TWI706518B - 佈線基板 - Google Patents

佈線基板 Download PDF

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Publication number
TWI706518B
TWI706518B TW108124297A TW108124297A TWI706518B TW I706518 B TWI706518 B TW I706518B TW 108124297 A TW108124297 A TW 108124297A TW 108124297 A TW108124297 A TW 108124297A TW I706518 B TWI706518 B TW I706518B
Authority
TW
Taiwan
Prior art keywords
conductor
planar
linear
planar conductor
power supply
Prior art date
Application number
TW108124297A
Other languages
English (en)
Chinese (zh)
Other versions
TW202013625A (zh
Inventor
樋渡俊弘
上村林太郎
Original Assignee
日商京瓷股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商京瓷股份有限公司 filed Critical 日商京瓷股份有限公司
Publication of TW202013625A publication Critical patent/TW202013625A/zh
Application granted granted Critical
Publication of TWI706518B publication Critical patent/TWI706518B/zh

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  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW108124297A 2018-07-26 2019-07-10 佈線基板 TWI706518B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2018-140374 2018-07-26
JP2018140374 2018-07-26
JP2018-157551 2018-08-24
JP2018157551A JP7017995B2 (ja) 2018-07-26 2018-08-24 配線基板

Publications (2)

Publication Number Publication Date
TW202013625A TW202013625A (zh) 2020-04-01
TWI706518B true TWI706518B (zh) 2020-10-01

Family

ID=69619509

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108124297A TWI706518B (zh) 2018-07-26 2019-07-10 佈線基板

Country Status (2)

Country Link
JP (1) JP7017995B2 (ja)
TW (1) TWI706518B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023136165A1 (ja) * 2022-01-11 2023-07-20 株式会社村田製作所 トラッカモジュール

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140291005A1 (en) * 2013-03-28 2014-10-02 Kyocera Slc Technologies Corporation Wiring board
TW201644334A (zh) * 2015-02-03 2016-12-16 京瓷股份有限公司 配線基板及其編碼資訊的辨識方法
TW201804886A (zh) * 2016-05-30 2018-02-01 京瓷股份有限公司 指紋感測器用佈線基板
TW201816967A (zh) * 2016-10-28 2018-05-01 京瓷股份有限公司 佈線基板以及使用了該佈線基板的電子裝置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006344740A (ja) * 2005-06-08 2006-12-21 Canon Inc 半導体パッケージ
JP5732357B2 (ja) * 2011-09-09 2015-06-10 新光電気工業株式会社 配線基板、及び半導体パッケージ
JP2014060244A (ja) * 2012-09-18 2014-04-03 Sony Corp 多層プリント配線基板
JP6611555B2 (ja) * 2015-10-16 2019-11-27 キヤノン株式会社 プリント回路板及び電子機器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140291005A1 (en) * 2013-03-28 2014-10-02 Kyocera Slc Technologies Corporation Wiring board
TW201644334A (zh) * 2015-02-03 2016-12-16 京瓷股份有限公司 配線基板及其編碼資訊的辨識方法
TW201804886A (zh) * 2016-05-30 2018-02-01 京瓷股份有限公司 指紋感測器用佈線基板
TW201816967A (zh) * 2016-10-28 2018-05-01 京瓷股份有限公司 佈線基板以及使用了該佈線基板的電子裝置

Also Published As

Publication number Publication date
JP7017995B2 (ja) 2022-02-09
JP2020025061A (ja) 2020-02-13
TW202013625A (zh) 2020-04-01

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