KR20190073353A - Holding apparatus, inspection apparatus, inspection method, resin sealing apparatus, resin sealing method, and manufacturing method of resin sealed article - Google Patents

Abstract

The holding device includes a table on which the object is placed, a plurality of suction holes formed on the table and sucking the object, and a plurality of suction holes formed on the table for holding the plurality of A sealing member surrounding the periphery of the suction hole, a pressing member pressing the periphery of the object against the table at the position where the sealing member is disposed, and a decompression mechanism connected to the plurality of suction holes.

Description

Holding apparatus, inspection apparatus, inspection method, resin sealing apparatus, resin sealing method, and manufacturing method of resin sealed article

The present invention relates to a holding device, an inspection device, an inspection method, a resin sealing device, a resin sealing method, and a manufacturing method of a resin sealed product.

In recent years, precision (dimensional accuracy, etc.) required for a resin-encapsulated encapsulated substrate (including a resin-sealed encapsulated wafer) has been increased. For this reason, there is an increasing tendency to carry out measurements by holding a substrate (including a wafer) or the like before or after resin sealing (or both before and after resin sealing).

Patent Document 1 discloses a holding device that sucks a substrate by a plurality of suction holes.

Patent Document 1: Japanese Patent Application Laid-Open No. 2007-201275

However, when an electronic component or the like is mounted on a substrate before sealing the resin, for example, there is a case where the substrate is bent (twisted or warped) by the mounting.

Further, after resin sealing, the substrate may be curved due to the difference in thermal expansion coefficient (linear expansion coefficient) between the substrate and the sealing resin when the substrate after the resin sealing is cooled and shrunk after being taken out of the molding die.

In the holding device described in the conventional patent document 1, when the substrate is curved, the substrate can not be stably held. Hereinafter, in the present application document, there is a case where "substrate is deformed" including "substrate is bent", "substrate is deformed", and "substrate is bent" in some cases.

Means for Solving the Problems In order to solve the above problems,

A table on which an object is placed,

A plurality of suction holes formed in the table and sucking the object,

A seal member provided on the table and surrounding the periphery of the plurality of suction holes,

A pressing member for pressing the periphery of the object against the table at a position where the sealing member is disposed;

A pressure reducing mechanism connected to the plurality of suction holes

Respectively.

In order to solve the above problems,

A table on which an object is placed,

A plurality of suction holes formed in the table and sucking the object,

A seal member provided on the table and surrounding the periphery of the plurality of suction holes,

A pressing member for pressing the periphery of the object against the table at a position where the sealing member is disposed;

A decompression mechanism connected to the plurality of suction holes,

Wherein the object is pressed by the pressing member and the object is sucked through the plurality of suction holes by the pressure reducing mechanism,

Respectively.

In order to solve the above problems, in the inspection method according to the present invention,

Disposing an object on a table provided with a plurality of suction holes and a sealing material surrounding the periphery of the plurality of suction holes;

Pressing the periphery of the object to the table with the pressing member at a position where the sealing member is disposed;

A step of forming a space between the table and the object by pressing the periphery of the object;

Drawing the object to the table by suctioning air in the space through the plurality of suction holes,

A step of inspecting the object by using an inspection instrument while the object is in close contact with the table

.

According to the present invention, even if a deformed object (curved, distorted, curved) is deformed, the object can be calibrated and stably held on the table.

Fig. 1 is a schematic view showing the holding device of Embodiment 1, wherein (a) is a plan view and (b) is a sectional view taken along the line AA.
2 (a) to 2 (c) are schematic cross-sectional views showing a process in which a sealed substrate is adhered to and adhered to a table in the first embodiment.
Fig. 3 is a schematic view showing the holding device of Embodiment 2, wherein (a) is a plan view, and Fig. 3 (b) is a sectional view taken along BB line.
4A and 4B are schematic cross-sectional views showing a process of measuring the thickness of a substrate of the sealed substrate in Embodiment 3.
5A and 5B are schematic cross-sectional views showing a process of measuring the thickness of a sealing resin included in a sealed substrate in Embodiment 4.
6A to 6C are schematic sectional views showing a process of measuring the thickness of the substrate and the sealing resin of the sealed substrate in Embodiment 5, respectively.
7 is a plan view showing an outline of a resin molding apparatus provided with an inspection apparatus in Embodiment 6. Fig.
8A to 8D are schematic cross-sectional views showing a process of resin sealing using the resin molding apparatus according to the sixth embodiment.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings. All drawings in this application document are drawn schematically and appropriately omitted or exaggerated for easy understanding. The same constituent elements are denoted by the same reference numerals and the description thereof is appropriately omitted. The term " object " in the present application document includes a substrate and a composite on which an insulator, a conductor, and the like are formed. The "substrate" includes a general substrate such as a glass epoxy laminate, a printed substrate, a glass substrate, and a metal substrate, or a semiconductor wafer. The term " resin-sealed article " means a resin-sealed object and includes a sealed substrate which will be described later.

[Embodiment 1]

(Configuration of Holding Apparatus)

The structure of the holding device according to the present invention will be described with reference to Fig. The holding device is a holding device that closely holds an object on a table by vacuum adsorption. The object to be held is a composite in which an insulator or a metal is formed on a substrate or a substrate. In Embodiment 1, an example is shown in which a substrate having a rectangular shape as an object is held in close contact with the table. As the substrate, for example, a glass epoxy laminate, a printed board, a ceramics substrate, a lead frame, or the like is used. Alternatively, a sealed substrate on which a sealing resin is molded on these substrates is used.

1 (a), the holding apparatus 1 includes a table 2 on which a substrate is placed and a plurality of suction holes 3 formed in the table 2. As shown in Fig. In the table 2, a plurality of suction holes 3 are formed in a lattice shape. In Fig. 1, ten suction holes 3 are formed along the long direction, and five suction holes 3 are formed along the short direction. Therefore, a total of 50 suction holes 3 are formed on the table 2. [ As shown in Fig. 1 (b), each suction hole 3 penetrates from the front surface to the back surface of the table 2. The number of the suction holes 3 can be arbitrarily set in correspondence with the size of the held substrate 4 (indicated by a chain double-dashed line in the drawing) and the deformed state of the substrate 4 (e.g., the substrate is twisted or warped) have. A plurality of suction holes 3 are connected to the decompression mechanism 6 through a pipe 5 following each suction hole 3. As the pressure-reducing mechanism 6, for example, a vacuum pump or the like is used.

The holding device 1 is provided with a pressing member 7 for pressing the periphery of the substrate 4 against the table 2 in accordance with the shape and size of the substrate 4. [ The pressing member 7 is constituted by, for example, a frame member having an opening portion 8 in a vertical direction. The pressing member 7 is a pressing member that presses only the periphery of the substrate 4 and does not press the central portion of the substrate 4 or the like. The pressing member 7 is moved up and down by a driving mechanism (not shown) provided in the holding device 1. [ As the pressing member 7, it is preferable to use a material which suppresses mechanical damage to the substrate 4. For example, polyether ether ketone (PEEK) and the like are used. A cushioning member or an elastic member may be provided on the bottom surface of the pressing member 7.

As shown in Fig. 1 (b), the table 2 is provided with a sealing groove 9 surrounding the periphery of the plurality of suction holes 3. In the sealing groove 9, a sealing material 10 such as an O-ring is disposed. The sealing material (10) is arranged so that the upper portion of the sealing material (10) protrudes from the surface of the table (2). As the sealing material 10, it is preferable to use silicone rubber, fluorine rubber, or the like. It is preferable that the sealing material 10 has a suitable hardness and is easy to elongate.

A frame-like pressing member 7 is disposed above the position where the sealing material 10 is disposed. In a plan view, the sealing material 10 is contained in the frame-shaped pressing member 7. The seal member 10 is completely contained in the pressing member 7 when the pressing member 7 and the sealing member 10 are overlapped with each other as shown in a plan view . 2 (b), the periphery of the substrate 4 (the sealed substrate 11 in Fig. 2) is sealed with the sealing material 10 disposed on the table 2 and the pressing Is pressed against the table (2) while being sandwiched between the members (7).

(Operation of the holding device)

An operation of keeping the object in close contact with the table 2 in the holding apparatus 1 will be described with reference to Figs. In Fig. 2, as an object, for example, an example in which a sealed substrate on which a sealing resin is molded on a substrate is kept in close contact with the table 2 will be described.

First, as shown in Fig. 2 (a), the sealed substrate 11 is placed at a predetermined position on the table 2. The sealed substrate 11 includes a substrate 12 made of, for example, a printed substrate or a lead frame, a plurality of chip-shaped components (not shown) mounted on a plurality of regions of the substrate 12, And has a sealing resin 13 molded so as to be covered with the sealing resin 13. If the difference between the thermal expansion coefficient of the substrate 12 and the thermal expansion coefficient of the sealing resin 13 is large, if the sealed substrate 11 is taken out of the molding die to be at a room temperature lower than the molding temperature, . 2 shows an example in which the sealing-finished substrate 11 is deformed, for example, in which convex warpage occurs on the surface side (the side where the sealing resin 13 is molded) of the sealing-finished substrate 11.

As shown in FIG. 2A, if the sealed substrate 11 having a convexly curved surface is disposed on the table 2, the sealed substrate 11 and the table 2 are not in close contact with each other A gap 14 is generated between the seal-completed substrate 11 and the table 2. When the gap 14 is large, the suction force is weak even when the sealed substrate 11 is sucked by the decompression mechanism 6, so that the sealed substrate 11 may not be sucked onto the table 2. When the leakage of air occurs between the sealed substrate 11 and the table 2 even if the sealed substrate 11 is sucked by the decompression mechanism 6, The adsorbent can not be sufficiently adsorbed. This phenomenon becomes particularly conspicuous in the sealed substrate 11 having a large area. The fact that the seal-completed substrate 11 can not be attracted to the table 2 means that the warp of the seal-completed substrate 11 can be flattened and the sealed substrate 11 can not be brought into close contact with the table 2 .

Next, as shown in Fig. 2 (b), the pressing member 7 is lowered from a predetermined position by using a driving mechanism (not shown) provided in the holding device 1. [ The bottom surface of the pressing member 7 is brought into contact with the periphery of the sealed substrate 11 and the periphery of the sealed substrate 11 is brought into close contact with the sealing member 10 by the pressing member 7. The sealed substrate 11 is further pressed while the periphery of the sealed substrate 11 is in close contact with the sealing material 10. [ Thereby, the closed space 15 sealed between the sealed substrate 11 and the table 2 can be formed through the sealing material 10. Therefore, air can be prevented from leaking to the outside from the closed space 15 formed between the sealed substrate 11 and the table 2. In this state, it is important to form a closed space 15 sealed between the sealed substrate 11 and the table 2 through the sealing material 10, (2).

Next, as shown in Fig. 2 (c), in a state in which the periphery of the sealed substrate 11 is pressed against the table 2 through the sealing material 10 by the pressing member 7, The air present in the closed space 15 formed between the sealed substrate 11 and the table 2 is sucked by the suction unit 6. By sucking the air present in the closed space 15, the pressure in the closed space 15 becomes a negative pressure (vacuum) from the atmospheric pressure. The pressure in the closed space 15 becomes smaller than the atmospheric pressure, so that a pressing force is applied to the table 2 by the atmospheric pressure. In other words, when the decompression mechanism 6 sucks the sealed substrate 11, the sealed substrate 11 is pulled to the table 2. As a result, the warp of the sealed substrate 11 can be flattened and the sealed substrate 11 can be brought into close contact with the table 2. The sealed substrate 11 can be held in tight contact with the table 2 by sucking the sealed substrate 11 to the table 2 through the plurality of suction holes 3.

The area occupied by the closed space 15 formed between the sealed substrate 11 and the table 2 corresponds to the vacuum adsorption area (water pressure area) as shown in Fig. 2 (b). Specifically, the area of the space area in the area indicated by A in FIG. 2B, in other words, the surface area of the sealed substrate 11 on the substrate 12 side not in contact with the table 2, . The greater the pressure receiving area, the larger the force received from the atmospheric pressure becomes, and the attractive force for attracting the sealed substrate 11 to the table 2 becomes larger. Therefore, even when the area of the sealed substrate 11 is large or the warpage of the sealed substrate 11 is large, the warpage of the sealed substrate 11 is corrected evenly, In a state in which they are in close contact with each other.

(Action effect)

In this embodiment, the holding apparatus 1 includes a table 2 on which a sealed substrate 11 as an object is placed, a plurality of suction holes (not shown) formed on the table 2 for sucking the sealed substrate 11 A seal member 10 provided on the table 2 and surrounding the plurality of suction holes 3 and a seal member 10 surrounding the periphery of the sealed substrate 11 at a position where the seal member 10 is disposed, A pressing member 7 for pressing against the suction port 2 and a pressure reducing mechanism 6 connected to the plurality of suction holes 3.

With this configuration, the sealed space 15 is formed between the sealed substrate 11 and the table 2, and the air present in the sealed space 15 is sucked, thereby sealing the sealed substrate 11 to the table 2 ). Thus, the warp of the sealed substrate 11 can be flattened and the sealed substrate 11 can be held in tight contact with the table 2.

According to the present embodiment, in the holding apparatus 1, a plurality of suction holes 3 for sucking a sealed substrate 11 as an object and a sealing material 10 surrounding the periphery of the suction hole 3, (2). A pressing member 7 for pressing the periphery of the sealed substrate 11 against the table 2 is provided at a position where the sealing material 10 is disposed. The sealed substrate 11 and the table 2 are pressed through the sealing material 10 by pressing the periphery of the sealed substrate 11 with the pressing member 7 even if warping occurs in the sealed substrate 11, A closed space 15 can be formed.

In this state, the air present in the closed space 15 is sucked by using the decompression mechanism 6. As a result, the pressure in the closed space 15 becomes smaller than the atmospheric pressure, and a force for pressing the sealed substrate 11 to the table 2 is generated by the atmospheric pressure. When the decompression mechanism 6 sucks the sealed substrate 11, the sealed substrate 11 is attracted to the table 2 and brought into close contact. Therefore, the warpage of the sealed substrate 11 can be flattened and the sealed substrate 11 can be held in tight contact with the table 2.

The sealed substrate 11 is brought into close contact with the table 2 by sucking the air present in the sealed space 15 formed between the sealed substrate 11 and the table 2. In this embodiment, Since the area occupied by the closed space 15 corresponds to the pressure receiving area of the vacuum, the larger the area occupied by the closed space 15, the larger the attracting force for attracting the sealed substrate 11 to the table 2. Therefore, even when the area of the sealed substrate 11 is large or the warpage of the sealed substrate 11 is large, the warpage of the sealed substrate 11 is corrected evenly, In a state in which they are in close contact with each other.

In this embodiment, a force for pressing the sealed substrate 11 to the table 2 is generated by the atmospheric pressure. As a result, the warpage of the sealed substrate 11 is flattened and the sealed substrate 11 is brought into close contact with the table 2. In this case, the pressing force of the pressing member 7 may be relaxed, or the sealing material 10 may be made of a slippery material so that the sealing substrate 11 slides on the sealing material 10. [ Thus, breakage of the sealed substrate 11 caused by correcting the warp of the sealed substrate 11 can be prevented.

[Embodiment 2]

(Configuration of Holding Apparatus)

Referring to Fig. 3, the holding device according to the second embodiment will be described. As shown in Fig. 3, the holding device 16 is a holding device for holding a substrate (object) having a circular shape in close contact with the table. As the substrate, a wafer level package in which a sealing resin is formed on a wafer or a wafer is used.

3 (a), the holding device 16 includes a table 17 on which a circular substrate is placed, and a plurality of suction holes 3 formed on the table 17. As shown in Fig. In the table 17, for example, a plurality of suction holes 3 are formed in a columnar shape. The number of the suction holes 3 can be arbitrarily set corresponding to the size of the held substrate 18 (indicated by the chain double-dashed line in the figure) and the deformed state of the substrate 18 (the substrate is twisted or warped) . A plurality of suction holes 3 are connected to the decompression mechanism 6 through a pipe 5 following each suction hole 3. As the pressure reducing mechanism 6, a vacuum pump or the like is used.

The retaining device 16 is provided with a pressing member 19 for urging the periphery of the substrate 18 against the table 17 in correspondence with the size of the substrate 18. [ The pressing member 19 is constituted by an annular member having an opening 20 in a vertical direction. As the pressing member 19, polyetheretherketone: PEEK (Poly Ether Ether Ketone) or the like is used. A cushioning member or an elastic member may be provided on the bottom surface of the pressing member 19. The pressing member 19 is moved up and down by a driving mechanism (not shown) provided in the holding device 16.

As shown in Fig. 3 (b), the table 17 is provided with a sealing groove 21 surrounding the periphery of the plurality of suction holes 3. A sealing material 22 is disposed in the sealing groove 21. The periphery of the substrate 18 is pressed against the table 17 in a state sandwiched between the sealing member 22 disposed on the table 17 and the pressing member 19.

As the substrate 18, a wafer-like package such as a silicon wafer or a compound semiconductor wafer or a resin-sealed wafer level package in the state of a wafer can be held on the table 17. [ In this case, an annular pressing member for pressing the periphery of the wafer in correspondence with the diameter of the wafer may be provided in the holding device 16.

In the present embodiment, a plurality of suction holes 3 are formed in a columnar shape on the table 17. The position of the plurality of suction holes 3 may be arbitrarily set. For example, the suction holes 3 may be formed so as to correspond to the respective chip regions in which the fabrication process in the semiconductor previous process is completed and the wafer is divided and fragmented.

The operation of the holding device 16 is the same as the operation of the holding device 1 shown in the first embodiment, and a description thereof will be omitted. The holding device 16 has the same effect as the holding device 1 shown in the first embodiment.

[Embodiment 3]

(Configuration of inspection apparatus)

Referring to Fig. 4, the inspection apparatus used in the third embodiment will be described. The inspection apparatus is the inspection apparatus added to the holding apparatus 1 shown in the first embodiment or the holding apparatus 16 shown in the second embodiment. By adding the inspection apparatus to the holding apparatus, the holding apparatus can be used as the inspection apparatus. As the inspection mechanism, for example, a mechanism for measuring the thickness of the substrate or a mechanism for inspecting the surface state of the substrate is added. The configuration and operation of the apparatus other than the inspection apparatus are the same as those of the holding apparatus 1 of the first embodiment or the holding apparatus 16 of the second embodiment, and a description thereof will be omitted.

The inspection apparatus 23 has a configuration in which a holding mechanism 1 is further provided with a checking mechanism such as a contact type displacement sensor, an optical displacement sensor and an image processing system. By providing a contact type displacement sensor or an optical displacement sensor as the inspection mechanism, it is possible to accurately measure the thickness of the substrate in a state in which it is held in close contact with the table 2. A surface inspection of a substrate, a defect inspection, a pattern inspection, and the like can be performed by providing an image processing system equipped with a CMOS (Complementary Metal Oxide Semiconductor) image sensor or a CCD (Charge Coupled Device) image sensor as an inspection mechanism. Since the substrate is held in close contact with the table 2, accurate inspection can be performed with the influence of deformation such as warping or twisting removed. It is also possible to measure the thickness of the substrate held on the table 2 by applying an image recognition system. In the image processing, general image processing can be used, such as edge detection by binarizing an image picked up by a camera.

Fig. 4 shows a case in which a contact type displacement sensor is provided as an inspection mechanism, for example. As shown in Fig. 4, the inspection apparatus 23 has a contact-type displacement sensor 24 on the upper side of the table 2. As shown in Fig. The contact type displacement sensor 24 is movable in the X direction, the Y direction and the Z direction by a moving mechanism (not shown) provided in the inspection apparatus 23. [ By using the contact displacement sensor 24, the thickness of the substrate can be measured at an arbitrary position.

In the inspection apparatus 23, the pressing member 7 presses only the periphery of the substrate and does not press the central portion of the substrate or the like. That is, the entire sealing resin of the sealed substrate, which is important in the inspection, or the entire region of the semiconductor chip mounted on the substrate before sealing can be inspected. Therefore, the contact type displacement sensor 24 moves in the X direction, the Y direction, and the Z direction in the opening portion 8 of the pressing member 7. This makes it possible to measure the thickness of the substrate at an arbitrary position on the substrate.

In the present embodiment, the center portion of the substrate is not pressed by the pressing member. Thus, even if the rigidity of the table is weak, the central portion of the substrate is pressed against the central portion of the substrate to prevent the central portion of the substrate from being deformed for each table. Further, in the substrate before sealing, the semiconductor chip or the like is prevented from being damaged by the pressing member.

(Operation of Inspection Apparatus)

Referring to Fig. 4, there is shown a case where the sealed substrate 11 having warp shown in Fig. 2 is inspected as a substrate (object). In this embodiment, an operation of measuring the thickness of the substrate 12 of the sealed substrate 11 using the inspection apparatus 23 will be described. In the following embodiments, too, the case of inspecting a sealed substrate 11 having warpage as a substrate is shown.

4 (a), in the inspection apparatus 23, the contact type displacement sensor 24 is lowered (lowered) in a state in which the sealed substrate 11 is not disposed on the table 2 (P1) of the table (2). The predetermined position P1 of the table 2 corresponds to a position P2 (see Fig. 4 (b)) at which the thickness of the substrate 12 of the sealed substrate 11 is measured. The height position h1 of the table surface is measured by the contact type displacement sensor 24 at the predetermined position P1 of the table 2. [ The measured height position h1 of the table surface is stored as a reference height of the table 2 in a memory or the like. The contact type displacement sensor 24 is raised to wait at the predetermined position P1.

Next, as shown in Fig. 4 (b), the sealed substrate 11 having the warp is disposed at a predetermined position of the table 2. Fig. Next, the pressing member 7 is lowered, and the periphery of the sealed substrate 11 is pressed against the table 2. Thus, a closed space 15 (see Fig. 2) is formed between the sealed substrate 11 and the table 2 through the sealing material. Next, the sealing of the sealed substrate 11 is performed by the decompression mechanism 6 to flatten the warping of the sealed substrate 11, and the sealed substrate 11 is kept in close contact with the table 2. In this state, the sealed substrate 11 is flattened on the table 2 by correcting warpage.

Next, the contact type displacement sensor 24 is lowered to be brought into contact with the predetermined position P2 of the substrate 12 of the sealed substrate 11. The height position h2 of the substrate 12 is measured by the contact type displacement sensor 24 at a predetermined position P2 of the substrate 12. [ The height position h2 of the substrate 12 can be accurately measured because the sealed substrate 11 is kept in close contact with the table 2 in a flat manner. The difference (h2-h1) between the height position h2 of the substrate 12 and the height position h1 of the table surface previously stored is obtained. The difference h2-h1 corresponds to the thickness of the substrate 12 of the seal-completed substrate 11 at the predetermined position P2 of the seal-completed substrate 11. The predetermined position P2 of the substrate 12 and the predetermined position P1 of the table 2 become the same measurement position in plan view. Therefore, the thickness of the substrate 12 at the predetermined position P2 can be accurately obtained by obtaining the difference (h2-h1) between the height positions of the two points measured by the contact type displacement sensor 24. [ In this way, the thickness of the substrate 12 of the sealed substrate 11 can be accurately measured using the inspection apparatus 23 while the sealed substrate 11 is brought into flat contact with the table 2 .

(Action effect)

In the present embodiment, the inspection apparatus 23 includes a table 2 on which a sealed substrate 11 as an object is placed, a plurality of suction holes (not shown) formed on the table 2 for suctioning the sealed substrate 11 A seal member 10 provided on the table 2 and surrounding the plurality of suction holes 3 and a seal member 10 surrounding the periphery of the sealed substrate 11 at a position where the seal member 10 is disposed The periphery of the sealed substrate 11 is pressed by the pressing member 7 pressing on the table 2, the pressure reducing mechanism 6 connected to the plurality of suction holes 3, and the pressing member 7, And a contact type displacement sensor (24) as an inspection mechanism for inspecting the sealed substrate (11) while the sealed substrate (11) is sucked by the pressure reducing mechanism (6) through the plurality of suction holes .

The sealing space 15 is formed between the sealing substrate 11 and the table 2 having a warp through the sealing member 10. [ By suctioning the air present in the closed space 15, the sealed substrate 11 is attracted to the table 2 and brought into close contact. It is possible to flatten the warpage of the sealed substrate 11 to maintain the sealed substrate 11 in close contact with the table 2. Therefore, it is possible to accurately measure the thickness of the substrate 12 of the sealed substrate 11 by using the contact type displacement sensor 24, with the influence of deformation such as warpage or distortion being removed.

According to the present embodiment, the inspection apparatus 23 is provided with the pressing member 7 which presses the periphery of the sealed substrate 11 against the table 2 in correspondence with the sealed substrate 11, And a contact type displacement sensor 24 for measuring the thickness of the contact type displacement sensor. The pressing member 7 presses the periphery of the sealed substrate 11 to seal the sealed substrate 11 with the sealing member 10 even if the sealing substrate 11 is deformed such as warping or twisting And the table 2 can be formed in a closed space 15 that is hermetically sealed.

In this state, the air present in the closed space 15 is sucked by using the decompression mechanism 6. Thus, the deformation of the sealed substrate 11 can be corrected and the sealed substrate 11 can be brought into close contact with the table 2. The thickness of the substrate 12 of the sealed substrate 11 is measured using the contact type displacement sensor 24 while the sealed substrate 11 is in close contact with the table 2. [ Therefore, it is possible to accurately measure the thickness of the substrate 12 of the sealed substrate 11 with the influence of deformation such as warpage or distortion removed.

According to the present embodiment, in the inspection apparatus 23, the contact-type displacement sensor 24 is used at a predetermined position (P1) in a state in which the seal-completed substrate 11 is not initially placed on the table 2 The height position h1 of the table surface is measured. Next, the sealed substrate 11 is placed on the table 2, the warp of the sealed substrate 11 is flatly corrected, and the sealed substrate 11 is brought into close contact with the table 2. In this state, the height position h2 of the substrate 12 at the predetermined position P2 of the sealed substrate 11 is measured using the contact type displacement sensor 24. The thickness of the substrate 12 of the sealed substrate 11 can be accurately obtained by comparing the height position h2 of the measured substrate 12 with the height position h1 of the table surface previously measured. Therefore, it is possible to accurately measure the thickness of the substrate 12 of the sealed substrate 11 with the influence of deformation such as warpage or distortion removed.

The sealed substrate 11 is brought into close contact with the table 2 by sucking the air present in the sealed space 15 formed between the sealed substrate 11 and the table 2. In this embodiment, The area occupied by the closed space 15 corresponds to the pressure receiving area of the vacuum so that even when the area of the sealed substrate 11 is large or the warp of the sealed substrate 11 is large, The warpage can be flattened and the sealed substrate 11 can be brought into close contact with the table 2. Therefore, even in the case of the sealed substrate 11 having a large area or the sealed substrate 11 having a large warpage, the substrate 11 having the sealed substrate 11 can be prevented from being adhered to the table 2, It is possible to accurately measure the thickness of the substrate 12.

In the present embodiment, for the sake of convenience, the case where the thickness of the substrate 12 included in the sealed substrate 11 is measured at only one point is shown. The thickness of the substrate 12 can be measured at a plurality of positions in the same manner by using the contact type displacement sensor 24. [ In this case, the average value and the deviation of the thickness of the substrate 12 of the sealed substrate 11 can be obtained.

[Embodiment 4]

An operation of relatively measuring the thickness of the sealing resin 13 of the sealed substrate 11 using the inspection apparatus 23 will be described with reference to Fig.

First, as shown in Fig. 5 (a), the sealed substrate 11 having warp is disposed at a predetermined position on the table 2. Fig. Next, the pressing member 7 is lowered to press the periphery of the sealed substrate 11 against the table 2. Then, Next, the sealing of the sealed substrate 11 is performed by using the decompression mechanism 6 to flatten the warping of the sealed substrate 11, and the sealed substrate 11 is brought into close contact with the table 2. In this state, the sealed substrate 11 is held flat on the table 2.

Next, the contact type displacement sensor 24 is lowered to be brought into contact with the predetermined position P2 of the sealed substrate 11. The height position h2 of the substrate 12 of the sealed substrate 11 is measured by the contact type displacement sensor 24 at a predetermined position P2 of the sealed substrate 11. [ The measured height h2 of the substrate 12 is stored in a memory or the like as the relative height of the substrate 12 of the sealed substrate 11. [

Next, the contact type displacement sensor 24 is raised to move the contact type displacement sensor 24 to a predetermined position on the upper side of the sealing resin 13 of the sealed substrate 11. The contact type displacement sensor 24 is lowered to be brought into contact with the predetermined position P3 of the sealed substrate 11. The height position h3 of the sealed substrate 11 is measured by the contact type displacement sensor 24 at a predetermined position P3 of the sealed substrate 11. The difference (h3-h2) between the height position h3 of the sealed substrate 11 and the relative height position h2 of the substrate 12 previously stored is measured. This difference (h3-h2) corresponds to the relative thickness of the sealing resin 13 of the sealed substrate 11. The height position h2 of the substrate 12 and the height position h3 of the sealed substrate 11 of the sealed substrate 11 in a state in which the sealed substrate 11 is kept flat on the table 2 The thickness of the sealing resin 13 of the sealed substrate 11 can be relatively determined.

According to the present embodiment, the sealed substrate 11 is kept in close contact with the table 2 in a state where the warp is flat and corrected. Therefore, the height position h2 of the substrate 12 of the seal-completed substrate 11 and the height position h2 of the seal-completed substrate 11 of the seal-completed substrate 11 can be measured with the contact type displacement sensor 24 in the state in which the influence of deformation such as warpage, Both of the height position h3 of the light-emitting element 3 can be measured. Therefore, the thickness h3-h2 of the measured height position can be obtained, whereby the thickness of the sealing resin 13, which has conventionally been difficult to measure, can be easily obtained.

According to the present embodiment, the air present in the closed space 15 formed between the sealed substrate 11 and the table 2 is sucked to cause the sealed substrate 11 to be adsorbed to the table 2. The area occupied by the closed space 15 corresponds to the pressure receiving area of the vacuum so that even when the area of the sealed substrate 11 is large or the warp of the sealed substrate 11 is large, The warpage can be flattened and the sealed substrate 11 can be kept in close contact with the table 2. Therefore, even in the case of the sealed substrate 11 having a large area or the sealed substrate 11 having a large warpage, the sealing of the sealed substrate 11 can be performed in a state in which the sealed substrate 11 is in close contact with the table 2 The thickness of the resin 13 can be relatively obtained.

According to the present embodiment, the thickness of the sealing resin 13 of the resin-sealed substrate 11 in the resin molding apparatus can be relatively obtained. Therefore, it is possible to easily manage the thickness of the sealing resin 13 which has been difficult in the past, in other words, to manage the thickness of the final product package. This makes it possible to stably and easily manage the molding process in the resin molding apparatus.

In this embodiment, for the sake of convenience, only one point of the thickness of the sealing resin 13 of the sealed substrate 11 is measured. The thickness of the substrate 12 and the sealed substrate 11 at a plurality of positions can be measured in the same manner by using the contact type displacement sensor 24. [ In this case, the average value and the deviation of the relative thickness of the sealing resin 13 of the sealed substrate 11 can be obtained.

[Embodiment 5]

The operation of measuring the thickness of the substrate 12 and the thickness of the sealing resin 13 at the same position of the sealed substrate 11 using the inspection apparatus 23 will be described with reference to Fig.

First, as shown in Fig. 6A, the contact type displacement sensor 24 is moved to the upper side of the measurement position in a state where nothing is placed on the table 2 in the inspection apparatus 23. [ Next, the contact type displacement sensor 24 is lowered to be brought into contact with the predetermined position P4 of the table 2. The predetermined position P4 of the table 2 is a position P5 (see Fig. 6 (b)) for measuring the thickness of the substrate 12 of the substrate 26 before sealing, Corresponds to the position P6 (see Fig. 6 (c)) for measuring the thickness. The height position h4 of the table surface is measured by the contact type displacement sensor 24 at the predetermined position P4 of the table 2. [ The measured height position h4 of the table surface is stored as a reference height in a memory or the like. The contact type displacement sensor 24 is raised to wait on the upper side of the predetermined position P4.

Next, as shown in Fig. 6 (b), the pre-sealing substrate 26 on which the plurality of semiconductor chips 25 are mounted is arranged at a predetermined position of the table 2. Fig. Next, the pressing member 7 is lowered to press the periphery of the unsealed substrate 26 against the table 2. Then, Next, the deformation of the unsealed substrate 26 is corrected by sucking the unsealed substrate 26 using the decompression mechanism 6, and the unsealed substrate 26 is brought into close contact with the table 2. Next, In this state, the unsealed substrate 26 is deformed and held flat on the table 2.

Next, the contact type displacement sensor 24 is lowered to be brought into contact with the predetermined position P5 of the substrate 26 before sealing. The predetermined position P5 of the unsealed substrate 26 is an area where the upper surface of the substrate 12 is exposed because the semiconductor chip 25 is not mounted. The height position h5 of the substrate 26 before sealing is measured by the contact type displacement sensor 24 at a predetermined position P5 of the substrate 26 before sealing. The difference h5-h4 between the height position h5 of the unsealed substrate 26 and the reference height position h4 of the table surface previously stored is measured. This difference h5-h4 corresponds to the thickness of the substrate 12 of the pre-sealing substrate 26 at the predetermined position P5 of the substrate 26 before sealing. The height position h5 of the substrate 26 before sealing is stored in a memory or the like.

Next, the contact type displacement sensor 24 is raised to wait at the predetermined position P5. The pressing member 7 is raised to stop at the original position. And the substrate 26 before the sealing is taken out from the table 2. In this state, the inspection apparatus 23 returns to the initial standby state.

Next, as shown in Fig. 6 (c), the sealed substrate 11 is placed at a predetermined position on the table 2. The sealed substrate 11 is a sealed substrate obtained by resin-sealing the substrate 26 before sealing which measures the height position h5 at the above-mentioned predetermined position P5. Thus, the unsealed substrate 26 and the sealed substrate 11 are arranged at the same position in the table 2 of the inspection apparatus 23. [ Next, the pressing member 7 is lowered to press the periphery of the sealed substrate 11 against the table 2. Then, Next, the deformation of the seal-completed substrate 11 is corrected by sucking the seal-completed substrate 11 by using the pressure-reducing mechanism 6, and the seal-completed substrate 11 is brought into close contact with the table 2. [ In this state, the sealed substrate 11 is held flat on the table 2.

Next, the contact type displacement sensor 24 is lowered to be brought into contact with the predetermined position P6 of the sealed substrate 11. The height position h6 of the sealed substrate 11 is measured by the contact type displacement sensor 24 at the predetermined position P6 of the sealed substrate 11. The difference (h6-h5) between the height position h6 of the sealed substrate 11 and the height position h5 of the pre-sealing substrate 26 previously stored is measured. The difference h6-h5 corresponds to the thickness of the sealing resin 13 of the sealed substrate 11 at the predetermined position P6 of the sealed substrate 11. The deformation of the substrate 26 before the sealing and the deformation of the substrate 11 after the sealing are thus corrected and held flat on the table 2, The thickness of the substrate 12 and the thickness of the sealing resin 13 can be accurately measured.

According to the present embodiment, in the inspection apparatus 23, the unsealed substrate 26 and the sealed substrate 11 are held tightly on the table 2 in a state in which the deformation is corrected. Therefore, by using the contact type displacement sensor 24, the height position h5 of the substrate 12 of the sealed substrate 11 at the same position and the sealing position The height position h6 of the finished substrate 11 can be accurately measured. Therefore, the thickness of the substrate 12 and the thickness of the sealing resin 13 of the sealed substrate 11 are accurately determined from the height positions h6 and h5 and the reference height position h4 of the table surface at the same position Can be measured.

According to the present embodiment, deformation of the unsealed substrate 26 and the sealed substrate 11 can be corrected and maintained in close contact with the table 2 even when the area of the substrate is large or the substrate is warped large . The thickness of the substrate 12 and the thickness of the encapsulating resin 13 of the encapsulated substrate 11 can be accurately measured even in the encapsulated substrate 11 having a large area or the highly encapsulated encapsulated substrate 11 .

In the present embodiment, for convenience, the thickness of the substrate 12 of the sealed substrate 11 and the thickness of the sealing resin 13 are measured at only one point. The thickness of the substrate 12 of the sealed substrate 11 and the thickness of the sealing resin 13 can be measured at a plurality of positions by using the contact type displacement sensor 24. [ In this case, the average value and the deviation of the thickness of the substrate 12 and the thickness of the sealing resin 13 of the sealed substrate 11 can be obtained.

In this embodiment, the contact type displacement sensor 24 is used to measure the reference height position h4 of the table surface at the same position, the height position h5 of the substrate 12 of the sealed substrate 11, The height position h6 of the finished substrate 11 was measured and the thickness of the substrate 12 and the thickness of the sealing resin 13 of the sealed substrate 11 were respectively determined. However, the present invention is not limited to this, and it is also possible to measure the reference height position h4 of the table surface at the start of production, for example, and to share the value. The reference height position h4 of the table surface is measured and the value is shared according to the number of resin sealing times. In this way, the number of times of measurement of the reference height position h4 can be reduced.

In the present embodiment, the thickness of the substrate 12 and the thickness of the sealing resin 13 are obtained in the two-layered sealing substrate 11 having the substrate 12 and the sealing resin 13, respectively. The present invention is not limited thereto, and the height position can be measured in each layer even if the substrate (object) has a structure of three or more layers. The thicknesses of the respective layers can be accurately obtained by obtaining the differences between the measured height positions.

In this embodiment, the height position of the substrate 26 before sealing is measured by the contact type displacement sensor 24 in a state in which the unsealed substrate 26 is in close contact with the table 2. It is possible to inspect the state of the semiconductor chip 25, for example, in a state in which the substrate 26 is not in contact with the table 2 but in the state of being torn off, for example, without being limited to the measurement of the height position of the substrate 26 before sealing. In this case, it is possible to inspect whether or not the semiconductor chip 25 is normally disposed on the substrate 12, whether it is erratic, or the like by using a contact type displacement sensor, an optical displacement sensor, an image recognition system, have. When the semiconductor chip 25 is broken, the amount of resin to be supplied at the time of resin molding can be adjusted. This makes it possible to form the resin into a predetermined package thickness even when the semiconductor chip is rubbed on the substrate before sealing.

[Embodiment 6]

(Configuration of resin molding apparatus)

Referring to Fig. 7, the resin molding apparatus of the sixth embodiment will be described. The resin molding apparatus shown in Fig. 7 is a resin molding apparatus equipped with the inspection apparatus 23 described above. Fig. 7 shows a resin molding apparatus using, for example, a compression molding method.

The resin molding apparatus 27 includes a substrate supply and storage module 28, an inspection module 29, three molding modules 30A, 30B and 30C and a resin supply module 31 as constituent elements Respectively. The substrate supply / storage module 28, the inspection module 29, the molding modules 30A, 30B, and 30C, and the resin supply module 31, which are components, can be attached to and detached from each other And can also be exchanged.

The substrate supply / storage module 28 is provided with a pre-sealing substrate supply portion 32 for supplying a pre-sealing substrate 26, a sealed substrate storage portion 33 for storing the sealed substrate 11, A substrate arranging section 34 for transferring the substrate 26 and the sealed substrate 11 and a substrate transport mechanism 35 for transporting the substrate 26 before sealing and the substrate 11 sealed are provided. The substrate placement portion 34 moves in the Y direction within the substrate supply / storage module 28. [ The substrate transport mechanism 35 moves in the X direction, the Y direction and the Z direction within the substrate supply / storage module 28, the inspection module 29, and the respective molding modules 30A, 30B and 30C. The predetermined position S1 is a position where the substrate transport mechanism 35 waits in a state in which it does not operate.

In the inspection module 29, inspection devices 23 shown in the third to fifth embodiments are provided. The inspection apparatus 23 includes a table 2, a pressure-reducing mechanism 6, a pressing member 7, and a contact-type displacement sensor 24. The height position of the substrate 12 held by the unsealed substrate 26 and the height of the substrate 12 held by the sealed substrate 11 can be detected using the inspection apparatus 23, The height position of the sealed substrate 11, the arrangement state of the semiconductor chip in the substrate 26 before sealing, and the like are inspected if necessary.

Each of the molding modules 30A, 30B and 30C is provided with a lower mold 36 capable of ascending and descending and an upper mold arranged to face the lower mold 36 (see Fig. 8). The lower mold 36 is provided with a cavity 37 to which a resin material is supplied. There is provided a release film supply mechanism 38 (a rectangular portion shown by chain double-dashed lines in Fig. 7) for supplying an elongated release film to the lower die 36. [ Each of the molding modules 30A, 30B and 30C has a mold clamping mechanism 39 (a circular portion shown by chain double-dashed lines in Fig. 7) for opening and fastening the upper mold and the lower mold 36. [

The resin supply module 31 includes an XY table 40, a resin accommodating portion 41 disposed on the XY table 40, a resin material loading mechanism 42 for injecting a resin material into the resin accommodating portion 41, And a resin conveying mechanism 43 for conveying the resin receiving portion 41 are provided. The X-Y table 40 moves in the X-direction and the Y-direction in the resin supply module 31. The resin transport mechanism 43 moves in the X direction, the Y direction and the Z direction within the resin supply module 31 and the respective molding modules 30A, 30B and 30C. The predetermined position R1 is a position where the resin transport mechanism 43 waits in a state in which it does not operate.

The substrate supply / storage module 28 is provided with a control unit CTL. The control unit CTL controls the transfer of the resin material before and after the sealing of the substrate 26 and the sealed substrate 11, And so on. The control unit CTL may be provided in the inspection module 29, each of the molding modules 30A, 30B, and 30C, or the resin supply module 31. [

(Operation of resin molding apparatus)

With reference to Figs. 7 to 8, the operation of resin-sealing using the resin molding apparatus 27 will be described. First, in the substrate supply / storage module 28, the pre-sealing substrate 26 is sent from the pre-sealing substrate supply part 32 to the substrate arrangement part 34. [ The substrate transport mechanism 35 is moved in the -Y direction from the predetermined position S1 and the substrate transport mechanism 35 receives the substrate 26 before sealing from the substrate arrangement section 34. [ The substrate transport mechanism 35 is returned to the predetermined position S1.

Next, the substrate transport mechanism 35 is moved in the + X direction up to the predetermined position M1 of the forming module 30B, for example. In the forming module 30B, the substrate transport mechanism 35 is moved in the -Y direction to stop at a predetermined position C1 on the upper side of the lower mold 36. [ The release film 44 (see Fig. 8 (a)) is supplied from the release film supply mechanism 38 to the lower mold 36. [ The substrate transport mechanism 35 is raised to feed the substrate 26 before sealing to the top mold 45 (see FIG. 8A). The substrate transport mechanism 35 is returned to the predetermined position S1 of the substrate supply / storage module 28. [

Next, in the resin supply module 31, the X-Y table 40 is moved in the -Y direction so that the resin containing portion 41 is stopped at a predetermined position below the resin material loading mechanism 42. A predetermined amount of the resin material is supplied from the resin material charging mechanism 42 to the resin receiving portion 41 by moving the X-Y table 40 in the X direction and the Y direction. After the resin material is supplied to the resin accommodating portion 41, the X-Y table 40 is returned to its original position.

Next, the resin transport mechanism 43 is moved in the -Y direction from the predetermined position R1. The resin conveying mechanism 43 receives the resin accommodating portion 41 disposed in the XY table 40. The resin transport mechanism 43 is returned to the predetermined position R1. The resin conveying mechanism 43 is moved in the -X direction to the predetermined position M1 of the forming module 30B.

Next, in the forming module 30B, the resin conveying mechanism 43 is moved in the -Y direction to stop at the predetermined position C1 on the upper side of the lower mold 36. [ The resin conveying mechanism 43 is lowered to supply the resin material 46 (see Fig. 8 (a)) from the resin accommodating portion 41 to the cavity 37. [ The resin transport mechanism 43 is returned to the predetermined position R1. 8 (a) shows a case of supplying a granular resin as the resin material 46. Fig.

Next, as shown in Fig. 8 (b), the resin material 46 is melted to produce the fluid resin 47. Then, as shown in Fig. The lower mold 36 is lifted by the mold clamping mechanism 39 (see FIG. 7), and the upper mold 45 and the lower mold 36 are fastened. The semiconductor chip 25 mounted on the unsealed substrate 26 is immersed in the molten fluid resin 47 in the cavity 37. [

Next, as shown in Fig. 8 (c), the fluid resin 47 is heated for a time necessary for curing the fluid resin 47. Then, as shown in Fig. The fluid resin 47 is cured to form the cured resin 48. Thus, the semiconductor chip 25 mounted on the unsealed substrate 26 is resin-sealed with the cured resin 48 formed corresponding to the shape of the cavity 37.

Next, as shown in Fig. 8 (d), after the predetermined time has elapsed, the top mold 45 and the bottom mold 36 are opened. A sealed resin-sealed substrate 11 is fixed to the mold surface of the upper mold 45.

Next, the substrate transport mechanism 35 is moved from the predetermined position S1 of the substrate supply / storage module 28 to the predetermined position M1 of the forming module 30B. The substrate transport mechanism 35 is moved to a predetermined position C1 on the upper side of the lower mold 36 and the substrate transport mechanism 35 receives the sealed substrate 11. [

The substrate transport mechanism 35 is moved from the forming module 30B to the inspection module 29 and stopped at a predetermined position E1 on the upper side of the table 2 of the inspection apparatus 23. Then, And the sealed substrate 11 is transferred from the substrate transport mechanism 35 to the inspection device 23. [ The substrate transport mechanism 35 is returned to the predetermined position S1.

Next, the height position h2 of the substrate 12 and the height position h3 of the sealed substrate 11 of the resin-sealed, sealed substrate 11 are measured using the inspection apparatus 23, respectively (See FIG. 5). The controller CTL compares these height positions to determine the relative thickness of the sealing resin 13 of the sealed substrate 11.

Next, the substrate transport mechanism 35 is moved to a predetermined position E1 on the upper side of the table 2 of the inspection apparatus 23, and the sealed substrate 11 is received from the inspection apparatus 23. The substrate transport mechanism 35 is moved to transfer the sealed substrate 11 to the substrate disposing portion 34. The sealed substrate 11 is stored in the sealed substrate storage portion 33 from the substrate arrangement portion 34. [ The resin sealing is completed by the above steps.

According to the present embodiment, the inspection device 23 is provided on the inspection module 29 of the resin molding apparatus 27. [ The deformation of the pre-sealing substrate 26 or the deformation of the sealed substrate 11 is corrected using the inspection apparatus 23 and the deformation of the substrate 12 The height position of the substrate 12 having the seal-completed substrate 11, and the height position of the seal-completed substrate 11 can be measured. Thus, the thickness of the sealing resin 13 of the sealed substrate 11 can be accurately obtained. Therefore, the resin molding process in the resin molding apparatus 27 can be normally managed. Thus, the resin molding apparatus 27 can be stably operated.

This embodiment shows a case where the inspection apparatus 23 is provided in the resin molding apparatus 27 using the compression molding method. The inspection apparatus 23 of the present invention can be provided in a resin molding apparatus using a transfer molding method or an injection molding method.

In the present embodiment, the inspection device 23 is integrated with the inspection module 29 of the resin molding apparatus 27. The inspection apparatus 23 may be provided separately from the resin molding apparatus 27. [ In this case, the thickness of the sealing resin molded in the plurality of resin molding apparatuses can be measured by one inspection apparatus 23. [

In each embodiment, the height of the table 2, the height of the substrate 12 of the substrate 26 before the sealing 26, the height of the sealing substrate 26, The height position of the substrate 12 of the substrate 11 and the height position of the sealed substrate 11 were measured. The same measurement can be made using an optical displacement sensor or an image recognition system.

In each embodiment, the case where the contact type displacement sensor 24 is provided as the inspection apparatus in the inspection apparatus 23 is shown. The present invention is not limited to this, and both the contact type displacement sensor 24 and the image processing system can be provided in the inspection apparatus 23. [ In this case, the thickness of the substrate 12 of the sealed substrate 11, the thickness of the sealing resin 13 of the sealed substrate 11, the surface of the sealed substrate 11, Can be performed by using the inspection apparatus 23. In addition, it is also possible to check the state of the semiconductor chip being torn off, etc., on the substrate 26 before the sealing.

As described above, the holding apparatus of the above-described embodiment is provided with the table on which the object is placed, the plurality of suction holes formed on the table and sucking the object, the sealing material provided on the table and surrounding the periphery of the plurality of suction holes, An urging member for urging the periphery of the object against the table at a position where the sealing member is disposed, and a decompression mechanism connected to the plurality of suction holes.

According to this configuration, the deformation of the object can be corrected and the object can be kept in close contact with the table.

The inspection apparatus of the above embodiment includes a table on which an object is placed; a plurality of suction holes formed on the table and sucking the object; a sealing member provided on the table and surrounding the plurality of suction holes; A pressure sensitive member which is connected to the plurality of suction holes; and a pressing member which presses the periphery of the object, and the object is sucked through the plurality of suction holes by the pressure reducing mechanism And an inspection mechanism for inspecting an object in a state in which the object is detected.

According to this configuration, the inspection of the object can be accurately performed by using the inspection mechanism in a state in which the object is brought into close contact with the table and the influence of deformation such as warpage or twist is removed.

Further, in the inspection apparatus of the above embodiment, the inspection mechanism includes any one of a contact type displacement sensor, an optical displacement sensor and an image processing system.

According to this configuration, it is possible to accurately measure the thickness of the object or the surface of the object.

Further, the resin molding apparatus is provided with the inspection apparatus of the above-described embodiment.

According to this configuration, it is possible to normally manage the resin molding process in the resin molding apparatus. Therefore, the resin molding apparatus can be stably operated.

The inspection method of the above-described embodiment includes the steps of disposing an object on a table provided with a sealing material surrounding a plurality of suction holes and a plurality of suction holes, and a step of disposing the object around the object A step of pressing the periphery of the object to form a space between the table and the object, a step of attracting the object to the table by sticking air into the space by sucking the air through the plurality of suction holes, And inspecting the object by using the inspection apparatus in a state in which it is in close contact with the table.

According to this method, the inspection of the object can be accurately performed by using the inspection mechanism in a state in which the object is brought into close contact with the table and the influence of deformation such as warpage or twist is removed.

In the inspection method of the above embodiment, the object is an unsealed substrate or a sealed substrate, and the object is inspected by using an inspection mechanism.

According to this method, the substrate can be accurately inspected in a state in which the unsealed substrate or the sealed substrate is in close contact with the table.

In the inspection method of the above embodiment, the inspection step may include the steps of measuring the reference height information of the table using the inspection mechanism in a state where the object is not disposed on the table, The thickness of the object is obtained by comparing the height information of the object with the reference height information of the table.

According to this method, the thickness of the object can be obtained more accurately by comparing the reference height information of the table and the height information of the object measured while closely contacting the object with the table at the same position.

In the inspecting method of the above embodiment, the object has the substrate and the insulator formed on the substrate. In the inspecting step, the height information of the substrate and the height information of the insulator And the thickness of the insulator is obtained by comparing the height information of the insulator with the height information of the substrate.

According to this method, the relative thickness of the insulator can be easily obtained by comparing the height information of the substrate with the height information of the insulator, with the substrate and the object having the insulator closely contacted to the table.

In the inspection method of the above embodiment, the inspection mechanism is any one of a contact type displacement sensor, an optical displacement sensor and an image recognition system, and measures the thickness of the object by using an inspection mechanism.

According to this method, the thickness of the object can be accurately obtained by using any one of the contact type displacement sensor, the optical displacement sensor, and the image recognition system while keeping the object in close contact with the table.

In the resin sealing method, the resin is inspected by the inspection method of the above embodiment after sealing.

According to this method, the thickness of the substrate or the thickness of the sealing resin can be accurately obtained after resin sealing.

In the resin sealing method, inspection is performed by the inspection method of the above embodiment before resin sealing, and inspection by the inspection method of the above embodiment is performed after resin sealing.

According to this method, the thickness of the substrate can be accurately obtained before resin sealing, and the thickness of the sealing resin can be accurately obtained after resin sealing.

Further, in the method of producing a resin-sealed article, the resin-sealed article is produced by using the resin-sealing method of the above embodiment.

According to this production method, it is possible to conduct the inspections before resin sealing and after resin sealing to produce a resin sealing product.

The present invention is not limited to the above-described embodiments, and can be appropriately combined, changed or selected as necessary within a range not deviating from the gist of the present invention.

1, 16: holding device 2, 17: table
3: suction hole 4, 18: substrate (object)
5: Piping 6: Pressure reducing mechanism
7, 19: pressing member 8, 20: opening
9, 21: sealing grooves 10, 22: sealing material
11: sealed substrate (object) 12: substrate (object)
13: sealing resin (insulator) 14: clearance
15: Enclosed space (space) 23: Inspection device
24: Contact type displacement sensor (inspection instrument)
25: Semiconductor chip 26: Pre-sealing substrate (object)
27: Resin molding apparatus (resin sealing apparatus)
28: Substrate supply / storage module
29: inspection module 30A, 30B, 30C: molding module
31: resin supply module 32: pre-sealing substrate supply part
33: Sealed substrate storage section 34:
35: Substrate transport mechanism 36: Lower substrate
37: cavity 38: release film feeding mechanism
39: Mold fastening mechanism 40: XY table
41: resin receiving portion 42: resin material feeding mechanism
43: Resin transport mechanism 44: Release film
45: Upper mold 46: Resin material
47: Fluid Resin 48: Cured Resin
A: The area occupied by the closed space
P1, P2, P3, P4, P5, P6:
h1, h2, h3, h4, h5, h6: height position
CTL:
S1, R1, M1, C1, E1:

Claims (12)

A table on which an object is placed,
A plurality of suction holes formed in the table and sucking the object,
A seal member provided on the table and surrounding the periphery of the plurality of suction holes,
A pressing member for pressing the periphery of the object against the table at a position where the sealing member is disposed;
A pressure reducing mechanism connected to the plurality of suction holes
. A table on which an object is placed,
A plurality of suction holes formed in the table and sucking the object,
A seal member provided on the table and surrounding the periphery of the plurality of suction holes,
A pressing member for pressing the periphery of the object against the table at a position where the sealing member is disposed;
A decompression mechanism connected to the plurality of suction holes,
Wherein the object is pressed by the pressing member and the object is sucked through the plurality of suction holes by the pressure reducing mechanism,
. 3. The method of claim 2,
Wherein the inspection mechanism comprises any one of a contact displacement sensor, an optical displacement sensor, and an image processing system. A resin-sealing apparatus comprising the inspection apparatus according to claim 2 or 3. Disposing an object on a table provided with a plurality of suction holes and a sealing material surrounding the periphery of the plurality of suction holes;
Pressing the periphery of the object to the table with the pressing member at a position where the sealing member is disposed;
A step of forming a space between the table and the object by pressing the periphery of the object;
Drawing the object to the table by suctioning air in the space through the plurality of suction holes,
A step of inspecting the object by using an inspection instrument while the object is in close contact with the table
. 6. The method of claim 5,
The object is an unsealed substrate or a sealed finished substrate,
And inspecting the object by using the inspection mechanism. 6. The method of claim 5,
The step of inspecting includes the steps of measuring reference height information of the table using the inspection mechanism in a state in which the object is not disposed on the table,
A step of measuring the height information of the object using the inspection apparatus in a state in which the object is in close contact with the table
/ RTI >
Wherein the thickness of the object is obtained by comparing the height information of the object with the reference height information of the table. 6. The method of claim 5,
The object having a substrate, an insulator formed on the substrate,
The step of inspecting includes a step of measuring height information of the substrate and height information of the insulator by using the inspection mechanism in a state in which the object is in close contact with the table,
Wherein the thickness of the insulator is determined by comparing height information of the insulator with height information of the substrate. 9. The method according to claim 7 or 8,
Wherein the inspection mechanism is any one of a contact type displacement sensor, an optical displacement sensor and an image recognition system,
And the thickness of the object is measured by using the inspection mechanism. A resin encapsulation method for inspecting by the inspection method according to any one of claims 5 to 9 after resin sealing. A resin encapsulation method comprising the steps of: performing an inspection by the inspecting method according to claim 5 or 7 before resin sealing and inspecting by the inspecting method according to any one of claims 5 to 9 after resin sealing. A method for producing a resin encapsulated article, wherein the resin encapsulated article is produced by using the resin encapsulation method according to claim 10 or 11.

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