KR102153058B1 - Molding apparatus and manufacturing method of resin molded article - Google Patents

Abstract

It suppresses the occurrence of molding defects due to positioning of the resin molding object.
The resin molding apparatus includes a molding mold having an upper mold 9 as a first mold and a lower mold 10 as a second mold disposed opposite to each other, and a supply mechanism 13 for supplying a pre-molding substrate 15 as a resin molding object to the mold surface. ), a positioning mechanism 25 and 26 for positioning the substrate 15 to the guide members 23 and 24 before molding, a mold fastening mechanism for clamping the mold, and a light emitting element 27 emitting irradiation light. , 28), first light-receiving elements 31 and 32 provided in the supply mechanism 13 and capable of receiving irradiation light, and a determination unit for determining the position of the substrate 15 before molding, and an upper mold 9 ) Is provided with first outgoing passage holes 29 and 30 through which the irradiation light from the light emitting elements 27 and 28 passes, and the determination portion is irradiated through the first outgoing passage holes 29 and 30 Based on the detection of light by the first light receiving elements 31 and 32, it is determined whether or not the substrate 15 is normally positioned on the guide members 23 and 24 before molding.

Description

A resin molding apparatus, and a manufacturing method of a resin molded article TECHNICAL FIELD [MOLDING APPARATUS AND MANUFACTURING METHOD OF RESIN MOLDED ARTICLE}

The present invention relates to a resin molding apparatus for resin molding a resin molding object, and a method for producing a resin molded product.

As a prior art, for example, in Patent Document 1, the supply unit 8 of the molded article 5, the supply unit 20 of the plate jig 10 supporting the molded article 5, and the molded article 5 A mounting portion 30 for mounting the molded product 5 to a predetermined position of the plate jig 10 by detecting the provided identification portion for positioning, and the plate jig 10 on which the molded product 5 is mounted are placed in a resin mold mold ( Positioning means for positioning at 50 and 51 are provided, and a press device 40 equipped with a resin mold mold 50 and 51 for resin-molding by clamping the object 5 together with the plate jig 10 , The receiving portion 60 of the molded product 62 molded by resin molds 50 and 51, the molded product 5, the molded product 62, and the plate jig 10 are supplied to the molded product 5 (8), a supply part 20 of the plate jig 10, a mounting part 30, a press device 40, and a supply/discharge mechanism 70 and 72 for supplying and discharging to the receiving part 60 of the molded product 62. A resin mold apparatus is disclosed.

In addition, Patent Document 1 describes that as a positioning means, for example, as shown in Fig. 6 thereof, the plate jig 10 is brought into contact with the positioning pin 45 provided on the lower mold 44 ( See paragraph [0023]).

Japanese Patent Publication No. 2008-132730

In Patent Document 1, in positioning in which the plate jig 10 is brought into contact with the positioning pin 45, it is not described whether or not positioning has been appropriately performed. Then, a molding defect due to positioning from the molded article after molding is revealed.

It is an object of the present invention to solve the above problems and to provide a resin molding apparatus capable of suppressing the occurrence of molding defects due to positioning, and a method for producing a resin molded article.

In order to solve the above problems, the resin molding apparatus according to the present invention includes a molding mold having a first mold and a second mold disposed opposite to each other, and a resin molding object on the mold surface of any one of the first mold and the second mold. A supply mechanism for supplying a material, a positioning mechanism for positioning a resin-molded object on the guide member on the mold surface, a mold fastening mechanism for clamping a mold, a light emitting element emitting irradiation light, and irradiation provided in the supply mechanism A first light-receiving element capable of receiving light and a determination unit for determining the position of the resin-molded object are provided, and in one type, a first exit and use passage hole for passing irradiation light from the light emitting element is provided, and the determination unit , On the basis of detection by the first light-receiving element for the irradiation light that has passed through the first exit through hole, it is determined whether or not the resin-molded object is normally positioned on the guide member.

In order to solve the above problem, the method of manufacturing a resin molded article according to the present invention is to supply a resin molded object to a mold surface of one of a mold having a first mold and a second mold disposed opposite to each other by a supply mechanism. A supply process, a positioning process of positioning a resin-molded object on a guide member on a mold surface, an irradiation process of emitting irradiation light from a light emitting element passing through a first emission passage hole provided in one mold, and an irradiation process provided in the supply mechanism A detection step in which the first light receiving element detects the irradiation light passing through the first outgoing through hole, and based on detection in the detection step, it is determined whether or not the resin molding object is normally positioned on the guide member. In the determination step and the determination step, when it is determined that the object to be molded is normally positioned, a resin molding step of mold-fastening a mold and molding resin is included.

According to the present invention, it is possible to suppress the occurrence of molding defects due to positioning.

1 is a front view showing an outline of a resin molding apparatus unit in a resin molding apparatus according to the present invention.
2A to 2D are schematic cross-sectional views showing a step of resin molding a resin-molded object.
3 is a schematic diagram showing a mechanism for verifying whether or not a resin-molded object is normally positioned on the mold surface of the upper mold in Embodiment 1, (a) is a bottom view of the upper mold, and (b) is a molding mold and A schematic cross-sectional view of the supply mechanism, (c) is a plan view of the supply mechanism.
4 is a schematic diagram for verifying whether or not the resin molding object positioned on the mold surface of the upper mold in Embodiment 1 is normally positioned, (a) is a state in which the resin molding object is positioned, and (b) is normally The positioning state, (c) is a schematic cross-sectional view showing a state in which a positioning failure has occurred.
FIG. 5 is a schematic diagram showing a mechanism for verifying whether an abnormality in the guide member or deformation such as bending or bending has occurred in the resin molding object in Embodiment 1, (a) is a bottom view of an upper mold; (b) is a schematic cross-sectional view of the molding die and the supply mechanism, and (c) is a plan view of the supply mechanism.
6 is a schematic diagram for verifying whether an abnormality in the guide member or warping has occurred in the resin molding object in Embodiment 1, (a) is a state in which the resin molding object is normally positioned, (b) Is a schematic cross-sectional view showing a state in which an abnormality has occurred in the guide member, and (c) is a schematic cross-sectional view showing a state in which warpage has occurred in the resin molding object.
7 is a schematic diagram showing a state in which a resin molding object is positioned on a mold surface of an upper mold in Embodiment 2, (a) is a bottom view of the upper mold, (b) is a schematic cross-sectional view of a molding mold and a supply mechanism, (c) ) Is a plan view of the supply mechanism.
8 is a schematic diagram showing a state in which a resin molding object is positioned on the upper mold surface in Embodiment 3, (a) is a bottom view of the upper mold, (b) is a schematic cross-sectional view of the molding mold and the supply mechanism, (c) ) Is a plan view of the supply mechanism.
9 is a schematic diagram showing a state in which a resin molding object is positioned on the upper mold surface in Embodiment 4, (a) is a bottom view of the upper mold, (b) is a schematic cross-sectional view of the molding mold and the supply mechanism, (c) ) Is a plan view of the supply mechanism.
Fig. 10 is a schematic diagram showing a state in which a resin molding object is positioned on a mold surface of an upper mold in Embodiment 5, (a) is a bottom view of the upper mold, (b) is a schematic cross-sectional view of a molding mold and a supply mechanism, (c ) Is a plan view of the supply mechanism.
11 is a schematic diagram showing a state in which a resin molding object is positioned on a mold surface of an upper mold in Embodiment 6, (a) is a bottom view of the upper mold, (b) is a schematic cross-sectional view of a molding mold and a supply mechanism, (c) ) Is a plan view of the supply mechanism.
12 is a schematic diagram showing a state in which a resin molding object is positioned on an upper mold surface in Embodiment 7, (a) is a bottom view of the upper mold, (b) is a schematic cross-sectional view of a molding mold and a supply mechanism, (c) ) Is a plan view of the supply mechanism.
13 is a schematic diagram showing a state in which a resin molding object is positioned on a mold surface of an upper mold in Embodiment 8, (a) is a bottom view of the upper mold, (b) is a schematic cross-sectional view of a molding mold and a supply mechanism, (c) ) Is a plan view of the supply mechanism.
14 is a plan view showing an outline of the apparatus in the resin molding apparatus according to the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. Any drawings in the present application document are schematically drawn with appropriate omission or exaggeration for ease of understanding. Like components are denoted by the same reference numerals, and descriptions thereof are omitted appropriately. In addition, in the document of this application, "resin molding" means molding a resin by a molding mold, and is an expression of a concept including "resin sealing" in which a sealing resin part is molded by a molding mold. In addition, the term ``resin molded article'' means a product containing at least a resin-molded resin part, and includes a sealed substrate in which a semiconductor chip mounted on the substrate is resin-molded by a molding mold and resin-sealed, as described below. It is an expression of the concept of

[Embodiment 1]

(Configuration of resin molding unit)

Referring to Fig. 1, the configuration of a resin molding unit used in the resin molding apparatus according to the present invention will be described. The resin molding unit 1 shown in Fig. 1 is, for example, a resin molding unit using a compression molding method or a transfer molding method. The resin molding unit 1 has a base 2. In the 4 corners of the base 2, the tie bars 3, which are 4 holding members, are fixed. On top of the four tie bars 3 extending upwardly, a fixed platen 4 opposite the base 2 is fixed. Between the base 2 and the stationary platen 4, a movable platen 5 opposite each of the base 2 and the stationary platen 4 is fitted into the four tie bars 3. On the base 2, a mold fastening mechanism 6 for lifting the movable platen 5 is provided. The mold fastening mechanism 6 raises and lowers the movable platen 5 to open the mold and clamp the mold. The mold fastening mechanism 6 is composed of a combination of a drive source 7 and a transmission member 8. For example, as the mold fastening mechanism 6, a combination of a servo motor and a ball screw, a combination of a hydraulic cylinder and a rod, and the like are used. A toggle link mechanism can also be used as a type fastening mechanism.

The upper mold 9 is fixed to the lower surface of the fixed platen 4. Immediately under the upper mold 9, a lower mold 10 is provided opposite the upper mold 9. The lower mold 10 is fixed to the upper surface of the movable platen 5. The upper mold 9 and the lower mold 10 together constitute a mold 11. The upper mold 9 and the lower mold 10 are properly provided with a heater (not shown) as a heating means.

Between the upper mold 9 and the lower mold 10, for example, a supply mechanism 13 for supplying the resin molding object 12 to the mold surface of the upper mold 9 is disposed. As the resin molding object 12, for example, a substrate on which a semiconductor chip is mounted, a lead frame on which a semiconductor chip is mounted, and the like are supplied to the mold surface of the upper mold 9. In this case, although the case where the resin molding object 12 is supplied to the mold surface of the upper mold 9 is shown, the resin molding object 12 may be supplied to the mold surface of the lower mold 10.

(Method of manufacturing resin molded products)

1 to 2, in the resin molding unit 1 provided in the resin molding apparatus (see FIG. 14), for example, a method of manufacturing a resin molded article by resin molding a semiconductor chip mounted on a substrate as a resin molding object The process of will be described.

As shown in Fig. 2A, first, in the resin molding apparatus, the upper mold 9 and the lower mold 10 are mold-opened. Next, the pre-molding substrate 15, which is a substrate on which the semiconductor chip 14 is mounted, is conveyed between the upper mold 9 and the lower mold 10 using the supply mechanism 13. In this case, since the substrate 15 is supplied to the mold surface of the upper mold 9 before molding, the surface on which the semiconductor chip 14 is mounted is brought to the lower side. Next, the supply mechanism 13 is raised to supply the substrate 15 before molding to the mold surface of the upper mold 9.

Next, as described later, on the mold surface of the upper mold 9, the substrate 15 is positioned on the guide member by a positioning mechanism before molding (see Fig. 3(a)). Whether or not the substrate 15 is normally positioned on the mold surface of the upper mold 9 before molding is verified using the light-receiving element provided in the supply mechanism 13 (refer to FIGS. 3B and 3C). . The operation of positioning the substrate 15 on the mold surface of the upper mold 9 before molding, and the operation of determining whether the substrate 15 before molding is normally positioned on the mold surface of the upper mold 9 will be described later (Fig. 3 to 6).

Next, when it is determined that the substrate 15 is normally positioned on the mold surface of the upper mold 9 before molding, a release film supply mechanism (see FIG. 14) is used to release the cavity 16 provided in the lower mold 10. The film 17 is supplied. As the release film 17, either a release film of a long shape continuously supplied from a film supply reel to a take-up reel, or a release film cut into a rectangle is used. Alternatively, it is possible not to use a release film.

Next, as shown in Fig. 2(b), a case of supplying a liquid resin as a resin material to the cavity 16 using, for example, a dispenser as a resin supply mechanism will be described. The dispenser 18 shown in Fig. 2B is a one-liquid type dispenser using a liquid resin in which a main material and a curing agent are mixed in advance. As the subject, for example, a silicone resin or an epoxy resin having thermosetting properties is used. When supplying the liquid resin, you may use a two-liquid mixing type dispenser that uses a mixture of a main material and a hardener.

Next, the dispenser 18 is moved between the upper mold 9 and the lower mold 10 by the moving mechanism 19. Next, the liquid resin 20 is discharged into the cavity 16 from the discharge port of the dispenser 18. Thereby, the liquid resin 20 is supplied to the cavity 16. In this case, the liquid resin 20 was supplied to the cavity 16 using the dispenser 18. The present invention is not limited thereto, and a powdery, granular, sheet, or solid resin material may be used as the resin material and supplied to the cavity.

Next, as shown in Fig. 2C, the movable platen 5 is raised using the mold fastening mechanism 6 (see Fig. 1). Accordingly, the upper mold 9 and the lower mold 10 are mold-fastened. By mold fastening, the semiconductor chip 14 mounted on the substrate 15 before molding is immersed in the liquid resin 20 supplied to the cavity 16. In this case, a constant resin pressure may be applied to the liquid resin 20 in the cavity 16 by using a cavity bottom member (not shown) provided in the lower mold 10.

Further, in the mold-fastening process, the inside of the cavity 16 may be sucked using a vacuum mechanism (not shown). As a result, air remaining in the cavity 16 or air bubbles contained in the liquid resin 20 are discharged to the outside of the mold 11. In addition, the cavity 16 is set to a certain degree of vacuum.

Next, by using a heater (not shown) provided in the lower mold 10, the liquid resin 20 is heated for a time required to cure the liquid resin 20. The liquid resin 20 is cured and the cured resin 21 is molded. Thus, the semiconductor chip 14 mounted on the substrate 15 before molding is resin-molded (resin sealed) with the cured resin 21 molded corresponding to the shape of the cavity 16.

Next, as shown in Fig. 2D, after molding the cured resin 21, the movable platen 5 is lowered using the mold fastening mechanism 6. Thereby, the upper mold 9 and the lower mold 10 are mold-opened. A molded resin article 22, which is a molded resin-molded substrate, is fixed to the mold surface of the upper mold 9. Next, the resin molded article 22 is released from the upper mold 9. In this step, resin molding (resin sealing) is completed.

(Substrate positioning verification mechanism)

Referring to Fig. 3, a positioning verification mechanism for verifying the positioning of the pre-molding substrate 15 supplied to the molding die 11 will be described. The positioning verification mechanism includes a light-emitting element and a light-receiving element, and verifies the positioning of the substrate 15 before molding by whether the light-receiving element detects the irradiation light emitted by the light-emitting element. In this embodiment, a case where a light emitting element is provided in the fixed platen 4 and a light receiving element is provided in the supply mechanism 13 will be described.

As shown in (a) of FIG. 3, a guide member 23 is provided on the mold surface (lower surface) of the upper mold 9 as a positioning member for positioning the substrate 15 in the X direction before molding, for example. do. As the guide member 23, a member having a pin-shaped shape such as a guide pin is used, for example. Likewise, a guide member 24 for positioning the substrate 15 in the Y direction before molding is provided on the mold surface of the upper mold 9. It is preferable that at least two guide members 23 and 24 are provided respectively along the Y direction and the X direction, for example. In this case, a member having a pin-shaped shape was used as the guide member. As the guide member, a member having a rectangular parallelepiped shape extending along the X and Y directions may be used.

In the upper mold 9 or the fixed platen 4, for example, positioning mechanisms 25 and 26 for positioning by pressing the end faces of the substrate 15 before molding to the guide members 23 and 24, Each is provided. The substrate 15 before molding is positioned in the X direction by the positioning mechanism 25. Similarly, the substrate 15 before molding is positioned in the Y direction by the positioning mechanism 26. The substrate 15 before molding is placed on the mold surface of the upper mold 9 by the positioning mechanisms 25 and 26. In this case, the positioning mechanisms 25 and 26 are provided in the upper mold 9 or the fixed platen 5. The present invention is not limited to this, and a positioning mechanism may be provided in the supply mechanism 13.

In the present application document, as shown in Fig. 3(a), the long side of the substrate 15 before molding is arranged to follow the X direction, and the short side of the substrate 15 before molding is Y It shows the case of being arranged to follow the direction. Hereinafter, the end face along the longitudinal direction of the substrate 15 before molding is taken as the end face along the X direction of the substrate 15 before molding. Similarly, the end surface along the shorter direction of the substrate 15 before molding is taken as the end surface along the Y direction of the substrate 15 before molding.

As shown in (a) and (b) of FIG. 3, for example, as a component for verifying the positioning of the substrate 15 in the X and Y directions before molding, the interior of the fixed platen 4 Light-emitting elements 27 and 28 are provided in the. As the light-emitting elements 27 and 28, for example, a light-emitting diode (LED), a laser diode (LD) or the like is used. It is preferable that the light-emitting elements 27 and 28 have heat resistance. The upper mold 9 is provided with first outgoing passage holes 29 and 30 for passing irradiation light emitted by the light emitting elements 27 and 28, respectively. In addition, "exit use" means that irradiation light is emitted from the upper mold 9 side to the external light-receiving element side.

As shown in Fig. 3(a), the first exit through holes 29 and 30 are in a state in which the substrate 15 before molding is in contact with the guide members 23 and 24, the substrate 15 before molding. ) Is provided in each of the regions disposed on the mold surface of the upper mold 9. In more detail, in a state in which the substrate 15 before molding is in contact with the guide member 23, the first exit through hole 29 is inside from the end surface along the Y direction of the substrate 15 before molding. It is provided in the upper mold 9 so as to correspond to the area. Similarly, in a state in which the substrate 15 is in contact with the guide member 24 before molding, the first exit through hole 30 corresponds to an area inside from the end surface along the X direction of the substrate 15 before molding. So that it is provided in the upper mold (9).

As shown in (b) and (c) of Fig. 3, the supply mechanism 13 is provided with first light receiving elements 31 and 32 for detecting the irradiation light emitted by the light emitting elements 27 and 28, respectively. . The first light receiving elements 31 and 32 are light receiving elements for verifying the positioning of the substrate 15 in the X and Y directions before molding. As the first light receiving elements 31 and 32, for example, a photodiode (PD) or the like is used. In the state where the substrate 15 is positioned on the guide members 23 and 24 before molding, the first light-receiving element 31 overlaps the light-emitting element 27 and the first exit through hole 29 when viewed from the top. , The first light receiving element 32 is provided so as to overlap the light emitting element 28 and the first exit through hole 30. The diameters of the first outgoing through holes 29 and 30 can be arbitrarily set corresponding to the intensity of light received by the first light receiving elements 31 and 32. In the state where the substrate 15 is positioned on the guide members 23 and 24 before molding, depending on whether the first light receiving elements 31 and 32 detect the irradiation light emitted by the light emitting elements 27 and 28, It is verified whether or not the substrate 15 is normally positioned on the mold surface of the upper mold 9 before molding. For example, by setting the diameters of the first exit through holes 29 and 30 to a size of about 0.01 to 0.1 mm, it is possible to improve the verification accuracy for positioning the substrate 15 before molding.

Further, in the mold-open state of the mold 11, the guide members 23 and 24 protrude from the mold surface of the upper mold 9. In the mold-fastened state of the mold 11, the guide members 23 and 24 are configured to be pushed up to the mold surface of the lower mold 10 and accommodated in the upper mold 9. For this purpose, for example, the guide members 23 and 24 may be supported by an elastic member such as a spring. Further, the guide members 23 and 24 may not be moved, but may be retracted to an opening hole (not shown) formed in the lower mold 10.

{Substrate positioning operation and positioning verification operation (manufacturing method for resin molded products)}

3 to 4, the positioning operation of the pre-molding substrate 15 supplied to the molding mold 11 and whether the pre-molding substrate 15 supplied to the molding mold 11 is positioned normally. The operation of verifying is described. In the present embodiment, a case where the substrate 15 before molding is supplied to the upper mold 9 of the molding die 11 to be positioned is shown. In addition, the description here also serves as a description of a method of manufacturing a resin molded article.

(Board positioning operation)

Referring to Fig. 3, an operation of positioning the substrate 15 on the mold surface of the upper mold 9 before molding will be described. First, as shown in (b) of FIG. 3, the supply mechanism 13 holding the substrate 15 before molding is moved between the upper mold 9 and the lower mold 10. Next, the supply mechanism 13 is raised, and the substrate 15 before molding is transferred from the supply mechanism 13 to the mold surface of the upper mold 9.

Next, for example, using the positioning mechanisms 25 and 26 provided on the upper mold 9 or the fixed platen 4, the end surfaces of the substrate 15 before molding are pressed against the guide members 23 and 24, respectively. Contact. First, as shown in (a) of FIG. 3, the end faces along the Y direction of the substrate 15 before molding are pressed into contact with the two guide members 23 using the positioning mechanism 25. In this way, the end face of the substrate 15 along the Y direction before molding is positioned on the mold face of the upper mold 9. Next, by using the positioning mechanism 26, the end surfaces of the substrate 15 along the X direction before molding are brought into pressure contact with the two guide members 24. Thereby, the end surface along the X direction of the substrate 15 before molding is positioned on the mold surface of the upper mold 9.

The substrate 15 before molding is positioned on the mold surface of the upper mold 9 by pressing the substrate 15 before molding to the guide members 23 and 24 using the positioning mechanisms 25 and 26. After positioning the pre-molding substrate 15, the pre-molding substrate 15 is adsorbed by a suction mechanism (not shown) and fixed to the mold surface of the upper mold 9. In this state, the positioning of the substrate 15 on the upper mold 9 before molding is completed.

In this case, the positioning mechanisms 25 and 26 provided on the upper mold 9 or the fixed platen 4 were used to determine the positions of the substrate 15 in the X and Y directions before molding independently, respectively. . The configuration is not limited to this, and the positioning mechanisms 25 and 26 can be interlocked. Thereby, positioning of the substrate 15 in the X and Y directions before molding can be performed simultaneously.

(Verifying operation of board positioning)

Referring to Figs. 3 to 4, an operation of verifying whether or not the pre-molding substrate 15 supplied to the upper mold 9 is positioned normally will be described. First, as shown in FIG. 4A, the substrate 15 before molding is supplied to the mold surface of the upper mold 9 by the supply mechanism 13. Next, the substrate 15 is positioned on the mold surface of the upper mold 9 before molding using the positioning mechanisms 25 and 26. In this state, the light-emitting element 27, the first exit through hole 29, and the first light-receiving element 31 are disposed so as to overlap when viewed in plan. Likewise, the light-emitting element 28, the first emission through hole 30, and the first light-receiving element 32 are disposed so as to be overlapped when viewed in plan view.

Next, irradiation light 33 is emitted from the light-emitting elements 27 and 28 as shown in FIG. 4B. The irradiation light 33 emitted from the light emitting elements 27 and 28 passes through the first exit through holes 29 and 30 formed in the upper mold 9 and reaches the surface of the substrate 15 before molding. do.

When the substrate 15 before molding is normally positioned on the guide members 23 and 24 provided on the upper mold 9, for example, as shown in FIG. 4B, the substrate 15 before molding is When the end surface along the Y direction is in contact with the guide member 23, a gap does not occur between the guide member 23 and the end surface along the Y direction of the substrate 15 before molding. Therefore, the irradiation light 33 emitted by the light-emitting element 27 is blocked by the substrate 15 before molding. Therefore, the irradiation light 33 does not reach the first light receiving element 31 provided in the supply mechanism 13. Therefore, the first light receiving element 31 does not detect the irradiation light 33.

Similarly, when the end surface along the X direction of the substrate 15 before molding is in contact with the guide member 24 (see Fig. 3A), the guide member 24 and the substrate 15 before molding are There is no gap between the end faces along the X direction. Accordingly, the irradiation light 33 emitted by the light-emitting element 28 (see Fig. 3A) is blocked by the substrate 15 before molding. Therefore, the irradiation light 33 does not reach the first light-receiving element 32 (refer to FIG. 3C) provided in the supply mechanism 13. Therefore, the first light receiving element 32 does not detect the irradiation light 33.

When both of the first light-receiving elements 31 and 32 do not detect the irradiation light 33, the determination unit provided in the control unit of the resin molding apparatus (refer to Fig. 14) is the substrate before molding in the X and Y directions. It is determined that (15) is positioned normally. When both of the first light-receiving elements 31 and 32 do not detect the irradiation light 33, it is determined that the substrate 15 is normally positioned on the guide members 23 and 24 before molding, and the next step is resin. It proceeds to the molding process.

When the substrate 15 before molding is not normally positioned on the guide members 23 and 24, for example, as shown in FIG. 4C, the end along the Y direction of the substrate 15 before molding When the sub-surface is not in contact with the guide member 23, a gap 34 is generated between the guide member 23 and the end surface along the Y direction of the substrate 15 before molding. When a gap 34 is generated between the guide member 23 and the end surface along the Y direction of the substrate 15 before molding, the irradiation light 33 emitted from the light emitting element 27 passes through the gap 34 do. The irradiation light 33 passing through this gap 34 reaches the first light receiving element 31. In this way, the first light receiving element 31 detects the irradiated light 33. When the first light-receiving element 31 detects the irradiation light 33, the determination unit (see Fig. 14) determines that the substrate 15 before molding is not normally positioned with respect to the X direction. Therefore, the determination unit stops proceeding to the next process. Then, the positioning of the substrate 15 is performed again before molding.

Likewise, if the end surface along the X direction of the substrate 15 before molding is not in contact with the guide member 24, between the guide member 24 and the end surface along the X direction of the substrate 15 before molding A gap occurs. The irradiation light 33 emitted from the light-emitting element 28 passes through this gap and reaches the first light-receiving element 32. Thereby, the first light receiving element 32 detects the irradiated light 33. When the first light-receiving element 32 detects the irradiation light 33, the determination unit determines that the substrate 15 before molding is not normally positioned with respect to the Y direction. Even in this case, the determination unit determines that the substrate 15 is not normally positioned before molding, and stops proceeding to the next step. Then, the positioning of the substrate 15 is performed again before molding.

In a state in which the substrate 15 is positioned on the mold surface of the upper mold 9 before molding, when either of the first light-receiving elements 31 or 32 detects the irradiation light 33, the determination unit is in the X direction or Y It is judged that any of the directions are not normally positioned. In this case, the advancing to the next step is stopped, and the positioning of the substrate 15 before forming is performed again. When both of the first light-receiving elements 31 and 32 do not detect the irradiation light 33, the determination unit determines that the substrate 15 is normally positioned before molding, and proceeds to the next step. Therefore, whether or not the first light-receiving element 31 or 32 detects the irradiation light 33, it is possible to suppress the occurrence of molding defects due to positioning of the substrate 15 before molding.

In addition, with respect to the positioning of the substrate 15 before molding, ideally, when the irradiation light 33 is completely blocked by the substrate 15 before molding, the first light receiving elements 31 and 32 are irradiated light ( 33) is not detected. However, a part of the irradiation light 33 is diffracted light that passes through the substrate 15 before molding and reaches the first light receiving element 31 or 32, or the external noise light reaches the first light receiving element 31 or 32. There are cases. Therefore, when the first light-receiving element 31 or 32 detects the irradiation light exceeding the set threshold (for example, light intensity of a certain size) in consideration of the case of detecting diffracted light or noise light, the first light receiving element The determination unit determines that the elements 31 and 32 have detected the irradiation light 33. When irradiation light below the threshold is detected, the determination unit determines that the first light receiving elements 31 and 32 have not detected the irradiation light 33. In this way, the determination unit determines whether or not the substrate 15 is normally positioned on the mold surface of the upper mold 9 before molding. As an example, when the current value of the light-receiving element is measured and photodetection is performed using a photocurrent generated by light irradiation, a threshold value may be set for the measured current value. This is also the same in other embodiments, and also in detection using other light-receiving elements.

{Mechanism and operation to verify abnormality of the guide member or deformation of the substrate (including manufacturing methods of resin molded products)}

5 to 6, of whether an abnormality such as abrasion or missing has occurred in the guide members 23 and 24, and whether deformation such as bending or bending has occurred in the substrate 15 before molding. A mechanism and operation for verifying at least one of them will be described. With respect to the deformation of the substrate prior to molding, warping is mainly described here as an example. In addition, in the case where the substrate is bent so as to generate wrinkles or creases, the same operation can be performed using the same mechanism. The deformation of the substrate before molding is a deformation that is likely to occur in a resinous substrate containing a resin in at least a part, and includes deformation in which a part of the substrate is bent due to thermal influence. In addition, the description here also serves as a description of a method of manufacturing a resin molded article.

As shown in Fig. 5, the mechanism for verifying the abnormality of the guide members 23 and 24 or the deformation of the substrate 15 before molding is performed, the end face of the substrate 15 before molding is attached to the guide members 23 and 24. In the state of being in contact, the light-emitting elements 27 and 28, the first exit through holes 29 and 30, and the first light-receiving elements 31 and 32 correspond to the area where the substrate 15 is disposed before molding. Light-emitting elements 35 and 36, second exit through holes 37 and 38, and second light-receiving elements 39 and 40 are respectively provided at positions opposite to the provided positions. Therefore, in the state where the substrate 15 is positioned on the guide members 23 and 24 before molding, the second light receiving element 39 overlaps the light emitting element 35 and the second exit through hole 37 when viewed from the top. The second light-receiving element 40 is overlapped with the light-emitting element 36 and the second exit through hole 38, so that the second light-receiving elements 39 and 40 are provided in the supply mechanism 13, respectively.

Referring to Figure 6, to verify whether an abnormality such as abrasion or missing has occurred in the guide members 23 and 24, or whether deformation such as bending or bending has occurred in the substrate 15 before molding. The operation will be described.

6A shows that the guide members 23 and 24 do not have abnormalities such as abrasion or missing, and there is no deformation such as bending or bending of the substrate 15 before molding, and the substrate 15 before molding is an upper mold 9 ) Shows a state in which it is normally positioned on the shape surface. As shown in (a) of FIG. 6, when the substrate 15 before molding is normally positioned on the mold surface of the upper mold 9, the light emitted from the four light emitting elements 27, 28, 35, 36 All of the irradiation light 33 is blocked by the substrate 15 before molding. Therefore, all four light-receiving elements (the first light-receiving elements 31 and 32 and the second light-receiving elements 39 and 40) do not detect the irradiation light 33.

Since the first light receiving elements 31 and 32 do not detect the irradiation light 33, the determination unit determines that the substrate 15 is in normal contact with the guide members 23 and 24 before molding. Since the second light-receiving elements 39 and 40 do not detect the irradiation light 33, there is no abnormality such as wear or dropout in the guide members 23 and 24, and the substrate 15 is warped before molding. , The judgment unit judges that deformation such as bending has not occurred. As described above, when all four light receiving elements 31, 32, 39, and 40 do not detect the irradiation light 33, the determination unit has no abnormality and the substrate 15 before molding is placed on the mold surface of the upper mold 9 It judges that it has been positioned normally and proceeds to the next process.

When the first light receiving element 31 or 32 detects the irradiation light 33, the determination unit determines that the substrate 15 is not in normal contact with the guide member 23 or 24 before molding, and proceeds to the next step. Stop it. Then, the positioning of the substrate 15 is performed again before molding.

Fig. 6(b) shows a state in which abnormalities such as wear or dropout have occurred in the guide members 23 and 24. For example, it shows a state in which abrasion or missing occurs in the guide member arranged in the Y direction.

As shown in (b) of FIG. 6, by the positioning mechanism 25 (refer to (b) of FIG. 3), the guide member 23X in which the end of the substrate 15 is worn or missing before molding ) To contact with pressure. Since the guide member 23X has become smaller than usual due to wear or loss, the substrate 15 before molding is extruded toward the +X direction side rather than the normal position. Thereby, the first exit through hole 29 is blocked by the substrate 15 before molding, but a part of the second exit through hole 37 is not blocked by the pre-molding substrate 15. Therefore, the irradiation light 33 emitted from the light emitting element 27 is blocked by the substrate 15 before molding, but the irradiation light 33 emitted from the light emitting element 35 passes through the substrate 15 before molding and is removed. 2 It reaches the light receiving element 39. As a result, the second light receiving element 39 detects the irradiated light 33. When the second light-receiving element 39 detects the irradiation light 33, the determination unit determines that there is a possibility that an abnormality such as abrasion or missing has occurred in the guide member 23X. Therefore, the judgment unit stops advancing to the next process. Then, the abnormality of the guide member is investigated.

Similarly, when the second light-receiving element 40 (refer to Fig. 5A) detects the irradiation light 33, there is a possibility that an abnormality such as abrasion or dropout has occurred in the guide member 24 by the determination unit. I judge there. Therefore, the judgment unit stops advancing to the next process. In this way, when any of the second light receiving elements 39 or 40 detects the irradiation light 33, it is determined that there is a possibility that abnormalities such as wear or dropout may occur in the guide member 23 or 24, and the following Stop advancing to the process. Thereby, it is possible to suppress the occurrence of molding defects caused by abnormalities in the guide members 23 or 24.

FIG. 6C shows a state in which warpage, which is one type of deformation, has occurred in the substrate 15 before molding. For example, a state in which the substrate 15 is bent toward the side on which the semiconductor chip 14 is mounted is shown before molding.

As shown in (c) of FIG. 6, by means of the positioning mechanism 25 (refer to (b) of FIG. 3), for example, the end of the substrate 15 prior to forming, where warpage has occurred, is a guide member ( 23). Since the substrate 15 before molding is warped, the substrate 15 before molding is placed on the upper mold 9 with both ends of the substrate 15 along the Y direction lifted from the mold surface of the upper mold 9 before molding. do. Thereby, the first exit through hole 29 is blocked by the substrate 15 before molding, but a part of the second exit through hole 37 is not blocked by the pre-molding substrate 15. Therefore, the irradiation light 33 emitted from the light emitting element 27 is blocked by the substrate 15 before molding, but the irradiation light 33 emitted from the light emitting element 35 passes through the substrate 15 before molding and is removed. 2 It reaches the light receiving element 39. As a result, the second light receiving element 39 detects the irradiated light 33. When the second light receiving element 39 detects the irradiation light 33, the determination unit determines that there is a possibility that warpage has occurred in the substrate 15 before molding. Therefore, the judgment unit stops advancing to the next process. Then, the state of the substrate 15 before molding is examined.

Similarly, when the second light-receiving element 40 (see Fig. 5A) detects the irradiation light 33, the determination unit determines that there is a possibility that warpage has occurred in the substrate 15 before molding. Therefore, the judgment unit stops advancing to the next process. As described above, when either of the second light receiving elements 39 or 40 detects the irradiation light 33, it is determined that there is a possibility that warpage has occurred in the substrate 15 before molding, and the proceeding to the next step is stopped. Let it. In this way, it is possible to suppress the occurrence of molding defects due to the occurrence of warpage in the substrate 15 before molding.

When either of the second light-receiving elements 39 or 40 detects the irradiation light 33, an abnormality such as abrasion or missing occurs in the guide members 23 and 24, or on the substrate 15 before molding. There is a possibility that warping has occurred. For these abnormalities, it is necessary to confirm the cause, but in any case, the judgment unit determines that there is a possibility that some abnormality has occurred and stops proceeding to the next step. Thereby, it is possible to suppress the occurrence of molding defects due to positioning of the substrate 15 before molding.

As described above, when any of the four light-receiving elements (the first light-receiving elements 31 and 32 and the second light-receiving elements 39 and 40) provided in the supply mechanism 13 detects the irradiation light 33, It can be determined that an abnormality has occurred with respect to the positioning of the substrate 15 before molding. When the first light receiving element 31 or 32 detects the irradiation light 33, it is determined that the substrate 15 is not normally in contact with the guide member 23 or 24 before molding. When the second light-receiving element 39 or 40 detects the irradiation light 33, an abnormality such as abrasion or missing occurs in the guide member 23 or 24, or the substrate 15 is warped before molding, It is judged that there is a possibility that deformation such as bending is occurring. Here, when the second light-receiving element 39 or 40 detects the irradiation light 33, an abnormality such as abrasion or missing occurs in the guide member 23 or 24, or the substrate 15 is warped before molding. It is judged that there is a possibility that deformation, such as bending, has occurred, or that both of the abnormalities of the guide members 23 or 24 and deformation of the substrate 15 before molding may have occurred. In these cases, advancing to the next step is stopped.

When all of the four light-receiving elements 31, 32, 39, and 40 do not detect the irradiation light 33, abnormalities such as wear and tear on the guide members 23 and 24, and the substrate 15 before molding It is judged that there is no deformation such as warpage or bending, and that the substrate 15 is normally positioned on the mold surface of the upper mold 9 before molding. In this case, it proceeds to the next step. Accordingly, resin molding can be performed in a state in which it is verified that the substrate 15 is positioned normally before molding, and the occurrence of molding defects due to positioning can be suppressed.

The diameter of the four outgoing passage holes (the first outgoing passage holes 29 and 30 and the second outgoing passage holes 37 and 38) provided in the upper mold 9 is the four light receiving elements (first light receiving The elements 31 and 32 and the second light receiving elements 39 and 40} can be arbitrarily set corresponding to the intensity of light received. When the diameter of these outgoing passage holes is small, the outgoing passage holes may be blocked by a resin material or foreign matter. Therefore, it is desirable to periodically verify whether or not abnormalities such as resin clogging have occurred in the four exit through holes. For example, in a state where the substrate 15 is not supplied to the upper mold 9 before molding, the irradiation light 33 is emitted from the four light-emitting elements 27, 28, 35, and 36, respectively. When each of the four light-receiving elements 31, 32, 39, 40 detects the irradiation light 33, any of the four outgoing passage holes 29, 30, 37, 38 may be blocked by a resin or the like. It can be judged that no abnormality has occurred. When any of the four light-receiving elements 31, 32, 39, 40 does not detect the irradiation light 33, an abnormality occurs in the outgoing passage hole corresponding to the light-receiving element that does not detect the irradiation light 33 You can judge that you are doing. In this way, the abnormality of the four exit through holes 29, 30, 37, 38 provided in the upper mold 9 can also be verified.

In addition, a mechanism for verifying whether an abnormality such as abrasion or missing has occurred in the guide members 23 and 24, or whether deformation such as warpage or bending has occurred in the substrate 15 before molding is described in another embodiment. It can also be applied to.

(Action effect)

In the present embodiment, the resin molding apparatus is a molding die 11 having an upper die 9 as a first die and a lower die 10 as a second die, and any one of the upper die 9 and the lower die 10 disposed to face each other. A supply mechanism 13 for supplying the pre-molding substrate 15 as a resin molding object to the mold surface of the upper mold 9 or the lower mold 10 as a mold, and a guide member 23 and 24 on the mold surface before molding the substrate 15 Positioning mechanisms 25 and 26 for positioning, a mold fastening mechanism 6 for clamping the mold 11, light-emitting elements 27 and 28 for emitting irradiation light 33, and a supply mechanism ( The first light receiving elements 31 and 32 provided in 13) and capable of receiving the irradiation light 33, and a determination unit for determining the positioning of the substrate 15 before molding are provided, and the upper mold 9 is a light emitting element First exit through holes 29 and 30 through which the irradiation light 33 from (27, 28) passes are provided, and the determination unit includes the irradiation light passing through the first exit through holes 29 and 30 ( 33), based on detection by the first light-receiving elements 31 and 32, it is configured to determine whether or not the substrate 15 is normally positioned on the guide members 23 and 24 before molding.

The method for manufacturing a resin molded article of the present embodiment is either an upper mold (9) or a lower mold (10) of a mold (11) having a first mold (upper mold) (9) and a second mold (lower mold (10)) disposed opposite to each other. A supply process of supplying the pre-molding substrate 15, which is a resin molding object, to the mold surface of the mold surface by the supply mechanism 13, and positioning the pre-molding substrate 15 to the guide members 23 and 24 on the mold surface. The process, the irradiation process of emitting the irradiation light 33 passing through the first outgoing passage holes 29 and 30 provided in the upper mold 9 from the light emitting elements 27 and 28, and the agent provided in the supply mechanism 13 1 Based on the detection process in which the light-receiving elements 31 and 32 detect the irradiated light 33 that has passed through the first emission through holes 29 and 30, and the detection in the detection process, the substrate 15 before forming A determination process for determining whether or not) is normally positioned on the guide members 23 and 24, and in the determination process, when it is determined that the substrate 15 is positioned normally before molding, the molding mold 11 is It includes a resin molding step of mold-fastening and resin molding.

According to this configuration, it is possible to perform resin molding while verifying that the pre-molding substrate 15, which is a resin molding object supplied to the molding die 11, is normally positioned on the guide members 23, 24, and positioning It is possible to suppress the occurrence of molding defects caused by. Therefore, when it is determined that the substrate 15 is positioned normally before molding, resin molding is performed. When it is determined that the substrate 15 is not positioned normally before molding, resin molding is stopped.

More specifically, according to the present embodiment, in order to verify whether the pre-molding substrate 15 as a resin molding object is normally positioned on the guide members 23 and 24 provided in the upper mold 9 of the mold Light-emitting elements 27 and 28 and first light-receiving elements 31 and 32 are provided. Prior to molding, the substrate 15 is positioned on the upper mold 9 by contacting the guide members 23 and 24. When the substrate 15 before molding is normally positioned on the guide members 23 and 24, a gap does not occur between the end faces of the substrate 15 before molding and the guide members 23 and 24. Thereby, the substrate 15 before molding blocks the irradiation light 33 emitted from the light emitting elements 27 and 28. Therefore, the first light receiving elements 31 and 32 do not detect the irradiation light 33. When both of the first light-receiving elements 31 and 32 do not detect the irradiation light 33, the determination unit determines that the substrate 15 is normally positioned on the guide members 23 and 24 before molding. When it is determined that the substrate 15 is positioned normally before molding, resin molding is performed.

When the substrate 15 before molding is not normally positioned on the guide member 23 or 24, a gap is generated between the end surface of the substrate 15 and the guide member 23 or 24 before molding. When a gap occurs, the irradiation light 33 emitted from the light-emitting elements 27 and 28 passes through the gap and reaches the first light-receiving element 31 or 32. When either of the first light receiving elements 31 or 32 detects the irradiation light 33, the determination unit determines that the substrate 15 is not normally positioned on the guide member 23 or 24 before molding. When it is determined that the substrate 15 is not positioned normally before molding, resin molding is stopped. Therefore, it is possible to suppress the occurrence of molding defects due to positioning of the substrate 15 before molding.

In addition, according to the present embodiment, in order to verify abnormality of the guide members 23 and 24 or deformation of the substrate 15 before molding, the light emitting elements 35 and 36, the second exit through holes 37 and 38, and the 2 Light-receiving elements 39 and 40 are provided, respectively. When either of the second light-receiving elements 39 or 40 detects the irradiation light 33, an abnormality such as abrasion or missing occurs in the guide members 23 and 24, or on the substrate 15 before molding. It is judged that there is a possibility that deformation such as warping or bending has occurred. In these cases, the advancing to the next step is stopped, and abnormality of the guide members 23 and 24 or deformation of the substrate 15 before molding is investigated. Thereby, it is possible to suppress the occurrence of molding defects caused by abnormalities in the guide members 23 and 24 or deformation of the substrate 15 before molding.

Further, according to the present embodiment, irradiation light 33 is emitted from the four light-emitting elements 27, 28, 35, 36, respectively, in a state in which the substrate 15 before molding is not supplied to the upper mold 9. When each of the four light-receiving elements 31, 32, 39, 40 detects the irradiation light 33, any of the four outgoing passage holes 29, 30, 37, 38 may be blocked by a resin or the like. It is judged that no abnormality has occurred. If any of the light-receiving elements 31, 32, 39, 40 does not detect the irradiation light 33, it is said that an abnormality has occurred in the exit through hole corresponding to the light-receiving element that does not detect the irradiation light 33. Judge. In this case, the irradiation light 33 is cleaned by irradiating clogging of the outgoing passage hole corresponding to the light receiving element not detected. Thereby, it is possible to suppress the occurrence of molding defects caused by abnormalities in the exit through holes 29, 30, 37, 38.

As described above, according to the present embodiment, when the pre-molding substrate 15, which is a resin molding object, does not normally contact the guide members 23 and 24, abnormalities such as wear and dropout of the guide members 23 and 24 When this occurs, when deformation, such as bending or bending, occurs in the substrate 15 before molding, the first exit through holes 29 and 30 and the second exit through holes 37 and 38 are clogged with resin, etc. When an abnormality caused by positioning, such as when this occurs, stops advancing to the next step. Thereby, it is possible to suppress the occurrence of molding defects due to positioning. Therefore, resin molding can be performed in a state in which it is verified that the substrate 15 is normally positioned before molding.

In this embodiment, as a means for positioning the substrate 15 before molding, the positioning mechanisms 25 and 26 provided on the upper mold 9 or the fixed platen 4 were used. The present invention is not limited to this, and a positioning mechanism may be provided in the supply mechanism 13. After the supply mechanism 13 transfers the substrate 15 to the mold surface of the upper mold 9 before molding, the substrate 15 before molding is transferred to the guide members 23 and 24 using a positioning mechanism provided in the supply mechanism 13. Each pressurized contact. This makes it possible to position the substrate 15 on the mold surface of the upper mold 9 before molding. The configuration of the resin molding apparatus can be further simplified by providing the positioning mechanism in the supply mechanism 13.

Further, the supply mechanism 13 itself can be used as a positioning mechanism. When the supply mechanism 13 itself is used as a positioning mechanism, the substrate 15 before molding is placed on the mold surface of the upper mold 9 and the substrate 15 before molding is X using the supply mechanism 13. By moving in the direction and Y direction, the end surfaces of the substrate 15 before molding are brought into pressure contact with the guide members 23 and 24, respectively. This makes it possible to position the substrate 15 on the mold surface of the upper mold 9 before molding. By using the supply mechanism 13 itself as a positioning mechanism, the configuration of the resin molding apparatus can be further simplified.

[Embodiment 2]

Referring to FIG. 7, in the second embodiment, a mechanism for verifying whether or not the pre-molding substrate 15 supplied to the upper mold 9 is positioned normally will be described. The difference from the first embodiment is that the light emitting element 27 is provided outside the fixed platen 4 and an optical member that reflects the irradiated light 33 is provided in the light guide portion provided on the fixed platen 4. I prepared it. Other configurations and operations are the same as those of the first embodiment, and thus a description thereof will be omitted. In addition, in the following embodiment, the case where there is no abnormality, such as abrasion, missing, etc. in the guide members 23 and 24, and deformation|transformation, such as warpage or bending, does not occur in the board|substrate 15 before molding, is demonstrated.

As shown in (a) and (b) of FIG. 7, the fixed platen 4 has a light guide part 41 connected to the first through hole 29 for output and extending along the X direction, and the first output. Each of the light guide portions 42 connected to the use through hole 30 and extending along the Y direction are provided. The light-emitting element 27 is disposed on the extension of the light guide part 41 extending along the X direction. Similarly, the light-emitting element 28 is disposed on the extension of the light guide portion 42 extending along the Y direction.

As shown in (b) of FIG. 7, a reflector 43 for changing the traveling direction of the irradiation light 33 emitted from the light-emitting element 27 toward the -X direction by 90 degrees is provided in the light guide part 41 . The irradiation light 33 whose traveling direction is changed in the -Z direction by the reflector 43 passes through the first exit through hole 29 and reaches the substrate 15 before molding. Similarly, a reflector 44 for changing the traveling direction of the irradiation light 33 emitted from the light-emitting element 30 toward the -Y direction by 90 degrees is provided in the light guide portion 42. The irradiation light 33 whose traveling direction is changed in the -Z direction by the reflector 44 passes through the first exit through hole 30 to reach the substrate 15 before molding.

As shown in Fig. 7C, the arrangement of the first light receiving elements 31 and 32 provided in the supply mechanism 13 is the same as in the first embodiment. The operation of verifying the positioning of the substrate 15 before molding is the same as in the first embodiment. Therefore, also in this embodiment, the same effects as those in the first embodiment are exhibited.

[Embodiment 3]

With reference to Fig. 8, in the third embodiment, a mechanism and operation for verifying whether or not the pre-molding substrate 15 supplied to the upper mold has been normally positioned will be described. The difference from the first embodiment is that the light-emitting elements 27 and 28 are provided in the supply mechanism, and two reflecting mirrors are provided as optical members in the light guide part provided in the fixed platen. Along with this change, the configurations of the upper mold, the lower mold and the fixed platen differ from the first to second embodiments.

(Substrate positioning verification mechanism)

Referring to Fig. 8, a mechanism for verifying whether or not the pre-molding substrate 15 supplied to the upper mold is positioned normally will be described. As shown in (b) and (c) of FIG. 8, a light emitting element 27 and a first light receiving element 31, which are components for verifying the positioning of the substrate 15 in the X direction before molding, are supplied. It is provided in the mechanism 45. Similarly, the light-emitting element 28 and the first light-receiving element 32, which are constituent elements for verifying the positioning of the substrate 15 in the Y direction before molding, are provided in the supply mechanism 45.

As shown in (a), (b), and (c) of FIG. 8, a through hole for entrance for passing the irradiation light 33 emitted from the light emitting elements 27 and 28 provided in the supply mechanism 45 (46 and 47) are provided in the upper mold 48, respectively. When viewed in plan view, the light emitting element 27 and the entrance through hole 46 are disposed so as to overlap. Likewise, the light-emitting element 28 and the entrance hole 47 are disposed so as to overlap when viewed in plan view. In addition, "injection use" means that the irradiation light 33 is made to enter the light guide portions 50 and 51 (described later) on the upper mold 48 side from the external light emitting elements 27 and 28.

The fixed platen 49 is provided with a light guide portion 50 connected to the first exit through hole 29 and the entrance through hole 46 along the X direction. Likewise, a light guide portion 51 connected to the first exit through hole 30 and the entry through hole 47 is provided along the Y direction. The light guide portion 50 is provided with reflecting mirrors 43a and 43b that change the traveling direction of the irradiation light 33 as an optical member by 90 degrees, respectively. Similarly, the light guide portion 51 is provided with reflecting mirrors 44a and 44b for changing the traveling direction of the irradiation light 33 as an optical member by 90 degrees, respectively.

{Substrate positioning verification operation (manufacturing method of resin molded product)}

Referring to Fig. 8, an operation of verifying whether or not the pre-molding substrate 15 supplied to the upper mold is properly positioned will be described. In addition, the description here also serves as a description of a method of manufacturing a resin molded article.

As shown in FIG. 8B, the irradiation light 33 emitted from the light emitting element 27 toward the +Z direction passes through the entrance through hole 46 and enters the reflector 43a. The irradiation light 33 incident on the reflecting mirror 43a is changed in a direction of 90 degrees by the reflecting mirror 43a, travels in the -X direction in the light guide unit 50 and is incident on the reflecting mirror 43b. The irradiation light 33 incident on the reflector 43b is changed by 90 degrees by the reflector 43b, proceeds in the -Z direction, and passes through the first exit through hole 29. The irradiation light 33 passing through the first exit through hole 29 reaches the substrate 15 before molding.

The first light-receiving element 31 provided in the supply mechanism 45 is emitted from the light-emitting element 27 and passes through the entrance through hole 46, the light guide part 50, and the first exit through hole 29 in sequence. Depending on whether or not one irradiation light 33 is detected, it is determined whether or not the substrate 15 is normally positioned in the X direction before molding. Similarly, the second light-receiving element 32 is emitted from the light-emitting element 28 and sequentially passes through the entrance through hole 47, the light guide portion 51, and the first exit through hole 30. Depending on whether) is detected, it is determined whether or not the substrate 15 is normally positioned in the Y direction before molding. In this way, it is possible to verify the positioning of the substrate 15 before molding. In this case, since both the light-emitting elements 27 and 28 and the first light-receiving elements 31 and 32 are provided in the supply mechanism 45, it becomes easy to wire their signal lines to the control unit and determination unit of the resin molding apparatus. . About the action and effect, since the effect similar to that in Embodiment 1 is exhibited, description is abbreviate|omitted.

[Embodiment 4]

Referring to Fig. 9, in the fourth embodiment, a mechanism for verifying whether or not the pre-molding substrate 15 supplied to the upper mold 48 is positioned normally will be described. The difference from the third embodiment is that an optical fiber is used instead of a reflector as the optical member. Other configurations and operations are the same as those of the third embodiment, and thus a description thereof will be omitted.

As shown in (a) and (b) of FIG. 9, optical fibers 52 and 53 are provided in the light guide portions 50 and 51 provided on the fixed platen 49, respectively. It is preferable that the optical fibers 52 and 53 are optical fibers having heat resistance. The optical fibers 52 and 53 have a double structure of a core in the center and a cladding surrounding the core. In order to maintain heat resistance, it is preferable to use an optical fiber in which the core and clad are made of quartz glass and the periphery thereof is covered with heat-resistant polyimide.

Corresponding to the diameters of the first outgoing through holes 29 and 30 and the inlet through holes 46 and 47, a single-core optical fiber having one optical fiber, or an optical fiber bundle obtained by bundling and covering a plurality of single-core optical fibers Can be used. In addition, lenses for optical fibers can be incorporated at both ends of the optical fiber. As the lens, a collimator lens, a condensing lens, an aspherical lens, and the like are appropriately used. In FIG. 9, the case where the optical fiber lens 54 is provided on the side which receives the irradiation light 33 emitted from the light emitting elements 27, 28 is shown, respectively. The optical fibers 52 and 53 are characterized by low transmission loss and high degree of freedom of wiring. Further, it is preferable to use a heat-resistant optical fiber as the optical fiber, and for example, an optical fiber made of quartz coated with a polyimide resin can be used.

The operation of verifying the positioning of the substrate 15 before molding is the same as in the first embodiment, and thus the description will not be repeated. Also in this embodiment, the same effects as those in the first embodiment are exhibited.

[Embodiment 5]

Referring to Fig. 10, in the fifth embodiment, a mechanism for verifying whether or not the pre-molding substrate 15 supplied to the upper mold 48 is positioned normally will be described. The difference from the fourth embodiment is that an optical fiber is provided in the light guide portion provided in the upper mold 48. Other configurations and operations are the same as those of the fourth embodiment, and thus a description thereof will be omitted.

As shown in FIGS. 10A and 10B, optical fibers 52 and 53 shown in the fourth embodiment are provided in the light guide portions 55 and 56 provided in the upper mold 48, respectively. The optical fibers 52 and 53 are optical fibers having heat resistance.

The operation of verifying the positioning of the substrate 15 before molding is the same as in the first embodiment. Also in this embodiment, the same effects as those in the first embodiment are exhibited.

[Embodiment 6]

Referring to Fig. 11, in the sixth embodiment, whether the pre-molding substrate 15 supplied to the upper mold 9 is normally positioned on the guide members 23, 24, and the guide members 23, 24 A mechanism for simultaneously verifying whether an abnormality such as abrasion or missing has occurred, or whether deformation such as warping or bending has occurred in the substrate 15 before molding will be described. The difference from the embodiment described so far is that the positions where the first exit through holes 29 and 30 are provided are different.

As shown in FIG. 11A, in a state in which the substrate 15 before molding is in contact with the guide members 23 and 24, for example, the substrate 15 before molding is on the mold surface of the upper mold 9 First exit through holes 29 and 30 are provided at diagonal corners in the arranged region (in the upper right and lower left in Fig. 11), respectively. In a state in which the first exit through holes 29 and 30 are provided at this position, the light emitting element 27 and the first light receiving element 31 are overlapped with the first exit through hole 29 in plan view, The light-emitting element 28 and the first light-receiving element 32 are provided so as to overlap the first exit through hole 30.

When both the first light-receiving elements 31 and 32 do not detect the irradiation light 33 emitted from the light-emitting elements 27 and 28, the positioning defect of the substrate 15 before molding, the guide member 23, It can be determined that the abnormality of 24) and the deformation|transformation of the board|substrate 15 before forming do not occur. When either of the first light-receiving elements 31 or 32 detects the irradiation light 33, the positioning failure of the substrate 15 before molding, abnormality of the guide members 23 and 24, or the substrate 15 before molding ), it can be judged that the normal position is not determined due to any of the deformation.

With such a configuration, it is possible to simultaneously verify poor positioning of the substrate 15 before molding, abnormalities of the guide members 23 and 24, and deformation of the substrate 15 before molding without increasing the number of light emitting elements and light receiving elements. have. Therefore, in the resin molding apparatus, the cost of the positioning mechanism can be suppressed.

[Embodiment 7]

Referring to Fig. 12, in the seventh embodiment, a mechanism for verifying whether or not the pre-molding substrate 15 supplied to the upper mold 9 is positioned normally will be described. The difference from Embodiment 1 is that at the ends along the Y and X directions of the substrate 15 before molding, two light-emitting elements and two light-receiving elements are provided to verify the positioning of the substrate 15 before molding. Is to do. Thereby, it can be verified whether or not the substrate 15 is normally positioned before forming, including not only the X and Y directions, but also the θ direction. Configurations other than that are the same as those of the first embodiment, and thus description thereof is omitted.

(Substrate positioning verification mechanism)

Referring to Fig. 12, in the seventh embodiment, a mechanism for verifying the positioning of the pre-molding substrate 15 supplied to the upper mold 9 will be described. As shown in Fig. 12A, as in the first embodiment, on the mold surface of the upper mold 9, a guide member 23 for positioning the substrate 15 before molding in the X direction, and the substrate 15 before molding Guide members 24 for positioning) in the Y direction are provided, respectively.

As shown in (a) and (b) of Fig. 12, in order to verify the positioning of the substrate 15 in the X direction before molding, two light-emitting elements 27a and 27b inside the fixed platen 4 Is prepared. Similarly, two light-emitting elements 28a and 28b are provided inside the fixed platen 4 in order to verify the positioning of the substrate 15 in the Y direction before molding.

The upper mold 9 is provided with first outgoing passage holes 29a and 29b for passing irradiation light emitted by the light emitting elements 27a and 27b, respectively. As shown in Fig. 12A, the first exit through holes 29a and 29b are the substrate 15 before molding in a state in which the substrate 15 is in contact with the guide member 23 before molding. Each of the upper mold 9 is provided in a region disposed on the mold surface. The first exit through-holes 30a and 30b are in a region where the substrate 15 is disposed on the mold surface of the upper mold 9 before molding, while the substrate 15 is in contact with the guide member 24 before molding. Each is provided.

As shown in Fig. 12C, the supply mechanism 13 is provided with first light-receiving elements 31a and 31b for detecting the irradiation light 33 emitted by the light-emitting elements 27a and 27b, respectively. The first light receiving elements 31a and 31b are light receiving elements for verifying the positioning of the substrate 15 in the X direction before forming. Similarly, the supply mechanism 13 is provided with first light-receiving elements 32a and 32b for detecting the irradiation light 33 emitted by the light-emitting elements 28a and 28b, respectively. The first light receiving elements 32a and 32b are light receiving elements that verify the positioning of the substrate 15 in the Y direction before forming.

Since two first light-receiving elements 31a and 31b are provided along the Y direction and two first light-receiving elements 32a and 32b are provided along the X direction, including the θ direction as well as the X and Y directions It can be verified whether or not the substrate 15 is normally positioned before molding. This makes it possible to verify the positioning of the substrate 15 before molding with higher precision.

In this embodiment, two first light-receiving elements 31a and 31b are provided along the Y-direction and two first light-receiving elements 32a and 32b are provided along the X-direction. The present invention is not limited thereto, and a configuration in which two first light receiving elements are provided along the Y direction and one first light receiving element is provided along the X direction may be employed. Alternatively, it may be configured to provide two first light receiving elements along the X direction and one first light receiving element along the Y direction. Also in these cases, it can be verified whether or not the substrate 15 is normally positioned before forming, including not only the X and Y directions, but also the θ direction.

Since the positioning verification operation of the substrate 15 before molding in this embodiment is basically the same as that of the first embodiment, the description will not be repeated. The effect similar to that of the first embodiment is also exhibited about the action and effect. Further, a mechanism for verifying an abnormality in the guide member or deformation of the substrate 15 before molding can be verified in the same manner as in the first embodiment.

[Embodiment 8]

Referring to FIG. 13, in the eighth embodiment, a mechanism for verifying the positioning of the pre-molding substrate 15 supplied to the upper mold 9 will be described. The difference from the seventh embodiment is that one light-emitting element and two first light-receiving elements are provided to verify positioning in the X and Y directions. The two first light receiving elements receive the irradiation light 33 emitted by the light emitting element through an optical fiber provided in the light guide portion in the fixed platen 4. Other configurations and operations are the same as those of the seventh embodiment, and thus descriptions thereof will be omitted.

13A and 13B, in order to verify the positioning of the substrate 15 in the X direction before molding, a light guide having a T-shaped shape inside the fixed platen 4 (57) is provided. The T-shaped light guide portion 57 is provided with an optical fiber 58, a branch member 59 for branching light traveling in the optical fiber 58, and branched optical fibers 58a and 58b. The irradiation light 33 emitted by the light-emitting element 27 passes through the optical fibers 58a and 58b, and the first emission through holes 29a and 29b sequentially through the optical fiber 58 and the branch member 59, They are detected by the first light receiving elements 31a and 31b, respectively.

Similarly, in order to verify the positioning of the substrate 15 in the Y direction before molding, a light guide portion 60 having a T-shaped shape is provided inside the fixed platen 4. The T-shaped light guide portion 60 is provided with an optical fiber 61, a branch member 62 for branching light traveling in the optical fiber 61, and branched optical fibers 61a and 61b. The irradiation light 33 emitted by the light-emitting element 28 passes through the optical fiber 61 and the branch member 62, and sequentially passes through the optical fibers 61a and 61b, and the first exit through holes 30a and 30b. They are detected by the first light receiving elements 32a and 32b, respectively.

With such a configuration, it is possible to reduce the number of light-emitting elements and verify whether or not the substrate 15 is normally positioned before molding, including not only the X and Y directions, but also the θ direction. Therefore, it is possible to verify the positioning of the substrate 15 before molding with higher precision, and furthermore, the cost of the positioning mechanism can be suppressed.

Here, the irradiation light 33 emitted from the common light-emitting element 28 is branched into the two first exit through holes 30a and 30b, but the first exit through hole and the second exit through hole Can also be branched to.

In the present embodiment, an optical fiber and a branch member are used to branch the irradiated light 33 emitted by the light emitting element. The present invention is not limited thereto, and it is not particularly limited as long as it employs an optical member that diverges the irradiation light emitted from the light-emitting element.

[Embodiment 9]

(Configuration of resin molding device)

The configuration of the resin molding apparatus according to the present invention will be described with reference to FIG. 14. The resin molding apparatus shown in FIG. 14 is, for example, a resin molding apparatus using a compression molding method. As shown in Embodiment 1, an example in which the pre-molding substrate 15 is used as a resin molding object and a liquid resin is used as the resin material is shown.

The resin molding apparatus 63 includes a substrate supply/storage module 64, three molding modules 65A, 65B, 65C, and a resin supply module 66 as constituent elements, respectively. The constituent elements of the substrate supply/receiving module 64, the molding modules 65A, 65B, 65C, and the resin supply module 66 can be detached from each other for different constituent elements, and can also be exchanged.

The substrate supply/storage module 64 includes a pre-molding substrate supply unit 67 for supplying a pre-molding substrate 15, a molded substrate storage unit 68 for accommodating a resin molded product 22 as a molded substrate, A substrate mounting portion 69 for receiving and receiving the pre-molding substrate 15 and the resin molded product 22, and a supply mechanism 13 for supplying the pre-molding substrate 15 to the mold 11 are provided. In this case, for example, the supply mechanism 13 shown in Embodiment 1 (refer FIG. 3(b), (c)) is provided. The supply mechanism 13 is provided with first light receiving elements 31 and 32 for verifying the positioning of the substrate 15 before molding. In this embodiment, the positioning verification mechanism described in the first embodiment is shown, but the positioning verification mechanism described in other embodiments may be employed.

Each of the molding modules 65A, 65B, 65C is provided with a resin molding unit 1 shown in Fig. 1, respectively. The resin molding unit 1 is provided with a lower mold 10 that can be raised and lowered, and an upper mold 9 (refer to FIGS. 3A and 3B) disposed opposite to the lower mold 10. The upper mold 9 and the lower mold 10 together constitute a molding mold 11 (see Fig. 2). Each of the shaping modules 65A, 65B, 65C has a mold clamping mechanism 6 for clamping and mold-opening the upper mold 9 and the lower mold 10 (a portion indicated by a dashed-dotted line in the drawing). A cavity 16 which is a space in which the liquid resin 20 (refer to FIG. 2B) is supplied and cured is provided in the lower mold 10. The lower mold 10 is provided with a mold release film supply mechanism 70 that supplies an elongated mold release film (see Fig. 2A). In addition, although the configuration in which the cavity 16 is provided in the lower mold 10 is described here, the cavity may be provided in the upper mold or may be provided in both the upper mold and the lower mold.

The resin supply module 66 is provided with a dispenser 18 for supplying the liquid resin 20 to the mold 11 and a moving mechanism 19 for moving the dispenser 18. The dispenser 18 is provided with a resin discharge part which discharges a liquid resin at the tip end.

The resin supply module 66 is provided with a control unit 72 having a determination unit 71. The determination unit 71 determines whether the first light-receiving elements 31 and 32 provided in the supply mechanism 13 detect the irradiation light 33, so that the substrate 15 is transferred to the mold 11 before molding. It is determined whether or not the position is normally determined. Further, the determination unit 71 also determines whether an abnormality has occurred in the guide member or whether deformation has occurred in the substrate 15 before molding. The control unit 72 includes the transfer of the substrate 15 and the resin molded product 22 before molding, positioning the substrate 15 before molding, supplying the liquid resin 20, heating the molding mold 11, and the molding mold ( 11) open and close control. In other words, the control unit 72 controls each operation in the substrate supply/storage module 64, the molding modules 65A, 65B and 65C, and the resin supply module 66.

The position where the control unit 72 is disposed may be any location, and may be disposed in at least one of the substrate supply/storage module 64, the molding modules 65A, 65B, 65C, and the resin supply module 66, and each module It can also be placed outside of. Further, the control unit 72 may be configured as a plurality of control units in which at least a part is separated according to an operation to be controlled. The determination unit 71 may also be provided corresponding to the configuration of the control unit.

The operation of the resin molding apparatus 63 is outlined in the method for producing a resin molded article shown in Fig. 2, and therefore, it is not repeated here.

In this embodiment, three molding modules 65A, 65B, and 65C are mounted in an X direction between the substrate supply/storage module 64 and the resin supply module 66. The substrate supply/storage module 64 and the resin supply module 66 may be used as one module, and one molding module 65A may be arranged in the X direction to be attached to the module. Further, another molding module 65B may be attached to the molding module 65A. Thereby, the molding modules 65A, 65B, ... can be increased or decreased according to the production form or production amount. Therefore, since the configuration of the resin molding apparatus 63 can be optimized, productivity can be improved.

In each embodiment, the pre-molding substrate 15 is supplied to the upper mold of the mold, and the light receiving element provided in the supply mechanism detects the irradiation light 33 so that the pre-molding substrate 15 supplied to the upper mold is normally positioned. Whether or not it was determined was verified. The present invention is not limited to this, and the present invention can also be applied to the case where the substrate 15 is supplied to the lower mold of the mold and the substrate 15 is positioned on the mold surface of the lower mold. Also in this case, the same effect as shown in each embodiment is exhibited.

In each embodiment, in the molding mold of the resin molding apparatus using the compression molding method, the case of verifying whether or not the pre-molding substrate 15 supplied to the upper mold has been properly positioned has been shown. The present invention is not limited to this, and the present invention can also be applied to a mold for a resin molding apparatus using a transfer molding method.

In each embodiment, an example in which the pre-molding substrate 15 on which the semiconductor chip 14 is mounted is used as a resin molding object is shown. As the substrate before molding, a general substrate such as a glass epoxy substrate, a ceramic substrate, a resin substrate, a metal substrate, and a lead frame can be used. Moreover, as a resin molding object, it can also be set as the structure attached to the plate jig as described in patent document 1.

In each of the embodiments, a resin molding apparatus used for resin molding a semiconductor chip, and a method for producing a resin molded article were described. The object to be resin-molded may be a semiconductor chip such as an IC or a transistor, a non-semiconductor chip that does not use a semiconductor, or a chip group in which a semiconductor chip and a non-semiconductor chip are mixed. The present invention can be applied when one or a plurality of chips mounted on a substrate such as a glass epoxy substrate, a ceramic substrate, or a lead frame are resin-molded with a cured resin.

As described above, in the resin molding apparatus of the above embodiment, a resin molding object is supplied to a mold surface having a first mold and a second mold disposed opposite to each other, and a mold surface of any one of the first mold and the second mold. A supply mechanism for positioning, a positioning mechanism for positioning a resin-molded object on a guide member on the mold surface, a mold fastening mechanism for clamping a mold, a light emitting element emitting irradiation light, and a light emitting element provided in the supply mechanism for irradiating light. A first light-receiving element capable of receiving light is provided, and a determination unit for determining the position of a resin-molded object is provided, and in one type, a first emission passage hole for passing irradiation light from the light emitting element is provided, and the determination unit 1 Based on the detection by the first light-receiving element for the irradiation light that has passed through the exit through hole, it is configured to determine whether or not the object to be molded is normally positioned on the guide member.

According to this configuration, it is possible to perform resin molding in the state of verifying that the object to be molded is normally positioned on the guide member. Therefore, it is possible to suppress the occurrence of molding defects due to positioning.

Further, in the resin molding apparatus of the above embodiment, when the first light receiving element does not detect the irradiation light, the determination unit determines that the resin molding object is normally positioned on the guide member, and the first light receiving element detects the irradiation light. In one case, it is determined that the resin molding object is not normally positioned on the guide member.

According to this configuration, it is determined whether or not the resin molding object is normally positioned on the guide member, depending on whether the first light receiving element detects the irradiation light. Therefore, it is possible to suppress the occurrence of molding defects due to positioning.

Further, in the resin molding apparatus of the above embodiment, in a state in which the resin molding object is in contact with the guide member, the first exit through hole is provided in a region in which the resin molding object on the side of the guide member is disposed.

According to this configuration, it is determined whether or not the object to be molded resin is normally positioned on the guide member by whether or not the first light receiving element detects the irradiation light that has passed through the first exit through hole. Therefore, it is possible to suppress the occurrence of molding defects due to positioning.

Further, in the resin molding apparatus of the above embodiment, a light guide portion for guiding the irradiation light emitted from the light emitting element to the first exit through hole is provided on the platen provided with one or the other, and the irradiation light in the light guide portion It has a structure in which an optical member which passes through is provided.

According to this configuration, by providing the optical member in the light guide portion, the irradiated light emitted from the light emitting element can be guided to the first through hole.

In addition, in the resin molding apparatus of the above embodiment, the optical member is configured to include any of an optical fiber, a reflector, and a prism.

According to this configuration, irradiation light can be guided to the first exit through hole by using any one of an optical fiber, a reflector, and a prism.

Further, in the resin molding apparatus of the above embodiment, the light-emitting element is provided in the supply mechanism, and in one type, an inlet through hole for guiding the irradiation light emitted from the light-emitting element to the light guide portion is provided.

According to this configuration, the irradiation light emitted from the light emitting element provided in the supply mechanism can be guided to the first exit through hole through the inlet passage hole and the optical member.

Further, in the resin molding apparatus of the above embodiment, in a state in which the resin molding object is in contact with the guide member, irradiation light emitted from the light emitting element or other light emitting element passes through the region where the resin molding object opposite to the guide member is disposed. A second light-emitting passage hole is provided, and a second light-receiving element capable of receiving irradiation light is provided in the supply mechanism.

According to this configuration, whether or not the second light-receiving element detects the irradiation light passing through the second outgoing passage hole provided on the opposite side of the guide member, whether or not an abnormality in the guide member and deformation of the resin molding object occur? At least one of whether or not can be determined. Therefore, it is possible to suppress the occurrence of molding defects due to positioning.

The method for manufacturing a resin molded article of the above embodiment includes a supply step of supplying a resin molding object to a mold surface of one of a mold having a first mold and a second mold disposed opposite to each other by a supply mechanism, and In the following, a positioning step of positioning the resin-molded object on the guide member, an irradiation step of emitting irradiation light passing through the first exit through hole provided in one mold from the light emitting element, and a first light receiving element provided in the supply mechanism are provided. 1 A detection process for detecting irradiation light that has passed through the exit through hole, a judgment process for judging whether or not the resin molding object is normally positioned on the guide member based on detection in the detection process, and a judgment process WHEREIN: In the case where it is judged that a resin molding object is positioned normally, it includes a resin molding process of mold-fastening a molding mold and resin molding.

According to this method, resin molding can be performed in a state in which it has been verified that the object to be molded is normally positioned on the guide member. Therefore, it is possible to suppress the occurrence of molding defects due to positioning.

In addition, in the method of manufacturing a resin molded article of the above embodiment, the determination step is, when the first light receiving element does not detect the irradiation light in the detection step, it is determined that the resin molding object is normally positioned on the guide member, and the detection step In the case where the first light-receiving element detects the irradiation light, it is determined that the resin molding object is not normally positioned on the guide member.

According to this method, it is determined whether or not the resin molding object is normally positioned on the guide member, depending on whether the first light receiving element detects the irradiation light. Therefore, it is possible to suppress the occurrence of molding defects due to positioning.

In addition, in the method of manufacturing a resin molded article of the above embodiment, the detection step passes through the first exit through hole provided in the region where the resin molded object on the side of the guide member is disposed in a state in which the resin molded object is in contact with the guide member. It detects one irradiation light.

According to this method, it is determined whether or not the object to be molded resin is normally positioned on the guide member by whether or not the first light receiving element detects the irradiation light that has passed through the first exit through hole. Therefore, it is possible to suppress the occurrence of molding defects due to positioning.

In addition, in the method of manufacturing a resin molded article of the above embodiment, the irradiation step emits irradiation light toward the light guide portion provided on the platen provided with one mold or one mold, and the detection step is the first exit through hole via the light guide portion. The irradiation light that has passed through is detected.

According to this method, it is determined whether or not the object to be molded resin is normally positioned on the guide member by whether the first light receiving element detects the irradiation light passing through the first exit through hole via the light guide. . Therefore, it is possible to suppress the occurrence of molding defects due to positioning.

Further, in the method for manufacturing a resin molded article of the above embodiment, the light emitting element is provided in the supply mechanism, and the irradiation light is sequentially passed through the inlet passage hole, the light guide portion, and the first outlet passage hole provided in one mold from the light-emitting element. It is detected by the first light receiving element.

According to this method, depending on whether or not the first light-receiving element detects the irradiation light that has passed through the inlet passage hole, the light guide portion, and the first outlet passage hole sequentially after the light emitting element provided in the supply mechanism emits, It is determined whether or not the guide member is normally positioned. Therefore, it is possible to suppress the occurrence of molding defects due to positioning.

Further, in the method of manufacturing a resin molded article of the above embodiment, the detection step is a second exit through hole provided in a region where the resin molded object on the opposite side of the guide member is disposed in a state in which the resin molded object is in contact with the guide member. The second light-receiving element detects the irradiation light emitted from the light-emitting element or other light-emitting element that has passed through, and the determination process includes a guide member based on detection by the second light-receiving element in the detection process. It judges about at least one of the abnormality and the deformation|transformation of the resin molding object.

According to this method, depending on whether the second light-receiving element detects the irradiation light that has passed through the second exit through hole provided on the opposite side of the guide member, it is possible to determine whether an abnormality in the guide member and deformation of the resin molding object are occurring. At least one of whether or not can be determined.

Therefore, it is possible to suppress the occurrence of molding defects due to positioning.

The present invention is not limited to each of the embodiments described above, and can be arbitrarily and appropriately combined, changed, or selected and adopted as necessary within a range not departing from the spirit of the present invention.

1: resin molding unit
2: base
3: tie bar
4, 49: fixed platen (platen)
5: Movable platen (platen)
6: type fastening mechanism
7: maneuver
8: transmission member
9, 48: upper type (first type, second type, one type)
10: Lower type (2nd type, 1st type, one type)
11: molding mold
12: resin molding object
13: supply mechanism
14: semiconductor chip
15: substrate before molding (resin molding object)
16: cavity
17: release film
18: dispenser
19: drive mechanism
20: liquid resin
21: cured resin
22: resin molded product
23, 23X, 24: guide member
25, 26: positioning mechanism
27, 27a, 27b, 28, 28a, 28b, 35, 36: light emitting element
29, 29a, 29b, 30, 30a, 30b: first exit through hole
31, 31a, 31b, 32, 32a, 32b: first light receiving element
33: irradiation light
34: gap
37, 38: second exit through hole
39, 40: second light receiving element
41, 42, 50, 51, 55, 56, 57, 60: light guide part
43, 43a, 43b, 44, 44a, 44b: reflector (optical member)
45: supply mechanism
46, 47: through hole for mouth
52, 53, 58, 58a, 58b, 61, 61a, 61b: optical fiber (optical member)
54: lens for optical fiber (optical member)
59, 62: branch member (optical member)
63: resin molding apparatus
64: Board supply/storage module
65A, 65B, 65C: Molding module
66: resin supply module
67: substrate supply before molding
68: resin molded product storage unit
69: substrate loading portion
70: release film supply mechanism
71: judgment unit
72: control unit

Claims (13)

A molding mold having a first mold and a second mold disposed opposite to each other,
A supply mechanism for supplying a resin molding object to a mold surface of any one of the first mold and the second mold,
A positioning mechanism for positioning the resin molding object on a guide member in the mold surface,
A mold fastening mechanism for mold-fastening the mold,
A light-emitting element provided in the supply mechanism and emitting irradiation light,
A first light receiving element provided in the supply mechanism and capable of receiving the irradiated light,
A determination unit that determines the position of the resin molding object,
And a light guide provided on the one mold or the platen on which the one mold is installed,
In the one of the molds, an entrance passage hole for passing the irradiation light emitted from the light emitting element to guide the light guide portion and a first exit passage hole for further passing the irradiation light from the light emitting element passing through the light guide portion. Is provided,
The determination unit determines whether or not the resin molding object is normally positioned on the guide member based on detection by the first light receiving element for the irradiation light that has passed through the first exit through hole. , Resin molding device. The method of claim 1,
When the first light-receiving element does not detect the irradiation light, the determination unit determines that the resin molding object is normally positioned on the guide member, and when the first light-receiving element detects the irradiation light A resin molding apparatus for determining that the resin molding object is not normally positioned on the guide member. The method according to claim 1 or 2,
The resin molding apparatus, wherein the first exit through hole is provided in a region on the side of the guide member in which the resin molding object is disposed in a state in which the resin molding object is in contact with the guide member. The method according to claim 1 or 2,
The light guide portion is for guiding the irradiation light emitted from the light emitting element to the first exit through hole,
A resin molding apparatus in which an optical member through which the irradiation light passes is provided in the light guide portion. delete delete The method according to claim 1 or 2,
In a state in which the resin molding object is in contact with the guide member, a second exit to pass irradiation light emitted from the light emitting element or other light emitting element to a region in which the resin molding object is disposed on the opposite side of the guide member A through hole is provided in the one mold,
The resin molding apparatus, wherein the supply mechanism is provided with a second light receiving element capable of receiving the irradiation light that has passed through the second exit through hole. A supply step of supplying a resin molding object to a mold surface of any one of a molding mold having a first mold and a second mold disposed opposite to each other by a supply mechanism,
A positioning step of positioning the resin molding object on a guide member in the mold surface,
An irradiation step of emitting irradiation light passing through the first exit through hole provided in the one mold from the light emitting element provided in the supply mechanism;
A detection step in which the first light receiving element provided in the supply mechanism detects the irradiated light that has passed through the first exit through hole;
A determination step of determining whether or not the resin molding object is normally positioned on the guide member based on detection in the detection step;
In the determination step, when it is determined that the object to be molded is normally positioned, a resin molding step of mold-fastening the molding mold to mold the resin,
In the irradiation step, the irradiation light is emitted toward the light guide portion provided on the one mold or the platen on which the one mold is installed,
The irradiation light is detected by the first light-receiving element from the light-emitting element through an inlet passage hole provided in the one mold, the light guide portion, and the first outlet passage hole in sequence. The method of claim 8,
In the determination step, when the first light receiving element does not detect the irradiation light in the detection step, it is determined that the resin molding object is normally positioned on the guide member, and in the detection step, the first light receiving element A method of manufacturing a resin molded article, wherein when the light receiving element detects the irradiation light, it is determined that the resin molded object is not normally positioned on the guide member. The method according to claim 8 or 9,
In the detection step, in a state in which the resin molding object is in contact with the guide member, with respect to the irradiation light passing through the first exit through hole provided in a region on the side of the guide member in which the resin molding object is disposed A method of manufacturing a resin molded article to be detected. delete delete The method according to claim 8 or 9,
In the detection step, the light-emitting element passing through a second exit through hole provided in a region on the opposite side of the guide member in which the resin molding object is disposed in a state in which the resin molding object is in contact with the guide member Or a step of detecting by the second light-receiving element for irradiation light emitted from another light-emitting element,
In the determination step, based on detection by the second light-receiving element in the detection step, at least one of an abnormality in the guide member and a deformation of the resin molding object is determined.

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