TWI704043B - Resin molding device and manufacturing method of resin molded product - Google Patents

Abstract

The present invention provides a resin molding device and a method of manufacturing a resin molded product. The purpose is to suppress the occurrence of molding defects caused by the positioning of the resin molding object. The resin molding device includes: a molding die with an upper die (9) as a first die and a lower die (10) as a second die arranged opposite to each other; a supply mechanism (13) for supplying the molding surface as a resin molding The object's pre-molding substrate (15); positioning mechanism (25, 26) for positioning the pre-molding substrate (15) to the guide member (23, 24); mold clamping mechanism for clamping the molding mold; light emitting The elements (27, 28) are used to emit irradiated light; the first light-receiving element (31, 32) is provided in the supply mechanism (13) and can receive the irradiated light; and the judging part is used to compare the pre-molding substrate (15) The upper mold (9) is provided with a first outgoing through hole (29, 30) through which the irradiated light from the light emitting element (27, 28) passes, and the judgment unit is based on the first light receiving element (31, 32) Detecting the irradiated light passing through the first exit through holes (29, 30) to determine whether the substrate (15) is normally positioned on the guide member (23, 24) before molding.

Description

Resin molding device and manufacturing method of resin molded product

The present invention relates to a resin molding apparatus for resin molding a resin molding object and a method of manufacturing a resin molded product.

As a prior art, for example, Patent Document 1 discloses a resin molding apparatus including: a supply part 8 of a molded product 5; a supply part 20 of a plate holder 10 for supporting the molded product; and a mounting part 30 , By detecting the positioning recognition part provided on the molded product 5 and mounting the molded product 5 on the predetermined position of the plate clamp 10; the pressing device 40 is provided with the plate clamp 10 on which the molded product 5 is mounted Positioning devices for the resin molding metal molds 50, 51, and are equipped with resin molding metal molds 50, 51 that perform resin molding by clamping the molded product 5 together with the plate clamp 10; the resin molding metal molds 50, 51 51 The receiving part 60 of the molded product 62 after resin molding; and the feeding and discharging mechanism 70, 72 for feeding and discharging the molded product 5, the molded product 62 and the plate clamp 10 to the supply part 8 and the plate clamp of the molded product 5 10 of the supply section 20, the mounting section 30, the pressing device 40, and the storage section 60 of the molded product 62.

In addition, in Patent Document 1, as the positioning device, for example, as shown in FIG. 6 of Patent Document 1, the positioning pin 45 provided on the lower mold 44 abuts the plate jig 10 (see paragraph [0023]).

Patent Document 1: Japanese Patent Publication No. 2008-132730

Patent Document 1 does not describe the following: in the positioning in which the plate clamp 10 is brought into contact with the positioning pin 45, it is confirmed whether or not the positioning is properly performed. Therefore, it is judged from the molded product after molding that the molding defect due to positioning is performed.

The present invention is proposed to solve the above-mentioned problems. An object thereof is to provide a resin molding apparatus and a method of manufacturing a resin molded product that can suppress the occurrence of molding defects caused by positioning.

In order to solve the above-mentioned problems, the resin molding apparatus according to the present invention includes: a molding die having a first die and a second die arranged opposite to each other; and a supply mechanism for feeding the first die and the second die The molding surface of any mold is supplied with a resin molding object; a positioning mechanism for positioning the resin molding object to a guide member on the molding surface; a mold clamping mechanism for clamping the molding mold; a light emitting element , Used to emit irradiated light; the first light-receiving element is provided in the supply mechanism and can receive the irradiated light; and a judging section for judging the positioning of the resin molding object, in the one mold A first emission through hole is provided through which the irradiation light from the light emitting element passes, and the judgment unit is based on the detection of the irradiation light passing through the first emission through hole by the first light receiving element , Judging whether the resin molded object is normally positioned on the guide member.

In order to solve the above-mentioned problems, the method of manufacturing a resin molded product according to the present invention includes a supply process of supplying resin to the molding surface of any one of the molding molds having a first mold and a second mold disposed opposite to each other through a supply mechanism Molding object; positioning process, positioning the resin molding object to the guide member on the molding surface; irradiating process, emitting irradiated light from the light-emitting element, the irradiated light passes through the first exit pass provided in the one mold Hole; detection process, by the first light-receiving element provided in the supply mechanism to detect the irradiated light passing through the first outgoing through hole; judging process, based on the detection in the detection process, judging the resin molding Whether the object is normally positioned to the guide member; and a resin molding process, when it is determined that the resin molded object is normally positioned in the judgment process, the molding mold is clamped to perform resin molding.

According to the present invention, it is possible to suppress the occurrence of molding defects caused by positioning.

1: Resin molding unit

10: Lower die

11: Forming mold

12: Resin molding objects

13: Supply organization

14: Semiconductor wafer

15: Substrate before molding

16: cavity

17: Release film

18: Distributor

19: Mobile agency

2: base

20: Liquid resin

21: Hardened resin

22: Resin molded products

23, 23X, 24: guide parts

25, 26: positioning mechanism

27, 27a, 27b, 28, 28a, 28b, 35, 36: light-emitting element

29, 29a, 29b, 30, 30a, 30b: through holes for the first exit

3: connecting rod

31, 31a, 31b, 32, 32a, 32b: the first light receiving element

33: Irradiation light

34: gap

37, 38: Through hole for second ejection

39, 40: second light receiving element

4.49: Fixed table

41, 42, 50, 51, 55, 56, 57, 60: light guide

43, 43a, 43b, 44, 44a, 44b: mirror

45: Supply organization

46, 47: Through hole for incident

48, 9: upper die

5: movable table

52, 53, 58, 58a, 58b, 61, 61a, 61b: optical fiber

54: Optical fiber lens

59, 62: branch parts

6: Mold clamping mechanism

63: Resin molding device

64: substrate supply storage module

65A, 65B, 65C: molding module

66: Resin supply module

67: Substrate supply section before molding

68: Resin molded product storage section

69: Board placement section

7: Startup source

70: Release film supply mechanism

71: Judgment Department

72: Control Department

8: transfer parts

Fig. 1 is a front view showing the general structure of the resin molding unit in the resin molding apparatus according to the present invention.

(A) to (d) of FIG. 2 are schematic cross-sectional views showing the process of resin molding a resin molding object.

Figure 3 is a schematic diagram showing the mechanism used to check whether the resin molding object is properly positioned on the surface of the upper mold in the first embodiment, (a) is a bottom view of the upper mold, (b) is a molding mold and its supply A schematic cross-sectional view of the mechanism, (c) is a top view of the supply mechanism.

Figure 4 is a schematic diagram used to verify whether the resin molding object positioned on the molding surface of the upper mold is normally positioned in Embodiment 1, (a) is a schematic cross-sectional view showing the state of positioning the resin molding object, (b ) Is a schematic cross-sectional view showing a state of normal positioning, and (c) is a schematic cross-sectional view showing a state of poor positioning.

Figure 5 is a schematic diagram showing the mechanism used to check whether the guide member is abnormal or the resin molding object is warped or bent in the first embodiment. (a) is the bottom view of the upper mold, (b) is the molding A schematic cross-sectional view of the mold and the supply mechanism, (c) is a top view of the supply mechanism.

Fig. 6 is a schematic diagram for checking whether an abnormality of the guide member or warpage of the resin molded object occurs in the first embodiment, (a) is a schematic cross-sectional view showing a state in which the resin molded object is normally positioned, and (b) shows A schematic cross-sectional view of a state in which an abnormality occurs in the guide member, and (c) is a schematic cross-sectional view showing a state in which the resin molded object is warped.

Fig. 7 is a schematic diagram showing a state in which the resin molding object is positioned on the molding surface of the upper mold in the second embodiment, (a) is a bottom view of the upper mold, (b) is a schematic cross-sectional view of the molding mold and the supply mechanism , (C) is the top view of the supply mechanism.

Figure 8 is a schematic diagram showing a state in which the resin molding object is positioned on the molding surface of the upper mold in the third embodiment, (a) is a bottom view of the upper mold, (b) is a schematic cross-sectional view of the molding mold and the supply mechanism , (C) is the top view of the supply mechanism.

Figure 9 is a schematic diagram showing a state in which the resin molding object is positioned on the molding surface of the upper mold in the fourth embodiment, (a) is a bottom view of the upper mold, (b) is a schematic cross-sectional view of the molding mold and the supply mechanism , (C) is the top view of the supply mechanism.

Figure 10 is a schematic diagram showing the state of positioning the resin molding object on the molding surface of the upper mold in the fifth embodiment, (a) is a bottom view of the upper mold, (b) is a schematic cross-sectional view of the molding mold and the supply mechanism , (C) is the top view of the supply mechanism.

Figure 11 is a schematic diagram showing a state where the resin molding object is positioned on the molding surface of the upper mold in the sixth embodiment, (a) is a bottom view of the upper mold, (b) is a schematic cross-sectional view of the molding mold and the supply mechanism , (C) is the top view of the supply mechanism.

Figure 12 is a schematic diagram showing the state in which the resin molding object is positioned on the molding surface of the upper mold in the seventh embodiment, (a) is a bottom view of the upper mold, and (b) is a schematic cross-sectional view of the molding mold and the supply mechanism , (C) is the top view of the supply mechanism.

Figure 13 is a schematic diagram showing the state of positioning the resin molding object on the molding surface of the upper mold in the eighth embodiment, (a) is a bottom view of the upper mold, (b) is a schematic cross-sectional view of the molding mold and the supply mechanism , (C) is the top view of the supply mechanism.

Fig. 14 is a plan view showing the general structure of the resin molding apparatus according to the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. Any figure in the present invention is schematically drawn for ease of understanding and is appropriately omitted or exaggerated. To the same structure The same symbols are used for the elements, and the description is omitted appropriately. In addition, in the present invention, "resin molding" refers to molding a resin using a molding die, and includes the concept expression of "resin encapsulation" in which a molding die is used to mold a sealing resin portion. In addition, "resin molded product" refers to a product containing at least a resin portion after resin molding, and is a conceptual expression of a packaged substrate including a form in which a semiconductor wafer mounted on a substrate described later is resin molded by a molding die and resin encapsulated. .

[Embodiment 1]

(Structure of resin molding unit)

The mechanism of the resin molding unit used in the resin molding apparatus according to the present invention will be described with reference to Fig. 1. The resin molding unit 1 shown in FIG. 1 is a resin molding unit using a compression molding method or a transfer molding method, for example. The resin molding unit 1 has a base 2. Four connecting rods 3 as holding members are fixed to the four corners of the base 2. A fixed table 4 opposite to the base 2 is fixed to the upper part of the four connecting rods 3 extending upward. Between the base 2 and the fixed platform 4, the movable platform 5 opposite to the base 2 and the fixed platform 4 is sleeved on the four connecting rods 3. The base 2 is provided with a mold clamping mechanism 6 for raising and lowering the movable platen 5. The mold clamping mechanism 6 raises and lowers the movable platen 5 to open and close the molding mold. The mold clamping mechanism 6 is constructed by a combination of the drive source 7 and the transmission member 8. For example, as the mold clamping mechanism 6, a combination of a servo motor and a ball screw or a combination of a hydraulic cylinder and a connecting rod can be used. As the clamping mechanism, a toggle mechanism can also be used.

An upper mold 9 is fixed on the lower surface of the fixed platen 4. Just below the upper mold 9, a lower mold 10 is provided opposite to the upper mold 9. The lower mold 10 is fixed on the upper surface of the movable platen 5. The upper mold 9 and the lower mold 10 constitute a molding mold 11 together. The upper mold 9 and the lower mold 10 are appropriately provided with heaters (not shown) as heating devices.

Between the upper mold 9 and the lower mold 10, for example, a supply mechanism 13 for supplying the resin molding object 12 to the surface of the upper mold 9 is arranged. As the resin molding object 12, for example, a substrate on which a semiconductor wafer is mounted, a lead frame on which a semiconductor wafer is mounted, and the like are supplied to the molding surface of the upper mold 9. In this case, although the case where the resin molding object 12 is supplied to the molding surface of the upper mold 9 is shown, the resin molding object 12 may be supplied to the molding surface of the lower mold 10.

(Method of manufacturing resin molded products)

With reference to Figures 1 to 2, the manufacturing process of the following method will be described: This method uses the resin molding unit 1 installed in the resin molding apparatus (refer to Figure 14), for example, the resin molding object mounted on the substrate The semiconductor wafer is resin molded to produce a resin molded product.

As shown in Fig. 2(a), first, in the resin molding apparatus, the upper mold 9 and the lower mold 10 are opened. Next, the supply mechanism 13 is used to transport the pre-molding substrate 15 as the substrate on which the semiconductor wafer 14 is mounted between the upper mold 9 and the lower mold 10. In this case, since the pre-molding substrate 15 is supplied to the molding surface of the upper mold 9, the pre-molding substrate 15 is transported with the surface on which the semiconductor wafer 14 is mounted faces downward. Next, by raising the supply mechanism 13, the pre-molding substrate 15 is supplied to the molding surface of the upper mold 9.

Next, as described later, on the molding surface of the upper mold 9, the pre-molding substrate 15 is positioned to the guide member by a positioning mechanism (see Fig. 3(a)). The light-receiving element (refer to (b) and (c) of FIG. 3) provided in the supply mechanism 13 is used to check whether the substrate 15 is normally positioned on the surface of the upper mold 9 before molding. As for the operation of positioning the substrate 15 on the molding surface of the upper mold 9 before molding and the operation of determining whether the substrate 15 is normally positioned on the molding surface of the upper mold 9 before molding, they will be described later (refer to FIGS. 3 to 6). ).

Next, when it is determined that the substrate 15 is normally positioned on the molding surface of the upper mold 9 before molding, a release film supply mechanism (refer to Figure 14) is used to supply the release film to the cavity 16 provided in the lower mold 10 17. As the release film 17, either a long release film continuously supplied from a film supply reel to a take-up reel or a cut rectangular release film can be used. Alternatively, the release film may not be used.

Next, a description will be given of a case where, as shown in (b) of FIG. 2, for example, a dispenser is used as a resin supply mechanism and a liquid resin as a resin material is supplied into the cavity 16. The dispenser 18 shown in (b) of FIG. 2 is a single-liquid type dispenser using a liquid resin prepared by mixing a main agent and a curing agent in advance. As the main agent, for example, a thermosetting silicone resin or epoxy resin can be used. When supplying liquid resin, a two-liquid mixing type dispenser that mixes a main mixing agent and a curing agent can also be used.

Then, the dispenser 18 is moved between the upper mold 9 and the lower mold 10 by the moving mechanism 19. Next, the liquid resin 20 is discharged from the discharge port of the dispenser 18 to the cavity 16. Thus, the liquid resin 20 is supplied to the cavity 16. In this case, the dispenser 18 is used to supply the liquid resin 20 into the cavity 16. Not limited to this, as the resin material, a powdered, granular, flake, or solid resin material may be used and supplied into the cavity.

Next, as shown in FIG. 2(c), the movable platen 5 is lifted using the mold clamping mechanism 6 (refer to FIG. 1). Thus, the upper mold 9 and the lower mold 10 are clamped. By clamping the mold, the semiconductor wafer 14 mounted on the pre-molding substrate 15 is immersed in the liquid resin 20 supplied to the cavity 16. At this time, a cavity bottom surface member (not shown) provided in the lower mold 10 can be used to apply a predetermined resin pressure to the liquid resin 20 in the cavity 16.

In addition, in the mold clamping process, a vacuuming mechanism (not shown) may also be used to suck the inside of the cavity 16. As a result, air remaining in the cavity 16 and air bubbles contained in the liquid resin 20 are discharged to the outside of the molding die 11. In addition, the inside of the cavity 16 is set to a predetermined degree of vacuum.

Next, the liquid resin 20 is heated using a heater (not shown) provided in the lower mold 10, and the heating time is the time required for the curing of the liquid resin 20. By curing the liquid resin 20, the cured resin 21 is molded. Thus, the semiconductor wafer 14 mounted on the pre-molding substrate 15 is resin-molded (resin encapsulation) by molding the cured resin 21 corresponding to the shape of the cavity 16.

Next, as shown in (d) of FIG. 2, after the cured resin 21 is molded, the mold clamping mechanism 6 is used to lower the movable platen 5. Thus, the upper mold 9 and the lower mold 10 are opened. A resin molded product 22 as a resin molded substrate after molding is fixed to the molding surface of the upper mold 9. Next, the resin molded product 22 is released from the upper mold 9. In this step, resin molding (resin encapsulation) is completed.

(Substrate positioning inspection agency)

With reference to FIG. 3, the positioning inspection mechanism for inspecting the positioning of the substrate 15 before molding supplied to the molding die 11 will be described. The positioning inspection mechanism includes a light-emitting element and a light-receiving element, and checks the positioning of the substrate 15 before molding according to whether the light-receiving element detects the emitted light from the light-emitting element. In this embodiment, a case where a light emitting element is provided on the fixed platen 4 and a light receiving element is provided on the supply mechanism 13 will be described.

As shown in FIG. 3(a), a guide member 23 is provided on the molding surface (lower surface) of the upper mold 9. The guide member 23 is, for example, a positioning member for positioning the substrate 15 before molding in the X direction. As the guide member 23, for example, a member having a pin-like shape such as a guide pin can be used. Likewise, a guide member 24 for positioning the pre-molding substrate 15 in the Y direction is provided on the molding surface of the upper mold 9. Preferably, for example, at least two guide members 23 and 24 are respectively provided along the Y direction and the X direction. In this case, a member having a pin-like shape is used as the guide member. As the guide member, a member having a rectangular parallelepiped shape extending in the X direction and the Y direction may be used.

The upper mold 9 or the fixed platen 4 is provided with, for example, positioning mechanisms 25 and 26 which perform positioning by pressing the end surface of the substrate 15 before molding against the guide members 23 and 24. The positioning mechanism 25 positions the pre-molding substrate 15 in the X direction. Similarly, the positioning mechanism 26 positions the pre-molding substrate 15 in the Y direction. By the positioning mechanisms 25 and 26, the substrate is placed on the molding surface of the upper mold 9 before molding. In this case, it is assumed that the positioning mechanisms 25 and 26 are provided on the upper mold 9 or the fixed platen 4. It is not limited to this, and a structure in which the positioning mechanism is provided on the supply mechanism 13 may be adopted.

In the present invention, as shown in FIG. 3(a), it is shown that the long side direction of the substrate 15 before molding is arranged in the X direction, and the short side direction of the substrate 15 before molding is arranged in the Y direction. Hereinafter, the end surface of the substrate 15 before molding along the longitudinal direction is referred to as the end surface of the substrate 15 before molding along the X direction. Similarly, the end surface of the substrate 15 before molding in the short-side direction is referred to as the end surface of the substrate 15 before molding in the Y direction.

As shown in Fig. 3 (a) and (b), for example, as a structural element for checking the positioning of the substrate 15 in the X direction and the Y direction before molding, light emitting elements 27 and 28 are provided inside the fixed platen 4 . As the light emitting elements 27 and 28, for example, a light emitting diode (LED), a laser diode (LD), or the like can be used. Preferably, the light-emitting elements 27 and 28 have heat resistance. The upper mold 9 is provided with first emission through holes 29, 30 through which the irradiated light emitted by the light emitting elements 27, 28 passes, respectively. In addition, the term “for emission” means to emit irradiated light from the upper mold 9 side to the outside light receiving element side.

As shown in Fig. 3(a), the first ejection through holes 29, 30 are respectively provided in a type in which the substrate 15 is placed on the upper mold 9 before the molding substrate 15 is in contact with the guide members 23, 24. On the surface area. In more detail, the first through-hole 29 for ejection is provided on the upper mold 9 in such a manner that the first through-hole 29 for ejection extends from the edge of the substrate 15 before molding in a state where the substrate 15 is in contact with the guide member 23 before molding. The end surface in the Y direction corresponds to the inner region. Similarly, the first through hole 30 for ejection is provided on the upper mold 9 in the following manner: In a state where the pre-molding substrate 15 is in contact with the guide member 24, the first ejection through hole 30 corresponds to the inner region from the end surface of the pre-molding substrate 15 in the X direction.

As shown in (b) and (c) of FIG. 3, the supply mechanism 13 is provided with first light-receiving elements 31 and 32 for detecting the irradiation light emitted by the light-emitting elements 27 and 28, respectively. The first light-receiving elements 31 and 32 are light-receiving elements for checking the positioning of the substrate 15 in the X direction and the Y direction before molding. As the first light receiving elements 31 and 32, for example, a photodiode (PD) or the like can be used. In the state where the substrate 15 is positioned on the guide members 23 and 24 before molding, the first light receiving element 31 is arranged so as to overlap the light emitting element 27 and the first emission through hole 29 in a plan view, and the first light receiving element 32 is arranged in a plan view. It overlaps with the light-emitting element 28 and the first emission through hole 30 during observation. The diameters of the first emission through holes 29 and 30 can be arbitrarily set according to the intensity of light received by the first light receiving elements 31 and 32. In the state where the substrate 15 is positioned on the guide members 23, 24 before molding, it is checked whether the substrate 15 is normally positioned on the upper mold before molding according to whether the first light receiving elements 31, 32 detect the light emitted by the light emitting elements 27, 28 The shape of 9. For example, by setting the diameter of the first through holes 29 and 30 for ejection to a size of about 0.01 to 0.1 mm, the accuracy of the inspection of the positioning of the substrate 15 before molding can be improved.

In addition, in a state where the molding die 11 is opened, the guide members 23 and 24 protrude from the molding surface of the upper die 9. The guide members 23 and 24 are configured to be pushed up by the profile surface of the lower mold 10 in a state where the molding mold 11 is closed, and are accommodated in the upper mold 9. This structure can be realized, for example, by setting the guide members 23 and 24 to be supported by elastic members such as springs. In addition, the guide members 23 and 24 may be made immovable, and the guide members 23 and 24 may be retracted into an opening hole (not shown) provided in the lower mold 10.

(Board positioning operation and positioning inspection operation (method of manufacturing resin molded products))

Referring to Figs. 3 to 4, the positioning operation of the pre-molding substrate 15 supplied to the molding die 11 and the operation for checking whether the pre-molding substrate 15 supplied to the molding die 11 is properly positioned will be described. Bright. In this embodiment, the case where the pre-molding substrate 15 is supplied to the upper mold 9 of the molding die 11 and positioned is shown. In addition, the description here also serves as the description of the manufacturing method of the resin molded article.

(Substrate positioning operation)

3, the operation of positioning the pre-molding substrate 15 on the molding surface of the upper mold 9 will be described. First, as shown in (b) of FIG. 3, the supply mechanism 13 holding the pre-molding substrate 15 is moved between the upper mold 9 and the lower mold 10. Next, the supply mechanism 13 is lifted, and the pre-molding substrate 15 is transferred from the supply mechanism 13 to the molding surface of the upper mold 9.

Next, for example, using positioning mechanisms 25 and 26 provided on the upper mold 9 or the fixed platen 4, the end faces of the substrate 15 before molding are pressed against the guide members 23 and 24, respectively. First, as shown in (a) of FIG. 3, the positioning mechanism 25 is used to press the Y-direction end surface of the substrate 15 before molding to the two guide members 23. Thereby, the end surface of the substrate 15 in the Y direction before molding is positioned on the molding surface of the upper mold 9. Next, the positioning mechanism 26 is used to press the X-direction end surface of the substrate 15 before molding to the two guide members 24. Thereby, the end surface of the substrate 15 in the X direction before molding is positioned on the molding surface of the upper mold 9.

By using positioning mechanisms 25 and 26 to push the pre-molding substrate 15 to the guide members 23 and 24, the pre-molding substrate 15 is positioned on the molding surface of the upper mold 9. After positioning the pre-molding substrate 15, a suction mechanism (not shown) is used to suck the pre-molding substrate 15 and fix it on the molding surface of the upper mold 9. In this state, the positioning of the substrate 15 on the upper mold 9 before molding is completed.

In this case, the positioning mechanisms 25 and 26 provided on the upper mold 9 or the fixed platen 4 are used to independently position the molded substrate 15 in the X direction and the Y direction. It is not limited to this, and it may be set as the structure which interlock|cooperates the positioning mechanisms 25 and 26. Thereby, the positioning of the substrate 15 before molding in the X direction and the Y direction can be performed simultaneously.

(Substrate positioning inspection operation)

Referring to FIGS. 3 to 4, the operation for checking whether the pre-molding substrate 15 supplied to the upper mold 9 is normally positioned will be described. First, as shown in (a) of FIG. 4, the pre-molding substrate 15 is supplied to the molding surface of the upper mold 9 by the supply mechanism 13. Next, positioning mechanisms 25 and 26 are used to position the pre-molding substrate 15 on the molding surface of the upper mold 9. In this state, the light emitting element 27, the first emitting through hole 29, and the first light receiving element 31 are arranged so as to overlap in a plan view. Similarly, the light emitting element 28, the first emitting through hole 30, and the first light receiving element 32 are arranged so as to overlap in a plan view.

Next, as shown in FIG. 4(b), the irradiated light 33 is emitted from the light emitting elements 27 and 28. The irradiated light 33 emitted from the light-emitting elements 27 and 28 passes through the first exit through holes 29 and 30 formed in the upper mold 9 and reaches the substrate-side surface of the substrate 15 before molding.

When the substrate 15 is normally positioned to the guide members 23 and 24 provided on the upper mold 9 before molding, for example, as shown in FIG. 4(b), the end surface of the substrate 15 in the Y direction and the guide member 23 before molding In the case of contact, no gap is generated between the guide member 23 and the end surface of the substrate 15 before molding in the Y direction. Therefore, the irradiation light 33 emitted by the light-emitting element 27 is blocked by the pre-molding substrate 15. Therefore, the irradiation light 33 does not reach the first light receiving element 31 provided in the supply mechanism 13. Therefore, the first light receiving element 31 cannot detect the irradiation light 33.

Similarly, when the X-direction end surface of the substrate 15 before molding is in contact with the guide member 24 (refer to Figure 3(a)), there is no gap between the guide member 24 and the X-direction end surface of the substrate 15 before molding. There will be gaps. Therefore, the irradiated light 33 emitted by the light-emitting element 28 (refer to FIG. 3(a)) is blocked by the pre-molding substrate 15. Therefore, the irradiation light 33 does not reach the first light receiving element 32 provided in the supply mechanism 13 (see (c) of FIG. 3). Therefore, the first light receiving element 32 cannot detect the irradiation light 33.

When the two light-receiving elements of the first light-receiving elements 31 and 32 do not detect the irradiated light 33, the judgment unit (refer to Figure 14) provided in the control unit of the resin molding apparatus judges that the substrate 15 before molding is normal Often positioned in the X and Y directions. When the two light receiving elements 31, 32, the first light receiving elements 31, 32 do not detect the irradiated light 33, it is determined that the substrate 15 is normally positioned to the guide members 23, 24 before molding, and the next process, namely the resin molding process, is entered.

In the case where the substrate 15 is not normally positioned to the guide members 23 and 24 before molding, for example, as shown in FIG. 4(c), the end surface of the substrate 15 in the Y direction before molding is not in contact with the guide member 23 , A gap 34 is generated between the guide member 23 and the end surface of the substrate 15 in the Y direction before molding. If a gap 34 is generated between the guide member 23 and the end surface of the substrate 15 before molding in the Y direction, the irradiated light 33 emitted from the light-emitting element 27 passes through the gap 34. The irradiation light 33 passing through the gap 34 reaches the first light receiving element 31. As a result, the first light receiving element 31 detects the irradiation light 33. When the first light receiving element 31 detects the irradiated light 33, the determination unit (refer to FIG. 14) determines that the substrate 15 is not normally positioned in the X direction before molding. Therefore, the judgment unit stops entering the next process. And, the positioning of the substrate 15 before molding is performed again.

Similarly, when the end surface of the substrate 15 before molding in the X direction is not in contact with the guide member 24, a gap is generated between the guide member 24 and the end surface of the substrate 15 before molding in the X direction. The irradiation light 33 emitted from the light emitting element 28 passes through the gap and reaches the first light receiving element 32. As a result, the first light receiving element 32 detects the irradiation light 33. In the case where the first light receiving element 32 detects the irradiated light 33, the determination unit determines that the substrate 15 is not normally positioned in the Y direction before molding. In this case, the judgment unit also judges that the substrate 15 is not normally positioned before molding, and stops entering the next process. And, the positioning of the substrate 15 before molding is performed again.

In the state where the substrate 15 is positioned on the molding surface of the upper mold 9 before molding, when any one of the first light receiving elements 31, 32 detects the irradiated light 33, the judgment unit determines that the substrate 15 before molding is not normal Position in either the X direction or the Y direction. In this case, stop entering the next process, and re-position the substrate 15 before molding. In the first light-receiving element 31, 32, the two light-receiving elements If the irradiated light 33 is not detected, the judgment unit judges that the substrate 15 is normally positioned before molding and enters the next process. Therefore, it is possible to suppress the occurrence of molding defects caused by the positioning of the substrate 15 before molding based on whether the first light receiving elements 31 and 32 detect the irradiated light 33.

In addition, regarding the positioning of the pre-molding substrate 15, it is desirable that the first light receiving elements 31 and 32 do not detect the illuminating light 33 when the irradiating light 33 is completely blocked by the pre-molding substrate 15. However, sometimes a part of the irradiated light 33 bypasses the pre-molding substrate 15 as diffracted light and reaches the first light receiving elements 31 and 32, or sometimes external noise light reaches the first light receiving elements 31 and 32. Therefore, considering the detection of diffracted light or noise light by the first light-receiving elements 31, 32, and the detection of irradiation light exceeding a set threshold (for example, a certain magnitude of light intensity), the determination unit determines that The first light receiving elements 31 and 32 detect the irradiation light 33. When the irradiation light below the threshold value is detected, the determination unit determines that the first light receiving elements 31 and 32 have not detected the irradiation light 33. In this way, the determination unit determines whether the substrate 15 is normally positioned on the molding surface of the upper mold 9 before molding. As an example, in the case of performing light detection by measuring the current value of the light-receiving element and using the phenomenon that photocurrent is generated by light irradiation, a threshold value may be set for the current value to be measured. This setting is the same in other embodiments, and also in detection using other light-receiving elements.

(Mechanism and operation for inspecting abnormality of guide member or substrate deformation (including manufacturing method of resin molded product))

With reference to Figures 5 to 6, the mechanism and operation for inspecting at least one of abnormalities such as wear or chipping of the guide members 23 and 24 and whether the substrate 15 has deformed such as warpage or bending before molding will be described. . Regarding the deformation of the substrate before molding, the warpage will be mainly described here as an example. In addition, when the substrate is bent such as wrinkles or creases, the same operation can be performed using the same mechanism. For the deformation of the substrate before molding, as at least a part of The deformation that is likely to occur in the resinous resin substrate of the resin also includes deformation such as warpage of a part of the substrate due to the influence of heat. In addition, the description here also serves as the description of the manufacturing method of the resin molded article.

As shown in Figure 5, the mechanism for inspecting the abnormality of the guide members 23, 24 or the deformation of the substrate 15 before molding is in contact with the pre-molding substrate 15 in the state where the end surface of the substrate 15 is in contact with the guide members 23 and 24. Corresponding to the region, light emitting elements 35, 36, and second light emitting elements 35, 36, and 32 are respectively provided at positions opposite to the positions where light emitting elements 27, 28, first emission through holes 29, 30, and first light receiving elements 31, 32 are provided. Outgoing through holes 37, 38 and second light receiving elements 39, 40. Therefore, the second light-receiving elements 39 and 40 are respectively installed on the supply mechanism 13 in such a way that the second light-receiving element 39 and the light-emitting element 39 and the light emitting The element 35 and the second emission through hole 37 overlap, and the second light receiving element 40 overlaps with the light emitting element 36 and the second emission through hole 38.

With reference to Fig. 6, an operation for inspecting whether abnormalities such as wear or chipping have occurred on the guide members 23 and 24, or whether deformation such as warpage or bending has occurred on the substrate 15 before molding will be described.

Fig. 6(a) shows that the substrate 15 is normally positioned on the surface of the upper mold 9 before molding without abnormalities such as wear or defect of the guide members 23 and 24, and warpage or bending of the substrate 15 before molding. On the status. As shown in Fig. 6(a), when the substrate 15 is normally positioned on the molding surface of the upper mold 9 before molding, the irradiated light 33 emitted from the four light-emitting elements 27, 28, 35, 36 is all molded The front substrate 15 is blocked. Therefore, none of the four light receiving elements (the first light receiving elements 31, 32 and the second light receiving elements 39, 40) detects the irradiation light 33.

Since the first light receiving elements 31 and 32 do not detect the irradiated light 33, the judgment unit judges that the substrate 15 and the guide members 23 and 24 are in normal contact before the molding. Since the second light receiving elements 39, 40 do not detect the irradiated light 33, the determination unit determines that the guide members 23, 24 have no abnormalities such as wear or chipping, and no warpage or bending deformation has occurred on the substrate 15 before molding. In this way, the four light-receiving elements (the first light-receiving element 31, 32 and the When the two light-receiving elements 39, 40) do not detect the irradiated light 33, the judging part determines that there is no abnormality and the substrate 15 is normally positioned on the surface of the upper mold 9 before forming, and the next process is entered.

When the first light-receiving elements 31 and 32 detect the irradiated light 33, the judgment unit judges that the substrate 15 is not in normal contact with the guide member 23 or 24 before molding, and stops entering the next process. And, the positioning of the substrate 15 before molding is performed again.

Fig. 6(b) shows a state in which abnormalities such as wear or chipping of the guide members 23 and 24 have occurred. For example, it indicates a state in which a guide member arranged in the Y direction is worn or chipped.

As shown in FIG. 6(b), the end of the pre-molding substrate 15 is pressed by the positioning mechanism 25 (see FIG. 3(b)) to the guide member 23X where wear or defect occurs. Since the guide member 23X is worn or chipped and becomes smaller than the usual size, the substrate 15 before molding is pushed out to the +X direction side than the normal position. Thus, although the first through-hole 29 for ejection is blocked by the pre-molding substrate 15, a part of the second through-hole 37 for ejection is not blocked by the pre-molding substrate 15. Therefore, although the irradiation light 33 emitted from the light-emitting element 27 is blocked by the pre-molding substrate 15, the irradiating light 33 emitted from the light-emitting element 35 passes through the pre-molding substrate 15 and reaches the second light receiving element 39. Thus, the second light receiving element 39 detects the irradiation light 33. When the second light receiving element 39 detects the irradiation light 33, the determination unit determines that there is a possibility that an abnormality such as abrasion or chipping may have occurred on the guide member 23X. Then, the judgment unit stops entering the next process and investigates the abnormality of the guide member.

Similarly, when the second light receiving element 40 (see FIG. 5(a)) detects the irradiated light 33, the determination unit determines that there is a possibility that abnormalities such as wear or chipping may have occurred on the guide member 24. Then, the judgment unit stops entering the next process. In this way, when any one of the second light receiving elements 39, 40 detects the irradiated light 33, it is determined that there is a possibility of wear or chipping on the guide members 23, 24. Exception and stop entering the next process. Thus, it is possible to suppress the occurrence of molding defects caused by abnormalities of the guide members 23 and 24.

(C) of FIG. 6 shows a state where warpage, which is one of the deformations, has occurred on the substrate 15 before molding. For example, it shows a state where the substrate 15 before molding is warped to the side where the semiconductor wafer 14 is mounted.

As shown in FIG. 6(c), the end of the pre-molding substrate 15 that has warped, for example, is pressed against the guide member 23 by the positioning mechanism 25 (see FIG. 3(b)). Since the pre-molding substrate 15 is warped, the pre-molding substrate 15 is arranged on the upper mold 9 in a state where both ends of the pre-molding substrate 15 in the Y direction are raised from the molding surface of the upper mold 9. Thus, although the first through-hole 29 for ejection is blocked by the pre-molding substrate 15, a part of the second through-hole 37 for ejection is not blocked by the pre-molding substrate 15. Therefore, although the irradiation light 33 emitted from the light-emitting element 27 is blocked by the pre-molding substrate 15, the irradiating light 33 emitted from the light-emitting element 35 passes through the pre-molding substrate 15 and reaches the second light receiving element 39. Thus, the second light receiving element 39 detects the irradiation light 33. When the second light receiving element 39 detects the irradiated light 33, the judgment unit judges that there is a possibility that warpage has occurred on the substrate 15 before molding. Then, the judgment unit stops entering the next process, and investigates the state of the substrate 15 before molding.

Similarly, when the second light receiving element 40 (refer to (a) of FIG. 5) detects the irradiated light 33, the judgment unit judges that there is a possibility that the pre-molding substrate 15 has warped. Then, the judgment unit stops entering the next process. In this way, when any one of the second light receiving elements 39 and 40 detects the irradiated light 33, it is determined that there is a possibility of warping on the substrate 15 before molding and the next process is stopped. Thereby, it is possible to suppress the occurrence of molding defects caused by warpage generated on the substrate 15 before molding.

When any one of the second light receiving elements 39, 40 detects the irradiated light 33, it is possible that abnormalities such as wear or chipping may occur on the guide members 23, 24, or the substrate 15 may be produced before molding. Warped. Although it is necessary to confirm the cause of these abnormalities, in any case, The judgment unit also judged that some kind of abnormality might have occurred and stopped entering the next process. Thus, it is possible to suppress the occurrence of molding defects caused by the positioning of the substrate 15 before molding.

As described above, if any one of the four light receiving elements (first light receiving elements 31, 32 and second light receiving elements 39, 40) provided in the supply mechanism 13 detects the irradiated light 33, it can be determined that An abnormality occurred in the positioning of the substrate 15 before molding. When the first light receiving elements 31 and 32 detect the irradiated light 33, it is determined that the substrate 15 is not in normal contact with the guide members 23 and 24 before molding. When the second light-receiving elements 39, 40 detect the irradiated light 33, it is determined that there may be abnormalities such as wear or chipping on the guide members 23, 24, or there may be warping or warping on the substrate 15 before molding. Deformation such as bending. Here, when the second light-receiving elements 39, 40 detect the irradiated light 33, it is determined that abnormalities such as wear or chipping may occur on the guide members 23, 24, or it is determined that it may be on the substrate 15 before molding. Deformation such as warpage or bending occurs, or it is judged that the abnormality of the guide members 23 and 24 and the deformation of the substrate 15 before molding may occur simultaneously. In these cases, stop entering the next process.

In the case where none of the four light receiving elements (the first light receiving elements 31, 32 and the second light receiving elements 39, 40) detects the irradiated light 33, it is determined that there is no abnormality such as wear or damage of the guide members 23, 24, and In the case of deformation such as warpage or bending of the substrate 15 before molding, the substrate 15 before molding is normally positioned on the molding surface of the upper mold 9. In this case, proceed to the next process. Therefore, it is possible to perform resin molding in a state after the normal positioning of the substrate 15 is checked before molding, and it is possible to suppress the occurrence of molding defects due to positioning.

According to the light intensity received by the four light receiving elements (the first light receiving element 31, 32 and the second light receiving element 39, 40), the four exit through holes (first exit through holes) provided in the upper mold 9 can be arbitrarily set. The diameters of the holes 29, 30 and the second ejection through holes 37, 38). When the diameter of these through-holes for ejection is small, the through-holes for ejection may be blocked by a resin material, foreign matter, or the like. Therefore, it is preferable to periodically check whether there are abnormalities such as resin clogging on the four ejection through holes. For example, before the molding substrate 15 is supplied to In the state of the upper mold 9, the four light-emitting elements 27, 28, 35, and 36 emit irradiation light 33, respectively. When each of the four light-receiving elements (the first light-receiving elements 31, 32 and the second light-receiving elements 39, 40) detects the irradiated light 33, it can be judged as four exit through holes (first exit No abnormalities such as resin clogging occurred in the through holes 29 and 30 and the second ejection through holes 37 and 38). When any one of the four light receiving elements (the first light receiving elements 31, 32 and the second light receiving elements 39, 40) does not detect the irradiated light 33, it can be determined that the light receiving of the irradiated light 33 is not detected. An abnormality occurred in the through hole for ejection corresponding to the component. In this way, it is also possible to check the abnormality of the four ejection through holes (the first ejection through holes 29 and 30 and the second ejection through holes 37 and 38) provided in the upper mold 9.

In addition, a mechanism for checking whether abnormalities such as wear or chipping have occurred on the guide members 23 and 24 or whether deformation such as warpage or bending has occurred on the substrate 15 before molding may be applied in other embodiments.

(Effect)

In this embodiment, the resin molding apparatus has the following structure. That is, the resin molding apparatus includes: a molding die 11 having an upper die 9 as a first die and a lower die 10 as a second die arranged opposite to each other; a supply mechanism 13 for supplying the upper die 9 and the lower die 10 The molding surface of the upper mold 9 or the lower mold 10 of any one of the molds supplies the pre-molding substrate 15 as the object of resin molding; positioning mechanisms 25, 26 are used to position the pre-molding substrate 15 on the molding surface to the guide members 23, 24; mold clamping mechanism 6 for clamping the molding mold 11; light emitting elements 27, 28 for emitting illuminating light 33; first light receiving elements 31, 32, which are provided in the supply mechanism 13 and can receive illuminating light 33 ; And a judging part for judging the positioning of the substrate 15 before molding. Among them, the upper mold 9 is provided with first emitting through holes 29, 30 through which the irradiated light 33 from the light emitting elements 27, 28 passes, and the judging unit is based on the first light receiving elements 31, 32 to pass through the first emitting through holes The detection of irradiation light at 29 and 30 determines whether the substrate 15 is normally positioned to the guide members 23 and 24 before molding.

The method of manufacturing a resin molded product of the present embodiment includes a supply process of supplying a pre-molding substrate 15 as a resin molding object to the surface of an upper mold 9 or a lower mold 10 that is any one of the molding dies 11, wherein the The forming mold 11 has the upper mold 9 as a first mold and the lower mold 10 as a second mold, which are arranged opposite to each other; a positioning process, positioning the substrate 15 before forming on the mold surface to the guide members 23, 24; During the irradiation process, the irradiated light 33 is emitted from the light-emitting elements 27 and 28, and the irradiated light 33 passes through the first outgoing through holes 29, 30 provided in the upper mold 9. The detection process is performed by the first light receiving element 31 provided in the supply mechanism 13 , 32 to detect the irradiated light 33 passing through the first outgoing through holes 29, 30; to determine the process, based on the detection in the inspection process, to determine whether the substrate 15 is normally positioned to the guide parts 23, 24 before molding; and the resin molding process, in When it is determined in the judgment process that the substrate 15 is normally positioned before molding, the molding die 11 is clamped during the resin molding process to perform resin molding.

According to this structure, it is possible to perform resin molding while checking that the pre-molding substrate 15 supplied to the molding die 11 as a resin molding object is normally positioned on the guide members 23 and 24, and the occurrence of molding defects due to positioning can be suppressed. Therefore, resin molding is performed when it is determined that the substrate 15 is normally positioned before molding. If it is determined that the substrate 15 is not normally positioned before molding, the resin molding is stopped.

In more detail, according to this embodiment, in order to check whether the pre-molding substrate 15 that is the object of resin molding is normally positioned on the guide members 23, 24 provided on the upper mold 9 of the molding die, the light-emitting elements 27, 28 and the first Light receiving elements 31, 32. By bringing the pre-molding substrate 15 into contact with the guide members 23 and 24, the pre-molding substrate 15 is positioned on the upper mold 9. When the pre-molding substrate 15 is normally positioned to the guide members 23 and 24, no gap will be generated between the end surface of the pre-molding substrate 15 and the guide members 23 and 24. Thereby, the substrate 15 before molding blocks the irradiation light 33 emitted from the light emitting elements 27 and 28. Therefore, the first light receiving elements 31 and 32 cannot detect the irradiation light 33. The two light-receiving elements 31 and 32 are not detected When the irradiation light 33 is reached, the determination unit determines that the substrate 15 is normally positioned on the guide members 23 and 24 before molding. When it is determined that the substrate 15 is normally positioned before molding, resin molding is performed.

In the case where the substrate 15 is not normally positioned to the guide member 23 or 24 before molding, a gap is generated between the end surface of the substrate 15 and the guide member 23 or 24 before molding. When a gap occurs, the irradiation light 33 emitted from the light-emitting elements 27 and 28 reaches the first light-receiving elements 31 and 32 after passing through the gap. When any one of the first light receiving elements 31 and 32 detects the irradiated light 33, the determination unit determines that the substrate 15 is not normally positioned on the guide member 23 or 24 before molding. If it is determined that the substrate 15 is not normally positioned before molding, the resin molding is stopped. Therefore, it is possible to suppress the occurrence of molding defects caused by the positioning of the substrate 15 before molding.

In addition, according to this embodiment, in order to check the abnormality of the guide members 23 and 24 or the deformation of the substrate 15 before molding, the light emitting elements 35 and 36, the second emission through holes 37 and 38 and the second light receiving elements 39 and 40 are respectively provided. When any one of the second light-receiving elements 39 or 40 detects the irradiated light 33, it is determined that abnormalities such as wear or chipping may have occurred on the guide members 23, 24, or the substrate 15 may be formed before molding. Deformation such as warping or bending occurred on the surface. In these cases, stop entering the next process, and investigate the abnormality of the guide members 23 and 24 or the deformation of the substrate 15 before molding. Thereby, it is possible to suppress the occurrence of molding defects caused by abnormalities of the guide members 23 and 24 or deformation of the substrate 15 before molding.

In addition, according to this embodiment, in a state where the pre-molding substrate 15 is not supplied to the upper mold 9, the four light-emitting elements 27, 28, 35, and 36 emit irradiation light 33, respectively. When each of the four light-receiving elements (the first light-receiving elements 31, 32 and the second light-receiving elements 39, 40) detects the irradiated light 33, it is determined as four through-holes for emission (for the first emission). No abnormalities such as resin clogging occurred in the through holes 29, 30 and the second ejection through holes 37, 38). When any one of the light-receiving elements (the first light-receiving elements 31, 32 and the second light-receiving elements 39, 40) does not detect the irradiated light 33, it is judged as different from the undetected light. An abnormality has occurred in the emission through hole corresponding to the light receiving element that emits the light 33. In this case, it is checked and cleaned for clogging of the emission through hole corresponding to the light receiving element that has not detected the irradiation light 33. Thereby, it is possible to suppress the occurrence of molding defects caused by abnormalities in the ejection through holes (the first ejection through holes 29, 30 and the second ejection through holes 37, 38).

As described above, according to the present embodiment, for example, when the pre-molding substrate 15 that is the object of resin molding is not in normal contact with the guide members 23, 24, the guide members 23, 24 are worn or damaged, and the pre-molding substrate 15 When there is deformation such as warpage or bending on the top, and when resin clogging occurs in the first through-holes 29, 30, and the second through-holes 37, 38 for ejection, etc., an abnormality caused by positioning occurs, Stop entering the next process. Thereby, it is possible to suppress the occurrence of molding defects due to positioning. Therefore, it is possible to perform resin molding in a state after checking that the substrate 15 is normally positioned before molding.

In this embodiment, as a device for positioning the substrate 15 before molding, positioning mechanisms 25 and 26 provided on the upper mold 9 or the fixed platen 4 are used. It is not limited to this, and a positioning mechanism may be provided on the supply mechanism 13. After the supply mechanism 13 transfers the pre-molding substrate 15 to the molding surface of the upper mold 9, the positioning mechanism provided in the supply mechanism 13 pushes the pre-molding substrate 15 to the guide members 23 and 24, respectively. Thereby, the pre-molding substrate 15 can be positioned on the molding surface of the upper mold 9. By providing a positioning mechanism on the supply mechanism 13, the structure of the resin molding apparatus can be simplified.

In addition, the supply mechanism 13 itself can be used as a positioning mechanism. When the supply mechanism 13 itself is used as a positioning mechanism, the substrate 15 before molding is transferred to the molding surface of the upper mold 9, and the substrate 15 before molding is moved in the X direction and the Y direction by the supply mechanism 13 The end faces of the substrate 15 before molding are pressed against the guide members 23 and 24, respectively. Thereby, the pre-molding substrate 15 can be positioned on the molding surface of the upper mold 9. By using the supply mechanism 13 itself as a positioning mechanism, the structure of the resin molding apparatus can be further simplified.

[Embodiment 2]

With reference to Fig. 7, a mechanism for checking whether the pre-molding substrate 15 supplied to the upper mold 9 is normally positioned in the second embodiment will be described. The second embodiment differs from the first embodiment in that the light emitting element 27 is provided outside the fixed platen 4 and an optical member for reflecting the irradiated light 33 is provided on the light guide portion provided on the fixed platen 4. The structure and operation other than this are the same as those of the first embodiment, so the description is omitted. In addition, in the following embodiments, a description will be given of a case where there is no abnormality such as wear or chipping in the guide members 23 and 24 and the substrate 15 is not deformed such as warpage or bending before molding.

As shown in (a) and (b) of Figure 7, the fixed platen 4 is provided with a light guide portion 41 connected to the first exit through hole 29 and extending in the X direction; and a light guide portion 42 , Which is connected to the first emission through hole 30 and extends in the Y direction. The light emitting element 27 is arranged in the extending direction of the light guide 41 extending in the X direction. Similarly, the light emitting element 28 is arranged in the extending direction of the light guide portion 42 extending in the Y direction.

As shown in FIG. 7(b), a reflecting mirror 43 is provided in the light guide portion 41, and the reflecting mirror 43 changes the traveling direction of the irradiation light 33 emitted from the light emitting element 27 in the −X direction by 90 degrees. The irradiation light 33 whose traveling direction is changed to the −Z direction by the reflecting mirror 43 passes through the first exit through hole 29 and reaches the pre-molding substrate 15. Similarly, a reflecting mirror 44 is provided in the light guide portion 42 for changing the traveling direction of the irradiation light 33 emitted from the light-emitting element toward the -Y direction by 90 degrees. The irradiation light 33 whose traveling direction is changed to the −Z direction by the reflecting mirror 44 passes through the first exit through hole 30 and reaches the pre-molding substrate 15.

As shown in FIG. 7(c), the arrangement of the first light receiving elements 31 and 32 provided in the supply mechanism 13 is the same as that of the first embodiment. The operation for checking the positioning of the substrate 15 before molding is the same as in the first embodiment. Therefore, the present embodiment also obtains the same effect as the first embodiment.

[Embodiment 3]

With reference to Fig. 8, the mechanism and operation for checking whether the pre-molding substrate 15 supplied to the upper mold is normally positioned in the third embodiment will be described. The third embodiment is different from the first embodiment in that the light-emitting elements 27 and 28 are provided in the supply mechanism, and the light guide portion provided on the fixed platen is provided with two mirrors as optical components. With this change, the structures of the upper mold, the lower mold, and the fixed platen are different from those of the first and second embodiments.

(Substrate positioning inspection agency)

Referring to Fig. 8, the mechanism for checking whether the pre-molding substrate 15 supplied to the upper mold is normally positioned will be described. As shown in Fig. 8 (b) and (c), the supply mechanism 45 is provided with The light-emitting element 27 and the first light-receiving element 31 of the structural elements positioned in the X direction of the substrate 15 before molding are inspected. Similarly, the supply mechanism 45 is provided with a light-emitting element 28 and a first light-receiving element 32 as structural elements for checking the positioning of the substrate 15 in the Y direction before molding.

As shown in Fig. 8 (a), (b), (c), the upper mold 48 is provided with an incident light for passing the irradiated light 33 emitted from the light emitting elements 27 and 28 provided in the supply mechanism 45, respectively. Through holes 46 and 47. The light emitting element 27 and the incident through-hole 46 are arranged so as to overlap in a plan view. Similarly, the light-emitting element 28 and the incident through-hole 47 are arranged so as to overlap in a plan view. In addition, "for incident" means that the irradiated light 33 is incident on the light guide portions 50, 51 (described later) on the upper mold 48 side from the external light emitting elements 27, 28.

The fixed platen 49 is provided with a light guide 50 connected to the first through hole for emission and the through hole 46 for incidence along the X direction. Similarly, the fixed platen 49 is provided with a light guide 51 connected to the first through hole 30 for emission and the through hole 47 for incidence along the Y direction. In the light guide 50, mirrors 43a and 43b for changing the traveling direction of the irradiation light 33 by 90 degrees are provided as optical components, respectively. Similarly, in the light guide portion 51, mirrors 44a and 44b for changing the traveling direction of the irradiation light 33 by 90 degrees are provided as optical components, respectively.

(Substrate positioning inspection operation (method of manufacturing resin molded products))

Referring to Fig. 8, the operation for checking whether the pre-molding substrate 15 supplied to the upper mold is normally positioned will be described. In addition, this description also serves as a description of the method of manufacturing a resin molded product.

As shown in (b) of FIG. 8, the irradiation light 33 emitted from the light emitting element 27 in the +Z direction passes through the entrance through hole 46 and then enters the mirror 43a. The irradiation light 33 that has entered the mirror 43a changes its traveling direction by 90 degrees by the mirror 43a, travels in the -X direction in the light guide 50, and enters the mirror 43b. The irradiation light 33 that has entered the mirror 43b changes the traveling direction by 90 degrees by the mirror 43b, travels in the -Z direction, and passes through the first exit through hole 29. The irradiated light 33 passing through the first exit through hole 29 reaches the pre-molding substrate 15.

According to whether the first light-receiving element 31 provided in the supply mechanism 45 detects the irradiated light 33 emitted from the light-emitting element 27 and passed through the incident through hole 46, the light guide 50, and the first exit through hole 29 in order to determine the pre-molding Whether the substrate 15 is normally positioned in the X direction. Similarly, according to whether the second light-receiving element 32 detects the irradiated light 33 emitted from the light-emitting element 28 and sequentially passed through the incident through hole 47, the light guide 51, and the first outgoing through hole 30, it is determined whether the substrate 15 before molding is normal Position in the Y direction. In this way, the positioning of the substrate 15 before molding can be checked. In this case, since the light-emitting elements 27 and 28 and the first light-receiving elements 31 and 32 are all provided in the supply mechanism 45, it is easy to wire their signal lines to the control unit and the judgment unit of the resin molding apparatus. Since the same effect as that of the first embodiment is obtained, the description of the effect is omitted.

[Embodiment 4]

With reference to Fig. 9, a mechanism for checking whether the pre-molding substrate 15 supplied to the upper mold 48 is normally positioned in the fourth embodiment will be described. The fourth embodiment is different from the third embodiment in that an optical fiber is used as an optical component instead of a mirror. The structure and operation other than this are the same as those of the third embodiment, so the description is omitted.

As shown in (a) and (b) of FIG. 9, optical fibers 52 and 53 are respectively provided on the light guide portions 50 and 51 provided on the fixed platen 49. Preferably the optical fibers 52 and 53 are optical fibers having heat resistance. The optical fibers 52 and 53 have a dual structure of a core wire at the center and a metal cladding surrounding the core wire. In order to maintain heat resistance, it is preferable to use an optical fiber in which the core wire and the metal clad of the optical fiber are made of silica glass, and the optical fiber is covered with heat-resistant polyimide.

Corresponding to the diameters of the first exit through holes 29, 30 and the entrance through holes 46, 47, a single-core fiber with a single fiber can be used, or a single-core fiber formed by bundling and coating multiple single-core fibers can be used Fiber optic bundle. In addition, the optical fiber lens can be embedded at both ends of the optical fiber. As the lens, a collimator lens, a condenser lens, an aspheric lens, or the like can be suitably used. FIG. 9 shows a case where the optical fiber lens 54 is provided on the side receiving the irradiation light 33 emitted from the light emitting elements 27 and 28, respectively. The optical fibers 52 and 53 have the characteristics of low transmission loss and high wiring freedom. In addition, as the optical fiber, a heat-resistant optical fiber is preferably used. For example, a silica optical fiber coated with polyimide can be used.

The operation for checking the positioning of the substrate 15 before molding is the same as that of the first embodiment, so the description will not be repeated. This embodiment also has the same effect as the first embodiment.

[Embodiment 5]

With reference to Fig. 10, a mechanism for checking whether the pre-molding substrate 15 supplied to the upper mold 48 is normally positioned in the fifth embodiment will be described. The difference between the fifth embodiment and the fourth embodiment is that the optical fiber is provided in the light guide portion provided in the upper mold 48, and the path of the irradiation light 33 emitted from the light emitting element 27 to the first light receiving element 31 is formed only by the upper mold. 48. The inside of the position range formed by the supply mechanism 45 and the space between the upper mold 48 and the supply mechanism 45. The structure and operation other than this are the same as those of the fourth embodiment, so the description is omitted.

As shown in (a) and (b) of FIG. 10, the optical fibers 52 and 53 shown in Embodiment 4 are respectively provided in the light guide portions 55 and 56 provided on the upper mold 48. The optical fibers 52 and 53 are optical fibers having heat resistance.

The operation for checking the positioning of the substrate 15 before molding is the same as in the first embodiment. This embodiment also has the same effect as the first embodiment.

[Embodiment 6]

Referring to Fig. 11, the sixth embodiment is used to simultaneously check whether the pre-molding substrate 15 supplied to the upper mold 9 is normally positioned on the guide members 23, 24, and whether the guide members 23, 24 have abnormalities such as wear or chipping. , Or whether there is a deformation mechanism such as warpage or bending on the substrate 15 before molding. The sixth embodiment is different from the previously described embodiments in that the installation positions of the first emission through holes 29 and 30 are different.

As shown in Fig. 11(a), in the state where the substrate 15 is in contact with the guide members 23 and 24 before molding, for example, the upper mold 9 is arranged at the diagonal corners in the area where the substrate 15 before molding is arranged The first exit through holes 29 and 30 are respectively provided in the parts (upper right and lower right in FIG. 11). In the state where the first emitting through holes 29 and 30 are provided at this position, the light emitting element 27 and the first light receiving element 31 are arranged so as to overlap the first emitting through hole 29 in a plan view, and the light emitting element 28 and the first light receiving element The element 32 is provided so as to overlap with the first emission through hole 30 in a plan view.

When the two light-receiving elements of the first light-receiving elements 31, 32 do not detect the irradiated light 33 emitted from the light-emitting elements 27, 28, it can be judged that there is no positioning failure of the substrate 15 before molding, and the failure of the guide members 23, 24. Abnormalities and deformation of the substrate 15 before molding. When any one of the first light receiving elements 31, 32 detects the irradiated light 33, it can be judged that the positioning failure of the substrate 15 before molding, the abnormality of the guide members 23, 24, and the deformation of the substrate 15 before molding have occurred. Either of them, the substrate 15 is not normally positioned before molding.

With this configuration, it is possible to simultaneously inspect the positioning failure of the substrate 15 before molding, the abnormality of the guide members 23 and 24, and the deformation of the substrate 15 before molding without increasing the number of light emitting elements and light receiving elements. Therefore, in the resin molding apparatus, the cost of the positioning mechanism can be suppressed.

[Embodiment 7]

With reference to Fig. 12, a mechanism for checking whether the pre-molding substrate 15 supplied to the upper mold 9 is normally positioned in the seventh embodiment will be described. The seventh embodiment is different from the first embodiment in that two light-emitting elements and two light-receiving elements are respectively provided at the ends of the substrate 15 before molding in the Y direction and the X direction, and the positioning of the substrate 15 before molding is checked. Therefore, it is possible to check whether the substrate 15 is normally positioned before molding not only in the X direction and the Y direction, but also in the θ direction. The structure other than this is the same as that of the first embodiment, so the description is omitted.

(Substrate positioning inspection agency)

With reference to Fig. 12, a mechanism for checking the positioning of the pre-molding substrate 15 supplied to the upper mold 9 in the seventh embodiment will be described. As shown in Fig. 12(a), in the seventh embodiment, similarly to the first embodiment, a guide member 23 is provided on the molding surface of the upper mold 9 to position the substrate 15 before molding in the X direction; and The guide member 24 is used to position the pre-molding substrate 15 in the Y direction.

As shown in (a) and (b) of FIG. 12, in order to verify the positioning of the substrate 15 in the X direction before molding, two light-emitting elements 27a and 27b are provided inside the fixed platen 4. Similarly, in order to verify the positioning of the substrate 15 in the Y direction before molding, two light-emitting elements 28a and 28b are provided inside the fixed platen 4.

The upper mold 9 is provided with first emission through holes 29a and 29b through which the irradiated light emitted by the light-emitting elements 27a and 27b passes, respectively. As shown in Figure 12(a), the first ejection through holes 29a, 29b are respectively provided in the state that the pre-molding substrate 15 is in contact with the guide member 23 and the pre-molding substrate 15 is placed on the upper mold. 9 on the surface area. The first ejection through holes 30 a and 30 b are respectively provided in the area where the pre-molding substrate 15 is arranged on the molding surface of the upper mold 9 in a state where the pre-molding substrate 15 is in contact with the guide member 24.

As shown in FIG. 12(c), the supply mechanism 13 is provided with first light receiving elements 31a, 31b for detecting the irradiation light 33 emitted by the light emitting elements 27a, 27b, respectively. The first light-receiving elements 31a and 31b are light-receiving elements for checking the positioning of the substrate 15 in the X direction before molding. Similarly, the supply mechanism 13 is provided with first light-receiving elements 32a, 32b for inspecting the irradiation light 33 emitted by the light-emitting elements 28a, 28b, respectively. The first light-receiving elements 32a and 32b are light-receiving elements for checking the positioning of the substrate 15 in the Y direction before molding.

Since there are two first light-receiving elements 31a, 31b along the Y direction, and two first light-receiving elements 32a, 32b along the X direction, the molding can be checked not only in the X and Y directions, but also in the θ direction Whether the front substrate 15 is positioned normally. As a result, the positioning of the substrate 15 before molding can be checked with higher accuracy.

In this embodiment, two first light receiving elements 31a and 31b are provided along the Y direction, and two first light receiving elements 32a and 32b are provided along the X direction. It is not limited to this, and a structure in which two first light receiving elements are provided along the Y direction and one first light receiving element is provided along the X direction may be adopted. Alternatively, it may be a structure in which two first light receiving elements are provided along the X direction and one first light receiving element is provided along the Y direction. In these cases, not only in the X direction and the Y direction, but also in the θ direction, it is possible to check whether the substrate 15 is normally positioned before molding.

Since the positioning inspection operation of the substrate 15 before molding in this embodiment is basically the same as that in Embodiment 1, the description will not be repeated. Regarding the effects, the same effects as in the first embodiment are obtained. In addition, the mechanism for inspecting the abnormality of the guide member or the deformation of the substrate 15 before molding can also be inspected in the same manner as in the first embodiment.

[Embodiment 8]

With reference to Fig. 13, a mechanism for checking the positioning of the pre-molding substrate 15 supplied to the upper mold 9 in the eighth embodiment will be described. The eighth embodiment differs from the seventh embodiment in that one light-emitting element and two first light-receiving elements are respectively provided in order to verify the positioning in the X direction and the Y direction. The two first light-receiving elements receive the irradiated light 33 emitted by the light-emitting element through the optical fiber provided in the light guide portion in the fixed platen 4. The structure and operation other than this are the same as those of the seventh embodiment, so the description is omitted.

As shown in (a) and (b) of FIG. 13, in order to verify the positioning of the substrate 15 in the X direction before molding, a T-shaped light guide 57 is provided inside the fixed platen 4. The T-shaped light guide 57 is provided with an optical fiber 58, a branching member 59 for branching light traveling in the optical fiber 58, and branched optical fibers 58a and 58b. The irradiated light 33 emitted by the light emitting element 27 passes through the optical fibers 58a and 58b and the first emission through holes 29a and 29b via the optical fiber 58 and the branch member 59 in this order, and is detected by the first light receiving elements 31a and 31b, respectively.

Similarly, in order to verify the positioning of the substrate 15 in the Y direction before molding, a light guide 60 having a T-shaped shape is provided inside the fixed platen 4. The T-shaped light guide 60 is provided with an optical fiber 61, a branching member 62 for branching the light traveling in the optical fiber 61, and branched optical fibers 61a and 61b. The irradiated light 33 emitted by the light emitting element 28 passes through the optical fibers 61a and 61b and the first emission through holes 30a and 30b via the optical fiber 61 and the branching member 62 in this order, and is detected by the first light receiving elements 32a and 32b, respectively.

With this structure, the number of light-emitting elements can be reduced, and it is possible to check whether the substrate 15 is normally positioned before molding not only in the X direction and the Y direction, but also in the θ direction. Therefore, the positioning of the substrate 15 before molding can be verified with higher accuracy, and the cost of the positioning mechanism can be suppressed.

Here, although the irradiated light 33 emitted from the common light-emitting element 28 is branched to the two first exit through holes 30a, 30b, the irradiated light 33 may be branched to the first exit through hole and the second exit. Use through holes.

In this embodiment, in order to branch the irradiation light 33 emitted by the light emitting element, an optical fiber and a branch member are used. It is not limited to this, and it is not particularly limited as long as an optical member for branching the irradiated light emitted from the light-emitting element is used.

[Embodiment 9]

(Structure of resin molding equipment)

The structure of the resin molding apparatus according to the present invention will be described with reference to Fig. 14. The resin molding apparatus shown in FIG. 14 is a resin molding apparatus using a compression molding method, for example. As shown in Embodiment 1, an example is shown in which the pre-molding substrate 15 is used as a resin molding object and a liquid resin is used as the resin material.

The resin molding apparatus 63 includes a substrate supply storage module 64, three molding modules 65A, 65B, 65C, and a resin supply module 66 as constituent elements, respectively. The substrate supply storage module 64, the molding modules 65A, 65B, 65C, and the resin supply module 66 as the structural elements can be attached to and detached from other structural elements, and can be exchanged.

The substrate supply and storage module 64 is provided with a pre-molding substrate supply portion 67 for supplying the pre-molding substrate 15; a post-molding substrate storage portion 68 for accommodating the resin molded product 22 as a molded substrate; and a substrate placement portion 69, used to transfer the pre-molding substrate 15 and the resin molded product 22; and a supply mechanism 13 for supplying the pre-molding substrate 15 to the molding die 11. In this case, for example, the supply mechanism 13 shown in Embodiment 1 is provided (see (b) and (c) in FIG. 3). The supply mechanism 13 is provided with first light receiving elements 31 and 32 for checking the positioning of the substrate 15 before molding. In this embodiment, the positioning inspection mechanism described in Embodiment 1 is shown, but the positioning inspection mechanism described in other embodiments may be adopted.

The resin molding unit 1 shown in FIG. 1 is provided in each molding module 65A, 65B, and 65C. The resin molding unit 1 is provided with a lower mold 10 that can be raised and lowered and a lower mold 10 arranged opposite to Upper mold 9 (refer to (a) and (b) of Figure 3). The upper mold 9 and the lower mold 10 construct a forming mold 11 together (refer to FIG. 2). Each molding module 65A, 65B, 65C has a mold clamping mechanism 6 (a portion indicated by a two-dot chain line in FIG. 14) for clamping and opening the upper mold 9 and the lower mold 10. A cavity 16 is provided in the lower mold 10, and the cavity 16 is a space where the liquid resin 20 (see (b) of FIG. 2) is supplied and cured. The lower mold 10 is provided with a release film supply mechanism 70 for supplying a long release film (see (a) of FIG. 2). In addition, the structure in which the cavity 16 is provided in the lower mold 10 is described here, but the cavity may be provided in the upper mold, and may also be provided in both the upper mold and the lower mold.

The resin supply module 66 is provided with a dispenser 18 for supplying the liquid resin 20 to the molding die 11 and a moving mechanism 19 for moving the dispenser 18. The front end of the dispenser 18 has a resin discharge part for discharging liquid resin.

The resin supply module 66 is provided with a control unit 72 having a judgment unit 71. The determining unit 71 determines whether the pre-molding substrate 15 is normally positioned in the molding die 11 based on whether the first light receiving elements 31 and 32 provided in the supply mechanism 13 have detected the irradiated light 33. In addition, the judgment unit 71 also judges whether an abnormality has occurred in the guide member or whether deformation has occurred in the substrate 15 before molding. The control unit 72 controls the transportation of the pre-molding substrate 15 and the resin molded product 22, the positioning of the pre-molding substrate 15, the supply of the liquid resin 20, the heating of the molding die 11, the opening and closing of the molding die 11, and the like. In other words, the control unit 72 controls various operations in the substrate supply storage module 64, the molding modules 65A, 65B, 65C, and the resin supply module 66.

The position of the control unit 72 can be any position. The control unit 72 can also be arranged on at least one of the substrate supply storage module 64, the molding modules 65A, 65B, 65C, and the resin supply module 66. It is arranged outside each module. In addition, the control unit 72 may be configured as a plurality of control units that are separated at least in part according to an operation as a control target. The determination unit 71 may be provided corresponding to the configuration of the control unit.

Since the outline of the operation of the resin molding apparatus 63 has been described in the method of manufacturing a resin molded article shown in FIG. 2, the description will not be repeated here.

In the present embodiment, three molding modules 65A, 65B, and 65C are arranged in the X direction between the substrate supply storage module 64 and the resin supply module 66. It is also possible to set the substrate supply storage module 64 and the resin supply module 66 as one module, and install one molding module 65A on the module along the X direction. In addition, other molding modules 65B can also be mounted on the molding module 65A. Thereby, it is possible to increase or decrease the molding modules 65A, 65B, ... in accordance with the production method or production volume. Therefore, the structure of the resin molding apparatus 63 can be optimized, and thus the productivity can be improved.

In each embodiment, by supplying the pre-molding substrate 15 to the upper mold of the molding die, and detecting the irradiation light 33 by the light receiving element provided in the supply mechanism, it is checked whether the pre-molding substrate 15 supplied to the upper mold is normally positioned. Not limited to this, the present invention can also be applied in the case where the pre-molding substrate 15 is supplied to the lower mold of the molding mold and positioned on the molding surface of the lower mold. Also in this case, the same effect as in each embodiment is obtained.

In each embodiment, a case is shown in which it is checked whether the pre-molding substrate 15 supplied to the upper mold is normally positioned in the molding mold of the resin molding apparatus using the compression molding method. Not limited to this, the present invention can also be applied to a molding die of a resin molding apparatus using a transfer molding method.

In each embodiment, an example in which the pre-molding substrate 15 on which the semiconductor wafer 14 is mounted is used as a resin molding object is shown. As the substrate before molding, ordinary substrates such as glass epoxy substrates, ceramic substrates, resin substrates, or metal substrates, lead frames, and the like can be used. In addition, the resin molding object may be a structure mounted on a plate jig as described in Patent Document 1.

In each embodiment, a resin molding apparatus and a method of manufacturing a resin molded product have been described. Among them, this resin molding apparatus is used when resin molding a semiconductor wafer. Resin The object of the type can be a semiconductor wafer such as an IC or a transistor, a non-semiconductor wafer that does not use a semiconductor, or a wafer group in which a semiconductor wafer and a non-semiconductor wafer are mixed together. The present invention can be applied to resin molding of one or more wafers mounted on a substrate such as a glass epoxy substrate, a ceramic substrate, or a lead frame using a hardened resin.

As described above, the resin molding apparatus of the above embodiment includes: a molding die having a first die and a second die arranged opposite to each other; and a supply mechanism for supplying a resin molding object to any one of the first die and the second die Positioning mechanism for positioning the resin molding object to the guide member on the molding surface; Mold clamping mechanism for clamping the molding mold; Light emitting element for emitting light; The first light receiving element is set in the supply Mechanism and capable of receiving irradiated light; and a judging section for judging the positioning of the resin molding object, a mold is provided with a first outgoing through hole that allows the irradiated light from the light-emitting element to pass, and the judging section is based on the first light receiving The element detects the irradiated light passing through the first emission through hole to determine whether the resin molded object is normally positioned on the guide member.

According to this structure, it is possible to perform resin molding in a state after checking that the resin molding object is normally positioned on the guide member. Therefore, it is possible to suppress the occurrence of molding defects due to positioning.

In addition, in the resin molding apparatus of the above-mentioned embodiment, the determining section has a structure: when the first light receiving element does not detect the irradiated light, it is determined that the resin molding object is normally positioned on the guide member; the first light receiving element detects the irradiation In the case of light, it is determined that the resin molded object is not properly positioned on the guide member.

According to this structure, based on whether the first light receiving element detects the irradiated light, it is determined whether the resin molded object is normally positioned on the guide member. Therefore, it is possible to suppress the occurrence of molding defects due to positioning.

In addition, the resin molding apparatus of the above-mentioned embodiment has a structure in which a first ejection through hole is provided in a region where the resin molding object on the guide member side is arranged in a state where the resin molding object is in contact with the guide member.

According to this structure, based on whether the first light-receiving element detects the irradiated light passing through the first outgoing through hole, it is determined whether the resin molded object is normally positioned on the guide member. Therefore, it is possible to suppress the occurrence of molding defects due to positioning.

In addition, the resin molding apparatus of the above embodiment has a structure in which one mold or a platen on which one mold is mounted is provided with a light guide portion for guiding the irradiated light emitted from the light emitting element to the first exit With the through hole, an optical member for passing the irradiated light is provided in the light guide portion.

According to this configuration, by providing the optical member on the light guide portion, it is possible to guide the irradiated light emitted from the light emitting element to the first emission through hole.

In addition, the resin molding apparatus of the above-mentioned embodiment has a structure in which the optical component includes any one of an optical fiber, a mirror, and a prism.

According to this structure, by using any one of an optical fiber, a mirror, and a prism, it is possible to guide the irradiated light to the first emission through hole.

In addition, the resin molding apparatus of the above-mentioned embodiment has a structure in which the light-emitting element is provided in the supply mechanism, and one mold is provided with an incident through hole for passing the irradiated light from the light-emitting element and It is guided to the light guide.

According to this configuration, the irradiated light emitted from the light emitting element provided in the supply mechanism can be guided to the first emission through hole via the incident through hole and the optical member.

In addition, the resin molding apparatus of the above-mentioned embodiment has a structure in which the resin molding object is arranged in an area on the opposite side of the guide member in a state where the resin molding object is in contact with the guide member A second emission through hole is provided for passing the irradiated light emitted from a light-emitting element or other light-emitting element, and a second light-receiving element capable of receiving the irradiated light is provided on the supply mechanism.

According to this configuration, it is possible to determine at least one of abnormality of the guide member and deformation of the resin molded object based on whether or not the second light receiving element detects the irradiated light passing through the second emission through hole provided on the opposite side of the guide member. Therefore, it is possible to suppress the occurrence of molding defects due to positioning.

The method of manufacturing a resin molded product of the above-mentioned embodiment includes: a supplying process of supplying a resin molding object to the molding surface of any one of the molding dies having a first mold and a second mold arranged opposite to each other through a supplying mechanism; a positioning process, Position the resin molding object to the guide member on the molding surface; the irradiation process, from the light-emitting element, emits the irradiated light through the first outgoing through hole provided in a mold; the detection process, the first light-receiving element provided in the supply mechanism passes through The first exit is detected by the irradiated light of the through hole; the judgment process is based on the detection in the detection process to judge whether the resin molding object is normally positioned to the guide member; and the resin molding process is judged as the resin molding object is normally positioned during the judgment process In this case, the molding die is closed during the resin molding process to perform resin molding.

According to this method, it is possible to perform resin molding in a state where it is verified that the resin molding object is normally positioned on the guide member. Therefore, it is possible to suppress the occurrence of molding defects due to positioning.

In addition, in the method for manufacturing a resin molded article of the above embodiment, when the first light receiving element does not detect the irradiated light in the inspection process, it is determined in the determination process that the resin molded object is normally positioned on the guide member; in the inspection process, the first When the light-receiving element detects the irradiated light, it is determined in the judging process that the resin molding device is not properly positioned to the guide member.

According to this method, based on whether the first light receiving element detects the irradiated light, it is determined whether the resin molded object is normally positioned on the guide member. Therefore, it is possible to suppress the occurrence of molding defects due to positioning.

In addition, in the method of manufacturing a resin molded article of the above-mentioned embodiment, the irradiated light passing through the first through-hole for exit is detected in the inspection process, wherein the first through-hole for exit is provided between the resin molded object and the guide member In the contact state, on the area where the resin molded object on the side of the guide member is arranged.

According to this method, it is determined whether or not the resin molded object is normally positioned on the guide member based on whether the first light receiving element detects the irradiated light passing through the first emission through hole. Therefore, it is possible to suppress the occurrence of molding defects due to positioning.

In addition, the method of manufacturing a resin molded article of the above embodiment emits irradiating light toward the light guide portion during the irradiation process, wherein the light guide portion is provided on a mold or a platen on which a mold is mounted, and the inspection During the manufacturing process, the irradiated light passing through the first emission through hole through the light guide portion is detected.

According to this method, it is determined whether or not the resin molded object is normally positioned on the guide member based on whether or not the first light receiving element detects the irradiated light passing through the first emission through hole via the light guide portion. Therefore, it is possible to suppress the occurrence of molding defects due to positioning.

In addition, in the method of manufacturing a resin molded article of the above embodiment, the light emitting element is provided in the supply mechanism, and the irradiated light from the light emitting element sequentially passes through the incident through hole, the light guide portion, and the first exit through hole provided in one mold Then it is detected by the first light-receiving element.

According to this method, it is judged whether the resin molding object is normal based on whether the first light receiving element detects the irradiated light emitted by the light emitting element provided in the supply mechanism and passing through the incident through hole, the light guide portion, and the first emission through hole in sequence Position to the guide part. Therefore, it is possible to suppress the occurrence of molding defects due to positioning.

In addition, in the method of manufacturing a resin molded article of the above embodiment, the detection process includes the following process: the second light receiving element detects the irradiated light emitted from the light emitting element or other light emitting element through the second emission through hole, wherein, In a state where the resin molding object is in contact with the guide member, the second ejection through hole is further provided on the area where the resin molding object on the opposite side of the guide member is arranged, and the judgment process is based on the detection process. 2. Detection by the light receiving element to determine at least one of the abnormality of the guide member and the deformation of the resin molded object.

According to this method, it is possible to determine at least one of abnormality of the guide member and deformation of the resin molded object based on whether the second light receiving element detects the irradiated light passing through the second emission through hole provided on the opposite side of the guide member.

Therefore, it is possible to suppress the occurrence of molding defects due to positioning.

The present invention is not limited to the above-mentioned respective embodiments, and can be combined, changed or selectively adopted arbitrarily and appropriately as needed within the scope not departing from the spirit of the present invention.

10: Lower die

13: Supply organization

14: Semiconductor wafer

15: Substrate before molding

16: cavity

23, 24: guide parts

25, 26: positioning mechanism

27, 28: Light-emitting components

29, 30: Through hole for the first shot

31, 32: the first light receiving element

4: fixed platen

9: upper die

Claims (4)

A resin molding device includes: a molding die having a first die and a second die arranged opposite to each other; a supply mechanism for supplying a resin molding object to the molding surface of any one of the first die and the second die Positioning mechanism for positioning the resin molding object to the guide member on the molding surface; Mold clamping mechanism for clamping the molding mold; Light emitting element for emitting light; First light receiving element Provided in the supply mechanism and capable of receiving the irradiated light; and a judging section for determining the positioning of the resin molded object, and a first emitting device for passing the irradiated light from the light-emitting element is provided in the one mold A through hole is provided in the one mold so as to correspond to the inner region of the end face of the resin molded object in a state where the resin molded object is in contact with the guide member, and the first light receiving element is provided as When the resin molding object is positioned on the guide member in a plan view, the first light receiving element overlaps the first emitting through hole, and a light guide portion is provided on the one mold, and the light guide portion is used to The irradiated light emitted from the light-emitting element is guided to the first emission through hole, and an optical member for passing the irradiated light is provided on the light guide portion, The light-emitting element is provided on the supply mechanism, and the one mold is provided with a through-hole for incidence, and the through-hole for incidence is used to pass and guide the irradiated light emitted from the light-emitting element to the light guide, and from the The path of the irradiated light emitted by the light-emitting element to the first light-receiving element is formed within the position range formed by only the one mold, the supply mechanism, and the space between the one mold and the supply mechanism. If the light receiving element does not detect the irradiated light, the judgment unit judges that the resin molding object is normally positioned on the guide member; if the first light receiving element detects the irradiated light, the judgment unit judges that the resin The molding object is not normally positioned to the guide part. The resin molding apparatus described in claim 1, wherein in the one mold, the resin molding object on the opposite side of the guide member is arranged in a state where the resin molding object is in contact with the guide member The area is provided with a second emission through hole, wherein the second emission through hole is used to pass the irradiated light emitted from the light-emitting element or other light-emitting elements, the supply mechanism is provided with a second light-receiving element, the The second light receiving element can receive the irradiated light passing through the second emission through hole. A method of manufacturing a resin molded product includes: a supplying process, supplying a resin molding object to the molding surface of any one of the molding dies having a first mold and a second mold disposed opposite to each other through a supplying mechanism; Position the resin molding object on the guide member on the molding surface; irradiate the manufacturing process to emit irradiated light from the light-emitting element, and the irradiated light passes through the first exit through hole provided in the one mold; The detection process, the first light-receiving element provided in the supply mechanism detects the irradiated light passing through the first exit through hole; the judgment process, based on the detection in the detection process, determines whether the resin molding object is normally positioned The guide member; and the resin molding process, in the case of determining that the resin molding object is normally positioned in the determining process, the molding mold is clamped to perform resin molding, and the first through hole for ejection is used in the resin When the molding object is in contact with the guide member, it is set on the one mold so as to correspond to the inner region of the end surface of the resin molding object, and the first light receiving element is set to be in a state where the resin molding object is positioned on the guide member When viewed from the top down, the first light receiving element overlaps the first emitting through hole. During the irradiation process, the irradiation light is emitted toward the light guide portion provided on the one mold. During the inspection process, the The light guide is detected by the irradiated light from the first outgoing through hole, the light-emitting element is provided on the supply mechanism, and the irradiated light sequentially passes from the light-emitting element through the incident through hole provided on the one mold, the The light guide portion, the first exit hole are detected by the first light receiving element, and the path of the irradiated light emitted from the light emitting element to the first light receiving element is formed by only the one mold, the supply mechanism, and the The interior of the position range formed by the space between a mold and the supply mechanism, In the case that the first light-receiving element does not detect the irradiated light in the detection process, it is determined in the judgment process that the resin molded object is normally positioned on the guide member; in the detection process, the first light-receiving element detects In the case of the irradiated light, it is determined in the determination process that the resin molded object is not normally positioned on the guide member. According to the method of manufacturing a resin molded article described in the scope of the patent application, the detection process includes the following process: the second light-receiving element responds to the light emitted from the light-emitting element or other light-emitting elements through the second emission through hole Detection is performed, wherein the second ejection through hole is further provided on the region where the resin molded object is arranged on the opposite side of the guide member in a state where the resin molded object is in contact with the guide member, and in the judgment During the manufacturing process, at least one of the abnormality of the guide member and the deformation of the resin molded object is determined based on the detection performed by the second light-receiving element in the detection process.

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