TWI708065B - 測試插座以及導電顆粒 - Google Patents

測試插座以及導電顆粒 Download PDF

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Publication number
TWI708065B
TWI708065B TW107130236A TW107130236A TWI708065B TW I708065 B TWI708065 B TW I708065B TW 107130236 A TW107130236 A TW 107130236A TW 107130236 A TW107130236 A TW 107130236A TW I708065 B TWI708065 B TW I708065B
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TW
Taiwan
Prior art keywords
conductive
particles
main body
insulating material
parts
Prior art date
Application number
TW107130236A
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English (en)
Chinese (zh)
Other versions
TW201920973A (zh
Inventor
鄭永倍
Original Assignee
南韓商Ｉｓｃ股份有限公司
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Application filed by 南韓商Ｉｓｃ股份有限公司 filed Critical 南韓商Ｉｓｃ股份有限公司
Publication of TW201920973A publication Critical patent/TW201920973A/zh
Application granted granted Critical
Publication of TWI708065B publication Critical patent/TWI708065B/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
TW107130236A 2017-08-31 2018-08-30 測試插座以及導電顆粒 TWI708065B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2017-0110660 2017-08-31
??10-2017-0110660 2017-08-31
KR1020170110660A KR101976703B1 (ko) 2017-08-31 2017-08-31 검사용 소켓 및 도전성 입자

Publications (2)

Publication Number Publication Date
TW201920973A TW201920973A (zh) 2019-06-01
TWI708065B true TWI708065B (zh) 2020-10-21

Family

ID=65527683

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107130236A TWI708065B (zh) 2017-08-31 2018-08-30 測試插座以及導電顆粒

Country Status (4)

Country Link
KR (1) KR101976703B1 (ko)
CN (1) CN111051894B (ko)
TW (1) TWI708065B (ko)
WO (1) WO2019045426A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI845865B (zh) * 2021-10-08 2024-06-21 韓商斯諾有限公司 檢查用插座

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110726918B (zh) * 2019-09-25 2022-04-05 苏州韬盛电子科技有限公司 阻抗匹配结构的半导体芯片测试同轴插座及其制备方法
KR102387745B1 (ko) * 2020-06-23 2022-05-19 (주)하이그레이드 손상된 실리콘 러버 소켓 복원 방법
KR102342480B1 (ko) * 2020-08-21 2021-12-23 (주)티에스이 테스트 소켓 및 이를 포함하는 테스트 장치
KR102707149B1 (ko) * 2021-12-13 2024-09-19 주식회사 티에프이 반도체 소자 테스트용 러버 소켓 및 러버 소켓용 도전성 부재

Citations (5)

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KR20100069989A (ko) * 2008-12-17 2010-06-25 제일모직주식회사 절연 전도성 입자 및 이를 포함하는 이방 전도성 필름용 조성물
KR20100075938A (ko) * 2007-10-22 2010-07-05 니폰 가가쿠 고교 가부시키가이샤 피복 도전성 분체 및 그것을 이용한 도전성 접착제
TW201603111A (zh) * 2014-07-10 2016-01-16 鴻海精密工業股份有限公司 場發射陰極及場發射裝置
KR101586340B1 (ko) * 2014-12-26 2016-01-18 주식회사 아이에스시 전기적 검사 소켓 및 전기적 검사 소켓용 도전성 입자의 제조방법
KR101748184B1 (ko) * 2016-02-02 2017-06-19 (주)티에스이 검사용 소켓 및 검사용 소켓의 도전성 입자 제조방법

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TW561266B (en) * 1999-09-17 2003-11-11 Jsr Corp Anisotropic conductive sheet, its manufacturing method, and connector
KR100621463B1 (ko) * 2003-11-06 2006-09-13 제일모직주식회사 절연 전도성 미립자 및 이를 함유하는 이방 전도성 필름
KR101375298B1 (ko) * 2011-12-20 2014-03-19 제일모직주식회사 전도성 미립자 및 이를 포함하는 이방 전도성 필름
KR101266124B1 (ko) * 2012-04-03 2013-05-27 주식회사 아이에스시 고밀도 도전부를 가지는 테스트용 소켓 및 그 제조방법
KR101339166B1 (ko) * 2012-06-18 2013-12-09 주식회사 아이에스시 관통공이 형성된 도전성 입자를 가지는 검사용 소켓 및 그 제조방법
WO2014129784A1 (ko) * 2013-02-19 2014-08-28 주식회사 아이에스시 고밀도 도전부를 가지는 테스트용 소켓
CN104741605B (zh) * 2015-04-10 2017-03-01 武汉大学 纳米银包裹二氧化硅纳微米球导电粉末及其制备方法和应用

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KR20100075938A (ko) * 2007-10-22 2010-07-05 니폰 가가쿠 고교 가부시키가이샤 피복 도전성 분체 및 그것을 이용한 도전성 접착제
KR20100069989A (ko) * 2008-12-17 2010-06-25 제일모직주식회사 절연 전도성 입자 및 이를 포함하는 이방 전도성 필름용 조성물
TW201603111A (zh) * 2014-07-10 2016-01-16 鴻海精密工業股份有限公司 場發射陰極及場發射裝置
KR101586340B1 (ko) * 2014-12-26 2016-01-18 주식회사 아이에스시 전기적 검사 소켓 및 전기적 검사 소켓용 도전성 입자의 제조방법
KR101748184B1 (ko) * 2016-02-02 2017-06-19 (주)티에스이 검사용 소켓 및 검사용 소켓의 도전성 입자 제조방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI845865B (zh) * 2021-10-08 2024-06-21 韓商斯諾有限公司 檢查用插座

Also Published As

Publication number Publication date
KR20190024070A (ko) 2019-03-08
TW201920973A (zh) 2019-06-01
KR101976703B1 (ko) 2019-05-09
CN111051894A (zh) 2020-04-21
WO2019045426A1 (ko) 2019-03-07
CN111051894B (zh) 2023-02-21

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