JPWO2019102890A1 - Board inspection device, inspection position correction method, position correction information generation method, and position correction information generation system - Google Patents

Abstract

The substrate inspection device 1 is a combination pattern of an inspection jig 3 that holds a plurality of probes U and D, a drive mechanism 801 that brings the plurality of probes U and D into contact with the surface of the substrate, and a conduction state of each probe U and D. The inspection jig 3 is moved to a predetermined inspection position and a storage unit 86 that stores in advance position correction information in which deviation information representing the deviation of the inspection jig 3 and each combination pattern are associated with each other. Of the plurality of combination patterns, the continuity state detection unit 82 that detects the continuity state of each probe U and D by bringing the probes U and D into contact with the substrate at the inspection position, and the continuity state of each detected probe. The deviation information acquisition unit 83 that selects one of the above and acquires the deviation information associated with the selected combination pattern by the position correction information as the correction deviation amount, and corrects the inspection position based on the correction deviation amount. A correction unit 84 is provided.

Description

The present invention relates to a substrate inspection device capable of correcting an inspection position, an inspection position correction method, a position correction information generation method for generating position correction information used for correction of the inspection position, and a position correction information generation system.

Conventionally, a substrate inspection device that inspects a substrate by pressing a probe against the substrate has been known. In such a substrate inspection device, it is necessary to accurately bring the probe into contact with the inspection point provided on the substrate. Therefore, the substrate to be inspected is imaged with a camera, and the position of the probe is positioned based on the captured image. Is being done. When positioning the probe position based on such an captured image, if an attempt is made to take an image with the probe in contact with the substrate, the probe becomes an obstacle and the substrate cannot be photographed.

Therefore, the substrate is imaged by a camera attached to the inspection unit with the probe separated from the substrate, the amount of displacement and the amount of inclination of the substrate are calculated from the image, and the position and inclination of the probe are corrected based on the camera image. Then, a technique is known in which the probe is lowered to bring it into contact with the substrate (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 6-129831

However, as described above, when positioning is performed based on the image captured by the camera, positioning accuracy exceeding the resolution of the camera or its optical system cannot be obtained. For example, if the positioning accuracy is set to 0.1 μm or less, the accuracy required to be the same as the wavelength of light is required. Therefore, it is not easy to obtain an optical system capable of obtaining such a high-precision resolution. Further, since the probe is moved or rotated after the substrate is imaged by the camera, the position shift due to the driving accuracy of the driving mechanism, backlash, or the like occurs. Therefore, it is difficult to accurately bring the probe into contact with the inspection point on the substrate. On the other hand, in recent years, the miniaturization of the substrate has progressed, and it has become impossible to obtain sufficient positioning accuracy by the positioning method based on the camera image.

If the positioning accuracy is low and the inspection point and the probe are out of alignment, the user tries to fine-tune the position and tilt of the probe until the correct continuity result is obtained by actually performing the continuity inspection of the board. It is necessary to position by mistake, which takes time and effort. In addition, since it is necessary to repeatedly connect and disconnect the probe, the substrate used for positioning may be consumed or the probe may be deteriorated.

An object of the present invention is to provide a substrate inspection device for easily improving the positioning accuracy of a probe, an inspection position correction method, a position correction information generation method for generating position correction information used for these, and a position correction information generation system. It is to be.

The substrate inspection apparatus according to an example of the present invention has a plurality of pieces for contacting a plurality of inspection points set for the conductive exposed portion, which is an exposed portion of the plurality of conductive portions formed on the surface of the substrate to be inspected. A combination pattern of a jig for holding the probe, a drive mechanism for moving the jig relative to the substrate to bring the plurality of probes into contact with the surface of the substrate, and a conduction state of each probe. The jig includes a storage unit that stores in advance position correction information in which a plurality of patterns are included and is associated with deviation information representing the deviation of the jig and each combination pattern, and the jig is moved to a predetermined inspection position on the substrate by the drive mechanism. The conduction state detection unit that executes the continuity state detection process for detecting the continuity state of each probe by bringing the plurality of probes into contact with the surface of the substrate at the inspection position, and the detected One of the plurality of combination patterns is selected based on the conduction state of each probe, and the deviation information associated with the selected combination pattern by the position correction information is acquired as the correction deviation amount. A deviation information acquisition unit that executes information acquisition processing and a correction unit that corrects the inspection position based on the correction deviation amount are provided.

Further, the position correction information generation method according to an example of the present invention is a position correction information generation method for generating the position correction information in the above-mentioned substrate inspection apparatus, and (2a) the position of each conductive exposed portion on the substrate. The step of preparing the conductive exposed portion position data representing the above, (2b) the step of preparing the probe placement data representing the placement of each probe, and (2c) the plurality of probes contacting the plurality of inspection points, respectively. With the position of the jig as a reference position, the jig is positioned at a plurality of positions deviated from the reference position along the surface direction of the substrate based on the conductive exposed portion position data and the probe arrangement data. This includes a step of acquiring the conduction state of each of the probes when the probe is made, and generating position correction information for associating the deviation information representing the deviation with the conduction state of the probe.

Further, the position correction information generation method according to an example of the present invention can move to a plurality of inspection points set for the conductive exposed portion, which is an exposed portion in the plurality of conductive portions provided on the substrate to be inspected. It is a position correction information generation method for generating position correction information for correcting an inspection position which is a position where a plurality of probes held so as to correspond to the arrangement of the plurality of inspection points by a jig are brought into contact with each other. (2a) A step of preparing conductive exposed portion position data representing the position of each of the conductive exposed portions on the substrate, (2b) a step of preparing probe arrangement data representing the arrangement of each of the probes, and (2c) the plurality of steps. The position of the jig in which the plurality of probes come into contact with the inspection point is set as a reference position, and based on the conductive exposed portion position data and the probe arrangement data, the reference position is along the surface direction of the substrate. A step of acquiring the conduction state of each probe when the jig is positioned at a plurality of displaced positions, and generating position correction information for associating the deviation information representing the deviation with the conduction state of the probe. And include.

Further, the position correction information generation system according to an example of the present invention can move to a plurality of inspection points set for the conductive exposed portion, which is an exposed portion in the plurality of conductive portions provided on the substrate to be inspected. A position correction information generation system that generates position correction information for correcting an inspection position, which is a position where a plurality of probes held so as to correspond to the arrangement of the plurality of inspection points are brought into contact with each other. The conductive exposed portion position data storage unit that stores the conductive exposed portion position data representing the position of each conductive exposed portion on the substrate, the probe arrangement data storage unit that stores the probe arrangement data representing the arrangement of each probe, and the above. The position of the jig in which the plurality of probes come into contact with the plurality of inspection points is set as a reference position, and based on the conductive exposed portion position data and the probe arrangement data, the reference position is directed to the surface direction of the substrate. Acquires the conduction state of each probe when the jig is positioned at a plurality of positions shifted along the line, and generates position correction information for associating the deviation information representing the deviation with the conduction state of the probe. It is provided with a position correction information generation unit.

Further, the inspection position correction method according to an example of the present invention includes (1a) a step of generating the position correction information by the above-mentioned position correction information generation method, and (1b) the jig is placed at a predetermined inspection position on the substrate. Based on the step of detecting the conduction state of each of the probes by moving them relatively and bringing the plurality of probes into contact with the surface of the substrate at the inspection position, and (1c) the conduction state of each of the detected probes. A step of selecting one of the plurality of combination patterns and acquiring the deviation information associated with the selected combination pattern by the position correction information as a correction deviation amount, and (1d) the correction deviation. It includes a step of correcting the inspection position based on the amount.

Further, the inspection position correction method according to an example of the present invention is (1a) a plurality of inspection points set for the conductive exposed portion which is an exposed portion in the plurality of conductive portions formed on the surface of the substrate to be inspected. A plurality of patterns of combination patterns of conduction states of a plurality of probes to be brought into contact with the probe are included, and position correction information in which the deviation information representing the deviation of the jig holding the plurality of probes and the combination patterns are associated with each other is prepared. (1b) The jig is relatively moved to a predetermined inspection position with respect to the substrate, and the plurality of probes are brought into contact with the surface of the substrate at the inspection position to detect the conduction state of each probe. (1c) One of the plurality of combination patterns is selected based on the conduction state of each of the detected probes, and the selected combination pattern is associated with the position correction information. It includes a step of acquiring the deviation information as a correction deviation amount and (1d) a step of correcting the inspection position based on the correction deviation amount.

It is explanatory drawing which conceptually shows the schematic structure of the substrate inspection apparatus which uses the inspection position correction method which concerns on one Embodiment of this invention. It is a block diagram which mainly shows an example of the electrical structure of the substrate inspection apparatus shown in FIG. It is a block diagram which shows an example of the structure of the position correction information generation system which concerns on one Embodiment of this invention. It is explanatory drawing which shows an example of the information which shows the continuity state for each deviation included in the position correction information. It is explanatory drawing which shows an example of the information which shows the continuity state for each deviation included in the position correction information. It is explanatory drawing which shows an example of the information which shows the continuity state for each deviation included in the position correction information. It is explanatory drawing which shows the state which superposed the probe arrangement image represented by the probe arrangement data with respect to the conductive part arrangement image represented by the conductive exposed part position data so that it may be located at a reference position. It is explanatory drawing which shows the state which superposed the probe arrangement image with respect to the conductive part arrangement image so that it may be positioned corresponding to the position which is relatively displaced. It is explanatory drawing which shows the state which superposed the probe arrangement image with respect to the conductive part arrangement image so that it may be positioned corresponding to the position which is relatively displaced. It is explanatory drawing which shows the state which superposed the probe arrangement image with respect to the conductive part arrangement image so that it may be positioned corresponding to the position which is relatively displaced. It is explanatory drawing which shows the state which superposed the probe arrangement image with respect to the conductive part arrangement image so that it may be positioned corresponding to the position which is relatively displaced. It is explanatory drawing which shows the state which superposed the probe arrangement image with respect to the conductive part arrangement image so that it may be positioned corresponding to the position which is relatively displaced. It is explanatory drawing which shows the state which superposed the probe arrangement image with respect to the conductive part arrangement image so that it may be positioned corresponding to the position which is relatively displaced. It is explanatory drawing which shows the state which superposed the probe arrangement image with respect to the conductive part arrangement image so that it may be positioned corresponding to the position which is relatively displaced. It is a flowchart which shows an example of the position correction information generation method which concerns on one Embodiment of this invention. It is a flowchart which shows an example of the position correction information generation method which concerns on one Embodiment of this invention. It is explanatory drawing which shows an example of the information (U) corresponding to a conductive part. It is explanatory drawing which shows an example of the conductive part correspondence information (U, D) or the position correction information. It is a flowchart which shows an example of the operation of the substrate inspection apparatus shown in FIG. It is a flowchart which shows an example of the operation of the substrate inspection by the substrate inspection apparatus shown in FIG. It is explanatory drawing which shows an example of the case where a probe straddles and contacts a plurality of conductive portions formed on a substrate. It is explanatory drawing which shows another example of the case where a probe straddles and contacts a plurality of conductive portions formed on a substrate. It is explanatory drawing which shows an example of the position correction information which showed the conduction state by a plurality of net numbers corresponding to a plurality of conductive portions with which each probe contacts. It is a block diagram which shows an example of the structure of the substrate inspection apparatus which uses the inspection position correction method which concerns on 2nd Embodiment of this invention. It is a block diagram which shows an example of the electric structure of the position correction information generation system which uses the position correction information generation method which concerns on 2nd Embodiment of this invention. It is a flowchart which shows an example of the position correction information generation method which concerns on 2nd Embodiment of this invention. It is a flowchart which shows an example of the position correction information generation method which concerns on 2nd Embodiment of this invention. It is a flowchart which shows an example of the operation of the substrate inspection apparatus shown in FIG. It is a flowchart which shows an example of the operation of the substrate inspection by the substrate inspection apparatus shown in FIG.

Hereinafter, embodiments according to an example of the present invention will be described with reference to the drawings. It should be noted that the configurations with the same reference numerals in each figure indicate that they are the same configurations, and the description thereof will be omitted.

(First Embodiment)

FIG. 1 is an explanatory diagram conceptually showing a schematic configuration of a substrate inspection apparatus using the inspection position correction method according to the first embodiment of the present invention. FIG. 2 is a block diagram showing an example of mainly an electrical configuration of the substrate inspection device 1 shown in FIG. The substrate inspection device 1 shown in FIGS. 1 and 2 is an apparatus for inspecting a wiring pattern formed on a substrate 100, which is an example of an inspection target.

The substrate 100 may be various substrates such as a printed wiring board, a flexible substrate, a ceramic multilayer wiring board, an electrode plate for a liquid crystal display or a plasma display, a semiconductor substrate, and a package substrate or a film carrier for a semiconductor package.

A plurality of conductive portions 104 such as wiring patterns are formed on the upper surface (first surface), the lower surface (second surface) of the substrate 100, the inner layer of the substrate 100, and the like. At least a part of the conductive portion 104 formed on the upper surface or the lower surface of the substrate 100 is the conductive exposed portion 105, and the portion other than the conductive exposed portion 105 is covered with an insulating film such as a resist. .. Since the conductive portion 104 is exposed in the conductive exposed portion 105, the probe and the conductive portion 104 are made conductive by bringing the probe into contact with the conductive exposed portion 105.

An inspection point 102 is set on the conductive exposed portion 105. An insulating film such as a resist may not be formed. When an insulating film such as a resist is not formed, the entire portion of the conductive portion 104 formed on the upper surface or the lower surface of the substrate 100 becomes the conductive exposed portion 105. Hereinafter, for the sake of simplicity, an example in which an insulating film such as a resist is not formed and the entire portion formed on the upper surface or the lower surface of the substrate 100 is the conductive exposed portion 105 will be described.

Marks 103 and 103 for detecting the position and inclination of the substrate 100 are formed at substantially diagonal positions on the upper surface and the lower surface of the substrate 100. The inspection point 102 includes, for example, a wiring pattern, solder bumps, lands, pads, connection terminals, and the like.

The substrate inspection device 1 shown in FIG. 1 roughly includes inspection mechanisms 4U and 4D, a substrate fixing device 6, and an inspection unit 8. The board fixing device 6 is configured to fix the board 100 to be inspected at a predetermined position. The substrate fixing device 6 may have a configuration in which the substrate 100 is conveyed to the inspection position by sliding and moving. The inspection mechanisms 4U and 4D include inspection jigs 3U and 3D and imaging units 41U and 41D. The imaging units 41U and 41D are directly or indirectly attached to the inspection jigs 3U and 3D so as to move integrally with the inspection jigs 3U and 3D. The inspection jig 3U corresponds to an example of the first jig, and the inspection jig 3D corresponds to an example of the second jig.

The inspection mechanisms 4U and 4D support the inspection jigs 3U and 3D and the imaging units 41U and 41D so as to be movable in the three axial directions of X, Y and Z orthogonal to each other. Further, the inspection mechanisms 4U and 4D rotatably support the inspection jigs 3U and 3D and the imaging units 41U and 41D about the Z axis. The inspection jigs 3U, 3D and the imaging units 41U, 41D are made movable in the three axes of X, Y, and Z by the drive mechanisms 801U, 801D, and are rotatable about the Z axis. FIG. 1 shows an example in which the vertical direction is the Z axis.

As a result, the positions of the inspection jigs 3U and 3D are represented by the XY coordinates, and the inclination of the inspection jigs 3U and 3D is represented by the rotation angle θ about the Z axis.

The inspection mechanism 4U is located above the substrate 100 fixed to the substrate fixing device 6. The inspection mechanism 4D is located below the substrate 100 fixed to the substrate fixing device 6. Inspection jigs 3U and 3D for inspecting the wiring pattern formed on the substrate 100 are detachably arranged on the inspection mechanisms 4U and 4D. The inspection mechanisms 4U and 4D each include a connector (not shown) that is detachably connected to the inspection jigs 3U and 3D. Hereinafter, the inspection mechanisms 4U and 4D are collectively referred to as the inspection mechanism 4.

The inspection mechanisms 4U and 4D are not limited to those that move and rotate the inspection jigs 3U and 3D. The inspection mechanisms 4U and 4D may relatively move and rotate the inspection jigs 3U and 3D and the substrate 100 by, for example, moving and rotating the substrate 100. Alternatively, the inspection mechanism 4U, 4D may move and rotate both the inspection jig 3U, 3D and the substrate 100.

The image pickup units 41U and 41D are cameras configured by using, for example, a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor) image pickup device. The imaging unit 41U images the upper surface of the substrate 100, and the imaging unit 41D images the lower surface of the substrate 100. The images captured by the imaging units 41U and 41D are output to the control unit 80.

Since the image pickup unit 41U is attached to the inspection jig 3U, the image pickup unit 41U moves and rotates integrally with the inspection jig 3U. Since the image pickup unit 41D is attached to the inspection jig 3D, the image pickup unit 41D moves and rotates integrally with the inspection jig 3D. Therefore, based on the images taken by the imaging units 41U and 41D, the relative positional relationship between the inspection jigs 3U and 3D and the substrate 100, and the inclination of the inspection jigs 3U and 3D with respect to the substrate 100 (around the Z axis). Rotation angle) can be obtained.

From the positions and arrangements of the marks 103 and 103 in the images taken by the imaging units 41U and 41D, the relative positional relationship and inclination between the inspection jigs 3U and 3D and the substrate 100 can be easily calculated. There is.

The inspection jigs 3U and 3D each include a support member 31 and a base plate 321. Further, the inspection jig 3U includes n probes U1 to Un, and the inspection jig 3D includes m probes D1 to Dm. Hereinafter, the probes U1 to Un and D1 to Dm are collectively referred to as probes U and D. The base plate 321 is provided with an electrode (not shown) that contacts and conducts one end of each of the probes U and D. Each electrode is connected to the inspection unit 8 by a wire cable. As a result, the probes U and D are electrically connected to the inspection unit 8.

The probes U and D have a substantially rod-like shape as a whole. The support member 31 is formed with a plurality of through holes for supporting the probes U and D. Each through hole is arranged so as to correspond to the position of each inspection point 102. As a result, the support member 31 is configured such that one end of each of the probes U and D comes into contact with the inspection point 102 of the substrate 100. For example, the plurality of probes U and D are arranged so as to correspond to the intersection positions of the lattices. The directions corresponding to the crosspieces of the grid are oriented so as to coincide with the X-axis direction and the Y-axis direction orthogonal to each other.

The inspection jigs 3U and 3D are configured in the same manner as each other except that the probes U and D are arranged differently and the mounting directions to the inspection mechanisms 4U and 4D are upside down. Hereinafter, the inspection jigs 3U and 3D are collectively referred to as the inspection jig 3. The inspection jig 3 is configured to be replaceable according to the type of the substrate 100 to be inspected.

The inspection unit 8 includes, for example, a control unit 80, drive mechanisms 801U and 801D, a measurement unit 802, and a scanner unit 803. The drive mechanisms 801U and 801D are configured by using, for example, a motor, a gear mechanism, or the like. The drive mechanisms 801U and 801D move the inspection jigs 3U and 3D in the three axes of X, Y, and Z in response to the control signal from the control unit 80, and rotate them around the Z axis.

The scanner unit 803 is a switching circuit configured by using a switching element such as a semiconductor switch or a relay switch. The scanner unit 803 electrically connects the probe selected from the probes U1 to Un and D1 to Dm to the measuring unit 802 in response to the control signal from the control unit 80.

The measuring unit 802 includes, for example, a power supply circuit, a voltmeter, an ammeter, and the like. The measuring unit 802 supplies a current between the pair of probes selected by the scanner unit 803, measures the current flowing between the probes and the voltage generated between the probes, and transfers the measured value to the control unit 80. Output. The control unit 80 is capable of determining the presence or absence of continuity between probes and calculating the resistance value between probes based on the current and voltage. The measuring unit 802 supplies a current between the pair of probes selected by the scanner unit 803, and measures the voltage between the other pair of probes selected by the scanner unit 803 to measure the resistance by the four-terminal measurement method. It may be possible.

The control unit 80 includes, for example, a CPU (Central Processing Unit) that executes predetermined arithmetic processing, a RAM (Random Access Memory) that temporarily stores data, a non-volatile storage device that stores a predetermined control program, and the like. It is a so-called microcomputer configured to include peripheral circuits and the like. The storage device is also used as the storage unit 86. The storage unit 86 includes a plurality of combinations of patterns of conduction states of the probes U and D, and position correction in which each combination pattern is associated with deviation information indicating a deviation (shift amount) of the inspection jigs 3U and 3D. Information is stored in advance. The position correction information can be generated by, for example, a position correction information generation method described later.

The control unit 80 functions as an inspection position correction unit 89 and an inspection processing unit 85, for example, by executing a predetermined control program. The inspection position correction unit 89 includes a position determination unit 81, a continuity state detection unit 82, a deviation information acquisition unit 83, and a correction unit 84.

The process by the inspection position correction unit 89 is executed in a state where the substrate 100, which is normal or presumed to be normal, is attached to the substrate fixing device 6.

Based on the images captured by the imaging units 41U and 41D, the positioning unit 81 determines the relative positional relationship between the inspection jigs 3U and 3D and the substrate 100 based on the positions and arrangements of the marks 103 and 103 in the images. The inclination is calculated, and the XY coordinates and the rotation angle θ of the inspection jigs 3U and 3D for correctly contacting the probes U and D with each inspection point 102 of the substrate 100 are calculated as inspection positions.

Hereinafter, "inspection position" is used as a term including a position on a coordinate plane represented by XY coordinates and a rotation angle θ. For example, the description of moving to the "inspection position" means that the movement operation on the XY coordinates and the rotation operation of the rotation angle θ are performed.

The continuity state detection unit 82 relatively moves the inspection jigs 3U and 3D to the inspection position by the drive mechanisms 801U and 801D, and brings the probes U and D into contact with the surface of the substrate 100 at the inspection position to bring each probe. The conduction state of U and D is detected.

The deviation information acquisition unit 83 is one of a plurality of combination patterns included in the position correction information stored in the storage unit 86 based on the continuity state of each of the probes U and D detected by the continuity state detection unit 82. Is selected, and the deviation indicated by the deviation information associated with the position correction information for the selected combination pattern is acquired as the correction deviation amount.

The correction unit 84 corrects the inspection position based on the correction deviation amount acquired by the deviation information acquisition unit 83 so as to offset the correction deviation amount.

Further, the correction unit 84 causes the continuity state detection unit 82 to detect the continuity state of the probes U and D again based on the corrected inspection position, and when the probes U and D become conductive, the correction unit 84 Determines the amount of correction deviation at that time and stores it in the storage unit 86.

If there is a probe U or D that has no continuity among the conduction states of the probes U and D detected by the continuity state detection unit 82, the correction unit 84 shifts the continuity state to the information acquisition unit 83. It is output, and the deviation information acquisition unit 83 newly acquires the correction deviation amount. Further, the correction unit 84 corrects the inspection position again based on the new correction deviation amount, and repeats this process until the probes U and D become conductive based on the new corrected inspection position.

The inspection processing unit 85 calculates the inspection position by the same processing as the positioning unit 81 in a state where the substrate 100 to be inspected is attached to the substrate fixing device 6, and the correction processing unit 85 stores the inspection position in the storage unit 86. It is corrected based on the amount of deviation, and the inspection jigs 3U and 3D are moved by the drive mechanisms 801U and 801D to the corrected inspection position to bring the probes U and D into contact with the inspection point 102 of the substrate 100.

In this state, the inspection processing unit 85 measures the presence / absence of continuity between the inspection points 102 of the substrate 100 and the resistance value between the inspection points 102 of the substrate 100 via the probes U and D by the measurement unit 802 and the scanner unit 803, and the measurement result is obtained. Based on this, the inspection of the substrate 100 is performed.

Next, the position correction information generation system 2 using the position correction information generation method according to the embodiment of the present invention will be described. FIG. 3 is a block diagram showing an example of the configuration of the position correction information generation system 2 according to the first embodiment of the present invention. The position correction information generation system 2 shown in FIG. 3 includes a position correction information generation unit 21, a conductive exposed unit position data storage unit 201, a probe placement data storage unit 203, a conductive unit compatible information storage unit 204, and a position correction information storage unit. It is equipped with 205.

The conductive exposed portion position data storage unit 201, the probe arrangement data storage unit 203, the conductive unit compatible information storage unit 204, and the position correction information storage unit 205 are composed of, for example, a hard disk device or a storage device such as an SSD (Solid State Drive). It is made readable and writable by the position correction information generation unit 21.

The position correction information generation unit 21 includes, for example, a CPU that executes a predetermined arithmetic process, a RAM that temporarily stores data, a non-volatile storage device that stores a predetermined control program, and peripheral circuits thereof, and illustrations thereof. It is equipped with a keyboard and display device. By executing a predetermined control program, the position correction information generation unit 21 serves as a conductive unit image generation unit 22, a probe arrangement image generation unit 23, a conductive unit corresponding information generation unit 24, and a position correction information generation processing unit 25. Function. The simulation processing unit 26 is composed of the information generation unit 24 with a conductive portion and the position correction information generation processing unit 25.

The position correction information generation system 2 can be configured by using, for example, a personal computer, a server device, or the like. The position correction information generation system 2 is not limited to an example composed of one computer or the like, and may be composed of a plurality of computers, a storage device, or the like.

The conductive exposed portion position data storage unit 201 stores in advance the conductive exposed portion position data indicating the position and size (range) of each conductive exposed portion 105 in which the inspection point 102 is set on the substrate 100. For example, the conductive exposed portion position data can be generated by extracting the position information and the size of each conductive exposed portion 105 from the so-called Gerber data used for manufacturing the substrate 100. The user may store the conductive exposed portion position data thus obtained in the conductive exposed portion position data storage unit 201 by the position correction information generation unit 21 by operating a keyboard (not shown) or the like. As a result, the conductive exposed portion position data is prepared (step (2a)).

The signal line connecting each terminal of the board and the connection between the terminals are called a net, and generally, when designing the board of the board 100, a net list showing the connection information between the terminals by such a net is used. Used. In the net list, a net number for identifying each net is assigned to each net. The net corresponds to the conductive parts connected in a mass. Therefore, each conductive portion to be inspected formed on the substrate 100 can be specified by this net number. In the conductive exposed portion position data, for example, the conductive portion is represented by a net number, and the position information, size, shape, etc. of the conductive exposed portion 105 of the conductive portion are associated with the net number.

When the conductive exposed portion 105 formed on the upper surface of the substrate 100 and the conductive exposed portion 105 formed on the lower surface of the substrate 100 are conductively connected by an interlayer connection means such as a through hole or a via, the both surfaces of the substrate 100 are connected. Since the formed both conductive exposed portions 105 are one conductive portion as a whole, one net number is assigned to the entire conductive portion including both conductive exposed portions 105.

The probe placement data storage unit 203 stores in advance probe placement data indicating the placement and thickness of each of the probes U and D (the size of the contact surface with respect to the inspection point of the probe tip). The arrangement of the probes U and D indicated by the probe arrangement data corresponds to the arrangement of the inspection points 102 indicated by the conductive exposed portion position data.

The user arranges the probes based on the arrangement of the inspection points 102 indicated by the conductive exposed portion position data and the positions of the probes U and D (positions of through holes) indicated by the manufacturing data of the inspection jigs 3U and 3D. Data may be generated, and the probe arrangement data thus obtained may be stored in the probe arrangement data storage unit 203 by operating the position correction information generation unit 21. As a result, probe placement data is prepared (step (2b)).

The position correction information generation unit 21 uses each position of the inspection jigs 3U and 3D in which the probes U and D come into contact with each inspection point 102, that is, the correct position as a reference position, and conducts the conductive exposed portion position data and the probe. Based on the arrangement data, the conduction states of the probes U and D when the inspection jigs 3U and 3D are positioned at a plurality of positions deviated from each reference position along the surface direction of the substrate 100 are acquired. Position correction information for associating the deviation with the conduction state of the probes U and D is generated (step (2c)).

4 to 6 are explanatory views showing an example of information showing a conduction state for each deviation included in the position correction information. ΔX1 and ΔY1 indicate the X coordinate and the Y coordinate of the inspection jig 3U, and Δθ1 indicates the rotation angle θ of the inspection jig 3U around the Z axis. ΔX2 and ΔY2 indicate the X coordinate and the Y coordinate of the inspection jig 3D, and Δθ2 indicates the rotation angle θ of the inspection jig 3D around the Z axis.

The "X coordinate" and "Y coordinate" columns shown in FIGS. 4 to 6 indicate the coordinate positions of the probes U and D when the inspection jigs 3U and 3D are positioned at the reference positions. The "radius" column indicates the thickness (radius of the contact range) of each probe U, D. The "X coordinate", "Y coordinate", and "radius" correspond to the probe placement data. The X coordinate, Y coordinate, and radius are represented by, for example, mm, and ΔX1, ΔY1, ΔX2, and ΔY2 indicate, for example, the distance in which one direction is positive and the other direction is negative, centered on 0, and Δθ1 and Δθ2. Is represented by, for example, an angle in which clockwise is positive and counterclockwise is negative.

In the "net number" column of each figure, when the inspection jigs 3U and 3D are positioned at the "position of the inspection jig" and the probes are brought into contact with the substrate, the conductive exposed portion 105 that the probes U and D come into contact with. Indicates the net number of. If there are a plurality of probes that come into contact with the conductive exposed portion 105 having the same net number, those probes will conduct with each other through the conductive portion having the same net number. The "X coordinate", "Y coordinate", "radius", and "net number" do not necessarily have to be included in the position correction information.

FIG. 4 shows the conduction state when the inspection jigs 3U and 3D are located at the reference positions, that is, when the deviation is 0. Therefore, in FIG. 4, ΔX1, ΔY1, Δθ1, ΔX2, ΔY2, and Δθ2 are all 0, that is, the deviation is 0. “Conduction” in FIG. 4 refers to whether or not each probe U, D conducts with another probe when the inspection jigs 3U, 3D are positioned at reference positions and the probes U, D are brought into contact with the substrate 100. Is shown. The case of conducting is represented by 1 and the case of not conducting is represented by 0.

When the inspection jigs 3U and 3D are positioned at the reference positions, the probes U and D are in correct contact with the inspection points 102. Therefore, in the example shown in FIG. 4, continuity is "1" for all the probes U and D. "Is associated with it.

5 and 6 show an example of position correction information in which the position of the inspection jig is deviated from the reference position. In the example shown in FIG. 5, the position of the inspection jig 3U is ΔX1 = 0.5, ΔY1 = 0.7, Δθ1 = −0.001, and the position of the inspection jig 3D is ΔX2 = 0.2, ΔY2 =. 1.2, Δθ2 = 0.002. In this case, since ΔX1, ΔY1, Δθ1, ΔX2, ΔY2, and Δθ2 are all 0 at the reference position in FIG. 4, ΔX1, ΔY1, Δθ1, ΔX2, ΔY2, and Δθ2 in FIG. 5 deviate from the reference position. Represents.

When the positions of the inspection jigs 3U and 3D deviate from the reference position, the probes do not come into contact with the conductive exposed portion 105, so that some probes U and D do not conduct. Therefore, in FIG. 5, there is a probe whose continuity is 0. The combination pattern "0011 ... 00011 ... 0" of the conduction state corresponding to each probe is the deviation of the inspection jigs 3U and 3D, ΔX1 = 0.5, ΔY1 = 0.7, Δθ1 = −. It is associated with 0.001, ΔX2 = 0.2, ΔY2 = 1.2, and Δθ2 = 0.002.

ΔX1, ΔY1, Δθ1, ΔX2, ΔY2, Δθ2 correspond to an example of deviation information. The deviation information is not necessarily limited to the deviation of the inspection jig from the reference position, and may represent, for example, the amount of movement for canceling the deviation, and the position correction information is, for example, the above. Information obtained by reversing the polarities of ΔX1, ΔY1, Δθ1, ΔX2, ΔY2, and Δθ2 may be used as deviation information and associated with a combination pattern of conduction states.

FIG. 6 is an explanatory diagram showing an example of position correction information in which the position (deviation) of the inspection jig is different from the example shown in FIG. In the example shown in FIG. 6, the combination pattern "1010 ... 01010 ... 0" in the conduction state is a deviation of the inspection jigs 3U and 3D, ΔX1 = 0.7, ΔY1 = 0.9, Δθ1 = −. It is associated with 0.003, ΔX2 = 0.1, ΔY2 = 1.0, and Δθ2 = 0.001. Similar to FIGS. 5 and 6, a large number of position correction information having different deviations of the inspection jigs 3U and 3D are generated by the position correction information generation unit 21 and stored in the position correction information storage unit 205.

The position correction information does not necessarily include data when the inspection jigs 3U and 3D are located at the reference positions, that is, when the deviation of the inspection jigs 3U and 3D is 0.

Hereinafter, the configuration of the position correction information generation unit 21 will be described in detail. FIG. 7 is an explanatory diagram showing a state in which the probe arrangement image G2 based on the probe arrangement data is superimposed on the conductive portion arrangement image G1 based on the conductive exposed portion position data so as to be located at a reference position. 8 to 14 are explanatory views showing a state in which the probe arrangement image G2 is superimposed on the conductive portion arrangement image G1 so as to be positioned corresponding to a plurality of relatively displaced positions.

7 to 14 show an example in which probes U1 to U8 of the inspection jig 3U are brought into contact with the upper surface of the substrate 100. The probe U in the conductive state is represented by a black circle image, and the probe U in the non-conducting state is represented by a white circle image. Further, in FIGS. 7 to 14, it is assumed that the inspection jig 3D is located at the reference position on the lower surface of the substrate 100 and all the probes D are in correct contact with the inspection points 102, and the continuity state of the probe U (black circle, black circle, White circle) is described.

The conductive portion image generation unit 22 arranges each conductive exposed portion 105 by representing each conductive exposed portion 105 with a conductive portion image M based on the conductive exposed portion position data stored in the conductive exposed portion position data storage unit 201. Is generated as an image of the conductive portion arrangement image G1 (conductive portion arrangement image data) (step (2c1)). The conductive exposed portion position data may be any data indicating the position of each conductive exposed portion 105, and it is not always necessary to convert the conductive exposed portion position data into image data, and the step (2c1) does not have to be executed. ..

The probe placement image generation unit 23 images the placement of the probes U and D by representing the tips of the probes U and D with the probe image P based on the probe placement data stored in the probe placement data storage unit 203. The converted probe arrangement image G2 (probe arrangement image data) is generated (step (2c2)). The probe placement data may indicate a position (contact range) where the tips of the probes U and D come into contact with the substrate 100, and the probe placement data does not necessarily have to be converted into image data. It is not necessary to execute (2c2).

Hereinafter, for the sake of simplicity, the probe images P of the probes U and D may be simply referred to as probes U and D.

The information generation unit 24 with the conductive portion corresponds to the probe arrangement image G2 so as to correspond to a plurality of displaced positions with respect to the conductive portion arrangement image G1, and with each conductive portion image M of the conductive portion arrangement image G1. For the probes U and D corresponding to the probe images P in which at least a part overlaps, the conductive part correspondence information for associating the conductive part corresponding to the conductive part image M in which at least a part overlaps is generated (step (2c3)). .. As a result, instead of actually contacting the probes U and D with the substrate 100 to detect the conduction state of each probe, the information generation unit 24 with the conductive portion generates the information with the conductive portion by simulation using an image. can do.

The position correction information generation processing unit 25 generates the above-mentioned position correction information by acquiring the continuity states of the probes U and D corresponding to the plurality of displaced positions based on the information with the conductive portion (step). (2c4)).

Next, a position correction information generation method executed by the position correction information generation system 2 configured as described above will be described. 15 and 16 are flowcharts showing an example of the position correction information generation method according to the first embodiment of the present invention. In the following flowchart, the same process is assigned the same step number and the description thereof will be omitted.

For example, the user stores the conductive exposed portion position data generated as described above in the conductive exposed portion position data storage unit 201 (step S1: step (2a)). Next, for example, the user stores the probe placement data obtained as described above in the probe placement data storage unit 203 (step S2: step (2b)).

Next, the conductive portion image generation portion 22 displays the conductive portion arrangement image G1 (U) in which each conductive exposed portion 105 on the upper surface of the substrate 100 is represented by the conductive portion image M, and each conductive exposed portion 105 on the lower surface of the substrate 100. The conductive portion arrangement image G1 (D) represented by the conductive portion image M is generated (step S3: step (2c1)).

Next, the probe placement image generation unit 23 has a probe placement image G2 (U) in which the tip of each probe U is represented by a probe image P and a probe placement image G2 in which the tip of each probe D is represented by a probe image P. (D) and each are generated (step S4: step (2c2)).

Next, the simulation processing unit 26 determines what the combination pattern of the conduction states obtained by the probes U and D will be when the positions of the inspection jigs 3U and 3D deviate from the reference position of the substrate 100. Instead of actually detecting using the substrate inspection device 1, it is obtained by a simulation using the conductive portion arrangement images G1 (U) and G1 (D) and the probe arrangement images G2 (U) and G2 (D) (step). (2c)).

Specifically, first, the information generation unit 24 with a conductive portion sets ΔX1, ΔY1, Δθ1, ΔX2, ΔY2, Δθ2, which are deviations of the inspection jigs 3U and 3D with respect to the reference position of the substrate 100 (step S5). : Step (2c3)). The information generation unit 24 with a conductive portion sequentially changes ΔX1, ΔY1, Δθ1, ΔX2, ΔY2, Δθ2 in preset minimum units within a preset setting range, thereby sequentially performing ΔX1, ΔY1, A combination pattern of Δθ1, ΔX2, ΔY2, and Δθ2 is set.

For ΔX1, ΔY1, ΔX2, and ΔY2 in the X and Y directions, for example, the minimum pattern width defined by the design rules for manufacturing the substrate 100 can be used as the minimum unit of the deviation amount. Regarding the rotation angles Δθ1 and Δθ2, for example, the minimum rotation angle at which the drive mechanisms 801U and 801D can rotate the inspection jigs 3U and 3D can be used as the minimum unit of the deviation amount.

The setting range that causes the deviation includes the resolution of the imaging units 41U and 41D, the amount of positional deviation due to the optical system aberration of the imaging units 41U and 41D, and the machine maximum error of the drive mechanisms 801U and 801D in the X and Y directions. The total of can be used. As the setting range of the rotation angle, the total of the machine maximum error of the drive mechanisms 801U and 801D and the mounting error of the imaging units 41U and 41D can be used.

For example, assuming that the minimum unit in the X and Y directions is 0.1 μm and the setting range is 10.0 μm, the range of 20.0 μm in the + direction and the − direction is divided by 0.1 μm, and ΔX1, ΔY1, ΔX2. 200 deviations are set for each of, and ΔY2. For example, if the minimum unit of the rotation angle is 0.001 degrees and the setting range is 0.01 degrees, the range of 0.02 degrees in the + direction (clockwise) and the negative direction (counterclockwise) is incremented by 0.001 degrees. Then, 20 kinds of deviations are set for each of Δθ1 and Δθ2.

Then, depending on the combination of deviations, 200 × 200 × 200 × 200 × 20 × 20 = 64 × 10 ¹⁰ types of deviation positions are set. In the step (2c), the position correction information may be generated by actually operating the substrate inspection device 1 while changing the deviation position this number of times and detecting the continuity state of the probes U and D.

However, when the substrate inspection device 1 is actually operated to generate position correction information, the substrate 100 and the probes U and D are separated from each other 64 × 10 ¹⁰ times, which requires a large amount of time. Not only that, the substrate 100 and the probes U and D may be consumed.

On the other hand, according to steps S3 to S14 (steps (2c1) to (2c4)) by the simulation processing unit 26, the position correction information is generated by the simulation using the image, so that the generation time can be shortened. Further, since it is not necessary to actually operate the substrate inspection device 1, the substrate 100 and the probes U and D are not consumed.

In step S5, the information generation unit 24 with a conductive portion sets one of the plurality of such deviations as ΔX1, ΔY1, Δθ1, ΔX2, ΔY2, Δθ2, and this deviation is used in steps S6 to S13. ..

Next, the information generation unit 24 with the conductive portion superimposes the probe arrangement image G2 (U) on the conductive portion arrangement image G1 (U) at positions shifted by ΔX1, ΔY1, Δθ1 (step S6: step). (2c3)). When the probe arrangement image G2 is superimposed on the conductive portion arrangement image G1 at the reference position without shifting, all the probes U and the conductive portion image M overlap as shown in FIG. 7. On the other hand, when the conductive portion arrangement image G1 and the probe arrangement image G2 are shifted and superposed, for example, as shown in FIGS. 8 to 14, a probe U that overlaps with the conductive portion image M and a probe U that does not overlap with the conductive portion image M And occur.

In FIGS. 7 to 14, it is assumed that the inspection jig 3D is located at the reference position on the lower surface of the substrate 100 and all the probes D are in correct contact with the inspection point 102. The overlapping probe U coincides with the conducting probe U (black circle probe). Actually, the inspection jig 3D may be displaced even on the lower surface side of the substrate 100, and in that case, even the probe U overlapping the conductive portion image M may be non-conducting.

Next, the information generation unit 24 with a conductive portion corresponds to the conductive portion image M in which at least a part of the probe U overlaps with the conductive portion image M of the conductive portion arrangement image G1 (U). Generate the conductive part correspondence information (U) to which the net number to be associated is associated (step S7: step (2c3)). FIG. 17 is an explanatory diagram showing an example of the conductive portion correspondence information (U) obtained in this way.

Since the net number of each conductive portion is shown in the conductive exposed portion position data, the net number corresponding to the conductive portion image M can be obtained based on the conductive exposed portion position data. Based on the conductive exposed portion position data, the conductive portion corresponding information generation unit 24 can associate the probe U with a net number corresponding to the conductive portion image M in which at least a part thereof overlaps. As a result, the conductive portion corresponding to the conductive portion image M in which at least a part of the conductive portion image M overlaps with the conductive portion image M of the conductive portion arrangement image G1 (U) can be associated with the probe U.

Next, the information generation unit 24 with the conductive portion superimposes the probe arrangement image G2 (D) on the conductive portion arrangement image G1 (D) at a position shifted by ΔX2, ΔY2, Δθ2, as in step S6. (Step S11: Step (2c3)).

Next, as in step S7, the information generation unit 24 with the conductive portion corresponds to the conductivity in which at least a part of the probe D overlaps with the conductive portion image M of the conductive portion arrangement image G1 (D). The conductive part correspondence information (D) for associating the net number corresponding to the part image M is generated (step S12: step (2c3)).

FIG. 18 is an explanatory diagram showing an example of conductive portion-corresponding information (U, D) in which the conductive portion-corresponding information (D) obtained in this way and the conductive portion-corresponding information (U) are combined. .. In FIGS. 17 and 18, the net numbers of the probes U and D that do not overlap with any of the conductive part images M are set to “0”.

Next, the position correction information generation processing unit 25 acquires the continuity state of each probe U, D corresponding to ΔX1, ΔY1, Δθ1, ΔX2, ΔY2, Δθ2 based on the information (U, D) corresponding to the conductive portion. Position correction information is generated by doing so (step S13: step (2c4)). Then, the position correction information generation processing unit 25 stores the position correction information generated in this way in the position correction information storage unit 205.

For example, according to the conductive portion correspondence information (U, D) shown in FIG. 18, both the probe U3 and the probe D3 come into contact with the conductive exposed portion 105 of the conductive portion having the net number “3”. Both the probe U4 and the probe D4 come into contact with the conductive exposed portion 105 of the conductive portion having the net number “2”. Therefore, the probes U3, D3, U4, and D4 are conducting with other probes.

On the other hand, the probes U1 and D2 have no other probe associated with the same net number. The net numbers of the probes U2, Un, D1 and Dm are "0". Therefore, the probes U1, U2, Un, D1, D2, Dm are not conducting with other probes. As a result, the "continuity" column of the position correction information shown in FIG. 5 is obtained.

Next, the position correction information generation processing unit 25 checks whether or not the position correction information for all the deviation positions within the above-mentioned setting range has been generated (step S14). If it has been generated (YES in step S14), the position correction information is completed, so the process ends. On the other hand, if there is any position within the set range that has not yet been generated (NO in step S14), the process proceeds to step S5, and new ΔX1, ΔY1, Δθ1, ΔX2, ΔY2, Δθ2 are set in step S5 again. The processing after step S6 is repeated.

As described above, by the processing of steps S1 to S14, a plurality of combinations patterns of the conduction states of the probes U and D are included, and the position correction in which each combination pattern and the deviation (shift amount) of the inspection jigs 3U and 3D are associated with each other. Information can be generated.

The position correction information may be acquired by actually operating the substrate inspection device 1. However, the position correction information generation method according to steps S1 to S14 can be easily executed by computer simulation. By executing the position correction information generation method by computer simulation, the position correction information can be obtained in a short time without consuming the board 100 and the probes U and D as in the case where the board inspection device 1 is actually operated. It becomes possible to generate.

The position correction information thus obtained may be stored in the storage unit 86 by transmitting it to the substrate inspection device 1 using, for example, a communication circuit (not shown), or may be stored in a storage medium (not shown), for example. The storage unit 86 may store the position correction information by reading the position correction information from the storage medium by the substrate inspection device 1.

As shown in FIGS. 8 to 14, if the deviation of the inspection jig 3 (probe arrangement image G2) with respect to the substrate 100 (conductive portion arrangement image G1) is different, the continuity patterns of the probes U and D are also different. Therefore, when the substrate inspection device 1 inspects the substrate 100, the continuity patterns of the probes U and D are detected in advance using the substrate 100 which is presumed to be a non-defective product or a non-defective product, and the detection is performed with reference to the position correction information. By acquiring the deviation associated with the continuity pattern, the deviation of the inspection jigs 3U and 3D in the actual substrate inspection device 1 can be obtained. If the actual deviation of the inspection jigs 3U and 3D is obtained, the inspection jigs 3U and 3D may be moved so as to cancel the deviation.

As a result, unlike the background technology, the user does not have to manually fine-tune the position and inclination of the probe until the correct continuity result is obtained by actually performing the continuity inspection of the board, and automatically. Since the positioning position of the probe can be corrected, the work man-hours of the user can be reduced, and the positioning accuracy of the probe can be easily improved.

Next, the operation of the substrate inspection device 1 configured as described above will be described. FIG. 19 is a flowchart showing an example of the operation of the substrate inspection device 1 shown in FIG. First, for example, the position correction information generated by the position correction information generation system 2 is stored in the storage unit 86, and the position correction information is prepared (step S101: step (1a)). The position correction information is not necessarily limited to the one generated by the position correction information generation system 2 (position correction information generation method), and may be generated by another method.

Next, the positioning unit 81 causes the imaging units 41U and 41D to image the upper surface and the lower surface of the substrate 100 with the inspection jigs 3U and 3D separated from the substrate 100 (step S102). Next, the positioning unit 81 calculates the inspection position of the inspection jigs 3U and 3D based on the captured images of the imaging units 41U and 41D (step S103).

Next, the continuity state detection unit 82 moves the inspection jigs 3U and 3D to the inspection positions by the drive mechanisms 801U and 801D, and brings the probes U and D into contact with the substrate 100 at the inspection positions to bring the probes U and D into contact with the substrate 100. (Step S104: Step (1b)).

Specifically, the continuity state detection unit 82 sequentially selects two of the plurality of probes U and D by the scanner unit 803, and supplies a current between the two selected probes by the measurement unit 802. The current flowing between the probes is detected. Then, if the detected current value is equal to or higher than the preset threshold value Is, the continuity state detection unit 82 sets the continuity state of the two probes to "conduction: 1", and the detected current value is the threshold value Is. If the condition is not satisfied, the conduction state of the two probes is set to "non-conduction: 0".

As a result, when at least one of the probes U and D, which are sequentially selected and whose conduction state is to be detected, and at least one of the other probes are conducting, the probes to be detected in the conduction state and the conduction state are conducted. A conduction state is detected for each probe U, D, which is non-conducting when and all other probes do not conduct.

Next, the deviation information acquisition unit 83 is among a plurality of combination patterns included in the position correction information stored in the storage unit 86 based on the continuity state of each of the probes U and D detected by the continuity state detection unit 82. (Step S105: Step (1c)).

Specifically, the deviation information acquisition unit 83 selects one whose combination pattern matches the conduction state of each of the probes U and D detected by the continuity state detection unit 82. For example, when the pattern of the conduction state (hereinafter referred to as the detection pattern) detected by the continuity state detection unit 82 is "1010 ... 01010 ... 0", the deviation information acquisition unit 83 is in the continuity state. The combination pattern "1010 ... 01010 ... 0" of FIG. 6 having the same combination pattern is selected.

By the way, the position correction information may not include the combination pattern of the conduction state that matches the detection pattern. Therefore, the shift information acquisition unit 83 may select the one having the largest number of probes whose conduction state matches the detection pattern among the plurality of combination patterns included in the position correction information.

For example, when the continuity state pattern detected by the continuity state detection unit 82 is "10110101010", the position correction information includes the continuity pattern A "1110101010" and the continuity pattern B "1111101010". In this case, the continuity pattern A has nine probes whose conduction state matches the detection pattern, and the continuity pattern B has eight probes whose conduction state matches the detection pattern. Therefore, the deviation information acquisition unit 83 is conducted. Select pattern A. In this way, even when the position correction information does not include the combination pattern of the conduction state that matches the detection pattern, the combination pattern of the conduction state can be selected from the position correction information.

Next, the deviation information acquisition unit 83 acquires the deviation information associated with the combination pattern selected in step S105 by the position correction information as the correction deviation amount (step S106: step (1c)). For example, when the combination pattern shown in FIG. 6 is selected, ΔX1 = 0.7, ΔY1 = 0.9, Δθ1 = −0, which are the positions (deviations) of the inspection jig, based on the position correction information shown in FIG. .003, ΔX2 = 0.1, ΔY2 = 1.0, Δθ2 = 0.001 are acquired as the correction deviation amount.

The correction deviation amount may be a value for canceling the deviation of the inspection jig, that is, a value obtained by reversing the polarity of the positional deviation of the inspection jig.

Next, the correction unit 84 corrects the inspection position so as to offset the correction deviation amount acquired by the deviation information acquisition unit 83 (step S107: step (1d)). If the correction deviation amount is a value for canceling the deviation of the inspection jig, the correction unit 84 may correct the inspection position by using the correction deviation amount as it is.

Next, the correction unit 84 uses the continuity state detection unit 82 to bring the probes U and D into contact with the substrate 100 at the corrected inspection position by the same process as in step S104, and detects the continuity state of the probes U and D. (Step S108).

Next, the correction unit 84 checks the continuity state of each of the probes U and D detected by the continuity state detection unit 82 (step S109), and if all the probes U and D are conductive (YES in step S109), Since all the probes U and D have come into contact with each inspection point 102 accurately, the amount of correction deviation at this time is determined and stored in the storage unit 86 (step S110).

On the other hand, when there are probes U and D that have become non-conducting (NO in step S109), there is a probe that does not accurately contact each inspection point 102, so the correction unit 84 determines the conducting state. It is output to the deviation information acquisition unit 83, and steps S105 to S109 are repeated based on the new probe U and D continuity states detected in step S108.

As described above, each probe U, accurately at each inspection position of the inspection jigs 3U and 3D obtained based on the captured images of the imaging units 41U and 41D by the processing of steps S101 to S108, and each inspection point 102 on both sides of the substrate 100, The deviation from the correct inspection position where D can be brought into contact can be obtained as the correction deviation amount. Therefore, when the inspection is executed by the substrate inspection apparatus 1, the probes U and D can be brought into contact with the inspection points 102 with high accuracy by correcting the inspection position so as to cancel the correction deviation amount. It is easy to improve the positioning accuracy of.

Further, by the processing of steps S107 to S109, the substrate inspection device 1 is actually operated, and after confirming the correction deviation amount capable of positioning the inspection jigs 3U and 3D at the correct inspection position, the correction deviation amount is determined. Since it can be determined, it is possible to further improve the positioning accuracy of the probe.

It is not always necessary to execute steps S107 to S109, and the correction deviation amount obtained in step S106 may be stored in the storage unit 86 as a definite correction deviation amount in step S110.

Next, the operation when the substrate 100 is inspected by the substrate inspection apparatus 1 shown in FIG. 1 will be described. FIG. 20 is a flowchart showing an example of the operation of the substrate inspection by the substrate inspection apparatus 1 shown in FIG. First, the inspection processing unit 85 causes the imaging units 41U and 41D to image the upper surface and the lower surface of the substrate 100 in a state where the inspection jigs 3U and 3D are separated from the substrate 100 attached to the substrate fixing device 6 (step S201). ).

Next, the inspection processing unit 85 calculates the inspection position of the inspection jigs 3U and 3D by the same processing as the positioning unit 81 based on the captured images of the imaging units 41U and 41D (step S202).

Next, the inspection processing unit 85 corrects the inspection positions of the inspection jigs 3U and 3D so as to cancel the correction deviation amount stored in the storage unit 86 (step S203).

Next, the inspection processing unit 85 moves the inspection jigs 3U and 3D to the corrected inspection position by the drive mechanisms 801U and 801D to bring the probes U and D into contact with the inspection point 102 of the substrate 100 (step S204). ..

In this state, the inspection processing unit 85 measures the presence / absence of continuity between the inspection points 102 of the substrate 100 and the resistance value between the inspection points 102 of the substrate 100 via the probes U and D by the measurement unit 802 and the scanner unit 803, and the measurement result is obtained. Based on this, the inspection of the substrate 100 is executed (step S205).

According to steps S201 to S205, positioning of the imaging units 41U and 41D based on the captured image is performed by correcting the inspection positions of the inspection jigs 3U and 3D so as to cancel the correction deviation amount stored in the storage unit 86 in advance. Since the misalignment caused by the above can be automatically corrected, it becomes easy to improve the positioning accuracy of the probe.

It should be noted that the conduction state of each of the probes U and D is conducted when at least one of the probe to be detected in the continuity state and the other probes are conducted, and the probe to be detected in the continuity state and the other probes. Although an example is shown by the information showing non-conduction when all the probes of the above are not conducting, the conduction state is not limited to this example.

For example, the conduction state may be indicated by the information of associating another probe conducting with the probe to the probe to be detected of the continuity state among the plurality of probes U and D.

For example, in the conductive part correspondence information (U, D) shown in FIG. 18, by using the "net number" as the information indicating the conduction state, the conductive part correspondence information (U, D) is used as it is in step S13. It may be configured as position correction information.

In the position correction information shown in FIG. 5, according to the "Conduction" column, it is known that the probes U3, U4, D3, and D4 are conducting, but it is not known which probe these probes are conducting. On the other hand, when the "net number" shown in FIG. 18 (FIG. 5) is used as information indicating the continuity state, it indicates that the probes having the common "net number" are conducting. Therefore, from the position correction information shown in FIG. 18, it can be seen that the probe U3 and the probe D3 are conducting, and the probe U4 and the probe D4 are conducting.

That is, the net number corresponds to an example of information for associating another probe that conducts with the probe to the probe for which the conduction state is to be detected among the plurality of probes U and D.

According to the position correction information shown in FIG. 18, when the four probes U3, U4, D3, and D4 are conducting each other, the probe U3 and the probe D3 are conducting, and the probe U4 and the probe D4 are conducting each other. However, since it is possible to distinguish the case where the probes U3, D3 and the probes U4, D4 are non-conducting, it is better to use the position correction information shown in FIG. It is possible to position the probe more accurately than when the "conduction" column is used. In this case, the combination of the conduction relationship in which the probe U3 and the probe D3 are conducting and the probe U4 and the probe D4 are conducting corresponds to an example of the above-mentioned combination pattern.

Further, in steps S104 and S108, the conduction state is detected including the conduction relationship of which probe and which probe are conducting, and in step S105, which probe and which probe are conducting are included. Based on the combination pattern of the probes, the one with the same combination pattern or the one with the largest number of probes with the same conduction state including the conduction destination may be selected.

21A and 21B are explanatory views showing an example of a case where the probe U or D straddles and contacts a plurality of conductive exposed portions 105 formed on the substrate 100. As shown in FIGS. 21A and 21B, the probes U and D may come into contact with the plurality of conductively exposed portions 105 in a straddling manner. Therefore, as shown in FIG. 22, the conduction state in the position correction information may be indicated by a plurality of net numbers corresponding to the plurality of conductive exposed portions 105 with which the respective probes come into contact.

According to the position correction information shown in FIG. 22, the probes U1 and D3 are associated with the net number "1", the probes U4 and D4 are associated with the net number "2", and the net number "3" is associated with the net number "2". The probes U3 and D3 are associated with the net number "5", the probes U4 and Un are associated with the net number "5", and the probes D1 and Dm are associated with the net number "16".

Therefore, the position correction information shown in FIG. 22 indicates that the probes U1 and D3 are conductive, the probes U4 and D4 are conductive, the probes U3 and D3 are conductive, the probes U4 and Un are conductive, and the probes D1 and Dm are conductive. There is. Since the probe D3 is conductive with the probes U1 and U3, the probes U1 and U3 are electrically connected via the probe D3, and eventually the probes U1, U3 and D3 are electrically conductive with each other. Since the probe U4 is conducting with the probes D4 and Un, the probes D4 and Un are electrically connected via the probe U4, and eventually the probes U4, Un and D4 are electrically connected to each other.

That is, the net number shown in FIG. 22 corresponds to an example of information for associating another probe conducting with the probe to the probe to be detected in the conduction state among the plurality of probes U and D.

In this way, by associating the plurality of conductive exposed portions 105 with which the respective probes come into contact, the conductive state is represented including the case where the probes U or D straddle and contact the plurality of conductive exposed portions 105. As a result, the position of the probe can be positioned more accurately when the position correction information shown in FIG. 22 is used than when the position correction information shown in FIG. 18 is used. In this case, the combination of the conduction relationships in which the probes U1, U3, D3 are electrically connected to each other, the probes U4, Un, and D4 are electrically connected to each other, and the probes D1 and Dm are electrically connected to each other corresponds to an example of the above-mentioned combination pattern.

The position correction information does not necessarily have to include the conduction state of all the probes U and D attached to the inspection jigs 3U and 3D. The position correction information may include only the conduction state with respect to some probes selected (thinned out) from all the probes U and D attached to the inspection jigs 3U and 3D. Further, although an example in which the rotation angle θ is corrected is shown, the configuration may be such that the rotation angle θ is not corrected.

Further, although the substrate inspection device 1 is provided with the inspection jigs 3U and 3D, the substrate inspection device 1 may be provided with only one of the inspection jigs 3U and 3D. Further, the substrate inspection device 1 has shown an example in which the inspection jigs 3U and 3D are moved and positioned with respect to the fixed substrate 100, but the inspection jigs 3U and 3D are relative to the substrate 100. As long as it can be moved, the substrate 100 or both the substrate 100 and the inspection jigs 3U and 3D may be moved and positioned.

(Second Embodiment)

Next, a substrate inspection device 1a using the inspection position correction method according to the second embodiment of the present invention and a position correction information generation system 2a using the position correction information generation method according to the second embodiment of the present invention will be described. FIG. 23 is a block diagram showing an example of the configuration of the substrate inspection device 1a using the inspection position correction method according to the second embodiment of the present invention. FIG. 24 is a block diagram showing an example of an electrical configuration of the position correction information generation system 2a using the position correction information generation method according to the second embodiment of the present invention.

The substrate inspection device 1 shown in FIG. 2 and the substrate inspection device 1a shown in FIG. 23 differ in the following points. That is, the substrate inspection device 1a shown in FIG. 23 further includes a temperature detection unit 804. The position correction information stored in the storage unit 86 is associated with a plurality of temperatures and is preset. Further, in the substrate inspection device 1a shown in FIG. 23, in the control unit 80a included in the inspection unit 8a, the operations of the deviation information acquisition unit 83a and the inspection processing unit 85a are different from those of the deviation information acquisition unit 83 and the inspection processing unit 85.

The position correction information generation system 2 shown in FIG. 3 and the position correction information generation system 2a shown in FIG. 24 differ in the following points. That is, in the position correction information generation system 2a shown in FIG. 24, the operations of the conductive unit image generation unit 22a, the probe placement image generation unit 23a, and the position correction information generation processing unit 25a in the position correction information generation unit 21a are the conductive unit image generation. It is different from the unit 22, the probe arrangement image generation unit 23, and the position correction information generation processing unit 25.

Since the other configurations are the same as those of the substrate inspection device 1 and the position correction information generation system 2 shown in FIGS. 2 and 3, the description thereof will be omitted, and the characteristic points of the present embodiment will be described below.

The temperature detection unit 804 is a so-called temperature sensor, and outputs the detected detection temperature Td to the deviation information acquisition unit 83a. The temperature detection unit 804 is arranged near, for example, the inspection jig 3U, 3D or the substrate 100, and detects the ambient temperature of the inspection jig 3U, 3D and the substrate 100. Since the temperatures of the inspection jigs 3U, 3D and the substrate 100 are almost the same as the ambient temperature, the temperature detection unit 804 indirectly detects the temperatures of the inspection jigs 3U, 3D and the substrate 100 as the detection temperature Td. ing.

The temperature detection unit 804 may be incorporated into the inspection jigs 3U and 3D to directly detect the temperature of the inspection jigs 3U and 3D. For example, the temperature detection unit 804 may be incorporated into the substrate fixing device 6 to directly detect the temperature of the substrate 100. It may be detected. The temperature detection unit 804 may directly or indirectly detect the temperature of the inspection jig 3U, 3D or the substrate 100.

The deviation information acquisition unit 83a corrects the position stored in the storage unit 86 based on the detection temperature Td detected by the temperature detection unit 804 and the continuity state of each of the probes U and D detected by the continuity state detection unit 82. One of a plurality of combination patterns corresponding to the detection temperature Td included in the information is selected. Then, the deviation information acquisition unit 83a acquires the deviation indicated by the deviation information associated with the position correction information with respect to the selected combination pattern as the correction deviation amount.

The conductive portion image generation unit 22a arranges each conductive exposed portion 105 by representing each conductive exposed portion 105 with a conductive portion image M based on the conductive exposed portion position data stored in the conductive exposed portion position data storage unit 201. Is generated as an image of the conductive portion arrangement image G1. The conductive portion image generation unit 22a further enlarges or reduces the conductive portion arrangement image G1 so as to correspond to the thermal expansion generated in the substrate 100 in response to a plurality of temperatures, and each of the enlarged or reduced conductive portion arrangement images G1 is displayed. Corresponds to the corresponding temperature (step (2c1)).

The probe placement image generation unit 23a images the placement of the probes U and D by representing the tips of the probes U and D with the probe image P based on the probe placement data stored in the probe placement data storage unit 203. A modified probe arrangement image G2 is generated. The probe arrangement image generation unit 23a further enlarges or reduces the probe arrangement image G2 so as to correspond to the thermal expansion generated in the inspection jigs 3U and 3D according to a plurality of temperatures, and each enlarged or reduced probe arrangement image G2. Corresponds to the corresponding temperature (step (2c2)).

The position correction information generation processing unit 25a generates position correction information in association with a plurality of temperatures (step (2c3)).

The deviation information acquisition unit 83a in the substrate inspection device 1a is the temperature detection unit 804 of the position correction information stored in the storage unit 86 based on the continuity state of each of the probes U and D detected by the continuity state detection unit 82. One of a plurality of combination patterns included in the position correction information associated with the detected detection temperature Td is selected. Then, the deviation information acquisition unit 83a acquires the deviation indicated by the deviation information associated with the position correction information with respect to the selected combination pattern as the correction deviation amount.

The inspection processing unit 85a is different from the inspection processing unit 85 in that the inspection position is corrected based on the correction deviation amount corresponding to the detection temperature Td detected by the temperature detection unit 804.

Next, a position correction information generation method executed by the position correction information generation system 2a configured as described above will be described. 25 and 26 are flowcharts showing an example of the position correction information generation method according to the second embodiment of the present invention.

First, for example, the user stores the conductive portion position data at the reference temperature Tp in the conductive exposed portion position data storage unit 201 in the same manner as in step S1 (step S1a: step (2a)). In step S1a, in consideration of the thermal expansion of the substrate 100, the conductive portion position data at the reference temperature Tp set to, for example, 20 ° C. is stored in the conductive exposed portion position data storage unit 201 in association with the reference temperature Tp. Let me.

Next, for example, the user stores the probe arrangement data at the reference temperature Tp in the probe arrangement data storage unit 203 in the same manner as in step S2 (step S2a: step (2b)). In step S2a, in consideration of the thermal expansion of the inspection jigs 3U and 3D, the probe placement data at the reference temperature Tp set to, for example, 20 ° C. is associated with the reference temperature Tp and stored in the probe placement data storage unit 203. Remember.

Next, the conductive portion arrangement images G1 (U) and G1 (D) and the probe arrangement images G2 (U) and G2 (D) are generated (steps S3 and S4).

Next, the conductive unit image generation unit 22a sets the temperature T to the lower limit temperature assumed as the usage environment of the substrate inspection device 1a, for example, 0 ° C. (step S301). Next, the conductive unit image generation unit 22a calculates the temperature difference ΔT between the temperature T and the reference temperature Tp as ΔT = T−Tp (step S302).

Next, the conductive portion image generation unit 22a multiplies the conductive portion arrangement images G1 (U) and G1 (D) by (1 + α × ΔT) times in the X-axis direction and (1 + α × ΔT) times in the Y-axis direction (step). S303: Step (2c)). α is the coefficient of thermal expansion of the substrate 100. The coefficient of thermal expansion α is, for example, about 14 to 16 ppm / ° C. when the substrate 100 is a printed wiring board (FR4) and about 2.4 ppm / ° C. when the substrate 100 is a silicon semiconductor substrate.

Next, the probe placement image generation unit 23a multiplies the probe placement images G2 (U) and G2 (D) by (1 + β × ΔT) in the X-axis direction and (1 + β × ΔT) in the Y-axis direction (step S304). : Step (2c)). β is the coefficient of thermal expansion of the inspection jigs 3U and 3D. When the inspection jigs 3U and 3D are made of, for example, a resin material, the coefficient of thermal expansion β is about 20 to 200 ppm / ° C.

When the temperature T is lower than the reference temperature Tp, ΔT becomes negative, and the conductive portion arrangement images G1 (U) and G1 (D) and the probe arrangement images G2 (U) and G2 (D) are reduced.

Hereinafter, the above-mentioned steps S5 to S13 are executed (step S305). In step S305, the position correction information generation processing unit 25a executes the processing of the position correction information generation processing unit 25.

Then, after the execution of step S13, in step S14, the position correction information generation processing unit 25a shifts to step S305 if there is any position within the set range for which position correction information has not yet been generated (NO in step S14). Then, the processes of steps S5 to S13 are repeated again.

On the other hand, if the position correction information for all the deviation positions within the set range has been generated (YES in step S14), the position correction information corresponding to the temperature T is completed, so the process proceeds to step S306.

In step S306, the position correction information generation processing unit 25a stores the generated position correction information in the position correction information storage unit 205 as the position correction information corresponding to the temperature T (step S306).

Next, the position correction information generation processing unit 25a compares the temperature Tmax set in advance as the upper limit temperature assumed as the usage environment of the substrate inspection device 1a, for example, 50 ° C., with the temperature T (step S311). If the temperature T is equal to the temperature Tmax (YES in step S311), the position correction information corresponding to each temperature is completed, and the process ends. On the other hand, if the temperature T does not meet the temperature Tmax (NO in step S311), the temperature is set to a preset additional temperature, for example, 10 ° C., to generate the position correction information corresponding to the temperature for which the position correction information has not been generated yet. Addition to T (step S312), and steps S302 to S311 are repeated again.

The addition temperature is not limited to 10 ° C., and the amount of temperature change that may affect the contact between the conductive exposed portion 105 and the probes U and D due to thermal expansion of the substrate 100 or the inspection jigs 3U and 3D may be appropriately set. ..

As described above, by the processing of steps S1a to S312, a plurality of combinations patterns of the conduction states of the probes U and D are included, and the position correction in which each combination pattern and the deviation (shift amount) of the inspection jigs 3U and 3D are associated with each other. Information can be generated in association with a plurality of temperatures.

The position correction information may be acquired, for example, by actually placing the substrate inspection device 1a in a plurality of temperature environments and operating it. However, according to the position correction information generation method according to steps S1a to S312, it is easy to execute by computer simulation including the influence of the temperature environment. By executing this position correction information generation method in a computer simulation, not only the substrate 100 and the probes U and D are not consumed as in the case where the substrate inspection device 1a is actually operated, but also the substrate inspection device 1a is not consumed. It is possible to generate position correction information in a short time without having to control the temperature of the operation while changing the temperature of the above.

FIG. 27 is a flowchart showing an example of the operation of the substrate inspection device 1a shown in FIG. 23. First, the same processing as in steps S101 to S104 shown in FIG. 19 is executed. Next, the temperature detection unit 804 detects the detection temperature Td (step S402).

Next, the deviation information acquisition unit 83a selects one of the plurality of combination patterns included in the position correction information corresponding to the detection temperature Td based on the conduction state of the probes U and D (step S105a). According to the example of step S312, the temperature T associated with the position correction information is at intervals of 10 ° C. Therefore, the deviation information acquisition unit 83a may select, for example, the position correction information associated with the temperature T having the smallest difference from the detection temperature Td as the position correction information corresponding to the detection temperature Td.

Hereinafter, if the same processing as in steps S106 to S109 shown in FIG. 19 is executed and all probes U and D are conductive in step S109 (YES in step S109), all probes U and D are in an environment of the detection temperature Td. Is exactly in contact with each inspection point 102, so the correction unit 84 determines the correction deviation amount at this time as the correction deviation amount corresponding to the temperature T or the detection temperature Td and stores it in the storage unit 86.

FIG. 28 is a flowchart showing an example of the operation of the substrate inspection by the substrate inspection apparatus 1a shown in FIG. 23. First, the same processing as in steps S201 and 202 shown in FIG. 20 is executed. Next, the temperature detection unit 804 detects the detection temperature Td (step S501).

Next, the inspection processing unit 85a corrects the inspection position so as to offset the correction deviation amount corresponding to the detection temperature Td in the correction deviation amount stored in the storage unit 86 (step S203a). For example, the inspection processing unit 85a may acquire the correction deviation amount associated with the temperature having the smallest difference from the detection temperature Td as the correction deviation amount corresponding to the detection temperature Td.

Subsequently, the inspection processing unit 85a executes the same processing as in steps S204 and 205 shown in FIG. 20, the probes U and D are brought into contact with the inspection point 102 of the substrate 100 at the corrected inspection position, and the inspection of the substrate 100 is executed. Will be done.

According to steps S201 to S205 shown in FIG. 28, the inspection position is corrected based on the correction deviation amount in consideration of the thermal expansion of the substrate inspection device 1a and the substrate 100, so that it is easy to improve the positioning accuracy of the probe. It becomes.

That is, the substrate inspection device according to an example of the present invention is for contacting a plurality of inspection points set for the conductive exposed portion, which is an exposed portion of the plurality of conductive portions formed on the surface of the substrate to be inspected. A combination of a jig that holds the plurality of probes, a drive mechanism that moves the jig relative to the substrate to bring the plurality of probes into contact with the surface of the substrate, and a conduction state of each probe. A storage unit that includes a plurality of patterns and stores in advance position correction information in which deviation information representing the deviation of the jig and each combination pattern are associated with each other, and the driving mechanism to a predetermined inspection position on the substrate. A conduction state detection unit that executes a conduction state detection process in which the jig is relatively moved and the plurality of probes are brought into contact with the surface of the substrate at the inspection position to detect the continuity state of each probe, and the detection. One of the plurality of combination patterns is selected based on the conduction state of each probe, and the deviation information associated with the selected combination pattern by the position correction information is acquired as the correction deviation amount. A deviation information acquisition unit that executes the deviation information acquisition process and a correction unit that corrects the inspection position based on the correction deviation amount are provided.

According to this configuration, a plurality of combinations patterns of the conduction state of each probe are included, and the position correction information in which the deviation information representing the deviation of the jig and the combination patterns are associated with each other is stored in the storage unit. Then, the conduction state of each probe is detected in a state where the plurality of probes are in contact with the surface of the substrate at the inspection position. If the inspection position is accurate, each probe should be in contact with each conductive exposed area and the conductive state of each probe should indicate that it is conducting. However, if the inspection position deviates from the correct position, the probe will not come into contact with the conductively exposed portion, and thus some probes will not conduct. In this case, the combination pattern of the conductive probe and the non-conductive probe changes depending on how the jig is displaced with respect to the substrate. Therefore, based on the position correction information, the deviation information corresponding to the combination pattern of the conduction state of each probe obtained by the continuity state detection process is acquired as the correction deviation amount, and the inspection position is corrected based on this correction deviation amount. This makes it easy to improve the positioning accuracy of the probe.

Further, the conduction state is a probe that conducts when at least one of the plurality of probes for which the conduction state is detected and at least one of the other probes conducts, and the probe that is the detection target for the conduction state. It is preferable that the information is non-conducting when all other probes do not conduct.

According to this configuration, when detecting the conduction state in the continuity state detection process, the continuity state of each probe can be detected only by checking whether or not each probe is conducting with another probe. The state detection process becomes easy. Further, since the combination pattern of the conduction state of each probe is represented by simple data that simply combines whether or not each probe is conducting, the conduction state of each probe detected in the deviation information acquisition process is set. Based on this, it becomes easy to select one of a plurality of combination patterns.

Further, the conduction state is preferably information that associates the probe to be detected of the continuity state with another probe that conducts with the probe among the plurality of probes.

According to this configuration, the position correction information associates the combination pattern of the conduction state of each probe with the deviation information, including which probe and which probe are conducting, and which by the conduction state detection process. Since the conduction state of each probe is detected including which probe is conducting between the probe, the conduction state becomes more detailed information, and as a result, the deviation information corresponding to each combination pattern of the conduction state in the position correction information is obtained. Accuracy is improved. As a result, the correction accuracy of the inspection position based on the position correction information is improved.

Further, it is preferable that the plurality of probes are a part of all the probes held in the jig.

According to this configuration, the number of probes included in the position correction information can be reduced, so that the amount of processing for the conduction state detection process and the deviation information acquisition process can be reduced.

Further, the deviation information acquisition unit selects a combination pattern that matches the combination of the conduction states of the detected probes from the plurality of combination patterns, and the position correction information with respect to the selected combination pattern. It is preferable to acquire the deviation information associated with the above as the correction deviation amount.

According to this configuration, when the continuity state detected by the continuity state detection process and the combination pattern of the continuity state included in the position correction information match, the deviation information associated with the matching combination pattern is generated. It is acquired as a correction deviation amount.

Further, the deviation information acquisition unit selects the combination pattern having the largest number of probes matching the conduction state of each detected probe among the plurality of combination patterns, and with respect to the selected combination pattern. It is preferable to acquire the deviation information associated with the position correction information as the correction deviation amount.

According to this configuration, even if the combination pattern of the conduction state detected by the continuity state detection process and the continuity state included in the position correction information do not completely match, the continuity of each detected probe is detected. The deviation information associated with the position correction information for the combination pattern having the largest number of probes matching the state can be acquired as the correction deviation amount.

Further, the jig includes a first jig for contacting one surface of the substrate and a second jig for contacting the other surface of the substrate, and includes the deviation information and the inspection position. Is preferably corresponding to the first and second jigs.

According to this configuration, it is possible to correct both the deviation of the inspection position of the first jig and the deviation of the inspection position of the second jig with respect to the substrate.

Further, it is preferable that the deviation information and the inspection position include the rotation angle of the jig around the axis perpendicular to the surface of the substrate.

According to this configuration, even when the jig rotates about an axis perpendicular to the surface of the substrate, it is possible to correct the positional deviation in the rotation direction.

Further, a temperature detection unit for detecting the temperature is further provided, the position correction information is set in advance in association with a plurality of temperatures, and the deviation information acquisition process is associated with the temperature detected by the temperature detection unit. It is preferable to acquire the correction deviation amount based on the obtained position correction information.

According to this configuration, the inspection position can be corrected based on the amount of correction deviation in consideration of thermal expansion due to temperature, so that it is easy to improve the positioning accuracy of the probe.

Further, after the correction of the inspection position, the correction unit causes the continuity state detection unit to execute the continuity state detection process based on the corrected inspection position to newly detect the continuity state of each probe. When the conduction state of each of the new probes indicates continuity, the correction deviation amount is determined, and when the continuity state indicating that the continuity state of each of the new probes does not conduct is included, the deviation information acquisition unit It is preferable that the deviation information acquisition process is executed based on the continuity state of each of the new probes to acquire a new correction deviation amount, and the inspection position is newly corrected based on the new correction deviation amount. ..

According to this configuration, when each of the new conductive states obtained by actually contacting each probe with the substrate at the corrected inspection position includes a conductive state indicating that the probe does not conduct. This means that the probe did not properly contact the conductive part. In such a case, a new correction deviation amount is acquired again based on the continuity state of each new probe, and the inspection position is corrected again based on the new correction deviation amount. Therefore, the correction accuracy of the inspection position is improved.

Further, the position correction information generation method according to an example of the present invention is a position correction information generation method for generating the position correction information in the above-mentioned substrate inspection apparatus, and (2a) the position of each conductive exposed portion on the substrate. The step of preparing the conductive exposed portion position data representing the above, (2b) the step of preparing the probe placement data representing the placement of each probe, and (2c) the plurality of probes contacting the plurality of inspection points, respectively. With the position of the jig as a reference position, the jig is positioned at a plurality of positions deviated from the reference position along the surface direction of the substrate based on the conductive exposed portion position data and the probe arrangement data. This includes a step of acquiring the conduction state of each of the probes when the probe is made, and generating position correction information for associating the deviation information representing the deviation with the conduction state of the probe.

Further, the position correction information generation method according to an example of the present invention can move to a plurality of inspection points set for the conductive exposed portion, which is an exposed portion in the plurality of conductive portions provided on the substrate to be inspected. It is a position correction information generation method for generating position correction information for correcting an inspection position which is a position where a plurality of probes held so as to correspond to the arrangement of the plurality of inspection points by a jig are brought into contact with each other. (2a) A step of preparing conductive exposed portion position data representing the position of each of the conductive exposed portions on the substrate, (2b) a step of preparing probe arrangement data representing the arrangement of each of the probes, and (2c) the plurality of steps. The position of the jig in which the plurality of probes come into contact with the inspection point is set as a reference position, and based on the conductive exposed portion position data and the probe arrangement data, the reference position is along the surface direction of the substrate. A step of acquiring the conduction state of each probe when the jig is positioned at a plurality of displaced positions, and generating position correction information for associating the deviation information representing the deviation with the conduction state of the probe. And include.

Further, the position correction information generation system according to an example of the present invention can move to a plurality of inspection points set for the conductive exposed portion, which is an exposed portion in the plurality of conductive portions provided on the substrate to be inspected. A position correction information generation system that generates position correction information for correcting an inspection position, which is a position where a plurality of probes held so as to correspond to the arrangement of the plurality of inspection points are brought into contact with each other. The conductive exposed portion position data storage unit that stores the conductive exposed portion position data representing the position of each conductive exposed portion on the substrate, the probe arrangement data storage unit that stores the probe arrangement data representing the arrangement of each probe, and the above. The position of the jig in which the plurality of probes come into contact with the plurality of inspection points is set as a reference position, and based on the conductive exposed portion position data and the probe arrangement data, the reference position is directed to the surface direction of the substrate. Acquires the conduction state of each probe when the jig is positioned at a plurality of positions shifted along the line, and generates position correction information for associating the deviation information representing the deviation with the conduction state of the probe. It is provided with a position correction information generation unit.

According to these configurations, a plurality of probes are provided for a plurality of inspection points based on the conductive exposed portion position data indicating the position of each conductive exposed portion on the substrate and the probe arrangement data representing the arrangement of each probe. The position of each contacting jig, that is, the correct inspection position is set as the reference position, and the conduction state of each probe is acquired when the jigs are positioned at a plurality of positions deviated from the reference position along the surface direction of the substrate. As a result of associating the deviation information representing the deviation with the conduction state of the probe, position correction information is generated.

Further, in the step (2c), the conductive portion arrangement is represented by imaging the arrangement of the conductive exposed portions by representing each conductive exposed portion with a conductive portion image based on (2c1) the conductive exposed portion position data. A step of generating image data and (2c2) a step of generating probe placement image data in which the placement of each probe is imaged by representing the tip of each probe with a probe image based on the probe placement data. (2c3) With respect to the image represented by the conductive portion arrangement image data, the image represented by the probe arrangement image data is positioned so as to correspond to each of the plurality of displaced positions, and the conductive portion image A step of generating conductive portion correspondence information that associates a conductive portion corresponding to a conductive portion image that at least partially overlaps with a probe corresponding to the probe image that overlaps at least a part thereof, and (2c4) the conductive portion. It is preferable to include a step of generating the position correction information by acquiring the conduction state of each probe corresponding to each of the plurality of displaced positions based on the correspondence information.

According to this configuration, by using the conductive part arrangement image data in which the arrangement of each conductive part is imaged by the conductive part image and the probe arrangement data in which the arrangement of each probe is imaged by the probe image, the actual Position correction information can be generated by simulation using images instead of substrates and probes. As a result, it becomes easy to shorten the generation time of the position correction information. Further, the substrate and the probe are not consumed as in the case where the probe is actually brought into contact with the substrate to generate the position correction information.

Further, the conduction state is a state in which conduction occurs when at least one of the plurality of probes to be acquired in the conduction state and at least one of the other probes are conducted, and the probe to be acquired in the conduction state. It is preferable that the information is non-conducting when all other probes do not conduct.

According to this configuration, the conduction state of each probe is represented by simple data that simply combines whether or not each probe is conducting, so that the position correction information is simplified and the amount of data of the position correction information is reduced. It becomes easy to reduce.

Further, the conduction state is preferably information that associates another probe that conducts with the probe with respect to the probe for which the conduction state is to be acquired among the plurality of probes.

According to this configuration, the position correction information associates the combination pattern of the conduction state of each probe with the deviation information, including which probe and which probe are conducting. As a result, the position correction information becomes more detailed information, and it becomes easy to improve the correction accuracy of the inspection position based on the position correction information.

Further, the jig includes a first jig for contacting one surface of the substrate and a second jig for contacting the other surface of the substrate, and includes the deviation information and the inspection position. Is preferably corresponding to the first and second jigs, respectively.

According to this configuration, it is possible to generate position correction information capable of correcting both the deviation of the inspection position of the first jig and the deviation of the inspection position of the second jig.

Further, it is preferable that the deviation information and the inspection position include the rotation angle of the jig around the axis perpendicular to the surface of the substrate.

According to this configuration, it is possible to generate position correction information capable of correcting the position deviation in the rotation direction even for the position deviation of the jig that rotates about the axis perpendicular to the surface of the substrate.

Further, in the step (2c), based on the conductive exposed portion position data and the probe arrangement data, the position correction information is provided by associating the plurality of temperatures with each other and reflecting the thermal expansion corresponding to each temperature. It is preferable to generate.

According to this configuration, it is possible to generate position correction information in consideration of the position shift due to thermal expansion caused by temperature.

Further, the inspection position correction method according to an example of the present invention includes (1a) a step of generating the position correction information by the above-mentioned position correction information generation method, and (1b) the jig is placed at a predetermined inspection position on the substrate. Based on the step of detecting the conduction state of each of the probes by moving them relatively and bringing the plurality of probes into contact with the surface of the substrate at the inspection position, and (1c) the conduction state of each of the detected probes. A step of selecting one of the plurality of combination patterns and acquiring the deviation information associated with the selected combination pattern by the position correction information as a correction deviation amount, and (1d) the correction deviation. It includes a step of correcting the inspection position based on the amount.

Further, the inspection position correction method according to an example of the present invention is (1a) a plurality of inspection points set for the conductive exposed portion which is an exposed portion in the plurality of conductive portions formed on the surface of the substrate to be inspected. A plurality of patterns of combination patterns of conduction states of a plurality of probes to be brought into contact with the probe are included, and position correction information in which the deviation information representing the deviation of the jig holding the plurality of probes and the combination patterns are associated with each other is prepared. (1b) The jig is relatively moved to a predetermined inspection position with respect to the substrate, and the plurality of probes are brought into contact with the surface of the substrate at the inspection position to detect the conduction state of each probe. (1c) One of the plurality of combination patterns is selected based on the conduction state of each of the detected probes, and the selected combination pattern is associated with the position correction information. It includes a step of acquiring the deviation information as a correction deviation amount and (1d) a step of correcting the inspection position based on the correction deviation amount.

According to these configurations, a plurality of combinations patterns of the conduction state of each probe are included, and position correction information in which the deviation information representing the deviation of the jig and the combination patterns are associated with each other is prepared in advance. Then, the conduction state of each probe is detected in a state where the plurality of probes are in contact with the surface of the substrate at the inspection position. If the inspection position is accurate, each probe should be in contact with each conductive exposed area and the conductive state of each probe should indicate that it is conducting. However, if the inspection position deviates from the correct position, there will be a probe that does not contact the conductive exposed portion and therefore does not conduct. In this case, the combination pattern of the conductive probe and the non-conductive probe changes depending on how the jig is displaced with respect to the substrate. Therefore, based on the position correction information, the deviation information corresponding to the combination pattern of the conduction state of each probe obtained in the step (1b) is acquired as the correction deviation amount, and the inspection position is corrected based on this correction deviation amount. This makes it easy to improve the positioning accuracy of the probe.

The inspection position correction method, the position correction information generation method, the substrate inspection device, and the position correction information generation system having such a configuration can easily improve the positioning accuracy of the probe.

This application is based on Japanese Patent Application No. 2017-225633 filed on November 24, 2017, the contents of which are included in the present application. In addition, the specific embodiment or example made in the section of the mode for carrying out the invention merely clarifies the technical content of the present invention, and the present invention includes such a specific example. It should not be construed in a narrow sense.

1,1a Substrate inspection device 2,2a Position correction information generation system 3,3U, 3D inspection jig (jig)
4,4U, 4D Inspection mechanism 6 Substrate fixing device 8, 8a Inspection unit 21,21a Position correction information generation unit 22, 22a Conductive unit image generation unit 23, 23a Probe placement image generation unit 24 Conductive unit compatible information generation unit 25, 25a Position correction information generation processing unit 26 Simulation processing unit 31 Support members 41U, 41D Imaging unit 80, 80a Control unit 81 Positioning unit 82 Conduction state detection unit 83,83a Misalignment information acquisition unit 84 Correction unit 85, 85a Inspection processing unit 86 Storage unit 89 Inspection position correction unit 100 Board 102 Inspection point 103, 103 Mark 104 Conductive unit 105 Conductive exposed unit 201 Conductive exposed unit Position data storage unit 203 Probe arrangement data storage unit 204 Conductive unit compatible information storage unit 205 Position correction information storage Part 321 Base plate 801U, 801D Drive mechanism 802 Measuring part 803 Scanner part G1 Conductive part arrangement image (Conducting part arrangement image data)
G2 probe placement image (probe placement image data)
M Conductive part image P Probe image U, D, U1-Un, D1-Dm Probe

Claims (21)

A jig that holds a plurality of probes for contacting a plurality of inspection points set for the conductive exposed portion, which is an exposed portion of the plurality of conductive portions formed on the surface of the substrate to be inspected.
A drive mechanism that moves the jig relative to the substrate to bring the plurality of probes into contact with the surface of the substrate.
A storage unit that includes a plurality of combination patterns of the conduction state of each probe and stores in advance position correction information in which deviation information representing the deviation of the jig and the position correction information associated with each combination pattern are stored.
A conduction state in which the jig is relatively moved to a predetermined inspection position with respect to the substrate by the drive mechanism, and the plurality of probes are brought into contact with the surface of the substrate at the inspection position to detect the continuity state of each probe. The continuity state detector that executes the detection process and
One of the plurality of combination patterns is selected based on the conduction state of each of the detected probes, and the deviation information associated with the selected combination pattern by the position correction information is corrected by the correction deviation amount. The deviation information acquisition unit that executes the deviation information acquisition processing to be acquired as
A substrate inspection device including a correction unit that corrects the inspection position based on the correction deviation amount. The conduction state is conducted when at least one of the plurality of probes to be detected in the conduction state and at least one of the other probes are conducted, and the probe to be detected in the conduction state and other probes are connected. The substrate inspection apparatus according to claim 1, which is information for non-conductivity when all the probes of the above are not conductive. The substrate inspection apparatus according to claim 1, wherein the conductive state is information for associating another probe that conducts with the probe to be detected of the conductive state among the plurality of probes. The substrate inspection apparatus according to any one of claims 1 to 3, wherein the plurality of probes are a part of all the probes held in the jig. The deviation information acquisition unit selects a combination pattern that matches the combination of the conduction states of the detected probes from the plurality of combination patterns, and responds to the selected combination pattern by the position correction information. The substrate inspection apparatus according to any one of claims 1 to 4, wherein the attached deviation information is acquired as a correction deviation amount. The deviation information acquisition unit selects the combination pattern having the largest number of probes that matches the conduction state of each detected probe from the plurality of combination patterns, and the position with respect to the selected combination pattern. The substrate inspection apparatus according to any one of claims 1 to 4, wherein the deviation information associated with the correction information is acquired as the correction deviation amount. The jig includes a first jig for contacting one surface of the substrate and a second jig for contacting the other surface of the substrate.
The substrate inspection apparatus according to any one of claims 1 to 6, wherein the deviation information and the inspection position correspond to the first and second jigs. The substrate inspection apparatus according to any one of claims 1 to 7, wherein the deviation information and the inspection position include a rotation angle of the jig around an axis perpendicular to the surface of the substrate. It also has a temperature detector that detects the temperature.
The position correction information is set in advance in association with a plurality of temperatures.
The substrate inspection according to any one of claims 1 to 8, wherein the deviation information acquisition process acquires the correction deviation amount based on the position correction information associated with the temperature detected by the temperature detection unit. apparatus. The correction unit
After the inspection position is corrected, the continuity state detection unit executes the continuity state detection process based on the corrected inspection position to newly detect the continuity state of each probe.
When the continuity state of each of the new probes indicates continuity, the correction deviation amount is determined.
When the conduction state indicating that the new probes do not conduct is included, the deviation information acquisition unit executes the deviation information acquisition process based on the continuity state of each of the new probes to make a new one. The substrate inspection apparatus according to any one of claims 1 to 9, wherein a correction deviation amount is acquired and the inspection position is newly corrected based on the new correction deviation amount. A position correction information generation method for generating the position correction information in the substrate inspection apparatus according to any one of claims 1 to 10.
(2a) A step of preparing conductive exposed portion position data representing the position of each conductive exposed portion on the substrate, and
(2b) A step of preparing probe arrangement data representing the arrangement of each probe, and
(2c) The position of the jig in which the plurality of probes come into contact with the plurality of inspection points is set as a reference position, and the substrate is moved from the reference position based on the conductive exposed portion position data and the probe arrangement data. Position correction that acquires the conduction state of each probe when the jig is positioned at a plurality of positions shifted along the surface direction of the above, and associates the deviation information indicating the deviation with the conduction state of the probe. A position correction information generation method including a step of generating information. A movable jig corresponds to the arrangement of the plurality of inspection points at a plurality of inspection points set for the conductive exposed portion, which is an exposed portion of the plurality of conductive portions provided on the substrate to be inspected. It is a position correction information generation method for generating position correction information for correcting an inspection position, which is a position where a plurality of probes held in a contact are brought into contact with each other.
(2a) A step of preparing conductive exposed portion position data representing the position of each conductive exposed portion on the substrate, and
(2b) A step of preparing probe arrangement data representing the arrangement of each probe, and
(2c) The position of the jig in which the plurality of probes come into contact with the plurality of inspection points is set as a reference position, and the substrate is moved from the reference position based on the conductive exposed portion position data and the probe arrangement data. Position correction that acquires the conduction state of each probe when the jig is positioned at a plurality of positions shifted along the surface direction of the above, and associates the deviation information indicating the deviation with the conduction state of the probe. A position correction information generation method including a step of generating information. The step (2c) is
(2c1) A step of generating conductive portion arrangement image data representing the arrangement of each conductive exposed portion by imaging the arrangement of each conductive exposed portion by representing each conductive exposed portion with a conductive portion image based on the conductive exposed portion position data.
(2c2) A step of generating probe placement image data in which the placement of each probe is imaged by representing the tip of each probe with a probe image based on the probe placement data.
(2c3) With respect to the image represented by the conductive portion arrangement image data, the image represented by the probe arrangement image data is positioned so as to correspond to each of the plurality of displaced positions, and at least the conductive portion image and at least. A step of generating conductive part correspondence information that associates a conductive part corresponding to a conductive part image in which at least a part overlaps with a probe corresponding to the probe image in which a part overlaps.
(2c4) Claim 11 or 12 including a step of generating the position correction information by acquiring the conduction state of each of the probes corresponding to the plurality of displaced positions based on the information with the conductive portion. The position correction information generation method described in. The conduction state is conducted when at least one of the plurality of probes for which the conduction state is to be acquired and at least one of the other probes are conductive, and the probe for which the continuity state is to be acquired and the other probes. The position correction information generation method according to any one of claims 11 to 13, which is information that makes the probe non-conducting when all the probes do not conduct. The conduction state is described in any one of claims 11 to 13, which is information for associating another probe that conducts with the probe of the plurality of probes for which the conduction state is to be acquired. Position correction information generation method. The jig includes a first jig for contacting one surface of the substrate and a second jig for contacting the other surface of the substrate.
The position correction information generation method according to any one of claims 11 to 15, wherein the deviation information and the inspection position correspond to the first and second jigs, respectively. The position correction information generation method according to any one of claims 11 to 16, wherein the deviation information and the inspection position include a rotation angle of the jig around an axis perpendicular to the surface of the substrate. The step (2c) is
Any of claims 11 to 17 that generate the position correction information by associating a plurality of temperatures with each other based on the conductive exposed portion position data and the probe arrangement data and reflecting the thermal expansion corresponding to each temperature. The position correction information generation method according to item 1. (1a) A step of generating the position correction information by the position correction information generation method according to any one of claims 11 to 18.
(1b) A step of relatively moving the jig to a predetermined inspection position with respect to the substrate and bringing the plurality of probes into contact with the surface of the substrate at the inspection position to detect the conduction state of each probe.
(1c) One of the plurality of combination patterns is selected based on the conduction state of each of the detected probes, and the deviation information associated with the selected combination pattern by the position correction information is applied. The process of acquiring as the amount of correction deviation and
(1d) An inspection position correction method including a step of correcting the inspection position based on the correction deviation amount. (1a) A combination pattern of conduction states of a plurality of probes for contacting a plurality of inspection points set for a conductive exposed portion which is an exposed portion in a plurality of conductive portions formed on a surface of a substrate to be inspected. And a step of preparing position correction information in which deviation information representing the deviation of the jig holding the plurality of probes and each combination pattern are associated with each other.
(1b) A step of relatively moving the jig to a predetermined inspection position with respect to the substrate and bringing the plurality of probes into contact with the surface of the substrate at the inspection position to detect the conduction state of each probe.
(1c) One of the plurality of combination patterns is selected based on the conduction state of each of the detected probes, and the deviation information associated with the selected combination pattern by the position correction information is applied. The process of acquiring as the amount of correction deviation and
(1d) An inspection position correction method including a step of correcting the inspection position based on the correction deviation amount. A movable jig corresponds to the arrangement of the plurality of inspection points at a plurality of inspection points set for the conductive exposed portion, which is an exposed portion of the plurality of conductive portions provided on the substrate to be inspected. It is a position correction information generation system that generates position correction information for correcting the inspection position, which is the position where a plurality of probes held in the contact are brought into contact with each other.
A conductive exposed portion position data storage unit that stores conductive exposed portion position data representing the position of each conductive exposed portion on the substrate,
A probe placement data storage unit that stores probe placement data representing the placement of each probe, and
The position of the jig in which the plurality of probes come into contact with the plurality of inspection points is set as a reference position, and the surface direction of the substrate from the reference position is based on the conductive exposed portion position data and the probe arrangement data. Acquires the conduction state of each probe when the jig is positioned at a plurality of positions shifted along the line, and generates position correction information for associating the deviation information representing the deviation with the conduction state of the probe. A position correction information generation system including a position correction information generation unit.

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