TWI709002B - 曝光裝置及元件製造方法 - Google Patents

曝光裝置及元件製造方法 Download PDF

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Publication number
TWI709002B
TWI709002B TW107138629A TW107138629A TWI709002B TW I709002 B TWI709002 B TW I709002B TW 107138629 A TW107138629 A TW 107138629A TW 107138629 A TW107138629 A TW 107138629A TW I709002 B TWI709002 B TW I709002B
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TW
Taiwan
Prior art keywords
liquid
substrate
space
gap
addition
Prior art date
Application number
TW107138629A
Other languages
English (en)
Chinese (zh)
Other versions
TW201908875A (zh
Inventor
佐藤真路
Original Assignee
日商尼康股份有限公司
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Publication of TW201908875A publication Critical patent/TW201908875A/zh
Application granted granted Critical
Publication of TWI709002B publication Critical patent/TWI709002B/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW107138629A 2008-12-29 2009-12-28 曝光裝置及元件製造方法 TWI709002B (zh)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
US19383608P 2008-12-29 2008-12-29
US19383308P 2008-12-29 2008-12-29
US19383408P 2008-12-29 2008-12-29
US19383508P 2008-12-29 2008-12-29
US61/193,836 2008-12-29
US61/193,834 2008-12-29
US61/193,835 2008-12-29
US61/193,833 2008-12-29
US12/644,703 2009-12-22
US12/644,703 US8896806B2 (en) 2008-12-29 2009-12-22 Exposure apparatus, exposure method, and device manufacturing method

Publications (2)

Publication Number Publication Date
TW201908875A TW201908875A (zh) 2019-03-01
TWI709002B true TWI709002B (zh) 2020-11-01

Family

ID=42061940

Family Applications (4)

Application Number Title Priority Date Filing Date
TW107138629A TWI709002B (zh) 2008-12-29 2009-12-28 曝光裝置及元件製造方法
TW103145928A TWI598698B (zh) 2008-12-29 2009-12-28 曝光裝置、曝光方法、及元件製造方法
TW106117608A TWI644182B (zh) 2008-12-29 2009-12-28 曝光裝置、曝光方法、及元件製造方法
TW098145223A TWI479276B (zh) 2008-12-29 2009-12-28 曝光裝置、曝光方法、及元件製造方法

Family Applications After (3)

Application Number Title Priority Date Filing Date
TW103145928A TWI598698B (zh) 2008-12-29 2009-12-28 曝光裝置、曝光方法、及元件製造方法
TW106117608A TWI644182B (zh) 2008-12-29 2009-12-28 曝光裝置、曝光方法、及元件製造方法
TW098145223A TWI479276B (zh) 2008-12-29 2009-12-28 曝光裝置、曝光方法、及元件製造方法

Country Status (5)

Country Link
US (2) US8896806B2 (enExample)
JP (2) JP5408258B2 (enExample)
KR (2) KR101831984B1 (enExample)
TW (4) TWI709002B (enExample)
WO (1) WO2010076894A1 (enExample)

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US9823580B2 (en) 2012-07-20 2017-11-21 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, method for manufacturing device, program, and recording medium
US9568828B2 (en) 2012-10-12 2017-02-14 Nikon Corporation Exposure apparatus, exposing method, device manufacturing method, program, and recording medium
US9494870B2 (en) * 2012-10-12 2016-11-15 Nikon Corporation Exposure apparatus, exposing method, device manufacturing method, program, and recording medium
US9720331B2 (en) 2012-12-27 2017-08-01 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, method of manufacturing device, program, and recording medium
US9651873B2 (en) 2012-12-27 2017-05-16 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, method of manufacturing device, program, and recording medium
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CN105229774B (zh) * 2013-10-08 2019-01-11 株式会社尼康 液浸部件、曝光装置及曝光方法、以及器件制造方法
CN106662822A (zh) * 2014-07-01 2017-05-10 Asml荷兰有限公司 光刻设备和制造光刻设备的方法
NL2019453A (en) * 2016-09-12 2018-03-15 Asml Netherlands Bv Fluid handling structure for lithographic apparatus
CN118584764A (zh) * 2017-12-15 2024-09-03 Asml荷兰有限公司 流体处置结构、光刻设备、以及使用流体处置结构的方法
JP6610726B2 (ja) * 2018-07-11 2019-11-27 株式会社ニコン 液浸部材、露光装置及び露光方法、並びにデバイス製造方法
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Also Published As

Publication number Publication date
US9612538B2 (en) 2017-04-04
JP5668825B2 (ja) 2015-02-12
WO2010076894A1 (en) 2010-07-08
TW201732458A (zh) 2017-09-16
US8896806B2 (en) 2014-11-25
TWI644182B (zh) 2018-12-11
TW201518877A (zh) 2015-05-16
KR20180021907A (ko) 2018-03-05
KR101831984B1 (ko) 2018-02-23
JP2014027320A (ja) 2014-02-06
TWI479276B (zh) 2015-04-01
JP2012514315A (ja) 2012-06-21
KR102087015B1 (ko) 2020-03-10
JP5408258B2 (ja) 2014-02-05
KR20110106908A (ko) 2011-09-29
TW201030479A (en) 2010-08-16
TWI598698B (zh) 2017-09-11
US20100304310A1 (en) 2010-12-02
TW201908875A (zh) 2019-03-01
US20150036112A1 (en) 2015-02-05

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