JP2018183931A - Resin molding apparatus, and method for manufacturing resin molding - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the occurence of molding defects caused by positioning of a to-be-resin-molded object.SOLUTION: A resin molding apparatus includes: a mold having an upper mold 9 being a first mold and a lower mold 10 being a second mold arranged opposite to each other; a supply mechanism 13 for supplying a substrate 15 before molding being a to-be-resin-molded object onto a mold surface; positioning mechanisms 25 and 26 for positioning the substrate 15 before molding onto guide members 23 and 24; a clamp mechanism for clamping the mold; light-emitting elements 27 and 28 for emitting an irradiation light; first light receiving elements 31 and 32 provided in the supply mechanism 13 and capable of receiving the irradiation light; and a determination part for determining about the positioning of the substrate 15 before molding. The upper mold 9 is provided with first passing holes 29 and 30 for emission that allow the irradiation light from the light-emitting elements 27 and 28 to pass through. The determination section determines whether or not the substrate 15 before molding is properly positioned to the guide members 23 and 24 based on the detection by the first light receiving elements 31 and 32 of the irradiation light passed through the first passing holes 29 and 30.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a resin molding apparatus for resin molding a resin molding object and a method for manufacturing a resin molded product.

  As a conventional technique, for example, Patent Document 1 discloses a supply unit (8) for a molded product (5), a supply unit (20) for a plate jig (10) that supports the molded product (5), A mounting portion (30) for detecting a positioning identification portion provided on the molded product (5) and mounting the molded product (5) at a predetermined position of the plate jig (10), and a molded product (5) Is provided with positioning means for positioning the plate jig (10) mounted with the resin mold mold (50, 51), and clamps the molded product (5) together with the plate jig (10) to resin mold. A pressing device (40) to which a mold die (50, 51) is attached; a storage part (60) for a molded product (62) molded by a resin mold (50, 51); 5) Molded product (62) and plate jig (10) (5) The supply part (8), the supply part (20) of the plate jig (10), the mounting part (30), the pressing device (40), and the storage part (60) of the molded product (62) are supplied and discharged. A resin molding apparatus including a supply / discharge mechanism (70, 72) is disclosed.

  Further, Patent Document 1 describes that the plate jig 10 is brought into contact with a positioning pin 45 provided on the lower die 44 as a positioning means, for example, as shown in FIG. Paragraph [0023]).

JP 2008-132730 A

  Patent Document 1 does not describe whether or not the positioning is appropriately performed in the positioning in which the plate jig 10 is brought into contact with the positioning pin 45. Then, the molding defect resulting from the positioning is found from the molded product after molding.

  The present invention solves the above-described problems, and an object thereof is to provide a resin molding apparatus and a method for manufacturing a resin molded product that can suppress the occurrence of molding defects due to positioning.

  In order to solve the above-described problems, a resin molding apparatus according to the present invention includes a molding die having a first die and a second die arranged to face each other, and one of the first die and the second die. Supply mechanism for supplying resin molding object to mold surface of mold, positioning mechanism for positioning resin molding object on guide surface on guide member, mold clamping mechanism for clamping mold, and light emitting element for emitting irradiation light A first light receiving element that is provided in the supply mechanism and can receive the irradiation light, and a determination unit that determines the positioning of the resin molding target, wherein one of the molds allows the irradiation light from the light emitting element to pass therethrough. An exit passage hole is provided, and the determination unit determines whether the resin molding object is normally positioned on the guide member based on detection by the first light receiving element with respect to the irradiation light that has passed through the first exit passage hole. Judging.

  In order to solve the above-described problems, a method for producing a resin molded product according to the present invention includes a resin on a mold surface of one of a mold having a first mold and a second mold disposed to face each other. A supply step of supplying the molding object by the supply mechanism, a positioning step of positioning the resin molding object on the guide member on the mold surface, and emitting irradiation light that passes through the first emission passage hole provided in one mold Based on the irradiation process emitted from the element, the detection process in which the first light receiving element provided in the supply mechanism detects the irradiation light that has passed through the first emission passage hole, and the detection in the detection process, A determination process for determining whether or not the guide member is normally positioned, and a resin molding that performs resin molding by clamping the mold when it is determined in the determination process that the resin molding object is normally positioned. Process Including the.

  According to this invention, generation | occurrence | production of the molding defect resulting from positioning can be suppressed.

In the resin molding apparatus which concerns on this invention, it is a front view which shows the outline | summary of the resin molding mounting unit. (A)-(d) is a schematic sectional drawing which shows the process of resin-molding a resin molding target object. In Embodiment 1, it is the schematic which shows the mechanism which verifies whether the resin molding target object is normally positioned on the type | mold surface of an upper mold | type, (a) is a bottom view of an upper mold | type, (b) is a shaping | molding. A schematic sectional view of a mold and a supply mechanism, (c) is a plan view of the supply mechanism. In Embodiment 1, it is the schematic which verifies whether the resin molding target object positioned by the upper mold surface is positioned normally, (a) is the state which positions a resin molding target object, (b ) Is a schematic cross-sectional view showing a normally positioned state, and FIG. In Embodiment 1, it is the schematic which shows the mechanism which verifies whether the deformation | transformation of bending etc. has generate | occur | produced in the guide member abnormality or the resin molding target object, (a) is a bottom view of an upper mold | type, ( b) is a schematic cross-sectional view of a mold and a supply mechanism, and (c) is a plan view of the supply mechanism. In Embodiment 1, it is the schematic which verifies whether the abnormality of a guide member or curvature has generate | occur | produced in the resin molding target object, (a) is the state in which the resin molding target object is positioned normally, (b ) Is a schematic sectional view showing a state in which an abnormality has occurred in the guide member, and (c) is a schematic sectional view showing a state in which the resin molding object is warped. In Embodiment 2, it is the schematic which shows the state which positioned the resin molding target object on the type | mold surface of the upper mold | type, (a) is a bottom view of an upper mold | type, (b) is a schematic sectional drawing of a shaping | molding die and a supply mechanism, (C) is a top view of a supply mechanism. In Embodiment 3, it is the schematic which shows the state which positioned the resin molding target object on the type | mold surface of the upper mold | type, (a) is a bottom view of an upper mold | type, (b) is a schematic sectional drawing of a shaping | molding die and a supply mechanism, (C) is a top view of a supply mechanism. In Embodiment 4, it is the schematic which shows the state which positioned the resin molding target object on the mold surface of the upper mold, (a) is a bottom view of the upper mold, (b) is a schematic sectional view of the mold and the supply mechanism, (C) is a top view of a supply mechanism. In Embodiment 5, it is the schematic which shows the state which positioned the resin molding target object on the type | mold surface of the upper mold | type, (a) is a bottom view of an upper mold | type, (b) is a schematic sectional drawing of a shaping | molding die and a supply mechanism, (C) is a top view of a supply mechanism. In Embodiment 6, it is the schematic which shows the state which positioned the resin molding target object on the type | mold surface of the upper mold | type, (a) is a bottom view of an upper mold | type, (b) is a schematic sectional drawing of a shaping | molding die and a supply mechanism, (C) is a top view of a supply mechanism. In Embodiment 7, it is the schematic which shows the state which positioned the resin molding target object on the upper mold surface, (a) is a bottom view of an upper mold, (b) is a schematic sectional view of a mold and a supply mechanism, (C) is a top view of a supply mechanism. In Embodiment 8, it is the schematic which shows the state which positioned the resin molding target object to the upper mold surface, (a) is a bottom view of an upper mold, (b) is a schematic sectional view of a mold and a supply mechanism, (C) is a top view of a supply mechanism. In the resin molding apparatus which concerns on this invention, it is a top view which shows the outline | summary of an apparatus.

  Hereinafter, embodiments according to the present invention will be described with reference to the drawings. Any figure in the present application document is schematically omitted or exaggerated as appropriate for easy understanding. About the same component, the same code | symbol is attached | subjected and description is abbreviate | omitted suitably. In the present application documents, “resin molding” means that a resin is molded by a molding die, and is an expression of a concept including “resin sealing” in which a sealing resin portion is molded by a molding die. Further, “resin molded product” means a product including at least a resin-molded resin portion. It is an expression of a concept including a sealed substrate in a form in which a semiconductor chip mounted on a substrate as described later is resin-molded by a molding die and resin-sealed.

Embodiment 1
(Configuration of resin molding unit)
With reference to FIG. 1, the structure of the resin molding unit used in the resin molding apparatus according to the present invention will be described. A resin molding unit 1 shown in FIG. 1 is a resin molding unit using, for example, a compression molding method or a transfer molding method. The resin molding unit 1 has a base 2. Tie bars 3 as four holding members are fixed at the four corners of the base 2. A fixed platen 4 facing the base 2 is fixed to the upper part of the four tie bars 3 extending upward. Between the base plate 2 and the fixed platen 4, the movable platen 5 facing the base plate 2 and the fixed platen 4 is fitted into the four tie bars 3. A mold clamping mechanism 6 that raises and lowers the movable platen 5 is provided on the base 2. The mold clamping mechanism 6 moves the movable platen 5 up and down to perform mold opening and mold clamping of the mold. The mold clamping mechanism 6 is configured by a combination of a drive source 7 and a transmission member 8. For example, a combination of a servo motor and a ball screw, a combination of a hydraulic cylinder and a rod, or the like is used as the mold clamping mechanism 6. A toggle link mechanism can also be used as a mold clamping mechanism.

  An upper mold 9 is fixed to the lower surface of the fixed platen 4. A lower mold 10 is provided directly below the upper mold 9 so as to face the upper mold 9. The lower mold 10 is fixed to the upper surface of the movable platen 5. The upper die 9 and the lower die 10 together constitute a forming die 11. The upper mold 9 and the lower mold 10 are appropriately provided with heaters (not shown) as heating means.

  Between the upper mold 9 and the lower mold 10, for example, a supply mechanism 13 that supplies the resin molding object 12 to the mold surface of the upper mold 9 is disposed. As the resin molding object 12, for example, a substrate on which a semiconductor chip is mounted, a lead frame on which the semiconductor chip is mounted, and the like are supplied to the mold surface of the upper mold 9. In this case, the case where the resin molding object 12 is supplied to the mold surface of the upper mold 9 is shown, but the resin molding object 12 may be supplied to the mold surface of the lower mold 10.

(Production method of resin molded products)
1 and 2, in a resin molding unit 1 provided in a resin molding apparatus (see FIG. 14), for example, a semiconductor chip mounted on a substrate as a resin molding object is resin molded to obtain a resin molded product. The process of the manufacturing method will be described.

  As shown in FIG. 2A, first, the upper mold 9 and the lower mold 10 are opened in a resin molding apparatus. Next, the pre-molding substrate 15, which is a substrate on which the semiconductor chip 14 is mounted, is transported between the upper mold 9 and the lower mold 10 using the supply mechanism 13. In this case, since the pre-molding substrate 15 is supplied to the mold surface of the upper mold 9, it is transported with the surface on which the semiconductor chip 14 is mounted facing down. Next, the supply mechanism 13 is raised to supply the pre-molding substrate 15 to the mold surface of the upper mold 9.

  Next, as will be described later, the pre-molding substrate 15 is positioned on the guide member by the positioning mechanism on the mold surface of the upper mold 9 (see FIG. 3A). Whether or not the pre-molding substrate 15 is normally positioned on the mold surface of the upper mold 9 is verified using a light receiving element (see FIGS. 3B and 3C) provided in the supply mechanism 13. The operation of positioning the pre-molding substrate 15 on the mold surface of the upper mold 9 and the operation of determining whether the pre-molding substrate 15 is normally positioned on the mold surface of the upper mold 9 will be described later (FIG. 3). 6).

  Next, when it is determined that the pre-molding substrate 15 is normally positioned on the mold surface of the upper mold 9, it is provided on the lower mold 10 using a release film supply mechanism (see FIG. 14). A release film 17 is supplied to the cavity 16. As the release film 17, either a long release film continuously supplied from the film supply reel to the take-up reel or a release film cut into a strip shape is used. Alternatively, it is possible not to use a release film.

  Next, as shown in FIG. 2B, for example, a case where a dispenser is used as the resin supply mechanism and a liquid resin is supplied to the cavity 16 as a resin material will be described. A dispenser 18 shown in FIG. 2B is a one-component dispenser that uses a liquid resin in which a main agent and a curing agent are mixed in advance. For example, a thermosetting silicone resin or epoxy resin is used as the main agent. You may use the 2 component mixing type dispenser which mixes and uses a main ingredient and a hardening | curing agent when supplying liquid resin.

  Next, the dispenser 18 is moved between the upper mold 9 and the lower mold 10 by the moving mechanism 19. Next, the liquid resin 20 is discharged from the discharge port of the dispenser 18 into the cavity 16. As a result, the liquid resin 20 is supplied to the cavity 16. In this case, the liquid resin 20 was supplied to the cavity 16 using the dispenser 18. However, the resin material is not limited to this, and can be supplied to the cavity by using a resin material such as powder, granule, sheet, or solid.

  Next, as shown in FIG. 2C, the movable platen 5 is raised using the mold clamping mechanism 6 (see FIG. 1). Thus, the upper mold 9 and the lower mold 10 are clamped. By clamping the mold, the semiconductor chip 14 mounted on the pre-molding substrate 15 is immersed in the liquid resin 20 supplied to the cavity 16. At this time, a constant resin pressure can be applied to the liquid resin 20 in the cavity 16 by using a cavity bottom surface member (not shown) provided in the lower mold 10.

  In the mold clamping process, the inside of the cavity 16 may be sucked using a vacuuming mechanism (not shown). As a result, air remaining in the cavity 16 or bubbles contained in the liquid resin 20 are discharged to the outside of the mold 11. In addition, the inside of the cavity 16 is set to a certain degree of vacuum.

  Next, the liquid resin 20 is heated for a time necessary to cure the liquid resin 20 using a heater (not shown) provided in the lower mold 10. The liquid resin 20 is cured to form the cured resin 21. As a result, the semiconductor chip 14 mounted on the pre-molding substrate 15 is resin-molded (resin-sealed) with the cured resin 21 molded corresponding to the shape of the cavity 16.

  Next, as shown in FIG. 2D, after the cured resin 21 is molded, the movable platen 5 is lowered using the mold clamping mechanism 6. As a result, the upper die 9 and the lower die 10 are opened. A resin molded product 22 which is a resin-molded substrate is fixed to the mold surface of the upper mold 9. Next, the resin molded product 22 is released from the upper mold 9. At this stage, resin molding (resin sealing) is completed.

(Board positioning verification mechanism)
A positioning verification mechanism that verifies the positioning of the pre-molding substrate 15 supplied to the mold 11 will be described with reference to FIG. The positioning verification mechanism includes a light emitting element and a light receiving element, and verifies the positioning of the pre-molding substrate 15 depending on whether or not the light receiving element detects irradiation light emitted from the light emitting element. In this embodiment, a case where a light emitting element is provided on the fixed platen 4 and a light receiving element is provided on the supply mechanism 13 will be described.

  As shown in FIG. 3A, a guide member 23 is provided on the mold surface (lower surface) of the upper mold 9 as a positioning member for positioning the pre-molding substrate 15 in the X direction, for example. As the guide member 23, for example, a member having a pin shape such as a guide pin is used. Similarly, a guide member 24 for positioning the pre-molding substrate 15 in the Y direction is provided on the mold surface of the upper mold 9. For example, it is preferable that at least two guide members 23 and 24 are provided along the Y direction and the X direction, respectively. In this case, a member having a pin shape was used as the guide member. A member having a rectangular parallelepiped shape extending along the X direction and the Y direction may be used as the guide member.

  The upper mold 9 or the stationary platen 4 is provided with positioning mechanisms 25 and 26 for pressing and positioning the end surface of the pre-molding substrate 15 against the guide members 23 and 24, respectively. The pre-molding substrate 15 is positioned in the X direction by the positioning mechanism 25. Similarly, the pre-molding substrate 15 is positioned in the Y direction by the positioning mechanism 26. The pre-molding substrate 15 is placed on the mold surface of the upper mold 9 by the positioning mechanisms 25 and 26. In this case, the positioning mechanisms 25 and 26 are provided on the upper mold 9 or the fixed platen 5. Not limited to this, the positioning mechanism may be provided in the supply mechanism 13.

  In the present application document, as shown in FIG. 3A, the longitudinal direction of the pre-molding substrate 15 is arranged along the X direction, and the short direction of the pre-molding substrate 15 is arranged along the Y direction. Is shown. Hereinafter, an end surface along the longitudinal direction of the pre-molding substrate 15 is referred to as an end surface along the X direction of the pre-molding substrate 15. Similarly, an end surface along the short direction of the pre-molding substrate 15 is referred to as an end surface along the Y direction of the pre-molding substrate 15.

  As shown in FIGS. 3A and 3B, for example, light emitting elements 27 and 28 are provided in the fixed platen 4 as components for verifying the positioning of the pre-molding substrate 15 in the X direction and the Y direction. Provided. For example, a light emitting diode (LED) or a laser diode (LD) is used as the light emitting elements 27 and 28. The light emitting elements 27 and 28 preferably have heat resistance. The upper die 9 is provided with first emission passage holes 29 and 30 for passing the irradiation light emitted from the light emitting elements 27 and 28, respectively. Note that “for emission” means that irradiation light is emitted from the upper mold 9 side to the external light receiving element side.

  As shown in FIG. 3A, the first emission passage holes 29 and 30 are formed so that the pre-molding substrate 15 is on the mold surface of the upper mold 9 when the pre-molding substrate 15 is in contact with the guide members 23 and 24. It is provided in each area to be arranged. More specifically, in the state where the pre-molding substrate 15 is in contact with the guide member 23, the first emission passage hole 29 corresponds to the inner region from the end surface along the Y direction of the pre-molding substrate 15. 9 is provided. Similarly, in a state where the pre-molding substrate 15 is in contact with the guide member 24, the first emission passage hole 30 is formed in the upper die 9 so as to correspond to the inner region from the end surface along the X direction of the pre-molding substrate 15. Provided.

  As shown in FIGS. 3B and 3C, the supply mechanism 13 is provided with first light receiving elements 31 and 32 for detecting irradiation light emitted from the light emitting elements 27 and 28, respectively. The first light receiving elements 31 and 32 are light receiving elements for verifying the positioning of the pre-molding substrate 15 in the X direction and the Y direction. As the first light receiving elements 31 and 32, for example, a photodiode (PD) or the like is used. In a state where the pre-molding substrate 15 is positioned on the guide members 23, 24, the first light receiving element 31 overlaps the light emitting element 27 and the first emission passage hole 29 in a plan view, and the first light receiving element 32 is the light emitting element 28. And it is provided so as to overlap the first emission passage hole 30. The diameters of the first emission passage holes 29 and 30 can be arbitrarily set according to the intensity of light received by the first light receiving elements 31 and 32. Depending on whether or not the first light receiving elements 31 and 32 detect the irradiation light emitted from the light emitting elements 27 and 28 in a state where the premolding substrate 15 is positioned on the guide members 23 and 24, the premolding substrate 15 is the upper mold. It is verified whether or not it is normally positioned on the 9 mold surface. For example, the verification accuracy with respect to the positioning of the pre-molding substrate 15 can be improved by setting the diameters of the first emission passage holes 29 and 30 to about 0.01 to 0.1 mm.

  In the state where the mold 11 is opened, the guide members 23 and 24 protrude from the mold surface of the upper mold 9. In a state where the mold 11 is clamped, the guide members 23 and 24 are configured to be pushed up on the mold surface of the lower mold 10 and accommodated in the upper mold 9. For this purpose, for example, the guide members 23 and 24 may be supported by an elastic member such as a spring. Further, the guide members 23 and 24 may not be moved and may be retracted into an opening hole (not shown) provided in the lower mold 10.

(Substrate positioning operation and positioning verification operation (resin molded product manufacturing method))
With reference to FIGS. 3 to 4, the positioning operation of the pre-molding substrate 15 supplied to the molding die 11 and the operation of verifying whether or not the pre-molding substrate 15 supplied to the molding die 11 is normally positioned. Will be described. In the present embodiment, a case where the pre-molding substrate 15 is supplied to the upper mold 9 of the mold 11 and positioned is shown. The description here also serves as an explanation of a method for producing a resin molded product.

(Board positioning operation)
With reference to FIG. 3, the operation of positioning the pre-molding substrate 15 on the mold surface of the upper mold 9 will be described. First, as shown in FIG. 3B, the supply mechanism 13 holding the pre-molding substrate 15 is moved between the upper mold 9 and the lower mold 10. Next, the supply mechanism 13 is raised, and the pre-molding substrate 15 is delivered from the supply mechanism 13 to the mold surface of the upper mold 9.

  Next, for example, using the positioning mechanisms 25 and 26 provided on the upper die 9 or the fixed platen 4, the end surfaces of the pre-molding substrate 15 are pressed against the guide members 23 and 24, respectively. First, as shown in FIG. 3A, the end surface along the Y direction of the pre-molding substrate 15 is pressed against the two guide members 23 using the positioning mechanism 25. Thus, the end surface along the Y direction of the pre-molding substrate 15 is positioned on the mold surface of the upper mold 9. Next, the end surface along the X direction of the pre-molding substrate 15 is pressed against the two guide members 24 using the positioning mechanism 26. Thus, the end surface along the X direction of the pre-molding substrate 15 is positioned on the mold surface of the upper mold 9.

  By positioning the pre-molding substrate 15 against the guide members 23 and 24 using the positioning mechanisms 25 and 26, the pre-molding substrate 15 is positioned on the mold surface of the upper mold 9. After positioning the pre-molding substrate 15, the pre-molding substrate 15 is sucked and fixed to the mold surface of the upper mold 9 by a suction mechanism (not shown). In this state, positioning of the pre-molding substrate 15 on the upper mold 9 is completed.

  In this case, the positioning mechanisms 25 and 26 provided on the upper die 9 or the fixed platen 4 were used to position the pre-molding substrate 15 in the X direction and the Y direction independently. However, the configuration is not limited to this, and the positioning mechanisms 25 and 26 can be linked. As a result, the pre-molding substrate 15 can be positioned in the X and Y directions at the same time.

(Board positioning verification operation)
The operation for verifying whether or not the pre-molding substrate 15 supplied to the upper mold 9 is properly positioned will be described with reference to FIGS. First, as shown in FIG. 4A, the substrate 15 before molding is supplied to the mold surface of the upper mold 9 by the supply mechanism 13. Next, the pre-molding substrate 15 is positioned on the mold surface of the upper mold 9 using the positioning mechanisms 25 and 26. In this state, the light emitting element 27, the first emission passage hole 29, and the first light receiving element 31 are arranged so as to overlap each other in plan view. Similarly, the light emitting element 28, the first emission passage hole 30, and the first light receiving element 32 are arranged so as to overlap in plan view.

  Next, as shown in FIG. 4B, the irradiation light 33 is emitted from the light emitting elements 27 and 28. The irradiation light 33 emitted from the light emitting elements 27 and 28 passes through the first emission passage holes 29 and 30 formed in the upper mold 9 and reaches the surface of the pre-molding substrate 15 on the substrate side.

  When the pre-molding substrate 15 is normally positioned on the guide members 23 and 24 provided on the upper die 9, for example, as shown in FIG. 4B, the end surface along the Y direction of the pre-molding substrate 15 is When in contact with the guide member 23, no gap is generated between the guide member 23 and the end surface along the Y direction of the pre-molding substrate 15. Therefore, the irradiation light 33 emitted from the light emitting element 27 is blocked by the pre-molding substrate 15. Therefore, the irradiation light 33 does not reach the first light receiving element 31 provided in the supply mechanism 13. Therefore, the first light receiving element 31 does not detect the irradiation light 33.

  Similarly, when the end surface along the X direction of the pre-molding substrate 15 is in contact with the guide member 24 (see FIG. 3A), the guide member 24 and the end surface along the X direction of the pre-molding substrate 15 are formed. There is no gap between them. Therefore, the irradiation light 33 emitted from the light emitting element 28 (see FIG. 3A) is blocked by the pre-molding substrate 15. Therefore, the irradiation light 33 does not reach the first light receiving element 32 (see FIG. 3C) provided in the supply mechanism 13. Therefore, the first light receiving element 32 does not detect the irradiation light 33.

  When both the first light receiving elements 31 and 32 do not detect the irradiation light 33, the determination unit (see FIG. 14) provided in the control unit of the resin molding apparatus molds the X direction and the Y direction. It is determined that the front substrate 15 is normally positioned. When both of the first light receiving elements 31 and 32 do not detect the irradiation light 33, it is determined that the pre-molding substrate 15 is normally positioned on the guide members 23 and 24, and the next step is resin molding. Proceed to the process.

  When the pre-molding substrate 15 is not normally positioned on the guide members 23 and 24, for example, as shown in FIG. 4C, the end surface along the Y direction of the pre-molding substrate 15 is in contact with the guide member 23. If not, a gap 34 is generated between the guide member 23 and the end surface along the Y direction of the pre-molding substrate 15. When the gap 34 is generated between the guide member 23 and the end surface along the Y direction of the pre-molding substrate 15, the irradiation light 33 emitted from the light emitting element 27 passes through the gap 34. The irradiation light 33 that has passed through the gap 34 reaches the first light receiving element 31. Thereby, the first light receiving element 31 detects the irradiation light 33. When the first light receiving element 31 detects the irradiation light 33, the determination unit (see FIG. 14) determines that the pre-molding substrate 15 is not normally positioned in the X direction. Therefore, the determination unit stops proceeding to the next process. Then, the positioning of the pre-molding substrate 15 is performed again.

  Similarly, when the end surface along the X direction of the pre-molding substrate 15 is not in contact with the guide member 24, a gap is generated between the guide member 24 and the end surface along the X direction of the pre-molding substrate 15. Irradiation light 33 emitted from the light emitting element 28 passes through this gap and reaches the first light receiving element 32. Thereby, the first light receiving element 32 detects the irradiation light 33. When the first light receiving element 32 detects the irradiation light 33, the determination unit determines that the pre-molding substrate 15 is not normally positioned in the Y direction. Also in this case, the determination unit determines that the pre-molding substrate 15 is not properly positioned, and stops proceeding to the next step. Then, the positioning of the pre-molding substrate 15 is performed again.

  In a state where the pre-molding substrate 15 is positioned on the mold surface of the upper mold 9, when either one of the first light receiving elements 31 or 32 detects the irradiation light 33, the determination unit performs either the X direction or the Y direction. Is determined not to be properly positioned. In this case, proceeding to the next process is stopped, and the pre-molding substrate 15 is positioned again. When both the first light receiving elements 31 and 32 do not detect the irradiation light 33, the determination unit determines that the pre-molding substrate 15 is normally positioned and proceeds to the next step. Therefore, the occurrence of molding defects due to the positioning of the pre-molding substrate 15 can be suppressed depending on whether the first light receiving element 31 or 32 detects the irradiation light 33.

  Regarding the positioning of the pre-molding substrate 15, ideally, when the irradiation light 33 is completely blocked by the pre-molding substrate 15, the first light receiving elements 31 and 32 do not detect the irradiation light 33. However, there are cases where part of the irradiation light 33 travels around the pre-molding substrate 15 as diffracted light and reaches the first light receiving element 31 or 32, or external noise light reaches the first light receiving element 31 or 32. Therefore, in consideration of the case where the first light receiving element 31 or 32 detects diffracted light or noise light, when detecting irradiation light exceeding a set threshold value (for example, a light intensity of a certain magnitude) The determination unit determines that the first light receiving elements 31 and 32 have detected the irradiation light 33. When the irradiation light below the threshold is detected, the determination unit determines that the first light receiving elements 31 and 32 have not detected the irradiation light 33. In this way, the determination unit determines whether or not the pre-molding substrate 15 is normally positioned on the mold surface of the upper mold 9. As an example, when the current value of the light receiving element is measured and light detection is performed by using the photocurrent generated by light irradiation, a threshold value may be set for the measured current value. This is the same in other embodiments, and the same applies to detection using other light receiving elements.

(Mechanism and operation for verifying abnormality of guide member or deformation of substrate (including manufacturing method of resin molded product))
Referring to FIGS. 5 to 6, whether or not the guide members 23 and 24 are abnormal such as wear or chipping, and whether or not the pre-molding substrate 15 is warped and deformed such as bending is generated. A mechanism and operation for verifying at least one will be described. Regarding the deformation of the substrate before molding, the warp will be mainly described here as an example. However, when the substrate is bent so that wrinkles or creases are generated, the same operation is performed using the same mechanism. Can do. The deformation of the pre-molding substrate includes a deformation in which a part of the substrate warps due to a thermal effect as a deformation that is likely to occur in a resinous substrate including at least a resin. The description here also serves as an explanation of a method for producing a resin molded product.

  As shown in FIG. 5, the mechanism for verifying the abnormality of the guide members 23 and 24 or the deformation of the pre-molding substrate 15 is such that the end surface of the pre-molding substrate 15 is in contact with the guide members 23 and 24 before molding. Corresponding to the region where the substrate 15 is disposed, the light emitting element 35 is disposed at a position opposite to the position where the light emitting elements 27, 28, the first emission passage holes 29, 30 and the first light receiving elements 31, 32 are provided. , 36, second emission passage holes 37 and 38, and second light receiving elements 39 and 40, respectively. Therefore, in a state where the pre-molding substrate 15 is positioned on the guide members 23 and 24, the second light receiving element 39 overlaps the light emitting element 35 and the second emission passage hole 37 in plan view, and the second light receiving element 40 emits light. Second light receiving elements 39 and 40 are provided in the supply mechanism 13 so as to overlap the element 36 and the second emission passage hole 38, respectively.

  With reference to FIG. 6, it is verified whether or not the guide members 23 and 24 have an abnormality such as wear or chipping, or whether or not the pre-molding substrate 15 is warped and deformed such as bending. The operation will be described.

  FIG. 6A shows that the guide members 23 and 24 are not abnormally worn or chipped, and the pre-molding substrate 15 is not warped or deformed, and the pre-molding substrate 15 is normally positioned on the mold surface of the upper mold 9. It shows the state. As shown in FIG. 6A, when the pre-molding substrate 15 is normally positioned on the mold surface of the upper mold 9, the irradiation emitted from the four light emitting elements 27, 28, 35, 36. All the light 33 is blocked by the pre-molding substrate 15. Accordingly, all of the four light receiving elements (the first light receiving elements 31 and 32 and the second light receiving elements 39 and 40) do not detect the irradiation light 33.

  When the first light receiving elements 31 and 32 do not detect the irradiation light 33, the determination unit determines that the pre-molding substrate 15 is normally in contact with the guide members 23 and 24. Since the second light receiving elements 39 and 40 do not detect the irradiation light 33, there is no abnormality such as wear or chipping in the guide members 23 and 24, and warping of the pre-molding substrate 15 causes deformation such as bending. The determination unit determines that it is not. As described above, when all of the four light receiving elements 31, 32, 39, and 40 do not detect the irradiation light 33, the determination unit has no abnormality and the pre-molding substrate 15 is placed on the mold surface of the upper mold 9. It is determined that the positioning is normally performed, and the process proceeds to the next step.

  When the first light receiving element 31 or 32 detects the irradiation light 33, the determination unit determines that the pre-molding substrate 15 is not normally in contact with the guide member 23 or 24, and stops proceeding to the next step. To do. Then, the positioning of the pre-molding substrate 15 is performed again.

  FIG. 6B shows a state where the guide members 23 and 24 are abnormal such as wear or chipping. For example, a state in which wear or chipping has occurred in the guide member arranged in the Y direction is shown.

  As shown in FIG. 6B, the end portion of the pre-molding substrate 15 is pressed against the guide member 23X in which wear or chipping occurs by the positioning mechanism 25 (see FIG. 3B). Since the guide member 23X is worn or chipped and becomes smaller than usual, the pre-molding substrate 15 is pushed out to the + X direction side from the normal position. Accordingly, the first outgoing passage hole 29 is blocked by the pre-molding substrate 15, but a part of the second outgoing passage hole 37 is not blocked by the pre-molding substrate 15. Therefore, the irradiation light 33 emitted from the light emitting element 27 is blocked by the pre-molding substrate 15, but the irradiation light 33 emitted from the light emitting element 35 passes through the pre-molding substrate 15 and reaches the second light receiving element 39. To reach. As a result, the second light receiving element 39 detects the irradiation light 33. When the second light receiving element 39 detects the irradiation light 33, the determination unit determines that there is a possibility that an abnormality such as wear or chipping has occurred in the guide member 23X. Therefore, the determination unit stops moving to the next step. And it investigates about the abnormality of a guide member.

  Similarly, when the second light receiving element 40 (see FIG. 5A) detects the irradiation light 33, there is a possibility that the determination unit has an abnormality such as wear or chipping in the guide member 24. to decide. Therefore, the determination unit stops moving to the next step. As described above, when either of the second light receiving elements 39 or 40 detects the irradiation light 33, it is determined that the guide member 23 or 24 may have an abnormality such as wear or chipping. Stop proceeding to the next step. Thereby, it is possible to suppress the occurrence of molding defects due to the abnormality of the guide member 23 or 24.

  FIG. 6C shows a state in which the warpage, which is one type of deformation, occurs in the pre-molding substrate 15. For example, a state in which the pre-molding substrate 15 is warped to the side on which the semiconductor chip 14 is mounted is shown.

  As shown in FIG. 6C, for example, the end portion of the pre-molding substrate 15 in which the warp is generated is pressed against the guide member 23 by the positioning mechanism 25 (see FIG. 3B). Since the pre-molding substrate 15 is warped, the pre-molding substrate 15 is arranged on the upper mold 9 in a state where both end portions along the Y direction of the pre-molding substrate 15 are lifted from the mold surface of the upper mold 9. Accordingly, the first outgoing passage hole 29 is blocked by the pre-molding substrate 15, but a part of the second outgoing passage hole 37 is not blocked by the pre-molding substrate 15. Therefore, the irradiation light 33 emitted from the light emitting element 27 is blocked by the pre-molding substrate 15, but the irradiation light 33 emitted from the light emitting element 35 passes through the pre-molding substrate 15 and reaches the second light receiving element 39. To reach. As a result, the second light receiving element 39 detects the irradiation light 33. When the second light receiving element 39 detects the irradiation light 33, the determination unit determines that there is a possibility that warpage has occurred in the pre-molding substrate 15. Therefore, the determination unit stops moving to the next step. Then, the state of the pre-molding substrate 15 is investigated.

  Similarly, when the second light receiving element 40 (see FIG. 5A) detects the irradiation light 33, the determination unit determines that there is a possibility that the pre-molding substrate 15 is warped. Therefore, the determination unit stops moving to the next step. As described above, when either of the second light receiving elements 39 or 40 detects the irradiation light 33, it is determined that there is a possibility that the pre-molding substrate 15 is warped, and the process proceeds to the next step. To stop. Thereby, generation | occurrence | production of the shaping | molding defect resulting from the curvature generate | occur | producing in the board | substrate 15 before shaping | molding can be suppressed.

  When either of the second light receiving elements 39 or 40 detects the irradiation light 33, the guide members 23, 24 have an abnormality such as wear or chipping, or the pre-molding substrate 15 is warped. There is a possibility. Although it is necessary to confirm the cause of these abnormalities, in any case, the determination unit determines that some abnormality may have occurred and stops proceeding to the next step. Thereby, it is possible to suppress the occurrence of molding defects due to the positioning of the pre-molding substrate 15.

  As described above, when any of the four light receiving elements (the first light receiving elements 31 and 32 and the second light receiving elements 39 and 40) provided in the supply mechanism 13 detects the irradiation light 33, before forming. It can be determined that an abnormality has occurred regarding the positioning of the substrate 15. When the first light receiving element 31 or 32 detects the irradiation light 33, it is determined that the pre-molding substrate 15 is not normally in contact with the guide member 23 or 24. When the second light receiving element 39 or 40 detects the irradiation light 33, an abnormality such as wear or chipping has occurred in the guide member 23 or 24, or the pre-molding substrate 15 is warped and deformed such as bending. Judge that it may have occurred. Here, when the second light receiving element 39 or 40 detects the irradiation light 33, the guide member 23 or 24 has an abnormality such as wear or chipping, or warps the pre-molding substrate 15 and deforms such as bending. Therefore, it is determined that there is a possibility that both of the abnormality of the guide member 23 or 24 and the deformation of the pre-molding substrate 15 may occur. In these cases, proceeding to the next step is stopped.

  When all of the four light receiving elements 31, 32, 39, and 40 do not detect the irradiation light 33, the guide members 23 and 24 are abnormally worn or chipped, warped on the substrate 15 before molding, bent, etc. It is determined that there is no deformation and the pre-molding substrate 15 is normally positioned on the mold surface of the upper mold 9. In this case, the process proceeds to the next step. Therefore, it is possible to perform resin molding in a state in which it is verified that the pre-molding substrate 15 is normally positioned, and it is possible to suppress the occurrence of molding defects due to positioning.

  The diameters of the four exit passage holes (the first exit passage holes 29 and 30 and the second exit passage holes 37 and 38) provided in the upper die 9 are four light receiving elements (the first light receiving elements 31 and 30). 32 and the second light receiving elements 39, 40) can be arbitrarily set according to the intensity of light received by the light receiving elements. When the diameters of these exit passage holes are small, the exit passage holes may be blocked by a resin material or foreign matter. Therefore, it is preferable to periodically verify whether or not abnormality such as resin clogging has occurred in the four exit passage holes. For example, the irradiation light 33 is emitted from each of the four light emitting elements 27, 28, 35, and 36 without supplying the pre-molding substrate 15 to the upper mold 9. When each of the four light receiving elements 31, 32, 39, 40 detects the irradiation light 33, abnormality such as resin clogging occurs in any of the four emission passage holes 29, 30, 37, 38. It can be determined that they have not. If any of the four light receiving elements 31, 32, 39, 40 does not detect the irradiation light 33, an abnormality occurs in the emission passage hole corresponding to the light receiving element that does not detect the irradiation light 33. Can be determined. In this way, it is possible to verify the abnormality of the four emission passage holes 29, 30, 37, 38 provided in the upper mold 9.

  Another implementation of a mechanism for verifying whether or not the guide members 23 and 24 are abnormal such as wear and chipping, or whether or not deformation such as warping and bending occurs on the pre-molding substrate 15 is performed. The present invention can also be applied in the form.

(Function and effect)
In the present embodiment, the resin molding apparatus includes a molding die 11 having an upper die 9 that is a first die and a lower die 10 that is a second die, and any one of the upper die 9 and the lower die 10. A supply mechanism 13 that supplies a pre-molding substrate 15 that is a resin molding target to the mold surface of the upper mold 9 or the lower mold 10 that is one of the molds, and positioning the pre-molding substrate 15 on the guide members 23 and 24 on the mold surface. Positioning mechanisms 25 and 26, a mold clamping mechanism 6 for clamping the mold 11, light emitting elements 27 and 28 for emitting irradiation light 33, and a first light receiving element that is provided in the supply mechanism 13 and can receive the irradiation light 33. 31 and 32 and a determination unit for determining the positioning of the pre-molding substrate 15, and the upper die 9 is provided with first emission passage holes 29 and 30 through which the irradiation light 33 from the light emitting elements 27 and 28 passes. , The judgment part is the first emission passage holes 29, 3 Based on the detection by the first light receiving elements 31 and 32 with respect to the irradiation light 33 that has passed through the, pre-molding substrate 15 is configured to determine whether or not it is correctly positioned in the guide members 23 and 24.

  The method for producing a resin molded product according to the present embodiment is an upper mold that is one of a mold 11 having an upper mold 9 that is a first mold and a lower mold 10 that is a second mold that are arranged to face each other. A supply step of supplying the pre-molding substrate 15 as a resin molding target to the mold surface of the mold 9 or the lower mold 10 by the supply mechanism 13, and a positioning step of positioning the pre-molding substrate 15 on the guide members 23, 24 on the mold surface; The irradiation process of emitting the irradiation light 33 that passes through the first emission passage holes 29 and 30 provided in the upper die 9 from the light emitting elements 27 and 28, and the first light receiving elements 31 and 32 provided in the supply mechanism 13 Whether or not the pre-molding substrate 15 is normally positioned on the guide members 23 and 24 based on the detection step for detecting the irradiation light 33 that has passed through the first emission passage holes 29 and 30 and the detection in the detection step. Judgment process to judge , At decision step, if it is determined that the pre-molding substrate 15 is positioned correctly and a resin molding step mold 11 by clamping a resin mold.

  According to this configuration, it is possible to perform resin molding in a state in which it is verified that the pre-molding substrate 15 that is the resin molding object supplied to the molding die 11 is normally positioned on the guide members 23 and 24. Generation | occurrence | production of the molding defect resulting from can be suppressed. Therefore, if it is determined that the pre-molding substrate 15 is properly positioned, resin molding is performed. If it is determined that the pre-molding substrate 15 is not properly positioned, the resin molding is stopped.

  More specifically, according to the present embodiment, it is verified whether or not the pre-molding substrate 15 that is a resin molding target is normally positioned on the guide members 23 and 24 provided on the upper mold 9 of the mold. Therefore, light emitting elements 27 and 28 and first light receiving elements 31 and 32 are provided. The pre-molding substrate 15 is positioned on the upper mold 9 by contacting the guide members 23 and 24. When the pre-molding substrate 15 is normally positioned on the guide members 23, 24, no gap is generated between the end surface of the pre-molding substrate 15 and the guide members 23, 24. As a result, the pre-molding substrate 15 blocks the irradiation light 33 emitted from the light emitting elements 27 and 28. Therefore, the first light receiving elements 31 and 32 do not detect the irradiation light 33. When both the first light receiving elements 31 and 32 do not detect the irradiation light 33, the determination unit determines that the pre-molding substrate 15 is normally positioned on the guide members 23 and 24. If it is determined that the pre-molding substrate 15 is properly positioned, resin molding is performed.

  When the pre-molding substrate 15 is not normally positioned on the guide member 23 or 24, a gap is generated between the end surface of the pre-molding substrate 15 and the guide member 23 or 24. When the gap is generated, the irradiation light 33 emitted from the light emitting elements 27 and 28 passes through the gap and reaches the first light receiving element 31 or 32. When either the first light receiving element 31 or 32 detects the irradiation light 33, the determination unit determines that the pre-molding substrate 15 is not normally positioned on the guide member 23 or 24. If it is determined that the pre-molding substrate 15 is not properly positioned, the resin molding is stopped. Therefore, generation | occurrence | production of the molding defect resulting from positioning of the board | substrate 15 before a shaping | molding can be suppressed.

  Furthermore, according to the present embodiment, in order to verify abnormality of the guide members 23 and 24 or deformation of the pre-molding substrate 15, the light emitting elements 35 and 36, the second emission passage holes 37 and 38, and the second light receiving element 39. , 40 are provided. When either of the second light receiving elements 39 or 40 detects the irradiation light 33, the guide members 23, 24 have abnormalities such as wear and chipping, or warped, bent, etc. It is determined that there is a possibility that the deformation has occurred. In these cases, the process proceeds to the next step, and the abnormality of the guide members 23 and 24 or the deformation of the pre-molding substrate 15 is investigated. Thereby, it is possible to suppress the occurrence of molding defects due to the abnormality of the guide members 23 and 24 or the deformation of the pre-molding substrate 15.

  Furthermore, according to the present embodiment, irradiation light 33 is emitted from each of the four light emitting elements 27, 28, 35, 36 in a state where the pre-molding substrate 15 is not supplied to the upper mold 9. When each of the four light receiving elements 31, 32, 39, 40 detects the irradiation light 33, an abnormality such as resin clogging occurs in any of the four emission passage holes 29, 30, 37, 38. Judge that it is not. If any of the light receiving elements 31, 32, 39, 40 does not detect the irradiation light 33, an abnormality has occurred in the emission passage hole corresponding to the light receiving element that did not detect the irradiation light 33. to decide. In this case, the emission passage hole corresponding to the light receiving element in which the irradiation light 33 is not detected is checked and cleaned. As a result, it is possible to suppress the occurrence of molding defects due to the abnormality of the emission passage holes 29, 30, 37, and 38.

  As described above, according to the present embodiment, when the pre-molding substrate 15 that is a resin molding target is not normally in contact with the guide members 23 and 24, the guide members 23 and 24 have abnormalities such as wear and chipping. If it occurs, warping of the pre-molding substrate 15 causes deformation such as bending, and resin clogging or the like occurs in the first emission passage holes 29, 30 and the second emission transmission holes 37, 38. If an abnormality caused by positioning has occurred, such as if the By these things, generation | occurrence | production of the molding defect resulting from positioning can be suppressed. Therefore, the resin molding can be performed in a state in which it is verified that the pre-molding substrate 15 is properly positioned.

  In this embodiment, positioning mechanisms 25 and 26 provided on the upper die 9 or the fixed platen 4 are used as means for positioning the pre-molding substrate 15. However, the supply mechanism 13 may be provided with a positioning mechanism. After the supply mechanism 13 delivers the pre-molding substrate 15 to the mold surface of the upper mold 9, the pre-molding substrate 15 is pressed against the guide members 23 and 24 using the positioning mechanism provided in the supply mechanism 13. As a result, the pre-molding substrate 15 can be positioned on the mold surface of the upper mold 9. By providing the supply mechanism 13 with a positioning mechanism, the configuration of the resin molding apparatus can be further simplified.

  Furthermore, the supply mechanism 13 itself can be used as a positioning mechanism. When the supply mechanism 13 itself is used as a positioning mechanism, the pre-molding substrate 15 is transferred to the mold surface of the upper mold 9 and the pre-molding substrate 15 is moved in the X direction and the Y direction using the supply mechanism 13. Thus, the end face of the pre-molding substrate 15 is pressed against the guide members 23 and 24, respectively. As a result, the pre-molding substrate 15 can be positioned on the mold surface of the upper mold 9. By using the supply mechanism 13 itself as a positioning mechanism, the configuration of the resin molding apparatus can be further simplified.

[Embodiment 2]
With reference to FIG. 7, a mechanism for verifying whether or not the pre-molding substrate 15 supplied to the upper mold 9 is normally positioned in the second embodiment will be described. The difference from the first embodiment is that the light emitting element 27 is provided outside the fixed platen 4, and an optical member that reflects the irradiation light 33 is provided in the light guide portion provided on the fixed platen 4. Since other configurations and operations are the same as those in the first embodiment, the description thereof is omitted. In the following embodiment, a case will be described in which the guide members 23 and 24 have no abnormality such as wear and chipping, and the pre-molding substrate 15 is not warped and is not deformed such as bending.

  As shown in FIGS. 7A and 7B, the stationary platen 4 is connected to the first emission passage hole 29 and extends along the X direction, and the first emission passage hole 30. Each of the light guide portions 42 extending along the connection Y direction is provided. The light emitting element 27 is disposed on the extension of the light guide portion 41 extending along the X direction. Similarly, the light emitting element 28 is disposed on the extension of the light guide portion 42 extending along the Y direction.

  As shown in FIG. 7B, the light guide 41 is provided with a reflecting mirror 43 that changes the traveling direction of the irradiation light 33 emitted from the light emitting element 27 in the −X direction by 90 degrees. The irradiation light 33 whose traveling direction is changed to the −Z direction by the reflecting mirror 43 passes through the first emission passage hole 29 and reaches the pre-molding substrate 15. Similarly, a reflecting mirror 44 that changes the traveling direction of the irradiation light 33 emitted from the light emitting element 30 in the −Y direction by 90 degrees is provided in the light guide unit 42. The irradiation light 33 whose traveling direction is changed to the −Z direction by the reflecting mirror 44 passes through the first emission passage hole 30 and reaches the pre-molding substrate 15.

  As shown in FIG. 7C, the arrangement of the first light receiving elements 31 and 32 provided in the supply mechanism 13 is the same as that in the first embodiment. The operation for verifying the positioning of the pre-molding substrate 15 is the same as in the first embodiment. Therefore, the same effects as in the first embodiment can be obtained in this embodiment.

[Embodiment 3]
With reference to FIG. 8, a mechanism and operation for verifying whether or not the pre-molding substrate 15 supplied to the upper mold is normally positioned in the third embodiment will be described. The difference from Embodiment 1 is that the light emitting elements 27 and 28 are provided in the supply mechanism, and that two reflecting mirrors are provided as optical members in the light guide portion provided in the fixed platen. With this change, the configurations of the upper mold, the lower mold, and the fixed platen are different from those in the first and second embodiments.

(Board positioning verification mechanism)
A mechanism for verifying whether or not the pre-molding substrate 15 supplied to the upper mold is normally positioned will be described with reference to FIG. As shown in FIGS. 8B and 8C, the light emitting element 27 and the first light receiving element 31, which are components for verifying the positioning of the pre-molding substrate 15 in the X direction, are provided in the supply mechanism 45. Similarly, the light-emitting element 28 and the first light-receiving element 32 which are components for verifying the positioning of the pre-molding substrate 15 in the Y direction are provided in the supply mechanism 45.

  As shown in FIGS. 8A, 8 </ b> B, and 8 </ b> C, the incident through holes 46 and 47 for allowing the irradiation light 33 emitted from the light emitting elements 27 and 28 provided in the supply mechanism 45 to pass through. Are provided on the upper die 48, respectively. In plan view, the light emitting element 27 and the incident passage hole 46 are arranged so as to overlap each other. Similarly, the light emitting element 28 and the incident passage hole 47 are arranged so as to overlap in plan view. Note that “for incident” means that the irradiation light 33 is incident on the light guide portions 50 and 51 (described later) on the upper mold 48 side from the external light emitting elements 27 and 28.

  The fixed platen 49 is provided with a light guide 50 connected to the first exit passage hole 29 and the entrance passage hole 46 along the X direction. Similarly, a light guide portion 51 connected to the first emission passage hole 30 and the incidence passage hole 47 is provided along the Y direction. The light guide 50 is provided with reflecting mirrors 43a and 43b that change the traveling direction of the irradiation light 33 by 90 degrees as optical members. Similarly, the light guide 51 is provided with reflecting mirrors 44a and 44b that change the traveling direction of the irradiation light 33 by 90 degrees as optical members.

(Substrate positioning verification operation (method for manufacturing resin molded products))
With reference to FIG. 8, the operation for verifying whether or not the pre-molding substrate 15 supplied to the upper mold is normally positioned will be described. The description here also serves as an explanation of a method for producing a resin molded product.

  As shown in FIG. 8B, the irradiation light 33 emitted from the light emitting element 27 in the + Z direction passes through the incident passage hole 46 and enters the reflecting mirror 43a. The irradiation light 33 incident on the reflecting mirror 43a is changed in the traveling direction by 90 degrees by the reflecting mirror 43a, travels in the light guide section 50 in the -X direction, and enters the reflecting mirror 43b. The irradiation light 33 incident on the reflecting mirror 43b is changed in the traveling direction by 90 degrees by the reflecting mirror 43b, travels in the −Z direction, and passes through the first emission passage hole 29. The irradiation light 33 that has passed through the first emission passage hole 29 reaches the pre-molding substrate 15.

  Whether the first light receiving element 31 provided in the supply mechanism 45 detects the irradiation light 33 emitted from the light emitting element 27 and sequentially passing through the incident passage hole 46, the light guide portion 50, and the first emission passage hole 29. Accordingly, it is determined whether or not the pre-molding substrate 15 is normally positioned in the X direction. Similarly, depending on whether or not the second light receiving element 32 detects the irradiation light 33 emitted from the light emitting element 28 and sequentially passing through the incident passage hole 47, the light guide portion 51, and the first emission passage hole 30. It is determined whether or not the front substrate 15 is normally positioned in the Y direction. In this way, the positioning of the pre-molding substrate 15 can be verified. In this case, since the light emitting elements 27 and 28 and the first light receiving elements 31 and 32 are all provided in the supply mechanism 45, it is easy to wire their signal lines to the control unit and the determination unit of the resin molding apparatus. Since the effects similar to those of the first embodiment are obtained, the description thereof is omitted.

[Embodiment 4]
With reference to FIG. 9, a mechanism for verifying whether or not the pre-molding substrate 15 supplied to the upper mold 48 is normally positioned in the fourth embodiment will be described. The difference from the third embodiment is that an optical fiber is used as an optical member instead of a reflecting mirror. Since other configurations and operations are the same as those of the third embodiment, the description thereof is omitted.

  As shown in FIGS. 9A and 9B, the light guides 50 and 51 provided on the fixed platen 49 are provided with optical fibers 52 and 53, respectively. The optical fibers 52 and 53 are preferably optical fibers having heat resistance. The optical fibers 52 and 53 have a double structure of a core at the center and a clad surrounding the core. In order to maintain heat resistance, it is preferable to use an optical fiber in which the core and the clad are made of quartz glass and the periphery thereof is covered with heat-resistant polyimide.

  A single optical fiber having a single optical fiber or a bundle of optical fibers coated with a plurality of single optical fibers is used corresponding to the diameters of the first emission passage holes 29 and 30 and the incident passage holes 46 and 47. can do. Furthermore, optical fiber lenses can be incorporated at both ends of the optical fiber. As the lens, a collimator lens, a condensing lens, an aspherical lens, or the like is appropriately used. In FIG. 9, the case where the lens 54 for optical fibers is each provided in the side which receives the irradiation light 33 emitted from the light emitting elements 27 and 28 is shown. The optical fibers 52 and 53 are characterized by low transmission loss and high wiring flexibility. As the optical fiber, a heat-resistant optical fiber is preferably used, and for example, a quartz optical fiber coated with a polyimide resin can be used.

  Since the operation for verifying the positioning of the pre-molding substrate 15 is the same as in the first embodiment, the description will not be repeated. In the present embodiment, the same effects as in the first embodiment are obtained.

[Embodiment 5]
With reference to FIG. 10, a mechanism for verifying whether or not the pre-molding substrate 15 supplied to the upper mold 48 is normally positioned in the fifth embodiment will be described. The difference from the fourth embodiment is that the optical fiber is provided in the light guide provided in the upper mold 48. Since other configurations and operations are the same as those of the fourth embodiment, description thereof is omitted.

  As shown in FIGS. 10A and 10B, the optical fibers 52 and 53 shown in the fourth embodiment are provided in the light guide portions 55 and 56 provided in the upper die 48, respectively. The optical fibers 52 and 53 are optical fibers having heat resistance.

  The operation of verifying the positioning of the pre-molding substrate 15 is the same as that of the first embodiment. In the present embodiment, the same effects as in the first embodiment are obtained.

[Embodiment 6]
Referring to FIG. 11, in the sixth embodiment, whether or not the pre-molding substrate 15 supplied to the upper mold 9 is normally positioned on the guide members 23 and 24, whether the guide members 23 and 24 are worn, chipped, etc. A mechanism for simultaneously verifying whether or not an abnormality has occurred or whether or not deformation such as bending has occurred due to warpage of the pre-molding substrate 15 will be described. The difference from the embodiment described so far is that the positions where the first emission passage holes 29 and 30 are provided are different.

  As shown in FIG. 11A, in the state where the pre-molding substrate 15 is in contact with the guide members 23 and 24, for example, the diagonal corners in the region where the pre-molding substrate 15 is disposed on the mold surface of the upper mold 9 The first emission passage holes 29 and 30 are provided in the part (in the upper right and lower left in FIG. 11), respectively. In a state in which the first emission passage holes 29 and 30 are provided at this position, the light emitting element 27 and the first light receiving element 31 overlap the first emission passage hole 29 in plan view, and the light emitting element 28 and the first light receiving element are overlapped. The element 32 is provided so as to overlap the first emission passage hole 30.

  If both the first light receiving elements 31 and 32 do not detect the irradiation light 33 emitted from the light emitting elements 27 and 28, the positioning failure of the pre-molding substrate 15, the abnormalities of the guide members 23 and 24, and It can be determined that deformation of the pre-molding substrate 15 has not occurred. When either the first light receiving element 31 or 32 detects the irradiation light 33, any of the positioning failure of the pre-molding substrate 15, the abnormality of the guide members 23 and 24, or the deformation of the pre-molding substrate 15 occurs. Thus, it can be determined that normal positioning is not performed.

  By adopting such a configuration, it is possible to simultaneously verify the positioning failure of the pre-molding substrate 15, the abnormalities of the guide members 23 and 24, and the deformation of the pre-molding substrate 15 without increasing the number of light emitting elements and light receiving elements. Can do. Therefore, the cost of the positioning mechanism can be suppressed in the resin molding apparatus.

[Embodiment 7]
With reference to FIG. 12, a mechanism for verifying whether or not the pre-molding substrate 15 supplied to the upper mold 9 is normally positioned in the seventh embodiment will be described. The difference from the first embodiment is that two light emitting elements and two light receiving elements are provided at the end portions along the Y direction and the X direction of the pre-molding substrate 15 to verify the positioning of the pre-molding substrate 15. That is. This makes it possible to verify whether or not the pre-molding substrate 15 is properly positioned including not only the X direction and the Y direction but also the θ direction. Since the other configuration is the same as that of the first embodiment, the description thereof is omitted.

(Board positioning verification mechanism)
With reference to FIG. 12, a mechanism for verifying the positioning of the pre-molding substrate 15 supplied to the upper mold 9 in the seventh embodiment will be described. As shown in FIG. 12A, as in the first embodiment, on the mold surface of the upper mold 9, a guide member 23 for positioning the pre-molding substrate 15 in the X direction, and the pre-molding substrate 15 in the Y direction. Guide members 24 for positioning are provided respectively.

  As shown in FIGS. 12A and 12B, two light emitting elements 27 a and 27 b are provided inside the fixed platen 4 in order to verify the positioning of the pre-molding substrate 15 in the X direction. Similarly, in order to verify the positioning of the pre-molding substrate 15 in the Y direction, two light emitting elements 28 a and 28 b are provided inside the fixed platen 4.

  The upper mold 9 is provided with first emission passage holes 29a and 29b for passing the irradiation light emitted from the light emitting elements 27a and 27b, respectively. As shown in FIG. 12A, the first emission passage holes 29 a and 29 b are arranged such that the pre-molding substrate 15 is disposed on the mold surface of the upper mold 9 in a state where the pre-molding substrate 15 is in contact with the guide member 23. Provided in each area. The first emission passage holes 30 a and 30 b are respectively provided in regions where the pre-molding substrate 15 is disposed on the mold surface of the upper mold 9 in a state where the pre-molding substrate 15 is in contact with the guide member 24.

  As shown in FIG. 12C, the supply mechanism 13 is provided with first light receiving elements 31a and 31b for detecting the irradiation light 33 emitted from the light emitting elements 27a and 27b, respectively. The first light receiving elements 31a and 31b are light receiving elements for verifying the positioning of the pre-molding substrate 15 in the X direction. Similarly, the supply mechanism 13 is provided with first light receiving elements 32a and 32b for detecting the irradiation light 33 emitted from the light emitting elements 28a and 28b, respectively. The first light receiving elements 32a and 32b are light receiving elements that verify the positioning of the pre-molding substrate 15 in the Y direction.

  Since the two first light receiving elements 31a and 31b are provided along the Y direction and the two first light receiving elements 32a and 32b are provided along the X direction, not only the X direction and the Y direction but also the θ direction are included. Whether the pre-molding substrate 15 is normally positioned can be verified. Thereby, the positioning of the pre-molding substrate 15 can be verified with higher accuracy.

  In the present embodiment, two first light receiving elements 31a and 31b are provided along the Y direction, and two first light receiving elements 32a and 32b are provided along the X direction. However, the present invention is not limited thereto, and two first light receiving elements along the Y direction and one first light receiving element along the X direction may be provided. Alternatively, two first light receiving elements along the X direction and one first light receiving element along the Y direction may be provided. Also in these cases, it is possible to verify whether or not the pre-molding substrate 15 is normally positioned including not only the X direction and the Y direction but also the θ direction.

  Since the positioning verification operation of the pre-molding substrate 15 in the present embodiment is basically the same as that in the first embodiment, description thereof will not be repeated. As for the effects, the same effects as those of the first embodiment are obtained. Further, the mechanism for verifying the abnormality of the guide member or the deformation of the pre-molding substrate 15 can be verified in the same manner as in the first embodiment.

[Embodiment 8]
With reference to FIG. 13, a mechanism for verifying the positioning of the pre-molding substrate 15 supplied to the upper mold 9 in the eighth embodiment will be described. The difference from Embodiment 7 is that one light emitting element and two first light receiving elements are provided in order to verify the positioning in the X direction and the Y direction. The two first light receiving elements receive the irradiation light 33 emitted from the light emitting element via the optical fiber provided in the light guide portion in the fixed platen 4. Since other configurations and operations are the same as those in the seventh embodiment, the description thereof is omitted.

  As shown in FIGS. 13A and 13B, in order to verify the positioning of the pre-molding substrate 15 in the X direction, a light guide 57 having a T-shape is provided inside the fixed platen 4. . The T-shaped light guide 57 is provided with an optical fiber 58, a branching member 59 for branching light traveling in the optical fiber 58, and branched optical fibers 58a and 58b. Irradiation light 33 emitted from the light emitting element 27 sequentially passes through the optical fibers 58a and 58b and the first emission passage holes 29a and 29b via the optical fiber 58 and the branching member 59, respectively, by the first light receiving elements 31a and 31b. Detected.

  Similarly, in order to verify the positioning of the pre-molding substrate 15 in the Y direction, a light guide portion 60 having a T-shape is provided inside the fixed platen 4. The T-shaped light guide 60 is provided with an optical fiber 61, a branching member 62 that branches light traveling in the optical fiber 61, and branched optical fibers 61 a and 61 b. Irradiation light 33 emitted from the light emitting element 28 sequentially passes through the optical fibers 61a and 61b and the first emission passage holes 30a and 30b via the optical fiber 61 and the branching member 62, and then passes through the first light receiving elements 32a and 32b. Detected.

  By adopting such a configuration, it is possible to reduce the number of light emitting elements and verify whether or not the pre-molding substrate 15 is properly positioned including not only the X direction and the Y direction but also the θ direction. it can. Therefore, the positioning of the pre-molding substrate 15 can be verified with higher accuracy, and the cost of the positioning mechanism can be suppressed.

  Here, the irradiation light 33 emitted from the common light emitting element 28 is branched into the two first exit passage holes 30a and 30b, but the first exit passage hole and the second exit passage hole It can also be branched to.

  In this embodiment, in order to branch the irradiation light 33 emitted from the light emitting element, an optical fiber and a branch member are used. However, the present invention is not limited to this, and there is no particular limitation as long as an optical member that branches the irradiation light emitted from the light emitting element is employed.

[Embodiment 9]
(Configuration of resin molding equipment)
The structure of the resin molding apparatus according to the present invention will be described with reference to FIG. The resin molding apparatus shown in FIG. 14 is, for example, a resin molding apparatus that uses a compression molding method. As shown in the first embodiment, an example in which a pre-molding substrate 15 is used as a resin molding target and a liquid resin is used as a resin material will be described.

  The resin molding apparatus 63 includes a substrate supply / storage module 64, three molding modules 65A, 65B, and 65C, and a resin supply module 66 as components. The substrate supply / storage module 64, the molding modules 65A, 65B, 65C, and the resin supply module 66, which are constituent elements, can be attached to and detached from each other and exchanged with each other. be able to.

  The substrate supply / storage module 64 includes a pre-molding substrate supply unit 67 that supplies the pre-molding substrate 15, a molded substrate storage unit 68 that stores the resin molded product 22 that is a molded substrate, and the pre-molding substrate 15 and the resin. A substrate platform 69 for delivering the molded product 22 and a supply mechanism 13 for supplying the pre-molding substrate 15 to the molding die 11 are provided. In this case, for example, the supply mechanism 13 (see FIGS. 3B and 3C) shown in the first embodiment is provided. The supply mechanism 13 is provided with first light receiving elements 31 and 32 for verifying the positioning of the pre-molding substrate 15. In this embodiment, the positioning verification mechanism described in the first embodiment is shown, but the positioning verification mechanism described in other embodiments may be adopted.

  Each molding module 65A, 65B, 65C is provided with the resin molding unit 1 shown in FIG. The resin molding unit 1 is provided with a lower mold 10 that can be raised and lowered, and an upper mold 9 (see FIGS. 3A and 3B) that is disposed to face the lower mold 10. The upper mold 9 and the lower mold 10 together constitute a mold 11 (see FIG. 2). Each of the molding modules 65A, 65B, and 65C has a mold clamping mechanism 6 that molds and opens the upper mold 9 and the lower mold 10 (part indicated by a two-dot chain line in the drawing). The lower mold 10 is provided with a cavity 16 that is a space in which the liquid resin 20 (see FIG. 2B) is supplied and cured. The lower mold 10 is provided with a release film supply mechanism 70 for supplying a long release film (see FIG. 2A). Here, the configuration in which the cavity 16 is provided in the lower mold 10 will be described. However, the cavity may be provided in the upper mold, or may be provided in both the upper mold and the lower mold.

  The resin supply module 66 is provided with a dispenser 18 that supplies the liquid resin 20 to the mold 11 and a moving mechanism 19 that moves the dispenser 18. The dispenser 18 includes a resin discharge unit that discharges liquid resin at the tip.

  The resin supply module 66 is provided with a control unit 72 having a determination unit 71. The determination unit 71 determines whether or not the pre-molding substrate 15 is normally positioned on the molding die 11 based on whether or not the first light receiving elements 31 and 32 provided in the supply mechanism 13 detect the irradiation light 33. To do. Further, the determination unit 71 also determines whether or not an abnormality has occurred in the guide member, or whether or not deformation has occurred in the pre-molding substrate 15. The control unit 72 controls the transport of the pre-molding substrate 15 and the resin molded product 22, the positioning of the pre-molding substrate 15, the supply of the liquid resin 20, the heating of the molding die 11, and the opening / closing of the molding die 11. In other words, the control unit 72 controls each operation in the substrate supply / storage module 64, the molding modules 65A, 65B, 65C, and the resin supply module 66.

  The control unit 72 may be disposed at any position, and may be disposed in at least one of the substrate supply / storage module 64, the molding modules 65A, 65B, 65C, and the resin supply module 66, or outside the modules. It can also be arranged. Moreover, the control part 72 can also be comprised as a some control part which isolate | separated at least one part according to the operation | movement used as control object. The determination unit 71 can also be provided corresponding to the configuration of the control unit.

  Since the outline of the operation of the resin molding apparatus 63 is described in the method of manufacturing a resin molded product shown in FIG. 2, it will not be repeated here.

  In the present embodiment, three molding modules 65A, 65B, and 65C are mounted side by side in the X direction between the substrate supply / storage module 64 and the resin supply module 66. The substrate supply / storage module 64 and the resin supply module 66 may be combined into one module, and one molding module 65 </ b> A may be mounted side by side in the X direction. Further, another molding module 65B may be attached to the molding module 65A. By these things, it can increase / decrease molding module 65A, 65B, ... according to a production form or a production amount. Therefore, the configuration of the resin molding apparatus 63 can be optimized, and thus productivity can be improved.

  In each embodiment, the pre-molding substrate 15 is supplied to the upper mold of the molding die, and the pre-molding substrate 15 supplied to the upper mold is normally detected by detecting the irradiation light 33 by the light receiving element provided in the supply mechanism. It was verified whether it was positioned. The present invention is not limited to this, and the present invention can also be applied to the case where the pre-molding substrate 15 is supplied to the lower mold of the molding die and positioned on the mold surface of the lower mold. Even in this case, the same effects as those shown in the embodiments can be obtained.

  In each embodiment, the case where it is verified whether or not the pre-molding substrate 15 supplied to the upper mold is properly positioned in the mold of the resin molding apparatus using the compression molding method is shown. However, the present invention is not limited to this, and the present invention can also be applied to a mold of a resin molding apparatus using a transfer molding method.

In each embodiment, the example which used the board | substrate 15 before a shaping | molding with which the semiconductor chip 14 was mounted | worn as a resin molding target was shown. As the pre-molding substrate, a general substrate such as a glass epoxy substrate, a ceramic substrate, a resin substrate, a metal substrate, a lead frame, or the like can be used. Furthermore, it can also be set as the structure mounted | worn with the plate jig | tool as described in patent document 1 as a resin molding target object.

  In each embodiment, the resin molding apparatus used when resin-molding a semiconductor chip and the manufacturing method of a resin molded product were demonstrated. The target of resin molding may be a semiconductor chip such as an IC or a transistor, a non-semiconductor chip that does not use a semiconductor, or a chip group in which semiconductor chips and non-semiconductor chips are mixed. The present invention can be applied when one or a plurality of chips mounted on a substrate such as a glass epoxy substrate, a ceramic substrate, or a lead frame is molded with a cured resin.

  As described above, in the resin molding apparatus according to the above-described embodiment, the mold surface of the mold having one of the first mold and the second mold, and the mold surface of one of the first mold and the second mold, which are arranged to face each other. A supply mechanism for supplying a resin molding object to the mold, a positioning mechanism for positioning the resin molding object on the guide surface on the guide member, a mold clamping mechanism for clamping the mold, a light emitting element for emitting irradiation light, and a supply mechanism Provided with a first light receiving element capable of receiving the irradiation light and a determination unit for determining the positioning of the resin molding target, and one of the molds has a first emission passage hole through which the irradiation light from the light emitting element passes. The determination unit determines whether the resin molding object is normally positioned on the guide member based on detection by the first light receiving element with respect to the irradiation light that has passed through the first emission passage hole. It is said.

  According to this configuration, it is possible to perform resin molding in a state where it is verified that the resin molding object is normally positioned on the guide member. Therefore, it is possible to suppress the occurrence of molding defects due to positioning.

  Furthermore, in the resin molding apparatus of the above embodiment, the determination unit determines that the resin molding object is normally positioned on the guide member when the first light receiving element does not detect the irradiation light, and the first light receiving element is When the irradiation light is detected, it is determined that the resin molding object is not normally positioned on the guide member.

  According to this configuration, whether or not the resin molding object is normally positioned on the guide member is determined based on whether or not the first light receiving element detects the irradiation light. Therefore, it is possible to suppress the occurrence of molding defects due to positioning.

  Furthermore, in the resin molding apparatus of the said embodiment, it is set as the structure by which the 1st output passage hole is provided in the area | region where the resin molding target object by the side of a guide member is arrange | positioned in the state which the resin molding target object contacted the guide member. .

  According to this configuration, whether or not the resin molding object is normally positioned on the guide member is determined based on whether or not the first light receiving element detects the irradiation light that has passed through the first emission passage hole. Therefore, it is possible to suppress the occurrence of molding defects due to positioning.

  Furthermore, in the resin molding apparatus of the above embodiment, a light guide unit is provided for guiding the irradiation light emitted from the light emitting element to the first emission passage hole on one plate or the platen to which the one plate is attached, An optical member that allows irradiation light to pass therethrough is provided in the light guide section.

  According to this configuration, by providing the optical member in the light guide portion, it is possible to guide the irradiation light emitted from the light emitting element to the first passage hole.

  Furthermore, in the resin molding apparatus according to the above embodiment, the optical member includes any one of an optical fiber, a reflecting mirror, and a prism.

  According to this configuration, the irradiation light can be guided to the first emission passage hole by using any one of the optical fiber, the reflecting mirror, and the prism.

  Furthermore, in the resin molding apparatus according to the above-described embodiment, the light emitting element is provided in the supply mechanism, and one mold is provided with an incident through hole that allows the irradiation light emitted from the light emitting element to pass therethrough and guide the light to the light guide unit. It is said.

  According to this structure, the irradiation light emitted from the light emitting element provided in the supply mechanism can be guided to the first emission passage hole via the incidence passage hole and the optical member.

  Further, in the resin molding apparatus of the above embodiment, the light emitting element or another light emitting element emits the resin molding object on the side opposite to the guide member in a state where the resin molding object is in contact with the guide member. The second emission passage hole through which the irradiated light passes is provided, and the second light receiving element capable of receiving the irradiated light is provided in the supply mechanism.

  According to this configuration, the second light receiving element is deformed into an abnormality of the guide member and a resin molding object depending on whether or not the irradiation light that has passed through the second emission passage hole provided on the opposite side of the guide member is detected. Whether at least one of the above has occurred can be determined. Therefore, it is possible to suppress the occurrence of molding defects due to positioning.

  In the method of manufacturing a resin molded product according to the above-described embodiment, the resin molding object is supplied to the mold surface of one of the molds having the first mold and the second mold that are arranged to face each other by the supply mechanism. A supplying step, a positioning step of positioning the resin molding object on the guide member on the mold surface, an irradiation step of emitting the irradiation light from the light emitting element that passes through the first emission passage hole provided in one of the molds, and a supply mechanism Based on the detection process in which the first light receiving element provided in the sensor detects the irradiation light that has passed through the first emission passage hole, and whether the resin molding object is normally positioned on the guide member based on the detection in the detection process A determination step of determining whether or not, and a resin molding step of clamping the mold and resin molding when it is determined in the determination step that the resin molding object is normally positioned.

  According to this method, it is possible to perform resin molding in a state in which it is verified that the resin molding object is normally positioned on the guide member. Therefore, it is possible to suppress the occurrence of molding defects due to positioning.

  Furthermore, in the method for manufacturing a resin molded product according to the above embodiment, the determination step determines that the resin molding object is normally positioned on the guide member when the first light receiving element does not detect the irradiation light in the detection step. In the detection step, when the first light receiving element detects the irradiation light, it is determined that the resin molding object is not normally positioned on the guide member.

  According to this method, whether or not the resin molding object is normally positioned on the guide member is determined based on whether or not the first light receiving element detects the irradiation light. Therefore, it is possible to suppress the occurrence of molding defects due to positioning.

  Furthermore, in the method for manufacturing a resin molded product according to the above-described embodiment, the detection step is a first step provided in a region where the resin molding object on the guide member side is arranged in a state where the resin molding object is in contact with the guide member. Detecting the irradiation light that has passed through the exit passage hole.

  According to this method, whether or not the resin molding object is normally positioned on the guide member is determined based on whether or not the first light receiving element detects the irradiation light that has passed through the first emission passage hole. Therefore, it is possible to suppress the occurrence of molding defects due to positioning.

  Furthermore, in the method of manufacturing a resin molded product according to the above embodiment, the irradiation step emits irradiation light toward the light guide portion provided on one mold or the platen to which the one mold is attached. Detection is performed with respect to irradiation light that has passed through the first emission passage hole via the light portion.

  According to this method, the resin molding object is normally positioned on the guide member depending on whether or not the first light receiving element detects the irradiation light that has passed through the first emission passage hole via the light guide portion. Determine whether or not. Therefore, it is possible to suppress the occurrence of molding defects due to positioning.

  Furthermore, in the method of manufacturing a resin molded product according to the above embodiment, the light emitting element is provided in the supply mechanism, and the irradiation light is provided from the light emitting element to one of the molds, the incident passage hole, the light guide unit, and the first emission The light is detected by the first light receiving element via the passage holes in order.

  According to this method, whether or not the first light receiving element detects the irradiation light emitted from the light emitting element provided in the supply mechanism and sequentially passing through the incident passage hole, the light guide unit, and the first emission passage hole. Then, it is determined whether or not the resin molding object is normally positioned on the guide member. Therefore, it is possible to suppress the occurrence of molding defects due to positioning.

  Furthermore, in the method for manufacturing a resin molded product according to the above-described embodiment, the detection step is further provided in a region where the resin molding object on the opposite side of the guide member is arranged in a state where the resin molding object is in contact with the guide member. The second light receiving element detects the light emitted from the light emitting element that has passed through the second emission passage hole or another light emitting element, and the determination step includes detection by the second light receiving element in the detection step. Based on this, at least one of the abnormality of the guide member and the deformation of the resin molding object is determined.

According to this method, depending on whether or not the second light receiving element detects the irradiation light that has passed through the second emission passage hole provided on the opposite side of the guide member, the guide member is deformed and the resin molding object is deformed. Whether at least one of the above has occurred can be determined.
Therefore, it is possible to suppress the occurrence of molding defects due to positioning.

  The present invention is not limited to each of the above-described embodiments, and can be arbitrarily combined, modified, or selected and adopted as necessary without departing from the spirit of the present invention. It is.

1 Resin molding unit 2 Base 3 Tie bar 4, 49 Fixed platen (platen)
5 Movable platen (platen)
6 Mold clamping mechanism 7 Start source 8 Transmission member 9, 48 Upper mold (first mold, second mold, one mold)
10 Lower mold (second mold, first mold, one mold)
11 Mold 12 Resin molding object 13 Supply mechanism 14 Semiconductor chip 15 Pre-molding substrate (resin molding object)
16 Cavity 17 Release film 18 Dispenser 19 Drive mechanism 20 Liquid resin 21 Cured resin 22 Resin molded product 23, 23X, 24 Guide member 25, 26 Positioning mechanism 27, 27a, 27b, 28, 28a, 28b, 35, 36 Light emitting element 29, 29a, 29b, 30, 30a, 30b First exit passage hole 31, 31a, 31b, 32, 32a, 32b First light receiving element 33 Irradiation light 34 Clearance 37, 38 Second exit passage hole 39, 40 First 2 light receiving elements 41, 42, 50, 51, 55, 56, 57, 60 Light guide parts 43, 43a, 43b, 44, 44a, 44b Reflective mirror (optical member)
45 Supply mechanism 46, 47 Incident passage hole 52, 53, 58, 58a, 58b, 61, 61a, 61b Optical fiber (optical member)
54 Optical fiber lenses (optical members)
59, 62 Branch member (optical member)
63 Resin molding device 64 Substrate supply / storage module 65A, 65B, 65C Molding module 66 Resin supply module 67 Pre-molding substrate supply unit 68 Resin molded product storage unit 69 Substrate placing unit 70 Release film supply mechanism 71 Judgment unit 72 Control unit

Claims (13)

A mold having a first mold and a second mold disposed opposite to each other;
A supply mechanism for supplying a resin molding object to a mold surface of one of the first mold and the second mold;
A positioning mechanism for positioning the resin molding object on the guide member on the mold surface;
A mold clamping mechanism for clamping the mold;
A light emitting element that emits irradiation light;
A first light receiving element provided in the supply mechanism and capable of receiving the irradiation light;
A determination unit for determining the positioning of the resin molding object,
The one mold is provided with a first emission passage hole through which the irradiation light from the light emitting element passes.
The determination unit determines whether the resin molding object is normally positioned on the guide member based on detection by the first light receiving element with respect to the irradiation light that has passed through the first emission passage hole. Resin molding equipment.   The determination unit determines that the resin molding object is normally positioned on the guide member when the first light receiving element does not detect the irradiation light, and the first light receiving element detects the irradiation light. The resin molding apparatus according to claim 1, wherein if it is determined, the resin molding object is not properly positioned on the guide member.   3. The resin according to claim 1, wherein the first emission passage hole is provided in a region where the resin molding object is disposed on the guide member side in a state where the resin molding object is in contact with the guide member. Molding equipment. A light guide portion is provided for guiding the irradiation light emitted from the light emitting element to the first emission passage hole on the one mold or the platen to which the one mold is attached;
The resin molding apparatus according to any one of claims 1 to 3, wherein an optical member that allows the irradiation light to pass through is provided in the light guide portion.   The resin molding apparatus according to claim 4, wherein the optical member includes any one of an optical fiber, a reflecting mirror, and a prism. The light emitting element is provided in the supply mechanism,
The resin molding apparatus according to claim 4, wherein the one mold is provided with an incident passage hole that allows the irradiation light emitted from the light emitting element to pass therethrough and guides the irradiation light to the light guide unit. In a state where the resin molding object is in contact with the guide member, irradiation light emitted from the light emitting element or another light emitting element is passed through a region where the resin molding object on the opposite side of the guide member is disposed. A second exit passage hole is provided in the one mold,
The resin molding apparatus according to claim 1, wherein the supply mechanism is provided with a second light receiving element capable of receiving the irradiation light that has passed through the second emission passage hole. A supply step of supplying a resin molding object to a mold surface of any one of the molds having a first mold and a second mold disposed to face each other by a supply mechanism;
A positioning step of positioning the resin molding object on a guide member on the mold surface;
An irradiation step of emitting, from the light emitting element, irradiation light that passes through a first emission passage hole provided in the one mold;
A detection step in which a first light receiving element provided in the supply mechanism detects the irradiation light that has passed through the first emission passage hole;
A determination step of determining whether or not the resin molding object is normally positioned on the guide member, based on detection in the detection step;
A resin molded product manufacturing method comprising: a resin molding step in which, in the determination step, it is determined that the resin molding object is normally positioned, the mold is clamped and resin molding is performed.   In the determination step, when the first light receiving element does not detect the irradiation light in the detection step, it is determined that the resin molding object is normally positioned on the guide member, and in the detection step, the first The method for manufacturing a resin molded product according to claim 7, wherein when the light receiving element detects the irradiation light, it is determined that the resin molding object is not normally positioned on the guide member.   In the detection step, in a state where the resin molding object is in contact with the guide member, the first molding passage hole provided in a region where the resin molding object on the guide member side is disposed is passed. The manufacturing method of the resin molded product of Claim 7 or 8 detected about irradiation light. In the irradiation step, the irradiation light is emitted toward a light guide provided on the platen to which the one mold or the one mold is attached,
The method for manufacturing a resin molded product according to any one of claims 7 to 9, wherein in the detection step, the irradiation light that has passed through the first emission passage hole via the light guide portion is detected. The light emitting element is provided in the supply mechanism,
The irradiation light is detected by the first light receiving element sequentially from the light emitting element through an incident passage hole, the light guide unit, and the first emission passage hole provided in the one mold. 10. A method for producing a resin molded product according to 10. In the detection step, in a state where the resin molding object is in contact with the guide member, a second emission passage hole provided in a region where the resin molding object on the opposite side of the guide member is further disposed. The second light receiving element detects the irradiation light emitted from the light emitting element or another light emitting element that has passed,
The determination step according to any one of claims 8 to 12, wherein a determination is made regarding at least one of an abnormality of the guide member and a deformation of the resin molding target based on detection by the second light receiving element in the detection step. The manufacturing method of the resin molded product of description.

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