formed as follows. In the following description, when the first reference positions Pr1a and Pr1b are not distinguished from each other, they are also referred to as “first reference positions Pr1”. When the second reference positions Pr2a and Pr2b are not distinguished from each other, they are also referred to as “second reference positions Pr2”. Further, when the first reference position Pr1 and the second reference position Pr2 are not distinguished, they are also referred to as “reference positions Pr”.

  The storage unit 16 stores later-described measurement positions Pm1a, Pm1a, Pm1b, and Pm2a (hereinafter also referred to as “measurement positions Pm” when not distinguished), which are measured by the control unit 17, respectively. The storage unit 16 also includes first separation distances L1ax, L1ay, L1bx, L1by, L1cx, L1cy (hereinafter also referred to as “first separation distance L1” when not distinguished) calculated by the control unit 17 and the first. 2 separation distances L2ax, L2ay, L2bx, L2by, L2cx, L2cy (hereinafter referred to as “second separation distance L2” when not distinguished, and “separation distance L” when the first separation distance L1 and the second separation distance L2 are not distinguished. (Also called). Furthermore, the storage unit 16 stores a later-described positional deviation amount Gr specified by the control unit 17. In addition, the storage unit 16 stores a reference value Gs used in a determination process described later that is executed by the control unit 17.

  The control part 17 controls each component which comprises the circuit board inspection apparatus 1 according to the operation signal output from the operation part outside a figure. Further, the control unit 17 functions as a processing unit, and specifies a relative positional deviation amount Gr between the pattern formation region 201a on the front surface 201 and the pattern formation region 202a on the back surface 202 on the circuit board 100 based on the separation distance L. Execute specific processing. Further, the control unit 17 functions as a determination unit, and executes a determination process for comparing the positional deviation amount Gr specified by the specifying process with a predetermined reference value Gs to determine the quality of the circuit board 100. Specifically, for example, when the positional deviation amount Gr is less than or equal to the reference value Gs, the control unit 17 determines that the circuit board 100 is “good” and the positional deviation amount Gr is the reference value. When Gs is exceeded (or above), the circuit board 100 is determined to be “defective”.

  Next, a method for inspecting the circuit board 100 using the circuit board inspection apparatus 1 will be described with reference to the accompanying drawings.

  First, as shown in FIG. 6, the circuit board 100 to be inspected is placed on the holding plate 11 a in the board holding part 11, and then the end part of the circuit board 100 is sandwiched and fixed by the clamp mechanism 11 b of the board holding part 11. As a result, the circuit board 100 is held by the board holding part 11. Subsequently, the control unit 17 controls the moving mechanisms 22a and 22b to match the initial position Ps1 of the camera 21a and the initial position Ps2 of the camera 21b, thereby canceling the positional deviation between the initial positions Ps1 and Ps2. . As a result, the situation in which the positional deviation between the initial positions Ps1 and Ps2 is reflected in the positional deviation amount Gr described later is eliminated, and the positional deviation amount Gr is accurately specified.

  Next, an inspection start operation is performed using an operation unit (not shown). In response to this, the control unit 17 controls the camera 21a of the first imaging unit 12a to start imaging. In addition, the control unit 17 reads the position data Dp1 from the storage unit 16, and then controls the moving mechanism 22a of the first imaging unit 12a to control the first reference position of the fiducial mark 102a indicated by the position data Dp1. The camera 21a is moved toward Pr1a. Next, the control unit 17 controls the moving mechanism 22a of the first imaging unit 12a, and based on the imaging result by the camera 21a, the fiducial formed on the surface 201 of the circuit board 100 as shown in FIG. The movement of the camera 21a is stopped at a position where the center of the mark 102a coincides with the center of the camera 21a.

  Subsequently, the control unit 17 performs fiducial based on the distance along the XY direction from the initial position Ps1 (see FIG. 7) of the camera 21a to the position where the center of the camera 21a and the center of the fiducial mark 102a coincide. The position of the char mark 102a is measured, and the measurement position Pm1a (see FIG. 11) is stored in the storage unit 16. 7 to 19, the circuit board 100 is shown as viewed from the front surface 201 side, and the circuit pattern 101 is not shown.

  Next, the control unit 17 controls the moving mechanism 22a to move the camera 21a toward the first reference position Pr1b of the fiducial mark 102b indicated by the position data Dp1, and subsequently, as shown in FIG. Then, the movement of the camera 21a is stopped at a position where the center of the fiducial mark 102b coincides with the center of the camera 21a. Next, the control unit 17 determines the position of the fiducial mark 102b based on the distance along the XY direction from the initial position Ps1 of the camera 21a to the position where the center of the camera 21a coincides with the center of the fiducial mark 102b. The measurement position Pm1b is measured and stored in the storage unit 16.

  Subsequently, the control unit 17 reads the position data Dp2 from the storage unit 16, and then controls the moving mechanism 22b of the second imaging unit 12b to control the second reference position of the fiducial mark 103a indicated by the position data Dp2. The camera 21b is moved toward Pr2a. Subsequently, as shown in FIG. 9, the control unit 17 stops the movement of the camera 21b at a position where the center of the fiducial mark 103a and the center of the camera 21b coincide. Next, the control unit 17 determines the position of the fiducial mark 103a based on the distance along the XY direction from the initial position Ps2 of the camera 21b to the position where the center of the camera 21b coincides with the center of the fiducial mark 103a. The measurement position Pm2a is measured and stored in the storage unit 16.

  Subsequently, the control unit 17 controls the moving mechanism 22b to move the camera 21b toward the second reference position Pr2b of the fiducial mark 103b indicated by the position data Dp2, and then, as shown in FIG. The movement of the camera 21b is stopped at a position where the center of the fiducial mark 103b and the center of the camera 21b coincide. Subsequently, the control unit 17 determines the position of the fiducial mark 103b based on the distance along the XY direction from the initial position Ps2 of the camera 21b to the position where the center of the camera 21b coincides with the center of the fiducial mark 103b. And the measurement position Pm2b is stored in the storage unit 16.

  Next, as shown in FIG. 11, the control unit 17 calculates the first separation distance L1ax along the X direction and the first separation distance L1ay along the Y direction between the first reference position Pr1a and the measurement position Pm1a. Then, as shown in FIG. 12, the second separation distance L2ax along the X direction between the second reference position Pr2a and the measurement position Pm2a and the second distance along the Y direction are stored. The separation distance L2ay is calculated and stored in the storage unit 16. Next, as shown in FIG. 13, the control unit 17 calculates the first separation distance L1bx along the X direction and the first separation distance L1by along the Y direction between the first reference position Pr1b and the measurement position Pm1b. Then, as shown in FIG. 14, the second separation distance L2bx along the X direction between the second reference position Pr2b and the measurement position Pm2b and the second along the Y direction are stored. The separation distance L2by is calculated and stored in the storage unit 16.

  Next, as illustrated in FIG. 15, the control unit 17 determines the reference position Pcs1 at the center of the pattern formation area 201a specified by the first reference positions Pr1a and Pr1b and the pattern formation area specified by the measurement positions Pm1a and Pm1b. A first separation distance L1cx along the X direction and a first separation distance L1cy along the Y direction from the actual position Pcm1 at the center of 201a are calculated and stored in the storage unit 16. Subsequently, as shown in FIG. 16, the control unit 17 forms the pattern formation specified by the reference position Pcs2 at the center of the pattern formation region 202a specified by the second reference positions Pr2a and Pr2b and the measurement positions Pm2a and Pm2b. A second separation distance L2cx along the X direction and a second separation distance L2cy along the Y direction from the actual position Pcm2 at the center of the region 202a are calculated and stored in the storage unit 16.

  Next, the control unit 17 executes a specifying process for specifying the relative positional deviation amount Gr between the pattern formation region 201a and the pattern formation region 202a based on the above-described separation distance L. 11 to 19, when the measurement position Pm is located on the right side of the reference position Pr and on the upper side, the separation distance L when the measurement position Pm is located on the upper side is a positive value, and the measurement position Pm is the reference position. In the following, the distance L between the position Pr and the position Pr on the left side of the position Pr will be described as a negative value.

  In this specific process, the control unit 17 firstly, of the four corners 100a to 100d in the circuit board 100, the corner 100a in which the fiducial marks 102a and 103a are formed (the upper left corner in FIG. 17). ) Based on the first separation distance L1ax and the second separation distance L2ax. The positional deviation amount Gr along the X direction of the pattern formation regions 201a and 202a in FIG. (Hereinafter, this positional deviation amount Gr is also referred to as “the positional deviation amount Gr1x”). To identify. Specifically, the control unit 17 uses the absolute value of a value obtained by subtracting the second separation distance L2ax from the first separation distance L1ax (a difference value between the first separation distance L1ax and the second separation distance L2ax) as the positional deviation amount Gr1x. As specified. In this case, in this example, as shown in the figure, since the measurement position Pm1a is located on the left side of the first reference position Pr1a, the first separation distance L1ax is a negative value, and the measurement position Pm2a is the second reference position. Since it is located on the right side of Pr2a, the second separation distance L2ax is a positive value. For this reason, the total value of the absolute value of the first separation distance L1ax and the absolute value of the second separation distance L2ax is the positional deviation amount Gr1x.

  Subsequently, the control unit 17 sets the positional deviation amount Gr along the Y direction of the pattern formation regions 201a and 202a in the corner portion 100a (hereinafter, this positional deviation amount Gr is also referred to as “the positional deviation amount Gr1y”) to the first separation. It specifies based on distance L1ay and 2nd separation distance L2ay. Specifically, the control unit 17 uses the absolute value of the value obtained by subtracting the second separation distance L2ay from the first separation distance L1ay (the difference value between the first separation distance L1ay and the second separation distance L2ay) as the positional deviation amount Gr1y. As specified. In this case, in this example, as shown in FIG. 17, since the measurement position Pm1a is located below the first reference position Pr1a, the first separation distance L1ay is a negative value, and the measurement position Pm2a is the second reference position. Since it is located above the position Pr2a, the second separation distance L2ay has a positive value. Therefore, the total value of the absolute value of the first separation distance L1ay and the absolute value of the second separation distance L2ay is the positional deviation amount Gr1y.

  Next, the control unit 17 has a pattern in a corner 100b (lower right corner in FIG. 18) in which the fiducial marks 102b and 103b are formed among the four corners 100a to 100d in the circuit board 100. The positional deviation amount Gr along the X direction of the formation regions 201a and 202a (hereinafter, this positional deviation amount Gr is also referred to as “the positional deviation amount Gr2x”) is specified based on the first separation distance L1bx and the second separation distance L2bx. . Specifically, an absolute value of a value obtained by subtracting the second separation distance L2bx from the first separation distance L1bx (a difference value between the first separation distance L1bx and the second separation distance L2bx) is specified as the positional deviation amount Gr2x. Subsequently, the control unit 17 sets the positional deviation amount Gr along the Y direction of the pattern formation regions 201a and 202a in the corner portion 100b (hereinafter, this positional deviation amount Gr is also referred to as “the positional deviation amount Gr2y”) to the first separation. It specifies based on distance L1by and 2nd separation distance L2by. Specifically, the control unit 17 determines the absolute value of the value obtained by subtracting the second separation distance L2by from the first separation distance L1by (difference value between the first separation distance L1by and the second separation distance L2by) as the positional deviation amount Gr2y. As specified.

  Next, the control unit 17 sets a positional deviation amount Gr along the X direction of the pattern formation regions 201a and 202a in the central portion of the circuit board 100 (hereinafter, this positional deviation amount Gr is also referred to as “a positional deviation amount Gr3x”). It specifies based on 1 separation distance L1cx and 2nd separation distance L2cx. Specifically, a value obtained by subtracting the second separation distance L2cx from the first separation distance L1cx is specified as the positional deviation amount Gr3x. Subsequently, the control unit 17 calculates a positional deviation amount Gr along the Y direction of the pattern formation regions 201a and 202a in the central portion of the circuit board 100 (hereinafter, this positional deviation amount Gr is also referred to as “a positional deviation amount Gr3y”). It specifies based on the 1st separation distance L1cy and the 2nd separation distance L2cy. Specifically, the control unit 17 specifies an absolute value of a value obtained by subtracting the second separation distance L2cy from the first separation distance L1cy as the positional deviation amount Gr3y.

  Thus, the specifying process for specifying the relative positional deviation amount Gr between the pattern formation regions 201a and 202a is completed. Next, the control unit 17 executes a determination process for determining whether the circuit board 100 is good or bad. In this determination process, the control unit 17 reads the reference value Gs from the storage unit 16. Subsequently, the control unit 17 compares the positional deviation amount Gr specified by the above-described specifying process with the reference value Gs. In this case, for example, when one or more of the positional deviation amounts Gr1x, Gr1y, Gr2x, Gr2y, Gr3x, Gr3y are equal to or greater than the reference value Gs, the control unit 17 determines that the circuit board 100 is defective. Is displayed on the display unit 15 to complete the inspection.

  Here, for example, a configuration for specifying only one positional deviation amount Gr specified based on the first separation distance L1 of one fiducial mark 102 and the second separation distance L2 of one fiducial mark 103, and In the method, even if the misregistration amount Gr is large at other locations other than the locations where the fiducial marks 102 and 103 are formed, if the misregistration amount Gr is small at the locations where the fiducial marks 102 and 103 are formed, the circuit The substrate 100 may be determined to be good. On the other hand, in the circuit board inspection apparatus 1 and the circuit board inspection method, as described above, a plurality of first separation distances L1 for the plurality of fiducial marks 102 and a plurality of the fiducial marks 103 are provided. The positional deviation amounts Gr at a plurality of locations are specified based on the second separation distance L2, and the circuit board 100 is determined to be defective when one or more positional deviation amounts Gr are equal to or greater than the reference value Gs. . For this reason, in the circuit board inspection apparatus 1 and the circuit board inspection method, even when the position deviation amount Gr differs depending on the location, if the position deviation amount Gr at any location is greater than or equal to the reference value Gs, the circuit board It is possible to reliably determine that 100 is defective.

  On the other hand, when each of the misregistration amounts Gr1x, Gr1y, Gr2x, Gr2y, Gr3x, and Gr3y is less than the reference value Gs, the control unit 17 determines that the circuit board 100 is good, and then executes an electrical inspection. . Specifically, the control unit 17 controls the moving mechanism 32 of each probing mechanism 13 to move the fixture 31 and cause each circuit pattern 101 to probe each circuit pattern 101. At this time, according to the control of the control unit 17, each moving mechanism 32 causes each inspection probe 41 to be probed while correcting the probing position based on the first separation distance L <b> 1 (imaging result by each imaging unit 12). .

  Subsequently, under the control of the control unit 17, the inspection unit 14 performs an electrical inspection on the circuit board 100 based on the electric signal S input / output via the inspection probes 41 of the fixtures 31 a and 31 b. Next, the control unit 17 causes the display unit 15 to display the result of the electrical inspection performed by the inspection unit 14.

  As described above, in the circuit board inspection apparatus 1 and the circuit board inspection method, the measurement position Pm of the fiducial marks 102 and 103 is measured based on the imaging results of the fiducial marks 102 and 103, and the pattern formation on the surface 201 is performed. The relative displacement Gr between the region 201a and the pattern formation region 202a on the back surface 202 is identified based on each measurement position Pm, and the circuit board is defective when the identified displacement is greater than a predetermined reference value. Is determined. Therefore, according to the circuit board inspection apparatus 1 and the circuit board inspection method, unlike the conventional circuit board inspection apparatus that does not have such a function, it is different from the circuit board inspection apparatus 1 such as a three-dimensional measuring apparatus. The operation (process / inspection) for measuring the positions of the fiducial marks 102 and 103 using the apparatus and specifying the relative displacement Gr of the circuit patterns 101 on both surfaces 201 and 202 based on the measurement results is performed. As a result of being able to be omitted, the inspection efficiency can be sufficiently improved.

  In the circuit board inspection apparatus 1 and the circuit board inspection method, the plurality of first separation distances L1 for the plurality of fiducial marks 102 and the plurality of second separation distances L2 for the plurality of fiducial marks 103 are also obtained. Based on this, the positional deviation amounts Gr at a plurality of locations are specified. Therefore, in the circuit board inspection apparatus 1 and the circuit board inspection method, for example, it is determined that the circuit board 100 is defective when one or more of the positional deviation amounts Gr at a plurality of locations is equal to or greater than the reference value Gs. Thus, even when the magnitude of the positional deviation amount Gr varies depending on the location, if the positional deviation amount Gr at any location is greater than or equal to the reference value Gs, it can be reliably determined that the circuit board 100 is defective. it can.

  Further, in the circuit board inspection apparatus 1 and the circuit board inspection method, the first separation distance L1 between the first reference position Pr1 and the measurement position Pm1 is calculated, and between the second reference position Pr2 and the measurement position Pm2. The second separation distance L2 is calculated, and the difference value between the first separation distance L1 and the second separation distance L2 is specified as the positional deviation amount Gr. Specifically, for example, an absolute value of a value obtained by subtracting the second separation distance L2ax from the first separation distance L1ax is specified as the positional deviation amount Gr1x. When the specified amount Gr1x is equal to or greater than the reference value Gs, the circuit board 100 is determined to be defective. In this case, the correction of the probing position when the inspection probe 41 is probed to perform the electrical inspection on the circuit board 100 is generally performed by the first separation distance L1 and the second separation distance L2 thus calculated. Is used. That is, in the circuit board inspection apparatus 1 and the circuit board inspection method, the first separation distance L1 and the second separation distance L2 used for correcting the probing position are also used for specifying the positional deviation amount Gr. For this reason, according to the circuit board inspection apparatus 1 and the circuit board inspection method, a value used for specifying the positional deviation amount Gr is calculated separately from the first separation distance L1 and the second separation distance L2 used for correcting the probing position. Compared with the configuration and method, the processing can be simplified sufficiently.

  In the circuit board inspection apparatus 1 and the circuit board inspection method, the positional deviation amount Gr is specified based on the imaging results of the fiducial marks 102 and 103 designated as the first reference pattern and the second reference pattern. In this case, the positions of the fiducial marks 102 and 103 in the pattern formation regions 201 a and 202 a are determined in advance at the time of manufacturing the circuit board 100. Therefore, according to the circuit board inspection apparatus 1 and the circuit board inspection method, the circuit pattern 101 used as the first reference pattern and the second reference pattern is designated from the circuit patterns 101 formed on the front surface 201 and the back surface 202. Unlike the configuration and method, for example, the step of measuring the reference position Pr of the designated circuit pattern 101 on the non-defective circuit board 100 can be omitted. As a result, the inspection efficiency can be further improved.

  The circuit board inspection apparatus 1 and the circuit board inspection method are not limited to the above configuration and method. For example, between the pattern formation region 201a and the pattern formation region 202a based on the imaging results of the two fiducial marks 102a and 102b on the front surface 201 and the imaging results of the two fiducial marks 103a and 103b on the back surface 202. As described above, the relative displacement amount Gr is specified based on the imaging result of one fiducial mark on the front surface 201 and the imaging result of one fiducial mark on the back surface 202. The positional deviation amount Gr is specified based on the configuration and method for specifying Gr, the imaging result of three or more fiducial marks on the front surface 201, and the imaging result of three or more fiducial marks on the back surface 202. Configurations and methods can also be employed.

  In addition, the pattern formation region 201a in the central portion of the circuit board 100 (that is, a location other than the formation location of the fiducial mark 102 as the first reference pattern and the formation location of the fiducial mark 103 as the second reference pattern). , 202a has been described above with respect to the configuration and method for specifying the positional deviation amount Gr. However, it is also possible to adopt a configuration and method for specifying only the positional deviation amount Gr at the location where the fiducial marks 102 and 103 are formed.

  Further, the configuration and method for calculating the separation distance L between the reference position Pr and the measurement position Pm and specifying the positional deviation amount Gr based on the separation distance L have been described above. However, the fiducial in the non-defective circuit board 100 is described above. When the distance between the marks 102 and 103 is defined in advance (known), the distance between the fiducial marks 102 and 103 on the circuit board 100 to be inspected from the measurement position Pm of each fiducial mark 102 and 103 is determined. It is also possible to adopt a configuration and method in which the actual separation distance is obtained and the difference value between the predetermined separation distance and the actual separation distance is specified as the positional deviation amount Gr. In this case, when two (plural) fiducial marks 102a and 102b and two (plural) fiducial marks 103a and 103b are formed as in the circuit board 100 described above, fiducials are formed. A difference value between the predetermined separation distance between the marks 102a and 103a and the actual separation distance is specified as a positional deviation amount Gr, and the predetermined separation distance between the fiducial marks 102b and 103b and the actual separation distance are specified. A difference value from the distance can be specified as the positional deviation amount Gr (that is, this processing is performed for a plurality of locations).

  Moreover, although the first reference positions Pr1a and Pr2a are defined at the same position and the second reference positions Pr1b and Pr2b are defined at the same position, the first reference positions Pr1a and Pr2a are defined at different positions. The circuit board 100 (for example, the circuit board 300 shown in FIG. 20) in which the second reference positions Pr1b and Pr2b are defined at different positions can be inspected in the same manner as described above. .

  Further, although the example in which the fiducial marks 102a and 102b are designated as the first reference pattern and the fiducial marks 103a and 103b are designated as the second reference pattern has been described above, the circuit pattern formed on the surface 201 is described above. One or more of 101 are defined as a first reference pattern, or one or more of circuit patterns 101 formed on the back surface 202 are defined as a second reference pattern. In addition, inspection can be performed by the circuit board inspection apparatus 1 and the circuit board inspection method described above, and even in this case, the above-described effects can be realized.

DESCRIPTION OF SYMBOLS 1 Circuit board inspection apparatus 11 Board | substrate holding part 12a 1st imaging part 12b 2nd imaging part 13a 1st probing mechanism 13b 2nd probing mechanism 14 Inspection part 17 Control part 41 Probe 100 for inspection 100,300 Circuit board 101 Circuit pattern 102a, 102b Fiducial mark 103a, 103b Fiducial mark 201 Front surface 201a Pattern formation region 202 Back surface 202a Pattern formation region Gr Position shift amount Gs Reference value L1ax, L1ay, L1bx, L1by, L1cx, L1cy First separation distance L2ax, L2ay, L2bx , L2by, L2cx, L2cy Second separation distance Pm1a, Pm1b, Pm2a, Pm2b Measurement position Pr1a, Pr1b First reference position Pr2a, Pr2b Second reference position S Electric signal

Claims (4)

A first image pickup for picking up an image of a first reference pattern designated in advance among each of the patterns formed on one surface of the circuit board held by the board holding portion and holding the circuit board. A probing position based on an imaging result obtained by the first imaging unit, a second imaging unit that images a second reference pattern designated in advance among each pattern formed on the other surface of the circuit board A first probing mechanism for probing an inspection probe with respect to each pattern formed on the one surface while correcting the probing position based on an imaging result by the second imaging unit. A second probing mechanism for probing the inspection probe with respect to each pattern formed on the surface, and input / output via each inspection probe A circuit board inspection apparatus comprising an inspection unit for performing an electrical inspection of the circuit board on the basis of the electrical signal,
A processing unit that executes a process of specifying a relative displacement amount between the pattern formation region on the one surface and the pattern formation region on the other surface; and the predetermined displacement amount and the predetermined amount. A determination unit that determines whether the circuit board is good or bad by comparing the reference value
The first imaging unit and the second imaging unit are each configured to include a camera and a moving mechanism that moves the camera,
The processing unit controls the moving mechanism of the first imaging unit to move the camera of the first imaging unit toward the plurality of first reference patterns, and specifies from the imaging result of the camera The position of each first reference pattern is measured based on the moving distance of the camera, and the moving mechanism of the second imaging unit is controlled to move toward the plurality of second reference patterns. The position of each said 2nd reference pattern is measured based on the moving distance of the said camera which each moved the said camera and was specified from the said imaging result by the said camera, and each measurement position of each said 1st reference pattern which measured each measurement position and the circuit board inspection apparatus for specifying the positional deviation amount at a plurality of locations on the basis of each said second reference pattern. The processing unit includes a first reference position that is determined in advance as a position where the first reference pattern is to be positioned when the circuit board is in a predetermined holding state in which the circuit board is held in a predetermined position by the substrate holding unit. A first separation distance between the first reference pattern and the measurement position is calculated, and a second predetermined position is determined as a position where the second reference pattern should be positioned when the circuit board is in the specified holding state. claim calculating a second distance between the reference position and the measurement position of the second reference pattern, and identifies the difference between the second distance and the first distance, as the positional deviation amount 1 serial mounting of the circuit board inspection apparatus. When the fiducial mark formed on the circuit board is designated as at least one of the first reference pattern and the second reference pattern, the processing unit determines the imaging result of the fiducial mark. circuit board inspection apparatus according to claim 1 or 2 wherein identifying the positional deviation amount based. Each pattern formed on the other surface of the circuit board is picked up by imaging a first reference pattern designated in advance among the patterns formed on one surface of the circuit board held by the board holding unit. The second reference pattern designated in advance is imaged, and the probe for inspection is applied to each pattern formed on the one surface while correcting the probing position based on the imaging result of the first reference pattern. Probing and probing the inspection probe for each pattern formed on the other surface while correcting the probing position based on the imaging result of the second reference pattern, and entering through the inspection probes. A circuit board inspection method for performing an electrical inspection on the circuit board based on an electrical signal to be output,
The position of each said 1st reference pattern is moved based on the movement distance of the said camera specified from the said imaging result by the said camera which moves the camera which images the said 1st reference pattern toward the said some 1st reference pattern, respectively. Each of the second references is measured based on the movement distance of the camera specified from the imaging result of the camera by moving each of the cameras that capture the second reference pattern toward a plurality of the second reference patterns. Each measurement position of each said 1st reference pattern which measured the position of the pattern and measured the relative displacement amount of the pattern formation area in the one side and the pattern formation area in the other side ratio and identified on the basis of the respective measurement positions of each of the second reference pattern, and a reference value predetermined with the specified position deviation amount Circuit board inspection method for determining the quality of the circuit board and.

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