TWI708998B - 感光性樹脂組成物、使用其的感光性樹脂層和電子裝置 - Google Patents

感光性樹脂組成物、使用其的感光性樹脂層和電子裝置 Download PDF

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Publication number
TWI708998B
TWI708998B TW108131591A TW108131591A TWI708998B TW I708998 B TWI708998 B TW I708998B TW 108131591 A TW108131591 A TW 108131591A TW 108131591 A TW108131591 A TW 108131591A TW I708998 B TWI708998 B TW I708998B
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TW
Taiwan
Prior art keywords
chemical formula
photosensitive resin
group
resin composition
substituted
Prior art date
Application number
TW108131591A
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English (en)
Chinese (zh)
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TW202018413A (zh
Inventor
金尙洙
姜眞熙
姜希炅
權章玄
權志倫
金煜
金二柱
白宅晋
宋斗理
韓圭奭
洪忠範
Original Assignee
南韓商三星Ｓｄｉ股份有限公司
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Publication of TW202018413A publication Critical patent/TW202018413A/zh
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Publication of TWI708998B publication Critical patent/TWI708998B/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
TW108131591A 2018-09-03 2019-09-03 感光性樹脂組成物、使用其的感光性樹脂層和電子裝置 TWI708998B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2018-0104743 2018-09-03
KR1020180104743A KR102288387B1 (ko) 2018-09-03 2018-09-03 감광성 수지 조성물, 이를 이용한 감광성 수지막 및 전자 소자

Publications (2)

Publication Number Publication Date
TW202018413A TW202018413A (zh) 2020-05-16
TWI708998B true TWI708998B (zh) 2020-11-01

Family

ID=69717141

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108131591A TWI708998B (zh) 2018-09-03 2019-09-03 感光性樹脂組成物、使用其的感光性樹脂層和電子裝置

Country Status (3)

Country Link
KR (1) KR102288387B1 (ko)
CN (1) CN110874015B (ko)
TW (1) TWI708998B (ko)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001049112A (ja) * 1999-08-04 2001-02-20 Hitachi Chem Co Ltd 樹脂組成物及びこれを用いた樹脂膜の形成方法
TW201335714A (zh) * 2012-02-16 2013-09-01 Fujifilm Corp 感光性樹脂組成物、硬化膜的製造方法、硬化膜、有機ｅｌ顯示裝置以及液晶顯示裝置
TW201525616A (zh) * 2013-12-19 2015-07-01 Samsung Sdi Co Ltd 正型感光性樹脂組成物、使用其製造的感光性樹脂膜及顯示元件
WO2015174199A1 (ja) * 2014-05-15 2015-11-19 Dic株式会社 変性フェノール性水酸基含有化合物、変性フェノール性水酸基含有化合物の製造方法、感光性組成物、レジスト材料及びレジスト塗膜

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7803510B2 (en) 2005-08-17 2010-09-28 Fujifilm Electronic Materials U.S.A., Inc. Positive photosensitive polybenzoxazole precursor compositions
JP5163899B2 (ja) * 2006-06-15 2013-03-13 日産化学工業株式会社 環構造を持つ高分子化合物を含有するポジ型感光性樹脂組成物
JP5736993B2 (ja) * 2011-06-15 2015-06-17 日立化成デュポンマイクロシステムズ株式会社 感光性樹脂組成物、パターン硬化膜の製造方法及び電子部品
KR101609631B1 (ko) * 2012-12-24 2016-04-06 제일모직 주식회사 포지티브형 감광성 수지 조성물, 및 이를 이용한 표시 소자용 유기 절연막 및 표시 소자
KR101750463B1 (ko) * 2013-11-26 2017-06-23 제일모직 주식회사 포지티브형 감광성 수지 조성물, 감광성 수지막, 및 표시 소자
KR101812580B1 (ko) * 2013-12-05 2017-12-27 제일모직 주식회사 포지티브형 감광성 수지 조성물, 감광성 수지막, 및 이를 이용한 표시 소자
KR101568318B1 (ko) * 2014-02-06 2015-11-12 (주)경인양행 염료 고분자 화합물, 이를 포함하는 컬러필터용 수지 조성물 및 이를 이용한 컬러필터
JP5673880B1 (ja) * 2014-05-26 2015-02-18 住友ベークライト株式会社 感光性樹脂組成物、電子装置、および電子装置の製造方法
KR101788399B1 (ko) 2015-09-23 2017-10-19 (주)경인양행 내열안정성이 우수한 옥심 에스테르 화합물, 그것을 포함하는 광중합 개시제 및 감광성 수지 조성물
KR102622128B1 (ko) * 2016-09-19 2024-01-09 동우 화인켐 주식회사 감광성 수지 조성물 및 이로부터 형성된 광경화성 보호막

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001049112A (ja) * 1999-08-04 2001-02-20 Hitachi Chem Co Ltd 樹脂組成物及びこれを用いた樹脂膜の形成方法
TW201335714A (zh) * 2012-02-16 2013-09-01 Fujifilm Corp 感光性樹脂組成物、硬化膜的製造方法、硬化膜、有機ｅｌ顯示裝置以及液晶顯示裝置
TW201525616A (zh) * 2013-12-19 2015-07-01 Samsung Sdi Co Ltd 正型感光性樹脂組成物、使用其製造的感光性樹脂膜及顯示元件
WO2015174199A1 (ja) * 2014-05-15 2015-11-19 Dic株式会社 変性フェノール性水酸基含有化合物、変性フェノール性水酸基含有化合物の製造方法、感光性組成物、レジスト材料及びレジスト塗膜

Also Published As

Publication number Publication date
KR20200026594A (ko) 2020-03-11
CN110874015A (zh) 2020-03-10
TW202018413A (zh) 2020-05-16
CN110874015B (zh) 2023-02-28
KR102288387B1 (ko) 2021-08-10

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