TWI705875B - Grindstone and, method for manufacturing same - Google Patents

Grindstone and, method for manufacturing same Download PDF

Info

Publication number
TWI705875B
TWI705875B TW106127898A TW106127898A TWI705875B TW I705875 B TWI705875 B TW I705875B TW 106127898 A TW106127898 A TW 106127898A TW 106127898 A TW106127898 A TW 106127898A TW I705875 B TWI705875 B TW I705875B
Authority
TW
Taiwan
Prior art keywords
base metal
grinding
abrasive grain
fixed abrasive
fixed
Prior art date
Application number
TW106127898A
Other languages
Chinese (zh)
Other versions
TW201819113A (en
Inventor
鈴木孝彰
西野雄紀
Θ田康弘
Original Assignee
日商利德股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商利德股份有限公司 filed Critical 日商利德股份有限公司
Publication of TW201819113A publication Critical patent/TW201819113A/en
Application granted granted Critical
Publication of TWI705875B publication Critical patent/TWI705875B/en

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic

Abstract

本發明提供一種:具有良好的切屑排出性,能提高研削效率的研削用磨石;及該種研削用磨石的製造方法。   本發明的研削用磨石具有:基底金屬(2),具有面向工件(W)的工件對向面;及固定研磨粒切割線(10),在芯線(12)固定有大量研磨粒(11)所形成,藉由將上述固定研磨粒切割線(10)固定於上述基底金屬(2)的工件對向面,在該工件對向面上形成工件研削用的研削部(3),並形成「由相鄰的固定研磨粒切割線(10、10)間的凹部(5)所形成之切屑排出用的排出溝」。The present invention provides a grinding stone for grinding with good chip discharge and improving grinding efficiency; and a manufacturing method of the grinding stone for grinding. The grinding stone for grinding of the present invention has: a base metal (2) with a workpiece facing surface facing the workpiece (W); and a fixed abrasive grain cutting line (10) with a large number of abrasive grains (11) fixed on the core wire (12) Thus, by fixing the fixed abrasive grain cutting line (10) to the workpiece facing surface of the base metal (2), a grinding portion (3) for workpiece grinding is formed on the workpiece facing surface, and a " A discharge groove for chip discharge formed by a recess (5) between adjacent fixed abrasive grain cutting lines (10, 10).

Description

研削用磨石及其製造方法Grinding stone for grinding and manufacturing method thereof

[0001] 本發明關於:「由金屬材料和陶瓷材料等所形成之工件」的研削所使用的研削用磨石及其製造方法。[0001] The present invention relates to a grinding stone for grinding used for grinding a workpiece formed of a metal material, a ceramic material, etc., and a manufacturing method thereof.

[0002] 傳統以來,就用來研削「由金屬材料和陶瓷材料等所形成之工件」的研削用磨石而言,譬如已知有以下的技術:具有「具有面向工件之工件對向面」的基底金屬;及「在該工件對向面,以適當的接合材保持有金剛石和cBN等研磨粒」的研磨粒層,亦即研削層(請參考專利文獻1)。然後,當採用這種研削用磨石對工件進行研削時,將該研削用磨石組裝於適當的研削裝置,使基底金屬繞著其軸高速旋轉並朝向工件饋送(進給),進而使配置在該基底金屬之工件對向面上的研削層接觸於工件。藉此,露出於研削層表面的研磨粒成為切刃,對該工件施以研削。   [0003] 然而,在這種研削用磨石中,研削工件時產生的切屑,因為堆積於研磨粒間的屑穴內而導致堵塞產生,其結果,恐有招致研削效率下降的疑慮。因此,在這種的研削用磨石中,在好是在上述的研削層,設置「用來提高切屑之排出性」的切屑排出用的排出溝,並通過該排出溝將上述切屑朝外部排出。   關於本發明的習知技術,可列舉出譬如專利文獻2所記載的技術。 [先前技術文獻] [專利文獻]   [0004]   [專利文獻1]:日本特開2010-46771號公報   [專利文獻2]:日本特開昭63-283865號公報[0002] Conventionally, with regard to grinding grindstones used to grind "workpieces made of metal materials, ceramic materials, etc.", for example, the following technology is known: having "a workpiece facing surface facing the workpiece" The base metal; and "on the opposite surface of the workpiece, with an appropriate bonding material to hold the abrasive grain layer such as diamond and cBN abrasive grains", that is, the grinding layer (please refer to Patent Document 1). Then, when using this grinding stone for grinding to grind the workpiece, the grinding stone for grinding is assembled in an appropriate grinding device, and the base metal is rotated around its axis at high speed and fed (feeding) toward the workpiece. The grinding layer on the opposite surface of the workpiece of the base metal contacts the workpiece. Thereby, the abrasive grains exposed on the surface of the grinding layer become cutting edges, and the workpiece is ground.  [0003] However, in this type of grinding stone for grinding, the chips generated during the grinding of the workpiece are clogged due to accumulation in the chip pockets between the abrasive grains. As a result, there is a concern that the grinding efficiency may decrease. Therefore, in this type of grinding stone, it is preferable to provide a discharge groove for chip discharge "to improve chip discharge performance" in the above-mentioned grinding layer, and discharge the chip to the outside through the discharge groove .   As for the conventional technology of the present invention, for example, the technology described in Patent Document 2 can be cited. [Prior Art Document] [Patent Document]   [0004]   [Patent Document 1]: Japanese Patent Laid-Open No. 2010-46771   [Patent Document 2]: Japanese Patent Laid-Open No. 63-283865

[發明欲解決之問題]   [0005] 有鑑於此,本發明的技術性課題,是提供一種:具有良好的切屑排出性,能提高研削效率的研削用磨石;及該種研削用磨石的製造方法。 [解決問題之手段]   [0006] 為了解決上述課題,根據本發明,提供一種研削用磨石,其特徵為具有:基底金屬,具有面向工件的工件對向面;及固定研磨粒切割線,在芯線固定有大量研磨粒所形成,藉由將上述固定研磨粒切割線固定成相鄰於基底金屬的上述工件對向面而延伸,在該工件對向面上形成工件研削用的研削部,並形成「由相鄰的固定研磨粒切割線間的凹部所形成之切屑排出用的排出溝」。   [0007] 此時,最好是:上述基底金屬的工件對向面,由該基底金屬之旋轉軸周圍的外周面所形成,上述固定研磨粒切割線,在沿著上述旋轉軸方向於基底金屬的外周面捲繞成螺旋狀的狀態下,固定於該基底金屬,如此一來,在該基底金屬的外周面形成上述研削部,並由在上述旋轉軸方向上相鄰之固定研磨粒切割線間的凹部,形成上述排出溝。   接著,最好是:上述固定研磨粒切割線,在其長度方向的兩端分別具有第1端部及第2端部,其第1端部被固定於基底金屬之旋轉軸方向的其中一端側,其第2端部被固定於該基底金屬之旋轉軸方向的另一端側,且位於這些第1端部與第2端部之間的中間部,相對於上述基底金屬的外周面,以非固定狀態捲繞成可朝上述旋轉軸方向相對移動。   [0008] 此外,在上述本發明的研削用磨石中,亦可:上述基底金屬的工件對向面,是由該基底金屬的旋轉軸方向之其中一端側的端面所形成,上述固定研磨粒切割線,在基底金屬的端面上,以繞著上述旋轉軸捲繞成渦捲狀的狀態,固定於該基底金屬,如此一來,在該基底金屬的端面上形成上述研削部,並藉由在該基底金屬之徑向上相鄰的固定研磨粒切割線間的凹部,形成上述排出溝。   [0009] 此時,最好是:上述固定研磨粒切割線,在其長度方向的兩端分別具有第1端部及第2端部,上述第1端部在基底金屬之徑向的其中一端側被固定,第2端部在該基底金屬之徑向的另一端側被固定,且位於這些第1端部與第2端部之間的中間部,相對於上述基底金屬的端面,沿著固定研磨粒切割線的長度方向間歇地固定。   [0010] 此外,亦可在上述基底金屬的端面刻設有:凹設成渦卷狀的導引溝,上述固定研磨粒切割線,在沿著該導引溝之長度方向而配設於該導引溝內的狀態下,固定於該基底金屬。   [0011] 不僅如此,根據本發明,提供一種研削用磨石的製造方法,是在「具有用來面向工件之工件對向面」之基底金屬的該工件對向面上,形成工件研削用的研削部與切屑排出用的排出溝之研削用磨石的製造方法,其特徵為含有:將上述基底金屬之旋轉軸周圍的外周面作為上述工件對向面,藉由將在芯線固定有研磨粒而形成的固定研磨粒切割線,在該基底金屬的外周面上,從該旋轉軸方向的一端側朝向另一端側捲繞成螺旋狀,而在該外周面上形成上述研削部,並由上述旋轉軸方向上相鄰之固定研磨粒切割線間的凹部形成上述排出溝的步驟;及將固定研磨粒切割線之長度方向的第1端部及第2端部固定於該基底金屬的步驟。   [0012] 此外,根據本發明,提供一種研削用磨石的製造方法,是在「具有用來面向工件之工件對向面」之基底金屬的該工件對向面上,形成工件研削用的研削部與切屑排出用的排出溝之研削用磨石的製造方法,其特徵為含有:將上述基底金屬之旋轉軸方向之一端部的端面作為上述工件對向面,藉由將在芯線固定有研磨粒而形成的固定研磨粒切割線,在該基底金屬的端面上,繞著該旋轉軸捲繞成渦卷狀,而在該端面上形成上述研削部,並由該端面之徑向上相鄰之固定研磨粒切割線間的凹部形成上述排出溝的步驟;及將固定研磨粒切割線之長度方向的第1端部及第2端部、以及位於該固定研磨粒切割線的第1端部與第2端部之間的中間部,固定於基底金屬的步驟。   [0013] 此時,亦可含有:在上述基底金屬的端面刻設有「繞著上述旋轉軸凹設成渦卷狀的導引溝」的步驟;將上述固定研磨粒切割線,沿著上述導引溝之長度方向而配置於該導引溝內的步驟。 [發明的效果]   [0014] 根據以上所記載的本發明,藉由將固定研磨粒切割線固定於「基底金屬之面向工件的工件對向面」,可在該基底金屬的工件對向面上,同時形成工件研削用的研削部、及切屑排出用的排出溝。因此,能提供一種:具有良好的切屑排出性,能提高研削效率的研削用磨石;及該種研削用磨石的製造方法。[Problem to be solved by the invention]   [0005] In view of this, the technical problem of the present invention is to provide a grinding stone for grinding with good chip discharge and improving grinding efficiency; and a grinding stone for grinding Production method. [Means to Solve the Problem]   [0006] In order to solve the above-mentioned problems, according to the present invention, a grinding stone for grinding is provided, which is characterized by having: a base metal having a workpiece facing surface facing the workpiece; and a fixed abrasive grain cutting line, The core wire is formed by fixing a large number of abrasive grains, and by fixing the fixed abrasive grain cutting line to extend adjacent to the workpiece facing surface of the base metal, a grinding part for grinding the workpiece is formed on the workpiece facing surface, and Form "discharge grooves for chip discharge formed by the recesses between adjacent fixed abrasive grain cutting lines". [0007] At this time, it is preferable that the workpiece facing surface of the base metal is formed by the outer peripheral surface around the rotation axis of the base metal, and the fixed abrasive grain cutting line is in the direction of the base metal along the rotation axis. The outer peripheral surface of the base metal is wound in a spiral shape and fixed to the base metal. In this way, the grinding part is formed on the outer peripheral surface of the base metal, and the line is cut by the fixed abrasive grains adjacent in the direction of the rotation axis The recesses between them form the above-mentioned discharge grooves. Next, it is preferable that the fixed abrasive grain cutting line has a first end and a second end at both ends in the longitudinal direction, and the first end is fixed to one end of the base metal in the direction of the axis of rotation , Its second end is fixed to the other end of the base metal in the direction of the axis of rotation, and is located in the middle between the first end and the second end, and is opposite to the outer peripheral surface of the base metal. The fixed state is wound so as to be relatively movable in the direction of the rotation axis. [0008] In addition, in the grinding stone for grinding of the present invention, the workpiece facing surface of the base metal may be formed by an end surface on one end side in the direction of the rotation axis of the base metal, and the fixed abrasive grain The cutting line is fixed to the base metal on the end surface of the base metal in a spirally wound state around the above-mentioned rotating shaft. In this way, the above-mentioned grinding part is formed on the end surface of the base metal, and by The above-mentioned discharge groove is formed in the recesses between the adjacent fixed abrasive cut lines in the radial direction of the base metal. [0009] At this time, it is preferable that the fixed abrasive grain cutting line has a first end and a second end at both ends in the longitudinal direction, and the first end is at one end in the radial direction of the base metal Side is fixed, the second end is fixed on the other end side in the radial direction of the base metal, and is located in the middle part between the first end and the second end, relative to the end face of the base metal, along the The longitudinal direction of the fixed abrasive grain cutting line is intermittently fixed. [0010] In addition, the end surface of the base metal may also be engraved with a guide groove recessed in a spiral shape, and the fixed abrasive grain cutting line is arranged in the guide groove along the length direction of the guide groove. In the state in the guide groove, it is fixed to the base metal. [0011] Not only that, according to the present invention, there is provided a method for manufacturing a grinding stone for grinding, which is formed on the opposite surface of the workpiece having a base metal for the opposite surface of the workpiece. A method for manufacturing a grinding stone for grinding of a grinding part and a discharge groove for chip discharge, which is characterized by comprising: using the outer peripheral surface around the rotating shaft of the base metal as the opposite surface of the workpiece, and fixing abrasive grains on the core wire The fixed abrasive grain cutting line formed is wound spirally on the outer peripheral surface of the base metal from one end to the other end in the direction of the rotation axis, and the grinding part is formed on the outer peripheral surface, and the The step of forming the above-mentioned discharge groove between the recesses between the adjacent fixed abrasive cut lines in the direction of the rotation axis; and the step of fixing the first end and the second end of the fixed abrasive cut line in the longitudinal direction to the base metal. [0012] In addition, according to the present invention, there is provided a method for manufacturing a grinding stone for grinding, which is formed on the opposite surface of the workpiece having a base metal for the opposite surface of the workpiece to be used for grinding the workpiece. A method for manufacturing a grinding stone for grinding with a discharge groove for discharging a chip and a chip is characterized by comprising: an end surface of one end in the direction of a rotation axis of the base metal is used as the opposing surface of the workpiece, and a grinding stone is fixed to the core wire The fixed abrasive grain cutting line formed by grains is wound on the end surface of the base metal in a spiral shape around the rotating shaft, and the above-mentioned grinding portion is formed on the end surface, and is adjacent to each other in the radial direction of the end surface. The step of fixing the recesses between the fixed abrasive grain cutting lines to form the above-mentioned discharge groove; and combining the first end portion and the second end portion in the longitudinal direction of the fixed abrasive grain cutting line, and the first end portion located on the fixed abrasive grain cutting line and The step of fixing the middle part between the second end parts to the base metal. [0013] At this time, it may also include: engraving the end surface of the base metal with a "guide groove recessed in a spiral around the rotation axis"; cutting the fixed abrasive grain along the above The step of arranging the guide groove in the longitudinal direction of the guide groove. [Effects of the invention]   [0014] According to the present invention described above, by fixing the fixed abrasive cutting line to the "workpiece opposed surface of the base metal facing the workpiece", it can be placed on the base metal's workpiece opposed surface , At the same time, a grinding part for grinding the workpiece and a discharge groove for chip discharge are formed. Therefore, it is possible to provide a grinding stone for grinding that has good chip discharge properties and can improve grinding efficiency; and a method for manufacturing the grinding stone for grinding.

[0016] 第1圖~第5圖,顯示本發明之研磨用磨石的第1實施形態。該研削用磨石1A,是用來研削金屬材料和陶瓷材料等之工件W的部分,具有:具有面向工件W之工件對向面的基底金屬2;及被設在該工件對向面上之工件研削用的研削部3。當藉由該研削用磨石1A對工件W進行研削時,如第2圖所示,將該基底金屬2裝於圖面中未顯示之適當的研削裝置,相對於基底金屬2,在繞著其旋轉軸L旋轉的狀態下進行饋送(進給),進而使被設在基底金屬2之工件對向面(後述之基底金屬2的外周面2a)的研削層3接觸於工件W。   [0017] 上述基底金屬2,譬如是由不鏽鋼、鋁、燒結碳化物(Cemented Carbide)等金屬形成圓柱形、或形成圓筒狀而成為圓形剖面,在本實施形態中,上述工件對向面,是由基底金屬2之旋轉軸L周圍的圓形外周面2a所形成。此外,在該基底金屬2,如第1圖或第2圖所示,一體地設有:形成較其更小徑之圓棒狀的軸4。該軸4是由研削裝置所夾取的部分。上述基底金屬2,藉由透過該軸4而組裝於上述研削裝置,進而形成:當藉由該研削裝置的驅動力繞著軸L旋轉的同時,可朝3軸方向移動。基底金屬2及軸4的外徑、及旋轉軸L方向長度,可配合欲研削之工件的尺寸等而任意地設定。   [0018] 接著,說明本發明之特徵部分的研削部3的具體性構造。如第1圖或第2圖所示,該研削部3,是藉由以下的方式形成:後述之具有可撓性的固定研磨粒切割線10,在上述基底金屬2的外周面2a上,以沿著上述旋轉軸L方向捲繞成螺旋狀的狀態,而固定於基底金屬2。接著,露出於固定研磨粒切割線10之表面的研磨粒11成為切刃,而形成對上述工件W研削。   [0019] 如第3圖所示,就上述研削用磨石1A所使用的固定研磨粒切割線10而言,適合採用:將金剛石和立方氮化硼(cBN)等細微的上述研磨粒11,以單層狀態(單粒狀態)固定於「鋼琴線等金屬製,且具有可撓性」的芯線12所構成者。此時,研磨粒11朝向芯線12的固定,雖可藉由適當的固定方法來執行,但如同本實施形態,在「上述研磨粒11以單層狀態固定於芯線12上」的場合中,由於並不會產生該研磨粒11的自發銳化(self-sharpening)效果,因此一旦研磨粒11脫落,將導致脫落部分的切削性鈍化。   [0020] 有鑑於此,在本實施形態中,藉由採用「使用鎳、銅等結合材之電沉積(electrodeposition)所形成的金屬電鍍層13」來固定上述研磨粒11,而提高該研磨粒11對芯線12的保持力。因此,得以盡可能地抑制研磨粒11從芯線12的脫落,並抑制固定研磨粒切割線10,亦即研削部3的劣化,能降低研削用磨石1A和固定研磨粒切割線10的更換頻率。   [0021] 在本實施形態中,上述研削部3,是藉由以下的方式構成:相對於基底金屬2的外周面2a,將1條上述固定研磨粒切割線10,以沿著旋轉軸L方向的方式,從該基底金屬2的一端側朝向另一端側連續地捲繞一層(單層)。如此一來,一旦相對於基底金屬2將固定研磨粒切割線10捲繞成單層的螺旋狀,由於芯線12的剖面,亦即固定研磨粒切割線10的剖面為略圓形,如第3圖~第5圖所示,在基底金屬2的外周面2a上,在上述旋轉軸L方向上彼此鄰接的固定研磨粒切割線10、10之間,形成有凹部5。   [0022] 該凹部5,是由相鄰的固定研磨粒切割線10、10之間的谷狀空間所形成的部分,沿著基底金屬2的上述旋轉軸L方向,從一端側連續至另一端側形成螺旋狀。上述凹部5,當工件W的研削加工時,與固定研磨粒切割線10之外周面上相鄰之研磨粒11、11間的屑穴14相同,可作為「提高工件W的切屑之排出性的排出溝」發揮作用。   [0023] 上述固定研磨粒切割線10的捲繞節距雖為任意,但在本實施形態中,該固定研磨粒切割線10,是以下述的狀態,緊密捲繞於基底金屬2的外周面2a上(請參考第3圖~第5圖):在旋轉軸L方向上相鄰的固定研磨粒切割線10、10之間,其中一個固定研磨粒切割線10之研磨粒11的前端部(刃尖部)接觸於另一個固定研磨粒切割線10的狀態,亦即形成「大約研磨粒11的平均研磨粒徑」或者「研磨粒11從金屬電鍍層13突出量」程度之間隙的狀態。   [0024] 上述固定研磨粒切割線10,在其長度方向(芯線12的長度方向)的兩端,分別具有第1端部與第2端部。然後,如第4圖所示,該固定研磨粒切割線10的第1端部10a,被固定於基底金屬2之外周面2a中旋轉軸L方向的其中一端側(亦即,外周面2a中軸4所連結的基端部),如第5圖所示,該固定研磨粒切割線10的第2端部10b,被固定於上述外周面2a的另一端側(在旋轉軸L方向中,位於上述基端部之相反側的前端部側)。   [0025] 其中,位於這些第1端部10a與第2端部10b之間的固定研磨粒切割線10的中間部10c,相對於上述基底金屬2的外周面2a,以非固定狀態形成捲繞,其結果,該中間部10c,相對於上述外周面2a形成可相對移動。亦即,由於該固定研磨粒切割線10的中間部10c,相對於基底金屬2並未形成固定,故形成可藉由切削抵抗等,在上述基底金屬2的外周面2a上,朝旋轉軸L方向和周方向些微地位移,或繞著該固定研磨粒切割線10的中心軸些微地振動。   [0026] 第4圖中的15,是相對於基底金屬2,利用軟焊(soldering)、硬焊(brazing)、或者焊接等固定手段來固定上述固定研磨粒切割線10的第1端部10a所形成的固定部,此外,第5圖中的16,同樣是相對於基底金屬2,以上述固定手段來固定上述固定研磨粒切割線10之第2端部10b所形成的固定部。   [0027] 在採用上述研削用磨石1A來研削工件的場合中,如以上所述,是將研削用磨石1A,透過與基底金屬2設成一體的軸4而組裝於研削裝置,並藉由研削裝置,設定關於研削用磨石1A的饋送(進給)速度和轉數、對工件W的切入量等的各種研削條件。然後,設定研削條件後,使研削用磨石1A在繞著上述旋轉軸L旋轉的狀態下朝向工件W饋送(進給)。一旦如此,工件W與基底金屬2的工件對向面、亦即由「在基底金屬2的外周面2a捲繞成螺旋狀的固定研磨粒切割線10」所形成的研削部3接觸,並由露出於該固定研磨粒切割線10表面的研磨粒11,朝上述饋送(進給)方向緩緩地研削該工件W。此時,利用該研削用磨石1A的研削加工,雖然期待是不使用研削液的乾式加工,但當然能因應於加工條件而使用研削液進行加工。   [0028] 研削時所產生的切屑,進入固定研磨粒切割線10的上述屑穴14內,並進入「形成於旋轉軸L方向上相鄰之該固定研磨粒切割線10、10之間,作為切屑之排出溝」的凹部5。然後,進入該凹部5的切屑,藉由研削用磨石1A的旋轉而朝外部排出。此時,由於上述固定研磨粒切割線10沿著旋轉軸L以大致一致的間隔捲繞於基底金屬2的外周面2a,因此,延伸設置於基底金屬2之周方向的上述凹部5,也成為以大致一致的間隔配置於研削用磨石1A之旋轉軸L方向的狀態。因此,無論在研削部3的哪一個位置,相對於工件W,上述凹部5皆能一致地形成對峙,如此一來,能有效率地執行切屑的排出。   [0029] 此外,研削工件W時,雖然在固定研磨粒切割線10產生研削抵抗,但如以上所述,該固定研磨粒切割線10,在位於其第1端部10a與第2端部10b之間的中間部10c,相對於基底金屬2以非固定狀態捲繞成可相對移動,而成為:可藉由該研削抵抗,在基底金屬2的外周面2a上,些微地形成往復移動等的位移、或者形成搖動。因此,舉例來說,即使工件W是由軟質材料等容易堵塞的材料所形成,其切屑也能從凹部5振落而有效率地排出。   [0030] 接著,說明製造上述研削用磨石1A的步驟。首先,如以上所述,準備由不鏽鋼、鋁、燒結碳化物等金屬素材所形成,在旋轉軸L周圍具有外周面2a的基底金屬2;及將由金剛石和cBN所形成的細微研磨粒11,固定於「由鋼琴線等金屬素材形成的芯線12」所構成之長條狀的固定研磨粒切割線10。接著,進入以下的步驟:藉由將固定研磨粒切割線10捲繞於上述基底金屬2的外周面2a,而形成用來研削工件W的研削部3、及切屑排出用的凹部5(排出溝)。   [0031] 在該步驟中,在對上述固定研磨粒切割線10賦予預定張力的狀態下,將該固定研磨粒切割線10,以沿著上述旋轉軸L方向緊密纏繞的狀態,在基底金屬2的外周面2a上捲繞成螺旋狀。然後,藉由將該固定研磨粒切割線10從基底金屬2之旋轉軸L方向的一端側到另一端側連續且緊密地捲繞,進而在基底金屬2的外周面2a,形成由一層固定研磨粒切割線10所構成的研削部3。此外,與此同時,在旋轉軸L方向相鄰的固定研磨粒切割線10、10間,形成切屑排出用的凹部5(排出溝)。就將固定研磨粒切割線10捲繞於基底金屬2的方法而言,舉例來說,能藉由採用特定的捲線機等來執行。   [0032] 接著,藉由將捲繞於基底金屬2之固定研磨粒切割線10的兩端切斷等,在其長度方向(芯線12方向)的兩端形成第1端部及第2端部,利用軟焊、硬焊、焊接等適當的固定方法,將該第1端部10a固定於基底金屬2之旋轉軸L方向的一端側。此外,與該第1端部10a相同,將該固定研磨粒切割線10的第2端部10b,固定於該基底金屬2之旋轉軸L方向的另一端側。其結果,可獲得本實施形態中的上述研削用磨石1A。   [0033] 此外,當卸下已組裝於基底金屬2的固定研磨粒切割線10時,舉例來說,在採用上述軟焊等固定手段的場合中,可藉由對該固定部分施以雷射加熱等適當的方法卸下。   當製造上述研削用磨石1A時,舉例來說,亦可在將固定研磨粒切割線10捲繞於基底金屬2之前,藉由切斷等形成該固定研磨粒切割線10的第1端部10a,並將其固定於基底金屬2的一端側,然後將該固定研磨粒切割線10從基底金屬2的一端側朝另一端側螺旋捲繞之後,藉由切斷等形成該固定研磨粒切割線10的第2端部10b,再將其固定於基底金屬2的另一端側。   [0034] 如此一來,在第1實施形態中,藉由將「在芯線12固定有研磨粒11的固定研磨粒切割線10」,在基底金屬2的外周面2a,以沿著其旋轉軸L方向捲繞成螺旋狀的狀態,固定於基底金屬2,而形成工件W研削用的研削部3,此外,與此同時,在旋轉軸L方向上相鄰的固定研磨粒切割線10、10之間,也形成切屑排出用的凹部5(排出溝)。因此,能以高生產性且低成本,提供可藉由良好的切屑排出性而抑制磨石的堵塞,具有良好研磨效率的研削用磨石1A。   [0035] 當研削用磨石1A的切削性下降時,只要從基底金屬2卸下經使用的固定研磨粒切割線10,並將新的固定研磨粒切割線10再度捲繞固定於基底金屬2,便能不廢棄基底金屬2地再利用,藉由前述的方式,也能抑制研削用磨石1A的運用成本。   [0036] 雖然上述基底金屬2構成「透過軸4組裝於研削裝置」,但本發明並不侷限於此,亦可如同平面磨石(straight grinding wheel)般,為具有貫穿厚度方向之組裝孔的基底金屬,透過上述組裝孔而安裝於研削裝置之心軸等的態樣。此外,在第2圖中,雖顯示了上述研削用磨石1A用於平面研削加工的例子,但本發明並不侷限於此,舉例來說,亦可用於圓筒研削加工和內面研削加工。不僅如此,雖然在上述實施形態中,固定研磨粒切割線10是在第1端部10a及第2端部10b的2個位置固定於基底金屬2的外周面2a,但除此之外,亦可以包含「捲繞於基底金屬2之該固定研磨粒切割線10的中央部」等之3處以上的位置固定於基底金屬2。   [0037] 第6圖~第9圖,是顯示本發明中研削用磨石之第2實施形態的圖,該第2實施形態的研削用磨石1B與上述第1實施形態的研削用磨石1A的差異之處在於:將基底金屬2之面向工件W的工件對向面,作為「被配置於該基底金屬2之旋轉軸L方向其中一方側(在旋轉軸L方向上,位在上述軸4之相反側的前端部側),且形成略圓形」的端面2b,並在該端面2b上設有工件研削用的研削部3、及切屑排出用的凹部5。該第2實施形態的研削用磨石1B,主要是執行拋光加工(lapping)時所使用,將繞著旋轉軸L旋轉之基底金屬2的端面2b側按壓於工件W,由設於該端面2b的研削部3使工件W表面形成平滑化。   上述以外的構造,由於實質上與第1實施形態的研削用磨石1A相同,故兩者之主要的相同構造部分,標示與第1實施形態之研削用磨石1A相同的圖號,而這些構造部分、及基於該構造部分的作用效果,為了避免重複記載,因此省略。   [0038] 如第6圖或第7圖所示,基底金屬2的上述端面2b一樣形成平坦的表面,上述固定研磨粒切割線10以「在上述旋轉軸L周圍捲繞成渦卷狀」的狀態,固定於在該端面2b上。藉此,在基底金屬2的端面2b上,形成有上述研削部3,並且在基底金屬2的徑向相鄰的固定研磨粒切割線10、10間,形成切屑排出用的上述凹部5。此時,對於朝上述基底金屬2之徑向捲繞的節距、捲繞的圈數和固定研磨粒切割線10等雖為任意,但在本實施形態中,是採用1條固定研磨粒切割線10,將其在上述端面2b上,從外周緣附近朝向中央位置緊密地捲繞成渦卷狀。   [0039] 如第6圖及第8圖、第9圖所示,在該研削用磨石1B,上述固定研磨粒切割線10的上述第1端部10a,被固定於上述基底金屬2之端面2a的外周緣側,該固定研磨粒切割線10的第2端部10b,被固定於上述端面2b的略中央位置。另外,位於這些第1端部10a與第2端部10b之間的中間部10c,相對於上述端面2b,沿著上述固定研磨粒切割線10的長度方向,具有特定間隔地間歇固定。據此,該中間部10c,沿著上述長度方向交互地具有:被固定於基底金屬2之端面2b的固定部17;及未固定於該基底金屬2之端面2b的非固定部分(請參考第8圖、第9圖)。其結果構成:藉由工件W之研削加工時的切削抵抗等,使上述非固定部分在上述基底金屬2的端面2b上形成位移或者搖動。   [0040] 就固定研磨粒切割線10對基底金屬2的固定手段而言,與第1實施形態相同,藉由軟焊、硬焊、焊接等所執行,在本實施形態中,舉例來說,如同在第7圖中以圖號17所示,該固定研磨粒切割線10,是利用電阻焊接(resistance welding)、雷射焊接、電弧焊接之類的點焊而形成點接合。在第7圖所示例子中,固定研磨粒切割線10的各固定部17,雖位於基底金屬2的徑向內側,但亦可位於徑向外側。   此外,第8圖中的15,是相對於基底金屬2的端面2b,將固定研磨粒切割線10的第1端部10a,在端面2b的外周緣附近的位置利用上述固定手段予以固定而形成的固定部,第9圖中的16,是相對於該端面2b,將第2端部10b,在端面2b的略中心位置以上述固定手段予以固定而形成的固定部。   [0041] 在製造該第2實施形態之研削用磨石1B的場合中,準備上述基底金屬2與上述固定研磨粒切割線10,將上述固定研磨粒切割線10,在基底金屬2的端面2b上,繞著上述旋轉軸L緊密地捲繞成渦卷狀,並固定於該端面2b。在此,當捲繞上述固定研磨粒切割線10時,譬如,是將固定研磨粒切割線10,從基底金屬2的外周緣側朝向中心側捲繞複數圈。在該場合中,首先,將該固定研磨粒切割線10的捲繞起始端側(第1端部10a側),相對於上述基底金屬,在端面2b的外周緣附近位置,以上述點焊等的固定手段予以固定。然後,將該固定研磨粒切割線10朝向上述端面2b的中心捲繞成渦卷狀,並沿著該固定研磨粒切割線10的長度方向,保持特定間隔地固定於基底金屬2。依序反覆地執行上述動作,最終,在基底金屬2之端面2b的略中央位置(旋轉軸L附近),將固定研磨粒切割線10的捲繞終端側(第2端部2b側)固定於該基底金屬2。接著,對固定研磨粒切割線10之捲繞起始側與捲繞終端側的剩餘部分施以切斷等。   [0042] 如此一來,可獲得:相對於上述基底金屬2的端面2b,上述固定研磨粒切割線10被固定成渦卷狀,並且在基底金屬2之徑向鄰接的固定研磨粒切割線10、10之間,形成切屑排出用之凹部5的研削用磨石1B。   也可以在固定研磨粒切割線10的固定步驟之前,將該固定研磨粒切割線10的兩端切斷而預先形成第1端部10a與第2端部10b,並如以上所述,將其在基底金屬2的端面2b上捲繞並固定於該端面2b。此外,雖然在上述的說明中,是將固定研磨粒切割線10,從基底金屬的外周緣側朝向中心捲繞,但當然也能採相反的作法,從中心側朝向外周緣側捲繞,或亦可將固定研磨粒切割線10從基底金屬2的徑向外側依序焊接。   [0043] 第10圖~第13圖,為顯示本發明之第3實施形態的圖。   該第3實施形態的研削用磨石1C與第2實施形態的研削用磨石1B的差異之處在於:在成為「面向工件W之工件對向面」的上述端面2b,將旋轉軸L作為中心,設有凹設成略渦卷狀的導引溝20,並在該導引溝20內,以沿著該導引溝20捲繞成渦卷狀的狀態配設上述固定研磨粒切割線10,並在該狀態下,在導引溝20內固定於基底金屬。   [0044] 上述渦卷狀的導引溝20,從基底金屬2之端面2b的外周緣附近朝向中央部分無間斷地連續。此外,如第11圖所示,上述導引溝20,具有略呈矩形的橫剖面形狀,其溝寬度形成稍大於上述固定研磨粒切割線10的直徑,其溝深度形成較上述固定研磨粒切割線10直徑更淺。據此,一旦沿著該導引溝20的長度方向將固定研磨粒切割線10收容於該導引溝20內,則如第11圖所示,該固定研磨粒切割線10之略呈弧狀的表面,從上述基底金屬2的端面2b突出,可藉由突出的固定研磨粒切割線10,對上述工件W進行研削。   [0045] 接著,如第11圖所示,在該第3實施形態的研削用磨石1C中,在基底金屬2之徑向鄰接的固定研磨粒切割線10、10之間,形成有切屑排出用的凹部5。   此外,決定凹部5之寬度的固定研磨粒切割線10、10的捲繞節距,實際上對應於在基底金屬2之徑向鄰接的導引溝20的徑向節距,在該第3實施形態中,上述導引溝20的捲繞節距被設定成:在已將固定研磨粒切割線10收容於該導引溝20內的狀態下,相鄰之該固定研磨粒切割線10、10的研磨粒11分離成彼此不會形成接觸的程度。   [0046] 就固定研磨粒切割線10的固定手段而言,在該第3實施形態中,使用樹脂系黏接劑。接著,藉由該黏接劑,如第12圖或第13圖所示,上述固定研磨粒切割線10的第1端部10a,固定在導引溝20之長度方向一端側(最外周側)的溝端部20a的位置,第2端部10b,固定在導引溝20之長度方向的另一端側(中心側)之溝端部20b的位置。另外,固定研磨粒切割線的中間部10c,在上述導引溝20內,沿著該固定研磨粒切割線10的長度方向,間歇地固定於基底金屬2。   [0047] 就上述黏接劑而言,舉例來說,藉由採用「當已硬化時,形成對變形具有仿效性之柔軟黏接劑層」者,而構成:於工件W的研削加工等時,藉由其接觸抵抗等,使固定研磨粒切割線10的上述固定部15~17,在被固定於上述端面2b的狀態下,在該端面2b上形成些微的位移。   此外,雖然在第11圖所示的例子中,固定研磨粒切割線10,是在上述導引溝20的溝底以非接觸狀態固定於基底金屬2,但亦能以「抵接於該溝底的狀態」在該導引溝20內固定。   [0048] 說明製造該第3實施形態所示之研削用磨石1C的步驟。   在製造該研削用磨石1C的場合中,在將上述固定研磨粒切割線10固定於基底金屬2之前,首先,在基底金屬2的端面2b,刻設「繞著該基底金屬2的旋轉軸L呈渦卷狀的導引溝20」。該導引溝20的形成步驟,譬如是利用雷射加工機等所執行,藉此,具有適當溝寬及溝深度之渦卷狀的溝,以特定的捲繞節距形成。在此之後,對導引溝20內之「位於最外周側之一端側的溝端部20a」及「位於最內周側之另一端側的溝端部20b」充填樹脂系的黏接劑,並在前述兩端部20a、20b間,沿著該導引溝20之長度方向並保持特定的間隔,間歇地充填黏接劑。藉此,在導引溝20內已充填了上述黏接劑的部分,形成黏接劑層(固定層15~17的部分)。然後,進入以下說明的固定步驟,此時,在上述黏接劑層尚未完全硬化之前,將上述固定研磨粒切割線10,沿著導引溝20的長度方向,配置於該導引溝20內。   [0049] 在此,雖然採用「形成對應於導引溝長度的長度,並預先具有第1端部10a與第2端部10b」的固定研磨粒切割線10,當然也能如「第2實施形態之研削用磨石1B的製造步驟」所述,在將長條狀的固定研磨粒切割線10固定於基底金屬2(導引溝20內)後,將該固定研磨粒切割線10的兩端切斷,而形成第1端部10a及第2端部10b。   [0050] 在該固定研磨粒切割線10對基底金屬2的固定步驟中,舉例來說,如第12圖所示,使該固定研磨粒切割線10的第1端部10a與導引溝20其中一端側的溝端部20a略呈一致,在該狀態下將該固定研磨粒切割線10沿著上述導引溝20的長度方向捲繞成渦卷狀,然後,如第13圖所示,將該固定研磨粒切割線10的第2端部10b配置成與導引溝20之另一側的溝端部20b略呈一致。如此一來,可獲得:相對於上述基底金屬2的端面2b,上述固定研磨粒切割線10被固定成渦卷狀,並且在基底金屬2之徑向鄰接的固定研磨粒切割線10、10之間,形成切屑排出用之凹部5的研削用磨石1C。   [0051] 雖然在該第3實施形態中,上述導引溝20是利用雷射加工機所形成,但亦可利用譬如切削工具等切刃加以切削形成。此外,針對導引溝20的橫剖面形狀,只要能將固定研磨粒切割線10的一部分收容於該導引溝20內,並使該固定研磨粒切割線10之外周面的局部朝外部突出,也可以是譬如具有「略呈圓形的橫剖面」、和「略呈V字型的橫剖面」的橫剖面形狀。   [0052] 以上,針對本發明的研削用磨石及其製造方法進行了說明,但是本發明並不侷限於上述實施形態,在不脫離申請專利範圍之主旨的範圍内,當然能有各式各樣的設計變更。[0016] Figures 1 to 5 show the first embodiment of the polishing grindstone of the present invention. The grinding stone 1A for grinding is used to grind the part of the workpiece W such as metal materials and ceramic materials, and has: a base metal 2 having a workpiece opposite surface facing the workpiece W; and a workpiece opposite to the workpiece Grinding part 3 for workpiece grinding. When the workpiece W is ground by the grinding grindstone 1A, as shown in Figure 2, the base metal 2 is mounted on an appropriate grinding device not shown in the figure, and the base metal 2 is around Feeding (feeding) is performed while the rotation axis L is rotating, and the grinding layer 3 provided on the workpiece facing surface of the base metal 2 (the outer peripheral surface 2a of the base metal 2 described later) is brought into contact with the workpiece W. [0017] The base metal 2, for example, is made of metal such as stainless steel, aluminum, cemented carbide (Cemented Carbide), etc., formed into a cylindrical shape, or formed into a cylindrical shape to have a circular cross-section. In the present embodiment, the workpiece facing surface , Is formed by the circular outer peripheral surface 2a around the rotation axis L of the base metal 2. In addition, as shown in Fig. 1 or Fig. 2, the base metal 2 is integrally provided with a rod-shaped shaft 4 having a smaller diameter. The shaft 4 is the part clamped by the grinding device. The base metal 2 is assembled to the grinding device through the shaft 4, so that it can move in the three-axis direction while rotating around the axis L by the driving force of the grinding device. The outer diameter of the base metal 2 and the shaft 4, and the length in the direction of the rotation axis L can be arbitrarily set according to the size of the workpiece to be ground.  [0018] Next, the specific structure of the grinding section 3 of the characteristic part of the present invention will be described. As shown in Fig. 1 or Fig. 2, the grinding portion 3 is formed by the following method: a flexible fixed abrasive grain cutting line 10 described later is formed on the outer peripheral surface 2a of the base metal 2 It is wound into a spiral state along the rotation axis L direction, and is fixed to the base metal 2. Next, the abrasive grain 11 exposed on the surface of the fixed abrasive grain cutting line 10 becomes a cutting edge, and the workpiece W is ground. [0019] As shown in FIG. 3, for the fixed abrasive grain cutting line 10 used for the grinding stone 1A, it is suitable to use the fine abrasive grains 11 such as diamond and cubic boron nitride (cBN), In a single-layer state (single-grain state), it is fixed to a flexible core wire 12 made of metal such as a piano wire. At this time, the fixing of the abrasive grains 11 toward the core wire 12 can be performed by an appropriate fixing method, but like this embodiment, in the case where the abrasive grains 11 are fixed to the core wire 12 in a single layer state, because The self-sharpening effect of the abrasive grains 11 is not produced. Therefore, once the abrasive grains 11 fall off, the machinability of the fallen off part will be dull. [0020] In view of this, in the present embodiment, the above-mentioned abrasive grains 11 are fixed by using a metal plating layer 13 formed by electrodeposition using a bonding material such as nickel, copper, etc., thereby improving the abrasive grains. 11 the holding power of the core wire 12. Therefore, it is possible to prevent the abrasive grains 11 from falling off from the core wire 12 as much as possible, and to suppress the deterioration of the fixed abrasive grain cutting line 10, that is, the grinding portion 3, and it is possible to reduce the frequency of replacement of the grinding grindstone 1A and the fixed abrasive grain cutting line 10 . [0021] In this embodiment, the grinding portion 3 is configured by cutting one fixed abrasive grain cutting line 10 with respect to the outer peripheral surface 2a of the base metal 2 along the direction of the rotation axis L In the method, one layer (single layer) is continuously wound from one end side of the base metal 2 toward the other end side. In this way, once the fixed abrasive grain cutting line 10 is wound into a single-layer spiral with respect to the base metal 2, the cross section of the core wire 12, that is, the cross section of the fixed abrasive grain cutting line 10 is slightly circular, as shown in the third As shown in FIGS. 5 to 5, on the outer peripheral surface 2a of the base metal 2, a recess 5 is formed between the fixed abrasive grain cutting lines 10, 10 adjacent to each other in the direction of the rotation axis L. [0022] The concave portion 5 is a portion formed by the valley-shaped space between the adjacent fixed abrasive grain cutting lines 10, 10, and is continuous from one end to the other along the direction of the rotation axis L of the base metal 2. The sides form a spiral shape. The above-mentioned recess 5 is the same as the chip cavity 14 between the adjacent abrasive grains 11 and 11 on the outer peripheral surface of the fixed abrasive grain cutting line 10 during the grinding process of the workpiece W, and can be used as an "improving chip discharge performance of the workpiece W" Drainage ditch will work. [0023] Although the winding pitch of the above-mentioned fixed abrasive grain cutting line 10 is arbitrary, in this embodiment, the fixed abrasive grain cutting line 10 is tightly wound on the outer peripheral surface of the base metal 2 in the following state On 2a (please refer to Figures 3 to 5): Between adjacent fixed abrasive grain cutting lines 10 and 10 in the direction of the rotation axis L, the tip of the abrasive grain 11 of one of the fixed abrasive grain cutting lines 10 ( The blade tip portion) is in contact with another fixed abrasive grain cutting line 10, that is, a state where a gap of "approximately the average abrasive particle size of the abrasive grains 11" or "the protruding amount of the abrasive grains 11 from the metal plating layer 13" is formed.  [0024] The fixed abrasive grain cutting wire 10 has a first end and a second end at both ends in the longitudinal direction (the longitudinal direction of the core wire 12). Then, as shown in Fig. 4, the first end portion 10a of the fixed abrasive grain cutting line 10 is fixed to one end side of the outer peripheral surface 2a of the base metal 2 in the direction of the rotation axis L (that is, the central axis of the outer peripheral surface 2a 4), as shown in Figure 5, the second end 10b of the fixed abrasive grain cutting line 10 is fixed to the other end of the outer peripheral surface 2a (in the direction of the rotation axis L, located The distal end side opposite to the above-mentioned base end). [0025] Among them, the intermediate portion 10c of the fixed abrasive grain cutting line 10 located between the first end portion 10a and the second end portion 10b is wound in a non-fixed state with respect to the outer peripheral surface 2a of the base metal 2. As a result, the intermediate portion 10c is formed to be relatively movable with respect to the outer peripheral surface 2a. That is, since the intermediate portion 10c of the fixed abrasive grain cutting line 10 is not fixed to the base metal 2, it is formed to be able to face the rotation axis L on the outer peripheral surface 2a of the base metal 2 by cutting resistance or the like. The direction and the circumferential direction are slightly displaced, or the fixed abrasive grain cutting line 10 is slightly vibrated around the central axis. [0026] 15 in FIG. 4 is the first end 10a of the fixed abrasive grain cutting line 10 to be fixed to the base metal 2 by a fixing means such as soldering, brazing, or welding. The formed fixing portion, 16 in FIG. 5, is also a fixing portion formed by fixing the second end 10b of the fixed abrasive grain cutting line 10 to the base metal 2 by the fixing means. [0027] In the case of using the grinding stone 1A for grinding to grind the workpiece, as described above, the grinding stone 1A for grinding is assembled in the grinding device through the shaft 4 integrated with the base metal 2, and The grinding device sets various grinding conditions regarding the feeding (feeding) speed and number of revolutions of the grinding stone 1A for grinding, the amount of cutting into the workpiece W, and the like. Then, after setting the grinding conditions, the grinding stone 1A for grinding is fed (feeded) toward the workpiece W while rotating around the above-mentioned rotation axis L. Once so, the workpiece W comes into contact with the workpiece facing surface of the base metal 2, that is, the grinding portion 3 formed by the “fixed abrasive grain cutting line 10 wound spirally on the outer peripheral surface 2a of the base metal 2, and is The abrasive grains 11 exposed on the surface of the fixed abrasive grain cutting line 10 slowly grind the workpiece W in the above-mentioned feeding (feeding) direction. At this time, the grinding process using the grinding stone 1A for grinding is expected to be dry processing without using a grinding fluid, but it is of course possible to perform processing using a grinding fluid in accordance with the processing conditions. [0028] The chips generated during grinding enter the above-mentioned chip cavity 14 of the fixed abrasive grain cutting line 10, and enter "formed between the fixed abrasive grain cutting lines 10, 10 adjacent to each other in the direction of the rotation axis L, as The recess 5 of the chip discharge groove. Then, the chips that have entered the recess 5 are discharged to the outside by the rotation of the grinding stone 1A for grinding. At this time, since the fixed abrasive grain cutting line 10 is wound on the outer peripheral surface 2a of the base metal 2 at substantially uniform intervals along the rotation axis L, the recesses 5 extending in the circumferential direction of the base metal 2 also become It is arrange|positioned in the state of the rotation axis L direction of 1 A of grinding grindstones at substantially uniform intervals. Therefore, regardless of the position of the grinding portion 3, the concave portion 5 can be uniformly opposed to the workpiece W, so that the discharge of chips can be performed efficiently. [0029] In addition, when grinding the workpiece W, although grinding resistance is generated at the fixed abrasive cutting line 10, as described above, the fixed abrasive cutting line 10 is located at the first end 10a and the second end 10b. The intermediate portion 10c between the base metal 2 is wound in a non-fixed state to be relatively movable, so that the grinding resistance can slightly form a reciprocating motion on the outer peripheral surface 2a of the base metal 2 Displacement, or shake. Therefore, for example, even if the workpiece W is formed of a material that is easily clogged, such as a soft material, the chips can be shaken down from the recess 5 and efficiently discharged.  [0030] Next, a procedure for manufacturing the above-mentioned grinding stone 1A for grinding will be described. First, as described above, prepare the base metal 2 formed of metal materials such as stainless steel, aluminum, cemented carbide, and having an outer peripheral surface 2a around the rotating shaft L; and fix the fine abrasive grains 11 formed of diamond and cBN It is a long strip of fixed abrasive grain cutting line 10 composed of a "core wire 12" formed of metal materials such as piano wire. Next, proceed to the following step: by winding the fixed abrasive grain cutting line 10 on the outer peripheral surface 2a of the base metal 2, the grinding portion 3 for grinding the workpiece W and the recess 5 (discharge groove) for discharging chips are formed. ). [0031] In this step, in a state where a predetermined tension is applied to the fixed abrasive grain cutting line 10, the fixed abrasive grain cutting line 10 is tightly wound along the direction of the rotation axis L on the base metal 2. The outer peripheral surface 2a is wound into a spiral shape. Then, the fixed abrasive grain cutting line 10 is continuously and tightly wound from one end of the base metal 2 in the direction of the rotation axis L to the other end, and then a layer of fixed abrasive is formed on the outer peripheral surface 2a of the base metal 2. The grinding part 3 constituted by the particle cutting line 10. In addition, at the same time, a recess 5 (discharge groove) for discharging chips is formed between the fixed abrasive grain cutting lines 10 and 10 adjacent in the direction of the rotation axis L. The method of winding the fixed abrasive grain cutting wire 10 on the base metal 2, for example, can be performed by using a specific wire winding machine or the like. [0032] Next, by cutting both ends of the fixed abrasive grain cutting wire 10 wound around the base metal 2, a first end and a second end are formed at both ends in the longitudinal direction (the core wire 12 direction). , The first end portion 10a is fixed to one end side of the base metal 2 in the direction of the rotation axis L by an appropriate fixing method such as soldering, brazing, or welding. In addition, similarly to the first end 10a, the second end 10b of the fixed abrasive grain cutting line 10 is fixed to the other end of the base metal 2 in the direction of the rotation axis L. As a result, the grinding stone 1A for grinding in this embodiment can be obtained. [0033] In addition, when the fixed abrasive grain cutting line 10 assembled in the base metal 2 is removed, for example, in the case where the above-mentioned fixing means such as soldering is used, the fixed part can be lasered. Remove by appropriate methods such as heating. When manufacturing the above-mentioned grinding stone 1A, for example, the first end portion of the fixed abrasive cutting line 10 may be formed by cutting or the like before winding the fixed abrasive cutting line 10 around the base metal 2. 10a, and fix it to one end of the base metal 2, and then spirally wind the fixed abrasive grain cutting line 10 from one end of the base metal 2 to the other end, and then form the fixed abrasive cut by cutting or the like The second end 10b of the wire 10 is fixed to the other end of the base metal 2. [0034] In this way, in the first embodiment, by placing the "fixed abrasive grain cutting line 10 with the abrasive grains 11 fixed on the core wire 12" on the outer peripheral surface 2a of the base metal 2 along its rotation axis The state is wound in a spiral shape in the L direction and fixed to the base metal 2 to form the grinding portion 3 for grinding the workpiece W. In addition, at the same time, the fixed abrasive grain cutting lines 10, 10 adjacent in the rotation axis L direction In between, a recess 5 (discharge groove) for chip discharge is also formed. Therefore, it is possible to provide the grinding grindstone 1A for grinding which can suppress the clogging of the grindstone due to the good chip discharge performance and has good grinding efficiency with high productivity and low cost. [0035] When the machinability of the grinding grindstone 1A for grinding decreases, simply remove the used fixed abrasive grain cutting wire 10 from the base metal 2, and rewind and fix the new fixed abrasive grain cutting wire 10 to the base metal 2. Therefore, the base metal 2 can be reused without discarding, and the operating cost of the grinding stone 1A for grinding can also be suppressed by the aforementioned method. [0036] Although the above-mentioned base metal 2 constitutes "Assembled in the grinding device through the shaft 4", the present invention is not limited to this. It may be a straight grinding wheel with assembling holes passing through the thickness direction. The base metal is installed on the spindle of the grinding device through the above-mentioned assembly hole. In addition, in Fig. 2, although the above-mentioned grinding stone 1A for grinding is shown as an example for flat grinding, the present invention is not limited to this. For example, it can also be used for cylindrical grinding and inner surface grinding. . Not only that, although in the above embodiment, the fixed abrasive grain cutting line 10 is fixed to the outer circumferential surface 2a of the base metal 2 at two positions of the first end 10a and the second end 10b, but in addition, It may be fixed to the base metal 2 at three or more positions including "the central part of the fixed abrasive grain cutting line 10 wound around the base metal 2". [0037] Figures 6 to 9 are diagrams showing the second embodiment of the grinding stone for grinding in the present invention, the grinding stone 1B of the second embodiment and the grinding stone of the first embodiment described above The difference of 1A is that the workpiece facing surface of the base metal 2 facing the workpiece W is arranged on one side of the base metal 2 in the direction of the rotation axis L (in the direction of the rotation axis L, located on the above axis 4), and a slightly rounded end surface 2b is formed, and a grinding portion 3 for workpiece grinding and a recess 5 for chip discharge are provided on the end surface 2b. The grinding stone 1B of the second embodiment is mainly used for lapping. The end surface 2b side of the base metal 2 that rotates about the rotation axis L is pressed against the workpiece W, and is set on the end surface 2b. The grinding part 3 smoothes the surface of the workpiece W. Since the structure other than the above is substantially the same as the grinding stone 1A of the first embodiment, the main parts of the same structure are marked with the same drawing numbers as the grinding stone 1A of the first embodiment. The structural parts and the effects based on the structural parts are omitted in order to avoid repetitive description. [0038] As shown in FIG. 6 or FIG. 7, the end surface 2b of the base metal 2 forms a flat surface, and the fixed abrasive grain cutting line 10 is "wound in a scroll shape around the rotation axis L". The state is fixed to the end surface 2b. Thereby, the grinding part 3 is formed on the end surface 2b of the base metal 2, and the recess 5 for chip discharge is formed between the fixed abrasive cutting lines 10 and 10 adjacent to the radial direction of the base metal 2. At this time, the pitch of the winding in the radial direction of the base metal 2, the number of windings, and the fixed abrasive grain cutting line 10 are arbitrary, but in this embodiment, a fixed abrasive grain is used for cutting The wire 10 is wound tightly in a spiral shape on the aforementioned end surface 2b from the vicinity of the outer peripheral edge toward the center position. [0039] As shown in FIGS. 6 and 8 and 9, in the grinding stone 1B, the first end portion 10a of the fixed abrasive grain cutting line 10 is fixed to the end surface of the base metal 2. On the outer peripheral edge side of 2a, the second end 10b of the fixed abrasive grain cutting line 10 is fixed to a substantially central position of the end surface 2b. In addition, the intermediate portion 10c located between the first end portion 10a and the second end portion 10b is intermittently fixed with a predetermined interval along the longitudinal direction of the fixed abrasive grain cutting line 10 with respect to the end surface 2b. Accordingly, the intermediate portion 10c alternately has a fixed portion 17 fixed to the end surface 2b of the base metal 2 along the aforementioned longitudinal direction; and a non-fixed portion not fixed to the end surface 2b of the base metal 2 (please refer to Figure 8, Figure 9). As a result, the non-fixed portion is displaced or shaken on the end surface 2b of the base metal 2 due to the cutting resistance during the grinding process of the workpiece W. [0040] With regard to the means for fixing the abrasive grain cutting line 10 to the base metal 2, the method is performed by soldering, brazing, welding, etc., as in the first embodiment. In this embodiment, for example, As shown in Fig. 7 with Fig. 17, the fixed abrasive grain cutting line 10 is spot welded by spot welding such as resistance welding, laser welding, and arc welding. In the example shown in FIG. 7, each fixing portion 17 for fixing the abrasive grain cutting line 10 is located on the radially inner side of the base metal 2, but may be located on the radially outer side. In addition, 15 in Figure 8 is formed by fixing the first end portion 10a of the fixed abrasive grain cutting line 10 with respect to the end surface 2b of the base metal 2 at a position near the outer periphery of the end surface 2b by the above-mentioned fixing means. The fixing part, 16 in Fig. 9, is a fixing part formed by fixing the second end 10b at the approximate center of the end surface 2b by the fixing means described above with respect to the end surface 2b. [0041] In the case of manufacturing the grinding stone 1B of the second embodiment, the base metal 2 and the fixed abrasive grain cutting line 10 are prepared, and the fixed abrasive grain cutting line 10 is placed on the end surface 2b of the base metal 2. The upper part is tightly wound into a scroll shape around the above-mentioned rotating shaft L and fixed to the end surface 2b. Here, when the fixed abrasive grain cutting line 10 is wound, for example, the fixed abrasive grain cutting line 10 is wound multiple times from the outer peripheral side of the base metal 2 toward the center side. In this case, first, the winding start end side (the first end portion 10a side) of the fixed abrasive grain cutting line 10 is located near the outer peripheral edge of the end surface 2b with respect to the base metal by the spot welding, etc. The fixing means to be fixed. Then, the fixed abrasive grain cutting line 10 is wound into a spiral shape toward the center of the end surface 2 b, and is fixed to the base metal 2 at a predetermined interval along the longitudinal direction of the fixed abrasive grain cutting line 10. The above operations are repeated in sequence, and finally, at the approximate center of the end surface 2b of the base metal 2 (near the rotation axis L), the winding terminal side (the second end 2b side) of the fixed abrasive grain cutting line 10 is fixed to The base metal 2. Next, cutting or the like is performed on the remaining parts of the winding start side and the winding end side of the fixed abrasive grain cutting line 10. [0042] In this way, it is possible to obtain: with respect to the end surface 2b of the base metal 2, the fixed abrasive cutting line 10 is fixed in a spiral shape and adjacent to the base metal 2 in the radial direction. Between, 10, the grinding stone 1B for forming the recess 5 for chip discharge. It is also possible to cut both ends of the fixed abrasive grain cutting line 10 before the fixing step of the fixed abrasive grain cutting line 10 to form the first end portion 10a and the second end portion 10b in advance, and to cut them as described above The base metal 2 is wound around the end surface 2b and fixed to the end surface 2b. In addition, although in the above description, the fixed abrasive grain cutting line 10 is wound from the outer peripheral side of the base metal toward the center, of course, the opposite method can also be adopted, from the center side to the outer peripheral side, or The fixed abrasive grain cutting line 10 may be welded sequentially from the radially outer side of the base metal 2.  [0043] Figures 10 to 13 are diagrams showing the third embodiment of the present invention. The difference between the grinding stone 1C of the third embodiment and the grinding stone 1B of the second embodiment is that the end surface 2b that becomes the "work opposing surface facing the workpiece W" has the rotation axis L as In the center, a guide groove 20 recessed in a slightly spiral shape is provided, and in the guide groove 20, the fixed abrasive grain cutting line is arranged in a spiral state along the guide groove 20 10. In this state, it is fixed to the base metal in the guide groove 20.  [0044] The spiral-shaped guide groove 20 is continuously continuous from the vicinity of the outer periphery of the end surface 2b of the base metal 2 toward the central portion. In addition, as shown in FIG. 11, the guide groove 20 has a slightly rectangular cross-sectional shape, the groove width is formed slightly larger than the diameter of the fixed abrasive grain cutting line 10, and the groove depth is formed to be larger than the fixed abrasive grain cutting line 10 Line 10 has a shallower diameter. Accordingly, once the fixed abrasive grain cutting line 10 is accommodated in the guiding groove 20 along the longitudinal direction of the guiding groove 20, as shown in FIG. 11, the fixed abrasive grain cutting line 10 is slightly curved The surface of the base metal 2 protrudes from the end surface 2b of the base metal 2, and the workpiece W can be ground by the protruding fixed abrasive cutting line 10. [0045] Next, as shown in FIG. 11, in the grinding stone 1C of the third embodiment, a chip discharge is formed between the fixed abrasive grain cutting lines 10 and 10 adjacent in the radial direction of the base metal 2. Used recess 5. In addition, the winding pitch of the fixed abrasive grain cutting lines 10, 10 that determines the width of the recess 5 actually corresponds to the radial pitch of the guide groove 20 adjacent to the base metal 2 in the radial direction. In the form, the winding pitch of the guide groove 20 is set such that the fixed abrasive grain cutting wire 10, 10 adjacent to the fixed abrasive grain cutting wire 10 is housed in the guide groove 20 The abrasive grains 11 are separated to the extent that they do not come into contact with each other.  [0046] Regarding the fixing means for fixing the abrasive grain cutting line 10, in this third embodiment, a resin-based adhesive is used. Then, with the adhesive, as shown in Fig. 12 or Fig. 13, the first end 10a of the fixed abrasive grain cutting line 10 is fixed to one end side (outermost peripheral side) of the guide groove 20 in the longitudinal direction. The position of the groove end 20a and the second end 10b of the guide groove 20 are fixed to the position of the groove end 20b on the other end side (center side) of the guide groove 20 in the longitudinal direction. In addition, the intermediate portion 10 c of the fixed abrasive grain cutting line is intermittently fixed to the base metal 2 in the guide groove 20 along the longitudinal direction of the fixed abrasive grain cutting line 10. [0047] With regard to the above-mentioned adhesive, for example, by adopting "when hardened, a soft adhesive layer that is imitative to deformation is formed" to form: during grinding processing of the workpiece W, etc. With the contact resistance or the like, the fixing portions 15-17 that fix the abrasive grain cutting line 10 are fixed to the end surface 2b, and the end surface 2b is slightly displaced. In addition, although in the example shown in FIG. 11, the fixed abrasive grain cutting line 10 is fixed to the base metal 2 in a non-contact state at the bottom of the guide groove 20, it can also be in contact with the groove The bottom state is fixed in the guide groove 20.  [0048] The process of manufacturing the grinding stone 1C for grinding shown in the third embodiment will be described. In the case of manufacturing the grinding stone 1C for grinding, before the fixed abrasive grain cutting line 10 is fixed to the base metal 2, first, the end surface 2b of the base metal 2 is engraved with a "rotation axis around the base metal 2" L is a scroll-shaped guide groove 20'. The forming step of the guide groove 20 is performed by, for example, a laser processing machine or the like, whereby a spiral groove having an appropriate groove width and groove depth is formed at a specific winding pitch. After that, the "ditch end 20a" located on one end of the outermost peripheral side and the "ditch end 20b located on the other end of the innermost peripheral side" in the guide groove 20 are filled with a resin-based adhesive, and The two ends 20a, 20b are intermittently filled with adhesive along the longitudinal direction of the guide groove 20 while maintaining a certain interval. Thereby, the adhesive layer (the part of the fixed layer 15-17) is formed in the part of the guide groove 20 that has been filled with the adhesive. Then, proceed to the fixing step described below. At this time, before the adhesive layer is completely hardened, the fixed abrasive grain cutting line 10 is arranged in the guide groove 20 along the longitudinal direction of the guide groove 20 . [0049] Here, although a fixed abrasive grain cutting line 10 having a length corresponding to the length of the guide groove and having a first end 10a and a second end 10b is adopted, of course, it can be implemented as in the second As described in the manufacturing steps of the grinding stone 1B for grinding, after the long fixed abrasive grain cutting line 10 is fixed to the base metal 2 (in the guide groove 20), both of the fixed abrasive grain cutting line 10 The ends are cut to form a first end 10a and a second end 10b. [0050] In the step of fixing the fixed abrasive grain cutting line 10 to the base metal 2, for example, as shown in FIG. 12, the first end portion 10a of the fixed abrasive grain cutting line 10 and the guide groove 20 One end of the groove end 20a is slightly aligned. In this state, the fixed abrasive grain cutting line 10 is wound into a spiral along the longitudinal direction of the guide groove 20, and then, as shown in FIG. 13, The second end portion 10b of the fixed abrasive grain cutting line 10 is arranged to slightly coincide with the groove end portion 20b on the other side of the guide groove 20. In this way, it is possible to obtain: with respect to the end surface 2b of the base metal 2, the fixed abrasive grain cutting line 10 is fixed in a spiral shape, and the fixed abrasive grain cutting lines 10, 10 are adjacent to each other in the radial direction of the base metal 2. In the meantime, a grinding stone 1C for grinding of the recess 5 for chip discharge is formed.  [0051] In the third embodiment, the guide groove 20 is formed by a laser processing machine, but it may be formed by cutting with a cutting edge such as a cutting tool. In addition, with regard to the cross-sectional shape of the guide groove 20, as long as a part of the fixed abrasive grain cutting line 10 can be accommodated in the guide groove 20, and a part of the outer peripheral surface of the fixed abrasive grain cutting line 10 protrudes outward, For example, it may be a cross-sectional shape having a "slightly circular cross section" and a "slightly V-shaped cross section". [0052] Above, the grinding stone for grinding of the present invention and its manufacturing method have been described, but the present invention is not limited to the above-mentioned embodiments, and of course there can be various types without departing from the scope of the patent application. Such design changes.

[0053]1A、1B、1C‧‧‧研削用磨石2‧‧‧基底金屬2a‧‧‧外周面2b‧‧‧端面3‧‧‧研磨部5‧‧‧凹部10‧‧‧固定研磨粒切割線(Fixed abrasive grain wire)10a‧‧‧第1端部10b‧‧‧第2端部10c‧‧‧中間部11‧‧‧研磨粒(Abrasive grain)12‧‧‧芯線20‧‧‧導引溝W‧‧‧工件[0053] 1A, 1B, 1C‧‧‧Grinding stone for grinding 2‧‧‧Base metal 2a‧‧‧Outer peripheral surface 2b‧‧End surface 3‧‧‧Grinding part 5‧‧‧Concave 10‧‧‧Fixed abrasive grain Fixed abrasive grain wire 10a‧‧‧First end 10b‧‧‧Second end 10c‧‧‧Middle part 11‧‧‧Abrasive grain 12‧‧‧Core wire 20‧‧‧Guide Lead groove W‧‧‧Workpiece

[0015]   第1圖:為顯示本發明之研磨用磨石的第1實施形態的示意圖。   第2圖:為示意地顯示上述研磨用磨石在工件研磨前之狀態的概略立體圖。   第3圖:捲繞於基底金屬之固定研磨粒切割線的局部放大剖面圖。   第4圖:是示意地顯示第1圖中以一點虛線所圍繞之領域A的局部放大側視圖。   第5圖:是示意地顯示第1圖中以一點虛線所圍繞之領域B的局部放大側視圖。   第6圖:為示意地顯示本發明之研磨用磨石的第2實施形態的俯視圖。   第7圖:是放大顯示「捲繞於第6圖之基底金屬的固定研磨粒切割線之中間部」的局部放大剖面圖。   第8圖:是示意地顯示第6圖中以一點虛線所圍繞之領域C的局部放大俯視圖。   第9圖:是示意地顯示第6圖中以一點虛線所圍繞之領域D的局部放大俯視圖。   第10圖:為示意地顯示本發明之研磨用磨石的第3實施形態的俯視圖。   第11圖:是放大顯示「捲繞於第10圖之基底金屬的固定研磨粒切割線之中間部」的局部放大剖面圖。   第12圖:是示意地顯示第10圖中以一點虛線所圍繞之領域E的局部放大俯視圖。   第13圖:是示意地顯示第10圖中以一點虛線所圍繞之領域F的局部放大俯視圖。[0015] "Figure 1": is a schematic diagram showing the first embodiment of the grinding stone of the present invention.   Figure 2: A schematic perspective view schematically showing the state of the above-mentioned polishing grindstone before the workpiece is polished.   Figure 3: A partial enlarged cross-sectional view of a cutting line of fixed abrasive grains wound on a base metal.   Figure 4: is a partially enlarged side view schematically showing the area A surrounded by a dotted line in Figure 1.   Figure 5: is a partially enlarged side view schematically showing the area B surrounded by a dotted line in Figure 1.   Figure 6: is a plan view schematically showing the second embodiment of the polishing grindstone of the present invention.   Figure 7: is an enlarged partial cross-sectional view showing the "intermediate part of the fixed abrasive cut line wound around the base metal in Figure 6".   Figure 8: is a partially enlarged top view schematically showing the area C surrounded by a dotted line in Figure 6.   Figure 9: is a partially enlarged plan view schematically showing the area D surrounded by a dotted line in Figure 6.   Figure 10: is a plan view schematically showing the third embodiment of the polishing grindstone of the present invention.   Figure 11: is an enlarged partial cross-sectional view showing "the middle part of the fixed abrasive cut line wound around the base metal in Figure 10".   Figure 12: is a partially enlarged plan view schematically showing the area E surrounded by a dotted dotted line in Figure 10.   Figure 13: is a partially enlarged plan view schematically showing the area F surrounded by a dotted line in Figure 10.

2‧‧‧基底金屬 2‧‧‧Base metal

2a‧‧‧外周面 2a‧‧‧Outer peripheral surface

5‧‧‧凹部 5‧‧‧Concave

10‧‧‧固定研磨粒切割線 10‧‧‧Fixed abrasive grain cutting line

11‧‧‧研磨粒 11‧‧‧Grit

12‧‧‧芯線 12‧‧‧Core wire

13‧‧‧金屬電鍍層 13‧‧‧Metal plating

14‧‧‧屑穴 14‧‧‧ Crumbs

Claims (8)

一種研削用磨石,其特徵為:具有:基底金屬,具有用來面向工件的工件對向面;及固定研磨粒切割線,在芯線固定有大量的研磨粒所形成,上述工件對向面,由該基底金屬之旋轉軸周圍的外周面所形成,上述固定研磨粒切割線,在基底金屬的外周面上,沿著上述旋轉軸方向捲繞成螺旋狀,並且,在上述旋轉軸方向上相鄰的該固定研磨粒切割線之間形成緊密捲繞,使其中一個固定研磨粒切割線的前端接觸於另一個固定研磨粒切割線,並固定於該基底金屬,藉此,在該基底金屬的外周面上,形成工件研削用的研削部,並形成切屑排出用的排出溝,該切屑排出用的排出溝是由在上述旋轉軸方向上相鄰的固定研磨粒切割線間的凹部所形成。 A grinding stone for grinding, which is characterized in that it has: a base metal with a workpiece opposite surface for facing the workpiece; and a fixed abrasive grain cutting line formed by fixing a large number of abrasive grains on the core wire, the workpiece opposite surface, Formed by the outer peripheral surface around the rotating shaft of the base metal, the fixed abrasive grain cutting line is wound on the outer peripheral surface of the base metal in a spiral shape along the direction of the rotating shaft, and is opposite in the direction of the rotating shaft. The adjacent fixed abrasive grain cutting lines are tightly wound, so that the front end of one of the fixed abrasive grain cutting lines contacts the other fixed abrasive grain cutting line and is fixed to the base metal, thereby, in the base metal A grinding portion for grinding the workpiece is formed on the outer peripheral surface, and a discharge groove for chip discharge is formed. The discharge groove for chip discharge is formed by a recess between adjacent fixed abrasive cutting lines in the direction of the rotation axis. 如請求項1所記載的研削用磨石,其中上述固定研磨粒切割線,在其長度方向的兩端分別具有第1端部及第2端部,其第1端部被固定於基底金屬之旋轉軸方向的其中一端側,其第2端部被固定於該基底金屬之旋轉軸方向的另一端側,且位於這些第1端部與第2端部之間的中間部,相對於上述基底金屬的外周面,以非固定狀態捲繞成可朝上述旋轉軸方向相對移動。 The grinding stone for grinding according to claim 1, wherein the fixed abrasive grain cutting line has a first end and a second end at both ends in the longitudinal direction, and the first end is fixed to the base metal One end in the direction of the rotation axis, the second end of which is fixed to the other end of the base metal in the direction of the rotation axis, and is located in the middle between the first and second ends, opposite to the base The outer peripheral surface of the metal is wound in a non-fixed state so as to be relatively movable in the direction of the rotation axis. 一種研削用磨石,其特徵為:具有:基底金屬,具有用來面向工件的工件對向面;及固定研磨粒切割線,在芯線固定有大量的研磨粒所形成,上述基底金屬的工件對向面,是由該基底金屬的旋轉軸方向之其中一端側的端面所形成,上述固定研磨粒切割線,在基底金屬的端面上,以繞著上述旋轉軸捲繞成渦捲狀的狀態,固定於該基底金屬,藉此,在該基底金屬的端面上,形成工件研削用的研削部,並形成切屑排出用的排出溝,該切屑排出用的排出溝是由在該基底金屬之徑向上相鄰的固定研磨粒切割線間的凹部所形成。 A grinding stone for grinding, which is characterized in that it has: a base metal with a workpiece facing surface for facing the workpiece; and a fixed abrasive grain cutting line formed by fixing a large number of abrasive grains on the core wire. The facing surface is formed by the end surface at one end side in the direction of the rotation axis of the base metal, and the fixed abrasive grain cutting line is wound on the end surface of the base metal in a spiral state around the rotation axis. It is fixed to the base metal, whereby a grinding part for grinding the workpiece is formed on the end surface of the base metal, and a discharge groove for chip discharge is formed. The discharge groove for chip discharge is formed in the radial direction of the base metal It is formed by the recesses between adjacent cutting lines of fixed abrasive grains. 如請求項3所記載的研削用磨石,其中上述固定研磨粒切割線,在其長度方向的兩端分別具有第1端部及第2端部,其第1端部在基底金屬之徑向的其中一端側被固定,其第2端部在該基底金屬之徑向的另一端側被固定,且位於這些第1端部與第2端部之間的中間部,相對於上述基底金屬的端面,沿著固定研磨粒切割線的長度方向間歇地固定。 The grinding stone for grinding according to claim 3, wherein the fixed abrasive grain cutting line has a first end and a second end at both ends in the longitudinal direction, and the first end is in the radial direction of the base metal One end side of the base metal is fixed, and the second end is fixed at the other end side in the radial direction of the base metal, and is located in the middle part between the first end and the second end, relative to the base metal The end surface is intermittently fixed along the longitudinal direction of the fixed abrasive grain cutting line. 如請求項3或請求項4所記載的研削用磨石,其中在上述基底金屬的端面,刻設有凹設成渦卷狀的導引溝,上述 固定研磨粒切割線,在沿著該導引溝之長度方向而配設於該導引溝內的狀態下,固定於該基底金屬。 The grinding stone for grinding described in claim 3 or claim 4, wherein a guide groove recessed in a spiral shape is engraved on the end surface of the base metal. The fixed abrasive grain cutting line is fixed to the base metal in a state of being arranged in the guide groove along the longitudinal direction of the guide groove. 一種研削用磨石的製造方法,是在具有用來面向工件之工件對向面之基底金屬的該工件對向面上,形成工件研削用的研削部與切屑排出用的排出溝之研削用磨石的製造方法,其特徵為含有:將上述基底金屬之旋轉軸周圍的外周面作為上述工件對向面,藉由將在芯線固定有研磨粒而形成的固定研磨粒切割線,在該基底金屬的外周面上,從該旋轉軸方向的一端側朝向另一端側捲繞成螺旋狀,並且,在上述旋轉軸方向上相鄰的該固定研磨粒切割線之間形成緊密捲繞,使其中一個固定研磨粒切割線的前端接觸於另一個固定研磨粒切割線,藉此,在該外周面上,形成上述研削部,並由上述旋轉軸方向上相鄰之固定研磨粒切割線間的凹部形成上述排出溝的步驟;及將固定研磨粒切割線之長度方向的第1端部及第2端部固定於該基底金屬的步驟。 A method of manufacturing a grinding stone for grinding is to form a grinding part for grinding the workpiece and a discharge groove for chip discharge on the opposite surface of the workpiece having a base metal for the opposite surface of the workpiece facing the workpiece. The method for producing a stone is characterized by comprising: using the outer peripheral surface around the rotating shaft of the base metal as the opposite surface of the workpiece, and cutting a fixed abrasive grain cut line formed by fixing abrasive grains on the core wire, and the base metal The outer peripheral surface of the rotating shaft is wound in a spiral shape from one end to the other end in the direction of the rotation axis, and the fixed abrasive grain cutting lines adjacent in the direction of the rotation axis are tightly wound so that one The tip of the fixed abrasive grain cutting line is in contact with another fixed abrasive cutting line, whereby the above-mentioned grinding portion is formed on the outer peripheral surface, and is formed by the concave portion between the adjacent fixed abrasive grain cutting lines in the direction of the rotation axis The step of discharging the groove; and the step of fixing the first end and the second end in the longitudinal direction of the fixed abrasive grain cutting line to the base metal. 一種研削用磨石的製造方法,是在具有用來面向工件之工件對向面之基底金屬的該工件對向面上,形成工件研削用的研削部與切屑排出用的排出溝之研削用磨石的製造方法, 其特徵為含有:將上述基底金屬的旋轉軸方向之一端側的端面作為上述工件對向面,藉由將在芯線固定有研磨粒而形成的固定研磨粒切割線,在該基底金屬的端面上,藉由繞著該旋轉軸捲繞成渦卷狀,而在該端面上,形成上述研削部,並由該端面之徑向上相鄰的固定研磨粒切割線間的凹部形成上述排出溝的步驟;及將固定研磨粒切割線之長度方向的第1端部及第2端部、以及位於該固定研磨粒切割線的第1端部與第2端部之間的中間部,固定於基底金屬的步驟。 A method of manufacturing a grinding stone for grinding is to form a grinding part for grinding the workpiece and a discharge groove for chip discharge on the opposite surface of the workpiece having a base metal for the opposite surface of the workpiece facing the workpiece. The manufacturing method of the stone, It is characterized by comprising: the end surface on one end side in the direction of the rotation axis of the base metal is used as the workpiece facing surface, and a fixed abrasive grain cutting line formed by fixing abrasive grains on the core wire is formed on the end surface of the base metal The step of forming the above-mentioned grinding part on the end face by winding around the rotating shaft in a scroll shape, and forming the above-mentioned discharge groove by the concave part between the fixed abrasive grain cutting lines adjacent in the radial direction of the end face ; And the first end and the second end of the longitudinal direction of the fixed abrasive cutting line, and the intermediate part between the first end and the second end of the fixed abrasive cutting line, fixed to the base metal A step of. 如請求項7所記載的研削用磨石的製造方法,其中含有:刻設繞著上述旋轉軸凹設成渦卷狀之導引溝的步驟;及將上述固定研磨粒切割線,沿著上述導引溝之長度方向而配置於該導引溝內的步驟。The method for manufacturing a grinding stone for grinding as described in claim 7, which includes: a step of engraving a guide groove recessed in a spiral shape around the rotation axis; and cutting the fixed abrasive grain along the The step of arranging the guide groove in the longitudinal direction of the guide groove.
TW106127898A 2016-09-06 2017-08-17 Grindstone and, method for manufacturing same TWI705875B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-173666 2016-09-06
JP2016173666A JP6755550B2 (en) 2016-09-06 2016-09-06 Grinding wheel and its manufacturing method

Publications (2)

Publication Number Publication Date
TW201819113A TW201819113A (en) 2018-06-01
TWI705875B true TWI705875B (en) 2020-10-01

Family

ID=61562270

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106127898A TWI705875B (en) 2016-09-06 2017-08-17 Grindstone and, method for manufacturing same

Country Status (5)

Country Link
JP (1) JP6755550B2 (en)
KR (1) KR20190044063A (en)
CN (1) CN109789533A (en)
TW (1) TWI705875B (en)
WO (1) WO2018047600A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX2020008582A (en) 2018-03-05 2020-09-21 Univ Saitama Medical Pharmaceutical composition for treating or preventing heterotopic ossification.
CN111015533B (en) * 2019-12-31 2022-04-12 枣庄北航机床创新研究院有限公司 Small-size polishing tool and manufacturing method thereof
KR102438282B1 (en) * 2020-08-07 2022-08-30 문덕주 An abrasive article and a method for manufacturing the abrasive article
CN117300927B (en) * 2023-11-28 2024-02-02 太原理工大学 Ordered abrasive particle arrangement method suitable for cylindrical grinding wheel and grinding wheel preparation method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63283865A (en) * 1987-05-14 1988-11-21 Brother Ind Ltd Casterd-iron bond diamond or cbn grindstone
JP2015142947A (en) * 2014-01-31 2015-08-06 コマツNtc株式会社 Tool for processing inner peripheral surface

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3939612A (en) * 1971-06-02 1976-02-24 Dresser Industries, Inc. Reinforced grinding wheel
CH641396A5 (en) * 1979-10-04 1984-02-29 Arthur Werner Staehli Flat-lapping or polishing wheel
DE3332085A1 (en) * 1983-09-06 1985-03-21 Festo KG, 7300 Esslingen Tool for roughening, or removing material by abrasion or cutting
JP2010046771A (en) 2008-08-22 2010-03-04 Asahi Diamond Industrial Co Ltd Superabrasive wheel
KR101192157B1 (en) * 2010-12-07 2012-10-17 지앤피테크놀로지 주식회사 Polishing roller apparatus for display panel, semiconductor substrate, etc.
CN103659530B (en) * 2012-09-03 2016-05-18 舒能(苏州)工业技术有限公司 A kind of S type bend pipe polishing grinding tool

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63283865A (en) * 1987-05-14 1988-11-21 Brother Ind Ltd Casterd-iron bond diamond or cbn grindstone
JP2015142947A (en) * 2014-01-31 2015-08-06 コマツNtc株式会社 Tool for processing inner peripheral surface

Also Published As

Publication number Publication date
KR20190044063A (en) 2019-04-29
CN109789533A (en) 2019-05-21
TW201819113A (en) 2018-06-01
WO2018047600A1 (en) 2018-03-15
JP6755550B2 (en) 2020-09-16
JP2018039066A (en) 2018-03-15

Similar Documents

Publication Publication Date Title
TWI705875B (en) Grindstone and, method for manufacturing same
KR101011911B1 (en) Method of producing brush-like grind stone, the brush-like grind stone, and brush for grind machine
US6295977B1 (en) Method and device for simultaneously cutting off a multiplicity of wafers from a workpiece
KR100804049B1 (en) Diamond toos and segment manufacturing method of the same
JP5701211B2 (en) Electroformed thin cutting saw and core drill impregnated with abrasive
US3436871A (en) Abrasive cutting tools
JP6270796B2 (en) Fixed abrasive wire saw and fixed abrasive wire dressing method
KR20020068171A (en) A Machining Tip And Cutting Wheel, Grinding Wheel, Punching Wheel Thatwith
WO2013065551A1 (en) Rotary dresser and manufacturing method therefor
KR100446981B1 (en) Segment of cutting tool
JP5075185B2 (en) Scribing wheel
JP5075184B2 (en) Scribing wheel
JP2005111638A (en) Stepped end mill, and its manufacturing method
JP2008178938A (en) Wire saw
JP2800475B2 (en) Manufacturing method of diamond core bit
JP2001009733A (en) Diamond tool
JP2007061943A (en) Brazed tool
JP5230328B2 (en) Wafer notch polishing pad
JP2001150353A (en) Diamond blade
JP2863339B2 (en) Chamfering polishing tool for inner circumference
JP2003031749A (en) Punch for manufacturing semiconductor device
JP2006136957A (en) Grinding wheel
KR100398776B1 (en) Method for manufacturing cutting edge of cutting tool to manufacture boll-seat in piston of car compressor
JP3958428B2 (en) Grinding tool
RU2306218C2 (en) Diamond disc

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees