CN101393885A - Fixing/releasing auxiliary device for a wafer detection platform, the wafer detection platform and method therefor - Google Patents
Fixing/releasing auxiliary device for a wafer detection platform, the wafer detection platform and method therefor Download PDFInfo
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- CN101393885A CN101393885A CN 200810218792 CN200810218792A CN101393885A CN 101393885 A CN101393885 A CN 101393885A CN 200810218792 CN200810218792 CN 200810218792 CN 200810218792 A CN200810218792 A CN 200810218792A CN 101393885 A CN101393885 A CN 101393885A
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Abstract
The invention discloses a fixing/releasing auxiliary device for wafer testing equipment, the testing equipment and a method thereof. The invention aims to help the testing equipment test a wafer to be tested, which is placed on the bearing surface of the bearing device of the testing equipment, by solving the problem that the uneven surface of the wafer stops the wafer from being successfully absorbed and fixed by air-pores on the bearing device. The method comprises the following steps: a set of mobile units are used for steadily pressing downwards a flexible material, so that the central part of the material, which is thicker than the peripheral part of the material, can come into contact with the central part of the wafer to be tested much earlier; and then the material is gradually pressed downwards so as to gradually flatten the whole piece of the wafer-the central part first and then the peripheral part-on the bearing surface. The invention provides an automatic operation mode, but also prevents the wafer to be tested from being broken or poor contact in the course of pressing, thereby enhancing the output yield and the output rate.
Description
Technical field
The present invention relates to a kind of fixing/releasing auxiliary device, especially a kind of wafer detects the board fixing/releasing auxiliary device, this detects board and method.
Background technology
Along with the progress of science and technology industry, LED wafer for example, thickness is thinned to below the 150 μ m gradually by 200 μ m originally, makes wafer because of the thermal stress isostension factor in the manufacture process then, produces the out-of-flatness warpage of about 5 μ m.And at present existing test process, mostly be that wafer to be measured is seated on the loading end of bogey, the bogey ventilation is connected to the tool vacuum pumps, make the pore place on the loading end produce negative pressure, adsorb wafer to be measured, and the spot measurement device by the top, the individual die in this wafer of conduction contact is used activation and is lighted each crystal grain and sensing it is luminous.
Yet above-mentioned warping phenomenon will make spot measurement device can't correctly conduct electricity contact to each crystal grain height, and loose contact will make detection correctly carry out; Wafer is smooth to be addressed the above problem in order to make, and the many modes of manually exerting pressure with operating personnel of industry force wafer to be closely attached on loading end at present; Or increase the vacuum pumps suction power that bogey connected, force wafer to be drawn to smooth loading end by brute force.
But no matter by manually exerting pressure or during strong pumping, all may be because a little flaw generation of application of force structure inhomogeneous, the wafer itself too fast, to be measured of exerting pressure stress concentration phenomenon, wafer to be measured thereby fragmentation.Even when allowing wafer reply the warpage kenel closing vacuum pumps, wafer can cause fragmentation because recover crooked shape rapidly.So, not only yield descends thereupon, and cost improves synchronously; The cleaning fragmentation also can delay subsequent job, makes output efficiency obviously reduce.
Therefore, if can automation exert pressure, make wafer under not easily broken situation, smooth being adsorbed on the loading end that is fixed in bogey not only promotes the reliability of detection system, also significantly improves output efficiency, more can reduce manufacturing cost, real is best solution.
Summary of the invention
The object of the present invention is to provide a kind of thicker flexible thing of central authorities that utilizes, when putting wafer, progressively flatten wafer to be measured by central authorities, make the warpage wafer progressively stressed and develop loading end, and be subjected to the absorption of loading end pore and not easily broken wafer detects the board fixing/releasing auxiliary device.
Another purpose of the present invention is to provide the stable absorption of a kind of energy wafer to make its easily examined wafer detect the board fixing/releasing auxiliary device.
A further object of the present invention is to provide a kind of simple in structure and fully automation and the wafer that increases test speed detects board.
Another purpose of the present invention is to provide a kind of wafer detection board that wafer damages probability, promotes the output yield that reduces.
Another purpose again of the present invention, but be to provide a kind of automated job, effectively promote the wafer detection method of detection efficiency.
A purpose more again of the present invention is to provide a kind of and avoids meaningless fragmentation, effectively increases the wafer detection method of output yield.
For realizing above purpose, the present invention has taked following technical scheme: a kind of wafer detects the board fixing/releasing auxiliary device, wherein this board comprises pedestal with bogey and the testing apparatus that is arranged at this pedestal, this bogey has the loading end that supplies this wafer to be measured of carrying and be formed with a plurality of pores, and ventilation is connected to exhaust group Pu, and this fixing/releasing auxiliary device comprises: comprise that middle body and thickness are lower than the flexible unit of the peripheral part of this middle body; And in order in ready position, and make this middle body of this flexible unit and this peripheral part be compressed to the mobile unit of mobile this flexible unit between the packing position that this wafer to be measured and deformation to thickness essence equates away from this bogey.
The wafer that the present invention uses this servicing unit detects board, then comprises the pedestal with bogey, and this bogey has the loading end that supplies this wafer to be measured of carrying and be formed with a plurality of pores, and ventilation is connected to exhaust group Pu; Be arranged at the testing apparatus of this pedestal; And be arranged at the fixing/releasing auxiliary device of this pedestal, comprise having the flexible unit that middle body and thickness are lower than the peripheral part of this middle body; And in order in ready position, and make this middle body of this flexible unit and this peripheral part be compressed to the mobile unit of mobile this flexible unit between the packing position that this wafer to be measured and deformation to thickness essence equates away from this bogey.Pedestal with bogey; Be arranged at the testing apparatus of this pedestal, this bogey has the loading end that supplies this wafer to be measured of carrying and be formed with a plurality of pores, and ventilation is connected to exhaust group Pu; And fixing/releasing auxiliary device, comprise having the flexible unit that middle body and thickness are lower than the peripheral part of this middle body; And in order in ready position, and make this middle body of this flexible unit and this peripheral part be compressed to the mobile unit of mobile this flexible unit between the packing position that this wafer to be measured and deformation to thickness essence equates away from this bogey.
Using above-mentioned board and carry out the method that wafer detects, is to detect board by the tool wafer to detect this tested wafer, and wherein this detection board comprises the pedestal that is provided with bogey, testing apparatus and fixing/releasing auxiliary device; This bogey has the loading end that supplies this wafer to be measured of carrying and be formed with a plurality of pores, and ventilation is connected to exhaust group Pu; This fixing/releasing auxiliary device comprises having the flexible unit that middle body and thickness are lower than the peripheral part of this middle body, and in order to move the mobile unit of this flexible unit, this method comprises the following step: a) with this exhaust group Pu a plurality of pores on this loading end are applied negative pressure, and should be placed on this loading end by tested wafer; B) with this mobile unit this flexible unit is moved to by the ready position away from this bogey and make this middle body of this flexible unit be compressed to this wafer to be measured; C) slow down this mobile unit and this flexible unit presses down speed, be compressed to this wafer to be measured up to this peripheral part of this flexible unit, make this flexible unit deformation to the equal packing position of thickness essence, force that this wafer to be measured is smooth to be subjected to these pore vacuum suctions in this loading end, keep being attached at this loading end; D) move this mobile unit and this flexible unit to allow this testing apparatus test this wafer to be measured away from this wafer position to be measured, test this wafer to be measured with this testing apparatus; E) stopping this exhaust group Pu provides negative pressure to these pores, discharges this wafer to be measured.
The present invention compared with prior art, has following advantage: by assisting of mobile unit, make flexible unit in pressing down deformation process, earlier oppress wafer center part to be measured gradually with middle body, with originally the smooth wafer center of part in loading end partly flatten, and the peripheral part that drives wafer moves closer to loading end, minimizing amount of warpage therebetween; Progressively press down subsequently, make whole warpage wafer energy to be measured smooth on loading end, be subjected to the absorption of pore on the loading end, make wafer become smooth and easily surveyed by correct point, can not only effectively reach automation and detect operation, more can reduce wafer and damage, improve detection efficiency and output yield synchronously, more make operation automation become possibility.
Description of drawings
Fig. 1 is the schematic side view of first embodiment of the invention;
Fig. 2 is that the first embodiment of the invention spheroid presses to smooth schematic side view in wafer start situation ();
Fig. 3 is that the first embodiment of the invention spheroid presses to smooth schematic side view in wafer start situation (two);
Fig. 4 is that the first embodiment of the invention spheroid presses to smooth schematic side view in wafer start situation (three);
Fig. 5 is the testing apparatus schematic diagram of first embodiment of the invention;
Fig. 6 is the detection method schematic flow sheet of first embodiment of the invention; And
Fig. 7 is the schematic side view of second embodiment of the invention.
Description of reference numerals: 1, fixing/releasing auxiliary device, 3, wafer, 10, pedestal, 33, antistatic, 35, spheroid, 35 ', sponge, 37, mobile unit, 41, exhaust group Pu, 43, bogey, 45, testing apparatus, 101, pore, 351,351 ', middle body, 353,353 ', peripheral part, 430, loading end, 451, the optics sensing member, 453, pressure connects assembly.
Embodiment
Below in conjunction with the drawings and specific embodiments content of the present invention is described in further details.
First embodiment:
The present invention as shown in Figures 1 and 2, the flexible unit that fixing/releasing auxiliary device 1 utilizes middle body 351 obviously to exert pressure than peripheral part 353 thick hollow sphere 35 conducts, spheroid 35 is before start not, stop at ready position with mobile unit 37 away from bogey 43, so in Fig. 6 step 61, be placed on the loading end 430 of bogey 43 when wafer 3 to be measured after, spheroid 35 moved to wafer to be measured 3 tops press down gradually.Wherein, the warpage of wafer 3 to be measured is not radial symmetry, but generally because of middle body 351 is minimum, approaching smooth state when being placed in loading end 430; And pore 101 applies negative pressure by the exhaust group Pu 41 that ventilation connects on the loading end 430 at this moment.
Therefore step 62 is extremely shown in Figure 5 as Fig. 1, the middle body 351 of spheroid 35 will preferentially be compressed to the central authorities of wafer 3, walk unhurriedly with mobile unit when spheroid 35 and to press down, pressure will outwards be urged to the intermediary position of leaving wafer 3 central authorities slightly by wafer 3 middle bodies gradually, forces the intermediary position to be developed to loading end 430.And the intermediary position is driven plain, and also makes that peripheral part 353 warpages of wafer 3 are suppressed gradually, and in company with moving down towards loading end 430.
For the purpose of explaining orally, after this definition mobile unit pressed down, making spheroid 35 middle bodies 351 deformation to the position that equates with spheroid peripheral part 353 thickness essence was the packing position.In addition for avoiding (the ESD that sparks of operating personnel or the entrained static of mechanical device, Electrostatic Discharge) causes overvoltage (EOS, Electrical Overstress) destroys tested wafer, also can be chosen on the wafer 3 to be measured and put antistatic 33, preventing that ESD from destroying, and reach best protection effect.
, in step 64 mobile unit and flexible unit jointly moved apart to be measured wafer thereafter, extremely shown in Figure 5 as Fig. 1, carrying out wafer by the testing apparatus 45 that is arranged at pedestal 10 detects, in this example, testing apparatus 45 comprises that two groups of pressure connect assembly 453, and one group of optics sensing member 451.Every group of pressure connects assembly 453 and has a metal probe respectively, puts the specific die that is depressed in the wafer to be measured one by one for mechanical type, power supply gas contact activation this tested crystal grain, and by the optics sensing member 451 tested crystal grain issued lights of reception and analyze.Certainly, as be familiar with this technical field personage and can understand easily, according to present technology, the common ground that part crystal grain is also arranged is to be positioned at wafer rear, and tested surface only has unitary electrode, and for the wafer to be measured of this kind structure, then can select loading end is the bogey of metal material, with the usefulness of loading end as ground connection, metal probe above making and pressure connect assembly and then only need one group.
To step 65, after detection is finished, as shown in Figure 4 mobile unit (as shown in Figure 1) and spheroid 35 are moved to the packing position of packing wafer 3 to be measured again, make that surveying the wafer of finishing 3 is flattened by spheroid 35 application of forces.In step 66, stop exhaust group Pu 41 on the one hand and continue to provide negative pressure at last, the elastic-restoring force of wafer is offset by flexible unit fully to pore 101.The aspect gently will be moved on mobile unit and the spheroid 35 in addition, progressively move to the ready position of bogey 43, make that wafer 3 to be measured is to be constrained to be replied by periphery to central elastic gradually to be original warpage state, thereby avoid wafer 3 in the step of rapid release, the risk of damaging because of rapid resilience.Certainly, be enough to bear resilience rapidly and unlikely fragmentation if confirm the structural strength of this wafer, the step of this part also can be omitted and not hinder enforcement in this case.
Second embodiment:
Certainly, as be familiar with present technique field person and can understand easily, flexible unit is not limited to hollow sphere, shown in Fig. 7 this case second embodiment, also can utilize as solid flexible elements such as sponges 35 ', make the thickness of its peripheral part 353 ' be less than middle body 351 ', and when in the end flattening the wafer process, but make the thickness essence of middle body 351 ' equal peripheral part 353 ', it is required to meet this case, and crystal column surface is exerted pressure to detect operation.
Above-listed detailed description is at the specifying of possible embodiments of the present invention, and this embodiment is not in order to limiting claim of the present invention, and the equivalence that all the present invention of disengaging do is implemented or change, all should be contained in the claim of this case.
Claims (9)
1, a kind of wafer detects the board fixing/releasing auxiliary device, it is characterized in that: described board comprises the pedestal with bogey and is arranged at testing apparatus on this pedestal, this bogey has the loading end that supplies this wafer to be measured of carrying and be formed with a plurality of pores, and ventilation is connected to exhaust group Pu, and this fixing/releasing auxiliary device comprises:
Comprise that middle body and thickness are lower than the flexible unit of the peripheral part of this middle body; And
In order in ready position, and make this middle body of this flexible unit and this peripheral part be compressed to the mobile unit that moves this flexible unit between the packing position that this wafer to be measured and deformation to thickness essence equates away from this bogey.
2, wafer as claimed in claim 1 detects the board fixing/releasing auxiliary device, and it is characterized in that: described flexible unit comprises the spheroid with hollow gasbag.
3, wafer as claimed in claim 1 detects the board fixing/releasing auxiliary device, and it is characterized in that: described flexible unit comprises solid flexible element.
4, detect the board fixing/releasing auxiliary device as claim 1 or 2 or 3 described wafers, it is characterized in that: described flexible unit comprises one deck antistatic towards this loading end.
5, a kind of wafer detects board, it is characterized in that, comprises:
Pedestal with bogey, this bogey have for this wafer to be measured of carrying and are formed with a plurality of
The loading end of pore, and ventilation is connected to exhaust group Pu;
Be arranged at the testing apparatus of this pedestal; And
Be arranged at the fixing/releasing auxiliary device of this pedestal, comprise
Have middle body and thickness and be lower than the flexible unit of the peripheral part of this middle body; And
In order in ready position, and make this middle body of this flexible unit and this peripheral part be compressed to the mobile unit that moves this flexible unit between the packing position that this wafer to be measured and deformation to thickness essence equates away from this bogey.
6, wafer as claimed in claim 5 detects board, it is characterized in that: described testing apparatus comprises that having the pressure that power supply gas contacts the metal probe of this wafer to be measured connects assembly.
7, detect board as claim 5 or 6 described wafers, it is characterized in that: described testing apparatus more comprises the optics sensing member.
8, a kind of wafer detection method is characterized in that: detect board by the tool wafer and detect this tested wafer, wherein this detection board comprises the pedestal that is provided with bogey, testing apparatus and fixing/releasing auxiliary device; This bogey has the loading end that supplies this wafer to be measured of carrying and be formed with a plurality of pores, and ventilation is connected to exhaust group Pu; This fixing/releasing auxiliary device comprises having the flexible unit that middle body and thickness are lower than the peripheral part of this middle body, and in order to move the mobile unit of this flexible unit, this method comprises the following step:
A) with this exhaust group Pu a plurality of pores on this loading end are applied negative pressure, and should be placed on this loading end by tested wafer;
B) with this mobile unit this flexible unit is moved to by the ready position away from this bogey and make this middle body of this flexible unit be compressed to this wafer to be measured;
C) slow down this mobile unit and this flexible unit presses down speed, be compressed to this wafer to be measured up to this peripheral part of this flexible unit, make this flexible unit deformation to the equal packing position of thickness essence, force that this wafer to be measured is smooth to be subjected to these pore vacuum suctions in this loading end, keep being attached at this loading end;
D) move this mobile unit and this flexible unit to allow this testing apparatus test this wafer to be measured away from this wafer position to be measured, test this wafer to be measured with this testing apparatus;
E) stopping this exhaust group Pu provides negative pressure to these pores, discharges this wafer to be measured.
9, detection method as claimed in claim 8 is characterized in that, comprises:
Between described step d) and step e), re-move this mobile unit and this flexible unit step f) to this packing position; And
After described step e), slowly move this mobile unit and this flexible unit towards away from the described ready position of this bogey, avoid the described wafer to be measured step g) that resilience damages in release steps.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810218792 CN101393885A (en) | 2008-10-31 | 2008-10-31 | Fixing/releasing auxiliary device for a wafer detection platform, the wafer detection platform and method therefor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810218792 CN101393885A (en) | 2008-10-31 | 2008-10-31 | Fixing/releasing auxiliary device for a wafer detection platform, the wafer detection platform and method therefor |
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| CN101393885A true CN101393885A (en) | 2009-03-25 |
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| CN 200810218792 Pending CN101393885A (en) | 2008-10-31 | 2008-10-31 | Fixing/releasing auxiliary device for a wafer detection platform, the wafer detection platform and method therefor |
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| CN102305882A (en) * | 2011-05-25 | 2012-01-04 | 上海集成电路技术与产业促进中心 | Testing wafer carrying table |
| CN102682791A (en) * | 2011-03-17 | 2012-09-19 | 东莞新科技术研究开发有限公司 | Elongated strip adhesion device |
| CN102879180A (en) * | 2011-07-14 | 2013-01-16 | 致茂电子股份有限公司 | Measuring device for light emitting diode |
| CN103852711A (en) * | 2012-11-30 | 2014-06-11 | 上海华虹宏力半导体制造有限公司 | Structure of probe station and method of testing wafer by using probe station |
| CN104641461A (en) * | 2012-08-31 | 2015-05-20 | 联达科技设备私人有限公司 | Multifunction wafer and film frame handling system |
| CN109256356A (en) * | 2018-09-28 | 2019-01-22 | 上海理工大学 | A kind of smooth fixed device of wafer |
| CN109273398A (en) * | 2018-09-28 | 2019-01-25 | 上海微松工业自动化有限公司 | A kind of smooth fixed device of wafer |
| CN109285807A (en) * | 2018-09-28 | 2019-01-29 | 上海微松工业自动化有限公司 | A kind of smooth fixed equipment of wafer |
| CN109360804A (en) * | 2018-09-28 | 2019-02-19 | 上海微松工业自动化有限公司 | A kind of smooth fixed device of 12 inch wafers |
| CN109716503A (en) * | 2016-11-04 | 2019-05-03 | 东和株式会社 | Holding meanss, check device, inspection method, the manufacturing method of resin encapsulation equipment, resin encapsulation method and resin-encapsulated product |
| CN110119069A (en) * | 2018-02-05 | 2019-08-13 | 上海微电子装备（集团）股份有限公司 | A kind of substrate adsorbent equipment, lithographic equipment and adsorption method |
| CN111103442A (en) * | 2018-10-29 | 2020-05-05 | 致茂电子(苏州)有限公司 | Wafer test carrying disc and wafer test device |
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2008
- 2008-10-31 CN CN 200810218792 patent/CN101393885A/en active Pending
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102682791A (en) * | 2011-03-17 | 2012-09-19 | 东莞新科技术研究开发有限公司 | Elongated strip adhesion device |
| CN102305882A (en) * | 2011-05-25 | 2012-01-04 | 上海集成电路技术与产业促进中心 | Testing wafer carrying table |
| CN102879180A (en) * | 2011-07-14 | 2013-01-16 | 致茂电子股份有限公司 | Measuring device for light emitting diode |
| CN104641461A (en) * | 2012-08-31 | 2015-05-20 | 联达科技设备私人有限公司 | Multifunction wafer and film frame handling system |
| CN104641461B (en) * | 2012-08-31 | 2017-06-06 | 联达科技设备私人有限公司 | Multi-functional wafer and diaphragm frame manage system |
| CN103852711A (en) * | 2012-11-30 | 2014-06-11 | 上海华虹宏力半导体制造有限公司 | Structure of probe station and method of testing wafer by using probe station |
| CN103852711B (en) * | 2012-11-30 | 2017-02-15 | 上海华虹宏力半导体制造有限公司 | Method of testing wafer by using probe station |
| CN109716503A (en) * | 2016-11-04 | 2019-05-03 | 东和株式会社 | Holding meanss, check device, inspection method, the manufacturing method of resin encapsulation equipment, resin encapsulation method and resin-encapsulated product |
| CN109716503B (en) * | 2016-11-04 | 2023-04-14 | 东和株式会社 | Holding device, inspection method, resin packaging device, resin packaging method, and method for manufacturing resin packaged product |
| CN110119069A (en) * | 2018-02-05 | 2019-08-13 | 上海微电子装备（集团）股份有限公司 | A kind of substrate adsorbent equipment, lithographic equipment and adsorption method |
| CN109360804A (en) * | 2018-09-28 | 2019-02-19 | 上海微松工业自动化有限公司 | A kind of smooth fixed device of 12 inch wafers |
| CN109285807A (en) * | 2018-09-28 | 2019-01-29 | 上海微松工业自动化有限公司 | A kind of smooth fixed equipment of wafer |
| CN109273398A (en) * | 2018-09-28 | 2019-01-25 | 上海微松工业自动化有限公司 | A kind of smooth fixed device of wafer |
| CN109273398B (en) * | 2018-09-28 | 2023-01-20 | 上海微松工业自动化有限公司 | Wafer flattening and fixing device |
| CN109285807B (en) * | 2018-09-28 | 2023-01-20 | 上海微松工业自动化有限公司 | Wafer flattening and fixing equipment |
| CN109360804B (en) * | 2018-09-28 | 2023-02-10 | 上海微松工业自动化有限公司 | Leveling and fixing device for 12-inch wafer |
| CN109256356A (en) * | 2018-09-28 | 2019-01-22 | 上海理工大学 | A kind of smooth fixed device of wafer |
| CN111103442A (en) * | 2018-10-29 | 2020-05-05 | 致茂电子(苏州)有限公司 | Wafer test carrying disc and wafer test device |
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